Substrate preparation equipment, film deposition system

Abstract

To provide a substrate conveyance carrier capable of holding a substrate which is deposited on a surface inside of a vacuum chamber, without contaminating the surface, conveying the substrate between the vacuum chamber and an external field, and also easily removing the substrate.SOLUTION: A substrate conveyance carrier 20 holds a substrate 70 where a thin film is formed on a front face inside of a vacuum chamber and is handled when moving the substrate to the inside / outside of the vacuum chamber. The substrate conveyance carrier comprises: a support plate 45 which becomes a non-flexible and plate-shaped member; a communication path 50 which is formed in the support plate 45 and of which one end is opened on a support face and another end is opened at an external field side; and an adhesive part 35 which is provided while enclosing the communication path 50 on the support face of the support plate 45. A space which is enclosed by the adhesive part 35 and between the support face of the support plate 45 and a rear face of the substrate 70 becomes a pressure space 60 in which a positive pressure or a negative pressure is introduced via the communication path 50.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a substrate transport carrier that holds a substrate on which a thin film is formed in a vacuum chamber and is handled when moving the substrate in and out of the vacuum chamber, a substrate preparation device that includes the substrate transport carrier, and a film formation system. [Background technology]

[0002] In modern society, optical thin films have become essential for many products, and are used in products closely related to our daily lives, such as camera lenses in smartphones, touch panels, pickup lenses for DVDs and Blu-rays (registered trademarks), etc. In particular, multilayer films of oxide dielectrics, nitride dielectrics, etc. are widely used as optical thin film filters, such as light reflecting films, anti-reflection films, enhanced reflection films, and cut filters for light in specific wavelength ranges.

[0003] The multilayer film is formed on the surface of a glass substrate with a thickness of, for example, 1.0 mm or less. Specifically, the film is formed on the glass substrate in a vacuum chamber using techniques such as electron beam deposition or sputtering.

[0004] A glass substrate, with its rear surface protected by a substrate protector, is sometimes carried into and fixed in a vacuum chamber (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2019-44237 Summary of the Invention [Problem to be solved by the invention]

[0006] The process of attaching and removing the substrate protector to the glass substrate relies on manual labor, which results in the glass substrate being damaged or its surface being contaminated due to human error, making it difficult to increase productivity.

[0007] In view of the above-described situation, the present invention aims to provide a substrate transport carrier that can hold a substrate having a film formed on its surface in a vacuum chamber without contaminating the surface, can be transported between the vacuum chamber and the outside world, and can also easily remove the substrate, as well as a substrate preparation device and a film formation system that are equipped with the substrate transport carrier. [Means for solving the problem]

[0008] The present invention is a substrate transport carrier that holds a substrate having a thin film formed on its surface within a vacuum chamber and is handled when moving the substrate in and out of the vacuum chamber, comprising a support plate which is a non-flexible, plate-like member arranged on the back side of the substrate and has a support surface facing the back side, a communicating passage formed in the support plate and having one end opening to the support surface and the other end opening to the outside world, and an adhesive portion provided on the support surface of the support plate in a state surrounding the communicating passage and which adheres freely to the back side of the substrate, the substrate transport carrier being characterized in that the space between the support surface of the support plate and the back side of the substrate and surrounded by the adhesive portion becomes a pressure space into which positive pressure or negative pressure is introduced via the communicating passage.

[0009] The above invention has an effect that the use of a support plate, which is a non-flexible plate-like member, enables the substrate to be reliably fixed on the support plate of the substrate transport carrier when the substrate is transported. Furthermore, the provision of an adhesive portion allows the substrate to be repeatedly attached to and detached from the substrate transport carrier, which contributes to cost reduction. Furthermore, since the substrate has a communication passage that opens at a position surrounded by the adhesive portion, the substrate can be assisted in adhesion and separation between the adhesive portion and the substrate by introducing positive or negative pressure into the pressure space. Furthermore, for example, when the substrate is loaded on the substrate transport carrier and transported into a vacuum chamber and depressurized, the pressure space is also depressurized at the same time, so that the substrate is less likely to be subjected to stress.

[0010] In relation to the above-mentioned substrate transport carrier, it may be characterized in that the pressure space is formed by the adhesive portion being protruded relative to the support surface of the support plate, or by a portion of the support surface of the support plate being displaced in a direction away from the back surface of the substrate.

[0011] In relation to the above-mentioned substrate transport carrier, the outer contour shape of the adhesive portion is located inward in the planar direction from the contour of the substrate, and a gap is formed between the vicinity of the peripheral edge of the back surface of the substrate and the support plate.

[0012] According to the above invention, there is an excellent effect that, when a substrate is handled, placed or removed by a robot hand on a substrate transport carrier, it becomes easy to hook part of the gripping portion of the robot hand into a gap on the back surface of the substrate to securely grip it.

[0013] In relation to the above-mentioned substrate transport carrier, it can be characterized in that the gap is formed by the adhesive portion being protruded relative to the support surface of the support plate, or by a portion of the support surface of the support plate being displaced in a direction away from the back surface of the substrate.

[0014] The substrate transport carrier may be characterized in that, in plan view, the periphery of the support plate is positioned outwardly of the periphery of the substrate.

[0015] According to the above invention, the possibility of damaging the substrate due to collision with the surroundings when the support plate is transported is reduced, thereby providing the excellent effect of protecting the peripheral edge of the substrate.

[0016] In relation to the above-mentioned substrate transport carrier, a plurality of the adhesive portions are provided independently of one another on a single support plate, the support plate has a plurality of the communicating passages corresponding to the plurality of the adhesive portions, and a plurality of the substrates are held by the plurality of the adhesive portions.

[0017] According to the above invention, a large number of substrates can be handled with a small number of substrate transport carriers, which has the excellent effect of increasing productivity.

[0018] The substrate transport carrier may further include a spacer that is provided on the support surface of the support plate and protrudes from the inside of the adhesive portion, and that abuts against the rear surface of the substrate.

[0019] According to the above invention, when the space formed by the substrate, the adhesive portion, and the support surface of the support plate is reduced in pressure, the possibility of the substrate bending is reduced, thereby achieving the excellent effect of increasing the adhesion between the substrate and the adhesive portion and preventing damage to the substrate itself.

[0020] The present invention provides a substrate preparation device that places and / or removes a substrate from a substrate transport carrier that holds a substrate having a thin film formed on its surface in a vacuum chamber, the substrate preparation device being characterized in comprising: the substrate transport carrier described in any one of the above; and a pressure adjustment device that introduces positive pressure or negative pressure, via the communicating passage, into the pressure space in the substrate transport carrier on which the substrate is placed.

[0021] According to the above-mentioned invention, for example, by reducing the pressure in the pressure space, the adhesive force of the substrate in contact with the adhesive portion can be increased, and the possibility of the substrate falling off during substrate transportation and film formation can be reduced. Also, for example, by introducing a positive pressure into the pressure space, the substrate can be easily detached from the adhesive portion of the support plate of the substrate transport carrier.

[0022] In relation to the above-mentioned substrate preparation device, the positive pressure may be set to a level such that the substrate and the entire surface of the adhesive portion are not peeled off by the positive pressure alone.

[0023] According to the above invention, it is possible to obtain the excellent effect of reducing the possibility that the substrate will peel off from the adhesive portion due to the positive pressure from the pressure adjusting device alone, causing the substrate to fall off the substrate transport carrier and be damaged.

[0024] In relation to the above-mentioned substrate preparation device, it may also be characterized in that it is equipped with a substrate transfer device having a gripping portion for gripping the peripheral edge of the substrate and an arm portion for moving the gripping portion, and the substrate transfer device grips the peripheral edge of the substrate before thin film formation with the gripping portion, and transfers the substrate by the arm portion to a position where the back surface of the substrate abuts the adhesive portion of the substrate transport carrier.

