HEAD FOR HOLDING SUBSTRATE AND SUBSTRATE PROCESSING APPARATUS - Patent application

Abstract

To provide a structure which enables reduction of risks imposed on an attachment mechanism of a retainer member when a substrate collides with the retainer member.SOLUTION: According to one embodiment, a head for holding a polygonal substrate is provided. The head has: a substrate support surface having a shape corresponding to a shape of the polygonal substrate; a retainer member disposed at the outer side of each side of the substrate support surface; and a retainer guide which supports the retainer member. The retainer member has an engagement surface which extends in a direction perpendicular to the substrate support surface. The engagement surface of the retainer member engages with the retainer guide.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present application relates to a head for holding a substrate and a substrate processing apparatus. [Background technology]

[0002] In the manufacture of semiconductor devices, chemical mechanical polishing (CMP) equipment is used to planarize the surface of a substrate. Substrates used in the manufacture of semiconductor devices are often disk-shaped. In addition, there is an increasing demand for flatness when planarizing the surfaces of rectangular substrates such as copper clad laminate (CCL) substrates, printed circuit board (PCB) substrates, photomask substrates, and display panels, in addition to semiconductor devices. There is also an increasing demand for planarizing the surfaces of package substrates on which electronic devices are mounted, such as PCB substrates.

[0003] Furthermore, while the dimensions of circular semiconductor substrates are determined by standards (for example, SEMI standards), the dimensions of rectangular substrates such as the above-mentioned CCL substrates (Copper Clad Laminate substrates), PCB (Printed Circuit Board) substrates, photomask substrates, and display panels are not determined by standards, and substrates of various dimensions are possible. In recent years, there has been a trend toward larger substrate sizes in terms of device manufacturing efficiency. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2003-179015 A [Patent Document 2] U.S. Patent No. 6,019,670 [Patent Document 1] JP 2020-019115 A Summary of the Invention [Problem to be solved by the invention]

[0005] When polishing a rectangular substrate by CMP, the substrate is held by a polishing head, pressed against a polishing pad supported on a polishing table, and the polishing head and the polishing table are rotated to polish the substrate. A retainer member may be used to hold the substrate in a predetermined position within the polishing head so that the substrate does not jump out of the head during polishing. During polishing, the side of the rectangular substrate may collide with the retainer member. A rectangular substrate may be large and heavy, and if the substrate collides with the retainer member, it may adversely affect the mounting mechanism of the retainer member. Therefore, one object of the present application is to provide a structure that reduces the risk to the mounting mechanism of the retainer member when the substrate collides with the retainer member. [Means for solving the problem]

[0006] According to one embodiment, a head for holding a polygonal substrate is provided, the head comprising a substrate support surface shaped to correspond to the shape of the polygonal substrate, a retainer member positioned on the outside of each side of the substrate support surface, a retainer guide supporting the retainer member, the retainer member having an engagement surface extending in a direction perpendicular to the substrate support surface, the engagement surface of the retainer member engaging with the retainer guide. [Brief description of the drawings]

[0007] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; [Diagram 2] FIG. 2 is a perspective view showing a schematic configuration of a polishing module according to one embodiment. [Diagram 3] 2 is a cross-sectional view showing a detailed structure of a head according to an embodiment. [Figure 4] 2 is a view of the head from the polishing table side according to one embodiment. FIG. [Diagram 5] 4 is an enlarged cross-sectional view of a retainer portion of the cross-sectional view shown in FIG. 3. [Figure 6] 4 is an enlarged cross-sectional perspective view of a retainer portion shown in the cross-sectional view of FIG. 3. FIG. [Figure 7] FIG. 13 is a top plan view of a lower housing according to one embodiment. [Figure 8] 1 is a schematic diagram of a retainer member viewed from above (retainer guide side) according to one embodiment. FIG. [Figure 9] 9 is a partial cross-sectional view of the retainer member shown in FIG. 8 . [Figure 10] 9 is a partial cross-sectional view taken along the direction of arrows BB-BB in FIG. 8. [Figure 11] 13 is a cross-sectional view of a retainer portion according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of a head and a substrate processing apparatus including the head according to the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, the same or similar elements are given the same or similar reference symbols, and in the description of each embodiment, duplicated descriptions of the same or similar elements may be omitted. Furthermore, the features shown in each embodiment can be applied to other embodiments as long as they are not mutually inconsistent.

