Packaging assembly and electronic device

Abstract

An embodiment of this application discloses a packaging assembly and an electronic device. The packaging assembly includes a substrate and a chip, the substrate includes a first surface and a second surface opposite to each other, the first surface of the substrate faces the surface of the chip, a plurality of electrodes are arranged on the first surface of the substrate, a signal transmission port is arranged on the second surface of the substrate, the signal transmission port is electrically connected to the electrodes, and a plurality of pads are arranged on the surface of the chip facing the substrate, the pads are soldered and connected to the electrodes through a plurality of conductive connections, one pad is connected to the plurality of conductive connections, and the plurality of conductive connections are electrically connected to one signal transmission port. Thus, by arranging the plurality of conductive connections on a single pad, stress can be evenly distributed to the plurality of conductive connections, which improves the reliability of the component. Also, the plurality of conductive connections connected to one pad back up each other's operation. This provides multiple operation guarantees and improves the stability of the electrical connection.

Description

[Technical field]

[0001] TECHNICAL FIELD Embodiments of this application relate to the field of consumer electronics, and in particular to a packaging assembly and an electronic device. [Background technology]

[0002] Chip scale packages (CSPs) can be used in surface acoustic wave filters (SAW filters), film bulk acoustic resonator filters (FBAR filters), and bulk acoustic wave filters (BAW filters). Chip scale packages can not only significantly reduce the die package area, but also improve the chip's anti-interference and anti-noise performance.

[0003] The packaging assembly includes a stacked housing 40, a chip, and a substrate. The housing 40 and the substrate enclose a first cavity in which the chip is disposed. The chip can be soldered and connected to the substrate via conductive connections to provide input / output and grounding for the chip's electrical operation.

[0004] Currently, some solutions use tin balls as conductive connections, but there are air bubbles in the solder flux or tin paste of the tin balls, and holes are easily generated in the process of forming the conductive connections, which affects the reliability of the entire conductive connections.

[0005] Another solution is to use gold balls as conductive connections, and ultrasonic fusing can be done to the gold balls on the chip through gold wires to form the conductive connections. The chip is then flipped onto the substrate for ultrasonic soldering. This solves the problem of holes in the conductive connections.

[0006] However, gold balls have temperature cycling reliability problems: when the temperature increases or decreases, the mismatch of thermal expansion coefficients between the chip, the conductive connections, and the substrate affects the stability of the electrical connections.

[0007] Therefore, there is a need to provide an improved packaging assembly. Summary of the Invention

[0008] The embodiments of this application provide a packaging assembly and an electronic device to solve the problem of poor connection stability of the packaging assembly.

[0009] In order to achieve the above-mentioned objective, the embodiments of this application use the following technical solutions. According to a first aspect, the embodiments of this application provide a packaging assembly including a substrate and a chip, the substrate includes a first surface and a second surface opposite to each other, the first surface of the substrate faces the surface of the chip, a plurality of electrodes are arranged on the first surface of the substrate, a signal transmission port is arranged on the second surface of the substrate, the signal transmission port is electrically connected to the electrodes, a first pad is arranged on the surface of the chip facing the substrate, the first pad is soldered and connected to the electrodes through a conductive connection, and one first pad is connected to the plurality of conductive connections. Thus, a plurality of electrical connectors are arranged on a single pad, which can distribute stress evenly to the plurality of electrical connectors. This reduces the stress on the single electrical connector and improves the reliability of the component.

[0010] In one optional implementation, multiple conductive connections connected to one first pad are connected to one signal transmission port. Thus, by electrically connecting multiple conductive connections connected to one pad to one signal transmission port, the electrical operation of multiple electrical connectors connected to one pad is the same, and the multiple electrical connectors back up each other's operation, which provides multiple operation guarantees and improves the electrical connection stability.

[0011] In one optional implementation, the conductive connections being connected to one signal transmission port includes the conductive connections being electrically connected to one electrode and connected to one signal transmission port through one electrode. Thus, the electrical connectors connected to one first pad are interconnected on the first surface of the substrate through the electrode. This implements electrical operation backup of the component.

[0012] In one optional implementation, connecting the plurality of conductive connections to one signal transmission port includes providing a plurality of plated through holes in the substrate, soldering the plurality of conductive connections to the plurality of electrodes, respectively, and electrically connecting the plurality of electrodes to the one signal transmission port through the plurality of plated through holes. Thus, the plurality of electrical connectors connected to one pad are interconnected on the second surface of the substrate through the signal transmission port. This implements electrical operation backup of the component.

[0013] In one optional implementation, multiple plated through holes are combined into one path in the board and electrically connected to one signal transmission port. Thus, multiple electrical connectors connected to one pad are interconnected in the board through the plated through holes. This implements electrical operation backup of the component.

[0014] In one optional implementation, the distance between adjacent conductive connections in the plurality of conductive connections is equal to or less than the diameter of a single conductive connection, thereby increasing the density of the conductive connections, reducing stress on a single electrical connector, and improving component reliability.

[0015] In one optional implementation, the first pad is in the shape of a circle or a polygon, so that the pad placement method is more flexible and the shape of the chip is easily accommodated. 16 In an optional implementation, among the multiple conductive connections connected to one first pad, In one optional implementation, the connecting lines between the centers of the multiple conductive connecting parts connected to one first pad are configured in a straight line, a broken line, or a polygonal shape, so that the conductive connecting parts are flexibly arranged, which is convenient for adapting to different pad shapes.

[0016] In an optional implementation, the conductive connection is in the shape of a sphere, an ellipsoid, a cube, or a polyhedron, so that the shape of the conductive connection is more flexible and can fully use the inner space of the packaging assembly.

