Film forming apparatus, film forming method, and method for manufacturing electronic device

Abstract

To surely absorb a substrate to an absorption plate.SOLUTION: A film deposition apparatus includes: a chamber for maintaining inside vacuum; an absorption plate that is arranged inside the chamber and has an electrode generating an electrostatic force for absorbing the substrate; voltage controlling means for applying a first voltage and a second voltage to an electrode, the second voltage generating an electrostatic force lager than that of the first voltage; and detection means that detects an absorption status of the substrate to the absorption plate. When the detection means detects that a part of the substrate is not absorbed to the absorption plate in a state where the substrate is absorbed to the absorption plate by applying the first voltage to the electrode, the voltage controlling means applies the second voltage to the electrode.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a film forming apparatus, a film forming method, and a method for manufacturing an electronic device. [Background technology]

[0002] In the manufacture of organic electroluminescence displays and the like, a deposition material is deposited on a substrate through a mask. As a pre-treatment for deposition, the mask and the substrate are aligned and then superimposed. Patent Document 1 discloses that alignment is performed by bringing the substrate and the mask close to each other while the substrate is attached to an attachment plate such as an electrostatic chuck. Also disclosed is a detection means for detecting the attachment state of the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-117926 A Summary of the Invention [Problem to be solved by the invention]

[0004] Although the film forming apparatus disclosed in Patent Document 1 can detect a state in which the substrate is not sufficiently attracted to the attraction plate, it does not disclose a method for improving the adhesion of the substrate in such a state. When the substrate is not reliably attracted to the attraction plate, there is a possibility that film formation cannot be performed with sufficient accuracy.

[0005] An object of the present invention is to more reliably adsorb a substrate to an adsorption plate. [Means for solving the problem]

[0006] The first aspect of the present invention is A chamber that maintains a vacuum inside; an adsorption plate provided inside the chamber and having an electrode for generating an electrostatic force for adsorbing the substrate; a voltage control means for applying a first voltage and a second voltage that generates an electrostatic force larger than that generated when the first voltage is applied to the electrodes; a detection means for detecting an adsorption state of the substrate on the adsorption plate; Equipped with When the detection means detects that a part of the substrate is not attracted to the attraction plate in a state where the first voltage is applied to the electrode and the substrate is attracted to the attraction plate, the voltage control means applies the second voltage to the electrode. death, When the detection means detects that a part of the substrate is not attracted to the attraction plate, the voltage control means reduces the voltage applied to the electrode to zero, or applies a third voltage that generates an electrostatic force smaller than that generated when the first voltage is applied to the electrode, or a fourth voltage having a polarity opposite to that of the first voltage, and then applies the second voltage. The film forming apparatus is characterized in that: Also, a chamber that maintains a vacuum inside; an adsorption plate provided inside the chamber and having an electrode for generating an electrostatic force for adsorbing the substrate; a voltage control means for applying a first voltage and a second voltage that generates an electrostatic force larger than that generated when the first voltage is applied to the electrodes; a detection means for detecting an adsorption state of the substrate on the adsorption plate; Equipped with when the detection means detects that a part of the substrate is not attracted to the attraction plate in a state in which the first voltage is applied to the electrode and the substrate is attracted to the attraction plate, the voltage control means applies the second voltage to the electrode; an approaching means for bringing a peripheral portion of the substrate into proximity with an adsorption surface of the adsorption plate; The film forming apparatus is characterized in that, before the second voltage is applied, the peripheral portion of the substrate is brought close to the attraction surface of the attraction plate by the approaching means.

[0007] In addition, the second aspect of the present invention is a step of applying a first voltage to an electrode of an attraction plate that is provided inside a chamber that maintains a vacuum and generates an electrostatic force for attracting the substrate, thereby attracting the substrate to the attraction plate; detecting an adsorption state of the substrate on the adsorption plate; applying a second voltage to the electrode to generate an electrostatic force larger than that generated when the first voltage is applied to the electrode when it is detected that a portion of the substrate is not attracted to the attraction plate; a step of depositing a film forming material onto the substrate through a mask in a state where the substrate is adsorbed onto the adsorption plate when the substrate is detected to be normally adsorbed onto the adsorption plate; Have death, When it is detected in the detecting step that a part of the substrate is not attracted to the attraction plate, the second voltage applying step reduces the voltage applied to the electrode to zero, or applies a third voltage that generates an electrostatic force smaller than that generated when the first voltage is applied to the electrode, or a fourth voltage having a polarity opposite to that of the first voltage, and then applies the second voltage. The film forming method is characterized by the above. Also, a step of applying a first voltage to an electrode of an attraction plate that is provided inside a chamber that maintains a vacuum and generates an electrostatic force for attracting the substrate, thereby attracting the substrate to the attraction plate; detecting an adsorption state of the substrate on the adsorption plate; applying a second voltage to the electrode to generate an electrostatic force larger than that generated when the first voltage is applied to the electrode when it is detected that a portion of the substrate is not attracted to the attraction plate; a step of depositing a film forming material onto the substrate through a mask in a state where the substrate is adsorbed onto the adsorption plate when the substrate is detected to be normally adsorbed onto the adsorption plate; having The method further includes a step of bringing a peripheral portion of the substrate into proximity with an adsorption surface of the adsorption plate, This is a film forming method, characterized in that, before the step of applying the second voltage is performed, the peripheral portion of the substrate is brought close to the attraction surface of the attraction plate in the approaching step. Effect of the Invention

[0008] According to the present invention, the substrate can be more reliably attracted to the attraction plate. [Brief description of the drawings]

[0009] [Figure 1] Schematic diagram of a part of a manufacturing line for electronic devices. [Diagram 2] 1 is a schematic diagram of a film forming apparatus according to an embodiment. [Diagram 3] FIG. 4 is an explanatory diagram of a substrate supporting unit and an adsorption plate. [Figure 4] An explanatory diagram of the electrical wiring of the suction plate. [Diagram 5] FIG. [Figure 6] FIG. [Figure 7] 1A to 1C are explanatory diagrams of a process for overlapping a substrate and a mask using an adsorption plate. [Figure 8] FIG. 2 is an explanatory diagram of a process for improving the adsorption state. [Figure 9] 1A to 1C are diagrams illustrating a method for manufacturing an electronic device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0011] <Electronic device manufacturing line> Fig. 1 is a schematic diagram showing a part of the configuration of a manufacturing line for electronic devices to which the film forming apparatus of the present invention can be applied. The manufacturing line in Fig. 1 is used, for example, for manufacturing display panels for organic electroluminescence (EL) display devices for smartphones. Substrates 100 are sequentially transported to a film forming block 301, and an organic electroluminescence (EL) film is formed on the substrates 100.

[0012] In the film formation block 301, a plurality of film formation chambers 303a to 303d in which film formation processing is performed on the substrate 100 and a mask storage chamber 305 in which masks before and after use are stored are arranged around a transfer chamber 302 having an octagonal shape in a plan view. A transfer robot 302a for transferring the substrate 100 is arranged in the transfer chamber 302. The transfer robot 302a includes a hand for holding the substrate 100 and an articulated arm for moving the hand in the horizontal direction. In other words, the film formation block 301 is a cluster-type film formation unit in which a plurality of film formation chambers 303a to 303d are arranged so as to surround the transfer robot 302a. When the film formation chambers 303a to 303d are collectively referred to or when they are not distinguished from one another, they are referred to as film formation chambers 303.

[0013] In the transport direction (arrow direction) of the substrate 100, a buffer chamber 306, a swirl chamber 307, and a delivery chamber 308 are disposed on the upstream side and downstream side of the film-forming block 301, respectively. In the manufacturing process, each chamber is maintained in a vacuum state. Although only one film-forming block 301 is illustrated in FIG. 1, the manufacturing line according to this embodiment has a plurality of film-forming blocks 301, and the plurality of film-forming blocks 301 are connected by a connection device composed of the buffer chamber 306, the swirl chamber 307, and the delivery chamber 308. The configuration of the connection device is not limited to this, and may be composed of, for example, only the buffer chamber 306 or the delivery chamber 308.

