Nitride semiconductor light emitting device

Abstract

To provide a nitride semiconductor light emission element capable of suppressing contamination of Mg into a light emission layer due to thermal diffusion and enhancing injection efficiency of positive holes into the light emission layer.SOLUTION: A nitride semiconductor light emission element includes: an n-side semiconductor layer 30; one or more light emission layers 55 arranged above the n-side semiconductor layer 30; a first barrier layer 51 arranged above the one or more light emission layers 55 and containing Al; a second barrier layer 52 arranged above the first barrier layer 51 and containing Al; a p-side guide layer 61 arranged above the second barrier layer 52 and having lower Al composition ratio than the second barrier layer 52; an electron barrier layer 62 arranged above the p-side guide layer 61, containing Mg, and having higher Al composition ratio than the second barrier layer 52; and p-side semiconductor layer 70 arranged above the electron barrier layer 62.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a nitride semiconductor light emitting device. [Background technology]

[0002] Conventionally, nitride semiconductor light-emitting elements that emit blue light have been known (see, for example, Patent Document 1, etc.), but there is a demand for high-output, high-efficiency nitride semiconductor light-emitting elements that emit light with a shorter wavelength (i.e., light with a wavelength of 390 nm or less). Hereinafter, nitride semiconductor light-emitting elements that emit light with a wavelength of 390 nm or less are also referred to as short-wavelength nitride semiconductor light-emitting elements. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-335052 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a nitride semiconductor light-emitting element that emits blue light, for example, an InGaN-based material is used in the light guide layer. In contrast, in a short-wavelength nitride semiconductor light-emitting element, an AlGaN-based material with a larger band gap energy than InGaN is used in the light guide layer, so that the electrical resistance of the short-wavelength nitride semiconductor light-emitting element is larger than that of a nitride semiconductor light-emitting element that emits blue light. In addition, the activation rate of Mg added as an acceptor impurity to a p-type AlGaN layer decreases with an increase in the Al composition ratio, so that the injection efficiency of holes into the light-emitting layer decreases in a p-type AlGaN layer with a high Al composition ratio. If Mg is added close to the light-emitting layer to increase the injection efficiency of holes from the p-type AlGaN layer to the light-emitting layer, Mg is mixed into the light-emitting layer by thermal diffusion. As a result, the number of non-radiative recombination centers in the light-emitting layer increases, and the light-emitting efficiency decreases.

[0005] The present disclosure is devised to solve such problems, and has an object to provide a nitride semiconductor light-emitting element that can suppress the intrusion of Mg into the light-emitting layer due to thermal diffusion and increase the efficiency of hole injection into the light-emitting layer. [Means for solving the problem]

[0006] In order to solve the above problems, one aspect of the nitride semiconductor light-emitting device according to the present disclosure includes an n-side semiconductor layer, one or more light-emitting layers arranged above the n-side semiconductor layer, a first barrier layer arranged above the one or more light-emitting layers and containing Al, a second barrier layer arranged above the first barrier layer and containing Al, a p-side guide layer arranged above the second barrier layer and having a smaller Al composition ratio than the second barrier layer, an electron barrier layer arranged above the p-side guide layer, containing Mg and having a larger Al composition ratio than the second barrier layer, and a p-side semiconductor layer arranged above the electron barrier layer. Effect of the Invention

[0007] According to the present disclosure, it is possible to provide a nitride semiconductor light emitting device that can suppress the incorporation of Mg into the light emitting layer due to thermal diffusion and can increase the efficiency of hole injection into the light emitting layer. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a schematic side view showing the overall configuration of a nitride semiconductor light emitting device according to the first embodiment. [Diagram 2] FIG. 2 is a graph showing an outline of a band diagram of a conduction band in the growth direction of the nitride semiconductor light emitting device according to the first embodiment. [Diagram 3] FIG. 3 is a diagram illustrating a band diagram and lattice constants of a conduction band from the first barrier layer to the p-side guide layer according to the first embodiment. [Figure 4] FIG. 4 is a diagram showing a band diagram and lattice constants of a conduction band from a first barrier layer to a p-side guide layer according to a comparative example. [Diagram 5]FIG. 5 is a flowchart showing a flow of the method for manufacturing the nitride semiconductor light-emitting device according to the first embodiment. [Figure 6] FIG. 6 is a diagram showing the relationship between time, temperature, and supplied gas in the manufacturing process of the nitride semiconductor light-emitting device according to the first embodiment. [Figure 7] FIG. 7 is a graph showing an outline of the composition distribution in the stacking direction of the nitride semiconductor light emitting device according to the first embodiment. [Figure 8] FIG. 8 is a schematic side view showing an overall configuration of a nitride semiconductor light emitting device according to a modification of the first embodiment. [Figure 9] FIG. 9 is a schematic side view showing the overall configuration of the nitride semiconductor light emitting device according to the sixth embodiment. [Figure 10] FIG. 10 is a graph showing the Mg concentration distribution from the second barrier layer to the p-side cladding layer of the nitride semiconductor light emitting device according to the sixth embodiment. [Figure 11] FIG. 11 is a graph showing a first other example of the Mg concentration distribution from the second barrier layer to the p-side cladding layer in the nitride semiconductor light emitting device according to the sixth embodiment. [Figure 12] FIG. 12 is a graph showing a second other example of the Mg concentration distribution from the second barrier layer to the p-side cladding layer in the nitride semiconductor light emitting device according to the sixth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present disclosure. Therefore, the numerical values, shapes, materials, components, and the arrangement and connection forms of the components shown in the following embodiments are merely examples and are not intended to limit the present disclosure.

