Carbon gap-filling process

Abstract

An exemplary semiconductor processing method may include providing a carbon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed in the processing region. The substrate may define one or more recessed features. The method may include providing a second precursor to the processing region. The method may include forming a plasma of the carbon-containing precursor and the second precursor in the processing region. The forming of the plasma of the carbon-containing precursor and the second precursor may be performed at a plasma power of about 500 W or more. The method may include depositing a carbon-containing material on the substrate. The carbon-containing material may extend into the one or more recessed features. The method may include applying a bias power during deposition of the carbon-containing material for a second period of time after depositing the carbon-containing material for a first period of time.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. patent application Ser. No. 17 / 508,419, filed Oct. 22, 2021, the entire disclosure of which is incorporated herein by reference.

[0002]

[0002] The present technology relates to semiconductor systems, processes, and devices. More specifically, the present technology relates to processes and systems for filling gaps with carbon-containing materials. [Background technology]

[0003]

[0003] Integrated circuits are made possible by processes that create intricately patterned layers of material on a substrate surface. Creating patterned materials on a substrate requires controlled methods for forming and removing materials. As device sizes continue to shrink, features in integrated circuits become smaller and aspect ratios of structures can become larger, and maintaining the dimensions of these structures during processing steps can be a challenge. Some processes can result in recessed features in the material that may need to be filled without leaving seams or voids to avoid unnecessary and undesirable effects in further processing. Developing materials that can avoid the formation of seams or voids can become more difficult.

[0004]

[0004] Accordingly, there is a need for improved systems and methods that can be used to fabricate high quality devices and structures. These and other needs are addressed by the present technique. Summary of the Invention

[0005]

[0005] An exemplary semiconductor processing method may include providing a carbon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed within the processing region of the semiconductor processing chamber. The substrate may define one or more recessed features along the substrate. The method may include providing a second precursor to the processing region of the semiconductor processing chamber. The method may include forming a plasma of the carbon-containing precursor and the second precursor in the processing region. The forming of the plasma of the carbon-containing precursor and the second precursor may be performed at a plasma power of about 500 W or more. The method may include depositing a carbon-containing material on the substrate. The carbon-containing material may extend into the one or more recessed features along the substrate. The method may include applying a bias power during deposition of the carbon-containing material on the substrate for a second period of time after depositing the carbon-containing material on the substrate for a first period of time. The carbon-containing material may be deposited on the substrate in situ in the same chamber in which etching and / or processing steps may be performed. This may reduce wait times and limit exposure of the substrate between steps.

[0006] In some embodiments, the carbon-containing precursor may be or may include methane (CH4). The one or more recessed features may be characterized by an aspect ratio of about 1:3 or greater. A temperature within the semiconductor processing chamber may be maintained at about 100° C. or less during deposition of the carbon-containing material on the substrate. A pressure within the semiconductor processing chamber may be maintained at about 10 mTorr or less during deposition of the carbon-containing material on the substrate. The second precursor may be or may include helium, a nitrogen-containing precursor, or argon. The method may include decreasing a flow rate of the carbon-containing precursor between the first time period and the second time period. The method may include increasing a flow rate of the second precursor between the first time period and the second time period. A flow rate of the carbon-containing precursor may be about 10 sccm or greater during the first time period. A flow rate of the second precursor may be about 300 sccm or greater during the first time period. The method may include increasing a bias power to a processing region of the semiconductor processing chamber while depositing the carbon-containing material on the substrate for a third period of time after depositing the carbon-containing material for a second period of time. The carbon-containing material deposited on the substrate may be substantially free of any seams or voids in one or more recessed features along the substrate.

[0007]

[0007] Some embodiments of the present technique may include a semiconductor processing method. The method may include providing a carbon-containing precursor to a processing region of a semiconductor processing chamber. A substrate may be disposed in the processing region of the semiconductor processing chamber. The substrate may define one or more recessed features along the substrate. The method may include forming a plasma of the carbon-containing precursor in the processing region. The method may include depositing a carbon-containing material on the substrate. The method may include treating the carbon-containing material with a second precursor. The second precursor may extend the carbon-containing material into the one or more recessed features along the substrate. The method may include introducing a bias power during depositing the carbon-containing material and treating the carbon-containing material with the second precursor. The bias power may be applied gradually. The initial bias power may be 0 W.

[0008] In some embodiments, the temperature in the semiconductor processing chamber can be maintained at about 75° C. or less during depositing the carbon-containing material and treating the carbon-containing material on the substrate with the second precursor. The pressure in the semiconductor processing chamber can be maintained at about 7 mTorr or more during depositing the carbon-containing material and treating the carbon-containing material on the substrate with the second precursor. After depositing the carbon-containing material on the substrate for a first period of time, a bias power can be introduced for a second period of time such that the bias power is about 50 W or more. The second precursor can be or include helium.

[0009] Some embodiments of the present technique may include a semiconductor processing method. The method may include etching one or more recessed features along a substrate. The substrate may be disposed in a processing region of a semiconductor processing chamber. The method may include delivering a carbon-containing precursor to the processing region of the semiconductor processing chamber. The method may include delivering a second precursor to the processing region of the semiconductor processing chamber. The method may include forming a plasma of the carbon-containing precursor and the second precursor in the processing region. The plasma may be characterized by an electron temperature of about 6 eV or greater. The method may include depositing a carbon-containing material on the substrate. The carbon-containing material may extend into the one or more recessed features along the substrate. The carbon-containing material may be deposited in the same semiconductor processing chamber as the etching. The method may include applying a bias power to the processing region of the semiconductor processing chamber after depositing the carbon-containing material on the substrate for a first period of time.

