Electrical Connection Device

Abstract

To provide probes and a probe card, which prevent short-circuiting between probes and does not interfere operation of a probe head.SOLUTION: A probe designed to be inserted to a through-hole of a guide plate to be used for inspection of an inspection target is provided, the probe comprising a columnar conductor portion, and a plurality of insulative coating materials arranged on a surface of the conductor portion along a center axis of the conductor portion so as to be spaced apart from each other.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention is used for inspecting the electrical characteristics of a test object. Electrical Connection Device Regarding. [Background technology]

[0002] In order to test the electrical characteristics of a test object such as a semiconductor integrated circuit without separating it from a wafer, a probe card having probes that contact the test object is used (see Patent Document 1). In the probe card, the probes are arranged at positions corresponding to the test pads of the test object. Therefore, when the spacing between test pads becomes narrower due to miniaturization of semiconductor integrated circuits, the spacing between probes also becomes narrower. If the spacing between probes is narrowed, there is a possibility that adjacent probes may come into contact with each other when the probes are curved in the internal space of the probe head during testing of the test object. For this reason, a measure is taken in which a guide film that holds the probes by penetrating them is arranged in the internal space of the probe head. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-118064 A Summary of the Invention [Problem to be solved by the invention]

[0004] The guide film is made of a material such as resin. For this reason, the guide film is easily deformed. Furthermore, since resin is easily deformed by heat, the guide film is easily distorted by thermal deformation. When the guide film is deformed, the sliding movement of the probe that penetrates the through hole formed in the guide film inside the probe head is hindered. This results in poor contact between the probe and the test pad, and the movement of the probe from a state in which it is in contact with the test pad to a state separated from the test pad is hindered. In this way, the use of a guide film in the probe head hinders the operation of the probe. The present invention is capable of suppressing short circuits between the probes, and is not hindered in the operation of the probe head. Electrical Connection Device The purpose is to provide. [Means for solving the problem]

[0005] According to one aspect of the present invention, An electrical connection device used for testing electrical characteristics of an object to be tested is provided, the electrical connection device comprising a plurality of probes and at least two guide plates each having a through hole into which the probe is inserted. The probes are inserted into the through holes and held in a curved state between the two guide plates. The probes comprise a columnar conductor having a rectangular shape in a cross section perpendicular to the central axis direction, and an insulating coating material arranged on at least one of the four faces of the conductor constituting the rectangular shape, which is the curved side. The coating material is not arranged on the opposing face of the conductor facing in the opposite direction to the one face. Effect of the Invention

[0006] According to the present invention, short circuits between probes are suppressed and the operation of the probe head is not hindered. Electrical Connection Device can be provided. [Brief description of the drawings]