[0010] In addition, each figure is a schematic diagram and is not necessarily illustrated precisely. Therefore, the scales and the like are not necessarily the same in each figure. In addition, in each figure, the same reference numerals are given to substantially the same configurations, and duplicated explanations are omitted or simplified.

[0011] In addition, in this specification, the terms "upper" and "lower" refer to absolute spatial perception. Lead Directly above Method and lead Directly below Directions It does not refer to the upper or lower side of a stacking structure, but is used as a term that is defined by the relative positional relationship based on the stacking order in the stacking structure. In addition, the terms "upper" and "lower" are applied not only to the case where two components are arranged with a gap between them and another component is present between the two components, but also to the case where two components are arranged in contact with each other.

[0012] (Embodiment 1) A nitride semiconductor light emitting device according to a first embodiment will be described.

[0013] [1-1. Overall composition] First, the overall configuration of the nitride semiconductor light-emitting device according to the present embodiment will be described with reference to Figures 1 and 2. Figure 1 is a schematic side view showing the overall configuration of a nitride semiconductor light-emitting device 10 according to the present embodiment. Figure 2 is a graph showing an outline of a band diagram of a conduction band in the growth direction of the nitride semiconductor light-emitting device 10 according to the present embodiment. The horizontal and vertical axes of Figure 2 respectively indicate the position and energy in the stacking direction of the nitride semiconductor light-emitting device 10. On the horizontal axis of Figure 2, the direction from left to right corresponds to the direction from bottom to top in the stacking direction (i.e., the direction of crystal growth).

[0014] As shown in FIG. 1, the nitride semiconductor light-emitting element 10 according to this embodiment includes a substrate 20, an n-side semiconductor layer 30, a first n-side guide layer 41, a second n-side guide layer 42, a third barrier layer 53, a light-emitting layer 55, a first barrier layer 51, a second barrier layer 52, a p-side guide layer 61, an electron barrier layer 62, and a p-side semiconductor layer 70.

[0015] The substrate 20 is a plate-like member that serves as a base for the nitride semiconductor light-emitting device 10. In this embodiment, the substrate 20 is an n-type GaN substrate.

[0016] The n-side semiconductor layer 30 is a nitride semiconductor layer disposed above the substrate 20. In the present embodiment, the n-side semiconductor layer 30 is directly stacked on the upper main surface of the substrate 20. The n-side semiconductor layer 30 has an underlayer 31, a strain relaxation layer 32, a cap layer 33, and an n-side cladding layer 34.

[0017] The underlayer 31 is an n-type nitride semiconductor layer disposed above the substrate 20. In this embodiment, the underlayer 31 is an n-type Al 0.02 Ga 0.98 The base layer 31 is an N-layer. The base layer 31 is doped with Si as an impurity. The n-side semiconductor layer 30 does not necessarily have to include the base layer 31.

[0018] The strain relaxation layer 32 is an n-type nitride semiconductor layer disposed above the substrate 20. In this embodiment, the strain relaxation layer 32 is an n-type InN layer having a thickness of 0.2 μm disposed above the base layer 31. 0.03 Ga 0.97 The n-side semiconductor layer 30 is an N-layer. The strain relaxation layer 32 is doped with Si as an impurity. The n-side semiconductor layer 30 does not necessarily have to include the strain relaxation layer 32.

[0019] The cap layer 33 is an n-type nitride semiconductor layer disposed above the substrate 20. In this embodiment, the cap layer 33 is an n-type AlN layer having a thickness of 10 nm disposed above the strain relaxation layer 32. 0.08 Ga 0.92 The cap layer 33 is an N-layer. The cap layer 33 is doped with Si as an impurity. The n-side semiconductor layer 30 does not necessarily have to include the cap layer 33.

[0020] The n-side cladding layer 34 is an n-type nitride semiconductor layer disposed above the substrate 20. In this embodiment, the n-side cladding layer 34 is an n-type AlN layer having a thickness of 0.8 μm disposed above the cap layer 33. 0.08 Ga 0.92The n-side cladding layer 34 is an N layer. The n-side cladding layer 34 is doped with Si as an impurity. The n-side cladding layer 34 has a lower refractive index than the light emitting layer 55, the first barrier layer 51, the second barrier layer 52, and the third barrier layer 53. As a result, the n-side cladding layer 34 suppresses the light generated in the light emitting layer 55 from passing through the n-side cladding layer 34 and reaching the substrate 20. The n-side cladding layer 34 may be an AlInGaN layer or an AlInN layer. The n-side cladding layer 34 may be composed of one layer having a uniform composition, or may have multiple layers having different compositions. For example, the n-side cladding layer 34 may have a superlattice structure. Specifically, the n-side cladding layer 34 may have a configuration in which multiple AlGaN layers and multiple AlInGaN layers or multiple AlInN layers are alternately stacked. The n-side cladding layer 34 may have a configuration in which two types of AlGaN layers having different Al composition ratios are alternately stacked.

[0021] The first n-side guide layer 41 is a nitride semiconductor layer disposed above the n-side semiconductor layer 30. The first n-side guide layer 41 has a higher refractive index than the n-side cladding layer 34. In this embodiment, the first n-side guide layer 41 is an n-type Al 0.03 Ga 0.97 The first n-side guide layer 41 is an N layer. The first n-side guide layer 41 is doped with Si as an impurity.

[0022] The second n-side guide layer 42 is a nitride semiconductor layer disposed above the n-side semiconductor layer 30. The second n-side guide layer 42 has a higher refractive index than the n-side cladding layer 34. In this embodiment, the second n-side guide layer 42 is an undoped AlN layer having a thickness of 18 nm disposed above the first n-side guide layer 41. 0.02 Ga 0.98 The second n-side guide layer 42 is an N layer. The second n-side guide layer 42 may be doped with Si as an impurity.