[0010] In some embodiments, the bias power applied after the first period of time may be about 75 W or greater. The second precursor may be or may include helium. The method may include decreasing a flow rate of the carbon-containing precursor into the semiconductor processing chamber after depositing the carbon-containing material for the first period of time. The flow rate of the second precursor may be maintained at a flow ratio of about 10:1 or greater to the carbon-containing precursor during the first period of time.

[0011]

[0011] The above techniques may provide numerous advantages over conventional methods and techniques. For example, the process may uniformly deposit carbon-containing material into recessed features. Additionally, the process may reduce or limit seams or voids in the deposited carbon-containing material deposited within the recessed features. These and other embodiments, along with their many advantages and features, are described in more detail in conjunction with the following description and accompanying figures.

[0012] A further understanding of the nature and advantages of the disclosed technology may be realized by reference to the remaining portions of the specification and the drawings. [Brief description of the drawings]

[0013] [Figure 1] 1 is a schematic top view illustrating an exemplary processing system according to some embodiments of the present technique. [Diagram 2] 1 is a schematic cross-sectional view of an exemplary processing system in accordance with some embodiments of the present technique; [Diagram 3] 1A-1D illustrate selected steps in a semiconductor processing method according to some embodiments of the present technique. [Figure 4] 1A-D show schematic cross-sectional views of exemplary structures that may include layers of material and may be fabricated in accordance with some embodiments of the present technology. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014]

[0017] Some of the figures are included as schematic diagrams. It should be understood that the figures are for illustrative purposes and should not be considered to scale unless scale is explicitly stated. Furthermore, schematic diagrams are provided to aid in understanding and may not include all aspects or information as compared to realistic representations and may include exaggerated material for illustrative purposes.

[0015]

[0018] In the accompanying figures, similar components and / or features may be labeled with the same reference label. Additionally, various components of the same type may be distinguished by following the reference label with a letter that distinguishes the similar components. If only a first reference label is used herein, the description is applicable to any one of the similar components having the same first reference label, regardless of the letter.

[0016]

[0019] As device sizes continue to decrease, many material layers may decrease in thickness and size to scale the devices. Features within semiconductor structures may decrease in size and the aspect ratio of the features may increase. As the aspect ratio of the features increases, subsequent depositions may have difficulty filling the high aspect ratio features without leaving seams or voids.

[0017]

[0020] Conventional techniques have had difficulty refilling recessed features on a substrate or materials deposited thereon. Deposition of material into the underlying structure containing the recessed feature may be incomplete. The conformal filling process may seal near the top of the feature before filling the feature, and may result in a seam in the middle of the feature or a void below the sealed top. Furthermore, conventional techniques may require performing an etching process in one chamber, releasing the vacuum, transferring the structure, and performing a deposition process in another chamber. This transfer may result in undesirable contamination during processing. Some manufacturing processes may be followed by a polishing step, which may expose seams or voids due to removal of material, thereby making the recessed feature accessible. This may result in oxidation of the material once exposed to the atmosphere, as well as the ingress of slurry or other materials along the seams. Thus, many conventional techniques have limited ability to prevent structural defects in the final device.

[0018]

[0021] The present technique overcomes these problems by delivering not only a carbon-containing precursor, but also a second precursor to refill the recessed feature. This deposition can occur in the same chamber as the etching process, thereby limiting wait times and improving structural integrity. By delivering a second precursor, the present technique can deposit the carbon-containing material toward the bottom of the recessed feature without sealing or closing the feature. By depositing material at the bottom of the feature, any seams or voids can be reduced or avoided before depositing material to seal or close the feature. By filling the feature or high aspect ratio structure, the present technique can prevent problems in subsequent integration processes and / or defects in the final device.

[0019]

[0022] While the remaining disclosure will always identify specific etching and deposition processes using the disclosed technology, it will be readily understood that the systems and methods are equally applicable to a variety of other processes, such as may be performed in the chambers described. Thus, the technology should not be considered limited to use with only the etching or deposition processes described. Before describing the systems and methods or steps of an exemplary process sequence according to some embodiments of the technology, the present disclosure will describe one possible system and chamber that may be used with the technology. It should be understood that the technology is not limited to the equipment described, and the processes described may be performed in any number of processing chambers and systems.

[0020]

[0023] Figure 1 illustrates a top view of one embodiment of a deposition, etch, bake, and / or cure chamber processing system 10 according to an embodiment. The tool or processing system 10 illustrated in Figure 1 may include multiple process chambers 24a-d, a transfer chamber 20, a service chamber 26, an integrated metrology chamber 28, and a pair of load lock chambers 16a-b. The process chambers may include any number of structures or components and any number or combination of process chambers.

[0021]

[0024] To transport substrates between chambers, the transfer chamber 20 may include a robotic transport mechanism 22. The transport mechanism 22 may have a pair of substrate transport blades 22a, each attached to a distal end of an extendable arm 22b. The blades 22a may be used to transport individual substrates to or from a process chamber. In a process, one of the substrate transport blades, such as blade 22a of the transport mechanism 22, may retrieve a substrate W from one of the load lock chambers, such as chambers 16a-b, and transport the substrate W to a first processing stage, e.g., a processing process, as described below, in chambers 24a-d. The chambers may be included to perform individual or combinations of steps of the described techniques. For example, one or more chambers may be configured to perform a deposition or etching step, while one or more other chambers may be configured to perform a pre-processing step and / or one or more post-processing steps described. Any number of configurations capable of performing any number of additional manufacturing steps typically performed in semiconductor processing are encompassed by the present technology.

[0022]

[0025] If a chamber is occupied, the robot can wait until processing is complete and then remove the processed substrate from the chamber with one blade 22a and insert a new substrate with a second blade. Once the substrate has been processed, it can then be moved to a second processing stage. For each move, the transport mechanism 22 may generally have one blade carrying the substrate and one blade that is empty to perform a substrate swap. The transport mechanism 22 can wait at each chamber until it can complete the swap.

