SFP+ Package Compatible Fiber Optic Amplifier

Abstract

To provide an SFP+ package compatible fiber optic amplifier.SOLUTION: An SFP+ package compatible fiber optic amplifier includes a housing, and a circuit device and an optical path device disposed inside the housing. The housing includes a base 11 and a cover plate 12, and the entire optical path device is located on the opposite side of the cover plate with respect to the circuit device. A gold finger type power connector exposed to the outside of the housing is disposed on the circuit device. The optical path device includes a two-in-one device 31 including a first isolator and a wavelength division multiplexer, a three-in-one device 32 including a second isolator, an optical splitter, and a photodiode, an erbium doped optical fiber 33, and an adapter 34. The erbium doped optical fiber includes an annular structure, and both the two-in-one device and the three-in-one device are located inside the annular structure, and the adapter is located outside the annular structure.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to the technical field of optical fiber amplifiers, and in particular to an optical fiber amplifier compatible with an SFP+ package. [Background technology]

[0002] With the rapid development of modern communications, the requirements for compatibility and integration of transmission systems are becoming higher and higher. However, compatibility brings about larger losses, and the requirements for system integration are also becoming higher. Therefore, the requirements for the external volume of Erbium-doped fiber amplifiers (EDFAs) are increasing, and it is preferable that they can be easily inserted and removed from existing systems. Summary of the Invention

[0003] To solve the problem of not being able to realize hot swap in the related art and at the same time reduce the volume, the present invention provides an optical fiber amplifier compatible with SFP+ package.

[0004] As one aspect of the present invention, there is provided an optical fiber amplifier compatible with an SFP+ package, comprising a housing and a circuit device and an optical path device disposed inside the housing. The housing includes a structure compatible with an SFP+ package. An accommodation space is provided inside the housing, and the circuit device and the optical path device are both located inside the accommodation space. The optical path device is located below the circuit device. A gold finger type power connector is disposed on the circuit device so as to be exposed to the outside of the housing.

[0005] Furthermore, the housing includes a base and a cover plate that covers the base, and the accommodating space is formed in the base.

[0006] Further, a module unlocking mechanism is disposed on the housing, which is used to lock or unlock the housing and a mounting cage of a SFP+ package compatible optical fiber amplifier.

[0007] Furthermore, the module unlocking mechanism includes a pull ring, a slide block, and an elastic member. The pull ring is disposed at one end of the base, the slide block is disposed at the cover plate, and the elastic member is disposed at the slide block. The pull ring and the slide block are connected to each other, and when the pull ring is pulled, the slide block is pushed to move, and the elastic member is compressed, thereby realizing the unlocking of the housing and the mounting cage of the SFP+ package compatible optical fiber amplifier. When the pull ring is released, the elastic force of the elastic member causes the slide block to return to its initial state, thereby realizing the locking of the housing and the mounting cage of the SFP+ package compatible optical fiber amplifier.

[0008] Further, the elastic member includes springs symmetrically arranged on both sides of the slide block.

[0009] Furthermore, the optical path device includes a two-in-one device, a three-in-one device, an erbium-doped optical fiber, and an adapter. The erbium-doped optical fiber includes an annular structure. The two-in-one device and the three-in-one device are both located inside the annular structure. The two-in-one device is connected to a pump light source, and an input end of the two-in-one device is used to input an optical signal. An output end of the two-in-one device and an input end of the three-in-one device are connected via the erbium-doped optical fiber. An output end of the three-in-one device is used to output an optical signal. The adapter is located outside the annular structure. The two-in-one device and the three-in-one device are both connected to the adapter.

[0010] Furthermore, the two-in-one device includes a first isolator and a wavelength division multiplexer, and the three-in-one device includes a second isolator, an optical splitter, and a photodiode.

[0011] Furthermore, the pump light source includes a 3-pin uncooled series pump laser.

[0012] Furthermore, the circuit device includes a printed circuit board, a pump light source, a photoelectric detector, an analog circuit, and a digital circuit disposed on the printed circuit board.

[0013] Furthermore, the analog and digital circuits are both disposed on both sides of the printed circuit board in a surface mount format.