[0007] [Figure 1] FIG. 2 is a schematic diagram showing a configuration of a probe according to an embodiment of the present invention. [Diagram 2] 2 is a schematic diagram of a cross section perpendicular to the central axis direction of a conductor portion of a probe according to an embodiment of the present invention. FIG. [Diagram 3] 1 is a schematic diagram showing a configuration of a probe card having a probe according to an embodiment of the present invention. [Figure 4] 3A and 3B are schematic diagrams showing examples of arrangements of probes arranged on a probe head. [Diagram 5] FIG. 13 is a schematic diagram showing the configuration of a probe and a probe head of a comparative example. [Figure 6] 10A to 10C are schematic diagrams for explaining a method of inserting a probe into a guide hole of a guide plate. [Figure 7] FIG. 2 is a schematic diagram showing the shape of a coating material of a comparative example. [Figure 8] 13 is a schematic diagram showing an obstacle that occurs when a probe having a coating material of the comparative example disposed thereon is inserted into a guide hole of a guide plate. FIG. [Figure 9] 1A to 1C are schematic diagrams showing modified shapes of the covering material of the probe according to the embodiment of the present invention (part 1). [Figure 10] 13 is a schematic diagram showing a modified shape of the covering material of the probe according to the embodiment of the present invention (part 2). FIG. [Figure 11] 13A to 13C are schematic diagrams showing modified shapes of the covering material of the probe according to the embodiment of the present invention (part 3). [Figure 12] FIG. 4 is a schematic diagram showing a modified example of the shape of the covering material of the probe according to the embodiment of the present invention (part 4). [Figure 13] 10A to 10C are schematic diagrams showing another modified example of the shape of the covering material of the probe according to the embodiment of the present invention (part 1). [Figure 14] FIG. 11 is a schematic diagram showing another modified example of the shape of the covering material of the probe according to the embodiment of the present invention (part 2). [Figure 15] 5A to 5C are schematic diagrams for explaining an example of a method for forming a coating material for a probe according to an embodiment of the present invention. [Figure 16] 13A and 13B are schematic diagrams showing a structure of a coating material of a probe according to a modified example of an embodiment of the present invention. [Figure 17] 10A to 10C are schematic diagrams showing examples of shapes of a coating material of a probe according to a modified example of an embodiment of the present invention. [Figure 18] 13A and 13B are schematic diagrams showing examples of arrangements of a coating material of a probe according to a modified example of an embodiment of the present invention. [Figure 19] 13A and 13B are schematic diagrams showing a structure of a coating material of a probe according to another modified example of the embodiment of the present invention. [Figure 20] 13A to 13C are schematic diagrams showing examples of shapes of a coating material of a probe according to another modified example of the embodiment of the present invention. [Figure 21] 13A and 13B are schematic diagrams showing examples of arrangements of a coating material of a probe according to another modified example of the embodiment of the present invention. [Figure 22A]FIG. 13 is a schematic diagram showing a configuration of a probe according to another embodiment of the present invention. [Figure 22B] 13A and 13B are schematic diagrams showing another configuration of a probe according to another embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Next, an embodiment of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic, and the thickness ratios of each part are different from the actual ones. Of course, the drawings also include parts with different dimensional relationships and ratios. The embodiments shown below are examples of devices and methods for embodying the technical ideas of this invention, and the embodiments of this invention do not specify the materials, shapes, structures, arrangements, and manufacturing methods of the components as described below.

[0009] 1, a probe 10 is used to inspect electrical characteristics of an object under inspection. The probe 10 includes a columnar conductor 11 having a rectangular cross section perpendicular to the central axis direction, and a plurality of insulating coating materials 12 arranged on at least one surface of the conductor 11 and spaced apart from each other along the central axis direction of the conductor 11.

[0010] 2 shows a cross section perpendicular to the central axis direction (hereinafter also simply referred to as the "central axis direction") of the conductor 11. FIG. 2 is a cross section taken along the II-II direction in FIG. 1. The cross section of the probe 10 is rectangular, defined by a first surface 101, a second surface 102 opposing the first surface 101, and a first side surface 103 and a second side surface 104 connected to the first surface 101 and the second surface 102, respectively. In the probe 10 shown in FIG. 2, a coating material 12 is disposed on the surface of the conductor 11, extending from the first side surface 103 through the first surface 101 to the second side surface 104.

[0011] In the drawings, the Y-axis direction is the central axis direction of the conductor 11. The central axis direction is parallel to the direction in which the probe 10 is inserted into the probe head, as described below. The X-axis direction is the width direction of the first surface 101 of the conductor 11, which is perpendicular to the Y-axis direction. The Z-axis direction is the surface normal direction of the first surface 101, and is also the thickness direction of the coating material 12.

