Electrostatic Edge Ring Attachment System for Substrate Processing

Abstract

An edge ring system includes a substrate support configured to support a substrate during plasma processing, the edge ring system including a base plate and an upper layer disposed on the base plate. The edge ring support includes a first body and an electrostatic clamping electrode disposed on the first body. The edge ring support is disposed above the base plate and radially outward of the substrate during processing. The edge ring includes a second body disposed on the edge ring support and electrostatically clamped to the edge ring support during plasma processing.

Description

[Technical field]

[0001] [CROSS REFERENCE TO RELATED APPLICATIONS] This application claims the benefit of U.S. Provisional Application No. 62 / 969,933, filed February 4, 2020, the disclosure of which is incorporated herein by reference in its entirety.

[0002] The present disclosure relates to substrate processing systems, and more particularly to an edge ring attachment system for a substrate support of a substrate processing system. [Background technology]

[0003] The background discussion provided herein is intended to generally present the context of the present disclosure. To the extent described in this background section, aspects of the inventors' work as currently set forth, and the discussion that may not qualify as prior art at the time of filing, are not admitted, expressly or impliedly, to be prior art against the present disclosure.

[0004] Substrate processing systems may be used to etch films on substrates, such as semiconductor wafers. Substrate processing systems typically include a process chamber, a gas distribution system, and a substrate support. During processing, the substrate is placed on the substrate support. A mixture of various gases may be introduced into the process chamber, and a radio frequency (RF) plasma may be used to activate chemical reactants.

[0005] The substrate support typically has a ceramic top layer bonded to a base plate. An edge ring is typically supported on the base plate or another structure and is positioned radially outward of the substrate during processing. The edge ring is used to modify the action of the plasma on the substrate.

[0006] In older technology nodes, edge rings of various different shapes and / or positions relative to the substrate can be used to control and / or tune the etch rate and / or substrate slope uniformity. Additional tuning can be achieved by adjusting and controlling the RF voltage coupling impedance between the edge ring and the substrate support. However, newer technology nodes require more precise edge slope tuning.

[0007] Edge slope uniformity may be improved using a thermal interface material (TIM) located under the edge ring. The TIM provides adequate thermal performance / edge ring temperature under high plasma loads. However, the TIM must be replaced every time the process chamber is cleaned. However, removing and replacing the TIM is tedious, which results in relatively long chamber opening and closing times and reduced customer satisfaction. Summary of the Invention

[0008] An edge ring system includes a substrate support configured to support a substrate during plasma processing. The edge ring system includes a base plate and an upper layer disposed on the base plate. The edge ring support includes a first body and an electrostatic clamping electrode disposed on the first body. The edge ring support is disposed above the base plate and radially outward of the substrate during processing. An edge ring includes a second body disposed on the edge ring support and electrostatically clamped during plasma processing. The edge ring is disposed between the edge ring support and plasma generated during plasma processing.

[0009] In other features, a supply conductor is configured to supply power to the electrostatic clamping electrode. A gas supply line is configured to supply gas between the edge ring and the edge ring support. The supply conductor and the gas supply line pass through the base plate.

[0010] In other features, a gas supply line supplies gas to a recess defined by at least one of the edge ring support and the edge ring between the edge ring support and the edge ring. The second body of the edge ring support further comprises a recess on an upper surface of the edge ring support facing the edge ring. The first body of the edge ring further comprises a recess on a lower surface of the edge ring facing the edge ring support. The gas supply line passes through a portion of the base plate.

[0011] In other features, a first outer edge ring is disposed radially outward of the edge ring and the edge ring support. A first seal is disposed between an inner surface of the first outer edge ring and an outer surface of the base plate.

[0012] In other features, a second outer edge ring is disposed radially outward from the first outer edge ring. A second seal is disposed between an inner surface of the second outer edge ring and an outer surface of the first outer edge ring. The edge ring support is bonded to an upper surface of the base plate. A thermal interface material is disposed between the edge ring support and the upper surface of the base plate. The edge ring is not bonded to the edge ring support.

[0013] In other features, the second body of the edge ring has a protrusion on its lower radially inner surface, the protrusion extending radially inward of the radially outer surface of the substrate. An annular ring is disposed below the edge ring and radially outward of the edge ring support. The annular ring includes a third body and an electrode disposed on the third body.

[0014] In other features, a first outer edge ring is disposed radially outward of the edge ring and the edge ring support. A first seal is disposed between an inner surface of the first outer edge ring and a base plate radially inward of the annular ring. An annular ring is disposed below the edge ring, radially outward of the edge ring support and radially inward of the first outer edge ring. The annular ring includes a third body and an electrode disposed on the third body. A seal is disposed between the annular ring and the first outer edge ring.

