Wiring board, package for storing electronic components, and electronic device

Abstract

This wiring board comprises: a base body having a first surface, a second surface, and a side surface positioned between the first and second surfaces; a signal electrode positioned on the first surface; first and second recesses positioned from the side surface to the first surface; a first ground conductor positioned in the inner surface of the first recess; and a second ground conductor positioned in the inner surface of the second recess. When seen in a first direction perpendicular to the first surface, the visible outline of the base body includes at least one circular arc. When seen in the first direction, the signal electrode extends from a median value region of the first surface toward the circular arc, and is positioned biased from a normal passing through the center point of the circular arc. When seen in the first direction, the first and second recesses are positioned in a manner as to overlap the circular arc and to interpose the signal electrode therebetween.

Description

[Technical field]

[0001] The present disclosure relates to a wiring board, an electronic component storage package, and an electronic device. [Background technology]

[0002] Japanese Patent Application Laid-Open No. 2012-238640 describes a package for an optical semiconductor element having a ceramic wiring substrate portion. Summary of the Invention [Means for solving the problem]

[0003] (1) The present disclosure In one aspect The wiring board is A substrate having a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface; A signal electrode located on the first surface; a first recess and a second recess located from the side surface to the first surface; a first ground conductor located on an inner surface of the first recess; a second ground conductor located on an inner surface of the second recess; a first via connected to the first ground conductor; a second via connected to the second ground conductor; Equipped with When viewed from a first direction perpendicular to the first surface, an outline of the base includes at least one arc; When viewed from the first direction, the signal electrode extends from a central region of the first surface toward the arc and is positioned offset from a normal line passing through a central point of the arc, When viewed from the first direction, the first recess and the second recess overlap the arc and are positioned with the signal electrode therebetween. 、 the first via is exposed to the side surface closer to the second surface than the first recess; the second via is exposed to the side surface closer to the second surface than the second recess; When a direction parallel to the first surface and perpendicular to the normal line is defined as a horizontal direction, Each of the first recess, the second recess, the first via, and the second via has a dimension in the direction along the normal line that is longer than a dimension in the lateral direction, and a corner shape of a portion close to the signal electrode in a cross section parallel to the first surface is rounded. do. (2) Another aspect of the wiring board according to the present disclosure is A substrate having a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface; A signal electrode located on the first surface; a first recess and a second recess located from the side surface to the first surface; a first ground conductor located on an inner surface of the first recess; a second ground conductor located on an inner surface of the second recess; a first via connected to the first ground conductor; a second via connected to the second ground conductor; Equipped with When viewed from a first direction perpendicular to the first surface, an outline of the base includes at least one arc; When viewed from the first direction, the signal electrode extends from a central region of the first surface toward the arc and is positioned offset from a normal line passing through a central point of the arc, When viewed from the first direction, the first recess and the second recess overlap the arc and are positioned with the signal electrode therebetween, the first via is exposed to the side surface closer to the second surface than the first recess; the second via is exposed to the side surface closer to the second surface than the second recess; The first via and the second via are spaced from the second surface. (3) Another aspect of the wiring board according to the present disclosure is A substrate having a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface; A signal electrode located on the first surface; a first recess and a second recess located from the side surface to the first surface; a first ground conductor located on an inner surface of the first recess; a second ground conductor located on an inner surface of the second recess; a ground electrode located on the first surface; Equipped with When viewed from a first direction perpendicular to the first surface, an outline of the base includes at least one arc; When viewed from the first direction, the signal electrode extends from a central region of the first surface toward the arc and is positioned offset from a normal line passing through a central point of the arc, When viewed from the first direction, the first recess and the second recess overlap the arc and are positioned with the signal electrode therebetween, a dimension of the first recess in a direction along the normal line is larger than a dimension of the second recess; the ground electrode is connected to the first ground conductor and the second ground conductor; In the ground electrode, a first region that is closer to the first recess than to the second recess has a larger area than a second region that is closer to the second recess than to the first recess.

[0004] The electronic component storage package according to the present disclosure comprises: The device comprises the above wiring board and a frame portion located on the second surface.

[0005] The electronic device according to the present disclosure comprises: The electronic component storage package; An electronic component mounted on the wiring board; a module substrate joined to the signal electrode, the first ground conductor, and the second ground conductor; Equipped with. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is an exploded perspective view illustrating an electronic device according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a perspective view showing the wiring board of FIG. [Diagram 3] 2 is a plan view of the front side showing the wiring board of FIG. 1. [Figure 4A] 2 is a plan view showing the rear side of the wiring board of FIG. 1. [Figure 4B] 2 is a plan view of the back side of the wiring board shown in FIG. 1 with an insulating film removed. [Diagram 5] 4 is an enlarged plan view of the periphery of the ground electrode on the first surface. FIG. [Figure 6] 2 is a side view showing the wiring board of FIG. 1. [Figure 7A] FIG. 7 is a cross-sectional view taken along line AA in FIG. 6. [Figure 7B] FIG. 7 is a cross-sectional view taken along line BB in FIG. [Figure 8] FIG. 13 is a plan view showing another example of the wiring board according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. Fig. 1 is an exploded perspective view showing an electronic device according to an embodiment of the present disclosure.

[0008] As shown in FIG. 1, an electronic device 1 of the present embodiment includes an electronic component storage package 20 including a wiring board 10, a module substrate 30 on which the wiring board 10 is mounted, and a component 50 mounted on the wiring board 10.

[0009] The electronic component storage package 20 includes a wiring board 10 having a component mounting portion 101, a frame portion 21, and a lid 22. The frame portion 21 is joined to the wiring board 10 and the lid 22, and supports the wiring board 10 and the lid 22. The frame portion 21 may be made of metal and have a disk shape having a through hole 211 in the center. The frame portion 21 may be joined to the wiring board 10 at a periphery of the opening of the through hole 211 on one surface. The component mounting portion 101 may be open to the other side through the through hole 211. The lid 22 is joined to the other surface of the frame portion 21, and covers the component mounting portion 101 of the wiring board 10. The lid 22 has an opening 221 through which light passes, and the opening 221 may be blocked by a transparent member.

[0010] The module substrate 30 may be an FPC (Flexible Printed Circuits). The module substrate 30 has a plurality of electrodes 31 to 36 electrically connected to the wiring substrate 10. The module substrate 30 has a signal line 37 through which a high frequency signal is input or output. The signal line 37 is connected to an electrode 35.

