SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract

To provide a substrate processing apparatus capable of effectively suppressing the supply of a treatment liquid containing particles to a substrate.SOLUTION: A substrate processing apparatus 1 comprises: a treatment liquid tank 30; a first circulation pipeline 31; a filter 39; a pump 37; and a control part 3A. In the first circulation pipeline 31, an upstream end 31a is connected to the treatment liquid tank 30, a downstream end 31b is connected to the treatment liquid tank 30, and a treatment liquid is circulated. The filter 39 is arranged in the first circulation pipeline 31, and captures particles contained in the treatment liquid. The pump 37 is arranged on the first circulation pipeline 31. The pump 37 includes a rotational body 371, and the treatment liquid can be transmitted by rotating the rotational body 371. In the case of driving the pump 37 in a stop state, the control part 3A controls the pump 37 so that the rotational body 371 is rotated at a roll acceleration of 400 rpm / sec or less.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] The liquid processing apparatus described in Patent Document 1 includes a tank, a circulation line, a pump, a filter, a back-pressure valve, and a control unit. The tank stores the processing liquid. The circulation line returns the processing liquid sent from the tank to the tank. The pump forms a circulating flow of the processing liquid in the circulation line. The filter is provided in the circulation line downstream of the pump. The back-pressure valve is provided in the circulation line downstream of the filter. The control unit controls the pump and the back-pressure valve. When starting to circulate the processing liquid in the circulation line, the control unit controls the pump's discharge pressure so that the pump's discharge pressure rises to a first pressure and increases to a second pressure greater than the first pressure after a predetermined time has elapsed.

[0003] By controlling the discharge pressure of the pump to the first pressure and starting circulation of the treatment liquid, the pressure difference between the upstream and downstream sides of the filter can be kept small, which prevents foreign matter (particles) from passing through the filter due to the discharge pressure of the pump immediately after starting circulation of the treatment liquid. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-41039 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the liquid processing apparatus described in Patent Document 1 does not disclose any type of pump, which may include, for example, a bellows pump that pumps out processing liquid using a bellows, and a pump that pumps out processing liquid by rotating a rotor (e.g., an impeller).

[0006] The inventors of the present application have focused on pumps that deliver processing liquid by rotating a rotating body and, as a result of extensive research, have gained new knowledge regarding particles in processing liquid supplied to a substrate.

[0007] That is, when a pump is started from a stopped state and the rotor rotates at a high rotational acceleration (e.g., 3000 rpm / sec), a pressure difference is generated inside the pump, which may result in air bubbles being generated in the processing liquid being pumped out by the rotor, depending on the situation.

[0008] Specifically, according to Bernoulli's theorem, as the velocity of a fluid increases, the pressure decreases. In other words, the greater the acceleration of the fluid, the greater the pressure drop. Therefore, it becomes easier for the saturated vapor pressure of the processing liquid to be reached. As a result, when a stopped pump is started and the rotor rotates at a high rotational acceleration, bubbles may easily be generated in the processing liquid being pumped out by the rotor.

[0009] Bubbles generated in the processing liquid may trap particles accumulated on the secondary side of the filter, particles accumulated on the secondary side of the filter and dispersed into the flow path, and / or particles retained in the flow path. In this case, the processing liquid containing particles may be supplied to the substrate. Even if such a possibility is extremely low, it is preferable to take measures in consideration of the recent trend toward finer substrate patterns.

[0010] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide a substrate processing apparatus and a substrate processing method that can effectively prevent processing liquid containing particles from being supplied to a substrate. [Means for solving the problem]

[0011] According to one aspect of the present invention, a substrate processing apparatus processes a substrate with a processing liquid. The substrate processing apparatus includes a processing liquid storage unit, a first circulation pipe, a filter, a pump, and a control unit. The processing liquid storage unit stores the processing liquid. The first circulation pipe has an upstream end connected to the processing liquid storage unit and a downstream end connected to the processing liquid storage unit, through which the processing liquid circulates. A filter is disposed in the first circulation pipe and captures particles contained in the processing liquid. A pump is disposed in the first circulation pipe. The control unit controls the pump. The pump has a rotating body and rotates the rotating body to deliver the processing liquid. When the pump is driven while stopped, the control unit controls the pump so that the rotating body rotates at a rotational acceleration of 400 rpm / sec or less.

[0012] When driving the pump in a stopped state, the control unit may control the pump by rotating the rotating body at a rotational acceleration of 400 rpm / sec or less and over 120 seconds or more so that the rotation speed reaches a target rotation speed. In one aspect of the present invention, when the pump is driven while stopped, the control unit preferably controls the pump so that the rotating body rotates at a constant rotational acceleration of 400 rpm / s or less. When the rotation speed of the rotating body reaches a target rotation speed, the control unit preferably controls the pump so that the rotating body maintains the target rotation speed.

[0013] In one aspect of the present invention, when the pump is driven in a stopped state, the control unit preferably controls the pump so that the rotating body rotates at a rotational acceleration of 50 rpm / sec or less.

[0014] In one aspect of the present invention, the substrate processing apparatus preferably further includes a first drainage pipe and a first drainage valve. The first drainage pipe is preferably connected to the first circulation pipe and discharges the processing liquid from the first circulation pipe. The first drainage valve is preferably disposed in the first drainage pipe and opens and closes a flow path of the first drainage pipe. When driving the pump in a stopped state, the control unit preferably controls the first drainage valve so that the first drainage valve opens the flow path of the first drainage pipe.

[0015] In one aspect of the present invention, the substrate processing apparatus preferably further includes a second drainage pipe and a second drainage valve, the second drainage pipe preferably extending from the filter and discharging the processing liquid from the filter. The second drainage pipe may extend from the primary space of the filter and discharge the treated liquid from the primary space of the filter. A second drainage valve is preferably disposed in the second drainage pipe and opens and closes a flow path of the second drainage pipe. When the pump is driven in a stopped state, the control unit preferably controls the second drainage valve so that the second drainage valve opens the flow path of the second drainage pipe.

[0016] In one aspect of the present invention, the substrate processing apparatus preferably further includes a first circulation valve, a second circulation pipe, and a second circulation valve. The first circulation valve is preferably disposed in the first circulation pipe and opens and closes a flow path of the first circulation pipe. The second circulation pipe preferably extends from the first circulation pipe to the processing liquid reservoir. The second circulation pipe may extend from a connection position set downstream of both the pump and the filter on the first circulation pipe. Preferably, a second circulation valve is disposed in the second circulation pipe and opens and closes the flow path of the second circulation pipe. When the pump is driven in a stopped state, preferably, the control unit controls the first circulation valve to close the flow path of the first circulation pipe and controls the second circulation valve to open the flow path of the second circulation pipe.

[0017] According to another aspect of the present invention, a substrate processing method processes a substrate with a processing liquid, the substrate processing method including: a first rotation step of rotating a rotor of a pump at a rotational acceleration of 400 rpm / sec or less when driving a stopped pump that is located upstream of a filter in a first circulation pipe through which the processing liquid circulates; and a processing liquid supply step of supplying the processing liquid delivered by the rotor to the substrate after the first rotation step. In the first rotation step, the rotor of the pump may be rotated at a rotational acceleration of 400 rpm / sec or less so that the rotation speed reaches the target rotation speed over 120 seconds or more.

[0018] In one aspect of the present invention, the substrate processing method preferably further includes a second rotation step. In the first rotation step, when the pump is driven in a stopped state, the rotor is preferably rotated at a constant rotational acceleration of 400 rpm / sec or less. In the second rotation step, when the rotation speed of the rotor reaches a target rotation speed, the rotor is preferably maintained at the target rotation speed. In the processing liquid supply step, the processing liquid is preferably supplied to the substrate while the rotation speed of the rotor is maintained at the target rotation speed.

[0019] In one aspect of the present invention, in the first rotation step, when the pump is driven in a stopped state, it is preferable that the rotor is rotated at a rotational acceleration of 50 rpm / sec or less.

[0020] In one aspect of the present invention, when the pump is driven while stopped, it is preferable that the method further includes a circulation pipe drainage step of draining the treatment liquid from the first circulation pipe through a first drainage pipe extending from the first circulation pipe.

[0021] In one aspect of the present invention, when the pump is driven while stopped, it is preferable that the method further includes a filter drainage step of draining the treated liquid from the filter through a second drainage pipe extending from the filter arranged in the first circulation pipe. The second drainage pipe may extend from the primary space of the filter. The filter drainage step may discharge the treated liquid from the primary space of the filter.

