Polishing head with localized wafer pressure

Abstract

The polishing system includes a carriage arm having an actuator disposed on its underside. The actuator includes a piston and a roller coupled to a distal end of the piston. The polishing system includes a polishing pad and a substrate carrier suspended from the carriage arm and configured to apply pressure between the substrate and the polishing pad. The substrate carrier includes a housing, a retaining ring, and a membrane. The substrate carrier includes an upper load ring disposed in the housing. The roller of the actuator is configured to contact the upper load ring during relative rotation between the substrate carrier and the carriage arm. The actuator is configured to apply a load to a portion of the upper load ring to change the pressure applied between the substrate and the polishing pad.

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE

[0001] Embodiments of the present disclosure relate generally to apparatus and methods for polishing and / or planarizing a substrate. More specifically, embodiments of the present disclosure relate to polishing heads utilized in chemical mechanical polishing (CMP). [Background technology]

[0002] 2. Description of Related Art

[0002] Chemical mechanical polishing (CMP) is commonly used in semiconductor device manufacturing to planarize or polish a material layer deposited on a crystalline silicon (Si) substrate surface. In a typical CMP process, the substrate is held in a substrate carrier, e.g., a polishing head, which presses the substrate against a rotating polishing pad in the presence of a polishing fluid. Generally, the polishing fluid includes an aqueous solution of one or more chemical components and nanoscale abrasive particles suspended in the aqueous solution. Material is removed across the material layer surface of the substrate in contact with the polishing pad by a combination of chemical and mechanical activity provided by the polishing fluid and the relative motion of the substrate and polishing pad.

[0003]

[0003] The substrate carrier includes a membrane having a number of different radial zones that contact the substrate. The membrane may include three or more zones, such as from three zones to eleven zones, e.g., 3, 5, 7, or 11 zones. The zones are typically labeled from outside to inside (e.g., outer zone 1 to inner zone 11 for an eleven-zone membrane). Using the various radial zones, the pressure applied to the chamber bounded by the back surface of the membrane can be selected to control the center-to-edge profile of the force applied by the membrane to the substrate, and thus the center-to-edge profile of the force applied by the substrate against the polishing pad. Even with the use of various radial zones, a persistent problem with CMP is the occurrence of edge effects, i.e., over-polishing or under-polishing the outermost 5-10 mm of the substrate. Edge effects can result from a sharp rise in pressure between the substrate and the polishing pad at the periphery of the substrate due to a knife-edge effect in which the leading edge of the substrate is scraped along the top surface of the polishing pad. Current approaches to applying pressure to various radial zones result in forces that are distributed over a large area of ​​the substrate. Distributing such an added load over a large area cannot prevent the edge effects mentioned above.

[0004]

[0004] To reduce edge effects and improve the resulting finish and flatness of the substrate surface, the polishing head includes a retaining ring surrounding the film. The retaining ring has a bottom surface for contacting the polishing pad during polishing and a top surface that is fixed to the polishing head. Precompression of the polishing pad under the bottom surface of the retaining ring reduces the pressure increase at the outer periphery of the substrate by moving the area of ​​increased pressure from under the substrate to under the retaining ring. However, the resulting improvement in uniformity at the outer periphery of the substrate is generally limited and has been found to be inadequate for many applications.

[0005] Therefore, what is needed in the art is an apparatus and method for solving the problems discussed above. Summary of the Invention

[0006]

[0006] Embodiments of the present disclosure relate generally to apparatus and methods for polishing and / or planarizing a substrate, and more particularly, embodiments of the present disclosure relate to polishing heads utilized in chemical mechanical polishing (CMP).

[0007]

[0007] In one embodiment, a polishing system includes a carriage arm having an actuator disposed on an underside thereof, the actuator including a piston and a roller coupled to a distal end of the piston, a polishing pad, and a substrate carrier suspended from the carriage arm and configured to apply pressure between a substrate and the polishing pad, the substrate carrier including a housing, a retaining ring coupled to the housing, a membrane coupled to the housing and spanning an inner diameter of the retaining ring, the membrane having a bottom configured to contact the substrate, a side extending perpendicular to the bottom, the side including an annular recess formed along an outer edge of the side, an annular sleeve disposed within the annular recess, and an upper load ring disposed in the housing, wherein the roller of the actuator rotates between the substrate carrier and the carriage arm during relative rotation between the substrate carrier and the carriage arm. and a substrate carrier including an upper load ring configured to contact the upper load ring, a plurality of load pins circumferentially arranged in the housing, each of the plurality of load pins having a proximal end connected to the upper load ring and a distal end connected to the lower load ring, and a lower load ring arranged in the housing, the lower load ring having a flange portion connected to each of the distal ends of the plurality of load pins and a body portion extending perpendicular to the flange portion, the body portion contacting an annular sleeve disposed in the membrane, and actuation of the actuator is configured to change the pressure applied between the substrate and the polishing pad by applying a load to portions of the upper load ring, one or more of the plurality of load pins, the lower load ring, the annular sleeve, and the outer edge region of the membrane.