[0009] FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus 1000 according to an embodiment. The substrate processing apparatus 1000 shown in FIG. 1 includes a load module 100, a transfer module 200, a polishing module 300, a drying module 500, and an unload module 600. In the illustrated embodiment, the transfer module 200 includes two transfer modules 200A and 200B, and the polishing module 300 includes two polishing modules 300A and 300B. In an embodiment, each of these modules can be formed independently. By forming these modules independently, the substrate processing apparatus 1000 can be easily formed with different configurations by arbitrarily combining the number of each module. In addition, the substrate processing apparatus 1000 includes a control device 900, and each component of the substrate processing apparatus 1000 is controlled by the control device 900. In an embodiment, the control device 900 can be formed from a general computer including an input / output device, a calculation device, a storage device, and the like.

[0010] <Load module> The load module 100 is a module for introducing the substrate WF into the substrate processing apparatus 1000 before processing such as polishing and cleaning is performed. In one embodiment, the load module 100 includes a plurality of transport rollers 202 for transporting the substrate WF. The transport rollers 202 are attached to a roller shaft 204. By rotating the transport rollers 202 via the roller shaft 204, the substrate WF on the transport rollers 202 can be transported in a predetermined direction (leftward in FIG. 1). In one embodiment, the load module 100 may include an ID reader and be configured to read the ID of the received substrate. In one embodiment, the load module 100 may include a sensor for detecting the presence or absence of the substrate WF at a predetermined position on the transport rollers 202.

[0011] In the illustrated embodiment, the transport mechanism of the load module 100 has a plurality of transport rollers 202 and a plurality of roller shafts 204 to which the transport rollers 202 are attached. In the embodiment shown in FIG. 1, three transport rollers 202 are attached to each roller shaft 204. The substrate WF is placed on the transport rollers 202, and the substrate WF is transported by the rotation of the transport rollers 202. The transport rollers 202 may be attached at any position on the roller shaft 204 as long as the substrate WF can be transported stably. However, since the transport rollers 202 come into contact with the substrate WF, they should be arranged so that the transport rollers 202 come into contact with an area that does not cause any problems even if they come into contact with the substrate WF to be processed. In one embodiment, the transport rollers 202 of the load module 100 may be made of a conductive polymer. In one embodiment, the transport rollers 202 are electrically grounded via the roller shafts 204 or the like. This is to prevent the substrate WF from being charged and damaging the substrate WF. In one embodiment, the load module 100 may be provided with an ionizer (not shown) to prevent the substrate WF from being charged.

[0012] <Transport module> 1 includes two transfer modules 200A and 200B. The two transfer modules 200A and 200B may have the same configuration, and therefore will be collectively referred to as the transfer module 200 in the following description.

[0013] The illustrated transport module 200 includes a plurality of transport rollers 202 for transporting the substrate WF. By rotating the transport rollers 202, the substrate WF on the transport rollers 202 can be transported in a predetermined direction. The transport rollers 202 of the transport module 200 may be formed of a conductive polymer or a non-conductive polymer. The transport rollers 202 are attached to a roller shaft 204 and driven by a motor via a gear. In one embodiment, the transport module 200 may include a sensor for detecting the presence or absence of the substrate WF at a predetermined position on the transport rollers 202.

[0014] In one embodiment, the transport module 200 may include a transfer mechanism for transferring the substrate on the transport rollers 202 to the polishing module 300 and for receiving the substrate from the polishing module 300. The transfer mechanism may be a pusher 230 that lifts the substrate on the transport rollers 202. The pusher 230 may be the same or similar to the pusher disclosed in JP 2020-019115 A, for example.

[0015] In one embodiment, the transport module 200 has a cleaning mechanism for cleaning the substrate moving on the transport rollers 202. The cleaning mechanism may include a cleaning nozzle 284 that sprays a cleaning liquid toward the substrate moving on the transport rollers 202. For the cleaning nozzle 284, for example, a cleaning nozzle the same as or similar to the cleaning nozzle disclosed in JP 2020-019115 A may be used.

[0016] <Polishing module> Fig. 2 is a perspective view showing a schematic configuration of a polishing module 300 according to an embodiment. The substrate processing apparatus 1000 shown in Fig. 1 includes two polishing modules 300A and 300B. The two polishing modules 300A and 300B may have the same configuration, and therefore will be collectively referred to as the polishing module 300 below.

[0017] As shown in FIG. 2, the polishing module 300 includes a polishing table 350 and a head 302 constituting a polishing head that holds a substrate as a polishing object and presses it against a polishing surface on the polishing table 350. The polishing table 350 is connected to a polishing table rotating motor (not shown) disposed below the polishing table 350 via a table shaft 351, and is rotatable around the table shaft 351. A polishing pad 352 is attached to the upper surface of the polishing table 350, and a surface 352a of the polishing pad 352 constitutes a polishing surface for polishing a substrate. In one embodiment, the polishing pad 352 may be attached via a layer for facilitating peeling from the polishing table 350. Such a layer may be, for example, a silicone layer or a fluorine-based resin layer, and may be one described in, for example, JP 2014-176950 A.