[0015] In other features, a first outer edge ring is disposed radially outward of the edge ring and the edge ring support. A supply conductor is configured to supply power to the electrostatic clamping electrode. A gas supply line is configured to supply gas between the edge ring and the edge ring support. At least one of the supply conductor and the gas supply line passes through the first outer edge ring.

[0016] In other features, the supply conductors and gas supply lines pass through the first outer edge ring but not through the base plate. A first outer edge ring is disposed radially outward of the edge ring and the edge ring support. A threaded recess is located in the edge ring support. A rod received in the threaded recess is configured to mechanically clamp the edge ring support to the first outer edge ring.

[0017] In other features, an electrode is disposed on the edge ring support. A first supply conductor is configured to supply power to the electrostatic clamping electrode. A gas supply line is configured to supply gas between the edge ring and the edge ring support. A second supply conductor is configured to supply power to the electrode.

[0018] In other features, a first outer edge ring is disposed radially outward of the edge ring and edge ring support, the first supply conductor and gas supply line passing through the base plate, and the second supply conductor passing through the first outer edge ring.

[0019] In other features, a first outer edge ring is disposed radially outward of the edge ring and the edge ring support. A threaded recess is located in the edge ring support. A rod is received in the threaded recess configured to mechanically clamp the edge ring support to the first outer edge ring.

[0020] Further areas of applicability of the present disclosure will become apparent from the detailed description, the claims and the drawings. The detailed description and specific examples are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure. [Brief description of the drawings]

[0021] The present disclosure will become more fully understood from the detailed description and the accompanying drawings, wherein:

[0022] [Figure 1A] 1 illustrates a cross-sectional side view of an example of a substrate support having an edge ring system according to the present disclosure.

[0023] [Figure 1B] FIG. 1B is a detailed view of the upper edge ring of FIG. 1A.

[0024] [Figure 2A] FIG. 2 is a top plan view of a gas channel located on the top surface of the edge ring support.

[0025] [Figure 2B] FIG. 2 is a top plan view of a gas channel located on the underside of the edge ring support.

[0026] [Diagram 3] 13 is a cross-sectional side view of another example of a substrate support including an edge ring assembly according to the present disclosure. [Figure 4] 13 is a cross-sectional side view of another example of a substrate support including an edge ring assembly according to the present disclosure. [Diagram 5] 13 is a cross-sectional side view of another example of a substrate support including an edge ring assembly according to the present disclosure. [Figure 6] 13 is a cross-sectional side view of another example of a substrate support including an edge ring assembly according to the present disclosure. [Figure 7] 13 is a cross-sectional side view of another example of a substrate support including an edge ring assembly according to the present disclosure. [Figure 8] 13 is a cross-sectional side view of another example of a substrate support including an edge ring assembly according to the present disclosure. [Figure 9] 13 is a cross-sectional side view of another example of a substrate support including an edge ring assembly according to the present disclosure.

[0027] In the drawings, numbers may be reused to identify similar and / or identical elements. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0028] Systems and methods according to the present disclosure may be used to improve edge slope uniformity in a substrate processing system. In some examples, the substrate processing system generates a capacitively coupled RF plasma using upper and lower electrodes located in a processing chamber. The substrate is disposed on a substrate support including a lower electrode. A plasma is generated between the substrate and the upper electrode. The substrate includes an edge ring concentrically surrounding the lower electrode. In some examples, the edge ring includes an RF electrode for generating a secondary plasma.

[0029] The substrate processing system includes one or more components for holding the edge ring so that the edge ring can be quickly replaced during chamber cleaning while ensuring adequate thermal conductance between the edge ring and the base plate. In some examples, the edge ring is held to an element, such as an edge ring support, located below the edge ring using an electrostatic clamp. In some examples, a thermally conductive gas is provided between the edge ring and the element located below the edge ring to cool the edge ring. In some examples, the edge ring support is bonded or mechanically clamped to the outer edge ring. In some examples, a seal is used to provide a vacuum break between the vacuum process in the processing chamber and the area below the substrate. In other processes, the seal may be omitted.

[0030] 1A, a portion of a substrate processing system including an edge ring is shown. A substrate support 100 supports a substrate 110 disposed on an upper surface of an upper layer 112 during processing. In some examples, the upper layer 112 is made of a material such as ceramic, although other materials can be used. The upper layer 112 is affixed via a bonding layer 114 to a base plate 116 disposed below the upper layer 112. The base plate 116 includes a number of cooling channels 118. A coolant supply tube 122 supplies fluid to the number of cooling channels 118. In some examples, the base plate 116 is affixed to a lower plate 126, which may also be referred to as a fixture plate.

[0031] A number of electrostatic clamping electrodes 132 are disposed on the upper layer 112. A clamp supply conductor 136 supplies a voltage to the electrostatic clamping electrodes 132 when electrostatic clamping is required. The upper surface of the upper layer 112 has one or more gas channels 140 supplied by gas supply lines 146. A thermally conductive gas, such as helium, may be supplied to the gas channels 140 to enhance heat transfer from the substrate to the upper layer 112 during processing. The gas channels 140 may define a gas channel pattern (not shown) on a substrate-facing surface of the upper layer 112 underlying the substrate 110.

