Dresser Board

Abstract

To provide a dresser board which can simply perform a work for specifying a region on the surface of the dresser board served to dressing.SOLUTION: A mark as a reference of a distance from a first side on a rectangular surface of a dresser board is displayed on a region along a second side vertical to the first side. Thereby, in the dresser board, an interval between the region on the surface of the dresser board available for next dressing and the first side can be easily measured. As a result, a work for specifying the region on the surface of the dresser board served to dressing can be simplified.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a dresser board. [Background technology]

[0002] Device chips such as IC (Integrated Circuit) and LSI (Large Scale Integration) are essential components in various electronic devices such as mobile phones, personal computers, etc. Such chips are manufactured, for example, by dividing a wafer on which a large number of devices are formed into regions each containing an individual device.

[0003] An example of a device used to divide a wafer is a cutting device. This cutting device has a chuck table that holds the wafer, and a cutting unit including a spindle to which a cutting blade is attached at its tip. Furthermore, this cutting blade has an annular cutting edge with abrasive grains dispersed therein. In the cutting device, the cutting blade is rotated and the outer circumferential surface of the cutting edge is brought into contact with the wafer, thereby cutting and dividing the wafer.

[0004] However, in unused cutting blades, the outer peripheral surface of the cutting edge may not be perfectly round and / or the abrasive grains may not be sufficiently exposed on the outer peripheral surface of the cutting edge. Furthermore, when cutting chips generated by cutting adhere to the outer peripheral surface of the cutting edge, the abrasive grains may not be sufficiently exposed on this outer peripheral surface (clogged). Furthermore, repeated cutting may cause the abrasive grains exposed on the outer peripheral surface of the cutting edge to wear out (become dull).

[0005] For this reason, in cutting devices, a process (dressing) is often performed at an appropriate timing to grind the outer peripheral surface side of the cutting edge of the cutting blade to prepare it in a state suitable for cutting. This dressing is performed, for example, in the following order. First, a plate-shaped dresser board (dressing board) with abrasive grains dispersed therein is held on a sub-chuck table (dressing board support table) provided near the chuck table. Then, the sub-chuck table is moved linearly so that the rotating cutting blade cuts into the surface side of the dresser board (for example, see Patent Document 1). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2011-16175 A Summary of the Invention [Problem to be solved by the invention]

[0007] When the above-mentioned dressing is performed, the front surface side of the dresser board is scraped, so that the dressing is performed while shifting the position of the cutting blade every time the cutting blade cuts into the dresser board so that the outer peripheral surface of the cutting edge of the cutting blade contacts the area of ​​the dresser board that is not scraped.

[0008] For example, when an area parallel to a first side of the rectangular surface of a dresser board is to be dressed, an area slightly inside the first side is first dressed, and in each subsequent dressing, an area further inside than the area previously dressed is dressed.

[0009] However, such dressing is performed on the cutting edge of an unused cutting blade or on the cutting edge of a cutting blade that has become clogged and / or ballast from cutting a large number of wafers, and is not performed continuously. Therefore, when dressing is performed, it is necessary to identify the area of ​​the dresser board to be dressed again, taking into account the usage status of the dresser board.

[0010] Currently, this identification is performed manually by an operator of the cutting device. Specifically, the operator measures the distance between the first side of the surface of the dresser board and the desired area using a tape measure or the like, and inputs the measured distance value into the cutting device, thereby identifying this area as the area of ​​the dresser board to be used for dressing.

