Tool tip forming device and tool tip forming method

Abstract

To mold a blade edge of a cutting tool having a straight cutting blade accurately.SOLUTION: A tool edge molding device 100 molds a blade edge Ta of a cutting tool T having a straight cutting blade T1 by pulse laser grinding and includes: a first sensor 61 which detects at least one of a cutting blade position and a cutting blade direction D4 of the straight cutting blade T1; a second sensor 62 which detects light generated by contact of a processable area LA of laser light L in the pulse laser grinding with the blade edge Ta; and a control unit 70 which controls a relative position and a relative movement between the processable area LA of the laser light L and the cutting tool T according to output of at least one of the first sensor 61 and the second sensor 62.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a tool tip shaping device and a tool tip shaping method. [Background technology]

[0002] It is known that a workpiece can be shaped by pulsed laser grinding (PLG) (see, for example, Patent Document 1). Pulsed laser grinding is a technique for shaping a workpiece surface by moving (scanning) a cylindrical workable area extending in the optical axis direction of a laser beam relative to the workpiece surface, and is also called laser grinding. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6562536 Summary of the Invention [Problem to be solved by the invention]

[0004] It is also conceivable to use the above-mentioned pulsed laser grinding to form the cutting edge of a cutting tool having a straight cutting edge as used in turning. In this case, it is necessary to precisely adjust the cutting edge direction of the straight cutting edge (the direction in which the cutting edge of the straight cutting edge extends linearly) and the direction in which the laser light moves relative to the straight cutting edge to a specified arbitrary angle. In addition, since processing is performed in a cylindrical machining area as specified in Patent Document 1, the cylindrical machining area described above needs to be in contact with the entire straight cutting edge with one degree of linear reciprocating motion, and due to the characteristics of the above-mentioned machining area, several machining operations are required at the same point to generate the machining surface, and this number of operations varies depending on the machining conditions, the shape of the cutting edge before machining, and the material. If this adjustment and confirmation are left to the discretion of the operator, it can cause variation depending on the skill of the operator. As a result, the shape of the straight cutting edge in the produced cutting tools will vary, which is not preferable.

[0005] The present invention aims to provide a tool cutting edge forming device and a tool cutting edge forming method that are capable of precisely and efficiently forming the edge of a cutting tool having a straight cutting edge by detecting at least one of the cutting edge position and cutting edge direction of the straight cutting edge and controlling the relative position and relative movement between the laser light and the cutting tool. [Means for solving the problem]

[0006] A tool edge shaping device according to an aspect of the present invention is a tool edge shaping device that shapes the edge of a cutting tool having a straight cutting edge by pulse laser grinding, and includes a first sensor that detects at least one of the cutting edge position and cutting edge direction of the straight cutting edge, a second sensor that detects light generated when the machineable area of ​​the laser light in the pulse laser grinding hits the cutting edge, and a control unit that controls the relative position and relative movement between the machineable area of ​​the laser light and the cutting tool according to the output of at least one of the first sensor and the second sensor. The second sensor is a spectrometer that detects plasma light generated when the processable area of ​​the laser light hits the cutting edge. . In addition, a tool edge shaping device according to an embodiment of the present invention is a tool edge shaping device that shapes the edge of a cutting tool having a straight cutting edge by pulse laser grinding, and includes a first sensor that detects at least one of the cutting edge position and cutting edge direction of the straight cutting edge, a second sensor that detects light generated when the machineable area of ​​the laser light in pulse laser grinding hits the cutting edge, and a control unit that controls the relative position and relative movement between the machineable area of ​​the laser light and the cutting tool depending on the output of at least one of the first sensor and the second sensor, and the second sensor includes a bandpass filter that attenuates or blocks light of a wavelength used as the laser light and transmits light of a wavelength different from the laser light.

[0007] A tool edge shaping method according to an embodiment of the present invention is a tool edge shaping method for shaping the edge of a cutting tool having a straight cutting edge by pulse laser grinding, the tool edge shaping method comprising the steps of: detecting at least one of the cutting edge position and cutting edge direction of the straight cutting edge; and detecting a cutting edge shaping error caused by the cutting edge being hit by a processable region of a laser beam in pulse laser grinding. Plasma Light of By spectrometer and controlling the relative position and relative movement between the processable area of ​​the laser light and the cutting tool based on the detection results of at least one of the cutting edge position and cutting edge direction and the detection results of the light. In addition, a tool edge shaping method according to an aspect of the present invention is a tool edge shaping method for shaping the edge of a cutting tool having a straight cutting edge by pulsed laser grinding, and includes detecting at least one of the cutting edge position and cutting edge direction of the straight cutting edge, detecting light generated when the machineable area of ​​the laser light in pulsed laser grinding hits the cutting edge, and controlling the relative position and relative movement between the machineable area of ​​the laser light and the cutting tool according to the detection results of at least one of the cutting edge position and cutting edge direction and the detection results of the light, and detecting the light generated when the machineable area hits the cutting edge includes attenuating or blocking light of a wavelength used as the laser light and transmitting light of a wavelength different from the laser light. Effect of the Invention

[0008] According to the tool edge forming device and the tool edge forming method of the above aspects, the relative position and relative movement between the machining area of ​​the laser beam and the cutting tool are controlled according to the output of at least one of the first sensor and the second sensor, so that the laser beam can be moved accurately relative to the cutting edge direction of the straight cutting edge. As a result, the straight cutting edge of the cutting tool can be formed accurately and efficiently. Also, cutting tools having straight cutting edges formed with stable quality can be produced.

[0009] In the tool cutting edge shaping device of the above aspect, the first sensor may be a shape measuring sensor that can calculate the three-dimensional shape of the cutting edge by irradiating the cutting edge with detection light and receiving the reflected light. With this configuration, the first sensor calculates the three-dimensional shape of the cutting edge, thereby enabling the cutting edge shape, cutting edge position, or cutting edge direction to be detected with high accuracy. In the tool cutting edge shaping device of the above aspect, the first sensor may be used to measure the cutting edge after shaping with laser light, or to check the degree of wear of the cutting edge when resharpening after use. With this configuration, the first sensor can be used both to detect the cutting edge shape, cutting edge position, or cutting edge direction before shaping, and to measure the cutting edge after shaping.

[0010] In the tool edge forming device of the above aspect, the second sensor may be a spectroscope that detects plasma light generated when the machineable region of the laser light hits the cutting edge. According to this configuration, since the plasma light is detected by the spectroscope, it is possible to accurately detect that the machineable region of the laser light hits the cutting edge. In the tool edge forming device of the above aspect, the second sensor may output a spectrum of the plasma light, and the control unit may determine at least one of that the intensity of a predetermined wavelength of the spectrum exceeds a preset threshold value and that the intensity of the predetermined wavelength falls below the threshold value. According to this configuration, the control unit determines that the intensity of the predetermined wavelength exceeds the threshold value or falls below the threshold value, so it is possible to accurately detect whether the machineable region of the laser light hits the cutting edge. In the tool edge forming device of the above aspect, the control unit may determine that the intensity of the predetermined wavelength exceeds the threshold value as the start point of machining the cutting edge by the machineable region of the laser light, and that the intensity of the predetermined wavelength falls below the threshold value as the end point of machining the cutting edge by the machineable region of the laser light. According to this configuration, it is possible to clearly distinguish the start point of machining the cutting edge and the end point of machining the cutting edge.

[0011] In the tool edge forming device of the above aspect, the control unit may determine the shape of the cutting edge before forming based on the detection result of the first sensor and determine the processing operation. According to this configuration, by checking the shape of the cutting edge, an appropriate processing operation can be performed on the cutting edge, and in particular, it can be used to determine whether the cutting edge is at a level where it can be processed when regrinding after wear. In the tool edge forming device of the above aspect, a processing area for forming the cutting edge by the processable area of ​​the laser light and a measurement area for measuring the cutting edge separately from the processing area may be provided, and the first sensor may be arranged corresponding to the measurement area, and the second sensor may be arranged corresponding to the processing area. According to this configuration, the first sensor is arranged corresponding to the measurement area separate from the processing area, so that interference with the second sensor can be prevented. In the tool edge forming device of the above aspect, the second sensor may be provided with a bandpass filter that attenuates or blocks light of a wavelength used as the processable area of ​​the laser light and transmits light of a wavelength different from the laser light. According to this configuration, the bandpass filter attenuates or blocks light of a wavelength used as laser light, so that the influence of the laser light on the detection result of the second sensor can be reduced. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a perspective view showing a schematic diagram of an example of a tool tip shaping device according to an embodiment. [Diagram 2] FIG. 2 is a side view showing an example of the appearance of a tool tip shaping device. [Diagram 3] FIG. 2 is a front view showing an example of a tool tip shaping device. [Figure 4] FIG. 2 is a plan view showing an example of a tool tip shaping device. [Diagram 5] FIG. 2 is an enlarged plan view of a main portion of the tool tip shaping device. [Figure 6] 11A and 11B are diagrams illustrating an example of the operation of the rotary table. [Figure 7] 1 shows an example of the angle between the first direction and the cutting edge direction, where (A) is when θ=K, (B) is when θ=X, and (C) is when θ=0. [Figure 8]FIG. 13 is a diagram showing an example of irradiating a cutting edge of a cutting tool with laser light. [Figure 9] FIG. 1 is a diagram showing an example of a cutting tool having a shaped cutting edge. [Figure 10] FIG. 2 is a perspective view of an example of a plate as viewed obliquely from above. [Figure 11] FIG. 2 is a perspective view of an example of a plate as viewed obliquely from below. [Figure 12] FIG. 2 is a perspective view showing an example of a rotary table. [Figure 13] FIG. 2 is a perspective view showing a state in which the plate is attached to the rotary table. [Figure 14] FIG. 11 is a perspective view of another example of the plate, as viewed obliquely from above. [Figure 15] FIG. 4 is a cross-sectional view showing a part of the plate attached to the rotary table. [Figure 16] FIG. 4 is a plan view showing an example of a holder. [Figure 17] FIG. 17 is a side view of the holder shown in FIG. [Figure 18] FIG. 11 is a plan view showing another example of the holder. [Figure 19] FIG. 19 is a side view of the holder shown in FIG. [Figure 20] FIG. 11 is a cross-sectional view showing another example of the holder. [Figure 21] 11 is a diagram showing an example of a state in which a first sensor is directed toward a blade tip; FIG. [Figure 22] 13 is a diagram showing another example of a state in which the first sensor is directed toward the blade tip. FIG. [Diagram 23] 1A shows a state in which the oscillator is oscillated, and FIG. 1B shows a diagram illustrating the change in the optical axis of the laser light relative to the optical system, and FIG. 1B shows the inclination of the optical axis of the laser light relative to the cutting edge. [Figure 24] FIG. 2 is a functional block diagram of the tool tip forming device according to the embodiment. [Diagram 25] 4 is a flowchart showing an example of a tool cutting edge shaping method according to the embodiment. [Figure 26] 25 is a flowchart showing an example of a tool cutting edge shaping method according to an embodiment. [Figure 27]FIG. 11 is a diagram showing an example of data acquired by a second sensor. [Figure 28] 1A and 1B show a state in which a cutting edge is being shaped by a laser beam, in which (A) shows the laser beam, and (B) is a diagram explaining a processable region. [Figure 29] 11 is a diagram showing the relative movement between the cutting edge and the area that can be processed by laser light. FIG. [Diagram 30] 13 is a diagram showing another example of data acquired by the second sensor. FIG. [Diagram 31] 13A and 13B show another example of the plate, in which (A) is a plan view and (B) is a side view showing the plate attached to the rotary table. [Diagram 32] FIG. 2 is a diagram showing a configuration in which a laser head is movable in a first direction and a second direction. [Diagram 33] 1A and 1B show a form in which a laser beam is deflected in a first direction, in which (A) is a diagram using a polygon mirror and (B) is a diagram using a galvanometer mirror. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. However, the present invention is not limited to the embodiment described below. In addition, in the drawings, in order to explain the embodiment, the scale is appropriately changed, such as by enlarging or emphasizing a part, and the dimensions and shape may differ from those of the actual product. In each of the following figures, the directions in the figures are explained using the XYZ coordinate system. In this XYZ coordinate system, a plane parallel to the horizontal plane is the XY plane. One direction in this XY plane is written as the X direction, and a direction perpendicular to the X direction is written as the Y direction. In addition, a direction perpendicular to the XY plane is written as the Z direction. In each of the X direction, Y direction, and Z direction, the direction indicated by the arrow in the figure is the + direction, and the direction opposite to the direction indicated by the arrow is the - direction.