[0011] The component 50 includes an electronic component 51 and an optical component 52, and is mounted on the component mounting portion 101 of the wiring board 10. The component 50 may be mounted on the component mounting portion 101 via a submount 55. The electronic component 51 may be a component that inputs or outputs a high-frequency signal. In the example of FIG. 1, the electronic component 51 is an optical semiconductor component such as a semiconductor laser, and the optical component 52 is a prism that reflects light emitted by the electronic component 51 toward the opening 221 of the lid 22. The optical component 52 may be a lens, or the electronic component 51 may be a light receiving element such as a photodiode. The optical component 52 may be arranged to match the emission position or incidence position of light. The electronic component 51 may be arranged to match the position of the optical component 52. The component 50 may also include circuit components such as a capacitor and a resistor element.

[0012] Fig. 2 is a perspective view showing the wiring board of Fig. 1. The perspective view shows the wiring board 10 from the back side. Fig. 3 is a plan view of the front side showing the wiring board of Fig. 1. Fig. 4A is a plan view of the back side showing the wiring board of Fig. 1. Fig. 4B is a plan view of the back side of the wiring board excluding the insulating film. Fig. 5 is an enlarged plan view of the periphery of the ground electrode on the first surface.

[0013] The wiring board 10 includes a base 11 having a first surface S1, a second surface S2 located on the opposite side to the first surface S1, and a side surface S3 extending from the first surface S1 to the second surface S2. Here, the back side mentioned above is the first surface S1 side of the wiring board 10, and the front side mentioned above is the second surface S2 side of the wiring board 10.

[0014] The substrate 11 may be formed by laminating layers of dielectric materials. Examples of the dielectric materials that can be used include ceramic materials such as aluminum oxide sintered body, mullite sintered body, silicon carbide sintered body, aluminum nitride sintered body, and silicon nitride sintered body, and glass ceramic materials.

[0015] The base 11 may be, for example, circular when viewed from a direction (first direction) perpendicular to the first surface S1. The circular shape here may include a shape with a part of a circle cut out or a shape with a part of a circle protruding. When the base 11 is circular, the radius of the circle may be 0.5 mm to 5 mm, and the height of the base 11 may be 0.5 mm to 10 mm. Here, the direction perpendicular to the first surface S1 is defined as the height direction.

[0016] 4A, the outline of the base 11 when viewed from a direction perpendicular to the first surface S1 includes at least one arc a1. The outline may include a plurality of arcs a1 to a4 and a plurality of straight lines b1 to b4. The plurality of arcs a1 to a4 and the plurality of straight lines b1 to b4 may be arranged alternately. The plurality of arcs a1 to a4 may have the same center of curvature.

[0017] As shown in Fig. 2, the side surface S3 of the base 11 extends in a direction perpendicular to the first surface S1. The side surface S3 has a curved surface portion S3a and a flat surface portion S3b. The arcs a1 to a4 correspond to the outline of the curved surface portion S3a when viewed from a direction perpendicular to the first surface S1. The straight lines b1 to b4 correspond to the outline of the flat surface portion S3b when viewed from a direction perpendicular to the first surface S1.

[0018] As shown in Fig. 3, the second surface S2 side of the base 11 has a recess D1 that opens upward. Hereinafter, the direction from the first surface S1 toward the second surface S2 is referred to as "upward." Hereinafter, in this disclosure, the direction from the first surface S1 toward the second surface S2 may be referred to as "upward." The component mounting portion 101 may be located in the recess D1. That is, a submount 55 (Fig. 1) may be mounted in the recess D1, and the above-mentioned component 50 may be mounted on the submount 55.

[0019] 3 and 4A, wiring board 10 further includes electrodes (121-126) located on first surface S1, electrodes (131-137) located on second surface S2, and internal conductors (141-146) located within base 11. Wiring board 10 further includes insulating film 15 that covers a portion of the electrodes. Insulating film 15 may be an alumina coating.

[0020] The electrodes located on the second surface S2 include a plurality of power electrodes 131-134, a signal electrode 135 to which a high frequency signal is transmitted, and ground electrodes 136 and 137.

[0021] The signal electrode 135 may be disposed at a position offset from the center of the second surface S2 in accordance with the arrangement of the electronic component 51. As shown in FIG. 1, the optical component 52 may be disposed at the center of the second surface S2, and the electronic component 51 may be disposed off-center of the second surface S2 in accordance with the optical component 52. This arrangement of the optical component 52 allows light to be emitted or incident from the center of the second surface S2, and the above arrangement of the electronic component 51 allows light to be emitted or incident from the electronic component 51 in accordance with the arrangement of the optical component 52. Furthermore, the above arrangement of the signal electrode 135 allows a signal to be transmitted with reduced power loss in accordance with the arrangement of the electronic component 51. The signal electrode 135 may have a shape that is long on one side. The signal electrode 135 may be disposed in a direction such that the longitudinal direction is perpendicular to one side of the electronic component 51. In this arrangement, even if the signal electrode 135 is extended in the longitudinal direction, the extended line does not overlap the center of the second surface S2.

[0022] The ground electrode 136 surrounds the signal electrode 135 outside the recess D1. The ground electrode 137 is located on the inner bottom surface of the recess D1. The ground electrode 137 may also be located on a part of the inner side surface of the recess D1 and connected to the ground electrode 136 outside the recess D1.

[0023] The power electrodes 131-134 may be located outside the recess D1, on the opposite side of the recess D1 to the signal electrode 135. That is, the power electrodes 131-134 may be located on one side of the recess D1, and the signal electrode 135 may be located on the other side of the recess D1.

[0024] As shown in FIG. 4A and FIG. 4B, the electrodes located on the first surface S1 include a plurality of power electrodes 121-124, a signal electrode 125 to which a high-frequency signal is transmitted, and a ground electrode 126. The ground electrode 126 surrounds the signal electrode 125 except for a part of the area. The part of the area may be the vicinity of the outer edge of the first surface S1 closest to the signal electrode 125. The power electrodes 121-124 are located in an area opposite the signal electrode 125 across the ground electrode 126. That is, the power electrodes 121-124 are located on one side of the ground electrode 126, and the signal electrode 125 is located on the other side of the ground electrode 126. The power electrodes 121-124 may be arranged in two rows and two columns in the normal direction Y and the horizontal direction X (see FIG. 4A). The power electrodes 121-124 may be arranged symmetrically with respect to the normal line L1 (FIG. 4A). The normal line L1, the horizontal direction X, and the normal direction Y will be described later.