[0023] The third barrier layer 53 is a nitride semiconductor layer disposed above the n-side semiconductor layer 30, and is also referred to as a lower barrier layer. The third barrier layer 53 is disposed at a position adjacent to the light emitting layer 55. In this embodiment, the third barrier layer 53 is a 5 nm-thick undoped Al layer disposed between the second n-side guide layer 42 and the light emitting layer 55. 0.05 Ga 0.95 This is the N layer.

[0024] The light emitting layer 55 is a nitride semiconductor layer disposed above the n-side semiconductor layer 30, and emits light. In this embodiment, the light emitting layer 55 is an undoped InN layer having a thickness of 10 nm disposed between the third barrier layer 53 and the first barrier layer 51. 0.01 Ga 0.99 The light emitting layer 55 is an N layer. The light emitting layer 55 generates light with a wavelength of 390 nm or less. Thus, the light emitting layer 55 contains In, and the emission wavelength of the nitride semiconductor light emitting element 10 is 390 nm or less. The emission wavelength of the nitride semiconductor light emitting element 10 may be 350 nm or more. In addition, the emission wavelength of the nitride semiconductor light emitting element 10 may be 365 nm or more and 385 nm or less.

[0025] The first barrier layer 51 is disposed above the light emitting layer 55, and is a nitride semiconductor layer containing Al, and is also referred to as an upper barrier layer. X1 Ga 1-X1 In this embodiment, the first barrier layer 51 is an undoped AlN layer having a thickness of 5 nm and disposed between the light emitting layer 55 and the second barrier layer 52. 0.05 Ga 0.95 The first barrier layer 51, the third barrier layer 53, and the light emitting layer 55 may form a quantum well structure.

[0026] The second barrier layer 52 is disposed above the first barrier layer 51 and is a nitride semiconductor layer containing Al, and is also called a diffusion suppression layer. An example of the composition of the second barrier layer 52 is Al x 1 + ... X2 Ga 1-X2It is represented by N. The Al composition ratio X2 of the second barrier layer 52 is larger than the Al composition ratio X1 of the first barrier layer 51. That is, the inequality X2>X1 holds. Thereby, as shown in FIG. 2, the bandgap energy of the second barrier layer 52 becomes larger than the bandgap energy of the first barrier layer 51. In the present embodiment, the second barrier layer 52 is an undoped AlGaN layer having a film thickness of 3 nm disposed between the second barrier layer 52 and the p-side guide layer 61. 0.07 Ga 0.93 N layer.

[0027] The second barrier layer 52 is thinner than the first barrier layer 51. Thereby, an increase in the electrical resistance in the second barrier layer 52 can be suppressed. In the present embodiment, the film thickness of the second barrier layer 52 may be 1 nm or more and 4 nm or less. Also, the Al composition ratio of the second barrier layer 52 may be 6% or more. Further, in order to suppress an increase in the electrical resistance in the second barrier layer 52, the Al composition ratio of the second barrier layer 52 may be 10% or less. Furthermore, the Al composition ratio X2 may satisfy the relationship of 0.01≦X2-X1≦0.06.

[0028] The p-side guide layer 61 is disposed above the second barrier layer 52 and is a nitride semiconductor layer having an Al composition ratio smaller than that of the second barrier layer 52. That is, the inequality Xpg<X2 holds between the Al composition ratio Xpg of the p-side guide layer 61 and the Al composition ratio X2 of the second barrier layer 52.

[0029] The p-side guide layer 61 has a higher refractive index than the p-side semiconductor layer 70. In the present embodiment, the p-side guide layer 61 is a p-type AlGaN layer having a film thickness of 50 nm disposed between the second barrier layer 52 and the electron barrier layer 62. 0.05 Ga 0.95N layer. The p-side guide layer 61 contains Mg as an impurity. In this embodiment, Mg is added in the growth process of the p-side guide layer 61. The average Mg concentration in the p-side guide layer 61 may be lower than the average Mg concentration in the electron barrier layer 62. For example, the average Mg concentration in the p-side guide layer 61 may be 1 / 10 or less of the average Mg concentration in the electron barrier layer 62. The Mg concentration in the p-side guide layer 61 near the interface far from the electron barrier layer 62 may be lower than the Mg concentration in the p-side guide layer 61 near the interface near the electron barrier layer 62. In other words, the Mg concentration in the p-side guide layer 61 near the interface near the light emitting layer 55 may be lower than the Mg concentration in the p-side guide layer 61 near the interface far from the light emitting layer 55. This can reduce the Mg concentration in the p-side guide layer 61 near the interface near the light emitting layer 55, and therefore the amount of Mg mixed into the light emitting layer 55 by thermal diffusion can be reduced. Therefore, an increase in non-radiative recombination centers in the light-emitting layer 55 can be suppressed, and therefore a decrease in luminous efficiency can be suppressed.

[0030] The electron barrier layer 62 is disposed above the p-side guide layer 61, and is a nitride semiconductor layer containing Mg and having a higher Al composition ratio than the second barrier layer 52. An example of the composition of the electron barrier layer 62 is Al 100 / 1000 with an Al composition ratio of Xe. Xe Ga 1-Xe N. The electron barrier layer 62 has a function of suppressing the movement of electrons that have passed through the light emitting layer 55 to the p-side semiconductor layer 70. This makes it possible to confine the electrons in the vicinity of the light emitting layer 55. In this embodiment, the electron barrier layer 62 is a p-type Al 2 O 3 layer having a thickness of 5 nm that is disposed between the p-side guide layer 61 and the p-side semiconductor layer 70. 0.36 Ga 0.64 The electron barrier layer 62 is an N layer. Mg is added to the electron barrier layer 62 as an impurity. The Al composition ratio Xe of the electron barrier layer 62 is larger than the Al composition ratio Xp of the p-side semiconductor layer 70. In other words, the inequality Xe>Xp holds. As a result, the band gap energy of the electron barrier layer 62 is larger than the band gap energy of the p-side semiconductor layer 70, as shown in FIG. 2.

