Polishing apparatus and polishing method

Abstract

To solve the problem that a stray light is generated by an illumination light and it is not possible to observe a polishing state of a resin seal sample well.SOLUTION: A light irradiator 201 is mounted on a moving (rotating) stage 603a and adjusts an angle of an incident light 205a incident to a resin sealing sample 105. The incident light 205a transmits a polarizing plate 202a and becomes a linear polarization light. Optical image detection / photography means 206 is mounted on the moving (rotating) stage 603b, and the angle is adjusted so that a light 205d reflected by a grinding sample 102 and on a processing surface 602a is made incident to the optical image detection / photography means 206. The incident light 205d is phase converted on a λ / 2 plate 210 or a λ / 4 plate 204, and is converted into a linear polarization light by the polarizing plate 202b.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a polishing method, a polished sample, a method for evaluating a polished sample, a polishing device, and a method for preparing a polished sample, which are capable of observing the surface state and polishing position of an object to be polished (a polished sample) and realizing good cross-sectional polishing. It also relates to a polished surface observation device for an object to be polished, and a polishing device equipped with the same. [Background technology]

[0002] The density of semiconductor devices continues to increase with no apparent limit, and various techniques and methods are being developed to achieve this increase in density.

[0003] As the density increases, defects such as poor connection at the terminals of semiconductor devices, peeling off of terminals, cracks, etc. Analysis of the defects requires polishing and observing the cross section of the defective part, but as semiconductor devices become more fine-grained, it becomes difficult to perform polishing with high precision. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2002-178257 Summary of the Invention [Problem to be solved by the invention]

[0005] Patent Document 1 discloses a polishing device having a light projector / receiver, a transparent window provided in a polishing body and a reflecting mirror facing the light projector / receiver, which are provided in a polishing table. However, the polishing body needs to be made of a material having optical transparency, and the transparent window is contaminated by the polishing material, which causes a problem that the polished part of the polishing body cannot be observed.

[0006] Although polishing is sometimes performed while visually observing the polishing state of the polishing body from time to time, it is difficult to observe the polishing location, and as a result, it is difficult to perform polishing with high precision. [Means for solving the problem]

[0007] The polishing apparatus of the present invention includes a sealed object in which an object to be polished is sealed, a polishing table for polishing the sealed object, an illumination light irradiator for irradiating illumination light onto the object to be polished, a polarizing plate arranged on the light emission side of the illumination light irradiator, and an optical observation means for observing the light reflected by the object to be polished.

[0008] The polishing apparatus of the present invention includes a sealed object in which an object to be polished is sealed, a polishing table for polishing the sealed object, an illumination light irradiator for irradiating illumination light onto the object to be polished, a first polarizing plate arranged on the light output side of the illumination light irradiator, a first λ / 4 plate arranged on the light output side of the polarizing plate, an optical observation means for observing light reflected by the object to be polished, a second λ / 4 plate arranged between the optical observation means and the sealed object, and a second polarizing plate arranged between the second λ / 4 plate and the optical observation means.

[0009] The polishing apparatus of the present invention includes a sealed object in which an object to be polished is sealed, a polishing table for polishing the sealed object, an illumination light irradiator for irradiating the object to be polished with illumination light, a polarizing beam splitter arranged on the light output side of the illumination light irradiator, a λ / 4 plate arranged on the light output side of the polarizing beam splitter, and an optical observation means for observing the light reflected by the object to be polished. The illumination light is reflected by the light separation surface of the polarizing beam splitter, then passes through the λ / 4 plate and is irradiated to the object to be polished, and the light reflected by the object to be polished is emitted from the sealed object, passes through the λ / 4 plate, passes through the light separation surface of the polarizing beam splitter, and is incident on the optical observation means.

[0010] In the polishing apparatus of the present invention, the light irradiator 201 is mounted on a moving (rotating) stage 603a. The moving (rotating) stage 603a adjusts the angle of the incident light 205a to be incident on the resin-sealed sample 105. The incident light 205a passes through a polarizing plate 202a and becomes linearly polarized light. The optical image detection / photographing means 206 is mounted on a moving (rotating) stage 603b. The angle is adjusted so that the light 205d reflected by the polished sample 102, the processing surface 602a, is incident on the optical image detection / photographing means 206. The incident light 205d is phase-converted by the λ / 2 plate 210 or the λ / 4 plate 204, and converted into linearly polarized light by the polarizing plate 202b.

[0011] The polishing method of the present invention is characterized in that the polishing surface of a sealed object in which an object to be polished is sealed is cleaned, a solution film or a cleaning liquid film is formed on the polishing surface to make it mirror-finished, polarized light is irradiated onto the sealed object, and an optical image of the object to be polished on the polishing surface is observed.

[0012] The polishing method of the present invention uses an object to be polished as a reflecting surface, forms an optical image of the object to be polished on the reflecting surface, and performs the polishing process while simultaneously observing the object to be polished and the optical image.

[0013] The polishing method of the present invention is characterized in that the polishing surface of a sealed object in which an object to be polished is sealed is cleaned, a solution film is formed on the polishing surface, polarized light is irradiated from the side of the sealed object, and an optical image of the object to be polished on the polishing surface is observed from the top surface of the object to be polished. Effect of the Invention

[0014] By generating a light reflecting surface on the polished surface and illuminating it with polarized light, the polished state of the resin-encapsulated sample can be observed well and polishing can be performed with high precision. [Brief description of the drawings]

[0015] [Figure 1] FIG. 2 is an explanatory diagram of a method for preparing a polished sample in the polishing method of the present invention. [Diagram 2] FIG. 2 is an explanatory diagram of a method for preparing a polished sample in the polishing method of the present invention. [Diagram 3]FIG. 2 is an explanatory diagram of a method for preparing a polished sample in the polishing method of the present invention. [Figure 4] FIG. 2 is an explanatory diagram of a method for preparing a polished sample in the polishing method of the present invention. [Diagram 5] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 6] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 7] FIG. 2 is an explanatory diagram of the polishing method of the present invention. [Figure 8] FIG. 2 is an explanatory diagram of the polishing method of the present invention. [Figure 9] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 10] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 11] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 12] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 13] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 14] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 15] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 16] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 17] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 18] FIG. 1 is an explanatory diagram of a polishing apparatus according to the present invention. [Figure 19] FIG. 2 is an explanatory diagram of the polishing method of the present invention. [Figure 20] FIG. 2 is an explanatory diagram of the polishing method of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The present invention will be described below with reference to the drawings showing the embodiments. In the embodiments described in the specification and drawings, some parts may be omitted, enlarged, or reduced in size in order to facilitate understanding or to facilitate drawing. The embodiments of the present invention described in this specification and the drawings may be combined in part or in whole with each other.

[0017] Fig. 1 is an explanatory diagram of a method for preparing a polished sample in the polishing method of the present invention. Fig. 1(a) is a model diagram (schematic diagram) of a polished sample for explaining an embodiment of the present invention. Imagining a part of a semiconductor chip (object to be polished, polished sample) 102, an electrode terminal 101 is formed on one side of the semiconductor chip (object to be polished, polished sample) 102. In this embodiment, as one embodiment, cross-section polishing is performed along line AA', which is the center of the electrode terminal 101.

[0018] As shown in FIG. 1(a), a marking line 507 is formed on the polished sample 102. The marking line 507 is formed by marking the X-direction and Y-direction lines with a laser marker device (not shown). The marking line 507 is marked in the X-direction parallel to the cutting line AA', and in the Y-direction parallel to the electrode terminal 101. The marking lines in the X-direction and Y-direction are formed so as to intersect at right angles. When polishing the polished sample 102, the marking line 507 is monitored or detected, and the polishing operation is carried out using the marking line 507 as a reference.

[0019] After the polished sample 102 is cut into small pieces, a sample holding block 601 made of or configured with acrylic resin or the like is attached to the back surface or the like of the chip. The attachment is performed with an adhesive, a pressure sensitive adhesive, or double-sided tape.

[0020] The sample holding block 601 allows the polished sample 102 to be stably arranged by the polished sample sealing pipe 103, and also stably holds the polished sample 102 when the sealing resin is injected.

[0021] 1(b) is a perspective view of a polished sample sealing pipe 103 for producing a resin-sealed sample 105. Examples of the polished sample sealing pipe 103 include an acrylic pipe, a polycarbonate pipe, a stainless steel pipe, an aluminum pipe, and a vinyl chloride pipe.

[0022] The inner surface of the polished sample sealing pipe is preferably coated or formed with a resin such as fluororesin (fluorocarbon resin) that has excellent properties such as slipperiness, non-stickiness, chemical resistance, and low friction.

[0023] For example, polytetrafluoroethylene (Poly Tetra Fluoro Etylene) is an example. Polytetrafluoroethylene is a polymer of tetrafluoroethylene, a fluororesin (fluorocarbon resin) consisting only of fluorine atoms and carbon atoms. It is chemically stable and has excellent heat resistance and chemical resistance.

[0024] A polished sample 102 as an object to be polished is placed in a polished sample sealing pipe 103, and a sealing resin (molding resin) is injected or filled into the polished sample sealing pipe 103. The sealing resin (molding resin) is a liquid sealing material (thermosetting or ultraviolet curing resin, etc.), and the liquid sealing material is classified into thermosetting / thermoplastic, solvent / solventless, one-liquid / two-liquid type, etc. depending on the type of resin and formulation.

[0025] The main constituent materials of liquid sealing materials are acrylic resin and epoxy resin. If necessary, resins such as plastic polymers, and additives such as coupling agents, diluents, flame retardants, and defoamers are used.

[0026] The sealing resin (mold resin) is a resin whose main component is epoxy resin. Epoxy resin has a high refractive index, and the difference in refractive index between the polished surface 602 and air (refractive index 1.0) is large. Therefore, it is preferable because a good mirror surface (reflective surface) is formed or configured on the polished surface 602. It is preferable to use a light-transmitting epoxy resin with a refractive index of 1.55 or more and 1.7 or less as the sealing resin.

[0027] Another example is silicone resin. Compared to epoxy resin, silicone resin is slower in the rate at which the material deteriorates and its light transmittance decreases. While epoxy resin absorbs a maximum of several percent of light, silicone resin reduces this to less than 1%. This slows down the rate at which the resin deteriorates, making it easier to observe the object being polished by illuminating it with polarized light.

[0028] If necessary, a plastic polymer is mixed or added, such as polyamide resin, polyimide resin, urethane resin, silicone resin, or phenoxy resin.

[0029] The polished sample 102 is placed in the polished sample sealing pipe 103, and after the sealing resin is filled, the sealing resin is cured. The sealing resin can be cured by photocuring or heat curing.

[0030] 2 is an explanatory diagram showing how the resin-sealed sample 105 sealing the polished sample 102 is removed from the polished sample sealing pipe 103. Removal is easy. As shown in FIG. 2(a), the resin-sealed sample 105 is pressed from above the polished sample sealing pipe 103 with a cylindrical pusher 104. By pressing, the resin-sealed sample 105 is peeled off from the polished sample sealing pipe 103, and the polished sample 102 is taken out in a resin-sealed state as shown in FIG. 2(b).

[0031] Fig. 3(a) is an explanatory diagram showing a cross section of the resin-sealed sample 105 shown in Fig. 2(b) taken along line AA' in the vertical direction. Fig. 3(b) is an explanatory diagram showing a cross section of the resin-sealed sample 105 shown in Fig. 2(b) taken along line BB' in the vertical direction. As shown in Fig. 3, the polished sample 102 is sealed in a sealing resin.

[0032] Fig. 5 is a diagram showing one embodiment of a polishing apparatus. As shown in Fig. 5, the polishing apparatus of the present invention includes a polishing table 107 to which a polishing pad 506 having a polishing surface 505 is attached. A resin-encapsulated sample 105 is attached to the polishing sample holder 106.

[0033] 5, the polished sample holder 106 can be moved upward (U1) and downward (D1). By raising (U1) the polished sample holder 106, the polished sample 102 can be separated from the polishing surface 505. By lowering (D1) the polished sample holder 106, the polished sample 102 can be pressed against the polishing surface 505. In addition, by adjusting the amount of lowering (D1) or raising (U1) the polished sample holder 106, the pressure with which the polished sample 102 is pressed against the polishing surface 505 can be adjusted.