[0025] According to the above-mentioned invention, it is possible to perform film formation without manually handling the substrate, which is an excellent effect.

[0026] In relation to the above-mentioned substrate preparation device, the negative pressure may be introduced into the communication passage after the back surface of the substrate is brought into contact with the adhesive portion of the substrate transport carrier by the substrate transfer device.

[0027] According to the above invention, the substrate is placed in an appropriate position on the support plate and then strongly attracted to the adhesive portion, thereby providing the excellent effect of preventing the substrate from being fixed in an incorrect position and possibly falling off.

[0028] In relation to the above-mentioned substrate preparation device, it may also be characterized in that it is provided with a substrate transfer device having a gripping portion for gripping the peripheral edge of the substrate and an arm portion for moving the gripping portion, and the substrate transfer device grips the peripheral edge of the substrate held by the substrate transport carrier and uses the arm portion to separate the substrate from the adhesive portion.

[0029] According to the above-mentioned invention, it is possible to obtain an excellent effect of making it possible to prepare a substrate for film formation without manual operations.

[0030] The above-mentioned substrate preparation device may be characterized in that the arm portion separates the substrate from the adhesive portion while the positive pressure is being introduced into the pressure space.

[0031] According to the above invention, since the substrate can be detached from the substrate transport carrier without manual labor, it has an excellent effect of improving productivity and yield.

[0032] In relation to the above-mentioned substrate preparation device, a control device may be provided that determines whether or not the substrate has been detached from the adhesive portion based on at least one of a pressure change in the pressure space, a displacement change in the arm portion, and a load change acting on the substrate transfer device, and the control device may be characterized in that the control device terminates the introduction of the positive pressure by the pressure adjustment device based on the determination that the substrate has been detached from the adhesive portion. According to the above-mentioned invention, it is possible to automatically control the pressure.

[0033] The present invention is a film formation system for forming a thin film on a surface of a substrate in a vacuum chamber, comprising: a substrate preparation device as described above; a vacuum chamber for vacuum film formation; and a carrier transfer device for transferring the substrate transport carrier holding the substrate from the substrate preparation device into the vacuum chamber.

[0034] According to the above-mentioned invention, vacuum film formation on a substrate can be performed without manual operations from preparation to removal after film formation, and therefore, there is an excellent effect of improving productivity and yield. Effect of the Invention

[0035] According to the present invention, it is possible to obtain an excellent effect of improving productivity and yield by appropriately preparing a substrate for vacuum film formation. [Brief description of the drawings]

[0036] [Figure 1] 1 is a plan view of a film forming system according to an embodiment of the present invention. [Diagram 2] FIG. 1A is a plan view of a substrate transport carrier used in the film formation system, FIG. 1B is a cross-sectional view taken along line BB in FIG. 1A, and FIG. [Diagram 3] 3A and 3B are partial cross-sectional views showing a manner in which a substrate is transferred by a supply-side substrate transfer device used in the film formation system. [Figure 4] 13(A) and 13(B) are partial cross-sectional views showing a substrate transfer mode by a retrieval-side substrate transfer device used in the film formation system. [Diagram 5] 11 is an enlarged partial cross-sectional view showing a manner in which a substrate is held by a supply-side or recovery-side substrate transfer device. FIG. [Figure 6] 13A and 13B are cross-sectional views showing a substrate transport carrier and a supply-side suction mechanism in a substrate supply area of ​​the film formation system. [Figure 7] 13(A) and 13(B) are cross-sectional views showing the control manner of a supply-side suction mechanism and a supply-side substrate transfer device in the substrate supply region. [Figure 8] 13A and 13B are cross-sectional views showing a substrate transport carrier and a recovery-side discharge mechanism in a substrate recovery area of ​​the film formation system. [Figure 9] 13A and 13B are cross-sectional views showing the control manner of the recovery-side discharge mechanism and the recovery-side substrate transfer device in the substrate recovery area. [Figure 10]13A and 13B are cross-sectional views showing the control manner of the recovery-side discharge mechanism and the recovery-side substrate transfer device in the substrate recovery area. [Figure 11] 13A and 13B are control timing charts for the recovery-side discharge mechanism and the recovery-side substrate transfer device. [Figure 12] 2 is a partial cross-sectional view showing a carrier detachment mechanism and a turntable in a vacuum chamber of the film formation system. FIG. [Figure 13] 4 is a flowchart of a film formation procedure using the film formation system. [Figure 14] FIG. 2 is a plan view of the film formation system for explaining a film formation procedure. [Figure 15] FIG. 2 is a plan view of the film formation system for explaining a film formation procedure. [Figure 16] FIG. 2 is a plan view of the film formation system for explaining a film formation procedure. [Figure 17] FIG. 2 is a plan view of the film formation system for explaining a film formation procedure. [Figure 18] FIG. 13 is a plan view showing a modified example of the substrate transport carrier. [Figure 19] 13 is a cross-sectional view showing a modified example of the recovery-side discharge mechanism and the supply-side suction mechanism. FIG. [Figure 20] 1A is a plan view showing a modified example of the substrate transport carrier, and FIG. 1B is a cross-sectional view taken along the line BB in FIG. [Figure 21] 13 is a partial cross-sectional view showing a modified example of the gripping portion of the supply-side or removal-side substrate transfer device. FIG. [Figure 22] 1A shows a modified example of the substrate transport carrier, and FIG. 1B is a cross-sectional view taken along line BB in FIG. 1A. FIG. 1C is a cross-sectional view taken along line CC in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0037] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

[0038] 1 to 6 show an example of an embodiment of the invention, and in the drawings, parts with the same reference numerals represent the same objects. In each drawing, some configurations are omitted as appropriate to simplify the drawings. In addition, the size, shape, thickness, etc. of the members are appropriately exaggerated.

[0039] <Overall composition>

[0040] 1, a film formation system 1 according to an embodiment of the present invention includes a vacuum chamber 15 for vacuum film formation, a substrate preparation device 5, a carrier transfer device 10 for transferring a substrate transport carrier 20 from the substrate preparation device 5 into the vacuum chamber 15, and a carrier attachment / detachment device 120 for attaching and detaching the substrate transport carrier 20 to and from a turntable 25 in the vacuum chamber 15. In this embodiment, the mechanism for rotating the substrate transport carrier 20 is called a turntable, but it may also be called a rotating drum.

[0041] The substrate preparation device 5 includes a carrier circulation device 130, a recovery side carrier stocker 130A, a supply side carrier stocker 130B, a standby carrier stocker 130C, a recovery side substrate transfer device 37, a supply side substrate transfer device 38, a recovery side discharge mechanism 147, a supply side suction mechanism 148, a substrate recovery table 157, a substrate supply table 158, a pressure reducing pump 80, a compressor 90, etc. The pressure reducing pump 80 and the compressor 90 are a type of pressure adjustment device, and play a role in assisting adhesion and detachment of the substrate 70.

[0042] The carrier circulation device 130 moves in a circulating manner the multiple substrate transport carriers 20 that are unloaded from the vacuum chamber 15 via the carrier transfer device 10. Here, the carrier circulation device 130 transports the substrate transport carriers 20 along a circular circulation path J. The carrier circulation device 130 also sends the substrate transport carriers 20 into the vacuum chamber 15 in order.

[0043] On the circulation path J, a recovery side carrier stocker 130A, a standby carrier stocker 130C, and a supply side carrier stocker 130B are arranged in this order. The recovery side carrier stocker 130A is a magazine rack that temporarily stores a plurality of substrate transport carriers 20 that are carried out from the vacuum chamber 15 via the carrier transfer device 10. The substrate transport carriers 20 stored in the recovery side carrier stocker 130A are transferred one by one to the substrate recovery area R by the carrier circulation device 130. The standby carrier stocker 130C is a magazine rack that temporarily stores a plurality of substrate transport carriers 20 that are transferred from the substrate recovery area R by the carrier circulation device 130. The substrate transport carriers 20 stored in the standby carrier stocker 130C are transferred one by one to the substrate supply area S by the carrier circulation device 130. The supply side carrier stocker 130B is a magazine rack that temporarily stores a plurality of substrate transport carriers 20 that are transferred from the substrate supply area S by the carrier circulation device 130.