[0014] The transport robot 302a transports the substrate 100 from the upstream delivery chamber 308 to the transport chamber 302, transports the substrate 100 between the film formation chambers 303, transports the mask between the mask storage chamber 305 and the film formation chamber 303, and transports the substrate 100 from the transport chamber 302 to the downstream buffer chamber 306.

[0015] The buffer chamber 306 is a chamber for temporarily storing the substrates 100 depending on the operating status of the production line. The buffer chamber 306 is provided with a substrate storage shelf also called a cassette, and a lifting mechanism. The substrate storage shelf has a multi-stage structure capable of storing a plurality of substrates 100 while maintaining the substrates 100 in a horizontal state with the surfaces to be processed (surfaces to be film-formed) facing downward in the direction of gravity. The lifting mechanism raises and lowers the substrate storage shelf to match the stage where the substrates 100 are carried in or out with the transport position. This allows the buffer chamber 306 to temporarily store and retain a plurality of substrates 100.

[0016] The swirl chamber 307 is equipped with a device for changing the orientation of the substrate 100. In this embodiment, the swirl chamber 307 rotates the orientation of the substrate 100 by 180 degrees using a transport robot provided in the swirl chamber 307. The transport robot provided in the swirl chamber 307 rotates 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and delivers it to the delivery chamber 308, so that the front end and the rear end of the substrate are swapped between the buffer chamber 306 and the delivery chamber 308. As a result, the orientation of the substrate 100 when it is carried into the film formation chamber 303 is the same in each film formation block 301, so that the scan direction of film formation on the substrate S and the orientation of the mask can be made consistent in each film formation block 301. With this configuration, the orientation of the mask installed in the mask storage chamber 305 in each film formation block 301 can be made consistent, simplifying mask management and improving usability.

[0017] The control system of the manufacturing line includes a host device 300 that controls the entire line as a host computer, and control devices 14a-14d, 309, and 310 that control each component, and these can communicate with each other via a wired or wireless communication line 300a. The control devices 14a-14d are provided corresponding to the film formation chambers 303a-303d, and control the film formation apparatus 1 described below. When the control devices 14a-14d are collectively referred to or when there is no need to distinguish between them, they are referred to as the control device 14.

[0018] The control device 309 controls the transport robot 302a. The control device 310 controls the transport robot provided in the swirl chamber 307. The host device 300 transmits information about the substrate 100 and instructions such as transport timing to each of the control devices 14, 309, and 310, and each of the control devices 14, 309, and 310 controls each component based on the received instructions.

[0019] <Overview of the deposition equipment> FIG. 2 is a schematic diagram of a film forming apparatus 1 according to an embodiment. The film forming apparatus 1 provided in the film forming chamber 303 is an apparatus for forming a thin film on the substrate 100 by a film forming material, and forms a thin film of a predetermined pattern using a mask 101. The material of the substrate 100 on which the film is formed by the film forming apparatus 1 can be appropriately selected from materials such as glass, resin, and metal, and a resin layer such as polyimide formed on glass is preferably used. As the film forming material, substances such as organic materials and inorganic materials (metals, metal oxides, etc.) are adopted. The film forming apparatus 1 can be applied to manufacturing apparatuses for manufacturing electronic devices such as display devices (flat panel displays, etc.), thin-film solar cells, and organic photoelectric conversion elements (organic thin-film imaging elements), and optical members, and is particularly preferably used in manufacturing apparatuses for manufacturing organic EL panels. In the following description, an example will be described in which the film forming apparatus 1 forms a film on the substrate 100 by vacuum deposition. However, the present invention is not limited thereto, and can be applied to various film forming apparatuses for performing sputtering, CVD, etc. In each drawing, arrow Z indicates the vertical direction, and arrows X and Y indicate horizontal directions that are perpendicular to each other.

[0020] The film forming apparatus 1 has a box-shaped vacuum chamber 3 (also simply called a chamber) capable of maintaining a vacuum inside. An internal space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 3 is connected to a vacuum pump (not shown). In this specification, "vacuum" refers to a state in which the chamber is filled with a gas at a pressure lower than atmospheric pressure. In other words, the vacuum chamber 3 is in a reduced pressure state. In the internal space 3a of the vacuum chamber 3, a substrate support unit 6 for supporting the substrate 100 in a horizontal position, a mask table 5 for supporting the mask 101, a film forming unit 4, a plate unit 9, and an adsorption plate 15 are arranged. The mask 101 is a metal mask having an opening pattern corresponding to the thin film pattern to be formed on the substrate 100, and is placed on the mask table 5. The mask table 5 can be replaced with other means for fixing the mask 101 in a predetermined position. The mask 101 may be a mask having a structure in which a mask foil having a thickness of several μm to several tens of μm is welded and fixed to a frame-shaped mask frame. The material of the mask 101 is not particularly limited, but it is preferable to use a metal having a small thermal expansion coefficient such as an Invar material. The film forming process is performed in a state in which the substrate 100 is placed on the mask 101 and the substrate 100 and the mask 101 are overlapped with each other.

[0021] The plate unit 9 includes a cooling plate 10 and a magnet plate 11. The cooling plate 10 is suspended below the magnet plate 11 so as to be displaceable in the Z direction relative to the magnet plate 11. The cooling plate 10 has a function of cooling the substrate 100 attracted to the attraction plate 15 by contacting the attraction plate 15 during film formation. The cooling plate 10 is not limited to a plate having a water cooling mechanism or the like to actively cool the substrate 100, and may be a plate-like member that does not have a water cooling mechanism or the like but removes heat from the substrate 100 by contacting the attraction plate 15. The magnet plate 11 is a plate that attracts the mask 101 by magnetic force, and is placed on the upper surface of the substrate 100 to improve the adhesion between the substrate 100 and the mask 101 during film formation.

[0022] It is also possible to adopt a configuration in which the cooling plate 10 and the magnetic plate 11 are not provided. For example, if the adsorption plate 15 is provided with a cooling mechanism, the cooling plate 10 may not be provided. Also, if the adsorption plate 15 adsorbs the mask 101, the magnetic plate 11 may not be provided.

[0023] The film forming unit 4 is a unit having an evaporation source, and in addition to the evaporation source, includes a heater, a shutter, a driving mechanism for the evaporation source, an evaporation rate monitor, and the like. More specifically, in this embodiment, the film forming unit 4 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged in the X direction, and an evaporation material is discharged from each nozzle. For example, the linear evaporation source is moved back and forth in the Y direction (depth direction of the device) by an evaporation source moving mechanism (not shown). In this embodiment, the film forming unit 4 is provided in the same vacuum chamber 3 as the alignment device 2 described later. However, in an embodiment in which the film forming process is performed in a chamber other than the vacuum chamber 3 in which the alignment is performed, the film forming unit 4 is not provided in the vacuum chamber 3.

[0024] <Alignment device> The film forming apparatus 1 includes an alignment device 2 that aligns a substrate 100 and a mask 101. The alignment device 2 includes a substrate support unit 6, an adsorption plate 15, a position adjustment unit 20, a distance adjustment unit 22, a plate unit lifting unit 13, measurement units 7 and 8, an adjustment unit 17, a floating portion 19, and a detection unit 16. Each component of the alignment device will be described below.

[0025] (Substrate support unit) The alignment apparatus 2 includes a substrate supporting unit 6 that supports the peripheral portion of the substrate 100. Description will be made with reference to Fig. 3 in addition to Fig. 2. Fig. 3 is an explanatory diagram of the substrate supporting unit 6 and the suction plate 15, as viewed from below.

