Flexible PCB transport fixture

Abstract

To provide a transport jig for flexible substrates that can be used repeatedly while maintaining a high holding force to hold flexible substrates to reduce cost and increase product yield for highly efficient production.SOLUTION: This is a transport jig 1 for flexible substrates that holds flexible substrate 2 by adhering it to a fixation stand 3 having adhesive properties. The fixation stand 3 has a convex portion 21 to which the flexible substrate 2 is adhered and a concave portion 22 to which the flexible substrate 2 is not adhered. It also has at least one ventilation area 26 and an edge convex portion 23 that adheres and holds a portion of the flexible substrate outside the use range of the flexible substrate 2. The recess 22 can be vented to the outside of the fixation stand 3 via the ventilation area 26.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a carrier for a flexible substrate that holds the flexible substrate by adhesion. [Background technology]

[0002] In recent years, technologies have been developed for bonding electronic components to the surface of thin flexible printed wiring boards (hereinafter simply referred to as flexible substrates), including flexible printed circuits (FPCs). In the field that uses this type of technology, i.e., the printed electronics field, active research is being conducted on electronic products that use flexible substrates, such as thin flexible devices or thin-film TFTs obtained by printing and coating organic semiconductors, and organic electroluminescence.

[0003] The manufacturing process for these electronic products involves multiple steps, including printing, coating, baking, drying, component mounting and bonding, solder reflow, lamination, etc. These steps are carried out with a synthetic resin flexible board placed on a transport jig, and require repeated heating and cooling as well as high-precision microfabrication (solder printing, drilling, laser processing, etc.).

[0004] When this flexible substrate goes through the various processes described above, it may partially float from the conveying jig due to thermal deformation, impairing the smoothness of the surface of the flexible substrate.Furthermore, defects such as distortion of the flexible substrate may occur when the flexible substrate is placed on and held by the conveying jig, or when it is removed from the suction device that adsorbs the flexible substrate to the conveying jig.

[0005] Furthermore, a removably weak adhesive may be used to mount and fix a flexible substrate on a transport jig. As described in Patent Document 1, acrylic, silicone, and fluorine-based adhesives are known as this type of removably weak adhesive. These transport jigs and weak adhesives have been commonly used for rigid substrates for some time.

[0006] In recent years, advanced flexible device substrates that require much higher precision microfabrication have been devised for manufacturing organic TFTs (Thin Film Transistors), organic EL (Electro Luminescence), other sensors, etc. These advanced flexible device substrates are attached to a transport jig via heat-resistant polyimide tape that has been reinforced and modified.

[0007] Furthermore, the manufacturing process of devices using advanced flexible device substrates, which require highly accurate microfabrication, includes multiple heating and cooling steps. In the process including heating and cooling, problems such as changes in the adhesive strength of the transport jig and the generation and inclusion of air bubbles have become a problem. Air bubbles are generated between the flexible device substrate and the transport jig, and they block the heat transfer path between the flexible device substrate and the transport jig. When manufacturing devices using advanced flexible device substrates, a conductive paste such as silver is printed by a printing device. The presence of the above-mentioned air bubbles has an adverse effect when this conductive paste is dried and baked.

[0008] Furthermore, conventional flexible substrates, including the above-mentioned advanced flexible device substrates, are required to be easily removed from a transport jig (carrier) in a short time without causing damage such as solder cracks or breaks. For this reason, as described in Patent Document 2, for example, a pattern consisting of uniform projections and recesses is applied to the adhesive layer. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] JP 2006-245323 A [Patent Document 2] JP 2011-9384 A Summary of the Invention [Problem to be solved by the invention]

