Compositions comprising ammonia-activated siloxanes for avoiding pattern collapse when processing patterned materials having line-to-line dimensions of 50 nm or less

Abstract

A non-aqueous composition comprising: (a) an organic protic solvent; and (b) ammonia. (c) at least one additive of formula I or II, [Formula 1] TIFF2022527614000016.tif8491In formula, R 1 is H, R 2 H, C1~C 10 Alkyl, C1-C 10 Alkoxy, C6-C 10 Aryl and C6-C 10 selected from aloxi R 3 is R 2 is selected from R 4 is C1~C 10 Alkyl, C1-C 10 Alkoxy, C6-C 10 Aryl and C6-C 10 selected from aloxi R 10 , R 12 is C1~C 10 Alkyl and C1-C 10 independently selected from alkoxy; m is 1, 2 or 3; n is 0 or an integer from 1 to 100. and at least one additive.

Description

[Technical field]

[0001] The present invention is directed to compositions for pattern collapse prevention treatments and their uses and methods for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices. [Background technology]

[0002] In the process of manufacturing ICs with LSI, VLSI and ULSI, patterned material layers such as patterned photoresist layers, patterned barrier material layers containing or consisting of titanium nitride, tantalum or tantalum nitride, patterned multi-stack material layers containing or consisting of alternating stacks of polysilicon and silicon dioxide or silicon nitride layers, and patterned dielectric material layers containing or consisting of low-k or ultra-low-k dielectric materials are produced by photolithographic techniques. Recently, such patterned material layers include structures with high aspect ratios with dimensions even smaller than 22 nm.

[0003] However, regardless of the exposure technique, wet chemical processing of small patterns suffers from several problems. As technology advances and dimensional requirements become more stringent, patterns are required to include relatively thin and tall structures or features of device structures on the substrate, i.e. features with high aspect ratios. These structures may be subject to bending and / or collapse, especially during the spin-dry process, due to excessive capillary forces of the rinse liquid deionized water liquid or solution remaining between adjacent patterned structures after the chemical rinse and spin-dry processes.

[0004] As dimensions shrink, removal of particles and plasma etch residues also becomes a critical factor in order to obtain defect-free patterned structures, which applies not only to photoresist patterns but also to other patterned material layers that arise during the manufacture of optical, micromachined and precision mechanical devices.

[0005] WO2012 / 027667A2 discloses a method of modifying the surface of a high aspect ratio feature by contacting the surface of the high aspect ratio feature with an additive composition to produce a modified surface, in which the forces acting on the high aspect ratio feature when a rinsing solution contacts the modified surface are sufficiently minimized to prevent bending or collapse of the high aspect ratio feature at least during removal of the rinsing solution or at least during drying of the high aspect ratio feature. The modified surface should have a contact angle in the range of about 70° to about 110°. Several siloxane type surfactants are disclosed, as well as many types of acids, bases, nonionic surfactants, anionic surfactants, cationic surfactants, and zwitterionic surfactants. Various solvents are described, including ethylene glycol, isopropanol, 1-methoxy-2-propyl acetate, isopropyl acetate, ethyl carbonate, dimethyl sulfoxide, and hexane.

[0006] WO2014 / 091363A1 discloses an aqueous composition comprising a hydrophobing agent in combination with a surfactant having a surface tension of 10 mN / m to 35 mN / m, which may be a siloxane type surfactant, besides other types of surfactants. The aqueous composition preferably does not contain an organic solvent.

[0007] WO2019 / 086374 discloses an aqueous pattern collapse prevention solution containing a siloxane-based additive.

[0008] US2018 / 0254182 discloses the use of silanes such as hexamethyldisilazane in a surface treatment composition that can highly hydrophobize (silylate) the surface of a treatment target, such as an inorganic pattern or a resin pattern, while suppressing deterioration of the polyvinyl chloride, when performing surface treatment of the treatment target using an apparatus having a liquid contact part equipped with a polyvinyl chloride member.

[0009] However, these compositions still suffer from frequent pattern collapse in structures below 50 nm. Summary of the Invention [Problem to be solved by the invention]

[0010] It is an object of the present invention to provide a method for manufacturing integrated circuits of the sub-50 nm node, in particular the sub-32 nm node, especially the sub-22 nm node, which no longer exhibits the drawbacks of the prior art manufacturing methods.

