Cutting blade and method for manufacturing the same

Abstract

To provide a cutting blade enabling reduction of difference in a vertical direction, of width dimension of a cut groove formed when cutting a workpiece, and a method for manufacturing a cutting blade, the method enabling efficient manufacture of the above cutting blade.SOLUTION: A cutting blade 100 rotating around a shaft line O is provided, comprising: a blade body 10 which is formed in a discoid shape with the shaft line as a center, and in which diamond super abrasive grains 16 are dispersed over a metal bond phase 15; portions 20 with reliefs, which are arranged on both side surfaces 103A and 103B (103) of an outer peripheral edge portion of the blade body 10 and in which diamond super abrasive grains 26 are dispersed over a metal bond phase 25 and which protrude outward in the shaft line-O direction from the blade body 10; and a cutting blade 102 formed on an outer peripheral surface 101 of the blade body 10 and the portions 20 with reliefs.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a cutting blade used for cutting a substrate such as a semiconductor material into individual chips, and to a method for efficiently manufacturing such cutting blades. [Background technology]

[0002] As is well known, when cutting a substrate such as a semiconductor material into individual chips, cutting blades (metal blades) in which abrasive grains are dispersed and arranged in a metal bond phase mainly composed of Cu-Sn are widely used (see, for example, Patent Document 1).

[0003] Furthermore, as cutting blades for dividing substrates of semiconductor materials or the like, in addition to metal blades having a metal bond phase, resin blades having a resin bond phase and vitrified blades having a vitrified bond phase are used (see, for example, Patent Documents 2 and 3).

[0004] Also, in order to improve sharpness, a cutting blade has been disclosed in which a soft material is placed on the inner circumference and a hard material on the outer circumference, and the molded and sintered cutting blade is then lapped to remove excess material from the inner circumference and reduce the thickness, thereby forming a recess (see, for example, Patent Document 4). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2018-187736 A [Patent Document 2] JP 2013-154424 A [Patent Document 3] Japanese Patent Application Publication No. 61-178181 [Patent Document 4] JP 2001-079768 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, the width of the cut groove when cutting a workpiece with the cutting blades described in Patent Documents 1 and 2 is likely to vary depending on the vertical position (depth from the surface of the workpiece). In addition, when cutting a package such as a QFN (Quad Flat Non-lead package) that simultaneously cuts ceramics and metals such as leads as the workpiece, the difference in width between the vertical positions of the cut groove becomes particularly large.

[0007] In addition, the cutting blade described in Patent Document 4 requires wrapping during the manufacturing process, which may increase manufacturing costs, and the inner circumference is made of a soft material that is highly abrasive, which reduces the rigidity and strength of the cutting blade, making it unsuitable for high-speed cutting. Furthermore, the outer peripheral edge (tip) that contributes to cutting has a single structure, and it is not possible to ensure a stable wear pattern in which the shape and size of the upper (surface) and lower surfaces of the tip formed by cutting the workpiece remain constant over a long period of time.

[0008] On the other hand, in order to cut workpieces with even higher precision in the future, it will be essential not only to reduce the thickness of the cutting blade, but also to cut so that the dimensional difference between the vertical positions of the cutting groove is reduced. Therefore, there is a demand for a cutting technique that can reduce the difference in width dimension between the vertical positions of the cut groove when cutting a workpiece.

[0009] This invention has been made in consideration of the above circumstances, and aims to provide a cutting blade that can reduce the vertical difference in width dimension of the cutting groove when cutting the workpiece, and a cutting blade manufacturing method that can efficiently manufacture such a cutting blade. [Means for solving the problem]

[0010] In order to solve the above problems, the present invention proposes the following means. (1) A first aspect of the present invention is a cutting blade that rotates about an axis to cut a workpiece, characterized in that it comprises a blade body formed in a disk shape centered on the axis and having first abrasive grains dispersed in a first bond phase, a relief portion disposed on at least one side of an outer circumferential edge portion of the blade body, having second abrasive grains dispersed in a second bond phase and protruding outward from the blade body in the axial direction, and a cutting edge formed on the outer circumferential surfaces of the blade body and the relief portion.

[0011] In the cutting blade of this invention, the blade body is formed in a circular plate shape centered on the axis and has first abrasive grains dispersed in a first bond phase, and a relief portion is disposed on the side of the outer peripheral edge of the blade body, the second abrasive grains being dispersed in a second bond phase and protruding outward in the axial direction from the blade body, and a cutting edge is formed on the outer peripheral surfaces of the blade body and the relief portion, so that the side of the blade body is not involved in cutting the side of the cutting groove. As a result, the cutting resistance when cutting the workpiece can be reduced. Furthermore, even if one of the sides of the cutting groove is cut by the side of the relief portion, since the relief portion has a shorter radial dimension, it is easier to maintain a rectangular shape in a cross section including the axis than the blade body (improved rectangular shape maintenance), and the difference in width dimension between the upper and lower positions when the cutting groove is viewed along the cutting direction can be reduced (maintained).

[0012] Here, the content (concentration) of the second abrasive grains can be set arbitrarily, and may be higher or lower than the content of the first abrasive grains, or may be set to the same content as the first abrasive grains. The average grain size of the second abrasive grains can be set arbitrarily and may be larger or smaller than the average grain size of the first abrasive grains, or may be set to the same average grain size as the first abrasive grains. Moreover, the materials (metal or metal compound, resin material, glass, etc.) constituting the first bond phase and the second bond phase can be set arbitrarily.

[0013] The first bond phase constituting the metal blade body may be, for example, any of a metal bond phase, a resin bond phase, and a vitrified bond phase. Here, the metal bond phase may be formed by compacting and sintering a metal or metal compound, or by plating a metal or metal compound.

[0014] (2) In the cutting blade described in (1) above, the relief portions may be formed on both side surfaces of the blade body.

[0015] According to the cutting blade of the present invention, the relief portions are formed on both side surfaces of the blade body, so that even if the cutting blade scrapes away the side surface of the cutting groove during cutting, the difference in width dimension between the vertical positions of the cutting groove can be reduced.

[0016] (3) In the cutting blade described in (1) or (2) above, the second abrasive grains may be diamond superabrasive grains.

[0017] In the cutting blade according to the present invention, the second abrasive grains are diamond superabrasive grains, so that the wear of the undercut portion can be suppressed, and as a result, the rectangular shape of the undercut portion can be maintained more easily.

[0018] (4) In the cutting blade according to any one of (1) to (3) above, a content of the second abrasive grains may be set higher than a content of the first abrasive grains.

[0019] In the cutting blade of the present invention, the content of the second abrasive grains is set higher than the content of the first abrasive grains, so that it is possible to improve the wear resistance of the undercut portion compared to the blade body, and the rectangular shape of the undercut portion can be maintained more accurately.

[0020] (5) In the cutting blade described in any one of (1) to (4) above, the average grain size of the second abrasive grains may be set to be smaller than the average grain size of the first abrasive grains.

[0021] In the cutting blade of this invention, the average grain size of the second abrasive grains is set smaller than the average grain size of the first abrasive grains, and therefore the second abrasive grains are positioned up to the vicinity of the corners of the cutting edge, suppressing wear of the relief portion and improving the maintenance of the rectangular shape.

[0022] (6) In the cutting blade described in any one of (1) to (4) above, the second abrasive grains may have an average grain size larger than an average grain size of the first abrasive grains.

[0023] In the cutting blade of this invention, the average grain size of the second abrasive grains is set larger than the average grain size of the first abrasive grains, thereby increasing the wear resistance of the undercut portion as a whole and preventing partial detachment of the undercut portion when cutting the workpiece, thereby improving the maintenance of the rectangular shape.

