SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Abstract

To provide an apparatus for treating a substrate.SOLUTION: An apparatus for treating the substrate includes a liquid treating chamber for liquid-treating the substrate by supplying a treatment liquid to the substrate, a drying chamber for drying the substrate by supplying a process fluid to the substrate, a returning unit for returning the substrate between the liquid treating chamber and the drying chamber, and a rear surface cleaning unit for cleaning a rear surface of the substrate, in which the rear surface cleaning unit may clean the rear surface of the substrate while returning the substrate from the liquid treating chamber to the drying chamber.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an apparatus for processing a substrate, and more particularly to a substrate processing apparatus and method for supplying a liquid to a substrate to perform liquid processing on the substrate. [Background technology]

[0002] Generally, in order to manufacture a semiconductor device, various processes such as a photo process, an etching process, an ion implantation process, and a deposition process are performed.

[0003] During each process, various foreign matter such as particles, organic contaminants, and metal impurities are generated. The generated foreign matter causes defects on the substrate and directly affects the performance and yield of the semiconductor device. Therefore, before and after the semiconductor device manufacturing processes are performed, a cleaning process is performed to remove foreign matter remaining on the substrate.

[0004] The cleaning process includes a step of removing foreign matter remaining on the substrate using a chemical solution, a step of removing the chemical solution remaining on the substrate using a cleaning solution such as deionized water (DIW), a step of removing the cleaning solution remaining on the substrate using an organic solvent having a lower surface tension than the cleaning solution, and a drying step of drying the organic solvent remaining on the substrate surface.

[0005] Various liquids used in the cleaning process have fluidity. As a result, a problem occurs in that the liquid supplied to the substrate is separated from the substrate while the substrate is being transported to perform a drying step. In addition, when liquid is supplied excessively onto the substrate to remove particles remaining on the substrate, the liquid supplied to the substrate is separated from the substrate. The liquid separated from the substrate remains during the substrate transport process or in a chamber where a subsequent process is performed, and acts as a source of contamination that contaminates the subsequent substrate. Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of efficiently cleaning a substrate.

[0007] Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of efficiently removing liquid remaining on the rear surface of a substrate.

[0008] Another object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of efficiently removing liquid remaining on the rear surface of a substrate during transportation of the substrate.

[0009] The object of the present invention is not limited thereto, and other objects not mentioned herein will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0010] The present invention provides an apparatus for treating a substrate, the apparatus for treating a substrate including a liquid treatment chamber for supplying a treatment liquid to the substrate to perform liquid treatment, a drying chamber for supplying a process fluid to the substrate to dry it, a transfer unit for transferring the substrate between the liquid treatment chamber and the drying chamber, and a backside cleaning unit for cleaning a backside of the substrate, the backside cleaning unit being capable of cleaning the backside of the substrate during transfer from the liquid treatment chamber to the drying chamber.

[0011] According to an embodiment, the transport unit may include a transport robot that moves within a transport frame that provides a transport space and has a transport hand by which the substrate is held.

[0012] According to an embodiment, the back surface cleaning unit may include a contact member that contacts the back surface of the substrate to remove the processing liquid remaining on the back surface of the substrate.

[0013] According to an embodiment, the contact member may be installed on the transport robot.

[0014] According to one embodiment, the contact member is located below the hand and can contact the rear surface of the substrate by vertical movement of the hand on which the substrate is placed.

[0015] According to one embodiment, the contact member may have a plurality of holes penetrating an upper end and a lower end of the contact member, and the holes may be spaced apart from each other along a length direction of the contact member.

[0016] According to one embodiment, a backside cleaning frame having a slot in which the substrate is placed is installed inside the transfer frame, the backside cleaning frame is located between the liquid treatment chamber and the transfer frame, and the contact member may be installed inside the backside cleaning frame.

[0017] According to an embodiment, the contact member may be installed at a position where it comes into contact with the rear surface of the substrate while the substrate held by the hand is being transported into the rear surface cleaning frame.

[0018] According to an embodiment, the back surface cleaning unit may include a non-contact member spaced apart from the back surface of the substrate to remove the processing liquid remaining on the back surface of the substrate in a non-contact manner.

[0019] According to one embodiment, the non-contact member provides a decontamination source for removing the processing liquid toward the backside of the substrate, which may be provided by heat or airflow.

[0020] According to an embodiment, the non-contact member may be installed on the transport robot.

[0021] According to one embodiment, a backside cleaning frame having slots in which the substrate is placed is installed inside the transfer frame, the backside cleaning frame is located between the liquid treatment chamber and the transfer frame, and the non-contact member may be installed inside the backside cleaning frame.

[0022] According to an embodiment, the drying chamber includes a support for supporting the substrate, and the support may support a rear edge region of the substrate after the liquid processing is completed.

[0023] The present invention also provides a method for treating a substrate, comprising a liquid treating step of supplying a treatment liquid to the substrate, a transporting step of transporting the liquid-treated substrate, and a drying step of supplying a process fluid to the liquid-treated substrate and drying the substrate, wherein the transporting step can remove the treatment liquid remaining on the back surface of the substrate during the transport of the liquid-treated substrate.

[0024] According to one embodiment, in the transporting step, the processing solution remaining on the rear surface of the substrate may be removed by mutual contact between the liquid-treated substrate and a contact member contacting the rear surface of the substrate.

[0025] According to one embodiment, the transport step is performed by a transport robot that transports the liquid-treated substrate, and the contact member is installed on the transport robot so as to contact the back surface of the substrate while the transport robot transports the liquid-treated substrate.

[0026] According to one embodiment, the contact member is installed in a backside cleaning frame installed in a transport space that transports the liquid-treated substrate in the transport step, and the transport step may include a first transport step of transporting the substrate on which the liquid treatment has been completed from a liquid treatment chamber where the liquid treatment step is performed to the backside cleaning frame, a backside cleaning step of cleaning the backside of the substrate in the backside cleaning frame, and a second transport step of transporting the substrate to a drying chamber where a drying step is performed after the backside cleaning step.

[0027] According to one embodiment, the processing liquid remaining on the back surface of the liquid-treated substrate during the transport step may be removed from the substrate in a non-contact manner by a non-contact member that supplies a decontamination source to remove the processing liquid toward the back surface of the substrate.

[0028] According to one embodiment, the non-contact member may be installed on a transfer robot that transfers the liquid-treated substrate in the transfer step and / or on a backside cleaning frame installed in a transfer space that transfers the liquid-treated substrate in the transfer step.

[0029] The present invention also provides an apparatus for treating a substrate, the apparatus for treating a substrate including a liquid treatment chamber for supplying a treatment liquid to an upper surface of the substrate to perform liquid treatment on the substrate, a drying chamber for supplying a supercritical fluid to the substrate to dry the substrate, a transport unit for transporting the substrate between the liquid treatment chamber and the drying chamber, and a backside cleaning unit for cleaning a backside of the substrate, the drying chamber including a housing having an internal space and a support unit for supporting a backside edge region of the substrate after the liquid treatment is completed in the internal space, and the backside cleaning unit may clean the backside of the substrate in a contact and / or non-contact manner during transport of the substrate from the liquid treatment chamber to the drying chamber to remove the treatment liquid remaining on the backside of the substrate. Effect of the Invention

[0030] According to an embodiment of the present invention, a substrate can be efficiently cleaned.

[0031] Furthermore, according to the embodiment of the present invention, the liquid remaining on the rear surface of the substrate can be efficiently removed.

[0032] Furthermore, according to the embodiment of the present invention, liquid remaining on the rear surface of the substrate can be efficiently removed during the substrate transportation.

[0033] The effects of the present invention are not limited to those described above, and effects not mentioned will be clearly understood by those having ordinary skill in the art to which the present invention pertains from this specification and the accompanying drawings. [Brief description of the drawings]

[0034] [Figure 1] 1 is a diagram illustrating an example of a substrate processing apparatus according to the present invention; [Diagram 2] 2 is a diagram illustrating a schematic diagram of one embodiment of the liquid treatment chamber of FIG. 1. [Diagram 3] 2 is a diagram showing a schematic diagram of one embodiment of the drying chamber of FIG. 1; [Figure 4] FIG. 2 is a perspective view showing an example of a transfer unit and a back surface cleaning unit in FIG. 1; [Diagram 5] FIG. 5 is a perspective view showing a schematic configuration of another embodiment of the rear surface cleaning unit of FIG. [Figure 6] FIG. 5 is a perspective view showing a schematic diagram of another embodiment of the rear surface cleaning unit of FIG. [Figure 7] FIG. 5 is a perspective view showing a schematic diagram of another embodiment of the rear surface cleaning unit of FIG. [Figure 8] 1 is a flowchart of a substrate processing method according to an embodiment of the present invention. [Figure 9] 9 is a diagram illustrating a substrate being treated in a liquid treatment step according to an embodiment of FIG. 8; [Figure 10] 9 is a view showing a state in which a substrate that has been subjected to liquid processing is placed in a back cleaning position in a transport step according to an embodiment of FIG. 8; [Figure 11] 9 is a view showing a state in which a substrate that has been subjected to liquid processing in the transport step according to the embodiment of FIG. 8 is positioned at a back surface cleaning position. [Figure 12] 9 is a view showing the substrate being dried in sequence in a drying step according to an embodiment of FIG. 8; [Figure 13]9 is a view showing the substrate being dried in sequence in a drying step according to an embodiment of FIG. 8; [Figure 14] FIG. 5 is a perspective view showing a schematic configuration of another embodiment of the rear surface cleaning unit of FIG. [Figure 15] 15 is a diagram showing a schematic view of an embodiment of the back cleaning unit of FIG. 14 as viewed from above. [Figure 16] 15 is a front view of the back surface cleaning unit according to the embodiment of FIG. 14 cleaning the back surface of the substrate; [Figure 17] 2 is a diagram illustrating a schematic view of another embodiment of the substrate processing apparatus of FIG. 1; [Figure 18] FIG. 18 is a perspective view showing a schematic example of a rear cleaning frame of FIG. 17; [Figure 19] 5 is a flowchart of a substrate processing method according to another embodiment of the present invention. [Figure 20] 20 is a top view of the back surface of the substrate being cleaned in the back surface cleaning step according to an embodiment of FIG. 19; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] Hereinafter, the embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The embodiments of the present invention can be modified in various ways, and the scope of the present invention should not be interpreted as being limited to the embodiments described below. The embodiments are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes of components in the drawings are exaggerated to emphasize a clearer description.