[0012] The cross-sectional area perpendicular to the central axis direction of the end face of the coating material 12 facing at least one end of the conductor 11 (hereinafter referred to as the "end face area") gradually increases from the portion closest to the end of the conductor 11 along the central axis direction. The shape of the coating material 12 of the probe 10 shown in FIG. 1 is an ellipse with both ends missing when viewed from the surface normal direction of the first surface 101 (hereinafter referred to as the "planar view"). Therefore, in the probe 10, the area of ​​the first end face 121 of the coating material 12 facing the first end face 111 of the conductor 11 gradually increases along the central axis direction from the portion closest to the first end face 111. Furthermore, the area of ​​the second end face 122 of the coating material 12 facing the second end face 112 of the conductor 11 gradually increases along the central axis direction from the portion closest to the second end face 112.

[0013] In the following, one or both of the first end face 121 and the second end face 122 of the coating material 12 will also be referred to as the "end face." In addition, one or both of the first end face 111 and the second end face 112 of the conductor portion 11 will also be referred to as the "end face."

[0014] In the following, in order to explain the function of the probe 10, a probe card including a probe head that holds the probe 10 will be described.

[0015] Fig. 3 shows a probe card 1 equipped with probes 10. The probe card 1 is used to inspect the characteristics of a test subject 2. The test subject 2 is, for example, a semiconductor integrated circuit formed on a semiconductor substrate. The probe card 1 includes a probe head 20 that holds the probes 10 with first ends 111 facing the test subject 2, and a wiring board 30. Note that, although the number of probes 10 held by the probe head 20 in Fig. 3 is four, the number of probes 10 is of course not limited to four.

[0016] As shown in Fig. 3, the probe 10 penetrates the probe head 20. A second end 112 of the probe 10 is connected to a land 31 arranged on a wiring board 30. The land 31 is made of a conductive material such as metal, and is electrically connected to an inspection device such as a tester (not shown). An electric signal is transmitted between the inspection device and the device under test 2 via the probe card 1. The wiring board 30 is, for example, a printed circuit board (PCB) or an interposer (IP) board.

[0017] The probe head 20 has a plurality of guide plates each having a through hole (hereinafter also referred to as a "guide hole") through which the probe 10 penetrates. The probe head 20 shown in FIG. 3 has a top guide plate 21 facing the wiring board 30, a bottom guide plate 22 facing the device under test 2, and an MGC guide plate 23 arranged between the top guide plate 21 and the bottom guide plate 22. The MGC guide plate 23 is arranged in a position close to the bottom guide plate 22. By arranging a spacer 25 between the outer edge region of the top guide plate 21 and the outer edge region of the bottom guide plate 22, an intermediate region 200 is formed between the top guide plate 21 and the MGC guide plate 23 inside the probe head 20. The guide plates and spacer 25 of the probe head 20 are made of an insulating material such as ceramic or a metal material.

[0018] When viewed from the surface normal direction of the main surface of the guide plate in which the openings of the guide holes are formed, the positions of the guide holes of the top guide plate 21 through which the same probe 10 penetrates and the positions of the guide holes of the bottom guide plate 22 and the MGC guide plate 23 are offset in a direction parallel to the main surface. Due to such an arrangement of the guide holes (offset arrangement), the probe 10 is curved by elastic deformation in the intermediate region 200. Therefore, the probe 10 buckles when it comes into contact with the object under test 2, and the probe 10 comes into contact with the object under test 2 with a predetermined pressure.

[0019] As shown in Fig. 4, when viewed from the surface normal direction of the main surface of the guide plate, the probes 10 are arranged, for example, in a matrix. However, the arrangement of the probes 10 is not limited to a matrix. The number of probes 10 held by one probe head 20 may range from several hundred to several tens of thousands. Furthermore, as the integration of semiconductor integrated circuits progresses, the arrangement intervals of the test pads are becoming narrower, and accordingly, the arrangement intervals of the probes 10 are also becoming narrower. This increases the possibility that adjacent probes 10 will come into contact with each other.

[0020] In contrast, an insulating coating material 12 is disposed on the surface of the probe 10. Therefore, even if the probes 10 come into contact with each other when the probes 10 buckle in the intermediate region 200, the conductor 11 of one probe 10 comes into contact with the coating material 12 of the other probe 10. Therefore, it is possible to prevent a short circuit between the probes 10 caused by the conductors 11 of the probes 10 coming into contact with each other.