[0044] A substrate recovery area R and a substrate supply area S are provided along the circulation path J. A recovery-side discharge mechanism 147 is disposed in the substrate recovery area R, and a supply-side suction mechanism 148 is disposed in the substrate supply area S. The positive pressure of a compressor 90, which serves as a type of pressure adjustment device, is supplied to the recovery-side discharge mechanism 147. The negative pressure of a pressure reduction pump 80, which serves as a type of pressure adjustment device, is introduced into the supply-side suction mechanism 148.

[0045] The recovery-side substrate transfer device 37 removes the substrate 70 after the thin film has been formed from the substrate transport carrier 20 positioned on the recovery-side discharge mechanism 147, and transfers it to the substrate recovery table 157. The supply-side substrate transfer device 38 removes the substrate 70 before the thin film has been formed, which is stocked on the substrate supply table 158, and transfers it to the substrate transport carrier 20 positioned on the supply-side suction mechanism 148.

[0046] The substrate preparation device 5 is equipped with a control device (not shown). This control device controls the pressure reducing pump 80, the compressor 90, the removal-side substrate transfer device 37, and the supply-side substrate transfer device 38. The control device is comprised of a CPU, RAM, ROM, etc., and executes various controls. The CPU is a so-called central processing unit, and executes various programs to realize various functions. The RAM is used as a working area and storage area for the CPU, and the ROM stores the operating system and programs executed by the CPU.

[0047] The vacuum chamber 15 is a space in which a thin film is formed on the substrate 70, and includes a material supply unit (not shown) that generates a thin film material, a vacuum pump (not shown) that creates a negative pressure inside the vacuum chamber 15, and the like. A turntable 25 disposed inside the vacuum chamber 15 rotates while holding a plurality of (eight in this case) substrate transport carriers 20, thereby enabling a film to be formed uniformly on the substrate 70. The carrier attachment / detachment device 120 grips the substrate transport carrier 20 brought into the vacuum chamber 15 by the carrier transfer device 10, transports it to the turntable 25 and mounts it thereon, or grips the substrate transport carrier 20 mounted on the turntable 25 and transports it to the carrier transfer device 10.

[0048] <Substrate transport carrier>

[0049] As shown in Figure 2, the substrate transport carrier 20 has a support plate 45 which is a plate-shaped member, an adhesive portion 35 arranged on the surface (support surface 47) side of the support plate 45, and a connecting passage 50 formed in the support plate 45.

[0050] The support plate 45 is made of a highly rigid material such as metal or engineering plastic, and is therefore non-flexible. The support plate 45 is preferably made of a metal material having a thickness of 2.0 mm or more, more preferably 3.0 mm or more, and even more preferably 5.0 mm or more. A support surface 47 corresponding to the front surface of the support plate 45 faces the rear surface of the substrate 70. The communication passage 50 formed in the support plate 45 has an opening 50A on one end side facing the support surface 47, and an opening 50B on the other end facing the rear surface. A plurality of communication passages 50 are provided for a single substrate transport carrier 20. Each communication passage 50 corresponds to each of the plurality of substrates 70. In this embodiment, eight communication passages 50 corresponding to eight substrates 70 are formed. A plurality of communication passages 50 can also be provided for one substrate 70. In this embodiment, the case where the other end opening 50B of the communication passage 50 opens on the rear surface of the support plate 45 is illustrated, but it can also open to another location such as a side surface. Further, although the support plate 45 holds a plurality of substrates 70 in this example, it may hold a single substrate 70.

[0051] The outer shape (periphery) of the support plate 45 is located outside in the planar direction of the outer shapes of the multiple substrates 70 to be placed thereon. In other words, when the support plate 45 is viewed in a plan view, the size of the support plate 45 is larger than the substrates 70. As a result, when the support plate 45 is handled by the carrier attachment / detachment device 120 described later, it is possible to prevent the carrier attachment / detachment device 120 and the substrates 70 from coming into contact with each other and being damaged.

[0052] The adhesive portion 35 is provided in a convex shape on the support surface 47 of the support plate 45, and is detachably (repeatedly) attached to the back surface 79 of the substrate 70. The adhesive portion 35 is arranged so as to surround the one end opening 50A of the communication passage 50 corresponding to each substrate 70. As a result, a gap is formed between the back surface 79 of the substrate 70 and the support surface 47, forming a pressure space 60. When a positive pressure is introduced into this pressure space 60, an external force acts in a direction in which the substrate 70 and the support surface 47 move away from each other, and when a negative pressure is introduced into the pressure space 60, an external force acts in a direction in which the substrate 70 and the support surface 47 move closer to each other. The height of the gap in the pressure space 60 (the distance between the support surface 47 and the back surface 79) is preferably 0.1 mm or more, and more preferably 0.2 mm or more. As will be described later, as long as a negative pressure can be applied to the back surface of the substrate 70, it is not necessary for the adhesive portion 35 to be completely annular and surround the one end opening 50A. The opening 50A at one end of the communication passage 50 has a shape smaller than the inner contour shape of the adhesive portion .

[0053] The outer contour shape of the adhesive portion 35 is located inside in the planar direction of the contour of the outermost periphery of the substrate 70. As a result, a gap 40 is formed between the vicinity of the periphery of the rear surface 79 of the substrate 70 and the support plate 45 (see FIG. 5).

[0054] The adhesive portion 35 is selected from a sheet that can be repeatedly adhered to the substrate 70. The shear adhesive strength of the surface (upper surface) of the adhesive portion 35 is, for example, preferably 0.5 N / cm2 or more, and more preferably 1.0 N / cm2 or more. If the adhesive strength is smaller than this, there is a risk of the substrate 70 peeling off due to the centrifugal force acting on the substrate 70 when the substrate transport carrier 20 is rotated in the vacuum chamber 15. On the other hand, the shear adhesive strength of the adhesive portion 35 is, for example, preferably 10.0 N / cm2 or less, more preferably 5.0 N / cm2 or less, and more preferably 2.0 N / cm2 or less. If the adhesive strength is larger than this, there is a risk of the substrate 70 being damaged when the substrate 70 is separated from the substrate transport carrier 20 after film formation. The adhesive portion 35 may be a so-called double-sided tape.

[0055] Also, the adhesive portion 35 is made of a sheet material having a thickness of 1.0 mm or less, for example, a sheet material having a thickness of 0.5 mm or less, and a sheet material having a thickness of 0.2 mm or less. In this embodiment, the thickness of the sheet material of the adhesive portion 35 is the same as the height of the gap 40, so if this height is too large, the coating material is likely to get into the gap 40. In other words, it can be said that it is preferable that the adhesive portion 35 is thin. It is preferable that the adhesive portion 35 is made of a sheet material having a thickness of 0.1 mm or more. If the gap 40 is too small, the distance for attracting the substrate 70 to the support surface 47 side to bring the substrate 70 and the adhesive portion 35 into close contact is insufficient.

[0056] <Supply side substrate transfer device>

[0057] FIG. 3(A) shows the supply-side substrate transfer device 38. The supply-side substrate transfer device 38 has an arm unit 97 and a gripper unit 95. The arm unit 97 moves the gripper unit 95 in the planar direction of the substrate 70 (the XY plane direction in the figure) and in the vertical direction (the Z direction in the figure). The gripper unit 95 is a so-called chuck, and at least one of a pair of fingers 95A is moved in the opening and closing direction by a linear guide 95B. As a result, the pair of fingers 95A grip the substrate 70 while contacting the periphery of the substrate 70. It is preferable that a claw 95C that wraps around the back side of the substrate 70 is formed at the tip of the pair of fingers 95A. Here, the gripping force of the substrate 70 by the fingers 95A can be adjusted by a spring 96. If the gripping force is too strong, the substrate 70 will be damaged.