[0036] Terms such as "first" and "second" may be used to describe various components, but the components should not be limited by the terms. The terms may be used to distinguish one component from another. For example, a first component may be named as a second component, and similarly, a second component may be named as a first component, without departing from the scope of the present invention.

[0037] In this embodiment, a process of supplying a liquid such as a cleaning liquid onto a substrate W to perform liquid processing on the substrate W will be described as an example. However, this embodiment is not limited to a cleaning process, and can be applied to various processes in which a substrate W is processed using a liquid, such as an etching process, an ashing process, or a developing process.

[0038] Hereinafter, an embodiment of the present invention will be described in detail with reference to Figures 1 to 20. A substrate processing apparatus 1 according to an embodiment of the present invention can perform a cleaning process including a drying process for drying a substrate (W) using a process fluid.

[0039] 1 is a plan view showing a schematic view of a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 1, the substrate processing apparatus 1 includes an index module 10 and a treating module 20. According to an embodiment, the index module 10 and the treating module 20 are arranged along one direction. Hereinafter, the direction in which the index module 10 and the treating module 20 are arranged is defined as a first direction 2. When viewed from above, a direction perpendicular to the first direction 2 is defined as a second direction 4, and a direction perpendicular to a plane including both the first direction 2 and the second direction 4 is defined as a third direction 6.

[0040] The index module 10 transports the substrate (W) from the container (F) in which the substrate (W) is stored to the processing module 20 for processing the substrate (W). The index module 10 stores the substrate (W) that has been processed in the processing module 20 back into the container (F). The length direction of the index module 10 is provided in the second direction 4. The index module 10 has a load port 120 and an index frame 140.

[0041] A container (F) containing a substrate (W) is placed on the load port 120. The load port 120 is located on the opposite side of the processing module 20 with respect to the index frame 140. A plurality of load ports 120 may be provided. The plurality of load ports 120 may be arranged in a row along the second direction 4. The number of load ports 120 may be increased or decreased depending on the process efficiency and footprint conditions of the processing module 20.

[0042] The container (F) has a plurality of slots (not shown). The slots (not shown) can accommodate the substrates (W) while they are arranged horizontally with respect to the ground. The container (F) may be a sealed container such as a Front Opening Unified Pod (FOUP). The container (F) may be placed on the load port 120 by a transport means (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle, or by a worker.

[0043] An index rail 142 and an index robot 144 are provided inside the index frame 140. The index rail 142 is provided in the index frame 140 with its length direction aligned along the second direction 4. The index robot 144 can transport a substrate (W). The index robot 144 can transport a substrate (W) between the index module 10 and a buffer unit 220, which will be described later.

[0044] The index robot 144 includes an index hand 146. The index hand 146 holds a substrate (W). The index hand 146 may be provided movably along the second direction 4 on the index rail 142. The index hand 146 may move forward and backward along the index rail 142. The index hand 146 may also be provided rotatably about the third direction 6. The index hand 146 may also be provided movably vertically along the third direction 6. A plurality of index hands 146 may be provided. The plurality of index hands 146 may be provided spaced apart from each other in the vertical direction. The plurality of index hands 146 may move forward, backward, and rotate independently of each other.

[0045] The controller 30 can control the substrate processing apparatus 1. The controller 30 can include a process controller implemented by a microprocessor (computer) that controls the substrate processing apparatus 1, a user interface implemented by a keyboard for an operator to input commands to manage the substrate processing apparatus 1 and a display that visualizes and displays the operating status of the substrate processing apparatus 1, and a storage unit that stores a control program for executing the processing performed by the substrate processing apparatus 1 under the control of the process controller and a program for causing each component to execute the processing according to various data and processing conditions, i.e., a processing recipe. The user interface and the storage unit may be connected to the process controller. The processing recipe may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, a portable disk such as a CD-ROM or a DVD, or a semiconductor memory such as a flash memory.

[0046] The controller 30 can control the substrate processing apparatus 1 to perform a substrate processing method described below. For example, the controller 30 can control components provided in a transfer unit 500 and a back surface cleaning unit 600 to perform a substrate processing method described below.

[0047] The processing module 20 may include a buffer unit 220, a transfer frame 240, a liquid treatment chamber 300, a drying chamber 400, a transfer unit 500, and a backside cleaning unit 600. The buffer unit 220 provides a buffer space where the substrate (W) loaded into the processing module 20 and the substrate (W) loaded out of the processing module 20 temporarily stay. The transfer frame 240 provides a transfer space for transferring the substrate (W) between the buffer unit 220, the liquid treatment chamber 300, and the drying chamber 400. In addition, the buffer frame 240 provides a backside cleaning space for cleaning the backside of the substrate (W) that has completed the liquid treatment in the liquid treatment chamber 300 while being transferred from the liquid treatment chamber 300 to the drying chamber 400.

[0048] The liquid treatment chamber 300 and the drying chamber 400 may perform a cleaning process. The cleaning process may be performed sequentially in the liquid treatment chamber 300 and the drying chamber 400. The liquid treatment chamber 300 performs a liquid treatment process of supplying a liquid onto the substrate (W) and liquid treating the substrate (W). The liquid treatment chamber 300 may supply a treatment liquid onto the substrate (W). For example, the treatment liquid may be at least one of a chemical, a rinse liquid, and an organic solvent. The drying chamber 400 may perform a drying process of drying the liquid remaining on the substrate (W). For example, the drying chamber 400 may perform a drying process of drying the liquid remaining on the substrate (W) using a supercritical fluid.

[0049] The buffer unit 220 may be disposed between the index frame 140 and the transport frame 240. The buffer unit 220 may be located at one end of the transport frame 240. A slot (not shown) in which a substrate (W) is placed is provided inside the buffer unit 220. A plurality of slots (not shown) may be provided. The plurality of slots (not shown) may be disposed to be spaced apart from each other along the third direction 6. The buffer unit 220 has an open front face and a rear face. The front face may face the index module 10, and the rear face may face the transport frame 240. The index robot 144 may approach the buffer unit 220 through the front face, and the transport robot 540 described below may approach the buffer unit 220 through the rear face.

[0050] The transfer frame 240 has a transfer space therein through which the substrate (W) is transferred. The transfer frame 240 may have a transfer space therein through which the substrate (W) is transferred between the buffer unit 220, the liquid treatment chamber 300, and the drying chamber 400. Components of a transfer unit 500, which will be described later, may be disposed in the transfer space. For example, a guide rail 520 and a transfer robot 540, which will be described later, may be disposed in the transfer space.

[0051] A fan filter unit (not shown) for forming a downward air current in the transfer space may be installed on the upper surface of the transfer frame 240. The fan filter unit (not shown) may include a fan and a filter. The fan filter unit (not shown) supplies external air to the transfer space. The filter removes impurities contained in the air.

[0052] An exhaust member 242 may be installed on the lower surface of the transfer space of the transfer frame 240. A plurality of exhaust members 242 may be provided. The exhaust members 242 may form a negative pressure in the transfer space. The exhaust members 242 may exhaust various particles and by-products generated in the transfer space to the outside of the transfer space. In addition, particles present in the transfer space may ride on the downward air current of the transfer space formed by a fan filter unit (not shown) and be exhausted to the outside of the transfer space through the exhaust member 242.

[0053] The transport frame 240 may be provided with its length direction along the first direction 2. The liquid treatment chamber 300 and the drying chamber 400 may be disposed on both sides of the transport frame 240. The liquid treatment chamber 300 and the drying chamber 400 may be disposed on the sides of the transport frame 240. The transport frame 240 and the liquid treatment chamber 300 may be disposed along the second direction 4. In addition, the transport frame 240 and the drying chamber 400 may be disposed along the second direction 4.

[0054] According to an example, the liquid treatment chambers 300 are disposed on both sides of the transfer frame 240, and the drying chambers 400 are disposed on both sides of the transfer frame 240. The liquid treatment chambers 300 may be disposed relatively closer to the buffer unit 220 than the drying chambers 400. The liquid treatment chambers 300 may be provided in an AXB (A and B are each a natural number greater than 1 or 1) array along the first direction 2 and the third direction 6 on one side of the transfer frame 240. Here, A is the number of the liquid treatment chambers 300 provided in a row along the first direction 2, and B is the number of the liquid treatment chambers 300 provided in a row along the third direction 6. For example, when four liquid treatment chambers 300 are provided on one side of the transfer frame 240, the liquid treatment chambers 300 may be arranged in a 2X2 array. The number of the liquid treatment chambers 300 may be increased or decreased. Unlike the above, the liquid treatment chamber 300 may be provided on only one side of the transfer frame 240, and the other side opposite the one side may be provided with only the drying chamber 400. Also, the liquid treatment chamber 300 and the drying chamber 400 may be provided in a single layer on one and both sides of the transfer frame 240.

[0055] The liquid treatment chamber 300 performs a liquid treatment process on the substrate (W). For example, the liquid treatment chamber 300 may be a chamber that performs a cleaning process to remove process by-products attached to the substrate (W). The liquid treatment chamber 300 may have different structures depending on the type of process to treat the substrate (W). Alternatively, each liquid treatment chamber 300 may have the same structure.

[0056] 2 is a schematic diagram illustrating an embodiment of the liquid treatment chamber of FIG 1. Referring to FIG 2, the liquid treatment chamber 300 includes a housing 310, a treatment container 320, a supporting unit 330, and a liquid supply unit 340.

[0057] The housing 310 has an internal space. The housing 310 is generally shaped like a rectangular parallelepiped. An opening (not shown) is formed on one side of the housing 310. The opening (not shown) functions as an entrance through which a substrate (W) is transferred into or out of the internal space of the housing 310 by a transfer robot 540, which will be described later. The processing vessel 320, the support unit 330, and the liquid supply unit 340 are disposed in the internal space of the housing 310.

[0058] The processing vessel 320 has a processing space with an open top. The processing vessel 320 may be a bowl having the processing space. The processing vessel 320 may be provided to enclose the processing space. The processing space of the processing vessel 320 is provided as a space where a supporting unit 330, which will be described later, supports and rotates the substrate (W). The processing space is provided as a space where a liquid supplying unit 340, which will be described later, supplies liquid onto the substrate (W) to process the substrate (W).

[0059] According to an example, the processing vessel 320 may have a guide wall 321 and a plurality of collection troughs 323, 325, and 327. Each of the collection troughs 323, 325, and 327 separates and collects different liquids from among the liquids used in processing the substrate (W). Each of the collection troughs 323, 325, and 327 may have a collection space for collecting the liquid used in processing the substrate (W).