[0031] The p-side semiconductor layer 70 is a nitride semiconductor layer disposed above the electron barrier layer 62. In this embodiment, the p-side semiconductor layer 70 has a p-side cladding layer 71 and a contact layer 72.

[0032] The p-side cladding layer 71 is a nitride semiconductor layer disposed above the electron barrier layer 62. In this embodiment, the p-side cladding layer 71 is a p-type AlN layer having a thickness of 0.5 μm disposed between the electron barrier layer 62 and the contact layer 72. 0.08 Ga 0.92 The p-side cladding layer 71 is an N layer. Mg is added to the p-side cladding layer 71 as an impurity. The p-side cladding layer 71 has a lower refractive index than the light emitting layer 55, the first barrier layer 51, the second barrier layer 52, and the third barrier layer 53. As a result, the p-side cladding layer 71 suppresses the light generated in the light emitting layer 55 from passing through the p-side cladding layer 71. The p-side cladding layer 71 may be an AlInGaN layer or an AlInN layer. The p-side cladding layer 71 may be composed of one layer having a uniform composition, or may have multiple layers having different compositions. For example, the p-side cladding layer 71 may have a superlattice structure. Specifically, the p-side cladding layer 71 may have a configuration in which multiple AlGaN layers and multiple AlInGaN layers or multiple AlInN layers are alternately stacked. The p-side cladding layer 71 may have a configuration in which two types of AlGaN layers having different Al composition ratios are alternately stacked.

[0033] The contact layer 72 is a nitride semiconductor layer disposed above the p-side cladding layer 71. A conductive film is disposed on the contact layer 72, and the contact layer 72 is in ohmic contact with the conductive film. In this embodiment, the contact layer 72 is a p-type GaN layer having a thickness of 10 nm. The contact layer 72 may also contain Al. The Al composition ratio of the contact layer 72 is smaller than the Al composition ratio of the p-side cladding layer 71. The contact layer 72 is, for example, Al 0.02 Ga 0.98 N layers may also be used.

[0034] 1 and the like, the nitride semiconductor light emitting device 10 may have an n-side electrode formed on the main surface below the substrate 20 (i.e., of the main surfaces of the nitride semiconductor light emitting device 10, the main surface on the back side of the main surface on which the n-side semiconductor layer 30 is laminated). In addition, a p-side electrode may be formed above the contact layer 72.

[0035] [1-2. Effects] Next, the effect of the nitride semiconductor light emitting device 10 according to the present embodiment will be described with reference to FIG. 3. FIGS. 3 and 4 are diagrams each showing a band diagram and a lattice constant of the conduction band from the first barrier layer 51 to the p-side guide layer 61 according to the present embodiment and the comparative example, respectively. The graphs (a) in FIGS. 3 and 4 are graphs showing an outline of the band diagram of the conduction band in the growth direction. The schematic diagrams (b) in FIGS. 3 and 4 are diagrams showing the lattice constant of each layer and the stress generated in each layer. In each schematic diagram (b), the size (width) of the lattice represents the size of the lattice constant of each layer, and the solid arrow indicates the direction of the stress. In each schematic diagram (b), the range of movement of Mg due to thermal diffusion is also shown by the dashed arrow. The nitride semiconductor light emitting device of the comparative example shown in FIG. 4 is different from the nitride semiconductor light emitting device 10 according to the present embodiment in that it does not include the second barrier layer 52, and is the same in other respects.

[0036] As shown in FIG. 4, in a nitride semiconductor light-emitting device not including the second barrier layer 52, the first barrier layer 51 and the p-side guide layer 61 have the same Al composition ratio and band gap energy, and therefore the lattice constants of the first barrier layer 51 and the p-side guide layer 61 are equal. Therefore, no stress due to the difference in lattice constants between the first barrier layer 51 and the p-side guide layer 61 occurs near the interface between the first barrier layer 51 and the p-side guide layer 61. Therefore, Mg contained in the p-side guide layer 61 moves to the first barrier layer 51 by thermal diffusion. Moreover, the Mg that has moved to the first barrier layer 51 further moves to the light-emitting layer 55 disposed below the first barrier layer 51 by thermal diffusion. Therefore, the number of non-radiative recombination centers in the light-emitting layer 55 increases, and the light-emitting efficiency decreases.

[0037] On the other hand, the nitride semiconductor light emitting device 10 according to this embodiment includes a second barrier layer 52 between the p-side guide layer 61 and the first barrier layer 51, the second barrier layer 52 having a larger Al composition ratio and band gap energy than the p-side guide layer 61 and the first barrier layer 51. In this case, as shown in the schematic diagram (b) of FIG. 3, the second barrier layer 52 has a smaller lattice constant than the p-side guide layer 61 and the first barrier layer 51. Therefore, stress is generated near the interface between the p-side guide layer 61 and the second barrier layer 52. Compressive stress is generated near the interface between the p-side guide layer 61 and the second barrier layer 52, and tensile stress is generated near the interface between the second barrier layer 52 and the p-side guide layer 61. Moreover, tensile stress is generated near the interface between the second barrier layer 52 and the first barrier layer 51, and compressive stress is generated near the interface between the first barrier layer 51 and the second barrier layer 52.