[0058] Supply-side substrate transfer device 38 grips substrate 70 stocked on substrate supply table 158 with gripper 95, and as shown in Fig. 3(B), moves to substrate transport carrier 20 with arm 97 until rear surface 79 of substrate 70 abuts against adhesive portion 35 of substrate transport carrier 20. Thereafter, gripper 95 is released, completing the supply of substrate 70. Supply-side substrate transfer device 38 may be a robot hand.

[0059] <Recovery side substrate transfer device>

[0060] 4(A) shows the retrieval-side substrate transfer device 37. The retrieval-side substrate transfer device 37 has an arm unit 97 and a gripper unit 95. Since the structure of the retrieval-side substrate transfer device 37 is similar to that of the supply-side substrate transfer device 38, the parts and members are given the same reference numerals in the figure, and individual explanations are omitted.

[0061] The retrieval-side substrate transfer device 37 grips the periphery of the substrate 70 held by the adhesive portion 35 of the substrate transport carrier 20 with the gripping portion 95, and peels the substrate 70 from the adhesive portion 35 by rising, and moves to the substrate retrieval table 157 by the arm portion 97 as shown in Fig. 4(B). Thereafter, the gripping portion 95 is released, thereby completing the retrieval of the substrate 70. The retrieval-side substrate transfer device 37 may be a robot hand.

[0062] In addition, in the present embodiment, the case where the recovery side substrate transfer device 37 and the supply side substrate transfer device 38 are separately provided is illustrated, but one substrate transfer device can also function as both the recovery side and the supply side. Furthermore, in the present embodiment, the case where the substrate recovery area R and the substrate supply area S are separately provided is illustrated, but one area can also function as both the substrate recovery area R and the substrate supply area S.

[0063] 5 shows the positional relationship between the claws 95C of the fingers 95A of the removal-side substrate transfer device 37 and the supply-side substrate transfer device 38 and the gap 40 formed between the periphery of the back surface 79 of the substrate 70 and the support plate 45. The height (dimension in the Z direction in the figure) of the gap 40 formed by the thickness of the adhesive portion 35 is defined as H1, and the width (dimension in the X or Y direction in the figure) of the gap 40 formed by the dimensional difference between the outer edge of the substrate 70 and the outer edge of the adhesive portion 35 is defined as W1. In addition, in the fingers 95A, the protrusion amount (dimension in the X or Y direction in the figure) of the claws 95C toward the substrate 70 side with respect to the gripping surface 95D that abuts against the outer edge of the substrate 70 is defined as W2, and the protrusion amount (dimension in the Z direction in the figure) of the claws 95C downward from the lower end of the gripping surface 95D is defined as H2. The above-mentioned defined dimensions satisfy the following relationship.

[0064] H1>H2 and / or W1>W2

[0065] By doing this, when supplying and retrieving the substrate 70 to and from the substrate transport carrier 20, it is possible to avoid the fingers 95A and the claws 95C interfering with the support plate 45, and the claws 95C wrapping around the back surface 79 of the substrate 70 interfering with the adhesive portion 35.

[0066] <Supply side suction mechanism>

[0067] 6(A) shows the relationship between the supply-side suction mechanism 148 in the substrate supply region S and the substrate transport carrier 20 positioned thereby. For ease of explanation, a state is shown in which a substrate 70 before film formation is temporarily adhered to the adhesive portion 35 of the substrate transport carrier 20. "Temporarily adhered" means a state in which the substrate 70 is placed on the adhesive portion 35 by the supply-side substrate transfer device 38.

[0068] The supply side suction mechanism 148 has a carrier fixing part 150, a connection pad 152, a pressure supply path 158, a switching valve 154, and a relative movement mechanism 156. The carrier fixing part 150 serves as a chuck that holds the support plate 45 of the substrate transport carrier 20 transported to the substrate supply region S. This fixes the attitude of the substrate transport carrier 20. Note that the method of fixing the support plate 45 by the carrier fixing part 150 is not limited to a chuck structure, and various fixing methods such as an air suction structure or a magnetic attraction structure can be used.

[0069] The connecting pad 152 is disposed on the rear surface side of the support plate 45 of the substrate transport carrier 20. The relative movement mechanism 156 moves the connecting pad 152 toward and away from the rear surface of the substrate 70. In this embodiment, an air cylinder, a solenoid, or the like is adopted as the relative movement mechanism 156, and the connecting pad 152 is structured to move up and down. Here, a case where the connecting pad 152 side moves up and down is exemplified, but the substrate transport carrier 20 side may also move up and down. When the other end opening 50B of the communication passage 50 is opened on the side surface of the support plate 45, the connecting pad 152 is disposed on the side surface of the support plate 45. The connecting pad 152 is moved toward and away from the side surface of the support plate 45 by the relative movement mechanism 156.

[0070] The relative movement mechanism 156 moves an abutment surface 152C corresponding to the upper surface of the connecting pad 152 toward or away from the rear surface of the support plate 45. Also, the connecting pad 152 is formed with guide holes 152A corresponding to each of the communication paths 50 of the support plate 45. Ring seals 152B are disposed on the abutment surface 152C so as to surround each of the guide holes 152A.

[0071] A pressure guide path 158 that guides the negative pressure of the pressure reducing pump 80 is connected to each guide hole 152A of the connecting pad 152. A switching valve 154 is disposed in the pressure guide path 158 corresponding to each guide hole 152A. The switching valve 154 can switch ON / OFF of the supply of negative pressure to each guide hole 152A.

[0072] As shown in FIG. 6B, after the substrate transport carrier 20 is fixed by the carrier fixing part 150, the connecting pad 152 is raised by the relative movement mechanism 156, and the contact surface 152C approaches the back surface of the substrate 70, and each guide hole 152A and each communication path 50 are connected. At this time, the ring seal 152B is crushed so that the negative pressure does not leak from the connection boundary between the two. After that, when the switching valve 154 is turned ON, the negative pressure of the decompression pump 80 is supplied to the pressure guide path 158. As a result, the pressure space 60 surrounded by the back surface 79 of the substrate 70, the inner edge of the adhesive part 35, and the support surface 47 of the support plate 45 becomes negative pressure. As a result, the substrate 50 is pressed against the adhesive part 35 in the direction of the arrow K by the surrounding atmospheric pressure, and the substrate 50 and the adhesive part 35 are firmly bonded. In other words, the adhesive force acting between the substrate 50 and the adhesive part 35 can be increased.

[0073] 2, when the support plate 45 is viewed in a plan view, the area of ​​the pressure space 60 formed in each substrate 70 is preferably set to be equal to or greater than the area of ​​the adhesive portion 35. Since the area of ​​the pressure space 60 is the area to which negative pressure or positive pressure is applied to the substrate 70, by increasing the ratio of this area, a large external force (suction force or repulsion force) can be generated on the substrate 70. This leads to the absolute value of the negative pressure or positive pressure to be supplied being set small.

[0074] <Control of the supply side suction mechanism and supply side substrate transfer device>

[0075] As shown in FIG. 7(A), in a state where the substrate transport carrier 20 is fixed by the carrier fixing part 150, the supply side substrate transfer device 38 lowers the substrate 70 and places it on the substrate transport carrier 20. At this time, it is preferable to abut the connection pad 152 against the substrate transport carrier 20 in advance. Meanwhile, during the descent of the substrate 70, the negative pressure supply to the communication passage 50 corresponding to the intended mounting position is turned off. If the negative pressure supply is turned on, the substrate 70 may be sucked downward during the descent of the substrate 70, causing the substrate 70 to lose its posture or be damaged. In addition, since the substrate 70 can be strongly attracted to the adhesive part 35 after being placed in an appropriate position relative to the support plate 45, the substrate 70 can be prevented from being fixed in an incorrect position.