[0008]

[0008] So that the above-mentioned features of the present disclosure may be understood in detail, a more particular description of the present disclosure, briefly summarized above, will be obtained by reference to the embodiments. Some embodiments are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings show only exemplary embodiments, and therefore should not be considered as limiting the scope of the present disclosure, which may admit of other equally effective embodiments. [Brief description of the drawings]

[0009] [Figure 1A] FIG. 1 is a schematic side view of an exemplary polishing station that may be used to practice the methods set forth herein in accordance with one or more embodiments. [Figure 1B]

[0010] FIG. 1 is a schematic plan view of a portion of a multi-station polishing system that may be used to implement the methods set forth herein in accordance with one or more embodiments. [Figure 2A]

[0011] 1C is a schematic side view of one embodiment of a substrate carrier that may be used in the polishing system of FIG. 1B. [Figure 2B] [

[0012] FIG. 2B is an enlarged side cross-sectional view of a portion of FIG. 2A. [Figure 2C]

[0013] FIG. 2B is an enlarged isometric view of a portion of FIG. 2A. [Figure 3A]

[0014] 1C is a cross-sectional side view of yet another embodiment of a substrate carrier that may be used in the polishing system of FIG. 1B. [Figure 3B]

[0015] FIG. 3B is a schematic top view of the substrate carrier of FIG. 3A. [Figure 3C-3D]

[0016] 3C is an enlarged cross-sectional side view of a portion of FIG. 3B showing an internal actuator according to two different embodiments. [Figure 4]

[0017] 1C is a cross-sectional side view of yet another embodiment of a substrate carrier that may be used in the polishing system of FIG. 1B.

[0010]

[0018] For ease of understanding, wherever possible, the same reference numerals have been used to designate identical elements that are common to several figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011]

[0019] Before describing certain exemplary embodiments of the present apparatus and methods, it is to be understood that the disclosure is not limited to the details of structure or process steps set forth in the following description. It is contemplated that certain embodiments of the present disclosure may be combined with other embodiments.

[0012]

[0020] FIG. 1A is a schematic side view of a polishing station 100a according to one or more embodiments that may be used to implement the methods set forth herein. FIG. 1B is a schematic plan view of a portion of a multi-station polishing system 101 including multiple polishing stations 100a-c, each of which is substantially similar to the polishing station 100a shown in FIG. 1A. In FIG. 1B, at least some of the components associated with the polishing station 100a shown in FIG. 1A are not shown in the multiple polishing stations 100a-c to reduce visual clutter. Polishing systems that may be adapted to benefit from the present disclosure include, among others, the REFLEXION® LK and REFLEXION® LK PRIME Planarizing Systems available from Applied Materials, Inc. of Santa Clara, Calif.

[0013]

[0021] As shown in FIG. 1A, the polishing station 100a includes a platen 102, a first actuator 104 coupled to the platen 102, a polishing pad 106 disposed on and secured to the platen 102, a fluid delivery arm 108 disposed above the polishing pad 106, a substrate carrier 110 (shown in cross section), and a pad conditioner assembly 112. Here, the substrate carrier 110 is suspended from a carriage arm 113 of a carriage assembly 114 (FIG. 1B) such that the substrate carrier 110 is disposed above and facing the polishing pad 106. The carriage assembly 114 is rotatable about a carriage axis C to move the substrate carrier 110, and thus the substrate 122, between the substrate carrier loading station 103 (FIG. 1B) and / or between the polishing stations 100a-c of the multi-station polishing system 101, among which the substrate 122 is chucked. The substrate carrier loading station 103 includes a load cup 150 (shown in phantom) for loading the substrate 122 onto the substrate carrier 110 .