[0060] The guide wall 321 and the collecting troughs 323, 325, 327 are provided in a ring shape surrounding the support unit 330. When liquid is supplied onto the substrate (W), the liquid scattered by the rotation of the substrate (W) can flow into the collecting space through the collecting troughs 323a, 325a, 327a of the inlets of the collecting troughs 323, 325, 327, which will be described later. Different types of liquid can flow into each of the collecting troughs 323, 325, 327.

[0061] The treatment vessel 320 has a guide wall 321, a first collecting trough 323, a second collecting trough 325, and a third collecting trough 327. The guide wall 321 is provided in a ring shape surrounding the support unit 330. The first collecting trough 323 is provided in a ring shape surrounding the guide wall 321. The second collecting trough 325 is provided in a ring shape surrounding the first collecting trough 323. The third collecting trough 327 is provided in a ring shape surrounding the second collecting trough 325.

[0062] The space between the guide wall 321 and the first collecting trough 323 functions as a first inlet 323a through which the liquid flows in. The space between the first collecting trough 323 and the second collecting trough 325 functions as a second inlet 325a through which the liquid flows in. The space between the second collecting trough 325 and the third collecting trough 327 functions as a third inlet 327a through which the liquid flows in. The second inlet 325a may be located above the first inlet 323a, and the third inlet 327a may be located above the second inlet 325a. The liquid flowing into the first inlet 323a, the second inlet 325a, and the third inlet 327a may be different types of liquid.

[0063] The space between the lower end of guide wall 321 and first collecting trough 323 functions as first exhaust port 323b through which fumes and air generated from the liquid are exhausted. The space between the lower end of first collecting trough 323 and second collecting trough 325 functions as second exhaust port 325b through which fumes and air generated from the liquid are exhausted. The space between the lower end of second collecting trough 325 and third collecting trough 327 functions as third exhaust port 327b through which fumes and air generated from the liquid are exhausted. The fumes and air exhausted from first exhaust port 323b, second exhaust port 325b, and third exhaust port 327b are exhausted to the outside of liquid treatment chamber 300 through exhaust unit 370 described below.

[0064] Recovery lines 323c, 325c, 327c extending vertically downward are connected to the bottom of each of the recovery tubs 323, 325, 327. Each of the recovery lines 323c, 325c, 327c discharges the liquid that has flowed in through each of the recovery tubs 323, 325, 327. The discharged treated liquid can be reused through an external liquid regeneration system (not shown).

[0065] The support unit 330 supports and rotates the substrate W in the processing space and may include a spin chuck 331, support pins 333, chuck pins 335, a rotating shaft 337, and a driver 339.

[0066] The spin chuck 331 has an upper surface that is generally circular when viewed from above. The upper surface of the spin chuck 331 may have a diameter larger than that of the substrate (W).

[0067] A plurality of support pins 333 are provided. The support pins 333 are disposed on the upper surface of the spin chuck 331. The support pins 333 are disposed at regular intervals on the edge of the upper surface of the spin chuck 331. The support pins 333 are formed to protrude upward from the upper surface of the spin chuck 331. The support pins 333 are disposed to have an overall ring shape when combined with each other. The support pins 333 support the rear edge region of the substrate (W) so that the substrate (W) is spaced a regular distance from the upper surface of the spin chuck 331.

[0068] A plurality of chuck pins 335 are provided. The chuck pins 335 are disposed so as to be relatively farther away from the central region of the spin chuck 331 than the support pins 333. The chuck pins 335 protrude upward from the upper surface of the spin chuck 331. The chuck pins 335 support the side regions of the substrate (W) so that the substrate (W) does not move sideways from its normal position when it is rotated. The chuck pins 335 are provided so as to be linearly movable between a standby position and a support position along the radial direction of the spin chuck 331. The standby position is defined as the position of the chuck pins 335 when the substrate (W) is received from a transfer robot 540 described later or the substrate (W) is handed over to the transfer robot 540. The support position is defined as the position of the chuck pins 336 when a process is performed on the substrate (W). At the support position, the chuck pins 335 come into contact with the side of the substrate (W). The standby position is provided at a position relatively farther away from the center of the spin chuck 331 than the support position.

[0069] The rotating shaft 337 is coupled to the spin chuck 331. The rotating shaft 337 is coupled to a lower surface of the spin chuck 331. The rotating shaft 337 may be provided such that its length faces the third direction 6. The rotating shaft 337 is provided to be rotatable by receiving power from the driver 339. The rotating shaft 337 is rotated by the driver 339, and the spin chuck 331 is rotated via the rotating shaft 337. The driver 339 rotates the rotating shaft 337. The driver 339 may vary the rotation speed of the rotating shaft 337. The driver 339 may be a motor that provides a driving force. However, the driver 339 is not limited thereto, and may be provided by being modified in various ways from a known device that provides a driving force.

[0070] The liquid supply unit 340 supplies a liquid to the substrate W. The liquid supply unit 340 supplies a processing liquid to the substrate W supported by the supporting unit 330. The processing liquid supplied to the substrate W by the liquid supply unit 340 is provided in a variety of types. According to an example, the processing liquid may include at least one of a chemical, a rinse liquid, and an organic solvent.

[0071] The liquid supply unit 340 may include a supporting rod 341, an arm 342, a driver 343, and a liquid supply nozzle 344. The supporting rod 341 is located in the internal space of the housing 310. The supporting rod 341 may be located at one side of the processing vessel 320 in the internal space. The supporting rod 341 may have a rod shape with its length direction facing the third direction 6. The supporting rod 341 is provided to be rotatable by the driver 343 described below.

[0072] The arm 342 is connected to an upper end of the support rod 341. The arm 342 extends vertically from the length of the support rod 341. The arm 342 may extend in a third direction 6. A liquid supply nozzle 344, which will be described later, may be fixedly connected to an end of the arm 342.

[0073] The arm 342 may be provided to be capable of moving forward and backward along its length direction. The arm 342 may be swung by a driver 343 that rotates the supporting rod 341 via a supporting rod 341. The liquid supply nozzle 344 may also be swung by the rotation of the arm 342 and moved between a process position and a standby position.

[0074] The process position may be a position where the liquid supply nozzle 344 faces the substrate W supported by the supporting unit 330. According to one example, the process position may be a position where the center of the liquid supply nozzle 344 faces the center of the substrate W supported by the supporting unit 330. The standby position may be a position where the liquid supply nozzle 344 is away from the process position.

[0075] The driver 343 is coupled to the supporting load 341. The driver 343 may be disposed on the bottom surface of the housing 310. The driver 343 provides a driving force for rotating the supporting load 341. The driver 343 may be provided by a known motor that provides a driving force.

[0076] The liquid supply nozzle 344 supplies a liquid onto the substrate (W). The liquid supply nozzle 344 can supply a processing liquid onto the substrate (W) supported by the support unit 330. For example, the processing liquid can be a liquid that removes a film or foreign matter remaining on the substrate (W). According to an example, the first liquid can be a chemical containing an acid or an alkali, such as sulfuric acid (H2SO4), nitric acid (HNO3), hydrochloric acid (HCl), etc. Also, the processing liquid can be a liquid that is easily dissolved in a supercritical fluid used in the drying chamber 400 described below. According to an example, the processing liquid according to an embodiment can be provided as any one of pure water and alcohol, such as isopropyl alcohol (IPA).

[0077] Although the above-described embodiment of the present invention has been described with reference to a single liquid supply nozzle 344, the present invention is not limited thereto. For example, a plurality of liquid supply nozzles 344 may be provided, and each liquid supply nozzle 344 may supply different processing liquids onto the substrate (W). According to one example, each liquid supply nozzle 344 may independently supply chemicals, pure water, and isopropyl alcohol onto the substrate (W), or may sequentially supply chemicals, pure water, and isopropyl alcohol onto the substrate (W).

[0078] Also, the plurality of liquid supply nozzles 344 may all be coupled to the arm 342. Alternatively, the plurality of liquid supply nozzles 344 may each have an independent arm, a supporting rod, and a driving mechanism, and may independently swing and move forward and backward to move between a process position and a standby position.

[0079] The lifting unit 350 is disposed in the internal space of the housing 310. The lifting unit 350 adjusts the relative height between the processing vessel 320 and the supporting unit 330. The lifting unit 350 can move the processing vessel 320 linearly in the third direction 6. Accordingly, the heights of the recovery tubs 323, 325, 327 for recovering liquids are changed according to the type of liquid supplied to the substrate (W), so that the liquids can be separated and recovered. Unlike the above, the processing vessel 320 is fixedly installed, and the lifting unit 350 can change the relative height between the supporting unit 330 and the processing vessel 320 by moving the supporting unit 330 vertically.

[0080] The airflow supply unit 360 supplies airflow to the internal space of the housing 310. The airflow supply unit 360 may supply a downward airflow to the internal space. The airflow supply unit 360 may be provided in a fan filter unit. The airflow supply unit 360 may be installed on the upper part of the housing 310. The gas supplied to the internal space of the housing 310 through the airflow supply unit 360 forms a downward airflow in the internal space. By-products generated in the processing space during the process are exhausted to the outside of the housing 310 through the exhaust unit 370 described below by the internal space and the downward airflow formed in the processing space.

[0081] The exhaust unit 370 exhausts process by-products such as fumes and gases generated in the processing space. A pressure reducing unit (not shown) provided in the exhaust unit 370 exhausts process by-products such as fumes and gases generated during liquid processing of the substrate (W). The exhaust unit 370 may be coupled to a bottom surface of the processing vessel 320. In one example, the exhaust unit 370 may be disposed in a space between the rotation shaft 337 and an inner wall of the processing vessel 320.

[0082] The drying chamber 400 removes residual liquid from the substrate (W) using a process fluid. According to one embodiment, the drying chamber 400 removes residual processing liquid from the substrate (W) using a supercritical fluid. In the drying chamber 400, a supercritical process is performed using the characteristics of the supercritical fluid. Representative examples include a supercritical drying process and a supercritical etching process. Hereinafter, the supercritical process will be described based on a supercritical drying process. However, this is for convenience of explanation only, and the drying chamber 400 may perform other supercritical processes besides the supercritical drying process. According to one embodiment, the supercritical fluid may be supercritical carbon dioxide (scCO2).

[0083] Fig. 3 is a diagram showing a schematic embodiment of the drying chamber of Fig. 1. Referring to Fig. 3, the drying chamber 400 may include a housing 410, a support 430, a fluid supply unit 450, an exhaust line 460, and a blocking plate 470. The housing 410 provides an internal space 401 in which a drying process is performed on a substrate (W). The housing 410 may include a first body 412, a second body 414, and a lifting member 416.

