Component mounting device, transfer device, and method for setting transfer height in component mounting device

Abstract

To provide a component mounting device, a transfer device, and a method for setting a transfer height, capable of favorably setting a height of a transfer head when a paste is transferred on a member to be mounted.SOLUTION: In a component mounting device, a transfer head 41 includes: a transfer pin 47; a measurement part 12 measuring a load due to contact of the transfer pin; an encoder 43B detecting a descending amount of a nozzle shaft 43; and a control part 13. The control part executes: height adjustment processing for adjusting a height of the nozzle shaft; storage processing for storing, as a reference height Hs, the height of the nozzle shaft when a load measured by the measurement part is close to a target value during the height adjustment processing; and transfer height setting processing for setting a transfer height based on the reference height. The height adjustment processing repeats multiple sets of operations, the operation including, as one set, a descending operation of descending the nozzle shaft one or more times by unit length until the load measured by the measurement part exceeds the target value and an ascending operation of ascending the nozzle shaft to an end height. The unit length is set such that later sets are set smaller.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus, a transfer apparatus, and a method for setting a transfer height in the component mounting apparatus. [Background technology]

[0002] A conventional component mounting device is an electronic component mounting device described in JP 2010-98210 A (Patent Document 1 below). This electronic component mounting device includes a transfer tool that transfers a paste adhesive for adhering an electronic component to a substrate to the substrate. The transfer tool is attached to a transfer head that is movable in the vertical and horizontal directions. The paste adhesive is stored in a paste storage section. The transfer head is lowered over the paste storage section to attach the paste adhesive to the lower end of the transfer tool. The transfer tool with the paste adhesive attached thereto is brought into contact with the substrate to transfer the paste adhesive to the substrate.

[0003] Incidentally, some component mounting devices have a configuration for mitigating the impact on a board when mounting components on the board, as described in JP 2014-168004 A (Patent Document 2 below). The component mounting head of the component mounting device in Patent Document 2 below includes a nozzle shaft that can be raised and lowered by a lifting mechanism, and a suction nozzle attached to the tip side of the nozzle shaft. The suction nozzle includes a nozzle body that picks up components at its lower end, a cylindrical holder part that holds the nozzle body inside, and a spring member that urges the nozzle body downward relative to the holder part. When mounting a component on a board with the suction nozzle, the spring member contracts, allowing the nozzle body to move upward relative to the nozzle shaft, so that the impact that the component receives from the board can be mitigated. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-98210 A [Patent Document 2] JP 2014-168004 A Summary of the Invention [Problem to be solved by the invention]

[0005] It is conceivable that the shock caused when the transfer tool contacts the substrate during transfer of the paste adhesive can be mitigated by applying the configuration of the suction nozzle with spring member described in Patent Document 2 to the configuration of the transfer tool described in Patent Document 1. However, in such a configuration, it is difficult to set the optimal height when the transfer tool transfers the paste adhesive due to the assembly tolerance involved in mounting the transfer tool on the transfer head and the individual differences in the spring members. For this reason, the amount of paste adhesive transferred to the substrate may vary between different transfer tools. [Means for solving the problem]

[0006] A component mounting device disclosed herein is a component mounting device having transfer pins that transfer paste to a mounted member on which a component is to be mounted, and the component mounting device comprises a first head unit, a transfer head held below the first head unit, a measurement unit capable of measuring a downward load due to contact of the transfer pin, a detection unit, and a control unit, the transfer head comprises a nozzle shaft that can be raised and lowered relative to the first head unit, the transfer pin arranged below the nozzle shaft, and a spring member that urges the transfer pin downward, the transfer pin being movable upward relative to the nozzle shaft as the spring member contracts, the detection unit being capable of detecting an amount of descent of the nozzle shaft relative to the first head unit, and the control unit is configured to perform an initial movement process of moving the nozzle shaft to an initial position where a lower end of the transfer pin is arranged above an upper end of the measurement unit, a height adjustment process of adjusting the height of the nozzle shaft so that a load measured by the measurement unit approaches a preset target value, and a position of the nozzle shaft when the load measured by the measurement unit during the height adjustment process becomes close to the target value. and a transfer height setting process that sets, based on the reference height, a transfer height, which is the height of the nozzle shaft when the transfer pin transfers paste to the mounted component. The height adjustment process is a process that repeats a predetermined number of sets of lowering and ascent operations, each of which includes a lowering operation in which the nozzle shaft is lowered by the lowering operation one or more times by a unit length until the load measured by the measuring unit exceeds the target value, and an ascent operation in which the nozzle shaft lowered by the lowering operation is raised to an end height at which the lower end of the transfer pin is located above the upper end of the measuring unit. When N is an integer greater than or equal to 2 and less than or equal to the predetermined number of sets, the unit length of the Nth set is smaller than the unit length of the N-1th set, and the reference height is set based on the height of the nozzle shaft when the lowering operation in the final set of lowering and ascent operations is completed, and when the height of the nozzle shaft becomes the transfer height, the load applied from the transfer pin to the mounted component is close to the target value.

[0007] Further, a method of setting a transfer height in a component mounting apparatus of the present disclosure is a method of setting a transfer height in a component mounting apparatus equipped with transfer pins that transfer paste to a mounted member on which components are to be mounted, the component mounting apparatus comprising a first head unit, a transfer head held under the first head unit, a measurement unit capable of measuring a downward load caused by contact of the transfer pin, and a detection unit, the transfer head comprising a nozzle shaft that can be raised and lowered relative to the first head unit, the transfer pin disposed below the nozzle shaft, and a detection unit that detects the downward load of the transfer pin. a spring member that biases the transfer pin upward relative to the nozzle shaft by contracting the spring member, and the detection unit is capable of detecting a lowering amount of the nozzle shaft relative to the first head unit, and the transfer height is a height of the nozzle shaft when the transfer pin transfers paste to the mounted member, and a method of setting the transfer height in the component mounting apparatus includes an initial movement step of moving the nozzle shaft to an initial position where a lower end of the transfer pin is disposed above an upper end of the measurement unit, and a transfer height measurement step of measuring the transfer height by the measurement unit. the height of the nozzle shaft when the load measured by the measuring unit during the height adjustment step becomes close to the target value approaches a preset target value; a storage step of storing the height of the nozzle shaft when the load measured by the measuring unit during the height adjustment step becomes close to the target value as a reference height; and a transfer height setting step of setting the transfer height based on the reference height, wherein the height adjustment step is a step of repeating a preset number of sets of a lowering and ascent operation, the lowering operation including: lowering the nozzle shaft one or more times by a unit length until the load measured by the measuring unit exceeds the target value; and ascent operation of raising the nozzle shaft lowered by the lowering operation to an end height at which the lower end of the transfer pin is disposed above the upper end of the measuring unit, the unit length of the Nth set being smaller than the unit length of the N-1th set, and the reference height being set based on the height of the nozzle shaft when the lowering operation in the final set of the lowering and ascent operations is completed;The method for setting a transfer height in a component mounting apparatus, wherein the load applied from the transfer pin to the mounted member is close to the target value. Effect of the Invention

[0008] According to the present disclosure, it is possible to properly set the height of the transfer head when transferring paste to a mounted component in a component mounting device. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing the overall configuration of a component mounting apparatus according to a first embodiment. [Diagram 2] FIG. 2 is a schematic perspective view showing main components of the component mounting apparatus. [Diagram 3] FIG. 3 is a schematic diagram for explaining a series of mounting operations in the component mounting apparatus. [Figure 4] FIG. 4 is a cross-sectional view showing a transfer head disposed above a measurement unit. [Diagram 5] FIG. 5 is a cross-sectional view showing the transfer head in a state where the transfer pin is in contact with the measurement portion and the spring member is compressed. [Figure 6] FIG. 6 is a cross-sectional view showing the transfer head in a state where the nozzle body is in contact with the nozzle shaft. [Figure 7] FIG. 7 is a block diagram showing the electrical configuration of a control unit related to the transfer height setting process in the component mounting apparatus. [Figure 8] FIG. 8 is an explanatory diagram for explaining the initial movement process using a graph showing the relationship between the load measured by the measuring unit and the amount of descent of the nozzle shaft. [Figure 9] FIG. 9 is an explanatory diagram for explaining the first set of descending and ascending operations using a graph that is a partially enlarged version of the graph in FIG. [Figure 10] FIG. 10 is an explanatory diagram showing the second set of descending and ascending movements using a graph that is a partially enlarged version of the graph in FIG. [Figure 11]FIG. 11 is a flowchart showing the transfer height setting process in the component mounting apparatus. [Figure 12] FIG. 12 is a flowchart showing the initial movement process in FIG. [Figure 13] FIG. 13 is a flowchart showing the height adjustment process of FIG. [Figure 14] FIG. 14 is a flowchart showing the height adjustment process according to the second embodiment. [Figure 15] FIG. 15 is a plan view showing the overall configuration of a transfer device according to the third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] [Description of the embodiments of the present disclosure] First, embodiments of the present disclosure will be listed and described.

