Substrate processing apparatus and substrate processing method

Abstract

To provide a substrate processing apparatus and a substrate processing method that improves the productivity of the substrate processing apparatus in which a plurality of substrate processing units sequentially process substrates.SOLUTION: A substrate processing apparatus 1 includes a plurality of first substrate processing units 32, one or more second substrate processing units 33, and a transfer unit 31. The first substrate processing unit (liquid processing apparatus) processes substrates one by one with a processing liquid. The second substrate processing unit (drying device) simultaneously dries the plurality of substrates processed by the plurality of first substrate processing units. The transfer unit simultaneously carries the plurality of substrates processed by the plurality of first substrate processing units into the same second substrate processing unit.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] The substrate processing system described in Patent Document 1 includes a plurality of cleaning devices that supply a cleaning liquid to wafers to perform a cleaning process, and a plurality of supercritical processing devices that remove anti-drying liquid (e.g., IPA) remaining on the wafers after the cleaning process by contacting them with a processing fluid (e.g., carbon dioxide) in a supercritical state. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2018-81966 A Summary of the Invention [Problem to be solved by the invention]

[0004] One aspect of the present disclosure provides a technique for improving the productivity of a substrate processing apparatus in which a plurality of substrate processing units process substrates in sequence. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes a plurality of first substrate processing units, one or more second substrate processing units, and a transport unit. The first substrate processing units process substrates one by one. The second substrate processing unit simultaneously processes the plurality of substrates that have been processed in the plurality of first substrate processing units. The transport unit simultaneously loads the plurality of substrates that have been processed in the plurality of first substrate processing units into the same second substrate processing unit. The transport section includes a transport path extending in a horizontal direction. A plurality of the first substrate processing sections for processing a plurality of the substrates to be simultaneously loaded into the same second substrate processing section are symmetrically arranged on either side of the transport path. The second substrate processing section is adjacent to one of the first substrate processing sections that processes the substrates loaded into the second substrate processing section. Effect of the Invention

[0006] According to one aspect of the present disclosure, it is possible to improve the productivity of a substrate processing apparatus in which a plurality of substrate processing sections process substrates in sequence. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment. [Diagram 2] FIG. 2 is a front view of the substrate processing apparatus according to an embodiment. [Diagram 3] FIG. 3 is a side view of the substrate processing apparatus according to an embodiment. [Figure 4] FIG. 4 is a flowchart showing a substrate processing method according to an embodiment. [Diagram 5] FIG. 5(A) is a cross-sectional view of a drying device according to one embodiment, and FIG. 5(B) is a perspective view showing the internal structure of the drying device of FIG. 5(A). [Figure 6] 6A to 6I are plan views showing the operation of a substrate processing apparatus according to one embodiment, in which (A) to (I) are plan views showing a number of steps in order. [Figure 7] FIG. 7 is a plan view of the substrate processing apparatus according to the first modified example. [Figure 8] FIG. 8A is a plan view showing a collision between a first transport mechanism and a second transport mechanism according to a first modified example, and FIG. 8B is a plan view showing a passing between the first transport mechanism and the second transport mechanism. [Figure 9] FIG. 9(A) is a side view of FIG. 8(A), and FIG. 9(B) is a side view of FIG. 8(B). [Figure 10] 10A to 10I are plan views showing the operation of the substrate processing apparatus according to the first modified example, in which (A) to (I) are plan views showing a number of steps in order. [Figure 11] 11A to 11I are plan views showing the operation of the substrate processing apparatus according to the first modified example, following FIG. 10, in which (A) to (I) are plan views showing a number of steps in order. [Figure 12] 12A to 12C are plan views showing the operation of the substrate processing apparatus according to the first modified example, following FIG. 11, in which (A) to (C) are plan views showing a number of steps in order. [Figure 13]FIG. 13 is a plan view showing the operation of the substrate processing apparatus according to the second modified example, where (A) to (G) are plan views showing a number of steps in order. [Figure 14] FIG. 14(A) is a side view showing the stage of FIG. 13(B), and FIG. 14(B) is a side view showing the stage of FIG. 13(F). [Figure 15] FIG. 15 is a plan view showing the operation of a substrate processing apparatus according to a third modified example, where (A) to (F) are plan views showing a number of steps in order. [Figure 16] FIG. 16(A) is a side view showing the stage of FIG. 15(A), FIG. 16(B) is a side view showing the stage of FIG. 15(B), and FIG. 16(C) is a side view showing the stage of FIG. 15(E). [Figure 17] FIG. 17 is a plan view of a substrate processing apparatus according to a fourth modified example. [Figure 18] FIG. 18 is a side view of the substrate processing apparatus according to the fourth modified example. [Figure 19] FIG. 19 is a side view of the substrate processing apparatus according to the fifth modified example. [Figure 20] FIG. 20 is a side view showing a modified example of the conveying section. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In each drawing, the same components are denoted by the same reference numerals, and the description may be omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is vertical.

[0009] First, a substrate processing apparatus 1 according to an embodiment will be described with reference to Figures 1 to 3. As shown in Figure 1, the substrate processing apparatus 1 includes a loading / unloading station 2 and a processing station 3. The loading / unloading station 2 and the processing station 3 are provided adjacent to each other in the Y-axis direction.