[0014] The SFP+ package compatible optical fiber amplifier provided by the present invention has a very compact internal space, the product shape is compatible with the standard SFP+ package, the electrical interface pins also meet the requirements of the traditional SFP+ package, and it can be dynamically inserted and removed, plugged and played, making it very easy to use. [Brief description of the drawings]

[0015] The drawings are provided to facilitate a better understanding of the present invention and, as part of the specification, are intended to illustrate, but not limit, the present invention in conjunction with the following specific embodiments. [Figure 1] FIG. 1 is a schematic diagram of the outer structure of an optical fiber amplifier compatible with an SFP+ package provided by the present invention. [Diagram 2] FIG. 2 is a schematic diagram of the structure of FIG. 1 with the cover plate removed. [Diagram 3] FIG. 3 is an exploded schematic diagram of an SFP+ package compatible optical fiber amplifier provided by the present invention. [Figure 4] FIG. 4 is a block diagram of the structure of the optical path device provided by the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] It should be noted that the embodiments and features of the embodiments of the present invention can be combined with each other to the extent that they are not inconsistent.The present invention will now be described in detail in conjunction with the embodiments with reference to the drawings.

[0017] In order to make it easier for those skilled in the art to understand the solution of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. It is clear that the described embodiments are only a part of the embodiments of the present invention, and are not all of the embodiments. Based on the embodiments of the present invention, any other embodiments obtained by those skilled in the art without creative efforts should fall within the protection scope of the present invention.

[0018] It should be noted that terms such as "first" and "second" in the present specification, claims and the above drawings are used to distinguish between similar items, and are not used to describe a particular order or sequence. It should be understood that the numerical values ​​used in this manner can be substituted for each other in appropriate circumstances so as to be able to describe the embodiments of the present invention. In addition, "comprises" and "having" and any variations thereof are intended to cover non-exclusive "comprises". For example, it may include a process, method, system, product, or apparatus of a series of steps or units, and is not limited to the steps or units expressly recited, and may include other steps or units not expressly recited or inherent to these processes, methods, products, or apparatus.

[0019] In this embodiment, an optical fiber amplifier compatible with the SFP+ package is provided. As shown in Figs. 1 to 3, the optical fiber amplifier includes a housing 10 and a circuit device 20 and an optical path device 30 disposed inside the housing 10. The housing 10 includes a structure compatible with the SFP+ package. An accommodation space is provided inside the housing 10, and both the circuit device 20 and the optical path device 30 are located inside the accommodation space. The optical path device 30 is located below the circuit device 20. A gold finger type power connector 21 is disposed on the circuit device 20 so as to be exposed to the outside of the housing 10.

[0020] The SFP+ package compatible optical fiber amplifier provided by the embodiment of the present invention has a very compact internal space, the product outline is compatible with the standard SFP+ package, the electrical interface pins also meet the requirements of the traditional SFP+ package, and it can be dynamically inserted and removed, plugged and played, and is very easy to use.

[0021] It should be noted that the Small Form-factor Pluggables (SFP+) in the embodiments of the present invention may be simply understood as an upgraded version of a Gigabit Interface Converter (GBIC).

[0022] Specifically, the housing 10 includes a base 11 and a cover plate 12 that covers the base 11, and the housing space is formed in the base 11.

[0023] Also, as shown in FIG. 3, it should be noted that the SFP+ package compatible optical fiber amplifier provided by the embodiment of the present invention further includes an EMC lead 40 used to fix the base and cover plate 12 after closing.

[0024] The housing 10 adopts a format compatible with the SFP+ package, and the housing 10 includes a base 11 and a cover plate 12 for covering the base 11, and the accommodating space is formed in the base 11. The circuit device 20 includes a printed circuit board. Passive elements are arranged on the base 11, and a pump light source and a photoelectric detector are arranged on the printed circuit board. The optical path device 30 is located below the printed circuit board. One side of the printed circuit board is provided with a gold finger type electrical interface. The SFP+ package compatible optical fiber amplifier provided by the present invention has a compact structure and is compatible with the size and pin description of a conventional SFP+ optical transceiver module.

[0025] Specifically, in order to make it easier to install an SFP+ package compatible optical fiber amplifier, a module unlocking mechanism is disposed on the housing 10. The module unlocking mechanism is used to lock or unlock the housing and the mounting cage of the SFP+ package compatible optical fiber amplifier.

[0026] In some embodiments, the module unlocking mechanism includes a pull ring 13, a slide block 14, and an elastic member 15. The pull ring 13 is disposed at one end of the base 11, the slide block 14 is disposed at the cover plate 12, and the elastic member 15 is disposed at the slide block 14. The pull ring 13 and the slide block 14 are coupled together, and when the pull ring 13 is pulled, the slide block 14 is pushed to move, and the elastic member 15 is compressed, thereby realizing the unlocking of the housing and the mounting cage of the SFP+ package compatible optical fiber amplifier. When the pull ring 13 is released, the elastic force of the elastic member 15 causes the slide block 14 to return to its initial state, thereby realizing the locking of the housing and the mounting cage of the SFP+ package compatible optical fiber amplifier.

