Inductor Components

Abstract

To provide an inductor component having improved strength of connection between a via wiring line and each internal wiring line.SOLUTION: An inductor component 1 includes: a base body; a first internal wiring line (inductor wiring line) 100 and a second internal wiring line (second columnar wiring line) 221 that are provided inside the base body; an interlayer insulation film 31 provided inside the base body and disposed between the first internal wiring line and the second internal wiring line, and including a first main surface 31a on the first internal wiring line side, a second main surface 31b on the second internal wiring line side, and a via hole 31h passing through between the first main surface and the second main surface; and a second via wiring line 222 inserted into the via hole and electrically connecting the first internal wiring line and the second internal wiring line to each other. In a first cross-section including a central axis AX of the via wiring line, the second via wiring line includes a first portion P1 in contact with the first internal wiring line, and a second portion P2 in contact with the second internal wiring line. A width of the first portion decreases in a direction from the first internal wiring line toward the second internal wiring line, a width of the second portion increases in the direction from the first internal wiring line toward the second internal wiring line.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present disclosure relates to inductor components. [Background technology]

[0002] Conventionally, there is an electronic component described in JP 2020-107877 A (Patent Document 1). This electronic component has two internal wirings, an insulating layer having a via hole disposed between the two internal wirings, and a via wiring inserted into the via hole. The via wiring electrically connects the two internal wirings. The via hole has a tapered shape in which the diameter decreases in the depth direction. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-107877 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional electronic components, there is a risk that the via wiring may come out of the insulating layer, and the connection strength between the via wiring and the internal wiring may be insufficient, which may reduce the connection reliability between the via wiring and the internal wiring.

[0005] An object of the present disclosure is to provide an inductor component capable of improving the connection strength between via wiring and internal wiring. [Means for solving the problem]

[0006] In order to solve the above problems, an inductor component according to one aspect of the present disclosure comprises: The body and a first internal wiring and a second internal wiring provided within the element body; an interlayer insulating layer provided within the element body, disposed between the first internal wiring and the second internal wiring, the interlayer insulating layer having a first main surface on the side of the first internal wiring, a second main surface on the side of the second internal wiring, and a via hole penetrating between the first main surface and the second main surface; a via wiring that is inserted into the via hole and electrically connects the first internal wiring and the second internal wiring; Equipped with In a first cross section including a central axis of the via wiring, The via wiring has a first portion in contact with the first internal wiring and a second portion in contact with the second internal wiring, the width of the first portion narrowing from the first internal wiring to the second internal wiring, and the width of the second portion widening from the first internal wiring to the second internal wiring.

[0007] Here, the "central axis" refers to a line that passes through the center of gravity of the via wiring and is perpendicular to the first main surface. The "width" refers to the size in a direction perpendicular to the central axis. The "first cross section" is preferably a cross section in which the width of the via wiring is at its maximum. The first portion or the second portion "contacts" refers to a portion (e.g., an end face) of the first portion or the second portion being in contact.

[0008] According to the above aspect, the width of the first portion narrows from the first internal wiring toward the second internal wiring, and the width of the second portion widens from the first internal wiring toward the second internal wiring, so that the interlayer insulating layer bites into the via wiring, and the via wiring can be prevented from coming out of the interlayer insulating layer, thereby improving the connection strength between the via wiring and the first and second internal wirings.

[0009] In addition, the width of the first portion on the side of the first internal wiring is increased, so that the contact area of ​​the first portion with the first internal wiring can be increased. The width of the second portion on the side of the second internal wiring is increased, so that the contact area of ​​the second portion with the second internal wiring can be increased. This can improve the connection strength between the via wiring and the first internal wiring and between the via wiring and the second internal wiring.

[0010] An inductor component according to one aspect of the present disclosure includes: The body and a first internal wiring and a second internal wiring provided within the element body; an interlayer insulating layer provided within the element body, disposed between the first internal wiring and the second internal wiring, the interlayer insulating layer having a first main surface on the side of the first internal wiring, a second main surface on the side of the second internal wiring, and a via hole penetrating between the first main surface and the second main surface; a via wiring that is inserted into the via hole and electrically connects the first internal wiring and the second internal wiring; Equipped with In a first cross section including a central axis of the via wiring, The via wiring has a first portion in contact with the first internal wiring and a second portion in contact with the second internal wiring, the width of the first portion increasing from the first internal wiring to the second internal wiring, and the width of the second portion decreasing from the first internal wiring to the second internal wiring.

[0011] According to the above aspect, the width of the first portion becomes wider from the first internal wiring toward the second internal wiring, and the width of the second portion becomes narrower from the first internal wiring toward the second internal wiring, so that the via wiring can be embedded in the interlayer insulating layer and prevented from coming out of the interlayer insulating layer, thereby improving the connection strength between the via wiring and the first and second internal wirings. Effect of the Invention

[0012] According to an inductor component according to one aspect of the present disclosure, the connection strength between the via wiring and the internal wiring can be improved. [Brief description of the drawings]

[0013] [Figure 1] 1 is a perspective plan view showing a first embodiment of an inductor component. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II of FIG. [Diagram 3] FIG. 3 is an enlarged view of part A in FIG. 2. [Figure 4] FIG. 4 is an enlarged view of part A in FIG. [Figure 5A]5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5B] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5C] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5D] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5E] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5F] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5G] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5H] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5I] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5J] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5K] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5L] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 5M] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing an inductor component. [Figure 6] FIG. 4 is a schematic cross-sectional view showing a second embodiment of the inductor component. [Figure 7] FIG. 11 is a schematic cross-sectional view showing a third embodiment of the inductor component. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an inductor component according to an embodiment of the present disclosure will be described in detail with reference to the drawings. Note that the drawings include some schematic views and may not reflect actual dimensions or proportions.

[0015] First Embodiment (composition) Fig. 1 is a perspective plan view showing one embodiment of an inductor component. Fig. 2 is a cross-sectional view taken along line II-II of Fig. 1. Fig. 2 shows an XZ cross section including a central axis AX of a via wiring. The XZ cross section is an example of a first cross section including the central axis AX. For convenience, a seed layer is omitted in Fig. 2.

[0016] In the figure, the thickness direction of inductor component 1 is defined as the Z direction. In a plane perpendicular to the Z direction of inductor component 1, the longitudinal direction of inductor component 1, in which first external terminal 51 and second external terminal 52 are arranged, is defined as the X direction. The width direction of inductor component 1, which is perpendicular to the longitudinal direction, is defined as the Y direction. The XZ cross-sectional view is obtained by cutting inductor component 1 at a plane formed by a straight line extending in the X direction and a straight line extending in the Z direction and including the central axis AX of the via wiring.

[0017] The inductor component 1 is mounted in, for example, electronic devices such as personal computers, DVD players, digital cameras, TVs, mobile phones, car electronics, etc., and is, for example, a component having an overall rectangular parallelepiped shape. However, the shape of the inductor component 1 is not particularly limited, and may be a cylindrical shape, a polygonal columnar shape, a truncated cone shape, or a polygonal truncated cone shape.

