Mounting Equipment

Abstract

To provide a mounting tool and a mounting device capable of reducing residual air bubbles and damage to a substrate when an electronic component is mounted on the substrate.SOLUTION: A mounting tool 31 according to an embodiment that mounts an electronic component 2 on a substrate W includes a holding surface 311 protruding such that the electronic component 2 is curved and in contact with the holding surface, a plurality of openings 312 provided in the holding surface 311, and a ventilation hole 313 that communicates with the opening 312, holds the electronic component 2 on the holding surface 311 by making the internal pressure negative, and releases the electronic component 2 from the holding surface 311 by sequentially making positive pressure from a part of the ventilation hole.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to Mounting Equipment Regarding. [Background technology]

[0002] When mounting electronic components, such as logic, memory, image sensors, and other semiconductor elements, on a substrate, the wafer on which the semiconductor elements are formed is cut into individual chips, and these chips are then picked up one by one and transferred to the substrate for mounting.

[0003] In mounting such electronic components, air bubbles may remain between the electronic component and the board. If air bubbles exist between the electronic component and the board, this leads to poor connection and insufficient strength, which leads to mounting defects. To address this, when mounting electronic components, a mounting tool that presses the electronic component against the board holds the electronic component in a curved manner, brings a part of the electronic component into contact with the board, and then presses the electronic component with an elastic body to push out the gas between the electronic component and the board. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 3757193 [Patent Document 2] JP 2003-203946 A [Patent Document 3] JP 2005-150311 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, with a tool that uses an elastic body to deform and crush as it presses, depending on the size of the electronic component, there are cases where the pressed area is not uniform, or where sufficient pressure is not applied to the outer edge, making it impossible to push out air bubbles.In addition, excessive pressure is applied to the center, causing damage to the electronic component.

[0006] The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a mounting tool and a mounting apparatus that can reduce the residual air bubbles and damage to the substrate when mounting electronic components on a substrate. [Means for solving the problem]

[0007] The present invention Mounting equipment a mounting tool for mounting an electronic component on a substrate, the mounting tool comprising: a holding surface that is raised so that the electronic component comes into contact with the holding surface in a curved manner; a plurality of openings provided on the holding surface; and an air hole that communicates with the openings and holds the electronic component on the holding surface by making an internal pressure negative and sequentially making a portion of the internal pressure positive, thereby removing the electronic component from the holding surface. a mounting tool which sequentially applies positive pressure to the plurality of vent holes, starting with the vent hole closest to the most elevated ridge portion of the holding surface and then to adjacent vent holes; a tool moving mechanism which reciprocates the mounting tool between a transfer position and a mounting position and raises and lowers the mounting tool at the transfer position and the mounting position; a detection unit which detects contact with the mounting tool; and a switching unit which switches between negative and positive pressures applied to the vent holes of the mounting tool when contact is detected by the detection unit. has. Effect of the Invention

[0009] The mounting tool and mounting device of the present invention can reduce the occurrence of residual air bubbles and damage to the substrate when mounting electronic components on the substrate. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a front view showing the mounting device according to the embodiment. [Diagram 2] FIG. 1 is a plan view showing a mounting device according to an embodiment. [Diagram 3] 1A is a side view, FIG. 1B is a cross-sectional view, and FIG. 1C is a bottom view showing a mounting tool of an embodiment. [Figure 4] FIG. 2 is a functional block diagram of a control device according to the embodiment. [Diagram 5] 4 is a flowchart showing a procedure for mounting an electronic component according to the embodiment. [Figure 6]FIG. 2 is an explanatory diagram showing a mounting state of an electronic component according to an embodiment. [Figure 7] FIG. 11 is a cross-sectional view showing a modified example of the mounting tool. [Figure 8] 10A and 10B are explanatory diagrams showing a manner in which an electronic component is received by a mounting tool; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The mounting apparatus of the embodiment will be described with reference to the drawings. The drawings are schematic diagrams, and the size, ratio, and the like of each part are exaggerated for easy understanding. As shown in Figs. 1 and 2, the mounting apparatus 1 includes a supplying device 10, a pick-up device 20, a mounting device 30, and a control device 50, and is an apparatus that transfers an electronic component 2 to the mounting device 30 by the pick-up device 20, and mounts the electronic component 2 on a substrate W on a substrate stage 60 by the mounting device 30. The electronic component 2 is, for example, a chip-shaped component. In this embodiment, the electronic component 2 is a semiconductor chip obtained by dividing a wafer into individual pieces.

