Parts supply device

Abstract

Provided is a component supply device that feeds a continuous row of components toward a supply position along a conveyance path extending in a horizontal direction by using the power of air and thereby supplies the components. The supply position is lower than the conveyance path.　Provided is a component supply method for feeding components having terminals toward a supply position by using the power of air and thereby supplying the components. This component supply method performs a conveying step of conveying a continuous row of components having terminals toward the supply position in a state in which the terminals are in contact with a conveying surface of a conveyance path and a positioning step of positioning, at the supply position, the terminals of the components that have the terminals and have been conveyed in the conveying step to supply, one by one, the components having the terminals that have been positioned in the positioning step.

Description

[Technical field]

[0001] The present invention relates to a component supplying device that supplies components by using air force to feed components connected together in the direction of a supply position. [Background technology]

[0002] The following Patent Document describes a component supplying device that supplies a component by using air force to move the component toward a supply position. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 9-57545 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to supply a component at an appropriate supply position in an apparatus that supplies a component by feeding the component in the direction of the supply position using air force. [Means for solving the problem]

[0005] In order to solve the above problems, the present specification provides a component supplying device that uses air force to feed components connected together along a horizontally extending conveying path toward a supply position to supply the components, the supply position being lower than the conveying path, The supply position is formed with a wall positioned in the feed direction of the component and a recessed portion that opens to the bottom surface. A part is conveyed to the supply position, and the air for conveying the part along the conveying path is caused to flow along the upper surface of the part conveyed to the supply position. To The first hole is formed on the wall, To flow air for feeding the parts along the conveying path in a direction to suck the parts conveyed to the supply position downward To Second Wind A hole is formed inside the recess. A configured component feeder is disclosed.

[0006] Effect of the Invention

[0007] In this specification, the supply position of the components is lower than the component transport path. Also, in this specification, the components having terminals are positioned at the supply position and supplied one by one. This allows the components to be supplied at the appropriate supply position. [Brief description of the drawings]

[0008] [Figure 1] FIG. 2 is a perspective view showing a component mounting device. [Diagram 2] FIG. [Diagram 3] FIG. 2 is a perspective view showing a bowl feeder. [Figure 4] FIG. 2 is a side view showing the bowl feeder. [Diagram 5] FIG. 2 is a plan view showing the bowl feeder. [Figure 6] FIG. 2 is a schematic diagram showing a conveying lane, a supply block, and an air ejection device. [Figure 7] FIG. 2 is a plan view showing the transport lane and the supply block. [Figure 8] FIG. 2 is an enlarged cross-sectional view showing the transport lane and the supply block. [Figure 9] FIG. 2 is a block diagram showing a control device. [Figure 10] FIG. 2 is an enlarged cross-sectional view showing the transport lane and the supply block. [Figure 11] FIG. 2 is an enlarged cross-sectional view showing the transport lane and the supply block. [Figure 12] FIG. 2 is an enlarged cross-sectional view showing the transport lane and the supply block. [Figure 13] FIG. 2 is an enlarged cross-sectional view showing the transport lane and the supply block. [Figure 14] FIG. 2 is an enlarged cross-sectional view showing the transport lane and the supply block. [Figure 15] FIG. 2 is an enlarged cross-sectional view showing the transport lane and the supply block. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

[0010] 1 shows a component mounting apparatus 10. The component mounting apparatus 10 is an apparatus for performing a mounting operation of components on a circuit substrate 12. The component mounting apparatus 10 includes an apparatus main body 20, a substrate transport and holding device 22, a component mounting device 24, imaging devices 26, 28, a bulk component supply device 30, a component supply device 32, and a control device (see FIG. 9) 36. Examples of the circuit substrate 12 include a circuit board, a substrate with a three-dimensional structure, and the like, and examples of the circuit substrate include a printed wiring board, a printed circuit board, and the like.

[0011] The main body 20 is composed of a frame 40 and a beam 42 suspended on the frame 40. The substrate conveying and holding device 22 is disposed in the center of the frame 40 in the front-rear direction, and includes a conveying device 50 and a clamping device 52. The conveying device 50 is a device for conveying the circuit substrate 12, and the clamping device 52 is a device for holding the circuit substrate 12. As a result, the substrate conveying and holding device 22 conveys the circuit substrate 12 and holds the circuit substrate 12 fixedly at a predetermined position. In the following description, the conveying direction of the circuit substrate 12 is referred to as the X direction, the horizontal direction perpendicular to that direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction. In other words, the width direction of the component mounting device 10 is the X direction, and the front-rear direction is the Y direction.

[0012] The component mounting device 24 is disposed on the beam 42 and has two work heads 60, 62 and a work head moving device 64. As shown in FIG. 2, a suction nozzle 66 is removably provided on the lower end surface of each of the work heads 60, 62, and the component is held by the suction nozzle 66. The work head moving device 64 has an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The two work heads 60, 62 are moved integrally to any position on the frame 40 by the X-direction moving device 68 and the Y-direction moving device 70. The work heads 60, 62 are removably positioned and attached to sliders 74, 76 by a single touch by an operator without using tools, and the Z-direction moving device 72 moves the sliders 74, 76 individually in the vertical direction. That is, the work heads 60, 62 are moved individually in the vertical direction by the Z-direction moving device 72.