[0014]

[0022] During substrate polishing, the first actuator 104 is used to rotate the platen 102 about a platen axis A, and the substrate carrier 110 is disposed above and facing the platen 102. The substrate carrier 110 is used to press a polished surface of a substrate 122 (shown in phantom lines) disposed therein against a polishing surface of a polishing pad 106 while simultaneously rotating about a carrier axis B. Here, the substrate carrier 110 includes a housing 111, an annular retaining ring 115 coupled to the housing 111, and a membrane 117 spanning an inner diameter of the retaining ring 115. The retaining ring 115 surrounds the substrate 122 and prevents the substrate 122 from slipping off the substrate carrier 110 during polishing. The membrane 117 is used to apply a downward force to the substrate 122 to load (chuck) the substrate onto the substrate carrier 110 during a substrate loading operation and / or between substrate polishing stations. For example, during polishing, pressurized gas is provided to the carrier chamber 119 to exert a downward force on the membrane 117 and thus on the substrate 122 in contact therewith. Before and after polishing, a reduced pressure is applied to the chamber 119 such that the membrane 117 can be deflected upwardly to create a low pressure pocket between the membrane 117 and the substrate 122, thereby chuck- ing the substrate 122 within the substrate carrier 110.

[0015]

[0023] During polishing, the substrate 122 is pressed against the pad 106 in the presence of polishing fluid provided by the fluid delivery arm 108. The rotating substrate carrier 110 oscillates between the inner and outer diameters of the platen 102, in part to reduce uneven wear on the surface of the polishing pad 106. Here, the substrate carrier 110 rotates using a first actuator 124 and oscillates using a second actuator 126.

[0016]

[0024] Here, pad conditioner assembly 112 includes a fixed abrasive conditioning disk 120, such as a diamond-impregnated disk, that may be pressed against polishing pad 106 to re-enhance its surface and / or remove polishing by-products or other debris therefrom. In other embodiments, pad conditioner assembly 112 may include a brush (not shown).

[0017]

[0025] The operation of the multi-station polishing system 101 and / or its individual polishing stations 100a-c is facilitated by a system controller 136 (FIG. 1A). The system controller 136 includes a programmable central processing unit (CPU 140) operable with a memory 142 (e.g., non-volatile memory) and support circuits 144. The support circuits 144 are coupled to the CPU 140 in a conventional manner and include cache, clock circuits, input / output subsystems, power supplies, and the like, and combinations thereof, coupled to various components of the polishing system 101 to facilitate control of the substrate polishing process. For example, in some embodiments, the CPU 140 is one of any form of general-purpose computer processor used in industrial settings (e.g., a programmable logic controller (PLC)) to control various polishing system components and sub-processors. The memory 142 coupled to the CPU 140 is non-transitory and includes one or more of a readily available memory, local or remote (e.g., random access memory (RAM), read-only memory (ROM), floppy disk drive, hard disk, or any other form of digital storage device).

[0018]

[0026] As used herein, memory 142 is in the form of a computer-readable storage medium (e.g., non-volatile memory) that contains instructions that, when executed by CPU 140, facilitate operation of polishing system 101. The instructions in memory 142 are in the form of a program product (e.g., a program implementing the methods of the present disclosure, such as a middleware application, an equipment software application, etc.). The program code may conform to any of a number of different programming languages. In one example, the present disclosure may be implemented as a program product stored on a computer-readable storage medium for use with a computer system. One or more programs of the program product define functions of embodiments (including the methods described herein).

[0019]

[0027] Exemplary computer-readable storage media include, but are not limited to, (i) non-writable storage media in which information is permanently stored (e.g., a read-only memory device in a computer such as a CD-ROM drive, a flash memory, a CD-ROM disk readable by a ROM chip or any type of solid-state non-volatile semiconductor memory), and (ii) writable storage media in which changeable information is stored (e.g., a floppy disk in a diskette drive or hard disk drive or any type of solid-state random access semiconductor memory). Such computer-readable storage media, when carrying computer-readable instructions that direct the functions of the methods described herein, are embodiments of the present disclosure.