[0022] In one aspect of the present invention, the substrate processing method preferably further includes a circulating step of closing a flow path of the first circulation pipe and supplying the processing liquid to a second circulation pipe connected to the first circulation pipe when the pump is driven while the pump is stopped. The second circulation pipe preferably extends from the first circulation pipe to a processing liquid reservoir that stores the processing liquid. In the circulating step, the processing liquid preferably circulates through the second circulation pipe. The second circulation pipe may extend from a connection position set downstream of both the pump and the filter on the first circulation pipe. [Effects of the Invention]

[0023] According to the substrate processing apparatus and substrate processing method of the present invention, it is possible to effectively prevent the processing liquid containing particles from being supplied to the substrate. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a plan view showing the inside of a substrate processing apparatus according to an embodiment of the present invention. [Figure 2] FIG. 2 is a side view showing the inside of the processing unit according to the embodiment. [Figure 3] 1 is a diagram showing a configuration of a processing liquid supply device according to an embodiment of the present invention; [Figure 4] 1A is a plan view showing the pump according to the embodiment, and FIG. 1B is a graph showing the rotation speed of the pump according to the embodiment. [Figure 5] 5 is a diagram showing the flow of a processing liquid in a ready state of the processing liquid supply device according to the embodiment; FIG. [Figure 6] 10 is a diagram showing the flow of the processing liquid in the processing liquid supply device according to the embodiment when the circulation is stopped and the device is in an idle state. FIG. [Figure 7] 5A and 5B are diagrams illustrating the flow of a treatment liquid in a draining state of the treatment liquid supply device according to the embodiment. [Figure 8] 1 is a flowchart showing a substrate processing method according to the present embodiment. [Figure 9] 1 is a flowchart showing a flow of substrate processing according to the present embodiment. [Figure 10] FIG. 10 is a diagram showing a ready state of a processing liquid supply device according to a modified example of the present embodiment. [Figure 11] FIG. 10 is a diagram showing an internal circulation state of a processing liquid supply device according to a modified example of the present embodiment. [Figure 12] 10 is a flowchart showing a flow of substrate processing according to a modified example of the present embodiment. [Figure 13] 1 is a graph showing the rotation speed of the pump in Examples 1 to 3 of the present invention and a comparative example. [Figure 14] 1 is a graph showing the relationship between the rotational acceleration and the number of particles of pumps according to Examples 1 to 3 of the present invention and a comparative example. [Figure 15] 10 is another graph showing the relationship between the rotational acceleration and the number of particles of the pumps according to Examples 1 to 3 of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0025] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. For convenience of explanation, a three-dimensional Cartesian coordinate system (X, Y, Z) is appropriately depicted in the drawings. In the drawings, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction.

[0026] First, a substrate processing apparatus 1 will be described with reference to Fig. 1. Fig. 1 is a plan view showing the interior of the substrate processing apparatus 1. The substrate processing apparatus 1 shown in Fig. 1 processes a substrate W with a processing liquid.

[0027] The substrate W is, for example, a semiconductor wafer, a substrate for a liquid crystal display device, a substrate for a plasma display, a substrate for a field emission display (FED), a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, or a substrate for a solar cell.

[0028] The processing liquid is, for example, a chemical liquid, such as dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide water, organic acid (e.g., citric acid, oxalic acid), organic alkali (e.g., TMAH: tetramethylammonium hydroxide), sulfuric acid hydrogen peroxide water mixture (SPM), ammonia hydrogen peroxide water mixture (SC1), hydrochloric acid hydrogen peroxide water mixture (SC2), isopropyl alcohol (IPA), a surfactant, or a corrosion inhibitor.

[0029] The processing liquid may be, for example, a rinse liquid, such as deionized water (DIW), carbonated water, electrolytic ionized water, hydrogen water, ozone water, or diluted hydrochloric acid water (for example, about 10 ppm to 100 ppm).

[0030] In the following, as an example, the processing liquid is IPA.

[0031] As shown in FIG. 1, the substrate processing apparatus 1 includes a plurality of load ports LP, an indexer robot IR, a center robot CR, a plurality of processing units 2, a control device 3, a plurality of fluid boxes 4, and a processing liquid cabinet 5.

[0032] Each load port LP accommodates a stack of substrates W. The indexer robot IR transports the substrates W between the load port LP and the center robot CR. The center robot CR transports the substrates W between the indexer robot IR and the processing units 2. Each processing unit 2 supplies a processing liquid to the substrate W to process the substrate W. Each fluid box 4 accommodates fluid equipment. The processing liquid cabinet 5 accommodates a processing liquid.

[0033] Specifically, the processing units 2 form multiple towers TW (four towers TW in the example of FIG. 1) arranged to surround the center robot CR in a plan view. Each tower TW includes multiple processing units 2 stacked one above the other (three processing units 2 in the example of FIG. 1). The multiple fluid boxes 4 correspond to the multiple towers TW, respectively. The processing liquid in the processing liquid cabinet 5 is supplied to all processing units 2 included in the tower TW corresponding to the fluid box 4 via one of the fluid boxes 4.

[0034] The control device 3 controls the load port LP, the indexer robot IR, the center robot CR, the processing unit 2, the fluid box 4, and the processing liquid cabinet 5. The control device 3 is, for example, a computer.

[0035] The control device 3 includes a control unit 3A and a memory unit 3B. The control unit 3A includes a processor such as a CPU (Central Processing Unit). The memory unit 3B includes a storage device and stores data and computer programs. Specifically, the memory unit 3B includes a main storage device such as a semiconductor memory, and an auxiliary storage device such as a semiconductor memory, a solid-state drive, and / or a hard disk drive. The memory unit 3B may include removable media. The memory unit 3B corresponds to an example of a non-transitory computer-readable storage medium.

[0036] The control unit 3A controls the load port LP, the indexer robot IR, the center robot CR, the processing unit 2, the fluid box 4, and the processing liquid cabinet 5 by executing a computer program stored in the storage unit 3B.

[0037] Next, the processing unit 2 will be described with reference to Fig. 2. Fig. 2 is a side view showing the inside of the processing unit 2.

[0038] 2, the processing unit 2 includes a chamber 6, a spin chuck 10, a spin motor 13, a plurality of guards 14, a nozzle 16, a nozzle 21, and a nozzle moving part 26. The substrate processing apparatus 1 further includes a processing liquid supply apparatus CS, a pipe 17, and a valve 18. The processing liquid supply apparatus CS includes a pipe 22 and a valve 23. The pipe 17 and the valve 18 may be included in the processing liquid supply apparatus CS.

[0039] Chamber 6 has a generally box-like shape and accommodates spin chuck 10, spin motor 13, multiple guards 14, nozzle 16, nozzle 21, nozzle moving section 26, part of piping 17, and part of piping 22. Valves 18 and 23 may also be accommodated in chamber 6.

[0040] The spin chuck 10 holds the substrate W. Specifically, a spin motor 13 rotates the spin chuck 10 about a rotation axis AX1. Therefore, the spin chuck 10 rotates the substrate W about the rotation axis AX1 while holding the substrate W horizontally. Specifically, the spin chuck 10 includes a plurality of chuck members 11 and a spin base 12. The spin base 12 is substantially disk-shaped and supports the plurality of chuck members 11 in a horizontal position. The plurality of chuck members 11 hold the substrate W in a horizontal position. The spin chuck 10 is not particularly limited and may be, for example, a vacuum chuck or a Bernoulli chuck that utilizes the Bernoulli effect.

[0041] The nozzle 21 discharges the processing liquid onto the substrate W. The nozzle moving unit 26 raises and lowers the nozzle 21 and rotates the nozzle 21 horizontally around a rotation axis AX2. The nozzle moving unit 26 includes, for example, a ball screw mechanism and an electric motor that provides a driving force to the ball screw mechanism in order to raise and lower the nozzle 21. The nozzle moving unit 26 also includes, for example, an electric motor in order to rotate the nozzle 21 horizontally.

[0042] The processing liquid supplying device CS supplies the processing liquid to the nozzle 21. Specifically, a pipe 22 of the processing liquid supplying device CS supplies the processing liquid to the nozzle 21. Therefore, the processing liquid flows through the pipe 22. A valve 23 is disposed in the pipe 22. The valve 23 opens and closes the flow path of the pipe 22, switching between supplying and stopping the processing liquid to the nozzle 21.

[0043] The nozzle 16 supplies the rinse liquid toward the substrate W. As a result, the processing liquid is washed away from the substrate W.

[0044] The pipe 17 supplies the rinse liquid to the nozzle 16. Therefore, the rinse liquid flows through the pipe 17. The valve 18 is disposed in the pipe 17. The valve 18 opens and closes the flow path of the pipe 17, switching between supplying and stopping the rinse liquid to the nozzle 16.

[0045] Each guard 14 has a generally cylindrical shape and receives the processing liquid or rinse liquid discharged from the substrate W.

[0046] Next, the details of the processing liquid supplying apparatus CS will be described with reference to Fig. 3. Fig. 3 is a diagram showing the processing liquid supplying apparatus CS. In Fig. 3, the fluid box 4 is indicated by a dashed line, and the processing liquid cabinet 5 is indicated by a dashed double-dashed line. The components arranged in the area surrounded by the dashed double-dashed line are arranged inside the fluid box 4, and the components arranged in the area surrounded by the dashed double-dashed line are arranged inside the processing liquid cabinet 5.

[0047] 3, the control unit 3A controls the processing liquid supplying apparatus CS by executing a computer program stored in the memory unit 3B. The processing liquid supplying apparatus CS includes a processing liquid tank 30 that stores the processing liquid to be supplied to the substrate W, and a circulation pipe that circulates the processing liquid in the processing liquid tank 30. The processing liquid tank 30 corresponds to an example of the "processing liquid storage unit" of the present invention.

[0048] The circulation pipe includes a first circulation pipe 31 and a second circulation pipe 32. An upstream end 31a of the first circulation pipe 31 is connected to the processing liquid tank 30, and a downstream end 31b of the first circulation pipe 31 is connected to the processing liquid tank 30. The second circulation pipe 32 extends from the first circulation pipe 31 to the processing liquid tank 30. Specifically, the second circulation pipe 32 is a return pipe that branches off from the first circulation pipe 31 and returns the processing liquid in the first circulation pipe 31 to the processing liquid tank 30. The first circulation pipe 31 includes an upstream section 33 upstream of a connection position P2 to which the second circulation pipe 32 is connected, and a downstream section 34 downstream of the connection position P2.