[0013] The imaging device 26 is attached to the slider 74 facing downward on the vertical axis, and moves together with the work head 60 in the X, Y, and Z directions. As a result, the imaging device 26 captures an image of an arbitrary position on the frame 40. The imaging device 28 is disposed between the base material conveying and holding device 22 and the component supplying device 32 on the frame 40, as shown in FIG. 1, facing upward on the vertical axis. As a result, the imaging device 28 captures an image of a component held by the suction nozzle 66 of the work heads 60, 62. The imaging devices 26, 28 are two-dimensional cameras and capture two-dimensional images.

[0014] The bulk parts supplying device 30 is disposed at one end of the frame 40 in the front-rear direction. The bulk parts supplying device 30 is a device that aligns multiple parts that are scattered randomly and supplies the parts in the aligned state. In other words, it is a device that aligns multiple parts in any orientation into a predetermined orientation and supplies the parts in the predetermined orientation.

[0015] The component supplying device 32 is disposed at the other end of the frame 40 in the front-rear direction. The component supplying device 32 has a tray-type component supplying device 78 and a feeder-type component supplying device 80. The tray-type component supplying device 78 is a device that supplies components placed on a tray. The feeder-type component supplying device 80 is a device that supplies components by a bowl feeder 82, a device that supplies components by a tape feeder, etc. The structure of the bowl feeder 82 will be described below.

[0016] Bowl feeder 82 is detachably positioned and attached by an operator using multiple slots among all the slots of feeder holder 86 fixedly provided at the other end of frame 40. Bowl feeder 82 is a supply device that transports multiple electronic components contained in a bowl-shaped bowl in a line-up and contacting state, that is, in a connected state, to a supply position and supplies the electronic components one by one at the supply position.

[0017] As shown in Figures 3 to 5, bowl feeder 82 includes a feeder body 100, a parts hopper 102, a bowl 104, a conveying lane 106, an air blowing device (see Figure 6) 108, a supply block 110, and a separation device (see Figure 8) 111. In the following description, the direction from part hopper 102 to supply block 110 is referred to as the front, and the direction from supply block 110 to part hopper 102 is referred to as the rear. Also, Figure 3 is a perspective view showing bowl feeder 82 from an obliquely upward perspective, Figure 4 is a side view showing bowl feeder 82 from a lateral perspective, and Figure 5 is a plan view showing bowl feeder 82 from an upward perspective.

[0018] The bowl feeder 82 is mounted on the feeder holder 86 in the feeder body 100, and a component hopper 102, a bowl 104, a conveying lane 106, and a feed block 110 are disposed on the upper surface of the feeder body 100. The component hopper 102 is generally cylindrical and disposed at the rear end of the upper surface of the feeder body 100. The upper surface of the component hopper 102 has a bowl-shaped recess, which is a component input section 112. A protrusion 114 that protrudes forward is formed at the front end of the upper edge of the component hopper 102. A groove 116 is formed on the upper surface of the protrusion 114 so as to extend in the front-rear direction, and the groove 116 opens at the front end of the protrusion 114 at its front end and opens at the component input section 112 at its rear end. The width of the groove 116 is slightly larger than the width of the electronic component.

[0019] A spiral-shaped conveying path 118 is formed on the inner wall surface of the component insertion section 112, and the conveying path 118 runs from the bottom surface of the component insertion section 112 around the inner wall surface of the component insertion section 112 to the opening at the rear end of the groove 116. The component hopper 102 is held on the upper surface of the feeder body 100 so as to be vibrable in the front-rear and left-right directions, and is torsionally vibrated in the front-rear and left-right directions by operation of an electromagnetic motor (see FIG. 9 ). By operation of the electromagnetic motor 120, the component hopper 102 vibrates at a high frequency with a very small vibration amplitude, so that the components inserted into the component insertion section 112 move upward along the conveying path 118.

[0020] Bowl 104 is also generally cylindrical, and is disposed on the upper surface of feeder body 100, in front of component hopper 102. The height dimension of bowl 104 is smaller than the height dimension of component hopper 102, and bowl 104 is disposed on the front side of component hopper 102 so that the upper surface of bowl 104 is located below the front end of protrusion 114, which protrudes forward from the upper end of component hopper 102. The upper surface of bowl 104 is also recessed in a bowl shape, and this recess functions as component storage section 122.

[0021] A spiral-shaped conveying path 124 is also formed on the inner wall surface of the component-accommodating section 122, and the conveying path 124 opens to the side of the upper edge of the bowl 104 while going around the inner wall surface of the component-accommodating section 122 from the bottom surface of the component-accommodating section 122. The bowl 104 is also held on the upper surface of the feeder body 100 so as to be vibrated in the front-rear and left-right directions, and is torsionally vibrated in the front-rear and left-right directions by the operation of an electromagnetic motor (see FIG. 9 ). Similarly, the operation of the electromagnetic motor 128 causes the bowl 104 to vibrate at a high frequency with a very small vibration amplitude, so that the components inserted into the component-accommodating section 122 move upward along the conveying path 124.