[0026] The substrate support unit 6 includes a plurality of base portions 61a to 61d that form an outer frame thereof, and a plurality of placement portions 62 and 63 that protrude inward from the base portions 61a to 61d. The placement portions 62 and 63 are sometimes also called "claws" or "fingers." 61a to 61d are each supported by a support shaft R3. The plurality of mounting parts 62 are arranged at intervals on the base parts 61a to 61d so as to receive the long side of the peripheral part of the substrate 100. The plurality of mounting parts 63 are arranged at intervals on the base parts 61a to 61d so as to receive the short side of the peripheral part of the substrate 100. The substrate 100 carried into the film forming apparatus 1 by the transfer robot 302a is supported by the plurality of mounting parts 62 and 63. Hereinafter, when the base parts 61a to 61d are collectively referred to or when no distinction is made, they will be referred to as the base part 61.

[0027] In this embodiment, the multiple mounting portions 62 and 63 are composed of leaf springs, and when the substrate 100 supported by the multiple mounting portions 62 and 63 is adsorbed onto the suction plate 15, the elastic force of the leaf springs can press the substrate 100 against the suction plate 15.

[0028] 3, the four base parts 61 form a rectangular frame with a partial cutout, but the present invention is not limited to this, and the base parts 61 may be a continuous rectangular frame that surrounds the outer periphery of the rectangular substrate 100. However, by providing the cutouts by the multiple base parts 61, the transport robot 302a can avoid the base parts 61 when transferring the substrate 100 to the placement parts 62 and 63. This can improve the efficiency of transferring and transferring the substrate 100.

[0029] In addition, the substrate support unit 6 may be provided with multiple clamp portions corresponding to the multiple mounting portions 62 and 63, and a configuration may be adopted in which the peripheral portion of the substrate 100 placed on the mounting portions 62 and 63 is clamped and held by the clamp portions.

[0030] (Adsorption plate) 2 and 3. The alignment device 2 is provided inside the vacuum chamber 3, and includes an adsorption plate 15 capable of adsorbing the substrate 100. In this embodiment, the adsorption plate 15 is provided between the substrate support unit 6 and the plate unit 9, and is supported by one or more support shafts R1. In this embodiment, the adsorption plate 15 is supported by four support shafts R1. In one embodiment, the support shaft R1 is a cylindrical shaft.

[0031] In this embodiment, the chucking plate 15 is an electrostatic chuck that chucking the substrate 100 by electrostatic force. For example, the chucking plate 15 has a structure in which an electric circuit such as a metal electrode is embedded inside a matrix (also called a base) made of a ceramic material. For example, in each electrode arrangement region 151, a pair of electrodes to which positive (+) and negative (-) voltages are applied to generate an electrostatic force are arranged. The positive and negative electrodes are arranged alternately in one electrode arrangement region 151. When positive and negative voltages are applied to the metal electrodes arranged in the electrode arrangement region 151, a polarization charge is induced in the substrate 100 through the ceramic matrix, and the substrate 100 is chucking and fixed to the chucking surface 150 of the chucking plate 15 by the electrostatic attraction (electrostatic force) between the substrate 100 and the chucking plate 15.

[0032] In addition, the attraction plate 15 can control the magnitude and polarity of the voltage applied to the electrode, the timing of starting and ending the voltage application, the voltage maintenance time, the voltage application sequence, etc. The voltage application to the attraction plate 15 is controlled by the control device 14. The control device 14 can control the voltage application to the multiple electrode arrangement regions 151 independently of each other.

[0033] The electrode arrangement area 151 can be appropriately set. For example, in this embodiment, the multiple electrode arrangement areas 151 are provided spaced apart from each other, but one electrode arrangement area 151 may be formed over substantially the entire surface of the adsorption surface 150 of the adsorption plate 15.

[0034] Further, a plurality of touch sensors 1621 are embedded in the suction plate 15 to detect contact between the suction plate 15 and the substrate 100. In this embodiment, a total of nine touch sensors 1621 are provided. Four touch sensors 1621 are provided along each of the long sides of the suction plate 15 at the periphery thereof, and one touch sensor 1621 is provided at the center of the suction plate 15. In this manner, the touch sensors 1621 are provided at a plurality of locations on the suction plate 15, so that the suction state and the degree of suction of the substrate 100 relative to the suction surface 150 can be detected. Based on the output of the touch sensor 1621, it can be detected that the entire surface of the substrate 100 is suctioned to the suction surface 150, that a portion of the substrate 100 is not suctioned to the suction surface 150 of the suction plate 15, and the like. The number and arrangement of the touch sensors 1621 can be changed as appropriate.

[0035] In addition, in this embodiment, the touch sensor 1621 mechanically detects contact between itself and the object. As an example, the touch sensor 1621 is provided so that its tip is biased by a spring or the like, and the tip protrudes from the adsorption surface 150 when the tip is not in contact with the substrate 100 or the like. When the substrate 100 contacts the tip of the touch sensor 1621, the tip is pushed by the substrate 100 and retracts toward the adsorption plate 15, and contacts an internal contact to output a predetermined electric signal. The shape of the tip is not particularly limited, and may be a button shape or a rod shape. By appropriately setting the length by which the tip protrudes from the adsorption surface 150 when not in contact with the object, the touch sensor 1621 can substantially detect contact between the adsorption plate 15 and the substrate 100. In addition, the plurality of touch sensors 1621 constitute a detection unit 16 that detects the parallelism between the adsorption plate 15 and the mask table 5, as described later.

[0036] In this embodiment, the suction plate 15 is provided with a fiber sensor 1622 that detects the state of suction of the substrate 100 to the suction plate 15. The fiber sensor 1622 includes a light emitting portion 1622a and a light receiving portion 1622b. The light emitting portion 1622a and the light receiving portion 1622b are provided so as to form an optical path 1622c below the suction plate 15, for example, several mm to several tens of mm below the suction plate 15. If a part of the substrate 100 is not suctioned to the suction plate 15, the part is bent downward by gravity. If the substrate 100 is bent after the suction process of the substrate 100 to the suction plate 15 is performed, the bent part blocks the optical path 1622c, and the bending of the substrate 100 is detected. That is, it is possible to detect that the substrate 100 is not properly suctioned. It is also possible to adopt a configuration in which the fiber sensor 1622 is not provided.

[0037] Further, a plurality of openings 152 are formed in the attraction plate 15, and measurement units (first measurement unit 7 and second measurement unit 8) described later capture images of a mask mark described later through the plurality of openings 152.

[0038] Also refer to FIG. 4. FIG. 4 shows a schematic structure from the suction plate 15 to the support shaft R1. FIG. 4 is an explanatory diagram of the electrical wiring of the suction plate 15, and shows wiring for supplying electricity to the electrodes arranged in the electrode arrangement area 151 of the suction plate 15. In the present embodiment, a plurality of support shafts R1 supporting the suction plate 15 are formed in a hollow cylindrical shape. Electric wires 153 for applying positive (+) and negative (-) voltages are wired to pass through the inside of the support shafts R1. In the example of FIG. 4, two electric wires 153 are shown, one each for applying positive (+) and negative (-) voltages. The electric wires 153 extending from the lower part of the support shaft R1 to the vacuum chamber 3 extend along the short side of the suction plate 15 and are connected to an electrical connection part 154 provided at approximately the center of the short side. That is, the electric wires 153 are led from the outside to the inside of the vacuum chamber 3 via the support shaft R1 and are connected to the electrical connection part 154. Furthermore, power supplied from the electric wire 153 to the electrical connection portion 154 is supplied to each electrode arranged in the electrode arrangement region 151 .

[0039] In this embodiment, four support shafts R1 are provided, and various electric wires (cables) are led into the vacuum chamber 3 through these support shafts R1. Electric wires 153 that supply electricity to the suction plate 15 pass inside the two diagonally arranged support shafts R1, and cables such as a touch sensor 1621 and a fiber sensor 1622 pass in a bundled state inside the remaining two support shafts R1.

