Component mounting device and component mounting method

Abstract

To provide a component mounting device capable of suppressing the reduction of the recognition accuracy of a component even when the entire component does not fit within the imaging range of an imaging unit when imaging a moving component.SOLUTION: A component mounting device includes: a head that has a plurality of marks 61 arranged in a parallel first direction or a second vertical direction facing at least one of the plurality of nozzles aligned along the first direction; an imaging unit that sequentially picks up images of a component P and marks 61 from below while placing a part of the component P held by a nozzle and one mark out of the plurality of marks 61 arranged along the second direction in the imaging range while the head is moved along the second direction by the movement control unit; and an image generation unit that recognizes the mark position included in a plurality of images captured sequentially, and based on the mark position generates a combined image while correcting the positional relationship when the plurality of captured images are combined; and a mounting unit that mounts the component P on a circuit board based on the recognition result of the component by a recognition unit that recognizes the component P based on the combined image.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method. [Background technology]

[0002] Conventionally, a component mounting device that mounts (mounts) electronic components on a board is known. Also, a component recognition method that recognizes electronic components when mounting components using the component mounting device is known. As a component recognition method, in a component recognition method for an electronic component mounting device, in a state where the electronic component is attracted and held on the suction surface of a nozzle, light is irradiated onto the electronic component to capture an image, and the image of the electronic component is subjected to image recognition processing for mounting, the electronic component is imaged several times while the electronic component crosses the field of view of an imaging unit of the component recognition device, the image data is input to the component recognition device, the multiple image data are position-corrected and combined, and the image data obtained by the combination is subjected to image recognition processing (see Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-108563 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the component recognition method of Patent Document 1, a plurality of image data including the entire image of an electronic component is obtained, a detection frame is set within each image data, and the center of the electronic component in each image data is aligned with the center of the detection frame to obtain three pixel values ​​at one image position in a composite image. In other words, the plurality of image data are composited by overlapping the positions of the electronic components. However, when the imaging range of the imaging unit is small, or when the electronic component to be recognized is relatively large, and the entire electronic component does not fit within the imaging range of the imaging unit, different parts of the electronic component are captured when attempting to image the electronic component. In this case, if vibrations or the like occur in the moving nozzle, the composite position of the plurality of image data in which different parts of the electronic component are reflected is shifted. If the plurality of image data are composited in this state, distortion occurs in the composite image, and the recognition accuracy of the electronic component may decrease.

[0005] The present disclosure has been made in consideration of the above-mentioned circumstances, and aims to provide a component mounting device and a component mounting method that can suppress a decrease in the recognition accuracy of electronic components when imaging a moving electronic component, even if the entire electronic component does not fit within the imaging range of the imaging unit. [Means for solving the problem]

[0006] One aspect of the present disclosure is a head having a plurality of nozzles arranged along a first direction and a plurality of marks arranged along a second direction that is parallel to the first direction or perpendicular to the first direction, facing at least one of the plurality of nozzles; a movement control unit that moves the head along the second direction; and a movement control unit that moves a part of a component held by the nozzle and one of the plurality of marks arranged along the second direction while the head is moving. onlyan imaging unit that captures images of the component and the mark from below in an imaging range including the component and the mark; an image generation unit that recognizes a position of the mark included in a plurality of images captured sequentially by the imaging unit, corrects a positional relationship of the plurality of images when combined based on the position of the mark, and combines the plurality of images to generate a combined image; a component recognition unit that recognizes the component based on the combined image; and a component mounting unit that mounts the component on a board with the head based on a recognition result by the component recognition unit.

[0007] One aspect of the present disclosure includes a step of moving a head having a plurality of nozzles arranged along a first direction and a plurality of marks arranged along a second direction that is a direction parallel to the first direction or a direction perpendicular to the first direction, facing at least one of the plurality of nozzles, along the second direction, and performing a printing method for a part held by the nozzle and one of the plurality of marks arranged along the second direction while the head is moving. only and a mark of the component that is to be mounted on a board by the head based on the recognition result.

[0008] Furthermore, these comprehensive or specific aspects may be realized by a system, an apparatus, a method, an integrated circuit, a computer program, or a recording medium, or may be realized by any combination of a system, an apparatus, a method, an integrated circuit, a computer program, and a recording medium. Effect of the Invention

[0009] According to the present disclosure, when capturing an image of a moving electronic component, even if the entire electronic component does not fit within the imaging range of the imaging unit, a decrease in recognition accuracy of the electronic component can be suppressed. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a top view illustrating a mechanical configuration of a component mounting apparatus according to an embodiment of the present disclosure; [Diagram 2] FIG. 2 is a side view illustrating a mechanical configuration of the component mounting device; [Diagram 3] FIG. 11 is a perspective view illustrating the operation of the moving head and the component holding nozzle; [Figure 4] FIG. 1 is a side view illustrating a mechanical configuration of a component recognition camera and a head unit; [Diagram 5] FIG. 2 is a perspective view illustrating a mechanical configuration of a lighting unit; [Figure 6] FIG. 1 is a diagram showing an example of the positional relationship between electronic components held by a plurality of component holding nozzles arranged in a predetermined direction and a reference mark; [Figure 7] FIG. 2 is a block diagram illustrating a functional configuration of a control unit of the component mounting device. [Figure 8] FIG. 13 is a diagram showing an example of the imaging range of the component recognition camera and the moving direction of the head unit when scanning in the X direction; [Figure 9] FIG. 1 shows an example of each captured image and a combined image during scanning in the X direction. [Figure 10] FIG. 13 shows an example of a combined image that takes into account the positional deviation of each captured image during scanning in the X direction. [Figure 11] Flowchart showing an example of operation of a component mounting device [Figure 12] FIG. 13 is a diagram showing an example of the imaging range of the component recognition camera and the moving direction of the head unit when scanning in the Y direction; [Figure 13] FIG. 1 shows an example of each captured image and a combined image during Y-direction scanning. [Figure 14] A diagram showing an example of generating a combined image that takes into account the positional deviation of each captured image during Y-direction scanning. [Figure 15] FIG. 13 is a diagram for explaining correction of rotational deviation of a captured image during scanning in the Y direction; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the drawings as appropriate. However, more detailed description than necessary may be omitted. For example, detailed description of already well-known matters and duplicated description of substantially the same configuration may be omitted. This is to avoid the following description becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0012] For example, the term "unit" or "device" in the embodiments is not limited to a physical configuration that is mechanically realized by hardware, but also includes a configuration whose functions are realized by software such as a program. Also, the functions of one configuration may be realized by two or more physical configurations, or the functions of two or more configurations may be realized by, for example, one physical configuration.

[0013] (Embodiment 1) <Mechanical configuration of the component mounting device> First, the mechanical configuration of the component mounting device 1 will be described with reference to Fig. 1 and Fig. 2. Fig. 1 is a top view illustrating the mechanical configuration of the component mounting device 1 according to embodiment 1. Fig. 2 is a side view illustrating the mechanical configuration of the component mounting device 1 shown in Fig. 1.

[0014] For ease of explanation, the axis extending in the height direction from the floor surface on which the component mounting device 1 is installed is referred to as the Z axis. The axis perpendicular to the Z axis (i.e., horizontal, parallel to the floor surface) and extending from the front of the component mounting device 1 (the lower side of the paper in FIG. 1) to the rear side of the component mounting device 1 (the upper side of the paper in FIG. 1) is referred to as the Y axis. The axis perpendicular to the Y axis and the Z axis is referred to as the X axis. For ease of explanation, the positive direction of the Z axis may be referred to as "up", the negative direction of the Z axis as "down", the negative direction of the Y axis as "front", and the positive direction of the Y axis as "rear". These expressions relating to directions are used for ease of explanation and are not intended to limit the position of the structure during actual use.

[0015] One or more component mounting devices 1 are arranged in a mounting board manufacturing line for attaching various components P to a board W to manufacture the board, and mount the components P in a predetermined position and attitude on the board W transported from upstream of the mounting board manufacturing line.

[0016] As shown in Figs. 1 and 2, the component mounting apparatus 1 includes a main body mechanism unit 10 (an example of a component mounting unit) that mounts components P (e.g., electronic components such as ICs (Integrated Circuits), transistors, and capacitors, lead components, chip components, or BGA (Ball Grid Array) components) on a board W mainly through the operation of each component mechanism, and a control unit 40 that controls the operation of the main body mechanism unit 10. The main body mechanism unit 10 includes a mounting machine main body 11 including a base 12, and a head unit 23 that is movable relative to the mounting machine main body 11. The control unit 40 is housed inside the base 12 (see below) of the component mounting apparatus 1, and controls various mechanisms such as the mounting machine main body 11 and the head unit 23.

[0017] 1 (the conveying direction of the board W). The board conveying mechanism 13 has a pair of conveyor units 14 extending along the X direction, and conveys the board W placed on the pair of conveyor units 14, and positions and holds the board W at a predetermined mounting position.

[0018] A pair of component supply mechanisms 15 are disposed facing each other on both the front and rear sides of the board transport mechanism 13 (top and bottom sides in the plane of FIG. 1, left and right sides in the plane of FIG. 2). Each of the pair of component supply mechanisms 15 has a feeder base 16 in which a slot 17 is provided, and a plurality of tape feeders 18 are attached in parallel to the slot 17 as part feeders.