[0010] If the adhesive layer is simply provided with uniform unevenness as in the transport jig disclosed in Patent Document 2, the adhesive strength will decrease and the necessary holding power will be lost when heating and cooling are repeated. If an attempt is made to secure the holding power by increasing the adhesive strength of the adhesive to about 0.5 to 7 N / 20 mm (0.625 to 8.75 N / 25 mm) to solve this problem, the adhesive strength will change due to heating and cooling, and the transport jig will not be able to be used repeatedly. If the transport jig cannot be used repeatedly, the manufacturing cost of the manufactured device will increase. In order to maintain high adhesive strength, it is necessary to avoid air bubbles being present between the flexible substrate and the transport jig. The reason for this is that heat transfer will deteriorate at the location where air bubbles are generated, causing unevenness in the drying and baking of the conductive paste such as silver printed on the flexible substrate. If unevenness occurs in the drying and baking of the conductive paste, the performance of the device will become non-uniform and the yield will deteriorate.

[0011] The object of the present invention is to provide a transport jig for flexible substrates which can be used repeatedly while maintaining a high holding force for holding the flexible substrate, thereby reducing costs, and which can increase product yields and enable highly efficient production. [Means for solving the problem]

[0012] In order to achieve this objective, the transport jig for flexible substrates of the present invention is a transport jig for flexible substrates that adheres and holds a flexible substrate on an adhesive fixed base, the fixed base having a convex portion to which the flexible substrate adheres, a concave portion to which the flexible substrate does not adhere, and an end convex portion having at least one ventilation portion and adhesively holding a portion of the flexible substrate outside the use range, the concave portion being capable of ventilating to the outside of the fixed base via the ventilation portion when the flexible substrate is adhered to the convex portion and the end convex portion.

[0013] In the transport jig for a flexible substrate according to the present invention, the recess may be formed by a groove communicating with each other, and may extend to the outside of the end protrusion through the ventilation portion.

[0014] The present invention may provide a transport jig for a flexible substrate, wherein the fixing base is formed in a rectangular shape when viewed in a plane, the end convex portion is provided at a position parallel to a side of the fixing base, and the ventilation portion is provided at a corner or a portion that is the side of the fixing base.

[0015] In the transport jig for the flexible substrate of the present invention, the area ratio of the convex portions excluding the end convex portions to the entire area of ​​the adhesive surface of the fixing base facing the flexible substrate may be 10% to 60%.

[0016] In the transport jig for a flexible substrate of the present invention, the end protrusion may have a width of 5 mm to 20 mm. Effect of the Invention

[0017] According to the present invention, the end protrusions can adhesively hold the flexible substrate in a state of being firmly attached to the back surface of the flexible substrate. Therefore, even if the adhesive strength of the fixing base is reduced due to repeated heating and cooling, the end protrusions can hold the flexible substrate, and the number of repeated uses can be increased. Since the end protrusions adhesively hold a narrow portion of the flexible substrate outside the usable range, the flexible substrate can be easily peeled off without causing damage such as solder cracks or breakage.

[0018] In addition, any air bubbles generated between the flexible substrate and the protruding portion are expelled to the outside of the fixing base through the recessed portion, which prevents uneven heat transfer between the portion of the flexible substrate within the usable range and the fixing base, ensuring consistent quality of products that use the flexible substrate. Therefore, it is possible to provide a transport jig for flexible substrates that can be used repeatedly while maintaining a high holding force for holding the flexible substrate, thereby reducing costs, and that can increase product yields and enable highly efficient production. [Brief description of the drawings]