[0010] The loading / unloading station 2 includes a carrier placement section 21, a second transport section 22, and a delivery section 23. The carrier placement section 21 is where the carrier C is placed. The carrier C accommodates a plurality of substrates W. The plurality of substrates W are lined up at intervals in the vertical direction in the carrier C, and are each accommodated horizontally.

[0011] The substrate W includes a semiconductor substrate such as a silicon wafer or a compound semiconductor wafer, or a glass substrate. The substrate W may further include a device such as an electronic circuit formed on the surface of the semiconductor substrate or the glass substrate. The substrate W may have a concave-convex pattern on its surface.

[0012] The second transport section 22 is provided adjacent to the carrier placement section 21, and takes out the substrate W from the carrier C. The second transport section 22 has a transport path 221 extending in the X-axis direction, and a holder 222 that holds the substrate W. The holder 222 is, for example, fork-shaped. The holder 222 is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about the vertical axis. The number of holders 222 may be one or more.

[0013] The delivery section 23 is provided adjacent to the second transport section 22, and receives the substrate W delivered by the second transport section 22. The delivery section 23 has a transition device 24 on which a plurality of substrates W are placed. As shown in Fig. 2, a plurality of transition devices 24 may be stacked in the vertical direction. However, the arrangement and number of the transition devices 24 are not particularly limited.

[0014] The processing station 3 includes a first transport unit 31, a liquid processing device 32, and a drying device 33. As shown in Fig. 2, a plurality of liquid processing devices 32 may be stacked in the vertical direction. Similarly, a plurality of drying devices 33 may be stacked in the vertical direction. Also, as shown in Fig. 3, a plurality of first transport units 31 may be stacked in the vertical direction. The first transport unit 31 transports the substrate W between a plurality of devices at the same height as the first transport unit 31 (for example, the transition unit 24, the liquid processing device 32, and the drying device 33).

[0015] The first transport section 31 has a transport path 311 extending in the Y-axis direction, and a holder 312 that holds the substrate W. The holder 312 is, for example, fork-shaped. The holder 312 is capable of moving in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and of rotating about a vertical axis. There are multiple holders 312 (for example, two).

[0016] The liquid processing device 32 processes the surface of the substrate W with a processing liquid. The liquid processing device 32 includes, for example, a spin chuck that holds the substrate W horizontally and a nozzle that ejects the processing liquid onto the upper surface of the substrate W. The nozzle supplies the processing liquid to the center of the upper surface of the rotating substrate W. The processing liquid spreads from the center to the periphery of the upper surface of the substrate W by centrifugal force. As the processing liquid, for example, a chemical liquid, a rinsing liquid, and a drying liquid are supplied in this order. A plurality of types of chemical liquids may be supplied, and a rinsing liquid may be supplied between the supply of one chemical liquid and the supply of another chemical liquid. The liquid processing device 32 may include a moving mechanism that moves the nozzle in the radial direction of the substrate W.

[0017] The liquid treatment device 32, for example, forms a liquid film of a chemical liquid on the upper surface of the horizontal substrate W, then replaces the liquid film of the chemical liquid with a liquid film of a rinsing liquid, and then replaces the liquid film of the rinsing liquid with a liquid film of a drying liquid. The chemical liquid is, for example, SC1 (aqueous solution of ammonia and hydrogen peroxide), DHF (dilute hydrofluoric acid), or SPM (aqueous solution of sulfuric acid and hydrogen peroxide), etc. The rinsing liquid is, for example, DIW (deionized water), diluted ammonia water, ozone water, etc. The drying liquid is, for example, an organic solvent such as IPA (isopropyl alcohol).

[0018] The drying device 33, for example, replaces the drying liquid placed on the substrate W with a supercritical fluid to dry the substrate W. A supercritical fluid is a fluid that is at a temperature equal to or higher than its critical temperature and at a pressure equal to or higher than its critical pressure, and is in a state in which it is difficult to distinguish between liquid and gas. By replacing the drying liquid with a supercritical fluid, it is possible to prevent an interface between liquid and gas from appearing in the uneven pattern of the substrate W. As a result, it is possible to prevent the occurrence of surface tension and the collapse of the uneven pattern. The drying device 33 includes a processing container 331 and a supply mechanism 332.

[0019] The supply mechanism 332 supplies a fluid to the processing vessel 331. Specifically, the supply mechanism 332 includes a group of supply devices including a flow meter, a flow regulator, a back pressure valve, a heater, and the like, and a housing that houses the group of supply devices. The supply mechanism 332 supplies, for example, CO 2 to the processing vessel 331. The supply mechanism 332 may also function as a discharge mechanism for discharging the fluid from the processing vessel 331. The supply mechanism 332 may be divided into two parts sandwiching the processing vessel 331 as shown in Fig. 1. The transport time of the substrate W can be uniformed among a plurality of groups G1 and G2 described later.

[0020] The substrate processing apparatus 1 includes a control unit 5. The control unit 5 is, for example, a computer, and includes a CPU (Central Processing Unit) 51 and a storage medium 52 such as a memory. The storage medium 52 stores programs that control various processes executed in the substrate processing apparatus 1. The control unit 5 controls the operation of the substrate processing apparatus 1 by having the CPU 51 execute the programs stored in the storage medium 52.

[0021] Next, a substrate processing method according to an embodiment will be described with reference to Fig. 4. The substrate processing method includes, for example, steps S1 to S8. Steps S1 to S8 are performed under the control of a control unit 5.