[0011] In particular, compounds according to the present invention allow chemical rinsing of patterned material layers containing features having high aspect ratios and line-to-line dimensions of 50 nm or less, particularly 32 nm or less, and especially 22 nm or less, without causing pattern collapse. [Means for solving the problem]

[0012] The present invention completely avoids all of the shortcomings of the prior art by using a non-aqueous composition comprising an organic solvent in combination with a siloxane-type non-ionic additive as described herein.

[0013] A first embodiment of the invention is a non-aqueous composition comprising: (a) an organic protic solvent; (b) ammonia; (c) at least one additive of formula I or II, [ka] During the ceremony, R 1 is H, R 2 , H, C 1 ~C 10 Alkyl, C 1 ~C 10 Alkoxy, C 6 ~C 10 Aryl and C 6 ~C 10 selected from aloxi R 3 is R 2 is selected from R 4 is C 1 ~C10 Alkyl, C 1 ~C 10 Alkoxy, C 6 ~C 10 Aryl and C 6 ~C 10 selected from aloxi R 10 , R 12 is C 1 ~C 10 Alkyl and C 1 ~C 10 independently selected from alkoxy, m is 1, 2 or 3; n is 0 or an integer from 1 to 100; and at least one additive.

[0014] Surprisingly, it has been found that additives according to the invention that contain at least one H atom bonded to a Si atom provide better pattern collapse rates when used in cleaning than their fully substituted counterparts.

[0015] Another embodiment of the present invention is a kit comprising: (a) ammonia dissolved in an organic protic solvent; and (b) at least one additive of formula I, as defined herein.

[0016] Yet another embodiment of the present invention is the use of the compositions described herein to treat a substrate having a patterned layer of patterned material having a line-to-line dimension of 50 nm or less, an aspect ratio of 4 or greater, or a combination thereof.

[0017] Yet another embodiment of the present invention is a method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices, the method comprising: (1) providing a substrate having a patterned layer of patterning material having a line-to-line dimension of 50 nm or less, an aspect ratio of 4 or greater, or a combination thereof; (2) contacting the substrate with the composition according to any one of claims 1 to 10 at least once; (3) removing the non-aqueous composition from contact with the substrate; and Includes.

[0018] The composition comprising a combination of an organic protic solvent, preferably an alcohol, and an H-silane activated by ammonia is particularly useful for treating substrates containing patterns with line-to-line dimensions of 50 nm or less, particularly 32 nm or less, and most particularly 22 nm or less, to prevent pattern collapse. Furthermore, the composition according to the invention is particularly useful when the aspect ratio is 4 or more, without causing pattern collapse. In addition to all the above, due to the use of a protic organic solvent and optionally an alkane as the solvent, the composition has excellent compatibility with substrates containing polyvinyl chloride.

[0019] It should be noted that cleaning or rinsing solutions comprising organic polar solvents in combination with ammonia-activated H-silane are generally useful for avoiding pattern collapse of photoresist structures as well as non-photoresist patterns having high aspect ratio stacks (HARS), particularly patterned multi-stack material layers containing or consisting of stacks comprising alternating polysilicon and silicon dioxide or silicon nitride layers. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] The present invention is directed to compositions that are particularly suitable for fabricating patterned materials containing sub-50 nm sized features, such as integrated circuit (IC) devices, optical devices, micromachined and precision mechanical devices, especially IC devices.

[0021] Any conventional and known substrate used to manufacture IC devices, optical devices, micromachines and precision mechanical devices may be used in the method of the present invention. Preferably, the substrate is a semiconductor substrate, more preferably a silicon wafer, which is conventionally used in the manufacture of IC devices, particularly IC devices including ICs having LSI, VLSI and ULSI.

[0022] The compositions are particularly suitable for treating substrates having patterned material layers with line-to-line dimensions of 50 nm or less, particularly 32 nm or less, and especially 22 nm or less (i.e., patterned material layers for sub-22 nm technology nodes). The patterned material layers preferably have an aspect ratio of greater than 4, preferably greater than 5, more preferably greater than 6, even more preferably greater than 8, even more preferably greater than 10, even more preferably greater than 12, even more preferably greater than 15, and even more preferably greater than 20. The smaller the line-to-line dimensions and the higher the aspect ratio, the more advantageous the methods of using the compositions described herein.