[0019] [Figure 1] FIG. 1 is a plan view of a transport jig for a flexible substrate according to the present invention. [Diagram 2] FIG. 2 is a cross-sectional view of the conveying jig. [Diagram 3] FIG. 3 is a cross-sectional view of an electronic device on a flexible substrate. [Figure 4] FIG. 4 is a plan view showing the configuration of the convex portions and the concave portions. [Diagram 5] FIG. 5 is a cross-sectional view of the protrusions and recesses. [Figure 6] FIG. 6 is a cross-sectional view of a conveying jig when the width of the recess is excessively wide. [Figure 7] FIG. 7 is a cross-sectional view of a conveying jig when the length of the protrusion is excessively long. [Figure 8] FIG. 8 is a plan view for explaining the area ratio of the convex portions. [Figure 9] FIG. 9 is a plan view showing a modified example of the recess. [Figure 10] FIG. 10 is a plan view showing a modified example of the end protrusion. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, one embodiment of a transport jig for a flexible substrate according to the present invention will be described in detail with reference to Figs. A transport jig 1 for a flexible substrate (hereinafter simply referred to as transport jig 1) shown in Fig. 1 includes a fixing table 3 that adheres to and holds a flexible substrate 2 (see Fig. 2). The fixing table 3 according to this embodiment is formed in a rectangular shape in a plan view, and is composed of a plate-like support 4 and an adhesive layer 5 provided on the upper surface of the support 4, as shown in Fig. 2.

[0021] The flexible substrate 2 is layered and adhered to the upper surface of the adhesive layer 5. The support 4 is formed of a rectangular plate made of a rigid body. The material forming the support 4 is, for example, glass, epoxy glass (glass epoxy), copper, aluminum, stainless steel, brass, etc. The adhesive layer 5 will be described later.

[0022] Flexible substrate 2 can form electronic device 6 (see FIG. 3) by laminating three or more conductive circuits and insulating layers. The width of one conductor of the conductive circuit used in this type of electronic device 6 is 300 μm or less. Materials for forming flexible substrate 2 include, for example, PI (polyimide), PEN (polyethylene naphthalate), PET (polyethylene terephthalate), PC (polycarbonate), etc.

[0023] The electronic device 6 using this flexible substrate 2 is, for example, an organic TFT element, an organic EL element, a sensor element, or the like. The electronic device 6 shown in Fig. 3 is formed by laminating a plurality of functional layers 11 to 20. These functional layers 11 to 20 form an organic EL element, and are composed of, from the bottom in Fig. 3, a high barrier layer 11 formed by inorganic vapor deposition, an anode 12 formed by ITO patterning, a HIL (hole injection layer) 13, a HTL / IL (hole transport layer) 14, an EML (light emitting layer) 15, an ETL electron transport layer 16, a cathode 17, a sealant 18 made of a high barrier adhesive, a high barrier layer 19 formed by inorganic vapor deposition, a seal film 20, and the like.

[0024] The total thickness of all the functional layers 11 to 20 is about 0.2 μm. To form such functional layers 11 to 20, the flexible substrate 2 needs to have a high degree of flatness. The adhesive layer 5 of the fixing base 3 according to this embodiment is configured to hold the flexible substrate 2 by adhesion so as to achieve such a high degree of flatness. The adhesive layer 5 is formed in a layer shape on the upper surface of the support 4 using a removably weak adhesive. Therefore, the adhesive layer 5 is formed in the same rectangular shape as the support 4 in a plan view. As the weak adhesive, an acrylic, silicone, or fluorine-based adhesive can be used.

[0025] The adhesive layer 5 according to this embodiment is formed by attaching a sheet made of a weak adhesive to the upper surface of the support 4, and imparts adhesiveness to the upper surface of the fixing base 3. The adhesive layer 5 has the following three functional parts. The first functional portion is a large number of protrusions 21 formed to form an inclined square with respect to the rectangular fixed base 3 in Fig. 1. The second functional portion is recesses 22 formed in a diagonal lattice pattern in Fig. 1. The third functional portion is end protrusions 23 formed on each of the four sides of the fixed base 3, which is rectangular in plan view. The flexible substrate 2 adheres to the protrusions 21 and end protrusions 23. The flexible substrate 2 does not adhere to the recesses 22.