[0024] (7) In the cutting blade according to any one of (1) to (6) above, a recess that is recessed in the axial direction may be formed on an outer side surface of the relief portion.

[0025] According to the cutting blade of the present invention, a recess that is recessed in the axial direction is formed on the outer side of the relief portion, so that the recess efficiently discharges or retains chips and the like generated by cutting, thereby preventing the chips and the like from affecting the side of the cutting groove during cutting. Here, the shape of the recess when viewed along the axis can be set arbitrarily, and may include, for example, a slit portion penetrating the inner peripheral side and the outer peripheral side of the relief portion, a dimple that is not open on either the inner peripheral side or the outer peripheral side of the relief portion, or a tongue-shaped recess that is open only on one of the inner peripheral side or the outer peripheral side of the relief portion when viewed along the axis. Also, the dimension (depth) in the axial direction can be set arbitrarily.

[0026] (8) In the cutting blade described in (7) above, the recess may have a plurality of slits extending in a radial direction.

[0027] According to the cutting blade of this invention, a recess that is recessed in the axial direction on the outer side of the relief portion is provided with a plurality of slit portions that extend radially and penetrate from the inner circumference to the outer circumference, so that cutting chips and the like generated by cutting can be efficiently discharged through the slit portions, thereby preventing the cutting chips and the like from affecting the side of the cutting groove. Here, the shape can be set arbitrarily when viewed along the axial direction, and includes shapes that are radial about the axis, shapes formed tangent to a circle centered on the axis, shapes formed in curved shapes including spirals, etc.

[0028] (9) In the cutting blade described in (7) above, the recess may have a plurality of dimples.

[0029] According to the cutting blade of the present invention, the recess that is recessed in the axial direction on the outer side surface of the relief portion is provided with a plurality of dimples, so that chips and the like generated during cutting can be captured by the dimples, thereby preventing the chips and the like from affecting the side surface of the cutting groove during cutting. Here, the dimples can be set to any shape when viewed along the axis, and may be, for example, a circle, a triangle, a rectangle or other polygon, the letter "J" or "U" of the alphabet, the "K" shape of the hiragana, or a mixture of various sizes and shapes. Also, they may be arranged randomly, or in a staggered or checkerboard pattern.

[0030] (10) In the cutting blade described in (7) above, the recess may include a plurality of slit portions extending radially and a plurality of dimples arranged between adjacent slit portions.

[0031] According to the cutting blade of this invention, the recess has a plurality of slit portions and a plurality of dimples arranged between adjacent slit portions, so that water can circulate easily and chips and the like generated during cutting can be efficiently discharged by the slit portions, while chips and the like that are not discharged can be captured by the dimples, thereby preventing the chips and the like from affecting the side of the cutting groove.

[0032] (11) A second aspect of the present invention is a cutting blade manufacturing method for manufacturing the cutting blade described in any one of (1) to (10) above, comprising a blade body forming process for forming a blade body, and a relief portion forming process for forming a relief portion on an outer peripheral edge portion of a side surface of the blade body, and when the relief portion is a metal relief portion, the outer peripheral edge portion of the blade body is immersed in a dispersion plating solution formed by dispersing the second abrasive grains in a plating solution containing a metal or metal compound constituting the second bond phase, and the blade body is rotated around the axis to form the relief portion.

[0033] According to the cutting blade manufacturing method of the present invention, when the relief portion is a metal relief portion, the outer peripheral edge portion of the blade body is immersed in a dispersed plating solution formed by dispersing second abrasive grains in a plating solution containing a metal or metal compound that constitutes the second bond phase, and the blade body is rotated around the axis to form the relief portion, so that the metal relief portion can be easily formed.

[0034] (12) A third aspect of the present invention is a method for manufacturing a cutting blade according to any one of (1) to (10) above, comprising a blade body forming step of forming a blade body, and a relief portion forming step of forming a relief portion on an outer peripheral edge portion of a side surface of the blade body, wherein, when the relief portion is a metal relief portion, in the relief portion forming step, a container storing the second abrasive grains is immersed in a plating solution containing a metal or metal compound constituting the second bond phase, and the blade body is rotated around the axis while bringing the outer peripheral edge portion of the blade body into contact with the second abrasive grains to form the relief portion.

[0035] According to the cutting blade manufacturing method of the present invention, when the recess is a metal recess, in the recess forming process, a container storing second abrasive grains is immersed in a plating solution containing the metal or metal compound that constitutes the second bond phase, and the blade body is rotated about its axis while bringing the outer peripheral edge of the blade body into contact with the second abrasive grains to form the recess, thereby making it possible to form the metal recess easily and efficiently.

[0036] (13) In the cutting blade manufacturing method described above in (12), in the undercut portion forming step, the blade body may be intermittently rotated to form the undercut portion.

[0037] According to the cutting blade manufacturing method of the present invention, in the relief portion forming step, the blade body is rotated intermittently to form the relief portion, so that the metal relief portion can be formed efficiently and stably. Furthermore, even when the thickness is large, the metal relief portion can be formed stably.

[0038] (14) The method for manufacturing a cutting blade according to any one of (11) to (13) above, wherein when the blade body is a resin-bonded blade or a vitrified-bonded blade, the method may include a pretreatment step of coating the outer peripheral edge portion of the blade body formed in the blade body forming step with a conductive primer.

[0039] According to the cutting blade manufacturing method of the present invention, when the blade body is a resin bonded blade or a vitrified bonded blade, a pretreatment process is provided in which a conductive primer is coated on the outer peripheral edge of the resin bonded blade or vitrified bonded blade formed in the blade body forming process in the pretreatment process. Therefore, regardless of the metal or metal compound that forms the first bond phase and the plating method (electroless plating, electrolytic plating), a metal relief can be formed efficiently and stably in the relief forming process.

[0040] (15) A fourth aspect of the present invention is a method for manufacturing a cutting blade as described in any one of (1) to (10) above, comprising a blade body forming step of forming a blade body, and a relief portion forming step of forming a relief portion on an outer peripheral edge portion of a side surface of the blade body, wherein, when the relief portion is a resin relief portion, in the relief portion forming step, a dispersed resin material is prepared in which second abrasive grains are dispersed in a resin material constituting the second bond phase, and the blade body is rotated around the axis while contacting the outer peripheral edge portion of the blade body with the dispersed resin material to form the relief portion.

[0041] According to the cutting blade manufacturing method of the present invention, when the undercut portion is a resin undercut portion, in the undercut portion forming process, a dispersed resin material is prepared in which second abrasive grains are dispersed in a resin material constituting the second bond phase, and the blade body is rotated about the axis while contacting the outer peripheral edge portion of the blade body with this dispersed resin material to form the undercut portion, thereby making it possible to form the resin undercut portion easily and efficiently.

[0042] (16) In the cutting blade manufacturing method described in any one of (11) to (15) above, in the undercut portion forming step, a recess that is recessed in the axial direction may be formed in the undercut portion by masking the outer peripheral edge portion.