[0025] The internal conductors located within the base 11 include power conductors 141-144 that electrically connect the power electrodes 121-124 on the first surface S1 to the power electrodes 131-134 on the second surface S2, respectively. When the base 11 is composed of a plurality of laminated dielectric layers, each of the power conductors 141-144 may be composed of a combination of a via conductor penetrating each dielectric layer and a film-like conductor located between two adjacent dielectric layers. The via conductor may be cylindrical extending in a direction perpendicular to the first surface S1, and may be filled with a conductor.

[0026] The internal conductors located within the base 11 further include a signal conductor 145 that electrically connects the signal electrode 125 on the first surface S1 and the signal electrode 135 on the second surface S2. The signal conductor 145 may be configured in such a way that via conductors are connected in a straight line, or in such a way that a plurality of via conductors and one or a plurality of film conductors are connected in a stepped manner. The film conductor of the signal conductor 145 may be strip-shaped.

[0027] The internal conductor located in the base 11 further includes a plurality of ground conductors 146 that electrically connect the ground electrode 126 on the first surface S1 and the ground electrodes 136, 137 on the second surface S2. The ground conductor 146 includes a plurality of via conductors that are connected in a straight line from the first surface S1 to the second surface S2. The plurality of ground conductors 146 are arranged around the signal conductor 145 at intervals that reduce leakage of high-frequency signals. Any of the plurality of ground conductors 146 may be arranged between the power supply conductors 141 to 144 and the signal conductor 145. Furthermore, the plurality of ground conductors 146 may include a film-like conductor, and some of the ground conductors 146 may be electrically connected via one film-like conductor. The film-like conductor included in the ground conductor 146 may be as wide as the ground electrodes 126, 136, 137, or may be narrower than the ground electrodes 126, 136, 137, or may be strip-shaped. That is, in a planar perspective view along the height direction, the area of ​​the film-like conductor included in the ground conductor 146 may be equal to or smaller than the area of ​​the ground electrodes 126, 136, and 137.

[0028] 2, the wiring board 10 further includes a first recess 16, a second recess 17, a first ground conductor 16A, a second ground conductor 17A, a first filled via (first via) 18, and a second filled via (second via) 19. The first ground conductor 16A is a film-like conductor and is located on the inner surface of the first recess 16. The second ground conductor 17A is a film-like conductor and is located on the inner surface of the second recess 17. The first filled via 18 is partially exposed to the side surface S3. The second filled via 19 is partially exposed to the side surface S3.

[0029] The configuration having the first recess 16 and the first ground conductor 16A may be called a castellation. Similarly, the configuration having the second recess 17 and the second ground conductor 17A may be called a castellation. The openings of the first recess 16 and the second recess 17 are located across the side surface S3 and the first surface S1. The first ground conductor 16A may be located at least on a first inner wall surface S16i (FIG. 7A) that is close to the signal electrode 125 among the inner surfaces of the first recess 16. The first ground conductor 16A may be located on the entire inner surface of the first recess 16. The second ground conductor 17A may be located at least on a second inner wall surface S17i (FIG. 7A) that is close to the signal electrode 125 among the inner surfaces of the second recess 17. The second ground conductor 17A may be located on the entire inner surface of the second recess 17. The first ground conductor 16A and the second ground conductor 17A may be connected to the ground electrode 126.

[0030] The first filled via 18 is continuous with the first recess 16 at a position closer to the second surface S2 than the first recess 16. The second filled via 19 is continuous with the second recess 17 at a position closer to the second surface S2 than the second recess 17. The first filled via 18 and the second filled via 19 have a configuration in which a conductor is filled in a hole in the base 11, and a part of the conductor is exposed on the side surface S3. The first filled via 18 may be connected to the first ground conductor 16A. The second filled via 19 may be connected to the second ground conductor 17A.

[0031] In the wiring board 10, a transmission line T1 for transmitting a high-frequency signal is configured by a signal line including a signal electrode 125, a signal conductor 145, and a signal electrode 135, and the surrounding configuration. The surrounding configuration includes a dielectric (base 11) around the signal line, and a plurality of ground conductors arranged around the signal line with the surrounding dielectric sandwiched therebetween. The ground conductors include the ground electrode 126 on the first surface S1, the ground conductor 146 in the base 11, the first ground conductor 16A, the second ground conductor 17A, the first filled via 18, the second filled via 19, and the ground electrode 136 on the second surface S2.

[0032] <Method of Manufacturing Wiring Board 10> The wiring board 10 can be manufactured by the following method, for example. For example, when the base 11 is made of a ceramic material or a glass ceramic material, a conductive material and an insulating material are first provided on a green sheet of the material before firing to produce a sheet-like molded product. Here, the conductive material is a material that forms the electrodes (121-126, 131-137), the first ground conductor 16A, the second ground conductor 17A, the first filled via 18, the second filled via 19, and the internal conductors (141-146). The insulating material is a material that forms the insulating film 15.

[0033] When the base 11 is formed by laminating a plurality of dielectric layers, the step of providing the conductive material and the insulating material may be performed for each layer. That is, by forming holes in the green sheet of each layer and filling the holes with conductive paste, the conductive material for forming the via conductor of the internal conductor (141-146), the first filled via 18, and the second filled via 19 can be provided in the green sheet of each layer. Also, by pattern printing the conductive paste on the surface of the green sheet of each layer, the conductive material for forming the film-like conductor of the internal conductor (141-146) can be provided in the green sheet of the intermediate layer. Furthermore, the conductive material for forming the electrodes (121-126, 131-137) can be provided in the green sheet of the surface layer. Furthermore, by forming holes in the green sheet of a predetermined layer and applying the conductive paste to the inner wall of the hole, the conductive material for forming the first ground conductor 16A in the first recess 16 and the second ground conductor 17A in the second recess 17 can be provided in the green sheet. After that, the green sheets of multiple layers are stacked to obtain one sheet-like molded product before firing.

[0034] The first recess 16 and the second recess 17 may be formed across one layer or multiple layers from the side closer to the first surface S1. Similarly, the first ground conductor 16A and the second ground conductor 17A may be formed across one layer or multiple layers from the side closer to the first surface S1. The first filled via 18 and the second filled via 19 may be formed in one layer or multiple layers located directly above the layer having the first recess 16 and the second recess 17.

