Positioning device and mounting device using same

Abstract

To provide a positioning device and a mounting device for mounting a plurality of chip components on a large-sized substrate with high accuracy and at high speed.SOLUTION: Provided are a positioning device and a mounting device employing the same. The positioning device comprises: a substrate table on which a substrate is held; a processing position moving mechanism including driving means for relatively moving the substrate table and processing means and braking means for regulating movement, due to the driving means, of at least one of the substrate table and the processing means; and a control unit connected to the driving means and the braking means. The control unit regulates the movement of at least one of the substrate table and the processing means during addition processing through the braking means.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a positioning device that determines the relative position between a processing means and a substrate when additional processing is performed at a predetermined position on the substrate, and to a mounting device using the same. [Background technology]

[0002] In mounting devices that mount multiple chip components on substrates such as wiring boards, the substrates are becoming larger. To deal with the increase in substrate size, a method of moving a bonding head to each mounting location can be used to narrow the substrate movement range, thereby preventing the device from becoming larger.

[0003] However, when attempting to move the bonding head 14 with a bonding device such as that shown in Fig. 17, the bonding head 14 is held in a cantilevered state. When attempting to use such cantilevered bonding head 14 to bond a chip component C to a substrate S with a pressure F, the bonding head 14 will tilt from the state shown in Fig. 18 to that shown in Fig. 19. As a result, as shown in Fig. 19, the part of the bonding head 14 that holds the chip component C may be mounted with its position shifted in the +Y direction.

[0004] Therefore, when high-precision mounting is required even for large substrates, as shown in FIG. 20, the pressure axis of the bonding head 14 (by the lifting and lowering pressure unit 13) is fixed to the gate-shaped frame 300, and the alignment of the chip component and the substrate is performed by moving (adjusting the position) the substrate stage 2. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 08-288337 Summary of the Invention [Problem to be solved by the invention]

[0006] In mounting chip components on large substrates, high speed as well as high accuracy is required. For this reason, for example, in a mounting device configuration as shown in FIG. 20, it is necessary to move and align the substrate stage 2 at high speed.

[0007] However, since the substrate stage 2 that moves the large substrate has also become larger, it has become difficult to perform high-speed alignment.

[0008] To speed up this alignment, the applicant has invented a method in which, after the stage movement control process, precise alignment is performed using a bonding tool (attachment tool) attached to the bonding head while keeping the positions of the substrate stage and bonding head fixed (Patent Document 1).

[0009] However, when trying to simultaneously achieve the recent demands for larger substrate sizes, improved precision to the submicron level, and shorter takt times, the contents of Patent Document 1 alone may not be sufficient.

[0010] The present invention has been made in consideration of the above problems, and provides a positioning device and a mounting device that enable mounting multiple chip components on a large substrate with high precision and high speed. [Means for solving the problem]

[0011] In order to solve the above problem, the invention described in claim 1 comprises: A positioning device that determines a relative position between a processing means for performing additional processing and a substrate when additional processing is performed on a predetermined position of the substrate, comprising: a processing position moving mechanism including a substrate table for holding the substrate, a driving means for relatively moving the substrate table and the processing means, and a braking means for restricting the movement of at least one of the substrate table and the processing means by the driving means, and a control unit connected to the driving means and the braking means; The control unit is a positioning device characterized in that the control unit restricts the movement of at least one of the substrate table and the processing means during the additional processing by the braking means.

[0012] The invention described in claim 2 is the positioning device described in claim 1, the processing position moving mechanism has a slide rail, and the relative movement of the substrate table and the processing means by the driving means is performed along the slide rail; The braking means is a positioning device that partially grips the slide rail to restrict movement.

[0013] The invention described in claim 3 is the positioning device described in claim 2, The slide rail further includes a length measuring means for arranging a position detector along the slide rail, The position detector is a positioning device provided in the vicinity of the braking means.

[0014] The invention described in claim 4 is the positioning device according to any one of claims 1 to 3, A timer is connected to the control unit and measures the time after the braking means is operated, The control unit is a positioning device that determines that the additional process can be started when the time measured by the timer reaches a predetermined value.

[0015] The invention described in claim 5 is the positioning device according to any one of claims 1 to 4, The control unit of the positioning device turns off the power supply to the driving means after operating the braking means.

[0016] The invention described in claim 6 is the positioning device according to any one of claims 1 to 4, A servomotor is used as the driving means, and the control unit is a positioning device that changes the responsiveness of the servomotor after operating the braking means.

[0017] The invention described in claim 7 uses the positioning device according to any one of claims 1 to 6, The additional processing is mounting in which a chip component is placed on the substrate and pressure-bonded, The processing means is a mounting device that includes an attachment tool that adsorbs and holds the chip component, a bonding head that holds the attachment tool, and a lifting and lowering pressure unit that is connected to the bonding head and can control the position of the bonding head in the vertical direction and also control the pressure force.