[0014] Fig. 1 is a perspective view showing a schematic diagram of an example of a tool edge forming device according to an embodiment. Fig. 2 is a side view showing an example of the appearance of the tool edge forming device. Fig. 3 is a front view showing an example of the tool edge forming device. Fig. 4 is a plan view showing an example of the tool edge forming device. Fig. 5 is an enlarged view of a part of Fig. 4.

[0015] The tool edge shaping device 100 shown in Figs. 1 to 5 shapes the cutting edge of a cutting tool, which is a workpiece, by pulsed laser grinding (PLG). Pulsed laser grinding shapes the workpiece surface by moving (scanning) a cylindrical or nearly cylindrical workable area extending in the optical axis direction of the laser light relative to the workpiece surface. In this embodiment, the tool edge shaping device 100 shapes the cutting edge Ta to be sharp by pulsed laser grinding by relatively moving the workable area LA (see Fig. 8) of the laser light L and the cutting edge Ta of the cutting tool T. Details of the cutting tool T and details of the technique for shaping the cutting edge Ta by pulsed laser grinding will be described later.

[0016] As shown in FIG. 1 to FIG. 5, the tool cutting edge forming device 100 includes a laser irradiation mechanism 10, a first stage 20, a second stage 30, a rotary table 40, a driving unit 50, a measuring unit 60, a control unit 70, and a bed 80. As shown in FIG. 2 to FIG. 4, the bed 80 has a lower stage side placement part 81 arranged on the -X side and an upper stage side placement part 82 arranged on the +X side. The bed 80 is provided, for example, by casting or in a can shape. The configuration of the bed 80 is arbitrary, and may be a form without steps such as the lower stage side placement part 81 and the upper stage side placement part 82. A lower stage side component 81A including the first stage 20, the second stage 30, the rotary table 40, the laser head 13 which is a part of the laser irradiation mechanism 10, and the measuring unit 60 is arranged on the lower stage side placement part 81 of the bed 80. An oscillator 11, which is a part of the laser irradiation mechanism 10 and will be described later, is disposed on the upper placement portion .

[0017] As shown in FIG. 1, the laser irradiation mechanism 10 has an oscillator 11, an optical system 12, and a laser head 13. The oscillator 11 generates a laser light (pulse laser) L for pulse laser grinding. The oscillator 11 is placed on an upper stage side mounting portion 82 of a bed 80, and is disposed on the +Z side higher than the position where the cutting tool T is disposed. The oscillator 11 is placed on the upper stage side mounting portion 82 via a rotating table 15. The rotating table 15 is rotatable around an axis of an oscillation axis AX2 parallel to the Z direction. The oscillator 11 is oscillated around the axis of the oscillation axis AX2 integrally with the rotating table 15 by the rotating table 15 oscillating (rotating) around the axis of the oscillation axis AX2.

[0018] The optical system 12 sends the laser light L generated by the oscillator 11 to the laser head 13. The optical system 12 is fixed to a lower stage side mounting part 81 or an upper stage side mounting part 82 of the bed 80. The optical system 12 includes a lens barrel 12a and an optical element 12b such as a lens, a mirror, and a filter. The optical system 12 sends the laser light L in a direction parallel or approximately parallel to the XY plane. The lens barrel 12a is fixed to the upper stage side mounting part 82 of the bed 80 by a stay or the like. The end of the lens barrel 12a on the +X side is flexibly arranged with the oscillator 11. Therefore, by the oscillator 11 swinging around the axis of the swing axis AX2, the laser light L emitted from the oscillator 11 is incident on the optical system 12 (lens barrel 12a) at different angles. Note that the optical system 12 is provided so as to bend the laser light L in the X direction and the Y direction, but is not limited to this form, and may be a form that does not bend the laser light L.

[0019] The laser head 13 emits the laser light L sent from the optical system 12 in the -Z direction. Therefore, in this embodiment, the emission direction D3 of the laser light L is the -Z direction. The laser head 13 is movable in the Z direction along the Z guide 14. The Z guide 14 is fixed to the bed 80 via the guide racket 14a. The laser head 13 is connected to the Z guide 14 via the base 13a. The laser head 13 and the base 13a are integrally movable in the Z direction along the Z guide 14. The base 13a includes, for example, an optical system for sending the laser light L sent from the optical system 12 to the laser head 13, and a Z drive unit 50Z described later for moving the laser head 13 and the base 13a in the Z direction.

[0020] The laser head 13 and the base 13a are disposed above (on the +Z side) the first stage 20, the second stage 30, and the rotary table 40. Therefore, by disposing the oscillator 11 on the upper stage mounting portion 82, i.e., disposing the laser head 13 above (on the +Z side) the first stage 20, the second stage 30, and the rotary table 40, and matching the height of the oscillator 11 to the height of the laser head 13, the optical system 12 can be configured with fewer folds and no extra folds. Note that the optical system 12 may use optical fibers or the like instead of a portion of the optical element 12b.

[0021] As described above, in the laser irradiation mechanism 10, the oscillator 11 can be swung relative to the optical system 12 around the oscillation axis AX2 parallel to the emission direction D3 (Z direction) of the laser light L. The oscillation axis AX2 is located in front of the oscillator 11 (-X direction), and the adjustment angle of the oscillator 11 can be reduced, facilitating fine adjustment of the optical axis of the laser light L. By oscillating the oscillator 11, the laser light L emitted in the horizontal direction rotates around the oscillation axis AX2, and the emission direction D3 of the laser light L is tilted around the axis of the first direction (X direction) D1 with respect to a predefined direction (e.g., Z direction). By tilting the emission direction D3 of the laser light L around the axis of the first direction D1, the emission direction D3 of the laser light L with respect to the cutting edge Ta of the cutting tool T can be easily changed to the set correction angle.

[0022] As shown in FIG. 5, in plan view, a processing area AR1 is set in an area including the +Z side of the laser head 13. The processing area AR1 is an area for irradiating the cutting edge Ta of the cutting tool T with the laser light L to form the cutting edge. In plan view, the processing area AR1 is set as an area including the emission position of the laser light L from the laser head 13. In addition, a measurement area AR2 is set separately from the processing area AR1 on the -X side of the processing area AR1. The measurement area AR2 is an area for detecting at least one of the position of the cutting edge Ta (cutting edge position) and the cutting edge direction D4 of the straight cutting edge T1 by the first sensor 61 described later. The shapes of the processing area AR1 and the measurement area AR2 are arbitrary.

[0023] The processing area AR1 and the measurement area AR2 are arranged side by side in the first direction D1. The processing area AR1 and the measurement area AR2 are arranged apart in the first direction D1 in a plan view, but are not limited to this form. For example, the processing area AR1 and the measurement area AR2 may be in contact with each other in a plan view, or may at least partially overlap each other. However, the first sensor 61 and the second sensor 62 in each area must maintain a positional relationship that does not cause physical or wavelength interference during measurement.

[0024] The first stage 20 is disposed on a lower placement portion 81 of a bed 80 via an X-guide 21. The first stage 20 is movable along the X-guide 21 in a first direction D1 intersecting with the Z-direction, which is the emission direction D3 of the laser light L. In this embodiment, the first direction D1 is the X-direction. The first stage 20 is formed to have larger dimensions in the X-direction, Y-direction, and Z-direction (first direction D1, second direction D2, and emission direction D3) than the second stage 30, and has higher rigidity so as to be less likely to deform than the second stage 30.

[0025] The first stage 20 has a beam damper 22 on its upper surface (surface on the +Z side). The beam damper 22 receives the laser light L emitted from the laser head 13. The beam damper 22 prevents the laser light L from directly hitting the first stage 20, thereby preventing damage to the first stage 20. In addition, the beam damper 22 is attached to the first stage 20 via a heat insulating material 23. The heat insulating material 23 prevents the heat of the beam damper 22, which is heated by receiving the laser light L, from being transmitted to the first stage 20.

[0026] Beam dumper 22 is provided in a state of extending in first direction D1 along first direction D1. With this configuration, even when first stage 20 moves in first direction D1, laser light L can be received by beam dumper 22. Beam dumper 22 is disposed outside the movement range of second stage 30 described later. That is, beam dumper 22 is disposed on the +Y side of Y guide 31 described later, and is disposed outside the movement range of second stage 30 in the Y direction. With this configuration, interference between second stage 30 and beam dumper 22 can be prevented. Note that beam dumper 22 may be disposed on second stage 30 instead of on first stage 20.

[0027] The second stage 30 is provided on the first stage 20 via a Y guide 31. Therefore, the second stage 30 moves in the first direction D1 while being placed on the first stage 20. The second stage 30 moves along the Y guide 31 in a second direction D2 that intersects with both the Z direction, which is the emission direction of the laser light L, and the X direction, which is the first direction D1, relative to the first stage 20. In this embodiment, the second direction D2 is the Y direction. The Y guide 31 is provided so as to extend close to the -Y side of the beam dumper 22. Therefore, as described above, the second stage 30 does not interfere with the beam dumper 22.

[0028] The rotary table 40 is provided on the second stage 30. The rotary table 40 is, for example, disk-shaped. The rotary table 40 is provided so as to be rotatable (swivelable) around a rotation axis (axis line) AX1. In this embodiment, the rotation axis AX1 is parallel to the Z direction. The rotary table 40, while placed on the second stage 30, is moved in a first direction D1 by the first stage 20, and further moved in a second direction D2 by the second stage 30. An annular plate (plate) 41 is detachably attached to the rotary table 40. One or more holders 42 are attached to the annular plate 41. That is, the holder 42 is detachable from the rotary table 40. The holder 42 holds and fixes the cutting tool T.

[0029] The annular plate 41 has a circular ring shape and is attached to the rotary table 40 so that its center coincides with the rotation axis AX1 of the rotary table 40. Any number of holders 42 may be attached to the annular plate 41. For example, when a plurality of holders 42 are attached to the annular plate 41, by attaching the annular plate 41 to the rotary table 40, the rotary table 40 will have a plurality of holders 42 for fixing cutting tools T.

[0030] Furthermore, when multiple holders 42 are attached to the annular plate 41, multiple cutting tools T can be replaced collectively by replacing the annular plate 41 with respect to the rotary table 40. Furthermore, by rotating the rotary table 40 to which the annular plate 41 is attached about the rotation axis AX1, any one of the multiple cutting tools T can be easily assigned to a processing position by the laser light L. The holders 42 and the annular plate 41 will be described in detail later.

[0031] The driving unit 50 changes the relative position between the laser light L and the cutting tool T. In this embodiment, the driving unit 50 drives the laser head 13, the first stage 20, the second stage 30, and the rotary table 40. Furthermore, in this embodiment, the driving unit 50 oscillates the oscillator 11. The driving unit 50 has an X driving unit 50X, a Y driving unit 50Y, a rotary driving unit 50R, an oscillating driving unit 50S, and a Z driving unit 50Z. The X driving unit 50X moves the first stage 20 in a first direction D1. The Y driving unit 50Y moves the second stage 30 in a second direction D2. The rotary driving unit 50R oscillates the oscillator 11 (the rotary table 15) around the oscillating axis AX2. The Z driving unit 50Z raises and lowers the laser head 13 in the emission direction D3.

[0032] The X driving unit 50X can move the position of the cutting tool T in a first direction D1 within the processing area AR1, between the processing area AR1 and the measurement area AR2, and in the first direction D1 within the measurement area AR2. The Y driving unit 50Y can move the position of the cutting tool T in a second direction D2 within the processing area AR1, and in the second direction D2 within the measurement area AR2.