[0012] The supply device 10 is a device that supplies electronic components 2 to the pickup device 20. The supply device 10 moves the electronic component 2 to be picked up to a supply position P1. The supply position P1 is a position where the pickup device 20 picks up the electronic component 2 to be picked up. The supply device 10 includes a supply stage 12 that supports a sheet 11 to which the electronic components 2 are attached, and a stage movement mechanism 13 that moves the supply stage 12. The stage movement mechanism 13 is, for example, a ball screw mechanism driven by a servo motor.

[0013] The sheet 11 to which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown) in this embodiment. The electronic components 2 are arranged in a matrix on the sheet 11. In this embodiment, the electronic components 2 are arranged in a face-up state with their functional surfaces exposed upward.

[0014] The supply stage 12 is a platform that horizontally supports the wafer ring to which the sheet 11 is attached. In other words, the supply stage 12 supports the sheet 11 to which the electronic components 2 are attached via the wafer ring. The supply stage 12 is provided so as to be movable in the horizontal direction by a stage movement mechanism 13. Since the sheet 11 is supported horizontally together with the supply stage 12, the sheet 11 and the electronic components 2 placed on the sheet 11 are also provided so as to be movable in the horizontal direction.

[0015] 1 and 2, among the horizontal directions, the direction in which the supply device 10 and the mounting device 30 are aligned is called the X-axis direction, and the direction perpendicular to the X-axis is called the Y-axis direction. The direction perpendicular to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The upward direction is the direction toward the side on which the electronic components 2 are placed, with the plane of the sheet 11 as the boundary, and the downward direction is the direction toward the side on which the electronic components 2 are not placed, with the plane of the sheet 11 as the boundary.

[0016] [Pickup device] The pickup device 20 is a relay device that picks up the electronic components 2 from the supply device 10 and delivers the picked-up electronic components 2 to the mounting device 30. The pickup device 20 includes a pickup nozzle 21, a nozzle moving mechanism 22, a direction changing unit 23, and a push-up pin 24.

[0017] The pick-up nozzle 21 is a cylindrical suction nozzle that holds the electronic component 2 and releases the held state to release the electronic component 2. The pick-up nozzle 21 has a nozzle hole that opens into the suction surface at the tip of the pick-up nozzle 21. The nozzle hole is connected to a negative pressure generating circuit (not shown) such as a vacuum pump, and the circuit generates negative pressure to suck and hold the electronic component 2 at the nozzle hole. The electronic component 2 is released from the pick-up nozzle 21 by releasing the negative pressure.

[0018] The nozzle movement mechanism 22 is a mechanism for reciprocating the pickup nozzle 21 between the supply position P1 and the transfer position P2, and also for raising and lowering the pickup nozzle 21 at the supply position P1 and the transfer position P2. Specifically, the nozzle movement mechanism 22 includes a slide mechanism 221 and a lifting mechanism 222. The transfer position P2 is a position where the pickup device 20 passes the electronic component 2 picked up at the supply position P1 to a mounting tool 31 that functions as a receiving unit, which will be described later.

[0019] The supply position P1 and the delivery position P2 mainly refer to positions in the XY directions, and do not necessarily refer to positions in the Z axis direction. Even if they refer to the position (height) in the Z axis direction, the height is assumed to have a predetermined width. The predetermined width includes the thickness of the electronic component 2, the distance the electronic component 2 is pushed up, the distance at which the electronic component 2 can be sucked, and the like when the electronic component 2 is delivered.

[0020] The slide mechanism 221 reciprocates the pick-up nozzle 21 between the supply position P1 and the delivery position P2. Here, the slide mechanism 221 has a rail 221b that extends parallel to the X-axis direction and is fixed to a support frame 221a, and a slider 221c that runs on the rail 221b. The lift mechanism 222 moves the pick-up nozzle 21 in the up and down direction. Specifically, the lift mechanism 222 can use a ball screw mechanism driven by a servo motor. That is, the pickup nozzle 21 moves up and down along the Z-axis direction by driving the servo motor.