[0026] The upper surfaces of the many protrusions 21 are formed flat. When the upper surface of the adhesive layer 5 is formed flat (when the adhesive layer 5 is formed only by the protrusions 21), the adhesive strength of the adhesive layer 5 is 0.05 to 0.3 (N / 25 mm). The properties of the upper surface of the protrusions 21 are smooth. If the upper surface of the protrusions 21 is conical or spherical (convex curved surface), the volume of the recesses 22 described later becomes large, and a difference in thermal conductivity occurs between the contact portion of the flexible substrate 2 that contacts the protrusions 21 and the non-contact portion that faces the recesses 22, resulting in uneven conductivity of the conductive paste such as silver. However, if the upper surface of the protrusions 21 is flat as shown in this embodiment, unevenness in the thermal conduction of the conductive paste is less likely to occur, and a high-quality circuit can be formed.

[0027] The shape of the upper surface of the protrusions 21 shown in Fig. 1 is a square in plan view. As shown in Fig. 4, which is an enlarged view of a portion of the adhesive layer 5, the length L of one side of the square is 50 µm to 200 µm. In Fig. 4, the recesses 22 are depicted with hatching. Of the numerous protrusions 21, two adjacent protrusions 21, 21 are formed with a recess 22 between them. The recesses 22 according to this embodiment are formed by subjecting the upper surface of the adhesive layer 5 to laser processing so as to form lattice-shaped grooves in a plan view. More specifically, the recesses 22 are formed by irradiating the upper surface of the adhesive layer 5 with laser light of a predetermined energy and partially removing a part of the upper surface of the adhesive layer 5. The recesses 22 may be provided by machining the adhesive layer 5, or may be provided by printing or coating. By forming the recesses 22 by laser processing as shown in this embodiment, steps are unlikely to occur on the upper surfaces of the protrusions 21, and the smoothness of the upper surfaces of the protrusions 21 can be ensured.

[0028] As shown in FIG. 5, the depth D of the recess 22, i.e., the height of the protrusion 21, is about 40 μm. The width W of the recess 22 is 200 μm or less. In FIG. 1, the interval between the recesses 22 (the length of one side of the protrusion 21) is drawn wider than in reality so that the shape of the recess 22 can be easily understood. Here, the maximum value of the width W of the recess 22 and the maximum value of the length L of one side of the protrusion 21 described above will be explained with reference to FIG. 6 and FIG. 7. A conductive paste 24 containing nanometal particles is applied on the flexible substrate 2 shown in FIG. 6 and FIG. 7. The nanometal particles may contain silver. Here, the maximum values ​​of the width W and length L will be explained based on the phenomenon that occurs when the conductive paste 24 is heated and fired.

[0029] When the width W of the recess 22 is wide, that is, when the volume of the recess 22 is large, as shown in FIG. 6, the air layer in the recess 22 essentially becomes a heat insulating layer, and the thermal resistance of the first heat transfer path A from the flexible substrate 2 to the support 4 via the protrusion 21 of the adhesive layer 5 and the second heat transfer path B from the flexible substrate 2 to the support 4 via the recess 22 becomes significantly different. In such a case, the drying and firing of the conductive paste 24 becomes uneven, and the drying and firing cannot be performed with uniform quality over the entire area. If the conductive paste 24 contains nanometal particles, a significant difference appears in the drying and firing result between the part above the recess 22 and the part above the protrusion 21. When the width W of the recess 22 exceeds 500 μm, a significant deterioration is observed, and therefore, the width W of the recess 22 is preferably 200 μm or less.

[0030] 7, when the length L of one side of the protrusion 21 is long, in other words, when the area of ​​the top surface of the protrusion 21 is too large, air bubbles 25 that essentially act as a heat insulating layer remain between the protrusion 21 and the flexible substrate 2. For example, in a heating process including a process of drying and baking the conductive paste 24, the moisture and other volatile components contained in the flexible substrate 2 and the adhesive layer 5 evaporate or vaporize due to heating.