[0019] The component mounting device 1 further includes a feeder cart 19. The feeder cart 19 includes a carriage unit 20 having a plurality of wheels disposed on its underside, and a plurality of reel stock units (not shown) disposed on the upper side of the carriage unit 20. A reel 21 is accommodated in each of the plurality of reel stock units. A carrier tape 22 carrying a component P is pulled out from each of the reels 21, and the component P is supplied to a tape feeder 18 of the component supply mechanism 15. As a result, the tape feeder 18 of the component supply mechanism 15 pitch-feeds the carrier tape 22 in the tape feed direction, thereby supplying the component P to a pick-up position where pick-up is performed by a moving head 26 of a head unit 23 described below.

[0020] Head unit 23 is disposed above base 12, and configured to be movable between a mounting position and a removal position where component supply mechanism 15 and substrate W are disposed. Specifically, head unit 23 is capable of linear movement along the X and Y directions by X-axis table mechanism 25 and Y-axis table mechanism 24 that are disposed orthogonal to each other on a plane substantially parallel to the surface of substrate W.

[0021] A Y-axis table mechanism 24 is disposed on the upper surface of the base 12 along the Y direction. A pair of front and rear X-axis table mechanisms 25 are disposed along the X direction, and are attached to the Y-axis table mechanism 24 so as to be slidable along the Y direction. A moving head 26 is attached to the tip of each of the pair of front and rear X-axis table mechanisms 25 so as to be slidable along the X direction. That is, in the first embodiment, the moving head 26 is mounted on the head unit 23, and the moving head 26 is provided so as to be movable independently of each other by the X-axis table mechanism 25 and the Y-axis table mechanism 24. As a result, the moving head 26 is arbitrarily positioned on a plane approximately parallel to the surface of the substrate W, that is, on a horizontal plane (XY plane). Both the X-axis table mechanism 25 and the Y-axis table mechanism 24 are configured by linear guide drive mechanisms.

[0022] A component recognition camera 28 (an example of an imaging unit) is disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. A component holding nozzle 27 (see below) attached to moving head 26 picks up and holds a component P from component supply mechanism 15 and moves and passes above component recognition camera 28. At this time, component recognition camera 28 illuminates component P sucked and held by component holding nozzle 27 as it passes by at a predetermined timing and images the component P at least once. The image capture result is subjected to a recognition process, whereby identification and position detection of component P can be performed with high accuracy.

[0023] Furthermore, a nozzle holder 38 and a waste box 37 are disposed between the pair of front and rear component supply mechanisms 15 and the board transport mechanism 13. The nozzle holder 38 stores a plurality of types of component holding nozzles 27 of the moving head 26 corresponding to the components P to be held. By having the moving head 26 access the nozzle holder 38 and performing a predetermined nozzle replacement operation, a component holding nozzle 27 (described below) suitable for the object to be held is attached to the moving head 26. The waste box 37 is formed in a box shape and has an internal space, in which components P and the like determined to be defective as a result of image capture by the component recognition camera 28 are discarded.

[0024] <About the configuration and operation of the moving head> Next, the configuration and operation of the moving head 26 will be described with reference to Fig. 3. Fig. 3 is a perspective view illustrating the operation of the moving head 26 shown in Fig. 2.

[0025] The moving head 26 is a multiple head having one moving head or multiple moving heads, and multiple component holding nozzles 27 are arranged side by side at the lower end of each moving head 26 (see FIG. 8, etc.). For example, the moving head 26 may have multiple component holding nozzles 27 (e.g., eight nozzles) arranged in multiple rows (e.g., two rows). Note that the moving head 26 may have multiple component holding nozzles 27 (e.g., eight nozzles) arranged in a single row. A reflector (not shown) is fixed to the moving head 26 for reflecting illumination light emitted from the transmitted illumination unit 34 (see below). The reflector is disposed above the held components P.

[0026] Each of the component holding nozzles 27 vacuum-sucks and holds a component P from the tape feeder 18 of the component supply mechanism 15, for example, by using air pressure, and moves up and down individually. The moving head 26 further includes a Z-axis lifting mechanism (not shown) for individually lifting and lowering each of the component holding nozzles 27, and a θ-axis rotation mechanism (not shown) for individually rotating each of the component holding nozzles 27 about the nozzle axis. The Y-axis table mechanism 24 and the X-axis table mechanism 25 are driven to position the moving head 26 arbitrarily in the horizontal plane (XY plane). By this movement, the moving head 26 sucks up the component P with the component holding nozzle 27 from the take-out position of the tape feeder 18 of the component supply mechanism 15 and takes it out.

[0027] A board recognition camera 36 (see FIG. 1) is fixed to the moving head 26. The board recognition camera 36 is disposed on the underside of the X-axis table mechanism 25 and moves integrally with the moving head 26. As the moving head 26 moves, the board recognition camera 36 passes above the board W positioned by the board transport mechanism 13 and captures an image of the board W. The image capture result (image capture information) is similarly subjected to recognition processing to detect the position and posture of the board W.

[0028] As a result of detecting the position of the board W, the moving head 26 places the components P at their respective mounting points (e.g., the mounting positions and mounting orientations on the board W where the components P are to be placed) using their component holding nozzles 27 in accordance with instructions from the control unit 40. This mounting of the components P at one time is continued until all of the components P sucked and held by each of the component holding nozzles 27 of the moving head 26 are placed on the board W. In this manner, the components P are held and moved by the component holding nozzles 27 of the moving head 26 between the removal position and the mounting operation position, and are finally placed on the board W.

[0029] The component mounting device 1 repeatedly executes a series of operations of picking up and mounting multiple components P using the component holding nozzle 27 of the moving head 26, and then moving the moving head 26 back to the pick-up position, until mounting is completed at all of the multiple mounting points on the board W. By repeating this operation, a large number of components P are sequentially mounted on each of the boards W that are transported in sequence, and after mounting, the boards W on which all of the components P have been mounted are transported to a downstream process. In this manner, the mounting machine main body 11 and the head unit 23 operate in cooperation with each other, and this cooperative operation is executed in accordance with instructions from the control unit 40.

[0030] In the first embodiment, a series of work units consisting of the forward movement from the removal of component P at the removal position to the mounting work position and the subsequent return movement to the removal position is also referred to as a work unit of "one turn." The forward movement from the removal position to the mounting work position in one turn is also referred to simply as "forward movement in one turn" below.

[0031] <Component recognition camera configuration> Next, the configuration of the component recognition camera 28 will be described with reference to Fig. 4 and Fig. 5. Fig. 4 is a side view illustrating the mechanical configuration of the component recognition camera 28 and the head unit 23 shown in Fig. 2. Fig. 5 is a perspective view illustrating the mechanical configuration of the lighting unit section 31 shown in Fig. 4.

[0032] As shown in FIG. 4, the component recognition camera 28 includes an image pickup sensor section 29 and an illumination unit section 31.

[0033] The imaging sensor unit 29 is disposed so that its optical axis is aligned along the vertical direction (Z direction) and captures an image of the component P moving above the component recognition camera 28 from below. The imaging sensor unit 29 includes a substantially cylindrical housing 30, and a lens 71 and an imaging element 72 built into the housing 30. The lens 71 may be one or more. The imaging element 72 may be configured of a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS). The imaging sensor unit 29 has a shutter function and performs exposure and imaging at a predetermined timing according to a command from an imaging processing unit 47 (see below) of the control unit 40. The imaging sensor unit 29 transmits the result of imaging by the imaging element 72 (captured image) to the control unit 40. The imaging sensor unit 29 and the head unit 23 will be described in more detail later.

[0034] Component recognition camera 28 is capable of capturing images according to a scan imaging method, and may have an ROI (Region Of Interest) function using an area sensor. With the ROI function, component recognition camera 28 can set a plurality of ROI ranges for imaging sensor unit 29, and capture images by continuously switching between these ROI ranges. The ROI range corresponds to imaging range CA by imaging sensor unit 29. The set ROI ranges may differ in position, size, etc.

[0035] The lighting unit section 31 includes a box-shaped housing 32, a plurality of reflective illumination sections 33, a plurality of transmitted illumination sections 34, a plurality of side illumination sections 35, and a coaxial illumination section 39. The reflective illumination section 33 may be referred to as an oblique illumination section, a component illumination section, or a first illumination section. The reflective illumination section 33, the transmitted illumination section 34, the side illumination section 35, and the coaxial illumination section 39 are disposed inside the housing 32. The housing 32 of the lighting unit section 31 is disposed on the upper side of the housing 30 of the image sensor section 29 in a stacked and connected state.

[0036] 5, the multiple side illumination units 35 are arranged in a circular ring shape along the horizontal direction. The multiple reflective illumination units 33 are arranged below the side illumination units 35 and around the center inside the ring formed by the multiple side illumination units 35 so that a space is formed in the center. The multiple transmitted illumination units 34 are arranged between the reflective illumination units 33 and the side illumination units 35. The coaxial illumination unit 39 and the reflector C are arranged below the reflective illumination units 33.

[0037] The reflective illumination section 33 is disposed approximately parallel to the bottom wall (i.e., the XY plane, horizontal plane) of the housing 32 of the illumination unit section 31. The reflective illumination section 33 is provided so that the direction of light irradiation is along the optical axis of the imaging sensor section 29. When emitting light, the reflective illumination section 33 irradiates light in an approximately vertical direction (Z direction). A transparent glass (not shown) may be disposed in the horizontal direction between the component P held by the component holding nozzle 27 and the reflective illumination section 33.

[0038] The reflective illumination unit 33 emits light at a timing t1 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the bottom surface of the component P held by the component holding nozzle 27 is illuminated by the light irradiated from the reflective illumination unit 33 and transmitted through the transmission glass. Corresponding to this timing t1, the imaging sensor unit 29 captures an image of the component P.