[0021] The direction changing unit 23 is provided between the pick-up nozzle 21 and the nozzle movement mechanism 22. Here, the direction changing unit 23 is an actuator including a drive source such as a motor that changes the direction of the pick-up nozzle 21. Changing the direction means rotating the pick-up nozzle 21 by 0° to 180° in the vertical direction. For example, the pick-up nozzle 21 with its suction surface facing the supply stage 12 suctions and holds the electronic component 2 at the supply position P1. Thereafter, the direction changing unit 23 changes the direction of the pick-up nozzle 21 so that the suction surface faces upward. At this time, the rotation angle is 180°.

[0022] The push-up pin 24 is provided below the sheet 11 of the supply device 10. The push-up pin 24 is a needle-shaped member with a sharp tip. The push-up pin 24 is provided inside the backup body 241 so that the length direction is parallel to the Z-axis direction.

[0023] The backup body 241 has a drive mechanism for advancing or retreating the thrust pin 24 from or to the inside of the backup body 241. The advancement or retreat is performed in the vertical direction. The drive mechanism is, for example, a mechanism driven by an air cylinder or a cam mechanism.

[0024] [Onboard equipment] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to a mounting position P3 and mounts the electronic component 2 on the board W. The mounting position P3 is a position where the electronic component 2 is mounted on the board W. The mounting device 30 has a mounting tool 31 and a tool moving mechanism 32.

[0025] The mounting tool 31 functions as a receiving unit that receives the electronic component 2 from the pickup nozzle 21 at the delivery position P2, and is also a member that mounts the electronic component 2 on the board W at the mounting position P3. The mounting tool 31 holds the electronic component 2, and after mounting, releases the held state to release the electronic component 2.

[0026] Specifically, as shown in Figs. 3(A) and (B), the mounting tool 31 is a block having a substantially rectangular parallelepiped shape, and has a holding surface 311, an opening 312, and an air hole 313. The holding surface 311 is the bottom surface of the mounting tool 31, and is a surface that is raised so that the electronic component 2 is curved and comes into contact with the holding surface 311. The curved surface means a curved surface between flat surfaces, as shown in Fig. 3(B), which can be called a bend. The holding surface 311 in this embodiment is a mountain shape. The mountain shape here means a shape in which two flat surfaces with different angles are gently connected at a peak portion including the highest apex in the center. In other words, the holding surface 311 has a rectangular planar shape, with the center of both side surfaces in the long side direction being the peak portion, and the ridge line connecting the peak portions of both side surfaces being in the short side direction. It is preferable that the mounting tool 31 is formed of a hard material so that the holding surface 311 is not elastically deformed by the pressure when mounting the electronic component 2. The holding surface 311 may have a rectangular or square planar shape depending on the electronic component 2 to be mounted. As described above, Fig. 3 and other drawings are schematic diagrams, and the degree of protrusion of the holding surface 311, the ratio to other parts, and the like are exaggerated for ease of understanding.

[0027] As shown in FIG. 3C, a plurality of openings 312 are provided on the holding surface 311. The plurality of openings 312 are arranged in a plurality of rows. In this embodiment, the direction of each row is a direction parallel to the short side of the holding surface 311 when the holding surface 311 is rectangular. However, the direction is not limited to this direction. In this embodiment, the openings 312 are provided in two rows, row [2] and row [3], on both short sides of the holding surface 311, sandwiching row [1], which is a row provided on the ridge portion.

[0028] One end of the vent hole 313 communicates with the opening 312, and the pressure inside the hole can be made negative to hold the electronic component 2 on the holding surface 311, or made positive to release the electronic component 2. The other end of each vent hole 313 communicates with an air pressure circuit (not shown) that switches between generating negative and positive pressure. In this embodiment, each row of the vent holes 313 is connected to a pipe and a valve so that negative and positive pressures can be switched for each row. Such a valve functions as a switch that switches between negative and positive pressures for the vent holes 313.