[0021] The coating material 12 is not continuously disposed on the surface of the probe 10 along the central axis direction, but a plurality of coating materials 12 are disposed at a distance from each other along the central axis direction of the conductor portion 11. This makes it possible to suppress warping of the probe 10 that would occur if the coating material 12 were continuously disposed on the surface of the probe 10.

[0022] On the other hand, in the probe head 20M of the probe card of the comparative example shown in FIG. 5, the guide film PI and the guide film MGF are arranged between the top guide plate 21 and the bottom guide plate 22. Then, the probe 10M is inserted through the guide holes of the guide film PI and the guide film MGF to prevent short-circuiting between the probes 10M. However, as already described, the use of a guide film that is easily deformed in the probe head 20M inhibits the sliding of the probe 10M. In contrast, according to the probe 10 having the configuration in which the covering material 12 is arranged on the surface of the conductor portion 11, it is possible to suppress short-circuiting between the probes 10 without using a guide film. Therefore, in the probe card 1 using the probe 10, the operation of the probe 10 in the probe head 20 is not inhibited.

[0023] In order to set the probe 10 in the probe head 20, the probe 10 is inserted through the guide hole of the guide plate. For example, with the central axes of the guide holes of all the guide plates aligned, the probe 10 is inserted successively through the top guide plate 21, the MGC guide plate 23, and the bottom guide plate 22 in that order, as shown by the arrows in Fig. 6. At this time, as shown in Fig. 6, the probe 10 is inserted into the guide hole of the guide plate from the side of the first end 111.

[0024] If the distance (clearance) between the inner wall of the guide hole in the guide plate and the outer edge of the probe 10 is too wide, the position of the probe 10 will be displaced inside the guide hole. As a result, the alignment accuracy between the probe 10 and the object under test will decrease. Therefore, it is preferable to have a narrow clearance, and the clearance is set to, for example, about 2 μm to 5 μm.

[0025] However, in the case of the probe 10 having the coating material 12 disposed on its surface, when the probe 10 is inserted into the guide hole, the coating material 12 is likely to collide with the guide plate. In particular, when the shape of the coating material 12 in a plan view (hereinafter, simply referred to as "shape") is a rectangle like the coating material 12a of the comparative example shown in FIG. 7, the part of the coating material 12a approaching the guide plate 201 is one side of the rectangle. In other words, when the probe 10 approaches the guide plate 201 as shown by the arrow, the area of ​​the coating material 12a facing the guide plate has a certain area. For this reason, as shown by the x mark in FIG. 8, the end face of the coating material 12a collides with the periphery of the guide hole of the guide plate 201, causing an obstacle that prevents the probe 10 from being inserted into the guide hole. For example, the narrower the clearance, the more likely the coating material 12 is to collide with the guide plate.

[0026] In contrast, the end face of the coating material 12 of the probe 10 is a curved surface. Therefore, the area of ​​the first end face 121 of the coating material 12 facing the first end 111 gradually increases as it moves away from the part closest to the first end face 111 along the central axis direction of the conductor 11. Since the end face of the coating material 12 is curved in a plan view, the area of ​​the coating material 12 approaching the guide plate is dot-like in a plan view. In other words, even if the first end face 121 of the coating material 12 collides with the guide plate, the first end face 121 and the guide plate do not collide with each other on their surfaces. Therefore, the coating material 12 does not get caught on the probe head 20, and the probe 10 continues to move as it is. In this way, according to the probe 10, it is possible to suppress the movement of the probe 10 from being hindered due to the end face of the coating material 12 colliding with the guide plate.