[0084] The first body 412 and the second body 414 are combined with each other to provide an internal space 401. The first body 412 may be located higher than the second body 414. The first body 412 is fixed in position, and the second body 414 may be elevated by an elevation member 416, which will be described later.

[0085] When the second body 414 descends and is separated from the first body 412, the internal space 401 is opened. When the internal space 401 is opened, the substrate (W) can be loaded into the internal space 401 or the substrate (W) can be unloaded from the internal space 401. The substrate (W) loaded into the internal space 401 may be a substrate (W) that has been subjected to liquid processing in the liquid processing chamber 300. According to an embodiment, processing liquid may remain on an upper surface of the substrate (W) loaded into the internal space 401.

[0086] When the second body 414 moves upward and comes into close contact with the first body 412, the internal space 401 is sealed. When the internal space 401 is sealed, a process fluid can be supplied to perform a drying process on the substrate (W).

[0087] The lifting member 416 lifts and lowers the second body 414. The lifting member 416 may include a lifting cylinder 417 and a lifting rod 418. The lifting cylinder 417 may be coupled to the second body 414. The lifting cylinder 417 may seal the internal space 401 by tightly contacting the first body 412 and the second body 414 against a high pressure exceeding the critical pressure of the internal space 401 while a drying process is being performed on the substrate (W).

[0088] The lift rod 418 generates a lifting force in the up and down direction. For example, the lift rod 418 can generate a force to move in the third direction 6. The length direction of the lift rod 418 can be formed vertically. One end of the lift rod 418 can be inserted into the lift cylinder 417. The other end of the lift rod 418 can be connected to the first body 412. The second body 414 can be moved vertically by the relative lifting motion of the lift cylinder 417 and the lift rod 418. While the second body 414 is moved vertically, the lift rod 418 prevents the first body 412 and the second body 414 from moving in the horizontal direction. The lift rod 418 guides the vertical movement direction of the second body 414. The lift rod 418 can prevent the first body 412 and the second body 414 from separating from each other in the correct position.

[0089] According to the above-mentioned embodiment of the present invention, the second body 414 moves in the vertical direction to seal the internal space 401, but the present invention is not limited to this. For example, the first body 412 and the second body 414 may each move in the vertical direction. Also, the first body 412 may move in the vertical direction, and the second body 414 may be fixed in position.

[0090] Unlike the above-mentioned example, a single housing 410 may be provided with an opening (not shown) through which the substrate (W) is loaded on one side of the housing 410. A door (not shown) may be provided on the housing 410. The door (not shown) may move up and down to open and close the opening (not shown) and maintain the housing 410 in a sealed state.

[0091] A heater 419 may be installed in the housing 410. According to an example, the heater 419 may be installed by being embedded inside at least one wall of the first body 412 and the second body 414. The heater 419 may heat the process fluid supplied to the internal space 401 to a temperature above the critical temperature to maintain the process fluid in a supercritical state, or may heat the process fluid to return to a supercritical state when the process fluid is liquefied.

[0092] The support 430 supports the substrate W within the internal space 401. The support 430 may be fixed to the lower surface of the first body 412. The support 430 may include a fixed rod 432 and a mounting table 434.

[0093] The fixed rod 432 may be fixedly installed on the first body 412 so as to protrude downward from the bottom surface of the first body 412. The fixed rod 432 is provided with its length in the up-down direction. A plurality of fixed rods 432 may be provided. The plurality of fixed rods 432 are positioned to be spaced apart from each other. When a substrate (W) is loaded or unloaded into or from a space surrounded by the plurality of fixed rods 432, the plurality of fixed rods 432 are disposed at positions that do not interfere with the substrate (W). A mounting stand 434 is coupled to each fixed rod 432.

[0094] The mounting table 434 extends from the fixed rod 432. The mounting table 434 may extend from the lower end of the fixed rod 432 in a direction toward the space surrounded by the fixed rods 432. The mounting table 434 supports an edge region of the rear surface of the substrate (W). According to an example, the rear surface of the substrate (W) may be a surface on which no pattern is formed, and the upper surface of the substrate (W) may be a surface on which a pattern is formed. According to the above-mentioned structure, the edge region of the substrate (W) carried into the internal space 401 may be placed on the mounting table 434. In addition, the entire upper surface region of the substrate (W), a central region of the bottom surface of the substrate (W), and a part of the edge region of the bottom surface of the substrate (W) may be exposed to the process fluid supplied to the internal space 401.

[0095] The fluid supply unit 450 supplies a process fluid to the internal space 401. According to an example, the process fluid may be supplied to the internal space 401 in a supercritical state. However, the present invention is not limited thereto, and the process fluid may be supplied to the internal space 401 in a gas state and may be phase-changed to the supercritical state within the internal space 401. The fluid supply unit 450 may include a main supply line 451, a first branch line 452, and a second branch line 454.

[0096] One end of the main supply line 451 is connected to a supply source (not shown) storing the process fluid. The other end of the main supply line 451 is branched into a first branch line 452 and a second branch line 454. The first branch line 452 is connected to the upper surface of the housing 410. According to an example, the first branch line 452 may be connected to the first body 412. For example, the first branch line 452 may be coupled to the center of the first body 412. The first branch line 452 may be located in an upper central region of the substrate (W) placed on the support 430. A first valve 453 may be installed in the first branch line 452. The first valve 453 may be provided as an opening / closing valve. The process fluid may be selectively supplied to the internal space 401 by opening and closing the first valve 453.

[0097] The second branch line 454 is connected to the lower surface of the housing 410. According to an example, the second branch line 454 may be connected to the second body 414. For example, the second branch line 454 may be coupled to the center of the second body 414. The second branch line 454 may be located vertically below the central region of the substrate (W) placed on the support 430. A second valve 455 may be installed in the second branch line 454. The second valve 455 may be an on-off valve. The process fluid may be selectively supplied to the internal space 401 by opening and closing the second valve 455.

[0098] The exhaust line 460 exhausts the atmosphere in the internal space 401. The exhaust line 460 may be coupled to the second body 414. According to an example, the exhaust lines 460 may be arranged to cross each other from the center of the lower surface of the second body 414 when viewed from above. The supercritical fluid flowing in the internal space 401 is exhausted to the outside of the housing 410 through the exhaust line 460.

[0099] A blocking plate 470 is disposed in the internal space 401. The blocking plate 470 may be provided to overlap the outlet of the second branch line 454 and the inlet of the exhaust line 460 when viewed from above. The blocking plate 470 may prevent the process fluid supplied through the second branch line 454 from being directly discharged toward the substrate (W) and damaging the substrate (W).

[0100] The blocking plate 470 may be disposed to be spaced a certain distance upward from the bottom surface of the housing 410. For example, the blocking plate 470 may be supported by a support 472 to be spaced upward from the bottom surface of the housing 410. The support 472 may be provided in a rod shape. A plurality of support stands 472 may be provided. The plurality of support stands 472 are disposed to be spaced a certain distance apart from each other.

[0101] 4 is a perspective view showing an example of a transfer unit and a back cleaning unit of FIG 1. Hereinafter, the transfer unit and the cleaning unit according to the example of the present invention will be described in detail with reference to FIG 4.

[0102] The transfer unit 500 is provided in a transfer space inside the transfer frame 240. The transfer unit 500 transfers the substrate (W) in the transfer space. The transfer unit 500 can transfer the substrate (W) between the buffer unit 220, the liquid treatment chamber 300, and the drying chamber 400. For example, the transfer unit 500 can transfer the substrate (W) from the buffer unit 220 to the liquid treatment chamber 300, and transfer the substrate (W) that has been subjected to liquid treatment from the liquid treatment chamber 300 to the drying chamber 400.

[0103] The transfer unit 500 has a guide rail 520 and a transfer robot 540. The guide rail 520 is installed in the transfer space of the transfer frame 240. For example, the guide rail 520 may be installed on the lower surface of the transfer frame 240. The guide rail 520 may be installed parallel to the length direction of the transfer frame 240. For example, the length direction of the guide rail 520 may be formed in a direction facing the second direction 4. The transfer robot 540, which will be described later, is installed on the guide rail 520 and moves linearly along the length direction of the guide rail 520.

[0104] The transfer robot 540 transfers the substrate (W). The transfer robot 540 may include a transfer hand 541, a hand driver 543, a rotary driver 544, a vertical driver 545, a horizontal driver 546, and an extension 547. According to an embodiment of the present invention, the hand driver 543, the rotary driver 544, the vertical driver 545, and the horizontal driver 546 may be provided by a known motor for transmitting power.

[0105] The transfer hand 541 supports the substrate (W). A pad 541a may be provided on the upper surface of the transfer hand 541. The pad 541a may support the lower surface of the substrate (W). A plurality of pads 541a may be provided. According to an embodiment, three pads 541a are provided to support the lower surface of the substrate (W) at three points.

[0106] A plurality of transfer hands 541 may be provided. The number of transfer hands 541 may be increased or decreased depending on process requirements. A plurality of transfer hands 541 may be provided spaced apart from each other in the vertical direction. The plurality of transfer hands 541 may move forward, backward, and rotate independently of each other. For example, when a plurality of transfer hands 541 are provided, some of the transfer hands 541 may be used to transfer the substrate W from the buffer unit 220 to the liquid treatment chamber 300, and other of the transfer hands 541 may be used to transfer the substrate W that has been subjected to liquid treatment in the liquid treatment chamber 300 to the drying chamber 400.

[0107] The transport hand 541 may be coupled to a connecting part 542. The connecting part 542 may be installed in a hand driving part 543, which will be described later. As an example, the connecting part 542 may be inserted into a rail groove formed in the hand driving part 543. The connecting part 542 may move horizontally along the rail groove formed in the hand driving part 543. The transport hand 541 may move horizontally by the hand driving part 543 via the connecting part 542.

[0108] The hand driver 543 moves the connecting part 542. The hand driver 543 moves the transfer hand 541 via the connecting part 542. The hand driver 543 can horizontally move the transfer hand 541. According to an example, the transfer hand 541 is located on the upper part of the hand driver 543, and a rail groove for guiding the horizontal movement of the transfer hand 541 can be installed on a side of the hand driver 543.

[0109] The rotation driver 544 moves the hand driver 543. The rotation driver 544 can rotate and move the hand driver 543 based on an axis in the third direction 6. The hand driver 543 can be installed on the upper part of the rotation driver 544. According to an example, the rotation driver 544 can be coupled to a lower surface of the hand driver 543. The hand driver 543 rotates due to the rotation of the rotation driver 544, and the transfer hand 541 coupled to the upper part of the hand driver 543 can rotate via the hand driver 543.