[0029] The tool movement mechanism 32 reciprocates the mounting tool 31 between the delivery position P2 and the mounting position P3, and raises and lowers the mounting tool 31 between the delivery position P2 and the mounting position P3. The tool movement mechanism 32 includes a slide mechanism 321 and a lift mechanism 322.

[0030] The slide mechanism 321 reciprocates the mounting tool 31 between the delivery position P2 and the mounting position P3. Here, the slide mechanism 321 has two rails 321b that extend parallel to the X-axis direction and are fixed to a support frame 321a, and a slider 321c that runs on the rails 321b. Although not shown, the slide mechanism 321 has a slide mechanism that slides the mounting tool 31 in the Y-axis direction. This slide mechanism can also be configured by a rail in the Y-axis direction and a slider that runs on the rails.

[0031] The lifting mechanism 322 moves the mounting tool 31 up and down by driving an arm to which the mounting tool 31 is detachably attached. Specifically, the lifting mechanism 322 can use a ball screw mechanism driven by a servo motor. That is, the mounting tool 31 is raised and lowered along the Z-axis direction by driving the servo motor. Furthermore, the lifting mechanism 322 is provided with a detector 322a that detects contact with the mounting tool 31. A load sensor such as a strain gauge or a piezoelectric element can be used as the detector 322a.

[0032] The substrate stage 60 is a platform that supports the substrate W on which the electronic component 2 is to be mounted. The substrate stage 60 is provided on a stage movement mechanism 61. The stage movement mechanism 61 is a movement mechanism that slides and moves the substrate stage 60 on the XY plane to align it with the mounting position P3 of the electronic component 2 on the substrate W. The stage movement mechanism 61 is, for example, a ball screw mechanism driven by a servo motor.

[0033] The control device 50 controls the start, stop, speed, operation timing, etc. of the supply device 10, the pickup device 20, the mounting device 30, and the substrate stage 60. In other words, the control device 50 is a control device for the mounting device 1. The control device 50 can be realized, for example, by a dedicated electronic circuit or a computer that operates with a predetermined program. An input device through which an operator inputs instructions and information required for control, and an output device for checking the status of the device are connected to the control device 50. The input device can be a switch, a touch panel, a keyboard, a mouse, etc. The output device can be a display unit such as a liquid crystal or an organic electroluminescence (EL).

[0034] 4 is a functional block diagram of the control device 50. The control device 50 has a supply device control unit 51, a push-up pin control unit 52, a pickup nozzle control unit 53, a mounting tool control unit 54, a substrate stage control unit 56, and a storage unit 57.

[0035] The supply device control unit 51 controls the movement of the supply stage 12. In other words, it controls the movement of the electronic components 2 to be picked up that are placed on the sheet 11. The push-up pin control unit 52 controls the movement of the push-up pins .

[0036] The pick-up nozzle control unit 53 controls the movement of the pick-up nozzle 21, i.e., the operation of the nozzle movement mechanism 22 and the direction changing unit 23. The pick-up nozzle control unit 53 also controls the negative pressure generating circuit that is in communication with the nozzle hole 21b, and controls the holding and release of the electronic component 2.

[0037] The mounting tool control unit 54 controls the movement of the mounting tool 31, i.e., the operation of the tool moving mechanism 32. The mounting tool control unit 54 also controls an air pressure circuit communicating with the vent holes 313 of the mounting tool 31, and switches between negative and positive pressures at the openings 312 of each row to control holding and releasing of the electronic components 2. The mounting tool control unit 54 also controls switching between negative and positive pressures at the vent holes 313 in response to contact detection by the detection unit 322a. The substrate stage control unit 56 controls the movement of the substrate stage 60, i.e., the operation of the stage moving mechanism 61.

[0038] The storage unit 57 is a recording medium such as an HDD or SSD. The storage unit 57 stores data and programs necessary for the operation of the mounting device 1 in advance, and also stores data necessary for the operation of the mounting device 1. This necessary data is, for example, the position coordinates of the supply position P1, the transfer position P2, and the mounting position P3, and the position coordinates of each moving mechanism. Each of the above-mentioned moving mechanisms controls the movement of each component based on these coordinates. The storage unit 57 also stores the timing for switching which of the rows of the vent holes 313 of the mounting tool 31 from negative pressure to positive pressure.