[0043] According to the cutting blade manufacturing method of the present invention, in the undercut portion forming step, a recess is formed in the undercut portion by masking the outer peripheral edge portion, so that the recess can be easily and efficiently formed in the process of forming the recess without using machining or the like. Moreover, by masking after forming a part of the recess, the depth of the recess can be set as desired. Effect of the Invention

[0044] According to the cutting blade and the method of manufacturing the cutting blade of the present invention, the difference in width dimension between the vertical positions of the cutting groove can be reduced. According to the cutting blade manufacturing method of the present invention, it is possible to efficiently manufacture cutting blades that can reduce the width dimensional difference between the vertical positions of the cutting groove. [Brief description of the drawings]

[0045] [Figure 1] FIG. 1 is a perspective view illustrating a schematic configuration of a cutting blade according to a first embodiment of the present invention. [Diagram 2] FIG. 1 is a schematic diagram illustrating the schematic configuration of a cutting blade according to a first embodiment, in which (A) is a plan view seen along the axial direction, and (B) is a cross-sectional view including the axis. [Diagram 3] 2 is an enlarged conceptual diagram illustrating a cross section including an axis of a cutting blade according to a first embodiment of the present invention. FIG. [Figure 4] 4A and 4B are schematic configuration diagrams illustrating an example of a relief portion of a cutting blade according to the first embodiment, in which (A) is a plan view and (B) is a view taken along the arrows IVB-IVB in (A). [Diagram 5]1A and 1B are schematic diagrams illustrating a cutting blade according to a modified example of the first embodiment, in which (A) shows a recess in which no recess is formed according to the first modified example, (B) shows a recess in which a slit is formed according to the first modified example, and (C) shows a recess in which a dimple is formed according to the third modified example. [Figure 6] FIG. 11 is an enlarged conceptual diagram illustrating a cross section including an axis of a cutting blade according to a fourth modified example of the first embodiment. [Figure 7] 4 is a flowchart outlining a cutting blade manufacturing process according to the first embodiment. [Figure 8] FIG. 4 is a conceptual diagram for explaining an outline of a metal relief portion forming step in the cutting blade manufacturing process according to the first embodiment. [Figure 9] 6 is an enlarged conceptual diagram illustrating a cross section including an axis of a cutting blade according to a second embodiment of the present invention, illustrating a main part of the blade. FIG. [Figure 10] 10 is a flowchart outlining a cutting blade manufacturing process according to a second embodiment. [Figure 11] FIG. 11 is a conceptual diagram for explaining an outline of a resin relief portion forming step in the cutting blade manufacturing process according to the second embodiment. [Figure 12] FIG. 11 is an enlarged conceptual diagram illustrating a cross section including an axis of a cutting blade according to a third embodiment of the present invention, illustrating a main part of the blade. [Figure 13] 10 is a flowchart outlining a cutting blade manufacturing process according to a third embodiment. [Figure 14] FIG. 11 is an enlarged conceptual diagram illustrating a cross section including an axis of a cutting blade according to a fourth embodiment of the present invention, illustrating a main part of the blade. [Figure 15] 10 is a flowchart outlining a cutting blade manufacturing process according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0046] First Embodiment Hereinafter, a cutting blade according to a first embodiment of the present invention will be described with reference to Figs. Fig. 1 is a perspective view for explaining the schematic configuration of a cutting blade according to a first embodiment, Fig. 2 is a schematic diagram for explaining the schematic configuration of the cutting blade, Fig. 2(A) is a plan view seen along the axial direction, and Fig. 2(B) is a cross-sectional view including the axial line. Fig. 3 is a conceptual enlarged view of a cross section including the axial line for explaining a main part of the cutting blade. Fig. 4 is a schematic diagram for explaining an example of a relief portion of the cutting blade, Fig. 4(A) is a plan view, and Fig. 4(B) is a view shown by arrows IVB-IVB in Fig. 4(A).

[0047] In Figures 1 to 4, symbol 100 indicates a cutting blade, symbol 101 indicates the outer peripheral surface (cutting blade), symbol 102 indicates a cutting edge (cutting blade), symbols 103, 103A, and 103B indicate side surfaces (cutting blades), symbol 10 indicates a metal blade body (blade body), symbol 15 indicates a metal bond phase (first bond phase), symbol 16 indicates diamond superabrasive grains (first abrasive grains), symbol 20 indicates a metal relief portion (relief portion), symbol 25 indicates a metal bond phase (second bond phase), symbol 26 indicates diamond superabrasive grains (second abrasive grains), symbol 27 indicates a slit portion, and symbol 28 indicates a dimple.

[0048] As shown in FIG. 1, the cutting blade 100 comprises, for example, a metal blade body (blade body) 10, a metal undercut portion (undercut portion) 20, and a cutting edge 102 formed on the outer peripheral surface 101 of the metal blade body (blade body) 10 and the metal undercut portion (undercut portion) 20, and a circular hole 100H coaxial with the axis O is formed on the inner peripheral side. The cutting blade 100 is capable of rotating around an axis O to cut a workpiece (not shown) such as a wafer (substrate of semiconductor material or the like) and separate it into IC chips (chip-shaped) or the like.

[0049] In this embodiment, the cutting blade 100 is formed to have, for example, an outer diameter of 55.05 mm and a blade thickness of 0.15 to 0.50 mm (for example, 0.35 mm), and the circular hole 100H is formed to have a diameter of 42.0 mm. In this embodiment, the metal undercut portion (undercut portion) 20 is formed to have a blade thickness of, for example, 0.015 to 0.05 mm (for example, 0.025 mm).

[0050] The metal blade body (blade body) 10 comprises a metal bond phase (first bond) phase 15 formed in a disk shape centered on an axis O, and diamond superabrasive grains (first abrasive grains) 16 dispersed in the metal bond phase (first bond phase) 15.

[0051] Here, the metal bond phase (first bond phase) includes those formed by sintering a molded product made by compressing powder of a metal or metal compound, and those formed by plating a metal or metal compound (e.g., nickel blade, electroplated blade, etc.). Unless otherwise specified, the metal blade body (blade body) 10 described below is a metal bond phase such as a nickel blade or an electrodeposited blade in which the first bond phase is formed by plating a metal or a metal compound.

[0052] The material constituting the metal bond phase (first bond phase) 15 can be set arbitrarily, but in this embodiment, it is made of, for example, an alloy containing nickel (Ni) or a nickel alloy as a main component. For example, it is preferable to use an alloy mainly composed of nickel (for example, a nickel single layer, nickel-phosphorus (Ni-P), nickel-cobalt (Ni-Co), or nickel-boron (Ni-B).

[0053] The diamond superabrasive grains (first abrasive grains) 16 are set, for example, to have an average grain size of 3 to 10 μm (for example, 5 μm) and a content of 6.25 to 31.25 vol % (concentration degree is 25 to 125). Moreover, the diamond superabrasive grains 16 are exposed, for example, by about 2 μm from the surface of the metal bond phase 15. Whether or not the diamond superabrasive grains 16 are protruded from the surface of the metal bond phase 15 can be arbitrarily set.

[0054] Here, the above-mentioned "average particle size" refers to the average value of the particle sizes of a large number of superabrasive grains 16. For example, superabrasive grains 16 having a certain particle size range are measured using a Microtrac Corporation (registered trademark) model MT3300EXII-SDC or the like, and the average particle size is calculated using a particle size indication based on mesh size (see JIS B 4130:1998).

[0055] Also, "concentration" is an index that indicates the amount of abrasive grains in a tool. In the case of a cutting blade, when the volume of the abrasive grains occupies 25 vol% of the total volume of the blade body, the concentration is defined as 100. (Therefore, if the entire blade body is composed of abrasive grains, the concentration is 400.)

[0056] The metal recessed portion (recessed portion) 20 includes, for example, a metal bond phase (second bond phase) 25 and diamond superabrasive grains (second abrasive grains) 26 dispersed in the metal bond phase (second bond phase) 25. In this embodiment, the metal recess portion (recess portion) 20 is formed in a ring shape (annular shape) centered on the axis O, is arranged on the outer peripheral edge portion of both side surfaces 103A, 103B (103) of the blade body 10 in the axis O direction, and is formed to protrude outward in the axis O direction from both side surfaces 103A, 103B (103) of the metal blade body 10.