[0023] The composition according to the present invention can be applied to any substrate of patterned material so long as the structure is prone to collapse due to its shape.

[0024] By way of example, the patterned material layer may be (a) A Si layer coated with patterned silicon oxide or silicon nitride; (b) a patterned barrier material layer containing or consisting of ruthenium, cobalt, titanium nitride, tantalum, or tantalum nitride; (c) a patterned multi-stack material layer containing or consisting of layers of at least two different materials selected from the group consisting of silicon, polysilicon, silicon dioxide, SiGe, low-k and ultra-low-k materials, high-k materials, semiconductors other than silicon and polysilicon, and metals; and (d) a patterned dielectric material layer containing or consisting of silicon dioxide or a low-k or ultra-low-k dielectric material; It could be.

[0025] solvent The non-aqueous pattern collapse prevention composition contains a polar protic organic solvent. Due to their hydrophilicity, the organic protic solvent is usually hygroscopic and has a significant amount of residual water unless it is removed by drying. Therefore, the organic protic solvent is preferably dried before being used in the pattern collapse prevention composition.

[0026] As used herein, "non-aqueous" means that the composition contains only a small amount of water, up to about 1% by weight.Preferably, the non-aqueous composition contains less than 0.5% by weight, more preferably less than 0.2% by weight, even more preferably less than 0.1% by weight, even more preferably less than 0.05% by weight, even more preferably less than 0.02% by weight, even more preferably less than 0.01% by weight, even more preferably less than 0.001% by weight of water.Most preferably, essentially no water is present in the composition.Here, "essentially" means that the water present in the composition does not significantly affect the performance of the additive in the non-aqueous solution in terms of pattern collapse of the substrate being treated.

[0027] The organic solvent should have a boiling point low enough to be removed by heating without adversely affecting the substrate being treated with the composition. For typical substrates, the boiling point of the organic solvent should be 150° C. or less, preferably 100° C. or less.

[0028] In a preferred embodiment, the solvent consists essentially of one or more organic protic solvents, and preferably consists of a single polar protic organic solvent.

[0029] In another preferred embodiment, the solvent consists essentially of one or more organic protic solvents and one or more non-polar C 5 ~C 12 The solvent comprises an alkane solvent, preferably one or more alkane solvents, and most preferably a single alkane solvent.

[0030] As used herein, a "polar protic organic solvent" is an organic solvent that contains an acidic hydrogen (ie, is capable of donating a hydrogen ion).

[0031] Exemplary polar protic organic solvents include, but are not limited to, (a) C 1 ~C 10 (b) a primary or secondary amine, a carboxylic acid, such as, but not limited to, formic acid or acetic acid, or (c) a primary or secondary amide, such as, but not limited to, formamide.

[0032] Preferred protic organic solvents are linear, branched or cyclic C 1 ~C 10 Aliphatic alkanols, especially linear or branched C 1 ~C 6 Alkanols containing at least one hydroxy group. Preferred alkanols are methanol, ethanol, 1-propanol, 2-propanol (isopropanol) or butanol. The most preferred alkanol is isopropanol.

[0033] Preferred C 5 ~C 12 The alkane solvent is selected from linear, branched, or cyclic hexane, heptane, octane, nonane, and decane. Particularly preferred are C 5 ~C 12 The alkane solvent is selected from linear or branched hexane, heptane, or octane. 5 ~C 12 The alkane solvent is linear or branched heptane, in particular linear heptane.

[0034] Additives of formula I or II In a first embodiment, the non-ionic H-silane additive (also called additive, more specifically also silane or siloxane) according to the present invention may be selected from formula I or II: [ka]

[0035] In this specification, R 1 is H, i.e., the additive according to the present invention is a H-silane or H-siloxane, which shows much better performance compared to other silanes or siloxanes such as tetraethylorthosilicate.

[0036] In formulas I and II, R 2 , H, C 1 ~C 10 Alkyl, C1 ~C 10 Alkoxy, C 6 ~C 12 Aryl and C 6 ~C 10 Preferably, R 2 is C 1 ~C 8 Alkyl, C 1 ~C 8 More preferably, R 2 is C 1 ~C 6 Alkyl and C 1 ~C 6 The most preferred R 2 is C 1 ~C 4 Alkyl and C 1 ~C 4 The most preferred R 2 The groups may be selected from methyl, ethyl, methoxy and ethoxy.