[0020]

[0028] FIG. 2A is a schematic side view of one embodiment of a substrate carrier 110 that may be used in the polishing system 101 of FIG. 1B. FIG. 2B is an enlarged cross-sectional side view of a portion of FIG. 2A. FIG. 2C is an enlarged isometric view of a portion of FIG. 2A. In FIG. 2C, the housing 111 and the retaining ring 115 have been removed to more clearly show the internal components of the substrate carrier 110. The membrane 117 includes a bottom portion 117a that spans the inner diameter of the retaining ring 115 and a side portion 117b that extends substantially parallel to the inner wall 115a of the retaining ring 115. An external actuator 202 (e.g., a linear actuator) is coupled to the carriage arm 113. The external actuator 202 is disposed between the carriage arm 113 and the housing 111 of the substrate carrier 110. Although only one external actuator 202 is shown in FIGS. 2A-2C, it will be understood that multiple external actuators 202 may be disposed circumferentially around the carrier axis B. In some embodiments, the number of external actuators 202 may be between 1 and 12 external actuators, such as between 1 and 4 external actuators, between 4 and 12 external actuators, between 4 and 8 external actuators.

[0021]

[0029] The external actuator 202 includes a cylindrical housing 204 coupled to a bottom side of the carriage arm 113. The cylindrical housing 204 is oriented longitudinally (e.g., aligned with the direction of gravity) substantially along the z-axis. A piston 206 is disposed partially inside the cylindrical housing 204. The piston 206 is actuatable (e.g., vertically movable) toward and away from the cylindrical housing 204 substantially along the z-axis. In one embodiment, a roller 208 is coupled to a distal end of the piston 206 using a fastener (e.g., a clamp). The roller 208 is configured to contact the housing 111 to transfer a load from the external actuator 202 to the housing 111 or to one or more components of the housing described in more detail below. The roller 208 enables load transfer to the carrier head 110 during operation (e.g., when the external actuator 202 is stationary and the carrier head 110 is rotating).

[0022]

[0030] The rollers 208 contact an upper load ring 210 disposed in the housing 111. The upper load ring 210 is an annular ring having an upper surface 212 and a plurality of lower surfaces 214 opposite the upper surface 212. In some embodiments, the upper load ring 210 has a continuous annular upper surface. The upper surface 212 is exposed through the top of the housing 111 to maintain contact with the rollers 208 during rotation of the carrier head 110. In some other embodiments (not shown), the upper load ring 210 includes a plurality of arc-shaped segments having the plurality of upper surfaces 212. Below the upper load ring 210, a plurality of load pins 216 are circumferentially disposed about the carrier axis B of the substrate carrier 110. Each of the plurality of load pins 216 is oriented longitudinally substantially along the z-axis. The plurality of load pins 216 are more clearly depicted in FIG. 2C. As shown in FIG. 2C, the plurality of load pins 216 are uniformly spaced apart. In some embodiments, the plurality of load pins 216 may include between 6 and 36 load pins, for example between 12 and 24 load pins.

[0023]

[0031] The load pins 216 are disposed vertically between the upper load ring 210 and the flange portion 220 of the lower load ring 218. A proximal end of each of the load pins 216 contacts one of the lower surfaces 214 of the upper load ring 210. A distal end of each of the load pins 216 is coupled to the flange portion 220 of the lower load ring 218 by a fastener (e.g., a machine screw). The lower load ring 218 includes a body portion 222 extending perpendicular to the flange portion 220. The body portion 222 extends substantially along the z-axis. The body portion 222 is disposed radially between the side 117b of the membrane 117 and the housing 111. An inner diameter of the body portion 222 is configured to engage the side 117b of the membrane 117. The body portion 222 includes a plurality of arcuate segments 224 having a void 226 between adjacent segments 224 (FIG. 2C). The segments 224 are circumferentially aligned with each of the plurality of load pins 216. The voids 226 are spaced between adjacent load pins 216. In some other embodiments (not shown), the body portion 222 may be a continuous annular ring without the voids 226.

[0024]

[0032] The side 117b of the membrane 117 includes an annular recess 117c formed along an outer edge of the side 117b. The outer diameter of the recess 117c is smaller than the outer diameter of the side 117b. An annular sleeve 228 is disposed within the recess 117c. The inner diameter of the sleeve 228 is configured to fit the outer diameter of the recess 117c. The outer diameter of the sleeve 228 is larger than the outer diameter of the side 117b. A distal end of the body portion 222 of the lower load ring 218 engages an upper end of the sleeve 228 that is radially exposed outside the recess 117c. The segments 224 of the lower load ring 218 concentrate the load applied by each of the multiple load pins 216 to a lower circumferential portion of the sleeve 228. The voids 226 (FIG. 2C) increase the compliance of the lower load ring 218 in the z-direction. Side 117b of membrane 117 surrounding recess 117c is disposed partially along the z-axis between the lower end of sleeve 228 and substrate 122. The lower end of side 117b contacts the edge of substrate 122. Thus, application of a downward force to sleeve 228 increases the pressure between the edge of substrate 122 and polishing pad 106.