[0027] Preferably, the elastic member 15 includes springs symmetrically disposed on each side of the slide block 14 .

[0028] As shown in Figure 3, when the lock is released, the pull ring 13 is pulled, and the slide block 14 is pushed forward by the pull ring 13. The inclined surface of the head of the slide block 14 presses the locking metal dome of the mounting cage away from the locking triangular block 16 on the cover plate 12, releasing the lock. When the pull ring 13 is released, the elasticity of the two springs of the slide block 14 is used to return the slide block 14 to its initial state so that it can be locked when the SFP+ package compatible optical fiber amplifier is inserted into the mounting cage.

[0029] Specifically, as shown in FIG. 3 and FIG. 4, the optical path device 30 includes a two-in-one device 31, a three-in-one device 32, an erbium-doped optical fiber 33, and an adapter 34. The erbium-doped optical fiber 33 includes an annular structure. The two-in-one device 31 and the three-in-one device 33 are both located inside the annular structure. The two-in-one device 31 is connected to the pump light source 22, and the input end of the two-in-one device 31 is used to input an optical signal. The output end of the two-in-one device 31 and the input end of the three-in-one device 32 are connected via the erbium-doped optical fiber 33. The output end of the three-in-one device 32 is used to output an optical signal. The adapter 34 is located outside the annular structure. The two-in-one device 31 and the three-in-one device 32 are both connected to the adapter 34.

[0030] More specifically, the two-in-one device 31 includes a first isolator and a wavelength division multiplexer, and the three-in-one device 32 includes a second isolator, an optical splitter, and a photodiode.

[0031] The two-in-one device 31 is connected to the pump light source 22, and the two-in-one device 31 and the three-in-one device 32 are connected via an erbium-doped optical fiber 33. The two-in-one device 31 is connected to an input optical signal, and the three-in-one device 32 is connected to an output optical signal. The SFP+ package compatible optical fiber amplifier provided in this embodiment can monitor the output power in real time and can well maintain a stable output of the amplifier.

[0032] Preferably, the pump light source 22 includes a three-pin uncooled series pump laser.

[0033] The adapter 34 is placed in the annular recess of the base 11 as required by the protocol, and when the cover is closed, the upper cover firmly holds the adapter to ensure perfect positioning. The pump light source 22 is placed inside the base at approximately the middle position, so that it is in close contact with the boss at the corresponding position of the base to ensure good heat dissipation. The optical path device and heat shrink fusion points are placed on both sides of the pump light source, so that there is enough space between the device and the two side walls inside the base to allow the erbium-doped optical fiber to be placed. The circuit device is placed inside the base directly above the entire optical path device as required by the protocol.

[0034] The external shape and circuit device of the SFP+ package compatible optical fiber amplifier provided by the embodiment of the present invention fully meets the relevant requirements of SFF-8432 V5.2, and can realize hot swap of the amplifier by using the corresponding SFP+ mounting cage and electrical interface.

[0035] Specifically, the circuit device includes a printed circuit board, a pump light source, a photoelectric detector, an analog circuit, and a digital circuit disposed on the printed circuit board.

[0036] Preferably, the analog and digital circuits are both disposed on opposite sides of the printed circuit board in surface mount form.

[0037] Regarding the design of the printed circuit board (PCB), the devices are arranged in a front-back surface mount format to minimize the size of the PCB. Regarding the layout, the analog circuits and digital circuits are arranged relatively concentrated according to their respective functions to avoid the digital parts interfering with the analog circuits, especially to avoid the influence on the detection of the output signal light.

[0038] In some embodiments, the outer dimensions of the housing 10 are 72 mm x 13.55 mm x 8.55 mm. The optical fibers located inside the housing are also relatively thin, mainly having a diameter of 165 μm. The diameter of the erbium doped optical fiber is also 165 μm. This saves space and allows for EDFAs (Erbium doped optical fiber amplifiers) that are compatible with SFP+ packages.

[0039] Since 250 μm optical fibers are widely used in communication and information exchange systems outside the product, if the input and output ends of the product directly use 165 μm optical fibers, excessive loss will occur due to the difference in mode field diameter. To solve this problem, in the embodiment of the present invention, a hybrid optical fiber type synthesis device is used (the input of the two-in-one device and the output of the three-in-one device are 250 μm optical fibers, the output and pump end of the two-in-one device are 165 μm optical fibers, and the input of the three-in-one device is 165 μm optical fibers). In this way, the synthesis device shifts the optical fiber from 250 μm to 165 μm, and after connecting to the 165 μm erbium-doped optical fiber, the three-in-one device of the hybrid optical fiber again becomes a 250 μm optical fiber. Since the pump end of the two-in-one device uses a 165 μm optical fiber, and the diameter of the pump optical fiber in the SFP+ package compatible optical fiber amplifier provided in the embodiment of the present invention is also 165 μm, the pump can be smoothly fusion spliced. The SFP+ package compatible optical fiber amplifier in the embodiment of the present invention does not have a fusion splice point between a 250 μm optical fiber and a 165 μm optical fiber, so that excessive loss due to different mode field diameters of the optical fibers is avoided.