[0011] (1) A component mounting device disclosed herein is a component mounting device equipped with a transfer pin that transfers paste to a mounted member on which a component is to be mounted, the component mounting device comprising: a first head unit; a transfer head held under the first head unit; a measurement unit capable of measuring a downward load caused by contact of the transfer pin; a detection unit; and a control unit. The transfer head comprises a nozzle shaft that can be raised and lowered relative to the first head unit, the transfer pin disposed below the nozzle shaft, and a spring member that urges the transfer pin downward. The transfer pin is movable when the spring member is compressed. the detection unit is capable of detecting a lowering amount of the nozzle shaft relative to the first head unit, and the control unit performs an initial movement process of moving the nozzle shaft to an initial position where a lower end of the transfer pin is disposed above an upper end of the measurement unit, a height adjustment process of adjusting the height of the nozzle shaft so that a load measured by the measurement unit approaches a preset target value, and a height adjustment process of adjusting the height of the nozzle shaft when the load measured by the measurement unit during the height adjustment process becomes close to the target value. and a transfer height setting process that sets a transfer height, which is the height of the nozzle shaft when the transfer pin transfers paste to the mounted component, based on the reference height. The height adjustment process is a process that repeats a predetermined number of sets of a lowering operation in which the nozzle shaft is lowered by the lowering operation one or more times by unit length until the load measured by the measurement unit exceeds the target value, and an ascent operation in which the nozzle shaft lowered by the lowering operation is raised to an end height at which the lower end of the transfer pin is disposed above the upper end of the measurement unit, wherein when N is an integer greater than or equal to 2 and less than or equal to the predetermined number of sets, the unit length of the Nth set is smaller than the unit length of the N-1th set, and the reference height is set based on the height of the nozzle shaft when the lowering operation in the lowering and ascent operation of a final set is completed, and when the height of the nozzle shaft becomes the transfer height, the load applied from the transfer pin to the mounted component is close to the target value.

[0012] According to this configuration, the lowering and raising operations are repeatedly performed, and the unit length is set smaller for the later lowering operations, so that it is possible to obtain a reference height at which the load from the transfer pin approaches a target value. Then, the transfer height can be set based on the reference height.

[0013] (2) When M is an integer greater than or equal to 3 and less than or equal to a preset number of sets, it is preferable that the end height of the (M-1)th set is lower than the end height of the (M-2)th set.

[0014] According to this configuration, the end height decreases each time the lowering and raising operations are repeated, so that the time required to set the transfer height can be shortened.

[0015] (3) When the transfer pin has moved to the uppermost position relative to the nozzle shaft, the load measured by the measuring unit is equal to or greater than a threshold value, and it is preferable that the control unit executes the initial movement process by lowering the nozzle shaft until the load measured by the measuring unit is close to the threshold value, and then raising the nozzle shaft a predetermined length that is set in advance based on the length by which the transfer pin can move in the vertical direction relative to the nozzle shaft.

[0016] According to this configuration, the vertical distance between the transfer pin and the measurement portion in the initial position can be easily set small, so that the time required to set the transfer height can be reduced.

[0017] (4) It is preferable that the final height of the final set is set higher than the final heights of the other sets.

[0018] According to this configuration, by setting the end height of the final set high, it is easy to move on to the work after setting the transfer height.

[0019] (5) It is preferable that the above-mentioned component mounting apparatus further includes a second head unit including a mounting head that mounts the component on the mountee.

[0020] According to this configuration, the first head unit can transfer the paste, and the second head unit can mount the components, thereby improving production efficiency.

[0021] (6) A transfer device according to the present disclosure is a transfer device including a transfer pin for transferring paste to a mounted member, the transfer device including a first head unit, a transfer head held under the first head unit, a measurement unit capable of measuring a downward load due to contact of the transfer pin, a detection unit, and a control unit, the transfer head including a nozzle shaft capable of ascending and descending relative to the first head unit, the transfer pin disposed below the nozzle shaft, and a spring member for biasing the transfer pin downward, the transfer pin being movable upward relative to the nozzle shaft as the spring member contracts, the detection unit being capable of detecting an amount of descent of the nozzle shaft relative to the first head unit, the control unit including an initial movement process for moving the nozzle shaft to an initial position where a lower end of the transfer pin is disposed above an upper end of the measurement unit, a height adjustment process for adjusting the height of the nozzle shaft so that a load measured by the measurement unit approaches a preset target value, and a height adjustment process for adjusting the height of the nozzle shaft when a load measured by the measurement unit during the height adjustment process becomes close to the target value. and a transfer height setting process that sets a transfer height, which is the height of the nozzle shaft when the transfer pin transfers paste to the mounted member, based on the reference height. The height adjustment process is a process that repeats a predetermined number of sets of a lowering operation in which the nozzle shaft is lowered by the lowering operation one or more times by unit length until the load measured by the measuring unit exceeds the target value, and an ascent operation in which the nozzle shaft lowered by the lowering operation is raised to an end height at which the lower end of the transfer pin is located above the upper end of the measuring unit. When N is an integer greater than or equal to 2 and less than or equal to the predetermined number of sets, the unit length of the Nth set is smaller than the unit length of the N-1th set. The reference height is set based on the height of the nozzle shaft when the lowering operation in the final set of the lowering and ascent operations is completed. When the height of the nozzle shaft becomes the transfer height, the load applied from the transfer pin to the mounted member is close to the target value.

[0022] According to this configuration, the lowering and raising operations are repeatedly performed, and the unit length is set smaller for the later lowering operations, so that it is possible to obtain a reference height at which the load from the transfer pin approaches a target value. Then, the transfer height can be set based on the reference height.

[0023] (7) A method of setting a transfer height in a component mounting apparatus according to the present disclosure is a method of setting a transfer height in a component mounting apparatus having transfer pins that transfer paste to a mount member on which a component is to be mounted, the component mounting apparatus including a first head unit, a transfer head held under the first head unit, a measurement unit capable of measuring a downward load caused by contact of the transfer pin, and a detection unit, the transfer head including a nozzle shaft that can be raised and lowered relative to the first head unit, the transfer pin disposed below the nozzle shaft, and a detection unit that can move the transfer pin downward. a spring member that biases the transfer pin toward the nozzle shaft, the transfer pin being movable upward relative to the nozzle shaft by contracting the spring member, the detection unit being capable of detecting a lowering amount of the nozzle shaft relative to the first head unit, the transfer height being a height of the nozzle shaft when the transfer pin transfers paste to the mounted member, and a method of setting the transfer height in the component mounting apparatus comprising: an initial movement step of moving the nozzle shaft to an initial position where a lower end of the transfer pin is disposed above an upper end of the measurement unit; the height adjusting step of adjusting the height of the nozzle shaft so that the measured load approaches a preset target value; a storing step of storing, as a reference height, the height of the nozzle shaft when the load measured by the measuring unit during the height adjusting step becomes close to the target value; and a transfer height setting step of setting the transfer height based on the reference height, wherein the height adjusting step is a step of repeating a preset number of sets of a lowering and ascent operation, the lowering operation including: a lowering operation of lowering the nozzle shaft one or more times by a unit length until the load measured by the measuring unit exceeds the target value; and an ascent operation of raising the nozzle shaft lowered by the lowering operation to an end height at which the lower end of the transfer pin is disposed above the upper end of the measuring unit, the unit length of the Nth set being smaller than the unit length of the N-1th set, and the reference height being set based on the height of the nozzle shaft when the lowering operation in the final set of the lowering and ascent operations is completed;The method for setting a transfer height in a component mounting apparatus, wherein the load applied from the transfer pin to the mounted member is close to the target value.

[0024] (8) In the above-mentioned method for setting the transfer height in the component mounting apparatus, when M is an integer greater than or equal to 3 and less than or equal to a predetermined number of sets, it is preferable that the finishing height of the M-1th set is lower than the finishing height of the M-2th set.