[0011] However, the task of using a tape measure or the like for this identification is cumbersome. In view of this, an object of the present invention is to provide a dresser board that can simplify the task of identifying the area of ​​the dresser board to be used for dressing. [Means for solving the problem]

[0012] According to the present invention, there is provided a dresser board having a rectangular surface, the dresser board being provided with a distance indicator from a first side of the surface. Multiple A mark is displayed in an area along a second side of the surface perpendicular to the first side. Each of the plurality of marks is a line segment extending from the second side along a direction parallel to the first side, and the plurality of marks are classified into two types according to their length. A dressing board is provided. Effect of the Invention

[0013] In the dresser board of the present invention, a mark indicating the distance from the first side of the rectangular surface is displayed in an area along a second side perpendicular to the first side. This makes it easy to measure the distance between the area of ​​the dresser board available for the next dressing and the first side. As a result, the task of identifying the area of ​​the dresser board to be used for dressing can be simplified. [Brief description of the drawings]

[0014] [Figure 1] FIG. 1 is a perspective view that illustrates an example of a dresser board. [Diagram 2] FIG. 2 is a perspective view illustrating an example of a cutting device. [Diagram 3] FIG. 3(A) is a top view showing a schematic of the sub-chuck table holding a new (unused) dresser board, and FIG. 3(B) is a front view showing a schematic of the sub-chuck table holding a new (unused) dresser board. [Figure 4] FIG. 4(A) is a top view showing a schematic diagram of the sub-chuck table holding a reusable second-hand (used) dresser board, and FIG. 4(B) is a front view showing a schematic diagram of the sub-chuck table holding a reusable second-hand (used) dresser board. [Diagram 5] FIG. 5 is a perspective view illustrating a modified example of the dresser board. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] An embodiment of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view showing an example of a dresser board. The dresser board 1 shown in Fig. 1 has a rectangular parallelepiped shape with a width and length 10 times or more larger than a thickness.

[0016] The dresser board 1 is made of, for example, green carborundum (GC) abrasive grains made of silicon carbide (SiC) or aluminum oxide (Al 2 O 3 It is manufactured by mixing white alundum (WA) abrasive grains made of a resin binder and then firing it.

[0017] The surface 3 of the dresser board 1 has a rectangular shape having a first side 3a and a second side 3b perpendicular to the first side 3a. A plurality of marks 5 are displayed in an area along the second side 3b of the surface 3, which function as a scale indicating the distance from the first side 3a.

[0018] Specifically, each of the marks 5 is a line segment extending from the second side 3b along a direction parallel to the first side 3a. Each of the marks 5 is displayed at approximately equal intervals along a direction parallel to the second side 3b so that the distance from the first side 3a to each of the marks 5 is 5×k (k is a natural number equal to or less than 13) mm.

[0019] Furthermore, the marks 5 are classified into two types according to the length of the line segment (the length in the width direction of the dresser board 1). Specifically, the marks 5 (the former marks) that are located approximately 5×l (l is a positive even number not exceeding 12) mm away from the first side 3a are longer than the marks 5×m (m is a positive odd number not exceeding 13) mm away from the first side 3a.

[0020] In addition, a number 7 indicating the distance from the first side 3a is displayed in an area of ​​the front surface 3 located on the opposite side of the second side 3b from the former mark. The marks 5 and the number 7 are applied to the front surface 3 of the dresser board 1 by, for example, laser marking.

[0021] Fig. 2 is a perspective view showing a schematic example of a cutting device in which dressing is performed using a dresser board 1. Note that the X-axis direction (front-back direction) and the Y-axis direction (left-right direction) shown in Fig. 2 are directions perpendicular to each other on a horizontal plane, and the Z-axis direction (up-down direction) is a direction (vertical direction) perpendicular to the X-axis and Y-axis directions.

[0022] The cutting device 2 shown in Fig. 2 includes a base 4 that supports each component. A rectangular opening 4a is formed in the front corner of the base 4, and a cassette support stage 6 that can rise and fall is provided within this opening 4a. A cassette 8 that contains a plurality of wafers 11 is placed on the upper surface of the cassette support stage 6. For ease of explanation, only the outline of the cassette 8 is shown in Fig. 1.

[0023] The wafer 11 is made of a semiconductor material such as silicon, and its front surface is divided into a central device region and a peripheral surplus region surrounding the device region. This device region is further divided into a plurality of regions by planned division lines (streets) arranged in a lattice pattern, and devices 15 such as ICs and LSIs are formed in each region.