[0110] The vertical driver 545 may be installed under the rotary driver 544. The vertical driver 545 is coupled to the rotary driver 544 to move the rotary driver 544. For example, the vertical driver 545 may move the rotary driver 544 along the third direction 6. The vertical positions of the transfer hand 541 and the hand driver 543 may be changed. As a result, the transfer hand 541 may move vertically along the third direction 6.

[0111] The horizontal driving unit 546 may be installed under the vertical driving unit 545. The horizontal driving unit 546 may be coupled to the guide rail 520. The horizontal driving unit 546 may move along the guide rail 520. Thus, the transfer hand 541 may move forward and backward along the guide rail 520. For example, the horizontal driving unit 546 may move linearly along the first direction 2. By the movement of the horizontal driving unit 546, the substrate (W) held by the transfer hand 541 may be transferred between the liquid treatment chamber 300 and the drying chamber 400.

[0112] The extension 547 may extend from the horizontal actuator 546. For example, the extension 547 may extend from the horizontal actuator 546 along the second direction 4. A contact member 620, which will be described later, may be installed on an upper surface of the extension 547.

[0113] The hand driver 543, the rotary driver 544, and the vertical driver 545 described above can move the substrate W held by the transfer hand 541 to a back cleaning position. The back cleaning position can be a position where the back cleaning unit 600 described later can remove liquid remaining on the back surface of the substrate W. For example, the back cleaning position can be a position where the contact member 620 installed on the extension 547 and the back surface of the substrate W come into contact with each other. For example, the back cleaning position can be a position where the edge region of the substrate W held by the transfer hand 541 and the contact member 620 described later overlap each other when viewed from above. Also, the back cleaning position can be a height where the back surface of the substrate W held by the transfer hand 541 and the upper surface of the contact member 620 correspond to each other when viewed from the front. For example, the back cleaning position can be a height where the back surface of the substrate W held by the transfer hand 541 and the upper surface of the contact member 620 match each other when viewed from the front.

[0114] The back surface cleaning unit 600 cleans the substrate (W). According to an embodiment, the back surface cleaning unit 600 can clean the back surface of the substrate (W) while transporting the substrate (W). For example, the back surface cleaning unit 600 can clean the back surface of the substrate (W) while transporting the substrate (W) that has been subjected to liquid treatment in the liquid treatment chamber 300 to the drying chamber 400. That is, the back surface cleaning unit 600 can clean the back surface of the substrate (W) while transporting the substrate (W) in the transport space inside the transport frame 240.

[0115] The back cleaning unit 600 may include a contact member 620. The contact member 620 may come into contact with the back surface of the substrate (W). The contact member 620 may come into contact with the back surface of the substrate (W) to remove liquid remaining on the back surface of the substrate (W). For example, the contact member 620 may come into contact with the back surface of the substrate (W) to remove processing liquid remaining on the edge region of the back surface of the substrate (W). The contact member 620 may be made of a material that does not damage the substrate (W). Also, the contact member 620 may be made of a material that can easily absorb liquid. According to an example, an upper end region of the contact member 620 may be made of a material that can easily absorb liquid. For example, the upper end of the contact member 620 may be made of a synthetic resin material such as a sponge, which is an example of a porous material.

[0116] The contact member 620 may be installed at a position where it does not interfere with the transport hand 541, the connecting part 542, and the hand driving part 543. According to an embodiment, the contact member 620 may be installed on the upper surface of the extension part 547. The contact member 620 may have a set height and a constant thickness. The contact member 620 may have a thickness that is recessed a certain distance from an end of the substrate (W) toward the center of the substrate (W) when the substrate (W) held by the transport hand 541 is located at the back cleaning position.

[0117] For example, the set height may be a height corresponding to the height from the lower end of the hand driving part 543 to the back surface of the substrate (W) placed on the transport hand 541. Thus, when the substrate (W) held by the transport hand 541 moves to the back surface cleaning position, the substrate (W) held by the transport hand 541 may move in the third direction 6 without being interfered with by the contact member 620. Thus, the back surface of the substrate (W) held by the transport hand 541 may come into contact with the upper surface of the contact member 620.

[0118] The contact member 620 may be formed to have a curvature. According to one example, the contact member 620 may have a shape with a curved shape with a portion cut off. When viewed from above, the cut portion of the contact member 620 may overlap with a portion of the transfer hand 541 holding the substrate W positioned at the back cleaning position.

[0119] The detailed mechanism by which the contact member 620 cleans the back surface of the substrate (W) while the substrate (W) is being transported by the transport robot 540 will be described later.

[0120] According to the above-described embodiment, a member capable of wiping and removing the processing liquid, such as a brush or wiper, may be further installed on the upper surface of the contact member 620. When the brush or wiper is further installed on the upper surface of the contact member 620, the processing liquid remaining on the rear surface of the substrate W may be removed by the brush or wiper in a state where the rear surface of the substrate W is in contact with the brush or wiper when the substrate W is positioned at the rear surface cleaning position.

[0121] Figures 5 to 7 are perspective views showing another embodiment of the rear cleaning unit of Figure 4. Hereinafter, a modified embodiment of the rear cleaning unit of the present invention will be described in detail with reference to Figures 5 to 7. The rear cleaning unit according to the embodiment described below is provided in a manner similar to or the same as the above-mentioned rear cleaning unit except where otherwise described, and therefore the description of the overlapping contents will be omitted.

[0122] 5, a contact member 620 according to an example may have a guide hole 622 formed therein. A plurality of guide holes 622 may be provided. The plurality of guide holes 622 may be arranged along a circumferential direction of the contact member 620. The plurality of guide holes 622 may be disposed spaced apart at regular intervals. The guide holes 622 may be provided as through holes penetrating the contact member 620 from an upper end to a lower end. The guide holes 622 may be provided as fine holes having a small diameter.

[0123] When the substrate (W) placed on the transfer hand 541 is located at the back cleaning position, the back surface of the substrate (W) and the upper surface of the contact member 620 may come into contact with each other. Due to the contact between the substrate (W) and the contact member 620, the processing solution remaining on the back surface of the substrate (W) may flow to the upper surface of the contact member 620. The processing solution flowed to the upper surface of the substrate (W) may flow in a direction toward the lower end of the contact member 620 along the guide holes 622 due to capillary action.

[0124] Unlike the above example, the contact member 620 may not be provided with a guide hole 622 penetrating the upper and lower ends of the contact member 620. According to one example, a groove may be formed on a side of the contact member 620. The groove may be formed from the upper end to the lower end of the contact member 620. The processing liquid remaining on the rear surface of the substrate (W) flows to the upper surface of the contact member 620, and the processing liquid that has flowed to the upper surface of the contact member 620 may be removed from the substrate (W) through the groove formed in the contact member 620.

[0125] 6, the contact member 620 according to an embodiment may have a first portion 624 and a second portion 626. The first portion 624 and the second portion 626 may be installed on the upper surface of the extension portion 547. The first portion 624 and the second portion 626 may be combined with each other to have a generally circular shape. The first portion 624 and the second portion 626 may be combined with each other to correspond to an edge region of the substrate W positioned at the back cleaning position when viewed from above. The first portion 624 and the second portion 626 may be positioned to face each other. The first portion 624 and the second portion 626 may be positioned symmetrically to each other and have a symmetrical shape.

[0126] The first portion 624 and the second portion 626 are provided to have the same or similar structure, and the following description will focus on the first portion 624.

[0127] The first portion 624 may be formed to have a curvature. When the substrate (W) is located at the back cleaning position, the first portion 624 may be formed to have a curvature with respect to the center of the substrate (W). The upper surface of the first portion 624 may contact the rear surface of the substrate (W) when the substrate (W) is located at the back cleaning position. The upper surface of the first portion 624 may contact the rear edge region of the substrate (W) when the substrate (W) is located at the back cleaning position. The upper surface of the first portion 624 may be provided with a material that does not damage the substrate (W). Also, the first portion 624 may be provided with a material that can easily absorb liquid. According to an example, the upper end region of the first portion 624 may be provided with a material that can easily absorb liquid. For example, the upper end of the first portion 624 may be provided with a porous material.

[0128] The first part 624 may be disposed at a position where it does not interfere with the transfer hand 541, the connecting part 542, and the hand driving part 543. For example, when the substrate (W) placed on the transfer hand 541 is located at the back surface cleaning position, the transfer hand 541, the connecting part 542, and a part of the hand driving part 543 may be located in the space between the first part 624 and the second part 626.

[0129] Referring to FIG. 7, the contact member 620 according to an embodiment may be provided with a contact pin 628 having a rod shape. The contact pin 628 may be coupled to the upper surface of the extension portion 547. A plurality of contact pins 628 may be provided. When the substrate (W) is positioned at the rear cleaning position, the plurality of contact pins 628 are arranged at a certain distance from each other to correspond to the edge region of the substrate (W) when viewed from above. The end of the contact pin 628 may be formed to be convex toward the rear surface of the substrate (W). The contact pins 628 having a convex end may minimize damage to the rear surface of the substrate (W) when contacting the rear surface of the substrate (W) positioned at the rear cleaning position. The processing solution remaining on the rear surface of the substrate (W) may flow along the contact pins 628 that are in contact with the rear surface of the substrate (W).

[0130] In the above-described embodiments, the contact member 620 is installed on the upper surface of the extension 547, but the present invention is not limited thereto. In an embodiment, the transfer robot 540 may not be provided with the extension 547, and the contact member 620 may be installed on the upper surface of the horizontal driving unit 546. Alternatively, the contact member 620 may be installed on the upper surface of the hand driving unit 543 to contact the rear surface of the substrate (W).

[0131] In the above example, the pad 541a is provided on the upper surface of the transfer hand 541 to support the lower surface of the substrate (W), but the present invention is not limited to this. For example, the upper surface of the transfer hand 541 is provided with a suction hole (not shown) for providing a vacuum force, and the suction hole (not shown) faces the lower surface of the substrate (W) and provides negative pressure to vacuum-suck the substrate (W).

[0132] A substrate processing method according to an embodiment of the present invention will be described in detail below. The substrate processing method described below can be performed by the substrate processing apparatus 1. The controller 30 controls components of the transfer unit 500 and the backside cleaning unit 600 to perform the substrate processing method described below. For convenience of explanation, the substrate processing method according to an embodiment of the present invention will be described below by taking as an example the substrate processing apparatus 1 described with reference to FIGS. 1 to 4 as being performed. However, the present invention is not limited thereto, and the substrate processing method according to the embodiment of the present invention can be performed in the same or similar manner in FIGS. 5 to 7.