[0034] The polishing apparatus of the present invention includes a polishing head 106 for polishing a polishing sample 102 while pressing it against a polishing pad 506 on a polishing table 107, a polishing liquid supply nozzle 307 for supplying a polishing liquid (e.g., a slurry) to the polishing pad 506, a cleaning liquid supply nozzle 207 for supplying a cleaning liquid, and a polishing control unit (not shown) for controlling the polishing of the polishing sample 102.

[0035] The polishing table 107 is connected via a table shaft 108 to a table motor 509 disposed below it, and the polishing table 107 is rotated by this table motor 509 in the direction indicated by the arrow.

[0036] A polishing pad 506 is attached to a pad support surface 508 of the polishing table 107. The pad support surface 508 is disposed on the upper surface of the polishing table 107. The upper surface of the polishing pad 506 constitutes a polishing surface 505 for polishing the sample 102 to be polished.

[0037] 5, the polishing table 107 can move in an upward direction (U2) and a downward direction (D2). By lowering the polishing table 107 (in the D2 direction), the polished sample 102 can be moved away from the polished surface 505. By raising the polishing table 107 (in the U2 direction), the polished sample 102 can be pressed against the polished surface 505. In addition, by adjusting the amount of lowering (in the D1 direction) or raising (in the U1 direction) of the polishing table 107, the pressure with which the polished sample 102 is pressed against the polished surface 505 can be adjusted.

[0038] In addition, by forming a space between the resin-sealed sample 105 and the polished surface 505 and supplying a cleaning liquid such as water from the cleaning liquid supply nozzle 207 into the space, the polished surface of the resin-sealed sample 105 is cleaned and a coating made of water, cleaning liquid, oil, surfactant, etc. is formed on the polished surface, thereby generating a reflective surface (mirror surface, optical image surface) as described in Figures 7 and 8.

[0039] The polishing head 106 is configured to be rotatable in the direction of the arrow. By rotating the polishing head 106 at high speed, a cleaning liquid is supplied at high pressure to the polished surface of the polished sample 102, thereby cleaning the polished surface.

[0040] 6, the polishing head 106 is connected to the lower end of a polishing head shaft 301. The polishing head 106 is configured to hold the polished sample 102 on its lower surface by vacuum suction. The polishing head shaft 301 is configured to adjust the angle of the resin-encapsulated sample 105 by an angle adjustment unit (rotating unit, position setting unit) 302. The polishing head shaft 301 is configured to move up and down and left and right by the operation of a vertical and left and right movement mechanism.

[0041] The polishing head 106 and the polishing table 107 are rotated in the directions indicated by the arrows, and a polishing liquid (slurry) (not shown) is supplied from the polishing liquid supply nozzle 307 onto the polishing pad 506. In this state, the polishing head 106 presses the polishing sample 102 against the polishing surface 505 of the polishing pad 506. The surface of the polishing sample 102 is polished by the mechanical action of the abrasive grains contained in the polishing liquid, or by the mechanical action of the abrasive grains and the chemical action of the polishing liquid.

[0042] The polishing apparatus is equipped with an optical image detection / photography means 206a that detects an optical image from the side of the polished sample 102, and an optical image detection / photography means 206b that detects an optical image from above the polished sample 102. The optical image detection / photography means 206 corresponds to an observer's eye, a camera, a video camera, a photosensor, or other optical members / elements, an imaging device, visual sense, etc.

[0043] If necessary, an optical measuring instrument (thickness measuring device) (not shown) is provided to measure the thickness of the polished sample 102. The optical measuring instrument (not shown) includes a sensor module (not shown) that acquires an optical signal that changes according to the thickness of the polished sample 102, and a processing unit that determines the thickness from the optical signal.

[0044] The sensor module (not shown) is disposed inside the polishing table 107, and the processing section is connected to a polishing control section (not shown). The sensor module (not shown) includes a sensor head that guides light to the surface of the polished sample 102 and receives reflected light from the polished sample 102.

[0045] The sensor head rotates together with the polishing table 107 and acquires an optical signal of the polished sample 102 held by the polishing head 106. The sensor module (not shown) is connected to a processing unit, and the optical signal acquired by the sensor module (not shown) is sent to the processing unit.

[0046] 1 is a schematic cross-sectional view showing a polishing apparatus equipped with an optical measuring device (not shown). A polishing head shaft 301 is connected to a polishing head motor 509 via a connecting means such as a belt, and is rotated by the polishing head motor 509. The rotation of the polishing head shaft 301 rotates the polishing head 106 in the direction indicated by the arrow.

[0047] The rotation speed of the polishing head 106 differs between when polishing the polished sample 102 and when cleaning the polished surface of the polished sample 102. When cleaning the polished surface of the polished sample 102, the polishing head 106 rotates at high speed to clean the polished surface, form a film of moisture or the like on the polished surface, and remove moisture and abrasives from the polished surface. When cleaning the polished surface, cleaning water is supplied from a cleaning liquid supply nozzle 207. When forming a coating on the polished surface, cleaning water mixed with a surfactant is supplied from the cleaning liquid supply nozzle 207. Examples of the surfactant include soap and detergent.

[0048] When polishing, you can achieve a neat finish by starting with the coarsest number and then gradually changing to larger numbers. Start with #80 or #150, then #400 or #800, and finish with #2000, etc.

[0049] Numbers such as #1000 and #3000 indicate the size of the abrasive grain. Abrasive grains are abrasive materials, and by polishing starting with coarse grains with small numbers and gradually changing to larger numbers, the processed surface (polished surface, cut surface) 602 can be finished beautifully.

[0050] When the abrasive grain size is #400 or less, there are polishing scratches on the processed surface 602, and the observation condition of the image of the electrode terminal 101 on the processed surface (polished surface, cut surface) 602 is poor. When the abrasive grain size is #1000 or more, the polishing scratches on the processed surface (polished surface) 602 are reduced, and the observation condition of the image of the electrode terminal 101 on the processed surface (polished surface, cut surface) 602 is good.

[0051] In the present invention, the processed surface 602 of the polished sample 102 is used as a mirror surface, and the polishing process is carried out by observing the image of the electrode terminal 101 reflected on the processed surface 602 (mirror surface or reflective surface). Therefore, it is important to be able to observe the processed surface 602 when the abrasive grain number is still small. In the present invention, the processed surface 602 can be observed when the abrasive grain number is still small. In the present invention, if there are polishing scratches on the processed surface 602, the polishing scratches scatter light, and the observation condition of the image of the electrode terminal 101 reflected on the processed surface 602a becomes poor.

[0052] Cleaning water is supplied from the cleaning liquid supply nozzle 207. Moreover, a surfactant is mixed into the cleaning water and the cleaning water is supplied. The cleaning water washes away the abrasive grains on the machined surface 602. After cleaning, the cleaning water or a solution mixed with a surfactant forms a film on the polishing scratches, and the machined surface 602 becomes mirror-like or the polishing scratches become less noticeable. Therefore, even when the abrasive grains are small, the machined surface 602 becomes closer to a mirror surface, and the image of the electrode terminal 101 reflected in the mirror surface can be observed.

[0053] After washing away the abrasive grains from the processing surface 602, cleaning water or the like is supplied between the polishing table 107 and the processing surface 602, and the cleaning liquid or the like is filled or interposed between the polishing table 107 and the processing surface 602, thereby reducing polishing scratches on the processing surface 602. In addition, a light reflecting surface is generated due to the difference in refractive index between the cleaning liquid or the like and the polished sample 102. Therefore, the processing surface 602 becomes a mirror surface, and obstacles due to polishing scratches are reduced, making it possible to clearly observe the image of the electrode terminal 101 reflected on the processing surface 602a (mirror surface, optical image forming surface).

[0054] Instead of the cleaning solution, vaseline, lubricating oil, etc. may be applied. For example, colored vaseline is an example. White vaseline is a product made by bleaching and refining a mixture of hydrocarbons obtained from petroleum.

[0055] Vaseline is a bleached and refined mixture of hydrocarbons derived from petroleum, containing mostly branched-chain paraffins (isoparaffins) and alicyclic hydrocarbons (cycloparaffins, naphthenes). In other words, a viscous, light-transmitting material is applied or formed on the work surface 602.

[0056] Another example of a material that can be applied or formed on the processing surface 602 is oil. Oil is a hydrophobic chemical substance that is extracted from animals, plants, minerals, etc. and undergoes phase separation from water, and is usually a mixture of many compounds. In the narrow sense, it refers to fats and oils, but in the broad sense, oils other than fats and oils, such as petroleum, which is mainly composed of hydrocarbons, and essential oils, which are mainly composed of terpenoids, are also called oils.

[0057] As the polishing of the polished sample progresses and the polishing is performed with high abrasive grains, the polishing scratches disappear from the processed surface 602. In this case, an air layer can be placed between the polished sample 102 (resin-encapsulated sample 105) and the polished surface 505 by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction).

[0058] The air layer has a refractive index of 1.0, and the resin-sealed sample 105, which is made of epoxy resin or the like, has a refractive index of 1.55. Due to the difference in refractive index between the air layer and the resin-sealed sample 105 and the polished sample 102, a light reflecting surface is generated.

[0059] Therefore, the processed surface 602 becomes a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be clearly observed. The water or solution adhering to the processed surface 602 can be removed by centrifugal force by rotating the polishing head 106 at high speed.

[0060] 3, the sealing resin is raised at the location indicated by the arrow on the upper part of the resin-sealed sample 105. This is because the sealing resin adheres to the periphery of the polished sample sealing pipe.

[0061] The resin-sealed sample 105 is first polished at the portion indicated by the arrow in Fig. 3. As shown in Fig. 6(a), the resin-sealed sample 105 is held by a polishing head 106. The polishing head 106 is attached to a polishing head shaft 301, and the polishing angle is adjusted, set, or changed by an angle adjustment unit 302. In addition, the polishing head 106 rotates.

[0062] The polishing table 107 rotates, and a polishing liquid (slurry) (not shown) is supplied from a polishing liquid supply nozzle 307. The resin-encapsulated sample 105 is pressed against the polishing surface 505, thereby polishing the portion indicated by the arrow in Fig. 3. The portion indicated by the arrow after polishing is shown in Fig. 4.

[0063] Fig. 4(a) is a side view of the resin-sealed sample 105, and Fig. 4(b) is a top view of the resin-sealed sample 105. After polishing the portion indicated by the arrow in Fig. 3, the processed surface 602b shown in Fig. 4(a) is polished and processed into a mirror surface.

[0064] 6(b), the resin-sealed sample 105 is turned upside down and attached to the polishing head 106. The polishing head 106 or the polishing head shaft 301 is moved to position the processing surface 602a of the resin-sealed sample 105 so that it contacts the polishing surface 505, and the polishing surface 602a is processed. In addition, the polishing head 106 rotates.

[0065] The polishing table 107 rotates, and a polishing liquid (slurry) (not shown) is supplied from a polishing liquid supply nozzle 307. The resin-encapsulated sample 105 is pressed against the polishing surface 505, whereby the processed surface 602a is polished.

[0066] 5(b), the processed state of the electrode terminal 101 is observed from the side of the resin-sealed sample 105 by the optical image detection / photography means 206a. The optical image detection / photography means 206a may be the observer's vision (eyes) or an imaging / display device consisting of a camera, a monitor, etc.

[0067] Also, an image of the electrode terminal 101 on the bottom surface (processed surface 602b) of the resin-sealed sample 105 is observed from the top surface of the resin-sealed sample 105 by the optical image detection / photographing means 206b. As shown in FIG. 1 and FIG. 4, in the embodiment of the present invention, cross-section polishing is performed at CC′, which is the center of electrode terminal 101, for explanation.

[0068] The polishing process of the polished sample 102 must be performed while knowing the actual dimensions or relative dimensions of the polished sample 102. Therefore, the height H and width W of the polished sample 102 must be measured.

[0069] As shown in Fig. 4 and other figures, the resin-sealed sample 105 has a cylindrical shape. The H2 direction is the planar direction of the cylinder, so the length H2 can be measured. On the other hand, the length W2 cannot be measured because it is in the cylindrical direction and has a curved surface, as shown in Fig. 4(b).

[0070] However, if the length of H2 can be measured, the relative length of W2 can be determined from the length of H2. Also, if the length H1, which is determined as the length H1 formed by the laser marker device, is known, the actual length of H2 can be determined from H1.