[0025] (9) In the above-mentioned method for setting the transfer height in the component mounting apparatus, when the transfer pin has moved to the uppermost position relative to the nozzle shaft, the load measured by the measuring unit is equal to or greater than a threshold value, and in the initial movement process, it is preferable that the nozzle shaft is lowered until the load measured by the measuring unit is close to the threshold value, and then the nozzle shaft is raised a predetermined length that is set in advance based on the length by which the transfer pin can move in the vertical direction relative to the nozzle shaft.

[0026] (10) In the above-described method for setting a transfer height in a component mounting apparatus, it is preferable that the end height of a final set is set higher than the end heights of other sets.

[0027] [Details of the embodiment of the present disclosure] The present disclosure will be described below with reference to the embodiments. The present disclosure is not limited to these examples, but is defined by the claims, and is intended to include all modifications within the meaning and scope of the claims.

[0028] <Embodiment 1> A first embodiment of the present disclosure will be described with reference to Fig. 1 to Fig. 13. Hereinafter, with respect to a plurality of identical members, reference numerals may be given to only some of the members, and the reference numerals of the other members may be omitted.

[0029] The component mounting apparatus 100 is a so-called composite type component mounting apparatus 100 that can take out bare chips (semiconductor chips) C from a diced wafer W and mount (mount) them on a substrate P such as a printed wiring board, and also mount chip components supplied by a tape feeder 31 on the substrate P. The bare chips C and chip components are examples of "components" in the present disclosure. Hereinafter, when there is no particular distinction between the bare chips C and the chip components, the term "component E" is used to refer to either of them. The substrate P is also an example of a "mounted member" in the present disclosure. Other examples of "mounted members" include, for example, electronic components such as semiconductor elements, and three-dimensional members having mounting surfaces with different heights.

[0030] The component mounting apparatus 100 includes transfer pins 47 that transfer a paste such as flux or adhesive onto the substrate P before the components are mounted on it. The component E is adhered onto the substrate P by the paste transferred to the substrate P. According to the component mounting apparatus 100, as shown in FIG. 3, for example, the flux (paste) is transferred to a conductive path provided on the substrate P by the transfer pins 47, and then the component E can be mounted on the substrate P to which the flux has been transferred by the suction nozzle 51A of the mounting head 51.

[0031] As shown in FIG. 1, this component mounting apparatus 100 includes a base 1, a conveyor 2, two chip component supply sections 3, a first head unit 4, a second head unit 5, a wafer holding section 6, a push-up section 7 (see FIG. 2), a removal section 8, a transfer unit 9, a fixed camera 10, a wafer storage section 11, a measurement section 12, and a control section 13 (see FIG. 7).

[0032] The conveyor 2 includes a conveyor body extending in the X direction for transporting the substrate P, and a positioning mechanism (not shown) for lifting and positioning the substrate P on the conveyor body. The substrate P is transported in the X direction in a horizontal position from the left side to the right side of FIG. 1 by the conveyor 2, and is positioned and fixed at a predetermined mounting work position. In this embodiment, positions (positions of the substrate P in the figure) on the transport path of the conveyor 2 and spaced apart by a predetermined interval in the X direction are each set as work positions for the substrate P. In the following description, the position on the upstream side (left side of the figure) in the transport direction of the substrate P is referred to as a first work position S1, and the position on the downstream side (right side of the figure) is referred to as a second work position S2.

[0033] The two chip component supplying units 3 are provided at both ends of the front side (the lower side in FIG. 1) of the component mounting apparatus 100. In the chip component supplying unit 3, tape feeders 31 are arranged side by side along the X direction. Each tape feeder 31 intermittently feeds out a carrier tape and supplies chip components such as ICs, transistors, resistors, and capacitors contained in the carrier tape to a predetermined component supply position. The bare chips C can be supplied by the wafer W, or can be supplied by the tape feeders 31 in a state where they are individually stored in a carrier tape.

[0034] [First head unit, second head unit] As shown in Fig. 2, the first head unit 4 is supported by an XY movement mechanism 4A so as to be movable in the horizontal direction (XY direction) above the conveyor 2 and the wafer holding part 6. The second head unit 5 is similarly supported by an XY movement mechanism 5A so as to be movable in the horizontal direction (XY direction) above the conveyor 2 and the wafer holding part 6. The first head unit 4 has a movable area that is mainly an upstream area on the base 1 that includes a first work position S1 (see Fig. 1). On the other hand, the second head unit 5 has a movable area that is mainly a downstream area on the base 1 that includes a second work position S2 (see Fig. 1).

[0035] The first head unit 4 includes two transfer heads 41 aligned in the X direction and each capable of ascending and descending (moving up and down), and one movable camera 42 for substrate recognition. Each transfer head 41 transfers paste supplied by a transfer unit 9, which will be described later, onto the substrate P. Furthermore, the first head unit 4 captures an image of a fiducial mark (not shown) affixed to the substrate P by the movable camera 42 prior to the transfer of the paste to the substrate P. The movable camera 42 outputs an image signal to the control unit 13. This allows the position of the substrate P at the first work position S1 to be recognized.

[0036] [Encoder] The first head unit 4 is provided with a servo motor 43A for moving the nozzle shaft 43 (see FIG. 4) of the transfer head 41 in the Z-axis direction (up and down direction). The servo motor 43A has an encoder 43B. Based on the output of the encoder 43B, the amount of descent of the nozzle shaft 43 from the first head unit 4 and the height (Z-axis position coordinate) of the nozzle shaft 43 can be detected. The encoder 43B is an example of a "detection unit" in this disclosure.

[0037] [Transfer head, nozzle shaft, transfer pin] As shown in FIG. 4, the transfer head 41 includes a nozzle shaft 43 extending downward from the first head unit 4, a cylindrical holder portion 44 attached to the lower portion of the nozzle shaft 43, a nozzle body 45 inserted and held in the lower portion of the holder portion 44, a spring member 46 for biasing the nozzle body 45 downward, and a transfer pin 47 provided at the tip (lower end) of the nozzle body 45. The transfer pin 47 receives the paste spread by a transfer unit 9 described later and transfers it onto the substrate P (see FIG. 3). The component E is adhered to the substrate P by this paste. The transfer head 41 is configured in the same manner as the "suction nozzle" described in Patent Document 2 (JP Patent Publication 2014-168004), and the spring member 46 is adapted to reduce the impact when the transfer pin 47 comes into contact with the substrate P.

[0038] As shown in FIG. 4, the holder portion 44 has a cylindrical shape and includes an upper cylindrical portion 44A, an intermediate cylindrical portion 44B, a lower cylindrical portion 44C, and a tip portion 44D. With the upper cylindrical portion 44A accommodating the lower portion of the nozzle shaft 43, the holder portion 44 is fixed to the nozzle shaft 43. The intermediate cylindrical portion 44B is formed continuously with the lower portion of the upper cylindrical portion 44A and is capable of sliding contact with the upper portion of the nozzle body 45. The lower cylindrical portion 44C is continuous with the lower portion of the intermediate cylindrical portion 44B and is formed with a larger inner diameter than the intermediate cylindrical portion 44B. The lower cylindrical portion 44C is configured to accommodate the intermediate portion of the nozzle body 45 and the spring member 46 therein. The upper end of the spring member 46 is pressed from above by a stepped portion 44E that connects the lower cylindrical portion 44C and the intermediate cylindrical portion 44B. The tip portion 44D of the holder portion 44 has an opening through which the lower portion of the nozzle body 45 is inserted. By the opening edge portion 44F of this opening coming into contact with the nozzle body 45, the nozzle body 45 is prevented from coming off downward.

[0039] The nozzle body 45 includes a shaft-like portion 45A disposed in the upper approximately two-thirds region, a nozzle portion 45B that is continuous with the lower portion of the shaft-like portion 45A and is provided with an outer diameter smaller than that of the shaft-like portion 45A, and a transfer pin 47 provided at the tip (lower end) of the nozzle portion 45B. The transfer pin 47 may be formed separately from the nozzle portion 45B or integrally formed. Near the lower end portion of the shaft-like portion 45A, a flange portion 45C is provided that is formed with a diameter larger than that of the shaft-like portion 45A on the outside. The flange portion 45C is configured to support the lower end of the spring member 46 from below. Below the flange portion 45C, a locking portion 45D is provided that is formed with a diameter larger than that of the nozzle portion 45B on the outside. The locking portion 45D is configured to come into contact with the opening edge portion 44F of the holder portion 44.