[0040] (Position adjustment unit) The alignment device 2 includes a position adjustment unit 20 that adjusts the relative position between the substrate 100, the peripheral portion of which is supported by the substrate support unit 6, or the substrate 100, which is adsorbed by the adsorption plate 15, and the mask 101. The position adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by moving the substrate support unit 6 or the adsorption plate 15 in the XY plane. That is, the position adjustment unit 20 can also be said to be a unit that adjusts the horizontal positions of the mask 101 and the substrate 100. For example, the position adjustment unit 20 can move the substrate support unit 6 in the rotational directions around the axes in the X direction, Y direction, and Z direction. In this embodiment, the position of the mask 101 is fixed, and the substrate 100 is moved to adjust their relative positions, but the mask 101 may be moved, or both the substrate 100 and the mask 101 may be moved to adjust the relative positions.

[0041] In this embodiment, the position adjustment unit 20 includes a fixed plate 20a, a movable plate 20b, and a plurality of actuators 201 arranged between these plates. The fixed plate 20a is fixed onto the upper wall portion 30 of the vacuum chamber 3. A frame-shaped base 21 is mounted on the movable plate 20b, and a distance adjustment unit 22 and a plate unit lifting / lowering unit 13 are supported on the base 21. When the actuator 201 moves the movable plate 20b in the horizontal direction relative to the fixed plate 20a, the base 21, the distance adjustment unit 22, and the plate unit lifting / lowering unit 13 move integrally.

[0042] The multiple actuators 201 include, for example, an actuator capable of moving the movable plate 20b in the X direction and an actuator capable of moving the movable plate 20b in the Y direction. By controlling the amount of movement of these actuators, the movable plate 20b can be moved in the X and Y directions, and in a rotational direction around the axis in the Z direction. For example, the multiple actuators 201 can include a motor as a drive source, and a mechanism such as a ball screw mechanism that converts the drive force of the motor into linear motion.

[0043] (Distance adjustment unit) Distance adjustment unit 22 raises and lowers suction plate 15 and substrate support unit 6 to adjust the distance between them and mask stage 5, and moves substrate 100 and mask 101 closer to or farther apart in the thickness direction (Z direction) of substrate 100. In other words, distance adjustment unit 22 moves substrate 100 and mask 101 closer to each other in the direction in which they are superimposed, and moves them apart in the opposite direction. Note that the "distance" adjusted by distance adjustment unit 22 is the so-called vertical distance, and the distance adjustment unit can also be said to be a unit that adjusts the vertical positions of mask 101 and substrate 100.

[0044] 2, the distance adjustment unit 22 includes a first lifting plate 220. A guide rail 21a extending in the Z direction is formed on the side of the stand 21, and the first lifting plate 220 is capable of freely moving up and down in the Z direction along the guide rail 21a.

[0045] The first lift plate 220 supports the suction plate 15 via a plurality of support shafts R1. When the first lift plate 220 moves up and down, the suction plate 15 moves up and down accordingly. In other words, the first lift plate 220 supports a plurality of support shafts R1 that support the suction plate 15, and as the first lift plate 220 moves up and down, the plurality of support shafts R1 move up and down in synchronous with each other, so that the suction plate 15 moves up and down while maintaining its parallelism. The first lift plate 220 also supports the substrate support unit 6 via a plurality of actuators 65 and a plurality of support shafts R3. The first lift plate 220 supports the substrate support unit 6 via a plurality of actuators 65 and a plurality of support shafts R3. When the support 220 moves up and down, the substrate support unit 6 moves up and down accordingly. In addition, the multiple actuators 65 can move the multiple support shafts R3 connected to these actuators 65 in the vertical direction. The substrate support unit 6 moves vertically relative to the suction plate 15 by the multiple actuators 65. The multiple actuators 65 are configured by, for example, a motor and a ball screw mechanism, and can move the support shafts R3 in the vertical direction.

[0046] The lifting and lowering of the first lifting plate 220 will be described in more detail. The distance adjustment unit 22 is supported by the base 21 and includes a drive unit 221 as an actuator for lifting and lowering the first lifting plate 220. The drive unit 221 is a mechanism for transmitting the driving force of a motor 221a, which is a driving source, to the first lifting plate 220. In this embodiment, a ball screw mechanism having a ball screw shaft 221b and a ball nut 221c is used as the transmission mechanism of the drive unit 221. The ball screw shaft 221b is provided extending in the Z direction and rotates around an axis in the Z direction by the driving force of the motor 221a. The ball nut 221c is fixed to the first lifting plate 220 and meshes with the ball screw shaft 221b. The first lifting plate 220 is lifted and lowered in the Z direction by rotating the ball screw shaft 221b and switching the rotation direction. The amount of lift of the first lift plate 220 can be controlled based on the detection result of a sensor such as a rotary encoder that detects the amount of rotation of the motor 221a. This allows the position in the Z direction of the adsorption plate 15 that adsorbs and supports the substrate 100 to be controlled, thereby controlling the contact and separation between the substrate 100 and the mask 101. In addition, an adjustment unit 17, which will be described later, is provided above the first lift plate 220.

[0047] In the distance adjustment unit 22 of this embodiment, a configuration is adopted in which the position of the mask table 5 is fixed, and the substrate support unit 6 and the suction plate 15 are moved to adjust the distance therebetween in the Z direction. However, the distance adjustment unit is not limited to this configuration. The positions of the substrate support unit 6 or the suction plate 15 may be fixed, and the mask table 5 may be moved to perform adjustment, or a configuration may be adopted in which the substrate support unit 6, the suction plate 15, and the mask table 5 are each moved to adjust the distance therebetween.

[0048] (Plate unit lifting unit) The plate unit lifting unit 13 lifts and lowers the second lifting plate 12 arranged outside the vacuum chamber 3, thereby lifting and lowering the plate unit 9 connected to the second lifting plate 12 and arranged inside the vacuum chamber 3. The plate unit 9 is connected to the second lifting plate 12 via one or more support shafts R2. In this embodiment, the plate unit 9 is supported by two support shafts R2. The support shafts R2 extend upward from the magnet plate 11 and pass through the openings of the upper wall portion 30, the openings of the fixed plate 20a and the movable plate 20b, and the opening of the first lifting plate 220 to be connected to the second lifting plate 12.

[0049] The second lift plate 12 can be raised and lowered in the Z direction along the guide shaft 12a. The plate unit lift unit 13 is supported by the stand 21 and includes a drive mechanism for lifting and lowering the second lift plate 12. This drive mechanism transmits the driving force of the motor 13a, which is a driving source, to the second lift plate 12. In this embodiment, a ball screw mechanism having a ball screw shaft 13b and a ball nut 13c is used as the transmission mechanism of the plate unit lift unit 13. The ball screw shaft 13b extends in the Z direction and rotates around an axis in the Z direction by the driving force of the motor 13a. The ball nut 13c is fixed to the second lift plate 12 and meshes with the ball screw shaft 13b. The second lift plate 12 is raised and lowered in the Z direction by rotating the ball screw shaft 13b and switching the rotation direction. The amount of lift of the second lift plate 12 can be controlled from the detection result of a sensor such as a rotary encoder that detects the amount of rotation of each motor 13a. As a result, the Z direction of the plate unit 9 By controlling the position in the plate unit 9, it is possible to control the contact and separation between the plate unit 9 and the substrate 100.

[0050] The openings in the upper wall 30 of the vacuum chamber 3 through which the above-mentioned support shafts R1 to R3 pass have a size that allows the support shafts R1 to R3 to be displaced in the X and Y directions. To maintain the airtightness of the vacuum chamber 3, bellows or the like are provided in the openings in the upper wall 30 through which the support shafts R1 to R3 pass. For example, the support shaft R1 that supports the first lifting plate 220 is covered with bellows 31 (see FIG. 4, etc.).