[0040] In order to realize the miniaturization of the amplifier, the present invention further uses a dual-core heat shrink sleeve, in which two optical fiber fusion splice points are arranged in one heat shrink sleeve, which can save the space to the maximum extent.

[0041] The output power of the amplifier described in the present invention is not large, it can support a maximum output of 16dbm, and the module external dimensions are only 72mm x 13.55mm x 8.55mm, so only a small uncooled pump can be selected. The pump laser adopts a 3-pin uncooled series pump, which generates little heat when the product is in normal operation, so there is no problem in heat dissipation and the requirements for product reliability are met.

[0042] The internal structure of the SFP+ package compatible optical fiber amplifier provided by the embodiment of the present invention uses a multi-layer design, and the optical path device is arranged under the printed circuit board and above the base. The optical path device is a glass package and does not have a metal sleeve package structure, so when it comes into contact with the PCB, it will not cause a short circuit of the device on the PCB substrate. In addition, the SFP+ package compatible optical fiber amplifier provided by the present invention has a compact structure and is fully compatible with the size and pin description of the conventional SFP+ optical transceiver module. Due to its small volume, convenient installation and insertion / removal, and extremely low power consumption, the present invention is very suitable for densely integrated transmission or reception PCBs. It can meet the requirements of the optical fiber communication system backbone network, access network, and cable television network.

[0043] The above embodiments are merely illustrative examples used to explain the principles of the present invention, and the present invention is not limited thereto. Various modifications and improvements that can be obtained by those skilled in the art without departing from the spirit of the present invention should also fall within the scope of protection of the present invention.

Claims

1. The optical fiber includes a housing and a circuit device and an optical path device disposed inside the housing, the housing, the circuit device, and the optical path device are compatible with an SFP+ package; The optical path device amplifies and outputs an input optical signal; the circuit device provides power for amplifying the optical signal; The housing includes a base and a cover plate that covers the base, A storage space is formed in the base, The circuit device and the optical path device are both located within the accommodating space, the entire optical path device is located on the opposite side of the cover plate with respect to the circuit device; a gold finger type power connector is disposed on the circuit device so as to be exposed to the outside of the housing; the optical path device includes a two-in-one device including a first isolator and a wavelength division multiplexer, a three-in-one device including a second isolator, an optical splitter, and a photodiode, an erbium-doped optical fiber, and an adapter to which an optical fiber from an outside is connected; the erbium-doped optical fiber includes an annular structure; the two-in-one device and the three-in-one device are both located within the annular structure; the two-in-one device is connected to a pump light source included in the circuit device; an input end of the two-in-one device is used to input the optical signal; an output end of the two-in-one device and an input end of the three-in-one device are connected via the erbium-doped optical fiber; an output end of the three-in-one device is used for outputting the optical signal; the adaptor is located outside the annular structure; The two-in-one device and the three-in-one device are both connected to the adapter.

2. The SFP+ package compatible optical fiber amplifier according to claim 1, further comprising a module unlocking mechanism disposed on the housing for locking the housing to a mounting cage of the SFP+ package compatible optical fiber amplifier or unlocking the housing from the locked state.

3. 3. The SFP+ package compatible optical fiber amplifier of claim 1, wherein the pump light source includes a 3-pin uncooled series pump laser.

4. The SFP+ package compatible optical fiber amplifier of any one of claims 1 to 3, characterized in that the circuit device includes a printed circuit board, and the pump light source, a photoelectric detector, an analog circuit, and a digital circuit arranged on the printed circuit board.

5. 5. The SFP+ package compatible optical fiber amplifier according to claim 4, wherein the analog circuitry and the digital circuitry are both disposed on both sides of the printed circuit board in a surface mount format.

6. 6. The SFP+ package compatible optical fiber amplifier according to claim 1, wherein the adaptor is held in position by the cover plate.

7. The adapter is disposed on one end side of the housing in a longitudinal direction, The gold finger type power connector is disposed on the other end side of the housing in the longitudinal direction, The SFP+ package compatible optical fiber amplifier according to any one of claims 1 to 6, wherein the two-in-one device and the three-in-one device are arranged along the longitudinal direction of the housing.

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