[0018] A polishing liquid supply nozzle 354 is provided above the polishing table 350, and a polishing liquid is supplied onto the polishing pad 352 on the polishing table 350 by the polishing liquid supply nozzle 354. As shown in FIG. 2, the polishing table 350 and the table shaft 351 are provided with a passage 353 for supplying the polishing liquid. 3 communicates with an opening 355 on the surface of the polishing table 350. A through hole 357 is formed in the polishing pad 352 at a position corresponding to the opening 355 of the polishing table 350, and the polishing liquid passing through the passage 353 is supplied to the surface of the polishing pad 352 from the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352. The opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 may be one or more. The positions of the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 are arbitrary, but in one embodiment, they are disposed near the center of the polishing table 350.

[0019] 2, in one embodiment, the polishing module 300 includes an atomizer 358 (see FIG. 1) for spraying a liquid or a mixture of liquid and gas toward the polishing pad 352. The liquid sprayed from the atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen gas.

[0020] The head 302 is connected to a head shaft 18, which is movable up and down relative to a swing arm 360 by a vertical movement mechanism 319. The vertical movement of the head shaft 18 moves the entire head 302 up and down relative to the swing arm 360 for positioning. The head shaft 18 is rotated by the drive of a head rotation motor (not shown). The rotation of the head shaft 18 causes the head 302 to rotate around the head shaft 18. A rotary joint 323 is attached to the upper end of the head shaft 18.

[0021] There are various polishing pads available on the market, such as SUBA800 ("SUBA" is a registered trademark), IC-1000, IC-1000 / SUBA400 (two-layer cloth) manufactured by Nitta Haas Corporation, and Surfin xxx-5, Surfin 000, etc. ("surfin" is a registered trademark) manufactured by Fujimi Incorporated. SUBA800, Surfin xxx-5, and Surfin 000 are nonwoven fabrics in which fibers are solidified with urethane resin, and IC-1000 is a hard polyurethane foam (single layer). Polyurethane foam is porous and has many fine dents or holes on its surface.

[0022] The head 302 is adapted to hold a rectangular substrate on its lower surface. The swing arm 360 is adapted to be rotatable about a support shaft 362. The head 302 is movable between the substrate transfer position of the transfer module 200 and above the polishing table 350 by the rotation of the swing arm 360. The head 302 is lowered by lowering the head shaft 18, so that the substrate can be pressed against the surface (polishing surface) 352a of the polishing pad 352. At this time, the head 302 and the polishing table 350 are rotated, and a polishing liquid is supplied onto the polishing pad 352 from a polishing liquid supply nozzle 354 provided above the polishing table 350 and / or from an opening 355 provided in the polishing table 350. In this manner, the substrate can be pressed against the polishing surface 352a of the polishing pad 352 to polish the surface of the substrate. During polishing of the substrate WF, the arm 360 may be fixed or swung so that the head 302 passes through the center of the polishing pad 352 (so as to cover the through-hole 357 of the polishing pad 352).

[0023] The up-down movement mechanism 319 that moves the head shaft 18 and the head 302 up and down includes a bridge 28 that rotatably supports the head shaft 18 via a bearing 321, a ball screw 32 attached to the bridge 28, a support base 29 supported by a support column 130, and an AC servo motor 38 provided on the support base 29. The support base 29 that supports the servo motor 38 is fixed to a swing arm 360 via the support column 130.

[0024] The ball screw 32 includes a screw shaft 32a connected to a servo motor 38 and a The head shaft 18 is adapted to move up and down together with the bridge 28. Therefore, when the servo motor 38 is driven, the bridge 28 moves up and down via the ball screw 32, and as a result, the head shaft 18 and the head 302 move up and down. The polishing module 300 is provided with a distance measuring sensor 70 as a position detector that detects the distance to the underside of the bridge 28, i.e., the position of the bridge 28. The position of the head 302 can be detected by detecting the position of the bridge 28 with the distance measuring sensor 70. The distance measuring sensor 70 constitutes a vertical movement mechanism 319 together with the ball screw 32 and the servo motor 38. The distance measuring sensor 70 may be a laser sensor, an ultrasonic sensor, an eddy current sensor, or a linear scale sensor. The distance measuring sensor 70, the servo motor 38, and other devices in the polishing module are configured to be controlled by a control device 900.