[0022] The conveying lane 106 is generally rod-shaped and supported by two support legs 130, 131 so as to extend horizontally and in the front-rear direction on the upper surface of the feeder body 100. The rear end of the conveying lane 106 extends toward the conveying path 124 that opens to the side of the upper edge of the bowl 104. A conveying groove 132 is formed on the upper surface of the conveying lane 106 so as to extend in the front-rear direction, and the conveying groove 132 opens at the front end of the conveying lane 106 at its front end and at its rear end at its rear end. The conveying groove 132 opens on the upper surface of the conveying lane 106, but the opening is covered by a cover member 134 as shown in FIG. 6. Therefore, the conveying groove 132 is formed in a tunnel shape that penetrates the conveying lane 106 in the front-rear direction. However, the lid member 134 does not cover the front end of the transport groove 132, and only the front end of the transport groove 132 is open to the upper surface of the transport lane 106. The dimension between the bottom surface of the transport groove 132 and the lower surface of the lid member 134, i.e., the vertical dimension of the tunnel-shaped transport groove 132, is slightly larger than the height of the electronic components. In addition, the width dimension of the transport groove 132 is slightly larger than the width dimension of the electronic components.

[0023] The rear end of the conveying groove 132 faces the conveying path 124 opening at a side portion of the upper edge of the bowl 104 with a small clearance therebetween. In other words, the rear end of the conveying lane 106 where the rear end of the conveying groove 132 opens faces the side portion of the upper edge of the bowl 104 where the conveying path 124 opens with a small clearance therebetween. The conveying lane 106 is held by support legs 130 and 131 so as to be able to vibrate in the front-rear direction, and vibrates in the front-rear direction by the operation of an electromagnetic motor (see FIG. 9 ) 136. Similarly, by the operation of the electromagnetic motor 136, the conveying lane 106 vibrates at a very small vibration amplitude at a high frequency, so that the parts lined up in the conveying groove 132 of the conveying lane 106 move forward.

[0024] Incidentally, the clearance between the rear end of the conveying lane 106 and the side part of the upper edge of the bowl 104 is set to be larger than the sum of the vibration width of the conveying lane 106 and the vibration width of the bowl 104. As a result, the bowl 104 and the conveying lane 106 do not come into contact with each other when the bowl 104 and the conveying lane 106 vibrate. As will be described in detail later, electronic components are conveyed from the conveying path 124 of the bowl 104 to the conveying groove 132 of the conveying lane 106, but the clearance between the rear end of the conveying lane 106 and the side part of the upper edge of the bowl 104 is set to be smaller than the outer dimensions of the electronic components. As a result, when the electronic components are conveyed from the conveying path 124 of the bowl 104 to the conveying groove 132 of the conveying lane 106, the electronic components are prevented from falling off.

[0025] As shown in FIG. 6, the air ejection device 108 includes a pipe 140 and an air pump 142. The transport lane 106 is provided with an air flow path 146 that penetrates from the bottom surface of the transport lane 106 to the bottom surface of the transport groove 132. The air flow path 146 penetrates from the bottom surface of the transport lane 106 obliquely upward toward the front and opens into the bottom surface of the transport groove 132. Seven air flow paths 146 are formed at approximately seven equally spaced positions in the front-rear direction of the transport lane 106. The pipe 140 is branched into seven at one end, and one end of the seven branched pipes 140 is connected to the openings of the seven air flow paths 146 on the bottom surface of the transport lane 106. The other end of the pipe 140 is connected to the air pump 142. With this structure, when the air pump 142 is operated, air flows into the air flow path 146 through the pipe 140, and the air is ejected into the inside of the transport groove 132. In addition, since the air flow path 146 penetrates the bottom surface of the transport lane 106 diagonally upward toward the front, the air ejected into the transport groove 132 flows inside the transport groove from the rear to the front, causing the parts lined up in the transport groove 132 of the transport lane 106 to move forward.

[0026] 3, the supply block 110 is supported by a support leg 150 on the upper surface of the feeder body 100 at a position facing the front end of the transport lane 106. The upper surface of the supply block 110 is located at approximately the same height as the upper surface of the transport lane 106. As shown in FIG. 7, a component storage opening 152 is formed on the upper surface of the supply block 110. The component storage opening 152 opens on the upper surface and rear end surface of the supply block 110, and the opening of the component storage opening 152 on the rear end surface of the supply block 110 faces the opening of the front end of the transport groove 132 of the transport lane 106 with a small clearance therebetween. The bottom surface of the component storage opening 152 is at the same height as the bottom surface of the transport groove 132 of the transport lane 106, as shown in FIG. 8. The clearance between the rear end surface of the supply block 110 and the front end of the transport lane 106 is larger than the vibration width of the transport lane 106. This prevents the supply block 110 from coming into contact with the supply lane 106 when the transport lane 106 vibrates. As will be described in detail later, electronic components are transported from the transport groove 132 of the transport lane 106 to the component storage opening 152 of the supply block 110, but the clearance between the rear end face of the supply block 110 and the front end of the transport lane 106 is set smaller than the outer dimensions of the electronic components. This prevents the electronic components from falling off when they are transported from the transport groove 132 of the transport lane 106 to the component storage opening 152 of the supply block 110.