[0025]

[0033] In operation, actuation of the external actuator 202 extends the piston 206 downwardly, which exerts a downward force on the upper load ring 210 via the roller 208. The downward force exerted on the upper load ring 210 is ultimately transferred to the edge of the substrate 122 by a load path passing through the multiple load pins 216, the lower load ring 218, the sleeve 228, and the side 117b of the membrane 117. Thus, actuation of the external actuator 202 causes the outer radial portion of the membrane 117 to receive load in a narrow region at the outer edge of the membrane 117 and the substrate 122, which may tend to tilt the bottom 117a relative to the xy plane. In particular, the narrow distribution load to the outer edge of the membrane 117 and / or the subsequent slope of the membrane 117 tends to form a negative taper, which corresponds to a larger downward deflection of the bottom 117a moving radially outward from the central axis to the outer edge of the membrane 117. The narrowly distributed load on the outer edge of the membrane 117 modifies the pressure applied between the substrate 122 and the polishing pad 106 .

[0026]

[0034] In certain embodiments, the pressure applied to the edge of the substrate 122 may be locally controlled. In other words, the pressure applied by each of the external actuators 202 may be localized to an arcuate region of the substrate 122 located under the external actuator 202 applying one or more active loads. In some embodiments, the length of the arcuate region corresponding to the localized pressure control may be about 30° or less, about 45° or less, about 60° or less, about 90° or less, such as about 30° to about 90°. Thus, the pressure between the substrate 122 and the polishing pad 106 may be locally controlled within a discrete circumferential region by timing the actuation of each of the multiple external actuators 202. By orienting and positioning the external actuators 202 at a desired location or orientation relative to the platen 102 and / or the carriage assembly 114, the pressure applied by the external actuators 202 may be applied to one or more desired regions of the membrane 117 at any time during processing. In one example, the desired region or regions may include portions of the film near a leading edge or a trailing edge of the carrier head 110 at any one time as the carrier head 110 rotates and moves across the polishing pad 106 during processing. As disclosed herein, the carrier head 110 may move in a direction along the radius of the platen, away from the radius of the platen, or in an arcuate direction relative to the radius of the platen.

[0027]

[0035] In some other embodiments (not shown), which may be combined with other embodiments described herein, the multiple load pins 216 may be linear or piezoelectric actuators configured to independently apply a downward force to the lower load ring 218.

[0028]

[0036] In some embodiments (not shown), the upper load ring 210 is coupled to the annular sleeve 228. In such embodiments, the upper load ring 210, the plurality of load pins 216, and the lower load ring 218 form one continuous structure, or piece, that extends from the load application shaft of the external actuator 202 to the annular sleeve 228.

[0029]

[0037] 3A is an enlarged cross-sectional side view of another embodiment of a substrate carrier 300 that may be used in the polishing system 101 of FIG. 1B. In this example, the substrate carrier 300 includes a separated membrane assembly 302. A flexure plate 304 is disposed between the housing 111 and the base assembly 116 to flexibly couple the membrane assembly 302 to the housing 111. The flexure plate 304 is an annular plate. The flexure plate 304 has an inner flange 306 for coupling the flexure plate 304 to the housing 111. The flexure plate 304 is a circular plate. The inner flange 306 is a circular plate that is rotatable relative to the housing 111. The flexure plate 304 ...

[0030]

[0038] 304 includes an outer flange 308 for coupling to inner tube 320. Generally, inner tube 320 (described in more detail below) is operable to apply a downward force to outer flange 308 of flexure plate 304 along the z-axis. Flexure plate 304 also includes a flexure portion 310 and a body portion 312 that are radially adjacent to one another and extend between inner flange 306 and outer flange 308. Flexure portion 310 is thinner than each of inner and outer flanges 306, 308 and body portion 312 such that bending of flexure plate 304 is primarily concentrated within flexure portion 310.