[0038] In this case, it is generally known that, viewed from the Mg contained in the p-side guide layer 61, diffusion of Mg is suppressed in a region where a compressive stress region and a tensile stress region are arranged in this order, such as near the interface (hetero interface) between the p-side guide layer 61 and the second barrier layer 52. As a result, in the nitride semiconductor light emitting device 10 according to this embodiment, it is possible to suppress the migration of Mg contained in the p-side guide layer 61 to the first barrier layer 51 and the light emitting layer 55 due to thermal diffusion. Therefore, it is possible to suppress an increase in non-radiative recombination centers in the light emitting layer 55, and therefore a decrease in light emission efficiency can be suppressed.

[0039] In the above comparative example, the first barrier layer 51 and the p-side guide layer 61 have the same Al composition ratio and band gap energy, but even if the first barrier layer 51 has a smaller Al composition ratio and band gap energy than the p-side guide layer 61, Mg moves from the p-side guide layer 61 to the first barrier layer 51 and the light-emitting layer 55 by thermal diffusion. That is, viewed from the perspective of Mg contained in the p-side guide layer 61, in the region where the tensile stress region and the compressive stress region are arranged in this order, the diffusion of Mg is not suppressed.

[0040] Furthermore, since the second barrier layer 52 of the nitride semiconductor light-emitting device 10 according to this embodiment is thinner than the first barrier layer 51, the distance between the p-side guide layer 61 containing Mg and the light-emitting layer 55 can be reduced. That is, Mg can be added up to the vicinity of the light-emitting layer 55. This can improve the efficiency of hole injection into the light-emitting layer 55. Furthermore, by making the second barrier layer 52 thinner, an increase in the electrical resistance of the second barrier layer 52 can be suppressed. This can reduce the series resistance of the nitride semiconductor light-emitting device 10.

[0041] As described above, according to the nitride semiconductor light emitting device 10 of this embodiment, the incorporation of Mg into the light emitting layer 55 due to thermal diffusion can be suppressed, and the efficiency of hole injection into the light emitting layer 55 can be increased.

[0042] [1-3. Manufacturing method] Next, an example of a method for manufacturing the nitride semiconductor light-emitting element 10 according to this embodiment will be described with reference to Fig. 5 and Fig. 6. Fig. 5 is a flowchart showing the flow of a method for manufacturing the nitride semiconductor light-emitting element 10 according to this embodiment. Fig. 6 is a diagram showing the relationship between time, temperature, and supplied gas in the manufacturing process of the nitride semiconductor light-emitting element 10 according to this embodiment.

[0043] As shown in Fig. 5, first, a substrate 20 is prepared (S20), and the substrate 20 is set in a crystal growth apparatus. In this embodiment, a GaN substrate is prepared as the substrate 20. In this embodiment, a MOCVD (Metalorganic Chemical Vapor Deposition) apparatus is used as the crystal growth apparatus. Next, NH 3 and H 2 is supplied to raise the temperature of the substrate 20 to 1150° C. (see the period from time t0 to time t1 in FIG. 6).

[0044] Next, the n-side semiconductor layer 30 is formed (S30). In the n-side semiconductor layer 30, the underlayer 31 is formed first (S31). In this embodiment, TMG (trimethylgallium), TMA (trimethylaluminum), and SiH 4By supplying the above, a 1.5 μm thick n-type Al film was formed on the substrate 20. 0.02 Ga 0.98 An underlayer 31 made of N is grown (see time t1 to time t2 in FIG. 6). Next, a strain relaxation layer 32 is formed (S32). Specifically, after the formation of the underlayer 31 is completed, TMG, TMA, SiH 4 , and H 2 The supply of N 2 The supply of TMG, TMI (trimethylindium), and SiH is then started. The temperature of the substrate 20 is lowered to 850° C. (see the period from time t2 to time t3 in FIG. 6). Then, TMG, TMI, and SiH 4 By supplying the n-type In layer 31 with a thickness of 0.2 μm, 0.03 Ga 0.97 A strain relaxation layer 32 made of N is grown (see time t3 to time t4 in FIG. 6). Next, a cap layer 33 is formed (S33). Specifically, after the formation of the strain relaxation layer 32 is completed, the supply of TMI is stopped and the supply of TMA is started, so that an n-type AlN layer having a thickness of 10 nm is formed on the strain relaxation layer 32. 0.08 Ga 0.92 A cap layer 33 made of N is grown (see time t4 to time t5 in FIG. 6). Next, an n-side cladding layer 34 is formed (S34). Specifically, after the formation of the cap layer 33 is completed, TMG, TMA, SiH 4 , N 2 The supply of H 2 The supply of TMG, TMA, and SiH is started. The temperature of the substrate 20 is also increased to 1150° C. (see time t5 to time t6 in FIG. 6). Then, TMG, TMA, and SiH 4 By supplying the n-type Al 0.08 Ga 0.92 An n-side cladding layer 34 made of N is grown (see time t6 to time t7 in FIG. 6).

[0045] Next, the first n-side guide layer 41 is formed (S41). Specifically, the amount of TMA supplied to the crystal growth apparatus is reduced, and a 0.12 μm-thick n-type Al 0.03 Ga 0.97The first n-side guide layer 41 made of N is grown (see time t7 to time t8 in FIG. 6).