[0027] The electronic component 160 is generally composed of a block-shaped component body 162 and two terminals 164 disposed on the bottom surface of the component body 162. The terminals 164 are short cylindrical and extend downward from the bottom surface of the terminals 164. The width of the component housing opening 152 is slightly larger than the width of the component body 162 of the electronic component 160, and the length of the component housing opening 152 is slightly larger than the length of the component body 162 of the electronic component 160. Therefore, one electronic component 160 is housed in the component housing opening 152. The supply block 110 is formed with a recess 168 that opens into the bottom surface of the component housing opening 152. The opening of the recess 168 is smaller than the entire bottom surface of the component body 162 of the electronic component 160, but larger than the portion where the two terminals 164 of the component body 162 are fixed. The depth of the recess 168 is longer than the length of the terminal 164. Therefore, with the two terminals 164 of the electronic component 160 accommodated in the component housing opening 152 inserted into the recess 168 , the lower surface of the component body 162 is supported by the bottom surface of the component housing opening 152 .

[0028] 7, a cylindrical transmission type detection sensor 180 is provided in the supply block 110, and the detection sensor 180 is composed of a light-projecting unit 182 and a light-receiving unit 184. The light-projecting unit 182 and the light-receiving unit 184 are disposed facing each other with the component housing opening 152 in between. The light-projecting unit 182 and the light-receiving unit 184 are embedded in the supply block 110, and light irradiated from the light-projecting unit 182 is received by the light-receiving unit 184 through the component housing opening 152. For this reason, if an electronic component 160 is present in the component housing opening 152 between the light-projecting unit 182 and the light-receiving unit 184, the light irradiated from the light-projecting unit 182 is blocked by the electronic component 160, and the light-receiving unit 184 does not receive the light irradiated by the light-projecting unit 182. On the other hand, when there is no electronic component 160 in the component housing opening 152 between the light-projecting unit 182 and the light-receiving unit 184, the light-receiving unit 184 receives the light irradiated from the light-projecting unit 182. As a result, the detection sensor 180 detects the presence or absence of the electronic component 160 in the component housing opening 152 based on the presence or absence of reception of light by the light-receiving unit 184.

[0029] As shown in FIG. 8, the separator 111 has a pusher 190 and an air cylinder (see FIG. 9). The pusher 190 is generally block-shaped and is disposed above the front end of the conveying lane 106. As described above, the cover member 134 is not disposed at the front end of the conveying lane 106, so the conveying groove 132 is open. The pusher 190 is held by the air cylinder 192 so as to be movable up and down. The pusher 190 is lowered by the expansion of the air cylinder 192, and the pusher 190 is raised by the contraction of the air cylinder 192. When the pusher 190 is lowered, the lower end of the pusher 190 enters the inside of the conveying groove 132, and when the pusher 190 is raised, it moves out of the conveying groove 132 and above the conveying groove 132. A tapered surface 196 is formed on the rear edge of the lower end surface of the pusher 190.

[0030] 9, the control device 36 includes a controller 200, a plurality of drive circuits 202, and an image processing device 206. The plurality of drive circuits 202 are connected to the above-mentioned conveying device 50, clamping device 52, working heads 60, 62, X-direction moving device 68, Y-direction moving device 70, Z-direction moving device 72, tray-type component supply device 78, electromagnetic motors 120, 128, 136, air pump 142, air cylinder 192, and bulk component supply device 30. The controller 200 includes a CPU, ROM, RAM, and the like, and is mainly a computer, and is connected to the plurality of drive circuits 202. As a result, the operation of the substrate conveying and holding device 22, the component mounting device 24, and the like is controlled by the controller 200. The controller 200 is also connected to the image processing device 206. The image processing device 206 processes image data obtained by the imaging devices 26, 28, and the controller 200 acquires various information from the image data. Furthermore, the controller 200 is also connected to the detection sensor 180 of the bowl feeder 82. In this way, the controller 200 obtains the detection result by the detection sensor 180.

[0031] The component mounting apparatus 10 performs a component mounting operation on the circuit board 12 held by the substrate conveying and holding device 22 with the above-mentioned configuration. Specifically, the circuit board 12 is conveyed to the work position and fixedly held at that position by the clamp device 52. Next, the imaging device 26 moves above the circuit board 12 and captures an image of the circuit board 12. This allows information regarding an error in the holding position of the circuit board 12 to be obtained. Also, the bulk component supply device 30 or the component supply device 32 supplies components at a predetermined supply position. Note that the supply of components by the bowl feeder 82 of the component supply device 30 will be described in detail later. Then, one of the work heads 60, 62 moves above the component supply position and holds the component by the suction nozzle 66. Next, the work heads 60, 62 holding the component move above the imaging device 28, and the imaging device 28 captures an image of the component held by the suction nozzle 66. This allows information regarding an error in the holding position of the component to be obtained. Then, the work heads 60, 62 holding the components move above the circuit board 12, and the components they are holding are mounted on the circuit board 12 after correcting any errors in the holding position of the circuit board 12, any errors in the holding position of the components, etc.