[0039] The plurality of reflective illumination units 33 may configure a reflective illumination channel. The control unit 40 may perform light emission control for each reflective illumination channel.

[0040] The transillumination unit 34 is disposed obliquely with respect to the bottom wall and side wall (i.e., Z direction) of the housing 32. The transillumination unit 34 is provided so that the direction of light irradiation is oblique with respect to the optical axis of the image sensor unit 29. A shielding plate B is disposed between the reflective illumination unit 33 and the transillumination unit 34. Similar to the transillumination unit 34, the shielding plate B is disposed so as to be oblique with respect to both the bottom wall and side wall of the housing 32.

[0041] When the transillumination unit 34 emits light, it irradiates the light obliquely in the vertical direction (Z direction) and the horizontal direction (XY plane). The transillumination unit 34 emits light at a timing t2 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the component P held by the component holding nozzle 27 is illuminated by the light irradiated from the transillumination unit 34 and reflected by the reflector of the moving head 26. In response to this timing t2, the imaging sensor unit 29 captures an image of the component P.

[0042] The multiple transillumination units 34 may configure a transillumination channel. The control unit 40 may perform light emission control for each transillumination channel.

[0043] The side illumination section 35 is disposed approximately parallel to the side wall of the housing 32 of the illumination unit section 31. The side illumination section 35 is provided so that the direction of light irradiation is perpendicular to the optical axis of the image sensor section 29. The side illumination section 35 is also disposed above the reflective illumination section 33 and the transmitted illumination section 34. When the side illumination section 35 emits light, it irradiates light along a horizontal plane.

[0044] The side illumination unit 35 emits light at timing t3 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the side of the component P held by the component holding nozzle 27 is illuminated by the light emitted from the side illumination unit 35. Corresponding to this timing t3, the imaging sensor unit 29 captures an image of the component P.

[0045] The side lighting section 35 may configure a side lighting channel. The control section 40 may perform light emission control for each side lighting channel.

[0046] The coaxial illumination section 39 is disposed approximately parallel to the side wall of the housing 32 of the illumination unit section 31. The coaxial illumination section 39 is provided so that the direction of light irradiation is perpendicular to the optical axis of the imaging sensor section 29. The coaxial illumination section 39 is disposed below the reflective illumination section 33. When the coaxial illumination section 39 emits light, it irradiates light along a horizontal plane. In addition, a reflector C (e.g., a mirror) included in the component recognition camera 28 is disposed at a position spaced apart from the coaxial illumination section 39 in the direction along the XY plane. The light irradiated from the coaxial illumination section 39 is reflected upward by the reflector C and illuminates the area above the reflector C.

[0047] The coaxial illumination unit 39 emits light at timing t4 when the component P held by the component holding nozzle 27 is moving above the component recognition camera 28. As a result, the lower part of the component P held by the component holding nozzle 27 is illuminated by light that is irradiated from the coaxial illumination unit 39, reflected upward by the reflector C, and passed through the central space surrounded by the multiple reflective illumination units 33 and the transmissive glass. Corresponding to this timing t4, the imaging sensor unit 29 captures an image of the component P.

[0048] The coaxial illumination unit 39 may configure a coaxial illumination channel. The control unit 40 may perform light emission control on a coaxial illumination channel basis.

[0049] The light emission timings t1 to t4 of the illumination units 33, 34, 35, and 39 may be any of a plurality of image capture timings within the time of the forward movement in one turn. The light emission timings of the illumination units 33, 34, 35, and 39 may overlap. For example, at least two of the illumination units 33, 34, 35, and 39 may emit light simultaneously to illuminate the component P.

[0050] <Details of the parts recognition camera and head unit> Next, the component recognition camera 28 and the head unit 23 will be described in detail with reference to Fig. 4 and Fig. 6. Fig. 6 is a diagram showing an example of the positional relationship between components P held by a plurality of component holding nozzles 27 arranged in a predetermined direction and a reference mark 61. Fig. 6 shows a view of the head unit 23 as seen from below (Z-axis negative side). Note that, although Fig. 6 shows a single row of component holding nozzles 27 arranged in the moving head 26, the moving head 26 may have a plurality of component holding nozzles 27 arranged in multiple rows as in Figs. 8 and 9 described below.

[0051] 4, head unit 23 includes moving head 26 extending downward, and a cylindrical marking tube 60 extending downward. A component holding nozzle 27 is attached to moving head 26. Marking tube 60 is provided adjacent to moving head 26 at a position a predetermined distance away from moving head 26. A semi-transparent reference mark 61 is provided on the bottom surface of marking tube 60. Reference mark 61 is used, for example, when generating a combined image in which the entire component P is reflected by combining multiple captured images, each of which reflects a portion of component P, as described below.

[0052] The reference mark 61 (i.e., the lower surface of the mark tube 60) is located, for example, above the lower end of the component holding nozzle 27. In this case, as shown in FIG. 4, the distance from the lens 71 to the reference mark 61 is longer than the distance from the lens 71 to the component P.

[0053] In response to this, the reflective illumination section 33 irradiates light 101 of a first wavelength towards the component P. A mark illumination section 62 is provided inside the mark tube 60. The mark illumination section 62 may be interpreted as a second illumination section. The mark illumination section 62 irradiates light 102 of a second wavelength towards the reference mark 61 (i.e., downward). The first wavelength and the second wavelength are different wavelengths. Note that the reference mark 61 may be illuminated by illumination from the illumination unit section 31.

[0054] The lens 71 may be a lens 71 having chromatic aberration characteristics such that the focal position differs depending on the first wavelength and the second wavelength. For example, the lens 71 may be a lens 71 whose focal position is the position of the component P at the first wavelength and whose focal position is the position of the reference mark 61 at the second wavelength. This allows the imaging element 72 to capture clear images of both the component P and the reference mark 61.

[0055] Alternatively, the lens 71 may be a lens having a predetermined chromatic aberration characteristic. In this case, the first wavelength may be a wavelength at which the position of the component P is the focal position of the lens 71, and the second wavelength may be a wavelength at which the position of the reference mark 61 is the focal position of the lens 71. This allows the imaging element 72 to capture clear images of both the component P and the reference mark 61.

[0056] In other words, the component mounting device 1 may be configured using a combination of a first wavelength, a second wavelength, and a lens 71 such that both the component P held by the component holding nozzle 27 and the reference mark 61 are clearly imaged on the imaging element 72.

[0057] The second wavelength may be shorter than the first wavelength. In this case, for example, the first wavelength may be any wavelength within the range of 600 nm to 900 nm, and the second wavelength may be any wavelength within the range of 400 nm to 550 nm.

[0058] As shown in Fig. 6, moving head 26 has a plurality of (e.g., eight, four in Fig. 6) component holding nozzles 27 arranged along the X direction. Each component holding nozzle 27 can hold a variety of components P. In Fig. 6, a relatively small component P1 or a relatively large component P2 is held. In Fig. 6, the component holding nozzle 27 (a reflector plate called a nozzle flange in this case) located above the component P1 is visible, but the component holding nozzle 27 located above the component P2 is hidden by the component P1 and cannot be seen.

[0059] A plurality of reference marks 61 are arranged in the same direction as the arrangement direction (X direction) of a plurality of component holding nozzles 27 in moving head 26. One mark cylinder 60 may be provided for one reference mark 61, or one mark cylinder 60 may be provided for a plurality of reference marks 61 (e.g., all of the reference marks 61). In Fig. 6, a plurality of reference marks 61 are arranged along the X direction on the lower surface of one mark cylinder 60.

[0060] Furthermore, the number of mark illumination units 62 is arbitrary. For example, one mark illumination unit 62 may be provided for each of the multiple reference marks 61 to be illuminated (e.g., all of the reference marks 61). Also, for example, one mark illumination unit 62 may be provided for each of the multiple reference marks 61 to be illuminated (e.g., all of the reference marks 61).

[0061] Furthermore, the mark interval, which is the interval (distance) between two adjacent reference marks 61, is shorter than the nozzle interval, which is the interval (distance) between two adjacent component holding nozzles 27. Here, there are multiple mark intervals, but each mark interval may be equal (for example, about 5 mm). There are multiple nozzle intervals, but each nozzle interval may be equal. For example, the shape of the reference mark 61 is circular, and the diameter of the reference mark 61 may be about 1 mm, but the reference mark 61 may have other lengths and shapes.

[0062] The imaging range CA (the field of view of the component recognition camera 28) of the component recognition camera 28 is configured to include one of the multiple aligned reference marks 61. For example, at least one of the arrangement interval of the reference marks 61 in the X direction, the moving speed of the head unit 23, and the time interval between images captured by the component recognition camera 28 is adjusted so that one reference mark 61 is included in one imaging range CA. Thus, one reference mark 61 is included in one captured image GA (see FIG. 9, etc.) in which one imaging range CA is captured.

[0063] The imaging range CA is, for example, of a size such that the entire component P is not contained therein, but only a portion of the component P is included within the imaging range CA. Even in this case, the component mounting device 1 captures images of the component P moving during one forward movement multiple times and combines the multiple captured images to grasp the entire component P. The imaging range CA may be set so that the entire component P is contained therein. The length of the imaging range CA in the X direction here may be, for example, about 5 mm, or may be shorter than 5 mm (for example, 1.5 mm).

[0064] While the head unit 23 moves along the X direction, the imaging range CA is imaged by the component recognition camera 28. Therefore, a different part of the component P is reflected in each of the imaging ranges CA that are imaged in sequence.