[0017] In one optional implementation, the conductive connection is made of a metal or alloy material, so that conductive connections of multiple materials are available and convenient to process.

[0018] In an optional implementation, the method further includes: disposing a second pad on the surface of the chip; disposing a support component between the chip and the substrate, one end of the support component is connected to the second pad, the other end of the support component is connected to the electrode, and the support component is not connected to the signal transmission port. The forming process of the support component is the same as the forming process of the conductive connection. Therefore, since the same process is used for the conductive connection and the support component, the height of the conductive connection and the height of the support component are the same, so that the conductive connection and the substrate can be effectively contacted and the connection can be completed. This avoids the generation of gaps and improves the stability of the component.

[0019] The packaging assembly of claim 10 , wherein in one optional implementation, the support component is disposed in a peripheral area of ​​the chip.

[0020] In one optional implementation, the support component is disposed in the peripheral region of the chip, the area surrounded by the first pad connected to the signal transmission port is the active area, and the area between the active area and the edge of the chip is the peripheral region of the chip. Thus, the support component is disposed in the peripheral region of the chip, which can effectively support the chip and distribute stress on the peripheral region of the chip.

[0021] In one optional implementation, the support components are spaced apart from the conductive connections, so that stress over the effective area of ​​the chip can be effectively distributed.

[0022] In one optional implementation, the support component is in the shape of a sphere, an ellipsoid, a cube, or a polyhedron, so that the shape of the support component is more flexible and the inner space of the packaging assembly can be fully used.

[0023] In one optional implementation, the support component is made of a metal or alloy material, so multiple materials are available and processing is convenient.

[0024] In one optional implementation, the packaging assembly further includes a housing, the housing and the first surface of the substrate enclose the first cavity, and the chip is disposed in the first cavity, so that the housing can isolate the chip from the outside and avoid interference caused to the chip by the outside environment.

[0025] In one optional implementation, the housing includes a bracket and a cover plate, the bracket is positioned on the first surface of the substrate to enclose the chip, and the cover plate is positioned on top of the bracket, such that the housing and substrate can enclose the cavity to protect the chip.

[0026] According to a second aspect, an embodiment of the present application provides an electronic device, which includes a circuit board and the above-mentioned packaging assembly, and a signal transmission port of the packaging assembly is soldered onto the circuit board. Thus, the electronic device uses the packaging assembly, which improves component reliability and electrical connection stability. [Brief description of the drawings]

[0027] [Figure 1] FIG. 2 is a schematic diagram of the structure of a packaging assembly. [Diagram 2] FIG. 2 is a schematic layout of conductive connections on a chip. [Diagram 3] FIG. 3 is a simulation diagram of accumulated viscoplastic strain in each conductive connection part of FIG. 2. [Figure 4] 1 is a schematic diagram of performing a compression test on a packaging assembly. [Diagram 5] FIG. 2 is a schematic diagram of a structure of a packaging assembly according to an embodiment of the present application. [Figure 6] FIG. 6 is a schematic diagram of the structure of the surface of the chip of FIG. 5. [Figure 7] FIG. 6 is a top view of a first surface of the substrate of FIG. 5. [Figure 8] FIG. 2 is a schematic diagram of an arrangement of conductive connections according to one embodiment of the present application. [Figure 9] FIG. 13 is a schematic diagram of another arrangement of conductive connections according to an embodiment of the present application. [Figure 10] FIG. 13 is a schematic diagram of another arrangement of conductive connections according to an embodiment of the present application. [Figure 11] 2 is a cross-sectional view of a conductive connection according to one embodiment of the present application. [Figure 12] FIG. 2 is a schematic diagram of the structure of another surface of a chip according to an embodiment of the present application. [Figure 13] FIG. 13 is a simulation diagram of accumulated viscoplastic strain of each conductive connection part of FIG. [Figure 14]FIG. 2 is a schematic diagram of a structure of another packaging assembly according to an embodiment of the present application. [Figure 15] FIG. 2 is a schematic diagram of a structure of another packaging assembly according to an embodiment of the present application. [Figure 16] FIG. 2 is a schematic diagram of a structure of another packaging assembly according to an embodiment of the present application. [Figure 17] FIG. 13 is a schematic diagram of another packaging assembly structure. [Figure 18] 18 is a schematic diagram of the structure of a first surface of the substrate of FIG. 17. [Figure 19] 18 is a schematic diagram of a connected state of the conductive connector of FIG. 17. [Figure 20] FIG. 2 is a schematic diagram of a structure of another packaging assembly according to an embodiment of the present application. [Figure 21] FIG. 21 is a schematic diagram of the structure of the surface of the chip of FIG. 20. [Figure 22] 21 is a schematic diagram of the structure of a first surface of the substrate of FIG. 20. [Diagram 23] FIG. 21 is a schematic layout diagram of the conductive connectors in FIG. 20. [Figure 24] 21 is a schematic layout diagram of another conductive connection portion of FIG. 20. FIG. [Diagram 25] FIG. 22 is a simulation diagram of accumulated viscoplastic strain of each conductive connection part in FIG. 21. [Figure 26] 13A-13C are simulation diagrams of the compressive performance of each conductive connection without a supporting component. [Figure 27] 13A-13C are simulation diagrams of the compression performance of each conductive connection when there is a support component on the outer ring of the peripheral region. [Figure 28] FIG. 1 is a schematic diagram of a structure of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Hereinafter, implementations of the embodiments of this application will be described in detail with reference to the accompanying drawings.