[0018] 1 and 2, the inductor component 1 has an element body 10, an inductor wiring 100, an insulating layer 30, a first vertical wiring 21 and a second vertical wiring 22, a first external terminal 51 and a second external terminal 52, and a coating film 60. For convenience, the external terminals are depicted by two-dot chain lines in Fig. 1. In Fig. 1, the element body 10, the coating film 60, and the interlayer insulating layer 31 of the insulating layer 30 are depicted as transparent so that the structure can be easily understood, but they may be semi-transparent or opaque.

[0019] The element body 10 has a first magnetic layer 11, a substrate 70 disposed on the first magnetic layer 11, and a second magnetic layer 12 disposed on the substrate 70. The substrate 70 and the second magnetic layer 12 are laminated to sandwich the inductor wiring 100 and the insulating layer 30. In other words, the inductor wiring 100 and the insulating layer 30 are provided within the element body 10. The element body 10 has a three-layer structure of the first magnetic layer 11, the substrate 70, and the second magnetic layer 12, but may have a two-layer structure of the first magnetic layer 11 and the second magnetic layer 12.

[0020] Hereinafter, the upward direction refers to the direction from the first magnetic layer 11 toward the second magnetic layer 12 in a direction (or Z direction) perpendicular to the main surface (top surface) of the substrate 70 on the second magnetic layer 12 side. The upper surface of an element refers to the upward surface of the element. The downward direction refers to the direction from the second magnetic layer 12 toward the first magnetic layer 11 in a direction perpendicular to the main surface of the substrate 70 on the second magnetic layer 12 side. The lower surface of an element refers to the downward surface of the element. The direction of the central axis AX of the second via wiring 222 coincides with the direction perpendicular to the main surface of the substrate 70 on the second magnetic layer 12 side.

[0021] An inductor wiring refers to a curve (two-dimensional curve) that extends on a plane, and may be a curve with more than one turn, a curve with less than one turn, or a curve that may have a straight line in some parts.

[0022] The first magnetic layer 11 and the second magnetic layer 12 each have a resin and a metal magnetic powder as a magnetic body contained in the resin. Therefore, compared to a magnetic layer made of ferrite, the metal magnetic powder can improve the DC bias characteristics, and the resin insulates the metal magnetic powder from each other, thereby reducing loss (iron loss) at high frequencies.

[0023] The resin includes, for example, any of epoxy, polyimide, phenol, and vinyl ether resins. This improves insulation reliability. More specifically, the resin is epoxy, a mixture of epoxy and acrylic, or a mixture of epoxy, acrylic, and other materials. This ensures insulation between the metal magnetic powder, thereby reducing loss (iron loss) at high frequencies.

[0024] The average particle size of the metal magnetic powder is, for example, 0.1 μm or more and 5 μm or less. In the manufacturing stage of the inductor component 1, the average particle size of the metal magnetic powder can be calculated as a particle size corresponding to 50% of the integrated value in the particle size distribution obtained by the laser diffraction and scattering method. The metal magnetic powder is, for example, an FeSi-based alloy such as FeSiCr, an FeCo-based alloy, an Fe-based alloy such as NiFe, or an amorphous alloy thereof. The content of the metal magnetic powder is preferably 20 vol% or more and 70 vol% or less with respect to the entire magnetic layer. When the average particle size of the metal magnetic powder is 5 μm or less, the DC superposition characteristics are further improved, and the iron loss at high frequencies can be reduced by the fine powder. When the average particle size of the metal magnetic powder is 0.1 μm or more, uniform dispersion in the resin is facilitated, and the manufacturing efficiency of the first magnetic layer 11 and the second magnetic layer 12 is improved. Note that instead of or in addition to the metal magnetic powder, a ferrite magnetic powder such as NiZn-based or MnZn-based may be used.

[0025] The substrate 70 is laminated on the first magnetic layer 11. The substrate 70 is flat and serves as a base in the manufacturing process of the inductor component 1. The substrate 70 is made of a sintered body such as a magnetic substrate made of NiZn-based or MnZn-based ferrite, or a non-magnetic substrate made of alumina or glass. The thickness of the substrate 70 is, for example, 300 μm or more and 1000 μm or less.

[0026] The inductor wiring 100 is provided on the upper surface of the substrate 70 and extends in a direction parallel to the upper surface of the substrate 70. The inductor wiring 100 is wound in a spiral shape around the axis of the inductor wiring 100 on the upper surface of the substrate 70. The inductor wiring 100 has a spiral shape with more than one turn. When viewed from above, the inductor wiring 100 is wound in a spiral shape in a clockwise direction from the outer circumferential end to the inner circumferential end. Note that the inductor wiring 100 may be a curve with less than one turn, or may have a straight line in part.

[0027] The thickness of the inductor wiring 100 is, for example, 40 μm or more and 120 μm or less. Specifically, the inductor wiring 100 has a thickness of 45 μm, a wiring width of 50 μm, and a space between the wirings of 10 μm. The space between the wirings may be 3 μm or more and 20 μm or less.

[0028] The inductor wiring 100 has a spiral portion 120, a first pad portion 111, and a second pad portion 112. The first pad portion 111 is connected to a first vertical wiring 21, and the second pad portion 112 is connected to a second vertical wiring 22. The spiral portion 120 extends from the first pad portion 111 and the second pad portion 112 along a direction parallel to the upper surface of the substrate 70, with the first pad portion 111 as the outer circumferential end and the second pad portion 112 as the inner circumferential end, and is wound in a spiral shape.

[0029] The first vertical wiring 21 and the second vertical wiring 22 extend from the inductor wiring 100 in the direction of the central axis AX and penetrate the element body 10. The first vertical wiring 21 includes a first via wiring 212 extending upward from the upper surface of the first pad portion 111 of the inductor wiring 100 and penetrating the inside of the interlayer insulating layer 31, and a first columnar wiring 211 extending upward from the first via wiring 212 and penetrating the inside of the second magnetic layer 12. The second vertical wiring 22 includes a second via wiring 222 extending upward from the upper surface of the second pad portion 112 of the inductor wiring 100 and penetrating the interlayer insulating layer 31, and a second columnar wiring 221 extending upward from the second via wiring 222 and penetrating the inside of the second magnetic layer 12.

[0030] The inductor wiring 100 corresponds to an example of a "first internal wiring" recited in the claims. The first columnar wiring 211 and the second columnar wiring 221 correspond to an example of a "second internal wiring" recited in the claims.

[0031] The inductor wiring 100 is made of a conductive material, for example, a metallic material with low electrical resistance such as Cu, Ag, Au, Fe, or an alloy containing these. This can reduce the DC resistance of the inductor component 1. The first vertical wiring 21 and the second vertical wiring 22 are made of the same conductive material as the inductor wiring 100.