[0033] The rotary drive unit 50R can change the cutting edge direction D4 (the direction in which the cutting edge Ta of the linear cutting edge T1 extends linearly) of the linear cutting edge T1 of the cutting tool T held by the holder 42 by rotating the rotary table 40 around the rotation axis AX1. In addition, when a plurality of holders 42 are attached to the annular plate 41 on the circumference as shown in Figs. 10 and 14, it is also possible to index each holder 42 to a processing position. The Z drive unit 50Z can adjust the height (position in the Z direction) of the processable area LA of the laser light L irradiated from the laser head 13 by moving the laser head 13 in the emission direction D3.

[0034] Each of the driving units 50 may be, for example, a linear motor mechanism, a ball screw mechanism using an electric rotary motor, a rack and pinion mechanism using an electric rotary motor, a cylinder device using hydraulic pressure or pneumatic pressure, etc. The operation of each of the driving units 50 is controlled by the control unit 70. In addition, the movement amount or movement position of the first stage 20, the movement amount or movement position of the second stage 30, the rotation amount or rotation position of the turntable 40, and the lift amount or lift position of the laser head 13 are acquired by the control unit 70 based on, for example, an output from an encoder.

[0035] The measurement unit 60 has a first sensor 61 and a second sensor 62. The first sensor 61 is disposed corresponding to the measurement area AR2. The second sensor 62 is disposed corresponding to the processing area AR1 separately from the first sensor 61. Since the first sensor 61 is disposed corresponding to the measurement area AR2 different from the processing area AR1 in this manner, interference with the second sensor 62 can be prevented. Since the first sensor 61 and the second sensor 62 are disposed in different areas, interference due to the wavelength of the detection light (laser light) can be prevented. The first sensor 61 detects the cutting edge direction D4 of the straight cutting edge T1 for the cutting tool T disposed in the measurement area AR2.

[0036] The first sensor 61 detects at least one of the cutting edge position and cutting edge direction D4 of the straight cutting edge T1. For example, the first sensor 61 is a shape measurement sensor that can calculate the three-dimensional shape of the cutting edge Ta by irradiating detection light onto the cutting edge Ta and receiving the reflected light. The first sensor 61 is supported on the bed 80 via an angle adjustment mechanism 63. The first sensor 61 can adjust the detection angle with respect to the cutting edge Ta by the angle adjustment mechanism 63. The angle adjustment mechanism 63 will be described in detail later.

[0037] When the first sensor 61 is a shape measurement sensor, for example, a line light is obliquely irradiated onto the cutting edge Ta as a detection light, the line light is scanned along the cutting edge direction D4, and the three-dimensional shape of the cutting edge Ta at the straight cutting edge T1 is measured from the reflected light. The first sensor 61 calculates the three-dimensional shape of the straight cutting edge T1Ta, so that at least one of the cutting edge position and the cutting edge direction D4 at the straight cutting edge T1 can be detected with high accuracy without contact. In addition, by measuring the shape of the cutting edge Ta before forming, it can be used to determine how to actually process the cutting edge. It is possible to process not only parallel to the first direction D1 (X-axis), but also tilted at a specified arbitrary angle. It is also possible to process the cutting edge Ta at an arbitrary length from both ends at a specified angle.

[0038] The first sensor 61 can measure the cutting edge Ta after shaping by the laser light L. That is, after shaping the straight cutting edge T1 of the cutting tool T by the laser light L, or during shaping, the first sensor 61 can measure the shape or position of the straight cutting edge T1 after shaping or during shaping. In this way, the first sensor 61 can be used for both detecting the cutting edge position or cutting edge direction before shaping and measuring the cutting edge after shaping. Note that the first sensor 61 is not limited to being the shape measurement sensor described above. For example, a non-contact sensor such as a laser length measuring machine may be used, or a contact type sensor that measures the shape or position by contacting a probe or the like may be used.

[0039] The second sensor 62 detects light generated by the cutting edge Ta of the straight cutting edge T1 being struck by the machineable area LA of the laser light L with respect to the cutting tool T arranged in the machining area AR1. The second sensor 62 can detect whether the position of the cutting edge Ta is at a predetermined position by detecting light generated by the machineable area LA of the laser light L striking the cutting edge Ta. The second sensor 62 is supported on the bed 80 via a stay or the like so as to be directed to the machining position of the cutting edge Ta by the machineable area LA of the laser light L. Note that when the machineable area LA of the laser light L strikes the cutting edge Ta, plasma light according to the material of the cutting edge Ta is generated. The second sensor 62 detects this plasma light. A spectrometer capable of detecting plasma light can be used as the second sensor 62. By using a spectrometer as the second sensor 62 and detecting the plasma light with this spectrometer, it is possible to accurately detect that the machineable area LA of the laser light L strikes the cutting edge Ta.

[0040] The second sensor 62 outputs the spectrum of the plasma light as the detection result. The control unit 70 judges at least one of the following: that the intensity of a predetermined wavelength in the spectrum output from the second sensor 62 exceeds a preset threshold value, and that the intensity of the predetermined wavelength falls below the threshold value. The predetermined wavelength is set to, for example, a wavelength of high light intensity in the generated plasma light.

[0041] The second sensor 62 may also include a bandpass filter that attenuates or blocks light of a wavelength used as the laser light L and transmits light of a wavelength different from that of the laser light L. In this case, the bandpass filter attenuates or blocks light of a wavelength used as the laser light L, thereby reducing the influence of the laser light L on the detection result of the second sensor 62 and making it possible to more accurately detect whether the machineable region LA of the laser light L is hitting the cutting edge Ta.

[0042] FIG. 6 is a diagram showing an example of the operation of the rotary table 40. As shown in FIG. 6, the control unit 70 can adjust the posture of the cutting tool T so that, for example, the cutting edge direction D4 of the straight cutting edge T1 is parallel to the first direction D1 (X direction) by rotating the rotary table 40 around the rotation axis AX1 according to the detection result of the first sensor 61. The control unit 70 calculates the cutting edge position of the cutting edge Ta of the straight cutting edge T1 and the cutting edge direction D4 according to the detection result from the first sensor 61. The control unit 70 determines whether the calculated cutting edge direction D4 is inclined with respect to the first direction D1, and if it is inclined (see the dotted line in FIG. 6), drives the rotary drive unit 50R (see FIG. 1) to rotate the rotary table 40 around the rotation axis AX1 so that the cutting edge direction D4 is parallel to the first direction D1. In addition, it is also possible to drive and rotate the rotary drive unit 50R to a position inclined by a specified angle as necessary. FIG. 7 shows an example of the angle between the first direction D1 and the cutting edge direction D4, where (A) is when θ=K, (B) is when θ=X, and (C) is when θ=0. As shown in FIG. 7(A), when the cutting tool T is held by the holder 42 and the rotary table 40 is rotated to allocate the cutting tool T to the processing position (when the cutting tool T is set), the angle θ of the cutting edge direction D4 with respect to the first direction D1 is angle K from the detection result from the first sensor 61. From this state, the control unit 70 drives the rotary table 40 to rotate it until it becomes the specified angle X, so that the cutting edge direction D4 can be inclined by the angle X with respect to the first direction D1, as shown in FIG. 7(B). Also, as shown in FIG. 7(C), the control unit 70 drives the rotary table 40 to rotate it until the angle θ becomes 0, so that the cutting edge direction D4 can be made parallel to the first direction D1.

[0043] FIG. 8 is a diagram showing an example of irradiating the cutting edge Ta of the cutting tool T with the laser light L in the machineable area LA. As shown in FIG. 8, the laser light L is emitted from the laser head 13 in the emission direction D3. This laser light L converges toward the focal position and then diffuses to reach the beam damper 22. In the vicinity of the focal position of the laser light L, a machineable area LA with high energy density (where the cutting edge Ta can be formed) is formed in a cylindrical or nearly cylindrical area centered on the optical axis L1. While this machineable area LA is applied to the cutting edge Ta, the laser light L and the cutting tool T are moved relatively in the first direction D1, whereby the cutting edge Ta of the straight cutting edge T1 is formed by the laser light L. Note that while the machineable area LA is applied to the cutting edge Ta, the above-mentioned plasma light is generated, and this plasma light is detected by the second sensor 62.

[0044] The cutting tool T in this embodiment is used in cutting processing and has a straight cutting edge T1. One surface having the straight cutting edge T1 as one side is a flank Tb, and the other surface having the straight cutting edge T1 as one side is a rake face Tc. FIG. 9 is a diagram showing an example of a cutting tool T on which a cutting edge Ta is formed. The cutting tool T before forming the cutting edge Ta is formed in a state having a straight cutting edge T1 (cutting edge Ta) by, for example, powder metallurgy or the like. A new (for example, sharp) cutting edge is formed on this cutting tool T by removing a part of the flank Tb and the rake face Tc by the processable area LA of the laser light L. In FIG. 9, the arrow indicates the direction in which the laser light L is irradiated, and the hatched portion in the figure is the part removed by the processable area LA of the laser light L.

[0045] FIG. 10 is a perspective view of an example of the annular plate 41 seen from diagonally above. A plurality of flank holders 43 are attached to the upper surface side of the annular plate 41 shown in FIG. 10. The flank holders 43 are used when forming the flank Tb of the straight cutting edge T1. A plurality of flank holders 43 are arranged at equal intervals along the circumferential direction of the annular plate 41. FIG. 10 shows an example in which the flank holders 43 are arranged on a part of the circumferential direction of the annular plate 41, but is not limited to this configuration. The flank holders 43 may be arranged, for example, over the entire circumferential direction of the annular plate 41.

[0046] The flank holder 43 is detachable from the annular plate 41 with bolts or the like. By making the flank holder 43 detachable from the annular plate 41, the annular plate 41 can be replaced with the same type of holder 42 or a different holder 42. The flank holder 43 is provided so that when the cutting tool T is held, the cutting edge direction D4 of the straight cutting edge T1 of the cutting tool T is parallel or approximately parallel to the tangent direction at the outer periphery of the annular plate 41.

[0047] The inner peripheral surface of the annular plate 41 is a positioned portion 41a. The positioned portion 41a is circular in a plan view and has a shape into which a positioning portion 40a of the turntable 40, which will be described later, can be inserted. When the annular plate 41 is attached to the turntable 40, the positioning portion 40a fits into the positioned portion 41a, so that the annular plate 41 is held in a state aligned with the rotation axis AX1 of the turntable 40.

[0048] FIG. 11 is a perspective view of an example of the annular plate 41, seen from diagonally below. As shown in FIG. 11, the annular plate 41 has holes 41b for positioning the annular plate 41 relative to the rotary table 40 in the axial direction of the rotary axis AX1. The holes 41b are, for example, circular, and are formed in the thickness direction of the annular plate 41. The holes 41b may or may not penetrate the annular plate 41. The holes 41b have a shape that allows the insertion of a diamond pin 40b of the rotary table 40, which will be described later. On the lower surface (rear surface) of the annular plate 41, plate-like bodies 41c are provided at a plurality of locations surrounding the positioned portion 41a.

[0049] When the annular plate 41 is attached to the rotary table 40, the diamond pin 40b is inserted into the hole 41b, and the deviation around the rotation axis AX1 with respect to the rotary table 40 is restricted. As a result, the angles in the rotational direction of the annular plate 41 and the rotary table 40 can be matched. That is, the hole 41b acts as a portion to be positioned, and the diamond pin 40b acts as a positioning portion.

[0050] Fig. 12 is a perspective view showing an example of the rotary table 40. As shown in Fig. 12, the rotary table 40 has a positioning portion 40a, a diamond pin 40b, a plate-like body 40c, and a clamp member 40d. The positioning portion 40a is cylindrical and is provided so as to protrude from the upper surface (the surface on the +Z side) of the rotary table 40. The positioning portion 40a is inserted into the positioned portion 41a of the annular plate 41 to position the annular plate 41 relative to the rotary table 40 in the first direction D1 (X direction) and the second direction D2 (Y direction), thereby aligning the center of the rotation axis AX1 of the rotary table 40 with the center of the annular plate 41.