[0029] The terms "first" and "second" referred to below are intended for descriptive purposes only and are not to be understood as indicating or implying relative importance or quantity of the technical features referred to. Thus, a feature defined by "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0030] Also, in this application, location terms such as "upper" and "lower" are defined relative to the exemplary locations of components in the accompanying drawings. It should be understood that these directional terms are relative concepts and are used for relative description and clarity, and may change accordingly depending on the location changes in which the components are disposed in the accompanying drawings.

[0031] The following describes possible terms in the embodiments of this application.

[0032] Pad: A closed area formed by connecting metal layers on a die together. After ball planting is performed on the chip pad, a solder ball is connected to an electrode on the substrate to realize input / output of electrical signals or grounding.

[0033] Die: A small piece on a wafer that becomes a smaller piece when packaged. Using silicon processing as an example, generally, the entire silicon chip is the wafer, each unit is diced and packaged, and the single unit before packaging is the die.

[0034] 1 is a schematic diagram of the structure of a packaging assembly. As shown in FIG. 1, the packaging assembly includes a housing 40, a chip 20, and a substrate 10, which are stacked together. The housing 40 and the substrate 10 enclose a first cavity, and the chip 20 is disposed in the first cavity. The chip 20 can be soldered and connected to the substrate 10 via a conductive connection 30 to realize input / output and grounding of the electrical operation of the chip 20.

[0035] The structure of the housing 40 is not limited to the embodiment of this application. The housing 40 includes a bracket 401 and a cover plate 402, where the bracket 401 is placed on the first surface of the substrate 10 to surround the chip 20, and the cover plate 402 is disposed on the top of the bracket 401.

[0036] 2 is a schematic diagram of the layout of the conductive connections on the chip. As shown in FIG. 2, 14 conductive connections 30 are arranged on the surface of the chip 20, and are respectively arranged at positions (1), (2), (3), (4), (5), (6), (7), (8), (9), (10), (11), (12), (13), and (14) on the surface of the chip 20.

[0037] In some embodiments, a tin ball may be used as the conductive connection 30. However, air bubbles exist in the solder flux or tin paste of the tin ball, and holes are easily generated in the process of forming the conductive connection 30. This affects the reliability of the conductive connection 30.

[0038] In some other embodiments, gold balls may be used as the conductive connections 30, and ultrasonic fusing may be performed to the gold balls on the chip 20 via gold wires to form the conductive connections 30. Then, the chip 20 may be flipped onto the substrate 10 for ultrasonic soldering. This solves the problem of holes in the conductive connections 30. However, the size of the gold balls is small, which affects the reliability of the conductive connections 30.

[0039] The size of the conductive connection 30 is not limited in the embodiment of this application. When a tin ball is used as the conductive connection 30, the diameter of the conductive connection 30 is usually 150 μm, and the height of the conductive connection 30 is 65 μm.

[0040] When gold balls are used as the conductive connectors 30, the diameter of the conductive connectors 30 is typically 100 μm, and the height of the conductive connectors 30 is 20 μm.

[0041] 3 is a simulation diagram of the cumulative viscoplastic strain of each conductive connection 30 of FIG. 2 during high and low temperature cycles (-55 to +125°C). FIG. 3 shows the cumulative viscoplastic strain of each conductive connection 30 when gold balls are used as each conductive connection 30 from position (1) to position (14) on the surface of the chip 20, and the cumulative viscoplastic strain of each conductive connection 30 when tin balls are used as each conductive connection 30 from position (1) to position (14) on the surface of the chip 20.

[0042] 3, when gold balls are used as the conductive connections 30, the accumulated viscoplastic strain of each conductive connection 30 is large, and when tin balls are used as the conductive connections 30, the accumulated viscoplastic strain of each conductive connection 30 is small. When gold balls are used as the conductive connections 30, the reliability of the packaging assembly is low.

[0043] As shown in Fig. 4, in the factory test stage, the packaging assembly 20 needs to be subjected to a pressure contact test. If a tin ball is used as the conductive connection 30, there will be holes inside the conductive connection 30, which will result in poor reliability. If a gold ball is used as the conductive connection 30, the size of the conductive connection 30 will be small, which will result in poor reliability. The pressure contact test may cause damage to the conductive connection 30 or the chip 20, which will affect the product performance.

[0044] Thus, the embodiments of the present application provide an improved packaging assembly for improving the reliability of the conductive connections 30.

[0045] 5, the packaging assembly includes a substrate 10 and a chip 20. The substrate 10 and the chip 20 are stacked in the z-direction.

[0046] The substrate 10 includes a first surface and a second surface opposite each other. For example, the first surface of the substrate 10 faces the surface of the chip 20.

[0047] 5, the second surface of the substrate 10 is the lower surface of the substrate 10 in FIG. 5, and the above-mentioned surface of the chip 20 is the lower surface of the chip 20 in FIG.

[0048] A plurality of electrodes 101 are disposed on a first surface of the substrate 10 , and a plurality of signal transmission ports 102 are disposed on a second surface of the substrate 10 , the signal transmission ports 102 being connected to the electrodes 101 .

[0049] The connection manner between the signal transmission port 102 and the electrode 101 is not limited in the embodiments of this application. In some embodiments, the signal transmission port 102 can be connected to the electrode 101 through the plated through hole 103, and the signal transmission port 102 can input or output an electrical signal to the electrode 101 through the plated through hole 103.

[0050] A number of pads 201 are disposed on the surface of the chip 20, and the electrodes 101 are connected to the pads 201 through the conductive connections 30. Thus, the electrodes 101 can further perform signal transmission between the pads 201 and the chip 20, so that the chip 20 can perform signal transmission or implement grounding through the signal transmission port 102.