[0032] In the bowl feeder 82, electronic components are inserted into the component insertion section 112 of the component hopper 102 by an operator, and the inserted electronic components are transported to the component storage opening 152 of the supply block 110 by the high-frequency vibration of the component hopper 102, bowl 104, and conveying lane 106 and the air ejected from the air ejection device 108, and the electronic components are supplied at the component storage opening 152.

[0033] Specifically, the worker puts a plurality of electronic components 160 into the component insertion section 112 of the component hopper 102. Then, the electronic components 160 put into the component insertion section 112 are caused to rise in a spiral shape on the inner wall surface of the component insertion section 112 along the conveying path 118 formed in the component insertion section 112 by the operation of the electromagnetic motor 120. Specifically, as described above, the component hopper 102 is caused to torsionally vibrate in the front-rear and left-right directions at high frequency by the operation of the electromagnetic motor 120. That is, the component hopper 102 is repeatedly vibrated in the torsional direction at high frequency. At this time, the electronic components 160 put into the component insertion section 112 are urged toward the inner wall surface of the component insertion section 112 by the centrifugal force caused by the repeated vibration of the component hopper 102 in the torsional direction. As a result, the electronic components put into the component insertion section 112 are caused to rise in a spiral shape on the inner wall surface of the component insertion section 112 along the conveying path 118. The electronic components rising along the conveying path 118 reach groove 116 formed in protruding portion 114 of component hopper 102, and drop from the opening at the front end of groove 116 to be received in component receiving portion 122 of bowl 104. Next, the electronic components received in component receiving portion 122 of bowl 104 rise in a spiral shape along the inner wall surface of component receiving portion 122 along conveying path 124 formed in component receiving portion 122 due to the operation of electromagnetic motor 128 of bowl 104.

[0034] Specifically, as described above, the operation of the electromagnetic motor 128 causes the bowl 104 to vibrate in a torsional manner in the front-rear and left-right directions at high frequency. That is, the bowl 104 vibrates repeatedly in the torsional direction at high frequency. At this time, the electronic components 160 accommodated in the component accommodating section 122 are urged toward the inner wall surface of the component accommodating section 122 by centrifugal force caused by the repeated vibration in the torsional direction of the bowl 104. As a result, the electronic components 160 accommodated in the component accommodating section 122 ascend in a spiral shape on the inner wall surface of the component accommodating section 122 along the conveying path 124. The conveying path 124 formed on the inner wall surface of the component accommodating section 122 is shaped so that the terminals 164 of the electronic components 160 can be fitted into the conveying path 124. Therefore, the electronic components 160 ascend in a spiral shape on the inner wall surface of the component accommodating section 122 with the terminals 164 fitted into the conveying path 124. That is, the electronic component 160 ascends in a spiral shape along the transport path 124 with the terminals 164 facing the inner wall surface of the component-receiving portion 122 .

[0035] Then, the electronic component 160 ascending along the conveying path 124 reaches the upper end of the conveying path 124 and enters the conveying groove 132 of the conveying lane 106 facing the upper end of the conveying path 124. That is, the electronic component 160 ascending along the conveying path 124 is fed from the upper end of the conveying path 124 into the conveying groove 132 of the conveying lane 106. At this time, the electronic component 160 is fed from the conveying path 124 into the conveying groove 132 of the conveying lane 106 with the terminals 164 fitted into the conveying path 124 of the bowl 104. Therefore, the electronic component 160 is fed into the conveying groove 132 of the conveying lane 106 with the terminals 164 facing downward. That is, the electronic component 160 is fed with the lower ends of the terminals 164 in contact with the bottom surface of the conveying groove 132. The width of the tunnel-shaped transport groove 132 is slightly larger than the width of the electronic component 160, and the height of the tunnel-shaped transport groove 132 is slightly larger than the height of the electronic component 160. Therefore, the electronic component 160 enters the transport groove 132 in a posture in which the width direction of the electronic component 160 coincides with the width direction of the transport groove 132. In other words, the electronic component 160 enters the transport groove 132 in a posture in which the length direction of the electronic component 160 is the extension direction of the transport groove 132 and the width direction of the electronic component 160 is the width direction of the transport groove 132. In addition, as the electromagnetic motor 128 of the bowl 104 is operated, the electronic components 160 enter the transport groove 132 of the transport lane 106 one by one from the transport path 124 of the bowl 104, so that the electronic components 160 are lined up in a row in the transport groove 132 in the above-mentioned predetermined posture. At this time, the electronic components 160 that have entered the transport groove 132 are pushed by the new electronic components 160 that are entering the transport groove 132 of the transport lane 106 from the transport path 124 of the bowl 104, causing adjacent electronic components 160 to come into contact with each other. In other words, the multiple electronic components 160 enter the transport groove 132 of the transport lane 106 in a connected state.

[0036] In this way, the multiple electronic components 160 that have entered the transport groove 132 in a state of being connected to one another in a predetermined posture are transported toward the front end of the transport lane 106 by the operation of the electromagnetic motor 136 of the transport lane 106 and the ejection of air from the air ejection device 108. More specifically, the operation of the electromagnetic motor 136 causes the transport lane 106 to vibrate repeatedly in the front-rear direction at a high frequency, as described above. At this time, the vibration frequency of the electromagnetic motor 136 is adjusted so that the electronic components that have entered the transport groove 132 are lifted up diagonally forward. Therefore, the transport lane 106 vibrates repeatedly in the front-rear direction at a high frequency, causing the electronic components that have entered the transport groove 132 to move forward in small increments.