[0051] (Measuring unit) The alignment apparatus 2 includes measurement units (first measurement unit 7 and second measurement unit 8) that measure the positional deviation between the substrate 100, the peripheral portion of which is supported by the substrate support unit 6, and the mask 101. A description will be given with reference to FIG. 5 in addition to FIG. 2. FIG. 5 is an explanatory diagram of the first measurement unit 7 and the second measurement unit 8, and shows a state in which the positional deviation between the substrate 100 and the mask 101 is measured. The first measurement unit 7 and the second measurement unit 8 in this embodiment are both imaging devices (cameras) that capture images. The first measurement unit 7 and the second measurement unit 8 are disposed above the upper wall portion 30, and are capable of capturing an image of the inside of the vacuum chamber 3 through a window portion (not shown) formed in the upper wall portion 30.

[0052] Substrate rough alignment mark 100a and substrate fine alignment mark 100b are formed on substrate 100, and mask rough alignment mark 101a and mask fine mark 101b are formed on mask 101. Hereinafter, substrate rough alignment mark 100a will be referred to as substrate rough mark 100a, substrate fine alignment mark 100b will be referred to as substrate fine mark 100b, and both will be collectively referred to as substrate marks. Further, mask rough alignment mark 101a will be referred to as mask rough mark 101a, mask fine alignment mark 101b will be referred to as mask fine mark 101b, and both will be collectively referred to as mask marks.

[0053] Substrate rough mark 100a is formed in the center of a short side of substrate 100. Substrate fine marks 100b are formed at the four corners of substrate 100. Mask rough mark 101a is formed in the center of a short side of mask 101 in correspondence with substrate rough mark 100a. Furthermore, mask fine mark 101b is formed in the four corners of mask 101 in correspondence with substrate fine mark 100b.

[0054] Four second measurement units 8 are provided to capture images of corresponding pairs (four pairs in this embodiment) of substrate fine marks 100b and mask fine marks 101b. The second measurement units 8 are high-magnification CCD cameras (fine cameras) with a relatively narrow field of view but high resolution (for example, on the order of several μm), and measure the positional deviation between the substrate 100 and the mask 101 with high accuracy. One first measurement unit 7 is provided to capture images of corresponding pairs (two pairs in this embodiment) of substrate rough marks 100a and mask rough marks 101a.

[0055] The first measurement unit 7 is a low-magnification CCD camera (rough camera) having a relatively wide field of view but low resolution, and measures a rough positional deviation between the substrate 100 and the mask 101. In the example of Fig. 5, a configuration is shown in which two sets of substrate rough marks 100a and mask rough marks 101a are collectively imaged by one first measurement unit 7, but this is not limiting. As with the second measurement unit 8, the first measurement unit 7 may be provided at positions corresponding to each set so as to image each set of the substrate rough mark 100a and the mask rough mark 101a, so that two first measurement units 7 in total are provided.

[0056] In this embodiment, the substrate 100 and the mask 101 are measured based on the measurement results of the first measurement unit 7. After roughly adjusting the positions of the substrate 100 and the mask 101, the control unit 104 controls the substrate 100 and the mask 101 so as to perform precise position adjustment based on the measurement results of the second measurement unit 8.

[0057] (Adjustment unit) The alignment device 2 includes an adjustment unit 17. Fig. 6 is an explanatory diagram of the adjustment unit 17 (adjustment device). The adjustment unit 17 is a unit that adjusts the relative inclination between the suction plate 15 and the mask table 5. In this embodiment, the adjustment unit 17 adjusts the relative inclination between the suction plate 15 and the mask table 5 by moving the suction plate 15. More specifically, the adjustment unit 17 adjusts the relative inclination between the suction plate 15 and the mask table 5 by adjusting the axial positions of at least some of the support axes R1 among the multiple support axes R1.

[0058] The adjustment unit 17 has a plurality of operation parts 171 operated by an operator. In this embodiment, a plurality of operation parts 171 are provided corresponding to each of a plurality of support shafts R1. When the operation part 171 is operated, the corresponding support shaft R1 moves in the vertical direction, which is the axial direction of the support shaft R1, independently of the other support shafts R1. That is, the plurality of operation parts 171 can independently adjust the vertical position at which the corresponding support shaft R1 supports the suction plate 15. Therefore, the operator operates the operation part 171 to adjust the relative inclination between the suction plate 15 and the mask table 5. In order to increase the degree of freedom of adjustment, it is preferable that the operation part 171 is provided for each of the plurality of support shafts R1, but if the operation part 171 is provided for at least one support shaft R1, the relative inclination between the suction plate 15 and the mask table 5 can be adjusted within a certain range.

[0059] In this embodiment, the operation unit 171 is an adjustment nut that moves the support shaft R1 in the vertical direction, which is its axial direction. The adjustment nut and the thread 172 formed on the support shaft R1 are provided to screw together, and when the adjustment nut is turned by an operator, the support shaft R1 moves.

[0060] Moreover, in this embodiment, the operation unit 171 is provided outside the vacuum chamber 3. Specifically, the support shaft R1 is supported by the first lifting plate 220 via a slide bush 173, and the operation unit 171 is provided above the slide bush 173. By providing the operation unit 171 outside the vacuum chamber 3, an operator can perform adjustments using the adjustment unit 17 while the inside of the vacuum chamber 3 is maintained at a vacuum.

[0061] In addition, a joint portion 18 is provided between the support shaft R1 and the suction plate 15 to connect the support shaft R1 and the suction plate 15 in such a way that the angle of the suction plate 15 relative to the support shaft R1 can be varied. In this embodiment, the joint portion 18 is a spherical bearing, and includes a spherical portion 181 and a bearing portion 182 that slidably receives the spherical portion 181.

[0062] In this embodiment, the multiple support shafts R1 are configured to be movable only in the vertical direction (axial direction). Therefore, the angle of the suction plate 15 with respect to the support shaft R1 is different between a state in which the suction plate 15 is kept horizontal as in state ST1 shown on the left side of Fig. 6 and a state in which the suction plate 15 is tilted as in state ST2 shown on the right side of Fig. 6. In this embodiment, the suction plate 15 is bent with respect to the support shaft R1 at the joint portion 18, so that the support shaft R1 can support the suction plate 15 even in a state in which the suction plate 15 is tilted. Note that the joint portion 18 can appropriately adopt a structure that connects two members in a manner that allows the connection angle to be changed, such as a universal joint.

[0063] Here, the configuration of the adjustment unit 17 will be described in comparison with the distance adjustment unit 22. When the first lift plate 220 of the distance adjustment unit 22 moves up and down, all of the multiple support shafts R1 supported by the first lift plate 220 are lifted and lowered by the same amount, that is, the multiple support shafts R1 are lifted and lowered synchronously. Therefore, the suction plate 15 moves up and down while maintaining its parallelism or relative inclination with respect to the mask stage 5. On the other hand, the adjustment unit 17 moves up and down the multiple support shafts Any one of the support shafts R1 can be moved in the vertical direction (axial direction) relative to the first lift plate 220 independently of the other support shafts R1. For example, the adjustment unit 17 can adjust the axial position of the remaining one support shaft R1 without changing the positions of the three support shafts R1. This allows the adjustment unit 17 to adjust the inclination of the suction plate 15 supported by the multiple support shafts R1.

[0064] (Floating part) The alignment device 2 includes a floating part 19. The floating part 19 is provided between the joint part 18 and the suction plate 15. The floating part 19 includes an elastic member 191, a bush 192, a shaft member 193, a suction plate support part 194, and a flange 195. The shaft member 193 is provided so as to extend downward from the joint part 18. The bush 192 is provided so as to be interposed in an annular gap between the shaft member 193 and the suction plate support part 194, and reduces friction therebetween and reduces wobbling. For example, the bush 192 is formed of a metal sintered material having good sliding properties. The suction plate support part 194 supports the suction plate 15. The elastic member 191 is provided between the suction plate support part 194 and a flange 195 provided on the shaft member 193, and is configured to receive the load of the suction plate 15. That is, the floating part 19 is connected to the support shaft R1 via the joint part 18, and the elastic member 191 of the floating part 19 supports the suction plate 15. In this way, the support shaft R1 supports the suction plate 15 via the elastic member 191 of the floating part 19, thereby reducing the load applied to the mask 101 when the suction plate 15 comes into contact with the mask 101, and ensuring the escape of the suction plate 15 when the suction plate 15 comes into contact with the mask 101.