[0051] It should be noted that the scope of use of the conductive connection 30 is not limited to the embodiments of this application. The conductive connection 30 may further be configured to implement interconnections between a die and a wafer, between wafers, between dies, between a wafer and a substrate, between a die and a substrate, or between substrates.

[0052] At least one of the pads 201 is connected to a plurality of conductive connections 30 .

[0053] For example, a plurality of pads 201 are arranged on the chip 20. At least one pad 201 is connected to a plurality of conductive connecting parts 30 means that one or more pads 201 out of the plurality of pads 201 are connected to a plurality of conductive connecting parts 30.

[0054] For example, as shown in FIG. 5, pad 201a on the second surface of chip 20 is connected to two conductive connections 30 simultaneously.

[0055] Fig. 6 is a top view of the second surface of the chip 20. As shown in Fig. 6, the conductive connection portion 30a and the conductive connection portion 30b are connected to one pad 201a at the lower right corner of the chip 20.

[0056] Thus, pad 201a may distribute stress evenly to conductive connection 30a and conductive connection 30b connected to pad 201a, which may reduce stress on a single electrical connector and improve component reliability.

[0057] Certainly, in some other embodiments of this application, each pad may be connected to multiple conductive connections 30, all of which are within the scope of protection of this application.

[0058] It should also be noted that when one pad 201 is connected to multiple conductive connections 30, the number of conductive connections 30 is not limited, and there may be two or more conductive connections 30.

[0059] Thus, multiple electrical connectors may be placed on a single pad 201, which may distribute stress evenly across the multiple electrical connectors, reducing stress on the single electrical connector and improving component reliability.

[0060] Figure 7 is a top view of a first surface of the substrate 10. As shown in Figure 7, the electrode 101 includes a first electrode 1011 configured to be connected to a signal end.

[0061] Referring to FIG. 6, the conductive connection portion 30 includes a conductive connection portion 30c configured to be connected to a ground end, a conductive connection portion 30b and a conductive connection portion 30b' configured to be connected to a signal end, and a conductive connection portion 30a used only for support.

[0062] The conductive connection 30 shown in Fig. 6 has a one-to-one correspondence with the electrode 101 shown in Fig. 7. The conductive connection 30b is configured to be connected to the first electrode 1011.

[0063] Therefore, the first electrode 101 can transmit a signal from the signal input end to the conductive connection portion 30b, transmit the signal to the chip 20 via the conductive connection portion 30b, and finally output the signal via the conductive connection portion 30b'.

[0064] The material of the conductive connection 30 is not limited in the embodiments of this application, and the conductive connection 30 can be made of any metal or alloy material. In some embodiments of this application, the conductive connection 30 can be made of tin or gold.

[0065] The embodiment of this application is not limited to a method of arranging the plurality of conductive connecting parts 30. As shown in Figures 8, 9, and 10, the connecting line between the centers of the plurality of conductive connecting parts 30 connected to one pad 201 is configured in the shape of a straight line, a broken line, or a polygon.

[0066] In some embodiments, as shown in Figure 8, there are two conductive connections 30 connected to one pad 201, and the two conductive connections 30 may be arranged side-by-side and back-to-back as shown in Figure 8(a) or spaced apart as shown in Figures 8(b) and (c). As shown in Figure 8(c), the conductive connections 30 are spaced apart along a diagonal of the pad 201.

[0067] In some embodiments, as shown in Fig. 9, there are three conductive connections 30 connected to one pad 201, and the three conductive connections 30 may be arranged side-by-side in succession as shown in Fig. 9(a), or spaced apart as shown in Fig. 9(b), (c), and (e), or stacked as shown in Fig. 9(d). The connecting lines between the centers of the conductive connections 30 in Fig. 9(a) and (b) are configured in a straight line shape, and the surfaces of the three conductive connections 30 in Fig. 9(a) and (d) are in contact. The connecting lines between the centers of the conductive connections 30 in Fig. 9(c), (d), and (e) are configured in a triangular shape.

[0068] In some embodiments, as shown in Fig. 10, there are four conductive connections 30 connected to one pad 201, and the four conductive connections 30 may be arranged side-by-side as shown in Fig. 10(a) or spaced apart as shown in Fig. 10(b) and (d). The connecting lines between the centers of the conductive connections 30 in Fig. 10(a) and (b) are configured in the shape of a straight line, or stacked as shown in Fig. 10(c) and (e), specifically arranged to be tangent in a plane. The connecting lines between the centers of the conductive connections 30 in Fig. 10(c) are configured in the shape of a broken line, and the connecting lines between the centers of the conductive connections 30 in Fig. 10(d) and (e) are configured in the shape of a square.

[0069] In some embodiments, the distance between adjacent conductive connections 30 in the plurality of conductive connections 30 connected to one pad 201 is equal to or less than the diameter of a single conductive connection 30 .

[0070] It should be noted that the diameter d of a single conductive connection 30 can be defined as the distance between the most distant points on the surface of the single conductive connection 30, as shown in (a), (b), (c), (d), (e), (f), and (g) of Figures 11.

[0071] The shape of the conductive connection portion 30 is not limited in the embodiments of this application. The shape of the conductive connection portion 30 can be a sphere, an ellipsoid, a cube, a polyhedron, or other irregular shapes.

[0072] In some embodiments, as shown in FIG. 11, the cross-sectional shape of the conductive connection 30 may be circular, oval, square, pentagonal, hexagonal, decagonal, heptagonal star, or the like.