[0065] <Software configuration of component placement device> Next, the software configuration (functional configuration) of the control unit 40 of the component mounting device 1 will be described with reference to Fig. 7. Fig. 7 is a block diagram illustrating an example of the functional configuration of the control unit 40 of the component mounting device 1.

[0066] The control unit 40 of the component mounting device 1 may be configured by a general-purpose computer equipped with a storage device represented by a ROM (Read Only Memory) and a RAM (Random Access Memory), and an arithmetic device represented by a CPU (Central Processing Unit). The arithmetic device realizes the software configuration (functional configuration) shown in FIG. 7 by reading and executing a computer program stored in the storage device. That is, each block shown in the control unit 40 in FIG. 7 represents a function realized by software. However, at least a part of the functions expressed as blocks is not limited to software, and may be realized by the physical configuration (hardware) of the "device".

[0067] The control unit 40 includes a storage unit 41, a mechanism driving unit 46, and an image processing unit 47. The mechanism driving unit 46 controls the driving of the main body mechanism unit 10. For example, the mechanism driving unit 46 controls the driving of the board transport mechanism 13, the component supply mechanism 15, and the head unit 23, and causes the board transport mechanism 13, the component supply mechanism 15, and the head unit 23 to operate in a coordinated manner.

[0068] The storage unit 41 holds at least mounting information 42, component information 43, mark information 44, and imaging timing information 45. The mounting information 42 includes information such as the type of component P to be mounted on each board W, the mounting position and mounting attitude (e.g., orientation) of the component P on the board W, the mounting order of the components P, and the mounting timing of the components P. The component information 43 may include information such as the outer shape and size of each type of component P, and the presence or absence of electrodes or the number of electrodes.

[0069] The mark information 44 includes information on the reference marks 61. Specifically, the mark information 44 includes information on the outer shape and size of the reference marks 61, the distance between the reference marks 61 (mark interval), and the reference position of the reference marks 61 with respect to the captured image. The reference position of the reference marks 61 indicates the position where the reference marks 61 should be originally placed with respect to the captured image captured by the component recognition camera 28. In reality, the position of the head unit 23 with respect to the component recognition camera may be shifted due to vibration of the component mounting device 1 or the like, so that the reference marks 61 may appear at a position different from the reference position in the captured image. Note that the information on the reference position of the reference marks 61 may be accurate information that is stored in advance, or the position of the reference marks 61 with respect to the image capture range CA may be optically detected by the control unit 40, for example, and the detected position may be stored as the reference position of the reference marks 61.

[0070] The imaging timing information 45 may include information indicating the light emission timing of the lighting channel and information indicating the imaging timing of the component P. The number of imaging timings may be multiple. The imaging timing may be interpreted as shutter timing. Also, the number of light emission timings may be multiple. For example, the imaging timing information 45 may include information indicating the light emission timing of the lighting channel during the forward movement in one turn and information indicating the imaging timing of the imaging sensor unit 29.

[0071] The imaging processing unit 47 includes a camera control unit 48 , a combined image generating unit 49 , and a part recognition unit 50 .

[0072] The camera control unit 48 controls the imaging of the imaging sensor unit 29 and the light emission at the imaging timing of the lighting unit 31. For example, the camera control unit 48 reads the imaging timing information 45 from the storage unit 41, and causes the lighting channel to emit light at each imaging timing indicated by the imaging timing information 45, and causes the imaging sensor unit 29 to capture an image showing the component P.

[0073] The combined image generating unit 49 combines a plurality of captured images to generate a combined image. The combined image generating unit 49 arranges the plurality of captured images on a virtual plane, and detects the presence or absence of misalignment of the combining positions in the plurality of captured images to be combined. If there is misalignment of the combining positions, the combined image generating unit 49 corrects the positions of the captured images with the misalignment on the virtual plane, and generates a combined image based on the captured images with the misalignment corrected.

[0074] The component recognition unit 50 recognizes the features of the component P included in the combined image based on the combined image. The features of the component P may include at least one of the position of the component P, the attitude of the component P, the polarity of the component P, the three-dimensional shape of the component P, the external shape of the component P, and characters added to the component P. The moving head 26 and the component holding nozzle 27 mount the component P at the mounting point on the board W based on the recognition result by the component recognition unit 50.

[0075] The imaging information of the board recognition camera 36 may also be transmitted to the imaging processing unit 47. The imaging processing unit 47, like the component recognition unit 50, may recognize the position and posture of the board W from the imaging information (image) and transmit the recognition result to the mechanism driving unit 46.

[0076] <Component mounting device operation> Next, the operation of the component mounting apparatus 1 will be described with reference to FIGS.

[0077] FIG. 8 is a diagram showing an example of the imaging range CA (CA1) of the component recognition camera 28 and the moving direction of the head unit 23 when scanning in the X direction.

[0078] In this embodiment, head unit 23 moves along the X direction, which is the arrangement direction in which multiple component holding nozzles 27 are arranged. In Fig. 8, imaging range CA1 captured by component recognition camera 28 is at a spatially fixed position, and components P held by component holding nozzles 27 and reference marks 61 adjacent to these component holding nozzles 27 pass through imaging range CA1 in order. Therefore, component recognition camera 28 captures images of components P held by component holding nozzles 27 and reference marks 61 adjacent to these component holding nozzles 27 in the order in which they pass above component recognition camera 28. Such sequential imaging of components P and reference marks 61 along the X direction is also referred to as X-direction scanning.

[0079] 8, moving head 26 is assumed to have multiple component holding nozzles 27 arranged in multiple rows. One reference mark 61 is reflected in imaging range CA, and a portion of multiple (e.g., two) components P held by component holding nozzles 27 in each row (e.g., two) that are positioned differently in the Y direction but the same in the X direction is also reflected. Imaging range CA may be formed, for example, in a rectangular shape (e.g., a strip shape). This rectangular shape has a long length in the Y direction and a short length in the X direction. The length of imaging range CA in the X direction here may be, for example, about 5 mm, or may be shorter than 5 mm (e.g., 1.5 mm).

[0080] 8, moving head 26 has a plurality of component holding nozzles 27 arranged in two rows, so that images of parts of components P in the X direction and reference marks 61 corresponding to these parts are captured in order from two components P held by two component holding nozzles 27 arranged on the positive side of the X axis to two components P held by two component holding nozzles 27 arranged on the negative side of the X axis. This results in a plurality of captured images GA.

[0081] FIG. 9 is a diagram showing an example of each captured image GA (GA1) and a combined image GAC (GAC1) during scanning in the X direction.

[0082] The multiple captured images GA1 captured by X-direction scanning capture different parts of the component P because the multiple captured images GA1 are captured while the head unit 23 is moving. The multiple captured images GA1 are combined so as to include at least one entire component P. When combined, the multiple captured images GA1 are arranged on a virtual plane. In this case, the multiple captured images GA1 are arranged based on the capturing order of the multiple captured images GA1 and the moving direction A of the head unit 23.

[0083] In FIG. 9, the captured image GA1 captured first in time series is arranged at the tip of the moving direction A (the tip of the arrow, the end on the positive side of the X-axis). The captured image GA1 captured last in time series is arranged at the base of the moving direction A (the base of the arrow, the end on the negative side of the X-axis). The captured images GA1 captured between the first and last in time series are arranged in a row from the tip to the base in the moving direction A in chronological order. Two captured images GA1 adjacent to each other in the X direction arranged on the virtual plane are arranged adjacent to each other. Note that the captured images GA adjacent to each other in the X direction on the virtual plane may have part of their image ranges overlapping, or may not have part of their image ranges overlapping, and the edges of the opposing peripheries of the captured images GA may be in contact with each other. In other words, the appearance of each component P held by each component holding nozzle 27 in real space is reproduced in a planar manner by the multiple captured images GA1.

[0084] 9 shows a state in which the multiple captured images GA1 arranged on a virtual plane are not displaced in the joining positions, or the displaced positions of the captured images GA1 have already been corrected. The captured images GA1 that are displaced among the multiple captured images GA1 are corrected for the displaced positions on the virtual plane, for example, by a method shown in FIG. 10, which will be described later.

[0085] FIG. 10 is a diagram showing an example of generating a combined image GAC1 taking into consideration the positional deviation of the combined positions of the captured images GA1 during scanning in the X direction.

[0086] 10 illustrates an example in which three captured images GA1 (GA11, GA12, GA13) in which different parts of a component P are captured are used as the multiple captured images GA1 to be combined. Here, it is assumed that a captured image GA11 is obtained by a first capturing, a captured image GA12 is obtained by a second capturing, and a captured image GA13 is obtained by a third capturing. Note that, although the component holding nozzles 27 are arranged in one row on the moving head 26 in FIG. 10, the moving head 26 may have multiple component holding nozzles 27 arranged in multiple rows as in FIGS. 8 and 9.

[0087] The first imaging captures an image GA11 in which a portion Pa (here, the left end) of the component P and one reference mark 61a are reflected (state A). The second imaging captures an image GA12 in which a portion Pb (here, the center) of the component P and one reference mark 61b are reflected. The third imaging captures an image GA13 in which a portion Pc (here, the right end) of the component P and one reference mark 61c are reflected. The three reference marks 61 imaged each time are the reference marks 61 arranged next to each other in the mark tube 60.