[0040] The spring member 46 is a compression coil spring, and is attached to the shaft-shaped portion 45A of the nozzle body 45 by inserting the spring member 46. The spring member 46 is disposed on the outer circumferential side of the shaft-shaped portion 45A of the nozzle body 45 and in the lower cylinder portion 44C of the holder portion 44. The spring member 46 urges the nozzle body 45 (flange portion 45C) toward the tip side (downward) and presses the locking portion 45D against the opening edge portion 44F. When an upward stress is applied to the nozzle body 45, as shown in FIG. 5, the nozzle body 45 is capable of moving upward relative to the nozzle shaft 43 while compressing the spring member 46. As shown in FIG. 6, the nozzle body 45 is capable of moving upward relative to the nozzle shaft 43 until the upper end portion of the nozzle body 45 abuts against the nozzle shaft 43. Therefore, during the transfer operation, the impact when the transfer pin 47 at the tip of the nozzle body 45 comes into contact with the substrate P can be mitigated. The length by which the nozzle body 45 can move up and down relative to the nozzle shaft 43 is called a movable stroke MR (see FIG. 4).

[0041] [Mounting head] As shown in FIG. 2, the second head unit 5 includes two mounting heads 51 arranged in the X direction and each of which can be raised and lowered (moved up and down), and one moving camera 52 for substrate recognition. The second head unit 5 adsorbs the chip components supplied by the tape feeder 31 with the mounting head 51 and mounts them on the substrate P, and also adsorbs the bare chips C taken out of the wafer W by the take-out unit 8 (wafer head 81) with the mounting head 51 and mounts them on the substrate P. As a result, both the bare chips C and the chip components such as transistors and capacitors are mounted on the substrate P. In addition, the second head unit 5 captures an image of a fiducial mark (not shown) attached to the substrate P with the moving camera 52 prior to mounting the components E on the substrate P. The moving camera 52 outputs the image signal to the control unit 13. As a result, the position of the substrate P at the work position S2 is recognized.

[0042] Although the configuration of the mounting head 51 is not shown in detail, it has a configuration similar to that of the transfer head 41. However, the mounting head 51 has a suction nozzle 51A at the tip (lower end) of the mounting head 51 instead of the transfer pin 47 (see FIG. 3). The mounting head 51 has a spring member 46, which can reduce the impact when the component E picked up by the suction nozzle 51A comes into contact with the board P.

[0043] 1, a fixed camera 10 for component recognition is installed on the base 1 within the movable area of ​​the second head unit 5. The fixed camera 10 is configured to capture an image of the component E picked up by the suction nozzle 51A of the second head unit 5 from below. Based on the bottom image of the component E captured by the fixed camera 10, the control unit 13 is able to recognize deviations in the suction position of the component E, defects in the bumps or leads of the component E, and the like.

[0044] The wafer storage section 11 is configured to be capable of storing a plurality of diced wafers W. The bare chips C of the wafers W are, for example, flip chips with bumps formed on electrodes. Each wafer W stored in the wafer storage section 11 is attached and held on the upper surface of a film-like wafer sheet so that the bare chips C are in a face-up state (circuit-forming surface facing upward).

[0045] The wafer holding part 6 is configured to support at a predetermined position the wafer W that has been drawn out from the wafer storage part 11 by a drawer mechanism (not shown). The wafer holding part 6 is also configured to be movable in the Y direction.

[0046] 2, the push-up unit 7 is configured to push up the bare chip C to be removed from the wafer W on the wafer holding unit 6 from below, thereby lifting the bare chip C while peeling it off from the wafer sheet. The push-up unit 7 is configured to be movable in the X direction. By moving the wafer holding unit 6 in the Y direction and the push-up head 71 in the X direction, the push-up head 71 can push up any bare chip C of the wafer W held by the wafer holding unit 6.

[0047] The removal unit 8 is configured to remove the bare chip C from the wafer W and transfer it to the second head unit 5. The removal unit 8 is moved horizontally (XY direction) at a position above the wafer holding unit 6 by a predetermined driving means. The removal unit 8 includes four wafer heads 81. A component recognition camera 82 is provided on the frame of the removal unit 8. The component recognition camera 82 is configured to capture an image of the bare chip C to be removed prior to removal of the bare chip C from the wafer W. The control unit 13 can recognize the removal position and angle of the bare chip C based on the image of the bare chip C captured by the component recognition camera 82.

[0048] The wafer head 81 is configured to be rotatable around the X-axis and movable (raised and lowered) in the vertical direction (Z direction). The wafer head 81 is also configured to be able to suck the bare chip C by negative pressure generated at its tip by a negative pressure generator (not shown). As a result, the removal unit 8 is configured to suck and remove the bare chip C pushed up by the push-up head 71 using the wafer head 81, invert (flip) the bare chip C, and deliver the bare chip C to the suction nozzle 51A at a predetermined delivery position. As a result, the suction nozzle 51A can suck the bare chip C in a face-down state (a state in which the circuit-forming surface faces downward) (see FIG. 3).

[0049] The movable area of the take-out unit 8 in the XY direction and the movable area of the second head unit 5 in the XY direction partially overlap in a plan view, and it is possible to arrange the second head unit 5 and the take-out unit 8 so as to be vertically aligned. As a result, it is possible to transfer the bare chip C from the take-out unit 8 to the second head unit 5.

[0050] Also, the transfer of the bare chip C from the take-out unit 8 to the second head unit 5 may be performed via a relay table (not shown) provided on the base 1. That is, the take-out unit 8 may place the bare chip C on the relay table, and the second head unit 5 may receive the bare chip C placed on the relay table. In this case, the wafer head 81 of the take-out unit 8 does not necessarily need to be configured to be rotatable about the X axis. By providing the relay table, the suction nozzle 51A of the second head unit 5 can suck the bare chip C in the face-up state and mount it on the substrate P.

[0051] Also, the take-out unit 8 may be omitted, and the mounting head 51 of the second head unit 5 may be configured to directly suck the bare chip C from the wafer W.

[0052] As shown in FIG. 2, the transfer unit 9 includes a rotating stage 92 having a flat upper surface (transfer surface 91), and a squeegee 93 disposed slightly above the transfer surface 91 of the rotating stage 92. A paste such as flux is supplied onto the transfer surface 91, and the transfer surface 91 is rotated by the rotating stage 92. As a result, the paste is stretched by the squeegee 93 on the transfer surface 91 and formed into a thin flat surface shape corresponding to the interval between the transfer surface 91 and the squeegee 93.

[0053] [Measurement unit] The measuring unit 12 is capable of measuring the load when the transfer head 41 comes into contact with the component mounting apparatus 100. In this embodiment, a general-purpose load cell used for general load measurement is used as the measuring unit 12 to determine the load. As shown in FIG. 7, the measuring unit 12 is electrically connected to the control unit 13. When a load is applied from above to the upper surface of the measuring unit 12, the resistance value of the strain gauge in the measuring unit 12 changes. As a result, a signal corresponding to the load is output to the control unit 13.

[0054] 1, the measurement unit 12 is fixed to a position below the first work position S1 of the base 1. As shown in Figures 4 and 5, the tip (lower end) of the transfer pin 47 can be brought into contact with the upper surface of the measurement unit 12 by lowering the transfer head 41 (nozzle shaft 43) of the first head unit 4 from above the measurement unit 12.

[0055] [Control Unit] The control unit 13 has a function of controlling the operation of the conveyor 2, the chip component supply unit 3 (tape feeder 31), the first head unit 4, the second head unit 5, the wafer holding unit 6, the push-up unit 7, the take-out unit 8, the transfer unit 9, etc. The control unit 13 controls the operation of each unit based on an output signal from a position detection means built into the drive motor of each unit. For example, as shown in FIG. 7, the control unit 13 controls the lifting and lowering operation of the nozzle shaft 43 based on an output signal from an encoder 43B of a servo motor 43A. The control unit 13 also has a function of controlling the imaging of various cameras (the moving camera 42, the component recognition camera 82, and the fixed camera 10) and performing image recognition.

[0056] The control unit 13 also includes a storage unit (not shown) that includes a ROM (Read Only Memory) that stores various programs executed by the control unit 13, a RAM (Random Access Memory) that temporarily stores various data during operation of the device, and the like.

[0057] The various programs stored in the storage unit specifically include information on the substrate P, information on the components E to be mounted on the substrate P, information on the transfer position of the paste on the substrate P and the mounting position of the components E, etc. In addition, the various data stored in the storage unit includes various numerical data and the like used in the transfer height setting process described below.