[0073] The shape of the conductive connection portion 30 is merely an example for explanation, which is not limited to the embodiments of this application.

[0074] 12 is a schematic diagram of an arrangement of the conductive connection parts 30 according to one embodiment of this application. As shown in (a) of FIG. 12, one conductive connection part 30 is arranged on each pad 201, and the conductive connection part 30 is placed at the center position of the pad 201. This arrangement is called the first arrangement for short.

[0075] As shown in FIG. 12(b), three conductive connection parts 30 are arranged on each of the pads 201 at the four corners of the chip 20, and the three conductive connection parts 30 are spaced apart from each other.

[0076] Two conductive connections 30 are arranged on each of the pads 201 on the four sides of the chip 20, and the two conductive connections 30 are spaced apart. This arrangement is called the second arrangement for brevity. When the second arrangement is used, the distance d between adjacent conductive connections 30 is equal to the diameter of a single conductive connection 30.

[0077] As shown in FIG. 12(c), three conductive connection parts 30 are arranged on each of the pads 201 at the four corners of the chip 20, and the three conductive connection parts 30 are stacked with adjacent conductive connection parts 30 in contact with each other.

[0078] Two conductive connection parts 30 are arranged on each of the pads 201 on the four sides of the chip 20, and the two conductive connection parts 30 are in contact with each other. This arrangement is called the third arrangement for short. When the third arrangement is used, the distance d between the adjacent conductive connection parts 30 is smaller than the diameter of a single conductive connection part 30.

[0079] As shown in FIG. 12(c), the distance d between adjacent conductive connection portions 30 is zero.

[0080] Figure 13 is a simulation diagram of the cumulative viscoplastic strain of each conductive connection of Figure 12 during high and low temperature cycling (e.g., from -55 to +125°C). Figure 13 shows the cumulative viscoplastic strain of a packaging assembly when the conductive connections 30 from position (1) to position (14) use the first arrangement shown in Figure 12(a), when the conductive connections 30 from position (1) to position (14) use the second arrangement shown in Figure 12(b), and when the conductive connections 30 from position (1) to position (14) use the third arrangement shown in Figure 12(c).

[0081] As shown in FIG. 13, when the conductive connections 30 from position (1) to position (14) use the first configuration, the cumulative viscoplastic strain characteristics of the conductive connections are the worst.

[0082] When the conductive connections 30 from position (1) to position (14) use the second configuration, the cumulative viscoplastic strain characteristics of the conductive connections are good.

[0083] When the conductive connections 30 from position (1) to position (14) use the third arrangement, the cumulative viscoplastic strain characteristics of the conductive connections are the best. When the third arrangement is used, the stress of the conductive connections 30 can be reduced by 60% to 70% compared with when the first arrangement is used, and the stress of a single conductive connection 30 is greatly reduced. This improves the temperature shock resistance capability of the component during temperature cycling.

[0084] Furthermore, when comparing the shear test results when the conductive connection part 30 uses the first arrangement with the shear test results when the conductive connection part 30 uses the third arrangement, it can be seen that the shear force when the conductive connection part 30 uses the third arrangement is increased by 225% compared to the shear force when the conductive connection part 30 uses the first arrangement.

[0085] Thus, by arranging multiple conductive connections on a single pad, the stability of the component is improved, and the temperature cycling capability of the component is also greatly improved.

[0086] In addition, when the distance between the multiple conductive connections on a single pad is equal to or less than the diameter of the conductive connection, the stress of the single conductive connection is effectively reduced, which improves the temperature shock resistance ability of the component during temperature cycling, and the arrangement density of the solder balls is higher. The smaller the distance, the more significant the stress reduction of the single conductive connection 30.

[0087] It can be seen from performing simulated reflow soldering on the component that when the conductive connection 30 uses the third arrangement, the packaging assembly can perform simulated reflow soldering more times than when the first arrangement is used, and therefore the temperature cycle resistance performance of the component is better, and the reliability of the component is greatly improved.

[0088] It can be seen that when the distance between multiple conductive connections on a single pad is equal to or less than the diameter of the conductive connections, the number of simulated reflow solderings performed by the packaging assembly can be increased, the temperature cycle resistance performance of the component is better, and the reliability of the component is greatly improved. The smaller the distance, the more significant the increase in the number of simulated reflow solderings performed by the packaging assembly.

[0089] Moreover, the embodiments of the present application further provide an improved packaging assembly for implementing backup of electrical operation of the components and improving the stability of electrical connection of the components.

[0090] As shown in Figures 14, 15, and 16, the packaging assembly includes a substrate 10, a chip 20, an electrode 101 arranged on the substrate 10, a signal transmission port 102, a pad 201 arranged on the chip 20, and a conductive connection portion 30.

[0091] Please refer to the above-mentioned embodiments for the structures and connection relationships between the substrate 10, the chip 20, the electrodes 101, the pads 201, and the conductive connections 30. The details will not be described again here.

[0092] Based on the above-mentioned embodiment, at least one pad 201 is connected to multiple conductive connections 30, and the multiple conductive connections 30 connected to one pad 201 are electrically connected to one signal transmission port 102.

[0093] 5 and 6, in this embodiment, multiple conductive connections 30 connected to one pad 201 are electrically connected to one signal transmission port 102, so the electrical operations of multiple conductive connections connected to one pad 201 are the same, and the multiple conductive connections back up each other's operations, which provides multiple operation guarantees.

[0094] The connection method between the multiple conductive connecting parts 30 and one signal transmission port 102 is not limited in the embodiments of this application.