[0037] R 3 , H, C 1 ~C 10 Alkyl, C 1 ~C 10 Alkoxy, C 6 ~C 10 Aryl and C 6 ~C 10 Preferably, R 3 , H, C 1 ~C 8 Alkyl, C 1 ~C 8 More preferably, R 3 , H, C 1 ~C 6 Alkyl and C 1 ~C 6 More preferably, R 3 , H, C 1 ~C 4 Alkyl, C 1 ~C 4 The most preferred R 3The groups may be selected from H, methyl, ethyl, methoxy and ethoxy.

[0038] R 4 is C 1 ~C 10 Alkyl, C 1 ~C 10 Alkoxy, C 6 ~C 10 Aryl and C 6 ~C 10 Preferably, R 4 is C 1 ~C 8 Alkyl, C 1 ~C 8 More preferably, R 4 is C 1 ~C 6 Alkyl and C 1 ~C 6 The most preferred R 4 is C 1 ~C 4 Alkyl and C 1 ~C 4 The most preferred R 4 The groups may be selected from methyl, ethyl, methoxy and ethoxy.

[0039] R 10 , R 12 is C 1 ~C 10 Alkyl and C 1 ~C 10 alkoxy. Preferably, R 10 , R 12 and R 4 is C 1 ~C 8 Alkyl, C 1 ~C 8 More preferably, R 10 and R 12 is C 1 ~C 6 Alkyl and C 1 ~C 6The most preferred R 10 and R 12 is C 1 ~C 4 Alkyl and C 1 ~C 4 The most preferred R 4 The groups may be selected from methyl, ethyl, methoxy and ethoxy.

[0040] In formula I, n is 0 or an integer from 1 to 100, preferably 0 or an integer from 1 to 50, even more preferably 0 or an integer from 1 to 20, and most preferably 0. In formula II, m can be 1, 2 or 3, preferably 1.

[0041] Preferably, R 2 , R 4 , R 10 , and R 12 is independently selected from methyl, methoxy, ethyl, ethoxy, propyl, and propoxy.

[0042] In a particularly preferred embodiment, the additive is selected from trimethoxysilane, triethoxysilane, trimethylsilane, and triethylsilane.

[0043] The concentration should be high enough to adequately prevent pattern collapse, but as low as possible for economic reasons. The concentration of the additive of formula I or II in the non-aqueous solution may generally range from about 0.00005 to about 15% by weight. Preferably, the concentration of the additive is about 0.001 to about 12% by weight, more preferably about 0.005 to about 12% by weight, even more preferably about 0.05 to about 10% by weight, and most preferably 0.1 to 5% by weight, the weight percentage being based on the total weight of the composition.

[0044] Although there may be one or more additives in the composition, it is preferred to use only one additive of formula I or II.

[0045] Activation of ammonia In order to activate the H-silane additive, it is necessary to add ammonia. Such activation is generally possible by adding about 0.05 to about 8 mass % of ammonia to the solution. If the amount is less than 0.05 mass %, activation is insufficient, and if more than about 8 mass % is used, it is difficult to achieve due to the limited solubility of ammonia in protic organic solvents. Preferably, 0.2 to 6 mass %, more preferably 0.3 to 4 mass %, and most preferably 0.5 to 2 mass % is used for activation.

[0046] Other additives Further additives may be present in the cleaning solution according to the invention. Such additives include: (I) Buffer components for adjusting pH, such as, but not limited to, (NH 4 ) 2 CO 3 / NH 4 OH, Na 2 CO 3 / NaHCO 3 , Tris-hydroxymethyl-aminomethane / HCl, Na 2 HPO 4 / NaH 2 PO 4 , or organic acids such as acetic acid, methanesulfonic acid, (II) one or more further additives that improve the surface tension and solubility of the mixture, either nonionic or anionic additives; or (III) A dispersant that prevents removed dirt or polymer particles from reattaching to the surface. It could be.

[0047] Rinse Solution Preferably, the non-aqueous composition comprises an organic protic solvent, optionally C 5 ~C 12 The process consists essentially of an alkane, at least one additive of formula I or II, ammonia, and reaction products thereof.

[0048] Preferably, the ammonia is added in situ immediately prior to its use. Thus, the composition comprises (a) ammonia dissolved in an organic protic solvent and, optionally, C5 ~C 12 It is advantageous to supply it as a two-component kit comprising an alkane and (b) at least one additive of formula I or II as described herein.