[0051] The diamond pin 40b has a shape that allows it to be inserted into the hole 41b of the annular plate 41. The diamond pin 40b is provided to protrude upward (to the +Z side) from one of the plate-like bodies 40c. The plate-like bodies 40c are provided at multiple locations on the upper surface of the turntable 40 so as to surround the cylindrical positioning portion 40a. When the annular plate 41 is attached to the turntable 40, the plate-like body 40c comes into contact with the plate-like body 41c on the lower surface of the annular plate 41.

[0052] The clamp members 40d are provided at a plurality of locations on the upper surface of the positioning portion 40a. For example, as in this embodiment, the three clamp members 40d are arranged corresponding to the plate-like bodies 40c, and are arranged so as to be slidable outward. When the annular plate 41 is attached to the rotary table 40, the clamp members 40d sandwich a part of the annular plate 41 between the plate-like bodies 40c, thereby fixing the annular plate 41 to the rotary table 40. The number and arrangement of the clamp members 40d are arbitrary. In addition, as long as the annular plate 41 can be fixed to the rotary table 40, any clamp member (clamp mechanism) can be applied without being limited to the illustrated form.

[0053] FIG. 13 is a perspective view showing a state where the annular plate 41 is mounted on the rotary table 40. As shown in FIG. 13, the annular plate 41 is mounted on the rotary table 40 with the positioned portion 41a fitted into the positioning portion 40a. At this time, the rotational position of the annular plate 41 is set with respect to the rotary table 40 so that the diamond pin 40b is inserted into the hole portion 41b. With the diamond pin 40b inserted into the hole portion 41b, the tip of the clamp member 40d is slid so as to protrude upward from the annular plate 41, and a bolt or the like is tightened to press the plate-like body 41c on the lower surface of the annular plate 41 against the plate-like body 40c with the tip portion of the clamp member 40d, whereby the annular plate 41 is fixed to the rotary table 40 in a state where it is sandwiched between the clamp member 40d and the plate-like body 40c via the plate-like body 41c.

[0054] When removing the annular plate 41 from the rotary table 40, the bolt of the clamp member 40d is loosened and the clamp member 40d is slid inward, whereby the annular plate 41 can be removed from the rotary table 40. In the above-described embodiment, the hole 41b is provided in the annular plate 41 and the diamond pin 40b is provided in the rotary table 40, but a pin may be provided in the annular plate 41 and a hole may be provided in the rotary table 40.

[0055] FIG. 14 is a perspective view of another example of the annular plate seen from diagonally above. A plurality of rake face holders 44 are attached to the annular plate 41 shown in FIG. 14. The rake face holders 44 are used when forming the rake face Tc of the straight cutting edge T1. The rake face holders 44 are arranged at equal intervals along the circumferential direction of the annular plate 41, similar to the above-mentioned flank face holders 43. FIG. 14 shows an example in which the rake face holders 44 are arranged on a part of the circumferential direction of the annular plate 41, but is not limited to this configuration. The rake face holders 44 may be arranged, for example, over the entire circumferential direction of the annular plate 41.

[0056] The rake face holder 44 is detachable from the annular plate 41 by bolts or the like. The annular plate 41 can be replaced with the same or a different holder 42. For example, the rake face holder 44 can be entirely or partially removed from the annular plate 41, and the above-mentioned flank face holder 43 can be attached instead. That is, the annular plate 41 can be shared by the flank face holder 43 and the rake face holder 44. The rake face holder 44, like the flank face holder 43, is provided so that when a cutting tool T is held, the cutting edge direction D4 of the straight cutting edge T1 of the cutting tool T is parallel or nearly parallel to the tangent direction at the outer periphery of the annular plate 41.

[0057] In the above embodiment, the diamond pin 40b of the rotary table 40 is inserted into the hole 41b of the annular plate 41, but the present invention is not limited to this embodiment. FIG. 15 is a cross-sectional view showing a part of the state in which the annular plate 41 is attached to the rotary table 40. As shown in FIG. 15, a convex portion 40e and a concave portion 41e may be used instead of the diamond pin 40b and the hole 41b. A convex portion 40e is provided on the upper surface (+Z side surface) of the plate-like body 40c of the rotary table 40, and a concave portion 41e that fits with the convex portion 40e is provided on the lower surface (-Z side surface) of the annular plate 41. Also, a curvic coupling may be used instead of the positioning portion 40a, the positioned portion 41a, the diamond pin 40b, and the hole 41b.

[0058] When the annular plate 41 is attached to the turntable 40, the convex portion 40e fits into the concave portion 41e, thereby restricting the annular plate 41 from shifting about the rotation axis AX1 relative to the turntable 40. As a result, the angles of the rotational directions of the annular plate 41 and the turntable 40 can be made to match. That is, the concave portion 41e acts as a portion to be positioned, and the convex portion 40e acts as a positioning portion.

[0059] FIG. 16 is a plan view showing an example of the holder 42. FIG. 17 is a side view of the holder 42 shown in FIG. 16. FIG. 16 and FIG. 17 show the flank holder 43. The flank holder 43 is used when machining the flank Tb of the straight cutting edge T1 of the cutting tool T. As shown in FIG. 16 and FIG. 17, the flank holder 43 has a base 43a, tool arrangement surfaces 43b1 and 43b2, a tool positioning portion 43c, and a leaf spring (elastic member) 43d. The base 43a is fixed to the upper surface of the annular plate 41 by, for example, a bolt or the like. The tool arrangement surfaces 43b1 and 43b2 are provided so that the arranged cutting tool T faces the outside of the annular plate 41. The tool arrangement surface 43b1 contacts the surface of the cutting tool T (the surface including the rake face Tc). The tool placement surface 43b2 comes into contact with the surface of the cutting tool T opposite to the straight cutting edge T1.

[0060] The tool positioning portion 43c is provided on one side of the base portion 43a. The tool positioning portion 43c comes into contact with a side surface of the cutting tool T arranged on the tool arrangement surfaces 43b1, 43b2. The tool positioning portion 43c restricts the cutting tool T from shifting in the cutting edge direction D4.

[0061] The leaf spring 43d is attached to the base 43a by a bolt 43e. The leaf spring 43d holds the cutting tool T arranged on the tool arrangement surfaces 43b1 and 43b2 by its elastic force. The cutting tool T is held in a state sandwiched between the leaf spring 43d and the tool arrangement surface 43b1 by the elastic force of the leaf spring 43d. The cutting tool T is held in a state positioned with respect to the flank holder 43 by contacting the tool arrangement surfaces 43b1 and 43b2, respectively, and abutting against the tool positioning portion 43c. That is, the cutting tool T held by the flank holder 43 is in a state in which the cutting edge Ta of the straight cutting edge T1 is positioned with respect to the annular plate 41 (rotary table 40).

[0062] The elastic force of the leaf spring 43d may be such that the cutting tool T does not shift due to the movement of the first stage 20 in the X direction or the rotation of the rotary table 40. The elastic force of the leaf spring 43d may be such that an operator can hold the gripping portion 44f provided on the leaf spring 43d by hand and lift it up. In the tool cutting edge forming device 100 according to the present embodiment, the cutting edge Ta of the straight cutting edge T1 is formed by the laser light L. Therefore, no physical force acts on the cutting tool T during processing. Therefore, by simply holding the cutting tool T by the elastic force of the leaf spring 43d, the positional shift of the cutting tool T during processing can be sufficiently suppressed, and fixing the cutting tool T by a clamp or the like is not required.

[0063] The cutting tool T is inserted from the side opposite to the side where the tool positioning portion 43c is arranged, with the leaf spring 43d lifted, and is arranged by butting the cutting tool T against the tool positioning portion 43c and abutting the tool arrangement surfaces 43b1 and 43b2. In this manner, the cutting tool T is sandwiched and fixed by the leaf spring 43d, so that the cutting tool T can be easily replaced with respect to the flank holder 43.

[0064] Fig. 18 is a plan view showing another example of the holder 42. Fig. 19 is a side view of the holder 42 shown in Fig. 18. Figs. 18 and 19 show a rake face holder 44. The rake face holder 44 is used when machining the rake face Tc of the straight cutting edge T1 of the cutting tool T. As shown in Figs. 18 and 19, the rake face holder 44 has a base 44a, tool arrangement surfaces 44b1, 44b2, a tool positioning portion 44c, and a leaf spring (elastic member) 44d.

[0065] The base 44a is, for example, plate-shaped and fixed to the annular plate 41. The base 44a is arranged with the plate surface standing against the surface on the +Z side of the annular plate 41. The tool arrangement surface 44b is arranged at the end of the base 44a on the -Z side. The tool arrangement surface 44b is formed in a stepped shape with respect to the base 44a. The tool arrangement surface 44b supports the cutting tool T in a state of contacting the surface of the cutting tool T opposite to the straight cutting edge T1Ta. The base 44a is fixed to the upper surface of the annular plate 41 by, for example, a bolt or the like. The tool arrangement surfaces 44b1 and 44b2 are provided so that the arranged cutting tool T faces the outside of the annular plate 41. The tool arrangement surface 44b1 contacts the surface of the cutting tool T (the surface including the flank surface Tb). The tool arrangement surface 44b2 contacts the surface of the cutting tool T opposite to the rake face Tc.

[0066] The tool positioning portion 44c is provided on one side of the base 44a. The tool positioning portion 44c contacts the side of the cutting tool T arranged on the tool arrangement surfaces 44b1 and 44b2. The tool positioning portion 44c restricts the cutting tool T from shifting in the cutting edge direction D4. The leaf spring 44d is attached to the base 44a by the bolt 44e. The leaf spring 44d holds the cutting tool T arranged on the tool arrangement surfaces 44b1 and 44b2 by elastic force. The cutting tool T is held in a state sandwiched between the leaf spring 44d and the tool arrangement surface 44b1 by the elastic force of the leaf spring 44d. The cutting tool T is held in a state positioned relative to the rake face holder 44 by contacting the tool arrangement surfaces 44b1 and 44b2, respectively, and then abutting against the tool positioning portion 44c. That is, the cutting tool T held by the rake face holder 44 is in a state in which the cutting edge Ta of the straight cutting edge T1 is positioned relative to the annular plate 41 (the rotary table 40).

[0067] The elastic force of the leaf spring 44d is set similarly to that of the leaf spring 43d of the flank holder 43, and therefore a description thereof will be omitted. That is, in this rake face holder 44 as well, the positional deviation of the cutting tool T during processing can be sufficiently suppressed by simply holding the cutting tool T by the elastic force of the leaf spring 44d, and fixing the cutting tool T by a clamp or the like is not necessary.

[0068] The cutting tool T is inserted from the side opposite to the side where the tool positioning portion 44c is arranged, with the leaf spring 44d lifted, and is placed by butting it against the tool positioning portion 44c and abutting it against the tool arrangement surfaces 44b1, 44b2. In this way, the cutting tool T is sandwiched and fixed by the leaf spring 44d, so that the cutting tool T can be easily replaced with respect to the rake face holder 44.

[0069] FIG. 20 is a cross-sectional view showing another example of the holder 42. The holder 42 shown in FIG. 20 is a rake face holder 45. As shown in FIG. 20, the rake face holder 45 has a base 45a, tool placement surfaces 45b1 and 45b2, a pressing member 45d, a shaft member 45e, and a ball plunger mechanism 46. The base 45a and the tool placement surfaces 45b1 and 45b2 are similar to the base 44a and the tool placement surfaces 44b1 and 44b2 of the rake face holder 44 shown in FIG. 18 and FIG. 19, respectively. Note that the rake face holder 45 in FIG. 20 does not show a tool positioning portion, but has a tool positioning portion similar to the tool positioning portion 44c shown in FIG. 18.

[0070] The pressing member 45d is plate-shaped, and its central portion is rotatably supported by the shaft member 45e. An upper end of the pressing member 45d receives elastic force from the ball plunger mechanism 46. A lower end of the pressing member 45d sandwiching the shaft member 45e is used as a portion for pressing the cutting tool T. The ball plunger mechanism 46 has a spring accommodating portion 46a, a coil spring (elastic member) 46b, and a ball 46c. The ball plunger mechanism 46 is attached by screwing into a screw hole penetrating the base portion 45a. The coil spring 46b is accommodated in the spring accommodating portion 46a. The ball 46c is disposed at the tip of the spring accommodating portion 46a, and is given elastic force toward the outside by the coil spring 46b.