[0065] (Detection unit) The alignment device 2 includes a detection unit 16. Please refer to FIGS. 2 and 3 again. The detection unit 16 detects the parallelism between the suction plate 15 and the mask table 5. In this embodiment, the parallelism is a degree indicating the degree of relative inclination between the suction plate 15 and the mask table 5. In this embodiment, the detection unit 16 is composed of the above-mentioned multiple touch sensors 1621 and the like provided on the side of the suction plate 15. The multiple touch sensors 1621 are attached to the suction plate 15 so that the lengths of the tips protruding from the suction surface 150 are approximately equal to each other. By attaching the touch sensor 1621 to the suction plate 15, even if the vacuum chamber 3 is deformed by atmospheric pressure, the change occurring in the relative position between the suction plate 15 and the touch sensor 1621 can be reduced. That is, even in a vacuum state, the protruding lengths of the tips of the touch sensors 1621 hardly change and are maintained approximately equal to each other. Therefore, if all of the touch sensors 1621 react almost simultaneously when the suction plate 15 moves, it can be determined that the parallelism is high, in other words, that the relative inclination between the suction plate 15 and the mask table 5 is small. By appropriately changing the length of the tip protruding from the suction surface 150, a predetermined inclination that is not parallel can also be set as a target value. The operation of detecting the parallelism of the suction plate 15 using the detection unit 16 will be described later. In this embodiment, the touch sensor 1621 detects both the contact between the suction plate 15 and the substrate 100 and the parallelism between the suction plate 15 and the mask table 5. This allows the number of sensors to be reduced compared to the case where sensors for detecting these are provided separately.

[0066] <Control device> The control device 14 controls the entire film forming apparatus 1. The control device 14 includes a processing unit 141, a storage unit 142, an input / output interface (I / O) 143, a communication unit 144, a display unit 145, and an input unit 146. The processing unit 141 is a processor such as a CPU, and controls the film forming apparatus 1 by executing a program stored in the storage unit 142. The storage unit 142 is a storage device such as a ROM, RAM, or HDD, and stores various types of control information in addition to the program executed by the processing unit 141. The I / O 143 is an interface that transmits and receives signals between the processing unit 141 and an external device. The communication unit 144 communicates with a higher-level device 3 via a communication line 300a. 00 or other control devices 14, 309, 310, etc., and the processing unit 141 receives information from the higher-level device 300 via the communication unit 144 or transmits information to the higher-level device 300. The display unit 145 is, for example, a liquid crystal display, and displays various information. The input unit 146 is, for example, a keyboard or a pointing device, and accepts various inputs from the user. Note that all or a part of the control devices 14, 309, 310 and the higher-level device 300 may be configured with a PLC, ASIC, or FPGA.

[0067] <Substrate and mask overlay process> 7 is an explanatory diagram of the process of overlapping the substrate 100 and the mask 101 using the chucking plate 15. FIG 7 shows each state of the process.

[0068] In state ST100, the substrate 100 is carried into the film forming apparatus 1 by the transfer robot 302a, and then the transfer robot 302a is retreated. At this time, the substrate 100 is supported by the substrate supporting unit 6.

[0069] State ST101 shows a state in which the substrate supporting unit 6 has risen as a preparatory stage for the suction plate 15 to suction the substrate 100. The substrate supporting unit 6 is raised from state ST100 by the actuator 65 so as to approach the suction plate 15. In state ST101, the peripheral portion of the substrate 100 supported by the substrate supporting unit 6 is in contact with the suction plate 15 or is slightly spaced apart from it. On the other hand, the central portion of the substrate 100 is bent by its own weight and is therefore spaced apart from the suction plate 15 compared to the peripheral portion.

[0070] State ST102 shows a state in which the substrate 100 is being attracted by the attraction plate 15. Specifically, a voltage is applied to an electrode arranged in the electrode arrangement region 151 of the attraction plate 15, and the substrate 100 is attracted to the attraction plate 15 by electrostatic force.

[0071] State ST103 shows a state when detecting whether or not the substrate 100 is normally adsorbed to the adsorption plate 15. When the substrate support unit 6 is lowered and separated from the substrate 100, whether or not the substrate 100 is adsorbed to the adsorption plate 15 is detected based on the detection value of the touch sensor 1621. For example, when all the touch sensors 1621 embedded in the adsorption plate 15 detect contact with the substrate 100, the control device 14 determines that the substrate 100 is normally adsorbed to the adsorption plate 15. When the control device 14 detects that one or more touch sensors 1621 are not in contact with the substrate 100, that is, that a part of the substrate 100 is not adsorbed to the adsorption plate 15, the control device 14 determines that the substrate 100 is not normally adsorbed to the adsorption plate 15. In addition, when the fiber sensor 1622 is provided, it is also possible to determine whether or not the substrate 100 is normally adsorbed based on the output from the fiber sensor 1622. When the substrate 100 is normally adsorbed to the adsorption plate 15, the control device 14 proceeds to an alignment operation between the substrate 100 and the mask 101. When the substrate 100 is not normally adsorbed to the adsorption plate 15, the control device 14 performs a process to improve the adsorption state of the substrate 100 to the adsorption plate 15.

[0072] State ST104 shows a state during the alignment operation between the substrate 100 and the mask 101. The control device 14 causes the distance adjustment unit 22 to lower the chucking plate 15 to bring the substrate 100 and the mask 101 close to each other, and then causes the position adjustment unit 20 to perform the alignment operation.

[0073] State ST105 shows a state in which the substrate 100 and the mask 101 are brought into closer contact with each other by the magnet plate 11. After the alignment operation is completed, the control device 14 controls the plate unit 9 to move down by the plate unit lifting unit 13. As the magnet plate 11 approaches the substrate 100 and the mask 101, the mask 101 is attracted to the substrate 100 side, The adhesion between the substrate 100 and the mask 101 is improved.

[0074] The above-described operations complete the process of overlapping the substrate 100 and the mask 101. For example, after this process is completed, a deposition process is performed by the film formation unit 4.

[0075] Incidentally, when aligning the substrate 100 and the mask 101 in the above-described process, the inclination between the suction plate 15 and the mask table 5 may affect the accuracy of the alignment. By performing the alignment by shortening the distance between the substrate 100 and the mask 101, the accuracy of the alignment can be improved. However, if there is a relative inclination between the suction plate 15 and the mask table 5, a part of the substrate 100 may come into contact with the mask 101, which may cause scratches on the substrate 100. The accuracy of the alignment may decrease by the amount of the distance between the substrate 100 and the mask 101 being increased to protect the substrate 100. Therefore, in general, the parallel adjustment between the suction plate 15 and the mask table 5 may be performed in an environment where the internal space 3a of the vacuum chamber 3 is at atmospheric pressure. The parallel adjustment in an atmospheric pressure environment is performed, for example, by inserting a shim into the connecting portion of the substrate support unit 6.

[0076] <Control to improve adsorption state> Example 1 A process performed when it is determined that the substrate 100 is not normally attracted to the attraction plate 15 in state ST103 will be described with reference to FIG. 8. Here, a voltage applied to the electrode arranged in the electrode arrangement area 151 of the attraction plate 15 in the attraction control in state ST102 (hereinafter, may be simply expressed as application to the attraction plate 15) is defined as a first voltage. The first voltage is a voltage that generates an electrostatic force capable of normally attracting the substrate 100 to the attraction plate 15. However, depending on the degree of bending of the substrate 100 at the start of the attraction control and the progress of the attraction, a part of the substrate 100 may not adhere to the attraction plate 15, resulting in an adsorption state in which wrinkles are generated. If a film formation process is performed in a state in which the substrate 100 is wrinkled, a film cannot be formed with high accuracy. Therefore, in this embodiment, a control is performed to improve the adsorption state of the substrate 100 to the attraction plate 15.

