Substrate support unit and apparatus and method for depositing a layer using a substrate support unit - Patents.com
The substrate support unit with independently driven and orientable substrate carriers addresses the complexity and maintenance challenges of existing units, enhancing maintenance efficiency and positioning accuracy.
Patent Information
- Application Number
- JP2022521382
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2019-10-08
- Filing Date
- 2020-09-08
- Publication Date
- 2025-04-10
- Estimated Expiration
- 2040-09-08
AI Technical Summary
Existing substrate support units for thin film deposition are complex and require extensive maintenance, making it difficult to replace individual substrate carriers without synchronizing their orientation, which is time-consuming and inefficient.
A substrate support unit with a rotatable turntable and independently orientable substrate carrier units, each driven by a separate drive unit, allowing for easy replacement and precise positioning of substrate carriers without requiring synchronization.
This design simplifies maintenance by allowing easy replacement of substrate carriers and improves positioning accuracy, reducing downtime and operational complexity.
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Abstract
Description
[Technical field]
[0001] The present invention relates to a substrate support unit and an apparatus and method for depositing thin films using the substrate support unit, and more particularly to a substrate support unit configured to support multiple substrates and an apparatus and method for depositing thin films on substrates using the substrate support unit. [Background technology]
[0002] Generally, semiconductor devices are manufactured through various processes, such as deposition processes, photolithography processes, etching processes, and cleaning processes. Among these processes, deposition processes are performed to form layers of materials on a substrate. Deposition processes include, for example, physical vapor deposition (PVD) processes, chemical vapor deposition (CVD) processes, and atomic layer deposition (ALD) processes.
[0003] For example, US Pat. No. 6,399,633 discloses a substrate support unit having a rotating plate and a number of substrate carriers rotatably mounted on the rotating plate, where a single drive drives the rotation of the rotating plate and the rotation of the substrate carriers on the rotating plate. Such a concept is complex and therefore requires extensive maintenance. Since all substrate carriers are rigidly connected to each other, adjusting the individual substrate carriers is very complicated and time-consuming, especially when only one substrate carrier needs to be replaced. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] US Patent Application Publication No. 2012 / 0145080 Summary of the Invention [Problem to be solved by the invention]
[0005] SUMMARY OF THE PRESENT EMBODIMENT It is therefore an object of the present invention to provide a table support which allows easy maintenance, i.e. easy replacement of the support carriers, and which is more accurate with regard to the positioning of each of the substrate carriers. [Means for solving the problem]
[0006] This problem is solved by a substrate support unit having the features of claim 1. Further embodiments of the substrate support unit as well as an apparatus and a method for depositing a thin film onto a substrate using said substrate support unit are defined by the features of the further claims.
[0007] A substrate support unit according to the present invention comprises a turntable rotatable about a first axis and driven by a first drive unit, and a plurality of substrate carrier units arranged on the turntable concentrically about the first axis, each substrate carrier unit comprising a substrate carrier rotatable about a corresponding second axis and driven by a second drive unit, all of the second axes being parallel to the first axis.
[0008] With such a design, each substrate carrier can be oriented independently from each other and also from the turntable. Additionally, the replacement of one substrate carrier unit is easy and does not require synchronizing the orientation of the replaced substrate carrier with that of the other substrate carriers, thus reducing the effort of replacement. The substrate to be coated can be placed directly on the rotatable carrier. It is also possible to position the substrate on an intermediate carrier and place the intermediate carrier with the mounted substrate on the rotatable carrier.
[0009] In one embodiment, the second drive is suitable for vacuum. Such a drive can be introduced very close to the substrate carrier. The shorter transmission distance can increase the positioning accuracy of the substrate carrier. A vacuum-suitable drive requires a degassing process and more heat-resistant components. Additionally, if the drive is suitable for vacuum, no complex force transmission from the surroundings to the vacuum is necessary.