[0076] 7(B), while the substrate 70 and the adhesive portion 35 are in contact (temporary adhesion) by the supply-side substrate transfer device 38, the supply-side suction mechanism 148 turns on the negative pressure supply. As a result, the pressure force K can be applied uniformly by atmospheric pressure, so that the adhesive portion 35 and the substrate 70 can be firmly adhered (mainly adhered). The adhesive force (holding force) of the adhesive portion 35 to the substrate 70 is controlled to a level that resists the centrifugal force acting on the substrate 70 due to the rotation of the turntable 25.

[0077] The timing for switching ON the negative pressure supply by the supply-side suction mechanism 148 is preferably after the substrate 70 comes into contact with the adhesive portion 35, and further preferably while the gripping portion 95 is holding the substrate 70, and more preferably after the gripping portion 95 has released the substrate 70. For example, although not shown, when the substrate 70 is brought into close contact with the adhesive portion 35 from the side with the substrate transport carrier 20 in an upright position, if the gripping portion 95 is released before the negative pressure is supplied, there is a possibility that the substrate 70 will come off the adhesive portion 35 due to its own weight, and therefore it is desirable to start the negative pressure supply while the gripping portion 95 is holding the substrate 70.

[0078] On the other hand, in the substrate transport carrier 20, it is preferable to turn off the negative pressure supply to the communication passages 50 corresponding to the adhesive portions 35 when the substrate 70 is not placed thereon. If the negative pressure supply to the communication passages 50 when no substrate 70 is placed thereon is turned on, the negative pressure may leak out from the communication passages 50, causing a decrease in the negative pressure in other pressure spaces 60. As a result, in the substrate transport carrier 20, the substrate 70 can be supplied even if some of the adhesive portions 35 and communication passages 50 are unused.

[0079] <Recovery side discharge mechanism>

[0080] 8(A) shows the relationship between the recovery-side discharge mechanism 147 in the substrate recovery region R and the substrate transport carrier 20 positioned therewith. For ease of explanation, an example is shown in which the substrate 70 after film formation is permanently adhered to the adhesive portion 35 of the substrate transport carrier 20. "Perfectly adhered" means that the substrate 70 is firmly adhered to the adhesive portion 35 by the application of negative pressure by the supply-side suction mechanism 148.

[0081] The recovery-side discharge mechanism 147 has a carrier fixing portion 150, a connection pad 152, a pressure supply path 158, a switching valve 154, and a relative movement mechanism 156. Note that the structure of the recovery-side discharge mechanism 147 is similar to that of the supply-side suction mechanism 148, except for the relationship in which negative pressure and positive pressure are reversed, and therefore the reference numerals of both parts and members are the same in the drawings, and individual explanations will be omitted.

[0082] The positive pressure of the compressor 90 is guided to each guide hole 152A of the connecting pad 152 via a pressure guide path 158. A switching valve 154 provided in the pressure guide path 158 can switch the supply of positive pressure to each guide hole 152A between ON and OFF.

[0083] As shown in FIG. 8B, when the connecting pad 152 is raised by the relative movement mechanism 156 while the substrate transport carrier 20 is fixed by the carrier fixing part 150, the contact surface 152C approaches the back surface of the substrate 70, and each guide hole 152A and each communication passage 50 are connected. After that, when the switching valve 154 is turned ON, the positive pressure of the compressor 90 is supplied to the pressure guide path 158. As a result, the pressure space 60 surrounded by the back surface of the substrate 70, the inner edge of the adhesive part 35, and the support surface 47 of the support plate 45 becomes positive pressure. As a result, the substrate 70 is pushed up in the direction of the arrow L against the surrounding atmospheric pressure, so that the substrate 70 and the adhesive part 35 try to separate from each other. In other words, the adhesive force between the substrate 70 and the adhesive part 35 is weakened. It is preferable that this positive pressure is set to a level where the entire surface of the substrate 70 and the adhesive part 35 are not peeled off by the positive pressure alone. That is, the retrieval substrate transfer device 37 and the retrieval-side discharge mechanism 147 work together to set the substrate 70 to a level at which it can be peeled off from the adhesive portion 35. The holding force of the substrate transport carrier 20 by the carrier fixing portion 150 is adjusted to a level at which the posture of the substrate transport carrier 20 is not disturbed even when the connecting pad 152 is pressed against it.

[0084] <Control of the discharge mechanism on the recovery side and the substrate transfer device on the recovery side>

[0085] 9(A), before the retrieval substrate transfer device 37 grips the substrate 70 of the substrate transport carrier 20, the substrate transport carrier 20 is fixed by the carrier fixing part 150. At this time, it is preferable to abut the connection pad 152 against the substrate transport carrier 20. In addition, the positive pressure supply to the communication passage 50 of the substrate 70 to be gripped is turned OFF. If the positive pressure supply is turned ON before the substrate 70 is gripped by the gripping part 95, there is a risk that the substrate 70 will peel off from the adhesive part 35 due to the positive pressure alone and move to an unexpected location if the adhesive strength of the adhesive part 95 has decreased due to repeated use.

[0086] 9(B), when the retrieval-side substrate transfer device 37 has completed gripping of the substrate 70, the positive pressure supply by the retrieval-side discharge mechanism 147 is turned ON. As a result of the positive pressure being introduced into the pressure space 60, a uniform upward force L acts on the substrate 70 while the attitude of the substrate 70 remains stable due to the gripping portion 95.

[0087] Thereafter, as shown in FIG. 10(A), the retrieval-side substrate transfer device 37 raises the gripping portion 95. At the start of the rise, as shown in an enlarged view in FIG. 10(B), both a force (arrow D) that lifts the vicinity of the periphery of the substrate 70 upward by the gripping portion 95 and a pushing-up force L acting on the pressure space 60 side act simultaneously, so that the substrate 70 can be peeled off from the adhesive portion 35 while suppressing warping of the periphery of the substrate 70. As a result, damage to the substrate 70 during peeling can be suppressed. The lifting force D by the gripping portion 95 is generated by the frictional force between the gripping surface 95D and the periphery of the substrate 70 and the engagement state between the claws 95C and the substrate 70.

[0088] 10(A), it is preferable to turn off the supply of positive pressure to the adhesive portions 35 and the communicating paths 50 of the substrate transport carrier 20 when the substrate 70 is not placed thereon. If the supply of positive pressure to the communicating paths 50 when no substrate is placed thereon is turned on, the positive pressure may leak out of the communicating paths 50, lowering the positive pressure level of other pressure spaces 60. This control makes it possible to form a film on the substrate 70 in the substrate transport carrier 20 while leaving some of the adhesive portions 35 and communicating paths 50 unused.

[0089] Fig. 11 shows a control timing chart of the recovery side discharge mechanism 147 and the recovery side substrate transfer device 37. As shown in Fig. 11(A), when the positive pressure supply by the recovery side discharge mechanism 147 is turned ON at timing Ts, a pressure P1 higher than atmospheric pressure P0 is applied to the pressure space 60. Simultaneously with the start of positive pressure application or at timing Tu a predetermined time later, the recovery side substrate transfer device 37 raises the gripper 95 (substrate 70). The raising speed is set appropriately, but is preferably set to 10 mm / sec or less, and more preferably 5 mm / sec or less, for example. While the substrate 70 and the adhesive portion 35 are in close contact with each other, the substrate 70 is prevented from rising, and the rising load (load torque) of the retrieval-side substrate transfer device 37 increases. However, when the substrate 70 and the adhesive portion 35 gradually peel off and the pressure space 60 is opened to the atmosphere (see the dotted arrow in FIG. 10(A)), the rising load (load torque) suddenly decreases, and the rising speed of the substrate 70 naturally increases rapidly. At the same time, the pressure in the pressure space 60 suddenly decreases and returns to atmospheric pressure P0. Thereafter, at the timing Tf when the amount of rise of the gripping portion 95 reaches the threshold value M, it is determined that the peeling of the substrate 70 from the adhesive portion 35 is completed, and the positive pressure supply by the retrieval-side discharge mechanism 147 is turned off. Regarding the setting of the moving speed of the gripping portion 95 (substrate 70) by the retrieval-side substrate transfer device 37, the rising speed in the early stage of the rise can be set low, and the rising speed in the latter stage can be set high. Furthermore, the rising speed may be changed before and after the peeling determination described below, and the rising speed before the peeling determination can be set low and the rising speed after the peeling determination can be set high.