[0032] The insulating layer 30 covers at least a part of the inductor wiring 100. The insulating layer 30 has an interlayer insulating layer 31, a resin wall 32, and a base insulating layer 33. The interlayer insulating layer 31 covers the upper surface of the inductor wiring 100, the resin wall 32 covers the side surface of the inductor wiring 100, and the base insulating layer 33 covers the lower surface of the inductor wiring 100. Specifically, the resin wall 32 is provided on the same surface as the inductor wiring 100, and is provided between the turns of the inductor wiring 100 and on the outer diameter side and inner diameter side of the inductor wiring 100. The interlayer insulating layer 31 covers the upper surface of the inductor wiring 100, and has via holes at positions corresponding to the first and second pad portions 111 and 112 of the inductor wiring 100. The interlayer insulating layer 31 is provided so as to fill the gap between the upper ends of the adjacent resin walls 32.

[0033] The interlayer insulating layer 31, the resin wall 32, and the base insulating layer 33 are made of an insulating material that does not contain a magnetic material, and include, for example, any of epoxy, polyimide, phenol, and vinyl ether resins. This improves the insulation reliability. The base insulating layer 33 may include a non-magnetic filler such as silica. The thickness of the base insulating layer 33 is, for example, 10 μm or less.

[0034] The first external terminal 51 is provided on the upper surface of the second magnetic layer 12, and covers an end face of the first columnar wiring 211 exposed from the upper surface. This allows the first external terminal 51 to be electrically connected to the first pad portion 111 of the inductor wiring 100. The second external terminal 52 is provided on the upper surface of the second magnetic layer 12, and covers an end face of the second columnar wiring 221 exposed from the upper surface. This allows the second external terminal 52 to be electrically connected to the second pad portion 112 of the inductor wiring 100.

[0035] The first external terminal 51 and the second external terminal 52 are made of a conductive material. The first external terminal 51 and the second external terminal 52 have a three-layer structure in which metal layers made of Cu, which has low electrical resistance and excellent stress resistance, Ni, which has excellent corrosion resistance, and Au, which has excellent solder wettability and reliability, are laminated from the inside to the outside in this order.

[0036] The covering film 60 is made of an insulating material, covers the upper surface of the second magnetic layer 12, and exposes the end surfaces of the columnar wirings 211, 221 and the external terminals 51, 52. The covering film 60 ensures insulation of the surface of the inductor component 1. The covering film 60 may be formed on the lower surface side of the first magnetic layer 11.

[0037] Fig. 3 is an enlarged view of part A in Fig. 2. Fig. 3 shows a part of the first cross section including the central axis AX of the second via wiring 222.

[0038] 3, the interlayer insulating layer 31 is disposed between the inductor wiring 100 (first internal wiring) and the second columnar wiring 221 (second internal wiring). The interlayer insulating layer 31 has a first main surface 31a on the inductor wiring 100 side, a second main surface 31b on the second columnar wiring 221 side, and a via hole 31h penetrating between the first main surface 31a and the second main surface 31b. The second via wiring 222 is inserted into the via hole 31h and electrically connects the inductor wiring 100 and the second columnar wiring 221.

[0039] The second via wiring 222 has a first portion P1 in contact with the inductor wiring 100 and a second portion P2 in contact with the second columnar wiring 221. The width of the first portion P1 narrows from the inductor wiring 100 toward the second columnar wiring 221, and the width of the second portion P2 widens from the inductor wiring 100 toward the second columnar wiring 221.

[0040] Here, in the cross section shown in Fig. 3, the width of the first portion P1 refers to the size in the direction perpendicular to the central axis AX (X direction). Similarly, in the cross section shown in Fig. 3, the width of the second portion P2 refers to the size in the direction perpendicular to the central axis AX (X direction).

[0041] 3, for the sake of convenience, the boundary between the first portion P1 and the second portion P2, and the boundary between the second portion P2 and the second columnar wiring 221 are indicated by two-dot chain lines. When the width of the upper surface of the second portion P2 is the same as the width of the lower surface of the second columnar wiring 221, the boundary between the second portion P2 and the second columnar wiring 221 may be a plane including the second main surface 31b of the interlayer insulating layer 31.

[0042] Specifically, the width of the first portion P1 continuously narrows from the inductor wiring 100 toward the second columnar wiring 221. More specifically, in the cross section shown in Fig. 3, each of the two side surfaces of the first portion P1 is inclined so as to approach the central axis AX from the inductor wiring 100 toward the second columnar wiring 221. In short, in the cross section shown in Fig. 3, the first portion P1 is trapezoidal.

[0043] Moreover, the width of the second portion P2 becomes continuously wider from the inductor wiring 100 toward the second columnar wiring 221. More specifically, in the cross section shown in Fig. 3, each of the two side surfaces of the second portion P2 is inclined so as to move away from the central axis AX from the inductor wiring 100 toward the second columnar wiring 221. In short, in the cross section shown in Fig. 3, the second portion P2 has an inverted trapezoidal shape.

[0044] In this embodiment, the first portion P1 and the second portion P2 are in contact with each other. In other words, the first portion P1 and the second portion P2 are provided continuously in the Z direction. The first portion P1 and the second portion P2 are integrally formed. As a result, the second via wiring 222 has a constricted shape.

[0045] Note that the shape of the first portion P1 is not particularly limited as long as the width of the first portion P1 narrows from the inductor wiring 100 toward the second columnar wiring 221. For example, in the cross section shown in FIG. 3, one side surface of the first portion P1 may be disposed parallel to the Z direction. Also, for example, the width of the first portion P1 may narrow stepwise from the inductor wiring 100 toward the second columnar wiring 221.

[0046] Similarly, the shape of the second portion P2 is not particularly limited as long as the width of the second portion P2 increases from the inductor wiring 100 toward the second columnar wiring 221. For example, in the cross section shown in FIG. 3, one side surface of the second portion P2 may be disposed parallel to the Z direction. Also, for example, the width of the second portion P2 may increase stepwise from the inductor wiring 100 toward the second columnar wiring 221.

[0047] 2, the first via wiring 212 has a similar configuration to the second via wiring 222. That is, the first via wiring 212 has a first portion in contact with the inductor wiring 100 and a second portion in contact with the first columnar wiring 211. The width of the first portion narrows from the inductor wiring 100 toward the first columnar wiring 211, and the width of the second portion widens from the inductor wiring 100 toward the first columnar wiring 211. The first via wiring 212 has a constricted shape.