[0010] In one embodiment, the first drive and / or the second drive are stepper motors. Alternatively, the first drive and / or the second drive can be servo drives. When position determination is required, operation of a stepper motor requires fewer electrical cables than a servo drive.
[0011] In one embodiment, the turntable comprises a disk-shaped upper table plate with holes for receiving one substrate carrier unit, all holes being arranged on a common diameter concentric about a first axis. With such a design, it is possible to place a substrate carrier unit in all holes, or one or more holes can be closed by a cover. The holes can be evenly or unevenly distributed around the circumference of the turntable.
[0012] In one embodiment, each substrate carrier unit comprises a housing in which the second drive is received, and with the housing, each substrate carrier unit is positioned in a corresponding hole of the turntable, and when the substrate carrier unit needs to be replaced, the substrate carrier unit can be easily removed together with the housing, reducing downtime.
[0013] In one embodiment, a mounting flange is slidably disposed on the first shaft of the second drive section along the second axis, the first shaft protruding from the top surface of the housing. The mounting flange allows the vertical position of the substrate carrier to be adjusted. The top surface of the housing extends perpendicular to the first shaft and is essentially flush with the top surface of the upper table plate.
[0014] In one embodiment, an insulator is disposed between the mounting flange and the substrate carrier, the insulator reducing thermal stresses on the mounting flange and therefore the second actuation part.
[0015] In one embodiment, the position detection system is disposed on the second drive, opposite the first shaft. The position flag is disposed on the second shaft of the second drive, the second shaft being collinear with the first shaft and exiting the second drive opposite the first shaft at the second drive. The position flag is disk-shaped, extends beyond the width of the second drive, and includes at least one opening, the opening extending over a portion of the periphery of the portion of the disk that extends beyond the width of the second drive. A reflector is disposed within the housing of the substrate carrier unit adjacent to the second drive, the reflector being disposed essentially perpendicular to the connecting line of the first axis and the corresponding second axis, oriented parallel to the second axis, and facing the position flag.
[0016] In one embodiment, an upper shield is disposed around the substrate carrier and covers the top surface of the turntable, the top surface of the upper shield being essentially flush with the top surface of the substrate carrier. The shield has a lightweight design, reduces the heat load on the turntable, and prevents the turntable from becoming coated during operation. The shield can be easily replaced and easily cleaned elsewhere.
[0017] In one embodiment, a lower table plate is disposed below the second drive and extends around the entire periphery of the turntable, the lower table plate protecting the substrate carrier units from the opposite side to the upper table plate.
[0018] In one embodiment, a substrate lift is arranged on each substrate carrier. The substrate, or the substrate together with the intermediate carrier, can be lifted from the substrate carrier and lowered to the substrate carrier. For example, the substrate lift comprises pins with which the substrate can be lifted directly or with which the intermediate carrier can be lifted. With three pins, the substrate or intermediate carrier is always stably positioned on the pins, regardless of the flatness.
[0019] In one embodiment, a lifter is placed under the turntable at the substrate loading position. The lifter is designed to engage with each substrate lift assigned to the substrate loading position. This allows only one lifter, i.e. one actuator, to lift all substrates. Alternatively, instead of having a substrate lift and a lifter, a load robot can be used. The load robot can transfer the substrate, or the substrate together with the intermediate carrier, to the rotatable substrate carrier by performing horizontal and vertical movements. The horizontal movements can be linear and / or pivotal movements.
[0020] In one embodiment, a laser sensor is placed under the turntable at the substrate load position. The laser is positioned essentially perpendicular to the first axis and the corresponding second axis connection line, oriented parallel to the second axis, and facing the position flag. The distance from the laser sensor to the connection line is the same as the distance from the reflector to the connection line. With this arrangement of the laser sensor and reflector, the highest accuracy of the position of the substrate carrier at the substrate load position can be achieved. However, other positions of the laser sensor and reflector can also be realized.