[0088] Three captured images GA11, GA12, and GA13 are obtained by capturing images three times. However, in two of these captured images GA12 and GA13, a positional shift occurs in the joining position, and there are some parts that are discontinuous when joined. This positional shift occurs, for example, when the position of the head unit 23 relative to the component recognition camera 28 is shifted from the position (reference position) where the head unit 23 should be located relative to the component recognition camera 28 due to some vibration or the like during the operation of the component mounting device 1. In this case, when the three captured images GA11, GA12, and GA13 are arranged adjacent to each other on a virtual plane reflecting the positional relationship in the real space, the reference mark 61b and a part Pb of the component P and the reference mark 61b and a part Pb of the component P are shifted in the Y direction. Therefore, the reference marks 61a, 61b, and 61c are not arranged linearly along the X direction, and the parts Pa, Pb, and Pc of the component P are discontinuous at the image ends (state B).

[0089] That is, the position (center position) of the reference mark 61b reflected in the captured image GA12 has shifted by a predetermined distance d11 (not shown) on the negative Y-axis side with respect to the reference position 61o of the reference mark 61b for the captured image GA12, and has been displaced. Also, the position (center position) of the reference mark 61c reflected in the captured image GA13 has shifted by a predetermined distance d12 (not shown) on the negative Y-axis side with respect to the reference position 61o of the reference mark 61c for the captured image GA13, and has been displaced. Note that d11 <d12である。

[0090] The combined image generating unit 49 corrects the positional deviation of the captured image GA12 by moving the captured image GA12 by a predetermined distance d11 in the Y-axis positive direction on the virtual plane so as to offset the positional deviation. The combined image generating unit 49 also corrects the positional deviation of the captured image GA13 by moving the captured image GA13 by a predetermined distance d12 in the Y-axis positive direction on the virtual plane so as to offset the positional deviation. In this case, in the virtual plane, the position of the reference mark 61b in the captured image GA12 whose positional deviation has been corrected coincides with the reference position 61o in the case where the captured image GA12 has no positional deviation. Similarly, in the virtual plane, the position of the reference mark 61c in the captured image GA13 whose positional deviation has been corrected coincides with the reference position 61o in the case where the captured image GA13 has no positional deviation. The correction of the captured images GA12 and GA13 causes the reference marks 61a, 61b, and 61c to be arranged along the X direction. The positions of the parts Pa, Pb, and Pc of the component P relative to the reference mark 61 in each of the captured images GA11, GA12, and GA13 are constant and do not change. Therefore, the parts Pa, Pb, and Pc of the component P are arranged continuously at both ends in the X direction of each of the captured images GA11, GA12, and GA13 (state C).

[0091] The combined image generating unit 49 generates a combined image GAC1 by combining the captured images GA11, GA12, and GA13 in the positional relationship of the captured images GA11, GA12, and GA13 in state C. The component recognizing unit 50 performs image recognition on the combined image GAC1. Therefore, the component mounting device 1 can reproduce the entire component P that was separated into the captured images GA11, GA12, and GA13 with high accuracy and recognize this component P, thereby improving the recognition accuracy of the component P.

[0092] Fig. 11 is a flowchart showing an example of the operation of the component mounting device 1. When an instruction to start production is received, the component mounting device 1 starts the following process. In Fig. 11, the head unit 23 is also simply referred to as a head. Furthermore, the component holding nozzle 27 is also simply referred to as a nozzle. Furthermore, the reference mark 61 is also simply referred to as a mark.

[0093] The mechanism driving unit 46 transmits an instruction to the head unit 23 to have the moving head 26 pick up and pick up the component P from the pick-up position (S11). The head unit 23 picks up the component P from the pick-up position. The mechanism driving unit 46 starts the forward movement (head movement) in one turn from the time of transmission of step S11, and moves the moving head 26 of the head unit 23 above the component recognition camera 28 while holding the component P (S12).

[0094] Based on information (e.g., mounting information 42, component information 43, mark information 44, imaging timing information 45) and the like stored in the storage unit 41, the camera control unit 48 controls the head unit 23 to illuminate and image the component P held by the component holding nozzle 27 to be imaged and the reference mark 61 adjacent to the component holding nozzle 27 under predetermined illumination conditions (predetermined illumination timing and predetermined illumination intensity) during the movement of the head unit 23 (S13). Then, under the control of the camera control unit 48, the illumination unit 31 (at least one illumination channel) illuminates the component P held by a predetermined component holding nozzle 27 at a light emission timing corresponding to the imaging timing of the component P. Also, under the control of the camera control unit 48, the mark illumination unit 62 illuminates the reference mark 61 corresponding to the component holding nozzle 27 at the same light emission timing. Then, under the control of the camera control unit 48, the component recognition camera 28 images the component P and the reference mark 61 passing above at the imaging timing (S14). In this case, one imaging range CA includes a part of the component P and one reference mark 61.

[0095] The processes of steps S13 and S14 are repeated corresponding to the number of reference marks 61 while the head unit 23 is moving. That is, illumination and imaging are repeated while the reference marks 61 and a part of the component P to be illuminated and imaged are sequentially changed.

[0096] The combined image generating unit 49 recognizes the position of each of the reference marks 61 reflected in each of the captured images GA1 captured in step S14 (S15). The combined image generating unit 49 aligns the captured images GA1 to be combined based on the position of each of the reference marks 61, combines the aligned captured images GA1 to be combined, and generates a combined image GAC1 (S16).

[0097] In step S16, the combined image generating unit 49 may determine a plurality of captured images GA1 to be combined, based on, for example, the mounting order or mounting timing of each component P included in the mounting information 42. The plurality of captured images GA1 to be combined are a plurality of images in which at least a part of the same component P is reflected. The combined image GAC1 based on the plurality of captured images GA1 includes at least the entire component P.

[0098] Furthermore, the multiple captured images GA1 to be combined are arranged so that two captured images GA1 adjacent in time series (in terms of time) are adjacent on the virtual plane (in terms of space) in accordance with the imaging order of the multiple captured images GA1 and the moving direction (e.g., moving direction A) of the head unit 23. This arrangement is performed by the combined image generating unit 49. Then, the combined image generating unit 49 corrects the position of at least one of the multiple captured images GA1 to be combined that are arranged adjacent to each other on the virtual plane, and then generates a combined image GAC1.

[0099] Moreover, the process of step S16 may include the following process.

[0100] For example, the combined image generating unit 49 may recognize the size of the component P that was the imaged target based on the component information 43, and determine the number of captured images GA1 to be combined based on the size of this component P.

[0101] The combined image generating unit 49 may also determine whether or not the entire part P is reflected in one captured image GA1 based on the size of the part P that was the imaging target. When the entire part P is reflected in one captured image GA1, the combined image generating unit 49 may determine not to combine the multiple captured images GA1. When the entire part P is not reflected in one captured image GA1 but a part of the part P is reflected, the combined image generating unit 49 may determine to combine the multiple captured images GA1 to be combined. In this case, the combined image generating unit 49 may compare the size of the part P (e.g., the length of one side of the part P) with the size of the imaging range CA (e.g., the length in the x direction). When the size of the part P is smaller than the size of the imaging range CA, the combined image generating unit 49 may determine not to combine the multiple captured images GA1. When the size of the part P is larger than the size of the imaging range CA, the combined image generating unit 49 may determine to combine the multiple captured images GA1 to be combined.

[0102] For example, the combined image generating unit 49 may determine not to combine multiple captured images GA1 if the size of one side of the part P is 5 mm or less, to combine two captured images GA1 if the size of one side of the part P is 5 to 10 mm, and to combine three captured images GA1 if the size of one side of the part P is 10 to 15 mm. In the example of Fig. 10, the number of captured images to be combined is three.

[0103] The component recognition unit 50 performs image recognition on the generated combined image GAC1 (S17). In this case, the component recognition unit 50 recognizes one or more components P included in the combined image GAC1, and obtains recognition information related to the components P. The recognition information related to the components P here may include, for example, position information and orientation information of the components P, discrimination information on the polarity of the components P, information on the measurement results of the 3D measurement of the components P, information on the recognition results of the external shape of the components P, information on the recognition results of the characters added to the components P, or information on the recognition results of the alignment of the components P. The component recognition unit 50 sends the recognition results of the image recognition to the mechanism driving unit 46.

[0104] Shortly after each component holding nozzle 27 passes above the component recognition camera 28, head unit 23 reaches the vicinity of the mounting position of each component P. Then, mechanism driving unit 46 ends the movement of moving head 26 above the component recognition camera 28 (S18). Based on the recognition result by component recognition unit 50, mechanism driving unit 46 commands moving head 26 of head unit 23 to mount each component P at a predetermined position and attitude on board W. Following the command from mechanism driving unit 46, head unit 23 causes moving head 26 to mount each component P on board W (S19).

[0105] In this way, according to the component mounting device 1 of the present embodiment, the reference marks 61 provided on the head unit 23 are arranged at a predetermined pitch, and a part of the component P can be simultaneously imaged so as to fall within the imaging range CA of the component recognition camera 28 together with the reference marks 61. The head unit 23 may vibrate or shift due to vibration or fluctuation (also simply referred to as vibration or the like) of the moving axis (e.g., the X-axis table mechanism 25, the Y-axis table mechanism 24) along which the head unit 23 moves, causing the head unit 23 to be misaligned with respect to the component recognition camera 28. Even in this case, the reference mark 61 and a part of the component P are included in the same captured image GA, so that the component mounting device 1 can determine the movement state of the reference mark 61 (e.g., the movement amount and movement direction of the reference mark 61 relative to the reference position 61o of the reference mark 61), and can recognize the degree of influence of vibration or the like based on this movement state. Therefore, the component mounting device 1 can correct the position of at least one of the multiple captured images GA to be combined on a virtual plane so as to cancel the influence of vibration or the like, and combine the corrected multiple captured images GA to be combined. Therefore, the component mounting device 1 can reproduce the component P in the combined image GAC with reduced distortion, thereby improving the recognition accuracy of the component P. Also, each process can be carried out while the head unit 23 is moving, improving real-time performance and shortening the time required for component recognition.

