HEAT TRANSFER FLUID COMPOSITION, HEAT TRANSFER FLUID, DEVICE FOR HEAT TRANSFER, AND METHOD FOR HEAT TRANSFER

Abstract

To provide a heat transfer fluid having a relatively high boiling point.SOLUTION: A composition for heat transfer fluid comprises three types of hexafluoropropene trimers (I), (II), and (III) having specific structures, wherein the compound represented by (I) is comprised in an amount of more than 10 mass% and less than 85 mass%, preferably more than 30 mass% and less than 85 mass%, more preferably more than 50 mass% and less than 60 mass%, relative to the total amount of the compounds represented by (I) to (III)SELECTED DRAWING: None

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE The present disclosure relates to heat transfer fluid compositions, heat transfer fluids, devices for heat transfer, and methods of heat transfer. [Background technology]

[0002] It is known to use a trimer of hexafluoropropene (HFP) as a heat transfer fluid (Patent Document 1).

[0003] HFP trimers have attracted attention as an alternative to chlorofluorocarbons (CFCs) and hydrochlorofluorocarbons (HCFCs) because of their low global warming potential (GWP) and low toxicity. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Special Publication No. 2020-514420 [Patent Document 2] China Patent Publication No. 11354894 Summary of the Invention [Problem to be solved by the invention]

[0005] In the semiconductor manufacturing process, a heat transfer fluid is considered to be used for removing heat, but if the boiling point is low, there is a possibility that the heat transfer fluid may vaporize and leak from the device.

[0006] It is an object of the present invention to provide a heat transfer fluid that has a relatively high boiling point. [Means for solving the problem]

[0007] The present disclosure includes the following aspects. [1] The following formulas (I) to (III): [ka] The hexafluoropropene trimer is represented by A composition for heat transfer fluid, comprising the compound represented by formula (I) in an amount of 10 mass % or more and less than 85 mass % based on the total amount of the compounds represented by formulas (I) to (III). [2] The composition for heat transfer fluid according to the above [1], wherein the compound represented by formula (I) is contained in an amount of 30 mass% or more and less than 85 mass% based on the total amount of the compounds represented by formulas (I) to (III). [3] The heat transfer fluid composition according to [1] or [2] above, which is used in a semiconductor manufacturing process. [4] A heat transfer fluid comprising the composition for heat transfer fluid according to any one of the above [1] to [3]. [5] The heat transfer fluid according to [4] above, further comprising a stabilizer. [6] A heat transfer fluid according to [4] or [5] above, for use in a semiconductor manufacturing process. [7] Use of the heat transfer fluid composition according to any one of the above [1] to [3] or the heat transfer fluid according to the above [4] or [5] for heat transfer. [8] A device; A mechanism for transferring heat to or from the device, comprising the heat transfer fluid composition according to any one of the above [1] to [3] or the heat transfer fluid according to the above [4] or [5]. An apparatus for heat transfer comprising: [9] The heat transfer apparatus described in [8] above, wherein the device is a wafer used for manufacturing semiconductors.

[10] A semiconductor manufacturing apparatus comprising the heat transfer device according to [8] or [9] above.

[11] Providing a device; transferring heat to or from the device using the heat transfer fluid composition according to any one of the above [1] to [3] or the heat transfer fluid according to the above [4] or [5]; A method of heat transfer comprising:

[12] The heat transfer method according to

[11] above, wherein the device is a wafer used for manufacturing semiconductors. Effect of the Invention

[0008] In accordance with the present disclosure, a heat transfer fluid is provided that has a relatively high boiling point. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In the present specification, the numerical range "A to B" is intended to include the lower and upper limit numerical values ​​themselves. In other words, the numerical range "A to B" means A or more and B or less.

[0010] The heat transfer fluid composition of the present disclosure will now be described.

[0011] (Heat transfer fluid composition) The heat transfer fluid composition of the present disclosure has the following formulas (I) to (III): [ka] The hexafluoropropene trimer is represented by The compound represented by the formula (I) is contained in an amount of 10% by mass or more and less than 85% by mass based on the total amount of the compounds represented by the formulas (I) to (III).

[0012] The compounds represented by the formulas (I) to (III) are so-called hexafluoropropene trimers.

[0013] In this specification, the compound represented by the above formula (I) includes both E and Z diastereomers, unless otherwise specified.