[0025] Next, the head 302 in the polishing module 300 according to one embodiment will be described. Fig. 3 is a cross-sectional view showing a detailed structure of the head 302 according to one embodiment. Fig. 3 corresponds to a cross-sectional view of the head 302 shown in Fig. 2 taken along the arrow AA-AA. Fig. 4 is a view of the head 302 according to one embodiment as seen from the polishing table 350 side.

[0026] In the embodiment shown in FIG. 3, the head 302 has a head body 2 and a retainer portion 380. The head body 2 includes a rectangular plate-like upper member 303, an intermediate member 304 attached to the lower surface of the upper member 303, and a lower member 306 attached to the lower surface of the intermediate member 304. The retainer portion 380 is attached to the outer periphery of the upper member 303. The upper member 303 is connected to the head shaft 18 by a bolt 308 or the like. The intermediate member 304 is connected to the upper member 303 by a bolt 309 or the like. The lower member 306 is connected to the upper member 303 by a bolt 310 or the like. The upper member 303, the intermediate member 304, and the lower member 306 can be formed from a metal material or a plastic material. In one embodiment, the upper member 303 is formed from stainless steel (SUS), and the intermediate member 304 and the lower member 306 are formed from a plastic material.

[0027] As shown in FIG. 3, an elastic membrane 4 that contacts the back surface of the substrate WF is attached to the lower surface of the lower member 306. That is, the elastic membrane 4 constitutes a support surface that supports the substrate in the head 302. The support surface of the substrate by the elastic membrane 4 has the same dimensions as the substrate held by the head 302 or a slightly larger dimension than the substrate. The elastic membrane 4 is attached to the lower surface of the lower member 306 by three concentric holders 316 (the central part is a thin cylindrical member, and the two surrounding parts are square annular members) as shown in the figure. The holders 316 are fixed to the lower member 306 by bolts 311 or the like, and the elastic membrane 4 can be attached to the lower surface of the lower member 306 by sandwiching the elastic membrane 4 between the holders 316 and the lower member 306. The elastic membrane 4 has a plurality of compartments formed by partitions 4a. In one embodiment, the elastic membrane 4 is formed of a rubber material having excellent strength and durability, such as ethylene propylene rubber (EPDM), polyurethane rubber, and silicone rubber. In one embodiment, the elastic membrane 4 can be formed from a rubber material using a mold.

[0028] 3, a center chamber 5, a ripple chamber 6, an intermediate chamber 7, an outer chamber 8, and an edge chamber 9 are defined by the elastic membrane 4 and the lower surface of the lower member 306. The center chamber 5, the ripple chamber 6, the intermediate chamber 7, the outer chamber 8, and the edge chamber 9 are connected to flow paths (not shown), and fluid can be supplied to the center chamber 5, the ripple chamber 6, the intermediate chamber 7, the outer chamber 8, and the edge chamber 9 via these flow paths, thereby independently controlling the internal pressure of each of the chambers 5, 6, 7, 8, and 9. Therefore, when the substrate WF is polished, the contact pressure on the polishing pad 352 can be controlled for each area region of the substrate WF.

[0029] As shown in FIG. 4, the elastic film 4 is connected to a ripple chamber 6 and is arranged to hold the substrate WF in the head 3. A plurality of vacuum suction holes 315 are formed on the head 302 for vacuum suction to adhere to the elastic membrane 4 of the head 302. In one embodiment, as shown in Fig. 4, eight vacuum suction holes 315 are provided. The vacuum suction holes 315 communicate with a passage (not shown) and are connected to a vacuum source. The substrate WF can be vacuum suctioned to the elastic membrane 4 of the head 302 via the vacuum suction holes 315.

[0030] FIG. 5 is a cross-sectional view showing an enlarged view of the retainer portion 380 in the cross-sectional view shown in FIG. 3. FIG. 6 is a cross-sectional perspective view showing an enlarged view of the retainer portion 380 in the cross-sectional view shown in FIG. 3. As shown in the figure, the retainer portion 380 is provided on the outer periphery of the upper member 303. As shown in the figure, the upper housing 402 is connected to the lower surface of the outer periphery of the upper member 303. In one embodiment, the upper housing 402 can be fixed to the upper member 303 by bolts or the like via a seal packing or the like. The lower surface of the upper housing 402 is provided with the lower housing 404. In one embodiment, the upper housing 402 and the lower housing 404 are generally rectangular annular members and can be formed from polyphenylene sulfide (PPS) resin. A cylindrical cylinder 406 is defined inside the lower housing 404. A diaphragm 408 is disposed in the cylinder 406. In one embodiment, the diaphragm 408 is formed from a rubber material. The diaphragm 408 is fixed by being sandwiched between the upper housing 402 and the lower housing 404. The internal space of the cylinder 406 is divided into an upper space and a lower space by the diaphragm 408. A piston 410 is disposed within the diaphragm 408 of the lower housing 404. One end of the piston 410 is in contact with the lower surface of the diaphragm 408. The other end of the piston 410 protrudes from the lower side of the lower housing 404 and is in contact with a retainer support guide 412. In one embodiment, the piston 410 can be formed from PPS resin.