[0039] [Operation] The operation of the mounting apparatus 1 described above will be described. First, the pickup device 20 picks up the electronic component 2 from the supply device 10 and transfers the electronic component 2 to the mounting device 30. That is, the pickup device 20 moves the pickup nozzle 21 to the supply position P1 where the push-up pin 24 is located, and the nozzle hole 21b of the pickup nozzle 21 faces the push-up pin 24.

[0040] Meanwhile, supply device 10 moves supply stage 12 to position electronic component 2 to be picked up at supply position P1. Then, pick-up nozzle 21 is lowered to bring the suction surface into contact with electronic component 2 at supply position P1 and pick up electronic component 2. Next, pick-up nozzle 21 is raised while still holding electronic component 2, and pushes up electronic component 2 with push-up pin 24, thereby peeling electronic component 2 from sheet 11 and picking it up.

[0041] Pick-up device 20 reverses pick-up nozzle 21 by using direction changing unit 23. That is, the orientation of pick-up nozzle 21 is rotated 180° in the vertical direction so that the suction surface of pick-up nozzle 21 faces upward. The reversing operation may be performed at any point between supply position P1 and transfer position P2.

[0042] The pickup device 20 moves the picked up electronic component 2 to the delivery position P2 by the nozzle moving mechanism 22. The mounting tool 31 of the mounting device 30 is moved to the delivery position P2 by the tool moving mechanism 32 and waits there, and the nozzle hole 21b of the pickup nozzle 21 faces the holding surface 311 of the mounting tool 31 with the electronic component 2 interposed therebetween.

[0043] Then, mounting tool 31 is lowered toward pickup nozzle 21 located at transfer position P2, and negative pressure is applied to ventilation holes 313 of mounting tool 31 to hold electronic component 2, and then pickup nozzle 21 releases the negative pressure, thereby transferring electronic component 2 from pickup nozzle 21 to mounting tool 31. As a result, electronic component 2 is curved to follow the protrusion of holding surface 311 and is held by suction.

[0044] Thereafter, the mounting tool 31 moves to the mounting position P3 and mounts the electronic component 2 on the board W. This mounting operation will be described with reference to the flowchart in Fig. 5 and the operation explanatory diagram in Fig. 6. First, the mounting tool 31 moves to the mounting position P3, and as shown in Fig. 6(A), the electronic component 2 held by the mounting tool 31 faces the board W (step S01). Then, the mounting tool 31 descends to bring the electronic component 2 close to the board W (step S02).

[0045] When the detection unit 322a of the mounting tool 31 detects contact between the electronic components 2 and the board W (YES in step S03), the mounting tool 31 stops descending (step S04). Then, the negative pressure is stopped and positive pressure is applied sequentially from some of the ventilation holes 313, thereby removing the electronic components 2 and mounting them on the board W. That is, the positive pressure is applied in the order of row [1], row [2], and row [3] shown in FIG. 3, and air is blown from the openings 312 (steps S05 to S07).

[0046] At this time, as shown in Figures 6(B), (C), and (D), the portion of electronic component 2 corresponding to the most elevated ridge of holding surface 311 among the multiple rows of ventilation holes 313 comes into contact with substrate W first, and the pressure is switched from negative (white arrow in the figure) to positive (black arrow in the figure) from this ridge row to the adjacent row in sequence. As a result, curved electronic component 2 gradually moves outward from the ridge to follow the flat surface of substrate W, and thus electronic component 2 is mounted on substrate W while air bubbles are expelled to the outside. After mounting, as shown in Figure 6(E), mounting tool 31 rises and retreats from substrate W leaving electronic component 2 behind (step S08).

[0047] [effect] (1) This embodiment relates to a mounting tool 31 for mounting an electronic component 2 on a substrate W, and includes a raised holding surface 311 for allowing the electronic component 2 to curve and come into contact with the holding surface 311, a number of openings 312 provided in the holding surface 311, and an air vent 313 which communicates with the openings 312 and holds the electronic component 2 on the holding surface 311 by applying negative pressure and which gradually becomes positive pressure in a portion thereof, thereby removing the electronic component 2 from the holding surface 311.