[0024] A dicing tape 17 having a diameter larger than that of the wafer 11 is attached to the back surface side of the wafer 11. The outer peripheral portion of the dicing tape 17 is fixed to an annular frame 19. That is, the wafer 11 is supported by the frame 19 via the dicing tape 17.

[0025] A rectangular opening 4b that is long in the X-axis direction is formed on the side of the cassette support base 6. In this opening 4b, an X-axis moving table 10, an X-axis moving mechanism (not shown) that moves the X-axis moving table 10 along the X-axis direction, and a dustproof / waterproof cover 12 that covers the X-axis moving mechanism are provided.

[0026] A chuck table 14 for holding the wafer 11 is provided above the X-axis moving table 10. Four clamps 16 are arranged around the chuck table 14 to fix an annular frame 19 supporting the wafer 11 from all four sides.

[0027] The chuck table 14 is connected to a rotary drive source (not shown) such as a motor, and rotates about a rotation axis that is a straight line substantially parallel to the Z-axis direction. The chuck table 14 also moves along the X-axis direction together with the X-axis moving table 10.

[0028] The upper surface of the chuck table 14 is a holding surface 14a that holds the wafer 11. This holding surface 14a is connected to a suction source (not shown) through a suction path or the like formed inside the chuck table 14.

[0029] A transport unit (not shown) is provided at a position adjacent to the opening 4b to transport the wafer 11 to the chuck table 14. The wafer 11 is loaded onto the holding surface 14a of the chuck table 14 by the transport unit so that, for example, the front surface side is exposed upward.

[0030] A gate-shaped support structure 24 for supporting the two cutting units 22 is disposed across the opening 4b on the upper surface of the base 4. Two cutting unit moving mechanisms 26 for moving each cutting unit 22 along the Y-axis and Z-axis directions are provided on the upper front surface of the support structure 24.

[0031] Each cutting unit moving mechanism 26 is fixed to the front surface of the support structure 24 and shares a pair of guide rails 28 extending along the Y-axis direction. A moving plate 30 is connected to the front surface of the pair of guide rails 28 in a manner that allows it to slide along the pair of guide rails 28.

[0032] A screw shaft 32 extending along the Y-axis direction is disposed between the pair of guide rails 28. A motor 34 for rotating the screw shaft 32 is connected to one end of the screw shaft 32. In addition, a nut portion (not shown) for accommodating balls that roll on the surface of the rotating screw shaft 32 is provided on the surface of the screw shaft 32 on which a spiral groove is formed, thereby forming a ball screw.

[0033] That is, when the screw shaft 32 rotates, the balls circulate inside the nut portion, causing the nut portion to move along the Y-axis direction. The nut portion is fixed to the rear surface side of the moving plate 30. Therefore, when the screw shaft 32 is rotated by the motor 34, the moving plate 30 moves along the Y-axis direction together with the nut portion.

[0034] A pair of guide rails 36 extending along the Z-axis direction are fixed to the front surface of each movable plate 30. A movable plate 38 is connected to the front surface side of the pair of guide rails 36 in a manner that allows it to slide along the pair of guide rails 36.

[0035] A screw shaft 40 extending along the Z-axis direction is disposed between the pair of guide rails 36. A motor 42 for rotating the screw shaft 40 is connected to one end of the screw shaft 40. In addition, a nut portion (not shown) for accommodating balls that roll on the surface of the rotating screw shaft 40 is provided on the surface of the screw shaft 40 on which a spiral groove is formed, thereby forming a ball screw.

[0036] That is, when the screw shaft 40 rotates, the balls circulate inside the nut portion, causing the nut portion to move along the Z-axis direction. The nut portion is fixed to the rear surface side of the moving plate 38. Therefore, when the screw shaft 40 is rotated by the motor 42, the moving plate 38 moves along the Z-axis direction together with the nut portion.

[0037] A cutting unit 22 that cuts the wafer 11 is provided below each moving plate 38. The cutting unit 22 has a cylindrical spindle housing that extends along the Y-axis direction. A spindle that extends in the Y-axis direction is housed in the spindle housing. The spindle is supported by the spindle housing in a rotatable state.