[0031] Part of the volatile components forms air bubbles 25 between the flexible substrate 2 and the protrusions 21. If the area of ​​the protrusions 21 is too large, the air bubbles 25 cannot be discharged to the outside and become trapped between the flexible substrate 2 and the protrusions 21. If the air bubbles 25 remain in the flexible substrate 2, the third heat transfer path C from the flexible substrate 2 through the air bubbles 25 and the protrusions 21 to the support 4 will have different thermal resistances from the first and second heat transfer paths A and B, causing unevenness when the conductive paste 24 is dried and fired, for example. When the length L of one side of the protrusion 21 exceeds 500 μm, a significant deterioration is observed, so it is preferable that the length L of one side of the protrusion 21 is 200 μm or less.

[0032] The length L of one side of the convex portion 21 and the width W of the concave portion 22 are set to a predetermined ratio. In the adhesive layer 5 according to this embodiment, the area ratio of the convex portion 21, excluding the end convex portion 23 described below, to the entire area of ​​the upper surface (adhesive surface) of the adhesive layer 5, is 10% to 60%. Fig. 8(A) shows the convex portion 21 and the concave portion 22 in which the area ratio of the convex portion 21 is about 10%. Fig. 8(B) shows the convex portion 21 and the concave portion 22 in which the area ratio of the convex portion 21 is about 45%. Fig. 8(C) shows the convex portion 21 and the concave portion 22 in which the area ratio of the convex portion 21 is about 60%.

[0033] The end protrusions 23 serving as the third functional part are formed so that their surfaces are flat, and are formed in the shape of thin strips extending along the sides 3a to 3d of the fixed base 3, as shown in Fig. 1. The end protrusions 23 shown in Fig. 1 are provided at four locations corresponding to the sides 3a to 3d of the fixed base 3. The longitudinal length of the end protrusions 23 is such that adjacent end protrusions 23 are spaced apart by a predetermined distance. The spaces between the adjacent end protrusions 23 of the adhesive layer 5 are formed by the above-mentioned protrusions 21 and recesses 22.

[0034] The recess 22 is formed in a range extending from the center of the adhesive layer 5 surrounded by the four end protrusions 23, passing between the end protrusions 23, to the outside of the end protrusions 23. Therefore, the recess 22 is able to communicate with the outside of the fixing base 3 through the spaces between the end protrusions 23, and therefore the adhesive layer 5 is not sealed over the entire area. In the fixing base 3 according to this embodiment, ventilation sections 26 are formed at the four corners between the end protrusions 23, with the recess 22 essentially serving as an air passage.

[0035] The width A of the end protrusions 23 in a direction perpendicular to the longitudinal direction varies depending on the width of the use range of the flexible substrate 2, and is 5 mm to 20 mm. The use range of the flexible substrate 2 is the range in which the electronic circuits and component mounting parts of the flexible substrate 2 are formed, although this is not shown in the figure. The end protrusions 23 are formed so as to adhesively hold the part outside the use range of the flexible substrate 2. Here, "outside the use range" refers to an area that does not have elements or wiring and is not used as a substrate. The total area of ​​the upper surfaces of the four end protrusions 23 is 1% to 10% of the area of ​​the upper surface of the flexible substrate 2.

[0036] When holding the flexible substrate 2 using the fixed base 3 configured in this manner, the flexible substrate 2 is placed on the fixed base 3 and adhered so that the usable range of the flexible substrate 2 is located toward the center from the end protrusion 23. Since the recess 22 is not formed on the surface of the end protrusion 23, the end protrusion 23 adhesively holds the flexible substrate 2 with the entire upper surface thereof in close contact with the back surface of the flexible substrate 2.

[0037] Therefore, even if the adhesive strength of adhesive layer 5 decreases due to repeated heating and cooling, flexible substrate 2 can be held by end protrusions 23, allowing for increased number of repeated uses. The area of ​​end protrusions 23 is 1% to 10% of the total area of ​​flexible substrate 2, and furthermore, because it adhesively holds a narrow portion outside the usable range of flexible substrate 2, flexible substrate 2 can be easily peeled off from fixing base 3 after all processes are completed without causing damage such as solder cracks or breaks.