[0023]

[0026] Once processing is completed in the process chambers, the transport mechanism 22 can move the substrate W from the last process chamber and transport the substrate W to a cassette in the load lock chambers 16a-b. From the load lock chambers 16a-b, the substrate can be moved to the factory interface 12. The factory interface 12 generally operates to transfer substrates between the pod loaders 14a-d and the load lock chambers 16a-b in an atmospheric pressure clean environment. The clean environment of the factory interface 12 can generally be obtained through an air filtration process, such as HEPA filtration. The factory interface 12 can also include a substrate orienter / aligner that can be used to properly align the substrate prior to processing. At least one substrate robot, such as robots 18a-b, can be positioned within the factory interface 12 to transport substrates between various locations / locations within the factory interface 12 and to other locations associated therewith. The robots 18a-b may be configured to move along a track system within the factory interface 12 from a first end to a second end of the factory interface 12.

[0024]

[0027] The processing system 10 may further include an integrated metrology chamber 28 for providing control signals that may provide adaptive control for any process being performed in the processing chamber. The integrated metrology chamber 28 may include any of a variety of metrology tools for measuring various film properties such as thickness, roughness, composition, etc., and the metrology tools may further be capable of capturing grating parameters such as critical dimensions, sidewall angles, and feature heights under vacuum in an automated manner.

[0025]

[0028] Each of the processing chambers 24a-d may be configured to perform one or more process steps in the fabrication of semiconductor structures, and any number and combination of processing chambers may be used on the multi-chamber processing system 10. For example, any of the processing chambers may be configured to perform a number of substrate processing steps, including cyclical layer deposition, atomic layer deposition, chemical vapor deposition, physical vapor deposition, and any number of deposition processes, including etching, pre-cleaning, pre-treatment, post-treatment, annealing, plasma treatment, degassing, orientation, and other steps including other substrate processes. Some specific processes that may be performed in any of the chambers, or any combination of the chambers, may include metal deposition, surface cleaning and preparation, thermal annealing such as rapid thermal processing, plasma treatment, and the like. As one of ordinary skill in the art would readily appreciate, any other process may similarly be performed in a particular chamber incorporated in the multi-chamber processing system 10, including any of the processes described below.

[0026]

[0029] 2 shows a schematic cross-sectional view of an exemplary processing chamber 100 suitable for patterning a layer of material disposed on a substrate 302 in the processing chamber 100. While the exemplary processing chamber 100 is suitable for performing a patterning process, it should be understood that aspects of the present technology can be performed in any number of chambers, and the substrate support according to the present technology can be included in an etch chamber, a deposition chamber, a treatment chamber, or any other processing chamber. The plasma processing chamber 100 can include a chamber body 105 that defines a chamber region 101 in which a substrate can be processed. The chamber body 105 can have sidewalls 112 and a bottom 118 coupled to a ground 126. The sidewalls 112 can have a liner 115 to protect the sidewalls 112 and to extend the time between maintenance cycles of the plasma processing chamber 100. The dimensions of the chamber body 105 and associated components of the plasma processing chamber 100 are not limited and can generally be proportionally larger than the size of the substrate 302 to be processed therein. Examples of substrate sizes include 200 mm diameter, 250 mm diameter, 300 mm diameter, 450 mm diameter, among others, as well as display substrates, solar cell substrates, and the like.

[0027]

[0030] The chamber body 105 may support a chamber lid assembly 110 that encloses the chamber region 101. The chamber body 105 may be made of aluminum or other suitable materials. A substrate access port 113 may be formed through a sidewall 112 of the chamber body 105 to facilitate transfer of a substrate 302 into and out of the plasma processing chamber 100. The access port 113 may be coupled to a transfer chamber and / or other chambers of a substrate processing system, as previously described. A pumping port 145 may be formed through the sidewall 112 of the chamber body 105 and connected to the chamber region 101. A pumping apparatus may be coupled to the chamber region 101 through the pumping port 145 to evacuate and control the pressure in the processing region. The pumping apparatus may include one or more pumps and a throttle valve.

[0028]

[0031] A gas panel 160 may be coupled to the chamber body 105 by gas lines 167 to supply process gases into the chamber region 101. The gas panel 160 may include one or more process gas sources 161, 162, 163, 164 and may additionally include inert, non-reactive, and reactive gases for use in any number of processes. Examples of process gases that may be provided by the gas panel 160 include, but are not limited to, methane, sulfur hexafluoride, silicon chloride, carbon tetrafluoride, hydrogen bromide, hydrocarbon-containing gases, including argon gas, chlorine, nitrogen, helium, or oxygen gas, as well as any number of additional materials. Additionally, the process gas may include nitrogen, chlorine, fluorine, oxygen, and hydrogen-containing gases such as BCl3, C2F4, C4F8, C4F6, CHF3, CH2F2, CH3F, NF3, NH3, CO2, SO2, CO, N2, NO2, N2O, and H2, among any number of additional precursors.

[0029]

[0032] The valves 166 can control the flow of process gas from the sources 161, 162, 163, 164 from the gas panel 160 and can be managed by the controller 165. The flow of gas supplied from the gas panel 160 to the chamber body 105 can include a combination of gas from one or more sources. The lid assembly 110 can include a nozzle 114. The nozzle 114 can be one or more ports for introducing process gas from the sources 161, 162, 164, 163 of the gas panel 160 into the chamber region 101. After the process gas is introduced into the plasma processing chamber 100, a voltage can be applied to the gas to form a plasma. An antenna 148, such as one or more inductor coils, can be provided adjacent the plasma processing chamber 100. An antenna power supply 142 can provide power to the antenna 148 through a matching circuit 141 to inductively couple energy, such as RF energy, to the process gas to maintain a plasma formed from the process gas in the chamber region 101 of the plasma processing chamber 100. Alternatively, or in addition to the antenna power supply 142, a process electrode below and / or above the substrate 302 can be used to capacitively couple RF power to the process gases to maintain a plasma in the chamber region 101. The operation of the power supply 142 can be controlled by a controller, such as controller 165, which also controls the operation of the other components of the plasma processing chamber 100.