[0031] FIG. 7 is a plan view of the lower housing 404 seen from above. In one embodiment, a plurality of cylinders 406 are formed in the lower housing 404, and a diaphragm 408 and a piston 410 are arranged in each cylinder 406. FIG. 7 shows a plurality of cylinders 406 formed in the lower housing 404, and a diaphragm 408 arranged in each cylinder 406. As shown in the figure, by using the cylinders 406, diaphragms 408, and pistons 410 of the same shape, it is possible to reduce the cost of manufacturing them. For example, even when manufacturing head bodies 2 with different dimensions, the same parts, the diaphragms 408 and pistons 410, can be used, and the number of parts to be used can be changed depending on the size of the head body 2.

[0032] The upper housing 402 is provided with a passage 403. The passage 403 is connected to a fluid source. A fluid (e.g., air or nitrogen) can be supplied from the fluid source through the passage 403 into the upper space of the cylinder 406 of the lower housing 404. When a fluid is supplied into the upper space of the cylinder 406, the diaphragm 408 expands downward to move the piston 410 downward. The downward movement of the piston 410 can move the retainer support guide 412 downward.

[0033] 5 and 6, in one embodiment, a band 414 is attached from the outer side surface of the upper housing 402 to the outer side surface of the retainer support guide 412. The band 414 allows the retainer support guide 412 to be displaced relative to the lower housing 404, and prevents abrasive liquid and the like from entering the space between the lower housing 404 and the retainer support guide 412.

[0034] As shown in the figure, a retainer guide 416 is attached to the lower surface of the retainer support guide 412. In one embodiment, as shown in the figure, a seal packing 415 made of a rubber material or the like is disposed between the retainer support guide 412 and the retainer guide 416. As shown in the figure, the retainer member 3 is attached to the lower surface of the retainer guide 416. As shown in FIG. 6, the retainer support guide 412, the retainer guide 416, and the retainer member 3 can be fixed by a bolt 417. The retainer support guide 412 and the retainer guide 416 are generally rectangular annular members. In one embodiment, the retainer support guide 412 and the retainer guide 416 are formed from stainless steel (SUS), and the retainer member 3 is formed from stainless steel (SUS), ceramics, PPS resin, polyvinyl chloride resin, or the like. As described above, the retainer support guide 412 is moved downward by the piston 410 in the lower housing 404, whereby the retainer member 3 is moved downward.

[0035] In one embodiment, the retainer member 3 is a long and thin rectangular plate-like member as shown in FIG. 4. In the embodiment shown in FIG. 4, the retainer member 3 is provided with four plate-like members on the outside of each side of the rectangular head body 2. As shown in the figure, the retainer members 3 are arranged on the outside of each side of the rectangular support surface corresponding to the shape of the rectangular substrate. In the illustrated embodiment, the end of the long and thin retainer member 3 is in a fan-shaped shape. Therefore, by combining four retainer members 3 as shown in FIG. 4, it is possible to surround almost the entire head body 2, including the corners, with the retainer members 3. In one embodiment, the retainer member 3 is provided with a plurality of grooves 3a as shown in FIG. The retainer member 3 shown in FIG. 4 is formed with grooves 3a extending from the inside to the outside of the head 302. The grooves 3a form a path through which the polishing liquid such as slurry passes during polishing. The size and number of the grooves 3a are arbitrary, and the grooves 3a may be omitted.

[0036] FIG. 8 is a schematic diagram of the retainer member 3 according to one embodiment as viewed from above (the retainer guide 416 side). FIG. 9 is a partial cross-sectional view of the retainer member 3 shown in FIG. 8. As shown in the figure, each of the four plate-shaped retainer members 3 is provided with a bolt hole 419 into which a bolt 417 for fixing the retainer member 3 to the retainer support guide 412 and the retainer guide 416 is inserted. Also, as shown in FIG. 8, the retainer member 3 is provided with a pin hole 421 for arranging a positioning pin 423 for positioning the retainer member 3 to the retainer support guide 412 and the retainer guide 416. FIG. 10 is a partial cross-sectional view as viewed from the direction of the arrow BB-BB shown in FIG. 8. In one embodiment, the pin hole 421 and the positioning pin 423 may be omitted.