[0027] In the above, the case where the shape of the coating material 12 is an ellipse has been described. However, the shape of the coating material 12 is not limited to an ellipse as long as the area of ​​the end face facing at least one end of the conductor portion 11 gradually increases. For example, as shown in the modified example of FIG. 9, the shape of the coating material 12 may be a one-sided circular shape in which the end face facing one end of the conductor portion 11 is a curved surface and the end face facing the other end is a flat surface. Also, as shown in the modified examples of FIG. 10(a) to FIG. 10(d), the coating material 12 may be a triangular shape with the apex facing the end of the conductor portion 11. As shown in FIG. 10(d), the coating material 12 may be a shape in which a plurality of triangles are arranged. Furthermore, as shown in the modified examples of FIG. 11(a) to FIG. 11(d), the coating material 12 may be a polygonal shape with the apex facing the end of the conductor portion 11. Also, as shown in the modified examples of FIG. 12(a) to FIG. 12(d), the coating material 12 may be a shape in which a plurality of triangles or polygons are combined.

[0028] As described above, the shape of the coating material 12 may be polygonal, and the end face of the coating material 12 facing the end of the conductor portion 11 may be an inclined surface that intersects obliquely with the central axis direction. By making the end face an inclined surface and making the part closest to the end the apex of a polygon in a plan view, the area of ​​the end face facing the end gradually becomes wider.

[0029] In the above modification, by forming one end face of the covering material 12 as a curved face or an inclined face that crosses the central axis diagonally, it is possible to prevent the covering material 12 from contacting the guide plate and hindering the movement of the probe 10 when the probe 10 is inserted into the guide hole. Furthermore, by forming both end faces of the covering material 12 as curved or inclined faces, it is possible to prevent the covering material 12 from contacting the guide plate and hindering the movement of the probe 10 when the probe 10 is removed from the guide plate. For example, when the probe 10 is inserted into the guide hole of the guide plate from the first end 111 side and removed from the guide hole of the guide plate from the second end 112 side, it is possible to prevent the movement of the probe 10 from being hindered. FIGS. 13(a) to 13(g) show modifications in which both end faces of the covering material 12 are curved or inclined. As shown in FIGS. 14(a) to 14(d), the covering material 12 may have a shape that combines a plurality of polygons.

[0030] As described above, in the probe 10 according to the embodiment, by disposing the coating material 12 on the surface of the conductor portion 11, it is possible to prevent short circuits between the probes 10. Furthermore, by making the end face of the coating material 12 that first comes close to the guide plate when the probe 10 is inserted into the guide hole of the guide plate a curved or inclined surface, it is possible to prevent the coating material 12 from coming into contact with the guide plate and hindering the movement of the probe 10.

[0031] The material of the conductor 11 may be a metal material such as nickel (Ni), iron (Fe), cobalt (Co), or an alloy containing these metals. The coating material 12 may be, for example, a resin, glass fiber, permanent resist, or ceramic deposition.

[0032] To form the coating material 12 of a specific shape at a predetermined position on the surface of the conductor portion 11, the coating material 12 is formed on the surface of the conductor portion 11, and then the coating material 12 is patterned. For example, a photolithography technique using a photomask 120 on which an elliptical pattern as shown in FIG. 15 is formed is used to transfer the pattern on the photomask 120 onto the permanent resist formed on the first surface 101 of the conductor portion 11. The elliptical pattern on the photomask 120 shown in FIG. 15 has both ends of the ellipse extending beyond the first surface 101. The permanent resist formed on the first side surface 103 and the second side surface 104 of the conductor portion 11 is patterned by exposure to light at both ends of the extending ellipse. Note that the coating material 12, such as resin, glass fiber, or ceramic deposition, may be formed on the surface of the conductor portion 11 using photolithography.

[0033] The narrower the spacing of the coating material 12 along the central axis direction, the more it can prevent short circuits between the probes 10. The length and spacing of the coating material 12 along the central axis direction can be set arbitrarily depending on the thickness and material of the conductor portion 11, as long as the probes 10 are not warped. The thickness of the coating material 12 is set to a value that can prevent short circuits between the probes 10, as long as a clearance between the guide holes and the probes 10 can be secured.