[0030]

[0033] A substrate support pedestal 135 may be disposed in the chamber region 101 to support the substrate 302 during processing. The substrate support pedestal 135 may include an electrostatic chuck 122 for holding the substrate 302 during processing. The electrostatic chuck ("ESC") 122 may hold the substrate 302 to the substrate support pedestal 135 using electrostatic attraction. The ESC 122 may be powered by an RF power supply 125 integrated with a matching network 124. The ESC 122 may include an electrode 121 embedded within a dielectric body. The electrode 121 may be coupled to the RF power supply 125 and may provide a bias that attracts plasma ions formed by process gases in the chamber region 101 to the ESC 122 and the substrate 302 seated on the pedestal. The RF power supply 125 may be cycled on and off or pulsed during processing of the substrate 302. The ESC 122 may include an isolator 128 to prevent plasma attraction to the sidewalls of the ESC 122, thereby extending the maintenance life of the ESC 122. Additionally, the substrate support pedestal 135 may include a cathode liner 136 to protect the sidewalls of the substrate support pedestal 135 from the plasma gases, thereby extending the maintenance interval of the plasma processing chamber 100.

[0031]

[0034] The electrode 121 may be coupled to a power supply 150. The power supply 150 may provide a chucking voltage of about 200 volts to about 2000 volts to the electrode 121. The power supply 150 may also include a system controller for controlling the operation of the electrode 121 by directing a direct current to the electrode 121 for chucking and dechucking the substrate 302. The ESC 122 may include a heater disposed in a pedestal and connected to a power supply for heating the substrate, and the cooling base 129 supporting the ESC 122 may include conduits for circulating a heat transfer fluid to maintain the temperature of the ESC 122 and the substrate 302 disposed thereon. The ESC 122 may be configured to operate in a temperature range as required by the thermal budget of the devices fabricated on the substrate 302. For example, the ESC 122 may be configured to maintain the substrate 302 at a temperature of about −150° C. or less to about 500° C. or more, depending on the process being performed.

[0032]

[0035] A cooling base 129 may be provided to assist in temperature control of the substrate 302. To mitigate process drift and time, the temperature of the substrate 302 may be maintained substantially constant by the cooling base 129 throughout the time the substrate 302 is in the cleaning chamber. In some embodiments, the temperature of the substrate 302 may be maintained at a temperature of about −150° C. to about 500° C. throughout the subsequent cleaning process, although any temperature may be used. A cover ring 130 may be disposed on the ESC 122 and along a periphery of the substrate support pedestal 135. The cover ring 130 may be configured to confine the etching gas to a desired portion of the exposed upper surface of the substrate 302 while shielding the upper surface of the substrate support pedestal 135 from the plasma environment in the plasma processing chamber 100. Lift pins may be selectively translated through the substrate support pedestal 135 to lift the substrate 302 above the substrate support pedestal 135 to facilitate access to the substrate 302 by a transfer robot or other suitable transfer mechanism, as described above.

[0033]

[0036] The controller 165 can be used to control process sequences, regulate gas flow from the gas panel 160 into the plasma processing chamber 100, and control other process parameters. The software routines, when executed by the CPU, transform the CPU into a special purpose computer, such as a controller, that can control the plasma processing chamber 100 such that processes are performed in accordance with the present disclosure. The software routines can also be stored and / or executed by a second controller that can be associated with the plasma processing chamber 100.

[0034]

[0037] The above-mentioned processing chambers may be used during the method according to the embodiment of the present technology. FIG. 3 shows a semiconductor processing method 300 in which the steps may be performed in one or more chambers 100 integrated into a multi-chamber processing system 10. Any other chamber capable of performing one or more steps of any of the described methods or processes may also be used. The method 300 may include one or more steps prior to the start of the described method steps, including front-end processing, deposition, etching, polishing, cleaning, or any other steps that may be performed before the described steps. The method may include a number of optional steps as shown in the figure, which may or may not be specifically related to the method according to the present technology. For example, many of the steps are described to provide a broader scope of semiconductor processing, but are not essential to the present technology, or may be performed by alternative methodologies, as further described below.

[0035]

[0038] Method 300 may include multiple steps that may be performed in multiple variations, including starting at a different step of processing. Method 300 may generally include a deposition step that may be performed in a chamber in which an etching process may be performed. In many cases, deposition may be performed after etching. Thus, while method 300 is described in a particular order, it should be understood that the method may be performed in multiple different variations according to embodiments of the present technology. Method 300 may represent the steps shown generally in Figures 4A-4D, which illustrations will be described in conjunction with the steps of method 300. It should be understood that structure 400 in Figures 4A-4D is shown only in partial schematic view, and substrate 405 may include any number of structural sections having the aspects as shown, as well as alternative structural aspects that may benefit from the steps of the present technology.