[0057] The material constituting the metal bond phase (second bond phase) 25 can be set arbitrarily, but in this embodiment, for example, it is composed of an alloy whose main component is nickel (Ni) or a nickel alloy, the same type as the metal bond phase (first bond phase) 15 constituting the metal blade body 10.

[0058] The diamond super abrasive grains (second abrasive grains) 26 are set, for example, to have an average grain size of 2 to 6 μm (for example, 4 μm) and a content rate of 7.5 to 40.0 vol % (concentration degree is 30 to 160). That is, as shown in FIG. 3, the average grain size of the diamond superabrasive grains (second abrasive grains) 26 is set to be smaller than the average grain size of the diamond superabrasive grains (first abrasive grains) 16 constituting the metal blade body 10. Moreover, the content (degree of concentration) of the diamond superabrasive grains (second abrasive grains) 26 is set to be higher than the content (degree of concentration) of the diamond superabrasive grains (first abrasive grains) 16.

[0059] Also, the diamond superabrasive grains 26 are exposed, for example, by about 1.5 μm from the surface of the metal bond phase 25. It is possible to arbitrarily set whether or not the diamond superabrasive grains 26 are protruding from the surface of the metal bond phase 25. When increasing the accuracy of the side surface of the cutting groove, it is preferable to reduce this protrusion.

[0060] In this embodiment, as shown in FIG. 4, the metal relief portion 20 has recesses formed on outer side surfaces 103A, 103B (103) of the metal relief portion 20 that are recessed in the axis O direction. Specifically, as shown in FIG. 4(A), the recess has a plurality of slit portions 27 extending radially and formed radially around the axis O, and a large number (plurality) of dimples 28 arranged randomly between adjacent slit portions 27.

[0061] For example, as shown in FIG. 4(B), the slits 27 are arranged in the same circumferential direction around the axis O on both side surfaces 103A, 103B (103) of the cutting blade 100. Also, the slit portion 27 is formed, for example, with a depth equal to the thickness of the metal relief portion 20. That is, the slit portion 27 is formed so that the metal blade body 10 is exposed at the bottom surface of the slit portion 27. The depth of the slit portion 27 can be set arbitrarily.

[0062] The dimples 28 are, for example, circular depressions of the same size. Also, for example, the dimple 28 is formed to have a depth equal to the thickness of the metal relief portion 20. That is, the dimple 28 is formed so that the metal blade body 10 is exposed at the bottom surface of the dimple 28. The depth of the dimple 28 can be set arbitrarily.

[0063] Next, a modified example of the first embodiment will be described with reference to FIG. FIG. 5 is a schematic diagram illustrating first to third modified examples of the relief portion of the cutting blade according to the first embodiment.

[0064] <First Modification (First Embodiment)> Hereinafter, a cutting blade 100A according to a first modified example will be described with reference to FIG. 5(A). As shown in FIG. 5(A), a cutting blade 100A according to a first modified example includes a metal blade body 10 and a metal relief portion 20A. As shown in FIG. 5(A), the metal relief portion 20A differs from the cutting blade 100 in that no slit portion 27 or recesses such as dimples 28 are formed on both side surfaces 103A, 103B (103). Furthermore, on both side surfaces 103A, 103B (103) of metal recess 20A, diamond superabrasive grains 26 may be exposed from metal bond phase 25 or may be embedded within metal bond phase 25. The rest of the components are the same as those of the cutting blade 100 described above, so the same reference numerals are used and the description will be omitted.

[0065] <Second Modification (First Embodiment)> Hereinafter, a cutting blade 100B according to a second modified example will be described with reference to FIG. 5(B). As shown in FIG. 5(B), a cutting blade 100B according to a second modified example includes a metal blade body 10 and a metal relief portion 20B. As shown in FIG. 5(B), the metal recessed portion 20B has a slit portion 27 formed on both side surfaces 103A, 103B (103) that is centered on the axis O and penetrates from the inner side to the outer side of the metal recessed portion 20B. The slits 27 are formed on one and the other side surfaces 103A, 103B (103) of the cutting blade 100C to a depth at which the side surfaces of the metal blade body 10 are exposed.

[0066] Furthermore, the slit portions 27 may be arranged at the same circumferential position on one and the other side surfaces 103A, 103B (103) of the cutting blade 100B, or may be formed at different circumferential positions (for example, intermediate positions between each other in the circumferential direction). Furthermore, on both side surfaces 103A, 103 (103) of metal recess portion 20B, diamond superabrasive grains 26 may be exposed from metal bond phase 25 or may be embedded within metal bond phase 25. The rest of the components are similar to those of the cutting blade 100, so the same reference numerals are used and the description is omitted.

[0067] According to the cutting blade 100B of the second modified example, the recess on the outer side surface of the metal relief portion 20 is recessed in the direction of the axis O and has a plurality of slit portions 27 extending radially and penetrating from the inner circumference side to the outer circumference side. Therefore, by efficiently discharging chips and the like generated by cutting through the slit portions 27, it is possible to prevent the chips and the like from affecting the side surface of the cutting groove.

[0068] <Third Modification (First Embodiment)> Hereinafter, a cutting blade 100C according to a third modified example will be described with reference to FIG. 5(C). As shown in FIG. 5(C), a cutting blade 100C according to a third modified example includes a metal blade body 10 and a metal relief portion 20C. As shown in FIG. 5(C), the metal recessed portion 20C has a large number (plurality of) circular dimples 28 formed over the entire surfaces of the side surfaces 103A, 103B (103) on both sides.

[0069] The dimples 28 are formed on one and the other side surfaces 103A, 103B (103) of the cutting blade 100C to a depth at which the side surface of the metal blade body 10 is exposed. Furthermore, on both side surfaces 103A, 103 (103) of metal recess portion 20C, diamond superabrasive grains 26 may be exposed from metal bond phase 25 or may be embedded within metal bond phase 25. The rest of the components are similar to those of the cutting blade 100, so the same reference numerals are used and the description is omitted.

[0070] According to the cutting blade 100C of the third modified example, the recess that is recessed in the axial direction on the outer side surface of the metal relief portion 20 is provided with a large number (multiple) dimples 28, so that chips and the like generated during cutting can be captured by the dimples 28, thereby preventing the chips and the like from affecting the side surface of the cutting groove during cutting.

[0071] <Fourth Modification (First Embodiment)> Next, a fourth modified example of the first embodiment will be described with reference to FIG. FIG. 6 is an enlarged conceptual diagram illustrating a cross section including an axis of a cutting blade according to a fourth modified example of the first embodiment.

[0072] As shown in FIG. 6, a cutting blade 100D according to the fourth modified example includes a metal blade body 10 and a metal relief portion 20D. Here, the metal bond phase (first bond phase) 16 of the metal blade body 10 according to the fourth modified example is formed by, for example, plating with a metal or a metal compound (for example, an electrodeposited blade such as a nickel blade).

[0073] Moreover, the diamond superabrasive grains (first abrasive grains) 16 of the metal blade body 10 according to the fourth modification are set to have a content of, for example, 10.0 to 31.25 vol % (concentration degree is 40 to 125). In addition, when the metal bond phase (first bond phase) 15 is formed by plating a metal or metal compound, the content of diamond superabrasive grains (first abrasive grains) 16 may be set to a content rate of 6.25 to 31.25 vol% (concentration degree is 25 to 125).

[0074] The metal recessed portion 20D includes a metal bond phase (second bond phase) 25 and diamond superabrasive grains (second abrasive grains) 26D dispersed in the metal bond phase (second bond phase) 25.