[0014] In the heat transfer fluid composition of the present disclosure, the compound represented by formula (I) may be contained in an amount of less than 85% by mass, preferably 80% by mass or less, for example 75% by mass or less, 70% by mass or less, 60% by mass or less, 50% by mass or less, or 40% by mass or less, based on the total amount of the compounds represented by the above formulas (I) to (III). By setting the content of the compound represented by formula (I) within the above range, the boiling point of the heat transfer fluid composition is increased. In other words, the vapor pressure of the heat transfer fluid composition is reduced. When the vapor pressure of the heat transfer fluid composition is high, it becomes easier to vaporize, and when used in, for example, a semiconductor manufacturing device, leakage from the device may increase. In addition, cavitation occurs, making flow rate control unstable. Since the heat transfer fluid composition of the present disclosure has a low vapor pressure, leakage from the device is suppressed, which is environmentally and economically advantageous. In addition, cavitation can be suppressed.

[0015] In the heat transfer fluid composition of the present disclosure, the compound represented by formula (I) may be contained in an amount of preferably 10% by mass or more, more preferably 20% by mass or more, even more preferably 30% by mass or more, even more preferably 40% by mass or more, for example, 45% by mass or more, 50% by mass or more, 55% by mass or more, 60% by mass or more, or 65% by mass or more, based on the total amount of the compounds represented by the above formulas (I) to (III). By setting the content of the compound represented by formula (I) within the above range, the kinetic viscosity is reduced, and for example, when used in a semiconductor manufacturing device, the pressure for circulating the heat transfer fluid composition can be reduced. By reducing the pressure for circulating the heat transfer fluid composition, the pressure loss can be reduced, and leakage from the device can also be reduced, thereby reducing operating costs.

[0016] In the heat transfer fluid composition of the present disclosure, the amount of the compound represented by formula (I) relative to the total amount of the compounds represented by formulas (I) to (III) above may be, for example, 10% by mass or more and less than 85% by mass, 20% by mass or more and less than 85% by mass, 30% by mass or more and less than 85% by mass, 35% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 50% by mass or more and less than 80% by mass, 50% by mass or more and less than 70% by mass, 50% by mass or more and less than 60% by mass, 55% by mass or more and less than 80% by mass, 60% by mass or more and less than 75% by mass, or 65% by mass or more and less than 70% by mass. In the heat transfer fluid composition of the present disclosure, the compound represented by formula (I) may be present in an amount of preferably 30 mass% or more and less than 85 mass%, more preferably 35 mass% or more and 80 mass% or less, even more preferably 35 mass% or more and 60 mass% or less, and even more preferably 50 mass% or more and 60 mass% or less, based on the total amount of the compounds represented by formulas (I) to (III) above.

[0017] In the heat transfer fluid composition of the present disclosure, the mass ratio of the compound represented by formula (II) and the compound represented by formula (III) is not particularly limited, and may be, for example, 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0018] The compounds represented by formulas (I) to (III) can be produced by conventional methods, for example, but not limited to, the methods described in International Publication No. 2018 / 172919. They can also be obtained by trimerization of hexafluoropropene as a raw material by conventional methods.

[0019] The heat transfer fluid composition of the present disclosure is a compound represented by formulas (I) to (III) other than C9F 18 The hexafluoropropene may contain a hexafluoropropene trimer represented by the following formula:

[0020] The heat transfer fluid composition of the present disclosure may include a hexafluoropropene dimer.

[0021] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0022] The heat transfer fluid composition of the present disclosure may include hexafluoropropene tetramer.

[0023] The hexafluoropropene tetramer can include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0024] The heat transfer fluid composition of the present disclosure comprises, in addition to the hexafluoropropene trimer, C m F 2m and / or C. n F (2n-2) [In the formula, m is an integer of 4 or more and 12 or less except 9, and n is an integer of 4 or more and 12 or less.]

[0025] m is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Furthermore, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less, provided that m does not include 9.

[0026] n is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Also, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. Furthermore, n is particularly preferably 9.

[0027] C m F 2m may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called alkene, and may be a straight chain or a branched chain.

[0028] C n F (2n-2) may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called diene or alkyne, and may be a straight chain or a branched chain.

[0029] In the heat transfer fluid composition of the present disclosure, m F 2m and / or C. n F (2n-2) By making it coexist with the hexafluoropropene trimer, the function as a heat transfer fluid is improved. m F 2m and / or C. n F (2n-2) By including the above, the stability of the hexafluoropropene trimer is improved.

[0030] C m F 2m and / or C. n F (2n-2) The content of may be preferably 10% by mass or less, more preferably 5% by mass or less, and even more preferably 1% by mass or less, based on the hexafluoropropene trimer in the heat transfer fluid composition of the present disclosure. m F 2m and / or C. n F (2n-2) The content of C may be preferably 0.0001% by mass or more, more preferably 0.001% by mass or more, based on the hexafluoropropene trimer in the heat transfer fluid composition of the present disclosure. m F 2m and / or C. n F (2n-2) is not an essential component in the heat transfer fluid composition of the present disclosure and may not be included.