[0018] The invention described in claim 8 is the mounting device described in claim 7, a recognition mechanism for acquiring position information of a substrate recognition mark of the substrate and a chip recognition mark of the chip component, the bonding head has a tool position adjustment means capable of finely adjusting the position of the attachment tool in an in-plane direction of the chip component, The positioning device determines the relative position of the substrate with respect to the bonding head, This mounting device lowers the bonding head and brings the chip component held by the attachment tool close to the substrate, and then the recognition mechanism acquires position information of the substrate recognition mark and the chip recognition mark, and the tool position adjustment means precisely aligns the chip component to the mounting location on the substrate. Effect of the Invention

[0019] According to the present invention, the mounting apparatus can align chip components and large substrates quickly and with high accuracy, and can mount chip components on large substrates with high accuracy and in a short tact time. [Brief description of the drawings]

[0020] [Figure 1] 1 is a schematic diagram of a mounting apparatus according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a diagram illustrating main components according to an embodiment of the present invention. [Diagram 3]5A and 5B are diagrams illustrating a relationship between braking points and a position detection unit of the positioning device according to the embodiment of the present invention. [Figure 4] FIG. 2A is a front view and FIG. 2B is a side view illustrating an optical configuration according to an embodiment of the present invention. [Diagram 5] FIG. 2 is a block diagram showing a control system according to an embodiment of the present invention. [Figure 6] 5A to 5C are diagrams illustrating a process in which a mounting device according to an embodiment of the present invention mounts a chip component on a substrate. [Figure 7] 5A to 5C are diagrams illustrating various procedures for fixing a substrate stage in the mounting apparatus according to the embodiment of the present invention. [Figure 8] 11A and 11B are diagrams illustrating a state in which a chip recognition mark is recognized by an imaging means immediately after being transferred to a bonding head in the mounting apparatus according to the embodiment of the present invention. [Figure 9] 1A and 1B are diagrams illustrating a state in which a board recognition mark and a chip recognition mark are recognized by an imaging means in a mounting device according to an embodiment of the present invention. [Figure 10] 1A and 1B are a front view and a side view, respectively, illustrating an optical configuration according to a modified example of an embodiment of the present invention. [Figure 11] 13A and 13B are diagrams illustrating a state in which a board recognition mark and a chip recognition mark are recognized by different imaging means in a mounting device according to a modified example of an embodiment of the present invention. [Figure 12] 1A to 1C are diagrams illustrating steps performed when a conventional mounting device mounts chip components on a substrate. [Figure 13] FIG. 13 is a schematic diagram of a modified example of a mounting apparatus according to an embodiment of the present invention, the mounting apparatus having a plurality of bonding heads. [Figure 14] 1 is a schematic diagram showing main components of a mounting apparatus according to an embodiment in which the present invention is applied to flip chip mounting; [Figure 15] FIG. 11 is a schematic diagram of a mounting device according to a second embodiment of the present invention. [Figure 16] FIG. 11 is a schematic diagram of a mounting device according to a third embodiment of the present invention. [Figure 17] FIG. 1 is a schematic diagram of a conventional mounting device. [Figure 18]1A and 1B are diagrams illustrating a reaction force applied to a conventional mounting device when the device applies pressure. [Figure 19] 1A and 1B are diagrams illustrating the influence of a reaction force when pressure is applied by a conventional mounting device. [Figure 20] FIG. 1 is a schematic diagram illustrating an example of a high-precision mounting device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a schematic diagram of a mounting apparatus 1 using a positioning device in an embodiment of the present invention.

[0022] A mounting device sequentially mounts chip components at multiple mounting locations provided on a substrate such as a wiring board. The mounting device 1 in FIG. 1 is configured to perform face-up mounting, in which the electrode surface of the chip component and the electrode surface of the substrate are mounted in the same direction.

[0023] 1 has a substrate stage 2 and a gate-shaped frame 300 mounted on a base 200. The substrate stage 2 has the function of holding the substrate and moving it in the in-plane direction of the substrate. The gate-shaped frame 300 fixes a lifting and pressurizing unit 3 above the substrate stage 2, and a bonding head 4 is connected to the up and down drive shaft of the lifting and pressurizing unit 3 to constitute a mounting means (processing means). The mounting apparatus 1 also includes a chip transport means 6 that transports a chip component C to the bonding head 4, and a recognition mechanism 5 that acquires position information of the chip component C and the substrate when aligning them.

[0024] In order to further explain each of the components shown in Fig. 1, a configuration in which the portal frame 300 is omitted from the drawing is shown in Fig. 2. The following description will be given with reference to Fig. 2.

[0025] The substrate stage 2 is composed of a stage movement mechanism 20 and a suction table 23. The suction table 23 suctions and holds the substrate placed on its surface, and the suction table 23 can be moved in an in-plane direction of the substrate surface while holding the substrate by the stage movement mechanism 20. That is, in this embodiment (because the elevating and lowering pressure unit 3 constituting the mounting means is fixed), the stage movement mechanism 20 is a mounting position movement mechanism (processing position movement mechanism) that can move multiple mounting locations provided on the substrate successively to directly below the bonding head 4.

[0026] The stage movement mechanism 20 is composed of a Y-direction stage movement means 22 capable of linearly moving a suction table 23 in the Y direction, and an X-direction stage movement means 21 capable of linearly moving the Y-direction stage movement means 22 in the X direction and provided on a base 200. The Y-direction movement means 22 has the suction table 23 mounted on a movable part arranged on a slide rail, and the movable part is moved and positioned by a Y-direction servo 221, which is a driving means, but the movement is prevented by operating a Y-direction clamp 222. The X-direction movement means 21 has the Y-direction movement means 22 mounted on a movable part arranged on a slide rail, and the movable part is moved and positioned by an X-direction servo 211, which is a driving means, but the movement is prevented by a clamping force by operating the X-direction clamp 212. Here, the X-direction servo 211 and the Y-direction servo 221 are servo motors.