[0058] [Transfer height setting] Next, the setting of the transfer height in this embodiment will be described. In the present disclosure, the transfer height is defined as the height of the nozzle shaft 43 at which the paste can be satisfactorily transferred by the transfer pin 47. The height of the nozzle shaft 43 can be controlled by the servo motor 43A and detected by the encoder 43B. On the other hand, for example, when the transfer height is defined by the height of the transfer pin 47, it is difficult to appropriately define the transfer height due to the compression of the spring member 46.

[0059] In this embodiment, the downward load from the transfer pin 47 is measured by the measurement unit 12 while the nozzle shaft 43 is lowered and raised toward the measurement unit 12, the height of the nozzle shaft 43 at which the load is close to the target value is determined, and the transfer height is set based on the result. The target value is the optimum load applied to the substrate P when the paste is transferred. In other words, the target value is set so that the paste is well transferred to the substrate P when a load close to the target value is applied from the transfer pin 47 to the substrate P. The quality of the paste transfer can be judged, for example, from the amount of paste transferred to the substrate P and the presence or absence of damage to the substrate P.

[0060] 8 is a diagram showing a schematic example of the relationship between the amount of descent of the nozzle shaft 43 and the load measured by the measuring unit 12. Note that the horizontal axis represents the amount of descent of the nozzle shaft 43, and that the nozzle shaft 43 descends further to the right in the figure. The height of the nozzle shaft 43, which is indicated according to the amount of descent of the nozzle shaft 43, increases further to the left in the figure. Note that the present disclosure can also be applied to cases where the relationship between the load measured by the measuring unit 12 and the amount of descent of the nozzle shaft 43 is different from that shown in FIG. 8.

[0061] In Fig. 8, in the region where the amount of descent of the nozzle shaft 43 is small, the load is approximately constant and is at the initial value (F0 in Fig. 8). In this state, the transfer pin 47 is not in contact with the measurement part 12, and no load is applied to the measurement part 12 (see Fig. 4). When the amount of descent of the nozzle shaft 43 increases, the load increases suddenly when the transfer pin 47 comes into contact with the measurement part 12. In Fig. 8, the load rises when the amount of descent of the nozzle shaft 43 is near D1.

[0062] Furthermore, as the amount of descent of the nozzle shaft 43 increases, the load increases approximately in proportion to the amount of descent of the nozzle shaft 43. In a region where the load is approximately proportional to the amount of descent of the nozzle shaft 43 (the central portion shown in FIG. 8), the spring member 46 contracts, allowing the transfer pin 47 to move upward relative to the nozzle shaft 43 (see FIG. 5). Therefore, according to Hooke's law, the load increases in proportion to the length by which the spring member 46 contracts.

[0063] Furthermore, when the amount of descent of the nozzle shaft 43 becomes large, the upper end of the nozzle body 45 abuts against the nozzle shaft 43 (see FIG. 6). As a result, the transfer pin 47 cannot move upward relative to the nozzle shaft 43, and as shown in FIG. 8, the slope of the increase in the load with respect to the amount of descent of the nozzle shaft 43 becomes very large. When the upper end of the nozzle body 45 abuts against the nozzle shaft 43, the amount of descent of the nozzle shaft 43 is D2, and the load measured by the measuring unit 12 is F2 (threshold value). The threshold value is obtained by measuring the relationship of the load of the measuring unit 12 with respect to the amount of descent of the nozzle shaft 43 as shown in FIG. 8. The threshold value can also be calculated from the product of the spring constant of the spring member 46 and the movable stroke MR (and the initial value of the load).

[0064] The transfer of paste to the substrate P by the transfer pin 47 is usually performed at a height at which the spring member 46 can be compressed. In addition, it is preferable that the load from the transfer pin 47 to the substrate P during the paste transfer is not too large. The load required for good transfer varies depending on the type of the substrate P, the paste, and the transfer pin 47, but in this embodiment, a case will be described in which the load near the start of the load at the point where the transfer pin 47 contacts the substrate P is set as the target value (F1 in FIG. 8). The target value of the load may be set based on the result of measuring the relationship between the load of the measuring unit 12 and the amount of descent of the nozzle shaft 43. Alternatively, the target value may be set based on a threshold value calculated from the spring constant of the spring member 46 and the movable stroke MR.

[0065] The procedure for setting the transfer height in the component mounting apparatus 100 will be described below.

[0066] As shown in FIG. 11, the control unit 13 first executes an initial movement process to move the nozzle shaft 43 to the initial position (S1). When the nozzle shaft 43 is at the initial position, the transfer pin 47 and the measurement unit 12 face each other in the vertical direction, and the lower end of the transfer pin 47 and the upper end of the measurement unit 12 are not in contact with each other (for example, the state shown in FIG. 4). The control unit 13 executes a height adjustment process to repeat the stepwise lowering and raising of the nozzle shaft 43 that has been moved to the initial position (S2). From the result of the height adjustment process, the control unit 13 stores a reference height Hs, which is the height of the nozzle shaft 43 at which the load measured by the measurement unit 12 is close to the target value (S26 in FIG. 13). The control unit 13 sets a transfer height, which is the height of the nozzle shaft 43 when transferring the paste to the substrate P, based on the reference height Hs (S3 in FIG. 11).

[0067] In the initial movement process of this embodiment, in order to shorten the time required for the subsequent processes, the height of the nozzle shaft 43 at the initial position is set as low as possible. Specifically, the initial position is set by the procedure shown in FIG. 12. First, the control unit 13 lowers the nozzle shaft 43 so that the transfer pin 47 contacts the measurement unit 12 (S11). Then, the measurement unit 12 is pressed against the transfer pin 47, and the load measured by the measurement unit 12 reaches the vicinity of the threshold value (S12). Here, the vicinity of the threshold value can be, for example, a range from 98% to 102% of the threshold value. After S12, the control unit 13 raises the nozzle shaft 43 by a predetermined length that is set in advance (S13). Here, the predetermined length is set slightly longer than the movable stroke MR (see FIG. 4) that is the length by which the transfer pin 47 can move up and down relative to the nozzle shaft 43 (for example, 102% of the movable stroke MR). This makes it easier to reduce the distance between the transfer pin 47 and the measurement unit 12 as much as possible without the transfer pin 47 contacting the measurement unit 12.

[0068] After S13, the control unit 13 judges whether or not the load measured by the measurement unit 12 exceeds the initial value (S14). If the load does not exceed the initial value (S14: NO), it is judged that the transfer pin 47 is not in contact with the measurement unit 12, and the initial movement process is completed. On the other hand, if the load exceeds the initial value (S14: YES), it is judged that the transfer pin 47 is in contact with the measurement unit 12, and the control unit 13 further raises the nozzle shaft 43 by the preliminary length (S15), and judges again whether or not the load exceeds the initial value (S14). The preliminary length can be, for example, 2% of the movable stroke MR. Here, as shown in the lower part of the graph in FIG. 8, the amount of descent of the nozzle shaft 43 is set to D0 by the initial movement process, and the nozzle shaft 43 is moved to the initial position where the height of the nozzle shaft 43 is set to H0, and the subsequent processes will be described.

[0069] In the height adjustment process performed after the initial movement process, the lifting and lowering operation is repeated for a preset number of sets of two or more while the load is measured by the measuring unit 12. One set of lifting and lowering operation is composed of a lowering operation in which the nozzle shaft 43 is lowered by a unit length once or more, and an ascending operation in which the nozzle shaft 43 is raised to a final height after the lowering operation. Here, the descending operation is performed until the load measured by the measuring unit 12 exceeds the target value. In other words, the descending operation ends when the load exceeds the target value. In addition, the unit length is set to be smaller as the number of sets increases. That is, if N is an integer equal to or greater than 2 and equal to or less than the set number of sets, the unit length of the Nth set is smaller than the unit length of the N-1th set. Therefore, by repeating the lifting and lowering operation, it is possible to determine the amount of descent of the nozzle shaft 43 at which the load approaches the target value with a smaller unit length accuracy.

[0070] In this embodiment, the procedure of the height adjustment process when the number of sets is set to 2 (see FIG. 13) will be specifically described. The control unit 13 starts the lowering and raising operation of the first set. First, the control unit 13 lowers the nozzle shaft 43 by a unit length L1 from the initial position (S21). The unit length L1 can be, for example, 50 μm. When the load measured by the measurement unit 12 does not exceed the target value (S22: NO), the control unit 13 lowers the nozzle shaft 43 by the unit length L1 again (S21). By executing the operation of lowering the nozzle shaft 43 by the unit length L1 one or more times, when the load measured by the measurement unit 12 exceeds the target value (S22: YES), the control unit 13 ends the lowering operation of the nozzle shaft 43 and shifts to the raising operation (S23) of the nozzle shaft 43. Here, as shown in the lower part of the graph in FIG. 9, when the operation of lowering the nozzle shaft 43 by the unit length L1 is executed twice and the load measured by the measurement unit 12 exceeds the target value (= F1), the subsequent processing will be described.