[0037] In one embodiment, as shown in Figs. 5, 9 and 10, the retainer member 3 has a protrusion 425 that protrudes toward the retainer guide 416. Alternatively, it can be said that the protrusion 425 of the retainer member 3 protrudes in a direction perpendicular to the plate surface of the plate-shaped retainer member 3. The protrusion 425 of the retainer member 3 has an engagement surface 427 that contacts a side surface of the retainer guide 416. The engagement surface 427 of the retainer member 3 is configured to face toward the retainer guide 416. In other words, the engagement surface 427 of the retainer member 3 is configured to face away from the center of the head 302. Alternatively, it can be said that the engagement surface 427 extends in a direction perpendicular to the substrate or the surface supporting the substrate. The engagement surface 427 of the retainer member 3 is configured such that when the retainer member 3 is fixed to the retainer support guide 412 and the retainer guide 416, the engagement surface 427 contacts the inner side of the retainer guide 416 when viewed from the center of the head 302.

[0038] 8 and 9, the protrusion 425 and engagement surface 427 of the retainer member 3 are provided over almost the entire length of the plate-shaped retainer member 3. It is desirable that the protrusion 425 and engagement surface 427 of the retainer member 3 be provided up to the end of the retainer member 3 beyond the endmost bolt hole 419.

[0039] When polishing a substrate, the substrate is held under the elastic film 4 of the head 302, and the polishing table The head 302 and the polishing table 350 are rotated while the retainer member 3 is pressed against the polishing surface on the retainer guide 416. The retainer member 3 restricts the lateral movement of the substrate relative to the head 302 during polishing so that the substrate does not fly out laterally from the head 302 during polishing. As the head 302 and the polishing table 350 rotate during polishing of the substrate, the side surface of the substrate collides with the retainer member 3. When the substrate collides with the retainer member 3, a lateral force is applied to the retainer member 3. Since the retainer member 3 according to the above embodiment has an engagement surface 427 that contacts the retainer guide 416, the lateral force applied to the retainer member 3 is transmitted from the engagement surface 427 to the retainer guide 416. If the retainer member 3 does not have the engagement surface 427 as described above, the lateral force applied to the retainer member 3 is transmitted to the retainer guide 416 through the bolt 417. In that case, a large force is applied to the bolt 417, which may cause the bolt 417 to loosen. However, in the retainer member 3 according to the embodiment of the present disclosure, the lateral force applied to the retainer member 3 is transmitted from the engagement surface 427 to the retainer guide 416, so that the force transmitted to the bolt 417 can be reduced. Therefore, in the above-described embodiment, the risk of the bolt 417 loosening can be reduced.

[0040] In the illustrated embodiment, the retainer member 3 has an engagement surface 427 that contacts the inner side surface of the retainer guide 416, but other structures may be used as long as the lateral force applied to the retainer member 3 can be transmitted via a surface to the retainer guide 416. For example, by making the retainer member 3 have a convex portion and the retainer guide 416 have a concave portion corresponding to the convex portion of the retainer member 3, the force can be transmitted via a concave and convex engagement surface, and a similar effect can be expected. Also, the retainer member 3 may have a concave portion and the retainer guide 416 may have a convex portion.

[0041] FIG. 11 is a cross-sectional view showing a retainer part 380 according to an embodiment. The retainer member shown in FIG. 11 includes a first layer 3b and a second layer 3c. The first layer 3b and the second layer 3c of the retainer member 3 can be made of different materials. As described above, the retainer member 3b can be made of stainless steel (SUS), ceramics, PPS resin, polyvinyl chloride resin, etc., but for example, the first layer 3b can be made of stainless steel (SUS) or the like having high rigidity, and the second layer 3c can be made of PPS resin. Alternatively, the second layer 3c may be made of ceramics having higher rigidity than resin. The first layer 3b and the second layer 3c of the retainer member 3 can be bonded with an adhesive such as epoxy resin. In addition, an uneven structure may be provided on the joint surface between the first layer 3b and the second layer 3c of the retainer member 3 to make it resistant to lateral impact.

[0042] In one embodiment, the head 302 includes a retainer guide device that guides the retainer member 3 to be displaceable in the vertical direction and supports the retainer member 3 to prevent it from being displaced in the lateral direction. In one embodiment, as shown in FIG. 5 and FIG. 6, the retainer support guide 412, the retainer guide 416, and the retainer member 3 are supported and guided by the support roller 450 and are movable in the vertical direction. As shown in the figure, a support pad 418 is fixed to the inner side surface of the retainer support guide 412. As shown in the figure, the retainer support guide 412, the retainer guide 416, and the retainer member 3 move in the vertical direction while the support pad 418 fixed to the retainer support guide 412 is in contact with and supported by the support roller 450. Note that, in one embodiment, a configuration may be made such that a slight gap is formed between the support pad 418 fixed to the retainer support guide 412 and the support roller 450. In one embodiment, the support pad 418 may be made from PPS resin, polyvinyl chloride resin, PEEK resin, or the like.