[0048] Moreover, the mounting apparatus 1 of this embodiment has a mounting tool 31, a tool moving mechanism 32 that moves the mounting tool 31 back and forth between a transfer position and a mounting position and raises and lowers it at the transfer position and the mounting position, a detection unit 322a that detects contact pressure on the mounting tool 31, and a switching unit that switches between negative pressure and positive pressure on the air hole 313 of the mounting tool 31 when contact is detected by the detection unit 322a.

[0049] Therefore, by sequentially applying positive pressure to the vent holes from a state in which the electronic component 2 is curved and held on the holding surface 311 by the negative pressure, the electronic component 2 becomes flat to conform to the substrate W, and air bubbles are expelled during mounting. This prevents air bubbles from remaining between the electronic component 2 and the substrate W, reducing mounting defects. Since mounting is performed by utilizing the restoration of the curvature of the electronic component 2 itself, the pressing force acts evenly without bias, making it possible to push out air bubbles evenly and reducing damage to the electronic component 2.

[0050] (2) The multiple openings 312 are aligned in multiple rows. Therefore, by sequentially switching from negative pressure to positive pressure for each row, it is possible to prevent excessive force from being applied to a part of the electronic component 2 and to return the curve to a flat surface for mounting.

[0051] (3) Among the multiple air vents 313, positive pressure is applied to the air vents 313 that are closest to the most raised ridge of the holding surface 311, and then to the adjacent air vents 313 in sequence. This allows the electronic component 2 to be brought into contact with the substrate W gradually from the portion where it first comes into contact with the substrate W toward the outer edge, thereby allowing air bubbles to be expelled. Note that by making each row parallel to the short side direction, it is possible to generate a curve in the long side direction in which the rectangular electronic component 2 is easily deformed.

[0052] (3) The holding surface 311 is mountain-shaped. Therefore, the substrate W gradually becomes flat toward the outer edges on both sides of the central ridge, so that the distance from the center of the electronic component 2 to contact the substrate W while returning to a flat curve is short, and there is little risk of air bubbles being drawn in. Furthermore, by forming a mountain shape on the long side of the holding surface 311 and arranging the ridge line connecting the ridge lines in the short side direction, the electronic component 2 is curved in the long side direction, so that the electronic component 2 can easily follow the holding surface 311. The ridge line connecting the ridge lines can also be provided on either side of the holding surface 311. For example, when a ridge line is provided on the short side at one end, the electronic component 2 comes into contact with the substrate W from one end to the other end by applying positive pressure sequentially from one end to the other end. Even in this case, the effect of reducing damage to the electronic component 2 while eliminating air bubbles can be obtained. The risk of damage is further reduced because the electronic component 2 is not curved. For example, in the case where rows of openings 312 are provided as shown in FIG. 3(C), the pressure is switched from negative to positive in the order of row [3] on one end, row [2], row [1], row [2] on the other end, and row [3].

[0053] [Variations] The present embodiment can also be modified as follows. (1) The holding surface 311 may be a curved surface. For example, as shown in FIG. 7, the holding surface 311 may be in a raised shape like a part of the side surface of a cylinder. The part of the side surface of a cylinder here includes a part of a cylindrical body whose cross section is a circle, an ellipse, a rounded rectangle, or a track shape. This makes the electronic component 2 curve gently, and the influence on the electronic component 2 can be suppressed. In the above embodiment, the opening 312 is provided on the ridge line portion connecting the ridge portions. However, the opening 312 does not necessarily have to be provided on the ridge line, and may be provided in the vicinity of the ridge line. The same effect as above can be obtained by sequentially changing the pressure from negative to positive among the ventilation holes 313 of each opening 312, starting from the part closest to the ridge line. Even in the case of such a curved surface, the ridge line portion can be provided on any side of the holding surface 311.