[0071] If the length W1, which is determined as the length W1 formed by the laser marker device, is known, the actual length from W1 to W2 can be determined. The lengths H2 and W2 can be measured by the optical image detection / photographing means 206. The length A of the electrode terminal 101 can be determined from the length H2 or H1. Since the resin-sealed sample 105 is cylindrical and the cylindrical resin-sealed sample 105 is surrounded by air, the image is curved when the polished sample 102 is observed.

[0072] As shown in FIG. 12, when a rectangular container is filled with the solution and a resin-sealed sample 105 is immersed in the solution, the difference in refractive index between the resin constituting the resin-sealed sample 105 and the solution disappears or becomes small, and the actual dimensions of W (W1, W2), H (H1, H2), and A in FIG. 4 can be measured or understood.

[0073] Epoxy resin or acrylic resin is used as the sealing resin for the sealing sample 105. The refractive index of epoxy resin is 1.55 to 1.61, and the refractive index of acrylic is generally 1.49. Therefore, it is preferable to use a solution with a refractive index close to that of the sealing resin to be used.

[0074] Examples of the high refractive index solution 200 include edible oil, 2-propanol, methyl salicylate (refractive index 1.538), ethylene glycol (refractive index 1.431), carbon tetrachloride (refractive index 1.46), benzene (refractive index 1.50), and paraffin oil (refractive index 1.48). The refractive index of water is 1.33.

[0075] The container 109 is made of soda glass or light lime glass, and is filled with a high refractive index solution 200 (optical coupling liquid), and the resin-sealed sample 105 is immersed in the high refractive index solution 200. A light absorbing film such as black paint is formed or placed on the outer or inner surfaces (Sa, Sb, Sc, Sd) of the container 109 to absorb stray light.

[0076] Examples of black paints and light absorbing films include organic materials such as acrylic resins that contain carbon, or similar organic materials with black beads or the like dispersed therein. Other examples include resin vehicles that contain cyanine black, a phthalocyanine pigment with high electrical insulation properties, and polarizing films.

[0077] By forming a black paint or a light absorbing film on the outer or inner surface (Sa, Sb, Sc, Sd) of the container 109, stray light and reflected light at the interface of the container 109 are reduced, making it possible to satisfactorily observe the polished sample or the resin-sealed sample 105. In particular, when using polarized light, it is effective to configure the absorption axis of the polarizing film 202 and the absorption axis of the polarizing film placed on the outer surface of the container 109 etc. to be perpendicular to each other.

[0078] 12, the influence of the cylindrical shape of the resin-sealed sample 105 is eliminated, and the actual dimensions of W (W1, W2), H (H1, H2), and A in FIG. 4 can be measured or grasped.

[0079] 7 is an explanatory diagram of the polishing method of the present invention. As an embodiment, it shows a method of polishing the cross section of the electrode terminal 101 along the line CC'. The polishing device has been explained in Figs. 5 and 6, so its explanation is omitted.

[0080] 7, the photographed image 308a is an image taken when viewed from the side direction of the resin-sealed sample 105. The photographed image 308b is an image taken when the processed surface 602b of the resin-sealed sample 105 is viewed.

[0081] The processed surface 602a of the resin-sealed sample 105 is polished as shown in Fig. 6(b). As shown in Fig. 7, the polishing process proceeds in the direction of the arrow from the processed surface 602a. The length of the electrode terminal 101 is A. At the start of the polishing process, the distance between the electrode terminal 101 in the photographed image 308a and the reflected image 208 of the electrode terminal 101 in the photographed image 308b is D, as shown in Fig. 7(a). As the polishing process proceeds, the distance D becomes shorter.

[0082] 7(b), the distance D is 0. At this time, the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 appear to be connected, and the total length of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 is 2A.

[0083] When polishing is further performed, the length of electrode terminal 101 plus the reflected image 208 of electrode terminal 101 becomes A, as shown in Fig. 7(c). Fig. 7(c) shows the state where electrode terminal 101 has been polished by 1 / 2 the distance. The cross-section of electrode terminal 101 is polished at CC'. Therefore, when polishing is completed at Fig. 7(c), the cross-section of electrode terminal 101 will have been polished at the 1 / 2 position (center).

[0084] As described above, by observing or understanding the image of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 and carrying out the polishing process, a polished cross-sectional sample of the center portion of the electrode terminal 101 can be obtained. As shown in FIG. 7(d), by further performing polishing from FIG. 7(c), a polished sample of the portion other than the electrode terminal 101 can be obtained.

[0085] Fig. 7 is an explanatory diagram of a case where the polished sample 102 is arranged vertically to the resin-sealed sample 105. Fig. 8 is an explanatory diagram of a case where the polished sample 102 is arranged obliquely to the resin-sealed sample 105.

[0086] The case of Fig. 8 is similar to Fig. 7. The processing surface 602a of the resin-sealed sample 105 is polished as shown in Fig. 6(b). As shown in Fig. 8(a), the polishing proceeds from the processing surface 602a in the direction of the arrow.

[0087] 8(a), the distance between electrode terminal 101a and reflected image 208a of electrode terminal 101 is D1, and the distance between electrode terminal 101b and reflected image 208b of electrode terminal 101 is D2. Therefore, D2>D1. Therefore, it is necessary to shorten the distance D2 so that electrode terminal 101 and reflected image 208 of electrode terminal 101 have a linear relationship as shown in FIG.

[0088] Therefore, the angle of the angle adjustment portion 302 of the polishing apparatus of the present invention shown in FIG. 6 is adjusted, and the distance D2 is shortened compared to D1 as shown in FIG. 8(a)->FIG. 8(b)->FIG. 8(c)->FIG. 8(d), and polishing processing is performed so that the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 have a linear relationship as shown in FIG. 7.

[0089] In Fig. 8(c), the electrode terminal 101b and the reflected image 208b of the electrode terminal 101 form a straight line. In Fig. 8(d), similarly to Fig. 7(c), when the polishing process is completed in Fig. 8(d), the cross-section of the electrode terminal 101 is polished at the 1 / 2 position (center).

[0090] As shown in FIG. 8(d), the length obtained by adding the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 is A. FIG. 7(c) shows a state where the electrode terminal 101 is polished to a distance of 1 / 2. The electrode terminal 101 is in a state of being polished in cross section along CC'. Therefore, when the polishing process is completed in FIG. 8(d), it means that the electrode terminal 101 has been polished in cross section at the 1 / 2 position (central part).

[0091] As described above, by observing or grasping the image of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 and performing the polishing process, a cross-section polished sample of the central part of the electrode terminal 101 can be obtained.

[0092] The electrode terminal 101 etc. described in FIGS. 7 and 8 are illuminated by the light irradiator 201 and detected or observed by the optical image detection / photographing means 206. The light emitted from the light irradiator 201 is polarized light, and the polarized light is irradiated onto the polished sample 102. Also, wave plates (λ / 2 plate 210, λ / 4 plate 204) are used. The 1 / 2 wavelength plate 210 rotates the polarization direction of linearly polarized light. The 1 / 4 wavelength plate 204 converts linearly polarized light into circularly polarized light.

[0093] The wave plate functions by shifting the phase between two perpendicular polarization components of light waves. As a typical wave plate, there is a birefringent crystal with the direction of the optical axis and the thickness determined. When the direction of the crystal is selected so that the optical axis of the crystal is parallel to the surface of the plate and the crystal is cut into a plate, two axes, the ordinary axis with a refractive index of no and the extraordinary axis with a refractive index of ne, are obtained in the cut plane.

[0094] The ordinary axis is perpendicular to the optical axis, and the extraordinary axis is parallel to the optical axis. In the case of a light wave incident perpendicularly to the plate, the polarization component along the ordinary axis travels through the crystal at a speed of vo = c / no, while the polarization component along the extraordinary axis moves at a speed of ve = c / ne. When the incident light exits the crystal, a phase difference occurs between the two components. When ne < no as in calcite, the extraordinary axis is called the fast axis and the ordinary axis is called the slow axis. When ne > no, the fast axis and the slow axis are reversed.

[0095] Half-wave retarders (λ / 2 plates) give a phase difference of π (=λ / 2) to the electric field oscillation direction (polarization plane) of incident light. When the polarization plane of the incident light is incident at an azimuth angle of θ° to the fast axis (or slow axis) of the wave plate, the oscillation direction can be rotated by (2×θ°).

[0096] Therefore, the maximum rotation angle (=90°) is obtained when the light is incident at an azimuth angle of 45°. If you wish to change the direction of the polarization plane of the irradiated light, you can do so using only the half-wave plate, without physically rotating the light. When circularly polarized light is incident on a half-wave plate, it can reverse the direction of rotation of the polarized light.

[0097] A half-wave plate outputs light with a phase difference of π (= λ / 2) between the two perpendicularly polarized components of the incident light. When the polarization direction of the incident light is at an azimuth angle of θ with respect to the fast axis (or slow axis) of the wave plate, the polarization direction can be rotated by 2θ before being output. In other words, the maximum rotation angle is 90° when the light is incident at an azimuth angle of 45°. When the polarization components of the incident light are circularly or elliptically polarized, their direction can be reversed by passing it through a half-wave plate.

[0098] Quarter-wave retarders (λ / 4 plates) give a phase difference of λ / 4 to the electric field vibration direction (polarization plane) of incident light. When the polarization plane of the incident light is incident at an azimuth angle of 45° to the fast axis (or slow axis) of the wave plate, it can change linearly polarized light to circularly polarized light. It can also reversibly change circularly polarized light to linearly polarized light. When light is incident at an azimuth angle other than 45°, it becomes elliptically polarized light. A quarter wave plate can be paired with a polarizing filter to create an optical isolator, which is used in the present invention to eliminate unwanted back reflections and glare.

[0099] A quarter-wave plate outputs light with a phase difference of π / 2 (=λ / 4) between the two perpendicularly polarized components of the incident light. If the polarization direction of the incident light is at an azimuth angle other than 45° to the fast (or slow) axis of the wave plate, the output light will be elliptically polarized, and if it is at an azimuth angle of 45°, the output light will be circularly polarized.

[0100] When the polarization axis of the incident light is at 0° to the fast or slow axis, the polarization does not change and the outgoing light is also linearly polarized, when it is greater than 0° but less than 45° it becomes elliptically polarized, and when it is 45° it becomes circularly polarized. It is also possible to reversibly change circularly polarized or elliptically polarized incident light to linearly polarized light for emission. 9 is an explanatory diagram of the polishing apparatus of the present invention. The polished sample 102 in the resin-sealed sample 105 is illuminated with light emitted from a light irradiator 201.

[0101] Examples of the light irradiator 201 include a monochromatic laser device, a white laser device, a xenon lamp irradiator, a tungsten lamp irradiator, an LED irradiator, a backlight lighting device, and a fiber irradiator.

[0102] Since the resin-sealed sample 105 has a cylindrical shape, the light from the light irradiator 201 is diffusely reflected inside the resin-sealed sample 105, generating stray light. As a result, the illumination state of the polished sample 102 generates a distribution of light intensity, making it difficult to observe the state of the electrode terminals 101 of the polished sample 102 and the polishing state.

[0103] 4(a) of the present invention, a polarizing plate (polarizing film, polarizing sheet) 202a is disposed on the light emission side of the light irradiator 201. Light 205a from the light irradiator 201 passes through the polarizing plate 202a and becomes polarized light 205b, and the light 205b illuminates the polished sample 102.

[0104] In the figure, as an example, vertically linearly polarized light is shown with an up-down arrow, and horizontally linearly polarized light is shown with a left-right arrow. It goes without saying that the polarization direction is not limited to the up-down or left-right directions, but can be freely set and changed to an oblique direction, etc., by changing the angle of the polarization axis of the polarizing plate.

[0105] As shown in FIG. 9(c), the polarizing plate 202, the ¼ wavelength plate (λ / 4 plate) 204, and the ½ wavelength plate (λ / 2 plate) 210 are configured so that they can be arbitrarily adjusted or set at a positive angle (+θ) or a negative angle (-θ) relative to 0° (DEG.).

[0106] The quarter-wave plate 204 outputs the incident light with a phase difference of π / 2 (=λ / 4) between the two perpendicularly polarized components. If the polarization direction of the incident light is incident at an azimuth angle other than 45° with respect to the fast axis (or slow axis) of the wave plate, the output light becomes elliptically polarized light, and if it is incident at an azimuth angle of 45°, the output light becomes circularly polarized light.

[0107] 9(c), the elliptically polarized light to the circularly polarized light can be changed by rotating the fast axis (or the slow axis) of the quarter-wave plate 204. By changing the state of the elliptically polarized light to the circularly polarized light, the polished sample 102 can be adjusted so that it is most easily observed.