[0090] As shown in FIG. 11B, even if the retrieval-side substrate transfer device 37 attempts to lift the gripper 95 (substrate 70) at timing Tu, the lift of the gripper 95 may stop midway and not reach the threshold value M. This is because the adhesive force of the adhesive portion 95 is greater than the lifting force of the retrieval-side substrate transfer device 37 (this value is set in advance so that the substrate 70 is not damaged). Therefore, when the present control device determines that the amount of lift does not reach the threshold value M at timing Ta after a predetermined time has elapsed from timing Tu, it determines that the substrate 70 cannot be peeled off from the adhesive portion 35, and raises the positive pressure level by the retrieval-side discharge mechanism 147 to P2. As a result, the pushing-up force L acting on the substrate 70 increases, so that the substrate 70 and the adhesive portion 35 gradually begin to peel off. When the pressure space 60 is opened to the atmosphere, the lifting speed of the substrate 70 increases rapidly, and at the same time, the pressure in the pressure space 60 drops rapidly and returns to atmospheric pressure P0. As a result, at the timing Tf when the amount of lift of the gripper 95 reaches the threshold value M, it is determined (judged) that the peeling of the substrate 70 from the adhesive portion 35 is completed, and the positive pressure supply by the recovery side discharge mechanism 147 is turned off. In any control, if the amount of lift of the gripper 95 does not reach the threshold value M even after a preset time has elapsed, it is preferable to issue an alarm by sound, light, or vibration. In this case, the substrate 70 is peeled off manually by an operator. In this case, the timing of turning off the positive pressure supply is exemplified as follows: the peeling completion is judged by the amount of lift of the gripper 95; however, the positive pressure supply may be turned off by detecting a sudden drop in pressure in the pressure space with a pressure sensor. In addition, the peeling completion may be judged by detecting a sudden drop in the load (load torque) of the recovery side substrate transfer device 37, and the positive pressure supply may be turned off.

[0091] Although not specifically shown here, it is preferable to provide a vibration detection mechanism in the retrieval-side substrate transfer device 37 or the retrieval-side discharge mechanism 147. For example, in the retrieval-side substrate transfer device 37, the vibration detection mechanism can be provided in the gripper 95 or the arm 97. Vibrations may also be detected from minute vibration components included in the amount of movement of the gripper 95 or the arm 97, or from a sudden load change acting on the gripper 95 or the arm 97. The load change can be detected from a force sensor, a control current, a control voltage, a control power, or the like. This vibration detection mechanism makes it possible to determine whether the substrate 70 has been damaged during peeling.

[0092] <Carrier removal device>

[0093] 12, the carrier mounting / removing device 120 in the vacuum chamber 15 has an arm section 127 and a gripper 125. The arm section 127 moves the gripper 125 in the planar direction (XY plane direction in the figure) and in the vertical direction (Z direction in the figure) of the substrate transport carrier 20 being loaded, and also swings the gripper 125 around the Y axis in the figure. The gripper 125 is a so-called chuck, and a pair of fingers 125A grip the periphery of the support plate 45 of the substrate transport carrier 20. As already mentioned, the size of the support plate 45 is larger than the substrate 70, so that contact between the fingers 125A and the substrate 70 is avoided when the support plate 45 is handled by the fingers 125A.

[0094] The carrier attachment / detachment device 120 grips the substrate transport carrier 20 before film formation, which is carried into the vacuum chamber 15 by the carrier transfer device 10, with the gripping section 125, and then sets the substrate transport carrier 20 upright with the arm section 127 on the turntable 25. After film formation is completed, the substrate transport carrier 20 in the upright state set on the turntable 25 is gripped with the gripping section 125, and transferred to the carrier transfer device 10 while rotating the substrate transport carrier 20 to a horizontal state with the arm section 127.

[0095] It is preferable that the communication passage 50 of the substrate transport carrier 20 set on the turntable 25 communicates with the pressure space of the vacuum chamber 15. When the vacuum chamber 15 is depressurized, the pressure space 60 on the back side of the substrate 70 becomes positive pressure, which can prevent the substrate 70 from being separated from the adhesive portion 35 due to a decrease in adhesion between the substrate 70 and the adhesive portion 35.

[0096] In this embodiment, the substrate transport carrier 20 is fixed to the turntable 25 with the substrate 70 standing vertically, but the substrate 70 may be fixed to the turntable 25 with the substrate 70 lying horizontally. Also, in this embodiment, the substrate transport carrier 20 is horizontally loaded by the carrier moving device 10, but the substrate transport carrier 20 may be loaded in an upright position.

[0097] Next, referring to Fig. 13 onwards, an overall flow of a film formation procedure using the film formation system 1 will be shown. Note that Fig. 13 is a flowchart. For convenience of explanation, in Fig. 14 onwards, the substrate 70 after completion of film formation is coloured black.

[0098] First, in the state shown in Figure 14, eight substrate transport carriers 20 on which film formation has been completed are removed from the vacuum chamber 15 by the carrier removal and attachment device 120 and the carrier transfer device 10, and are stored in the recovery side carrier stocker 130A on the circulation path J of the carrier circulation device 130.

[0099] 15, the carrier circulation device 130 moves the substrate transport carriers 20 in the recovery side carrier stocker 130A one by one to the substrate recovery area R. In the substrate recovery area R, the substrates 70 of the substrate transport carriers 20 are detached from the adhesive portions 35 using the recovery side discharge mechanism 147 and the substrate transfer device 37, and are recovered onto the substrate recovery table 157. When recovery of all the substrates 70 of a particular substrate transport carrier 20 is completed, the carrier circulation device 130 moves that substrate transport carrier 20 to the standby carrier stocker 130C. At the same time, the next substrate transport carrier 20 is carried into the substrate recovery area R from the recovery side carrier stocker 130A.

[0100] Meanwhile, the carrier circulation device 130 moves the substrate transport carriers 20 without substrates loaded thereon, which are stocked in the standby carrier stocker 130C, one by one to the substrate supply area S. In the substrate supply area S of the substrate preparation device 5, the substrates 70 loaded on the substrate supply table 158 are placed on the adhesive portions 35 of the substrate transport carriers 20 for temporary adhesion, and are adhesively fixed (mainly adhered) by reducing the pressure in the pressure space 60 using the decompression pump 80 of the supply side suction mechanism 148 (S1).

[0101] In the substrate supply area S, when all the substrates 70 are adhesively fixed to a specific substrate transport carrier 20, the substrate transport carrier 20 is moved downstream by the carrier circulation device 130 and stocked in the supply carrier stocker 130B. At the same time, the next substrate transport carrier 20 is carried into the substrate supply area S from the standby carrier stocker 130C. Therefore, in the substrate supply area S, the substrate 70 to be stocked on the substrate supply table 158 is placed on the adhesive portion 35 of the next substrate transport carrier 20 and adhesively fixed (S1). By repeating this process, as shown in FIG. 16, the substrates 70 with film formation on the multiple substrate transport carriers 20 (eight substrates in this case) are collected, and at the same time, multiple substrate transport carriers 20 with a total of 64 substrates 70 without film formation adhesively fixed thereto (eight substrates in this case) are stocked in the supply carrier stocker 130B.