[0021] In one embodiment, at least two of the second drives are electrically connected in series. This can reduce the number of electrical cables required. Fewer electrical cables are desirable because all cables need to be guided from the rotating turntable to the stationary base. Fewer cables means fewer rotational feedthroughs are required.
[0022] In one embodiment, the substrate support unit comprises a control unit arranged in an atmospheric and static location, and each of the series second drives is connected to the control unit by a vacuum feedthrough and a rotary feedthrough, such a design is less demanding in terms of tightness than a vacuum rotary feedthrough.
[0023] In one embodiment, each second drive comprises a temperature sensor. The temperature sensor of one second drive in each of the series of second drives is connected to the control unit. In this way, the number of electrical cables that need to pass through the rotary feedthrough is reduced. For example, if there are two, three, four or five series-connected electrically connected second drives, each second drive comprises a temperature sensor, but only one of these temperature sensors is connected to the control unit.
[0024] The features of the above-described embodiments of the substrate support unit may be used in any combination unless they are mutually exclusive.
[0025] An apparatus for depositing a thin film on a substrate according to the invention comprises a process chamber, at least one supply on a first side of the process chamber, and a substrate support unit according to any one of the above embodiments. The substrate support unit defines a second side of the process chamber opposite the first side of the process chamber. The substrate support unit may define a lower side and the supply may be located on an upper side, or vice versa. It is also possible to have an arrangement in which the axis of the turntable is oriented horizontally, so that the substrate support unit defines one lateral side of the process chamber and the supply defines the opposite lateral side.
[0026] In one embodiment, the apparatus comprises a transfer module arranged at a substrate load position of the substrate support unit and at least one load module arranged at the transfer module on the opposite side of the substrate support unit. It is also possible to have two or more load modules arranged next to each other on the opposite side of the substrate support unit. In the load module, a single substrate or a batch of substrates can be arranged with or without an intermediate carrier. The transfer module can transfer the substrate or the intermediate carrier with the carried substrate from the at least one load module to the substrate load position or directly into the process chamber.
[0027] A process for depositing a thin film on a substrate according to the present invention comprises the steps of: - providing a substrate support unit according to any one of the above embodiments; - providing a process chamber with at least one supply of a first side of the process chamber, the substrate support unit defining a second side of the process chamber opposite the first side of the process chamber; - positioning one of the substrate carrier units into a substrate loading position using a first drive; - orienting a substrate carrier of the substrate carrier unit into a substrate loading position using a corresponding second drive; - loading a substrate onto the substrate carrier; - rotating the first drive while passing through an influence area of at least one supply unit to deposit an oriented thin film on the loaded substrate, or and rotating the first and second actuators while passing through an influence area of the at least one supply unit to deposit a non-oriented thin film on the loaded substrate.