[0071] By attaching the ball plunger mechanism 46 to the base 45a, the ball 46c presses the upper end of the pressing member 45d, and as a result, the lower end of the pressing member 45d presses the cutting tool T against the tool arrangement surface 44b2. That is, the cutting tool T is held in a state sandwiched between the lower end of the pressing member 45d and the tool arrangement surface 44b2. By loosening the screw connection between the ball plunger mechanism 46 and the base 45a, the ball 46c moves toward the base 45a. As a result, the lower end of the pressing member 45d is released from the pressure of the ball 46c, and the operator can lift it by hand.

[0072] The cutting tool T is placed by inserting the cutting tool T from the side opposite to the side where the tool positioning unit (not shown) is placed, while the lower end of the pressing member 45d is held up by the operator, and butting it against the tool positioning unit and abutting it against the tool placement surfaces 45b1 and 45b2. After placing the cutting tool T, the ball plunger mechanism 46 is screwed in, so that the balls 46c push the upper end of the pressing member 45d, and the cutting tool T can be held in the rake face holder 45. The cutting tool T is clamped and fixed by the screwing operation of the ball plunger mechanism 46, so that the cutting tool T can be easily replaced with respect to the rake face holder 45.

[0073] Fig. 21 is a diagram showing an example of a state in which the first sensor 61 is directed toward the blade edge Ta. Fig. 22 is a diagram showing another example of a state in which the first sensor 61 is directed toward the blade edge Ta. As shown in Figs. 21 and 22, the first sensor 61 is supported by an angle adjustment mechanism 63. The angle adjustment mechanism 63 allows the first sensor 61 to adjust the orientation (detection angle) of the first sensor 61 when measuring the blade edge Ta.

[0074] The angle adjustment mechanism 63 has a base portion 63a, a sensor support base 63b, an axis portion 63c, a bearing portion 63d, a locking portion 63e, a movable portion 63f, and a driving portion 63g. The base portion 63a is supported by the bed 80. The sensor support base 63b is plate-shaped, and the first sensor 61 is fixed thereto. The axis portion 63c is provided so as to protrude from the sensor support base 63b in the X direction (first direction D1). The bearing portion 63d is provided so as to protrude upward from the base portion 63a, and rotatably supports the axis portion 63c. With this configuration, the sensor support base 63b is rotatable around the axis in the first direction D1 with the axis portion 63c as the center.

[0075] The locking portion 63e is provided at the lower end of a protruding portion 63h that protrudes downward (-Z direction) from the lower surface of the sensor support base 63b. The movable portion 63f is movable in a second direction D2 (Y direction) along the upper surface of the base portion 63a. The movable portion 63f is provided with a guide hole 63i into which the locking portion 63e is inserted. The guide hole 63i is provided inclined in the +Z direction from the -Y side end to the +Y side end. The driving portion 63g moves the movable portion 63f along the second direction D2 (Y direction) between a first position P1 on the -Y side and a second position P2 on the +Y side. For example, a linear motor mechanism, a ball screw mechanism using an electric rotary motor, a cylinder device using air pressure or hydraulic pressure, etc. are used as the driving portion 63g.

[0076] The sensor support base 63b is supported so as to be inclined toward the +Z side from the -Y side to the +Y side. As shown in FIG. 21, when the movable part 63f is disposed at the first position P1, the locking part 63e is located near the -Y side end of the guide hole 63i. In this state, the sensor support base 63b is inclined at an angle θ1 with respect to the Y direction, and the inclination of the first sensor 61 is small. This inclination θ1 of the first sensor 61 is in a state in which the first sensor 61 is oriented in accordance with the rake face Tc of the cutting tool T held by the rake face holder 44. As a result, the first sensor 61 can accurately measure the shape of the cutting edge Ta including the rake face Tc.

[0077] 22, when the movable part 63f is located at the second position P2, the locking part 63e is located near the +Y side end of the guide hole 63i. In this state, the sensor support base 63b is inclined at an angle θ2 with respect to the Y direction, and the inclination of the first sensor 61 is large. This inclination θ2 of the first sensor 61 is in a state where the first sensor 61 is oriented in accordance with the flank Tb of the cutting tool T held by the flank holder 43. As a result, the first sensor 61 can accurately measure the shape of the cutting edge Ta including the flank Tb.

[0078] The driving of the driving unit 63g is controlled by the control unit 70. When measuring the cutting edge Ta of the cutting tool T held by the rake face holder 44, the control unit 70 drives the driving unit 63g to position the movable unit 63f at the first position P1, and when measuring the cutting edge Ta of the cutting tool T held by the flank face holder 43, the control unit 70 drives the driving unit 63g to position the movable unit 63f at the second position P2. In addition, it is possible to set a plurality of first positions P1 and second positions P2 by issuing a command from the control unit 70 to set any specified angle in accordance with the measurement of the machined surface after machining of the cutting edge Ta.

[0079] In this way, the angle adjustment mechanism 63 switches the angle of the sensor support base 63b between measuring the rake face Tc of the cutting tool T and measuring the flank Tb, and adjusts the orientation of the first sensor 61 to an orientation suitable for measuring the rake face Tc or the flank Tb, so that the shape of the cutting edge Ta can be measured with high accuracy. Note that the angle adjustment mechanism 63 is not limited to the above-mentioned configuration, and any configuration that can change the angle (inclination) of the first sensor 61 can be applied. For example, a configuration in which the first sensor 61 is attached to a shaft that rotates around an axis in the first direction D1 (X direction) and the angle (inclination) of the first sensor 61 is changed by rotating the shaft may be applied.

[0080] In the above embodiment, the configuration in which the emission direction D3 of the laser light L from the laser head is parallel to the Z direction has been described as an example, but the present invention is not limited to this configuration. For example, the emission direction D3 of the laser light L may be tilted around the axis of the first direction D1 by providing a mechanism for changing the optical axis to an arbitrary direction by swinging or rotating an optical device such as a galvano scanner or a polygon mirror. Figure 23 shows a state in which the oscillator 11 is swung, where (A) is a diagram showing the change in the optical axis L1 of the laser light L relative to the optical system 12, and (B) is a diagram showing the tilt of the optical axis L1 of the laser light L relative to the cutting edge Ta.

[0081] 23(A), when the oscillator 11 is swung around the axis of the oscillation axis AX2, the emission direction D3 of the laser light L emitted from the laser head 13 is inclined around the axis of the first direction D1 with respect to a predefined direction (for example, the direction of the optical axis L1) depending on the oscillation angle. When the laser light L emitted from the oscillator 11 is obliquely incident on the optical axis of the optical system 12, the position of the optical axis of the laser light L changes in the mirror 16 of the optical system 12, etc. Due to this change, the emission direction D3 of the laser light L emitted from the laser head 13 is inclined around the axis of the first direction D1 or the second direction D2.

[0082] When the optical axis L1 of the laser light L emitted from the oscillator 11 is inclined at an angle θ to the optical axis L2 as shown in Fig. 23(A), the laser light L is emitted from the laser head 13 as an optical axis L2 inclined at an angle θ around the axis of the first direction D1 with respect to the optical axis L1 according to the angle θ as shown in Fig. 23(B). When the optical axis L1 of the laser light L emitted from the oscillator 11 is inclined to the optical axis L3 as shown in Fig. 23(A), the laser light L is emitted from the laser head 13 as an optical axis L3 inclined around the axis of the first direction D1 with respect to the optical axis L1 as shown in Fig. 23(B). By utilizing these, the optical axis that has shifted as in the optical axis L2 or the optical axis L3 can be adjusted to the optical axis L1 to perform the required processing, and the above-mentioned adjustment is easy.

[0083] In this way, by swinging the oscillator 11 around the axis of the swing axis AX2, the laser light L emitted from the laser head 13 can be easily tilted around the axis of the first direction D1. Also, by tilting the laser light L emitted from the laser head 13 around the axis of the first direction D1 within a range of angle θ, the optical axis can be changed within a range of angle θL so as to be the set incident angle φ of the laser light L irradiated to the cutting edge Ta of the cutting tool T. For example, as shown in FIG. 23(B), when the laser light L is irradiated to the flank Tb of the cutting tool T, it is possible to easily set the appropriate incident angle φ with respect to the flank Tb by tilting the optical axis L2 of the laser light L around the axis of the first direction D1 by an angle θL.

[0084] In the above embodiment, the oscillator 11 is swung to tilt the laser light L emitted from the laser head 13 around the axis of the first direction D1, but the present invention is not limited to this configuration. For example, a configuration in which any one of the first stage 20, the second stage 30, and the rotary table 40 is rotatable (tiltable) around the axis of the first direction D1 (X direction) may be applied. According to this configuration, by rotating (tilting) the first stage 20, etc. around the axis of the first direction D1, the cutting tool T is tilted around the axis of the first direction D1 with respect to the emission direction D3 of the laser light L. That is, the optical axis L1 of the laser light L is inclined around the axis of the first direction D1 with respect to the cutting tool T. In addition, any one of the first stage 20, the second stage 30, and the rotary table 40 may be configured to be rotatable around the axis of the second direction D2 (Y direction), or may be configured to be rotatable in both the first direction D1 and the second direction D2.

[0085] FIG. 24 is a functional block diagram of the tool edge forming device 100 according to the embodiment. As shown in FIG. 24, the control unit 70 controls the tool edge forming device 100 in an integrated manner. The control unit 70 has a calculation unit 71 and a storage unit 72. The calculation unit 71 performs various calculations. The storage unit 72 not only stores various information such as preset threshold values, but also stores measurement data of various sensors, and can output the data as quality data after machining of the cutting edge Ta. The control unit 70 accepts input from the input unit 73. The input unit 73 is, for example, a keyboard, a mouse, a joystick, a touchpad, or the like. The control unit 70 can output the processing result to the display unit 74. The display unit 74 is, for example, a liquid crystal display, an organic EL display, or the like.

[0086] The control unit 70, for example, drives the shutter of the oscillator 11 to control the timing of irradiation of the laser light L in the laser head 13, the irradiation energy, etc. The control unit 70 also controls, for example, the timing and drive amount of the drive unit 50, and drives the drive unit 50 to control the lift position of the laser head 13, the moving position of the first stage 20, the moving position of the second stage 30, the rotation position of the rotary table 40, and the swing angle of the oscillator 11 by performing position feedback. In addition, in FIG. 24, an X-axis position sensor 60X, a Y-axis position sensor 60Y, a Z-axis position sensor 60Z, a rotation position sensor 60R, and a swing position sensor 60S are described as the measurement unit 60. The X-axis position sensor 60X detects the distance and position of the first stage 20 moving in the first direction D1. The Y-axis position sensor 60Y detects the distance and position of the second stage 30 moving in the second direction D2. The Z-axis position sensor 60Z detects the amount of lift and the lift position (height) of the laser head 13 and the base 13a that are lifted and lowered (moving in the Z direction). The rotational position sensor 60R detects the amount of rotation and the rotation angle (rotational position) of the rotary table 40 that rotates around the axis of the rotation axis AX1. The swing position sensor 60S detects the amount of swing and the swing angle (swing position) of the oscillator 11 that swings around the axis of the swing axis AX2. Note that the X-axis position sensor 60X, the Y-axis position sensor 60Y, the Z-axis position sensor 60Z, the rotational position sensor 60R, and the swing position sensor 60S are omitted in Figs. 1 to 5. For example, a linear encoder, a laser displacement meter, or the like is used for the X-axis position sensor 60X, the Y-axis position sensor 60Y, and the Z-axis position sensor 60Z. For example, a rotary encoder, or the like is used for the rotational position sensor 60R and the swing position sensor 60S.