[0031] The heat transfer fluid composition of the present disclosure may contain perfluorotripropylamine in addition to the hexafluoropropene trimer. The heat transfer fluid composition containing the hexafluoropropene trimer and perfluorotripropylamine may be a pseudoazeotropic liquid. By the heat transfer fluid composition being a pseudoazeotropic liquid, even if the heat transfer fluid composition is vaporized, the composition undergoes little change, making it easy to handle.

[0032] Here, the pseudo-azeotropic liquid means a liquid in which the difference in molar fraction of each component contained in the pseudo-azeotropic liquid between the gas phase and the liquid phase is within 10%.

[0033] Perfluorotripropylamine, also known as tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)amine, has the general formula: N(CF2CF2CF3) a (CF(CF3)CF3) 3-a (a is an integer of 0 to 3). Perfluorotripropylamine may contain only one type of compound represented by the above general formula, or may contain multiple types. N(CF2CF2CF3)3 is preferred, but N(CF2CF2CF3) may also be used as an impurity. a (CF(CF3)CF3) 3-a (wherein a is an integer of 0 to 2). Specific examples include the product name "Fluorinert (registered trademark)" (manufactured by 3M) (FC-3283).

[0034] The heat transfer fluid composition of the present disclosure may further include perfluoropolyethers, and methoxytridecafluoroheptene isomer mixtures, perfluorotributylamine, and the like.

[0035] The perfluoropolyether is preferably General formula: RO-Rf 1 -R' It is expressed as During the ceremony, R and R' may be the same or different and are -C m F 2m+1where m is an integer from 1 to 8; and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeat units, said repeat units being: (i) -CFXO-, where X is F or CF; (ii) -CF2CFXO- (wherein X is F or CF3); (iii) -CFXCF2O- (wherein X is F or CF3); (iv) -CF2CF2CF2O-; or (v) -CF2CF2CF2CF2O- or Rf 1 teeth, (vi) -(CF2) n -CFY-O- (wherein n is an integer of 0 to 3, and Y is a group represented by the general formula -ORf 2 A monovalent group represented by Z, where Rf 2 is a divalent fluoropolyoxyalkylene group having 2 to 20 repeating units represented by -CFXO-, -CF2CFXO-, -CF2CF2CF2O-, or -CF2CF2CF2CF2O-, where each X is the same or different and is F or CF3, and Z is a monovalent C 1-5 It is a divalent group represented by the formula (I) (a perfluoroalkyl group).

[0036] Specific examples of perfluoropolyethers include those with the product names GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by Solvay).

[0037] The methoxytridecafluoroheptene isomer mixture is specifically methyl-perfluoroheptene ether (MPHE) (CF 13 OCH3). A specific example is the product name "Opteon SF10" (manufactured by Chemours).

[0038] When the heat transfer fluid composition of the present disclosure includes perfluorotripropylamine, perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers, these and C9F 18 Since the heat transfer fluid properties of the heat transfer fluid composition as a whole are similar to those of the compound represented by the formula (I), regardless of the content ratio of these compounds, the heat transfer fluid properties of the heat transfer fluid composition as a whole are basically unchanged. Therefore, in this case, the heat transfer fluid composition of the present disclosure contains C9F 18 The compound represented by the formula (I) is preferably contained in an amount of 40% by mass to 99.9% by mass, more preferably 60% by mass to 99.9% by mass, and further preferably 80% by mass to 99.9% by mass.

[0039] The heat transfer fluid composition of the present disclosure may further contain water. The content of water in the heat transfer fluid composition is 1 ppm by mass or more, and preferably 5 ppm by mass or more. By making the water content at a certain level or more, for example 1 ppm by mass or more, it is possible to suppress the charging of the composition due to a decrease in the stability of the heat transfer fluid composition. In addition, the content of water in the heat transfer fluid composition is 1000 ppm by mass or less, preferably 500 ppm by mass or less, and more preferably 100 ppm by mass or less. By making the water content at a certain level or less, for example 1000 ppm by mass or less, it is possible to suppress the charging of the composition due to a decrease in the stability of the heat transfer fluid composition. 18 This makes it possible to suppress the decomposition of the HFP trimer represented by the following formula (1): and thus makes it possible to suppress an increase in fluoride ions and an increase in acidity.