[0027] The X-direction clamp 212 and the Y-direction clamp 222 are braking means that clamp the slide rail and prevent movement in the slide direction by means of a clamping force. Note that a plurality of X-direction clamps 212 and a plurality of Y-direction clamps 222 may be arranged on the slide rail.

[0028] In addition, a linear encoder, which is a length measuring means for measuring the amount of movement, may be provided along the slide rails for both the X-direction stage moving means 21 and the Y-direction stage moving means 22, but it is desirable to provide at least one position detection unit, each of the X-direction clamp 212 and the Y-direction clamp 222, immediately adjacent to the linear encoder.

[0029] The reason for this will be explained using the X-direction moving means 21 as an example, with reference to FIG. 3. In FIG. 3, the X-direction clamp 212 tightens the X-direction slide rail 210, thereby suppressing the movement in the X-direction of the table 21T constituting the X-direction stage moving means 21. In addition, the X-direction scale head 213, which is a position detection unit of the linear encoder, is fixed to the table 21T at a position along the X-direction slide rail 210 and provides X-direction position information. Even if the X-direction clamp 212 and the X-direction scale head 213 are in positions apart from each other, there is no problem if the X-direction clamp 212 is driven to reach the state shown in FIG. 3(a). However, during clamping, as shown in FIG. 3(b), a fluctuation occurs in the table 21T about the axis of the X-direction clamp 212, and a deviation may occur in the X-direction position information provided by the X-direction scale head 213. Although this deviation is slight, the X-direction servo 211 may oscillate in an attempt to correct this deviation. On the other hand, if the X-direction clamp 212 and the X-direction scale head 213 are close to each other as shown in FIG. 3(c), even if the table 21T moves as in FIG. 3(b), the deviation in the X-direction position information provided by the X-direction scale head 213 can be suppressed as shown in FIG. 3(d), and oscillation of the X-direction servo 211 can be prevented.

[0030] The lifting and pressurizing unit 3 is fixed to a gate-shaped frame 300, and a vertical drive shaft is provided perpendicular to the suction table 23, and the bonding head 4 is connected to the vertical drive shaft. The lifting and pressurizing unit 3 has the function of driving the bonding head 4 up and down, and applying a pressure force according to a setting. In addition, in the mounting device 1, the lifting and pressurizing unit 3 is supported from two directions, and is linearly connected to the bonding head 4, so that a lateral force is unlikely to be applied to the bonding head 4 when pressure is applied.

[0031] The bonding head 4 holds the chip component C and presses it in parallel with the substrate (held on the suction table 23 of the substrate stage 2). The bonding head 4 is composed of a head body 40, a heater section 41, an attachment tool 42, and a tool position control means 43. The head body 40 is connected to the elevation / lowering pressurizing unit 3 via the tool position control means 43, and the heater section 41 is fixedly disposed on the lower side. The heater section 41 has a heat generating function and heats the chip component C via the attachment tool 42. The heater section 41 also has a function of suctioning and holding the attachment tool 42 using a reduced pressure flow path. The attachment tool 42 suctions and holds the chip component C, and is replaced according to the shape of the chip component C. The tool position control means 43 finely adjusts the position of the head body 40 in the vertical plane relative to the up / down drive shaft of the elevation / lowering pressurizing unit 3, and the positions (in the XY plane of the figure) of the attachment tool 42 and the chip component C held by the attachment tool 42 are adjusted accordingly.

[0032] The tool position control means 43 includes an X-direction tool position control means 431, a Y-direction tool position control means 432, and a tool rotation control means 433. In the embodiment shown in FIG. 2, the tool rotation control means 433 adjusts the rotation direction of the head body 40, the Y-direction tool position control means 432 adjusts the Y-direction position of the tool rotation control means 433, and the X-direction tool position control means 431 adjusts the X-direction position of the Y-direction position control means, but the present invention is not limited to this configuration, and it is sufficient if the X-direction position, Y-direction position, and rotation angle of the head body 40 (and the components below it) can be adjusted. The maximum movable range of the tool position control means 43 is preferably about ±1.0 mm in each direction, but a maximum movable range of about ±5.0 mm may be used on the premise that the operating range is used within ±1.0 mm. Note that if the maximum movable range is large, when used at the upper limit of the movable range, it is easy for adverse effects to occur due to the misalignment of the pressurizing center below the head body 40 with respect to the vertical drive shaft of the lift-down pressurizing unit 3.

[0033] Figure 4 shows a view mainly focusing on the periphery of the head main body 40 (Figure 4(a) is a front view, and Figure 4(b) is a side view), and in the face-up mounting of this embodiment, a chip recognition mark AC (first chip recognition mark AC1 and second chip recognition mark AC2) is provided at a diagonal position on the electrode surface of the chip component C, and a board recognition mark AS (first board recognition mark AS1 and second board recognition mark AS2) is provided at a guide position diagonally across from the chip component mounting location on the electrode surface of the board S, both of which face in the direction of the bonding head 4.