[0038] The tip of the spindle is exposed outside the spindle housing, and a cutting blade 44 having an annular cutting edge is attached to the tip. The spindle housing also contains a rotation drive source (not shown) such as a motor that is connected to the base end of the spindle. Therefore, when the spindle is rotated by the rotation drive source, the cutting blade 44 rotates around a straight line along the Y-axis direction as the rotation axis.

[0039] The cutting blade 44 is, for example, a hub-type cutting blade. The hub-type cutting blade is composed of an annular base made of metal or the like and an annular cutting edge formed along the outer periphery of the base. The cutting edge of this cutting blade is composed of, for example, an electroformed grinding wheel in which abrasive grains made of diamond or cubic boron nitride (cBN) or the like are fixed by a binder such as nickel.

[0040] Alternatively, the cutting blade 44 may be a washer-type cutting blade. A washer-type cutting blade is configured with an annular cutting edge having abrasive grains fixed thereto by a binder such as metal, ceramic, or resin.

[0041] An imaging unit 46 is provided in front of the cutting unit 22. The imaging unit 46 has, for example, a light source such as an LED (Light Emitting Diode), an objective lens, and an imaging element such as a CCD (Charge Coupled Device) image sensor or a CMOS (Complementary Metal Oxide Semiconductor) image sensor.

[0042] A circular opening 4c is formed in the front corner of the base 4 opposite to the corner where the opening 4a is formed. A cleaning unit 48 for cleaning the wafer 11 and the like after cutting is provided in this opening 4c.

[0043] In addition, two sub-chuck tables 50 are provided on the X-axis moving table 10 of the cutting device 2. The sub-chuck tables 50 move along the X-axis direction together with the X-axis moving table 10. The upper surface of the sub-chuck table 50 serves as a holding surface that holds the dresser board 1.

[0044] This holding surface is connected to a suction source (not shown) through a suction path or the like formed inside the sub-chuck table 50. Fig. 3(A) is a top view diagrammatically showing the sub-chuck table 50 in a state in which a new (unused) dresser board 1 is held, and Fig. 3(B) is a front view diagrammatically showing the sub-chuck table 50 in a state in which a new (unused) dresser board 1 is held.

[0045] The sub-chuck table 50 is supported by the X-axis moving table 10 via a support 52 fixed to the lower end of the front side of the sub-chuck table 50. The holding surface 50a of the sub-chuck table 50 is rectangular, with a pair of short sides extending along the X-axis direction and a pair of long sides extending along the Y-axis direction. The length of the short sides of the holding surface 50a is approximately equal to the width of the dresser board 1.

[0046] Furthermore, a pair of set screws 54 aligned along the X-axis direction are inserted in an area adjacent to one of the pair of short sides of the holding surface 50a. The distance between the other of the pair of short sides of the holding surface 50a and the pair of set screws 54 is approximately equal to the length of the dresser board 1.

[0047] The dresser board 1 is placed on the holding surface of the sub-chuck table 50 so that the side of the front surface 3 opposite to the first side 3a contacts the pair of set screws 54 and the second side 3b overlaps with the long side of the holding surface 50a of the sub-chuck table 50. Then, the dresser board 1 is sucked and held on the sub-chuck table 50 by operating a suction source connected to this holding surface 50a.

[0048] Dressing using the dresser board 1 in the cutting device 2 is performed, for example, in the following order: First, the cutting unit moving mechanism 26 adjusts the position of the cutting unit 22 in the Y-axis direction so that an area slightly inside the first side 3a of the front surface 3 of the new (unused) dresser board 1 is positioned in the X-axis direction when viewed from above, as viewed from the cutting edge of the cutting blade 44.

[0049] Next, the cutting unit moving mechanism 26 adjusts the position of the cutting unit 22 in the Z-axis direction so that the bottom end of the cutting edge of the cutting blade 44 is positioned lower than the surface 3 of the dresser board 1 and higher than the holding surface 50a of the sub-chuck table 50. Next, while rotating the cutting blade 44, the X-axis moving mechanism moves the sub-chuck table 50 together with the X-axis moving table 10 so that the cutting blade 44 passes over the dresser board 1 from one end to the other in the X-axis direction.