[0040] In one embodiment, the water content is C9F 18 The amount is preferably 0.0001 part by mass or more, more preferably 0.01 part by mass or more, and even more preferably 0.1 part by mass or more, relative to 100 parts by mass of the total of the compounds represented by the formula:

[0041] On the other hand, the water content is C9F 18The amount is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less, relative to 100 parts by mass of the total of the compounds represented by the formula:

[0042] The heat transfer fluid composition of the present disclosure may further contain fluoride ions. The amount of fluoride ions in the heat transfer fluid composition is preferably 0.000001% by mass or more, more preferably 0.00001% by mass or more, even more preferably 0.001% by mass or more, and particularly preferably 0.001% by mass or more, based on the entire heat transfer fluid composition.

[0043] The amount of fluoride ions contained in the heat transfer fluid composition of the present disclosure is preferably 5% by mass or less, more preferably 1% by mass or less, even more preferably 0.1% by mass or less, and particularly preferably 0.01% by mass or less, based on the entire heat transfer fluid composition.

[0044] As the fluoride ion source, a wide variety of known fluoride ion sources can be used, and there is no particular limitation.Specific examples include hydrogen fluoride, sodium fluoride, sodium hydrogen fluoride, potassium fluoride, potassium hydrogen fluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride.These may be contained in one type or in a plurality of types.Preferably, the fluoride ion source is hydrogen fluoride.

[0045] (Heat transfer fluid) The heat transfer fluid of the present disclosure may include other components in addition to the heat transfer fluid composition of the present disclosure. In one embodiment, the heat transfer fluid composition itself may be a heat transfer fluid. In another embodiment, the heat transfer fluid composition includes other components.

[0046] The heat transfer fluid of the present disclosure may contain any other components other than the heat transfer fluid composition that do not impair the effects and objects of the present disclosure. Examples of such other components include water, stabilizers, etc.

[0047] The stabilizer exerts a stabilizing effect, thereby exerting a function as a so-called acid acceptor or antioxidant. The main stabilizing effects include an effect of preventing decomposition of the hexafluoropropene trimer by capturing radicals generated in the system, and an acid-accepting effect of preventing further decomposition of the hexafluoropropene trimer by the acid by capturing the acid generated in the system.

[0048] As the stabilizer, a wide variety of known stabilizers can be used. Among them, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol stabilizers, nitro stabilizers, amine stabilizers, phenol stabilizers, and epoxy stabilizers, because they can effectively suppress the occurrence of metal corrosion caused by the composition.

[0049] As the unsaturated alcohol-based stabilizer, a wide variety of known ones can be used. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadiene-1-ol and oleyl alcohol can be used.

[0050] As the nitro stabilizer, a wide variety of known stabilizers can be used. As the aliphatic nitro compound, for example, nitromethane, nitroethane, 1-nitropropane, 2-nitropropane, etc. can be mentioned. As the aromatic nitro compound, for example, one or more selected from the group consisting of nitrobenzene, o-, m- or p-dinitrobenzene, o-, m- or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m- or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole can be used.

[0051] As the amine-based stabilizer, it is possible to widely adopt known ones. For example, it is possible to use one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dipentylamine, tribenzylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine and diethylhydroxylamine.

[0052] As the phenol-based stabilizer, a wide variety of known stabilizers can be used, for example, one or more selected from the group consisting of 2,6-ditertiarybutyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0053] As the epoxy stabilizer, a wide variety of known ones can be used, for example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0054] The combination of stabilizers having different stabilizing effects more effectively prevents decomposition of the hexafluoropropene trimer, which may occur due to various causes. For this reason, the stabilizer is preferably one or more selected from the group consisting of the above-mentioned epoxy-based stabilizer, as well as unsaturated alcohol-based stabilizers, nitro-based stabilizers, and phenol-based stabilizers.

[0055] From the viewpoint of effectively suppressing acid liberation from the hexafluoropropene trimer and suppressing metal corrosion caused by the liquid composition, the content of the stabilizer in the entire heat transfer fluid is preferably 0.0001 mass% or more, more preferably 0.01 mass% or more. On the other hand, in consideration of avoiding undesirable changes in the physical properties of the heat transfer fluid due to excessive addition of the stabilizer, the content of the stabilizer in the entire heat transfer fluid is preferably 10 mass% or less, more preferably 5 mass% or less.