[0032] The upper edge ring 150 has an annular body 152. In some examples, the annular body 152 has a generally rectangular cross-section and has an annular protrusion 154. In some examples, the upper edge ring 150 is made of a plasma resistant material such as silicon, silicon carbide, silicon oxide, ceramic, or another suitable material. In some examples, the annular protrusion 154 protrudes radially inward from an inner lower surface of the annular body 152. In some examples, the annular protrusion 154 extends at least partially below a radially outer edge of the substrate 110.

[0033] An example of an upper edge ring 150 is shown in more detail in Figure IB. As shown, one or more corners of the upper edge ring 150 may be rounded and chamfered, or partially rounded and partially chamfered. For example, one or more of the lower inner corner 155, the upper outer corner 156, and the lower outer corner 157 may be rounded or chamfered. A portion of the lower inner corner 155 (e.g., a lower portion) may be rounded and another portion of the lower inner corner 155 (e.g., an upper portion) may be chamfered.

[0034] The upper edge ring 150 rests on an edge ring support 160. The edge ring support 160 includes a body 161 and an electrostatic clamping electrode 162 disposed on the body 161. When electrostatic clamping of the upper edge ring 150 is desired, a clamp supply conductor 164 supplies power to the electrostatic clamping electrode 162. In some examples, a groove or recess 166 is formed in the upper surface of the edge ring support 160, or a groove or recess 196 (dashed line) is formed in the lower surface of the upper edge ring 150. The height or depth, width and lateral location of the recess 166 / 196 may vary. A gas supply line 168 supplies gas to the recess 166 / 196 during processing to enhance heat transfer between the upper edge ring 150 and the edge ring support 160. The body 161 of the edge ring support 160 is bonded to the upper surface or shoulder of the base plate 116 by a bonding layer 169.

[0035] Referring again to FIG. 1B, the recess 196 may have a width, depth, and lateral position that optimizes heat transfer. For example, the width and depth of the recess 196 may determine the volume and distribution of the heat transfer gas within the recess 196. Increasing the depth of the recess 196 may decrease the heat transfer capacity. Conversely, decreasing the depth of the recess 196 and increasing the width of the recess 196 increases the heat transfer capacity. Thus, the depth of the recess 196 may be less than 1 mil (i.e., 0.001 inch, or 0.0254 mm). In some examples, the depth of the recess 196 is between 0.0001 and 0.0005 inches (i.e., 0.00254 and 0.0127 mm). Thus, the depth of the recess 196 is relatively shallow to facilitate heat transfer, and as the depth of the recess 196 increases, the heat transfer capacity decreases significantly. For example, if the depth of the recess 196 exceeds 10 mils, the heat transfer may become inefficient.

[0036] The width of the recess 196 may be further optimized to tune both heat transfer capability and clamping effectiveness. As the width of the recess 196 increases, the width of the clamping regions 158 on either side of the recess 196 decreases, thereby decreasing the clamping effectiveness. In other words, the smaller the surface area of ​​the regions 158 on either side of the recess 196, the less clamping effectiveness provided by the clamping electrode 162. Conversely, as the width of the recess 196 decreases, the width of the clamping regions 158 increases, thereby increasing the clamping effectiveness. In this manner, the width of the recess 196 can be tuned to balance heat transfer and clamping effectiveness for a given edge ring assembly.

[0037] In one embodiment, the width of the recess 196 (or the sum of the widths of the recesses) is at least 25% of the width of the upper edge ring 150. In another embodiment, the width of the recess 196 (or the sum of the widths of the recesses) is at least 35% of the width of the upper edge ring 150. In another embodiment, the width of the recess 196 (or the sum of the widths of the recesses) is at least 40% of the width of the upper edge ring 150. In another embodiment, the width of the recess 196 (or the sum of the widths of the recesses) is at least 50% of the width of the upper edge ring 150.

[0038] A first outer edge ring 170 is disposed radially outward of the base plate 116, the upper edge ring 150, and the edge ring support 160. The first outer edge ring 170 has a body 172 and a first annular step 174 and a second annular step 176, the annular steps projecting radially inward from the body 172. The first annular step 174 is disposed at least partially below the radially outer edge of the upper edge ring 150. The second annular step 176 is located at least partially below the first annular step 174. The second annular step 176 is also disposed at least partially below the radially outer edge of the base plate 116 and / or the upper edge ring 150. An upper surface of the second annular step 176 has an annular groove 177. In some examples, a seal 178, such as an O-ring, is disposed in the annular groove 177. The clamp supply conductors 164 and / or gas supply lines 168 may pass through the base plate 116, the first outer edge ring 170, and / or other components.