[0049] application The compositions described herein can be used to treat a substrate having a patterned material layer having line spacing dimensions of 50 nm or less, an aspect ratio of 4 or greater, or a combination thereof.

[0050] The compositions described herein may be used in a method found for manufacturing integrated circuit devices, optical devices, micromachines and precision mechanical devices, the method comprising the steps of: (1) providing a substrate having a patterned layer of material with line-to-line dimensions of 50 nm or less and an aspect ratio of 4 or greater; (2) contacting the substrate at least once with a non-aqueous solution containing at least one siloxane additive described herein; (3) removing the aqueous solution from contact with the substrate; and Includes.

[0051] Preferably, the substrate is (i) providing an immersion photoresist layer, an EUV photoresist layer, or an eBeam photoresist layer on a substrate; (ii) exposing the photoresist layer to actinic radiation through a mask with or without an immersion fluid; (iii) developing the exposed photoresist layer with a developer to obtain a pattern having a line-to-line dimension of 32 nm or less and an aspect ratio of 10 or more; (iv) applying a non-aqueous composition described herein to the developed patterned photoresist layer; (v) spin-drying the semiconductor substrate after application of the non-aqueous composition; The method is provided by a photolithography method including:

[0052] Any conventional and known immersion photoresist, EUV photoresist or eBeam photoresist can be used. The immersion photoresist may already contain at least one siloxane additive, or a combination thereof. In addition, the immersion photoresist may contain other non-ionic additives. Suitable non-ionic additives are described, for example, in US 2008 / 0299487 A1, page 6, paragraph

[0078] . Most preferably, the immersion photoresist is a positive resist.

[0053] Besides e-Beam exposure or extreme ultraviolet radiation at about 13.5 nm, preferably ultraviolet radiation at a wavelength of 193 nm is used as the actinic radiation.

[0054] In the case of immersion lithography, preferably ultrapure water is used as the immersion liquid.

[0055] Any conventional and known developer may be used to develop the exposed photoresist layer. Preferably, an aqueous developer containing tetramethylammonium hydroxide (TMAH) is used.

[0056] Preferably, the chemical rinse solution is applied as a puddle to the exposed and developed photoresist layer.

[0057] In the third step of the method, the non-aqueous solution is removed from contact with the substrate. Any known method commonly used to remove non-aqueous solutions from substrates may be employed.

[0058] It is essential for the photolithography process according to the method of the present invention that the chemical rinse solution contains at least one siloxane additive.

[0059] Conventional and well-known equipment commonly used in the semiconductor industry can be used to carry out photolithographic processes in accordance with the methods of the present invention. EXAMPLES

[0060] [Example 1] Patterned silicon wafers with circular nanopillar patterns were used to determine the pattern collapse performance of the formulations during drying. The (aspect ratio) AR20 pillars used in the test have a height of 600 nm and a diameter of 30 nm. The pitch size is 90 nm. 1×1 cm wafer pieces were processed in the following order without any drying in between: - Immerse in dilute hydrofluoric acid (DHF) 0.9% for 50 seconds, - Immerse in ultrapure water (UPW) for 60 seconds, Immerse in isopropanol (IPA) for 60 seconds, Immersion for 60 seconds in a solution of each ammonia-activating additive in either a protic organic solvent or a mixture of a protic organic solvent and a non-polar organic solvent at room temperature; Immerse in IPA for 60 seconds. N 2 by blow drying.

[0061] The additives were activated in-situ by adding each additive to a solution containing 1 wt.% ammonia in a solvent, the water content of which was less than 0.01 wt.%.

[0062] In the examples, the compositions of Table 1.1 were used.

[0063] [Table 1]

[0064] The dried silicon wafers were analyzed by top-down SEM and the collapse statistics are shown in Table 1.2 for Examples 1.1-1.9.

[0065] The cluster size corresponds to the number of uncollapsed pillars that make up each cluster. As an example, if an unprocessed wafer contains 4x4 pillars, 8 remain uncollapsed, 4 collapse into 2 clusters containing 2 pillars, and 4 pillars collapse into 1 cluster containing 4 pillars, the ratio will be 8 / 11 single clusters, 2 / 11 double clusters, and 1 / 11 clusters with 4 pillars.