[0046] Next, the second n-side guide layer 42 is formed (S42). Specifically, the amount of TMA supplied to the crystal growth apparatus is further reduced, and SiH 4 The supply of oxygen was stopped, and an undoped Al layer having a thickness of 18 nm was deposited on the first n-side guide layer 41. 0.02 Ga 0.98 Consists of N Second n-side guide layer 42 is grown (see time t8 to time t9 in FIG. 6).

[0047] Next, the third barrier layer 53 is formed (S51). 2 Stop the supply of N 2 The supply of TMG and TMA is started. The temperature of the substrate 20 is lowered to 950° C. (see the period from time t9 to time t10 in FIG. 6). Next, TMG and TMA are supplied into the crystal growth apparatus to grow an undoped Al layer having a thickness of 5 nm on the second n-side guide layer 42. 0.05 Ga 0.95 A third barrier layer 53 made of N is grown (see time t10 to time t11 in FIG. 6).

[0048] Next, the light-emitting layer 55 is formed (S52). Specifically, the supply of TMA to the crystal growth apparatus is stopped, and the supply of TMI is started, so that an undoped In layer having a thickness of 10 nm is formed on the third barrier layer 53. 0.01 Ga 0.99 A light emitting layer 55 made of N is grown (see time t11 to time t12 in FIG. 6).

[0049] Next, the first barrier layer 51 is formed (S53). Specifically, the supply of TMI to the crystal growth apparatus is stopped, and the supply of TMA is started, so that an undoped Al layer having a thickness of 5 nm is formed on the light-emitting layer 55. 0.05 Ga 0.95 A first barrier layer 51 made of N is grown (see time t12 to time t13 in FIG. 6).

[0050] Next, the second barrier layer 52 is formed (S54). Specifically, the amount of TMA supplied to the crystal growth apparatus is increased, and the temperature of the substrate 20 is raised to 1000° C. while a 3 nm-thick undoped Al layer is grown on the first barrier layer 51. 0.07 Ga 0.93 A second barrier layer 52 made of N is grown (see time t13 to time t14 in FIG. 6).

[0051] Next, the p-side guide layer 61 is formed (S61). Specifically, the supply of TMG and TMA to the crystal growth apparatus is stopped. 2 The supply of H 2 The supply of TMG, TMA, and Cp 2 By starting the supply of Mg, a p-type Al layer having a thickness of 50 nm is formed on the second barrier layer 52. 0.05 Ga 0.95 A p-side guide layer 61 made of N is grown (see time t14 to time t15 in FIG. 6).

[0052] Next, the electron barrier layer 62 is formed (S62). Specifically, the amount of TMA supplied to the crystal growth apparatus is increased to form a p-type Al layer 62 having a thickness of 5 nm on the p-side guide layer 61. 0.36 Ga 0.64 An electron barrier layer 62 made of N is grown (see time t15 to time t16 in FIG. 6).

[0053] Next, the p-side semiconductor layer 70 is formed (S70). In the p-side semiconductor layer 70, the p-side cladding layer 71 is formed first (S71). Specifically, the amount of TMA supplied to the crystal growth apparatus is reduced to form a p-type Al layer 71 having a thickness of 0.5 μm on the electron barrier layer 62. 0.08 Ga 0.92 A p-side cladding layer 71 made of N is grown (see time t16 to time t17 in FIG. 6). Next, a contact layer 72 is formed (S72). Specifically, the supply of TMA to the crystal growth apparatus is stopped, and Cp 2 By increasing the supply of Mg, a contact layer 72 made of p-type GaN having a thickness of 10 nm is grown on the p-side cladding layer 71 (see time t17 to time t18 in FIG. 6). 3 and H2 While supplying the gas, the temperature of the substrate 20 is lowered to room temperature (see time t18 to time t19 in FIG. 6), and then the substrate 20 on which the semiconductor layers are laminated is taken out from the crystal growth apparatus.

[0054] In this manner, the nitride semiconductor light emitting device 10 according to the present embodiment can be manufactured.

[0055] It should be noted that the method for manufacturing the nitride semiconductor light emitting device 10 according to the present embodiment is not limited to this. For example, although a GaN substrate is prepared as the substrate 20, other nitride semiconductor substrates such as an AlGaN substrate may also be prepared.

[0056] In addition, when the strain relaxation layer 32 is formed, TMA is also supplied to the crystal growth apparatus, so that n-type In 0.03 Al 0.02 Ga 0.95 The strain relaxation layer 32 may be made of N.

[0057] In addition, when the light-emitting layer 55 is formed, TMA is also supplied to the crystal growth apparatus, so that the undoped In 0.01 Al 0.02 Ga 0.97 The light emitting layer 55 may be made of N.

[0058] Furthermore, the formation of the cap layer 33 of the nitride semiconductor light emitting device 10 may be omitted. In this case, after the formation of the strain relaxation layer 32, the TMG, TMA, SiH 4 , and N 2 The supply of H2 is stopped and the supply of H2 is started. Next, the temperature of the substrate 20 is raised to 1150° C., and then the n-side cladding layer 34 is formed in the same manner as in the above manufacturing method.

[0059] In the above manufacturing method, the second barrier layer 52 is formed while the temperature of the substrate 20 is being increased. However, the temperature of the substrate 20 may be increased after the second barrier layer 52 is formed, or the second barrier layer 52 may be formed after the temperature of the substrate 20 is increased. Specifically, after the formation of the first barrier layer 51, the amount of TMA supplied to the crystal growth apparatus is increased to form an undoped Al layer having a thickness of 3 nm. 0.07 Ga0.93 Alternatively, the second barrier layer 52 made of N may be formed, and then the temperature of the substrate 20 may be raised to 1000° C. Alternatively, after the formation of the first barrier layer 51, TMG, TMA, and N may be introduced into the crystal growth apparatus. 2 The supply of H 2 Then, after the temperature of the substrate 20 is raised to 1000° C., TMG and TMA are supplied to the crystal growth apparatus to grow an undoped Al film having a thickness of 3 nm. 0.07 Ga 0.93 A second barrier layer 52 made of N may be formed.