[0034] Therefore, in the mounting device 1, the chip recognition mark AC is observed from above (through the bonding head 4), and the attachment tool 42 is formed of a transparent material or has a through hole aligned with the position of the chip recognition mark AC. Also, the heater section 41 needs to be made of a transparent material or have an opening so that the chip recognition mark AC can be observed, and in this embodiment, a through hole 41H is provided as shown in FIG. 4. Here, the through hole 41H may be provided according to the position of each chip recognition mark, but in order to eliminate the need for replacement according to the shape of the chip component C, it is desirable to have a hole shape that can accommodate all of the specification dimension ranges. Also, in order to observe the chip recognition mark AC and / or the board recognition mark AS, the bonding head 4 needs a space into which the image capture section 50 of the recognition mechanism 5 can enter, and in this embodiment, a head space 40V is provided as shown in FIG. 4. That is, the head body 40 is structured to be composed of side plates connected on the heater 41 and a top plate that connects both side plates.

[0035] The recognition mechanism 5 focuses on and captures the chip recognition mark AC and / or the board recognition mark AS (through the mounting head 4, passing through the attachment tool 42 and the heater unit 41) to obtain position information of the chip recognition mark AC and / or the board recognition mark AS. In this embodiment, the recognition mechanism 5 includes an image capture unit 50, an optical path 52, and an imaging means 53 connected to the optical path 52 as its components.

[0036] The image capture unit 50 is disposed above the target to be recognized, from which the image capture means 53 captures an image, and brings the target into its field of view.

[0037] The recognition mechanism 5 is configured to be movable in the in-plane direction of the substrate S (and chip components C) within the head space 40V by a drive mechanism (not shown). Furthermore, it is desirable to be able to move the substrate S in the vertical direction (Z direction) so that the focal position can be adjusted. The mounting head 4 is moved in a direction perpendicular to the substrate S by the lifting and pressurizing unit 3, but this operation can be performed independently of the operation of the recognition mechanism 5. For this reason, it is necessary to design the head space 40V to have a dimension such that even if the mounting head 4 moves in the vertical direction, the recognition mechanism 5 that has entered the head space 40V does not interfere.

[0038] The chip transport means 6 is composed of a transport rail 60 and a chip slider 61. The chip slider 61 holds the chip component C supplied from a chip supply unit (not shown) and slides it to just below the attachment tool 42 to transport it.

[0039] Here, a chip supply unit (not shown) places the chip component C at a fixed position on the chip slider 61. If necessary, the position of the chip component C placed on the chip slider 61 may be recognized by an imaging means (not shown). In this way, by controlling the positions of the chip slider 61 and the chip component C to be placed on the chip slider 61, it is possible to transfer the chip component C within a predetermined range of the attachment tool 42, and after the attachment tool 42 holds the chip component C, the chip slider 61, which has released its hold on the chip component C, moves to a retracted position.

[0040] As shown in the block diagram of FIG. 5, the mounting apparatus 1 includes a substrate stage 2, a lifting and pressing unit 3, a bonding head 4, a recognition mechanism 5, and a control unit 10 that is connected to a chip transport means 6.

[0041] The control unit 10 essentially consists of a CPU and a storage device as its main components, and has an interface with each device as necessary. The control unit 10 also has a built-in program that allows it to perform calculations using acquired data and output the results of the calculations.

[0042] The control unit 10 is connected to the substrate stage 2, and controls the operation of the X-direction servo 211 and the X-direction clamp 212, and the Y-direction servo 221 and the Y-direction clamp 222, thereby controlling the in-plane movement of the suction table 23. The control unit 10 also controls the suction table 23 to control the suction holding and release of the substrate S.

[0043] The control unit 10 is connected to the elevation / depressurization unit 3 and has the function of controlling the position of the bonding head 4 in the vertical direction (Z direction) and controlling the pressure applied when the chip component C is pressure-bonded to the substrate S.

[0044] The control unit 10 is connected to the mounting head 4, and has the function of controlling the suction, holding and release of the chip component C by the attachment tool 42, the heating temperature of the heater unit 41, and the position of the head main body 40 (and the heater unit 41 and attachment tool 42) in the XY plane. The control unit 10 is connected to the recognition mechanism 5 and has a function of controlling the driving in the horizontal (in the XY plane) and vertical (Z direction) directions, as well as controlling the imaging means 53 to acquire image data. Furthermore, the control unit 10 has an image processing function, and has a function of calculating the positions of the chip recognition mark AC and / or the board recognition mark AS from the image acquired by the imaging means 53.

[0045] The control unit 10 is connected to the chip transport means 6 and has a function of controlling the position of a chip slider 61 that moves along a transport rail 60 .

[0046] Hereinafter, the process in which the mounting apparatus 1 mounts the chip components C on the substrate S will be described with reference to FIGS.

[0047] 6 shows a series of steps in this embodiment in conjunction with the states of each component of the mounting apparatus 1. That is, the series of steps are conveniently classified into a mounting preparation step, a preliminary alignment step, a head lowering step, a precision alignment step, a pressure bonding step, and a post-process, and the states of the substrate stage 2, the bonding head 4, the recognition mechanism 5, and the chip slider 61 in each step are shown.

[0048] The mounting preparation process is a process in which the attachment tool 42 of the bonding head 4 holds the chip component C and positions the "next mounting location for mounting the chip component C" on the substrate S directly below the bonding head 4. In order to shorten the time for subsequent processes, it is desirable to increase the positional accuracy of the chip component C held by the attachment tool 42 and the positional accuracy of the "next mounting location for mounting the chip component" on the substrate S.

[0049] For this purpose, a mechanism is adopted in which the chip component C is placed at a predetermined position on the chip slider 61 with high accuracy from a chip supply unit (not shown), and the chip conveying means 6 conveys the chip slider 61 with high accuracy. In this way, it is desirable to keep the positional accuracy of the chip component C held by the attachment tool 42 within about ±50μ.