[0066] [Table 2]

[0067] Table 1.2 shows that additives 1.1-1.9 have a beneficial effect on the degree of pattern collapse compared to solutions without additives. Addition of an alkane further increases the proportion of uncollapsed structures.

[0068] [Example 2] Patterned silicon wafers with circular nanopillar patterns were used to determine the pattern collapse performance of the formulations during drying. The (aspect ratio) AR20 pillars used in the test have a height of 600 nm and a diameter of 30 nm. The pitch size is 90 nm. 1×1 cm wafer pieces were processed in the following sequence without any drying in between: SC1 (NH with mass ratio of 1 / 8 / 60 4 OH(28%) / H 2 O 2 (31%) / ultrapure water (UPA)) for 40 seconds, - Immerse in ultrapure water (UPW) for 60 seconds, Immerse in isopropanol (IPA) for 60 seconds, Immersion for 60 seconds in a solution of each ammonia-activating additive in either a protic organic solvent or a mixture of a protic organic solvent and a non-polar organic solvent at room temperature; Immerse in IPA for 60 seconds. N 2 by blow drying.

[0069] The additives were activated in-situ by adding each additive to a solution containing 1 wt.% ammonia in a solvent, the water content of which was less than 0.01 wt.%.

[0070] In the examples, the compositions in Table 2.1 were used.

[0071] [Table 3]

[0072] The dried silicon wafers were analyzed by top-down SEM, and the amount of uncollapsed structure is shown in Table 2.2 for Examples 2.1-2.9.

[0073] [Table 4]

[0074] The dried silicon wafers were analyzed by top-down SEM.

[0075] Table 2.2 shows that the additives have a beneficial effect on the degree of pattern collapse compared to a solution without any additive.

[0076] [Example 3] Patterned silicon wafers with circular nanopillar patterns were used to determine the pattern collapse performance of the formulations during drying. The (aspect ratio) AR20 pillars used in the test have a height of 600 nm and a diameter of 30 nm. The pitch size is 90 nm. 1×1 cm wafer pieces were processed in the following order without any drying in between: - Immerse in dilute hydrofluoric acid (DHF) 0.9% for 50 seconds, - Immerse in ultrapure water (UPW) for 60 seconds, Immerse in isopropanol (IPA) for 60 seconds, Immersion for 60 seconds in a solution of each ammonia-activating additive in either a protic organic solvent or a mixture of a protic organic solvent and a non-polar organic solvent at room temperature; Immerse in IPA for 60 seconds. N 2 by blow drying.

[0077] The additives were activated in-situ by adding each additive to a solution containing 1 wt.% ammonia in a solvent, the water content of which was less than 0.01 wt.%.

[0078] The dried silicon wafers were analyzed by top-down SEM and the collapse statistics are shown in Table 1 for Examples 3.1-3.4.

[0079] In the examples, the compositions in Table 3.1 were used.

[0080] [Table 5]

[0081] Additives 1, 2 and 3 have the following structures: [ka]

[0082] The dried silicon wafers were analyzed by top-down SEM.

[0083] The pattern collapse cluster size distribution was determined from SEM images.

[0084] [Table 6]

[0085] [Table 7]

[0086] Table 3.2 shows that the additives have a beneficial effect on the degree of pattern collapse compared to solutions without the additive.

[0087] [Comparative Example 4] Patterned silicon wafers with circular nanopillar patterns were used to determine the pattern collapse performance of the formulations during drying. The (aspect ratio) AR20 pillars used in the test have a height of 600 nm and a diameter of 30 nm. The pitch size is 90 nm. 1×1 cm wafer pieces were processed in the following sequence without any drying in between: - Immerse in dilute hydrofluoric acid (DHF) 0.9% for 50 seconds, - Immerse in ultrapure water (UPW) for 60 seconds, Immerse in isopropanol (IPA) for 60 seconds, Immersion for 60 seconds in a solution of each ammonia-activating additive in either a protic organic solvent or a mixture of a protic organic solvent and a non-polar organic solvent at room temperature; Immerse in IPA for 60 seconds. N 2 by blow drying.

[0088] The additives were activated in-situ by adding each additive to a solution containing 1 wt.% ammonia in a solvent, the water content of which was less than 0.01 wt.%.

[0089] In the examples, the compositions in Table 4.1 were used.