[0039] The second outer edge ring 180 has an annular body 182 and an annular projection 184 projecting radially inward from a central portion of the annular body 182. The upper surface of the annular projection 184 has an annular groove 186. A seal 188, such as an O-ring, is disposed in the annular groove 186.

[0040] A shaped seal 194 is disposed radially outward of top layer 112, bonding layer 114, and base plate 116 and is used to protect bonding layer 114 during processing. A shaped seal 195 is also disposed radially outward of edge ring support 160 and base plate 116 and is used to protect bonding layer 169. However, shaped seals 194 and 195 do not cause a vacuum break.

[0041] In some examples, a first space above the substrate support is at vacuum during processing and a second space below the substrate support is at atmospheric pressure. Seals 178 and 188 provide a vacuum break. In other words, seals 178 and 188 separate the vacuum in the first space from the atmospheric pressure in the second space.

[0042] The lower surface of the upper edge ring 150 rests on the upper surface of the edge ring support 160. In some examples, the upper edge ring 150 is not glued or bonded to the edge ring support 160. Furthermore, there is no seal (such as an O-ring seal) disposed between the upper edge ring 150 and the edge ring support 160. The edge ring support 160 is bonded to the base plate 116. In some embodiments, the edge ring support 160 may not be bonded to the base plate 116.

[0043] 2A, the recess 166 is shown in more detail on the top surface of the edge ring support 160. For example, the recess 166 defines an annular channel. In some examples, the recess 166 may further include radial arms 167 extending inwardly and outwardly from the recess 166 to increase the heat exchange surface area. In other examples, the radial arms are omitted. The bottom surface of the upper edge ring 150 may be flat or may include recesses as described below. Although a particular shape is shown, the recess 166 and / or the radial arms 167 may be other shapes. For example, the recess 166 may not include the radial arms 167, may be the same or different lengths or spacing, the radial arms 167 may be curved, etc. In other examples, the recess 166 may be serpentine, more than one recess 166 may be disposed on the edge ring support 160, etc.

[0044] Although the recess 166 is shown on the top surface of the edge ring support 160, the bottom surface 150 of the upper edge ring can have a recess 196 in addition to or instead of the recess 166 on the edge ring support 160. Referring now to FIG. 2B, the recess 196 is located on the bottom surface of the upper edge ring 150 and defines an annular channel or groove. In some examples, the top surface of the edge ring support 160 can be flat or can have the recess 166. In some examples, the recess 196 can further have radial arms 198 extending inwardly and outwardly from the recess to increase the heat exchange area. Although a particular shape is shown, the recess 196 and / or the radial arms 198 can have other shapes. In some examples, the recess can form both the bottom surface of the upper edge ring 150 and the top surface of the edge ring support 160. In other examples, the recess and the radial arms can be clocked, rotated relative to each other, or have different shapes.

[0045] Although a particular shape is shown, the recesses 196 and / or radial arms 198 may have other shapes. For example, the recesses 196 may not have radial arms 198, may be the same or different lengths or spacing, the radial arms 198 may be curved, etc. In other examples, the recesses 196 may be serpentine, two or more recesses 196 may be disposed in the edge ring support upper edge ring 150, etc.

[0046] When the upper edge ring 150 wears due to exposure to the plasma, it is removed and replaced. Replacement may occur after processing a predetermined number of substrates, after a predetermined amount of exposure to plasma, and / or using other criteria. In some examples, a sensor may be used to monitor edge ring wear, and the upper edge ring 150 is replaced when a predetermined amount of wear is detected.

[0047] During processing, power is provided to the electrostatic clamping electrode 162 to clamp the upper edge ring 150 against the edge ring support 160. In some examples, a plasma may be struck in the processing chamber. A thermally conductive gas is provided in the recess 166 to transfer heat from the upper edge ring 150 to the body 161 during plasma processing. Examples of thermally conductive gases that may be used include, but are not limited to, helium, nitrogen, and argon.

[0048] As can be seen, the upper edge ring 150 is held in place on the edge ring support 160 by an electrostatic clamping force. In some examples, the edge ring support 160 is bonded to a shoulder of the base plate 116. In some examples, the electrostatic clamping electrode 162 of the edge ring support 160 is a high voltage (HV) pole for bipolar / monopolar electrostatic clamping. In some examples, the upper edge ring 150 uses gas and channels to distribute the gas evenly under the upper edge ring 150 to help remove heat from the upper edge ring 150.

[0049] For example, a process may require the upper edge ring 150 to be a predetermined temperature range hotter than the top layer 112. For example, the predetermined temperature range may be 100° C. + / - 10° C. A flow rate of thermally conductive gas can be supplied and regulated in the recess 166 between the upper edge ring 150 and the edge ring support 160 to control the temperature within the predetermined temperature range.