[0036]

[0039] 4A-4B, in optional step 305, the method may include etching a liner from one or more features along a substrate 405. The substrate 405 may be placed in a processing region of a semiconductor processing chamber. The substrate 405 may have a substantially flat or textured surface in embodiments. The substrate 405 may be a material such as crystalline silicon, silicon oxide, strained silicon, silicon germanium, doped or undoped polysilicon, doped or undoped silicon wafer, patterned or unpatterned wafer, silicon-on-insulator, carbon doped silicon oxide, silicon nitride, doped silicon, germanium, gallium arsenide, or sapphire. The substrate 405 may have a variety of dimensions, such as 200 mm or 300 mm diameter wafers, as well as rectangular or square panels. 4B, etching around one or more features 410 along the substrate 405 can selectively remove material from the substrate 405 or from material previously deposited on the substrate 405. The substrate 405 can include a liner material 415 and a mandrel material 420 formed on the substrate 405. The liner material 415 can be conformally formed around the mandrel material 420 and any exposed portions of the substrate 405 between the mandrels. Step 305 can include etching a portion of the liner material 415 and / or the mandrel material 420 to recess the liner from the sides exposed by the directional etch to form a structure having gaps such as feature 410 that can expose portions of the substrate 305 between the mandrels 420. Any type of etching process can be used to form one or more recessed features 410 along the substrate 405, and can include a directional etch that removes liner material across the top surfaces of the mandrels and the lateral sections of the substrate between the mandrels, while maintaining a liner 415 along the sidewalls of the mandrel material.

[0037]

[0040] One or more features 410 may be characterized by an aspect ratio, or height of the feature relative to width, of about 1:3 or greater. For example, embodiments of the present disclosure may be suitable for gap-fill features characterized by aspect ratios of about 1:2 or greater, about 1:1 or greater, about 2:1 or greater, about 3:1 or greater, about 4:1 or greater, about 5:1 or greater, or greater. The height of the recessed feature 410 may be about 30 nm or greater, about 40 nm or greater, about 50 nm or greater, or greater. Larger aspect ratios may make it more difficult to fill a recess or gap because the material being deposited may deposit at the top of the recess and leave seams or voids in the recess that close or seal the recess. As described further below, embodiments of the present disclosure may deposit carbon-containing material toward the bottom of the recess before the recess closes or seals at the top. That is, embodiments of the present disclosure may fill a recess or gap without leaving seams or voids in the recess or gap.

[0038]

[0041] In step 310, the method 200 may include providing a carbon-containing precursor to a processing region of the semiconductor processing chamber 100. The carbon-containing precursor that may be used in step 310 may be or include any number of carbon-containing precursors. For example, the carbon-containing precursor may be or include any hydrocarbon, or may be or include any material that contains or is composed of carbon and hydrogen. The precursor may include a carbon and hydrogen-containing precursor that may include any amount of carbon and hydrogen bonds along with any other element bonds. In an embodiment, the carbon-containing precursor may be or include methane (CH4).

[0039]

[0042] The flow rate of the carbon-containing precursor may be about 10 sccm or more, about 20 sccm or more, about 30 sccm or more, about 40 sccm or more, about 50 sccm or more, about 60 sccm or more, about 70 sccm or more, or more. The flow rate of the carbon-containing precursor may be adjusted depending on the desired growth rate. Furthermore, the flow rate of the carbon-containing precursor may be adjusted depending on the aspect ratio of the recessed feature 410. For example, for high growth rates or low aspect ratio features, the flow rate of the carbon-containing precursor may be increased to a higher value. A high flow rate of the carbon-containing precursor may reduce the mean free path of the resulting plasma components, as described below, which may result in scattering that prevents the carbon-containing material from reaching the bottom of the recessed feature 410, or may increase deposition on the side and top surfaces of the structure. Thus, in some embodiments, the flow rate of the carbon-containing precursor can be maintained at about 100 sccm or less, can be maintained at about 90 sccm or less, about 80 sccm or less, about 70 sccm or less, about 60 sccm or less, about 50 sccm or less, or less.

[0040]

[0043] In step 315, the method 200 may include delivering a second precursor to the processing region of the semiconductor processing chamber 100, which may occur simultaneously with the delivery of the carbon-containing precursor. The second precursor may be or may include helium, a nitrogen-containing precursor, or argon. The second precursor may aid in the formation of carbon-containing material at the bottom of the recessed feature 410 for a number of reasons, as will be further described below. The flow rate of the second precursor may be about 300 sccm or more. A higher flow rate of the second precursor may aid in the deposition of carbon-containing material at the bottom of the recessed feature 410. This may be due to an increase in plasma temperature or an increase in the driving force that drives the carbon-containing material in the recessed feature 410. Thus, the flow rate of the second precursor may be about 350 sccm or more, about 400 sccm or more, about 450 sccm or more, about 500 sccm or more, about 600 sccm or more, about 700 sccm or more, or more.

[0041]

[0044] The flow rates of the carbon-containing precursor and the second precursor can be related or adjusted over time, as described further below. For example, the flow rate of the second precursor can be maintained at a flow rate ratio of about 10:1 to the carbon-containing precursor during deposition of the carbon-containing material. For example, the flow rate of the second precursor can be maintained at a flow rate ratio of about 15:1 or more, about 20:1 or more, about 25:1 or more, about 30:1 or more, about 35:1 or more, about 40:1 or more, or more, to the carbon-containing precursor. Providing a higher flow rate of the second precursor can help deposit the carbon-containing material at the bottom of the recessed feature 410 without depositing so much of the carbon-containing material at the top of the recessed feature 410 that it seals or closes off with remaining seams or voids.

[0042]

[0045] In step 320, the method 200 may include forming a plasma. The plasma may be formed from the carbon-containing precursor and / or the second precursor in a processing region of the semiconductor processing chamber 100. The forming of the plasma may be performed at a plasma power of about 500 W or more. A plasma power of about 500 W or more may increase the electron temperature in the plasma. The higher electron temperature may aid in the deposition of the carbon-containing material in the recessed features 410. Thus, the formation of the plasma may be performed at a plasma power of about 600 W or more, about 700 W or more, about 800 W or more, about 900 W or more, about 1000 W or more, about 1250 W or more, about 1500 W or more, about 1750 W or more, about 2000 W or more, or more. The plasma may be characterized by an electron temperature of about 6 eV or more.