[0106] (Modification) In the above-mentioned first embodiment, it has been described that the X-direction scan is performed, but this is not limited thereto. The component mounting device 1 may also perform the Y-direction scan. In the Y-direction scan, the component P and the reference mark 61 are sequentially imaged along the Y direction. In other words, the forward movement in one turn may be performed along the Y direction.

[0107] FIG. 12 is a diagram showing an example of the imaging range CA (CA2) of the component recognition camera 28 and the moving direction of the head unit 23 during scanning in the Y direction.

[0108] In this modification, a plurality of reference marks 61 are arranged in a direction (Y direction) perpendicular to the arrangement direction (X direction) of a plurality of component holding nozzles 27 in the moving head 26. The arrangement of the plurality of reference marks 61 is arranged adjacent to both ends (X-axis positive end and X-axis negative end) of the moving head 26 in the X direction. That is, two mark groups 61g are provided in which a plurality of reference marks 61 are arranged. One mark cylinder 60 may be provided for one reference mark 61, or one mark cylinder 60 may be provided for each mark group 61g including a plurality of reference marks 61. In FIG. 12, a plurality of reference marks 61 are arranged along the Y direction on the lower surfaces of two mark cylinders 60 provided for each mark group 61g.

[0109] Furthermore, the mark interval, which is the interval (distance) between two adjacent reference marks 61, may be shorter than the nozzle interval, which is the interval (distance) between two adjacent component holding nozzles 27 along the Y direction. The two adjacent component holding nozzles 27 here are component holding nozzles 27 in different rows, which are at different positions in the Y direction and the same position in the X direction. Note that, although there are multiple mark intervals here, each mark interval may be equal (for example, about 5 mm). For example, the shape of the reference mark 61 may be circular, and the diameter of the reference mark 61 may be about 1 mm, but the length and shape may be different.

[0110] Of the reference marks 61 arranged in two mark groups 61g1 and 61g2, two reference marks 61 at the same position in the Y direction are captured in the imaging range CA2 captured by the component recognition camera 28. For example, at least one of the arrangement interval of the reference marks 61 in the Y direction, the moving speed of the head unit 23, and the time interval between images captured by the component recognition camera 28 is adjusted so that one reference mark 61 from each of the two mark groups 61g1 and 61g2 is included in one imaging range CA2. Thus, two reference marks 61 are included in the imaging range CA2 captured by the component recognition camera 28 that captures the captured image GA2.

[0111] Therefore, the imaging range CA2 captures one reference mark 61 on each end, and also captures parts of the components P held by eight component holding nozzles 27 in one row that are positioned differently in the X direction but the same in the Y direction. The imaging range CA2 may be formed, for example, in a rectangular shape (e.g., a strip shape). This rectangular shape is long in the X direction and short in the Y direction.

[0112] While the head unit 23 moves along the Y direction, the imaging range CA2 is imaged by the component recognition camera 28. Therefore, the imaging ranges CA2 when images are captured multiple times in time series are aligned in the Y direction.

[0113] In this modified example, head unit 23 moves along the Y direction perpendicular to the X direction in which multiple component holding nozzles 27 are arranged. In Fig. 12, imaging range CA2 captured by component recognition camera 28 is at a spatially fixed position, and components P held by component holding nozzles 27 and reference marks 61 adjacent to these component holding nozzles 27 pass through imaging range CA2 in order. Thus, component recognition camera 28 captures images of components P held by component holding nozzles 27 and reference marks 61 adjacent to these component holding nozzles 27 in the order in which they pass above component recognition camera 28.

[0114] 12, moving head 26 has a plurality of component holding nozzles 27 in two rows, so that images of a portion of component P in the Y direction and reference marks 61 on both sides corresponding to this portion are captured in order from a portion of eight components P held by eight component holding nozzles 27 in a first row arranged on the Y axis positive side (Y axis positive side end) to a portion of eight components P held by eight component holding nozzles 27 in a second row arranged on the X axis negative side (Y axis negative side end). This results in a plurality of captured images GA2.

[0115] FIG. 13 is a diagram showing an example of each captured image GA (GA2) and a combined image GAC (GAC2) during scanning in the Y direction.

[0116] The multiple captured images GA2 captured by Y-direction scanning capture different parts of the components P because they are captured while the head unit 23 is moving. The multiple captured images GA2 are combined so as to include the entire components P (eight components P in this case) held by each of one row of component holding nozzles 27 of the moving head 26. When combined, the multiple captured images GA2 are arranged on a virtual plane. In this case, the multiple captured images GA2 are arranged based on the capturing order of the multiple captured images GA2 and the moving direction B of the head unit 23.

[0117] In FIG. 13, the captured image GA2 captured first in time series is disposed at the tip of the moving direction B (the tip of the arrow, the end on the positive side of the Y axis). The captured image GA2 captured last in time series is disposed at the base of the moving direction B (the base of the arrow, the end on the negative side of the Y axis). The captured images GA2 captured between the first and last in time series are disposed in a row from the tip to the base in the moving direction B in chronological order. Two adjacent captured images GA2 arranged on a virtual plane are disposed adjacent to each other. Note that the captured images GA2 adjacent in the Y direction on the virtual plane may have part of their image ranges overlapping, or may not have part of their image ranges overlapping, and the opposing peripheral edges of the captured images GA2 may be in contact with each other. In other words, the state of each component P held by each component holding nozzle 27 in real space is reproduced in a planar manner by the multiple captured images GA2.

[0118] 13 shows a state where the multiple captured images GA2 arranged on a virtual plane are not displaced from the combined positions or where the displaced positions have already been corrected. For the captured images GA2 among the multiple captured images GA2 where a displaced position has occurred, the displaced position of the captured images GA2 is corrected on the virtual plane by, for example, a method shown in FIG. 14, which will be described later, similar to the method shown in FIG. 10, described above.

[0119] FIG. 14 is a diagram showing an example of generating a combined image GAC2 taking into account the positional deviation of the combined positions of each captured image GA2 during scanning in the Y direction. In FIG. 14, of the two mark groups 61g1 and 61g2, the mark group 61g2 and a component P in the vicinity of the mark group 61g2 are shown, and other parts are omitted from the illustration. In FIG. 14, the positional deviation of the captured image GA2 is mainly corrected by using the reference mark 61 of the mark group 61g2, but the correction is possible by detecting the deviation of one reference mark 61 from the reference position 61o. Therefore, the positional deviation of the captured image GA2 may be corrected by using at least one of the reference mark 61 of the mark group 61g1 and the reference mark 61 of the mark group 61g2.

[0120] 14 illustrates an example in which three captured images GA2 (GA21, GA22, GA23) in which different parts of a component P are captured are used as the multiple captured images GA2 to be combined. Here, it is assumed that the captured image GA21 is obtained by a first capturing, the captured image GA22 is obtained by a second capturing, and the captured image GA23 is obtained by a third capturing. Note that, although the component holding nozzles 27 are arranged in one row on the moving head 26 in FIG. 14, the moving head 26 may have multiple component holding nozzles 27 arranged in multiple rows as in FIGS. 12 and 13.

[0121] The first imaging captures an image GA21 in which a portion Pa (here, the upper end) of the component P and one reference mark 61a are reflected (state A). The second imaging captures an image GA22 in which a portion Pb (here, the center) of the component P and one reference mark 61b are reflected. The third imaging captures an image GA23 in which a portion Pc (here, the right end) of the component P and one reference mark 61c are reflected. The three reference marks 61 imaged each time are the reference marks 61 arranged adjacent to each other in the mark group 61g2.

[0122] Three captured images GA21, GA22, and GA23 are obtained by capturing images three times. However, in two of the captured images GA22 and GA23, a positional shift occurs in the joining position, and there are some parts that are discontinuous when joined. This positional shift occurs, for example, when the position of the head unit 23 relative to the component recognition camera 28 is shifted from the position (reference position) where the head unit 23 should be located relative to the component recognition camera 28 due to some vibration or the like during the operation of the component mounting device 1. In this case, when the three captured images GA21, GA22, and GA23 are arranged adjacent to each other on a virtual plane reflecting the positional relationship in the real space, the reference mark 61b and a part Pb of the component P and the reference mark 61b and a part Pb of the component P are shifted in the X direction. Therefore, the reference marks 61a, 61b, and 61c are not arranged linearly along the Y direction, and the parts Pa, Pb, and Pc of the component P are discontinuous at the image ends (state B).

[0123] That is, the position (center position) of the reference mark 61b reflected in the captured image GA22 has moved and shifted by a predetermined distance d21 (not shown) on the negative X-axis side with respect to the reference position 61o of the reference mark 61b for the captured image GA22. Also, the position (center position) of the reference mark 61c reflected in the captured image GA23 has moved and shifted by a predetermined distance d22 (not shown) on the negative X-axis side with respect to the reference position 61o of the reference mark 61c for the captured image GA23. Note that d21 <d22である。

[0124] The combined image generating unit 49 corrects the positional deviation of the captured image GA22 by moving the captured image GA22 by a predetermined distance d21 in the X-axis positive direction on the virtual plane so as to offset the positional deviation. The combined image generating unit 49 also corrects the positional deviation of the captured image GA23 by moving the captured image GA23 by a predetermined distance d22 in the X-axis positive direction on the virtual plane so as to offset the positional deviation. In this case, in the virtual plane, the position of the reference mark 61b in the captured image GA22 whose positional deviation has been corrected coincides with the reference position 61o in the case where the captured image GA22 has no positional deviation. Similarly, in the virtual plane, the position of the reference mark 61c in the captured image GA23 whose positional deviation has been corrected coincides with the reference position 61o in the case where the captured image GA23 has no positional deviation. The correction of the captured images GA22 and GA23 causes the reference marks 61a, 61b, and 61c to be arranged along the Y direction. The positions of the parts Pa, Pb, and Pc of the component P relative to the reference mark 61 in each of the captured images GA21, GA22, and GA23 are constant and do not change. Therefore, the parts Pa, Pb, and Pc of the component P are continuously arranged at both ends in the Y direction of each of the captured images GA21, GA22, and GA23 (state C).