[0133] 8 is a flow chart of a substrate processing method according to an embodiment of the present invention, which includes a liquid processing step (S10), a transport step (S20), and a drying step (S30).

[0134] The liquid treatment step (S10), the transport step (S20), and the drying step (S30) may be performed in sequence, and the liquid treatment step (S10), the transport step (S20), and the drying step (S30) may be collectively defined as a cleaning process.

[0135] 9 is a diagram showing a schematic view of a substrate being treated in a liquid treatment step according to an embodiment of FIG. 8. Referring to FIG. 9, the liquid treatment step (S10) is performed in a liquid treatment chamber 300. In the liquid treatment step (S10), a liquid is supplied onto the substrate (W) to liquid-treat the substrate (W). According to an example, in the liquid treatment step (S10), a treatment liquid is supplied onto the substrate (W) to liquid-treat the substrate (W). For example, in the liquid treatment step (S10), at least one of a chemical, a rinsing liquid, and an organic solvent is supplied onto the substrate (W) to liquid-treat the substrate (W). For example, in the liquid treatment step (S10), a chemical, a rinsing liquid, and an organic solvent are sequentially supplied onto the substrate (W) to liquid-treat the substrate (W).

[0136] 10 and 11 are views sequentially showing how a substrate on which liquid treatment has been completed is positioned at a backside cleaning position in the transfer step according to one embodiment of FIG. 8. Referring to FIG. 10 and 11, the transfer step (S20) is performed by a transfer robot 540. In the transfer step (S20), the transfer robot 540 transfers the substrate (W) from the liquid treatment chamber 300 to the drying chamber 400. In the transfer step (S20), the transfer robot 540 removes the substrate (W) on which liquid treatment has been completed from the liquid treatment chamber 300. The transfer robot 540 transfers the substrate (W) removed from the liquid treatment chamber 300 into the drying chamber 400 through a transfer space inside the transfer frame 240.

[0137] In the transport step (S20), the processing liquid remaining on the back surface of the substrate (W) can be removed while the substrate (W) is being transported from the liquid treatment chamber 300 to the drying chamber 400. In the transport step (S20), while the substrate (W) is being transported in the transport space inside the transport frame 240, the substrate (W) is positioned at a back surface cleaning position, so that the processing liquid remaining on the back surface of the substrate (W) can be removed.

[0138] As described above, the back cleaning position may be a position where the back cleaning unit 600 can remove liquid remaining on the back surface of the substrate W. For example, the back cleaning position may be a position where the transfer robot 540 moves horizontally in the first direction 2 and / or the second direction 4 and moves downward in the third direction 6 so that the back surface of the substrate W placed on the transfer hand 541 and the upper surface of the contact member 620 installed on the transfer robot 540 can come into contact with each other. Also, the back cleaning position may be a position where the edge region of the substrate W and the contact member 620 overlap each other when viewed from above. Also, the back cleaning position may be a height where the back surface of the substrate W and the upper surface of the overlap member 620 coincide with each other when viewed from the front.

[0139] After the transfer robot 540 transfers the substrate (W) out of the liquid processing chamber 300, it can change the position of the transfer hand 541. The transfer hand 541 can be moved by a hand driving unit 543, a rotation driving unit 544, and a vertical driving unit 545 to be positioned at a back surface cleaning position.

[0140] 10, after the transfer hand 541 carries out the substrate W on which the liquid treatment has been completed from the liquid treatment chamber 300, the hand driver 543 and the rotation driver 544 can change the horizontal position of the substrate W lifted up by the transfer hand 541. The horizontal position can be a position where the edge region of the substrate W lifted up by the transfer hand 541 and the contact member 620 overlap each other when viewed from above.

[0141] When the substrate W lifted by the transfer hand 541 is positioned in a horizontal position, the vertical driver 545 can lower the transfer hand 541 in the third direction 6 as shown in Fig. 11 to position the rear surface of the substrate W lifted by the transfer hand 541 in contact with the upper surface of the contact member 620. More specifically, the vertical driver 545 lowers the substrate W that is positioned in a horizontal position to position the substrate W in the rear cleaning position. Thus, the rear edge region of the substrate W and the upper surface of the contact member 620 can come into contact with each other.

[0142] In addition, in the process of supplying the processing liquid from the liquid treatment chamber 300 onto the substrate (W), the processing liquid that has left the edge region of the substrate (W) and flowed onto the rear surface of the substrate (W) can be removed by the contact member 620. In addition, according to an embodiment of the present invention, in the process of transporting the substrate (W) from the liquid treatment chamber 300 to the drying chamber 400, the processing liquid remaining on the rear surface of the substrate (W) can be removed, thereby increasing the efficiency of the substrate (W) processing process. In addition, according to an embodiment of the present invention, a fan filter unit (not shown) and an exhaust member 242 are installed inside the transport frame 240, so that the processing liquid removed within the transport space can be preemptively discharged within the transport space without affecting the chamber in which the subsequent process is performed.

[0143] According to the above-described embodiment, the process of cleaning the rear surface of the substrate (W) in the transfer step (S20) may be performed while the transfer robot 540 moves along the first direction 2, which is the length direction of the transfer frame 240, by the horizontal driving unit 546. Alternatively, after unloading the substrate (W) that has been subjected to liquid treatment in the liquid treatment chamber 300, the process of cleaning the rear surface of the substrate (W) in the transfer step (S20) may be performed while the transfer robot 540 is stopped in the first direction 2 and only moves vertically in the third direction 6.

[0144] Figures 12 and 13 are views sequentially showing the state in which a substrate is dried in the drying step according to one embodiment of Figure 8. Referring to Figures 12 and 13, the drying step (S30) is performed in the drying chamber 400. The substrate (W) transferred by the transfer robot 224 in the transfer step (S20) is loaded into the inner space 401 of the drying chamber 400. In the drying step (S30), a process fluid is supplied to the substrate (W) transferred into the drying chamber 400 to remove any liquid remaining on the substrate (W).

[0145] In the drying step (S30), the substrate (W) is transferred to the support 430 with the internal space 401 open. The substrate (W) transferred to the support 430 may be a substrate (W) that has been liquid-treated in the liquid treatment chamber 300 and has had its back surface cleaned by the back surface cleaning unit 600. The substrate (W) transferred to the internal space 401 of the drying chamber 400 may be dried with its back surface edge region supported by the support 430.

[0146] When the substrate (W) is placed on the support 430, the first body 412 and the second body 414 are in close contact with each other, and the internal space 401 is sealed from the outside. For example, when the substrate (W) is placed on the mounting stand 434 and the rear edge region of the substrate (W) is supported, the internal space 401 is converted to a sealed state. After the internal space 401 is sealed, the fluid supply unit 450 supplies a process fluid to the internal space 401. In one example, the fluid supply unit 450 may supply a supercritical fluid to the internal space 401. The substrate (W) is dried by supplying the process fluid to the internal space 401. That is, the process fluid is supplied to the internal space 401 to remove the processing liquid remaining on the upper surface of the substrate (W).

[0147] After the internal space 401 is sealed, the second valve 455 is opened to supply the process fluid to the internal space 401 first through the second branch line 454. After the process fluid is supplied to the lower region of the internal space 401, the first valve 453 is opened to supply the process fluid to the internal space 401 through the first branch line 452.

[0148] Since the drying process of the substrate may proceed in a state where the internal space 401 has not yet reached the critical pressure at the beginning of the drying process of the substrate, the process fluid supplied to the internal space 401 may be liquefied. If the process fluid is supplied to the internal space 401 through the first branch line 452 at the beginning of the drying process of the substrate, the process fluid may be liquefied and fall onto the substrate (W) due to gravity, causing damage to the substrate (W). In this regard, in the drying step (S30) according to an embodiment of the present invention, the process fluid is first supplied to the internal space 401 through the second branch line 454, and after the pressure of the internal space 401 reaches the critical pressure, the process fluid begins to be supplied through the first branch line 452, thereby minimizing the process fluid supplied to the internal space 401 being liquefied and causing damage to the substrate (W).

[0149] In the latter stage of the drying step (S30), the internal atmosphere of the internal space 401 is exhausted through the exhaust line 460. If the pressure in the internal space 401 is increased to a critical pressure or lower, the process fluid may be liquefied. The liquefied process fluid may be exhausted through the exhaust line 460 by gravity.

[0150] Fig. 14 is a perspective view illustrating another embodiment of the back cleaning unit of Fig. 4. Fig. 15 is a view illustrating an embodiment of the back cleaning unit of Fig. 14 as viewed from above.

[0151] 14 and 15, the back surface cleaning unit 600 may be provided with a non-contact member 640. The non-contact member 620 may supply a decontamination source toward the back surface of the substrate (W). The non-contact member 640 may not be in physical contact with the back surface of the substrate (W). The non-contact member 640 may be installed in the transfer robot 540. According to one example, the non-contact member 640 may be installed in the hand drive unit 543.

[0152] When viewed from above, the non-contact member 640 may be installed at a position overlapping an edge region of the substrate (W) held by the transfer hand 541. Also, when viewed from the front, the non-contact member 640 may be installed at a position spaced a certain distance from the rear surface of the substrate (W) held by the transfer hand 541. In addition, the non-contact member 640 may be installed at a position spaced a certain distance from the rear surface of the substrate (W).

[0153] A plurality of non-contact members 640 may be provided. The plurality of non-contact members 640 may be positioned to be spaced apart from each other along a direction around the edge region of the substrate (W) when viewed from above. According to an example, the non-contact member 640 may be provided as an airflow supply device that supplies airflow as a decontamination source. For example, the non-contact member 640 may be provided with an air outlet through which airflow flows on an upper surface of the hand driving unit 543. The air outlet may be connected to an airflow supply source (not shown) to supply airflow toward the rear surface of the substrate (W).

[0154] 16 is a front view of the back surface cleaning unit according to an embodiment of FIG. 14 cleaning the back surface of a substrate. Referring to FIG. 16, a transfer robot 540 transfers a substrate (W) that has been liquid-treated in the liquid treatment chamber 300 to a drying chamber 400. While the transfer robot 540 transfers the substrate (W) that has been liquid-treated, a non-contact member 640 according to an embodiment of the present invention supplies airflow toward the back surface of the substrate (W). The airflow supplied to the edge region of the back surface of the substrate (W) may collide with the back surface of the substrate (W) and spread radially. Thus, the processing liquid remaining on the edge of the substrate (W) may be pushed outwardly of the back surface edge of the substrate (W) by the airflow supplied by the non-contact member 640 and removed.