[0035] The sheet-like molding is produced so that a single sheet-like molding contains multiple molded products that make up each individual wiring board 10, arranged vertically and horizontally, so that a large number of wiring boards 10 can be obtained from the single sheet-like molding.

[0036] Next, the sheet-like molding is subjected to a die-cutting process to form a part of the outer shape of each molding. At this stage, the moldings are processed so that adjacent moldings are partially connected to each other so that they do not separate. The die-cutting process forms the curved surface S3a of the side surface S3 of the base 11 in each molding. The die-cutting process also causes the first recess 16 and the second recess 17 to appear on the curved surface S3a of the side surface S3, and the first filling via 18 and the second filling via 19 to be exposed on the curved surface S3a of the side surface S3. The curved surface S3a of the side surface S3 is a portion including the arcs a1 to a4 when viewed from a direction perpendicular to the first surface S1.

[0037] Next, the sheet-like molded product is fired, resulting in a fired product in which a plurality of molded products, each of which will become a wiring board 10, are connected vertically and horizontally.

[0038] Next, individual molded products are separated from the fired product by a cutting process such as slicing. The flat surface S3b of the side surface S3 is formed by the cutting process. The flat surface S3b of the side surface S3 is a portion that includes the straight lines b1 to b4 when viewed from a direction perpendicular to the first surface S1. Each of the separated molded products then becomes one wiring board 10. A large number of wiring boards 10 can be efficiently manufactured by the manufacturing method described above.

[0039] <Joining of Module Substrate 30 and Wiring Substrate 10> The electrodes 31-36 of the module substrate 30 are joined to the power electrodes 121-124, signal electrode 125, and ground electrode 126 of the wiring substrate 10 via a conductive bonding material (such as a brazing material). However, a part of the ground electrode 126 is covered with the insulating film 15, and a part of the ground electrode 126 that is not covered with the insulating film 15 is joined to the electrode 36 of the module substrate 30. When the ground electrode 126 and the electrode 36 of the module substrate 30 are joined, a part of the conductive bonding material flows into the inner surface of the first recess 16 and the inner surface of the second recess 17 and then solidifies.

[0040] <Details of the peripheral configuration of the signal electrode 125> As shown in Fig. 4B, the arc a1 located near the signal electrode 125 has a symmetric shape with respect to a normal line L1 passing through the center point of the arc a1. The normal line of an arc means a straight line that is perpendicular to the tangent line of the arc and is included in the same plane as the arc. The normal line L1 may be a straight line included in the first surface S1 or a straight line parallel to the first surface S1. The normal line L1 may overlap the center point of the first surface S1.

[0041] In this embodiment, the direction parallel to the first surface S1 and along the normal line L1 is referred to as the normal direction Y. Also, the direction parallel to the first surface S1 and perpendicular to the normal line L1 is referred to as the horizontal direction X. The width refers to the width in the horizontal direction X (the dimension in the horizontal direction X), and the left and right refer to one side and the other side in the horizontal direction X.

[0042] The first recess 16 and the second recess 17 may overlap the arc a1 when viewed from a direction perpendicular to the first surface S1, and may be positioned to sandwich the signal electrode 125. With this arrangement, a portion of the signal electrode 125 close to the arc a1 can be sandwiched from the left and right by the first ground conductor 16A in the first recess 16 and the second ground conductor 17A in the second recess 17. Furthermore, with this arrangement of the first recess 16 and the second recess 17, it is possible to prevent a conductor from covering immediately above the signal line 37 of the module substrate 30. In addition, a part of the transmission line T1 (a portion close to the first surface S1) can be sandwiched from the lateral direction X by the first ground conductor 16A and the second ground conductor 17A. With the above arrangement, the impedance of the transmission line T1 can be matched, and good high-frequency characteristics of the signal transmission via the signal electrode 125 can be maintained.

[0043] Furthermore, according to the above configuration, in order to sandwich the signal electrode 125 and a part of the transmission line T1 between the ground conductors, the first recess 16 in which the film-like first ground conductor 16A is located on the inner surface and the second recess 17 in which the film-like second ground conductor 17A is located on the inner surface are adopted. Therefore, the bonding strength between the ground electrode 126 and the module substrate 30 can be improved. That is, when the ground electrode 126 and the electrode 36 of the module substrate 30 are bonded, a part of the conductive bonding material flows into the first recess 16 and the second recess 17, and a fillet can be formed between the first recess 16 and the second recess 17 and the module substrate 30. The fillet improves the bonding strength and reduces damage to the bonding portion during use of the electronic device 1.

[0044] The ground electrode 126 may be located around the openings of the first recess 16 and the second recess 17 on the first surface S1. In addition, the ground electrode 126 may be connected to the first ground conductor 16A and the second ground conductor 17A. Furthermore, the ground electrode 126 may be in contact with the arc a1. When viewed from a direction perpendicular to the first surface S1, the first recess 16 and the second recess 17 overlap the arc a1, and the ground electrode 126 is in contact with the arc a1, thereby improving the bonding strength between the ground electrode 126 and the module substrate 30. That is, as described above in the description of the manufacturing method, the portion of the arc a1 is formed by die-cutting before firing. Therefore, when the conductive bonding material is applied to the portion of the ground electrode 126 that overlaps the arc a1 after die-cutting, the conductive bonding material can drip onto the side surface S3. If the conductive bonding material drips onto the side surface S3, a fillet is likely to be formed between the side surface S3 and the electrode 36 of the module substrate 30 when the ground electrode 126 is bonded to the electrode 36 of the module substrate 30. The formation of the fillet improves the bonding strength of the ground electrode 126, and can reduce damage to the bonded portion when the electronic device 1 is used.

[0045] Furthermore, in the above configuration, the first recess 16 and the second recess 17 are arranged to overlap one arc a1 when viewed from a direction perpendicular to the first surface S1, so that damage such as cracks can be reduced in the wiring substrate 10 when the module substrate 30 and the wiring substrate 10 are joined. That is, both ends of the arc a1 are easily made into a gentle angular shape such as a rounded shape when viewed from a direction perpendicular to the first surface S1. The arc a1 having such a shape can be easily formed by die-cutting. Furthermore, the first recess 16 and the second recess 17 are located on either side of the signal electrode 125, so that they are close to the end of the arc a1. Therefore, the ground electrode 126 located around the first recess 16 and the second recess 17 is also likely to be close to the end of the arc a1. Therefore, the end of the arc a1 is likely to be subjected to thermal stress when the ground electrode 126 is joined to the electrode 36 of the module substrate 30. Therefore, by forming the end of the arc a1 to which the stress is applied into a gentle angular shape, it is possible to reduce the occurrence of damage such as cracks in that portion.