[0095] Multiple conductive connections connected to one pad 201 may be interconnected on a first surface of the substrate 10 via an electrode 101 (e.g., as shown in the dashed portion of FIG. 14), or on the substrate 10 (e.g., as shown in the dashed portion of FIG. 15), or on a second surface of the substrate 10 (e.g., as shown in the dashed portion of FIG. 16).

[0096] In some embodiments, multiple conductive connections 30 connected to one pad 201 are connected to one electrode 101 and connected to one signal transmission port 102 via one electrode 101 .

[0097] As shown in FIG. 14, the pad 201a is connected to two conductive connection parts (conductive connection part 30a and conductive connection part 30b), the two conductive connection parts (conductive connection part 30a and conductive connection part 30b) connected to the pad 201a are connected to one electrode 101a, and the electrode 101a is connected to a signal transmission port 102a via a plated through hole 103a.

[0098] The signal transmitted by the signal transmission port 102a can be transmitted to the electrode 101a through the plated through hole 103a, and then split into two paths of signals, which are respectively transmitted to the pad 201a through the conductive connection 30a and the conductive connection 30b, and finally transmitted to the chip 20 through the pad 201a.

[0099] It should be noted that the electrical operation of the conductive connection 30a is the same as that of the conductive connection 30b, and the conductive connection 30a and the conductive connection 30b back up each other's operation. When one of these conductive connections is disconnected due to a fault, the signal can be further transmitted through another conductive connection. This improves the stability of the component.

[0100] Thus, a number of conductive connections connected to one pad 201 are interconnected on the first surface of the substrate 10 via the electrodes 101. This implements the electrical operational backup of the component.

[0101] 15 and 16, a plated through hole 103 is disposed in the substrate 10, and a plurality of conductive connections 30 connected to one pad 201 are soldered and connected to a plurality of electrodes 101, respectively. The plurality of electrodes 101 connected to one pad 201 are electrically connected to one signal transmission port 102 via the plated through hole 103.

[0102] In some embodiments, multiple electrodes 101 connected to one pad 201 are connected via plated through holes 103. Multiple plated through holes 103 connected to one pad 201 are combined into one path within the substrate 10 and electrically connected to one signal transmission port 102.

[0103] 15, pad 201a is connected to two conductive connections (conductive connection 30a and conductive connection 30b). Conductive connection 30a is connected to electrode 101a, and conductive connection 30b is connected to electrode 101b. Electrode 101a is connected to signal transmission port 102a via plated through hole 103a, and electrode 101b is connected to plated through hole 103b. Plated through hole 103a and plated through hole 103b are connected within substrate 10 and combined into one path.

[0104] The signal transmitted by the signal transmission port 102a can be split into two paths of signals within the board. One path of the signal is transmitted to the electrode 101a via the plated through hole 103a, and then from the electrode 101a to the conductive connection 30a. The other path of the signal is transmitted to the electrode 101b via the plated through hole 103b, from the electrode 101b to the conductive connection 30b, and then from the conductive connection 30a and the conductive connection 30b to the pad 201a, and finally from the pad 201a to the chip 20.

[0105] It should be noted that the electrical operation of the conductive connection 30a is the same as that of the conductive connection 30b, and the conductive connection 30a and the conductive connection 30b back up each other's operation. When one of these conductive connections is disconnected due to a fault, the signal can be further transmitted through another conductive connection. This improves the stability of the component.

[0106] Thus, multiple conductive connections connected to one pad 201 are interconnected within the substrate 10 via plated through holes 103. This implements the electrical operational backup of the component.

[0107] In some other embodiments, multiple electrodes 101 connected to one pad 201 are electrically connected to one signal transmission port 102 via multiple plated through holes 103 .

[0108] 16, the pad 201a is connected to two conductive connections (conductive connection 30a and conductive connection 30b). The conductive connection 30a is connected to the electrode 101a, and the conductive connection 30b is connected to the electrode 101b. The electrode 101a is connected to the signal transmission port 102a via the plated through hole 103c, and the electrode 101b is connected to the signal transmission port 102a via the plated through hole 103d.

[0109] The signal transmitted by the signal transmission port 102a can be split into two path signals on the second surface of the substrate 10. The signal of one path is transmitted to the electrode 101a via the plated through hole 103c. The signal of the other path is transmitted to the electrode 101b via the plated through hole 103d, and then transmitted from the electrode 101a to the conductive connection 30a and from the electrode 101b to the conductive connection 30b, and from the conductive connection 30a and the conductive connection 30b to the pad 201a, and finally transmitted from the pad 201a to the chip 20.

[0110] Thus, multiple conductive connections connected to one pad 201 are interconnected on the second surface of the substrate 10 via the signal transmission port 102. This implements the electrical operation backup of the component.

[0111] Also, the stability of the components is further improved. In some embodiments, as shown in Figures 17 and 18, there is a circle of metal frame 50 between the chip 20 and the substrate 10. The metal frame 50 is, for example, a copper frame. The metal frame 50 is, for example, placed on the substrate 10, and the metal frame 50 and the chip 20 are separated.

[0112] If tin balls are used as the conductive connections 30, a metal frame 50 may be used to support the chip 20 to facilitate confining the molten tin solder material. The thickness of the metal frame 50 determines the height of the solidified tin balls, facilitating control of the size of the tin balls.