[0049] 3, the treatment liquid tank 30 and the first circulation pipe 31 form a first circulation flow path C1 that circulates the treatment liquid in the treatment liquid tank 30. In the example of Fig. 3, the treatment liquid tank 30, the upstream portion 33, and the second circulation pipe 32 form a second circulation flow path C2 that circulates the treatment liquid in the treatment liquid tank 30.

[0050] The circulation of the treatment liquid through the first circulation flow path C1 (first circulation piping 31) may be referred to as "external circulation," and the circulation of the treatment liquid through the second circulation flow path C2 (second circulation piping 32) may be referred to as "internal circulation." Therefore, the first circulation flow path C1 is an external circulation path, and the second circulation flow path C2 is an internal circulation path. Furthermore, the first circulation piping 31 is an external circulation piping, and the second circulation piping 32 is an internal circulation piping.

[0051] 3, the first circulation flow path C1 extends to the fluid box 4. In other words, the first circulation flow path C1 supplies the processing liquid to a plurality of processing units 2 in common. The pipes 22 provided in one-to-one correspondence with the processing units 2 are branched and connected to the first circulation pipe 31, so that the processing liquid flowing through the first circulation flow path C1 is supplied to the processing units 2 via the pipes 22.

[0052] 3, the first circulation pipe 31 includes a common pipe 35 extending downstream from the processing liquid tank 30, and a plurality of individual pipes 36 branching off from the common pipe 35. The upstream end of the common pipe 35 is connected to the processing liquid tank 30. The downstream end of each individual pipe 36 is connected to the processing liquid tank 30. The upstream end of the common pipe 35 corresponds to the upstream end 31a of the first circulation pipe 31. The downstream end of each individual pipe 36 corresponds to the downstream end 31b of the first circulation pipe 31. The upstream portion 33 is included in the common pipe 35. The connection position P2 is set in the common pipe 35. The downstream portion 34 includes a part of the common pipe 35 and a plurality of individual pipes 36.

[0053] The multiple individual pipes 36 correspond to the multiple towers TW, respectively. Fig. 3 shows the entirety of one individual pipe 36 and parts of the remaining three individual pipes 36. Fig. 3 shows three processing units 2 included in the same tower TW. Three pipes 22 corresponding to the three processing units 2 included in the same tower TW are connected to the same individual pipe 36. In other words, the pipe 22 is branched and connected to a connection position P1 set downstream of the connection position P2 in the first circulation pipe 31.

[0054] A first circulation valve 40 for opening and closing the individual pipe 36 is disposed in each individual pipe 36. When the first circulation valve 40 is closed, the treatment liquid flowing through the common pipe 35 is not guided to each individual pipe 36. That is, the treatment liquid flowing through the upstream portion 33 is not guided to the downstream portion 34. When the first circulation valve 40 is opened, the treatment liquid flowing through the common pipe 35 is guided to each individual pipe 36. That is, the treatment liquid flowing through the upstream portion 33 is guided to the downstream portion 34.

[0055] 3, the processing liquid supply device CS of the substrate processing apparatus 1 includes a pump 37 that sends the processing liquid in the processing liquid tank 30 to the first circulation pipe 31, a heater 38 that heats the processing liquid in the processing liquid tank 30 to adjust the temperature of the processing liquid in the processing liquid tank 30, and a filter 39 that captures particles contained in the processing liquid flowing through the first circulation pipe 31. The pump 37, heater 38, and filter 39 are arranged in this order from the processing liquid tank 30 side in the upstream section 33. That is, the pump 37, heater 38, and filter 39 are arranged in this order in the first circulation pipe 31 from upstream to downstream.

[0056] When in an operating state, the pump 37 continues to send the processing liquid in the processing liquid tank 30 at a constant pressure to the first circulation pipe 31. The pump 37 is disposed upstream of the filter 39 in the first circulation pipe 31, through which the processing liquid circulates. Details of the pump 37 will be described later with reference to FIG. 4.

[0057] The heater 38 heats the treatment liquid flowing through the upstream section 33. The heater 38 is a heater that generates Joule heat.

[0058] The filter 39 captures particles contained in the processing liquid that passes through the filter 39. In other words, the filter 39 removes particles contained in the processing liquid that passes through the filter 39. In other words, the filter 39 filters the processing liquid.

[0059] For example, the filter 39 has a large number of holes (not shown). The processing liquid passes through the holes of the filter 39. As a result, the processing liquid is filtered by the filter 39. Specifically, when particles contained in the processing liquid pass through the holes of the filter 39, they are adsorbed by the wall surfaces that define the holes and are trapped within the holes. As a result, the particles are removed from the processing liquid.

[0060] The particle capture capacity of filter 39 changes with fluctuations in the pressure applied to filter 39. When pressure is applied to filter 39, it can capture smaller particles than when no pressure is applied to filter 39. As the pressure applied to filter 39 increases, it can capture even smaller particles.

[0061] As shown in FIG. 3 , the processing liquid supply device CS of the substrate processing apparatus 1 further includes an air vent pipe 64 for removing air bubbles (air) on the primary side of the filter 39, and a second drainage pipe 66 for discharging the liquid from the filter 39. The air vent pipe 64 is used to remove air bubbles in the filter 39 that could cause particle generation. Specifically, one end (upstream end) of the air vent pipe 64 and the second drainage pipe 66 are connected to the primary side of the filter 39. The other end of the air vent pipe 64 is connected to the processing liquid tank 30. An air vent valve 65 for opening and closing the air vent pipe 64 is disposed in the air vent pipe 64. The other end of the second drainage pipe 66 is connected to the drainage tank 80. The second drainage pipe 66 extends from the filter 39 and discharges the processing liquid from the filter 39. A second drainage valve 67 is disposed in the second drainage pipe 66. The second drainage valve 67 opens and closes the flow path of the second drainage pipe 66.

[0062] 3, the processing liquid supply device CS of the substrate processing apparatus 1 includes a second circulation valve 70 disposed in the second circulation pipe 32, and a pressure adjustment unit that adjusts the pressure of the processing liquid flowing through the upstream portion 33. The pressure adjustment unit is an opening adjustment unit that adjusts the opening of the second circulation pipe 32. The opening adjustment unit is disposed in the second circulation pipe 32. In the example of FIG. 3, the opening adjustment unit is a regulator 71. The regulator 71 is, for example, an electro-pneumatic regulator.

[0063] The pressure adjustment unit further includes a pressure sensor 72 that detects the pressure of the processing liquid in the upstream portion 33. The pressure sensor 72 detects the pressure of the processing liquid in the upstream portion 33 at a predetermined detection position P11 on the upstream portion 33. Detecting the pressure of the processing liquid in the upstream portion 33 by the pressure sensor 72 at the detection position P11 is substantially equivalent to detecting the pressure of the processing liquid flowing through the filter 39. The detection position P11 may be upstream of the filter 39 as shown in FIG. 3 or downstream of the filter 39.

[0064] 3, the processing liquid supply device CS of the substrate processing apparatus 1 further includes a drainage tank 80 for storing the processing liquid discharged from the processing liquid tank 30. A drainage pipe 81 extending toward the drainage tank 80 is connected to the processing liquid tank 30. A drainage valve 82 for opening and closing the drainage pipe 81 is disposed midway along the drainage pipe 81. When the processing liquid stored in the processing liquid tank 30 is not to be used any more for processing the substrate W, the drainage valve 82 is opened. As a result, the processing liquid stored in the processing liquid tank 30 is guided from the processing liquid tank 30 to the drainage tank 80 and stored in the drainage tank 80.

[0065] A drainage pipe 83 is connected to the drainage tank 80. The treatment liquid stored in the drainage tank 80 is sent to a drainage treatment facility outside the machine by opening a valve (not shown) arranged on the drainage pipe 83, and is treated as a drainage liquid in the drainage treatment facility.

[0066] One end of a first drainage pipe 85 is branched and connected to the vicinity of the downstream side of each individual pipe 36 (i.e., near the downstream end of the first circulation pipe 31). That is, the first drainage pipe 85 is connected to the first circulation pipe 31. The other end of the first drainage pipe 85 is connected to the drainage tank 80. The first drainage pipe 85 discharges the treatment liquid from the first circulation pipe 31. A first drainage valve 86 that opens and closes the flow path of the first drainage pipe 85 is disposed in the middle of the first drainage pipe 85. In addition, a return valve 89 that opens and closes the individual pipe 36 is disposed in each individual pipe 36 downstream of the connection position P3 of the first drainage pipe 85.

[0067] The first drainage valve 86 and the return valve 89 constitute a first switching unit that switches the destination of the processing liquid upstream of the connection position P3 in the downstream section 34 between the downstream side of the connection position P3 in the downstream section 34 and the first drainage pipe 85. Instead of the first drainage valve 86 and the return valve 89, a three-way valve may be adopted as the first switching unit.

[0068] By opening the return valve 89 while the first drainage valve 86 is closed, the processing liquid flowing in the individual pipe 36 upstream of the connection position P3 of the first drainage pipe 85 is guided to the processing liquid tank 30 via the downstream side of the connection position P3. On the other hand, by opening the first drainage valve 86 while the return valve 89 is closed, the processing liquid flowing in the individual pipe 36 upstream of the connection position P3 of the first drainage pipe 85 is guided to the drainage tank 80 via the first drainage pipe 85.

[0069] As shown in FIG. 3, the processing liquid supply device CS of the substrate processing apparatus 1 further includes a processing liquid replenishment pipe 87 for replenishing the processing liquid tank 30 with new processing liquid, and a processing liquid replenishment valve 88 for opening and closing the processing liquid replenishment pipe 87.