[0046] The signal electrode 125 may extend from the central region of the first surface S1 toward the arc a1 when viewed from a direction perpendicular to the first surface S1. This configuration makes it easy to configure an arrangement in which the first recess 16 and the second recess 17 overlap the arc a1 and are positioned with the signal electrode 125 in between.

[0047] When viewed from a direction perpendicular to the first surface S1, the signal electrode 125 may extend from a first position pa (FIG. 4A) closer to the arc a1 than the center of the first surface S1 to a second position pb (FIG. 4A) spaced apart from the outer edge of the first surface S1. This configuration makes it easy to construct an arrangement in which the first recess 16 and the second recess 17 overlap the arc a1 and are positioned with the signal electrode 125 therebetween, and further, the signal electrode 125 can be spaced apart from the outer edge of the first surface S1. By spaced apart from the edge of the first surface S1, it is possible to reduce the conductive bonding material from flowing to the side surface S3 of the base 11 when the signal electrode 125 is joined to the electrode 34 of the module substrate 30. Therefore, it is possible to reduce the occurrence of unnecessary capacitance components due to the conductive bonding material flowing to the side surface S3, which causes deterioration of the high-frequency characteristics of the transmission line T1. In addition, it is possible to reduce the risk of the signal electrode 125 being short-circuited to the ground electrode 126 via the conductive bonding material that has flowed onto the side surface S3.

[0048] The signal electrode 125 may have a shape in which its width changes stepwise from one end to the other end in the longitudinal direction. The signal electrode 125 may have a width wider at a portion farther from the arc a1 than at a portion closer to the arc a1. This shape allows impedance matching around the signal electrode 125, and maintains good high-frequency characteristics of signal transmission through the signal electrode 125. In FIG. 4B, the portion of the signal electrode 125 having a wider width is located farther from the arc a1 than the first recess 16 and the second recess 17. This arrangement is suitable for impedance matching.

[0049] The signal electrode 125 may be positioned offset from the normal line L1. By positioning the signal electrode 125 offset from the normal line L1, the signal line of the transmission line T1 can be arranged closer to a linear arrangement in accordance with the offset arrangement of the signal electrode 135 on the second surface S2. That is, when seen through from the longitudinal direction of the signal electrode 125, the signal electrode 125 on the first surface S1, the signal conductor 145 in the base 11, and the signal electrode 135 on the second surface S2 can be arranged closer to a linear arrangement. Furthermore, when seen through from a direction perpendicular to the first surface S1, the signal electrode 125 on the first surface S1, the signal conductor 145 in the base 11, and the signal electrode 135 on the second surface S2 can be arranged closer to a linear arrangement. The signal line having this configuration can maintain good high frequency characteristics of the transmission line T1.

[0050] Here, the arrangement offset from the normal line L1 may mean an arrangement in which the signal electrode 125 does not intersect with the normal line L1. The offset arrangement may mean an arrangement in which, when the signal electrode 125 intersects with the normal line L1, one area of ​​the signal electrode 125 bisected by the normal line L1 is different from the other area. The signal electrode 125 may have a shape that is longer on one side when viewed from a direction perpendicular to the first surface S1. The longitudinal direction of the signal electrode 125 may be along the normal line L1, or more specifically, may be parallel to the normal line L1. The signal electrode 125 may face the arc a1 in the longitudinal direction of the signal electrode 125.

[0051] The first recess 16 and the second recess 17 may be arranged so that the distance from the first recess 16 to the signal electrode 125 and the distance from the second recess 17 to the signal electrode 125 are the same. This arrangement allows the first recess 16 and the second recess 17 to be arranged symmetrically with respect to the signal electrode 125 located offset from one side. Specifically, the first recess 16 and the second recess 17 can be arranged in plane symmetry with respect to a plane that passes through the center line of the signal electrode 125 in the longitudinal direction and is perpendicular to the first surface S1. The signal electrode 125 and the signal conductor 145 in the base 11 may be arranged so as to overlap the plane from one end to the other end. The above symmetric arrangement allows the impedance of the transmission line T1 to be matched, and good high-frequency characteristics of the transmission line T1 can be maintained.

[0052] The length Ln1 of the first recess 16 in the normal direction Y (dimension in the direction along the normal line L1) may be longer than the length Ln2 of the second recess 17 in the normal direction Y (dimension in the direction along the normal line L1) (FIG. 7A). With this configuration, when the signal electrode 125, the first recess 16, and the second recess 17 are seen through from the lateral direction X so as to overlap, one end p16a of the first recess 16 and one end p17a of the second recess 17 can be brought close to the same point. Alternatively, they can be overlapped at the same point. The one ends p16a and p17a are ends farther from the arc a1. With this configuration, the one ends of the first recess 16 and the second recess 17 can be arranged symmetrically with respect to the signal electrode 125 and the signal conductor 145 in the base 11, which are located offset from each other. Therefore, the impedance of the transmission line T1 can be matched, and good high-frequency characteristics of the transmission line T1 can be maintained.

[0053] When viewed from a direction perpendicular to the first surface S1, the first recess 16 may be disposed closer to the normal line L1 than the signal electrode 125. This arrangement can improve the overall bonding strength between the module substrate 30 and the base 11. That is, the location of the first surface S1 of the base 11 facing the module substrate 30 where a large pressure may be generated by vibration or force being applied to the base 11 is the center of the shape portion protruding outward. Therefore, when vibration or force is applied to the base 11, a large pressure is likely to be generated at the center point of the arc a1. On the other hand, by locating the first recess 16 near the normal line L1, the bonding portion between the ground electrode 136 and the module substrate 30 can be disposed near the center point of the arc a1 where a large pressure is likely to be generated. Since the bonding area between the ground electrode 126 and the module substrate 30 is large, a high bonding strength can be obtained. Therefore, a high bonding strength is obtained at the location where a large pressure is likely to be generated, and the overall bonding strength between the module substrate 30 and the base 11 is improved. Although the first recess 16 may be disposed so as to overlap with the normal line L1, as shown in Fig. 4B, the first recess 16 may be disposed so as not to overlap with the normal line L1. With this arrangement, the ground electrode 126 can be joined to the module substrate 30 at the center point of the arc a1, so that the joining strength between the wiring substrate 10 and the module substrate 30 can be further improved.