[0022] First, the second transport unit 22 takes out the substrate W from the carrier C, and transports the taken-out substrate W to the transition device 24. Next, the first transport unit 31 takes out the substrate W from the transition device 24, and transports the taken-out substrate W into the liquid processing device 32 (S1).

[0023] Next, the liquid treatment device 32 supplies (S2) a chemical liquid to the upper surface of the horizontal substrate W. The chemical liquid is supplied to the center of the upper surface of the rotating substrate W and spreads over the entire radial direction of the upper surface by centrifugal force to form a liquid film.

[0024] Next, the liquid treatment device 32 supplies a rinsing liquid to the upper surface of the horizontal substrate W (S3). The rinsing liquid is supplied to the center of the upper surface of the rotating substrate W, and spreads over the entire radial direction of the upper surface by centrifugal force to form a liquid film. The liquid film of the chemical liquid is replaced with a liquid film of the rinsing liquid.

[0025] Next, the liquid treatment device 32 supplies a drying liquid to the upper surface of the horizontal substrate W (S4). The drying liquid is supplied to the center of the upper surface of the rotating substrate W, and spreads over the entire radial direction of the upper surface by centrifugal force to form a liquid film. The liquid film of the rinsing liquid is replaced with a liquid film of the drying liquid.

[0026] Next, the first transport unit 31 unloads the substrate W from the liquid processing device 32 (S5), and loads the unloaded substrate W into the drying device 33 (S6). The first transport unit 31 transports the substrate W with a puddle of drying liquid thereon from the liquid processing device 32 to the drying device 33. The first transport unit 31 holds the substrate W horizontally.

[0027] Next, the drying device 33 replaces the puddle of drying liquid on the substrate W with a supercritical fluid, thereby drying the substrate W (S7). By replacing the drying liquid with a supercritical fluid, it is possible to prevent an interface between liquid and gas from appearing in the uneven pattern of the substrate W. As a result, it is possible to prevent the occurrence of surface tension and the collapse of the uneven pattern.

[0028] Finally, the first transport section 31 removes the substrate W from the drying device 33 (S8). The first transport section 31 transports the removed substrate W to the transition device 24. Next, the second transport section 22 removes the substrate W from the transition device 24, and stores the removed substrate W in the carrier C.

[0029] Next, the drying apparatus 33 will be described with reference to Fig. 5. The drying apparatus 33 includes a processing container 331 that accommodates the substrate W. As shown in Fig. 5(A), the processing container 331 includes, for example, a lower wall, an upper wall, and a pair of side walls. The drying apparatus 33 includes, inside the processing container 331, a holder 333 that holds the substrate W.

[0030] The holder 333 is fixed, for example, inside the processing vessel 331, and does not need to move between the inside and outside of the processing vessel 331 through an opening of the processing vessel 331 as in Patent Document 1. Since there is no need to provide an area for transferring the substrate W between the holder 333 and the first transfer unit 31 outside the processing vessel 331 as in Patent Document 1, the drying device 33 can be made compact.

[0031] Furthermore, if the holder 333 is fixed inside the processing vessel 331, backlash between the sliding parts does not occur, unlike the case in which the holder 333 advances and retreats as in Patent Document 1. As a result, vibration of the holder 333 can be suppressed, vibration of the substrate W can be suppressed, and dripping of the drying liquid from the substrate W can be suppressed.

[0032] The holder 333 holds multiple substrates W simultaneously. Multiple substrates W can be dried simultaneously in the same drying device 33, improving the productivity of the substrate processing apparatus 1. Also, the number of drying devices 33 can be reduced, resulting in cost reduction. The effect of reducing costs is particularly noticeable when the drying device 33 dries the substrates W with a supercritical fluid. This is because the supercritical fluid has a high pressure, and components such as the processing vessel 331 are required to be pressure resistant.

[0033] The holder 333 horizontally holds each of a plurality of (e.g., two) substrates W arranged at intervals in the vertical direction. The holder 333 includes a plurality of pins 334 that support the lower substrate W from below, and a plurality of beams 335 that support the pins 334 from below. The beams 335 extend in the X-axis direction, and the pins 334 are provided at one ends of the beams 335. The beams 335 are inserted into grooves in the bottom wall of the processing vessel 331. The beams 335 are fixed to the processing vessel 331 by screws 336 or the like, as shown in FIG. 5(B).

[0034] The holder 333 further includes a plurality of horizontal plates 337 supporting the upper substrate W from below, and a plurality of beams 338 supporting the horizontal plates 337 from the sides. The beams 338 extend in the X-axis direction, and the horizontal plates 337 are provided midway along the beams 338. The beams 338 are inserted into grooves in the bottom wall of the processing vessel 331, and abut against the side wall of the processing vessel 331. The beams 338 are fixed to the processing vessel 331 by screws 339 or the like, as shown in FIG. 5(B).

[0035] 1 again, a description will be given of the positional relationship between liquid processing apparatus 32 and drying apparatus 33. For each drying apparatus 33, a plurality of liquid processing apparatuses 32 for processing a plurality of substrates W to be simultaneously loaded into the drying apparatus 33 are grouped. Each group G1, G2 is, for example, L-shaped, and includes a plurality of liquid processing apparatuses 32 and one drying apparatus 33.