[0155] Unlike the above-mentioned example, the decontamination source supplied to the rear surface of the substrate W by the non-contact member 620 according to an example may be a heat source. The non-contact member 620 according to an example may be provided by a heating element. The heating element may be provided by a known heater.

[0156] An on / off switch (not shown) may be connected to the non-contact member 620. The non-contact member 620 may apply heat to the rear surface of the substrate (W) from the non-contact member 640 while the substrate (W) that has been subjected to the liquid treatment in the liquid treatment chamber 300 is being transported to the drying chamber 400. Also, the non-contact member 620 may apply heat to the rear surface of the substrate (W) from the non-contact member 640 only when the substrate (W) that has been subjected to the liquid treatment is being transported. The processing liquid remaining on the rear surface of the substrate (W) that has been subjected to the liquid treatment may be removed by the heat applied to the rear surface of the substrate (W) during the transport process.

[0157] Unlike the above example, the non-contact member 640 may be installed on the upper surface of the horizontal driving part 546. When the non-contact member 640 is installed on the upper surface of the horizontal driving part 546, the non-contact member 640 may supply airflow toward the rear surface of the substrate (W) after the substrate (W) placed on the transport hand 541 moves downward in the third direction 6, thereby removing the processing liquid remaining on the rear surface of the substrate (W). Optionally, the transport unit 540 may further be provided with an extension part 547, and the non-contact member 640 may be installed on the upper surface of the extension part 547.

[0158] Figure 17 is a schematic diagram showing another embodiment of the substrate processing apparatus of Figure 1. The substrate processing apparatus according to the embodiment described below is provided in a similar manner to the substrate processing apparatus described above except for the transfer frame 240, and therefore, description of overlapping contents will be omitted.

[0159] The transfer frame 240 may include a first transfer frame 240a and a second transfer frame 240b. The first transfer frame 240a and the second transfer frame 240b may be disposed such that their length direction is along the first direction 2. The first transfer frame 240a may be disposed to be in contact with the buffer unit 220 relative to the second transfer frame 240b. The liquid treatment chambers 300 may be disposed on both sides of the first transfer frame 240a. The drying chambers 400 may be disposed on both sides of the second transfer frame 240b. A rear cleaning frame 700, which will be described later, may be disposed between the first transfer frame 240a and the second transfer frame 240b. In addition, the first transfer frame 240a and the second transfer frame 240b may be disposed symmetrically to each other with respect to the rear cleaning frame 700.

[0160] One side of the first transfer frame 240a can be aligned with the front surface of the buffer unit 220. The other side of the first transfer frame 240a can be aligned with the front surface of the rear cleaning frame 700 (described later). One side of the second transfer frame 240b can be aligned with the rear surface of the rear cleaning frame 700.

[0161] The first transfer frame 240a has a first transfer space therein into which the substrate (W) is transferred. The first transfer space functions as a space for transferring the substrate (W) that has been subjected to liquid processing in the liquid processing chamber 300 to the back surface cleaning frame 700 described below. The second transfer frame 240b has a second transfer space therein into which the substrate (W) is transferred. The second transfer space functions as a space for transferring the substrate (W) that has had the processing liquid removed from its back surface by the back surface cleaning frame 700 to the drying chamber 400.

[0162] The first and second transfer frames 240a and 240b are each provided with the components of the transfer unit 500. For example, the first and second transfer frames 240a and 240b may be provided with the guide rails 520 and the transfer robot 540. In addition, the first and second transfer frames 240a and 240b may each have a fan filter unit (not shown) installed on an upper surface and an exhaust member 242 installed on a lower surface.

[0163] FIG. 18 is a perspective view showing an example of the back cleaning frame of FIG. 17. Referring to FIG. 18, the back cleaning frame 700 can remove the processing liquid remaining on the back surface of the substrate (W). For example, the back cleaning frame 700 can remove the processing liquid remaining on the back surface of the substrate (W) after the liquid processing in the liquid processing chamber 300 is completed. The back cleaning frame 700 can store the substrate (W) after the liquid processing in the liquid processing chamber 300 is completed. In one example, the back cleaning frame 700 can store the substrate (W) after the processing liquid is removed from the back surface. The back cleaning frame 700 can be disposed between the first transfer frame 240a and the second transfer frame 240b.

[0164] The back cleaning frame 700 may be provided as a housing having an internal space with front and rear sides open. In one example, the back cleaning frame 700 may be provided in a generally hexahedral shape. The substrate (W) that has been subjected to the liquid treatment in the liquid treatment chamber 300 may be placed in the internal space of the back cleaning frame 700. The open front surface of the back cleaning frame 700 may face the first transfer frame 240a. The open rear surface of the back cleaning frame 700 may face the second transfer frame 240b. Thus, the substrate (W) that has been subjected to the liquid treatment from the liquid treatment chamber 300 may be transferred to the open front surface of the back cleaning frame 700 by the transfer robot 540. Also, the substrate (W) that has been subjected to a predetermined treatment in the back cleaning frame 700 may be transferred to the drying chamber 400 through the open rear surface of the back cleaning frame 700.

[0165] A partition plate 720, a waiting slot 740, and an exhaust hole 760 may be provided in the inner space of the rear cleaning frame 700. Also, the above-mentioned rear cleaning unit 600 may be installed in the inner space of the rear cleaning frame 700. The rear cleaning unit 600 installed in the inner space of the rear cleaning frame 700 may be provided in the same or similar manner as the embodiments described with reference to FIGS. 1 to 16. That is, according to an example, a contact member 620 or a non-contact member 640 may be installed in the rear cleaning frame 700. According to an example, the contact member 620 or the non-contact member 640 installed in the rear cleaning frame 700 may be installed on the bottom surface of the rear cleaning frame 700.

[0166] The partition plate 720 may have a mesh structure so that the atmosphere in the internal space can be smoothly exhausted through exhaust holes 760 (described later). The partition plate 720 may divide the internal space of the rear cleaning frame 700. For example, the partition plate 720 may divide the internal space of the rear cleaning frame 700 into an upper waiting area and a lower cleaning area.

[0167] The upper waiting area may be provided as a space in which a waiting slot 740, which will be described later, is installed. The lower cleaning area may be provided as a space in which a back cleaning unit 600 is installed. According to one example, the upper waiting area may be provided as a space in which a substrate (W) whose back surface has had the processing solution removed waits. Alternatively, the upper waiting area may be provided as a space in which a substrate (W) waits before the processing solution is removed from its back surface. For ease of explanation, the upper waiting area will be described below as a space in which a substrate (W) waits after the processing solution has been removed from its back surface.

[0168] The waiting slot 740 may be formed on the inner surface of the back cleaning frame 700. A plurality of waiting slots 740 may be provided. The waiting slots 740 may be arranged spaced apart from each other vertically. The length direction of the waiting slots 740 may be formed along the inner surface of the back cleaning frame 700. The waiting slots 740 are formed to protrude from the inner surface of the back cleaning frame 700. The waiting slots 740 may generally have an arc shape. However, the waiting slots 740 are not limited thereto, and may have a rectangular shape when viewed from above. The waiting slots 740 are provided to overlap an edge region of the substrate (W) when viewed from above.

[0169] The substrate W after completion of the liquid treatment in the liquid treatment chamber 300 may be placed on the upper surface of the waiting slot 740. The edge region of the substrate W placed in the waiting slot 740 may be supported by the waiting slot 740. According to one example, the substrate W placed in the waiting slot 740 may be a substrate W from which the treatment liquid has been removed after the liquid treatment is completed.

[0170] Exhaust holes 780 may be formed on the bottom surface of the backside cleaning frame 700. The exhaust holes 780 may exhaust the atmosphere in the internal space of the backside cleaning frame 700. The exhaust holes 780 may exhaust particles, process by-products, etc., generated in the process of removing a processing solution remaining on the backside of the substrate (W) from the lower region of the backside cleaning frame 700.

[0171] Fig. 19 is a flow chart of a substrate processing method according to another embodiment of the present invention. Fig. 20 is a top view of the back surface of a substrate being cleaned in the back surface cleaning step according to an embodiment of Fig. 19. Hereinafter, for convenience of explanation, an example will be described in which an example contact member 620 is installed in the inner space of the back surface cleaning frame 700 in the substrate processing method according to an embodiment of the present invention. However, the present invention is not limited thereto, and the substrate processing method according to an embodiment of the present invention can be applied to the case in which a non-contact member 640 is installed inside the back surface cleaning frame 700.

[0172] 19 and 20, a method for treating a substrate according to an embodiment of the present invention includes a liquid treating step (S10), a transferring step (S20), and a drying step (S30). The transferring step (S20) may include a first transferring step (S22), a backside cleaning step (S24), and a second transferring step (S26).

[0173] In the first transfer step (S22), the transfer robot 540 may transfer the substrate (W) that has been subjected to the liquid treatment step (S10) in the liquid treatment chamber 300 to the inner space of the back cleaning frame 700 through the first transfer space. In the first transfer step (S22), the substrate (W) that has been subjected to the liquid treatment in the liquid treatment chamber 300 may be transferred to the inner space of the back cleaning frame 700 through the open front surface of the back cleaning frame 700.

[0174] In the back cleaning step (S24), the transfer robot 540 positions the transfer hand 541 in the lower cleaning region within the inner space of the back cleaning frame 700. When the transfer hand 541 is positioned in the lower cleaning region, the transfer robot 540 moves horizontally so that the back surface of the substrate (W) held by the transfer hand 541 comes into contact with the upper surface of the contact member 620. As shown in FIG. 20, the back edge region of the substrate (W) held by the transfer hand 541 overlaps with the upper surface of the contact member 620 when viewed from above. In this way, the horizontal movement of the transfer hand 541 brings the back edge region of the substrate (W) into contact with the upper surface of the contact member 620, and in this process, the processing solution remaining in the back edge region of the substrate (W) can be removed. The processing solution removed by the contact member 620 can be discharged through the exhaust hole 780 installed on the bottom surface of the back cleaning frame 700.

[0175] After the back cleaning step (S24) is completed, the substrate (W) is moved horizontally by the transfer robot 540 toward the open front side of the back cleaning frame 700, and then moved vertically upward to be placed in the waiting slot 740.