[0070] After the substrate processing apparatus 1 is powered on, it enters an idle state. Then, a readying operation is performed, causing the apparatus to transition to a ready state. In the ready state of the substrate processing apparatus 1, substrate processing operations by the substrate processing apparatus 1 can be realized.

[0071] The operating states of the substrate processing apparatus 1 include a ready state (executable state, i.e., operating state) in which processing can be performed in the processing unit 2, and an idle state (standby state) in which processing cannot be performed (not ready) in the processing unit 2. The ready state of the substrate processing apparatus 1 is a state in which the processing liquid supply device CS can supply processing liquid to the processing unit 2. The idle state of the substrate processing apparatus 1 is an operating state in which the processing liquid supply device CS cannot supply processing liquid to the processing unit 2 (not ready).

[0072] The substrate processing apparatus 1 has two idle states: a circulation stop idle state (circulation stop standby state) in which the circulation of the processing liquid is stopped in both the first circulation flow path C1 and the second circulation flow path C2, and a circulation idle state (circulation standby state) in which the circulation of the processing liquid is stopped in the first circulation flow path C1 while the circulation of the processing liquid continues in the second circulation flow path C2. That is, the substrate processing apparatus 1 has two idle states. Hereinafter, in this embodiment, attention will be focused only on the ready state and the circulation stop idle.

[0073] Next, the pump 37 will be described with reference to Fig. 4(a). Fig. 4(a) is a plan view showing the pump 37.

[0074] As shown in FIG. 4(a), the control unit 3A controls the pump 37. The pump 37 has a rotor 371 and a housing 372. The housing 372 accommodates the rotor 371. The housing 372 has an inlet 373 and an outlet 374. The rotor 371 rotates to suck in the treatment liquid through the inlet 373 and discharge the treatment liquid through the outlet 374. The rotor 371 is not particularly limited as long as it rotates, and may be, for example, an impeller or a propeller. In the example of FIG. 4(a), the pump 37 is a centrifugal pump. However, the type of the pump 37 is not particularly limited as long as it can pump out the treatment liquid by rotation of the rotor, and may be, for example, a mixed flow pump or an axial flow pump. The rotor 371 may be rotatably supported by a bearing (not shown) or may be magnetically levitated in a non-contact manner. When the rotor 371 is magnetically levitated in a non-contact state, the pump 37 is a magnetically levitated pump.

[0075] As described above with reference to FIG. 4( a), the pump 37 has a rotor 371 and rotates the rotor 371 to pump out the processing liquid. In this embodiment, when the pump 37 is driven while stopped, the controller 3A controls the pump 37 so that the rotor 371 rotates at a rotational acceleration of 400 rpm / sec or less. Therefore, this embodiment can prevent a pressure difference from occurring inside the pump 37. This can prevent air bubbles from being generated in the processing liquid pumped out by the rotor 371. As a result, it is possible to prevent particles accumulated on the secondary side of the filter 39, particles accumulated on the secondary side of the filter 39 and dispersed into the flow paths (first circulation flow path C1 and / or second circulation flow path C2), and particles retained in the flow paths (first circulation flow path C1 and / or second circulation flow path C2) from being trapped in air bubbles in the processing liquid and being supplied to the substrate W. In other words, it is possible to effectively prevent the processing liquid containing particles from being supplied to the substrate W.

[0076] It has been demonstrated in the examples described below that the number of particles in the processing liquid can be reduced if the rotor 371 rotates at a rotational acceleration of 400 rpm / sec or less when the pump 37 is driven while the pump 37 is stopped. "rpm (rotations per minute)" indicates the number of rotations of the rotor 371 per unit time.

[0077] Preferably, when the pump 37 is driven while stopped, the control unit 3A controls the pump 37 so that the rotor 371 rotates at a rotational acceleration of 50 rpm / sec or less. This preferred example further reduces the generation of a pressure difference inside the pump 37 compared to when the rotational acceleration of the rotor 371 is 400 rpm / sec or less and greater than 50 rpm / sec. This further reduces the generation of bubbles in the processing liquid pumped out by the rotor 371. This further reduces the possibility that particles accumulated on the secondary side of the filter 39, particles accumulated on the secondary side of the filter 39 and dispersed into the flow paths (first circulation flow path C1 and / or second circulation flow path C2), and particles retained in the flow paths (first circulation flow path C1 and / or second circulation flow path C2) are trapped in bubbles in the processing liquid and are supplied to the substrate W. This advantage is also demonstrated by the following examples.

[0078] Here, in this specification, the rotational acceleration refers to the "rate of change of the rotational speed of the rotating body 371 per unit time." The rotational speed refers to the "number of rotations of the rotating body 371 per unit time" or "a physical quantity proportional to the number of rotations of the rotating body 371 per unit time." An example of a physical quantity proportional to the number of rotations of the rotating body 371 per unit time is the rotation angle of the rotating body 371 per unit time, i.e., angular velocity.

[0079] Next, with reference to FIG. 3, the cause of particle generation, which is unavoidable, will be described.

[0080] When the pump 37 is stopped, the circulation of the treatment liquid is stopped (for example, a circulation-stopped idle state, which will be described later). Therefore, the treatment liquid is not moving through the filter 39, and therefore no pressure is applied to the filter 39. Therefore, when the pump 37 is stopped, the particle capturing ability of the filter 39 is lower than when the pump 37 is operating. As a result, when the pump 37 is stopped, particles that were captured by the filter 39 may flow out from the filter 39 to the secondary side and accumulate on the secondary side of the filter 39. Then, when the pump 37 is operated and the circulation of the treatment liquid is started in a state in which particles have accumulated on the secondary side of the filter 39, the particles that have accumulated on the secondary side of the filter 39 may diffuse throughout the entire first circulation flow path C1 (first circulation piping 31) and / or the second circulation flow path C2 (second circulation piping 32).

[0081] Furthermore, when the pump 37 is stopped and the circulation of the processing liquid is stopped (for example, a circulation-stopped idle state described below), the processing liquid chemical (e.g., IPA) is not filtered by the filter 39 and remains in the first circulation flow path C1 (first circulation piping 31), the second circulation flow path C2 (second circulation piping 32), and / or the processing liquid tank 30. As a result, there is a possibility that particles generated due to elution of the processing liquid chemical (e.g., IPA) from the piping (resin piping) and / or the processing liquid tank 30 will increase. Then, there is a possibility that particles generated due to the elution will remain in the first circulation flow path C1 (first circulation piping 31), the second circulation flow path C2 (second circulation piping 32), and / or the processing liquid tank 30.

[0082] Therefore, in this embodiment, when the pump 37 is driven from a stopped state, the rotor 371 of the pump 37 is rotated at a rotational acceleration of 400 rpm / sec or less (preferably a constant rotational acceleration), thereby suppressing the generation of bubbles when the pump 37 is driven from a stopped state. As a result, it is possible to suppress the particles generated due to the above-mentioned causes (particles accumulated on the secondary side of the filter 39, particles accumulated on the secondary side of the filter 39 and diffused into the flow path, and particles retained in the flow path and the processing liquid tank 30) from being supplied to the substrate W in a state of being trapped in the processing liquid.

[0083] Next, control of the pump 37 will be described with reference to Fig. 4(b). Fig. 4(b) is a graph showing the rotation speed of the pump 37. In Fig. 4(b), the horizontal axis represents time, and the vertical axis represents the rotation speed.

[0084] As indicated by the straight line Q1 in Figures 4(a) and 4(b), when the control unit 3A drives the pump 37 in a stopped state, it controls the pump 37 so that the rotor 371 rotates at a constant rotational acceleration of 400 rpm / sec or less. This further reduces the generation of a pressure difference inside the pump 37. This further reduces the generation of bubbles in the processing liquid delivered by the rotor 371. As a result, it is possible to more effectively prevent the processing liquid containing bubbles that have trapped particles from being supplied to the substrate W.

[0085] When the rotation speed of the rotor 371 reaches the target rotation speed TG, the control unit 3A controls the pump 37 so that the rotor 371 maintains the target rotation speed TG. As a result, the pump 37 can pump out the treatment liquid at a constant pressure.

[0086] Specifically, at time t0, controller 3A starts rotating rotor 371 of pump 37. Then, controller 3A rotates rotor 371 at a constant rotational acceleration of 400 rpm / sec or less during the period from time t0 to time t1. Then, when the rotational speed reaches target rotational speed TG at time t1, controller 3A causes rotor 371 to maintain target rotational speed TG. In other words, the rotational acceleration of rotor 371 is zero from time t1 onwards.

[0087] For example, if the target rotation speed TG is 6000 rotations and the constant rotation acceleration of the rotating body 371 is 400 rpm / sec, the target rotation speed TG is reached in 15 seconds from time t0.

[0088] Preferably, as indicated by the line Q2 in Figures 4(a) and 4(b), when the control unit 3A drives the pump 37 in a stopped state, it controls the pump 37 so that the rotating body 371 rotates at a constant rotational acceleration of 50 rpm / sec or less. Therefore, compared to when the rotational acceleration of the rotating body 371 is 400 rpm / sec or less and greater than 50 rpm / sec, it is possible to further suppress the generation of a pressure difference inside the pump 37. This further suppresses the generation of bubbles in the processing liquid delivered by the rotating body 371. As a result, it is possible to more effectively prevent the processing liquid containing bubbles that have trapped particles from being supplied to the substrate W.