[0056] (Use of heat transfer fluid composition or heat transfer fluid) The heat transfer fluid composition and heat transfer fluid of the present disclosure are used to remove heat from or supply heat to various heat transfer objects. The heat transfer objects in the present disclosure are items, devices, and atmospheres that are cooled, heated, or maintained at a temperature to be controlled. Such heat transfer objects include electrical components, mechanical components, and optical components, as well as processed products and assemblies thereof. Specific examples of heat transfer objects in the present disclosure include, but are not limited to, wafers used to manufacture semiconductor devices, microprocessors, power control semiconductors, electric branch switches, power transformers, circuit boards, multi-chip modules, mounted and unmounted semiconductor devices, chemical reactors, nuclear reactors, fuel cells, lasers, missile parts, and the like.

[0057] The heat transfer fluid composition or heat transfer fluid of the present disclosure has a small pressure loss during circulation during use, and is therefore suitable for use in applications requiring a large amount of heat transfer. In a preferred embodiment, the heat transfer fluid composition or heat transfer fluid of the present disclosure is used in a semiconductor manufacturing process. The object to which heat is transferred in the semiconductor manufacturing process is a wafer used to manufacture a semiconductor device.

[0058] The heat transfer fluid composition or heat transfer fluid of the present disclosure can also be utilized as a two-phase immersion cooling, chiller fluid, Rankine cycle working fluid.

[0059] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be used in devices that are designed to use them to transfer heat, replacing the heat transfer fluid currently used in the device.

[0060] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be a drop-in replacement, a near drop-in replacement, or a retrofit replacement for a heat transfer fluid currently in use. The term "drop-in replacement" means that the replacement can be made without any changes to the equipment. The term "near drop-in replacement" means that the replacement can be made with almost no changes to the equipment. The term "retrofit replacement" means that the replacement can be made with minimal changes (without significant changes) to the equipment. The heat transfer fluid composition or heat transfer fluid of the present disclosure is preferably a drop-in replacement or a near drop-in replacement for the above-mentioned heat transfer fluid.

[0061] Whether or not a drop-in substitution, near drop-in substitution, or retrofit substitution is possible can be determined by whether or not all of the following conditions are met. (i) The boiling point of the heat transfer fluid is at least about 80% or more, and preferably at least about 85% or more, of the boiling point of the heat transfer fluid prior to the exchange. (ii) The freezing point of the heat transfer fluid is equal to or lower than the freezing point of the heat transfer fluid before replacement. (iii) The kinematic viscosity of the heat transfer fluid is at least about 200% or less, and preferably at least about 150% or less, of the kinematic viscosity of the heat transfer fluid prior to the exchange. (iv) The heat transfer fluid is compatible with the heat transfer fluid before replacement in any proportion.

[0062] By setting the boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure to at least about 80% or more, preferably at least about 85% or more, of the boiling point of the heat transfer fluid before replacement, it is possible to suppress the occurrence of cavitation and leakage from the device. The upper limit of the boiling point of the heat transfer fluid is not particularly limited, but may be, for example, at least about 130% or less of the boiling point of the heat transfer fluid before replacement.

[0063] By making the pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure equal to or lower than the pour point of the heat transfer fluid before replacement, it becomes possible to use it at temperatures lower than the conventional use temperature, and the use temperature range can be expanded. The upper limit of the pour point of the heat transfer fluid is not particularly limited, but may be, for example, a temperature 30°C higher than the pour point of the heat transfer fluid before replacement.

[0064] By setting the kinetic viscosity of the heat transfer fluid composition or heat transfer fluid of the present disclosure to at least about 200% or less, preferably at least about 150% or less, of the kinetic viscosity of the heat transfer fluid before replacement, it is possible to suppress an increase in power consumption or reduce power consumption. The kinetic viscosity is preferably compared at the kinetic viscosity at the operating temperature, but is not limited thereto, and can be compared at any temperature of, for example, -20°C to -40°C, specifically at -20°C.

[0065] The heat transfer fluid composition or heat transfer fluid of the present disclosure is compatible with the heat transfer fluid before replacement in any desired ratio, making replacement work easy.

[0066] Furthermore, the heat transfer fluid composition or heat transfer fluid of the present disclosure satisfies the following conditions, making it more suitable as a drop-in replacement, a near drop-in replacement, or a retrofit replacement. (v) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a dielectric constant that is 120% or less of the heat transfer fluid prior to replacement. (vi) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a dielectric strength of 90% or more of the heat transfer fluid prior to replacement. (vii) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a specific heat of 90% or more of the heat transfer fluid prior to replacement. (viii) The heat transfer fluid composition or heat transfer fluid of the present disclosure has a thermal conductivity of 90% or more of the heat transfer fluid before replacement.