[0108] A half-wave plate outputs light with a phase difference of π (= λ / 2) between the two perpendicularly polarized components of the incident light. When the polarization direction of the incident light is at an azimuth angle of θ with respect to the fast axis (or slow axis) of the wave plate, the polarization direction can be rotated by 2θ before outputting. In other words, the maximum rotation angle is 90° when the light is incident at an azimuth angle of 45°.

[0109] When the polarized component of the incident light is circularly polarized or elliptically polarized, its direction can be reversed by passing it through a half-wave plate. The elliptically polarized light to circularly polarized light can be changed by rotating the fast axis (or slow axis) of the half-wave plate 204. By rotating the polarization direction by 2θ, the state of elliptically polarized light to circularly polarized light can be changed, and the polished sample 102 can be adjusted so that it is most easily observed.

[0110] 9(a), the light 205b becomes reflected light 205c on the polished sample 102. A part of the light 205c reflected on the polished sample 102 becomes stray light and is diffusely reflected within the resin-sealed sample 105. In addition, the phase axis of the light 205c rotates.

[0111] 9(a), the λ / 2 plate 210 is disposed and set so that light is incident at an azimuth angle of approximately 45°. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are disposed perpendicular to each other.

[0112] The reflected light 205c is rotated by 90° by the λ / 2 plate 210. Therefore, the reflected light 205c passes through the polarizing plate 202b and becomes reflected light 205d. The reflected light 205d is detected by the optical image detection / photographing means 206, and the polished state of the polished sample 102 is observed.

[0113] Optical image detection and photography means are optical detection means, etc., and include cameras, photography devices, and imaging devices, as well as light receiving members and light receiving elements. Also, display devices such as LCDs and organic EL displays, monitors, and combinations of photography devices and these display devices are also included. Also, grasping, recognizing, and evaluating objects by human vision or observation are included.

[0114] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the reflected light 205c is rotated by 90° by the λ / 2 plate 210, so that the stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b. The stray light is out of phase and does not match the polarization axis of the polarizing plate 202b.

[0115] Therefore, the amount of stray light that reaches the optical image detection / photographing means 206 is reduced, and the polishing state can be observed well. In order to obtain the best observation, the angle θ of the phase axis of the λ / 2 plate 210 (λ / 4 plate 204) is adjusted or set as shown in FIG. 9(c).

[0116] It goes without saying that the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form an integrated structure. The above also applies to the other embodiments of the present invention.

[0117] Fig. 9(b) is a configuration diagram and explanatory diagram of a polishing device in another embodiment of the present invention. In Fig. 9(b), a λ / 4 plate 204a is arranged on the light exit side of a polarizing plate 202a. A λ / 4 plate 204b is arranged on the light entrance side of a polarizing plate 202b.

[0118] The quarter-wave plate is disposed at approximately 45° (DEG.) with respect to the polarization axis of the polarizing plate 202. The quarter-wave plate outputs the incident light by giving a phase difference of π / 2 (=λ / 4) between the two perpendicularly polarized components of the incident light. When the polarization direction of the incident light is at an azimuth angle of 45°, the light becomes circularly polarized.

[0119] When circularly polarized light is reflected, its direction of rotation is reversed. The light transmitted through a circular polarizer is reversed at the reflecting surface (right rotation -> left rotation). This is because the direction of rotation of the polarized light remains the same, but the direction of the light is reversed. When this light passes through the quarter-wave plate, it returns to linearly polarized light, but the direction of the polarization plane changes by 90° from the outward path.

[0120] When the polarization axis of the incident light is at 0° to the fast or slow axis, the polarization does not change and the outgoing light is also linearly polarized, when it is greater than 0° but less than 45° it becomes elliptically polarized, and when it is 45° it becomes circularly polarized. It is also possible to reversibly change circularly polarized or elliptically polarized incident light to linearly polarized light for emission.

[0121] In the embodiment of the present invention, the rotation direction of the circularly polarized light is indicated by a rotating arrow in Fig. 9 etc. The λ / 4 plate 204 is arranged and set so that the light is incident at an azimuth angle of approximately 45°. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are arranged perpendicular to each other.

[0122] Light 205a emitted from light irradiator 201 becomes linearly polarized (up and down) by polarizing plate 202a. The linearly polarized light becomes circularly polarized light 205b by λ / 4 plate 204a. When circularly polarized light 205b is reflected by polished sample 102, it becomes circularly polarized light 205c, which has a rotation direction opposite to that of circularly polarized light 205b. Circularly polarized light 205c is converted into linearly polarized light by λ / 4 plate 204b. The polarization axis of linearly polarized light 205d is perpendicular to the polarization axis of the polarized light that exited polarizing plate 202a. Therefore, the light becomes linearly polarized after passing through λ / 4 plate 204b, and passes through polarizing plate 202b. The linearly polarized light 205d is detected by the optical image detection / photographing means 206, and the polished state of the polished sample 102 is observed.

[0123] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the λ / 4 plate 204b rotates the direction of rotation of the circularly polarized light, which is the reflected light 205c, in the opposite direction, so that the polarizing plate 202b blocks stray light in the resin-sealed sample 105. Therefore, the amount of stray light that reaches the optical image detection / photographing means 206 is reduced, and the polishing state can be observed well.

[0124] In Fig. 9, light is irradiated from a light irradiator 201 in a vertical direction onto the polished sample 102, and the light reflected by the polished sample 102 is detected by an optical image detection and photography means 206 arranged in the vertical direction. However, the present invention is not limited to this.

[0125] As shown in FIG. 10, a configuration may be adopted in which light is irradiated from a light irradiator 201 obliquely onto the polished sample 102, and the light reflected by the polished sample 102 is detected by an optical image detection / photography means 206 arranged in an oblique direction.

[0126] In FIG. 9(a), the polarizing plates 202a and 202b may be combined into one polarizing plate 202, and the polarizing axis of the polarizing plate 202 may be configured to be the same for the incident light 205a and the outgoing light 205c.

[0127] 9(a), the λ / 2 plate 210 may be disposed on the light exit side of the polarizing plate 202a. Also, in FIG. 9(a), the λ / 2 plate 210 may be disposed on the light exit side of the polarizing plate 202a, and the λ / 2 plate 210 on the light entrance side of the polarizing plate 202b may be omitted.

[0128] In FIG. 9(b), the λ / 4 plate 204a and the λ / 4 plate 204b may be combined into one λ / 4 plate 204, and the phase (optical) axis of the polarizing λ / 4 plate 204 may be configured in the same direction with respect to the incoming light 205a and the outgoing light 205c.

[0129] In FIG. 9B, the polarizing plates 202a and 202b may be combined into one polarizing plate 202, and the polarizing axis of the polarizing plate 202 may be configured to be the same for the incident light 205a and the outgoing light 205c. In FIG. 9(b), a λ / 4 plate 204 may be disposed on either the light exit side of the polarizing plate 202a or the light entrance side of the polarizing plate 202b. It goes without saying that the above points can also be applied to FIG. 10 and other drawings of the present invention and embodiments of the specification.

[0130] In the embodiment of Fig. 13(a), light 205d is emitted from the processing surface 602b, and in the embodiment of Fig. 13(b), light 205a is incident on the processing surface 602b. The processing surface 602b is mirror-finished in the embodiment of Fig. 6 etc. so that no hindrance occurs to the emission of light 205d and the incidence of light 205a.

[0131] 10 is placed or installed on a moving (rotating) stage 603a. The moving (rotating) stage 603a moves in the X-axis direction and the Y-axis direction, and also rotates the angle of light emitted from the light irradiator 201.

[0132] The optical image detection / photographing means 206 is placed or installed on a moving (rotating) stage 603b. The moving (rotating) stage 603a moves in the X-axis direction and the Y-axis direction, and also rotates the angle so that the reflected light 205d enters the optical image detection / photographing means 206.

[0133] The light irradiator 201a is placed (mounted, implemented) on a moving (rotating) stage 603, and adjusts, sets, or changes the angle of light incident on the resin-sealed sample 105. The optical image detection / photographing means 206 is placed (mounted, implemented) on the moving (rotating) stage 603, and adjusts, sets, or changes the angle of light emitted from the resin-sealed sample 105 to a satisfactory incident angle. In FIG. 10(a), similarly to FIG. 9(a), the polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are arranged perpendicular to each other.

[0134] 10(a), the polarizers 202a and 202b are arranged, set, and configured so that the optical axis of the light 205d is incident at an azimuth angle of approximately 45° with respect to the optical axis of the λ / 2 plate 210. The polarizers 202a and 202b are arranged so that their polarization axes are perpendicular to each other.

[0135] The polarization axis of the reflected light 205c is rotated by 90° by the λ / 2 plate 210. Therefore, the reflected light 205c passes through the polarizing plate 202b and becomes reflected light 205d. The reflected light 205d is detected by the optical image detection / photographing means 206, and the polished state of the polished sample 102 is observed.

[0136] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the reflected light 205c is rotated by 90° by the λ / 2 plate 210, so that stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b.

[0137] The stray light generated in the resin-sealed sample 105 is out of phase and does not coincide with the polarization axis of the polarizing plate 202b. Therefore, the amount of stray light that reaches the optical image detection / capture means 206 is reduced, the contrast of the optical image is improved, and the polishing state can be observed well.

[0138] 9(c), the angle θ of the phase axis of the λ / 2 plate 210 (λ / 4 plate 204) is adjusted or set while monitoring the image captured by the optical image detection / capturing means 206.

[0139] It goes without saying that the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form an integrated structure. By bonding the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) together, the number of interfaces where the polarizing plate 202, the λ / 2 plate, etc. come into contact with air is reduced, improving the light transmittance. In FIG. 10(a), a configuration in which at least one of the λ / 2 plate 210 and the polarizing plate 202b is omitted is also illustrated. The above also applies to other embodiments of the present invention.

[0140] Fig. 10(b) is a configuration diagram and an explanatory diagram of a polishing device in another embodiment of the present invention. In Fig. 10(b), a λ / 4 plate 204a is arranged on the light exit side of a polarizing plate 202a. A λ / 4 plate 204b is arranged on the light entrance side of a polarizing plate 202b.

[0141] The quarter-wave plate is disposed at approximately 45° (DEG.) with respect to the polarization axis of the polarizing plate 202. The quarter-wave plate appropriately adjusts the display contrast and the like by changing the angle θ as shown in FIG. 9(c). The quarter-wave plate outputs the light by giving a phase difference of π / 2 (=λ / 4) between the two perpendicularly polarized components of the incident light. When the polarization direction of the incident light is at an azimuth angle of 45°, it ideally becomes circularly polarized light.

[0142] When circularly polarized light is reflected, its direction of rotation is reversed. The light transmitted through the circular polarizer is reversed at the reflecting surface (right rotation -> left rotation). When this light passes through the quarter-wave plate, it returns to linearly polarized light, but the direction of the polarization plane changes by 90° from the outward path.

[0143] When the polarization axis of the incident light is at 0° to the fast or slow axis, the polarization does not change. The outgoing light is also linearly polarized, when it is greater than 0° but less than 45° it is elliptically polarized, and when it is 45° it is circularly polarized. Therefore, it is possible to change the incoming circularly or elliptically polarized light to linearly polarized light before it is emitted. The λ / 4 plate 204 is disposed and set so that light is incident at an azimuth angle of approximately 45°. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are disposed perpendicular to each other. Light 205a emitted from light irradiator 201 passes through polarizing plate 202a and becomes linearly polarized light (vertical direction). The linearly polarized light becomes circularly polarized light 205b by λ / 4 plate 204a.

[0144] When the circularly polarized light 205b is reflected by the polished sample 102, it becomes circularly polarized light 205c, which rotates in the opposite direction to the circularly polarized light 205b. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204b. The polarization axis of the linearly polarized light 205d is perpendicular to the polarization axis of the polarized light that exited the polarizing plate 202a. The light becomes linearly polarized after passing through the λ / 4 plate 204b, and passes through the polarizing plate 202b. The linearly polarized light 205d is detected by the optical image detection / photographing means 206, and the polished state of the polished sample 102 is observed.

[0145] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the direction of rotation of the circularly polarized light, which is the reflected light 205c, is rotated in the opposite direction by the λ / 4 plate 204b, so that stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b and does not enter the optical image detection / photography means 206, or is reduced. Therefore, the amount of stray light that reaches the optical image detection / photography means 206 is reduced, and the polishing state can be observed well.