[0050] 3, another example of the substrate support 100 includes an annular ring with RF electrodes to further control process performance using variable RF power to the RF electrodes. The electrostatic ring support 310 includes a body 311 and an electrostatic clamping electrode 312 disposed in the body 311. The electrostatic ring support 310 extends inwardly for approximately the same radial distance as the upper edge ring 150. The electrostatic ring support 310 extends outwardly only partially below the upper edge ring 150.

[0051] When electrostatic clamping of the upper edge ring 150 is desired, a clamp supply conductor 314 provides power to the electrostatic clamping electrode 312. In some examples, a recess 316 is formed in the upper surface of the electrostatic ring support 310 (or in the lower surface of the edge ring 150). A gas supply line 318 supplies a thermally conductive gas to the annular recess 316 during processing to transfer heat from the upper edge ring 150 to the electrostatic ring support 310.

[0052] A first outer edge ring 330 is disposed radially outward of the base plate 116, the upper edge ring 150 and the electrostatic ring support 310. The first outer edge ring 330 has a body 331 and first, second and third annular steps 332, 334 and 336 projecting radially inward from the body 331. The first annular step 332 is disposed at least partially below a radially outer edge of the upper edge ring 150. The second annular step 334 is disposed at least partially below the annular ring 340 and the upper edge ring 150.

[0053] An annular ring 340 is positioned below the radially outer surface of the upper edge ring 150, between the first outer edge ring 330 and the base plate 116 and / or upper edge ring 150. The annular ring 340 includes a body 341 and an RF electrode 344. A feed conductor 346 provides RF power to the RF electrode 344.

[0054] The upper surface of the second annular step 334 has an annular groove 350. A seal 352, such as an O-ring, is disposed in the annular groove 350 to provide a seal between the annular ring 340 and the upper surface of the second annular step 334 (around the clamp supply conductor 346). The third annular step 336 has an annular groove 354 in its upper surface and a seal 356, such as an O-ring, disposed in the annular groove 354.

[0055] 4-6, other edge ring assemblies are shown. Power lines, gas lines and / or seals can be located elsewhere and / or mechanical clamps can be used. In FIG. 4, the gas supply lines and clamp supply conductors do not penetrate the base plate 116. The electrostatic ring support 410 includes a body 411 and an electrostatic clamping electrode 412. A clamp supply conductor 414 supplies a voltage to the electrostatic clamping electrode 412 when electrostatic clamping of the upper edge ring 150 is desired. In some examples, a recess 416 is annular in shape and is formed in the upper surface of the electrostatic ring support 410. A gas supply line 418 supplies a thermally conductive gas to the recess 416 during processing to aid in transferring heat from the upper edge ring 150 to the electrostatic ring support 410.

[0056] A first outer edge ring 430 is disposed radially outward of the base plate 116, the upper edge ring 150, and the electrostatic ring support 410. The first outer edge ring 430 has a body 432 and a first annular step 434, a second annular step 436, and a third annular step 438 projecting radially inward from the body 432. The first annular step 434 is disposed at least partially below the radially outer edge of the upper edge ring 150. The second annular step 436 is disposed at least partially below the electrostatic ring support 410 and the upper edge ring 150. The third annular step 438 is disposed at least partially below the base plate 116. The clamp supply conductor 414 and the gas supply line 418 pass through the first outer edge ring 430 but not through the base plate 116.

[0057] The inner surface of the first outer edge ring 430 between the first annular step 434 and the second annular step 436 has a groove 440 and a seal 442, such as an O-ring, disposed in the groove 440. As can be appreciated, the seal 442 may be disposed in other locations. For example, in FIG. 5, the top surface of the second annular step 436 has a groove 510 and an O-ring seal 514 disposed in the groove 510.

[0058] 6, a mechanical clamp is used to hold the electrostatic ring support 410 against an underlying component such as the outer edge ring 430. The electrostatic ring support 410 has a threaded recess 610 for receiving a threaded rod 612 to a motor or other device (not shown) to provide the downward mechanical force when needed. In some examples, the rod 612 is made of plastic or another non-metallic material.

[0059] 7-9, another edge ring assembly is shown. In FIG. 7, an electrostatic ring support 710 includes an electrostatic clamping electrode 712 and an RF electrode 740. A clamping supply conductor 718 provides power to the electrostatic clamping electrode 712 when electrostatic clamping of the upper edge ring 150 is desired. In some examples, a recess 716 is formed in the upper surface of the electrostatic ring support 710 and / or the lower surface of the edge ring 150. A gas supply line 714 provides a thermally conductive gas to the recess 716 during processing to aid in transferring heat from the upper edge ring 150 to the electrostatic ring support 710. The electrostatic ring support 710 further includes an RF electrode 740 and an RF supply conductor 744 to provide power to the RF electrode 740.

[0060] In this example, the gas supply line 714 and the clamp supply conductor 718 pass through the base plate 116, and the RF supply conductor 744 passes through the outer edge ring 430. However, the gas supply line 714, the clamp supply conductor 718, and the RF supply conductor 744 can pass through either the base plate 116 or the outer edge ring 430.