[0125] The combined image generating unit 49 generates a combined image GAC2 by combining the captured images GA21, GA22, and GA23 in the positional relationship of the captured images GA21, GA22, and GA23 in state C. The component recognizing unit 50 performs image recognition on the combined image GAC2. Therefore, the component mounting device 1 can reproduce the entire component P that was separated into the captured images GA21, GA22, and GA23 with high accuracy and recognize this component P, thereby improving the recognition accuracy of the component P.

[0126] Next, an example of the operation of the component mounting device 1 in this modification is the same as that shown in FIG. 11 described in the first embodiment. However, since the scanning is in the Y direction, the moving direction B of the head unit 23 is parallel to the Y direction, and some of the processing in step S16 is different. In this modification, as the processing in step S16, the combined image generating unit 49 performs position alignment of the captured images GA2 for combining the captured images GA2 based on the positions of the reference marks 61, combines the aligned captured images GA2 to be combined, and generates a combined image GAC2. In this case, as the position alignment of the captured images GA2, a combined image GAC2 may be generated by taking into account the positional deviation of the combined positions of the captured images GA2 during the Y direction scanning shown in FIG. 14.

[0127] Next, the rotational deviation of the captured image GA2 during scanning in the Y direction will be described.

[0128] In this modification, moving head 26 has a large number (e.g., eight) of component holding nozzles 27 arranged along the X direction. As a result, moving head 26 is longer in the X direction than in the Y direction, and is more susceptible to the effects of vibrations and the like (e.g., the effects of deviation in the rotational direction) inside component mounting apparatus 1. In response to this, combined image generating unit 49 may correct the orientation of captured image GA2 on the virtual plane based on two reference marks 61 that are located at the same position in the Y direction near both ends of imaging range CA2, so as to offset the deviation in the rotational direction (rotational deviation) of captured image GA2.

[0129] Fig. 15 is a diagram for explaining the correction of rotational deviation of the captured image GA2 during scanning in the Y direction. Note that Fig. 15 omits the illustration of a plurality of components P located between two reference marks 61 near both ends of the moving head 26. Also, in Fig. 15, the ratio between the X direction and the Y direction of the captured image GA2 is changed in order to easily explain the change in angle, but this is not limiting, and the X direction may be significantly longer than the Y direction.

[0130] For example, it is assumed that a rotational deviation occurs in the predetermined captured image GA2. This rotational deviation occurs, for example, when the position of the head unit 23 relative to the component recognition camera 28 deviates from the position (reference position) where the head unit 23 should be located relative to the component recognition camera 28 due to some vibration or the like during the operation of the component mounting device 1. In this case, two reference marks 61 (61h, 61i) are reflected at both ends of the predetermined captured image GA2 arranged on a virtual plane. If no rotational deviation occurs, the two reference marks 61h, 61i are each arranged at the reference position 61o. In this case, the reference line LO, which is a straight line connecting the two reference marks 61, is a straight line along the X direction. In contrast, if a rotational deviation occurs in the captured image GA2, the detection line L1, which is a straight line connecting the two reference marks 61h, 61i, does not coincide with the reference line LO, but is a straight line inclined by an angle θ with respect to the reference line LO. Therefore, the combined image generating unit 49 detects that the captured image GA2 is rotationally deviated by the angle θ.

[0131] In this case, the combined image generating unit 49 corrects the rotational deviation of the captured image GA2 by rotating the captured image GA2 by −θ on the virtual plane around the center point cp so as to cancel the rotational deviation. The center point cp is the center point of the reference line LO and the center point of the detection line L1, and is the intersection of both lines. If the intersection of both lines is shifted from the center point of the reference line LO and the center point of the detection line L1, it can be determined that a positional deviation has occurred in addition to the rotational deviation. In this case, the combined image generating unit 49 also corrects the positional deviation shown in FIG. 14. The correction of the rotational deviation may be performed on other captured images GA2 to be combined other than the predetermined captured image GA2 as necessary. By correcting the rotational deviation on each captured image GA2 to be combined, each reference mark 61 reflected in each captured image GA2 is arranged along the Y direction at both ends of the X direction in each captured image GA2. The position of each part of the component P relative to the reference mark 61 in each captured image GA2 remains constant without change. Therefore, parts of the components P reflected in each captured image GA2 are arranged continuously at the end of the image along the Y direction.

[0132] The combined image generating unit 49 generates a combined image GAC2 by combining the multiple captured images GA2 to be combined in the positional relationship of the multiple captured images GA2 for which the rotational deviation has been corrected. The component recognizing unit 50 performs image recognition on the combined image GAC2. Therefore, even if a rotational deviation occurs in at least one of the multiple captured images GA2 to be combined, the component mounting device 1 can reproduce the entire component P that was separated into the multiple captured images GA2 with high accuracy and recognize this component P, thereby improving the recognition accuracy of the component P.

[0133] During scanning in the Y direction, the combined image generating unit 49 may correct both the positional deviation and the rotational deviation.

[0134] Note that the component recognition camera 28 used for imaging during X-direction scanning in the first embodiment and the component recognition camera 28 used for imaging during Y-direction scanning in this modification may be the same or different.

[0135] In the above embodiment and modified example, moving head 26 having 2 rows x 8 component holding nozzles 27 has been exemplified, but is not limited to this. For example, moving head 26 may have one row or three or more rows of component holding nozzles 27, and each row may have 8, 12, 14, or 16 component holding nozzles 27.

[0136] In the above embodiment and modified example, the X-direction scan or the Y-direction scan is performed, but both the X-direction scan and the Y-direction scan may be performed in combination. Therefore, the position and orientation of the captured image GA arranged on the virtual plane may be corrected based on at least one of the positional deviation in the X direction, the positional deviation in the Y direction, and the rotational deviation of the captured image GA.

[0137] As described above, the component mounting device 1 of the above embodiment includes the head unit 23 (an example of a head and a component mounting unit), the mechanism driving unit 46 (an example of a movement control unit), the component recognition camera 28 (an example of an imaging unit), the combined image generating unit 49 (an example of an image generating unit), and the component recognition unit 50. The head unit 23 has a plurality of component holding nozzles 27 (an example of a nozzle) arranged along the X direction (an example of a first direction), and a plurality of reference marks 61 (an example of a mark) arranged along the X direction or the second direction, which is the Y direction perpendicular to the X direction, facing at least one of the plurality of component holding nozzles 27. The mechanism driving unit 46 moves the head unit 23 along the second direction. During the movement of the head unit 23, the component recognition camera 28 sequentially captures images of the component P and the reference mark 61 from below, with an imaging range CA including a part of the component P held by the component holding nozzle 27 and one of the plurality of reference marks 61 arranged along the second direction. The combined image generating unit 49 recognizes the position of a reference mark 61 included in the multiple captured images GA captured sequentially, corrects the positional relationship of the multiple captured images GA when combined based on the position of the reference mark 61, and combines the multiple captured images GA to generate a combined image GAC. The component recognizing unit 50 recognizes the component P based on the combined image GAC. The head unit 23 mounts the component P on the board W using the moving head 26 based on the recognition result by the component recognizing unit 50. Note that the positional relationship of the multiple captured images GA when combined may include a relative positional deviation of the multiple captured images GA, or a relative deviation in the rotational direction (rotational deviation) of the multiple captured images GA, etc.

[0138] As a result, even if the size of the component P is larger than the size of the imaging range CA and the entire component P cannot be accommodated in the imaging range CA, the component mounting device 1 can accommodate the entire component P in the combined image GAC by combining the multiple captured images GA to generate a combined image GAC. At this time, the component mounting device 1 can generate a combined image GAC with reduced distortion even if vibration or the like occurs in the component mounting device 1 by correcting the positional relationship when combining the multiple captured images GA using the reference mark 61 as a reference. Therefore, even if a component recognition camera 28 with a narrow imaging range CA is used, the component mounting device 1 can suppress a decrease in the recognition accuracy of the component P by recognizing the component based on the combined image GAC with reduced distortion. In addition, the component mounting device 1 can improve the degree of freedom in selecting a camera to be adopted as the component recognition camera 28.

[0139] Furthermore, the combined image generating section 49 may arrange the multiple captured images GA on a virtual plane based on the imaging order in which the multiple captured images GA were captured and the moving direction of the head unit 23. The combined image generating section 49 may correct the position of at least one captured image GA on the virtual plane based on the positions of the reference marks 61 in the multiple captured images GA.

[0140] As a result, the component mounting device 1 can derive a combined image GAC with reduced distortion by correcting the positional deviation. Therefore, the component mounting device 1 can improve the recognition accuracy of the components P by performing image recognition on the combined image GAC. For example, during scanning in the X direction, the component mounting device 1 can detect and correct the positional deviation of the captured image GA along the Y direction using the reference mark 61 as a reference. Furthermore, the component mounting device 1 can sequentially perform component recognition in the order in which the components P are lined up in the X direction in which the components P are mainly arranged.