[0036] In each of the groups G1 and G2, the liquid processing apparatuses 32 are disposed symmetrically across the transport path 311, and the drying apparatus 33 is adjacent to one of the liquid processing apparatuses 32. The drying apparatuses 33 in the group G1 and the drying apparatuses 33 in the group G2 are disposed symmetrically across the transport path 311. This arrangement allows the transport times of the substrates W to be uniform among the multiple groups G1 and G2.

[0037] 3, the first transport unit 31 includes one moving base 313 that moves in the Y-axis direction along the transport path 311. When one moving base 313 moves in the Y-axis direction, the multiple holding units 312 move simultaneously in the Y-axis direction. On the moving base 313, a lifting mechanism 314, a rotating mechanism 315, and a moving mechanism 316 are provided.

[0038] The lifting mechanism 314 simultaneously lifts and lowers the multiple holding units 312. For example, the lifting mechanism 314 lifts and lowers the rotation mechanism 315, thereby lifting and lowering the movement mechanism 316 and the multiple holding units 312 simultaneously.

[0039] The rotation mechanism 315 rotates the multiple holding units 312 around a vertical rotation axis. For example, the rotation mechanism 315 rotates the movement mechanism 316 to rotate the multiple holding units 312 simultaneously.

[0040] The moving mechanism 316 moves the multiple holding parts 312 individually in a horizontal direction (for example, in the X-axis direction). If the rotation angle of the moving mechanism 316 is changed by the rotation mechanism 315, it is also possible to move the multiple holding parts 312 individually in the Y-axis direction.

[0041] The multiple holders 312, the moving base 313, the lifting mechanism 314, the rotating mechanism 315, and the moving mechanism 316 configure a transport mechanism 319. The transport mechanism 319 moves along the transport path 311, and transports the substrate W between multiple devices adjacent to the transport path 311.

[0042] Next, the operation of the substrate processing apparatus 1 according to the embodiment will be described with reference to Fig. 6. In Fig. 6, the substrate W marked with a dot pattern indicates that a puddle of drying liquid has been applied, and the substrate W marked with a diagonal stripe pattern indicates that the substrate W has already been dried. The meanings of the dot patterns and stripe patterns are the same in Figs. 10 to 13 and 15. Below, the processing of the substrate W using group G1 will be described. The processing of the substrate W using group G2 is similar, and therefore will not be illustrated or described.

[0043] 6(A) to 6(C), the transport mechanism 319 simultaneously takes out from the transition device 24 a plurality of substrates W to be simultaneously loaded into the same drying device 33, and sequentially loads them into a plurality of liquid processing devices 32. Note that the transport mechanism 319 may repeatedly take out one substrate W from the transition device 24 and load it into the liquid processing device 32.

[0044] Next, as shown in Fig. 6(D), the multiple liquid processing devices 32 may simultaneously complete piling the drying liquid onto the multiple substrates W that are to be simultaneously carried into the same drying device 33. Natural drying begins simultaneously with the completion of piling. Completing piling simultaneously can align the time from the completion of piling to the carrying into the drying device 33, and can align the amount of natural drying. Therefore, the amount of drying liquid at the time of carrying into the drying device 33 can be aligned. This is particularly effective when the drying liquid is highly volatile, for example, when the drying liquid is IPA.

[0045] The multiple liquid processing devices 32 may simultaneously start piling drying liquid onto the multiple substrates W that are to be simultaneously loaded into the same drying device 33. The time required for piling the drying liquid is the same for the multiple liquid processing devices 32. Therefore, if piling of the drying liquid is started simultaneously, it can be completed simultaneously. The timing for starting the supply of the chemical liquid is not particularly limited, but is preferably simultaneous. The supply of the chemical liquid is started simultaneously after waiting for the loading of the substrates W into the multiple liquid processing devices 32 to be completed.

[0046] 6(E) and 6(F), the transport mechanism 319 sequentially carries out the multiple substrates W from the multiple liquid processing devices 32. Next, as shown in Fig. 6(G), the transport mechanism 319 moves the multiple substrates W toward the drying device 33. At this time, a puddle of drying liquid is formed on each substrate W.

[0047] Next, as shown in Fig. 6(H), the transport mechanism 319 simultaneously carries the multiple substrates W that have been processed in the multiple liquid processing devices 32 into the same drying device 33. Next, as shown in Fig. 6(I), the drying device 33 dries the substrates W by replacing the drying liquid piled on each substrate W with a supercritical fluid. The drying device 33 dries the multiple substrates W simultaneously.

[0048] Next, although not shown, the transport mechanism 319 simultaneously unloads the multiple substrates W from the drying device 33, and simultaneously loads them into the transition device 24. Thereafter, the second transport section 22 simultaneously or sequentially unloads the multiple substrates W from the transition device 24, and stores the unloaded multiple substrates W in the carrier C simultaneously or sequentially.