[0102] 17, the carrier circulation device 130 sequentially sends out the substrate transport carriers 20 holding the unformed substrates 70 from the supply side carrier stocker 130B to the carrier transfer device 10. The carrier transfer device 10 and the carrier attachment / detachment device 120 sequentially set the eight substrate transport carriers 20 on the turntable 25 of the vacuum chamber 15 (S2). At the same time, the substrate transport carriers 20 on which the film formation has been completed in the vacuum chamber 15 are also discharged to the carrier circulation device 130 via the carrier transfer device 10 and the carrier attachment / detachment device 120. When all the substrate transport carriers 20 have been loaded into the vacuum chamber 15, the state shown in FIG. 14 is reached.

[0103] 14, a film is formed on the surface of the substrate 70 while rotating the turntable 25 in the vacuum chamber 15 (S3). The film formation method is not particularly limited, but for example, a film is formed using a technique such as electron beam evaporation or sputtering. During this film formation process, the substrate 70 on the substrate transport carrier 20 on which film formation has been completed is collected, and the next substrate 70 on which film has not yet been formed is fixed to the substrate transport carrier 20 and stored in the supply side carrier stocker 130B according to the procedure shown in FIGS. 15 and 16.

[0104] 17, when the film formation in the vacuum chamber 15 is completed, the substrate transport carrier 20 on which the film formation in the vacuum chamber 15 has been completed is discharged to the carrier circulation device 130 of the substrate preparation device 5 via the carrier transfer device 10 and the carrier attachment / detachment device 120 (S4), and is stored in the recovery side carrier stocker 130A. At the same time, the substrate transport carrier 20 to which the substrate 70 on which the film has not yet been formed is adhesively fixed is supplied from the supply side carrier stocker 130B, and is set in sequence on the turntable 25 of the vacuum chamber 15 (S2). As a result, the state shown in FIG. 14 is obtained.

[0105] 15, the carrier circulation device 130 moves the substrate transport carriers 20 in the recovery side carrier stocker 130A one by one to the substrate recovery area R. In the substrate recovery area R, the substrates 70 of the substrate transport carriers 20 are removed from the adhesive portions 35 using the recovery side discharge mechanism 147 and the recovery side substrate transfer device 37 and are recovered onto the substrate recovery table 157 (S5). When recovery of the substrates 70 of the substrate transport carriers 20 is completed, the carrier circulation device 130 moves and stocks the substrate transport carriers 20 in the standby carrier stocker 130C.

[0106] According to the substrate transport carrier 20 of the embodiment of the present invention, a support plate 45 which is a non-flexible plate-shaped member is used. Therefore, when the substrate 70 is adhered to the adhesive portion 35 or peeled off from the adhesive portion 35 by the recovery side discharge mechanism 147 or the supply side suction mechanism 148, the support plate 45 does not deform, and the substrate 70 can be reliably fixed and peeled off.

[0107] Furthermore, when attaching the substrate 70 to the adhesive portion 35 of the support plate 45, instead of pressing it manually, the substrate 70 and the adhesive portion 35 are brought into close contact with each other by the pressure difference with the atmospheric pressure caused by applying a negative pressure to the pressure space 60, so that a stable adhesive state can always be created. In other words, human error in attaching the substrate 70 can be avoided.

[0108] Furthermore, when peeling the substrate 70 from the adhesive portion 35 of the support plate 45, the peeling of the substrate 70 can be assisted by introducing positive pressure into the pressure space 60, making it easier to peel the substrate 70 and reducing damage to the substrate 70 during peeling.

[0109] In particular, according to the present substrate preparation device 5, the positive pressure by the compressor 90 is appropriately controlled, thereby preventing the substrate 70 from peeling off from the adhesive portion 35 due to the positive pressure alone. As a result, it is possible to prevent the substrate 70 from falling off the substrate transport carrier 20 and being damaged.

[0110] Furthermore, in the film formation system 1 of this embodiment, the application of positive and negative pressure to the pressure space 60 by the substrate preparation device 5 and the cooperation of the grippers 95 of the recovery side substrate transfer device 37 and the supply side substrate transfer device 38 can automate the attachment and removal of the substrate 70 from the substrate transport carrier 20. Furthermore, by handling the substrate transport carrier 20 side with the carrier attachment / detachment device 120, the loading and unloading into the vacuum chamber 15 can also be automated. As a result, there is an advantage in that the entire film formation process can be automated.

[0111] At this time, in the substrate transport carrier 20, the adhesive portion 35 is provided in a convex shape relative to the support surface 47 of the support plate 45, and is further disposed inward in the planar direction relative to the periphery of the substrate 70. As a result, contact with the support plate 45 and the adhesive portion 35 is avoided when the substrate 70 is handled by the gripping portion 95 of the recovery-side substrate transfer device 37 or the supply-side substrate transfer device 38. In particular, it becomes easy to reliably grip the substrate 70 by engaging the claw 95C with the rear surface 79 of the substrate 70.

[0112] Furthermore, according to the present substrate transport carrier 20, the support plate 45 protrudes outward beyond the substrate 70, which reduces the possibility of damaging the substrate 70 when the carrier attachment / detachment device 120 handles the support plate 45. In other words, the support plate 45 can serve as a part to be handled in the carrier attachment / detachment device 120.

[0113] Furthermore, according to this substrate transport carrier 20, the distance of the gap 40 formed between the support plate 45 and the rear surface 79 of the substrate is minimized, thereby simultaneously suppressing the film formation material from flowing around to the rear surface 79 during film formation.

[0114] Furthermore, according to the present substrate transport carrier 20, a single substrate transport carrier 20 can handle a large number of substrates 70, so that productivity can be increased dramatically. Although the example shown here is one in which a single substrate transport carrier 20 holds eight substrates 70, it is preferable for the single substrate transport carrier 20 to hold, for example, four or more substrates 70, preferably eight or more substrates, and more preferably ten or more substrates. On the other hand, a single support plate 45 may hold a single substrate 70.

[0115] In addition, in the present embodiment, the adhesive portion 35 is provided in a rectangular ring shape, but the ring shape of the adhesive portion 35 may be various shapes such as a circle or an ellipse. The adhesive portion 35 is not limited to a completely ring shape. For example, as shown in FIG. 18, the adhesive portion 35 may surround the communication hole 50, but may have a part of the ring open. This is because even if the pressure space 60 is connected to the atmosphere to some extent, the pressure space 60 can be controlled to a positive pressure or a negative pressure by the ventilation resistance.

[0116] Furthermore, in this embodiment, the recovery-side discharge mechanism 147 and the supply-side suction mechanism 148 are provided separately, but the present invention is not limited to this. For example, as shown in Fig. 19, if both the decompression pump 80 and the compressor 90 are connected to the pressure supply path 158 and a selection valve 155 is used to selectively supply positive pressure and negative pressure, a single device can function as both the recovery-side discharge mechanism 147 and the supply-side suction mechanism 148.

[0117] 20, which is a modified example of this embodiment, it is also preferable to provide a spacer 200 that abuts against or is close to the back surface 79 of the substrate 70 on the inside of the adhesive portion 35 on the support surface 47 of the support plate 45. The height (thickness) of this spacer 200 is set to be the same as or smaller than that of the adhesive portion 35. In this way, as shown in FIG. 20(B), it is possible to prevent the vicinity of the center of the substrate 70 from bending toward the pressure space 60 when the pressure space 60 is made negative pressure.

[0118] Furthermore, in the present embodiment, the case where the metal or resin finger 95A of the gripping portion 95 directly contacts and grips the substrate 70 has been illustrated, but the present invention is not limited to this. For example, as shown in FIG. 21, it is preferable to provide the finger 95A with an elastically deformable contact body 95E, and to grip the substrate 70 by contacting the side edge of the substrate 70. In this way, the contact body 95E can grip the substrate 70 while deforming due to contact pressure, so that chipping of the substrate 70 can be suppressed. Furthermore, the elastic deformation of the contact body 95E allows a part of the contact body 95E to move around to the back side of the substrate 70, so that the contact body 95E can also play a role as an alternative to the claw 95C.