[0043]

[0046] In addition to increasing the overall temperature of the plasma due to increased electron temperature, the increased electron temperature may form energetic ions in the plasma that may be able to migrate deeper into the recessed feature 410, which may aid in the deposition of carbon-containing material in the recessed feature 410. At high source powers and electron temperatures, excited carbon-containing ions in the plasma may overcome electrostatic or van der Waals forces exerted along the top surface of the recessed feature 410 and migrate deeper into the recessed feature 410, which may cause material to be deposited at the bottom of the recessed feature 410.

[0044]

[0047] As shown in FIGS. 4C-4D, in step 325, the method 200 may include depositing a carbon-containing material 425 on the substrate 405. The carbon-containing material 425 may extend into one or more recessed features 410 along the substrate 405. Carbon may be more likely to deposit on cooler surfaces throughout the substrate, so the temperature and properties of the plasma and material according to embodiments of the present technology may be used to improve bottom-up filling within the features. Based on the second precursor used, the temperature of the bottom of the recessed feature 410 may be maintained at a lower temperature than the temperature of the top of the recessed feature 410. That is, the top of the recessed feature may be affected by the temperature of the plasma, such as the electron temperature in the plasma, while the bottom of the recessed feature may be affected by the temperature of the electrostatic chuck. For example, if the second precursor is helium, the electron temperature in the plasma formed in step 320 may be elevated compared to other second precursors. Helium has only two electrons in one orbit and therefore requires more energy to form a plasma compared to, for example, argon, which has 18 electrons in more than one orbit. Electrons removed from helium are closer to the nucleus than, for example, electrons removed from argon, and therefore require more energy to be removed. As the electron temperature increases, so does the temperature of the entire plasma. As a result, using argon or nitrogen as a carrier gas may limit the electron temperature of the plasma to about 5 eV or less, about 4 eV or less, while forming the plasma with increasing amounts of helium addition may increase the electron temperature to about 6 eV or more, about 8 eV or more, about 10 eV or more, or more.

[0045]

[0048] As the temperature of the plasma above the substrate 405 increases, the top surface of the structure across the substrate may be characterized by a higher temperature than the recessed features 410 or locations away from the plasma exposure. This temperature difference between the top surface, such as across the top of the mandrels, and the bottom surface between the mandrels or across the exposed areas of the substrate may improve coverage and filling at the bottom while limiting or slowing formation on the top surface. In this manner, when the material is fully filled from bottom to top, the carbon-containing material 425 deposited on the substrate 405 may be free or substantially free of any seams or voids within one or more recessed features 410 along the substrate 405. By "substantially free," it is meant that after the carbon-containing material 425 is deposited on the substrate 405, less than 50% of the recessed features 410 may include seams or voids.

[0046]

[0049] As previously mentioned, helium may increase the electron temperature in the plasma, and therefore the temperature of the entire plasma, such that the carbon-containing material 425 may form at a faster rate at the bottom of the recessed feature than at the top of the recessed feature. However, when the second precursor is a nitrogen-containing precursor or argon, the carbon-containing material 425 may be deposited such that the carbon-containing material 425 deposited on the substrate 405 may be free, or substantially free, of any seams or voids in the one or more recessed features 410 along the substrate 405. For example, with a nitrogen-containing precursor or argon, the carbon-containing material 425 may be driven downwards in the recessed feature 410 due to the greater momentum of the large ions in the plasma. That is, the nitrogen-containing precursor and argon have a higher atomic weight than helium, and the momentum and mean free path of the ions may force the carbon-containing material 425 downwards in the recessed feature 410. As a result, in some embodiments, an amount of nitrogen and / or argon may be used during deposition. Additionally, in some embodiments, the deposition precursors may not include nitrogen or argon, and the carrier gas for the carbon-containing precursors may include only helium for the reasons discussed above.

[0047]

[0050] During step 325, the temperature within the semiconductor processing chamber 100, such as the substrate support temperature or the substrate temperature, may be maintained at about 100° C. or less during deposition of the carbon-containing material 425 onto the substrate 405. As previously discussed, a lower temperature toward the bottom of the substrate 405 may aid in depositing the carbon-containing material 425 at the bottom of the recessed feature 410 without sealing or closing off the recessed feature 410 prior to filling with the carbon-containing material 425. Thus, the temperature within the semiconductor processing chamber 100 may be maintained at about 90° C. or less, about 80° C. or less, about 70° C. or less, about 60° C. or less, about 50° C. or less, about 40° C. or less, about 30° C. or less, about 20° C. or less, about 10° C. or less, or less.

[0048]

[0051] Additionally, the pressure in the semiconductor processing chamber 100 may be maintained at about 10 mTorr or less during deposition of the carbon-containing material 425 on the substrate 405. At lower pressures, such as about 10 mTorr, the mean free path of the ions in the plasma may be longer. Similarly, lower pressures may result in higher ion energy in the plasma. The longer mean free path may allow the carbon-containing material 425 to reach the bottom of the recessed feature 410 without first accumulating at the top of the recessed feature 410 and sealing or closing the recessed feature 410. Higher pressures may decrease the mean free path and increase scattering, which may result in the carbon-containing material 425 depositing at the top of the recessed feature 410 instead of the bottom. Accordingly, the pressure within the semiconductor processing chamber 100 may be maintained at about 9 mTorr or less, about 8 mTorr or less, about 7 mTorr or less, about 6 mTorr or less, about 5 mTorr or less, about 4 mTorr or less, about 3 mTorr or less, about 2 mTorr or less, or less.

[0049]

[0052] In step 330, the method 200 may include depositing the carbon-containing material 425 on the substrate 405 for a first period of time, and then applying a bias power while continuing to deposit the carbon-containing material 425 on the substrate 405 for a second period of time. Additionally, in step 330, the method 200 may include decreasing a flow rate of the carbon-containing precursor between the first period of time and the second period of time, and may further include, in step 330, increasing a flow rate of the second precursor between the first period of time and the second period of time.