[0049] In this embodiment, the liquid processing apparatus 32 corresponds to the first substrate processing section described in the claims, and the drying apparatus 33 corresponds to the second substrate processing section described in the claims. The first substrate processing section is not particularly limited as long as it is an apparatus that processes the substrates W one by one. The second substrate processing section is not particularly limited as long as it is an apparatus that simultaneously processes a plurality of substrates W that have been processed in a plurality of first substrate processing sections. The second substrate processing section may be an inspection apparatus that measures the weight of a puddle of drying liquid on the substrate W before the substrate W is dried in the drying apparatus 33. The second substrate processing section may be a cleaning apparatus that irradiates the substrate W with ultraviolet light after the substrate W is dried in the drying apparatus 33, thereby removing organic matter attached to the substrate W. The drying apparatus 33 is not limited to a supercritical drying apparatus, and may be, for example, a reduced pressure drying apparatus. This is the same in the first to fifth modified examples described below.

[0050] Next, a substrate processing apparatus 1 according to a first modified example will be described with reference to Fig. 7 to Fig. 9. The following mainly describes the differences between the first modified example and the above embodiment. As shown in Fig. 7, the first transport section 31 includes a plurality of moving bases 313A, 313B which move individually along a single transport path 311.

[0051] 9, as in the above embodiment, a lifting mechanism 314A, a rotation mechanism 315A, and a moving mechanism 316A are provided on moving base 313A. The multiple holders 312A, moving base 313A, lifting mechanism 314A, rotation mechanism 315A, and moving mechanism 316A form a first transport mechanism 319A.

[0052] The first transport mechanism 319A moves along the transport path 311, and transports the substrate W between a plurality of apparatuses adjacent to the transport path 311. The first transport mechanism 319A transports the substrate W between the transition device 24 and the plurality of liquid treatment devices 32A and the drying device 33A. The plurality of liquid treatment devices 32A and the drying device 33A form a group G1 that is L-shaped in a plan view.

[0053] Similarly, a lifting mechanism 314B, a rotating mechanism 315B, and a moving mechanism 316B are provided on moving base 313B. The multiple holders 312B, moving base 313B, lifting mechanism 314B, rotating mechanism 315B, and moving mechanism 316B form a second transport mechanism 319B.

[0054] The second transport mechanism 319B moves along the transport path 311 independently of the first transport mechanism 319A, and transports the substrate W between a plurality of apparatuses adjacent to the transport path 311. The second transport mechanism 319B transports the substrate W between the transition device 24 and the plurality of liquid processing devices 32B and the drying device 33B. The plurality of liquid processing devices 32B and the drying device 33B form a group G2 that is L-shaped in a plan view.

[0055] The first transport mechanism 319A and the second transport mechanism 319B move along the same transport path 311. Therefore, as shown in Figures 8(A) and 9(A), there is a risk of collision between the first transport mechanism 319A or a substrate W held by the first transport mechanism 319A and the second transport mechanism 319B or a substrate W held by the second transport mechanism 319B.

[0056] Therefore, as shown in Fig. 8(B), the rotating mechanisms 315A and 315B may rotate the moving mechanisms 316A and 316B by 90° so that the longitudinal directions of the moving mechanisms 316A and 316B are aligned along the Y-axis when viewed from above. As is clear from Fig. 9(B), the first transport mechanism 319A and the second transport mechanism 319B can pass each other.

[0057] When the first transport mechanism 319A and the second transport mechanism 319B pass each other, the holding unit 312A, the rotation mechanism 315A, and the movement mechanism 316A are positioned below the holding unit 312B, the rotation mechanism 315B, and the movement mechanism 316B, but may be positioned above them.

[0058] Next, the operation of the substrate processing apparatus 1 according to the first modified example will be described with reference to Figures 10 to 12. Figures 10(A) to 10(F) are similar to Figures 6(A) to 6(F), and therefore will be described briefly.

[0059] As shown in Figures 10(A) to 10(C), the first transport mechanism 319A takes out the multiple substrates W from the transition device 24 and transports them in sequence to the multiple liquid processing devices 32A. Next, as shown in Figure 10(D), the multiple liquid processing devices 32A may simultaneously start piling drying liquid on the substrates W, and may simultaneously complete the piling. Next, as shown in Figures 10(E) and 10(F), the first transport mechanism 319A sequentially carries the multiple substrates W out of the multiple liquid processing devices 32A.

[0060] 10(G), the first transport mechanism 319A moves toward the drying device 33A. At this time, a puddle of drying liquid is formed on each substrate W. While the first transport mechanism 319A moves in the positive direction of the Y axis toward the drying device 33A, the second transport mechanism 319B moves in the negative direction of the Y axis toward the transition device 24. The longitudinal direction of the transport mechanisms 316A and 316B is aligned with the Y axis so that the first transport mechanism 319A and the second transport mechanism 319B can pass each other midway.

[0061] Next, as shown in Fig. 10(H), the first transport mechanism 319A simultaneously transports multiple substrates W into the same drying device 33A. Next, as shown in Fig. 10(I), the drying device 33A dries the multiple substrates W simultaneously. Next, as shown in Fig. 11(A), the first transport mechanism 319A simultaneously transports multiple substrates W out of the drying device 33A. Meanwhile, the second transport mechanism 319B takes out the multiple substrates W from the transition device 24 as shown in Fig. 10(H).

[0062] 11(B), first transport mechanism 319A moves toward transition device 24. While first transport mechanism 319A moves in the negative Y-axis direction toward transition device 24, second transport mechanism 319B moves in the positive Y-axis direction toward liquid processing device 32B. The longitudinal direction of transport mechanisms 316A and 316B is aligned with the Y-axis direction so that first transport mechanism 319A and second transport mechanism 319B can pass each other midway.