[0031]

[0039] The inner tube 320 is disposed within the housing 111 of the substrate carrier 300. The inner tube 320 is annular or arc-shaped. The inner tube 320 includes an upper clamp 322 and a lower clamp 324 matingly engaged with each other to form a pressure bladder. A connecting element 326 has an upper end that contacts the lower clamp 324 and a lower end that contacts the outer flange 308 of the curved plate 304. Pressurization of the inner tube 320 exerts a downward force against the outer flange 308 of the curved plate 304, generating a torsional moment on the curved plate 304 and deflecting the outer flange 308 and the body portion 312 toward the isolated membrane assembly 302. In particular, an annular protrusion 314 formed along the bottom surface of the curved plate 304 contacts the upper portion 317d of the isolated membrane assembly 302. Thus, application of a downward force to the curved plate 304 causes the radially outer portion of the membrane assembly 302, including its bottom 317a, to receive a load in a narrow region at the outer edge of the membrane 317 and the substrate 122, which may tend to tilt the bottom 317a relative to the xy plane. In particular, the narrowly distributed load to the outer edge of the membrane 317 and / or the subsequent slope of the membrane 317 tends to form a negative taper, which corresponds to a larger downward deflection of the bottom 317a moving radially outward from the central axis to the outer edge of the membrane 317. In some embodiments, the narrowly distributed load received by the membrane assembly 302 may be locally controlled to create a selectively distributed load on the substrate 122 along the radially outer portion of the membrane 317.

[0032]

[0040] Although only one inner tube 320 is shown in FIG. 3A, it will be understood that multiple inner tubes 320 may be circumferentially disposed about the carrier axis B. FIG. 3B is a schematic top view of the substrate carrier 300 of FIG. 3A showing the location of the multiple inner tubes 320. Referring to FIG. 3B, the substrate carrier 300 includes 12 separate arc-shaped inner tubes 320. However, other numbers of inner tubes 320 are contemplated. In some embodiments, the number of inner tubes 320 may be 1-16 inner tubes, e.g., 1-4 inner tubes, 4-16 inner tubes, 8-12 inner tubes. In some embodiments, the length of each inner tube 320 may be about 90° or less, about 60° or less, about 45° or less, about 30° or less, such as about 30° to about 90°.

[0033]

[0041] 3A-3B, the pressure applied to the edge of the substrate 122 may be locally controlled. In other words, the pressure may be localized to an arcuate region of the substrate 122 disposed under one or more pressurized inner tubes 320. Thus, the pressure between the substrate 122 and the polishing pad 106 may be locally controlled within a distinct circumferential region by timing the pressurization of each of the multiple inner tubes 320 as the carrier head 110 rotates about axis B during processing.

[0034]

[0042] With reference to FIG. 3B, the substrate carrier 300 includes a number of internal actuators 330 arranged circumferentially around the carrier axis B. Although twelve internal actuators 330 are shown in FIG. 3B, other numbers of internal actuators 330 are contemplated. In some embodiments, the number of internal actuators 330 may be between 1 and 16 internal actuators, e.g., between 1 and 4 internal actuators, between 4 and 16 internal actuators, between 8 and 12 internal actuators. With reference to FIG. 3B, the number of internal actuators 330 in the substrate carrier is equal to the number of internal tubes 320. However, in some other embodiments (not shown), the number of internal actuators 330 and internal tubes 320 are different.

[0035]

[0043] The plurality of internal actuators 330 may be similar in structure and function to the external actuator 202. Generally, the plurality of internal actuators 330 includes a cylindrical housing 332 and a piston 334. The piston 334 is partially disposed inside the cylindrical housing 332. The piston 334 is operable to move toward and away from the cylindrical housing 332 substantially along the z-axis.

[0036]

[0044] 3C and 3D are enlarged side cross-sectional views of a portion of FIG. 3B showing the internal actuator 330 according to two different embodiments. Referring collectively to FIGS. 3C and 3D, each of the internal actuators 330c-d is configured to contact the top 317d of the isolated membrane assembly 302. The distal end of the piston 334 contacts the top 317d of the membrane 317 and exerts a downward force thereon. Referring to FIG. 3C, the piston 334 of the internal actuator 330c extends through a hole formed in the flexure plate 304 and contacts the top 317d of the membrane 317. Meanwhile, referring to FIG. 3D, each of the multiple internal actuators 330d is disposed between the flexure plate 304 and the top 317d of the membrane 317. In particular, the cylindrical housing 332 is fixedly coupled to the flexure plate 304. The cylindrical housing 332 is at least partially disposed within a corresponding recess formed in a bottom surface of the outer flange 308 of the flexure plate 304. The piston 334 extends below the bottom surface of the outer flange 308 of the curved plate 304 and contacts the top portion 317 d of the membrane 317 .