[0071] In S23, the control unit 13 raises the nozzle shaft 43 to the end height H1 and completes the lowering and raising operation of the first set. In this embodiment, the end height H1 is set to be higher by the unit length L1 than the height of the nozzle shaft 43 at which the lowering operation ends. Therefore, in the case shown in FIG. 9, the end height H1 is lower than the height of the initial position (H0 in FIG. 9). In this way, by setting the end height H1 of the lowering and raising operation of the first set to be higher by the unit length L1 than the height of the nozzle shaft 43 at which the lowering operation ends, the height of the nozzle shaft 43 when the lowering and raising operation of the second set starts will not be higher than the initial position. Therefore, the time required for the lowering and raising operation of the second set can be shortened.

[0072] Next, the control unit 13 executes the lowering and raising operation of the second set (final set). The control unit 13 lowers the nozzle shaft 43 by the unit length L2 from the end height H1 of the first set (S24). Here, the unit length L2 of the second set is set smaller than the unit length L1 of the first set. The unit length L2 can be set to, for example, 10 μm. If the load measured by the measurement unit 12 does not exceed the target value (S25: NO), the control unit 13 again lowers the nozzle shaft 43 by the unit length L2 (S24). If the load measured by the measurement unit 12 exceeds the target value by executing the operation of lowering the nozzle shaft 43 by the unit length L2 one or more times (S25: YES), the control unit 13 ends the lowering operation of the nozzle shaft 43. Here, as shown in the lower part of the graph in FIG. 10, the load measured by the measurement unit 12 exceeds the target value (=F1) when the operation of lowering the nozzle shaft 43 by the unit length L2 is executed three times, and the subsequent processing will be described.

[0073] In the final set of descending and ascending processes, the control unit 13 executes a storage process to determine and store a reference height Hs based on the height of the nozzle shaft 43 when the descending operation is completed (S26). The reference height Hs is the height of the nozzle shaft 43 when a load close to a target value is applied to the measurement unit 12. In the case shown in FIG. 10, the reference height Hs is the height of the nozzle shaft 43 when the descending operation is completed (i.e., H1-3L2). In addition to this, the reference height Hs may be, for example, a height higher by unit length L2 than the height of the nozzle shaft 43 when the descending operation is completed (i.e., H1-2L2).

[0074] After S26, the control unit 13 raises the nozzle shaft 43 to the end height H2 of the second set, completing the lowering and raising operation of the final set (S27). This completes the height adjustment process. The end height H2 of the final set is preferably set higher than the end height H1 of the first set so as to facilitate transition to the subsequent operation (such as production of the substrate P). For example, the end height H2 can be the height of the nozzle shaft 43 at which the amount of lowering of the nozzle shaft 43 is zero.

[0075] The control unit 13 sets the transfer height based on the reference height Hs (S3 in FIG. 11). Specifically, the transfer height can be obtained by adding an offset corresponding to the difference between the height of the upper surface of the measurement unit 12 and the height of the upper surface of the substrate P when the paste is transferred to the reference height Hs. In this embodiment, the measurement unit 12 is disposed below the position where the substrate P is disposed, so that when the height of the upper surface of the measurement unit 12 is Hm and the height of the upper surface of the substrate P when the paste is transferred is Hp (>Hm), the transfer height is Hs-Hm+Hp. Note that when Hp≦Hm, the transfer height is Hs-Hp+Hm. By setting the transfer height in this manner, when the transfer pin 47 transfers the paste to the substrate P, the load applied from the transfer pin 47 to the substrate P can be made to be close to the target value. Therefore, the paste can be transferred to the substrate P well.

[0076] [Effects of the First Embodiment] According to the first embodiment, the following actions and effects are achieved. The component mounting apparatus 100 according to the first embodiment is a component mounting apparatus 100 having transfer pins 47 for transferring paste to a mounted member (substrate P) on which a component E is to be mounted, and is provided with a first head unit 4, a transfer head 41 held under the first head unit 4, a measurement unit 12 capable of measuring a downward load caused by contact of the transfer pins 47, a detection unit (encoder 43B), and a control unit 13. The transfer head 41 has a nozzle shaft 43 that can be raised and lowered relative to the first head unit 4, a transfer pin 47 disposed below the nozzle shaft 43, and a detection unit 13 for detecting the transfer pins 47. and a spring member 46 that biases the transfer pin 47 in the direction of the nozzle shaft 43, the transfer pin 47 being movable upward relative to the nozzle shaft 43 as the spring member 46 contracts, the detection unit being capable of detecting the amount of descent of the nozzle shaft 43 relative to the first head unit 4, and the control unit 13 performing an initial movement process of moving the nozzle shaft 43 to an initial position where the lower end of the transfer pin 47 is disposed above the upper end of the measurement unit 12, a height adjustment process of adjusting the height of the nozzle shaft 43 so that the load measured by the measurement unit 12 approaches a preset target value, and a height adjustment process of adjusting the height of the nozzle shaft 43 by the measurement unit 12 during the height adjustment process. The height adjustment process is configured to execute a storage process for storing the height of the nozzle shaft 43 when the load measured by the measuring unit 12 becomes close to the target value as a reference height Hs, and a transfer height setting process for setting a transfer height, which is the height of the nozzle shaft 43 when the transfer pin 47 transfers the paste to the mounted member, based on the reference height Hs. The height adjustment process is configured to execute a lowering operation for lowering the nozzle shaft 43 by unit length one or more times until the load measured by the measuring unit 12 exceeds the target value, and a step of adjusting the nozzle shaft 43 lowered by the lowering operation so that the lower end of the transfer pin 47 is above the measuring unit 12. The process repeats a preset number of sets of an ascent operation, which raises the nozzle shaft 43 to a final height that is above the end, and a descent and ascent operation, each of which constitutes one set. When N is an integer that is 2 or more and less than the preset number of sets, the unit length of the Nth set is smaller than the unit length of the N-1th set, and the reference height Hs is set based on the height of the nozzle shaft 43 when the descent operation in the final set of ascent and descent operations is completed. When the height of the nozzle shaft 43 becomes the transfer height, the load applied from the transfer pin 47 to the mounted member is close to the target value.

[0077] According to this configuration, the lowering and raising operations are repeatedly performed, and the unit length is set smaller for the later lowering operations, so that it is possible to obtain a reference height Hs at which the load from the transfer pin 47 becomes close to the target value. Then, the transfer height can be set based on the reference height Hs.

[0078] In embodiment 1, when the transfer pin 47 has moved to the uppermost position relative to the nozzle shaft 43, the load measured by the measuring unit 12 is equal to or greater than a threshold value, and the control unit 13 executes an initial movement process by lowering the nozzle shaft 43 until the load measured by the measuring unit 12 is close to the threshold value, and then raising the nozzle shaft 43 a predetermined length that is set in advance based on the length by which the transfer pin 47 can move vertically relative to the nozzle shaft 43.

[0079] According to such a configuration, it is easy to set the vertical distance between the transfer pin 47 and the measurement unit 12 in the initial position small, so that the time required to set the transfer height can be shortened.

[0080] In the first embodiment, the final height H2 of the final set (second set) is set higher than the final height H1 of the other sets (first set).

[0081] According to this configuration, by setting the end height H2 of the final set high, it is easy to move on to the work (eg, production of the substrate P) after the transfer height is set.

[0082] The component mounting apparatus 100 according to the first embodiment further includes a second head unit 5 that includes a mounting head 51 that mounts the component E on a mount target member.

[0083] According to this configuration, the first head unit 4 transfers the paste, and the second head unit 5 mounts the components E, so that production efficiency can be improved.