[0061] In Figure 8, a thermal interface material (TIM) 810 is located between the electrostatic ring support 710 and the base plate 116 to provide heat transfer. In this embodiment, the electrostatic ring support 710 may not be bonded to the base plate 116. In other words, the TIM 810 does not provide adhesion or bonding and thus requires a new mechanism (e.g., a bonding layer, the electrostatic clamps described above, mechanical clamps, etc.). The TIM 810 may be optionally provided in any of the examples described in Figures 1-7.

[0062] In Figure 9, a mechanical clamp is used to mechanically clamp the electrostatic ring support 710. The electrostatic ring support 710 further has a threaded recess 910 that receives a threaded rod 912 connected to a motor or other device to provide a downward mechanical force when needed. In some examples, the rod 912 is made of plastic or a non-metallic material. The TIM 810 of Figure 8 may be optionally provided in the example depicted in Figure 9.

[0063] In any of the examples shown in Figures 3-9, the recesses 196 described in Figures 1A and 1B may be provided in the upper edge ring 150 instead of, or in addition to, recesses in the corresponding edge ring supports, electrostatic ring supports, etc.

[0064] The use of an electrostatically clamped edge ring eliminates the need for time-consuming TIM application / removal processes during every ESC wet clean (which may be performed, for example, once every 1-3 months depending on the process), increasing customer satisfaction and reducing production costs. Supplying a thermally conductive gas to the recess between the edge ring and the edge ring support allows for control of the edge ring temperature by varying the delivery pressure. Varying edge ring grooves / patterns / depths / widths allows for flexible thermal control of the edge ring temperature, as described in more detail above. For example:

[0065] The high voltage connections and / or gas supply lines can pass through the outer edge ring instead of the base plate, making the substrate support cheaper to manufacture and enabling new flexibility, reducing RF coupling between the high voltage connections and the base plate, simplifying RF filtering in the DC circuits, and reducing the chance of arcing / lighting around the high voltage connections and gas supply lines.

[0066] The electrostatic and RF electrode implementation simplifies the overall design and assembly. The control of RF impedance / coupling between the RF electrode and the edge ring is more accurate and repeatable than other approaches. Also, the ability to create a vacuum break below the edge ring assembly improves resistance to arcing / lighting in the termination area.

[0067] The above description is merely illustrative and is not intended to limit the disclosure, its application, or uses in any way. The broad teachings of the disclosure can be embodied in a variety of forms. Thus, while the disclosure includes specific examples, the actual scope of the disclosure should not be so limited, since other modifications will become apparent upon study of the drawings, the specification, and the following claims. It should be understood that one or more steps of a method may be performed in different orders (or simultaneously) without altering the principles of the disclosure. Furthermore, although each embodiment has been described above as having specific features, any one or more of such features described with respect to any embodiment of the disclosure may be implemented in any other embodiment and / or combined with features of any other embodiment, even if the combination is not expressly described. In other words, the described embodiments are not mutually exclusive, and one or more embodiments may be substituted for one another and still be within the scope of the disclosure.