[0028] Embodiments of the invention are described in more detail below with reference to the drawings, which are for illustrative purposes only and should not be construed as limiting. [Brief description of the drawings]
[0029] [Figure 1] 1 is a partial cross-sectional view of an apparatus for depositing a thin film onto a substrate using a substrate support unit according to the present invention; [Diagram 2] FIG. 2 is a top perspective view of the turntable of FIG. 1. [Diagram 3] 2 is a cross-sectional view of the substrate carrier unit of FIG. 1; [Figure 4] FIG. 2 is an exploded perspective view from below of the load position of the device of FIG. 1; [Diagram 5] 2 is a schematic connection diagram of the substrate supporting unit of FIG. 1. [Figure 6] FIG. 2 is a top perspective view of a complete system for depositing thin films onto a substrate using the apparatus of FIG. 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0030] FIG. 1 shows a partial cross-sectional view of an apparatus 1 for depositing a thin film on a substrate by means of a substrate support unit according to the invention, and FIG. 2 shows a perspective view from above of a turntable 2 of FIG. 1. The apparatus 1 comprises a housing 10 which defines a process chamber at least on its upper side and on its lateral side. In the illustrated embodiment, the turntable 2 is arranged at least partially in the process chamber 11. The turntable 2 is arranged in the housing 10 gas-tight and rotatably about a first axis A1. In the process chamber 11 a vacuum can be achieved. A table shaft 21 of the turntable 2 is mounted in the housing 10 by means of a gas-tight bearing 210. The turntable 2 further comprises an upper table plate 20 and a lower table plate 24, the lower table plate 24 being connected to the table shaft 21 and the upper table plate 20 being connected to the lower table plate 24. Both table plates are arranged completely in the process chamber 11. The upper table plate 20 and the lower table plate 24 both have the shape of a circular disk. The upper table plate 20 rests on a circular wall 240, which extends essentially perpendicularly from the upper surface of the lower table plate 24. A ceiling 241 is arranged between the upper surface of the circular wall and the lower surface of the upper table plate 20. On the upper table plate 20, a plurality of substrate carrier units 3 are arranged, each evenly distributed around the periphery of the upper table plate 20 or the first axis A1. Each substrate carrier unit 3 comprises at least a substrate drive part 31 and a substrate carrier 34. The substrate carrier 34 is arranged on the substrate drive part 31 and is rotatable around the second axis A2. At the same lateral distance from the first axis A1 as each substrate carrier unit 3, at least one supply part 12 for coating substrates is arranged on the housing 10, such that one side of the supply part 12 faces the substrate carrier 34. The substrate carrier unit 3 can pass under the supply part 12 when the turntable 2 rotates. An upper shield 23 is disposed on the upper side of the upper table plate 20 , surrounding the substrate carrier 34 and completely covering the top surface of the upper table plate 20 .As the substrate carriers 34 are circular disks, the cutouts in the upper shield 23 are correspondingly circular. There is a small clearance between the lateral sides of each substrate carrier disk 34 and the corresponding cutouts. Each substrate carrier unit 3 is electrically connected to the control unit 7 by means of an electric cable. The electric cable passes through a vacuum feedthrough 26 and a rotary feedthrough 27, the vacuum feedthroughs 26 of each substrate carrier unit 3 being arranged in a circular wall 240, separating the process chamber 11 from the surrounding atmosphere. A common rotary feedthrough 27 for all substrate carrier units 3 is arranged inside the table shaft 21. The turntable 2 can be rotated by means of a table drive 22 that engages with the table shaft 21. In the load / unload position, the substrate lift 4 and the lifter 5 are arranged. The substrate lift 4 comprises pins 40 arranged on a common pin holder 41. In the correct loading position, the turntable 2 and the substrate carrier unit 3 are positioned and oriented such that the pins 40 can pass through corresponding through holes in the lower table plate 24, the upper table plate 20 and the substrate carrier 34 and lift the substrate from or lower the substrate onto the substrate carrier 34. The substrate is provided or removed by the transfer module as shown in FIG. 6. To determine the correct position and the orientation of the turntable 2, respectively, a table flag 25 is provided on the periphery of the turntable 2. In the embodiment of FIG. 2, the table flag 25 is arranged on the lower table plate 24 and extends laterally outward beyond the periphery of the lower table plate 24. The table flag 25 comprises at least one slot which, together with an optical sensor, allows for a correct determination of the orientation of the turntable 2.