[0176] In the second transfer step (S26), the transfer robot 540 located in the second transfer space pulls out the substrate (W) that has completed the back surface cleaning step (S24) and has the processing solution removed from its back surface and is waiting in the waiting slot 740 from the back surface cleaning frame 700, and transfers it to the second transfer space. The transfer robot 540 carries the substrate (W) transferred to the second transfer space into the drying chamber 400 and places the substrate (W) on the support 430 of the drying chamber 400. The substrate (W) placed on the support 430 performs the drying step (S30) with its edge region supported.

[0177] When a substrate (W) is treated in the liquid treatment chamber 300, the treatment liquid may be removed from the edge of the substrate (W) due to various reasons such as process conditions or the amount of liquid supplied. The treatment liquid removed from the edge region of the substrate (W) may remain on the back surface of the substrate (W). The treatment liquid remaining on the back surface of the substrate (W) may act as a contamination source that contaminates the subsequent substrate in the subsequent process.

[0178] In accordance with one embodiment of the present invention, residual processing liquid on the rear edge region of the substrate (W) is removed from a rear cleaning frame 700 having a separate internal space, thereby minimizing contamination of the transfer space as well as the chamber in which the subsequent process is performed by residual processing liquid.

[0179] In addition, the substrate (W) that has been subjected to the liquid treatment in the liquid treatment chamber 300 may be transported by a separate transport robot 540 provided in a separate first transport space, and the substrate (W) from which the treatment liquid has been removed from its rear surface may be transported by a separate transport robot 540 provided in a separate second transport space. That is, the substrate (W) before the rear surface treatment liquid is removed and the substrate (W) after the treatment liquid has been removed from its rear surface may be transported to separate transport robots 540. This makes it possible to efficiently prevent contamination of the substrate (W) by the treatment liquid remaining on the rear surface in a chamber performing a subsequent process.

[0180] The above detailed description is illustrative of the present invention. The above description is intended to illustrate preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, modifications or alterations are possible within the scope of the inventive concept disclosed herein, within the scope of equivalents to the disclosed contents, and / or within the scope of the technology or knowledge of the art. The described embodiments are intended to illustrate the best conditions for embodying the technical ideas of the present invention, and various modifications are possible as required by specific application fields and uses of the present invention. Therefore, the above detailed description of the invention is not intended to limit the present invention to the disclosed embodiments. The appended claims should be construed to include other embodiments. [Explanation of symbols]

[0181] 10 Index Module 20 Processing Module 30 Controller 240 Transport Frame 300 Liquid Processing Chamber 400 Drying Chamber 500 Transport Units 540 Transport Robot 600 Rear cleaning unit 620 Contact member 640 Non-contact components 700 Rear cleaning frame

Claims

1. In an apparatus for processing a substrate, a liquid treatment chamber for supplying a treatment liquid to the substrate to perform liquid treatment; a drying chamber for supplying a process fluid to the substrate and drying the substrate; a transport unit for transporting the substrate between the liquid treatment chamber and the drying chamber; and a back surface cleaning unit for cleaning a back surface of the substrate, The transport unit includes: a transport robot that moves within a transport frame that provides a transport space and has a transport hand that holds the substrate; The back surface cleaning unit includes: a contact member that is installed on the transfer robot and that contacts a rear surface of the substrate to remove the processing liquid remaining on the rear surface of the substrate; The back surface of the substrate is washed during the transfer of the substrate from the liquid treatment chamber to the drying chamber. Substrate processing equipment.

2. The contact member is The substrate processing apparatus according to claim 1 , wherein the transport hand is located below the transport hand, and contacts the rear surface of the substrate by vertical movement of the transport hand on which the substrate is placed.

3. The contact member includes: A plurality of holes are formed through the upper and lower ends of the contact member, The substrate processing apparatus of claim 2 , wherein the holes are spaced apart from one another along a length of the contact member.

4. In an apparatus for processing a substrate, a liquid treatment chamber for supplying a treatment liquid to the substrate to perform liquid treatment; a drying chamber for supplying a process fluid to the substrate and drying the substrate; a transport unit for transporting the substrate between the liquid treatment chamber and the drying chamber; and a back surface cleaning unit for cleaning a back surface of the substrate, The transport unit includes: a transport robot that moves within a transport frame that provides a transport space and has a transport hand that holds the substrate; a back cleaning frame having a slot in which the substrate is placed is installed inside the transfer frame; the backside cleaning frame is located between the liquid treatment chamber and the drying chamber; The back surface cleaning unit includes: a contact member that contacts a rear surface of the substrate to remove the processing liquid remaining on the rear surface of the substrate; The contact member is installed inside the rear cleaning frame, The back surface cleaning unit includes: The back surface of the substrate is washed during the transfer of the substrate from the liquid treatment chamber to the drying chamber. Substrate processing equipment.

5. The contact member is The substrate processing apparatus according to claim 4 , wherein the transport hand is installed at a position where the transport hand comes into contact with the rear surface of the substrate during the process of transporting the substrate held by the transport hand into the rear surface cleaning frame.

6. In an apparatus for processing a substrate, a liquid treatment chamber for supplying a treatment liquid to the substrate to perform liquid treatment; a drying chamber for supplying a process fluid to the substrate and drying the substrate; a transport unit for transporting the substrate between the liquid treatment chamber and the drying chamber; and a back surface cleaning unit for cleaning a back surface of the substrate, The transport unit includes: a transport robot that moves within a transport frame that provides a transport space and has a transport hand that holds the substrate; The back surface cleaning unit includes: a non-contact member that is installed on the transfer robot at a distance from a rear surface of the substrate and that removes the processing liquid remaining on the rear surface of the substrate in a non-contact manner, the non-contact member supplying a decontamination source toward the rear surface of the substrate to remove the processing liquid; The back surface cleaning unit includes: The back surface of the substrate is washed during the transfer of the substrate from the liquid treatment chamber to the drying chamber. Substrate processing equipment.

7. A substrate processing apparatus as described in claim 6, wherein the decontamination source is provided as heat or airflow.

8. In an apparatus for processing a substrate, a liquid treatment chamber for supplying a treatment liquid to the substrate to perform liquid treatment; a drying chamber for supplying a process fluid to the substrate and drying the substrate; a transport unit for transporting the substrate between the liquid treatment chamber and the drying chamber; and a back surface cleaning unit for cleaning a back surface of the substrate, The transport unit includes: a transport robot that moves within a transport frame that provides a transport space and has a transport hand that holds the substrate; The back surface cleaning unit includes: a non-contact member spaced apart from a rear surface of the substrate and configured to remove the processing liquid remaining on the rear surface of the substrate in a non-contact manner; A back cleaning frame having slots for receiving the substrate is installed inside the transfer frame, the backside cleaning frame is located between the liquid treatment chamber and the drying chamber; The non-contact member is installed inside the rear surface cleaning frame, The back surface cleaning unit includes: The back surface of the substrate is washed during the transfer of the substrate from the liquid treatment chamber to the drying chamber. Substrate processing equipment.

9. the drying chamber includes a support for supporting the substrate; The support is The substrate processing apparatus according to claim 1 , wherein the substrate processing apparatus supports a rear edge area of ​​the substrate after the liquid processing has been completed.

10. 1. A method for processing a substrate, comprising: a liquid treatment step of supplying a treatment liquid to the substrate; a transport step of transporting the liquid-treated substrate; and a drying step of supplying a process fluid to the liquid-treated substrate to dry the substrate; In the transport step, removing the processing liquid remaining on the back surface of the substrate by mutual contact between the substrate and a contact member that contacts the back surface of the substrate during the transportation of the substrate that has been subjected to the liquid processing; the transferring step is performed by a transfer robot that transfers the liquid-treated substrate, The contact member is installed on the transport robot, The transfer robot contacts the back surface of the substrate while transferring the substrate that has been liquid-treated. A method for processing a substrate.

11. 1. A method for processing a substrate, comprising: a liquid treatment step of supplying a treatment liquid to the substrate; a transport step of transporting the liquid-treated substrate; and a drying step of supplying a process fluid to the liquid-treated substrate to dry the substrate; In the transport step, removing the processing liquid remaining on the back surface of the substrate by mutual contact between the substrate and a contact member that contacts the back surface of the substrate during the transportation of the substrate that has been subjected to the liquid processing; the contact member is installed in a back cleaning frame installed in a transfer space for transferring the substrate that has been subjected to the liquid treatment in the transfer step, The transport step includes: a first transfer step of transferring the substrate, on which the liquid treatment has been completed, from a liquid treatment chamber in which the liquid treatment step is performed to the back cleaning frame; a back surface cleaning step of cleaning a back surface of the substrate by the back surface cleaning frame; and After the back surface cleaning step, the substrate is transported to a drying chamber where a drying step is performed. A method for processing a substrate.

12. 1. A method for processing a substrate, comprising: a liquid treatment step of supplying a treatment liquid to the substrate; a transport step of transporting the liquid-treated substrate; and a drying step of supplying a process fluid to the liquid-treated substrate to dry the substrate; In the transport step, the processing liquid remaining on the rear surface of the liquid-treated substrate is removed from the substrate in a non-contact manner by a non-contact member that supplies a decontamination source that removes the processing liquid toward the rear surface of the substrate; the transferring step is performed by a transfer robot that transfers the liquid-treated substrate, The non-contact member is The substrate is transferred to the transfer robot and / or to a back cleaning frame installed in a transfer space for transferring the substrate treated with the liquid in the transfer step. A method for processing a substrate.

13. In an apparatus for processing a substrate, a liquid processing chamber for supplying a processing liquid to an upper surface of the substrate to perform liquid processing on the substrate; a drying chamber for supplying a supercritical fluid to the substrate to dry the substrate; a transport unit for transporting the substrate between the liquid treatment chamber and the drying chamber; and a back surface cleaning unit for cleaning a back surface of the substrate, The drying chamber comprises: A housing having an interior space; and a support unit for supporting a rear edge region of the substrate after the liquid treatment is completed in the internal space, The transport unit includes: a transport robot that moves within a transport frame that provides a transport space and has a transport hand that holds the substrate; The back surface cleaning unit includes: a contact member that contacts the rear surface of the substrate to remove the treatment liquid remaining on the rear surface of the substrate, or a non-contact member that is spaced apart from the rear surface of the substrate to remove the treatment liquid remaining on the rear surface of the substrate in a non-contact manner, the contact member and the non-contact member are installed on the transport robot and positioned below the transport hand; The back surface cleaning unit includes: During the transfer of the substrate from the liquid treatment chamber to the drying chamber, the rear surface of the substrate is cleaned in a contact and / or non-contact manner to remove the treatment liquid remaining on the rear surface of the substrate. Substrate processing equipment.

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