[0048] According to the inductor component 1, the width of the first portion P1 of the second via wiring 222 narrows from the inductor wiring 100 toward the second columnar wiring 221, so that the second via wiring 222 can be prevented from coming out of the interlayer insulating layer 31 in the direction from the inductor wiring 100 toward the second columnar wiring 221. This can improve the connection strength between the first portion P1 and the inductor wiring 100. In addition, the width of the second portion P2 of the second via wiring 222 widens from the inductor wiring 100 toward the second columnar wiring 221, so that the second via wiring 222 can be prevented from coming out of the interlayer insulating layer 31 in the direction from the second columnar wiring 221 toward the inductor wiring 100. This can improve the connection strength between the second portion P2 and the second columnar wiring 221. As a result, the connection strength between the second via wiring 222 and the inductor wiring 100 and the second columnar wiring 221 can be improved.

[0049] In other words, the width of the first portion P1 narrows from the inductor wiring 100 toward the second columnar wiring 221, and the width of the second portion P2 widens from the inductor wiring 100 toward the second columnar wiring 221, so that the interlayer insulating layer 31 bites into the second via wiring 222, and it is possible to suppress the second via wiring 222 from coming out of the interlayer insulating layer 31. This makes it possible to improve the connection strength between the second via wiring 222 and the inductor wiring 100 and the second columnar wiring 221.

[0050] Furthermore, the width of the first portion P1 on the inductor wiring 100 side is increased, so that the contact area of ​​the first portion P1 with the inductor wiring 100 can be increased. The width of the second portion P2 on the second columnar wiring 221 side is increased, so that the contact area of ​​the second portion P2 with the second columnar wiring 221 can be increased. This can improve the connection strength between the second via wiring 222 and the inductor wiring 100 and the second columnar wiring 221.

[0051] Moreover, according to the inductor component 1, the width of the first portion of the first via wiring 212 also narrows from the inductor wiring 100 toward the first columnar wiring 212, and the width of the second portion increases from the inductor wiring 100 toward the first columnar wiring 212, so that the same effect as that of the second via wiring 222 is achieved. That is, the connection strength between the first via wiring 212 and the inductor wiring 100 and the first columnar wiring 211 can be improved.

[0052] Preferably, in a second cross section (YZ cross section) including the central axis AX of the second via wiring 222 and perpendicular to the first cross section (XZ cross section), the width of the first portion P1 narrows from the inductor wiring 100 toward the second columnar wiring 221, and the width of the second portion P2 widens from the inductor wiring 100 toward the second columnar wiring 221. This can further improve the connection strength between the second via wiring 222 and the inductor wiring 100 and the second columnar wiring 221. Preferably, the first via wiring 212 has a similar configuration.

[0053] Preferably, as shown in FIG. 3, the first portion P1 and the second portion P2 are in contact with each other. The first portion P1 includes a first end face P1e1 in contact with the inductor wiring 100 and a second end face P1e2 in contact with the second portion P2. The second portion P2 includes a first end face P2e1 in contact with the second columnar wiring 221 and a second end face P2e2 in contact with the first portion P1. In the first cross section, the width W1 of the second end face P1e2 of the first portion P1 and the width W4 of the second end face P2e2 of the second portion P2 are the same. The width W2 of the first end face P1e1 of the first portion P1 and the width W3 of the first end face P2e1 of the second portion P2 are larger than the width W1 of the second end face P1e2 of the first portion P1 and the width W4 of the second end face P2e2 of the second portion P2.

[0054] Here, the first cross section is a cross section where the width of the second via wiring 222 is maximum (i.e., the cross section shown in FIG. 3). According to the above configuration, the contact area of ​​the first end surface P1e1 of the first portion P1 with the inductor wiring 100 can be increased, thereby improving the connection strength between the second via wiring 222 and the inductor wiring 100. The contact area of ​​the first end surface P2e1 of the second portion P2 with the second columnar wiring 221 can be increased, thereby improving the connection strength between the second via wiring 222 and the second columnar wiring 221.

[0055] The first via wiring 212 may have a similar configuration to the above. That is, in the first cross section of the first via wiring 212, the width of the second end face of the first portion and the width of the second end face of the second portion may be the same, and the width of the first end face of the first portion and the width of the first end face of the second portion may be larger than the width of the second end face of the first portion and the width of the second end face of the second portion. Here, the first cross section is a cross section in which the width of the first via wiring 212 is maximum. Specifically, the first cross section is a cross section passing through a diagonal of the first via wiring 212 as viewed from the Z direction. This configuration provides the same effects as the second via wiring 222.

[0056] Preferably, in the first cross section (ie, the cross section shown in FIG. 3), the width W1 of the second end face P1e2 of the first portion P1 of the second via wiring 222 is greater than 0.8 times the width W2 of the first end face P1e1 of the first portion P1.

[0057] According to the above configuration, since the width W1 of the second end face P1e2 of the first portion P1 is larger than 0.8 times the width W2 of the first end face P1e1 of the first portion P1, it is possible to ensure the cross-sectional area of ​​the first portion P1 on the second end face P1e2 side, to ensure the strength of the second via wiring 222, and to reduce the electrical resistance of the second via wiring 222. The first via wiring 212 may have a similar configuration.

[0058] 2, the element body 10 includes a second external terminal 52 that is provided closer to the second columnar wire 221 than the inductor wire 100 and is electrically connected to the second columnar wire 221. As shown in Fig. 3, the first portion P1 of the second via wire 222 includes a first end face P1e1 in contact with the inductor wire 100, and the second portion P2 includes a first end face P2e1 in contact with the second columnar wire 221. In the first cross section, a width W3 of the first end face P2e1 of the second portion P2 is larger than a width W2 of the first end face P1e1 of the first portion P1.

[0059] Here, the first cross section is a cross section where the width of the second via wiring 222 is maximum (i.e., the cross section shown in FIG. 3). According to the above configuration, the second external terminal 52 is provided on a side closer to the second columnar wiring 221 than the inductor wiring 100 of the element body 10, so that stress during mounting of the inductor component 1 is more likely to be applied to the second columnar wiring 221 side than to the inductor wiring 100 side. At this time, the width W3 of the first end face P2e1 of the second portion P2 of the second via wiring 222 is larger than the width W2 of the first end face P1e1 of the first portion P1, so that the contact area of ​​the first end face P2e1 of the second portion P2 with the second columnar wiring 221 can be made larger than the contact area of ​​the first end face P1e1 of the first portion P1 with the inductor wiring 100, and peeling of the second via wiring 222 and the second columnar wiring 221 due to stress during mounting can be effectively suppressed.

[0060] 2, the element body 10 preferably includes a first external terminal 51 that is provided closer to the first columnar wiring 211 than the inductor wiring 100 and is electrically connected to the first columnar wiring 211. A first portion of the first via wiring 212 includes a first end face in contact with the inductor wiring 100, and a second portion includes a first end face in contact with the first columnar wiring 211. In the first cross section, the width of the first end face of the second portion is larger than the width of the first end face of the first portion.