[0089] When the rotation speed of the rotor 371 reaches the target rotation speed TG, the control unit 3A controls the pump 37 so that the rotor 371 maintains the target rotation speed TG. As a result, the pump 37 can pump out the treatment liquid at a constant pressure.

[0090] Specifically, at time t0, controller 3A starts rotating rotor 371 of pump 37. Then, controller 3A rotates rotor 371 at a constant rotational acceleration of 50 rpm / sec or less during the period from time t0 to time t2. Then, when the rotational speed reaches target rotational speed TG at time t2, controller 3A causes rotor 371 to maintain target rotational speed TG. In other words, the rotational acceleration of rotor 371 is zero from time t2 onwards.

[0091] For example, if the target rotation speed TG is 6000 rotations and the constant rotation acceleration of the rotating body 371 is 50 rpm / sec, the target rotation speed TG is reached in 120 seconds from time t0.

[0092] Next, the ready state, circulation stop idle state, and drain state of the processing liquid supplying device CS will be described with reference to Figures 5 to 7. In this case, in the symbols indicating the valves 40, 65, 67, 70, 82, 86, and 89 in Figures 5 to 7, white indicates that the valve is closed, and black indicates that the valve is open. In addition, in the symbol indicating the pump 37, a white triangle indicates that the pump 37 is stopped, and a black triangle indicates that the pump 37 is operating. Furthermore, the flow path of the processing liquid is indicated by a thick line.

[0093] First, the ready state will be described with reference to Fig. 5. Fig. 5 is a diagram showing the flow of the processing liquid in the ready state of the processing liquid supplying device CS.

[0094] As shown in Figure 5, in the ready state, the pump 37 is in an operating state. The first circulation valve 40 and the second circulation valve 70 are open. The air vent valve 65 is open, and the second drain valve 67 is closed. The return valve 89 is open, and the first drain valve 86 is closed. Also, the discharge valve 82 is closed.

[0095] Therefore, the processing liquid in the processing liquid tank 30 is sent by the pump 37 to the upstream section 33 of the first circulation pipe 31, and flows from the upstream section 33 to the downstream section 34. The processing liquid in the upstream section 33 flows to the downstream section 34 at the connection position P2, and returns to the processing liquid tank 30 from the downstream section 34. During this time, particles contained in the processing liquid are captured by the filter 39. Furthermore, the processing liquid in the processing liquid tank 30 is heated by the heater 38 to a temperature specified by the recipe, and then sent to the downstream section 34. As a result, the processing liquid in the processing liquid tank 30 is sent to the downstream section 34 while being maintained at a constant temperature higher than the ambient temperature in the processing unit 2 (for example, 20 to 26°C).

[0096] Furthermore, at the connection position P2, the processing liquid in the upstream portion 33 is guided not only to the downstream portion 34 but also to the second circulation pipe 32. The processing liquid guided to the second circulation pipe 32 is returned to the processing liquid tank 30 from the downstream end of the upstream portion 33 (connection position P2).

[0097] That is, in the ready state, the processing liquid circulates through the first circulation flow path C1 (first circulation piping 31) and also through the second circulation flow path C2 (second circulation piping 32) (dual circulation state).

[0098] Next, the circulation-stopped idle state will be described with reference to Fig. 6. Fig. 6 is a diagram showing the flow of the processing liquid in the circulation-stopped idle state of the processing liquid supplying device CS.

[0099] 6, when the processing liquid supplying system CS is in the circulation stop idle state, the pump 37 is stopped, the first circulation valve 40 and the second circulation valve 70 are closed, and the other valves are also closed.

[0100] In the circulation stop idle state, the pump 37 is stopped, and therefore the circulation of the treatment liquid is stopped in both the first circulation flow path C1 and the second circulation flow path C2. In the circulation stop idle state, the treatment liquid remains in the first circulation flow path C1 and the second circulation flow path C2.

[0101] In this embodiment, as an example, when transitioning from the circulation stop idle state shown in Fig. 6 to the ready state shown in Fig. 5, the control unit 3A controls the pump 37 so that the rotor 371 of the pump 37 rotates at a rotational acceleration of 400 rpm / sec or less (preferably a constant rotational acceleration). As a result, generation of bubbles in the pump 37 is suppressed, and the number of particles contained in the processing liquid supplied to the substrate W can be effectively reduced.

[0102] In this embodiment, preferably, when a system restart button (not shown) is operated in the circulation stop idle state (FIG. 6), the processing liquid supplying apparatus CS transitions to the ready state via the liquid draining state.

[0103] 7 is a diagram showing the flow of the processing liquid in the draining state of the processing liquid supplying device CS. As shown in FIG. 7, the processing liquid supplying device CS is in the draining state for a predetermined draining period T after the circulation stop idle state is released.

[0104] Specifically, the control unit 3A drives the pump 37, which is stopped, and opens the first circulation valve 40. The control unit 3A also opens the first drainage valve 86 while keeping the second circulation valve 70, the return valve 89, and the air vent valve 65 closed.

[0105] That is, when the pump 37 is driven while stopped, the control unit 3A controls the first drainage valve 86 so that the first drainage valve 86 opens the flow path of the first drainage pipe 85. Therefore, during the predetermined drainage period T, the processing liquid remaining in the first circulation flow path C1 and the second circulation flow path C2 is drained to the drainage tank 80 via the first drainage pipe 85 without being returned to the processing liquid tank 30. Therefore, together with the processing liquid, particles accumulated on the secondary side of the filter 39, particles accumulated on the secondary side of the filter 39 and diffused into the flow paths (first circulation flow path C1 and / or second circulation flow path C2), and particles remaining in the flow paths (first circulation flow path C1 and / or second circulation flow path C2) can be discharged to the drainage tank 80. As a result, the number of particles contained in the processing liquid supplied to the substrate W can be further reduced.

[0106] In addition, the control unit 3A opens the second drainage valve 67. That is, when driving the pump 37 that is stopped, the control unit 3A controls the second drainage valve 67 so that the second drainage valve 67 opens the flow path of the second drainage pipe 66. Therefore, during the predetermined drainage period T, the processing liquid present in the primary side space inside the filter 39 is drained into the drainage tank 80 via the second drainage pipe 66. Therefore, particles in the processing liquid are also discharged from the second drainage pipe 66 to the drainage tank 80. As a result, the number of particles contained in the processing liquid supplied to the substrate W can be further reduced.

[0107] Here, the predetermined drainage period T is determined experimentally and / or empirically in advance, for example. For example, the predetermined drainage period T is set based on the supply capacity of the pump 37, the viscosity of the treatment liquid, the diameter and length of the pipes, so that all of the remaining treatment liquid in the first circulation flow path C1 and the second circulation flow path C2 can be replaced with new treatment liquid supplied after the pump 37 is driven again.

[0108] When a predetermined drainage period T has elapsed since the first drainage valve 86 and the second drainage valve 67 were opened, the control unit 3A closes the first drainage valve 86 and the second drainage valve 67, and opens the return valve 89 and the second circulation valve 70. As a result, the state of the processing liquid supply device CS transitions to the ready state shown in Fig. 5. In the ready state, the substrate W is processed in the processing unit 2.

[0109] Next, a substrate processing method according to this embodiment will be described with reference to FIGS. 3 and 8. In the substrate processing method, a substrate W is processed with a processing liquid. FIG. 8 is a flowchart showing the substrate processing method according to this embodiment. As shown in FIG. 8, the substrate processing method according to this embodiment includes steps S1 to S11. The substrate processing method is performed by the substrate processing apparatus 1. At the start of the substrate processing method, the processing liquid supply apparatus CS is in the ready state (FIG. 5). That is, at the start of the substrate processing method, the pump 37 is driven, and the processing liquid is circulating through the first circulation path C1 and the second circulation path C2.

[0110] 3 and 8, first, in step S1, the control unit 3A receives an operation signal indicating a down operation from an operation device (not shown). The down operation is an operation to instruct a transition from a ready state to a circulation stop idle state.

[0111] Next, steps S2 and S3 are performed in parallel.

[0112] That is, in step S2, the control unit 3A stops the pump 37 (FIG. 6).

[0113] Meanwhile, in step S3, the control unit 3A controls the processing liquid supply device CS to close the external and internal circulation flow paths of the processing liquid ( FIG. 6 ). Specifically, the control unit 3A closes the first circulation valve 40 and the return valve 89. As a result, the flow path of the first circulation pipe 31 is closed, and the external circulation of the processing liquid is stopped. In addition, the control unit 3A closes the second circulation valve 70 and the air vent valve 65. As a result, the flow path of the second circulation pipe 32 is closed, and the internal circulation of the processing liquid is stopped.

[0114] When steps S2 and S3 are executed, the state of the processing liquid supplying device CS transitions from the ready state (FIG. 5) to the circulation stop idle state (FIG. 6).

[0115] Next, in step S4, the control unit 3A determines whether or not an operation signal indicating a ready operation has been received from an operation device (not shown). The ready operation is an operation to instruct a transition from the circulation stop idle state to the ready state.

[0116] If it is determined in step S4 that the operation signal indicating the ready operation has not been received (No), the process waits for step S4.

[0117] On the other hand, if it is determined in step S4 that an operation signal indicating a ready operation has been received (Yes), the process proceeds to step S5 and step S8.

[0118] Next, steps S5 to S7 and steps S8 and S9 are executed in parallel.