[0031] FIG. 3 shows a cross-sectional view of the substrate carrier unit 3 of FIG. 1. The substrate carrier unit 3 comprises a housing 30 in which a substrate drive 31 is arranged. The housing 30 comprises a flange, which is arranged in a corresponding opening 200 in the upper table plate 20. The upper surface of the flange is essentially flush with the upper surface of the upper table plate 20. The orientation of the housing 30, and thus of the substrate drive 31, is such that the second axis of rotation A2 extends perpendicularly to the upper table plate 20. The substrate drive 31 comprises a first shaft 310, which extends beyond the upper surface of the housing 30 along the second axis A2. A mounting flange 32 is arranged on the first shaft 310. The mounting flange 32 is disk-shaped, can be moved along the second axis A2 and can be fixed on the first shaft by fixing means, for example a fixing screw. A disk-shaped insulator 33 is arranged on the mounting flange 32. The substrate carrier 34 is disposed on an insulator 33. The insulator 33 is a thermal insulator that includes a material with low thermal conductivity, thus reducing the heat load on the mounting flange 32. The top side of the substrate carrier 34 has a ridge for supporting the substrate or holding the substrate in place. The ridge can be a point, a line, or a surface. For example, such a ridge can be a ridge. The peripheral ridge can prevent lateral movement of the substrate on the substrate carrier 34. The substrate drive 31 comprises a second shaft 311 on the opposite side of the substrate drive 31 from the first shaft 310. The second shaft 311 is rotatable about a second axis A2. The disk-shaped drive flag 35 is disposed on the second shaft 311. The drive flag 35 comprises at least one slot, which extends over a portion of the peripheral area of the drive flag 35. In the region of at least one slot, a reflector 36 is arranged on the housing 30 on the side of the drive flag 35 facing the substrate carrier 34. The lower table plate 24 is arranged below the drive flag 35. A through hole is formed in the lower table plate 24 and aligned with the reflector 36.The reflector 36 of each substrate carrier unit 3 is arranged in a plane perpendicular to the first axis A1 such that the connection line between the first axis A1 and the second axis A2 is essentially perpendicular to the connection line between the second axis A2 and the reflector 36.
[0032] FIG. 4 shows an exploded perspective view from below of the load position of the apparatus 1 of FIG. 1. One substrate carrier unit 3 is aligned with the substrate lift 4, the lifter 5, and the position sensor 6 of the load position. Before lifting, the upper tips of the pins 40 are positioned under the lower table plate 24 of the turntable 2. A pin holder 41 holding all the pins 40 is connected to the lifter 5 which, when activated, can lift the pins 40 vertically towards the substrate carrier unit 3. The position sensor 6 can emit a laser beam 60 which passes through a through hole in the lower table plate 24 in the load position and can reach the reflector 36 of the substrate carrier unit 3 depending on the position of the slot of the drive flag 35. To align a particular substrate carrier unit 3 to the load position, the turntable 2 can be rotated until the particular substrate carrier unit 3 is in the load position. This can be achieved by a position sensor together with the table flag 25 or by an encoder of the table drive 22. The substrate carrier 34 is subsequently rotated until the position sensor 6 together with the drive flag 35 indicates the correct orientation of the substrate carrier 34. The substrate lift 4 can then be operated to load or unload a substrate onto or from the substrate carrier 34.
[0033] FIG. 5 shows a schematic connection diagram of the substrate support unit of FIG. 1. In the illustrated embodiment, five substrate drives 31 are bundled in the unit. Each drive 31 comprises a first coil, a second coil and an integrated temperature sensor 312. Each drive is connected to the control unit 7 by an individual vacuum feedthrough 26 and a common rotary feedthrough 27. The first coil is connected to an input wire 3100 and an output wire 3102, and the second coil is connected to an input wire 3101 and an output wire 3103. As the drives 31 are connected in series, the input wire of the subsequent drive corresponds to the output wire of the preceding drive. When electricity flows through the wires, all drives rotate synchronously with each other. Additionally, the number of wires is reduced to two input wires and two output wires. A temperature sensor is connected to the input wire 3120 and the output wire 3121. For each unit, only the temperature sensor 312 of one drive 31 is connected to the control unit. Therefore, for each unit, only four wires for the drive and two wires for the temperature sensor 312 need to pass through the rotary feedthrough 27.