[0054] (2) When the mounting tool 31 receives the electronic component 2 from the pick-up nozzle 21, negative pressure may be applied sequentially from some of the vents 313 on the holding surface 311 to adjacent vents 313. In other words, when the mounting tool 31 receives the electronic component 2, even if the mounting tool 31 attempts to curve the electronic component 2 to conform to the holding surface 311, if a portion of the electronic component 2 floats or shifts to one side, problems such as being unable to recognize the position of the electronic component 2 may occur. Furthermore, if mounting is attempted with the electronic component 2 floating or shifting, there is a possibility that a timing shift will occur when the electronic component 2 moves away from the ridge along the outer edge, resulting in the inclusion of air bubbles.

[0055] For example, among the multiple ventilation holes 313, negative pressure may be applied to the ventilation holes 313 adjacent to the ventilation holes 313 closest to the most elevated ridge of the holding surface 311 in sequence. More specifically, as shown in FIG. 8(A), when the holding surface 311 of the mounting tool 31 approaches the electronic component 2 and the detection unit 322a detects contact, negative pressure is applied to the row [1], row [2], and row [3] (see FIG. 3(B)) of the openings 312 in sequence, as shown in FIGS. 8(B) to (D). This allows the mounting tool 31 to receive the electronic component 2 from the pickup nozzle 21 while gradually curving the electronic component 2 to follow the holding surface 311, thereby suppressing floating and deviation, and preventing the electronic component 2 from becoming unable to recognize its position. In addition, since floating and deviation are reduced, when mounting the electronic component 2, a deviation in the timing of removal is less likely to occur, and the possibility of air bubbles being entrained can be reduced.

[0056] [Other embodiments] The present invention is not limited to the above-described embodiment, but also includes other embodiments described below. The present invention also includes a combination of all or any of the above-described embodiment and the other embodiments described below. Furthermore, these embodiments can be omitted, replaced, or modified in various ways without departing from the scope of the invention, and such modifications are also included in the present invention. [Explanation of symbols]

[0057] 1 Mounting equipment 2. Electronic Components 10 Feeding device 11 sheets 12 Supply Stage 13 Stage movement mechanism 20 Pick-up device 21 Pick-up nozzle 21b Nozzle hole 22 Nozzle movement mechanism 23 Turning Point 24 Push-up pin 30 Onboard Equipment 31 Implementation Tools 32 Tool movement mechanism 50 Control device 51 Supply device control section 52 Push-up pin control section 53 Pickup nozzle control section 54 Mounting tool control section 56 Substrate stage control unit 57 Memory section 60 Substrate Stage 61 Stage movement mechanism 221 Slide mechanism 221a Support frame 221b Rail 221c slider 222 Lifting mechanism 241 Backup body 311 Holding surface 312 Aperture 313 Vent 321 Slide mechanism 321a Support frame 321b Rail 321c slider 322 Lifting mechanism 322a Detection unit

Claims

1. A mounting tool for mounting electronic components on a substrate, comprising: a holding surface that is raised so that the electronic component is curved and comes into contact with the holding surface; A plurality of openings provided on the holding surface; an air vent that communicates with the opening and holds the electronic component on the holding surface by making the internal pressure negative and sequentially makes a portion of the electronic component positive, thereby removing the electronic component from the holding surface; having a mounting tool that sequentially applies positive pressure to adjacent vent holes among the plurality of vent holes, starting from the vent hole closest to the most raised ridge portion of the holding surface; a tool moving mechanism for moving the mounting tool back and forth between a transfer position and a mounting position and for raising and lowering the mounting tool at the transfer position and the mounting position; A detection unit that detects contact with the mounting tool; a switching unit that switches between negative pressure and positive pressure applied to the vent hole of the mounting tool when the detection unit detects contact; A mounting device comprising:

2. The mounting device as described in claim 1, characterized in that the multiple openings of the mounting tool are formed arranged in multiple rows.

3. An mounting device as described in claim 1 or claim 2, characterized in that the holding surface of the mounting tool is mountain-shaped.

4. An mounting device as described in claim 1 or claim 2, characterized in that the holding surface of the mounting tool is a curved surface.

5. 5. The mounting device according to claim 1, wherein the negative pressure is sequentially applied to the plurality of vent holes, starting from the vent hole closest to the most elevated ridge portion of the holding surface, and progressing to adjacent vent holes.

Images