[0060] Moreover, the temperatures of the substrate 20 in the manufacturing method described above are merely examples, and the temperatures of the substrate 20 in the manufacturing method of the nitride semiconductor light emitting device 10 according to this embodiment are not limited to the above temperatures.

[0061] [1-4. Composition distribution] Next, the composition distribution in the stacking direction of the nitride semiconductor light-emitting element 10 according to this embodiment will be described with reference to Fig. 7. Fig. 7 is a graph showing an overview of the composition distribution in the stacking direction of the nitride semiconductor light-emitting element 10 according to this embodiment. Fig. 7 shows the secondary ion intensity corresponding to Al and In and the Mg concentration measured using secondary ion mass spectrometry (SIMS). The horizontal axis of Fig. 7 indicates the position in the stacking direction of the nitride semiconductor light-emitting element 10, the vertical axis on the left side indicates the secondary ion intensity, and the vertical axis on the right side indicates the concentration. The secondary ion intensity corresponds to the composition ratio of Al and In.

[0062] 7, the position where the secondary ion intensity of In is maximum corresponds to the light emitting layer 55, and the position where the secondary ion intensity of Al and the Mg concentration are maximum corresponds to the electron barrier layer 62. In this embodiment, the average Mg concentration in the electron barrier layer 62 is 1×10 19 [cm -3 The average Mg concentration in the p-side guide layer 61 is about 1×10 17 [cm -3 ] or more 3×10 18 [cm -3 The average Mg concentration in the p-side cladding layer 71 is about 8×1018 [cm -3 The average Mg concentration in the first barrier layer 51 and the second barrier layer 52 is lower than the average Mg concentration in the p-side guide layer 61 and is less than 1 / 10 of the average Mg concentration in the p-side cladding layer 71.

[0063] As described above, in the nitride semiconductor light emitting device 10 according to the present embodiment, the second barrier layer 52 can suppress the movement of Mg from the p-side guide layer 61 to the first barrier layer 51 due to thermal diffusion.

[0064] (Modification of the first embodiment) A nitride semiconductor light-emitting device according to a modification of embodiment 1 will be described. The nitride semiconductor light-emitting device according to this modification differs from the nitride semiconductor light-emitting device 10 according to embodiment 1 in that it includes a plurality of light-emitting layers. The nitride semiconductor light-emitting device according to this modification will be described below with reference to FIG. 8, focusing on the differences from the nitride semiconductor light-emitting device 10 according to embodiment 1.

[0065] Fig. 8 is a schematic side view showing the overall configuration of the nitride semiconductor light emitting device 10a according to this modification. As shown in Fig. 8, the nitride semiconductor light emitting device 10a according to this modification includes a substrate 20, an n-side semiconductor layer 30, a first n-side guide layer 41, a second n-side guide layer 42, a third barrier layer 53, light emitting layers 55a, 55b, and 55c, fourth barrier layers 54a and 54b, a first barrier layer 51, a second barrier layer 52, a p-side guide layer 61, an electron barrier layer 62, and a p-side semiconductor layer 70.

[0066] The light emitting layers 55a to 55c are nitride semiconductor layers disposed above the n-side semiconductor layer 30, and emit light. The light emitting layer 55a is an undoped InN layer having a thickness of 5 nm disposed between the third barrier layer 53 and the fourth barrier layer 54a. 0.01 Ga 0.99 The light-emitting layer 55b is an undoped InN layer having a thickness of 5 nm and disposed between the fourth barrier layer 54a and the fourth barrier layer 54b. 0.01 Ga 0.99The light-emitting layer 55c is an undoped InN layer having a thickness of 5 nm and disposed between the fourth barrier layer 54b and the first barrier layer 51. 0.01 Ga 0.99 This is the N layer.

[0067] The fourth barrier layers 54a and 54b are nitride semiconductor layers disposed above the n-side semiconductor layer 30, and are also referred to as intermediate barrier layers. Each of the fourth barrier layers 54a and 54b is disposed between two adjacent light-emitting layers among the light-emitting layers 55a to 55c. In this modification, the fourth barrier layer 54a is disposed between the light-emitting layers 55a and 55b, and has a thickness of 3 nm undoped Al 0.03 Ga 0.97 The fourth barrier layer 54b is disposed between the light emitting layer 55b and the light emitting layer 55c. 3 nm undoped Al 0.03 Ga 0.97 This is the N layer.

[0068] In this modification, the light emitting layers 55a to 55c, the first barrier layer 51, the third barrier layer 53, and the fourth barrier layers 54a and 54b form a multiple quantum well structure.

[0069] The nitride semiconductor light emitting device 10a having the above-mentioned configuration also exhibits effects similar to those of the nitride semiconductor light emitting device 10 according to the first embodiment.

[0070] Next, a method for manufacturing the nitride semiconductor light emitting device 10a according to this modified example will be described.

[0071] The light emitting layers 55a to 55c are formed in the same manner as the light emitting layer 55 according to the first embodiment. The fourth barrier layers 54a and 54b are formed in the same manner as the first barrier layer 51 according to the first embodiment.