[0146] In Figures 9(a), 9(b), 10(a), and 10(b), it has been explained that light from a light irradiator is irradiated onto the electrode terminal 101, and the electrode terminal 101 or its vicinity is observed to observe the polishing state.

[0147] As shown in Figures 10(c) and 10(d), by moving the moving (rotating) stage 603 to change or adjust the direction of light irradiation onto the polished sample 102 and the light detection direction of the optical image detection / photography means 206, the reflected image 208 can be observed, and the reflected image 208 and the electrode terminal 101 described in Figures 7 and 8 can be observed simultaneously.

[0148] 10(c) and 10(d), light is incident from the side of the resin-sealed sample 105 to illuminate the polished sample 102, and light is emitted from the side of the resin-sealed sample 105 to be detected and observed by the optical image detection / photographing means 206.

[0149] 10(c), light 205a emitted from the light irradiator 201 is polarized by the polarizing plate 202a, and the polarized light 205b is incident on the side of the resin-sealed sample 105. The polarized light 205b is reflected by the polished sample 102. The polished sample 102 is illuminated by the polarized light 205, and a reflected image 208 of the electrode terminal 101 is generated on the processing surface 602a.

[0150] The reflected image 208 becomes clearer as the mirror finish of the machined surface 602 progresses. When the abrasive grain size is #400 or less, there are polishing scratches on the machined surface 602a, and the observation condition of the image of the electrode terminal 101 on the machined surface 602a is poor. When the abrasive grain size is #1000 or more, the polishing scratches on the machined surface 602a decrease, and the observation condition of the image of the electrode terminal 101 on the machined surface 602 becomes good.

[0151] The present invention is characterized in that even if the processed surface 602a has scratches, a film of water or the like generated during polishing or the like is generated on the processed surface 602a, and the scratches are filled with water, cleaning liquid, oil, Vaseline, or the like, making the processed surface 602a closer to a mirror surface, or by reducing the effect of the scratches, the processed surface 602a can be used as a mirror to generate a reflected image 208 (optical image). Therefore, the processed surface 602a can be observed well even when the abrasive grain number (#) is small.

[0152] As the target cross-sectional polishing position is approached, the abrasive grain number (#) becomes larger, polishing scratches on the processing surface 602a are reduced, and further, by generating a coating such as , the processing surface 602a is improved in mirror finish, thereby achieving polishing with good processing position accuracy.

[0153] When the polishing position is near the target position, the processed surface 602a is mirror-finished. The processed surface 602a is cleaned, and the polishing head 106 is raised in the U1 direction in FIG. 5(b) and rotated at high speed to remove water or the like from the processed surface 602a or to form a thin film of water or the like. The processed surface 602a of the resin-encapsulated sample 105 is brought into contact with an air layer.

[0154] The refractive index of the epoxy resin of the resin-sealed sample 105 is approximately 1.55, and the refractive index of air is 1.0. Alternatively, the refractive index of the water of the water film on the processed surface 602a of the resin-sealed sample 105 is approximately 1.33, and the refractive index of air is 1.0. The water film or the like reduces the step of the polishing scratches or makes them less noticeable. Since the water film or the like is thin, even if there is a slight difference in the refractive index of the sealing resin, the reflection image of the polished sample or the like is formed well. Therefore, the processed surface 602a can reflect light well, and a good reflection image 208 is generated. Therefore, the reflection image of the polishing position can be observed well, and polishing with good processing position accuracy can be realized.

[0155] The polarizing plate 202a and the polarizing plate 202b are disposed, set, and configured so that the light is incident at an azimuth angle of approximately 45° with respect to the polarization axis of the λ / 2 plate 210. The polarizing plate 202a and the polarizing plate 202b are disposed so that their polarization axes are perpendicular to each other.

[0156] The polarization axis of the reflected light 205d is rotated by 90° by the λ / 2 plate 210. Therefore, the reflected light 205d passes through the polarizing plate 202b. The reflected light 205e is detected by the optical image detection / photographing means 206, and the polished state of the polished sample 102 is observed.

[0157] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the reflected light 205e is rotated by 90° by the λ / 2 plate 210, so that stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b.

[0158] The stray light generated in the resin-encapsulated sample 105 is not in phase with the light, or does not coincide with the polarization axis of the polarizing plate 202b. Therefore, the amount of stray light that reaches the optical image detection / photographing means 206 is reduced, the contrast of the optical image is improved, and the polishing state can be observed well.

[0159] 9(c), the angle θ of the phase axis of the λ / 2 plate 210 is adjusted or set while monitoring the image captured by the optical image detection / capture means 206.

[0160] It goes without saying that the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form an integrated structure. By bonding the polarizing plate 202 and the λ / 2 plate 210 together, the number of interfaces where the polarizing plate 202, the λ / 2 plate, etc. come into contact with air is reduced, improving the light transmittance.

[0161] Fig. 10(d) is a configuration diagram and an explanatory diagram of a polishing device in another embodiment of the present invention. In Fig. 10(d), a λ / 4 plate 204a is arranged on the light exit side of a polarizing plate 202a. A λ / 4 plate 204b is arranged on the light entrance side of a polarizing plate 202b.

[0162] In FIG. 10( d ), light is incident from the side of the resin-sealed sample 105 to illuminate the polished sample 102 , and light is emitted from the side of the resin-sealed sample 105 to be detected and observed by the optical image detection / photographing means 206 .

[0163] 10(d), light 205a emitted from the light irradiator 201 is polarized by the polarizing plate 202a, and the polarized light 205b is incident on the side of the resin-sealed sample 105. The polarized light 205b is reflected by the polished sample 102. The polished sample 102 is illuminated by the polarized light 205, and a reflected image 208 of the electrode terminal 101 is generated on the processed surface 602a.

[0164] The quarter-wave plate is positioned at 45° to the polarization axis of the polarizing plate 202. When circularly polarized light is reflected, its direction of rotation is reversed. The light transmitted through the circular polarizing plate is reversed on the reflecting surface (right rotation -> left rotation). When this light passes through the previous quarter-wave plate, it returns to linearly polarized light. The direction of the polarization plane changes by 90° relative to the outward path. Therefore, it is possible to convert circularly polarized or elliptically polarized incident light into linearly polarized light before outputting it. The λ / 4 plate 204 is disposed and set so that light is incident at an azimuth angle of approximately 45°. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are disposed perpendicular to each other. Light 205a emitted from light irradiator 201 passes through polarizing plate 202a and becomes linearly polarized light (vertical direction). The linearly polarized light becomes circularly polarized light 205b by λ / 4 plate 204a.

[0165] When the circularly polarized light 205b is reflected by the polished sample 102, it becomes circularly polarized light 205c, which has a rotation direction opposite to that of the circularly polarized light 205b. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204b. After passing through the λ / 4 plate 204b, the light becomes linearly polarized light and passes through the polarizing plate 202b. The linearly polarized light 205d is detected by the optical image detection / photography means 206, and the polished state of the polished sample 102 is observed.

[0166] The reflected image 208 becomes clearer as the mirror finish of the processed surface 602 progresses. If there are polishing scratches on the processed surface 602a, the clarity decreases. By cleaning the processed surface 602a and forming a coating of cleaning water or the like on the processed surface 602a, the processed surface 602a can be made mirror-finished or the light reflectance can be improved.

[0167] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the λ / 4 plate 204b rotates the direction of rotation of the circularly polarized light, which is the reflected light 205c, in the opposite direction, so that the polarizing plate 202b blocks stray light in the resin-sealed sample 105. Therefore, the amount of stray light that reaches the optical image detection / photographing means 206 is reduced, and the polishing state can be observed well.

[0168] 9 and 10, the polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are perpendicular to each other, but the present invention is not limited to this. For example, the polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b may be configured to be substantially aligned with each other.

[0169] The azimuth angle of the λ / 2 plate 210 and the λ / 4 plate 204 may be set to −θ, and the rotation axis of the circularly polarized light may be in the opposite direction. Also, the present invention is not limited to circularly polarized light, and elliptically polarized light may be used.

[0170] 10(c) and 10(d), the λ / 2 plate 210 may be omitted. The λ / 4 plate 204 may be omitted. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b may be configured to be approximately aligned.

[0171] As shown in Figures 10(c) and 10(d), the aperture 504 is arranged to narrow the directionality of the light incident on the optical image detection / photography means 206, thereby eliminating stray light and enabling the image observation of the polished sample 102, etc. to be performed with high contrast and clarity. In the embodiments shown in Figs. 2, 4, 9, 10, etc., the resin-sealed sample 105 is described as having a cylindrical shape, but the present invention is not limited to this.

[0172] Fig. 19 is an explanatory diagram of a resin-sealed sample 105 in the polishing apparatus of the present invention. In Fig. 19, Fig. 19(a) is an explanatory diagram of the resin-sealed sample 105 seen from the side, Fig. 19(b) is an explanatory diagram of the resin-sealed sample 105 seen from the front, and Fig. 19(c) is an explanatory diagram of the resin-sealed sample 105 seen from the top.

[0173] The resin-sealed sample 105 in FIG. 2(b) has one upper side cut or polished at an angle θ. The angle θ is preferably set to 40° or more and 60° or less in relation to the light incident angle. The cut processed surface 602b is polished or the like to a mirror finish. The polishing method or the like is the same as for the processed surface 602a.

[0174] 19, by cutting the resin-sealed sample 105 at an angle θ, light 205a from the light irradiator 201 is less attenuated by surface reflection of the resin-sealed sample 105 and can be incident on the resin-sealed sample 105. The light 205a illuminates the polished sample 102. The light reflected by the polished sample 102 is emitted from the resin-sealed sample 105 as light 205b. The emitted light 205b is incident on the optical image detection / photographing means 206.

[0175] The light incident on the resin-sealed sample 105 is scattered within the resin-sealed sample 105, generating stray light. When stray light occurs, observation of the electrode terminals 101 and the polished sample 102 becomes difficult or degraded.

[0176] In this embodiment, in order to deal with stray light, as shown in FIG. 20, in the resin-sealed sample 105, a light absorbing film 606 is formed in locations other than the processed surface 602, the light incident surface for illuminating the polished sample 102, and the light exit surface for observing the optical image of the polished sample 102.

[0177] The light absorbing film 606 can be made of an organic material such as acrylic resin containing carbon, or a similar organic material with black beads or the like dispersed therein. Another example is a resin vehicle containing cyanine black, a phthalocyanine pigment with high electrical insulation properties. In FIG. 4 and other figures, after the resin-sealed sample 105 is produced, a light-absorbing film 606 is formed on the surface of the resin-sealed sample 105, and processing of the processing surface 602 and other parts is carried out.

[0178] 11 is a configuration diagram and an explanatory diagram of the polishing apparatus of the present invention. A resin-sealed sample 105 is held by a polishing head 106. The polishing head 106 presses the resin-sealed sample 105 against a polishing surface 505, and the polishing head 106 rotates.

[0179] The polishing state is observed by the optical image detection / photographing means 206. In order to observe the state of the polished sample 102 in the resin-sealed sample 105, the optical image detection / photographing means 206 is synchronized with the rotational position of the resin-sealed sample 105.

[0180] The optical image detection / photographing means 206a photographs or observes the polished sample 102 when the polished sample 102 faces the front (point C). Similarly, the optical image detection / photographing means 206b photographs or observes a reflected image 208 of the electrode terminal 101 of the polished sample 102 when the polished sample 102 faces the front (point C). The reflected image 208 is reflected on the processed surface 602a.

[0181] A space is formed between the resin-sealed sample 105 and the polished surface 505, and a cleaning liquid such as water is supplied from the cleaning liquid supply nozzle 207 into the space, thereby cleaning the polished surface (machined surface 602a) of the resin-sealed sample 105 and forming a coating of water or the like on the polished surface (machined surface 602a). The polished surface (machined surface 602a) can be cleaned by rotating the polishing head 106 at high speed and supplying the cleaning liquid at high pressure to the polished surface of the polished sample 102. The solution supplied during polishing and the solution supplied during cleaning may be the same, but it is preferable that they are different.

[0182] 6, the polishing head 106 is connected to the lower end of a polishing head shaft 301. The polishing head shaft 301 has an opening so that the optical image detection / photographing means 206b can observe the reflected image 208.