[0037]

[0045] 3C and 3D, the effect of the multiple internal actuators 330c-d is to apply a narrowly distributed load to the outer edges of the membrane 317 and substrate 122, which may result in tilting of the membrane assembly 302 similar to the multiple internal tubes 320 described above. The multiple internal tubes 320 and the internal actuators 330c-d can each be independently actuated, allowing for more precise control of the pressure between the substrate 122 and polishing pad 106 compared to using only one or the other of the multiple internal tubes 320 or the internal actuators 330c-d alone.

[0038]

[0046] Although the overall effect of the embodiments of Figures 3C and 3D may be similar, the force coupling mechanism between the plurality of inner tubes 320 and the internal actuators 330c-d is different. In Figure 3C, the forces applied by the plurality of inner tubes 320 and the internal actuator 330c are decoupled from each other, meaning that each of the forces is applied independently of each other. However, in Figure 3D, the forces are not decoupled from each other. In other words, although the plurality of inner tubes 320 and the internal actuator 330d are independently actuable, the applied forces are actually coupled to each other via the curved plate 304. For example, a downward force applied by one or more of the internal actuators 330d against the membrane 317 results in an equal and opposite reaction force applied in an upward direction against the bottom surface of the curved plate 304. The resulting upward force acts in a direction opposite to the downward force applied by one or more of the inner tubes 320 against the curved plate 304.

[0039]

[0047] Each of the embodiments of Figures 3C and 3D has certain unique advantages. Returning to the embodiment of Figure 3C, because the multiple internal actuators 330c act on the flexure plate 304 as opposed to directly acting on the membrane 317, the multiple internal actuators 330c are disposed within the housing 111, where adequate space is available to accommodate significant design changes of the multiple internal actuators 330c. Furthermore, by disposing the multiple internal actuators 330c above the flexure plate 304, the multiple internal actuators 330c are less susceptible to slurry contamination. In some embodiments (not shown), additional sealing mechanisms can be incorporated into the substrate carrier 300 to prevent slurry contamination. For example, one or more sliding seals may be disposed between the piston 334 of the internal actuator 330c and the flexure plate 304 to enhance the seal therebetween. Returning now to the embodiment of FIG. 3D , because the multiple internal actuators 330d act directly on the membrane 317 as opposed to acting on the curved plate 304, the multiple internal actuators 330d can generate the same narrowly distributed load on the outer edge of the membrane 317 and / or tilt of the membrane 317 with less piston 334 displacement, which allows shorter actuators to be used.

[0040]

[0048] FIG. 4 is a side cross-sectional view of another embodiment of a substrate carrier 410 that may be used in the polishing system 101 of FIG. 1B. The embodiment of FIG. 4 may be combined with other embodiments described herein. The substrate carrier 410 includes an internal actuator 430 coupled to the base assembly 116. The internal actuator 430 may be similar in structure and function to the external actuator 202 and / or the internal actuators 330, 340. Generally, the internal actuator 430 includes a cylindrical housing 432 and a piston 434. The cylindrical housing 432 is coupled to the bottom side of the base assembly 116. The piston 434 is partially disposed inside the cylindrical housing 432. The piston 434 is operable to move toward and away from the cylindrical housing 432 substantially along the z-axis. The piston 434 is configured to contact the bottom 117a of the membrane 117 to transfer a load from the internal actuator 430 through the membrane 117 to the substrate 122.

[0041]

[0049] Although only one internal actuator 430 is shown in FIG. 4, it will be understood that multiple internal actuators 430 may be arranged in one or more concentric rings around the carrier axis B. In some embodiments (not shown), the number of internal actuators 430 in each concentric ring may be 1 to 12 internal actuators, e.g., 1 to 4 internal actuators, 4 to 12 internal actuators, 4 to 8 internal actuators. In some other embodiments (not shown), the multiple internal actuators 430 include an array of internal actuators 430 arranged at various radial distances from the carrier axis B. In some embodiments (not shown), one or more pressure zones of the membrane 117 include a ring of internal actuators 430. In certain embodiments, the pressure between the substrate 122 and the polishing pad 106 may be locally controlled in distinct circumferential and radial regions by timing the actuation of each of the multiple internal actuators 430.

[0042]

[0050] While the above is directed to embodiments of the disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the following claims.