[0034] <Modification> The structure of the coating material 12 of the probe 10 according to the modified embodiment of the present invention is shown in Fig. 16(a) to Fig. 16(c). Fig. 16(a) to Fig. 16(c) are side views of the coating material 12 as viewed from a direction perpendicular to the surface normal direction of the first surface 101 (hereinafter also referred to as "side view"). As shown in Fig. 16(a) to Fig. 16(c), in the probe 10 according to the modified embodiment, the part of the coating material 12 closest to the end of the conductor 11 contacts the surface of the conductor 11. The thickness t of the coating material 12 gradually increases as it moves away from the end of the conductor 11. The coating material 12 shown in Fig. 16(a) has a curved end face shape in a side view. The coating material 12 shown in Fig. 16(b) has a trapezoidal shape with the end face inclined along the central axis direction in a side view. The coating material 12 shown in Fig. 16(b) has a triangular shape with the end face inclined along the central axis direction in a side view.

[0035] The shape of the coating material 12 of the probe 10 according to the modified example in a plan view may be any shape. For example, the shape of the end face of the coating material 12 may be a curved surface as shown in Fig. 17(a), or the shape of the coating material 12 may be a rectangle as shown in Fig. 17(b).

[0036] Also, as shown in Figures 18(a) and 18(b), multiple covering materials 12 may be arranged in the central axis direction. Figure 18(a) shows an example of a configuration in which multiple covering materials 12 are arranged separately from each other. Figure 18(b) shows an example of a configuration in which multiple covering materials 12 are arranged connected to each other.

[0037] In the above, the coating material 12 is described in which the thickness t of one end face gradually increases with increasing distance from the end of the conductor portion 11. This makes it possible to prevent the coating material 12 from coming into contact with the guide plate during insertion of the probe 10 into the guide hole, thereby preventing the movement of the probe 10 from being hindered.

[0038] Furthermore, by gradually increasing the thickness t of both end faces of the coating material 12 as it moves away from the end of the conductor portion 11, it is possible to prevent the coating material 12 from coming into contact with the guide plate and hindering the movement of the probe 10 when the probe 10 is removed from the guide plate. FIGS. 19(a) to 19(c) show modified examples in which the thickness t of both end faces of the coating material 12 gradually increases from the portion close to the end. The coating material 12 shown in FIG. 19(a) has both end faces curved in side view. The coating material 12 shown in FIG. 19(b) has a trapezoidal shape in side view, and the end faces are inclined along the central axis direction. The coating material 12 shown in FIG. 19(c) has a triangular shape in side view, and the end faces are inclined along the central axis direction.

[0039] In the modified examples shown in Figures 19(a) to 19(c), the shape of the covering material 12 in a plan view may be any shape. For example, the shape of the covering material 12 in a plan view may be a one-sided circular shape as shown in Figure 20(a), a rectangular shape as shown in Figure 20(b), or a circular shape as shown in Figure 20(c).

[0040] Furthermore, as shown in Figures 21(a) and 21(b), multiple covering materials 12 may be arranged in the central axis direction. Figure 21(a) shows an example of a configuration in which multiple covering materials 12 having a semicircular shape in side view are arranged separately from each other. Figure 21(b) shows an example of a configuration in which multiple covering materials 12 having a semicircular shape in side view are arranged connected to each other.

[0041] (Other embodiments) Although the present invention has been described above by way of the embodiment, the description and drawings forming part of this disclosure should not be understood as limiting the present invention. Various alternative embodiments, examples and operating techniques will become apparent to those skilled in the art from this disclosure.

[0042] For example, although the above describes an example in which the coating material 12 is disposed on three surfaces or one surface of the probe 10 having a rectangular cross section, the coating material 12 may be disposed on two surfaces or four surfaces of the probe 10. By disposing the coating material 12 on at least one surface of the probe 10, short circuits between the probes 10 can be suppressed.