[0054] The ground electrode 126 may have an area larger than that of the signal electrode 125, and may surround the signal electrode 125 except for a portion of the region on the arc a1 side from the signal electrode 125. This configuration of the ground electrode 126 allows impedance matching in the vicinity of the signal electrode 125, and allows favorable high-frequency characteristics of signal transmission via the signal electrode 125 to be maintained.

[0055] As shown in FIG. 5, the ground electrode 126 has a first region F1 closer to the first recess 16 than the second recess 17, and a second region F2 closer to the second recess 17 than the first recess 16. The first region F1 may be larger than the second region F2. In FIG. 5, the first region F1 is on the left side of the boundary line E1, and the second region F2 is on the right side of the boundary line E1. The first region F1 and the second region F2 may be defined as one side and the other side when the ground electrode 126 is divided by the center line (center line extending in the longitudinal direction) of the signal electrode 125. The first recess 16 located in the first region F1 has a longer length in the normal direction Y than the second recess 17 located in the second region F2, and is located closer to the normal line L1. By having the first region F1 in the ground electrode 126, many ground conductors 146 (via conductors) can be connected to the first region F1 having a large area, and noise propagation between the power electrodes 121 to 124 and the transmission line T1 can be reduced. This is because the power electrodes 121 to 124 may be disposed symmetrically with respect to the normal line L1, and in this case, the power electrodes 121, 122 located on the opposite side of the normal line L1 from the signal electrode 125 are widely separated from the signal electrode 125 in the horizontal direction. Therefore, when noise occurs, the noise propagates in an oblique direction with respect to the normal line L1 between the power electrodes 121, 122 widely separated from each other in the horizontal direction and the transmission line T1. Therefore, the propagation of the noise can be reduced by the first region F1 of the ground electrode 126 having a large area and the many ground conductors 146 (via conductors) connected to the first region F1.

[0056] 4B, the width of the portion of the ground electrode 126 that contacts the arc a1 may be the same in the first region F1 and the second region F2. That is, in the arc a1, the width of the ground electrode 126 located on both the left and right sides of the first recess 16 may be the same as the width of the ground electrode 126 located on both the left and right sides of the second recess 17. With this configuration, the ground electrode can appropriately match the impedance of the transmission line T1, and good high-frequency characteristics of the transmission line T1 can be maintained.

[0057] The width of the edge 126e (FIG. 4B) of the ground electrode 126 farther from the arc a1 may be substantially the same as or larger than the width from the left end position p1 to the right end position p2 of the region in which the power electrodes 121-124 are arranged. This configuration can further reduce the propagation of noise between the power electrodes 121-124 and the transmission line T1.

[0058] The large-area ground electrode 126 may be partially covered with the insulating film 15 (FIG. 4A). In this case, the large-area first region F1 may be covered with the insulating film 15 to a larger extent than the small-area second region F2. By being covered with the insulating film 15, it is possible to reduce unevenness in the thickness of the conductive bonding material when bonding the ground electrode 126 and the electrode 36 of the module substrate 30, and to improve the bonding strength between the electrode 36 of the module substrate 30 and the ground electrode 126.

[0059] As described above, the first filled via 18 and the second filled via 19 may be provided closer to the second surface S2 than the first recess 16 and the second recess 17, and the first filled via 18 may be connected to the first ground conductor 16A, and the second filled via 19 may be connected to the second ground conductor 17A. The first filled via 18 and the second filled via 19 are via conductors whose internal conductors are exposed to the side surface S3 of the base 11. The first filled via 18 and the second filled via 19 can sandwich the portion of the transmission line T1 close to the side surface S3 between the first filled via 18 and the second filled via 19 in the lateral direction X, and the impedance of the transmission line T1 can be matched. Therefore, the transmission line T1 can maintain good high-frequency characteristics. In addition, the first filled via 18 and the second filled via 19 provide an advantage of reducing manufacturing costs compared to the case where the first recess 16 and the second recess 17 are formed long to the location of the first filled via 18 and the second filled via 19. As described above in the manufacturing method, the first filled vias 18 and the second filled vias 19 can be formed in the same process as the via conductors of the internal conductors (141-146). On the other hand, the first recess 16 having the first ground conductor 16A in the form of a film on the inside and the second recess 17 having the second ground conductor 17A in the form of a film on the inside require a process different from that for the via conductors because the shape of the hole provided in the green sheet is different from that of the via conductors and the conductive paste is applied only to the inner periphery of the hole. Therefore, by employing the first filled vias 18 and the second filled vias 19, the number of layers of the green sheet that require the above-mentioned separate process can be reduced, and manufacturing costs can be reduced.

[0060] Fig. 6 is a side view showing the wiring board 10 of Fig. 1. Fig. 7A and Fig. 7B show a cross section of a portion of the wiring board 10, with Fig. 7A being a cross section taken along line AA in Fig. 6 and Fig. 7B being a cross section taken along line BB in Fig. 6. Fig. 6 corresponds to a side view of the wiring board 10 as viewed from the normal direction Y.

[0061] As shown in FIG. 7A, the first recess 16 and the second recess 17 may have a shape in which the dimension in the normal direction Y is longer than the dimension in the horizontal direction X in a cross section parallel to the first surface S1. As shown in FIG. 7B, the first filled via 18 and the second filled via 19 may have a shape in which the dimension in the normal direction Y is longer than the dimension in the horizontal direction X in a cross section parallel to the first surface S1. The longitudinal directions of the first recess 16, the second recess 17, the first filled via 18 and the second filled via 19 may be parallel to the longitudinal direction of the signal electrode 125 or parallel to the normal direction Y. Furthermore, the first ground conductor 16A may be located at least on the first inner wall surface S16i (FIG. 7A) of the inner surface of the first recess 16 that is closer to the signal electrode 125. Similarly, the second ground conductor 17A may be located at least on the second inner wall surface S17i (FIG. 7A) of the inner surface of the second recess 17 that is closer to the signal electrode 125. The above-mentioned cross-sectional shapes of the first recess 16 and the second recess 17 and the above-mentioned positions of the first ground conductor 16A and the second ground conductor 17A allow the side of the transmission line T1 closer to the side surface S3 to be sandwiched in the lateral direction X by the wide surfaces of the ground conductors. Also, the above-mentioned cross-sectional shapes of the first filled via 18 and the second filled via 19 allow the side of the transmission line T1 closer to the side surface S3 to be sandwiched in the lateral direction X by the wide surfaces of the ground conductors. Therefore, the impedance of the transmission line T1 can be matched by the ground conductors, and good high-frequency characteristics of the transmission line T1 can be maintained.