[0050] On the other hand, in order to position the "mounting location where the next chip component is to be mounted" on the board S directly under the bonding head 4 with high accuracy, it is preferable to employ a stage movement mechanism 20 that controls the position of the suction table 23 with high accuracy, and to have the control unit 10 store a map of the position of the board S on the suction table 23 and the "mounting location where the chip component is to be mounted" on the board S. The map of the "mounting location where the chip component is to be mounted" on the board S may be obtained from a wiring pattern design drawing of the board S, but it is also possible to use position information obtained by actually measuring each "mounting location where the chip component is to be mounted" of the board S on the suction table 23 while moving the recognition mechanism 5 relative to the suction table 23. In this way, it is preferable to keep the positional accuracy of the "mounting location where the next chip component is to be mounted" on the board S to about ±50μ or less.

[0051] In the mounting preparation process, the position of the suction table 23 is controlled by using the stage movement mechanism 20 so that the "mounting location where the chip component C is to be mounted next" of the board S is located directly under the bonding head 4, but the X-direction servo 211 and the Y-direction servo 221 constituting the stage movement mechanism 20 are servo motors, and in the operating state, the position is constantly controlled, and the suction table 23 vibrates slightly. This vibration of the suction table 23 has a maximum amplitude of about 0.2 μm, but it also has the effect of inducing vibrations in other components, and this effect cannot be ignored in a situation where a mounting accuracy of 1 μm or less is required. Furthermore, as will be described later, in the preliminary positioning process, the recognition mechanism 5 moves, and the effect of the vibration generated during this movement on the position control of the suction table 23 cannot be ignored.

[0052] For this reason, in the mounting preparation step of this embodiment, the suction table 23 is moved so that the "mounting location where the chip component C is to be mounted next" of the substrate S is positioned directly under the bonding head 4, and then the suction table 23 is fixed. That is, the stage movement mechanism 20 operates the X-direction clamp 212 and the Y-direction clamp 222, thereby preventing the suction table 23 from being displaced in the X and Y directions and fixing the suction table 23.

[0053] Incidentally, it was found that the state of the suction table 23 differs depending on the timing of operating the braking means (X-direction clamp 212 and Y-direction clamp 222) and the operating state of the servo motors (X-direction servo 211 and Y-direction servo 221) during fixing. Therefore, the characteristics of each of fixing procedures A to D shown in FIG. 7 regarding the timing of operation of the braking means and the operating state of the servo motors will be described. First, in fixing procedure A, while the servo motors (X-direction servo 211 and Y-direction servo 221) are controlling the position of the suction table 23, the braking means (X-direction clamp 212 and Y-direction clamp 222) are driven to fix the position of the suction table 23. In other words, the absolute movement amount of the suction table 23 is set to zero (a value smaller than the required mounting accuracy). Here, even if the suction table 23 is moved to position the "mounting location on the substrate S where the chip component C is to be mounted next," the X-direction servo 211 and the Y-direction servo 221 continue to control the position against minute displacements, so that micro-vibrations may occur immediately after the X-direction clamp 212 and the Y-direction clamp 222 are activated. In addition, the clamping operation itself may cause micro-vibrations. Since these micro-vibrations usually tend to converge over time, it is desirable to provide a timer that determines that the micro-vibrations of the suction table 23 have converged after a certain time has elapsed since the braking means (X-direction clamp 212 and Y-direction clamp 222) were driven. The timer setting value is set according to the size and weight of the substrate stage 2, the rated value of the servo motor, etc., but must be 0.1 seconds or more, and is usually selected between 0.2 and 0.4 seconds.

[0054] In the case of the procedure of the fixing procedure A, if the gain (response) of the servo motor is high, it may oscillate when trying to perform position control repeatedly. Therefore, in order to avoid the oscillation state, the power supply of the servo motor (X-direction servo 211 and Y-direction servo 22) may be turned off after driving the braking means as in the fixing procedure B of FIG. 7. In this fixing procedure B, it is preferable to turn off the power supply of the servo motor after the time (set by a timer) for the micro-vibration to converge immediately after driving the braking means has elapsed. By turning off the power supply of the servo motor in this way, it is possible to eliminate the vibration caused by the substrate stage 2. Therefore, the vibration of the substrate stage 2 does not induce micro-vibration in the bonding head 4 or the recognition mechanism 5. However, immediately after turning off the power supply of the servo motor, the posture may be disturbed and micro-vibration may occur in other machine elements (other axes), so it is preferable to provide a timer according to the convergence time of this micro-vibration. The setting value of this timer may be set by actually measuring the time for the micro-vibration generated by turning off the power supply of the servo motor to converge, but is usually selected between 0.2 seconds and 0.4 seconds.

[0055] In terms of the time from when the braking means is driven to when the suction table 23 is fixed, fixing procedure B is longer than fixing procedure A, and fixing procedure B is disadvantageous in terms of takt time.

[0056] Therefore, we found a procedure that prevents oscillation by the servo motor without being disadvantageous in terms of takt time, which is the fixed procedure C in FIG. 7. That is, the servo parameters that are usually adjusted to move the suction table 23 quickly and with good response are changed to reduce the response when the braking means is operated. Here, the servo parameters are called position control gain, speed control gain, model control gain, etc. In the method of fixed procedure C, the power supply of the servo motor is not turned off, so there is no need for a timer to wait for the convergence of the micro-vibration of the other axis caused by turning off the power supply of the servo motor. However, since the servo motor is in operation, the micro-vibration is slightly larger than that in fixed procedure B. Also, although the response of the servo motor is reduced in fixed procedure C, the convergence time of the micro-vibration may be shortened by increasing the response after driving the braking means, so the response after driving the braking means may be selected according to the application.