[0067] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure is set to 120% or less of the dielectric constant of the heat transfer fluid before replacement, so that the composition or the heat transfer fluid can be suitably used as a replacement composition. The upper limit of the dielectric constant of the heat transfer fluid is not particularly limited, but may be, for example, 80% or more of the dielectric constant of the heat transfer fluid before replacement.

[0068] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be suitably used as a replacement composition by making the dielectric strength of the heat transfer fluid 90% or more of the dielectric strength of the heat transfer fluid before replacement. The upper limit of the dielectric strength of the heat transfer fluid is not particularly limited, but may be, for example, 120% or less of the dielectric strength of the heat transfer fluid before replacement.

[0069] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be suitably used as a replacement composition by making the specific heat of the heat transfer fluid 90% or more of the specific heat of the heat transfer fluid before replacement. The upper limit of the specific heat of the heat transfer fluid is not particularly limited, but may be, for example, 120% or less of the specific heat of the heat transfer fluid before replacement.

[0070] The heat transfer fluid composition or heat transfer fluid of the present disclosure can be suitably used as a replacement composition by making the thermal conductivity of the heat transfer fluid 90% or more of the thermal conductivity of the heat transfer fluid before replacement. The upper limit of the thermal conductivity of the heat transfer fluid is not particularly limited, but may be, for example, 120% or less of the thermal conductivity of the heat transfer fluid before replacement.

[0071] The boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 105° C. or higher, more preferably 108° C. or higher. The upper limit of the boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 150° C. or lower, 130° C. or lower, or 120° C. or lower.

[0072] The pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably −80° C. or lower, more preferably −100° C. or lower, and even more preferably −110° C. or lower. The lower limit of the pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, and may be, for example, −180° C. or higher, or −160° C. or higher.

[0073] The kinematic viscosity at 25° C. of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 5.0 cSt or less, more preferably 4.5 cSt or less, even more preferably 4.0 cSt or less, and even more preferably 3.7 cSt or less. The kinematic viscosity at 25° C. of the heat transfer fluid composition of the present disclosure may be 1.0 cSt or more, for example, 1.2 cSt or more, 2.0 cSt or more, 2.6 cSt or more, or 3.1 cSt or more.

[0074] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 3.0 or less, more preferably 2.5 or less, and even more preferably 2.0 or less. The lower limit of the dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 1.1 or more.

[0075] The dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 40 kV or more, more preferably 50 kV or more, and even more preferably 50 kV or more. The upper limit of the dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 150 kV or less, or 100 kV or less.

[0076] The specific heat of the heat transfer fluid composition or heat transfer fluid of the present disclosure may be preferably 800 J / kg·K or more, more preferably 900 J / kg·K or more, and even more preferably 1000 J / kg·K or more at 30° C. In addition, the upper limit of the specific heat of the heat transfer fluid composition or heat transfer fluid of the present disclosure is not particularly limited, but may be, for example, 2000 J / kg·K or less, or 1500 J / kg·K or less.

[0077] The thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present disclosure at 25° C. may be preferably 0.0570 W / (m·K) or more, more preferably 0.0600 W / (m·K) or more, even more preferably 0.0620 W / (m·K) or more, still more preferably 0.0660 W / (m·K) or more, and particularly preferably 0.0700 W / (m·K) or more. The thermal conductivity of the heat transfer fluid composition of the present disclosure at 25° C. may be 0.0750 W / (m·K) or less.

[0078] The boiling point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is the temperature at which a peak due to endothermic heat is observed when the temperature is increased from 25° C. at 5° C. / min using DSC (differential scanning calorimetry).

[0079] The pour point of the heat transfer fluid composition or heat transfer fluid of the present disclosure is the temperature at which an endothermic peak is observed when the composition is cooled to below its freezing point with liquid nitrogen and then heated at a rate of 5°C / min using DSC.

[0080] The dielectric constant of the heat transfer fluid composition or heat transfer fluid of the present disclosure is a value observed at a frequency of 1 kHz in an environment of a temperature of 25° C. and a humidity of 60% using a capacitance method.

[0081] The kinematic viscosity and density of the heat transfer fluid composition or heat transfer fluid of the present disclosure are values ​​measured using a kinematic viscometer SVM3001 manufactured by Anton Paar.