[0119] In addition, in this embodiment, the substrate 70 is a flat plate, but the present invention is not limited to this and can be applied to a substrate 70 having a curved surface. Furthermore, the thickness of the substrate 70 is not limited to being uniform overall, and the substrate 70 may have a variable thickness. Furthermore, the material of the substrate 70 is not limited to glass, and various materials such as resin and silicon wafer can be used.

[0120] Furthermore, in this embodiment, the adhesive portion 35 is provided on the support plate 45 in a protruding manner, and the height of the pressure space 60 is secured mainly by the thickness of the adhesive portion 35, but the present invention is not limited thereto. For example, as shown in FIG. 22, a chamber recess 700 may be formed in the space surrounded by the adhesive portion 35 on the support surface 47 of the support plate 45, and the height of the pressure space 60 may be secured by a gap between the bottom surface (support surface 47) of the chamber recess 700 and the back surface 79 of the substrate 70. In this way, even if the thickness of the adhesive sheet of the adhesive portion 35 is thinned to, for example, 0.8 mm or less (or even 0.2 mm or less), the height of the pressure space 60 can be secured to 0.1 mm or more. It is preferable that the outer edge of the chamber recess 700 is close to the inner edge of the adhesive portion 35 (for example, within 5 mm), and more preferably, the outer edge of the chamber recess 700 and the inner edge of the adhesive portion 35 are aligned with each other. The area of ​​the support surface 47 where the chamber recess 700 is not formed can function as a spacer 200 .

[0121] In addition, in this embodiment, the case where the gap 40 is formed near the periphery of the back surface 79 of the substrate 70 by the thickness of the adhesive portion 35 is exemplified, but the present invention is not limited thereto. For example, as shown in FIG. 22, in a region of the support surface 47 corresponding to the periphery of the back surface 79 of the substrate 70, a partial retreat recess 720 may be formed along the periphery, and the height of the gap 40 may be secured between the bottom surface (support surface 47) of the retreat recess 720 and the back surface 79. In this way, even if the thickness of the adhesive sheet of the adhesive portion 35 is thinned to, for example, 0.8 mm or less (even 0.2 mm or less), the height of the gap 40 can be secured to 0.5 mm or more, preferably 1.0 mm or more. As shown in FIG. 22(C), if the tip of the finger 95A of the gripping portion 95 is moved along the retreat recess 720 to grip the substrate 70, interference between the finger 95A and the support surface 47 can be suppressed. In addition, since the height of the gap 40 can be further reduced in the portion other than the refuge recess 720, it is possible to suppress the film forming material from flowing around to the rear surface 79. Note that the refuge recess 720 is preferably formed so as to straddle the outer edge of the substrate 70 from the inside to the outside.

[0122] Incidentally, the substrate transport carrier, substrate preparation apparatus, and film formation system of the present invention are not limited to the above-described embodiments, and it goes without saying that various modifications can be made within the scope of the gist of the present invention. [Explanation of symbols]

[0123] 1. Film deposition system 5 Board preparation equipment 10 Carrier transport device 15 Vacuum Chamber 20 Substrate transport carrier 25 Turntable 35 Adhesive part 37 Removal side substrate transfer device 38 Supply side substrate transfer device 40 Gap 45 Support Plate 50 communication path 60 Pressure Space 70 Substrate 80 Pressure reducing pump 90 Compressor 95 Gripping part 97 Arm section

Claims

1. A substrate preparation device that places and / or removes a substrate on a substrate transport carrier that holds a substrate on a surface of which a thin film is formed in a vacuum chamber, the substrate preparation device comprising: The substrate transport carrier includes: a support plate, which is a non-flexible plate-like member disposed on the rear surface side of the substrate and has a support surface facing the rear surface; a communication passage formed in the support plate, the communication passage having one end opening to the support surface and the other end opening to an outside environment; an adhesive portion provided on the support surface of the support plate in a state surrounding the communication passage and removably adhered to the back surface of the substrate; a space between the support surface of the support plate and the back surface of the substrate and surrounded by the adhesive portion serves as a pressure space into which positive pressure or negative pressure is introduced via the communication passage; an outer contour shape of the adhesive portion is located inward in a planar direction relative to a contour of the substrate, so that a gap of 0.1 mm or more is formed between a vicinity of a peripheral edge of the rear surface of the substrate and the support plate; The substrate preparation device further includes: a pressure adjusting device that introduces a positive pressure or a negative pressure into the pressure space in the substrate transport carrier on which the substrate is placed, via the communication passage; a substrate transfer device having a gripping part that grips a periphery of the substrate and an arm part that moves the gripping part; The substrate transfer device is characterized in that when the substrate transfer device uses the gripping portion to grip the peripheral edge of the substrate before thin film formation, and uses the arm portion to transfer the substrate to a position where the back surface of the substrate abuts the adhesive portion of the substrate transport carrier, the gap prevents interference between the gripping portion and the substrate transport carrier.

2. The gripping portion is provided with a claw that wraps around the back side of the substrate, and the claw enters the gap to engage with the back side of the substrate. The substrate preparation apparatus according to claim 1 .

3. the adhesive portion of the substrate transport carrier has an opening portion in which a part of a ring surrounding the communication passage is opened, When the pressure regulating device introduces negative pressure into the pressure space, the negative pressure in the pressure space is adjusted by the air flow resistance of the opening. The substrate preparation apparatus according to claim 1 .

4. A substrate preparation device that places and / or removes a substrate on a substrate transport carrier that holds a substrate on a surface of which a thin film is formed in a vacuum chamber, the substrate preparation device comprising: The substrate transport carrier includes: a support plate, which is a non-flexible plate-like member disposed on the rear surface side of the substrate and has a support surface facing the rear surface; a communication passage formed in the support plate, the communication passage having one end opening to the support surface and the other end opening to an outside environment; an adhesive portion provided on the support surface of the support plate in a state surrounding the communication passage and removably adhered to the back surface of the substrate; a space between the support surface of the support plate and the back surface of the substrate and surrounded by the adhesive portion serves as a pressure space into which positive pressure or negative pressure is introduced via the communication passage; The substrate preparation device includes: a pressure adjusting device that introduces a positive pressure or a negative pressure into the pressure space in the substrate transport carrier on which the substrate is placed, via the communication passage; a substrate transfer device having a gripping unit that grips the periphery of the substrate and an arm unit that moves the gripping unit, the substrate transfer device grips a peripheral edge of the substrate held by the substrate transport carrier, and separates the substrate from the adhesive portion by the arm portion; the substrate preparation device further includes a control device that determines whether the substrate has been separated from the adhesive portion based on at least one of a pressure change in the pressure space, a displacement change in the arm portion, and a load change acting on the substrate transfer device; The substrate preparation device according to claim 1, wherein the control device terminates the introduction of the positive pressure by the pressure adjustment device based on a determination that the substrate has separated from the adhesive portion.

5. When viewed in a plan view, a periphery of the support plate is located outside a periphery of the substrate. The substrate preparation device according to any one of claims 1 to 4.

6. A plurality of the adhesive portions are provided independently of each other on the single support plate, the support plate has a plurality of the communication paths corresponding to the plurality of the adhesive portions, A plurality of the substrates are held by a plurality of the adhesive portions. The substrate preparation device according to any one of claims 1 to 5.

7. A film formation system for forming a thin film on a surface of the substrate in a vacuum chamber, comprising: A substrate preparation device according to any one of claims 1 to 6, The vacuum chamber for vacuum deposition; a carrier transfer device that transfers the substrate transport carrier holding the substrate from the substrate preparation device into the vacuum chamber; A film forming system comprising:

Images