[0113] However, as shown in FIG. 19, when gold balls are used as the conductive connection 30, ultrasonic fusion needs to be performed on the gold wire on the chip 20 first to form the conductive connection 30, and then the chip 20 is flipped onto the substrate 10 for ultrasonic welding. In this process, due to the inherent error in the height of the metal frame 50, a gap 501 exists between the conductive connection 30 and the substrate 10. As a result, the conductive connection 30 and the substrate 10 cannot be effectively contacted to complete the ultrasonic soldering. This affects the soldering quality and reduces the stability of the components.

[0114] Thus, this application provides an improved packaging assembly, which may be used in a gold ball process.

[0115] As shown in Figures 20, 21, and 22, the packaging assembly includes a substrate 10, a chip 20, an electrode 101 arranged on the substrate 10, a signal transmission port 102, a pad 201 arranged on the chip 20, and a conductive connection portion 30.

[0116] Please refer to the above-mentioned embodiments for the structures and connection relationships between the substrate 10, the chip 20, the electrodes 101, the pads 201, and the conductive connections 30. The details will not be described again here.

[0117] Based on the above embodiment, as shown in Figures 20 and 21, a pad 201A is further disposed on the surface of the chip 20, and the packaging assembly further includes a support component 301 disposed between the chip 20 and the substrate 10. One end of the support component 301 is connected to the pad 201A, and the other end of the support component 301 is connected to the electrode 101. The support component 301 is not connected to the signal transmission port 102. In other words, the electrode 101 connected to the support component 301 is not connected to the signal transmission port 102.

[0118] When gold balls are used as the support components 301, ultrasonic melting can first be performed on the gold wires on the chip 20 to form the conductive connections 30 and the support components 301, and then the chip 20 is flipped onto the substrate 10 for ultrasonic soldering.

[0119] In this process, the same process is used for the conductive connection 30 and the supporting component 301, so the height of the conductive connection 30 and the height of the supporting component 301 are the same, and therefore the conductive connection 30 and the substrate 10 can be in effective contact to complete the ultrasonic soldering, which improves the soldering quality and improves the stability of the component.

[0120] The arrangement position of the support component 301 is not limited in the embodiments of this application. In some embodiments, as shown in FIG. 21, the support component 301 is arranged in the peripheral region of the chip 20. The region surrounded by the pads 201 connected to the signal transmission ports 102 is, for example, the effective region A. The region between the effective region A and the edge of the chip 20 is, for example, the peripheral region B of the chip 20, and the pads 201A are arranged in, for example, the peripheral region B.

[0121] 21 are configured to be connected to a signal end. After the pads 201B, 201C, and 201D are connected, the enclosed rectangular area can be used as an effective area A, the pad 201A is located in the peripheral area B, and the support component 301 is connected to the pad 201A.

[0122] Optionally, each signal transmission port 102 is connected to one pad 201. In one packaging assembly, the number N of signal transmission ports satisfies N≧2.

[0123] Optionally, the peripheral region may be an annular region bounded by the boundary of the active area A and the edges of the chip. For example, as shown in Figure 21, if the surface of the chip is rectangular, then the boundary of the active area A is also rectangular, and the boundary of the active area A and the edges of the chip enclose a square ring.

[0124] In some other embodiments, the surface of the chip is in the shape of a circle and the boundary of the active area A is also in the shape of a circle, with the boundary of the active area A and the edge of the chip enclosing a ring.

[0125] Therefore, the boundary of the active area A and the edge of the chip enclose a regular ring, so that the conductive connections are uniformly arranged on the edge of the chip and the stability of the packaging assembly is improved.

[0126] It should be noted that the boundary between the effective area A and the peripheral area B may have an irregular shape, all of which are within the scope of protection of this application.

[0127] The manner in which the support components 301 in the peripheral region B are grouped is not limited to the embodiment of this application. The support components 301 may be arranged contiguously or discontinuously. When the support components 301 are arranged discontinuously, the multiple support components 301 may be distributed at equal intervals or may not be distributed at equal intervals.

[0128] As shown in Figures 23 and 24, the spacing between the support components 301 varies.

[0129] Additionally, the support component 301 may be in a single layer arrangement or a multi-layer arrangement, with the multi-layer arrangement being more stable.

[0130] As shown in Figures 23(a) and (b), the support component 301 uses a single layer arrangement.

[0131] As shown in Figures 24(a) and (b), the support component 301 uses a two-layer arrangement.

[0132] In some other embodiments, the support component 301 may be disposed in the active area A of the chip 20 and spaced apart from the conductive connections 30 (not shown).

[0133] In another embodiment, a portion of the support component 301 is disposed in the active area A of the chip 20 and a portion of the support component 301 is disposed in the peripheral area B of the chip 20 (not shown).

[0134] The shape of the support component 301 is not limited in the embodiments of this application. The support component 301 may use the same shape as the conductive connection portion 30 described above. For example, the shape of the support component 301 may be a sphere, an ellipsoid, and a cube.

[0135] The material of the support component 301 is not limited in the embodiment of this application. The support component 301 is made of a metal or alloy material. Preferably, a gold ball can be used as the support component 301. When the packaging assembly is manufactured, the support component 301 can be formed by using the same process as the conductive connection part 30.

[0136] 25 is a simulation diagram of the accumulated viscoplastic strain of a packaging assembly according to an embodiment of the present application. FIG. 25 shows a comparison of the accumulated viscoplastic strain of the conductive connection 30 of the packaging assembly from position (1) to position (14) when the support component 301 is not present and when the support component 301 is present at the outer ring of the peripheral region.

[0137] As shown in FIG. 25, when the support component 301 is not present, the conductive connection portion may use the first configuration in the above embodiment (as shown in FIG. 12(a)), and the accumulated viscoplastic strain of the conductive connection portion 30 from position (1) to position (14) is large.