[0087] The control unit 70 receives the detection results output from the first sensor 61, the second sensor 62, the X-axis position sensor 60X, the Y-axis position sensor 60Y, the Z-axis position sensor 60Z, the rotational position sensor 60R, and the swing position sensor 60S. The control unit 70 performs position feedback from the detection results of the X-axis position sensor 60X, the Y-axis position sensor 60Y, the Z-axis position sensor 60Z, the rotational position sensor 60R, and the swing position sensor 60S, and controls the driving of the X-drive unit 50X, the Y-drive unit 50Y, the Z-drive unit 50Z, the rotational drive unit 50R, and the swing drive unit 50S. The control unit 70 controls the relative position and relative movement between the machining area LA of the laser light L and the cutting tool T by controlling the drive unit 50 according to at least one of the detection results of the first sensor 61 and the second sensor 62 while performing the position feedback described above. The control unit 70, for example, detects the cutting edge direction D4 of the straight cutting edge T1Ta of the cutting tool T using the first sensor 61, and adjusts the rotational position of the rotary table 40 based on the detection result so that the cutting edge direction D4 forms a specified arbitrary angle with the first direction D1. The control unit 70 also performs position control (feedback control) of the first stage 20 based on the detection result of the X-axis position sensor 60X, and further drives the X drive unit 50X according to the detection result of the first sensor 61 to control the relative position and relative movement in the first direction D1 between the processable area LA of the laser light L and the cutting tool T.

[0088] The control unit 70 controls the movement of at least one of the first stage 20 and the second stage 30, for example, based on the output of the second sensor 62. Since the second sensor 62 can identify whether the cutting edge Ta is hit by the processable area LA of the laser light L, the first stage 20 and the second stage 30 can be moved with high precision. For example, based on the detection result of the first sensor 61, the control unit 70 adjusts the position of the cutting edge Ta in the Y direction relative to the processable area LA of the laser light L by moving the second stage 30. With this configuration, the position of the cutting edge Ta can be easily set so that the processable area LA of the laser light L hits the cutting edge Ta.

[0089] The control unit 70 judges, for example, based on the result of the second sensor 62, at least one of the following: the intensity of a predetermined wavelength of the spectrum of the plasma light exceeds a preset threshold value, and the intensity of the predetermined wavelength falls below the threshold value. According to this configuration, the control unit 70 can accurately detect the timing when the processable area LA of the laser light L hits the cutting edge Ta, or the timing when the processable area LA of the laser light L leaves the cutting edge Ta. The position of the first stage 20 at these timings is detected by the X-axis position sensor 60X. For example, based on the detection result of the second sensor 62, the control unit 70 determines the time when the intensity of the predetermined wavelength exceeds the threshold value as the start point of processing the cutting edge by the processable area LA of the laser light L, and the time when the intensity of the predetermined wavelength falls below the threshold value as the end point of processing the cutting edge by the processable area LA of the laser light L. With this configuration, the start point and end point of processing of the straight cutting edge T1Ta can be clearly identified. The control unit 70 may also determine the shape of the cutting edge Ta before shaping based on the detection result of the first sensor 61, and determine the processing operation. The control unit 70 can execute an appropriate machining operation for the cutting edge Ta by checking the shape of the cutting edge Ta. Furthermore, when re-sharpening the cutting edge Ta after it has worn down, it is possible to determine whether or not it is at a level where machining is possible by using the detection result of the first sensor 61.

[0090] FIG. 25 is a flowchart showing an example of a tool cutting edge forming method according to the embodiment. FIG. 26 is a flowchart showing an example of a tool cutting edge forming method according to the embodiment, following FIG. 25. Here, for convenience, the flowchart is based on the assumption that the angle θ between the cutting edge direction D4 and the first direction D1 is the specified angle θ=0 degrees (parallel) (see FIG. 7(C)). The flowcharts of FIG. 25 and FIG. 26 are a tool cutting edge forming method for forming the cutting edge Ta of a cutting tool T having a straight cutting edge T1 by pulse laser grinding, and include using the above-mentioned tool cutting edge forming device 100 to adjust the rotational position of the rotary table 40 based on the output from the first sensor 61 so that the cutting edge direction D4 is parallel to the first direction D1, and after adjusting the rotational position of the rotary table 40, moving the first stage 20 in the first direction D1 while emitting the laser light L from the laser head 13, and forming the cutting edge Ta by the processable area LA of the laser light L.

[0091] In addition, the flowcharts of Figures 25 and 26 are a tool edge forming method for forming the cutting edge Ta of a cutting tool T having a straight cutting edge T1 by pulse laser grinding, and include detecting at least one of the cutting edge position and cutting edge direction D4 of the straight cutting edge T1, detecting light generated when the machineable area LA of the laser light L in pulse laser grinding hits the cutting edge Ta, and controlling the relative position and relative movement between the machineable area LA of the laser light L and the cutting tool T based on the detection result of at least one of the cutting edge position and cutting edge direction D4, and the detection result of the light.

[0092] In addition, the flowcharts of Figures 25 and 26 are a tool edge forming method for forming the cutting edge Ta of a cutting tool T having a straight cutting edge T1 by pulse laser grinding, and include the steps of preparing a plurality of plates (annular plates 41) having a plurality of holders 42 for respectively fixing a plurality of cutting tools T, mounting one of the plates (annular plates 41) on a rotating table 40 that can rotate around an axis (rotation axis AX1) parallel to the emission direction D3 of the laser light L in the pulse laser grinding, forming the cutting edge Ta by the machineable area LA of the laser light L while changing the relative position between the machineable area LA of the laser light L and the cutting tool T, and replacing the plate (annular plate 41) with respect to the rotating table 40.

[0093] As shown in FIG. 25, first, an annular plate 41 (plate) is prepared (step S01). For example, a plurality of annular plates 41 are prepared, and a plurality of holders 42 (flank holders 43 or rake face holders 44) are attached to one annular plate 41. In step S01, the annular plate 41 is prepared by having each of the plurality of holders 42 hold a cutting tool T. The cutting tool T may be held in the holder 42 manually by an operator or by a robot arm or the like. Next, after the cutting tool T is attached to the holder 42, the annular plate 41 is attached to the rotary table 40 (step S02). This step S02 may be performed manually by an operator or by a transport robot or the like.

[0094] Next, after the annular plate 41 is attached to the rotary table 40, an instruction is given to start the cutting edge forming operation of the cutting tool T (step S03). The instruction to start the operation may be given by an operator operating the input unit 73 (see FIG. 24), or may be given by the control unit 70 upon detecting by a sensor or the like that the annular plate 41 is attached to the rotary table 40. Next, the cutting tool T is allocated (step S04). The control unit 70 drives the rotary drive unit 50R to rotate the rotary table 40, and allocates the cutting tool T to be used to form the cutting edge Ta from among the multiple cutting tools T to the processing position. The memory unit 72 (see FIG. 24) previously stores information regarding the number, type, and allocation order of the cutting tools T held by the annular plate 41, and the control unit 70 reads out the information and allocates the cutting tool T to the processing position.

[0095] Next, after the cutting tool T is allocated, the cutting tool T is moved to the measurement area AR2 (step S05). The control unit 70 drives the X drive unit 50X to move the first stage 20 in the -X direction along the first direction D1, and disposes the cutting tool T in the measurement area AR2. Next, based on the information in the storage unit 72 described above, the inclination of the first sensor 61 is adjusted to measure the shape of the cutting edge Ta of the straight cutting edge T1 of the cutting tool T (step S06). The control unit 70 instructs the first sensor 61 to perform measurement. The first sensor 61 outputs the measurement result of the cutting edge Ta to the control unit 70.

[0096] Next, the parallelism between the cutting edge direction D4 of the straight cutting edge T1 and the first direction D1 is calculated based on the measurement result of the first sensor 61 (step S07). The calculation unit 71 of the control unit 70 (see FIG. 24) calculates the three-dimensional shape of the cutting edge Ta from the measurement result of the first sensor 61, and calculates the parallelism between the cutting edge direction D4 of the straight cutting edge T1 obtained from the three-dimensional shape and the first direction D1. The parallelism is indicated, for example, by the magnitude of deviation of the cutting edge direction D4 from the first direction D1. Next, it is determined whether the calculated parallelism is equal to or smaller than a threshold value (step S08). The calculation unit 71 determines whether the calculated parallelism is equal to or smaller than a threshold value previously stored in the storage unit 72.

[0097] Next, if it is determined that the parallelism is greater than the threshold value (NO in step S08), the turntable 40 is rotated (step S09). The control unit 70 drives the rotation drive unit 50R to rotate the turntable 40 so as to reduce the value of the parallelism calculated by the calculation unit 71. That is, the control unit 70 adjusts the rotational position of the turntable 40 so that the first direction D1 and the cutting blade direction D4 are parallel or nearly parallel. After rotating the turntable 40, the processes from step S05 onwards are performed again.

[0098] On the other hand, when it is determined that the parallelism is equal to or less than the threshold value (YES in step S08), the control unit 70 determines that the correction of the cutting tool T is completed (step S10). In step S10, the first direction D1 and the cutting edge direction D4 become parallel or substantially parallel, and the laser light L is relatively movable along the cutting edge direction D4. Subsequently, after the correction of the cutting tool T is completed, the cutting tool T is moved to the processing area AR1 (step S11). The control unit 70 drives the X drive unit 50X to move the first stage 20 in the +X direction along the first direction D1, thereby disposing the cutting tool T in the processing area AR1. For example, the control unit 70 moves the first stage 20 (and the second stage 30) based on the cutting edge position of the straight cutting edge T1 acquired from the detection result of the first sensor 61, and disposes the cutting tool T in the processing area AR1.

[0099] Next, the cutting tool T is moved to the processing area AR1, and then the laser light L is emitted (step S12). The control unit 70 opens the shutter of the oscillator 11 and emits the laser light L from the laser head 13. Prior to the emission of the laser light L, the control unit 70 drives the Z drive unit 50Z to set the laser head 13 to an appropriate height so that the height (position in the Z direction) of the processable area LA of the laser light L corresponds to the height of the cutting edge Ta. Next, after the laser light L is emitted, the second sensor 62 acquires data (step S13). The control unit 70 instructs the second sensor 62 to start acquiring data so as to detect light at the time of or after the emission of the laser light L. The second sensor 62 outputs data of the detected light (spectral spectrum of plasma light) to the control unit 70.

[0100] Next, after the second sensor 62 starts acquiring data, the first stage 20 is moved (step S14). The control unit 70 drives the X drive unit 50X to move the first stage 20 a predetermined distance in the +X direction along the first direction D1, and then moves the first stage 20 in the -X direction to return it to its original position. That is, the cutting tool T is moved back and forth once in the first direction D1 relative to the laser light L (step S14). The predetermined distance is desirably set to, for example, a distance slightly longer than the distance at which the laser light L is assumed to hit the linear cutting edge T1 of the cutting tool T. The predetermined distance and predetermined position of the first stage 20 moving in the first direction D1 are detected by the X-axis position sensor 60X (see FIG. 24). In step S14, the control unit 70 controls the position of the first stage 20 based on the detection result of the X-axis position sensor 60X, while controlling the relative position and relative movement between the laser light L and the cutting tool T according to the output of the first sensor 61.

[0101] Next, the first stage 20 is stopped (step S15), and a machining start point of the cutting edge Ta by the machineable area LA of the laser light L is calculated (step S16). The calculation of the machining start point is performed by the calculation unit 71. The calculation unit 71 determines whether or not the detection result of the second sensor 62 is equal to or greater than the threshold A (step S17). The calculation unit 71 determines whether or not the intensity of a predetermined wavelength is equal to or greater than the threshold A from the spectrum of the plasma light acquired from the second sensor 62. The calculation unit 71 selects a predetermined wavelength determined by, for example, the material of the cutting tool T stored in the storage unit 72, and determines whether or not the intensity of the predetermined wavelength is equal to or greater than the threshold A previously stored in the storage unit 72.