[0057] In fixing procedure C, the responsiveness of the servo motors (X-direction servo 211 and Y-direction servo 221) is reduced after the braking means (X-direction clamp 212 and Y-direction clamp 222) are driven. However, as shown in fixing procedure D (at the stage when the "location where chip component C is to be next mounted" of substrate S is positioned directly under bonding head 4), even if the responsiveness of the servo motors is reduced before the braking means is driven, results that are not significantly different from those of fixing procedure C are obtained.

[0058] On the other hand, when the procedure of driving the braking means after turning off the power supply of the servo motor is performed as in the fixing procedure E, although the position can be fixed with high accuracy, an extremely large positional fluctuation (tens of μm) may occur. Therefore, when the cause of the large positional deviation was investigated, it was found that the power cable for the servo motor has elasticity, and when the power supply is turned off, a part of the elasticity is released, causing the displacement. It was also found that if other components of the mounting device 1 are operating at the stage when the power supply of the servo motor is turned off, the mounting device 1 will be affected by the vibration. For this reason, when the fixing procedure E is adopted, it is necessary to consider what kind of force is applied to each part of the substrate stage 2 at the stage when the power supply of the servo motor is turned off.

[0059] In the mounting preparation process described so far, the "location where the chip component C is to be mounted next" on the substrate S is positioned with high precision directly below the bonding head 4. For this reason, in the next preliminary alignment process, the "location where the chip component C is to be mounted next" on the substrate S is assumed to be within a predetermined range directly below the bonding head 4, and only the position information of the chip component C is obtained by the recognition mechanism 5.

[0060] The preliminary alignment process is shown in Fig. 8. The preliminary alignment process is performed while the chip component C is held by the attachment tool 42, but since the recognition mechanism 5 only observes the chip recognition mark AC, it is possible to obtain position information of the chip component C even when the chip slider 61 that has handed over the chip component C to the attachment tool 42 is in the process of retracting as shown in Fig. 8. When the recognition mechanism 5 recognizes the chip recognition mark AC, it recognizes the first chip recognition mark AC1 and then the second chip recognition mark AC2 as shown in Fig. 8. For this reason, the recognition mechanism 5 is moved within the XY plane so as to align the image capture unit 50 with each of them.

[0061] In the preliminary alignment process, the first chip recognition mark AC1 and the second chip recognition mark AC2 are recognized, and the control unit 10 calculates the position information of the chip component C. If the position of the chip component C relative to the "mounting location where the chip component C is to be mounted next" is within a predetermined error range and the chip slider 61 is in a retreated state, the process proceeds to the next head lowering process. If the position of the chip component C relative to the "mounting location where the chip component C is to be mounted next" exceeds the predetermined error range, the tool position control means 40 is driven to perform alignment. Note that, as the allowable error range of the chip component C position, when performing the precision alignment process described later, it is necessary that the first chip recognition mark AC1 and the first board recognition mark AS1 (the second chip recognition mark AC2 and the second board recognition mark AS2) are in the same field of view at worst. A specific numerical value is ±100 μm or less, and more preferably ±50 μm or less.

[0062] After the preliminary alignment step, a head lowering step is performed as shown in Fig. 6. In the head lowering step, the bonding head 4 is lowered by the lifting and pressurizing unit 3 to bring the chip component C as close as possible to the substrate S without contacting it. The distance between the substrate S and the chip component C is preferably set so that both the first chip recognition mark AC1 and the first substrate recognition mark AS1 (and the second chip recognition mark AC2 and the second substrate recognition mark AS2) are within the depth of field of the recognition mechanism 5.

[0063] The precision alignment process is performed after the head lowering process. In the precision alignment process, as shown in FIG. 9, the first board recognition mark AS1 and the first chip recognition mark AC1 are simultaneously recognized in the same field of view to determine their positional relationship, but in order to improve accuracy, it is desirable to move the image capture unit 50 and determine the positional relationship between the second board recognition mark AS2 and the second chip recognition mark AC2. From the positional relationship between the first board recognition mark AS1 and the first chip recognition mark AC1 obtained here (and the positional relationship between the second board recognition mark AS2 and the second chip recognition mark AC2), the control unit 10 determines the amount of positional deviation between the mounting position of the board S and the chip component C, and drives the tool position control means 43 to correct the positional deviation and perform alignment. The tool position control means 43 has an extremely small movable range compared to the stage movement mechanism 20, and the servo motor is also small, so there is no vibration that affects the positional accuracy.

[0064] This completes the precision alignment process, and the bonding process begins. In the bonding process, the lifting and pressing unit 3 lowers the bonding head 4, and when the chip component C comes into close contact with the substrate S, a predetermined pressure is applied to mount the chip component C. The heater unit 41 may be heated to perform hot pressing. After a predetermined period of pressure application, the bonding process ends and the post-process begins. In the post-process, the attachment tool 42 releases the attachment of the chip component C to the bonding head 4, and the bonding head 4 is raised, while the fixing of the suction table 23 by the braking means (X-direction clamp 212 and Y-direction clamp 222) is released. Note that before the fixing by the braking means is released, the servo parameters of the servo motors (X-direction servo 211 and Y-direction servo 221) are returned to their original state (response is restored).