[0043] As shown in FIG. 5 and FIG. 6, a retainer support frame 420 is fixed to the lower member 306 of the head body 2. As shown in FIG. 6, the retainer support frame 420 is 5 and 6, a seal packing 415 is sandwiched between the lower member 306 and the retainer support frame 420. As shown in the figures, the seal packing 415 extends from the region between the lower member 306 and the retainer support frame 420 to the region between the retainer support guide 412 and the retainer guide 416. It can also be said that the seal packing 415 extends from the head main body 2 to the retainer portion 380. Therefore, the seal packing 415 can prevent the polishing liquid and the like from entering the inside of the head 302 from between the head main body 2 and the retainer portion 380.

[0044] 6, a shaft 424 is fixed to the retainer support frame 420. The support rollers 450 are rotatably supported by the shaft 424. In one embodiment, a plurality of support rollers 450 are provided along each side of the rectangular annular retainer portion 380.

[0045] In the above embodiment, the rotational force of the head shaft 18 is transmitted to the upper member 303, the intermediate member 304, and the lower member 306. Furthermore, the rotational force is transmitted from the retainer support frame 420 fixed to the lower member 306 to the support rollers 450, and then transmitted from the support rollers 450 to the retainer portion 380 through the support pads 418. Therefore, the rotational force of the head main body 2 of the head 302 is transmitted to the retainer portion 380 through the support rollers 450.

[0046] Furthermore, in the above-described embodiment, by supplying fluid to cylinder 406 through passage 403 and driving piston 410 by diaphragm 408, retainer member 3 can be moved vertically and pressed against polishing pad 352. Furthermore, the pressure of the fluid supplied to cylinder 406 can be controlled by the pressure of the fluid supplied to cylinder 406. In the above-described embodiment, when retainer member 3 moves vertically, it moves while being guided by support roller 450. Therefore, the resistance between support roller 450 and support pad 418 can be reduced.

[0047] <Drying module> The drying module is an apparatus for drying the substrate WF. In the substrate processing apparatus 1000 shown in Fig. 1, the drying module 500 dries the substrate WF that has been polished in the polishing module 300 and then cleaned in the cleaning section of the transfer module 200. As shown in Fig. 1, the drying module 500 is disposed downstream of the transfer module 200.

[0048] The drying module 500 has a transport roller 202 for transporting the substrate WF. In one embodiment, the transport roller 202 of the drying module 500 may be made of a conductive polymer. The transport roller 202 is electrically grounded via a roller shaft 204 or the like. This is to prevent the substrate WF from being charged and damaging the substrate WF. In one embodiment, the drying module 500 may also be provided with an ionizer (not shown) to prevent the substrate WF from being charged. In one embodiment, the drying module 500 may also include a sensor for detecting the presence or absence of the substrate WF at a predetermined position on the transport roller 202.

[0049] In an embodiment, the drying module 500 has a nozzle 530 for spraying gas toward the substrate WF transported on the transport roller 202. The gas can be, for example, compressed air or nitrogen. For the nozzle 530 of the drying module 500, for example, a nozzle similar to or similar to the nozzle disclosed in JP 2020-019115 A can be used.

[0050] <Unload module> The unload module 600 receives the substrate WF after processing such as polishing and cleaning. The unload module 600 is a module for unloading a substrate out of the substrate processing apparatus 1000. In the substrate processing apparatus 1000 shown in Fig. 1, the unload module 600 receives a substrate after it has been dried in the drying module 500. As shown in Fig. 1, the unload module 600 is disposed downstream of the drying module 500.

[0051] In the embodiment shown in FIG. 1, the unload module 600 includes a plurality of transport rollers 202 for transporting the substrate WF. The substrate on the transport rollers 202 can be transported in a predetermined direction by rotating the transport rollers 202. In one embodiment, the transport rollers 202 of the unload module 600 can be made of a conductive polymer. In one embodiment, the transport rollers 202 are electrically grounded via the roller shaft 204 or the like. This is to prevent the substrate WF from being charged and damaging the substrate WF. In one embodiment, the unload module 600 may also be provided with an ionizer (not shown) to prevent the substrate WF from being charged. In one embodiment, the unload module 600 may also be provided with a sensor for detecting the presence or absence of the substrate WF at a predetermined position on the transport rollers 202.