[0102] If it is determined that the intensity of the predetermined wavelength is smaller than the threshold A (NO in step S17), the second stage 30 is moved (step S18). The control unit 70 drives the Y drive unit 50Y to move the second stage 30 a predetermined distance in the +Y direction along the second direction D2. If the intensity of the predetermined wavelength is smaller than the threshold A, it means that the processable area LA of the laser light L does not hit the cutting edge Ta even if the cutting tool T is moved in the first direction D1 in the above-mentioned step S14. Therefore, the control unit 70 moves the second stage 30 a predetermined distance in the +Y direction along the second direction D2. The predetermined distance is a value such as several μm or several mm, which is stored in advance in the storage unit 72. Next, after the cutting tool T is moved a predetermined distance in the +Y direction, the processing from step S14 onwards is performed again.

[0103] On the other hand, when it is determined that the intensity of the light of the predetermined wavelength is equal to or greater than the threshold A (YES in step S17), the calculation unit 71 determines the processing start point (step S19). The calculation unit 71 determines the position (e.g., coordinate values ​​in the X and Y directions) of the cutting tool T (tip Ta) when it is determined that the intensity of the predetermined wavelength is equal to or greater than the threshold A as the processing start point of the tip Ta by the processable area LA of the laser light L.

[0104] FIG. 27 is a diagram showing an example of data acquired by the second sensor 62. In FIG. 27, the horizontal axis of the graph indicates the processing time. The vertical axis of the graph indicates the intensity of light of a predetermined wavelength detected by the second sensor 62 among the plasma light generated when the processable area LA of the laser light L hits the cutting edge Ta. As shown in FIG. 27, the threshold A is set to a value lower than the maximum light intensity. In other words, the threshold A is set to a value in a state in which the processable area LA of the laser light L hits the cutting edge Ta slightly and the amount of generated plasma light is small. In step S19, the calculation unit 71 determines the time when the value detected by the second sensor 62 becomes equal to or greater than the threshold A as the processing start point.

[0105] 26, the calculation unit 71 determines whether or not the total amount of movement of the cutting tool T (cutting edge Ta) from the machining start point in the +Y direction is equal to or greater than a threshold (step S20). The threshold amount of movement is stored in advance in the storage unit 72, and the calculation unit 71 determines whether or not the total amount of movement is equal to or greater than the threshold. If it is determined that the total amount of movement is smaller than the threshold (NO in step S20), the second stage 30 is moved (step S20). The control unit 70 drives the Y drive unit 50Y to move the second stage 30 a predetermined distance in the +Y direction along the second direction D2. The predetermined distance is a value of several μm, several mm, or the like, which is stored in advance in the storage unit 72. The predetermined distance in step S20 may be the same as or different from the predetermined distance in step S18.

[0106] Next, after the second stage 30 is moved, the second sensor 62 is caused to acquire data (step S22). The control unit 70 instructs the second sensor 62 to start acquiring data by detecting light at the timing when the second stage 30 is moved. The second sensor 62 outputs the detected light data (spectral spectrum of plasma light) to the control unit 70. Next, the first stage 20 is caused to repeatedly reciprocate (step S23). The control unit 70 drives the X drive unit 50X to move the first stage 20 in the +X direction along the first direction D1, and then moves the first stage 20 in the -X direction to return to the original position, thereby repeatedly executing one reciprocating movement. The number of repetitions is set in the storage unit 72. In step S23, the movement amount of the first stage 20 is set to a length exceeding the straight cutting edge T1. In this step S23, the cutting edge Ta is formed by the processable area LA of the laser light L.

[0107] FIG. 28 shows a state in which the cutting edge Ta is formed by the processable area LA of the laser light L, (A) is a diagram showing the processable area LA of the laser light L, and (B) is a diagram explaining the processable area. FIG. 29 is a diagram showing the relative movement of the cutting edge Ta and the processable area LA of the laser light L. As shown in FIG. 28(A), the laser light L emitted from the laser head 13 forms a cylindrical processable area LA in a part of the optical axis direction. As shown in FIG. 28(B), the laser light L is a beam whose intensity distribution in a plane perpendicular to the optical axis L1 is close to a Gaussian distribution. The processable area LA is an area of ​​the laser light L that has an energy density equal to or higher than the process threshold H according to the material characteristics of the cutting edge Ta. By bringing the processable area LA into contact with the cutting edge Ta, a part of the cutting edge Ta is ablated, and the cutting edge Ta can be formed. The processable area LA can be defined, for example, by the distance from the optical axis L1 of the laser light L (the radius in the cross section of the laser light L). By defining the processable area LA, it is possible to easily set the positional relationship between the laser light L and the cutting edge Ta.

[0108] As shown in FIG. 29, by moving the cutting tool T along the first direction D1, the machineable area LA of the laser light L is irradiated along the cutting edge Ta of the linear cutting edge T1 (along the cutting edge direction D4). The energy of the machineable area LA of the laser light L and the relative speed between the machineable area LA of the laser light L and the cutting tool T are set so that when the laser light L is irradiated, a part of the surface side of the cutting edge Ta irradiated with the machineable area LA of the laser light L (the hatched part of the cutting edge Ta in FIG. 29) is removed by ablation. If the energy of the machineable area LA of the laser light L is increased or the relative speed between the machineable area LA of the laser light L and the cutting tool T is slowed, the machineable area LA of the laser light L may cause ablation beyond the part to be removed or cause thermal deformation, which is not preferable. Therefore, the same part of the cutting edge Ta is irradiated multiple times to remove a part of the cutting edge Ta in stages, thereby removing the desired part.

[0109] Next, the calculation unit 71 performs a stop determination process (step S24). The calculation unit 71 determines whether or not to stop the movement of the first stage 20 in step S23 based on the detection result of the second sensor 62. The calculation unit 71 determines whether or not the detection result of the second sensor 62 is equal to or greater than threshold B (step S25). The calculation unit 71 determines whether or not the intensity of a predetermined wavelength is equal to or greater than threshold B based on the spectrum of the plasma light acquired from the second sensor 62 (step S25). The calculation unit 71 determines whether or not the intensity of the predetermined wavelength is equal to or greater than threshold B stored in advance in the storage unit 72, similar to step S17.

[0110] If it is determined that the intensity of the predetermined wavelength is equal to or greater than the threshold B (YES in step S25), the process from step S23 onward is performed again. If it is determined that the intensity of the predetermined wavelength is equal to or greater than the threshold B in step S25, the desired portion to be removed has not been completely removed, as described above. Therefore, in this case, the process from step S23 onward is performed again, and the laser light L is repeatedly irradiated to the same location of the cutting edge Ta. On the other hand, if it is determined that the intensity of the predetermined wavelength is smaller than the threshold (NO in step S25), the movement of the first stage 20 is stopped (step S26). The control unit 70 stops driving the X drive unit 50X to stop the movement of the first stage 20. Then, the control unit 70 executes the process from step S20 onward again. Note that the control unit 70 controls the relative position and relative movement between the machining area LA of the laser light L and the cutting tool T according to the output of the second sensor 62 in steps S21 to S26.

[0111] FIG. 30 is a diagram showing another example of data acquired by the second sensor 62. In FIG. 30, the horizontal axis of the graph indicates the processing time. Similarly to FIG. 27, the vertical axis of the graph indicates the intensity of light of a predetermined wavelength detected by the second sensor 62 among the plasma light generated when the processable area LA of the laser light L hits the cutting edge Ta. As shown in FIG. 30, the threshold value B is set to a value lower than the threshold value A of FIG. 27. When a value equal to or higher than the threshold value B is detected, it is determined that the cutting edge Ta is being formed by the processable area LA of the laser light L, but when the value is smaller than the threshold value B, it is determined that the removal of the desired part of the cutting edge Ta is completed and a small amount of plasma light is being generated. Also, in FIG. 30, the graph shows repeated maximum values ​​and minimum values. This is because the repeated reciprocating movement of the first stage 20 causes repeated times when the processable area LA of the laser light L hits the cutting edge Ta and when the processable area LA of the laser light L moves away from the cutting edge Ta.

[0112] Returning to the flowchart of FIG. 26, when it is determined in step S20 that the total movement amount of the cutting tool T (tip Ta) is equal to or greater than the threshold (YES in step S20), the emission of the laser light L is stopped (step S27). The control unit 70 closes the shutter of the oscillator 11 and stops the emission of the laser light L from the laser head 13. Subsequently, after stopping the emission of the laser light L, the control unit 70 determines that the formation of the tip Ta of the cutting tool T is completed (step S28) and determines the end point of the processing of the tip Ta by the processable area LA of the laser light L (step S29). The control unit 70 determines the position (for example, coordinate values ​​in the X direction and Y direction) of the straight cutting edge T1 when the formation of the tip Ta of the cutting tool T is completed as the end point of the processing of the tip Ta by the processable area LA of the laser light L.

[0113] Next, after the machining end point is determined, the cutting tool T is moved to the measurement area AR2 (step S30). The control unit 70 drives the X drive unit 50X to move the first stage 20 in the -X direction along the first direction D1, and places the cutting tool T in the measurement area AR2. Next, after the cutting tool T is moved to the measurement area AR2, the shape of the cutting edge Ta of the cutting tool T is measured (step S29). The control unit 70 instructs the first sensor 61 to perform shape measurement of the cutting edge Ta. The first sensor 61 measures the shape of the cutting edge Ta of the cutting tool T, and outputs the measurement result to the control unit 70.

[0114] Next, the control unit 70 calculates the shape of the cutting edge Ta of the cutting tool T after acquiring the measurement result from the first sensor 61 (step S30). The calculation unit 71 calculates, for example, the three-dimensional shape of the cutting edge Ta based on the measurement result from the first sensor 61. The calculation unit 71 may also calculate comparison data (such as deviation amount) between the calculated three-dimensional shape and the design value. Next, after calculating the shape of the cutting edge Ta of the cutting tool T, the calculation result is recorded (step S31). The calculation unit 71 stores the three-dimensional shape of the cutting edge Ta calculated in step S30 in the storage unit 72. Also, as described above, when the calculation unit 71 calculates the comparison data (such as deviation amount), this comparison data may be stored in the storage unit 72. Also, if the measurement result after forming is different from the design value and the processing is insufficient, it is also possible to instruct additional processing again. Also, if the processing is too much, it is also possible to display a failure on the display unit 74 (see FIG. 24).

[0115] Next, after the calculation result is recorded, the control unit 70 judges whether or not there is an unmachined cutting tool T remaining among the multiple cutting tools T held by the annular plate 41. If there is an unmachined cutting tool T remaining, the cutting tool T to be next formed is selected in a preset order, and the processing from step S04 onwards is performed. If there is no unmachined cutting tool T remaining, the control unit 70 ends the indexing of the cutting tools T (step S34). If the formation of the cutting edges Ta for all cutting tools T held by the annular plate 41 is completed, the control unit 70 ends the indexing of the cutting tools T. Next, the control unit 70 instructs that the operation of the tool cutting edge forming device 100 is completed (step S35). Since the formation of the cutting edges Ta for all cutting tools T held by the annular plate 41 is completed, the control unit 70 stops the operation of each part of the tool cutting edge forming device 100.

[0116] Next, after stopping the operation of each part of the tool cutting edge forming device 100, it is determined whether or not to replace the annular plate 41 (step S36). In step S36, the control unit 70 may make the determination, or the operator may make the determination. In the case where the control unit 70 makes the determination, information regarding the number of the annular plates 41 prepared in step S01 may be stored in advance in the storage unit 72 or the like, and the control unit 70 may count the number of the annular plates 41 for which the cutting edge Ta has been formed, and may indicate the annular plates 41 that have not yet been formed. The contents of this instruction may be displayed, for example, on the display unit 74 (see FIG. 24). In the case where the annular plate 41 is to be replaced (YES in step S36), a new annular plate 41 is attached to the rotary table 40, and the processing from step S02 onward is performed. In addition, in the case where the annular plate 41 is not to be replaced (NO in step S36), the series of processing is terminated.