[0082] The dielectric strength of the heat transfer fluid composition or heat transfer fluid of the present disclosure is the dielectric breakdown voltage when a liquid sample is immersed between spherical electrodes adjusted to a predetermined distance and the voltage is increased at a constant rate. The measurement conditions are as follows: Electrode shape: Spherical (φ12.5mm) Electrode spacing: 2.5mm Boost speed: 2kV / sec Measurement atmosphere: In air (22°C, 57% RH)

[0083] The specific heat of the heat transfer fluid composition or heat transfer fluid of the present disclosure is a value obtained by using DSC under the following conditions. Measurement equipment: Perkin-Elmer differential scanning calorimeter DSC8500 Heating rate: 10℃ / min Standard sample: Sapphire (-Al2O3) Atmosphere: Dry nitrogen gas flow Sample container: Aluminum airtight container

[0084] The thermal conductivity of the heat transfer fluid composition or heat transfer fluid of the present disclosure is a value obtained by the unsteady thin wire method.

[0085] The compatibility of the heat transfer fluid composition or heat transfer fluid of the present disclosure is determined by whether or not it is compatible with a target solvent when mixed with the composition or the heat transfer fluid. Here, compatibility means that when the two are mixed together, they become homogeneous, i.e., there is no phase separation.

[0086] (Heat transfer device) The present disclosure further provides an apparatus for heat transfer comprising a device and a mechanism for transferring heat to or from the device, the mechanism comprising the heat transfer fluid composition or fluid described above.

[0087] A device may be a component, work piece, assembly, etc. that is cooled, heated, or maintained at a predetermined temperature or temperature range. Devices include electrical, mechanical, and optical components, such as wafers used to manufacture semiconductors, semiconductor elements, computers, server computers, servers including blade servers, disk arrays / storage systems, storage area networks, network attached storage, storage communication systems, workstations, routers, telecommunications infrastructure / switches, wired, optical, and wireless communication devices, cell processing equipment, printers, power supplies, displays, optical devices, measurement systems including handheld systems, military electronics, chemical reactors, fuel cells, heat exchangers, electrochemical cells, microprocessors, power control semiconductors, power distribution switching equipment, power transformers, circuit boards, multichip modules, packaged or unpackaged semiconductor devices, lasers, etc., preferably wafers used to manufacture semiconductors.

[0088] A semiconductor element is a heat-generating element mounted on a device, and examples of such elements include a CPU, a GPU, and an SSD. The semiconductor element is composed of, for example, single elements such as silicon and germanium, and compound semiconductors such as gallium arsenide (GaAs), gallium phosphide (GaP), indium phosphide (InP), gallium nitride (GaN), and silicon carbide (SiC).

[0089] When the device is a server computer, a logic board or multiple logic boards are disposed within the interior space. The logic board includes a number of heat-generating electronic components, including at least one processor, such as a CPU, GPU, etc. In addition, other heat-generating computer components may be used, such as chipsets; memory, graphics chips, network chips, RAM, power supplies, daughter cards; storage drives, such as solid state drives, mechanical hard disks, etc.

[0090] The heat transfer device is a heat transfer device for transferring heat between an object to which heat is transferred using the above-mentioned heat transfer fluid, and transfers heat by thermal contact with the object to which heat is transferred. For example, cooling is used when removing heat from the object to which heat is transferred, and heating is used when supplying heat. Different mechanisms may be used depending on the case, but one heat transfer device may perform both cooling and heating.

[0091] Examples of heat transfer devices include, but are not limited to, pumps, valves, fluid containment systems, pressure control systems, coolers, heat exchangers, heat sources, heat sinks, refrigeration systems, active temperature control systems, and passive temperature control systems.

[0092] More specifically, the heat transfer apparatus includes a temperature controlled wafer chuck in a plasma enhanced chemical vapor deposition (PECVD) tool, a temperature controlled test head for die performance testing, a temperature controlled work area in semiconductor processing equipment, a thermal shock test bath fluid reservoir, a thermostatic chamber, and the like, preferably a temperature controlled work area in semiconductor processing equipment.

[0093] The object to which heat is transferred, which is brought into thermal contact with the heat transfer device, is the same as described above.

[0094] The present disclosure also provides a semiconductor manufacturing apparatus including the heat transfer apparatus of the present disclosure.

[0095] (Heat transfer method) The present disclosure discloses a method of heat transfer comprising the steps of preparing a device and transferring heat to or from the device using the above-mentioned heat transfer fluid composition or heat transfer fluid, where heat can be transferred by placing a heat transfer apparatus in thermal contact with the device. When placed in thermal contact with the device, the heat transfer apparatus removes heat from or supplies heat to the device, or maintains the device at a selected temperature or temperature range. The direction of heat flow (from or to the device) is determined by the relative temperature difference between the device and the heat transfer apparatus.

[0096] Although the present invention has been described above, the present invention is not limited to the above, and can be embodied in various forms without departing from the gist of the present invention. EXAMPLES

[0097] The present disclosure will be described below with reference to examples, but the present disclosure is not limited to the following examples.