[0183] Fig. 11(a) shows a case where the electrode terminal 101 and the reflected image 208 are arranged in a straight line as in Fig. 7, and Fig. 11(b) shows a case where the electrode terminal 101 and the reflected image 208 are arranged at an angle as in Fig. 8. In either case, the rotational position of the resin-sealed sample 105 and the optical image detection / photographing means 206 are synchronized to observe or detect the polishing state. 13 is a configuration diagram and an explanatory diagram of the polishing apparatus of the present invention, which shows a method for observing a reflected image 208 of a processed portion 602a on the bottom surface of a resin-encapsulated sample 105.

[0184] A diaphragm (light blocking device) 504 is disposed in front of the light irradiator 201. In addition, a diaphragm (light blocking device) 504 is also disposed on the light incident side of the optical image detection / photographing means 206 as required.

[0185] Examples of diaphragm (light blocking device) 504 include a Waterhouse diaphragm, in which a plate with holes is inserted through a slit on the side of the lens; a sluice gate diaphragm, in which a flat rod with large and small holes is moved up and down in front of or inside the lens; a rotary diaphragm, in which a disk with small holes is rotated in front of or inside the lens; and an iris diaphragm, which is made by stacking multiple plates (diaphragm blades) to allow for fine adjustments.

[0186] In this embodiment, it is preferable to adopt an iris diaphragm as the diaphragm 504. The central position of the iris diaphragm is arranged or configured as the center of the light beam of light (optical path) 205. By changing the opening of the iris diaphragm, it is possible to control the directivity of the light 205 in the optical path. Therefore, it is possible to realize the same control as by changing the F-number of the lens 605. By changing the opening of the iris diaphragm, it is possible to adjust or set the contrast and clarity of the optical image.

[0187] 13(a), light 205a emitted from the light irradiator 201 becomes polarized light by the polarizing plate 202a, becomes circularly polarized light by the λ / 4 plate, and becomes light 205b by being obliquely incident on the side surface of the resin-sealed sample 105. Since the refractive index of the resin-sealed sample 105 is higher than that of air, the incident angle of light 205b becomes θ2 (θ1>θ2) according to Snell's law. Circularly polarized light 205b illuminates the polished sample 102 and some of the light is reflected as circularly polarized light 205c with the opposite rotation.

[0188] The processed surface 602a is in contact with air or with an interface with water, which has a refractive index lower than that of the resin-sealed sample 105. Therefore, the circularly polarized light 205c is totally reflected or reflected by the processed surface 602a. A reflected image 208 of the electrode terminal 101 is formed on the processed surface 602a by the circularly polarized light 205c.

[0189] The circularly polarized light 205c and the circularly polarized light 205b are reflected inside the resin-sealed sample 105, and a part of the light becomes the reflected light 205d and enters the optical image detection / photography means 206, which detects or observes the reflected image 208. In addition, the light 205d has a narrow directivity due to the aperture 504b, and the amount of stray light entering the optical image detection / photography means 206 is reduced.

[0190] The light irradiator 201 is placed (mounted, implemented) on a moving (rotating) stage 603 and adjusts the angle of light incident on the resin-sealed sample 105 so that the image observed by the optical image detection / photographing means 206 is optimized.

[0191] The reflected light 205d is converted into linearly polarized light by the λ / 4 plate 204b and passes through the polarizing plate 202b. The polarization axes of the polarizing plate 202ba and the polarizing plate 202b are configured to be perpendicular to each other. As described above, the present invention utilizes the processed surface 602a as a reflecting surface.

[0192] When the abrasive grain size is #400 or less, polishing scratches are generated on the machined surface 602a, and the observation condition of the image of the electrode terminal 101 on the machined surface 602 is poor. When the abrasive grain size is #1000 or more, polishing scratches on the machined surface 602 are reduced, and the observation condition of the image of the electrode terminal 101 on the machined surface 602 is good. Use a low abrasive number at the beginning of the polishing process, and use a higher abrasive number as the polishing process nears completion.

[0193] The important thing in polishing is to make the cross section position exactly as the target position approaches the end of polishing. Therefore, the accuracy of the polishing position is not necessary in the first stage of the polishing process. The accuracy of the polishing position is necessary in the final stage of the polishing process.

[0194] In the present invention, the processed surface 602 of the polished sample 102 is used as a mirror surface, and the polishing process is carried out by observing the image of the electrode terminal 101 reflected on the mirror surface. Therefore, it is important to be able to observe the processed surface 602 at the stage when the abrasive grain number is small.

[0195] At the beginning of the polishing process, if there are polishing scratches on the processed surface 602, the polishing scratches will scatter light and deteriorate the observation condition of the image of the electrode terminal 101 reflected on the processed surface 602a. However, since it is far from the target position for polishing, there is no need to check the polishing position.

[0196] Cleaning water is supplied from the cleaning liquid supply nozzle 207. It is preferable to supply the cleaning water mixed with a surfactant. The cleaning water washes away abrasive grains and the like from the machined surface 602a. After cleaning, the cleaning water or a solution mixed with a surfactant forms a film on the machined surface 602a at the polishing scratches. The film covers the polishing scratches on the machined surface 602a, reduces the unevenness of the polishing scratches, and makes the machined surface 602a mirror-finished. Alternatively, it increases the regular reflectance of light on the machined surface 602a and reduces stray light.

[0197] When a coating is formed on the processed surface 602a and the processed surface 602a is mirror-finished, polishing scratches become inconspicuous. Therefore, when the abrasive grains are small, the processed surface 602a becomes closer to a mirror surface, and the reflected image 208 of the electrode terminal 101 reflected on the mirror surface can be observed.

[0198] After washing away the abrasive grains from the processing surface 602, cleaning water or the like is supplied between the polishing table 107 and the processing surface 602a, and the polishing table 107 and the processing surface 602 are filled with or interposed with the cleaning liquid, thereby reducing polishing scratches on the processing surface 602a. In addition, a light reflecting surface is generated due to the difference in refractive index between the cleaning liquid and the polished sample 102. Therefore, the processing surface 602a becomes more mirror-finished, and the electrode terminal 101 portion, the reflected image 208 of the electrode terminal 101 reflected on the processing surface 602a, etc. can be clearly observed.

[0199] As the polishing work of the polished sample progresses and abrasive grains with larger numbers (numbers 200 or more) are used, the polishing scratches on the processed surface 602 become smaller and shallower. By forming a coating of a cleaning solution or the like on the processed surface 602a, the processed surface 602a becomes mirror-finished, and the contrast and clarity of the reflected image 208 are improved. As the polishing work of the polished sample progresses, in the final stage of the polishing process in which abrasive grains with a larger number (number 200 or more) are used, polishing scratches on the processed surface 602 disappear.

[0200] At this stage, an air layer can be provided between the polished sample 102 (resin-sealed sample 105) and the polished surface 505 by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction).

[0201] The air layer has a refractive index of 1.0, and the resin-sealed sample 105, which is made of epoxy resin or the like, has a refractive index of about 1.55. Due to the difference in refractive index between the air layer and the resin-sealed sample 105, and the difference in refractive index between the air layer and the resin-sealed sample 105 and the polished sample 102, a light-reflecting surface is generated. Therefore, the processed surface 602 becomes a mirror surface, and the reflected image 208 of the electrode terminal 101 reflected on the mirror surface can be clearly observed. The water or solution attached to the processed surface 602a can be removed by centrifugal force by rotating the polishing head 106 at high speed. In addition, a thin water film or solution film can be formed on the processed surface 602a, and polishing scratches are eliminated, resulting in a mirror-finished processed surface 602a.

[0202] By placing an aperture 504a on the light emission side of the light irradiator 201 and placing an aperture 504b on the light incidence side of the optical image detection / photographing means 206, and narrowing the directionality of the light or specifying the directionality, it is possible to suppress the generation and reception of stray light, and to detect and observe optical images with high contrast.

[0203] Furthermore, by disposing a diaphragm 504b on the light incident side of the optical image detection / photographing means 206 and adjusting the aperture diameter of the diaphragm 504b, the F-number of the incident light can be controlled, enabling good contrast adjustment of the observed image.

[0204] 13(a), the light emitted by the light irradiator 201 is incident on the side surface of the resin-sealed sample 105, and the light 205d emitted from the top surface of the resin-sealed sample 105 is received by the optical image detection / photographing means 206. However, the present invention is not limited to this. For example, the light emitted by the light irradiator 201 may be incident on the top surface (processed surface 602b) of the resin-sealed sample 105, and the light 205dc emitted from the side surface of the resin-sealed sample 105 may be received by the optical image detection / photographing means 206.

[0205] 13(a), even if the λ / 4 plate 204a and the λ / 4 plate 204b are omitted, it may be sufficient for practical use. Also, the polarization axes of the polarizing plate 202a and the polarizing plate 202b may be in the same direction. 13A, the light 205b becomes reflected light 205c on the polished sample 102 etc. A part of the light 205c reflected on the polished sample 102 becomes stray light.

[0206] The λ / 4 plate 204a is disposed and set at an azimuth angle of approximately 45° with respect to the polarization axis of the polarizing plate 202a. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are disposed perpendicular to each other.

[0207] The polarized light transmitted through the λ / 4 plate 204a becomes circularly polarized light 205a. The circularly polarized light 205a enters the side surface of the resin-sealed sample 105, becomes light 205b, and is reflected by the polished sample 102, etc. The reflected circularly polarized light 205c becomes circularly polarized light that rotates in the opposite direction to the circularly polarized light 205b. A part of the circularly polarized light 205c is totally reflected by the processed surface 602a, and forms a reflected image 208 of the electrode terminal 101 on the processed surface 602a. The light within the resin-sealed sample 105 is emitted to the outside of the resin-sealed sample 105 as reflected light 205d.

[0208] The reflected light 205d is converted into linearly polarized light by the λ / 4 plate 204b, and the reflected light 205b passes through the polarizing plate 202b and is detected by the optical image detection / photographing means 206, allowing the polished state of the polished sample 102 to be observed.

[0209] When circularly polarized light is reflected, its direction of rotation is reversed. The light transmitted through a circular polarizer is reversed at the reflecting surface (right rotation -> left rotation). This is because the direction of rotation of the polarized light remains the same, but the direction of the light is reversed. When this light passes through the quarter-wave plate, it returns to linearly polarized light, but the direction of the polarization plane changes by 90° from the outward path.

[0210] The λ / 4 plate 204a converts the light into circularly polarized light 205a, and the λ / 4 plate 204b converts the light into circularly polarized light with the opposite rotation to the circularly polarized light 205a, so that stray light in the resin-encapsulated sample 105 is blocked by the polarizing plate 202b. Therefore, the amount of stray light that reaches the optical image detection / photographing means 206 is reduced, and the polishing state can be observed well. In order to obtain the best possible observation, the angle θ of the phase axis of the λ / 4 plate 204 is adjusted or set as shown in FIG. 9(c).

[0211] It goes without saying that the polarizing plate 202 and the λ / 4 plate 204 may be bonded together to form an integrated structure. The above also applies to the other embodiments of the present invention.

[0212] 5, the polishing table 107 can be moved upward (U2) and downward (D2). By lowering (D2) the polishing table 107, the polished sample 102 can be moved away from the polishing surface 505. By raising (U2) the polishing table 107, the polished sample 102 can be pressed against the polishing surface 505. In addition, by adjusting the amount of lowering (D1) or raising (U1) the polishing table 107, the pressure with which the polished sample 102 is pressed against the polishing surface 505 can be adjusted.

[0213] A space is formed between the resin-sealed sample 105 and the polished surface 505, and a cleaning liquid such as water is supplied from the cleaning liquid supply nozzle 207 into the space to clean the polished surface of the resin-sealed sample 105 and form a coating of water or the like on the processed surface 602a. The coating of water or the like reduces the optical scattering of light caused by polishing scratches on the processed surface 602a, making the processed surface 602a closer to a mirror surface. The mirror surface becomes a reflective surface, and can generate the reflective surface described in Figs. 7 and 8.

[0214] The polishing head 106 is configured to be rotatable in the direction of the arrow. By rotating the polishing head 106 at high speed and supplying a cleaning liquid at high pressure to the polished surface of the polishing sample 102, the polished surface (processed surface 602a) can be cleaned.

[0215] 6, the polishing head 106 is connected to the lower end of a polishing head shaft 301. The polishing head 106 is configured to be able to hold the polished sample 102. The polishing head shaft 301 is configured to be able to adjust the angle of the resin-encapsulated sample 105 by an angle adjustment part 302. The polishing head shaft 301 is configured to move up and down and left and right by the operation of a vertical and left and right movement mechanism.