[0037] As described above, the seven air passages 146 are formed in the transport groove 132 at approximately seven equally spaced positions in the front-rear direction, and air is blown into the transport groove 132 through the seven air passages 146 by the operation of the air pump 142 of the air blowing device 108. The air passages 146 penetrate the bottom surface of the transport lane 106 obliquely upward toward the front and open to the bottom surface of the transport groove 132, so that the air blown into the transport groove 132 flows inside the transport groove from the rear to the front. This causes the electronic components that have entered the transport groove 132 to move forward. In this way, the multiple electronic components 160 that have entered the transport groove 132 are transported toward the front end of the transport lane 106 in a connected state with the lower ends of the terminals 164 in contact with the bottom surface of the transport groove 132, as shown in FIG. 10, by the operation of the electromagnetic motor 136 and the blowing of air by the air blowing device 108. When the electronic components 160 are being transported in the transport groove 132, the pusher 190 is raised by the operation of the separation device 111 so as not to interfere with the transport of the electronic components 160 in the transport groove 132. In this manner, when the electronic components 160 are being transported in the transport groove 132, the air cylinder 192 of the separation device 111 is contracted and the pusher 190 is raised. In other words, when no components are being supplied to the supply position, the air cylinder 192 of the separation device 111 is contracted and the pusher 190 is raised.

[0038] Then, the electronic components 160 are transported in the transport groove 132 in a state where they are connected to one another, and the electronic components 160 transported to the front end of the transport groove 132 enter the component storage opening 152 of the supply block 110. That is, the electronic components 160 transported to the front end of the transport groove 132 are sent from the front end of the transport groove 132 into the component storage opening 152 of the supply block 110. The width dimension of the component storage opening 152 is slightly larger than the width dimension of the electronic components 160, and the length dimension of the component storage opening 152 is slightly larger than the length dimension of the electronic components 160. Therefore, one electronic component 160 enters the component storage opening 152 from the transport groove 132 of the transport lane 106 in a predetermined posture. As described above, the component accommodating opening 152 has the recess 168 formed therein, and therefore, as shown in Fig. 8, when the two terminals 164 of the electronic component 160 inserted in the component accommodating opening 152 are fitted into the recess 168, the lower surface of the component body 162 is supported by the bottom surface of the component accommodating opening 152. In this manner, when the two terminals 164 of the electronic component 160 are fitted into the recess 168, the lower surface of the component body 162 is supported by the bottom surface of the component accommodating opening 152, so that one electronic component 160 is positioned in the component accommodating opening 152. Then, one electronic component 160 positioned in the component accommodating opening 152 is supplied. That is, in the bowl feeder 82, the component accommodating opening 152 functions as a supply position, and the electronic components 160 positioned in the component accommodating opening 152 are supplied one by one in a predetermined attitude.

[0039] However, the electronic components 160 are conveyed in a connected state in the conveying groove 132 of the conveying lane 106, and the leading electronic component 160a (hereinafter referred to as the "leading component") of the electronic components 160 is inserted into the component housing opening 152 and positioned. Therefore, as shown in FIG. 8, the leading component 160a is in contact with the electronic component (hereinafter referred to as the "contact component") 160b located behind the leading component 160a, and the leading component 160a is sandwiched between the wall 210 that defines the component housing opening 152 and the contact component 160b. In this manner, when the leading component 160a is sandwiched, the leading component 160a cannot be appropriately held by the suction nozzle 66. Therefore, the leading component 160a and the contact component 160b are separated by the operation of the separating device 111.

[0040] More specifically, when the leading component 160a is accommodated in the component accommodation opening 152, operation of the electromagnetic motor 136 of the transport lane 106 and the air pump 142 of the air blowing device 108 is stopped. When an electronic component is accommodated in the component accommodation opening 152, the electronic component is detected by the detection sensor 180, as described above. Therefore, the controller 200 stops operation of the electromagnetic motor 136 of the transport lane 106 and the air pump 142 of the air blowing device 108 at the timing when the detection sensor 180 detects the electronic component. This stops the transport of electronic components on the transport lane 106.

[0041] In addition, the controller 200 extends the air cylinder 192 of the separation device 111 at the timing when the electromagnetic motor 136 of the conveying lane 106 and the air pump 142 of the air ejection device 108 are stopped. As described above, the pusher 190 of the separation device 111 is disposed above the front end of the conveying lane 106 and is held by the air cylinder 192 so that it can be raised and lowered. Then, the air cylinder 192 is extended, so that the pusher 190 descends and the lower end of the pusher 190 contacts the upper surface of the component body 162 of the contact component 160b. A tapered surface 196 is formed on the rear edge of the lower end surface of the pusher 190, and the outer edge of the upper surface of the component body 162 is chamfered. Therefore, the tapered surface 196 of the pusher 190 contacts the chamfered outer edge of the upper surface of the component body 162 as the pusher 190 descends. Then, as pusher 190 further descends, the chamfered outer edge of the upper surface of component body 162 is biased diagonally backward by tapered surface 196 of pusher 190. As a result, as shown in Fig. 11, contact part 160b moves backward, and leading part 160a and contact part 160b are separated. This releases leading part 160a from being held between wall 210 of component housing opening 152 and contact part 160b.