[0119] That is, in step S5, the control unit 3A drives the stopped pump 37 (FIG. 7). Specifically, in step S5, when driving the stopped pump 37, the control unit 3A rotates the rotor 371 of the pump 37 at a rotational acceleration of 400 rpm / sec or less. In this embodiment, when driving the stopped pump 37, the control unit 3A rotates the rotor 371 of the pump 37 at a constant rotational acceleration of 400 rpm / sec or less. Step S5 corresponds to an example of a "first rotation step" of the present invention.

[0120] Next, in step S6, the control unit 3A determines whether the rotation speed of the rotating body 371 has reached the target rotation speed TG.

[0121] If it is determined in step S6 that the rotation speed of the rotor 371 has not reached the target rotation speed TG (No), step S6 is repeated until the rotation speed reaches the target rotation speed TG.

[0122] On the other hand, if it is determined in step S6 that the rotation speed of the rotor 371 has reached the target rotation speed TG (Yes), the process proceeds to step S7.

[0123] Next, in step S7, the control unit 3A maintains the target rotation speed TG of the rotating body 371. Step S7 corresponds to an example of the "second rotation step" of the present invention.

[0124] On the other hand, in step S8, when the control unit 3A drives the pump 37 that is stopped (step S5), the control unit 3A controls the processing liquid supply device CS to discharge the processing liquid from the first circulation piping 31 through the first drainage piping 85 extending from the first circulation piping 31 through which the processing liquid is externally circulated ( FIG. 7 ). Specifically, the control unit 3A opens the first circulation valve 40 and the first drainage valve 86. As a result, the processing liquid is discharged from the first circulation piping 31 through the first drainage piping 85 to the drainage tank 80. Step S8 corresponds to an example of a "circulation piping drainage step" of the present invention.

[0125] Next, in step S9, when the control unit 3A drives the pump 37 that is stopped (step S5), it controls the processing liquid supply device CS to discharge the processing liquid from the filter 39 through the second drainage pipe 66 extending from the filter 39 arranged in the first circulation pipe 31 (FIG. 7). Specifically, the control unit 3A opens the second drainage valve 67. As a result, the processing liquid present in the primary side space inside the filter 39 is discharged through the second drainage pipe 66 to the drainage tank 80. Step S9 corresponds to an example of the "filter drainage step" of the present invention.

[0126] When steps S8 and S9 are performed, the state of the treatment liquid supply device CS transitions from the circulation stop idle state (FIG. 6) to the liquid draining state (FIG. 7). The control unit 3A maintains the liquid draining state for a predetermined liquid draining period T. Then, when the predetermined liquid draining period T has elapsed, the control unit 3A advances the treatment to step S10.

[0127] Next, in step S10, the control unit 3A controls the processing liquid supply device CS to start external and internal circulation of the processing liquid (FIG. 5). Specifically, the control unit 3A closes the first drainage valve 86 and opens the return valve 89. As a result, the flow path of the first circulation pipe 31 is opened and external circulation of the processing liquid is started. In addition, the control unit 3A closes the second drainage valve 67 and opens the second circulation valve 70 and the air vent valve 65. As a result, the flow path of the second circulation pipe 32 is opened and internal circulation of the processing liquid is started.

[0128] When step S10 is performed, the state of the processing liquid supplying device CS transitions from the draining state (FIG. 7) to the ready state (FIG. 5). Even in the ready state, the control unit 3A maintains the rotation speed of the rotor 371 of the pump 37 at the target rotation speed TG (step S7).

[0129] Next, in step S11, the processing unit 2 (FIG. 2) processes the substrate W with the processing liquid. That is, after steps S5 to S10, the processing unit 2 supplies the substrate W with the processing liquid pumped out by the rotor 371 of the pump 37. Specifically, in step S11, the processing unit 2 supplies the processing liquid to the substrate W while the rotation speed of the rotor 371 of the pump 37 is maintained at the target rotation speed TG. As a result, the substrate W is processed with the processing liquid. Then, the substrate processing method ends. Step S11 corresponds to an example of a "processing liquid supply step" of the present invention.

[0130] Fig. 9 is a flowchart showing step S11 in Fig. 8. As shown in Fig. 9, the substrate processing performed in step S11 includes steps S111 to S115.

[0131] First, in step S111, the center robot CR (FIG. 1) loads the substrate W into the processing unit 2. Then, in the processing unit 2 (FIG. 2), the spin chuck 10 holds the substrate W. Furthermore, the spin motor 13 rotates the spin chuck 10, thereby rotating the substrate W.

[0132] Next, in step S112, the nozzle 21 of the processing unit 2 supplies the processing liquid to the rotating substrate W. Specifically, the control unit 3A opens the valve 23. Therefore, the processing liquid is supplied to the nozzle 21 from the first circulation pipe 31 via the pipe 22. As a result, the nozzle 21 supplies the processing liquid toward the substrate W. Step S112 corresponds to an example of a "processing liquid supply step" of the present invention.

[0133] When a predetermined processing period has elapsed since the valve 23 was opened, the valve 23 is closed and the supply of the processing liquid from the nozzle 21 is stopped. The predetermined processing period is determined in advance depending on the processing purpose of the substrate W.

[0134] Next, in step S113, the nozzle 16 supplies the rinse liquid to the rotating substrate W. As a result, the processing liquid on the substrate W is washed away by the rinse liquid.

[0135] Specifically, when the valve 18 is opened, the nozzle 16 supplies the rinse liquid to the substrate W. When a predetermined rinse period has elapsed since the valve 18 was opened, the valve 18 is closed, and the supply of the rinse liquid from the nozzle 16 is stopped. The predetermined rinse period is determined in advance, for example, experimentally and / or empirically.

[0136] Next, in step S114, the processing unit 2 dries the substrate W by rotating the substrate W at high speed.

[0137] Specifically, the spin motor 13 accelerates the substrate W in the rotation direction, causing the substrate W to rotate at a high rotation speed that is higher than the rotation speed of the substrate W in steps S112 and S113. As a result, the liquid is removed from the substrate W, and the substrate W is dried. When a predetermined drying period has elapsed since the high-speed rotation of the substrate W began, the spin motor 13 stops rotating. Then, the rotation of the substrate W is stopped. Note that the predetermined drying period is determined in advance, for example, experimentally and / or empirically.

[0138] Next, in step S115, the center robot CR unloads the substrate W from the processing unit 2. That is, the processed substrate W is unloaded from the chamber 6. Then, the process returns to the main routine of FIG. 8, and the substrate processing method ends.

[0139] (Variation) A substrate processing apparatus 1 according to a modified example of the present embodiment will be described with reference to Figures 10 to 12. The hardware configuration of the substrate processing apparatus 1 according to the modified example is the same as the hardware configuration of the substrate processing apparatus 1 described with reference to Figures 1 to 3. The modified example mainly differs from the present embodiment described with reference to Figures 5 and 7 in that only external circulation is performed in the ready state and an internal circulation state exists instead of a drain state. The following mainly describes the differences between the modified example and the present embodiment.

[0140] FIG. 10 is a diagram showing the ready state of the processing liquid supplying apparatus CS according to the modified example. As shown in FIG. 10, in the ready state, the second circulation valve 70 is closed. Therefore, the processing liquid does not flow through the second circulation piping 32. In other words, the processing liquid does not circulate internally. The other states of the processing liquid supplying apparatus CS are the same as those in the ready state shown in FIG. 5. Therefore, in the ready state, the processing liquid flows through the first circulation piping 31 (first circulation flow path C1). In other words, only external circulation of the processing liquid is performed.

[0141] In a modified example, when the control unit 3A receives an instruction to transition from the circulation stop idle state shown in Figure 6 to the ready state shown in Figure 10, it does not immediately transition to the ready state, but rather controls the processing liquid supply device CS so that the state of the processing liquid supply device CS becomes an internal circulation state.

[0142] 11 is a diagram showing the internal circulation state of the processing liquid supplying apparatus CS according to the modified example. As shown in FIG. 11, in the internal circulation state, the first circulation valve 40 is closed, and the second circulation valve 70 and the air vent valve 65 are open. As a result, the processing liquid flows through the second circulation pipe 32 (second circulation flow path C2). In other words, the processing liquid circulates internally.

[0143] Specifically, when the control unit 3A drives the pump 37 that is in a stopped state, the control unit 3A controls the first circulation valve 40 to close the flow path of the first circulation pipe 31, and controls the second circulation valve 70 to open the flow path of the second circulation pipe 32. As a result, external circulation of the treatment liquid in the first circulation pipe 31 (first circulation flow path C1) is not performed, and internal circulation of the treatment liquid in the second circulation pipe 32 (second circulation flow path C2) is performed. The internal circulation of the treatment liquid is performed until the temperature of the treatment liquid reaches a target temperature. Then, for example, when the temperature of the treatment liquid reaches the target temperature, the state of the treatment liquid supply device CS transitions from the internal circulation state (FIG. 11) to the ready state (FIG. 10).

[0144] According to this modification, the rotation speed of the rotor 371 of the pump 37 can be made to reach the target rotation speed TG in parallel with the execution of the internal circulation. Meanwhile, since the temperature of the treatment liquid has reached the target temperature through the internal circulation, the temperature of the treatment liquid is quickly stabilized after transitioning to the ready state.

[0145] For example, the internal circulation of the processing liquid in the internal circulation state is performed for a predetermined circulation period. The predetermined circulation period is, for example, determined experimentally and / or empirically and is the time required for the temperature of the processing liquid to reach a target temperature. In this case, for example, the predetermined circulation period may be set to the time required for the rotation speed of the rotor 371 of the pump 37 to reach the target rotation speed TG from zero. In this case, the "time required for the rotation speed to reach the target rotation speed TG from zero" refers to the time required for the target rotation speed TG to be reached when the rotor 371 of the pump 37, which is in a stopped state, is rotated at a rotation acceleration of 400 rpm or less (preferably a constant rotation acceleration).