[0075] The diamond superabrasive grains (second abrasive grains) 26D are set to, for example, 10 to 20 μm (for example, average grain size 15 μm) and a content rate of 7.5 to 20.0 vol % (concentration degree is 30 to 80). That is, the average grain size is set to be larger than the average grain size of 3 to 10 μm (for example, 5 μm) of diamond superabrasive grains (first abrasive grains) 16 constituting metal blade body (blade body) 10.

[0076] The content (concentration) of the diamond superabrasive grains (second abrasive grains) 26D is set lower than the content (concentration) of the diamond superabrasive grains (first abrasive grains) 16 of the metal blade body (blade body) 10, which is 10.0 to 31.25 vol % (concentration is 40 to 125).

[0077] In addition, the content (concentration) of diamond superabrasive grains (second abrasive grains) 26D in the metal recess portion 20D may be set to be higher than or the same as the content (concentration) of diamond superabrasive grains (first abrasive grains) 16 in the metal blade body (blade body) 10.

[0078] In addition, it is possible to arbitrarily set whether or not the diamond superabrasive grains 26D are exposed on the side surfaces 103A, 103B (103) on both sides of the metal recessed portion 20D. In addition, it is possible to arbitrarily set whether or not recesses such as slits 27 and dimples 28 are formed on either or both of the side surfaces 103A, 103B (103) of the metal recessed portion 20D. The rest of the components are similar to those of the cutting blade 100, so the same reference numerals are used and the description is omitted.

[0079] In the cutting blade 100D of the fourth modified example, the average grain size of the diamond superabrasive grains (second abrasive grains) 26D is set larger than the average grain size of the diamond superabrasive grains (first abrasive grains) 16, so that the wear resistance of the metal recessed portion 20D as a whole is increased and partial detachment of the metal recessed portion 20D is suppressed when cutting the workpiece, thereby improving the maintenance of the rectangular shape.

[0080] Next, an example of a cutting blade manufacturing process (cutting blade manufacturing method) for manufacturing the cutting blade 100 will be outlined with reference to FIGS. FIG. 7 is a flow chart outlining the cutting blade manufacturing process according to the first embodiment, and FIG. 8 is a conceptual diagram outlining the metal relief portion forming step in the cutting blade manufacturing process.

[0081] 7, the cutting blade manufacturing process according to the first embodiment includes, for example, a metal blade body forming step (blade body forming step) (S101) and a metal relief portion forming step (relief portion forming step) (S102). Then, through the metal blade body forming step (S101) and the metal relief portion forming step (S102), the cutting blade 100 is completed. Here, we will explain the case where, in the metal blade body forming process (blade body forming process) (S101), a metal blade body 10 consisting of a nickel blade having a metal bond phase (first bond phase) 16 is formed using a dispersed plating solution in which diamond superabrasive grains are dispersed in a nickel plating solution.

[0082] (1) Metal blade body forming process (blade body forming process) (S101) (1-1) Prepare a SUS base metal (stainless steel base metal) First, for example, a SUS base metal (a stainless steel base metal) is prepared. The SUS base metal is preferably mirror-finished. In addition, the SUS base metal is preferably masked in areas that do not require nickel plating in accordance with the shape of the blade body 10. (1-2) Dispersion plating The nickel plating solution in which the diamond superabrasive grains 26 are dispersed is stored in a dispersion plating device (not shown), and the SUS base metal is immersed in the nickel plating solution. Using nickel as the anode, the nickel plating solution is stirred while electrolytic plating is used to grow nickel on the SUS base metal, forming a dispersed nickel plating layer (nickel layer with dispersed diamond superabrasive grains 26) that constitutes the metal blade body. Moreover, instead of the electrolytic plating method, the plating layer may be formed by an electroless plating method. In addition, in the metal blade body forming process (blade body forming process), instead of the metal blade body 10 having a metal bond phase (first bond phase) formed by plating, a metal blade body having a metal bond phase (first bond phase) formed by sintering a molded product obtained by compressing powder of a metal or metal compound may be formed.

[0083] (2) Metal Relief Forming Process (Relief Forming Process) (S102) Hereinafter, the formation of the metal relief portion 20 in the metal relief portion forming step will be described with reference to FIG. A container C2 containing (storing) particulate diamond superabrasive grains (second abrasive grains) 26M is placed in a container C1 that stores a plating solution 25M containing a metal or metal compound that constitutes a metal bond phase (second bond phase) 25, to create a material 20M in which the particulate diamond superabrasive grains (second abrasive grains) 26M are immersed in the plating solution 25M. Then, the outer peripheral edge portion of the metal blade body 10 (the portion where the metal relief portion 20 is to be formed, indicated by the two-dot chain line) is immersed in plating solution 25M of material 20M and embedded in particulate diamond superabrasive grains (second abrasive grains) 26M, and the metal blade body 10 is rotated around axis O while the outer peripheral edge portion is in contact with the particulate diamond superabrasive grains (second abrasive grains) 26M. At this time, it is preferable to rotate the metal blade body 10 intermittently by a predetermined angle and wait at that position for a predetermined time. When forming slit portions (recesses) 27 and dimples (recesses) 28 on the side surfaces 103A, 103B (103) of the metal recess 20, the metal recess 20 is formed after masking the target areas. As a result, a metal relief portion 20 is formed on the outer peripheral edge of the metal blade body 10, and the cutting blade 100 is completed.

[0084] According to the cutting blade 100 of the first embodiment, a cutting edge 102 is formed on the outer peripheral surface 101 of the metal blade body 10 and the metal recessed portion 20, and the side surfaces 103A, 103B (103) of the metal blade body 10 are not involved in cutting the side surfaces of the cutting groove of the workpiece, thereby making it possible to reduce the cutting resistance when cutting the workpiece.

[0085] Furthermore, even if the side of the cutting groove is cut (scraped) by the side of the metal recess 20, the metal recess 20 has a shorter radial dimension and is therefore more likely to maintain its rectangular shape than the metal blade body 10 (improved rectangular shape maintenance), and the difference in width dimension between the vertical positions of the cutting groove can be reduced (maintained).

[0086] According to the cutting blade 100 of the first embodiment, the metal recess 20 is formed on both side surfaces of the metal blade body 10, so that even if the cutting blade 100 scrapes off the side surface of the cutting groove during cutting, the difference in width dimension between the vertical positions of the cutting groove can be reduced.

[0087] According to the cutting blade 100 of the first embodiment, the second abrasive grains are diamond superabrasive grains 26, so that wear of the metal recess 20 can be suppressed and the rectangular shape of the metal recess 20 can be maintained more accurately.

[0088] According to the cutting blade 100 of the first embodiment, the content of diamond superabrasive grains (second abrasive grains) 26 is set higher than the content of diamond superabrasive grains (first abrasive grains) 16, so that it is possible to improve the wear resistance of the metal recessed portion 20 compared to the metal blade body 10, and the rectangular shape maintenance of the metal recessed portion 20 can be improved.

[0089] According to the cutting blade 100 of the first embodiment, the average grain size of the diamond superabrasive grains (second abrasive grains) 26 is set smaller than the average grain size of the diamond superabrasive grains (first abrasive grains) 16, so that the diamond superabrasive grains (second abrasive grains) 26 are positioned up to the vicinity of the corners of the cutting edge 102, and wear of the metal relief portion 20 is suppressed, thereby improving the maintenance of the rectangular shape.

[0090] According to the cutting blade 100 of the first embodiment, the metal relief portion 20 is formed with a plurality of slit portions 27 and a large number of dimples 28 arranged between the slit portions 27. This allows chips and the like generated during cutting to be efficiently discharged by the slit portions 27, while chips and the like that are not discharged to be captured by the dimples 28, thereby preventing the chips and the like from affecting the side surfaces of the cutting groove.