[0038] Furthermore, air bubbles 25 generated between flexible substrate 2 and protrusion 21 enter recess 22 and are discharged from the center of adhesive layer 5 surrounded by end protrusion 23 through ventilation section 26 to the outside of fixed base 3. This prevents uneven heat transfer between the portion of flexible substrate 2 within the usable range and fixed base 3, ensuring consistent quality of products manufactured using flexible substrate 2. Therefore, it is possible to provide a transport jig for flexible substrates that can be used repeatedly while maintaining a high holding force for holding the flexible substrate 2, thereby reducing costs, and that can increase product yields and enable highly efficient production.

[0039] The recess 22 according to this embodiment is formed by a large number of grooves that communicate with each other. The recess 22 also extends to the outside of the end protrusion 23 through the ventilation portion 26. Therefore, volatile components generated in the central portion of the adhesive layer 5 surrounded by the end protrusion 23 during the heating process are discharged to the outside of the end protrusion 23 through the recess 22. Therefore, heat is smoothly transferred from the flexible substrate 2 to the fixing base 3 throughout the entire range of use of the flexible substrate 2, and thus an electronic device of even higher quality can be manufactured.

[0040] The fixed base 3 according to this embodiment is formed in a rectangular shape in a plan view. The end protrusions 23 are provided at the four sides 3a to 3d of the fixed base 3. The ventilation sections 26 are provided at the corners of the fixed base 3. As a result, the thermal expansion of the fixed base 3 can be distributed over the entire range of use of the flexible substrate 2, so that even if heating and cooling are repeated and the fixed base 3 and the flexible substrate 2 are repeatedly expanded and contracted, no deformation occurs in the flexible substrate 2.

[0041] In this embodiment, the area ratio of convex portion 21, excluding end convex portion 23, to the entire area of ​​the adhesive surface of fixing base 3 facing flexible substrate 2 is 10% to 60%. Therefore, even if one of adhesive layer 5 and flexible substrate 2 is displaced relative to the other during a heating or cooling process due to a difference in thermal expansion coefficient between them, convex portion 21 bends and the upper surface of convex portion 21 can maintain a state of being adhered to flexible substrate 2. Therefore, even if the flexible substrate 2 is an advanced flexible device substrate that requires highly accurate microfabrication, it is possible to form a laminated structure in which multiple layers are stacked with high precision.

[0042] The width of end protrusion 23 in this embodiment is 5 mm to 20 mm. Therefore, when flexible substrate 2 is peeled off from fixing base 3, it can be easily peeled off without damaging the electronic circuit or electronic device.

[0043] (Modification of the recess) In the above-described embodiment, the recesses 22 are formed in a diagonal lattice pattern. However, the recesses 22 can be formed as shown in FIGS. 9(A) and 9(B). 9(A) is composed of a plurality of vertical grooves 22a extending in the up-down direction, a plurality of horizontal grooves 22b extending in the left-right direction, a plurality of first diagonal grooves 22c extending downward to the right, and a plurality of second diagonal grooves 22d extending downward to the left. These four types of grooves 22a to 22d are formed such that the first and second diagonal grooves 22c, 22d intersect at the position where the vertical groove 22a intersects with the horizontal groove 22b.

[0044] 9(B) is composed of a plurality of horizontal grooves 22b extending in the left-right direction in the figure, a plurality of first diagonal grooves 22c extending downward to the right, and a plurality of second diagonal grooves 22d extending downward to the left. The first diagonal grooves 22c and the second diagonal grooves 22d are formed so as to intersect with each other at the position where they intersect with the horizontal grooves 22b. Even when the recess 22 is formed as shown in Figures 9(A) and (B), the protrusion 21 bends and follows the displacement of the flexible substrate 2 in the same manner as when the configuration shown in Figure 1 is adopted, so that a high-quality electronic device can be manufactured.