[0061] Here, the first cross section is a cross section where the width of the first via wiring 212 is maximum. Specifically, the first cross section is a cross section passing through a diagonal of the first via wiring 212 when viewed from the Z direction. According to the above configuration, the first external terminal 51 is provided on a side closer to the first columnar wiring 211 than the inductor wiring 100 of the element body 10, so that stress during mounting of the inductor component 1 is more likely to be applied to the first columnar wiring 211 side than the inductor wiring 100 side. At this time, the width of the first end face of the second portion of the first via wiring 212 is larger than the width of the first end face of the first portion, so that the contact area of ​​the first end face of the second portion with the first columnar wiring 211 can be made larger than the contact area of ​​the first end face of the first portion with the inductor wiring 100, and peeling of the first via wiring 212 and the first columnar wiring 211 due to stress during mounting can be effectively suppressed.

[0062] Preferably, the average surface roughness of the inner surface of the via hole 31h of the interlayer insulating layer 31 is 1 μm or less. Here, a method for measuring the surface roughness will be described. FIG. 4 is an enlarged view of part A in FIG. 3. When a part of the inner surface of the via hole 31h is observed at a magnification of about 2000 times (field of view: about 5 μm per side) using a SEM (Scanning Electron Microscope) or the like, a cross-sectional photograph as shown in the schematic diagram of FIG. 4 is obtained. Based on the protrusions P and recesses C existing along the side surface of the via wiring, a reference line L0 drawn along the side surface of the via wiring is calculated using the least squares method or the like. The surface roughness is obtained based on the recesses C and protrusions P whose vertical distance from the reference line L0 is maximum. A first straight line L1 is drawn parallel to the reference line L0 so as to pass through the top of the protrusion P, and a second straight line L2 is drawn parallel to the reference line L0 so as to pass through the bottom of the recess C whose vertical distance is maximum. The vertical distance d between these two straight lines L1 and L2 is measured. Then, the vertical distance d is measured at a total of four points on the inner surface of the via hole 31h, two points in a portion corresponding to the first portion P1 and two points in a portion corresponding to the second portion P2, and the average value is taken as the surface roughness. With the above configuration, it is possible to suppress the resistance loss at high frequencies that is remarkable due to the skin effect.

[0063] (Manufacturing method) Next, a method for manufacturing the inductor component 1 will be described with reference to Figures 5A to 5M. Figures 5A to 5M are diagrams corresponding to the second pad 112 and the second vertical wiring 22 of the inductor wiring 100 in Figure 2. The same applies to the first pad 111 and the first vertical wiring 21, and their description will be omitted.

[0064] As shown in Fig. 5A, a base insulating layer 33 that does not contain a magnetic material is formed on a substrate 70. The substrate 70 is made of, for example, sintered ferrite and has a flat plate shape.

[0065] The base insulating layer 33 is made of, for example, a polyimide resin or an inorganic material that does not contain a magnetic material. After the polyimide resin is coated on the substrate 70 by printing, painting, or the like, the polyimide resin is left in the region where the inductor wiring 100 is to be formed by patterning using a photolithography method. This forms the base insulating layer 33. The insulating film made of an inorganic material is formed on the substrate 70 by, for example, a dry process such as deposition, sputtering, or CVD.

[0066] 5B, a seed layer 81 is formed on the underlying insulating layer 33. Specifically, a material for the seed layer 81 (e.g., a titanium / copper alloy) is deposited on the upper surface of the underlying insulating layer 33 by sputtering, and then patterned by a subtractive method to form the seed layer 81.

[0067] As shown in FIG. 5C, the resin wall 32 is formed on the base insulating layer 33. The resin wall 32 is formed, for example, by a photosensitive permanent photoresist. The photosensitive permanent photoresist is a photoresist that is not removed after processing. Specifically, the material of the resin wall 32 is printed on the substrate 70 and exposed to light. Thereafter, development is performed using an organic solvent such as PGMEA (propylene glycol monomethyl ether acetate pegmia) and an alkaline developer such as TMAH (tetramethyl ammonium hydroxide). As a result, the material in the unexposed portion is removed, and the resin wall 32 is formed.

[0068] 5D, the second pad portion 112 and the spiral portion 120 are formed on the seed layer 81. Specifically, plating is grown on the seed layer 81 by electrolytic plating. As a result, the second pad portion 112 and the spiral portion 120 are formed between the resin walls 32.

[0069] 5E to 5H are enlarged views of the position where the second via wiring is provided. As shown in FIG. 5E, a photosensitive insulating layer 310 is disposed so as to cover the upper surface of the second pad portion 112 and the upper surface of the spiral portion 120 (not shown). Specifically, a photosensitive insulating film is laminated so as to cover the upper surface of the second pad portion 112 and the upper surface of the spiral portion 120. The photosensitive insulating film is also made of a photosensitive permanent photoresist. It is preferable to use a negative type film as the photosensitive insulating film. In the following description, it is assumed that a negative type film is used as the photosensitive insulating film.

[0070] As shown in FIG. 5F, a photomask M is placed on the photosensitive insulating layer 310, and the photosensitive insulating layer 310 is irradiated with, for example, ultraviolet light L from above the photomask M to expose the photosensitive insulating layer 310. At this time, the exposure amount of the photosensitive insulating layer 310 is reduced by making the focus of the exposure machine higher than the upper surface of the photosensitive insulating layer 310. As a result, a hardened portion 311 is formed on the upper portion of the photosensitive insulating layer 310, and the photosensitive insulating layer 310 is in a semi-hardened state. It is preferable to use a projection type exposure machine with adjustable focus as the exposure machine. Although not shown in FIG. 5F, the photosensitive insulating layer 310 is slightly hardened due to heat generated during exposure even in the portion between the hardened portion 311 and the second pad portion 112. This heat gradually decreases from the hardened portion 311 toward the second pad portion 112. Therefore, the portion slightly hardened due to this heat is formed so that its width becomes narrower from the hardened portion 311 toward the second pad portion 112.

[0071] As shown in FIG. 5G, post-exposure bake (PEB) is performed to harden the photosensitive insulating layer 310 in the portion between the hardened portion 311 and the second pad portion 112 shown in FIG. 5F. At this time, hardening of the above-mentioned slightly hardened portion is accelerated. Therefore, after the post-exposure bake, the side surface of the hardened portion 311 has a shape corresponding to the constricted shape of the second via wiring. As for the conditions of PEB, for example, the temperature is +10 to +20° C. and the time is 2 to 3 times longer than in the case of normal via formation.

[0072] 5H, development is performed to remove the portions other than the hardened portion 311. This forms a via hole 31h having a constricted shape. The position of the constriction of the via hole 31h can be controlled by changing the focal position during exposure.

[0073] As shown in FIG. 5I, a seed layer 82 is formed on the inner surface of the via hole 31h, the exposed portion of the upper surface of the second pad portion 112, the interlayer insulating layer 31, and the upper surface of the resin wall 32 by sputtering.