[0062] As shown in FIG. 7A, the first recess 16 and the second recess 17 may have rounded corners (corresponding to the corners near the signal electrode 125) on the inner side (farther from the arc a1). That is, the first recess 16 and the second recess 17 may have a cross-sectional shape obtained by cutting an ellipse or an elongated hole shape (an elongated hole shape with one end and the other end being semicircular) midway in the longitudinal direction. The first recess 16 and the second recess 17 have the rounded shape, which can reduce stress. Therefore, the bonding strength can be improved when bonding the electrode 35 of the module substrate 30 and the ground electrode 126 of the wiring substrate 10.

[0063] As shown in Fig. 7B, the first filling via 18 and the second filling via 19 may have rounded corners (corresponding to the corner shapes of the parts close to the signal electrode 125) on the inner side (farther from the arc a1). That is, the first filling via 18 and the second filling via 19 may have a cross-sectional shape obtained by cutting an ellipse or an elongated hole shape (an elongated hole shape with semicircular ends) halfway along the longitudinal direction. This shape facilitates the process of filling the holes that will become the first filling via 18 and the second filling via 19 with conductive paste when producing the first filling via 18 and the second filling via 19.

[0064] The first and second filled vias 18 and 19 may be spaced apart from the second surface S2 as shown in Fig. 6. This configuration allows the volumes of the first and second filled vias 18 and 19 to be reduced. This allows the stress generated at the interface between the base 11 and the first and second filled vias 18 and 19 cooled after the sintering step in the manufacturing process to be reduced. Furthermore, since the conductor masses of the first and second filled vias 18 and 19 are located within the base 11 on the side closer to the second surface S2, damage to the first and second filled vias 18 and 19, such as peeling, can be reduced.

[0065] As shown in FIG. 6, the width (dimension in the horizontal direction) w1 of the first recess 16 may be larger than the width (dimension in the horizontal direction) w2 of the first filling via 18. Similarly, the width (dimension in the horizontal direction) w3 of the second recess 17 may be larger than the width (dimension in the horizontal direction) w4 of the second filling via 19. Since the widths w1 and w3 of the first recess 16 and the second recess 17 are large, the conductive bonding material is likely to flow into the first recess 16 and the second recess 17 when bonding the electrode 35 of the module substrate 30 and the ground electrode 126 of the wiring substrate 10. This flow can improve the bonding strength of the bonding portion. On the other hand, since the widths w2 and w4 of the first filling via 18 and the second filling via 19 are small, the volumes of the first filling via 18 and the second filling via 19 can be reduced. The small volume reduces stress generated at the interface between the base 11 and the first and second filling vias 18 and 19 cooled after the sintering step in the manufacturing process. This reduces damage such as peeling of the first and second filling vias 18 and 19. Therefore, by having the widths of the first and second recesses 16 and 17, and the first and second filling vias 18 and 19 satisfy the above-mentioned size relationship, it is possible to both improve the bonding strength and reduce peeling of the vias.

[0066] The first recess 16 and the first filled via 18, which have different widths w1 and w2, may be arranged such that their side surfaces close to the signal electrode 125 overlap at the same position when viewed from a direction perpendicular to the first surface S1. Similarly, the second recess 17 and the second filled via 19, which have different widths w3 and w4, may be arranged such that their side surfaces close to the signal electrode 125 overlap at the same position when viewed from a direction perpendicular to the first surface S1. With this configuration, the first recess 16 and the first filled via 18, and the second recess 17 and the second filled via 19 can be connected without generating a step on the side sandwiching the transmission line T1, and good high frequency characteristics of the transmission line T1 can be maintained.

[0067] The width w1 of the first recess 16 and the width w3 of the second recess 17 may be constant along the height direction, as shown in FIG. 6, or may vary along the height direction. When the width w1 of the first recess 16 and the width w3 of the second recess 17 are constant along the height direction, manufacturing is easy. Also, the width w2 of the first filling via 18 and the width w4 of the second filling via 19 may be constant along the height direction, as shown in FIG. 6, or may vary along the height direction. When the width w2 of the first filling via 18 and the width w4 of the second filling via 19 are constant along the height direction, the number of steps in the manufacturing process can be reduced when the base 11 has a laminated structure.

[0068] In addition, when the width w1 of the first recess 16 and / or the width w2 of the first filled via 18 change along the height direction, the width w1 of the first recess 16 being larger than the width w2 of the first filled via 18 may mean that the minimum value of the width w1 of the first recess 16 is larger than the maximum value of the width w2 of the first filled via 18.

[0069] As described above, the wiring board 10 and electronic component storage package 20 of this embodiment provide the advantages of reducing damage to components when mounted on the module board 30 and improving the bonding strength with the module board 30 while maintaining good high-frequency characteristics. Furthermore, the electronic device 1 of this embodiment has the electronic component storage package 20, which provides the advantage of improving the reliability of the bond between the module board 30 and the wiring board 10 while maintaining good high-frequency characteristics.

[0070] The above describes the embodiments of the present disclosure. However, the present disclosure is not limited to the above embodiments. For example, in the above embodiments, an example was shown in which the outer shape of the base 11 when viewed from a direction perpendicular to the first surface S1 has a plurality of arcs a1 to a4 and a plurality of straight lines b1 to b4. However, as shown in FIG. 8, the outer shape of the base 11 when viewed from a direction perpendicular to the first surface S1 may be, for example, a circle. FIG. 8 is a plan view showing another example of the wiring board 10 according to the embodiment. When the outer shape is a circle, the arc a1 included in the outer shape may be defined based on the signal electrode 125 located on the first surface S1. That is, first, in a plane viewed from a direction perpendicular to the first surface S1, a straight line O1 is set that is parallel to the longitudinal direction of the signal electrode 125 and passes through the center P0 of the circle. Next, the intersection point between the straight line O1 and the circle that is the outer shape of the base 11, which is closer to the signal electrode 125, is set as the reference point Pa. Then, the combined ranges Ha and Hb that are equidistant from the reference point Pa in the clockwise and counterclockwise directions along the circle can be defined as one circular arc a1.

[0071] In the above embodiment, the first filling via 18 is provided above the first recess 16, and the second filling via 19 is provided above the second recess 17, but at least one of the first filling via 18 and the second filling via 19 may not be provided. For example, at least one of the first recess 16 and the second recess 17 may extend in the height direction to the vicinity of the second surface S2 without providing a filling via.