[0098] (Production Example 1) HFP trimer was obtained based on the method described in Chem Ber (1973), Vol. 106, pp2950-2959. The obtained HFP trimer was purified by distillation to remove impurities such as hexafluoropropene dimers and tetramers. The purified HFP trimer was further separated into the compounds represented by formulae (I), (II), and (III) by distillation.

[0099] The compounds represented by formulae (I), (II) and (III) obtained above were mixed so that the ratio of the compounds represented by formulae (I), (II) and (III) was as shown in the table below, to obtain trimer mixtures 1 to 5. Examples 1 to 3 are trimer mixtures 1 to 3, and Comparative Examples 1 and 2 are trimer mixtures 4 to 5.

[0100] [Table 1]

[0101] (Boiling point measurement) The boiling point was measured by DSC as the temperature at which an endothermic peak was observed when the temperature was raised from 25° C. at 5° C. / min.

[0102] (Kinematic viscosity) The density and kinematic viscosity at 25° C. were measured using an Anton Paar kinematic viscosity system SVM-3001.

[0103] (Thermal Conductivity) The thermal conductivity at 25°C was measured by the unsteady thin-wire method.

[0104] (Pressure loss) The pressure loss was calculated using the Hagen-Poiseuille equation assuming an inner diameter of the pipe of 7.5 cm, a pipe length of 10 m, and an average flow velocity of 2.35 m / s.

[0105] [Table 2]

[0106] The compositions of Examples 1 to 3 have a lower kinetic viscosity and a smaller pressure loss than the composition described in Comparative Example 1. Furthermore, the compositions of Examples 1 to 3 have a higher boiling point and a smaller loss due to vaporization than the composition described in Comparative Example 2. Furthermore, the compositions of Examples 1 to 3 have sufficient thermal conductivity. [Industrial Applicability]

[0107] The heat transfer fluids and heat transfer fluid compositions of the present disclosure may be suitable for use in a variety of applications requiring heat transfer, particularly in semiconductor manufacturing processes.

Claims

1. The following formulas (I) to (III): 【Chemistry 1】 The hexafluoropropene trimer is represented by The compound represented by formula (I) is contained in an amount of 20% by mass or more and less than 85% by mass based on the total amount of the compounds represented by formulas (I) to (III), The content of the hexafluoropropene trimer is 77.3% by mass or more, further comprising or not comprising fluoride ions, C m F 2m and / or C n F (2n-2), and one or more stabilizers selected from the group consisting of epoxy-based stabilizers, unsaturated alcohol-based stabilizers, nitro-based stabilizers, and phenol-based stabilizers; The content of fluoride ions is 5% by mass or less, the content of C m F 2m and / or C n F (2n-2) is 10 mass% or less based on the hexafluoropropene trimer; The content of one or more stabilizers selected from the group consisting of epoxy-based stabilizers, unsaturated alcohol-based stabilizers, nitro-based stabilizers, and phenol-based stabilizers is 10 mass% or less. Heat transfer fluid compositions.

2. The heat transfer fluid composition according to claim 1, wherein the compound represented by formula (I) is contained in an amount of 30 mass% or more and less than 85 mass% based on the total amount of the compounds represented by formulas (I) to (III).

3. The heat transfer fluid composition according to claim 1, wherein the compound represented by formula (I) is contained in an amount of 50 mass% or more and less than 60 mass% based on the total amount of the compounds represented by formulas (I) to (III).

4. The heat transfer fluid composition according to claim 1, which is used in a semiconductor manufacturing process.

5. A heat transfer fluid comprising the heat transfer fluid composition of claim 1.

6. The heat transfer fluid of claim 5 further comprising a stabilizer.

7. 6. The heat transfer fluid of claim 5 used in semiconductor manufacturing processes.

8. 10. Use of the heat transfer fluid composition according to claim 1 or the heat transfer fluid according to claim 5 for heat transfer.

9. A device, A mechanism for transferring heat to or from said device, comprising the heat transfer fluid composition of claim 1 or the heat transfer fluid of claim 5. An apparatus for heat transfer comprising:

10. 10. The heat transfer apparatus of claim 9, wherein the device is a wafer used to manufacture semiconductors.

11. A semiconductor manufacturing device comprising the heat transfer device according to claim 9.

12. Providing a device; transferring heat to or from said device using the heat transfer fluid composition of claim 1 or the heat transfer fluid of claim 5; A method of heat transfer comprising:

13. The heat transfer method of claim 12 , wherein the device is a wafer used to manufacture semiconductors.

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