[0074] 5J, second via wiring 222 and second columnar wiring 221 are formed in a portion corresponding to the exposed portion of the upper surface of second pad portion 112. Specifically, resist film 320 is formed on seed layer 82, and an opening is provided in resist film 320 at a position corresponding to second via wiring 222. Plating is grown on seed layer 82 by electrolytic plating to form a plating layer in the above-mentioned opening. As a result, second via wiring 222 and second columnar wiring 221 are formed in the opening.

[0075] At this time, the narrowest width of the inner surface of the via hole 31h (i.e., equivalent to the width W1 of the second end face P1e2 of the first portion P1) is preferably larger than 0.8 times the width of the inner surface of the via hole 31h on the second pad portion 112 side (i.e., equivalent to the width W2 of the first end face P1e1 of the first portion P1). According to the above configuration, it is possible to prevent the plating solution from becoming difficult to enter the second pad portion 112 side of the via hole 31h, and it is possible to prevent the occurrence of voids in the region surrounded by the first portion P1, the second pad portion 112, and the interlayer insulating layer 31 on the outer side of the first portion P1 in the width direction during plating.

[0076] As shown in FIG. 5K, the resist film 320 is peeled off, the exposed seed layer 82 is removed, and the second magnetic layer 12 is formed on the interlayer insulating layer 31. Furthermore, the first magnetic layer 11 is formed on the lower surface of the substrate 70. The first magnetic layer 11 and the second magnetic layer 12 are formed by pressing a magnetic layer onto the interlayer insulating layer 31 or the lower surface of the substrate 70. Before pressing the second magnetic layer 12, a part of the substrate 70 is ground to adjust the thickness. The substrate 70 may be removed.

[0077] As shown in FIG. 5L, the second magnetic layer 12 is ground to expose the top surface of the second columnar interconnect 221.

[0078] 5M, a second external terminal 52 is formed on the top surface of the second columnar wiring 221, and a coating film 60 is formed to cover the other portion of the second magnetic layer 12. The coating film 60 is formed of, for example, a solder resist. After that, the inductor component 1 is manufactured by dividing the resulting product into individual pieces using a dicer or the like.

[0079] <Second embodiment> Fig. 6 is a schematic cross-sectional view showing a second embodiment of the inductor component. Fig. 6 corresponds to Fig. 3. The second embodiment differs from the first embodiment in the shape of the via wiring. This different configuration will be described below. The other configurations are the same as those of the first embodiment, so the same reference numerals as those of the first embodiment are used and the description thereof will be omitted.

[0080] 6, in the inductor component 1A of the second embodiment, in a first cross section including a central axis AX of the second via wiring 222A, the second via wiring 222A has a first portion P1 in contact with the inductor wiring 100 (second pad portion 112) and a second portion P2 in contact with the second columnar wiring 221. The width of the first portion P1 becomes wider from the inductor wiring 100 toward the second columnar wiring 221, and the width of the second portion P2 becomes narrower from the inductor wiring 100 toward the second columnar wiring 221.

[0081] Specifically, the width of the first portion P1 becomes continuously wider from the inductor wiring 100 toward the second columnar wiring 221. More specifically, in the cross section shown in Fig. 6, each of the two side surfaces of the first portion P1 is inclined so as to move away from the central axis AX from the inductor wiring 100 toward the second columnar wiring 221. In short, in the cross section shown in Fig. 6, the first portion P1 has an inverted trapezoidal shape.

[0082] Moreover, the width of the second portion P2 continuously narrows from the inductor wiring 100 toward the second columnar wiring 221. More specifically, in the cross section shown in Fig. 6, each of the two side surfaces of the second portion P2 is inclined so as to approach the central axis AX from the inductor wiring 100 toward the second columnar wiring 221. In short, in the cross section shown in Fig. 6, the second portion P2 is trapezoidal.

[0083] In this embodiment, the first portion P1 and the second portion P2 are in contact with each other. In other words, the first portion P1 and the second portion P2 are provided continuously in the Z direction. The first portion P1 and the second portion P2 are integrally formed.

[0084] Note that the shape of the first portion P1 is not particularly limited as long as the width of the first portion P1 increases from the inductor wiring 100 toward the second columnar wiring 221. For example, in the cross section shown in FIG. 6, one side surface of the first portion P1 may be disposed parallel to the Z direction. Also, for example, the width of the first portion P1 may increase stepwise from the inductor wiring 100 toward the second columnar wiring 221.

[0085] Similarly, the shape of the second portion P2 is not particularly limited as long as the width of the second portion P2 narrows from the inductor wiring 100 toward the second columnar wiring 221. For example, in the cross section shown in FIG. 6, one side surface of the second portion P2 may be disposed parallel to the Z direction. Also, for example, the width of the second portion P2 may narrow stepwise from the inductor wiring 100 toward the second columnar wiring 221.

[0086] In this embodiment, the first via wiring has a similar configuration to the second via wiring 222A. That is, the first via wiring has a first portion in contact with the inductor wiring 100 and a second portion in contact with the first columnar wiring 211. The width of the first portion becomes wider from the inductor wiring 100 toward the first columnar wiring 211, and the width of the second portion becomes narrower from the inductor wiring 100 toward the first columnar wiring 211.

[0087] According to the inductor component 1A, the width of the first portion P1 of the second via wiring 222A becomes wider from the inductor wiring 100 toward the second columnar wiring 221, so that the second via wiring 222A can be prevented from coming out of the interlayer insulating layer 31 in the direction from the second columnar wiring 221 toward the inductor wiring 100. This can improve the connection strength between the first portion P1 and the inductor wiring 100. In addition, the width of the second portion P2 of the second via wiring 222A becomes narrower from the inductor wiring 100 toward the second columnar wiring 221, so that the second via wiring 222A can be prevented from coming out of the interlayer insulating layer 31 in the direction from the inductor wiring 100 toward the second columnar wiring 221. This can improve the connection strength between the second portion P2 and the second columnar wiring 221. As a result, the connection strength between the second via wiring 222A and the inductor wiring 100 and the second columnar wiring 221 can be improved.

[0088] In other words, the width of the first portion P1 becomes wider from the inductor wiring 100 toward the second columnar wiring 221, and the width of the second portion P2 becomes narrower from the inductor wiring 100 toward the second columnar wiring 221, so that the second via wiring 222A bites into the interlayer insulating layer 31, and it is possible to suppress the second via wiring 222A from coming out of the interlayer insulating layer 31. This makes it possible to improve the connection strength between the second via wiring 222A and the inductor wiring 100 and the second columnar wiring 221.

[0089] Preferably, in a second cross section (YZ cross section) including the central axis AX of the second via wiring 222A and perpendicular to the first cross section (XZ cross section), the width of the first portion P1 becomes wider from the inductor wiring 100 toward the second columnar wiring 221, and the width of the second portion P2 becomes narrower from the inductor wiring 100 toward the second columnar wiring 221. This can further improve the connection strength between the second via wiring 222A and the inductor wiring 100 and the second columnar wiring 221. Preferably, the first via wiring has a similar configuration.