[0063] 11(C) and 11(D), the second transport mechanism 319B transports the multiple substrates W to the multiple liquid processing devices 32B in sequence. Next, as shown in FIG. 11(E), the multiple liquid processing devices 32B may simultaneously start piling drying liquid on the substrates W, and may simultaneously complete the piling.

[0064] 11(C), the first transport mechanism 319A delivers the plurality of processed substrates W to the transition device 24, and then removes the plurality of unprocessed substrates W from the transition device 24. Next, as shown in Figures 11(D) and 11(E), the first transport mechanism 319A transports the plurality of substrates W to the plurality of liquid processing devices 32A in sequence.

[0065] Next, as shown in FIG. 11(F) and FIG. 11(G), the second transport mechanism 319B sequentially carries out the multiple substrates W from the multiple liquid processing devices 32B. Next, as shown in FIG. 11(H), the second transport mechanism 319B moves toward the drying device 33B. At this time, a puddle of drying liquid is formed on each substrate W. Next, as shown in FIG. 11(I), the second transport mechanism 319B simultaneously carries in the multiple substrates W into the same drying device 33B. Next, as shown in FIG. 12(A), the drying device 33B dries the multiple substrates W simultaneously. Next, as shown in FIG. 12(B), the second transport mechanism 319B simultaneously carries out the multiple substrates W from the drying device 33B.

[0066] During this time, as shown in Figures 11(F) to 11(I), each of the multiple liquid processing devices 32A supplies a processing liquid to the substrate W. The multiple liquid processing devices 32A may simultaneously start and simultaneously finish piling drying liquid onto the substrate W. Next, as shown in Figures 12(A) and 12(B), the first transport mechanism 319A sequentially carries out the multiple substrates W from the multiple liquid processing devices 32A.

[0067] 12(C), the first transport mechanism 319A moves toward the drying device 33A. At this time, a puddle of drying liquid is formed on each substrate W. While the first transport mechanism 319A moves in the positive direction of the Y axis toward the drying device 33A, the second transport mechanism 319B moves in the negative direction of the Y axis toward the transition device 24. The longitudinal direction of the transport mechanisms 316A and 316B is aligned with the Y axis so that the first transport mechanism 319A and the second transport mechanism 319B can pass each other midway.

[0068] Thereafter, the operations shown in FIG. 10(H) to FIG. 12(C) are repeated.

[0069] Next, the operation of the substrate processing apparatus 1 and the first transport unit 31 according to the second modified example will be described with reference to Fig. 13 and Fig. 14. The following mainly describes the differences between the second modified example and the above embodiment. The first transport unit 31 includes, for example, one moving base 313 that moves in the Y-axis direction along the transport path 311 as shown in Fig. 14.

[0070] As one moving base 313 moves in the Y-axis direction, multiple holding parts 312 move simultaneously in the Y-axis direction. On moving base 313, there are provided lifting mechanism 314, rotation mechanisms 315A and 315B, and moving mechanisms 316A and 316B.

[0071] The lifting mechanism 314 individually lifts and lowers the multiple holding units 312. For example, the lifting mechanism 314 individually lifts and lowers the rotation mechanisms 315A and 315B, thereby individually lifting and lowering the movement mechanisms 316A and 316B, and individually lifting and lowering the multiple holding units 312.

[0072] The rotation mechanisms 315A and 315B individually rotate the multiple holding units 312 around a vertical rotation axis. For example, the rotation mechanisms 315A and 315B individually rotate the movement mechanisms 316A and 316B, thereby individually rotating the multiple holding units 312.

[0073] The movement mechanisms 316A and 316B move the multiple holding parts 312 individually in a horizontal direction (for example, in the X-axis direction). If the rotation angles of the movement mechanisms 316A and 316B are individually adjusted by the rotation mechanisms 315A and 315B, it is also possible to move the multiple holding parts 312 individually in the Y-axis direction.

[0074] The multiple holders 312, the moving base 313, the lifting mechanism 314, the rotating mechanisms 315A and 315B, and the moving mechanisms 316A and 316B configure a transport mechanism 319. The transport mechanism 319 moves along a transport path 311, and transports the substrate W between multiple devices adjacent to the transport path 311.

[0075] Next, the operation of the substrate processing apparatus 1 according to the second modified example will be described with reference to Fig. 13. The processing of the substrate W using the group G1 (see Fig. 1) will be described below. The processing of the substrate W using the group G2 is similar, and therefore will not be illustrated or described.

[0076] As shown in Figures 13(A) and 13(B), the transport mechanism 319 simultaneously removes multiple substrates W to be simultaneously loaded into the same drying device 33 from the transition device 24, and simultaneously loads them into multiple liquid processing devices 32. As shown in Figures 13(B) and 14(A), the multiple liquid processing devices 32 are arranged symmetrically across the transport path 311, and the multiple holders 312 move in opposite directions to each other, so that the multiple substrates W are simultaneously loaded into the multiple liquid processing devices 32. This reduces the transport time compared to loading the substrates W sequentially rather than simultaneously. When loading the substrates W sequentially, the supply of chemicals to the substrates W may be started simultaneously after all substrates have been loaded.