[0084] The method for setting the transfer height in the component mounting apparatus 100 according to the first embodiment is a method for setting the transfer height in the component mounting apparatus 100 equipped with transfer pins 47 for transferring paste to a mounted member on which a component E is to be mounted, and the component mounting apparatus 100 is equipped with a first head unit 4, a transfer head 41 held under the first head unit 4, a measuring unit 12 capable of measuring a downward load caused by contact of the transfer pins 47, and a detection unit, and the transfer head 47 is equipped with a nozzle shaft 43 that can be raised and lowered relative to the first head unit 4, and a transfer pin 41 disposed below the nozzle shaft 43. 7 and a spring member 46 that urges the transfer pin 47 downward, the transfer pin 47 is movable upward relative to the nozzle shaft 43 by the spring member 46 contracting, the detection unit is capable of detecting the amount of descent of the nozzle shaft 43 relative to the first head unit 4, the transfer height is the height of the nozzle shaft 43 when the transfer pin 47 transfers paste to the mounted member, and a method of setting the transfer height in the component mounting apparatus 100 includes an initial movement step of moving the nozzle shaft 43 to an initial position where the lower end of the transfer pin 47 is located above the upper end of the measurement unit 12, and a step of detecting the transfer height by the measurement unit 12. The method includes a height adjustment step of adjusting the height of the nozzle shaft 43 so that the load measured approaches a preset target value, a storage step of storing the height of the nozzle shaft 43 when the load measured by the measuring unit 12 during the height adjustment step approaches the target value as a reference height Hs, and a transfer height setting step of setting a transfer height based on the reference height Hs. The height adjustment step includes a lowering operation of lowering the nozzle shaft 43 by unit length one or more times until the load measured by the measuring unit 12 exceeds the target value, and a step of lowering the nozzle shaft 43 lowered by the lowering operation until the lower end of the transfer pin 47 is The process is configured to repeat a predetermined number of sets of an ascent operation to raise the measuring part 12 to a final height that is located above the upper end of the measuring part 12, and a descent and ascent operation, each of which constitutes one set. When N is an integer that is 2 or more and less than the predetermined number of sets, the unit length of the Nth set is smaller than the unit length of the N-1th set, and the reference height Hs is set based on the height of the nozzle shaft 43 when the descent operation in the final set of ascent and descent operations is completed. When the height of the nozzle shaft 43 becomes the transfer height, the load applied from the transfer pin 47 to the mounted member is close to the target value.

[0085] <Embodiment 2> A second embodiment of the present disclosure will be described with reference to Fig. 14. Note that the configuration of the second embodiment is similar to that of the first embodiment except for the height adjustment process, and therefore a duplicated description will be omitted.

[0086] In this embodiment, the number of sets of the height adjustment process is 3 or more, and when M is an integer equal to or greater than 3, the end height of the M-1th set is set lower than the end height of the M-2th set. This makes it possible to shorten the time required for the Mth set of lowering and raising operations to lower and raise the nozzle shaft 43 at the end height of the M-1th set.

[0087] For simplicity, the following will be described by way of example with the number of sets of height adjustment processing set to 3.

[0088] In the height adjustment process shown in FIG. 14, the control unit 13 executes a first set of lowering and raising operations (S31, S32, S33) and a second set of lowering operations (S34, S35) in the same manner as S21 to S25 (FIG. 13) in the first embodiment.

[0089] In S36, the control unit 13 performs a second set of lifting operations, and lifts the nozzle shaft 43 to a final height H2. Here, in the second embodiment, the final height H2 of the second set is set to be smaller than the final height H1 of the first set. This makes it possible to shorten the time required for the third set of lowering and lifting operations (S37, S38, S39, S40).

[0090] The third set of descending and ascending movements is the final set of descending and ascending movements, and is executed in the same procedure as S24 to S27 (FIG. 13) in the first embodiment.

[0091] [Effects of the second embodiment] According to the second embodiment, the following actions and effects are achieved. In the second embodiment, when M is an integer equal to or greater than 3 and equal to or less than a preset number of sets, the end height of the (M-1)th set is lower than the end height of the (M-2)th set.

[0092] According to this configuration, the end height decreases each time the lowering and raising operations are repeated, so that the time required to set the transfer height can be shortened.

[0093] <Embodiment 3> A third embodiment of the present disclosure will be described with reference to Fig. 15. A transfer device 200 according to the third embodiment includes a base 1, a conveyor 2, a first head unit 4 having a transfer head 41, a transfer unit 9, a measurement unit 12, and a control unit 13 (see Fig. 7), similar to the above-mentioned embodiments. The transfer device 200 can be configured to set the transfer height and transfer the paste to the substrate P, similar to the above-mentioned embodiments.

[0094] Meanwhile, unlike the above embodiment, the transfer device 200 may not have the configuration for mounting the components E on the substrate P (for example, the mounting head 51, the chip component supply unit 3, the wafer holding unit 6, the push-up unit 7, the removal unit 8, etc.). The substrate P onto which the paste has been transferred by the transfer device 200 is sent to a component mounting device (not shown) adjacent to the transfer device 200, and the components E are mounted in the adjacent component mounting device.

[0095] [Effects of the Third Embodiment] According to the third embodiment, the following actions and effects are achieved. The transfer device 200 according to the third embodiment is a transfer device 200 having transfer pins 47 that transfer paste to a mounted member (substrate P), and is provided with a first head unit 4, a transfer head 41 held under the first head unit 4, a measurement unit 12 capable of measuring a downward load caused by contact of the transfer pins 47, a detection unit (encoder 43B), and a control unit 13. The transfer head 41 includes a nozzle shaft 43 that can be raised and lowered relative to the first head unit 4, a transfer pin 47 disposed below the nozzle shaft 43, and a spring member that urges the transfer pin 47 downward. 46, the transfer pin 47 is movable upward relative to the nozzle shaft 43 by the contraction of the spring member 46, the detection unit is capable of detecting the amount of descent of the nozzle shaft 43 relative to the first head unit 4, and the control unit 13 performs an initial movement process of moving the nozzle shaft 43 to an initial position where the lower end of the transfer pin 47 is disposed above the upper end of the measurement unit 12, a height adjustment process of adjusting the height of the nozzle shaft 43 so that the load measured by the measurement unit 12 approaches a preset target value, and a load adjustment process of adjusting the height of the nozzle shaft 43 so that the load measured by the measurement unit 12 during the height adjustment process approaches a preset target value. The height adjustment process is configured to execute a storage process for storing the height of the nozzle shaft 43 when the load becomes close to the target value as a reference height Hs, and a transfer height setting process for setting a transfer height, which is the height of the nozzle shaft 43 when the transfer pin 47 transfers the paste to the mounted member, based on the reference height Hs. The height adjustment process is configured to execute a lowering operation for lowering the nozzle shaft 43 by unit length one or more times until the load measured by the measurement unit 12 exceeds the target value, and a step of lowering the nozzle shaft 43 lowered by the lowering operation until the lower end of the transfer pin 47 is lower than the upper end of the measurement unit 12. The process repeats a preset number of sets of an ascent action, which raises the nozzle shaft 43 to a final height located above, and a descent and ascent action, each of which constitutes one set. When N is an integer greater than or equal to 2 and less than or equal to the preset number of sets, the unit length of the Nth set is smaller than the unit length of the N-1th set, and the reference height Hs is set based on the height of the nozzle shaft 43 when the descent action in the final set of ascent and descent actions is completed. When the height of the nozzle shaft 43 becomes the transfer height, the load applied from the transfer pin 47 to the mounted member is close to the target value.

[0096] According to this configuration, the lowering and raising operations are repeatedly performed, and the unit length is set smaller for the later lowering operations, so that it is possible to obtain a reference height Hs at which the load from the transfer pin 47 becomes close to the target value. Then, the transfer height can be set based on the reference height Hs.