Claims

1. 1. A substrate carrier configured to be attached to a polishing system for polishing a substrate, the substrate carrier comprising: Housing and a retaining ring coupled to the housing; a membrane disposed within the housing and spanning an inner diameter of the retaining ring, the membrane comprising: a bottom portion configured to contact the substrate; a top portion opposite the bottom portion; and a membrane having sides extending perpendicularly between said bottom and said top, said membrane outer edge being the outer portion of said sides, bottom and top of said membrane; an actuator disposed at an outer edge of the membrane and configured to apply a load to the outer edge of the membrane toward the substrate to thereby vary a pressure applied between the substrate disposed on the substrate carrier and a polishing pad; Equipped with the side portion includes an annular recess formed along an outer edge of the membrane, an annular sleeve is disposed within the annular recess, and the load applied to the outer edge of the membrane is applied via the annular sleeve; the actuator comprises a piston engaging the top of the membrane, and the load applied to the outer edge of the membrane is applied by the piston applying a load to the top of the membrane; Board carrier.

2. The substrate carrier of claim 1 , further comprising a curved plate coupled to the housing.

3. The substrate carrier of claim 2 , wherein the piston of the actuator is disposed through a hole formed in the flexure plate.

4. The substrate carrier of claim 2 , wherein the actuator is disposed on an underside of the flexure plate, and the load applied to the top of the membrane is applied via the annular sleeve.

5. 1. A substrate carrier configured to be attached to a polishing system for polishing a substrate, the substrate carrier comprising: Housing and a retaining ring coupled to the housing; a membrane disposed within the housing and spanning an inner diameter of the retaining ring, the membrane comprising: a bottom portion configured to contact the substrate; a top portion opposite the bottom portion; and a membrane having sides extending perpendicularly between said bottom and said top, said membrane outer edge being the outer portion of said sides, bottom and top of said membrane; an actuator disposed at an outer edge of the membrane and configured to apply a load to the outer edge of the membrane toward the substrate to thereby modify a pressure applied between the substrate disposed on the substrate carrier and a polishing pad; a curved plate coupled to the housing; Equipped with the side portion includes an annular recess formed along an outer edge of the membrane, an annular sleeve is disposed within the annular recess, and the load applied to the outer edge of the membrane is applied via the annular sleeve; the actuator comprises an inner tube disposed within the housing; A substrate carrier, wherein the inner tube is configured to apply the load to a portion of the curved plate to modify the pressure applied between the substrate disposed on the substrate carrier and the polishing pad.

6. The substrate carrier of claim 5 , wherein a protrusion of the curved plate engages the top of the membrane to apply the load.

7. an upper load ring configured to contact the housing; a lower load ring disposed in the housing; a plurality of load pins circumferentially disposed in the housing, each of the plurality of load pins having a proximal end coupled to the upper load ring and a distal end coupled to the lower load ring; 2. The substrate carrier of claim 1 , further comprising: a piston configured to engage a first end of the first load ring and a second end of the second load pin, the first end of the second load ring, and the second end of the second load pin.

8. The substrate carrier of claim 7 , wherein the upper load ring is disposed in the housing.

9. 9. The substrate carrier of claim 8, wherein the lower load ring includes a flange portion coupled to the distal end of each of the plurality of load pins and a body portion extending perpendicular to the flange portion, the body portion contacting the annular sleeve disposed within the membrane.

10. 1. A substrate carrier configured to be attached to a polishing system for polishing a substrate, the substrate carrier comprising: Housing and a retaining ring coupled to the housing; a membrane disposed within the housing and spanning an inner diameter of the retaining ring, the membrane comprising: a bottom portion configured to contact the substrate; a top portion opposite the bottom portion; and a membrane having sides extending perpendicularly between said bottom and said top, said membrane outer edge being the outer portion of said sides, bottom and top of said membrane; an actuator disposed at an outer edge of the membrane and configured to apply a load to the outer edge of the membrane toward the substrate to thereby vary a pressure applied between the substrate disposed on the substrate carrier and a polishing pad; Equipped with the actuator is disposed between the membrane and a base of the substrate carrier; 11. A substrate carrier configured such that the pressure between the substrate disposed in the substrate carrier and the polishing pad is controlled in distinct circumferential and radial regions by timing the actuation of the actuator.

11. the polishing system comprises a plurality of actuators, each actuator of the plurality of actuators disposed between the membrane and the base of the substrate carrier, the pressure being controlled by timing the actuation of the plurality of actuators; and The substrate carrier of claim 10 , wherein the plurality of actuators are arranged in a plurality of concentric rings about a central axis of the substrate carrier.

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