[0090] [Table 8]

[0091] The dried silicon wafers were analyzed by top-down SEM.

[0092] Pattern collapse cluster size distribution was determined from SEM images. The collapse cluster size corresponds to the number of uncollapsed pillars that make up each cluster. As an example, if the unprocessed wafer contains 4x4 pillars, 8 remain uncollapsed, 4 collapse into 2 clusters containing 2 pillars, and 4 pillars collapse into 1 cluster containing 4 pillars, the ratio is 8 / 11 single clusters, 2 / 11 double clusters, and 1 / 11 clusters with 4 pillars.

[0093] The collapse statistics for Examples 4.1-4.3 are shown in Table 4.2.

[0094] [Table 9]

[0095] Table 4.2 shows that non-H-siloxanes such as TEOS have no or less beneficial effect on the degree of pattern collapse compared to solutions without H-siloxanes.

[0096] It is important to note that due to the different pretreatment and history of each wafer used, results can only be compared within one experiment, but not across different experiments.

Claims

1. 1. A non-aqueous composition comprising: (a) an organic protic solvent; (b) ammonia; (c) at least one additive, a silane-based additive or a siloxane-based additive, the silane-based additive and the siloxane-based additive being represented by Formulas I and II: 【Chemistry 1】 During the ceremony, R １ is H, R ２ is H, C １ ~C １０ Alkyl, C １ ~C １０ Alkoxy, C ６ ~C １０ Aryl, and C ６ ~C １０ selected from aloxi R ３ is R ２ is selected from R ４ is C １ ~C １０ Alkyl, C １ ~C １０ Alkoxy, C ６ ~C １０ Aryl, and C ６ ~C １０ selected from aloxi R １０ , R １２ is C １ ~C １０ Alkyl and C １ ~C １０ independently selected from alkoxy, m is 1, 2 or 3; n is 0 or an integer from 1 to 100; At least one additive selected from the group consisting of A non-aqueous composition comprising:

2. 2. The composition of claim 1, wherein the additive is selected from trimethoxysilane, triethoxysilane, trimethylsilane, and triethylsilane.

3. 3. The composition of claim 2, wherein the water content in the non-aqueous composition is less than 0.1% by weight and the additive is triethoxysilane.

4. The organic protic solvent is a linear or branched C １ ~C １０ The composition according to any one of claims 1 to 3, which is an alkanol.

5. 5. The composition of claim 4, wherein the concentration of the ammonia is from 0.1 to about 8% by weight.

6. Linear, branched, or cyclic C ５ ~C １２ The composition of any one of claims 1 to 5, further comprising a second solvent selected from an alkane.

7. The non-aqueous composition comprises an organic protic solvent, optionally ５ ~C １２ The composition of any one of claims 1 to 6, consisting essentially of an alkane, at least one additive of formula I or II, ammonia, and reaction products thereof.

8. The composition according to any one of claims 1 to 7, wherein the at least one additive of formula I or II is present in a concentration of from 0.005 to 12% by weight.

9. 2. The composition of claim 1, wherein the at least one additive is a compound of formula I, where n is 0, 1, or 2.

10. R ２ , R ４ , R １０ , and R １２ The composition of claim 1 , wherein is independently selected from methyl, methoxy, ethyl, ethoxy, propyl, and propoxy.

11. 11. Use of the composition of any one of claims 1 to 10 for treating a substrate having a patterned layer of patterned material having a line-to-line dimension of 50 nm or less, an aspect ratio of 4 or greater, or a combination thereof.

12. 1. A method for manufacturing integrated circuit devices, optical devices, micromachines and mechanical precision devices comprising the steps of: (1) providing a substrate having a patterned layer of patterning material having a line-to-line dimension of 50 nm or less, an aspect ratio of 4 or greater, or a combination thereof; (2) contacting the substrate with the composition according to any one of claims 1 to 10 at least once; (3) removing the non-aqueous composition from contact with the substrate; and A method comprising:

13. 13. The method of claim 12, wherein the patterned material layer has a line-to-line dimension of 32 nm or less and an aspect ratio of 10 or greater.

14. 14. The method of claim 12 or 13, wherein the patterned material layer is selected from the group consisting of a patterned developed photoresist layer, a patterned barrier material layer, a patterned multistack material layer, and a patterned dielectric material layer.

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