[0146] The control unit 3A monitors the temperature of the treatment liquid detected by a temperature sensor (not shown) and controls the heater 38 so that the temperature of the treatment liquid circulating inside becomes a target temperature. Although not shown in FIG. 11, the temperature sensor is disposed in the upstream portion 33, for example.

[0147] Next, a substrate processing method according to a modified example will be described with reference to FIGS. 3 and 12. FIG. 12 is a flowchart showing the substrate processing method according to the modified example. As shown in FIG. 12, the substrate processing method according to the modified example includes steps S21 to S31. The substrate processing method is performed by the substrate processing apparatus 1. At the start of the substrate processing method, the processing liquid supply apparatus CS is in the ready state (FIG. 10). That is, at the start of the substrate processing method, the pump 37 is driven, and the processing liquid is circulating through the first circulation path C1.

[0148] 3 and 12, first, in step S21, the control unit 3A receives an operation signal indicating a down operation from an operating device (not shown). Otherwise, step S21 is the same as step S1 in FIG.

[0149] Next, steps S22 and S23 are performed in parallel.

[0150] That is, in step S22, the control unit 3A stops the pump 37 (FIG. 6).

[0151] Meanwhile, in step S23, the control unit 3A controls the processing liquid supply device CS to close the flow path of the external circulation of the processing liquid (FIG. 6). Specifically, the control unit 3A closes the first circulation valve 40 and the return valve 89. As a result, the flow path of the first circulation pipe 31 is closed, and the external circulation of the processing liquid is stopped (FIG. 11). In the modified example, internal circulation is not performed in the ready state (FIG. 10).

[0152] When steps S22 and S23 are executed, the state of the processing liquid supplying device CS transitions from the ready state (FIG. 10) to the circulation stop idle state (FIG. 6).

[0153] Next, in step S24, the control unit 3A determines whether or not an operation signal indicating a ready operation has been received from an operation device (not shown). Otherwise, step S24 is the same as step S4 in FIG.

[0154] If it is determined in step S24 that an operation signal indicating a ready operation has been received (Yes), the process proceeds to step S25 and step S28.

[0155] Next, steps S25 to S27 and steps S28 and S29 are executed in parallel.

[0156] That is, in step S25, the control unit 3A drives the stopped pump 37. Specifically, in step S25, when driving the stopped pump 37, the control unit 3A rotates the rotor 371 of the pump 37 at a rotational acceleration of 400 rpm / sec or less (preferably a constant rotational acceleration). Otherwise, step S25 is the same as step S5 in Fig. 8. Step S25 corresponds to an example of the "first rotation step" of the present invention.

[0157] Next, in step S26, the control unit 3A determines whether or not the rotation speed of the rotating body 371 has reached the target rotation speed TG. Otherwise, step S26 is the same as step S6 in FIG.

[0158] Next, in step S27, the control unit 3A causes the rotating body 371 to maintain the target rotation speed TG. Otherwise, step S27 is similar to step S7 in Fig. 6. Step S27 corresponds to an example of the "second rotation step" of the present invention.

[0159] On the other hand, in step S28, the control unit 3A controls the processing liquid supply device CS to start internal circulation of the processing liquid (FIG. 11). That is, when the control unit 3A drives the pump 37 that is stopped (step S25), it closes the flow path of the first circulation pipe 31 and supplies the processing liquid to the second circulation pipe 32 connected to the first circulation pipe 31. Specifically, the control unit 3A opens the second circulation valve 70 and the air vent valve 65 while keeping the first circulation valve 40 closed. As a result, the flow path of the second circulation pipe 32 is opened and internal circulation of the processing liquid is started. That is, the processing liquid flows through the second circulation pipe 32 (second circulation flow path C2). Step S28 corresponds to an example of the "circulation step" of the present invention.

[0160] When step S28 is executed, the state of the processing liquid supplying apparatus CS transitions from the circulation stop idle state (FIG. 6) to the internal circulation state (FIG. 11).

[0161] Next, in step S29, the control unit 3A controls the processing liquid supplying device CS so that the internal circulation of the processing liquid stops after a predetermined circulation period has elapsed. Specifically, the control unit 3A closes the second circulation valve 70 to block the second circulation pipe 32 (second circulation flow path C2). As a result, the internal circulation of the processing liquid stops. In this case, the predetermined circulation period is set to, for example, a time period equal to or longer than the time it takes for the rotation speed of the rotor 371 of the pump 37 to increase from zero to the target rotation speed TG.

[0162] Next, in step S30, the control unit 3A controls the processing liquid supply device CS to start external circulation of the processing liquid (FIG. 10). Specifically, the control unit 3A opens the first circulation valve 40 and the return valve 89. As a result, the flow path of the first circulation piping 31 is opened, and external circulation of the processing liquid is started. In other words, the processing liquid flows through the first circulation piping 31 (first circulation flow path C1).

[0163] When step S30 is performed, the state of the processing liquid supplying device CS transitions from the internal circulation state (FIG. 11) to the ready state (FIG. 10). Even in the ready state, the control unit 3A maintains the rotation speed of the rotor 371 of the pump 37 at the target rotation speed TG (step S27).

[0164] Next, in step S31, the processing unit 2 (FIG. 2) processes the substrate W with the processing liquid. Otherwise, step S31 is the same as step S11 in FIG. 8. Then, the substrate processing method ends.

[0165] Next, the present invention will be described in detail based on examples, but the present invention is not limited to the following examples. [Example]

[0166] Examples 1 to 3 of the present invention and a comparative example will be described with reference to Figures 13 to 15. In Examples 1 to 3, the substrate processing apparatus 1 according to the present embodiment described with reference to Figures 1 to 3 was used. The hardware configuration of the substrate processing apparatus according to the comparative example was the same as the hardware configuration of the substrate processing apparatus 1 according to the present embodiment described with reference to Figures 1 to 3. For ease of explanation, the components of the substrate processing apparatus according to the comparative example will be described using the same reference numerals as the components of the substrate processing apparatus 1 according to Examples 1 to 3.

[0167] (1) The rotational acceleration of the rotor 371 of the pump 37 was as follows: Example 1: 400 rpm / sec Example 2: 50 rpm / sec Example 3: 10 rpm / sec Comparison example: 3000rpm / sec

[0168] (2) The target rotation speed TG in Examples 1 to 3 and the Comparative Example was 6000 rpm.

[0169] (3) Figure 13 is a graph showing the rotation speed of the pump 37 in Examples 1 to 3 and the comparative example. In Figure 13, the horizontal axis represents time (seconds) and the vertical axis represents the rotation speed.

[0170] 13, in Example 1, control unit 3A controlled pump 37 so that rotating body 371 rotated at a constant rotational acceleration of 400 rpm / sec from a stopped state of pump 37. Then, the rotation speed of rotating body 371 reached target rotation speed TG in 15 seconds from start and was maintained at target rotation speed TG.

[0171] As shown by the straight line RT2, in Example 2, the control unit 3A controlled the pump 37 so that the rotor 371 rotated at a constant rotational acceleration of 50 rpm / sec from a state in which the pump 37 was stopped. Then, the rotation speed of the rotor 371 reached the target rotation speed TG in 120 seconds from the start and was maintained at the target rotation speed TG.

[0172] As shown by the straight line RT3, in Example 3, the control unit 3A controlled the pump 37 so that the rotor 371 rotated at a constant rotational acceleration of 10 rpm / sec from a stopped state of the pump 37. The rotation speed of the rotor 371 reached the target rotation speed TG 600 seconds after starting and was maintained at the target rotation speed TG. Due to space limitations, the graph of the rotation speed in Example 3 shows only the portion before the target rotation speed TG was reached, and the rest is omitted.

[0173] As shown by the straight line RT0, in the comparative example, the control unit 3A controlled the pump 37 so that the rotor 371 rotated at a constant rotational acceleration of 3000 rpm / sec from a state in which the pump 37 was stopped. Then, the rotation speed of the rotor 371 reached the target rotation speed TG in 2 seconds after starting and was maintained at the target rotation speed TG.

[0174] (4) Regarding the control of the processing liquid supply device CS, the pump 37 was immediately switched from the circulation-stopped idle state (FIG. 6) in which the pump 37 was stopped to the ready state (FIG. 5) without passing through the draining state (FIG. 7). The ready state was maintained for 30 minutes or more from the time when the rotation speed of the rotor 371 of the pump 37 reached the target rotation speed TG. In this case, 30 minutes after the rotation speed of the rotor 371 of the pump 37 reached 6,000 rpm, the processing liquid was supplied from the first circulation pipe 31 and the pipe 22 to the nozzle 21, and the processing liquid was supplied from the nozzle 21 to the substrate W. The supply time of the processing liquid to the substrate W was 8 seconds. Then, the number of particles in the processing liquid on the upper surface of the substrate W was counted using a particle measurement device (KLA-Tencor Corporation, Surfscan® SP7). In this case, the number of particles with a particle diameter larger than 30 nm, the number of particles with a particle diameter larger than 19 nm, and the number of particles with a particle diameter larger than 15 nm were counted. The particle size was the length of the largest part of the particle.