[0138] When the support component 301 is present at the outer ring of the peripheral region, the accumulated viscoplastic strain of the conductive connection 30 from position (1) to position (14) is small.

[0139] Therefore, it can be seen from the above simulation that the stress on the single conductive connection can be weakened by disposing the support component in the peripheral region. Compared with the case where the support component is not disposed, the stress on the single conductive connection can be reduced by 30%, which can improve the deformation resistance of the component during temperature cycling.

[0140] Also, Fig. 26 is a simulation diagram of the compression performance of each conductive connection without a support component. Fig. 27 is a simulation diagram of the compression performance of each conductive connection when there is a support component on the outer ring of the peripheral region. As shown in Figs. 26 and 27, the stress on a single conductive connection is reduced by 44% when comparing the case where there is a support component on the outer ring of the peripheral region with the case where there is no support component on the outer ring of the peripheral region.

[0141] Thus, the above simulations show that by placing support components in the peripheral region, the stress on the single conductive connection can be reduced, reducing the risk of breakage of the chip and the conductive connection.

[0142] An embodiment of this application further provides an electronic device. Figure 28 is a schematic diagram of a cross-sectional structure of an electronic device 100 according to this application. The electronic device 100 includes, for example, a circuit board 101 and a packaging assembly disposed on the circuit board 101. A signal transmission port 102 of the packaging assembly is soldered to the circuit board 101.

[0143] The structure and function of the packaging assembly 20 are the same as those of the packaging assembly 20 in the above-described embodiment, and the details will not be described again here.

[0144] The electronic device may be a Surface Acoustic Wave Filter (SAW filter), a Film Bulk Acoustic Resonator Filter (FBAR filter), a Bulk Acoustic Wave Filter (BAW filter), or an Interdigital Transducer (IDT).

[0145] The above description is merely a specific implementation of this application, and is not intended to limit the scope of protection of this application. Any variation or replacement within the technical scope disclosed in this application shall fall within the scope of protection of this application. Therefore, the scope of protection of this application shall be subject to the scope of protection of the claims.

Claims

1. A packaging assembly including a substrate and a chip, the substrate has a first surface and a second surface opposite to each other, the first surface of the substrate facing a surface of the chip, a plurality of electrodes are disposed on the first surface of the substrate, and a signal transmission port is disposed on the second surface of the substrate, the signal transmission port being connected to the electrodes; A first pad is disposed on the surface of the chip, and the first pad is connected to the electrode via a conductive connection; The first pad is connected to a plurality of conductive connecting parts, and the plurality of conductive connecting parts are connected to one signal transmission port; A second pad is disposed on the surface of the chip; a support component is disposed between the chip and the substrate, one end of the support component is connected to the second pad, the other end of the support component is connected to the electrode, and the support component is not connected to the signal transmission port; the support component is disposed in a peripheral region of the chip outside the first pads; Packaging assembly.

2. The plurality of conductive connection parts are connected to one signal transmission port, The plurality of conductive connection parts are connected to one electrode and connected to one signal transmission port via the one electrode. The packaging assembly of claim 1 , comprising:

3. The plurality of conductive connection parts are connected to one signal transmission port, a plurality of plated through holes provided in the substrate; the plurality of conductive connection parts are respectively connected to the plurality of electrodes, and the plurality of electrodes are respectively connected to the signal transmission port via the plurality of plated through holes; The packaging assembly of claim 1 , comprising:

4. The packaging assembly of claim 3 , wherein the plurality of plated through holes are combined into a single path in the substrate and connected to a single signal transmission port.

5. The packaging assembly of claim 1 , wherein a distance between adjacent conductive connections in the plurality of conductive connections is equal to or less than a diameter of a single conductive connection.

6. A packaging assembly as described in any one of claims 1 to 5, wherein adjacent conductive connection portions in the plurality of conductive connection portions are in contact with each other.

7. The packaging assembly of claim 1 , wherein the first pad is in the shape of a circle or a polygon.

8. The packaging assembly according to claim 1 , wherein a connecting line between the centers of the plurality of conductive connecting parts connected to one first pad is configured in the shape of a straight line, a broken line, or a polygon.

9. The packaging assembly according to claim 1 , wherein the conductive connection is in the shape of a sphere, an ellipsoid, a cube, or a polyhedron.

10. The packaging assembly according to claim 1 , wherein the conductive connection is made of a metal or alloy material.

11. A packaging assembly described in any one of claims 1 to 10, wherein the second pad is arranged in the peripheral region of the chip and has a ring-shaped shape surrounding the first pad.

12. 12. The packaging assembly of claim 1, wherein the area between the active area of ​​the chip and an edge of the chip is the peripheral area of ​​the chip.

13. The packaging assembly of claim 1 , wherein the support component is spaced apart from the conductive connection.

14. The packaging assembly of claim 1 , wherein the support component is in the shape of a sphere, an ellipsoid, a cube, or a polyhedron.

15. The packaging assembly according to claim 1 , wherein the support component is made of a metal or alloy material.

16. 16. The packaging assembly of claim 1, further comprising a housing, the housing and the first surface of the substrate enclosing a first cavity, the chip being disposed within the first cavity.

17. 17. The packaging assembly of claim 16, wherein the housing comprises a bracket and a cover plate, the bracket being positioned on the first surface of the substrate and surrounding the chip, and the cover plate being disposed on top of the bracket.

18. 18. An electronic device comprising a circuit board and a packaging assembly according to claim 1, wherein a signal transmission port of the packaging assembly is soldered onto the circuit board.

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