[0042] Then, the controller 200 outputs a component holding command to the work heads 60, 62 and the work head moving device 64 at the timing when the extension of the air cylinder 192 is completed. As a result, one electronic component 160 positioned at the component storage opening 152 is appropriately held by the suction nozzle 66. In this manner, in the bowl feeder 82, a recess 168 is formed at the component storage opening 152, i.e., the component supply position, and the electronic component 160 is positioned at the recess 168 by making the component supply position lower than the conveying groove 132 of the conveying lane 106. In other words, the recess 168 formed at the component supply position is made lower than the bottom surface of the conveying groove 132 of the conveying lane 106, and the terminal 164 of the electronic component 160 fits into the recess 168 at the component supply position, so that the height of the electronic component 160 at the supply position is lower than the height of the electronic component 160 at the conveying groove 132. In this manner, the height of electronic component 160 at the supply position is lower than the height of electronic component 160 in transport groove 132, so that electronic component 160 is positioned at the supply position. Note that the height of electronic component 160 at the supply position and transport groove 132 refers to the vertical position of a predetermined portion of electronic component 160 at the supply position and transport groove 132, and the predetermined portion may be any portion, such as the upper surface, lower surface, or upper end of a terminal of component body 162 of electronic component 160.

[0043] However, at the supply position, i.e., at the component storage opening 152, the terminals 164 of the electronic components 160 may not fit into the recesses 168, and the electronic components 160 may not be positioned properly. More specifically, when the electronic components 160 are transported in a line in the transport groove 132 of the transport lane 106, air is ejected forward inside the transport groove 132, and the electronic components are transported forward by the ejection of air. At this time, as shown in FIG. 12, the air (arrow 220) ejected forward inside the transport groove 132 hits the wall 210 of the supply block 110 and changes direction obliquely upward toward the front side. In other words, the air (arrow 220) ejected forward inside the transport groove 132 becomes an ascending air current (arrow 222) obliquely upward toward the front side at the component storage opening 152. In addition, the air (arrow 220) being sprayed forward inside the transport groove 132 enters the recess 168 of the supply block 110 from near the bottom surface of the transport groove 132 and changes direction inside the recess 168, becoming an ascending air current (arrow 224).

[0044] Therefore, when the leading electronic component 160a among the plurality of electronic components 160 being transported in the transport groove 132 is transported to the component storage opening 152, the front end of the leading component 160a may be lifted up by the rising air current (arrows 222, 224) as shown in FIG. 13. In such a case, the leading component 160a may be caught by the wall 210 of the supply block 110, and the leading component 160a may be tilted at the component storage opening 152, that is, the component supply position. Furthermore, the leading component 160a may jump out of the component storage opening 152. In this way, if the leading component 160a is tilted at the component storage opening 152 or jumps out of the component storage opening 152, the leading component 160a cannot be supplied. Furthermore, even if the leading component 160a does not get caught by the wall 210 of the supply block 110 as shown in FIG. 13, the terminal 164 of the leading component 160a may not fit into the recess 168. Thus, unless the terminals 164 fit into the recesses 168 in the component receiving opening 152, the electronic component 160 will not be positioned properly, and therefore the electronic component 160 cannot be supplied appropriately.

[0045] In view of this, as shown in Fig. 14, the supply block 110 is formed with a first air hole 230 penetrating the wall 210 in the front-rear direction and a second air hole 232 penetrating the inner wall surface on the front side of the recess 168 toward the front. In this way, by forming the first air hole 230, the air (arrow 220) ejected toward the front inside the transport groove 132 flows in a direction (arrow 250) passing through the first air hole 230, so that no large upward air current is generated. In addition, by forming the second air hole 232, even if the air (arrow 220) ejected toward the front inside the transport groove 132 enters the recess 168 of the supply block 110 from near the bottom surface of the transport groove 132, it flows in a direction (arrow 252) passing through the second air hole 232, so that no large upward air current is generated. Therefore, when the leading electronic component of the multiple electronic components 160 being transported in the transport groove 132, i.e., the leading component 160a, is transported to the component accommodating opening 152, the terminals 164 of the leading component 160a fit into the recesses 168, as shown in FIG. 15, so that the leading component 160a is properly positioned in the component accommodating opening 152.