[0091] In addition, the metal blade body 10 is rotated intermittently and brought into contact with granular diamond superabrasive grains (second abrasive grains) 26M immersed in a plating solution 25M while remaining stationary for a predetermined period of time to form the metal relief portion 20, so that the metal relief portion 20 can be formed efficiently and stably. Moreover, even if the thickness dimension of the metal relief portion 20 is large, it can be formed stably.

[0092] <Second embodiment> A cutting blade according to a second embodiment of the present invention will now be described with reference to FIGS. Fig. 9 is a schematic diagram illustrating an enlarged cross section including an axis of a cutting blade according to a second embodiment of the present invention, showing a main part of the cutting blade. Fig. 10 is a flow chart illustrating an outline of a cutting blade manufacturing process according to the second embodiment, and Fig. 11 is a schematic diagram illustrating an outline of a resin relief portion forming process in the cutting blade manufacturing process according to the second embodiment. In the figure, reference numeral 200 denotes a cutting blade, reference numeral 30 denotes a resin relief portion (relief portion), reference numeral 35 denotes a resin bond phase (second bond phase), and reference numeral 36 denotes diamond superabrasive grains (second abrasive grains).

[0093] As shown in FIG. 9, the cutting blade 200 comprises, for example, a metal blade body (blade body) 10, a resin undercut portion (undercut portion) 30, and a cutting edge 102 formed on the outer peripheral surface 101 of the metal blade body (blade body) 10 and the resin undercut portion (undercut portion) 30, and a circular hole 100H is formed on the inner peripheral side. The metal blade body (blade body) 10 is similar to that of the first embodiment, so it is given the same reference numerals and the description thereof is omitted.

[0094] The resin recessed portion (recessed portion) 30 includes, for example, a resin bond phase (second bond phase) 35 and diamond superabrasive grains (second abrasive grains) 36 dispersed in the resin bond phase (second bond phase) 35 . In this embodiment, the resin recessed portion (recessed portion) 30 is arranged on the outer peripheral edge portion of both side surfaces 103A, 103B (103) of the metal blade body 10 in the direction of the axis O, is formed in a ring shape (annular shape) centered on the axis O, and is formed to protrude outward in the direction of the axis O from both side surfaces 103A, 103B (103) of the metal blade body 10.

[0095] The material constituting the resin bond phase (second bond phase) 35 can be set arbitrarily, but in this embodiment, it is made of, for example, a phenol resin.

[0096] The average particle size and content (degree of concentration) of the diamond superabrasive grains (second abrasive grains) 36 can be set arbitrarily, but for example, they are set to an average particle size of 2 to 6 μm (for example, average particle size of 4 μm) and a content of 7.5 to 40.0 vol% (degree of concentration is 30 to 160), equivalent to the diamond superabrasive grains (second abrasive grains) 26 of the first embodiment. That is, the average grain size of the diamond superabrasive grains (second abrasive grains) is set smaller than the average grain size of the diamond superabrasive grains (first abrasive grains) 16 constituting the metal blade body 10, which is 3 to 10 μm (for example, 5 μm). Moreover, the content (degree of concentration) of the diamond superabrasive grains (second abrasive grains) 36 is set higher than the content of the diamond superabrasive grains (first abrasive grains) 16, which is 6.25 to 31.25 vol % (degree of concentration is 25 to 125).

[0097] Moreover, the diamond superabrasive grains 36 are exposed, for example, by about 1.5 μm from the surface of the resin bond phase 35. It is possible to arbitrarily set whether or not the diamond superabrasive grains 36 are protruded from the surface of the metal bond phase 35.

[0098] Next, a method for manufacturing the cutting blade 200 will be described with reference to FIGS. FIG. 10 is a flow chart outlining the steps of manufacturing a cutting blade according to the second embodiment, and FIG. 11 is a conceptual diagram outlining the step of forming a resin relief portion in the cutting blade manufacturing process.

[0099] The cutting blade manufacturing process according to the second embodiment includes, for example, a metal blade body forming step (blade body forming step) (S201) and a resin relief portion forming step (relief portion forming step) (S202) as shown in Fig. 10. Then, through the metal blade body forming step (S201) and the resin relief portion forming step (S202), the cutting blade 200 is completed. The metal blade body forming step (blade body forming step) (S201) is similar to the metal blade body forming step (blade body forming step) (S101) according to the first embodiment, and therefore a description thereof will be omitted.

[0100] Resin relief portion forming process (Relief portion forming process) (S202) Hereinafter, the formation of the resin relief portion 30 in the resin relief portion forming step will be described with reference to FIG. An adhesive resin (adhesive) 35M containing a phenolic resin material constituting the resin bond phase (second bond phase) 35 is mixed with particulate diamond superabrasive grains (second abrasive grains) 36M to create a dispersed adhesive resin 30M consisting of adhesive resin (adhesive) 35M in which particulate diamond superabrasive grains (second abrasive grains) 36M are dispersed. Then, as shown in Figure 11, the dispersed adhesive resin 30M is stored in a container C3, the outer peripheral edge portion of the metal blade body 10 (the portion where the resin relief portion 30 is to be formed, shown by the dotted line) is immersed in the dispersed adhesive resin 30M, and the metal blade body 10 is rotated around the axis O. When forming slit portions (recesses) 27 and dimples (recesses) 28 on the side surfaces 103A, 103B (103) of the resin recess 30, the target portions are masked before forming the resin recess 30. As a result, a resin relief portion 30 is formed on the outer peripheral edge of the metal blade body 10, and the cutting blade 200 is completed.

[0101] According to the second embodiment of the cutting blade manufacturing method, a dispersed resin material 30M is created by dispersing particles 36M of diamond superabrasive grains (second abrasive grains) 36 in a resin material 35M constituting the resin bond phase (second bond phase) 35 of the resin recess 30, and the metal blade body (blade body) 10 is rotated around the axis O while contacting the outer peripheral edge of the metal blade body (blade body) 10 with this dispersed resin material 30M to form the resin recess 30, so that the resin recess 30 can be formed easily and efficiently.

[0102] <Third embodiment> Hereinafter, a cutting blade according to a third embodiment of the present invention will be described with reference to Figs. FIG. 12 is an enlarged conceptual diagram of a cross section including an axis illustrating a main portion of a cutting blade according to a third embodiment of the present invention, and FIG. 13 is a flowchart illustrating an outline of a manufacturing process for a cutting blade according to the third embodiment. In Figures 12 and 13, reference numeral 300 indicates a cutting blade, reference numeral 40 indicates a resin blade body (resin bonded blade body, blade body), reference numeral 45 indicates a resin bonded phase (first bonded phase), and reference numeral 46 indicates diamond superabrasive grains (first abrasive grains).

[0103] As shown in FIG. 12, the cutting blade 300 comprises, for example, a resin blade body (resin bonded blade body, blade body) 40, a metal undercut portion (undercut portion) 20, and a cutting edge 102 formed on the outer peripheral surface 101 of the resin blade body (blade body) 40 and the metal undercut portion (undercut portion) 20, and a circular hole 100H is formed on the inner peripheral side. The metal recessed portion (recessed portion) 20 is the same as in the first embodiment, so it is given the same reference numeral and the description thereof is omitted.

[0104] As shown in Figure 12, the resin blade body (resin bonded blade body, blade body) 40 has a resin bonded phase (first bonded phase) 45 formed in a disk shape centered on the axis O, and diamond superabrasive grains (first abrasive grains) 46 dispersed in the resin bonded phase (first bonded phase) 45.

[0105] The material constituting the resin bond phase (first bond phase) 45 can be set arbitrarily, but in this embodiment, it is made of, for example, a phenol resin.