[0077] Next, as shown in Fig. 13(C), the multiple liquid processing devices 32 may simultaneously start and simultaneously finish piling drying liquid on the multiple substrates W. Next, as shown in Fig. 13(D), the transport mechanism 319 simultaneously carries the multiple substrates W out of the multiple liquid processing devices 32. Next, as shown in Fig. 13(E), the transport mechanism 319 moves the multiple substrates W toward the drying device 33. At this time, a puddle of drying liquid is formed on each substrate W.

[0078] 13(F) and 14(B), the transport mechanism 319 simultaneously carries in multiple substrates W into the same drying device 33. Next, as shown in FIG. 13(G), the drying device 33 dries the multiple substrates W simultaneously.

[0079] Next, although not shown, the transport mechanism 319 simultaneously unloads the multiple substrates W from the drying device 33, and simultaneously loads them into the transition device 24. Thereafter, the second transport section 22 simultaneously or sequentially unloads the multiple substrates W from the transition device 24, and stores the unloaded multiple substrates W in the carrier C simultaneously or sequentially.

[0080] Next, the operation of the substrate processing apparatus 1 and the first transfer unit 31 according to the third modified example will be described with reference to Fig. 15 and Fig. 16. The following mainly describes the differences between the third modified example and the above embodiment. The first transfer unit 31 is, for example, an articulated robot as shown in Fig. 16, and has a plurality of articulated arms 317. A holder 312 is provided at the tip of each articulated arm 317. The holder 312 can move in the horizontal direction (both in the X-axis direction and the Y-axis direction) and the vertical direction, and can rotate around the vertical axis, by the articulated arm 317.

[0081] 15(A) to 15(F) are similar to those shown in Fig. 13(A) to 13(F), so only the essential parts will be described. As shown in Fig. 15(B) and Fig. 16(A), a plurality of liquid processing devices 32 are arranged symmetrically on either side of a transport path 311, and a plurality of holders 312 move in opposite directions to each other, and a plurality of substrates W are simultaneously loaded into a plurality of liquid processing devices 32. The transport time can be shortened compared to loading the substrates sequentially instead of simultaneously.

[0082] Next, a substrate processing apparatus 1 according to a fourth modified example will be described with reference to Figs. 17 and 18. The following mainly describes the differences between the fourth modified example and the above embodiment. As shown in Fig. 17, a group G1 may be formed by a plurality of liquid processing apparatuses 32A and drying apparatuses 33A arranged along one side of the transport path 311. Similarly, a group G2 may be formed by a plurality of liquid processing apparatuses 32B and drying apparatuses 33B arranged along the transport path 311 on the opposite side of the transport path 311. The configuration of group G1 will be described below. The configuration of group G2 is similar, so a description thereof will be omitted.

[0083] A plurality of liquid processing devices 32A are arranged side by side along the transport path 311 on one side of the transport path 311, and are adjacent to each other in the horizontal direction (Y-axis direction). In addition, the drying device 33A is adjacent to the liquid processing device 32A that processes the substrate W to be loaded into the drying device 33A. The drying device 33A is arranged at a position farther from the transition device 24 than the plurality of liquid processing devices 32A. In this case, it is sufficient that the processing container 331 of the drying device 33A is adjacent to the transport path 311, and the supply mechanism 332 of the drying device 33A does not have to be adjacent to the transport path 311. The supply mechanism 332 can be opened in three directions (X-axis positive direction, X-axis negative direction, and Y-axis positive direction), and the maintainability of the supply mechanism 332 can be improved. In addition, the transport path 311 can be shortened, and the transport time of the substrate W can be shortened.

[0084] 17, the first transport section 31 includes one moving base 313 that moves in the Y-axis direction along the transport path 311. As the single moving base 313 moves in the Y-axis direction, the multiple holders 312 move in the Y-axis direction simultaneously. The first transport section 31 sequentially loads the multiple substrates W into the multiple liquid processing devices 32A that are adjacent in the horizontal direction (Y-axis direction). At that time, the moving base 313 is moved in the Y-axis direction.

[0085] Furthermore, as shown in Figure 1, if multiple liquid processing devices 32 belonging to the same group G1 are arranged symmetrically on either side of the transport path 311, the operation of moving the movable base 313 in the Y-axis direction can be omitted when transporting multiple substrates W into multiple liquid processing devices 32.

[0086] 18, a plurality of liquid processing devices 32A may be stacked vertically on one side of one transport path 311. Similarly, a plurality of liquid processing devices 32B may be stacked vertically on the opposite side of one transport path 311. By increasing the number of liquid processing devices, the productivity of the substrate processing apparatus 1 can be improved.

[0087] Although not shown, a plurality of drying apparatuses 33A may be stacked vertically on one side of one transport path 311. Similarly, a plurality of drying apparatuses 33B may be stacked vertically on the opposite side of one transport path 311. By increasing the number of drying apparatuses, the productivity of the substrate processing apparatus 1 can be improved.

[0088] Note that the first transport unit 31 may take the substrates W having puddles of drying liquid from the liquid processing devices 32A arranged horizontally and simultaneously carry them into the drying device 33A, but may also take them from the liquid processing devices 32A stacked vertically and simultaneously carry them into the drying device 33A, instead of taking the substrates W having puddles of drying liquid from the liquid processing devices 32B arranged horizontally and simultaneously carry them into the drying device 33A, but may also take the substrates W from the liquid processing devices 32B stacked vertically and simultaneously carry them into the drying device 33B, instead of taking the substrates W having puddles of drying liquid from the liquid processing devices 32B arranged horizontally and simultaneously carry them into the drying device 33A.