[0175] (5) Fig. 14 is a graph showing the relationship between the rotational acceleration and the number of particles of pump 37 according to Examples 1 to 3 and the Comparative Example. In Fig. 14, the horizontal axis represents the rotational acceleration (rpm / sec), and the vertical axis represents the number of particles with a particle size greater than 30 nm. Bar A0 represents the number of particles in the Comparative Example, bar A1 represents the number of particles in Example 1, bar A2 represents the number of particles in Example 2, and bar A3 represents the number of particles in Example 3.

[0176] 14, the number of particles in the comparative example (bar A0) was 63. In contrast, the number of particles in example 1 (bar A1) was 33, the number of particles in example 2 (bar A2) was 25, and the number of particles in example 3 (bar A3) was 23.

[0177] As is clear from Examples 1 to 3, by setting the rotational acceleration of the pump 37 at startup to 400 rpm / sec or less, the number of particles in the processing liquid supplied to the substrate W was reduced to about half or less compared to the comparative example. In other words, by setting the rotational acceleration of the pump 37 at startup to 400 rpm / sec or less, the number of particles in the processing liquid supplied to the substrate W could be reduced.

[0178] Furthermore, in Example 2 (bar A2) and Example 3 (bar A3), the number of particles was smaller than that in Example 1 (bar A1). In other words, by setting the rotational acceleration of the pump 37 at the start to 50 rpm / sec or less, the number of particles in the processing liquid supplied to the substrate W could be further reduced.

[0179] (6) Fig. 15 is another graph showing the relationship between the rotational acceleration and the number of particles of the pump 37 according to Examples 1 to 3. In Fig. 15, the horizontal axis represents the rotational acceleration (rpm / sec), and the vertical axis represents the number of particles.

[0180] (6-1) In FIG. 15, bar B1 indicates the number of particles with a particle size larger than 19 nm in Example 1. Bar B2 indicates the number of particles with a particle size larger than 19 nm in Example 2. Bar B3 indicates the number of particles with a particle size larger than 19 nm in Example 3.

[0181] The number of particles in Example 1 (bar B1) was 583, the number of particles in Example 2 (bar B2) was 240, and the number of particles in Example 3 (bar B3) was 255.

[0182] In Example 2 (bar B2) and Example 3 (bar B3), the number of particles was reduced to about half or less compared to Example 1 (bar B1). In other words, by setting the rotational acceleration of the pump 37 at the start to 50 rpm / sec or less, the number of particles in the processing liquid supplied to the substrate W could be further reduced.

[0183] (6-1) In FIG. 15, bar E1 indicates the number of particles with a particle size larger than 15 nm in Example 1. Bar E2 indicates the number of particles with a particle size larger than 15 nm in Example 2. Bar E3 indicates the number of particles with a particle size larger than 15 nm in Example 3.

[0184] The number of particles in Example 1 (bar E1) was 927, the number of particles in Example 2 (bar E2) was 365, and the number of particles in Example 3 (bar E3) was 386.

[0185] In Example 2 (bar E2) and Example 3 (bar E3), the number of particles was reduced to about 1 / 2.5 or less compared to Example 1 (bar E1). In other words, by setting the rotational acceleration of the pump 37 at the start to 50 rpm / sec or less, the number of particles in the processing liquid supplied to the substrate W could be further reduced.

[0186] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be implemented in various forms without departing from the spirit of the present invention. Furthermore, the components disclosed in the above embodiments can be modified as appropriate. For example, some of the components shown in one embodiment may be added to the components of another embodiment, or some of the components shown in one embodiment may be deleted from the embodiment.

[0187] The drawings show each component diagrammatically to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of creating the drawings. Furthermore, the configuration of each component shown in the above embodiment is merely an example and is not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

[0188] 8 and 12, the circulation idle stop state has been described as a state in which the pump 37 is stopped. However, in the present invention, the stopped state of the pump 37 is not limited to the circulation idle stop state, as long as the stopped pump 37 is driven. For example, the present invention is also applicable to a case in which the pump 37 is driven for the first time from a stopped state immediately after the substrate processing apparatus 1 is installed in a factory.

[0189] (2) In Fig. 8, steps S8 and S9 may not be performed, or either step S8 or step S9 may be performed. Also, step S8 may be performed after step S9. Furthermore, steps S5 to S7 may be performed after steps S8 and S9. Furthermore, step S3 may be performed after step S2, or step S2 may be performed after step S3.

[0190] (3) In Fig. 12, steps S28 and S29 do not have to be performed. Furthermore, steps S25 to S27 may be performed after steps S28 and S29. Furthermore, step S23 may be performed after step S22, or step S22 may be performed after step S23. [Industrial Applicability]

[0191] The present invention relates to a substrate processing apparatus and a substrate processing method, and has industrial applicability. [Explanation of symbols]

[0192] 1. Substrate processing equipment 3A Control Unit 30 Processing liquid tank (processing liquid storage section) 31 1st circulation piping 37 Pump 39 filters 40 First circulation valve 66 Second drainage pipe 67 Second drain valve 70 Second circulation valve 85 First drainage pipe 86 First drain valve

Claims

1. A substrate processing apparatus for processing a substrate with a processing liquid, a treatment liquid storage section for storing the treatment liquid; a first circulation pipe having an upstream end connected to the treatment liquid storage section and a downstream end connected to the treatment liquid storage section, through which the treatment liquid circulates; a filter disposed in the first circulation pipe and configured to capture particles contained in the treatment liquid; A pump disposed in the first circulation pipe; A control unit for controlling the pump; Equipped with The pump has a rotor and pumps out the treatment liquid by rotating the rotor. The control unit, when driving the pump in a stopped state, controls the pump by rotating the rotating body at a rotational acceleration of 400 rpm / sec or less and taking 120 seconds or more to reach a target rotational speed.

2. When driving the pump in a stopped state, the control unit controls the pump so that the rotating body rotates at a constant rotation acceleration of 400 rpm / sec or less; The substrate processing apparatus according to claim 1 , wherein when the rotation speed of the rotating body reaches a target rotation speed, the control unit controls the pump so that the rotating body maintains the target rotation speed.

3. 3 . The substrate processing apparatus according to claim 1 , wherein, when the pump is driven in a stopped state, the control unit controls the pump so that the rotating body rotates at a rotational acceleration of 50 rpm / sec or less.

4. a first drainage pipe connected to the first circulation pipe and configured to drain the treatment liquid from the first circulation pipe; a first drainage valve disposed in the first drainage pipe and configured to open and close a flow path of the first drainage pipe; Further comprising:

4. The substrate processing apparatus according to claim 1, wherein when the pump is driven in a stopped state, the control unit controls the first drainage valve so that the first drainage valve opens a flow path of the first drainage pipe.

5. a second drainage pipe extending from the primary space of the filter and discharging the treated liquid from the primary space of the filter; a second drainage valve disposed in the second drainage pipe and configured to open and close a flow path of the second drainage pipe; Further comprising: 5 . The substrate processing apparatus according to claim 1 , wherein when the pump is driven in a stopped state, the control unit controls the second drainage valve so that the second drainage valve opens a flow path of the second drainage pipe.

6. A first circulation valve disposed in the first circulation pipe and configured to open and close a flow path of the first circulation pipe; a second circulation pipe extending from a connection position set downstream of both the pump and the filter in the first circulation pipe to the treatment liquid storage section; a second circulation valve disposed in the second circulation pipe and configured to open and close a flow path of the second circulation pipe; Further comprising:

4. The substrate processing apparatus according to claim 1, wherein, when driving the pump in a stopped state, the control unit controls the first circulation valve so that the first circulation valve closes the flow path of the first circulation piping, and controls the second circulation valve so that the second circulation valve opens the flow path of the second circulation piping.

7. A substrate processing method for processing a substrate with a processing liquid, comprising the steps of: a first rotation step of rotating a rotor of the pump at a rotational acceleration of 400 rpm or less and over 120 seconds or more when driving a pump that is in a stopped state and is disposed upstream of a filter in a first circulation pipe through which the treatment liquid circulates; a processing liquid supplying step of supplying the processing liquid delivered by the rotating body onto the substrate after the first rotating step; A method for processing a substrate, comprising:

8. Further comprising a second rotating step, In the first rotation step, when the pump is driven in a stopped state, the rotor is rotated at a constant rotation acceleration of 400 rpm / sec or less, In the second rotation step, when the rotation speed of the rotating body reaches a target rotation speed, the rotating body is caused to maintain the target rotation speed; 8. The substrate processing method according to claim 7, wherein in the processing liquid supplying step, the processing liquid is supplied to the substrate while a rotation speed of the rotating body is maintained at the target rotation speed.

9. 9. The substrate processing method according to claim 7, wherein in the first rotating step, when the pump is driven in a stopped state, the rotating body is rotated at a rotational acceleration of 50 rpm / sec or less.

10. 10. The substrate processing method according to claim 7, further comprising a circulation pipe drainage process for draining the processing liquid from the first circulation pipe through a first drainage pipe extending from the first circulation pipe when the pump in a stopped state is driven.

11. 11. The substrate processing method according to claim 7, further comprising a filter drainage process for draining the processing liquid from the primary space of the filter through a second drainage pipe extending from the primary space of the filter arranged in the first circulation pipe when the pump in a stopped state is driven.

12. The method further includes a circulating step of closing a flow path of the first circulation pipe and supplying the treatment liquid to a second circulation pipe connected to the first circulation pipe when the pump in a stopped state is driven, the second circulation pipe extends from a connection position of the first circulation pipe that is set downstream of both the pump and the filter to a treatment liquid storage portion that stores the treatment liquid; The substrate processing method according to claim 7 , wherein in the circulating step, the processing liquid circulates through the second circulation pipe.

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