[0045] (Modification of end protrusion) The end protrusions can be configured as shown in FIGS. 10(A) to (C). The end protrusion 31 shown in Fig. 10(A) is formed in an L-shape in a plan view, and is provided on the four sides 3a to 3d of the fixed base 3, so that two end protrusions 31, 31 are located on one side 3a to 3d of the fixed base 3. More specifically, the end protrusion 31 is provided such that two sides 31a, 31b are along the two sides of the fixed base 3, and a corner 31c is located near a corner of the fixed base 3. In this case, the fixed base 3 is provided with four end protrusions 31, and ventilation parts 26 are provided between these end protrusions 31. The ventilation parts 26 are provided on the sides 3a to 3d of the fixed base 3.

[0046] 10(B) is formed in an L-shape in a plan view, and is provided on four sides 3a to 3d of the fixed base 3 so as to extend along one corner of the fixed base 3 and two sides (e.g., sides 3a, 3b and sides 3c, 3d) adjacent to the corner. In this case, two end protrusions 32 are provided on the fixed base 3, and the ventilation section 26 is provided between these end protrusions 32.

[0047] 10(C) is composed of a first end protrusion 33a extending from one end of one side 3d to the other end along one side (side 3d in the figure) of the fixed base 3, and a second end protrusion 33b extending in a U-shape along the other three sides 3a to 3c of the fixed base 3. In this case, ventilation sections 26 are provided at two locations between both ends of the first end protrusion 33a and both ends of the second end protrusion 33b.

[0048] Even if the end protrusions 31 to 33 are configured as shown in Figures 10(A) to (C), the flexible substrate 2 can be firmly adhesively held, and when the flexible substrate 2 is peeled off, it can be easily peeled off without damaging the electronic circuitry, etc. 1 to 10(C) are configured so that ventilation portions 26 are provided at two or four locations. However, although not shown, end protrusions 23, 31 to 33 can be disposed along the four sides 3a to 3d of fixed base 3 so that only one ventilation portion 26 is provided. The shape of end protrusion 23 is not limited to the shape shown in the drawings as long as a ventilation portion is provided. [Explanation of symbols]

[0049] 1...transport jig for flexible substrate, 3...fixing stand, 2...flexible substrate, 21...convex portion, 22...concave portion, 26...ventilation portion, 23, 31-33...end convex portions, 3a-3d...sides.

Claims

1. A transport jig for a flexible substrate that holds a flexible substrate by adhering it to a fixing base having adhesiveness, The fixing base has a protrusion to which the flexible substrate is attached, a recess to which the flexible substrate does not adhere; a protruding end portion that has at least one ventilation portion and adhesively holds a portion of the flexible substrate outside its usable range, the recess is formed by grooves that are interconnected in a lattice shape in a plan view, and extends to the outside of the end protrusion through the ventilation part, and when the flexible substrate is adhered to the protrusion and the end protrusion, ventilation to the outside of the fixing base is possible via the ventilation part; The fixing base is formed in a rectangular shape in a plan view, The end protrusions are formed in a band shape extending along the four sides of the fixing base, A transport jig for a flexible substrate, wherein the ventilation section is provided at a corner or a side of the fixing table.

2. The transport jig for a flexible substrate according to claim 1, A transport jig for flexible substrates, characterized in that the area ratio of the convex portions excluding the end convex portions to the entire area of ​​the adhesive surface of the fixing table facing the flexible substrate is 10% to 60%.

3. In the transport jig for a flexible substrate according to claim 1 or claim 2, A transport jig for flexible substrates, characterized in that the width of the end protrusion is 5 mm to 20 mm.

4. A transport jig for a flexible substrate according to any one of claims 1 to 3, A transport jig for a flexible substrate, wherein the recess is not formed on the surface of the end protrusion.

5. A transport jig for a flexible substrate according to any one of claims 1 to 4, A transport jig for a flexible substrate, wherein a total area of ​​the upper surfaces of the end convex portions is 1% to 10% of the area of ​​the upper surface of the flexible substrate.

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