[0089] Next, the substrate processing apparatus 1 according to the fifth modification will be described with reference to FIG. 19. The following mainly describes the differences between the fifth modification and the above embodiment. As shown in FIG. 19, a plurality of liquid processing apparatuses 32 for processing a plurality of substrates W to be simultaneously loaded into the same drying apparatus 33 are stacked vertically on one side of one transport path 311. The drying apparatus 33 is disposed on the opposite side of the transport path 311 from the liquid processing apparatus 32 for processing the substrates W to be simultaneously loaded into the drying apparatus 33. In this case, the substrates W can be loaded and unloaded from the plurality of liquid processing apparatuses 32 and loaded into the drying apparatus 33 without moving the moving base 313 in the Y-axis direction.

[0090] Next, a modified example of the first transport section 31 will be described with reference to Fig. 20. The first transport section 31 of this modified example has a first transport mechanism 319A and a second transport mechanism 319B, similar to the first transport section 31 of the first modified example described above. However, the first transport mechanism 319A and the second transport mechanism 319B simultaneously transport a plurality of substrates W into the same drying apparatus 33. At that time, the holder 312B of the second transport mechanism 319B may be disposed above the holder 312A of the first transport mechanism 319A.

[0091] The first transport mechanism 319A includes a rotation mechanism 315A, a movement mechanism 316A, and a plurality of holders 312A arranged in this order from bottom to top. The first transport mechanism 319A loads the substrate W held by the upper holders 312A into the drying device 33.

[0092] On the other hand, the second transport mechanism 319B includes a rotation mechanism 315B, a movement mechanism 316B, and a plurality of holders 312B arranged in this order from top to bottom. The first transport mechanism 319A loads the substrate W held by the lower holders 312B into the drying device 33.

[0093] Although the embodiments of the substrate processing apparatus and the substrate processing method according to the present disclosure have been described above, the present disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations are possible within the scope of the claims. Naturally, these also fall within the technical scope of the present disclosure. [Explanation of symbols]

[0094] 1. Substrate Processing Equipment 31 First conveying section (conveying section) 32 Liquid processing apparatus (first substrate processing section) 33 Drying device (second substrate processing section) W substrate

Claims

1. a plurality of first substrate processing units for processing the substrates one by one; one or more second substrate processing units that simultaneously process the plurality of substrates that have been processed in the plurality of first substrate processing units; a transfer section that simultaneously transfers the plurality of substrates processed in the plurality of first substrate processing sections into the same second substrate processing section; Equipped with The transport section includes a transport path extending in a horizontal direction, a plurality of the first substrate processing units for processing a plurality of the substrates to be simultaneously loaded into the same second substrate processing unit are symmetrically disposed across the transfer path; The second substrate processing section is adjacent to one of the first substrate processing sections that processes the substrates loaded into the second substrate processing section.

2. The substrate processing apparatus according to claim 1 , wherein the second substrate processing sections are arranged symmetrically across the transport path.

3. a control unit that controls the first substrate processing unit, the second substrate processing unit, and the transport unit; 3. The substrate processing apparatus according to claim 1, wherein the control unit simultaneously unloads a plurality of the substrates from a plurality of the first substrate processing units that are arranged symmetrically on either side of the transport path, and simultaneously loads the unloaded plurality of substrates into the same second substrate processing unit.

4. A carrier placement section on which a carrier that accommodates a plurality of substrates is placed; a second transport unit that removes the substrate from the carrier; a transfer section that receives the substrate transferred by the second transport section; a first substrate processing section for processing the substrates one by one; one or more second substrate processing units that simultaneously process the plurality of substrates that have been processed in the plurality of first substrate processing units; a transfer section that simultaneously transfers the plurality of substrates processed in the plurality of first substrate processing sections into the same second substrate processing section; a control unit that controls the first substrate processing unit, the second substrate processing unit, the transfer unit, and the second transfer unit; Equipped with The control unit simultaneously removes multiple substrates to be simultaneously loaded into the same second substrate processing unit from the transfer unit using the transport unit, and transports them to multiple first substrate processing units.

5. The first substrate processing unit deposits a puddle of a processing liquid on the substrate, 5. The substrate processing apparatus according to claim 1, wherein the transport section transports the substrate from the first substrate processing section to the second substrate processing section in a state where the processing liquid is piled thereon.

6. a control unit that controls the first substrate processing unit, the second substrate processing unit, and the transport unit; The substrate processing apparatus according to claim 5 , wherein the control unit causes a plurality of the first substrate processing units to simultaneously complete piling the processing liquid onto a plurality of the substrates that are to be simultaneously loaded into the same second substrate processing unit.

7. a control unit that controls the first substrate processing unit, the second substrate processing unit, and the transport unit; The substrate processing apparatus according to claim 5 or 6, wherein the control unit simultaneously starts piling the processing liquid onto the substrates that are to be simultaneously loaded into the same second substrate processing unit by a plurality of the first substrate processing units.

8. 8. The substrate processing apparatus according to claim 5, wherein the second substrate processing section dries the substrate by replacing the processing liquid piled on the substrate with a supercritical fluid.

9. A substrate processing method comprising processing the substrate using a substrate processing apparatus according to claim 1.

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