[0216] 13(a) includes an optical image detection / photographing means 206a for detecting an optical image from above the resin-sealed sample 105, and a light irradiator 201 for irradiating light from the side of the resin-sealed sample 105. However, the present invention is not limited to this.

[0217] FIG. 13(b) shows a configuration in which light 205a emitted by a light irradiator 201 from the top surface of the resin-sealed sample 105 is incident on the resin-sealed sample 105, and light 205d emitted from the side surface of the resin-sealed sample 105 is detected by an optical image detection / photographing means 206.

[0218] 14(a) is a diagram showing a state in which water (cleaning water) 209 is sandwiched between the processing surface 602a of the resin-sealed sample 105 and the polishing table 107. The refractive index of the epoxy resin constituting the resin-sealed sample 105 is 1.55 to 1.65, and the refractive index of the water (cleaning water) is 1.33. Therefore, there is a refractive index difference between the epoxy resin and the water (cleaning water) 209, and light is reflected by the processing surface 602a. The reflected light is emitted from the resin-sealed sample 105 as reflected light 205c and enters the optical image detection / photographing means 206.

[0219] The cleaning water or a solution mixed with a surfactant forms a coating on the polishing scratches, and the machined surface 602 becomes mirror-finished or the polishing scratches become less noticeable. Therefore, even when the abrasive grains are small, the machined surface 602 becomes closer to a mirror surface, and the image of the electrode terminal 101 reflected in the mirror surface can be observed.

[0220] As the polishing work of the polished sample progresses and abrasive grains with a larger number are used, the polishing scratches on the processed surface 602 become smaller and shallower. By forming a film of a cleaning solution or the like on the processed surface 602a, the processed surface 602a becomes mirror-finished, and the contrast and clarity of the reflected image 208 are improved. As the polishing process of the polished sample progresses, at the final stage of the polishing process in which abrasive grains with a larger number are used, polishing scratches on the processed surface 602 disappear.

[0221] After washing away the abrasive grains on the processing surface 602, cleaning water or the like is supplied between the polishing table 107 and the processing surface 602, and a cleaning liquid 209 or the like is filled or interposed between the polishing table 107 and the processing surface 602, thereby reducing polishing scratches on the processing surface 602, and a light reflecting surface is generated due to the difference in refractive index between the cleaning liquid or the like and the polished sample 102. Therefore, the processing surface 602 becomes a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be clearly observed. FIG. 14( b ) shows a configuration in which an air layer (gap, space) is provided between the resin-sealed sample 105 and the polishing table 107 .

[0222] As the polishing of the polished sample progresses and the polishing is performed with high abrasive grains, the polishing scratches disappear from the processed surface 602. In this case, an air layer (gap, space) can be provided between the polished sample 102 (resin-encapsulated sample 105) and the polished surface 505 by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction).

[0223] The air layer has a refractive index of 1.0, and the resin-sealed sample 105 has a refractive index of 1.55 to 1.65 because it is made of epoxy resin or the like. Due to the difference in refractive index between the air layer and the resin-sealed sample 105 and the polished sample 102, a light reflecting surface is generated on the processed surface 602a.

[0224] Therefore, the processed surface 602 becomes a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be clearly observed. The water or solution adhering to the processed surface 602a can be removed by centrifugal force by rotating the polishing head 106 at high speed. Alternatively, a thinner water film can be formed on the processed surface 602a.

[0225] FIG. 14(b) shows a configuration in which an air layer (gap, space) is arranged between the resin-sealed sample 105 and the polishing table 107. However, it is also preferable to form a coating (coating) 604 made of a cleaning solution or water on the processing surface 602a of the resin-sealed sample 105 so that the coating (coating) 604 comes into contact with air.

[0226] The coating (water film) penetrates into polishing scratches on the processed surface 602 and flattens the polishing scratches. Therefore, the processed surface 602 becomes a mirror surface. The resin-sealed sample 105 has a refractive index of 1.5 to 1.65, and the coating (water film) has a refractive index of 1.33 to 1.5. The refractive index of air is 1.0.

[0227] The coating (water film) uses a solution or material that has affinity with the sealing resin that constitutes the resin-sealed sample 105. It is preferable to use a solution or material whose refractive index of the coating (water film) is lower than that of the sealing resin that constitutes the resin-sealed sample 105. It goes without saying that the coating may be formed by applying Vaseline or the like.

[0228] The refractive index of the sealing resin constituting the resin-sealed sample 105 is preferably 1.5 or more and 1.65 or less. When the coating (water film) is formed by coating, it is preferable to use a material with a refractive index of 1.45 to 1.55 or less.

[0229] The coating 604 is not limited to a cleaning solution. The coating 604 may be formed on the processing surface 602 by spraying or applying cleaning water mixed with a surfactant or a surfactant.

[0230] It is also preferable to use a material with good wettability. Wettability mainly refers to the affinity (ease of adhesion) of a liquid to a solid surface. When the liquid is a solution, wettability is also expressed as hydrophilicity or hydrophobicity.

[0231] Moreover, a coating agent such as wax may be applied or formed on the processing surface 602. For example, a photocurable resin made of acrylic resin is applied and cured by ultraviolet light.

[0232] The present invention is a method or configuration for improving the regular reflectance of light from the processed surface 602 by filling polishing scratches on the processed surface 602 with a liquid or solid and flattening the processed surface 602 or reducing light scattering.

[0233] As the polishing of the polished sample progresses and the polishing is performed with high abrasive grains, the polishing scratches disappear from the processed surface 602. In this case, an air layer (gap, space) can be provided between the polished sample 102 (resin-encapsulated sample 105) and the polished surface 505 by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction).

[0234] The air layer has a refractive index of 1.0, and the resin-sealed sample 105 has a refractive index of 1.55 to 1.65 because it is made of epoxy resin or the like. Due to the difference in refractive index between the air layer and the resin-sealed sample 105 and the polished sample 102, a light reflecting surface is generated on the processed surface 602a.

[0235] The above items are also the same for the processed surface 602b. By forming a coating (water film) 604b on the processed surface 602b, the influence of polishing scratches on the surface of the processed surface 602b is reduced, and the processed surface 602b is made mirror-finished. By making the surface mirror-finished, no attenuation occurs in the incidence and emission of the light 205.

[0236] In FIG. 15, light 205 emitted from a light irradiator 201 is split by a polarization splitting surface 501 of a polarizing beam splitter (PBS) 502 into P-polarized light 205P and S-polarized light 205S.

[0237] The PBS 502 is a polarizer that extracts light with a specific vibration (P polarization, S polarization) from natural light (random polarization). There are cube type and plate type, but either is acceptable. The wavelength band is adapted to the wavelength of the light emitted by the light irradiator 201.

[0238] The lens 605 is a relay lens. The lens 605 is disposed so as to collect the light 205, illuminate the polished sample 102, and allow the light from the polished sample 102 to be incident on the optical image detection / photographing means 206 in a satisfactory manner.

[0239] Of the light 205, S-polarized light 205S is reflected and P-polarized light 205P is transmitted by the separation surface 501. The S-polarized light 205S is converted into circularly polarized light 205b by the λ / 4 plate 204. The circularly polarized light 205b enters the resin-encapsulated sample 105 and is irradiated onto the polished sample 102.

[0240] The circularly polarized light 205b reflected by the polished sample 102 etc. becomes circularly polarized light 205c in the opposite direction to the circularly polarized light 205b, and exits from the resin-sealed sample 105. The circularly polarized light 205c is converted into P-polarized light 205d by the λ / 4 plate 204. The P-polarized light 205d passes through the separation surface 501 and enters the optical image detection / imaging means 206.

[0241] In the embodiment of Fig. 15, light 205b is incident from a side surface of the resin-sealed sample 105, and light 205c is emitted from the same side surface. In addition, the incident light 205b and the emitted light 205c pass through the same λ / 4 plate 204. Therefore, linearly polarized light can be converted to circularly polarized light, and circularly polarized light can be converted to linearly polarized light reversibly. In addition, the optical paths of the light entering and exiting the resin-sealed sample 105 can be made to coincide.

[0242] When the diaphragm 504a is completely closed, it blocks the light 205 from the light emitter 201. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206.

[0243] By adjusting the aperture diameter of the diaphragm 504a, the directivity of light incident on the optical image detection / capture means 206 can be adjusted. Reducing the aperture diameter of the diaphragm 504a narrows the directivity of light. This is therefore equivalent to increasing the F-number of the lens, and the contrast of the optical image can be increased. Increasing the aperture diameter of the diaphragm 504a widens the directivity of light. This is therefore equivalent to decreasing the F-number of the lens, and the brightness of the optical image can be increased. 15 shows a configuration in which incident light 205b and outgoing light 205c are incident and outgoing from the side surface of the resin-sealed sample 105. However, the present invention is not limited to this.

[0244] As shown in FIG. 16 , a configuration may be adopted in which light 205c is incident from a side surface of the resin-sealed sample 105 and light 205d is emitted from the side surface of the resin-sealed sample 105, while light 205a is incident from the top surface of the resin-sealed sample 105 and light 205b is emitted from the top surface of the resin-sealed sample 105.

[0245] The light 205a emitted from the light emitter 201a becomes linearly polarized light by the polarizing plate 202a, is collected by the relay lens 605a, and is reflected by the total reflection mirror 503. The light is reflected by the total reflection mirror 503, its direction is changed, and it is incident on the upper surface of the resin-sealed sample 105.

[0246] The linearly polarized light is converted into circularly polarized light 205a by the λ / 4 plate 204a. The circularly polarized light 205a enters the resin-sealed sample 105. Light 205b reflected by the resin-sealed sample 105 becomes circularly polarized light 205b having a direction opposite to that of the circularly polarized light 205a, and exits from the resin-sealed sample 105.

[0247] The circularly polarized light 205b is converted into linearly polarized light by the λ / 4 plate 204a, reflected by the total reflection mirror 503, collected by the relay lens 605b, transmitted through the polarizing plate 202b, and enters the optical image detection / photographing means 206a. The polarizing plates 202a and 202b are arranged so that their polarization axes are perpendicular to each other.

[0248] The light 205 emitted from the light emitter 201b becomes linearly polarized light by the polarizing plate 202c. The linearly polarized light is converted into circularly polarized light 205c by the λ / 4 plate 204a. The circularly polarized light 205c enters the resin-sealed sample 105 from its side surface.

[0249] The light 205d reflected within the resin-sealed sample 105 becomes circularly polarized light 205 in the opposite direction to the circularly polarized light 205c, and is emitted from the resin-sealed sample 105. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204b, passes through the polarizing plate 202d, and enters the optical image detection / photographing means 206b.

[0250] When the diaphragm 504a is completely closed, the light 205a from the light emitter 201a is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206a.

[0251] When the diaphragm 504b is completely closed, the light 205c from the light emitter 201b is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206b. By adjusting the opening diameters of the diaphragms 504a and 504b, the directivity of the light from the light irradiators 201a and 201b can be adjusted.

[0252] Reducing the aperture diameter of the diaphragms 504a and 504b narrows the directivity of light. This is therefore equivalent to increasing the F-number of the lens, and the contrast of the optical image can be increased. Reducing the aperture diameter of the diaphragms 504a and 504b widens the directivity of light. This is therefore equivalent to decreasing the F-number of the lens, and the brightness of the optical image can be increased.

[0253] Fig. 17 is an explanatory diagram of a polishing apparatus according to another embodiment of the present invention. As shown in Fig. 17, light 205d is incident on the side surface of the resin-sealed sample 105, and light 205e is emitted from the side surface of the resin-sealed sample 105. Light 205b is incident on the top surface of the resin-sealed sample 105, and light 205c is emitted from the top surface of the resin-sealed sample 105.

[0254] Light 205a emitted from light emitter 201a is separated into P-polarized light and S-polarized light by light separation surface 501 of PBS 502. S-polarized light 205b is reflected by separation surface 501, and the linearly polarized light is converted into circularly polarized light by λ / 4 plate 204a.

[0255] Incidentally, S-polarized light 205S is reflected by separation surface 501, and P-polarized light 205P is transmitted. Although S-polarized light 205S is reflected by total reflection mirror 503b, this is not limiting. A PBS 502 may be used in which P-polarized light 205P is reflected by separation surface 501, and S-polarized light 205S is transmitted.