[0072] In the above embodiment, the wiring board 10 has the film-like power electrodes 121-124, the signal electrode 125, and the ground electrode 126, and the power electrodes 121-124, the signal electrode 125, and the ground electrode 126 are respectively joined to the electrodes 31-36 of the module board 30. However, the wiring board 10 may have a plurality of electrode pins instead of the film-like power electrodes 121-124, the signal electrode 125, and the ground electrode 126, and the plurality of electrode pins may be connected to the module board 30. In this configuration, the electronic component storage package may have a TO (Transistor Outline)-Can type configuration. The number and arrangement of various electrodes and electrode pins can be appropriately selected depending on the components to be mounted. Other details shown in the embodiment can be appropriately changed without departing from the spirit of the present disclosure. [Industrial Applicability]

[0073] The present invention can be used in wiring boards, packages for housing electronic components, and electronic devices. [Explanation of symbols]

[0074] 1 Electronic equipment 10 Wiring board 11 Base S1 1st page S2 side 2 S3 Side S3a curved part S3b flat part 15 Insulating film 16 First recess S16i 1st inner wall surface 17 Second recess S17i 2nd inner wall 16A First Ground Conductor 17A Second Ground Conductor 18 First filled via (first via) 19 Second filled via (second via) a1~a4 Arc b1~b4 straight line L1 normal T1 Transmission Line pa 1st position pb 2nd position Ln1, Ln2 Length w1~w4 Width 20 Electronic component storage packages 21 Frame 22 Lid 30 Module Board 50 parts 51 Electronic Components 52 Optical Components 55 Submount 101 Parts mounting section 121~124 Power electrode 125 Signal Electrode 126 Ground electrode F1 1st area F2 2nd area 141~144 Power conductors 145 Signal Conductor 146 Ground Conductor

Claims

1. A substrate having a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface; A signal electrode located on the first surface; a first recess and a second recess positioned from the side surface to the first surface; a first ground conductor located on an inner surface of the first recess; a second ground conductor located on an inner surface of the second recess; a first via connected to the first ground conductor; a second via connected to the second ground conductor; Equipped with When viewed from a first direction perpendicular to the first surface, an outline of the base body includes at least one arc; When viewed from the first direction, the signal electrode extends from a central region of the first surface toward the arc and is positioned offset from a normal line passing through a central point of the arc, When viewed from the first direction, the first recess and the second recess overlap the arc and are positioned with the signal electrode therebetween, the first via is exposed to the side surface closer to the second surface than the first recess; the second via is exposed to the side surface closer to the second surface than the second recess; When a direction parallel to the first surface and perpendicular to the normal line is defined as a lateral direction, each of the first recess, the second recess, the first via, and the second via has a dimension in the direction along the normal line that is longer than a dimension in the lateral direction, and a corner shape of a portion close to the signal electrode in a cross section parallel to the first surface is rounded; Wiring board.

2. A substrate having a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface; A signal electrode located on the first surface; a first recess and a second recess positioned from the side surface to the first surface; a first ground conductor located on an inner surface of the first recess; a second ground conductor located on an inner surface of the second recess; a first via connected to the first ground conductor; a second via connected to the second ground conductor; Equipped with When viewed from a first direction perpendicular to the first surface, an outline of the base body includes at least one arc; When viewed from the first direction, the signal electrode extends from a central region of the first surface toward the arc and is positioned offset from a normal line passing through a central point of the arc, When viewed from the first direction, the first recess and the second recess overlap the arc and are positioned with the signal electrode therebetween, the first via is exposed to the side surface closer to the second surface than the first recess; the second via is exposed to the side surface closer to the second surface than the second recess; the first via and the second via are spaced from the second surface; Wiring board.

3. A substrate having a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface; A signal electrode located on the first surface; a first recess and a second recess positioned from the side surface to the first surface; a first ground conductor located on an inner surface of the first recess; a second ground conductor located on an inner surface of the second recess; a ground electrode located on the first surface; Equipped with When viewed from a first direction perpendicular to the first surface, an outline of the base body includes at least one arc; When viewed from the first direction, the signal electrode extends from a central region of the first surface toward the arc and is positioned offset from a normal line passing through a central point of the arc, When viewed from the first direction, the first recess and the second recess overlap the arc and are positioned with the signal electrode therebetween, a dimension of the first recess in a direction along the normal line is larger than a dimension of the second recess; the ground electrode is connected to the first ground conductor and the second ground conductor; The ground electrode has a first region closer to the first recess than to the second recess, the first region being larger in area than to the second recess, the second region being closer to the second recess than to the first recess. Wiring board.

4. When viewed from the first direction, the signal electrode is spaced apart from an outer edge of the first surface. The wiring board according to claim 1 .

5. When viewed from the first direction, the signal electrode extends from a first position that is closer to the arc than a center of the first surface to a second position that is spaced apart from the outer edge of the first surface. The wiring board according to claim 4 .

6. When viewed from the first direction, the first recess is closer to the normal line than the signal electrode. The wiring board according to claim 1 .

7. A dimension of the first recess is larger than a dimension of the second recess in a direction along the normal line. The wiring board according to claim 6 .

8. a first via connected to the first ground conductor; A second via connected to the second ground conductor, the first via is exposed to the side surface closer to the second surface than the first recess; The second via is exposed to the side surface closer to the second surface than the second recess. The wiring board according to claim 3 .

9. When a direction parallel to the first surface and perpendicular to the normal line is defined as a lateral direction, In the lateral direction, a dimension of the first via is smaller than a dimension of the first recess, and a dimension of the second via is smaller than a dimension of the second recess. The wiring board according to claim 1 or 2.

10. the first ground conductor is located at least on a first inner wall surface of the inner surface of the first recess, the first inner wall surface being close to the signal electrode; the second ground conductor is located at least on a second inner wall surface of the inner surface of the second recess, the second inner wall surface being closer to the signal electrode; The wiring board according to claim 1 .

11. When viewed from the first direction, the outline of the base body includes the arc and a straight line. The wiring board according to claim 1 .

12. 4. An electronic component storage package comprising: the wiring board according to claim 1; and a frame portion located on the second surface.

13. The electronic component storage package according to claim 12 ; An electronic component mounted on the wiring board; a module substrate joined to the signal electrode, the first ground conductor, and the second ground conductor; An electronic device comprising:

Images