[0106] The diamond superabrasive grains (first abrasive grains) 46 are set, for example, to an average grain size of 3 to 10 μm (e.g., 5 μm) and a content of 6.25 to 31.25 vol% (concentration degree of 25 to 125), which are set in the same manner as the diamond superabrasive grains (first abrasive grains) 16 in the first embodiment. Moreover, the diamond superabrasive grains 46 are exposed, for example, by about 2 μm from the surface of the resin bond phase 45. Whether or not the diamond superabrasive grains 46 are protruded from the surface of the metal bond phase 45 can be arbitrarily set.

[0107] Therefore, the average grain size of the diamond superabrasive grains (second abrasive grains) 36 that make up the resin recess 30 is set to 2 to 6 μm (for example, average grain size of 4 μm) smaller than the average grain size of the diamond superabrasive grains (first abrasive grains) 46 that make up the resin blade body 40. The content of the diamond superabrasive grains (second abrasive grains) 36 is set at 7.5 to 40.0 vol % (concentration degree is 30 to 160) higher than the content (concentration degree) of the diamond superabrasive grains (first abrasive grains) 46 . The rest of the components are the same as those in the first and second embodiments, so the same reference numerals are used and the description is omitted.

[0108] Next, a method for manufacturing the cutting blade 300 will be described with reference to FIG. 13, the cutting blade manufacturing process according to the third embodiment includes, for example, a resin blade body forming step (blade body forming step) (S301), a palladium (Pd) compound coating step (pretreatment step) (S302), and a metal relief portion forming step (relief portion forming step) (S303). Then, through the resin blade body forming step (S301), the palladium (Pd) compound coating step (S302), and the metal relief portion forming step (S303), the cutting blade 300 is completed.

[0109] (1) Resin blade body forming process (blade body forming process) (S301) (1-1) Preparation and mixing of powder materials First, a resin material powder constituting the resin bond phase (first bond phase) and diamond superabrasive grains (first abrasive grains) are mixed in a predetermined ratio to prepare a material powder, which is then mixed until it becomes uniform. For example, a ball mill is used to mix the material powder. Note that instead of the ball mill, any applicable well-known mixing device may be used. (1-2) Blade body blank formation (cold press) Next, the mixed material is fed to a blade body original plate forming mold and compressed, for example, at room temperature by a press device to form a blade body original plate made of a green compact. Here, the cold press is not limited to pressurization at normal temperature (for example, room temperature) or lower, but refers to pressurization at a temperature below the temperature at which the resin material powder starts to melt, for example. (1-3) Blade body formation (hot press) Next, the blade body original plate is placed in the blade body forming mold, and pressure is applied by a press device while the blade body original plate is sintered. Here, hot pressing refers to, for example, applying pressure at a temperature at which the resin material powder is flowable. In this manner, the resin blade body 40 is formed.

[0110] (2) Palladium (Pd) compound coating process (pretreatment process) (S302) Next, the outer peripheral edge (portion indicated by reference numeral 20 in FIG. 8 ) of both side surfaces 103A, 103B (103) of the resin blade body 40 is pretreated prior to the formation of the metal relief portion (relief portion) 20. Specifically, for example, the resin blade body 40 is immersed in a 3% aqueous solution of a palladium (Pd) compound (for example, Red Shumer (registered trademark) manufactured by Nippon Kangen Co., Ltd.) as a primer for electroless plating. Then, a palladium compound is attached (coated) to the target area of ​​the resin blade body 40 where the metal relief portion (relief portion) 20 is to be formed.

[0111] (3) Metal Relief Forming Process (Relief Forming Process) (S303) Next, the metal recess 20 is formed on the resin blade body 40 which has been coated with a palladium (Pd) compound to impart electrical conductivity to the area where the metal recess 20 is to be formed. The metal recess forming step (relief forming step) (S303) is otherwise similar to that of the first embodiment, so a description thereof will be omitted. As a result, the cutting blade 300 is completed.

[0112] <Fourth embodiment> A cutting blade according to a fourth embodiment of the present invention will be described below with reference to Figs. FIG. 14 is an enlarged conceptual diagram of a cross section including an axis illustrating a main portion of a cutting blade according to a fourth embodiment of the present invention, and FIG. 15 is a flowchart illustrating an outline of a manufacturing process for a cutting blade according to the fourth embodiment. In FIG. 15, reference numeral 400 denotes a cutting blade.

[0113] As shown in FIG. 14, the cutting blade 400 includes, for example, a resin blade body (blade body) 40, a resin recessed portion (relief portion) 30, and a cutting edge 102 formed on the outer peripheral surface 101 of the resin blade body (blade body) 40 and the resin recessed portion (relief portion) 30. The resin blade body (blade body) 40, resin undercut portion (undercut portion) 30, resin bond phases (first bond phase, second bond phase) 45, 35, and diamond superabrasive grains (first abrasive grains, second abrasive grains) 46, 36 are similar to those of the first to third embodiments, so their explanation will be omitted.

[0114] Next, a method for manufacturing the cutting blade 400 will be described with reference to FIG. 15, the cutting blade manufacturing process according to the fourth embodiment includes, for example, a resin blade body forming step (blade body forming step) (S401) and a resin undercut portion forming step (relief portion forming step) (S402). Then, through the resin blade body forming step (S401) and the resin undercut portion forming step (S402), the cutting blade 400 is completed. The resin blade body forming step (blade body forming step) (S401) and the resin relief portion forming step (relief portion forming step) (S402) are similar to those in the second and third embodiments, and therefore description thereof will be omitted.

[0115] It should be noted that various modifications can be made to the technical matters described in the above embodiment without departing from the spirit of the invention. For example, in the above embodiment, the cutting blades 100, 200 are provided with the metal blade body 10, and the cutting blades 300, 400 are provided with the resin blade body 40, but, for example, a vitrified bond blade body having a vitrified bond phase as the first bond phase may be used instead of the metal blade body 10 and the resin blade body 40. In this case, since the vitrified bond blade body is not conductive, the metal relief portion 20 can be formed by pre-treating it with a palladium (Pd) compound, similar to the resin blade body 40.

[0116] In addition, in the above embodiment, a case has been described in which the content of the second abrasive grains is set higher than the content of the first abrasive grains, and the average grain size of the second abrasive grains is set smaller or larger than the average grain size of the first abrasive grains. However, the content and average grain size of the second abrasive grains relative to the first abrasive grains can be set arbitrarily, and for example, the content of the second abrasive grains may be set lower than or the same as the content of the first abrasive grains, or the average grain size of the second abrasive grains may be set equal to the average grain size of the first abrasive grains, within a range in which rectangular shape maintenance is improved.

[0117] In addition, in the above embodiment, the blade body 10, 40 and the relief portions 20, 30 are described as having diamond superabrasive grains (second abrasive grains) 26, 36 dispersed in the first bond phase 15, 45. However, in order to improve various functions such as the workability and rigidity of the blade body 10, 40 and the relief portions 20, 30, a filler may be dispersed in the metal bond phase 15 and the resin bond phase 45 in addition to the diamond superabrasive grains (second abrasive grains) 26, 36. In this case, for example, molybdenum disulfide (MoS2), hollow particles such as silica balloons and glass balloons, and fillers (not shown) such as silicon carbide (SiC) and tungsten carbide (WC) may be dispersed, and it is possible to arbitrarily set whether or not to disperse a filler (not shown), and if so, the type of filler to be used.

[0118] In addition, in the above embodiment, the recesses formed on the outer side surfaces 103A, 103B, (103) of the recessed portions 20, 30 in the direction of the axis O are described as being a plurality of slit portions 27 extending radially in the radial direction and penetrating from the inner circumference side to the outer circumference side, or as being circular dimples 28. However, the shape (form) of the recesses when viewed along the axial direction can be set arbitrarily, and for example, instead of the radial slit portions 27 centered on the axis O, they may be slit portions formed tangent to a small-diameter circle centered on the axis O, or slit portions formed in a curved shape such as a spiral.