[0097] <Other embodiments> (1) In the above embodiment, one transfer head 41 has one transfer pin 47. However, this is not limited to the above, and one transfer head may have a plurality of transfer pins. (2) In the above embodiment, the component mounting apparatus 100 is configured to include a first head unit 4 equipped with a transfer head 41, and a second head unit 5 equipped with a mounting head 51, but this is not limited to this, and the component mounting apparatus may be configured to include a single head unit equipped with a transfer head and a mounting head. (3) In the first embodiment, the initial movement process is executed in the procedure of Fig. 12, but this is not limited to this. For example, in the initial movement process, the nozzle shaft may be moved to a preset initial position. (4) In the first embodiment, the number of sets of the height adjustment process is set to 2, and in the second embodiment, the number of sets of the height adjustment process is set to 3, but this is not limited to this. Even if the number of sets of the height adjustment process is set to 4 or more, the configurations of the first and second embodiments can be adopted. [Explanation of symbols]

[0098] Reference Signs List 1...base, 2...conveyor, 3...chip component supply section, 4...first head unit, 4A...XY movement mechanism, 5...second head unit, 5A...XY movement mechanism, 6...wafer holding section, 7...push-up section, 8...removal section, 9...transfer unit, 10...fixed camera, 11...wafer storage section, 12...measurement section, 13...control section, 31...tape feeder 41...transfer head, 42...moving camera, 43...nozzle shaft, 43A...servo motor, 43B...encoder (detection unit), 44...holder portion, 44A...upper cylinder portion, 44B...middle cylinder portion, 44C...lower cylinder portion, 44D...tip portion, 44E...step-shaped portion, 44F...opening edge portion, 45...nozzle body, 45A...shaft-shaped portion, 45B...nozzle portion, 45C...flange portion, 45D...locking portion, 46...spring member, 47...transfer pin 51... mounting head, 51A... suction nozzle, 52... moving camera, 71... thrust head, 81... wafer head, 82... component recognition camera, 91... transfer surface, 92... rotating stage, 93... squeegee, 100... component mounting device, 200... transfer device C: bare chip, E: component, P: substrate (mounted member), S1: first work position, S2: second work position, W: wafer H1...End height, H2...End height, Hs...Reference height, L1...Unit length, L2...Unit length, MR...Moving stroke

Claims

1. A component mounting device having a transfer pin that transfers paste to a mounting member on which a component is to be mounted, a first head unit; a transfer head held under the first head unit; a measurement unit capable of measuring a downward load caused by contact of the transfer pin; a detection unit; and a control unit; the transfer head includes a nozzle shaft that can be raised and lowered with respect to the first head unit, the transfer pin that is disposed below the nozzle shaft, and a spring member that urges the transfer pin downward; The transfer pin is movable upward relative to the nozzle shaft by contracting the spring member, the detection unit is capable of detecting a lowering amount of the nozzle shaft with respect to the first head unit, an initial movement process in which the control unit moves the nozzle shaft to an initial position where a lower end of the transfer pin is disposed above an upper end of the measurement unit; a height adjustment process for adjusting the height of the nozzle shaft so that the load measured by the measurement unit approaches a preset target value; a storage process for storing, as a reference height, the height of the nozzle shaft when the load measured by the measurement unit during the height adjustment process becomes close to the target value; a transfer height setting process for setting a transfer height, which is a height of the nozzle shaft when the transfer pin transfers the paste to the mounted member, based on the reference height; The height adjustment process is a process of repeating a set of lowering and raising operations, each set consisting of a lowering operation in which the nozzle shaft is lowered by a unit length at least once until the load measured by the measuring unit exceeds the target value, and a raising operation in which the nozzle shaft lowered by the lowering operation is raised to a final height at which the lower end of the transfer pin is disposed above the upper end of the measuring unit, a preset number of sets; When N is an integer equal to or greater than 2 and equal to or less than a preset number of sets, the unit length of the N-th set is shorter than the unit length of the N-1-th set, the reference height is set based on a height of the nozzle shaft when the lowering movement in a final set of the lowering and raising movements is completed; a load applied from the transfer pin to the mounted member when the height of the nozzle shaft reaches the transfer height, the load being close to the target value.

2. 2. The component mounting device according to claim 1, wherein, when M is an integer greater than or equal to 3 and less than or equal to a preset number of sets, the finishing height of the (M-1)th set is lower than the finishing height of the (M-2)th set.

3. When the transfer pin is in the uppermost position relative to the nozzle shaft, the load measured by the measurement unit is equal to or greater than a threshold value. The component mounting device according to claim 1 or claim 2, wherein the control unit executes the initial movement process by lowering the nozzle shaft until the load measured by the measuring unit becomes close to the threshold value, and then raising the nozzle shaft a predetermined length that is set in advance based on the length by which the transfer pin can move in the vertical direction relative to the nozzle shaft.

4. The component mounting device according to claim 1 , wherein the final height of a final set is set higher than the final heights of other sets.

5. The component mounting apparatus according to claim 1 , further comprising a second head unit including a mounting head that mounts the component on the mountee.

6. A transfer device having a transfer pin for transferring a paste to a mounted member, a first head unit; a transfer head held under the first head unit; a measurement unit capable of measuring a downward load caused by contact of the transfer pin; a detection unit; and a control unit; the transfer head includes a nozzle shaft that can be raised and lowered with respect to the first head unit, the transfer pin that is disposed below the nozzle shaft, and a spring member that urges the transfer pin downward, The transfer pin is movable upward relative to the nozzle shaft by contracting the spring member, the detection unit is capable of detecting a lowering amount of the nozzle shaft with respect to the first head unit, an initial movement process in which the control unit moves the nozzle shaft to an initial position where a lower end of the transfer pin is disposed above an upper end of the measurement unit; a height adjustment process for adjusting the height of the nozzle shaft so that the load measured by the measurement unit approaches a preset target value; a storage process for storing, as a reference height, the height of the nozzle shaft when the load measured by the measurement unit during the height adjustment process becomes close to the target value; a transfer height setting process for setting a transfer height, which is a height of the nozzle shaft when the transfer pin transfers the paste to the mounted member, based on the reference height; The height adjustment process is a process of repeating a preset number of sets of lowering and ascent operations, each set consisting of a lowering operation in which the nozzle shaft is lowered by a unit length at least once until the load measured by the measuring unit exceeds the target value, and an ascent operation in which the nozzle shaft lowered by the lowering operation is raised to a final height at which the lower end of the transfer pin is disposed above the upper end of the measuring unit, When N is an integer equal to or greater than 2 and equal to or less than a preset number of sets, the unit length of the N-th set is shorter than the unit length of the N-1-th set, the reference height is set based on a height of the nozzle shaft when the lowering movement in a final set of the lowering and raising movements is completed; When the height of the nozzle shaft reaches the transfer height, the load applied from the transfer pin to the mounted member is close to the target value.

7. A method for setting a transfer height in a component mounting apparatus having transfer pins that transfer paste to a substrate on which components are to be mounted, comprising the steps of: the component mounting apparatus includes a first head unit, a transfer head held under the first head unit, a measurement unit capable of measuring a downward load caused by contact of the transfer pin, and a detection unit; the transfer head includes a nozzle shaft that can be raised and lowered with respect to the first head unit, the transfer pin that is disposed below the nozzle shaft, and a spring member that urges the transfer pin downward, The transfer pin is movable upward relative to the nozzle shaft by contracting the spring member, the detection unit is capable of detecting a lowering amount of the nozzle shaft with respect to the first head unit, the transfer height is a height of the nozzle shaft when the transfer pin transfers the paste to the mounted member, The method for setting the transfer height in the component mounting apparatus includes: an initial movement step of moving the nozzle shaft to an initial position where a lower end of the transfer pin is disposed above an upper end of the measurement unit; a height adjustment step of adjusting the height of the nozzle shaft so that the load measured by the measurement unit approaches a preset target value; a storage step of storing, as a reference height, the height of the nozzle shaft when the load measured by the measuring unit during the height adjustment step becomes close to the target value; a transfer height setting step of setting the transfer height based on the reference height, The height adjustment step is a step of repeating a preset number of sets of lowering and ascent operations, each set including a lowering operation for lowering the nozzle shaft by a unit length at least once until the load measured by the measuring unit exceeds the target value, and an ascent operation for raising the nozzle shaft lowered by the lowering operation to a final height at which the lower end of the transfer pin is disposed above the upper end of the measuring unit, When N is an integer equal to or greater than 2 and equal to or less than a preset number of sets, the unit length of the N-th set is shorter than the unit length of the N-1-th set, the reference height is set based on a height of the nozzle shaft when the lowering movement in a final set of the lowering and raising movements is completed; A method for setting a transfer height in a component mounting apparatus, wherein, when the height of the nozzle shaft becomes the transfer height, the load applied from the transfer pin to the mounted member becomes close to the target value.

8. 8. The method for setting a transfer height in a component mounting apparatus according to claim 7, wherein, when M is an integer greater than or equal to 3 and less than or equal to a preset number of sets, the end height of the (M-1)th set is lower than the end height of the (M-2)th set.

9. When the transfer pin is in the uppermost position relative to the nozzle shaft, the load measured by the measurement unit is equal to or greater than a threshold value.

9. The method for setting a transfer height in a component mounting apparatus according to claim 7 or claim 8, wherein, in the initial movement process, the nozzle shaft is lowered until the load measured by the measurement unit becomes close to the threshold value, and then the nozzle shaft is raised a predetermined length that is set in advance based on the length by which the transfer pin can move in the vertical direction relative to the nozzle shaft.

10. 10. The method for setting a transfer height in a component mounting apparatus according to claim 7, wherein the end height of a final set is set higher than the end heights of other sets.

Images