[0065] After the post-process, if there is a new chip component C to be mounted, the mounting preparation process is started.

[0066] The above is a series of mounting steps in this embodiment. In this embodiment, the "location where the chip component C is to be mounted next" on the board S and the chip component C are positioned with high precision before the preliminary alignment step, so that the tool position control means 43 is rarely operated in the preliminary alignment step, and the takt time is shortened, resulting in a mounting device with excellent productivity.

[0067] However, in order to satisfy the high accuracy requirement before the preliminary alignment process, each part of the mounting device needs to be precisely machined and precisely assembled, which increases the cost of the device. Therefore, the configuration of a mounting device which is a modification of this embodiment, which can also handle cases where the accuracy of the "location where the chip component C is to be mounted next" of the substrate S and the chip component C before the preliminary alignment process exceeds several tens of μm, is shown in FIG.

[0068] The mounting device shown in Figure 10 differs from the mounting device 1 shown in Figure 4 in that the recognition mechanism 5 has as its components an image capture unit 50, an optical system (common) 51, optical paths 52a and 52b which branch off from the optical system 51 into two with a common optical axis, and an imaging means 53a connected to the optical path 52a and an imaging means 53b connected to the optical path 52b.

[0069] Also, by setting the optical path lengths of "the path from the image capture unit 50 to the optical system 51 and the optical path 52a" and "the path from the image capture unit 50 to the optical system 51 and the optical path 52b" to be different, the focal position of the imaging means 53a and the focal position of the imaging means 53b are different. Here, the optical system (common) 51 has a function of changing the direction of the optical path by the reflecting means 500 and the reflecting means 520, and the optical path is branched by the half mirror 511. The optical systems 52a and 52b have optical lenses and have a function of enlarging the image to obtain high resolution.

[0070] Therefore, as shown in FIG. 11, in the preliminary alignment process, the board recognition first mark AS1 and the chip recognition first mark AC1 (and the board recognition second mark AS2 and the chip recognition second mark AC2) are simultaneously recognized to obtain the positional relationship, and alignment can be performed. That is, if the board recognition first mark AS1 and the chip recognition first mark AC1 (and the board recognition second mark AS2 and the chip recognition second mark AC2) can be imaged on the same optical axis, alignment becomes easy. Note that the preliminary alignment process of this modification cannot be started unless the chip slider 61 is in a retracted state. Also, in the precise alignment in this modification, it is sufficient to use either the imaging means 53a or the imaging means 53b to image the board recognition first mark AS1 and the chip recognition first mark AC1 (and the board recognition second mark AS2 and the chip recognition second mark AC2). Note that the operation of the mounting device of this modification is the same except that in the preliminary alignment process of FIG. 6, the recognition mechanism 5 recognizes the board recognition mark AS in addition to the chip recognition mark AC.

[0071] Incidentally, in the case of the mounting apparatus 100 as shown in Fig. 20, the alignment process is performed by operating the substrate stage 2 as shown in Fig. 12. In contrast, in the operation of the mounting apparatus of the present invention, both the preliminary alignment process and the precision alignment process can be performed with the substrate stage 2 (the suction table 23 thereof) in a fixed state.

[0072] By providing multiple bonding heads 5 (and corresponding lifting and pressing units 3 and recognition mechanism 5) at intervals several times the mounting pitch, multiple chip components C can be mounted simultaneously on one suction table 23. As an example, FIG. 13 shows an example equipped with head A having lifting and pressing unit 3A and bonding head 4A, and head B having lifting and pressing unit 3B and bonding head 4B. By mounting multiple chip components C simultaneously, not only does the productivity of mounting improve, but it also makes it possible to mount in a wide area relative to the moving range of suction table 23. As a result, the moving range of suction table 23 can be narrowed, making it suitable as a mounting device for large boards.

[0073] 6 is merely for convenience, and is not limited to this. For example, if only the chip recognition 1 mark AC is recognized in the preliminary alignment process, the process of "moving the substrate S to the next mounting location" using the substrate stage 2 may be completed during the preliminary alignment process, not during the mounting preparation process.

[0074] Furthermore, although the embodiments described so far are targeted at face-up mounting, the procedure of "fixing the position of the suction table and moving the attachment tool to adjust the position" of the present invention can also be adapted to face-up mounting in which the electrode surface of the chip component C faces the electrode surface of the board S. That is, in a mounting apparatus 1001 that performs face-down mounting shown in Fig. 14, this can be implemented by using a two-view camera with upper and lower fields of view to recognize the chip recognition mark AC and board recognition mark AS that are facing each other.

[0075] In the above explanation, we have mentioned an apparatus configuration that moves the suction table 23 to avoid the phenomenon of the pressure axis tilting as shown in Fig. 19, but such an apparatus configuration inevitably requires a large installation area. For this reason, there is also a demand for a configuration that moves the lifting and lowering pressure unit 3 (and bonding head 4) in the in-plane direction of the substrate when dealing with large substrates.

[0076] Therefore, as shown in FIG. 15, the suction table 23 may be moved in only one direction (X direction) by an X-direction stage moving means 21, and a positioning mechanism may be configured in combination with a Y-direction mounting unit moving means 32 that moves the lifting and pressurizing unit 3 (and the connected bonding head 4) in the Y direction of the gate-shaped frame 300.