[0117] In the above embodiment, the configuration in which the annular plate 41 is used is described as an example, but the present invention is not limited to this configuration. FIG. 31 shows an example of the rectangular plate 47, where (A) is a plan view and (B) is a side view showing the rectangular plate 47 attached to the rotary table 40. As shown in FIGS. 31(A) and (B), the rectangular plate 47 is formed in a rectangular plate shape in a plan view. The rectangular plate 47 is detachable from the rotary table 40, similar to the annular plate 41. A plurality of holders 42 are attached to the upper surface (surface on the +Z side) of the rectangular plate 47, similar to the annular plate 41. The plurality of holders 42 are arranged along one side 47a of the rectangular plate 47.

[0118] The rectangular plate 47 and the rotary table 40 are provided with a positioning portion and a positioned portion (not shown) for positioning the rectangular plate 47 with respect to the rotary table 40. As a result, by controlling the rotational position of the rotary table 40, the cutting blade direction D4 of the cutting tool T held by the holder 42 of the rectangular plate 47 and the first direction D1 can be set to a specified arbitrary angle, similar to the annular plate 41. Also, by moving the first stage 20 in the first direction D1 (X direction), any one of the multiple cutting tools T can be assigned to a processing position by the laser light L.

[0119] In the above embodiment, the first stage 20 is moved in the first direction D1 (X direction) relative to the laser light L when forming the cutting edge Ta of the cutting tool T, but the present invention is not limited to this configuration. Instead of moving the first stage 20 in the first direction D1, the laser head 13 (including the base 13a) may be moved in the first direction D1. Fig. 32 is a diagram showing a configuration in which the laser head 13 can be moved in the first direction D1 and the second direction D2.

[0120] As shown in FIG. 32, the laser irradiation mechanism 10A includes a guide (not shown) that guides the laser head 13 (including the base 13a) in the first direction D1, and a drive unit (not shown) that moves the laser head 13 along the guide. The drive unit that moves the laser head 13 is a drive unit that changes the relative position between the laser light L and the cutting tool T. The laser head 13 can be moved in the first direction D1 along the guide by driving the drive unit. According to this laser irradiation mechanism 10A, by moving the laser head 13 in the first direction D1 while emitting the laser light L from the laser head 13, the machineable area LA of the laser light L can be scanned in the cutting edge direction D4 with respect to the cutting edge Ta of the cutting tool T. In this case, the first stage 20 may be fixed in the first direction D1, or the first stage 20 may be moved in the first direction D1 (for example, the opposite direction to the direction in which the laser head 13 moves) together with the movement of the laser head 13 in the first direction D1.

[0121] In addition, the laser irradiation mechanism 10A may also be configured to move the laser head 13 in the second direction D2 for the second stage 30. As shown by the dashed line in FIG. 32, the laser head 13 may be moved in the second direction D2 by a drive unit (not shown) along a guide in the second direction D2 (not shown). According to this laser irradiation mechanism 10A, instead of moving the second stage 30 in the second direction D2, the relative position between the processable area LA of the laser light L and the cutting edge Ta in the second direction D2 can be changed by moving the laser head 13 in the second direction D2. Note that a configuration may also be applied in which the laser head 13 is moved by a robot arm or the like to move in any of the first direction D1, the second direction D2, and the emission direction D3.

[0122] Also, instead of moving the first stage 20 in the first direction D1, a configuration may be applied in which the laser light L emitted from the laser head 13 is deflected (scanned) in the first direction D1. Fig. 33 shows a form in which the laser light L is deflected in the first direction D1, where (A) is a diagram using a polygon mirror 17 and (B) is a diagram using a galvanometer mirror 18.

[0123] As shown in FIG. 33(A), the laser irradiation mechanism 10B includes a polygon mirror 17 in the optical path of the laser light L. The polygon mirror 17 rotates in one direction about a rotation axis parallel to the second direction D2 (Y direction). By rotating the polygon mirror 17, the laser light L reflected by the polygon mirror 17 is scanned in the first direction D1 through the telecentric fθ lens TL with the irradiation direction of the laser light L with respect to the beam damper 22 (the cutting edge Ta) being aligned. The scanning of the laser light L is determined by the rotation direction of the polygon mirror 17, and the scanning of the laser light L from the -X side to the +X side or the scanning of the laser light L from the +X side to the -X side is repeated. According to this laser irradiation mechanism 10B, instead of moving the first stage 20 in the first direction D1, the laser light L can be scanned in the cutting edge direction D4 by scanning the laser light L in the first direction D1.

[0124] As shown in FIG. 33B, the laser irradiation mechanism 10C includes a galvanometer mirror 18 in the optical path of the laser light L. The galvanometer mirror 18 oscillates (vibrates) around an axis parallel to the second direction D2 (Y direction). By oscillating (vibrating) the galvanometer mirror 18, the laser light L reflected by the galvanometer mirror 18 is scanned in the first direction D1 through the telecentric fθ lens TL with the irradiation direction of the laser light L aligned with respect to the beam damper 22 (the cutting edge Ta). According to the laser irradiation mechanism 10C, similarly to the above-mentioned laser irradiation mechanism 10B, instead of moving the first stage 20 in the first direction D1, the laser light L can be scanned in the cutting edge direction D4 by scanning the laser light L in the first direction D1. The polygon mirror 17 and the galvanometer mirror 18 are driving units that change the relative positions of the workable area LA of the laser light L and the cutting tool T.

[0125] As described above, according to the tool edge forming device 100 and the tool edge forming method, by adjusting the rotational position of the turntable 40 so that the cutting edge direction D4 of the straight cutting edge T1 forms a specified arbitrary angle with the first direction D1, the first stage 20 moves in the first direction D1, and the laser light L can be precisely irradiated to the cutting edge direction D4 of the straight cutting edge T1. As a result, the cutting edge Ta of the cutting tool T can be precisely formed.

[0126] Furthermore, according to the above-described tool edge forming device 100 and tool edge forming method, the relative position and relative movement between the machining area LA of the laser light L and the cutting tool T are controlled in response to the output of at least one of the first sensor 61 and the second sensor 62, so that the machining area LA of the laser light L can be moved accurately relative to the cutting edge direction D4 of the straight cutting edge T1. As a result, the cutting edge Ta of the cutting tool T can be formed accurately and efficiently.

[0127] Furthermore, according to the above-described tool edge forming device 100 and tool edge forming method, since the rotary table 40 can be rotated about an axis parallel to the emission direction D3 of the laser light L, the cutting edge direction D4 of the straight cutting edge T1 of the cutting tool T can be easily adjusted. As a result, the cutting edge Ta of the cutting tool T can be formed with high precision. Furthermore, by attaching and detaching the holder 42 that holds the cutting tool T to and from the rotary table 40, the cutting tool T can be easily replaced, or the holder 42 can be easily replaced with one suitable for the cutting tool T.

[0128] Although the embodiments have been described above, the technical scope of the present invention is not limited to the scope described in the above-mentioned embodiments. One or more of the requirements described in the above-mentioned embodiments may be omitted. The requirements described in the above-mentioned embodiments may be combined as appropriate. It is clear to those skilled in the art that various modifications or improvements can be made to the above-mentioned embodiments. Such modifications or improvements are also included in the technical scope of the present invention. In addition, the execution order of the processes shown in the claims, specification, and drawings can be realized in any order, as long as the output of the previous process is not used in the subsequent process. Even if the operation flow in the claims, specification, and drawings is described using "first," "followed by," etc. for convenience, it does not mean that it is essential to perform the processes in this order. [Explanation of symbols]

[0129] AR1... Processing area AR2: Measurement area AX1: Rotation axis AX2: Swing axis D1...First direction D2...Second direction D3: Emission direction D4...cutting edge direction L...Laser light LA...Processable area T...cutting tool T1: Straight cutting edge Ta Cutting edge Tb Flank Tc: Rake face 10. Laser irradiation mechanism 11. Oscillator 12...Optical system 13 Laser head 20. Stage 1 22. Beam damper 30. Stage 2 40 Rotating table 40a Positioning part 40b Diamond pin (positioning part) 40e....Convex part (positioning part) 41... Annular plate (plate) 41a Positioned part 41b...Hole part (positioned part) 41e Recess (positioned portion) 42 Holder 43. Flank holder 43d, 44d: Leaf spring (elastic member) 44, 45....Rake face holder 46b Coil spring (elastic member) 47 Rectangular plate (plate) 50 Drive unit 50X...X drive unit 50Y...Y drive unit 50R...Rotation drive unit 50S···Swing drive unit 50Z...Z drive unit 60...Measuring section 61... First sensor 62 Second sensor 70...Control section 80. Bed 100 Tool tip forming device

Claims

1. A tool edge forming device that forms the edge of a cutting tool having a straight cutting edge by pulse laser grinding, A first sensor that detects at least one of a cutting edge position and a cutting edge direction of the straight cutting edge; A second sensor that detects light generated when a processable area of ​​the laser light in the pulse laser grinding hits the cutting edge; a control unit that controls a relative position and a relative movement between the processable area of ​​the laser light and the cutting tool in response to an output of at least one of the first sensor and the second sensor, The second sensor is a spectroscope that detects plasma light generated when the processable area of ​​the laser light hits the cutting edge.

2. A tool edge forming device that forms the edge of a cutting tool having a straight cutting edge by pulse laser grinding, A first sensor that detects at least one of a cutting edge position and a cutting edge direction of the straight cutting edge; A second sensor that detects light generated when a processable area of ​​the laser light in the pulse laser grinding hits the cutting edge; a control unit that controls a relative position and a relative movement between the processable area of ​​the laser light and the cutting tool in response to an output of at least one of the first sensor and the second sensor, The second sensor is provided with a bandpass filter that attenuates or blocks light of a wavelength used as the laser light and transmits light of a wavelength different from that of the laser light.

3. 3. The tool edge shaping device according to claim 1, wherein the first sensor is a shape measuring sensor that is capable of calculating a three-dimensional shape of the cutting edge by irradiating the cutting edge with detection light and receiving reflected light.

4. The tool edge shaping device according to claim 3 , wherein the first sensor measures the cutting edge after shaping by the laser light.

5. The second sensor outputs a spectrum of the plasma light, 2. The tool tip shaping device according to claim 1, wherein the control unit determines at least one of whether an intensity of a predetermined wavelength in the optical spectrum exceeds a preset threshold value and whether the intensity of the predetermined wavelength falls below the threshold value.

6. 6. The tool edge shaping device according to claim 5, wherein the control unit determines a point when the intensity of the predetermined wavelength exceeds the threshold value as a start point of machining of the cutting edge by the processable region of the laser light, and determines a point when the intensity of the predetermined wavelength falls below the threshold value as an end point of machining of the cutting edge by the processable region of the laser light.

7. The tool edge shaping device according to claim 1 , wherein the control unit determines a shape of the cutting edge before shaping based on a detection result of the first sensor, and determines a processing operation.

8. a processing area for forming the cutting edge by the laser light; A measurement area for measuring the cutting edge is provided separately from the processing area, the first sensor is disposed in correspondence with the measurement area; The tool edge shaping device according to claim 1 , wherein the second sensor is disposed in correspondence with the machining area.

9. A method for forming a cutting edge of a cutting tool having a straight cutting edge by pulse laser grinding, comprising: Detecting at least one of a cutting edge position and a cutting edge direction of the straight cutting edge; Detecting plasma light generated when the workable area of ​​the laser beam hits the cutting edge in the pulse laser grinding with a spectroscope; and controlling a relative position and relative movement between the machineable area of ​​the laser light and the cutting tool based on the detection results of at least one of the cutting edge position and the cutting edge direction, and the detection results of the light.

10. A method for forming a cutting edge of a cutting tool having a straight cutting edge by pulse laser grinding, comprising: Detecting at least one of a cutting edge position and a cutting edge direction of the straight cutting edge; Detecting light generated when a processable area of ​​the laser light in the pulse laser grinding hits the cutting edge; Controlling a relative position and a relative movement between the processable area of ​​the laser light and the cutting tool according to a detection result of at least one of the cutting edge position and the cutting edge direction and a detection result of the light, A tool cutting edge shaping method, in which detecting light generated when the machineable area hits the cutting edge includes attenuating or blocking light of a wavelength used as the laser light and transmitting light of a wavelength different from the laser light.

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