[0077] FIG. 8(a) shows a state in which, in state ST103, a first voltage is applied to the attraction plate 15, but it is determined that the substrate 100 is not normally attracted to the attraction plate 15. In this case, the control device 14 as a voltage control means applies a second voltage to the attraction plate 15, which generates a larger electrostatic force (attractive force) than when the first voltage is applied to the attraction plate 15. As a result, a larger attractive force acts on the substrate 100, so that the attraction force of the attraction plate 15 is increased, and the substrate 100 can be normally attracted to the attraction plate 15 as shown in FIG. 8(b). The second voltage is a voltage whose absolute value is larger than the absolute value of the first voltage. The first voltage may be a voltage that generates a minimum electrostatic force that allows the attraction plate 15 to normally attract the substrate 100.

[0078] In this way, the first voltage is usually applied to the suction plate 15 to perform the suction process, and when the suction is not performed normally with the first voltage, a second voltage having an absolute value larger than the first voltage is applied to improve the suction state, thereby reducing the load on the substrate 100 and the power consumption related to the suction process. After the second voltage is applied, the suction state of the substrate 100 is detected again using the touch sensor 1621 or the fiber sensor 1622, and if it is still determined that the substrate 100 is not normally suctioned, a voltage having an absolute value larger than the second voltage may be applied to improve the suction state. After the second voltage is applied, the suction state of the substrate 100 is detected using the touch sensor 1621 or the fiber sensor 1622, and if it is determined that the substrate 100 is normally suctioned, the process proceeds to a film formation process in which a film formation material is evaporated onto the substrate 100 through the mask 101 with the substrate 100 being suctioned to the suction plate 15.

[0079] Example 2 Another example of the process that is performed when it is determined in state ST103 that the substrate 100 is not normally attracted to the attraction plate 15 will be described with reference to FIG.

[0080] A state in which the substrate 100 is not normally attracted to the attraction plate 15 is a state in which most of the substrate 100 is attracted to the attraction plate 15 and a portion is not attracted to the attraction plate 15, that is, an adsorption state in which wrinkles occur on the substrate 100. In the control of the first embodiment, when the substrate 100 is in such an adsorption state in which wrinkles occur on the substrate 100, if a second voltage that generates a larger electrostatic force is applied, there is a possibility that the adsorption will be completed with the wrinkles remaining on the substrate 100, as shown in Fig. 8(c). In the second embodiment, control is performed to improve the adsorption state of the substrate 100 even in such a case.

[0081] FIG. 8(d) shows a state in which it is determined that the substrate 100 is not normally adsorbed to the adsorption plate 15 even though the first voltage is applied to the adsorption plate 150 in state ST103. In this case, the control device 14 makes the voltage applied to the adsorption plate 15 zero. That is, no electrostatic force is generated in the adsorption plate 15. As a result, the substrate 100 that is adsorbed to the adsorption plate 15 in an incomplete state is peeled off from the adsorption plate 15 and held by the substrate support unit 6 as shown in FIG. 8(e). Thereafter, the control device 14 applies a second voltage to the adsorption plate 15, which generates an electrostatic force larger than that generated when the first voltage is applied. As a result, as shown in FIG. 8(g), the substrate 100 can be normally adsorbed to the adsorption plate 15, and adsorption can be prevented from being completed with wrinkles remaining on the substrate 100.

[0082] In addition, when it is determined that the substrate 100 is not normally attracted to the suction plate 15, the control device 14 may apply a third voltage to the suction plate 15 to generate an electrostatic force smaller than that generated when the first voltage is applied, and then apply the second voltage. By applying the third voltage, the substrate 100 is partially peeled off from the suction plate 15, so that wrinkles are less likely to remain when the second voltage is applied. The third voltage is a voltage whose absolute value is smaller than that of the first voltage. In addition, the control device 14 may apply a fourth voltage of the opposite polarity to the first voltage to the suction plate 15, and then apply the second voltage. The first voltage is a voltage that generates an electrostatic force that attracts the substrate 100 toward the suction plate 15, and the voltage of the opposite polarity to the first voltage is a voltage that generates an electrostatic force that moves the substrate 100 away from the suction plate 15. This makes it possible to more reliably peel off the substrate 100 that is incompletely attracted from the attraction plate 15, so that the attracted state can be more reliably improved when the second voltage is applied.

[0083] (Variation 1) When the substrate 100 is incompletely attached to the suction plate 15, as shown in FIG. 8(c), wrinkles are likely to occur in the region inside the peripheral portion of the substrate 100. Therefore, as shown in FIG. 2, the film forming apparatus 1 of this embodiment may include a support shaft 401 that can move in a direction perpendicular to the suction plate 15 independently of the substrate support unit 6, and a receiving portion 400 that is provided at the lower end of the support shaft 401 and can support the vicinity of the center of the peripheral portion of the substrate 100. Then, as shown in FIG. 8(f), before applying an attachment voltage to the suction plate 15, the support shaft 401 may be moved vertically upward to lift the vicinity of the center of the peripheral portion of the substrate 100 by the receiving portion 400, and bring the substrate 100 close to the suction surface of the suction plate 15. As a result, when an attachment voltage is applied to the suction plate 15, the central portion of the substrate 100 that is lifted toward the suction plate 15 by the receiving portion 400 is first attached, so that wrinkles are less likely to occur. The difference is that the substrate support unit 6 is configured to hold the substrate 100 horizontally, while the receiving portion 400 and the support shaft 401 are configured to bring the portion of the substrate 100 that is prone to wrinkles closer to the suction plate 15, making the portions less likely to wrinkle.

[0084] In FIG. 2, in order to avoid the drawing becoming complicated, the mechanism and the drive source for moving the support shaft 401 are omitted. As long as the plate unit lifting / lowering unit 13 and the distance adjustment unit 22 are movable in the desired direction, a configuration similar to that of the plate unit lifting / lowering unit 13 or the distance adjustment unit 22 described above can be appropriately adopted. The receiving portion 400 may be provided so as to support the vicinity of the center of each of the four sides of the substrate 100 from below the substrate 100, or may be provided so as to support the vicinity of the center of the short side of the substrate 100, or may be provided so as to support the vicinity of the center of the long side of the substrate 100. The receiving portion 400 may also be provided so as to support a portion of the periphery of the substrate 100 that is not near the center of each side.

[0085] (Variation 2) In the above embodiment, an example has been described in which the suction state of the substrate 100 is detected using the touch sensor 1621 or the fiber sensor 1622, but the method of detecting the suction state is not limited to this. For example, a distance measuring sensor may be provided below the substrate 100 or above the suction plate 15, and the suction state may be detected based on the distance to the substrate 100 measured by the distance measuring sensor, or a capacitance sensor may be provided on the suction plate 15, and the suction state may be detected based on the distance to the substrate 100 measured by the distance measuring sensor.

[0086] <Electronic device manufacturing method> Next, an example of a method for manufacturing an electronic device using the film formation method by the film formation apparatus of this embodiment will be described. The configuration of an organic EL display device will be shown as an example of an electronic device, and a method for manufacturing the organic EL display device will be illustrated.

[0087] First, the organic EL display device to be manufactured will be described. Fig. 9(a) is an overall view of an organic EL display device 50, and Fig. 9(b) shows the cross-sectional structure of one pixel.

[0088] As shown in FIG. 9(a), a plurality of pixels 52 each including a plurality of light-emitting elements are arranged in a matrix in a display area 51 of an organic EL display device 50. Each of the light-emitting elements has a structure including an organic layer sandwiched between a pair of electrodes. The pixel here refers to the smallest unit that allows a desired color to be displayed in the display area 51. In the case of the organic EL display device according to this embodiment, the pixel 52 is configured by a combination of a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B that emit light different from each other. The pixel 52 is often configured by a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color.