[0077] In the mounting device 101 of FIG. 15, a mounting position moving mechanism is formed by combining an X-direction stage moving means 21 and a Y-direction mounting unit moving means 32. Even in this configuration, the present invention can be realized as a second embodiment by providing an X-direction clamp 212, which is a braking means, in the X-direction stage moving means 21 and a Y-direction clamp 322, which is a braking means, in the Y-direction mounting unit moving means 32.

[0078] 16, the present invention can also be realized as a third embodiment in a mounting device 102 in which the suction table 23 is fixed and a Y-direction mounting unit moving means 32 for moving the elevating / pressurizing unit 3 (and the connected bonding head 4) in the Y direction is combined with an X-direction mounting unit moving means 31 for moving the Y-direction mounting unit moving means 32 in the X direction along a rail 310. That is, a mounting unit moving mechanism consisting of the X-direction mounting unit moving means 31 for moving in the X direction and the Y-direction mounting unit moving means 32 is used as a mounting position moving mechanism, and the X-direction mounting unit moving means 31 is provided with an X-direction clamp 312 as a braking means, and the Y-direction mounting unit moving means 32 is provided with a Y-direction clamp 322 as a braking means.

[0079] The above describes the mounting device that mounts chip components C on a substrate S, and the configuration for positioning the mounting means, which is composed of the step-up / step-down unit 3 and the bonding head 4, and the substrate S. However, additional processing performed at a predetermined position on the substrate is not limited to mounting. For example, there is a high need to position the processing means and the substrate with high accuracy in additional processing such as printing, lamination, and imprint processing. Therefore, for these processing, the positioning device having the configuration used when positioning the mounting means and the substrate S in the mounting device of the present invention can be used to position the processing means and the substrate. [Explanation of symbols]

[0080] 1 Mounting equipment 2. Substrate stage 3 Lifting and Pressurizing Unit 4 Bonding head 5 Recognition mechanism 6 Chip transport means 10 Control section 20 Stage movement means 21 X-direction stage movement means 22 Y-direction stage movement means 23 Vacuum table 31 X-direction mounting unit movement means 32 Y-direction mounting unit moving means 40 Head body 40V head space 41 Heater section 42 Attachment Tools 43 Tool position control means 50 Image capture unit 52, 52a, 52b optical path 53, 53a, 53b Imaging means 60 Transport rail 61 Tip Slider 200 bases 210 X-direction slide rail 211 X-direction servo 212 X-direction clamp 221 Y-direction servo 222 Y-direction clamp 300 Gate Frame 310 Rail 311 X-direction servo 312 X-direction clamp 321 Y-direction servo 322 Y-direction clamp 431 X-direction tool position control means 432 Y-direction tool position control means 433 Tool rotation control means C Chip parts S-substrate AC1, AC2 chip recognition mark AS1, AS2 board recognition mark

Claims

1. A positioning device that determines a relative position between a processing means for performing additional processing and a substrate when additional processing is performed on a predetermined position of the substrate, comprising: a substrate table for holding the substrate; a drive means for moving said substrate table and said processing means relative to one another; a processing position moving mechanism having a braking means for restricting movement of at least one of the substrate table and the processing means by the driving means; a control unit connected to the driving means and the braking means; the processing position moving mechanism has a slide rail, and the relative movement of the substrate table and the processing means by the driving means is performed along the slide rail; a position detection unit is disposed along the slide rail, and a length measuring unit is further provided for measuring a movement amount of one of the substrate table and the processing unit, the one being provided with the processing position movement mechanism, the position detection unit being provided in the vicinity of the braking unit, The positioning apparatus according to claim 1, wherein the control unit regulates, by the braking means, movement of at least one of the substrate table and the processing means during the additional processing.

2. 2. The positioning device according to claim 1, The braking means is a positioning device that partially grips the slide rail to restrict movement.

3. The positioning device according to claim 1 or 2, A timer is connected to the control unit and measures the time after the braking means is operated, The control unit determines that the additional process can be started when the time measured by the timer reaches a predetermined value.

4. The positioning device according to any one of claims 1 to 3, A positioning device in which the control unit turns off the power supply to the driving means after operating the braking means.

5. The positioning device according to any one of claims 1 to 3, A servo motor is used as the driving means, The control unit is a positioning device that changes the responsiveness of the servo motor after activating the braking means.

6. A mounting method using the positioning device according to any one of claims 1 to 5, in which the additional processing is to place a chip component on the substrate and press the chip component on the substrate, the processing means comprises an attachment tool for suction-holding the chip component; a bonding head that holds the attachment tool; a mounting apparatus including a lifting and lowering pressure unit connected to the bonding head for controlling the position of the bonding head in the vertical direction and for controlling the pressure applied thereto;

7. The mounting device according to claim 6, a recognition mechanism for acquiring position information of a substrate recognition mark of the substrate and a chip recognition mark of the chip component, the bonding head has a tool position adjustment means capable of finely adjusting the position of the attachment tool in an in-plane direction of the chip component, A mounting apparatus in which the positioning device determines the relative position of the substrate with respect to the bonding head, then lowers the bonding head to bring the chip component held by the attachment tool close to the substrate, while the recognition mechanism acquires position information of the substrate recognition mark and the chip recognition mark, and the tool position adjustment means precisely aligns the chip component to the mounting location on the substrate.

Images