[0141] The second direction may be the X direction. The head unit 23 may have a plurality of component holding nozzles 27 arranged along the X direction, and arranged in a plurality of rows in the Y direction perpendicular to the X direction. Furthermore, a plurality of reference marks 61 may be arranged along the X direction between two adjacent rows. The imaging range CA may include a portion of each of a plurality of components P held by a plurality of component holding nozzles 27 in the plurality of rows at the same position in the X direction.

[0142] This allows the component mounting device 1 to perform X-direction scanning in response to a multi-row head unit 23 such as 2×8. Also, a captured image GA including parts of multiple components P in different rows can be obtained, and positional deviation of the captured image GA can be corrected using the reference mark 61 as a reference. Also, multiple components P in different rows that are at the same position in the X direction can be recognized collectively at the same time as recognition targets without providing a reference mark 61 for each row.

[0143] Moreover, the second direction may be the Y direction. The imaging range CA may include a portion of each of the multiple components P held by the multiple component holding nozzles 27 arranged along the X direction.

[0144] As a result, during scanning in the Y direction, the component mounting device 1 can detect and correct positional deviation of the captured image GA along the X direction with reference to the fiducial mark 61. Furthermore, the X direction is the main arrangement direction of the component holding nozzles 27, and although one captured image GA contains a large number of components P, many components P can be recognized at the same time as recognition targets.

[0145] Furthermore, the multiple reference marks 61 may be included in a mark group 61g1 (an example of a first mark group) or a mark group 61g2 (an example of a second mark group). The mark group 61g1 may be arranged along the Y direction at one end of the head unit 23 in the X direction. The mark group 61g2 may be arranged along the Y direction at the other end of the head unit 23 in the X direction. The imaging range CA may include one each of a first mark included in the mark group 61g1 and a second mark included in the mark group 61g2. The combined image generating unit 49 may recognize the positions of the first mark and the second mark included in the multiple captured images GA. The combined image generating unit 49 may correct the positional relationship when the multiple captured images GA are combined based on at least one of the positions of the first mark and the second mark.

[0146] This allows the component mounting device 1 to correct, for example, misalignment by using at least one of the two marks in the mark groups 61g1, 61g2 at both ends that are included in the captured image GA corresponding to the imaging range CA and that are located at the same position in the Y direction. Therefore, even if the component mounting device 1 cannot recognize the reference mark 61 on one side for some reason, it is highly likely that the component mounting device 1 can correct the misalignment.

[0147] Furthermore, the combined image generating section 49 may arrange the multiple captured images GA on a virtual plane based on the imaging order in which the multiple captured images GA were captured and the moving direction of the head unit 23. The combined image generating section 49 may correct the orientation of at least one captured image on the virtual plane based on the position of the first mark and the position of the second mark.

[0148] In the X direction, which is the main arrangement direction of the component holding nozzles 27, the length of the head unit 23 is long, and therefore the head unit 23 is particularly susceptible to the effects of vibrations and the like. Even in this case, the component mounting device 1 can correct the rotational deviation of the captured image GA in which the two reference marks 61 are reflected, based on the positional relationship of the two reference marks 61, by providing the reference marks 61 at both ends of the head unit 23 in the arrangement direction of the component holding nozzles 27. Therefore, the component mounting device 1 can generate a combined image GAC taking the rotational deviation into account, and can improve the recognition accuracy of the components P.

[0149] Furthermore, the combined image generating unit 49 may obtain information on the size of the part P, and determine whether or not to combine the multiple captured images GA based on the size of the part P and the size of the imaging range CA. When it is determined that the multiple captured images GA are to be combined, the combined image generating unit 49 may generate a combined image GAC.

[0150] As a result, the component mounting device 1 can generate a combined image GAC and perform component recognition based on the combined image GAC only when the component size is relatively large. On the other hand, when the component size is relatively small, the component mounting device 1 can eliminate the need to generate the combined image GAC by including the entire component P in the captured image GA. Therefore, the component mounting device 1 can reduce the processing load associated with generating the combined image GAC and the time required to recognize the component P. Even in this case, the component mounting device 1 can perform component recognition based on a single captured image GA in which the entire component P is captured.

[0151] Furthermore, the combined image generating unit 49 may obtain information on the size of the part P and determine the number of captured images to be combined based on the size of the part P. The combined image generating unit 49 may generate a combined image GAC by combining the determined number of captured images GA, which are a plurality of captured images GA captured sequentially.

[0152] As a result, the component mounting device 1 can adjust the number of combinations of the captured images GA to be larger as the size of the component P increases, and to be smaller as the size of the component P decreases, so that the entire component P is reliably accommodated within the combined image GAC. Therefore, the component mounting device 1 can improve the recognition accuracy of the component P and reduce the processing load when generating the combined image GAC as much as possible.

[0153] Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, corrections, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also belong to the technical scope of the present disclosure. In addition, the components in the above-mentioned embodiments may be arbitrarily combined within the scope of the invention. [Industrial Applicability]

[0154] The present disclosure is useful for a component mounting device and a component mounting method that can suppress a decrease in the recognition accuracy of an electronic component when imaging a moving electronic component even if the entire electronic component does not fit within the imaging range of the imaging unit. [Explanation of symbols]

[0155] 1 Component placement device 10 Main body mechanism section 11 Mounting machine body 12 Foundation 13 Substrate transport mechanism 14 Conveyor section 15 Parts supply mechanism 16 Feeder Base 17 Slots 18 Tape Feeder 19 Feeder Cart 20 Bogie section 21 Reel 22 Carrier Tape 23 Head Unit 24 Y-axis table mechanism 25 X-axis table mechanism 26 Moving Head 27 Part holding nozzle 28 Parts Recognition Camera 29 Image sensor section 30 Case 31 Lighting unit section 32 Case 33 Reflection lighting section 34 Transillumination unit 35 Side lighting section 36 Circuit Board Recognition Camera 37 Disposal Box 38 Nozzle holder 39 Coaxial lighting section 40 Control section 41 Storage section 42 Implementation Information 43 Parts Information 44 Mark Information 45 Imaging timing information 46 Mechanism drive unit 47 Imaging processing section 48 Camera control unit 50 Parts Recognition Unit 60 Mark Tube 61 Reference Mark 62 Mark Illumination Section 71 Lens 72 Image sensor 101 The first wavelength of light 102 Second Wavelength Light B Shielding plate C Reflector CA, CA1, CA2 imaging range GA, GA1, GA2 captured images GAC,GAC1,GAC2 combined image P parts W substrate

Claims

1. a head having a plurality of nozzles arranged along a first direction and a plurality of marks arranged opposite at least one of the plurality of nozzles along a second direction that is parallel to the first direction or perpendicular to the first direction; a movement control unit that moves the head along the second direction; an imaging unit that captures images of a part of a component held by the nozzle and only one of the multiple marks arranged along the second direction in an imaging range during movement of the head, successively capturing images of the component and the mark from below; an image generating unit that recognizes a position of the mark included in a plurality of captured images sequentially captured by the imaging unit, corrects a positional relationship of the plurality of captured images when combined based on the position of the mark, and combines the plurality of captured images to generate a combined image; a component recognition unit that recognizes the component based on the combined image; a component mounting unit that mounts the components on a board using the head based on a recognition result by the component recognition unit; A component mounting device comprising:

2. The image generating unit includes: arranging the plurality of captured images on a virtual plane based on an imaging order in which the plurality of captured images are captured by the imaging unit and a moving direction of the head; correcting a position of at least one captured image on the virtual plane based on positions of the marks in the plurality of captured images; 2. The component mounting apparatus according to claim 1.

3. the second direction is parallel to the first direction, the head has a plurality of nozzles arranged along a first direction and arranged in a plurality of rows in a direction perpendicular to the first direction, The marks are arranged along the first direction between two adjacent rows, the imaging range includes a portion of each of a plurality of components held by a plurality of nozzles arranged in a plurality of rows at the same position in the first direction, and the only one mark; 3. The component mounting device according to claim 1 or 2.

4. the second direction is perpendicular to the first direction, the imaging range includes a portion of each of the plurality of components held by the plurality of nozzles arranged along the first direction; 3. The component mounting device according to claim 1 or 2.

5. The image generating unit includes: Obtaining size information of the part; determining whether or not to combine the plurality of captured images based on a size of the component and a size of the imaging range; If it is determined that the plurality of captured images are to be combined, the combined image is generated. The component mounting device according to any one of claims 1 to 4.

6. The image generating unit includes: Obtaining size information of the part; determining the number of captured images to be combined based on the size of the part; Combining the determined number of captured images, which are the plurality of captured images captured sequentially, to generate the combined image. The component mounting device according to any one of claims 1 to 5.

7. a step of moving a head having a plurality of nozzles arranged along a first direction and a plurality of marks arranged along a second direction that is parallel to the first direction or perpendicular to the first direction and facing at least one of the plurality of nozzles, along the second direction; a step of sequentially capturing images of a part of a component held by the nozzle and only one of the plurality of marks arranged along the second direction from below while the head is moving, the part and the mark being included in an imaging range; Recognizing the position of the mark included in a plurality of captured images that are sequentially captured; correcting a positional relationship when combining the plurality of captured images based on the positions of the marks, and combining the plurality of captured images to generate a combined image; recognizing the part based on the combined image; and mounting the component on a board with the head based on the component recognition result.

Images