[0090] Preferably, as shown in FIG. 6, the first portion P1 and the second portion P2 are in contact with each other. The first portion P1 includes a first end face P1e1 in contact with the inductor wiring 100 and a second end face P1e2 in contact with the second portion P2. The second portion P2 includes a first end face P2e1 in contact with the second columnar wiring 221 and a second end face P2e2 in contact with the first portion P1. In the first cross section, the width W5 of the second end face P1e2 of the first portion P1 and the width W8 of the second end face P2e2 of the second portion P2 are the same. The width W6 of the first end face P1e1 of the first portion P1 and the width W7 of the first end face P2e1 of the second portion P2 are smaller than the width W5 of the second end face P1e2 of the first portion P1 and the width W8 of the second end face P2e2 of the second portion P2. Here, the first cross section is a cross section where the width of the second via wiring 222A is maximum (that is, the cross section shown in FIG. 6).

[0091] The first via wiring may have the same configuration as above. That is, in the first cross section, the width of the second end face of the first portion and the width of the second end face of the second portion may be the same, and the width of the first end face of the first portion and the width of the first end face of the second portion may be smaller than the width of the second end face of the first portion and the width of the second end face of the second portion. Here, the first cross section is a cross section where the width of the first via wiring is maximum. Specifically, the first cross section is a cross section that passes through a diagonal of the first via wiring as viewed from the Z direction. This configuration provides the same effect as the second via wiring 222A.

[0092] Preferably, in the first cross section, a width W7 of the first end face P2e1 of the second portion P2 is larger than a width W6 of the first end face P1e1 of the first portion P1, as shown in Fig. 6. Here, the first cross section is a cross section in which the width of the second via wiring 222A is maximum (i.e., the cross section shown in Fig. 6). According to the above configuration, the second external terminal 52 is provided on a side closer to the second columnar wiring 221 than the inductor wiring 100 of the element body 10, so that stress during mounting of the inductor component 1 is more likely to be applied to the second columnar wiring 221 side than to the inductor wiring 100 side. At this time, since the width W7 of the first end face P2e1 of the second portion P2 of the second via wiring 222A is larger than the width W6 of the first end face P1e1 of the first portion P1, the contact area of ​​the first end face P2e1 of the second portion P2 with the second columnar wiring 221 can be made larger than the contact area of ​​the first end face P1e1 of the first portion P1 with the inductor wiring 100, thereby effectively suppressing peeling of the second via wiring 222A and the second columnar wiring 221 due to stress during mounting.

[0093] Similarly, preferably, the first portion of the first via wiring includes a first end face in contact with the inductor wiring 100, and the second portion includes a first end face in contact with the first columnar wiring 211. In the first cross section, the width of the first end face of the second portion is larger than the width of the first end face of the first portion. Here, the first cross section is a cross section in which the width of the first via wiring is maximum. Specifically, the first cross section is a cross section passing through a diagonal of the first via wiring as viewed from the Z direction. According to the above configuration, the first external terminal 51 is provided on a side closer to the first columnar wiring 211 than the inductor wiring 100 of the element body 10, so that stress during mounting of the inductor component 1 is more likely to be applied to the first columnar wiring 211 side than the inductor wiring 100 side. At this time, since the width of the first end face of the second portion of the first via wiring is larger than the width of the first end face of the first portion, the contact area of ​​the first end face of the second portion with the first columnar wiring 211 can be made larger than the contact area of ​​the first end face of the first portion with the inductor wiring 100, effectively suppressing peeling of the first via wiring and the first columnar wiring 211 due to stress during mounting.

[0094] A method for manufacturing the inductor component 1A of the second embodiment will be described. The method is similar to the method for manufacturing the inductor component 1 of the first embodiment shown in Fig. 5A to Fig. 5M, but in the step of Fig. 5F, the focus of the exposure machine is adjusted to be located below the surface of the second pad portion 112 for exposure.

[0095] <Third embodiment> Fig. 7 is a schematic cross-sectional view showing a third embodiment of the inductor component. Fig. 7 corresponds to Fig. 3. The third embodiment differs from the first embodiment in the shape of the via wiring. This different configuration will be described below. The other configurations are the same as those of the first embodiment, so the same reference numerals as those of the first embodiment are used and the description thereof will be omitted.

[0096] 7, in the inductor component 1B of the third embodiment, the second via wiring 222B has a first portion P1, a second portion P2, and a third portion P3 located between the first portion P1 and the second portion P2. The first portion P1 has a similar configuration to the first portion P1 described in the first embodiment, and the second portion P2 has a similar configuration to the second portion P2 described in the first embodiment.

[0097] The width of the third portion P3 is constant from the inductor wiring 100 toward the second columnar wiring 221. The width of the third portion P3 may be narrower or wider from the inductor wiring 100 toward the second columnar wiring 221. According to the above configuration, since the third portion P3 is provided, the length of the second via wiring 222B in the direction of the central axis AX can be increased, and the degree of freedom in design is increased.

[0098] A method for manufacturing the inductor component 1B of the third embodiment will be described. The method is similar to the method for manufacturing the inductor component 1 of the first embodiment shown in Fig. 5A to Fig. 5M, but in the step of Fig. 5H, after development, the protruding portion located at the boundary between the first portion P1 and the second portion P2 may be removed by, for example, irradiating the substrate with a laser from above.

[0099] The first via wiring may have a similar configuration to the second via wiring 222B. Also, in addition to the first portion P1, the second portion P2, and the third portion P3, the first via wiring may have a plurality of other portions.

[0100] The present disclosure is not limited to the above-described embodiments, and design modifications are possible without departing from the scope of the present disclosure. For example, the respective characteristic points of the first to third embodiments may be combined in various ways.

[0101] In the above embodiment, the inductor wiring corresponds to the first internal wiring and the columnar wiring corresponds to the second internal wiring, but the first internal wiring and the second internal wiring are not limited to these. For example, the inductor component may include a first inductor wiring and a second inductor wiring arranged side by side in the Z direction, and the first internal wiring may be the first inductor wiring and the second internal wiring may be the second inductor wiring.