[0034] FIG. 6 shows a top perspective view of a complete system for depositing a thin film on a substrate using the apparatus 1 of FIG. 1. On the top side of the apparatus 1, a number of feeders 12 are arranged around the periphery. Adjacent to the load position is a transfer module 8. The transfer module 8 is sealingly connected to the apparatus 1, and the inside of the transfer module 8 is connected to the process chamber of the apparatus 1, respectively. The transfer module 8 comprises an alignment section 80 for orienting the substrate to be coated in a predefined orientation. Adjacent to the transfer module 8, on the opposite side of the apparatus 1, is a load module 9. The load module 9 is sealingly connected to the transfer module 8. The load module 9 comprises, in the illustrated embodiment, two load stations, into which the substrates to be coated can be loaded singly or in batches. [Explanation of symbols]
[0035] 1 device 10. Housing 11 Process chamber 12 Supply section 2. Turntable 20 Upper Table Plate 200 Opening 201 Cover 21 Table shaft 210 Bearings 22 Table drive unit 23 Upper Shield 24 Lower Table Plate 25 Table Flags 26 Vacuum Feedthrough 27 Rotary Feedthrough 3 Board Carrier Unit 30 Housing 31 Board drive unit 310 1st Shaft 311 Second Shaft 312 Temperature Sensor 3100 1st supply wire 3101 2nd supply wire 3102 First return wire 3103 Second return wire 3120 Supply wire 3121 Return wire 32 Mounting flange 33 Insulators 34 PCB Carrier 35 Driving Flag 36 Reflector 4. Lift the board 40 pin 41 Pin holder 5 Lifter 6 Position Sensors 60 Laser Beam 7. Control Unit 8. Transfer Module 80 Alignment Section 9 Load Modules A1 First axis A2 2nd axis
Claims
1. A turntable (2) rotatable around a first axis (A1) and driven by a first drive unit (22); a plurality of substrate carrier units (3) arranged on the turntable (2) concentrically about the first axis (A1), each of the substrate carrier units (3) comprising a substrate carrier (34) rotatable about a corresponding second axis (A2) and driven by a second drive (31); All of the second axes (A2) are parallel to the first axes (A1); The turntable (2) comprises a disk-shaped upper table plate (20) having a plurality of holes (200) for receiving one of the substrate carrier units (3); All of said holes (200) are arranged on a common diameter and concentric with said first axis (A1); A substrate support unit, wherein each of the substrate carrier units (3) has a housing (30) in which the second drive part (31) is received, and each of the substrate carrier units (3) is positioned in a corresponding hole (200) of the turntable (2) with the housing (30).
2. A turntable (2) rotatable around a first axis (A1) and driven by a first drive unit (22); a plurality of substrate carrier units (3) arranged on the turntable (2) concentrically about the first axis (A1), each of the substrate carrier units (3) comprising a substrate carrier (34) rotatable about a corresponding second axis (A2) and driven by a second drive (31); All of the second axes (A2) are parallel to the first axes (A1); an upper shield (23) is disposed around the substrate carrier (34) and covers the top surface of the turntable (2); A substrate support unit, wherein a top surface of the upper shield (23) is essentially flush with a top surface of the substrate carrier (34).
3. A turntable (2) rotatable around a first axis (A1) and driven by a first drive unit (22); a plurality of substrate carrier units (3) arranged on the turntable (2) concentrically about the first axis (A1), each of the substrate carrier units (3) comprising a substrate carrier (34) rotatable about a corresponding second axis (A2) and driven by a second drive (31); All of the second axes (A2) are parallel to the first axes (A1); A substrate support unit, wherein a lower table plate (24) is disposed below said second drive part (31) and extends around the entire periphery of said turntable (2).
4. Substrate support unit according to any one of the preceding claims, wherein the second drive part (31) is suitable for vacuum.
5. The substrate support unit according to any one of claims 1 to 4, wherein the first drive unit (22) and / or the second drive unit (31) is a stepping motor.