[0256] The circularly polarized light 205b enters the resin-sealed sample 105. The light 205c reflected by the resin-sealed sample 105 becomes circularly polarized light in the opposite direction to the circularly polarized light 205b, and exits from the resin-sealed sample 105. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204a, passes through the separation surface 501, and enters the optical image detection / photographing means 206a.

[0257] The light 205 emitted from the light emitter 201b becomes linearly polarized light by the polarizing plate 202c. The linearly polarized light is converted into circularly polarized light by the λ / 4 plate 204b. The circularly polarized light is incident on the side surface of the resin-sealed sample 105.

[0258] The light 205e reflected within the resin-sealed sample 105 becomes circularly polarized light in the opposite direction to the circularly polarized light 205d, and is emitted from the resin-sealed sample 105. The circularly polarized light 205e is converted into linearly polarized light by the λ / 4 plate 204b, passes through the polarizing plate 202b, and enters the optical image detection / photographing means 206a.

[0259] When the diaphragm 504a is completely closed, the light 205a from the light emitter 201a is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206a.

[0260] When the diaphragm 504b is completely closed, the light 205c from the light emitter 201b is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206b.

[0261] 18 is an explanatory diagram and configuration diagram of a polishing apparatus in another embodiment. Light 205 emitted from light irradiator 201 is split by polarization splitting surface 501 of polarizing beam splitter (PBS) 502 into P polarized light 205P and S polarized light 205S.

[0262] The lens 605 (lens 605a, lens 605b) is a relay lens. The lens 605 is disposed so as to collect the light 205, illuminate the polished sample 102, and allow the light from the polished sample 102 to be effectively incident on the optical image detection / photographing means 206.

[0263] Of the light 205, S-polarized light 205S is reflected by the separation surface 501, and P-polarized light 205P is transmitted. The S-polarized light 205S is reflected by a total reflection mirror 503b. The S-polarized light 205S is converted into circularly polarized light by a λ / 4 plate 204b. The circularly polarized light is incident on the processed surface 602b of the resin-encapsulated sample 105. The light reflected by the inside of the sealed sample 105, the polished sample 102, the processed surface 602a, etc. becomes circularly polarized light 205c that is rotated in the opposite direction to the incident circularly polarized light.

[0264] The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204a, reflected by a total reflection mirror 503a, and enters the PBS 502. The light that entered the PBS 502 enters the optical image detection / photographing means 206 at the light separation surface 501. The circularly polarized light 205 c that is not converted into linearly polarized light by the λ / 4 plate 204 a passes through the light separation surface 501 of the PBS 502 .

[0265] The diaphragm 504a is opened and the diaphragm 504b is closed when the light 205c is made incident on the optical image detection / photographing means 206. The diaphragm 504b is opened and the diaphragm 504a is closed when the light 205d is made incident on the optical image detection / photographing means 206.

[0266] When the aperture 504a is completely closed, the light 205c reflected mainly from the processing surface 602a is blocked. When the aperture 504b is opened, the light reflected from the polished sample 102 can be made to enter the optical image detection / photographing means 206.

[0267] When the aperture 504b is completely closed, it blocks light 205d that is mainly reflected by the polished sample 102. When the aperture 504a is opened, it allows light that is mainly reflected by the processed surface 602a to be incident on the optical image detection / photographing means 206.

[0268] In the embodiment of Fig. 18, light 205S is incident from a side surface of the resin-sealed sample 105, and light 205d is emitted from the same side surface. Therefore, linearly polarized light can be converted to circularly polarized light, and circularly polarized light can be converted to linearly polarized light reversibly. In addition, the optical path and optical axis of the light entering and exiting the resin-sealed sample 105 can be made to coincide with each other.

[0269] Also, light 205P is incident from the upper surface of the resin-sealed sample 105, and light 205c is emitted from the same upper surface. Therefore, linearly polarized light can be converted to circularly polarized light and circularly polarized light can be converted to linearly polarized light reversibly. Also, the optical path and optical axis of the light entering and exiting the resin-sealed sample 105 can be made to coincide with each other. When both the apertures 504a and 504b are completely stopped down, the dark level can be measured by measuring the amount of light incident on the optical image detection / capture means 206.

[0270] In addition, by adjusting the aperture diameter of the diaphragms 504a and 504b, it is possible to adjust the directivity of light incident on the optical image detection / capture means 206. Reducing the aperture diameter of the diaphragm 504 narrows the directivity of light. This is therefore equivalent to increasing the F-number of the lens, and it is possible to increase the contrast of the optical image.

[0271] Increasing the aperture diameter of the diaphragm 504 broadens the directivity of light. This is equivalent to decreasing the F-number of the lens, and the brightness of the optical image can be increased.

[0272] 16, 17, and 18, light is incident on the resin-sealed sample 105 from two directions, the top surface and the side surface of the resin-sealed sample 105, but the present invention is not limited to this. It goes without saying that light may be incident on the resin-sealed sample 105 from one direction, the top surface of the resin-sealed sample 105 or the side surface of the resin-sealed sample 105, and the light emitted from the resin-sealed sample 105 may be detected or observed by the optical image detection / photographing means 206.

[0273] In the present invention, the polished surface of the polished sample 105, which is made of resin-sealed members, is washed during the polishing process. The polished surface is cleaned by washing, polishing scratches are covered with a cleaning liquid 604a, and the polished surface 602a is made mirror-finished.

[0274] The refractive index of the sealing resin of the resin-sealed polished sample 105 is high, ranging from 1.55 to 1.65, and the difference in refractive index between the sealing resin and the air covered with a cleaning liquid is large, resulting in a high reflectance of illumination light within the resin-sealed polished sample 105. The optical image of the member is projected onto the polished surface 602a, and by simultaneously observing the real image 101 of the member and the optical image (reflected image, mirror image) 208 of the polished surface, the polished sample can be processed with high precision.

[0275] Light irradiated from light irradiator 201 is polarized by polarizing plate 202a, and the polarized light is converted to circularly polarized light 205a by λ / 4 plate 204a to illuminate polished sample 102. Light 205d emitted from resin-sealed polished sample 105 is converted to polarized light by λ / 4 plate 204b, and the light transmitted through polarizing plate 202b is observed by imaging camera (photography camera, monitor screen, display monitor) 206 or the like. By polarizing the illumination light and circularly polarizing it by the λ / 4 plate, stray light within resin-sealed sample 105 is reduced, allowing the polished surface to be observed clearly.

[0276] The embodiments disclosed herein are illustrative in all respects and are not restrictive. The scope of the present invention is indicated by the claims, not by the above meaning, and is intended to include all modifications within the meaning and scope of the claims. It goes without saying that the matters or contents described in this specification and drawings can be mutually combined. [Explanation of symbols]

[0277] 101 Electrode terminal (cross section) 102 Polishing object (polishing sample) 103 Polished sample sealed pipe 104 Extrusion tool 105 Resin sealing sample 106 Polishing Head 107 Polishing Table 108 Table Axis 109 Container 200 Optical coupling fluid (water, etc.) 201 Light irradiator 202 Polarizing plate (polarizing film) 204 λ / 4 plate (phase plate, wave plate, phase film) 205 Light (light path) 206 Optical image detection and photography means (optical detection means, camera, light receiving member, photographing device, light receiving element, display device, monitor, vision) 207 Cleaning liquid supply nozzle 208 Reflected image (mirror image, optical image) 209 Cleaning fluid 210 λ / 2 plate (phase plate, wave plate, phase film) 211 Wavelength axis (optical axis) 301 Polished head shaft 302 Angle adjustment part (rotation part) 307 Polishing fluid supply nozzle 308 Photographed Image 501 Separation plane 502 Polarizing Beam Splitters (PBS) 503 Mirror 504 Aperture (shading device) 505 Polished surface 506 Polishing Pad 507 Marking line (positioning marker) 508 Pad Support Surface 509 Polishing Motor 601 Sample Holding Block 602 Processed surface (polished surface, cutting surface) 603 Moving (rotating) stage 604 Film (solution film, etc.) 605 Lens (relay lens, condenser lens) 606 Light absorbing film

Claims

1. A polishing apparatus for processing a workpiece having a top surface, a bottom surface, and a cylindrical side surface, the workpiece being sealed with a light-transmitting resin, comprising: a polishing machine for polishing the bottom surface; a light generator that generates illumination light that is incident on the cylindrical side surface and illuminates the polishing object; 13. A polishing apparatus comprising: an observation means for forming a liquid film on said bottom surface and for simultaneously observing a reflected image of said object to be polished on said bottom surface and an actual image of said object to be polished from said cylindrical side surface.

2. A polishing apparatus for processing a workpiece having a top surface, a bottom surface, and a cylindrical side surface, the workpiece being sealed with a resin having optical transparency, comprising: a polishing machine for polishing the bottom surface; a light generator that generates illumination light that is incident on the cylindrical side surface and illuminates the polishing object; forming a liquid film on the bottom surface and observing light reflected on the bottom surface from the cylindrical side surface; 4. A polishing apparatus, comprising: a polishing light source for polishing a surface of a polishing object;

3. A polishing apparatus for processing a workpiece having a top surface, a bottom surface, and a cylindrical side surface, the workpiece being sealed with a resin having optical transparency, comprising: a presser for pressing the workpiece formed in the pipe and removing it from the pipe; a polishing machine that polishes the bottom surface after polishing the edge of the top surface; a light generator that generates illumination light that is incident on the cylindrical side surface and illuminates the polishing object; forming a liquid film on the bottom surface and observing the light reflected by the bottom surface and the light reflected by the polishing object from the cylindrical side surface at the same time; 4. A polishing apparatus, comprising: a polishing light source for polishing a surface of a polishing object;

4. A polishing apparatus for processing a workpiece having a top surface, a bottom surface, and a cylindrical side surface, the workpiece being sealed with a resin having optical transparency, comprising: a polishing machine for polishing the bottom surface; a light generator for generating illumination light incident on the upper surface and illuminating the workpiece; forming a liquid film on the bottom surface and observing light reflected on the bottom surface from the cylindrical side surface; 4. A polishing apparatus, comprising: a polishing light source for polishing a surface of a polishing object;

5. a polarizing plate capable of rotating the polarization direction is disposed in at least one of an optical path of the illumination light and an optical path of the reflected light; 5. A polishing apparatus according to claim 2, wherein a quarter-wave plate is disposed in at least one of the optical paths of said illumination light and said reflected light.

6. A top surface of the workpiece is cut; The illumination light is incident from a cut surface formed by cutting the upper surface, The resin is an epoxy resin having a refractive index of 1.55 or more and 1.7 or less, 5. A polishing apparatus according to claim 1, 2, 3 or 4, wherein the refractive index of said liquid film is lower than the refractive index of said resin.

7. A polishing method for processing a workpiece having a top surface, a bottom surface, and a cylindrical side surface, the workpiece being sealed with a resin having optical transparency, comprising: Illuminating the polished object with an illumination light; forming a liquid film on the bottom surface, and simultaneously observing a reflected image of the polished object on the bottom surface and a real image of the polished object from the cylindrical side surface; grinding the bottom surface of the workpiece; A polishing method comprising the steps of: setting a distance between the reflected image and the real image to a predetermined length.

8. A polishing method for processing a workpiece having a top surface, a bottom surface, and a cylindrical side surface, the workpiece being sealed with a resin having optical transparency, comprising: the abrasive article having a first portion and a second portion; Illuminating the polished object with an illumination light; forming a liquid film on the bottom surface, and simultaneously observing a reflected image of the polished object on the bottom surface and a real image of the polished object from the cylindrical side surface; grinding the bottom surface of the workpiece; A polishing method comprising the steps of: making a first length between the reflected image of the first portion and the real image of the first portion and a second length between the reflected image of the second portion and the real image of the second portion approximately the same length.

9. A polishing method for processing a workpiece having a top surface, a bottom surface, and a cylindrical side surface, the workpiece being sealed with a resin having optical transparency, comprising: Illuminating the polished object with an illumination light; Rotating the workpiece; forming a liquid film on the bottom surface; A polishing method comprising: observing a reflected image of the polished object from the bottom surface and an actual image of the polished object simultaneously from the cylindrical side surface in synchronization with the rotational position of the workpiece.

10. the illumination light is polarized; The polarization direction of the polarized light can be rotated, 10. The polishing method according to claim 7, wherein a quarter-wave plate is disposed in an optical path of the illumination light.

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