[0043] Although the above description has been given of the case where the cross section of the probe 10 perpendicular to the central axis direction is rectangular, the cross section of the probe 10 may have other shapes. For example, the cross section of the probe 10 may be circular or a polygonal shape other than rectangular.

[0044] Also, as shown in FIG. 22A, the conductor portion 11 of the probe 10 may have a structure including a tubular barrel 11A and a plunger 11B inserted into an open end of the barrel 11A. The covering material 12 is disposed on, for example, the surface of the barrel 11A. The plunger 11B is rod-shaped and includes an insertion portion 11B2 inserted into the barrel 11A and a tip portion 11B1 connected to the insertion portion 11B2. In the probe 10 shown in FIG. 22A, for example, the tip portion 11B1 of one of the plungers 11B may be brought into contact with the test object, and the tip portion 11B1 of the other plunger 11B may be brought into contact with a land. Note that the probe 10 shown in FIG. 22A has a structure in which the plungers 11B are inserted into the open ends at both ends of the barrel 11A, but as shown in FIG. 22B, the probe 10 may have a structure in which the plunger 11B is inserted into only one open end of the barrel 11A. In the probe 10 shown in FIG. 22B, for example, the tip 11B1 of the plunger 11B may be brought into contact with the object to be tested, and the end of the barrel 11A on the side where the plunger 11B is not inserted may be brought into contact with a land.

[0045] Thus, it goes without saying that the present invention includes various embodiments that are not described here. [Explanation of symbols]

[0046] 1...Probe card 2...Subject to be inspected 10…Probe 11...Conductor part 12…Coating material 20…Probe head 30...Wiring board 101...Side 1 102…Second side 103...First aspect 104...Second aspect 111...First end 112…Second end 121...First end surface 122…Second end face

Claims

1. An electrical connection device used for inspecting electrical characteristics of an object to be inspected, comprising: A plurality of probes; At least two guide plates each having a through hole into which the probe is inserted; the probe is inserted into the through hole and held in a curved state between the two guide plates; The probe comprises: A columnar conductor portion having a rectangular cross section perpendicular to the central axis direction; and an insulating covering material disposed on at least one curved surface of the four surfaces of the conductor portion constituting the rectangular shape, The coating material is not disposed on the opposing surface of the conductor portion facing in the opposite direction to the one surface. Electrical connection device.

2. 2. The electrical connecting device according to claim 1, wherein the coating materials are spaced apart from one another along the central axis.

3. 3. The electrical connecting device according to claim 1, wherein the coating material is disposed on three of the four surfaces of the conductor portion excluding the opposing surface.

4. A cross-sectional area perpendicular to the central axis direction of an end face of the coating material facing at least one end of the conductor portion gradually increases from a portion closest to the end along the central axis direction.

4. The electrical connecting device according to claim 1, wherein the electrical connecting device is a connector.

5. 5. The electrical connecting device according to claim 4, wherein the cross-sectional areas of the end faces facing the two ends of the conductor portion each become gradually wider as they move away from the portion closest to the end along the central axis direction.

6. 6. The electrical connecting device according to claim 4, wherein the end face of the coating material has a curved outer shape when viewed in a direction normal to the surface of the conductor on which the coating material is disposed.

7. 6. The electrical connecting device according to claim 4, wherein the portion of the end face of the coating material closest to the end portion is a vertex of a polygon when viewed from the surface normal direction of the one surface on which the coating material is disposed.

8. 8. The electrical connecting device according to claim 7, wherein the coating material has a shape formed by combining a plurality of polygons when viewed from the direction normal to the surface.

9. the closest portion of the coating contacts the one surface of the conductor; The thickness of the coating material at the end surface gradually increases with distance from the end of the conductor portion.

8. The electrical connecting device according to claim 4, wherein the electrical connecting device is a connector.

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