[0068] The spatial and functional relationships between elements (e.g., between modules, between circuit elements, between semiconductor layers, etc.) are described using various terms such as "connected," "engaged," "coupled," "adjacent," "next to," "on top of," "above," "below," and "disposed." Unless expressly described as "direct," when a relationship between a first element and a second element is described in the above disclosure, the relationship may be a direct relationship with no other intervening elements between the first element and the second element, but may also be an indirect relationship with one or more intervening elements (spatially or functionally) between the first element and the second element. As used herein, the phrase at least one of A, B, and C should be construed to mean (A or B or C) using a non-exclusive logical OR, indicating the logic, and not to mean "at least one of A, at least one of B, and at least one of C." The present disclosure includes the following application examples: [Application example 1] 1. An edge ring system, comprising: a substrate support configured to support a substrate during plasma processing, the substrate support including a base plate and an upper layer disposed on the base plate; an edge ring support including a first body and an electrostatic clamping electrode disposed on the first body, the edge ring support being positioned above the base plate and radially outward of the substrate during processing; and an edge ring including a second body disposed on the edge ring support and electrostatically clamped thereto during plasma processing; having An edge ring system, wherein the edge ring is at least partially disposed on top of the edge ring support. [Application example 2] The edge ring system according to Application Example 1, a supply conductor configured to supply power to the electrostatic clamping electrode; and A gas supply line configured to supply gas between the edge ring and the edge ring support The edge ring system further comprises: [Application example 3] An edge ring system according to application example 2, wherein the supply conductor and the gas supply line penetrate the base plate. [Application example 4] An edge ring system as described in Application Example 1, further comprising a gas supply line between the edge ring support and the edge ring for supplying gas to a recess defined by at least one of the edge ring support and the edge ring. [Application example 5] An edge ring system as described in Application Example 4, wherein the second body of the edge ring support further has the recess on an upper surface of the edge ring support facing the edge ring. [Application Example 6] An edge ring system as described in Application Example 4, wherein the first body of the edge ring further has the recess on a lower surface of the edge ring facing the edge ring support. [Application Example 7] 5. The edge ring system according to claim 4, wherein the gas supply line penetrates a portion of the base plate. [Application Example 8] An edge ring system as described in Application Example 1, further comprising a first outer edge ring arranged radially outward of the edge ring and the edge ring support. [Application Example 9] An edge ring system as described in Application Example 8, further comprising a first seal disposed between an inner surface of the first outer edge ring and an outer surface of the base plate. [Example 10] An edge ring system as described in Application Example 8, further comprising a second outer edge ring arranged radially outward of the first outer edge ring. [Application Example 11] An edge ring system as described in Application Example 10, further comprising a second seal disposed between the inner surface of the second outer edge ring and the outer surface of the first outer edge ring. [Application Example 12] An edge ring system as described in Application Example 1, wherein the edge ring support is joined to an upper surface of the base plate. [Application Example 13] An edge ring system as described in Application Example 1, further comprising a thermal interface material disposed between the edge ring support and the upper surface of the base plate. [Example 14] An edge ring system as described in Application Example 1, wherein the edge ring is not bonded to the edge ring support. [Example 15] An edge ring system as described in Application Example 1, wherein the second body of the edge ring has a protrusion on its lower radially inner surface, the protrusion extending radially inward of the radially outer surface of the substrate. [Example 16] An edge ring system as described in Application Example 1, further comprising an annular ring arranged below the edge ring and radially outside the edge ring support, the annular ring including a third body and an electrode arranged on the third body. [Application Example 17] The edge ring system according to Application Example 16, a first outer edge ring disposed radially outward of the edge ring and the edge ring support; and a first seal disposed between an inner surface of the first outer edge ring and the base plate radially inward of the annular ring; The edge ring system further comprises: [Example 18] An edge ring system as described in Application Example 17, further comprising an annular ring arranged below the edge ring, radially outside the edge ring support and radially inside the first outer edge ring, the annular ring including a third body and an electrode arranged on the third body. [Example 19] 19. The edge ring system of claim 18, further comprising a seal disposed between the annular ring and the first outer edge ring. [Example 20] The edge ring system according to Application Example 2, a first outer edge ring disposed radially outward of the edge ring and the edge ring support; a supply conductor configured to supply power to the electrostatic clamping electrode; and A gas supply line configured to supply gas between the edge ring and the edge ring support and At least one of the supply conductor and the gas supply line passes through the first outer edge ring. [Example 21] An edge ring system as described in Application Example 20, wherein the supply conductor and the gas supply line pass through the first outer edge ring but not through the base plate. [Example 22] The edge ring system according to Application Example 1, a first outer edge ring disposed radially outward of the edge ring and the edge ring support; a threaded recess located in the edge ring support; and a rod received in the threaded recess configured to mechanically clamp the edge ring support to the first outer edge ring; The edge ring system further comprises: [Example 23] An edge ring system as described in Application Example 1, further comprising an electrode arranged on the edge ring support. [Example 24] The edge ring system according to Application Example 23, a first supply conductor configured to supply power to the electrostatic clamping electrode; a gas supply line configured to supply gas between the edge ring and the edge ring support; and a second supply conductor configured to supply power to the electrode; The edge ring system further comprises: [Example 25] The edge ring system according to Application Example 24, a first outer edge ring disposed radially outward of the edge ring and the edge ring support; and an edge ring system, wherein the first supply conductor and the gas supply line pass through the base plate and the second supply conductor passes through the first outer edge ring; [Example 26] The edge ring system according to Application Example 23, a first outer edge ring disposed radially outward of the edge ring and the edge ring support; a threaded recess located in the edge ring support; and a rod received in the threaded recess configured to mechanically clamp the edge ring support to the first outer edge ring; The edge ring system further comprises:

Claims

1. 1. An edge ring system, comprising: a substrate support configured to support a substrate during plasma processing, the substrate support including a base plate and an upper layer disposed on the base plate; an edge ring support comprising: a first body; and an electrostatic clamping electrode disposed on the first body, the edge ring support being positioned above the base plate and radially outward of the substrate during processing; an edge ring including a second body disposed on the edge ring support and electrostatically clamped during plasma processing, the edge ring being at least partially disposed on top of the edge ring support; and an annular ring disposed below the edge ring and radially outward of the edge ring support, the annular ring including a third body and an electrode disposed on the third body; An edge ring system having

2. 2. The edge ring system of claim 1, a supply conductor configured to supply power to the electrostatic clamping electrode; and A gas supply line configured to supply gas between the edge ring and the edge ring support The edge ring system further comprises:

3. 3. The edge ring system of claim 2, wherein the supply conductor and the gas supply line pass through the base plate.