[0119] Also, instead of circular dimples 28, dimples may be formed in, for example, circles, triangles, squares or other polygons, or in "J" or "U" or "L" shapes, or a mixture of various sizes and shapes. Also, the dimples may be arranged randomly, or in a staggered or checkerboard pattern. The recess may include a tongue-shaped recess that is open only on either the inner circumferential side or the outer circumferential side of the relief portion. Moreover, the axial dimension (depth) of the recesses such as the slits 27 and the dimples 28 can also be set arbitrarily.

[0120] In the above embodiment, the metal blade body 10 is described as having diamond superabrasive grains 16 dispersed in the metal bond phase 15 made of nickel plating, but a metal blade body having abrasive grains dispersed in various applicable metal bond phases including, for example, Ni-P plating, Ni-Co plating, Ni-B plating, copper (Cu) and copper alloys (e.g., Cu-Sn) may also be used.

[0121] In addition, when forming the metal blade body 10, instead of the metal bond phase (first bond phase) 15 (e.g., nickel blade, electroplated blade, etc.) formed by plating a metal or metal compound, a well-known metal bond phase (first bond phase) formed by sintering a molded product obtained by compacting powder of a metal or metal compound may be used.

[0122] In the above embodiment, the metal relief portion 20 is formed by immersing and contacting the outer peripheral edge of the blade body 10, 40 in the material 20M immersed in the plating solution 25M in which particulate diamond superabrasive grains (second abrasive grains) 26M constitute the metal bond phase (second bond phase) 25. However, the metal relief portion 20 may be formed by contacting the outer peripheral edge of the blade body 10, 40 with a dispersed plating solution in which the second abrasive grains 26 are dispersed in the plating solution in which the metal bond phase (second bond phase) 25 is constituted. Also, instead of electrolytic plating, a dispersed plating layer may be formed by applying an electroless plating method.

[0123] In the above embodiment, the metal blade body 10 is formed by forming a dispersed plating layer on a SUS base metal by electrolytic plating. However, the dispersed plating layer may be grown on a base metal other than SUS (stainless steel) (for example, aluminum or titanium, which are prone to forming an oxide film on the surface) to form the original sheet of the blade material. Moreover, instead of electrolytic plating, an electroless plating method may be applied to form the dispersion plating layer.

[0124] In addition, the flowcharts relating to the manufacturing method shown in Figures 7, 10, 13, and 15 are just examples, and may be modified (omitted or added) as appropriate, or any other manufacturing method may be applied for manufacturing. [Industrial Applicability]

[0125] INDUSTRIAL APPLICABILITY The cutting blade and the method of manufacturing the cutting blade according to the present invention can reduce the difference in width dimension in the vertical direction of the cut groove when cutting a workpiece, and are therefore industrially applicable. [Explanation of symbols]

[0126] O axis 10 Metal blade body (blade body) 15 Metal bond phase (first bond phase) 16 Diamond super abrasive grain (first abrasive grain) 20, 20A, 20B, 20C, 20D Metal recessed section (recessed section) 25 Metal bond phase (second bond phase) 26, 26D Diamond super abrasive grain (second abrasive grain) 26M Diamond super abrasive grain (secondary abrasive grain) 27 Slit section 28 Dimples 30 Resin undercut part (undercut part) 35 Resin bond phase (second bond phase) 36 Diamond super abrasive grain (second abrasive grain) 40 Resin blade body (resin bond blade body, blade body) 45 Resin bond phase (first bond phase) 46 Diamond super abrasive grain (first abrasive grain) 100, 200, 300, 400 Cutting blades 100H mounting hole 101 Outer periphery (cutting blade) 102 Cutting edge (cutting blade) 103, 103A, 103B Side (Cutting blade)

Claims

1. A cutting blade that rotates around an axis to cut a workpiece, a blade body formed in a disk shape centered on an axis line and having first abrasive grains dispersed in a first bond phase; a relief portion disposed on at least one side surface of an outer peripheral edge portion of the blade body, the relief portion having second abrasive grains dispersed in a second bond phase and protruding outward in the axial direction from the blade body; A cutting edge formed on an outer peripheral surface of the blade body and the relief portion, A recess is formed on an outer side surface of the relief portion so as to be recessed in the axial direction, The recess includes a plurality of slits extending in a radial direction and formed so as to expose the blade body, A cutting blade, characterized in that the average grain size of the second abrasive grains is set to be larger than the average grain size of the first abrasive grains.

2. 2. The cutting blade of claim 1, The cutting blade is characterized in that the relief portions are formed on both side surfaces of the blade body.

3. A cutting blade according to claim 1 or 2, The second abrasive grains are diamond superabrasive grains. A cutting blade characterized by:

4. A cutting blade according to any one of claims 1 to 3, The content of the second abrasive grains is set to be higher than the content of the first abrasive grains. A cutting blade characterized by:

5. A cutting blade according to any one of claims 1 to 4, The recessed portion is A plurality of dimples disposed between adjacent ones of the slit portions; A cutting blade comprising:

6. A method for manufacturing the cutting blade according to any one of claims 1 to 5, comprising the steps of: a blade body forming step of forming a blade body; and a relief portion forming step of forming a relief portion on an outer peripheral edge portion of a side surface of the blade body, When the relief portion is a metal relief portion, The outer peripheral edge portion of the blade body is immersed in a plating solution containing a metal or metal compound constituting the second bond phase and the second abrasive grains are dispersed in the plating solution, and the blade body is rotated about the axis to form the relief portion. A method for manufacturing a cutting blade.

7. A method for manufacturing the cutting blade according to any one of claims 1 to 5, comprising the steps of: a blade body forming step of forming a blade body; and a relief portion forming step of forming a relief portion on an outer peripheral edge portion of a side surface of the blade body, When the relief portion is a metal relief portion, In the relief portion forming step, A container storing the second abrasive grains is immersed in a plating solution containing a metal or a metal compound constituting the second bond phase, and the blade body is rotated about the axis while bringing the outer peripheral edge portion of the blade body into contact with the second abrasive grains, thereby forming the relief portion. A method for manufacturing a cutting blade.

8. 8. A method for manufacturing a cutting blade according to claim 7, comprising the steps of: In the relief portion forming step, The blade body is rotated intermittently to form the relief portion. A method for manufacturing a cutting blade.

9. A method for manufacturing a cutting blade according to any one of claims 6 to 8, comprising the steps of: When the blade body is a resin bonded blade or a vitrified bonded blade, A cutting blade manufacturing method comprising a pretreatment step of coating the outer peripheral edge portion of the blade body formed in the blade body forming step with a conductive primer.

10. A method for manufacturing the cutting blade according to any one of claims 1 to 5, comprising the steps of: a blade body forming step of forming a blade body; and a relief portion forming step of forming a relief portion on an outer peripheral edge portion of a side surface of the blade body, When the relief portion is a resin relief portion, In the relief portion forming step, A dispersed resin material is prepared by dispersing second abrasive grains in a resin material constituting the second bond phase, and the blade body is rotated about the axis while contacting the outer peripheral edge portion of the blade body with the dispersed resin material, thereby forming the underhang portion. A method for manufacturing a cutting blade.

11. A method for manufacturing a cutting blade according to any one of claims 6 to 10, comprising the steps of: In the relief portion forming step, A recess is formed in the relief portion by masking the outer peripheral edge portion, the recess being recessed in the axial direction. A method for manufacturing a cutting blade.

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