[0046] In particular, when the leading component 160a is transported to the component storage opening 152, the air (arrow 220) being ejected forward inside the transport groove 132 flows along the upper surface of the component body 162 of the leading component 160a in a direction (arrow 250) passing through the first air hole 230. At this time, the air flowing along the upper surface of the component body 162 of the leading component 160a acts as a downforce, pressing the leading component 160a toward the recess 168. In addition, when the leading component 160a is transported to the component storage opening 152, the air (arrow 220) being ejected forward inside the transport groove 132 enters the recess 168 from the bottom surface of the transport groove 132, passes through the recess 168, and flows in a direction (arrow 252) passing through the second air hole 232. At this time, the air that enters recess 168 from the bottom surface of transport groove 132 and passes through recess 168 acts as a down force, sucking leading component 160a toward recess 168. In this way, the air (arrow 220) being ejected forward inside transport groove 132 acts as a down force on leading component 160a at component storage opening 152, so that terminal 164 of leading component 160a fits suitably into recess 168, and leading component 160a can be appropriately positioned in component storage opening 152.

[0047] Bowl feeder 82 is an example of a component supplying device. Conveyor groove 132 is an example of a conveying path. The bottom surface of conveyor groove 132 is an example of a conveying surface. Electronic component 160 is an example of a component. Terminal 164 is an example of a terminal.

[0048] Furthermore, the present invention is not limited to the above embodiment, and can be embodied in various forms with various modifications and improvements based on the knowledge of those skilled in the art. For example, in the above embodiment, bowl feeder 82 is used as a device for supplying parts, but various devices can be used as long as they are device for supplying parts that use air force to feed parts that are connected to each other toward the supply position. Specifically, for example, a bulk feeder that aligns loose parts in a line and feeds them, or a stick feeder that feeds aligned parts in a line, can be used.

[0049] Also, in the above embodiment, bowl feeder 82 is detachably positioned and attached using a plurality of slots provided in feeder holder 86, but as long as positioning is possible, a component supplying device such as a bowl feeder may be attached to component mounting device 10 using support legs, a fixing device, a locking mechanism, etc. In this way, by using support legs, a fixing device, a locking mechanism, etc., even a large component supplying device can be attached in a state where it is appropriately positioned on the component mounting device.

[0050] In the above embodiment, the electronic components are conveyed in a connected state along the tunnel-shaped conveying groove 132 in the conveying lane 106, but the electronic components may be conveyed in a connected state along conveying paths of various shapes. For example, a groove-shaped conveying path, a conveying path guided by a guide such as a wall or a rail, etc. may be adopted. The conveying groove 132 is a conveying path extending in a straight line, but a conveying path having a curved shape or the like may be adopted. Furthermore, the conveying lane 106 in which the conveying groove 132 is formed is arranged to extend horizontally, but it may be arranged in an inclined state.

[0051] In the above embodiment, the electronic components are transported toward the supply position by utilizing the force of air and the vibration of the transport lane 106, but if the force of air is used, the electronic components may be transported toward the supply position by utilizing something other than the vibration of the transport lane 106. As something other than the vibration of the transport lane 106, for example, magnetic force, gravity (the weight of the components), etc. may be adopted. Also, the electronic components may be transported toward the supply position by utilizing only the force of air. In the above embodiment, the electronic components are transported toward the supply position by utilizing the blowing force of air, but the electronic components may be transported toward the supply position by utilizing the suction force of air.

[0052] In the above embodiment, the terminals 164 of the electronic component 160 are positioned by fitting into the recesses 168, but a portion other than the terminals 164, for example, a part of the component body 162 such as the front end of the component body 162, may be positioned by fitting into the recesses. Also, the entire electronic component 160 may be positioned by fitting into the recesses. Also, the electronic component is not limited to recesses, and the terminals may be fitted between a plurality of protrusions.

[0053] In the above embodiment, short cylindrical terminals 164 are used, but terminals of various shapes such as pin, ball, and lead shapes can be used. In addition, the present invention is applied to a component supplying device that supplies electronic components having terminals, but the present invention may also be applied to a component supplying device that supplies electronic components not having terminals. Furthermore, the present invention may be applied to a component supplying device that supplies various components, not limited to electronic components.

[0054] In the above embodiment, the electronic component 160 is positioned at a supply position that is lower than the transport path, but the electronic component 160 may be positioned at a supply position that is at the same height as the transport path. When positioning, the component may be positioned by fitting all or part of it into a recess or the like, or the component may be positioned by being held or gripped all or part of it.

[0055] Furthermore, in the above embodiment, electronic components are supplied from bowl feeder 82 to the work heads 60, 62 of the component mounting device, but regardless of the electronic components, the components may be supplied to various robots, such as, for example, an articulated robot for assembling or aligning components. [Explanation of symbols]

[0056] 82: Bowl feeder (component supply device) 132: Conveyor groove (conveyor path) 160: Electronic component (component) 164: Terminal

Claims

1. A component supplying device that uses air force to feed components connected together along a horizontally extending conveying path toward a supply position to supply the components, The supply position is lower than the conveying path, The supply position is formed with a wall located in a feed direction of the component and a recessed portion that opens to a bottom surface, A component supply device in which a first air hole is formed in the wall to allow air for feeding the components along the transport path to flow along the upper surface of the components transported to the supply position, and a second air hole is formed inside the recess to allow air for feeding the components along the transport path to flow in a direction that sucks the components transported to the supply position downward.

2. 2. The component supplying device according to claim 1, wherein the component is supplied by positioning the component at the supply position.

3. 3. The component supply device according to claim 1, wherein a height of the component at the supply position is lower than a height of the component on the transport path.

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