[0050]

[0053] Initially, no bias power may be applied to the plasma during deposition of the carbon-containing material 425 on the substrate 405, and deposition may occur directly with the source power supply. By starting the method 200 without a bias, the carbon-containing material 425 may be deposited as a conformal protective layer on the one or more recessed features 410 such that application of a final bias does not damage the mandrel material 420 or the remaining liner material over the one or more recessed features 410. The bias power applied after the first period of time may be about 75 W or more. Application of the bias power may allow the one or more recessed features 410 to be filled more uniformly with the carbon-containing material 425 and may control or limit further deposition along the top of the features. Application of the bias may allow the carbon-containing material 425 to be further deposited on the one or more recessed features 410. Without application of the bias, the carbon-containing material 425 tends to deposit on the top of the one or more recessed features 410. The bias can increase directional delivery and promote deposition of the carbon-containing material 425 at the bottom of the one or more recessed features 410. By increasing the deposition rate at the bottom of the one or more recessed features 410, the one or more recessed features 410 can be filled with the carbon-containing material 425 before the top of the one or more recessed features 410 closes or seals, leaving seams or voids in the features. Thus, the bias can be about 100 W or more, about 150 W or more, about 200 W or more, about 250 W or more, about 300 W or more, or more. However, if the bias is applied too high, the one or more recessed features 410 can be damaged. For example, if the bias is too high, such as 400 W or more, the mandrel material 420 and / or the liner material 415 can chip, crack, or shatter. Thus, the bias can be about 400 W or less, about 350 W or less, about 325 W or less, about 300 W or less, about 250 W or less, or less.

[0051]

[0054] After depositing the carbon-containing material 425 for a second period of time, the method 200 may include increasing the bias power while continuing to deposit the carbon-containing material 425 on the substrate 405 for a third period of time. The bias may be increased after deposition of the carbon-containing material 425 begins. In the third period of time, the bias may be increased to a level of about 400 W or greater because the deposited carbon-containing material 425 may act to protect the mandrel material 420 and / or the liner material 415 from damage due to an increase in the bias power.

[0052]

[0055] Any number of additional steps may be performed depending on the structure to be filled. For example, in embodiments of the present technology, a multi-step deposition may be performed in which a first deposition is performed without bias power, followed by any number of additional deposition steps with increasing bias power. As described above, the first step may include a higher flow ratio of the carbon-containing precursor to the second precursor, which may increase a more conformal carbon deposition across the feature. Thus, the first deposition without bias may be performed for a reduced time relative to the subsequent deposition steps, which may limit the amount of coverage formed across the top surface of the feature. In some embodiments, the first deposition step may be performed for about 60 seconds or less, about 50 seconds or less, about 40 seconds or less, about 30 seconds or less, or less. Additionally, the flow ratio of the second precursor to the carbon-containing precursor may be about 20:1 or more, about 18:1 or less, about 16:1 or less, about 14:1 or less, or less.

[0053]

[0056] After the first period of time, a bias can be applied as described above, and the flow ratio of the second precursor to the carbon-containing precursor can be increased to about 15:1 or more, about 20:1 or more, about 25:1 or more, or more. The flow ratio can be adjusted by increasing the flow rate of the second precursor, decreasing the flow rate of the carbon-containing precursor, or both. This can result in more anisotropic filling in the feature and can also increase the amount of trimming at the top surface of the feature. In some embodiments, a second deposition step can be performed at any point described above and can be performed for a longer or shorter period of time than the first deposition step. These adjustments can be continued any additional number of times to further increase the flow ratio, thereby allowing continued bottom-up deposition throughout the feature. For example, after the second period of time, further adjustments to the bias power can or can not be made, and the flow ratio can be further increased to about 20:1 or more, about 25:1 or more, about 30:1 or more, or about 40:1 or more, or more, between the second precursor and the carbon-containing precursor. Again, the flow ratio can be adjusted by increasing the flow rate of the second precursor, decreasing the flow rate of the carbon-containing precursor, or both. Due to the reduced amount of carbon for the second precursor, and depending on the size or aspect ratio of the feature to be filled, the third or subsequent period can be longer than the first period, and can be about 60 seconds or more, about 80 seconds or more, about 100 seconds or more, about 150 seconds or more, about 200 seconds or more, about 250 seconds or more, about 300 seconds or more, or more. Further adjustments can continue to be made during this or subsequent deposition periods. The method 200 can include any number of iterations or steps to form the carbon-containing material 425, and three steps are envisioned as merely exemplary. For example, 4, 5, 6, 7, or more steps can be used in which biases and flow rates can be changed. By using a multi-step approach, one or more recessed features 410 can be filled with carbon-containing material 425 without creating a mushroom or bread loaf shape on the recessed features 410.Additionally, the carbon-containing material 425 may be free or substantially free of seams or voids.

[0054]

[0057] In the foregoing description, for purposes of explanation, numerous details are set forth in order to provide an understanding of various embodiments of the present technology. However, it will be apparent to one of ordinary skill in the art that certain embodiments may be practiced without some of these details or with additional details.

[0055]

[0058] Although several embodiments have been disclosed, those skilled in the art will recognize that various modifications, alternative configurations, and equivalents may be used without departing from the spirit of the embodiments. Moreover, a number of well-known processes and elements have not been described in order to avoid unnecessarily obscuring the technology. Thus, the above description should not be considered as limiting the scope of the technology.