[0089] 9(b) is a schematic partial cross-sectional view taken along line AB in FIG. 9(a). The pixel 52 is made up of a plurality of light-emitting elements, and each light-emitting element has a first electrode (anode) 54, a hole transport layer 55, any one of light-emitting layers 56R, 56G, and 56B, an electron transport layer 57, and a second electrode (cathode) 58 on a substrate 53. Among these, the hole transport layer 55, the light-emitting layers 56R, 56G, and 56B, and the electron transport layer 57 correspond to organic layers. In this embodiment, the light-emitting layer 56R is an organic EL layer that emits red light, the light-emitting layer 56G is an organic EL layer that emits green light, and the light-emitting layer 56B is an organic EL layer that emits blue light. The light-emitting layers 56R, 56G, and 56B are formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The first electrode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common to the light emitting elements 52R, 52G, and 52B, or may be formed for each light emitting element. In order to prevent the first electrode 54 and the second electrode 58 from being shorted by foreign matter, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 40 is provided to protect the organic EL element from moisture and oxygen.

[0090] In FIG. 9B, the hole transport layer 55 and the electron transport layer 57 are shown as a single layer, but depending on the structure of the organic EL display device, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer. In addition, a hole injection layer having an energy band structure capable of smoothly injecting holes from the first electrode 54 to the hole transport layer 55 may be formed between the first electrode 54 and the hole transport layer 55. Similarly, an electron injection layer may be formed between the second electrode 58 and the electron transport layer 57.

[0091] Next, an example of a method for manufacturing an organic EL display device will be specifically described.

[0092] First, a substrate 53 on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed is prepared.

[0093] An acrylic resin is formed by spin coating on the substrate 53 on which the first electrode 54 is formed, and the acrylic resin is patterned by lithography so as to form an opening in the portion where the first electrode 54 is formed, thereby forming an insulating layer 59. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0094] The substrate 53 on which the insulating layer 59 has been patterned is carried into a first organic material film forming apparatus, and the substrate is held by a substrate support table and an electrostatic chuck, and a hole transport layer 55 is formed as a common layer on the first electrodes 54 in the display region. The hole transport layer 55 is formed by vacuum deposition. In practice, the hole transport layer 55 is formed to be larger than the display region 51, so that a high-definition mask is not required.

[0095] Next, the substrate 53 on which the hole transport layer 55 has been formed is carried into a second organic material film forming apparatus and held by a substrate support table and an electrostatic chuck. The substrate and a mask are aligned, and the substrate is placed on the mask. A red light emitting layer 56R is formed on the portion of the substrate 53 where the red light emitting element is to be disposed.

[0096] Similar to the formation of the light-emitting layer 56R, a green light-emitting layer 56G is formed by a third organic material film formation apparatus, and a blue light-emitting layer 56B is formed by a fourth organic material film formation apparatus. After the formation of the light-emitting layers 56R, 56G, and 56B is completed, an electron transport layer 57 is formed over the entire display area 51 by a fifth film formation apparatus. The electron transport layer 57 is formed as a layer common to the three light-emitting layers 56R, 56G, and 56B.

[0097] The substrate on which the electron transport layer 57 has been formed is moved in a metallic evaporation material deposition device, and a second electrode 58 is deposited.

[0098] Thereafter, the substrate is transferred to a plasma CVD apparatus, where a protective layer 40 is formed, and the organic EL display device 50 is completed.

[0099] If the substrate 53 on which the insulating layer 59 is patterned is exposed to an atmosphere containing moisture or oxygen from the time when it is carried into the film forming apparatus until the film formation of the protective layer 40 is completed, the light emitting layer made of an organic EL material may be deteriorated by moisture or oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film forming apparatus in a vacuum atmosphere or an inert gas atmosphere.

[0100] The above embodiment shows one example of the present invention, but the present invention is not limited to the configuration of the above embodiment, and may be modified appropriately within the scope of the technical concept. [Explanation of symbols]

[0101] 1: film forming device, 3: chamber, 14: control device, 15: suction plate, 100: substrate, 1621: touch sensor

Claims

1. A chamber that maintains a vacuum inside; an adsorption plate provided inside the chamber and having an electrode for generating an electrostatic force for adsorbing the substrate; a voltage control means for applying a first voltage and a second voltage that generates an electrostatic force larger than that generated when the first voltage is applied to the electrodes; a detection means for detecting an adsorption state of the substrate on the adsorption plate; Equipped with when the detection means detects that a part of the substrate is not attracted to the attraction plate in a state in which the first voltage is applied to the electrode and the substrate is attracted to the attraction plate, the voltage control means applies the second voltage to the electrode; When the detection means detects that a portion of the substrate is not adsorbed to the adsorption plate, the voltage control means reduces the voltage applied to the electrode to zero, or applies a third voltage that generates a smaller electrostatic force than when the first voltage is applied to the electrode, or a fourth voltage of opposite polarity to the first voltage, and then applies the second voltage.

2. A chamber that maintains a vacuum inside; an adsorption plate provided inside the chamber and having an electrode for generating an electrostatic force for adsorbing the substrate; a voltage control means for applying a first voltage and a second voltage that generates an electrostatic force larger than that generated when the first voltage is applied to the electrodes; a detection means for detecting an adsorption state of the substrate on the adsorption plate; Equipped with When the detection means detects that a part of the substrate is not attracted to the attraction plate in a state where the first voltage is applied to the electrode and the substrate is attracted to the attraction plate, the voltage control means applies the second voltage to the electrode; an approaching means for bringing a peripheral portion of the substrate into proximity with an adsorption surface of the adsorption plate; a film forming apparatus, the film forming apparatus being configured to bring the peripheral portion of the substrate closer to the attraction surface of the attraction plate by the approaching means before the second voltage is applied;

3. The substrate is rectangular, 3. The film forming apparatus according to claim 2, wherein the approaching means brings the vicinity of the center of the peripheral portion of the substrate closer to the adsorption surface of the adsorption plate.

4. A process of applying a first voltage to an electrode of an adsorption plate provided inside a chamber that maintains a vacuum and that generates an electrostatic force for adsorbing a substrate, thereby adsorbing the substrate to the adsorption plate; detecting an adsorption state of the substrate on the adsorption plate; applying a second voltage to the electrode to generate an electrostatic force larger than that generated when the first voltage is applied to the electrode when it is detected that a portion of the substrate is not attracted to the attraction plate; a step of depositing a film forming material onto the substrate through a mask in a state where the substrate is adsorbed onto the adsorption plate when the substrate is detected to be normally adsorbed onto the adsorption plate; having A film forming method characterized in that, when the detecting step detects that a portion of the substrate is not adsorbed to the adsorption plate, the step of applying the second voltage applies the second voltage after reducing the voltage applied to the electrode to zero, or applying a third voltage that generates an electrostatic force smaller than that generated when the first voltage is applied to the electrode, or a fourth voltage of opposite polarity to the first voltage.

5. a step of applying a first voltage to an electrode of an attraction plate that is provided inside a chamber that maintains a vacuum and generates an electrostatic force for attracting the substrate, thereby attracting the substrate to the attraction plate; detecting an adsorption state of the substrate on the adsorption plate; applying a second voltage to the electrode to generate an electrostatic force larger than that generated when the first voltage is applied to the electrode when it is detected that a portion of the substrate is not attracted to the attraction plate; a step of depositing a film forming material onto the substrate through a mask in a state where the substrate is adsorbed onto the adsorption plate when the substrate is detected to be normally adsorbed onto the adsorption plate; having The method further includes a step of bringing a peripheral portion of the substrate into proximity with an adsorption surface of the adsorption plate, A film forming method, comprising the steps of: bringing a peripheral portion of the substrate into proximity with an attraction surface of the attraction plate in the approaching step before carrying out the step of applying the second voltage.

6. A method for manufacturing an electronic device, comprising the steps of: manufacturing an electronic device by using the film forming method according to claim 4 or 5;

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