6. a mounting flange (32) is slidably disposed on the first shaft (310) of the second drive part (31) along the second axis (A2); The first shaft (310) protrudes from the top surface of the housing (30); The substrate support unit of claim 1, wherein the top surface of the housing (30) extends perpendicular to the first shaft (310) and is essentially flush with a top surface of the upper table plate (20).
7. The substrate support unit of claim 6, wherein an insulator (33) is disposed between the mounting flange (32) and the substrate carrier (34).
8. a position detection system (35, 36) is arranged on the second drive part (31) on the opposite side of the first shaft (310); a position flag (35) is disposed on the second shaft (311) of the second drive part (31); the second shaft (311) is collinear with the first shaft (310) and exits the second drive section (31) on an opposite side of the second drive section (31) to the first shaft (310); the position flag (35) is disk-shaped, extends beyond the width of the second drive part (31) and has at least one opening, the opening extending over a portion of the periphery of the portion of the position flag (35) that extends beyond the width of the second drive part (31); 8. The substrate support unit of claim 6 or 7, wherein a reflector (36) is arranged in the housing (30) of the substrate carrier unit (3) adjacent to the second drive part (31), the reflector (36) being arranged essentially perpendicular to a connection line of the first axis (A1) and the corresponding second axis (A2), oriented parallel to the second axis (A2) and facing the position flag (35).
9. a laser sensor (6) is arranged below the turntable (2) at a substrate loading position, essentially perpendicular to a connection line of the first axis (A1) and the corresponding second axis (A2), oriented parallel to the second axis (A2) and facing the position flag (35); 9. The substrate support unit according to claim 8, wherein the distance of the connecting line from the laser sensor (6) is the same as the distance of the connecting line from the reflector (36).
10. The substrate support unit according to any one of the preceding claims, wherein a substrate lift (4) is arranged on each of the substrate carriers (34).
11. The substrate support unit of claim 10, wherein a lifter (5) is arranged below the turntable (2) at a substrate loading position, the lifter (5) being designed to be capable of engaging with each of the substrate lifts (4) assigned to the substrate loading position.
12. The substrate support unit according to any one of the preceding claims, wherein at least two of the second drives (31) are electrically connected in series.
13. A control unit (7) arranged in an atmospheric and static location, 13. Substrate support unit according to claim 12, wherein each of the second drives (31) in series is connected to the control unit (7) by a vacuum feedthrough (26) and a rotary feedthrough (27).
14. Each of the second drive units (31) includes a temperature sensor (312); 14. The substrate support unit according to claim 13, wherein the temperature sensor (312) of each one of the second drives (31) in series is connected to the control unit (7).
15. An apparatus (1) for depositing a thin film on a substrate, comprising: A process chamber (11); At least one supply (12) on a first side of the process chamber (11); A substrate support unit according to any one of claims 1 to 14, The apparatus (1), wherein the substrate support unit defines a second side of the process chamber (11) opposite to the first side of the process chamber (11).
16. a transfer module (8) arranged at a substrate loading position of the substrate support unit; 16. The apparatus (1) according to claim 15, comprising at least one load module (9) arranged on the transfer module (8) opposite the substrate support unit.
17. 1. A process for depositing a thin film on a substrate, comprising: - providing a substrate support unit according to any one of claims 1 to 14, - providing a process chamber (11) with at least one supply (12) for a first side of said process chamber (11), said substrate support unit defining a second side of said process chamber (11) opposite said first side of said process chamber (11); - positioning one of the substrate carrier units (3) in a substrate loading position using the first drive (22); - orienting the substrate carrier (34) of the substrate carrier unit (3) to the substrate loading position using the corresponding second drive (31); - loading a substrate onto said substrate carrier (34); - rotating said first drive part (22) while passing through an area of influence of at least one said supply part (12) in order to deposit an oriented thin film on said loaded substrate, or and rotating the first drive (22) and the second drive (31) while passing through an influence area of at least one of the supply parts (12) to deposit a non-oriented thin film onto the loaded substrate.
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