[0102] The present disclosure includes the following aspects. <1> The body and a first internal wiring and a second internal wiring provided within the element body; an interlayer insulating layer provided within the element body, disposed between the first internal wiring and the second internal wiring, the interlayer insulating layer having a first main surface on the side of the first internal wiring, a second main surface on the side of the second internal wiring, and a via hole penetrating between the first main surface and the second main surface; a via wiring that is inserted into the via hole and electrically connects the first internal wiring and the second internal wiring; Equipped with In a first cross section including a central axis of the via wiring, an inductor component, wherein the via wiring has a first portion in contact with the first internal wiring and a second portion in contact with the second internal wiring, the width of the first portion narrowing from the first internal wiring to the second internal wiring, and the width of the second portion widening from the first internal wiring to the second internal wiring. <2> In a second cross section including the central axis of the via wiring and perpendicular to the first cross section, a width of the first portion narrows from the first internal wiring toward the second internal wiring, and a width of the second portion widens from the first internal wiring toward the second internal wiring; <1> 2. An inductor component according to claim 1 . <3> the first portion and the second portion are in contact; the first portion includes a first end face in contact with the first internal wiring and a second end face in contact with the second portion, the second portion includes a first end face in contact with the second internal wiring and a second end face in contact with the first portion, In the first cross section, a width of the second end surface of the first portion and a width of the second end surface of the second portion are the same; a width of the first end surface of the first portion and a width of the first end surface of the second portion are greater than a width of the second end surface of the first portion and a width of the second end surface of the second portion; <1> or <2> 2. An inductor component according to claim 1 . <4> In the first cross section, The width of the second end surface of the first portion is greater than 0.8 times the width of the first end surface of the first portion. <3> 2. An inductor component according to claim 1 . <5> The body and a first internal wiring and a second internal wiring provided within the element body; an interlayer insulating layer provided within the element body, disposed between the first internal wiring and the second internal wiring, the interlayer insulating layer having a first main surface on the side of the first internal wiring, a second main surface on the side of the second internal wiring, and a via hole penetrating between the first main surface and the second main surface; a via wiring that is inserted into the via hole and electrically connects the first internal wiring and the second internal wiring; Equipped with In a first cross section including a central axis of the via wiring, An inductor component, wherein the via wiring has a first portion in contact with the first internal wiring and a second portion in contact with the second internal wiring, the width of the first portion increasing from the first internal wiring to the second internal wiring, and the width of the second portion decreasing from the first internal wiring to the second internal wiring. <6> In a second cross section including the central axis of the via wiring and perpendicular to the first cross section, a width of the first portion becomes wider from the first internal wiring toward the second internal wiring, and a width of the second portion becomes narrower from the first internal wiring toward the second internal wiring; <5> 2. An inductor component according to claim 1 . <7> an external terminal provided on a side of the element body closer to the second internal wiring than the first internal wiring and electrically connected to the second internal wiring; the first portion includes a first end surface in contact with the first internal wiring, and the second portion includes a first end surface in contact with the second internal wiring; In the first cross section, The width of the first end surface of the second portion is greater than the width of the first end surface of the first portion. <1> from <6> 13. An inductor component according to any one of the above. <8> The average surface roughness of the inner surface of the via hole is 1 μm or less. <1> from <7> 13. An inductor component according to any one of the above. [Explanation of symbols]

[0103] 1, 1A, 1B Inductor Components 10 Base 11 First magnetic layer 12 Second magnetic layer 21 1st vertical wiring 211 1st pillar wiring 212 First via wiring 22 2nd vertical wiring 221 2nd pillar wiring 222, 222A, 222B Second via wiring 30 Insulating layer 31 Interlayer insulation layer 31a 1st principal surface 31b 2nd principal surface 31h Via hole 32 Resin Wall 33 Undercoat insulation layer 51 First external terminal 52 Second external terminal 60 Coating membrane 70 Substrate 81,82 Seed layer 100 Inductor wiring 111 First pad section 112 Second pad section 120 Spiral Section 310 Photosensitive insulating layer 320 Resist film C recess P convex part d Distance W1~W8 width AX center axis P1 Part 1 P2 2nd part P3 3rd part P1e1: First end face of the first portion P1e2 Second end face of the first part P2e1: First end face of the second part P2e2: Second end face of the second portion

Claims

1. The body and a first internal wiring and a second internal wiring provided within the element body; an interlayer insulating layer provided within the element body and disposed between the first internal wiring and the second internal wiring, the interlayer insulating layer having a first main surface on the first internal wiring side, a second main surface on the second internal wiring side, and a via hole penetrating between the first main surface and the second main surface; a via wiring inserted into the via hole and electrically connecting the first internal wiring and the second internal wiring; Equipped with In a first cross section including a central axis of the via wiring, the via wiring has a first portion in contact with the first internal wiring and a second portion in contact with the second internal wiring, the width of the first portion narrowing from the first internal wiring toward the second internal wiring, and the width of the second portion widening from the first internal wiring toward the second internal wiring, an external terminal provided on a side of the element body closer to the second internal wiring than the first internal wiring and electrically connected to the second internal wiring; the first portion includes a first end surface in contact with the first internal wiring, and the second portion includes a first end surface in contact with the second internal wiring; In the first cross section, A width of the first end surface of the second portion is greater than a width of the first end surface of the first portion. Inductor components.

2. In a second cross section including a central axis of the via wiring and perpendicular to the first cross section, 2. The inductor component according to claim 1, wherein a width of the first portion narrows from the first internal wiring to the second internal wiring, and a width of the second portion widens from the first internal wiring to the second internal wiring.

3. the first portion and the second portion are in contact; the first portion includes a first end face in contact with the first internal wiring and a second end face in contact with the second portion, the second portion includes a first end face in contact with the second internal wiring and a second end face in contact with the first portion, In the first cross section, a width of the second end surface of the first portion and a width of the second end surface of the second portion are the same; The inductor component of claim 1 , wherein a width of the first end face of the first portion and a width of the first end face of the second portion are greater than a width of the second end face of the first portion and a width of the second end face of the second portion.

4. In the first cross section, The inductor component according to claim 3 , wherein a width of the second end surface of the first portion is greater than 0.8 times a width of the first end surface of the first portion.

5. The body and a first internal wiring and a second internal wiring provided within the element body; an interlayer insulating layer provided within the element body and disposed between the first internal wiring and the second internal wiring, the interlayer insulating layer having a first main surface on the first internal wiring side, a second main surface on the second internal wiring side, and a via hole penetrating between the first main surface and the second main surface; a via wiring inserted into the via hole and electrically connecting the first internal wiring and the second internal wiring; Equipped with In a first cross section including a central axis of the via wiring, An inductor component, wherein the via wiring has a first portion in contact with the first internal wiring and a second portion in contact with the second internal wiring, the width of the first portion becoming wider from the first internal wiring to the second internal wiring, and the width of the second portion becoming narrower from the first internal wiring to the second internal wiring.

6. In a second cross section including a central axis of the via wiring and perpendicular to the first cross section, The inductor component according to claim 5 , wherein a width of the first portion increases from the first internal wiring toward the second internal wiring, and a width of the second portion decreases from the first internal wiring toward the second internal wiring.

7. an external terminal provided on a side of the element body closer to the second internal wiring than the first internal wiring and electrically connected to the second internal wiring; the first portion includes a first end surface in contact with the first internal wiring, and the second portion includes a first end surface in contact with the second internal wiring; In the first cross section, The inductor component according to claim 5 , wherein a width of the first end face of the second portion is greater than a width of the first end face of the first portion.

8. 8. The inductor component according to claim 1, wherein an average value of surface roughness of the inner surface of the via hole is 1 [mu]m or less.

Images