[0056]

[0059] Where a range of values ​​is provided, it is understood that each intervening value between the upper and lower limit of that range, to the smallest fraction of the unit of the lower limit, is also specifically disclosed, unless the context clearly dictates otherwise. Any narrower range between any stated value or unstated intervening value in a stated range and any other stated or intervening value in that stated range is included. The upper and lower limits of these smaller ranges may be independently included or excluded, and each range in which either or both limits are included in the smaller ranges is also included within the technology, subject to any specifically excluded limit in the stated range. Where a stated range includes one or both limits, ranges excluding either or both of those included limits are also included.

[0057]

[0060] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural references unless the context clearly dictates otherwise. Thus, for example, reference to a "carbon-containing precursor" includes a plurality of such precursors, reference to a "carbon-containing material" includes a reference to one or more such materials and equivalents thereof known to those skilled in the art, and so forth.

[0058]

[0061] Additionally, as used in this specification and the claims that follow, the terms "comprise," "comprising," "contain," "containing," "include," and "including" specify the presence of stated features, integers, components, or steps, but they do not exclude the presence or addition of one or more other features, integers, components, steps, operations, or groups.

Claims

1. 1. A semiconductor processing method comprising: providing a carbon-containing precursor to a processing region of a semiconductor processing chamber, the processing region of the semiconductor processing chamber having a substrate disposed within the processing region of the semiconductor processing chamber, the substrate defining one or more recessed features along the substrate; delivering a second precursor to a processing region of the semiconductor processing chamber; forming a plasma of the carbon-containing precursor and the second precursor in the processing region, the plasma being performed at a plasma power of 500 W or more; depositing a carbon-containing material on the substrate, the carbon-containing material extending into the one or more recessed features along the substrate; applying a bias power during deposition of the carbon-containing material on the substrate for a second period of time after depositing the carbon-containing material on the substrate for a first period of time; The method includes:

2. The carbon-containing precursor is methane (CH ４ 2. The semiconductor processing method of claim 1 , comprising:

3. The semiconductor processing method of claim 1 , wherein the one or more recessed features are characterized by an aspect ratio of 1:3 or greater.

4. 10. The semiconductor processing method of claim 1, wherein a temperature within said semiconductor processing chamber is maintained at or below 100[deg.] C. during deposition of said carbon-containing material on said substrate.

5. 10. The semiconductor processing method of claim 1, wherein a pressure in said semiconductor processing chamber is maintained at or below 10 mTorr during deposition of said carbon-containing material on said substrate.

6. 10. The semiconductor processing method of claim 1, wherein the second precursor comprises helium, a nitrogen-containing precursor, or argon.

7. 10. The semiconductor processing method of claim 1, further comprising decreasing a flow rate of said carbon-containing precursor between said first time period and said second time period.

8. 10. The semiconductor processing method of claim 1, further comprising increasing a flow rate of the second precursor between the first time period and the second time period.

9. a flow rate of the carbon-containing precursor is greater than or equal to 10 sccm for the first period of time; a flow rate of the second precursor is greater than or equal to 300 sccm during the first period of time; 10. The semiconductor processing method of claim 1.

10. after depositing the carbon-containing material for the second period of time, increasing a bias power to a processing region of the semiconductor processing chamber while depositing the carbon-containing material on the substrate for a third period of time. The semiconductor processing method of claim 1 further comprising:

11. 10. The semiconductor processing method of claim 1, wherein the carbon-containing material deposited on the substrate is substantially free of any seams or voids within the one or more recessed features along the substrate.

12. 1. A semiconductor processing method comprising: providing a carbon-containing precursor to a processing region of a semiconductor processing chamber, the processing region of the semiconductor processing chamber having a substrate disposed within the processing region of the semiconductor processing chamber, the substrate defining one or more recessed features along the substrate; forming a plasma of the carbon-containing precursor in the processing region; depositing a carbon-containing material on the substrate; treating the carbon-containing material with a second precursor, the second precursor causing the carbon-containing material to extend into the one or more recessed features along the substrate; introducing a bias power while depositing the carbon-containing material and treating the carbon-containing material with the second precursor, the bias power being applied gradually and an initial bias power being 0 W; and The method includes:

13. maintaining a temperature within the semiconductor processing chamber at or below 75° C. during depositing the carbon-containing material and treating the carbon-containing material on the substrate with the second precursor; a pressure in the semiconductor processing chamber is maintained at or above 7 mTorr while depositing the carbon-containing material and treating the carbon-containing material on the substrate with the second precursor.

13. The semiconductor processing method of claim 12.

14. after depositing the carbon-containing material on the substrate for a first period of time, the bias power is introduced for a second period of time such that the bias power is greater than or equal to 50 W; 13. The semiconductor processing method of claim 12.

15. The semiconductor processing method of claim 12 , wherein the second precursor comprises helium.

16. 1. A semiconductor processing method comprising: Etching one or more recessed features along a substrate, the substrate being disposed within a processing region of a semiconductor processing chamber; providing a carbon-containing precursor to a processing region of a semiconductor processing chamber; delivering a second precursor to a processing region of the semiconductor processing chamber; forming a plasma of the carbon-containing precursor and the second precursor in the processing region, the plasma characterized by an electron temperature of 6 eV or greater; depositing a carbon-containing material onto the substrate, the carbon-containing material extending into the one or more recessed features along the substrate, the carbon-containing material being deposited in the same semiconductor processing chamber as etching; applying a bias power to a processing region of the semiconductor processing chamber after depositing the carbon-containing material on the substrate for a first period of time; The method includes:

17. 17. The method of claim 16, wherein the bias power applied after the first period of time is 75 W or greater.

18. The method of claim 16 , wherein the second precursor comprises helium.

19. decreasing a flow rate of the carbon-containing precursor into the semiconductor processing chamber after depositing the carbon-containing material for the first period of time. The method of claim 16 further comprising:

20. 17. The method of claim 16, wherein the flow rate of the second precursor is maintained at a flow rate ratio of 10:1 or greater to the carbon-containing precursor during the first period of time.

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