[0052] 1, two transfer modules 200 and two polishing modules 300 are provided, but the number of each of the transfer modules 200 and the polishing modules 300 may be one, or three or more. As described above, the load module 100, the transfer module 200, the polishing module 300, the drying module 500, and the unload module 600 may each be configured as an independent module.

[0053] At least the following technical ideas can be understood from the above-described embodiments. [Form 1] According to form 1, a head for holding a polygonal substrate is provided, the head including a substrate support surface having a shape corresponding to the shape of the polygonal substrate, a retainer member positioned outside each side of the substrate support surface, a retainer guide supporting the retainer member, the retainer member having an engagement surface extending in a direction perpendicular to the substrate support surface, the engagement surface of the retainer member engaging with the retainer guide.

[0054] [Feature 2] According to feature 2, in the head according to feature 1, the retainer member and the retainer guide are fixed by a bolt.

[0055] [Mode 3] According to mode 3, in the head according to mode 1 or 2, the engagement surface of the retainer member engages with an inner side surface of the retainer guide when viewed from the center of the head.

[0056] [Form 4] According to Form 4, in a head according to any one of Forms 1 to 3, the retainer member has a first layer and a second layer, and the first layer and the second layer are formed of different materials.

[0057] [Form 5] According to Form 5, there is provided a retainer member for use in a head for holding a polygonal substrate, the retainer member having a plate-shaped member, the retainer member having an engagement surface extending in a direction perpendicular to the plate surface, the engagement surface of the retainer member configured to engage with a retainer guide that supports the retainer member when the retainer is attached to the head.

[0058] [Feature 6] According to feature 6, in the retainer member according to feature 5, the retainer member has bolt holes for fastening to the retainer guide with bolts.

[0059] [Mode 7] According to Mode 7, in the retainer member according to Mode 5 or 6, the plate-like member has a first layer and a second layer, and the first layer and the second layer are formed of different materials.

[0060] [Form 8] According to form 8, there is provided a substrate processing apparatus for processing polygonal substrates, the substrate processing apparatus having a head according to any one of forms 1 to 4 and a polishing table for supporting a polishing pad. [Explanation of symbols]

[0061] 2...Head body 3…Retainer member 4...Elastic membrane 100...Load module 200...Transport module 300…Polishing module 302…Head 350…Polishing table 352...Polishing pad 380…Retainer part 412…Retainer support guide 416…Retainer guide 417…Bolt 418…Support pad 419…Bolt hole 420…Retainer support frame 421…Pin hole 423…Pin 425…Convex part 427…Engagement surface 500…Drying module 600...Unload module 900...Control device 1000...Substrate processing apparatus WF…Substrate

Claims

1. A head for holding a polygonal substrate, a substrate support surface having a shape corresponding to the shape of a polygonal substrate; a retainer member disposed on the outer side of each side of the substrate support surface; a retainer guide that supports the retainer member; Equipped with The retainer member and the retainer guide are fixed together by a bolt, the retainer member has an engagement surface extending in a direction perpendicular to the substrate support surface; the engagement surface of the retainer member engages with the retainer guide; The engagement surface of the retainer member is disposed inwardly of the bolt when viewed from the center of the head, The retainer member includes a protrusion that protrudes toward the retainer guide, and the protrusion includes the engagement surface. head.

2. 2. The head according to claim 1, The engagement surface of the retainer member engages with an inner side surface of the retainer guide when viewed from the center of the head. head.

3. 3. The head according to claim 1 or 2, The retainer member has a first layer and a second layer, the first layer and the second layer being formed of different materials. head.

4. A retainer member for use in a head for holding a polygonal substrate, comprising: The retainer member has a plate-like member, The retainer member has an engagement surface extending in a direction perpendicular to a plate surface, the engagement surface of the retainer member is configured to engage a retainer guide that supports the retainer member when the retainer is attached to the head; the retainer member has a bolt hole for fastening to the retainer guide with a bolt, The engagement surface of the retainer member is disposed on the inside of the bolt hole when viewed from the center of the head, The retainer member includes a protrusion that protrudes toward the retainer guide, and the protrusion includes the engagement surface. Retainer member.

5. 5. The retainer member according to claim 4, The plate-like member has a first layer and a second layer, and the first layer and the second layer are formed of different materials. Retainer member.

6. A substrate processing apparatus for processing a polygonal substrate, comprising: A head according to any one of claims 1 to 4, a polishing table for supporting the polishing pad; Substrate processing equipment.

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