4. 2. The edge ring system of claim 1, further comprising a gas supply line that supplies gas between the edge ring support and the edge ring to a recess defined by at least one of the edge ring support and the edge ring.

5. 5. The edge ring system of claim 4, wherein the second body of the edge ring support further comprises the recess on a top surface of the edge ring support facing the edge ring.

6. 5. The edge ring system of claim 4, wherein the first body of the edge ring further comprises the recess on a lower surface of the edge ring facing the edge ring support.

7. 5. The edge ring system of claim 4, wherein the gas supply line passes through a portion of the base plate.

8. 10. The edge ring system of claim 1, further comprising a first outer edge ring disposed radially outward of the edge ring and the edge ring support.

9. 9. The edge ring system of claim 8, further comprising a first seal disposed between an inner surface of the first outer edge ring and an outer surface of the base plate.

10. 9. The edge ring system of claim 8, further comprising a second outer edge ring disposed radially outward of the first outer edge ring.

11. 11. The edge ring system of claim 10, further comprising a second seal disposed between an inner surface of the second outer edge ring and an outer surface of the first outer edge ring.

12. The edge ring system of claim 1 , wherein the edge ring support is bonded to an upper surface of the base plate.

13. 10. The edge ring system of claim 1, further comprising a thermal interface material disposed between the edge ring support and a top surface of the base plate.

14. 2. The edge ring system of claim 1, wherein the edge ring is not bonded to the edge ring support.

15. 2. The edge ring system of claim 1, wherein the second body of the edge ring has a protrusion on its lower radially inner surface, the protrusion extending radially inward of the radially outer surface of the substrate.

16. 2. The edge ring system of claim 1, a first outer edge ring disposed radially outward of the edge ring and the edge ring support; and a first seal disposed between an inner surface of the first outer edge ring and the base plate radially inward of the annular ring; The edge ring system further comprises:

17. 17. The edge ring system of claim 16, wherein the annular ring is disposed radially inward of the first outer edge ring.

18. 20. The edge ring system of claim 17, further comprising a second seal disposed between the annular ring and the first outer edge ring.

19. An edge ring system comprising: a substrate support configured to support a substrate during plasma processing, the substrate support including a base plate and an upper layer disposed on the base plate; an edge ring support comprising: a first body; and an electrostatic clamping electrode disposed on the first body, the edge ring support being positioned above the base plate and radially outward of the substrate during processing; an edge ring including a second body disposed on the edge ring support and electrostatically clamped during plasma processing, the edge ring being at least partially disposed on top of the edge ring support; a first outer edge ring disposed radially outward of the edge ring and the edge ring support; a supply conductor configured to supply power to the electrostatic clamping electrode; and A gas supply line configured to supply gas between the edge ring and the edge ring support having At least one of the supply conductor and the gas supply line passes through the first outer edge ring.

20. 20. The edge ring system of claim 19, wherein the supply conductor and the gas supply line pass through the first outer edge ring but not through the base plate.

21. 2. The edge ring system of claim 1, a first outer edge ring disposed radially outward of the edge ring and the edge ring support; a threaded recess located in the edge ring support; and a rod received in the threaded recess configured to mechanically clamp the edge ring support to the first outer edge ring; The edge ring system further comprises:

22. 10. The edge ring system of claim 1 further comprising a second electrode disposed on the edge ring support.

23. 23. The edge ring system of claim 22, a first supply conductor configured to supply power to the electrostatic clamping electrode; a gas supply line configured to supply gas between the edge ring and the edge ring support; and a second supply conductor configured to supply power to the second electrode; The edge ring system further comprises:

24. An edge ring system comprising: a substrate support configured to support a substrate during plasma processing, the substrate support including a base plate and an upper layer disposed on the base plate; an edge ring support comprising: a first body; and an electrostatic clamping electrode disposed on the first body, the edge ring support being positioned above the base plate and radially outward of the substrate during processing; an edge ring including a second body disposed on the edge ring support and electrostatically clamped thereto during plasma processing; an electrode disposed on the edge ring support; a first supply conductor configured to supply power to the electrostatic clamping electrode; a gas supply line configured to supply gas between the edge ring and the edge ring support; a second supply conductor configured to supply power to the electrode; and a first outer edge ring disposed radially outward of the edge ring and the edge ring support; having an edge ring system, wherein the first supply conductor and the gas supply line pass through the base plate and the second supply conductor passes through the first outer edge ring;

25. 23. The edge ring system of claim 22, a first outer edge ring disposed radially outward of the edge ring and the edge ring support; a threaded recess located in the edge ring support; and a rod received in the threaded recess configured to mechanically clamp the edge ring support to the first outer edge ring; The edge ring system further comprises:

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