[0050] This completes the process (dressing) of grinding the outer peripheral surface of the cutting edge of the cutting blade 44 to make the cutting edge suitable for cutting (the outer peripheral surface becomes perfectly circular and / or the abrasive grains are sufficiently exposed on the outer peripheral surface). In addition, accompanying this dressing, the front surface 3 side of the dresser board 1 is also ground, and a groove is formed along the X-axis direction in an area slightly inside the first side 3a of the front surface 3.

[0051] Furthermore, if necessary, the same process may be repeated with the cutting blade 44 shifted in the Y-axis direction. That is, a plurality of grooves may be formed in the surface 3 of the dresser board 1 by one dressing.

[0052] FIG. 4(A) is a top view showing a schematic of the sub-chuck table 50 holding a reusable second-hand (used) dresser board 1, and FIG. 4(B) is a front view showing a schematic of the sub-chuck table 50 holding a reusable second-hand (used) dresser board 1.

[0053] 4(A) and 4(B) show a dresser board 1 that has been dressed multiple times while shifting the area of ​​the surface 3 to be dressed along the Y-axis direction. A plurality of grooves 3c are formed on the surface 3 of the dresser board 1 along the X-axis direction.

[0054] 4(A) and 4(B), a plurality of marks 5 are displayed in an area along the second side 3b of the surface 3 of the dresser board 1, which serve as a guide for the distance from the first side 3a. Furthermore, numbers indicating the distance from the first side 3a are displayed on the surface 3 of the dresser board 1.

[0055] This makes it possible to easily measure the distance (e.g., 17.5 mm) between the area of ​​the dresser board 1 available for the next dressing and the first side 3a of the dresser board 1. As a result, the task of identifying the area of ​​the dresser board 1 available for dressing can be simplified.

[0056] The above-described dresser board 1 is one embodiment of the present invention, and the present invention also includes dresser boards having features different from those of the dresser board 1. For example, the number of marks displayed on the surface of the dresser board of the present invention may be one.

[0057] In addition, the marks displayed on the surface of the dresser board of the present invention are not limited to lines parallel to the first side as long as they are a guide to the distance from the first side. Fig. 5 is a perspective view showing a schematic example of a dresser board on which a plurality of marks different from the marks 5 displayed on the surface 3 of the dresser board 1 are displayed.

[0058] 5 has a rectangular shape having a first side 23a and a second side 23b perpendicular to the first side 23a. A plurality of marks 25 that function as a scale indicating the distance from the first side 23a are displayed in an area along the second side 23b of the surface 23. Specifically, each of the marks 25 is polygonal and is displayed at approximately equal intervals along a direction parallel to the second side 23b.

[0059] In addition, the structures and methods according to the above-described embodiments can be modified as appropriate without departing from the scope of the present invention. [Explanation of symbols]

[0060] 1: Dresser board 3: Surface (3a: first side, 3b: second side) 5: Mark 7: Number 2:Cutting device 4: Base (4a, 4b, 4c: opening) 6: Cassette support stand 8: Cassette 10: X-axis moving table 11: Wafer 12: Dust-proof and water-resistant cover 14: Chuck table (14a: holding surface) 15: Device 16: Clamp 17: Dicing tape 19: Frame 22: Cutting unit 24:Support structure 26: Cutting unit movement mechanism 28: Guide rail 30: Moving plate 32: Screw shaft 34: Motor 36: Guide rail 38: Moving plate 40: Screw shaft 42: Motor 44: Cutting blade 46: Imaging unit 48: Cleaning unit 21: Dresser board 23: Surface (23a: first side, 23b: second side) 25: Mark

Claims

[Claim 1] A dresser board having a rectangular surface, a plurality of marks indicating distances from a first side of the surface are displayed in an area along a second side of the surface perpendicular to the first side; each of the plurality of marks is a line segment extending from the second side along a direction parallel to the first side; The plurality of marks are classified into two types according to their lengths.

Images