[0072] Specifically, similarly to the nitride semiconductor light-emitting device 10 according to the first embodiment, each layer from the n-side semiconductor layer 30 to the third barrier layer 53 is formed. Next, the supply of TMA to the crystal growth apparatus when forming the third barrier layer 53 is stopped, and the supply of TMI is started, thereby depositing an undoped In layer having a thickness of 5 nm on the third barrier layer 53. 0.01 Ga 0.99 An emission layer 55a made of N is grown.

[0073] Next, the supply of TMI to the crystal growth apparatus was stopped, and the supply of TMA was started, so that an undoped Al layer having a thickness of 3 nm was formed on the light-emitting layer 55a. 0.03 Ga 0.97 A fourth barrier layer 54a made of N is grown.

[0074] Next, the supply of TMA to the crystal growth apparatus was stopped, and the supply of TMI was started, so that an undoped In layer having a thickness of 5 nm was formed on the fourth barrier layer 54a. 0.01 Ga 0.99 The light emitting layer 55b made of N is grown.

[0075] Next, the supply of TMI to the crystal growth apparatus was stopped, and the supply of TMA was started, so that an undoped Al layer having a thickness of 3 nm was formed on the light-emitting layer 55b. 0.03 Ga 0.97 A fourth barrier layer 54b made of N is grown.

[0076] Next, the supply of TMA to the crystal growth apparatus was stopped, and the supply of TMI was started, so that an undoped In layer having a thickness of 5 nm was formed on the fourth barrier layer 54b. 0.01 Ga 0.99 An emission layer 55c made of N is grown.

[0077] Thereafter, the first barrier layer 51 and the like are formed in the same manner as in the nitride semiconductor light emitting device 10 according to the first embodiment, whereby the nitride semiconductor light emitting device 10a according to this modification can be manufactured.

[0078] When the light-emitting layers 55a to 55c are formed, TMA is also supplied to the crystal growth apparatus to form undoped In. 0.01 Al 0.02Ga 0.97 The light emitting layers 55a to 55c may be made of N.

[0079] (Embodiment 2) A nitride semiconductor light-emitting device according to embodiment 2 will be described. The nitride semiconductor light-emitting device according to this embodiment differs from the nitride semiconductor light-emitting device 10 according to embodiment 1 in the composition of the p-side guide layer. The nitride semiconductor light-emitting device according to this embodiment will be described below, focusing on the differences from the nitride semiconductor light-emitting device 10 according to embodiment 1.

[0080] The nitride semiconductor light-emitting device according to this embodiment has the same configuration as the nitride semiconductor light-emitting device 10 according to the first embodiment, except for the composition of the p-side guide layer. In the nitride semiconductor light-emitting device 10 according to the first embodiment, the Al composition ratio of the p-side guide layer 61 is equal to the Al composition ratio of the first barrier layer 51, but in the nitride semiconductor light-emitting device according to this embodiment, the Al composition ratio of the p-side guide layer is different from the Al composition ratio of the first barrier layer. The p-side guide layer according to this embodiment is a 50 nm-thick p-type Al 0.06 Ga 0.94 N layer. In this way, the Al composition ratio of the p-side guide layer only needs to be smaller than the Al composition ratio of the second barrier layer, and may be different from the Al composition ratio of the first barrier layer.

[0081] In this manner, even in a nitride semiconductor light emitting device in which the Al composition ratio of the p-side guide layer and the Al composition ratio of the first barrier layer 51 differ from each other, the same effects as those of the nitride semiconductor light emitting device 10 according to the first embodiment are achieved.

[0082] In the above, an example has been shown in which the Al composition ratio of the p-side guide layer is larger than that of the first barrier layer 51, but the Al composition ratio of the p-side guide layer may be smaller than that of the first barrier layer 51. The p-side guide layer is, for example, a p-type Al 0.04 Ga 0.96 It may be N layers.

[0083] (Embodiment 3) A nitride semiconductor light-emitting device according to embodiment 3 will be described. The nitride semiconductor light-emitting device according to this embodiment differs from the nitride semiconductor light-emitting device 10 according to embodiment 1 in the configuration of the second barrier layer. The nitride semiconductor light-emitting device according to this embodiment will be described below, focusing on the differences from the nitride semiconductor light-emitting device 10 according to embodiment 1.

[0084] The nitride semiconductor light emitting device according to the present embodiment has the same configuration as the nitride semiconductor light emitting device 10 according to the first embodiment, except for the configuration of the second barrier layer.

[0085] The second barrier layer in this embodiment is an undoped Al layer having a thickness of 1 nm. 0.10 Ga 0.90 N layer. Thus, the Al composition ratio of the second barrier layer is not limited to the Al composition ratio (0.07) of the second barrier layer 52 according to the first embodiment. When the second barrier layer according to the present embodiment has a larger A composition ratio than the second barrier layer 52 according to the first embodiment, the film thickness may be smaller than that of the second barrier layer 52 according to the first embodiment. This makes it possible to suppress an increase in the electrical resistance in the second barrier layer.

[0086] The nitride semiconductor light emitting device according to the present embodiment having the above-mentioned configuration also exhibits the same effects as the nitride semiconductor light emitting device 10 according to the first embodiment.

[0087] (Embodiment 4) A nitride semiconductor light-emitting device according to embodiment 4 will be described. The nitride semiconductor light-emitting device according to this embodiment differs from the nitride semiconductor light-emitting device 10 according to embodiment 1 in the configuration of the p-side guide layer. The nitride semiconductor light-emitting device according to this embodiment will be described below, focusing on the differences from the nitride semiconductor light-emitting device 10 according to embodiment 1.

[0088] The nitride semiconductor light emitting device according to the present embodiment has the same configuration as the nitride semiconductor light emitting device 10 according to the first embodiment, except for the configuration of the p-side guide layer.

[0089] The p-side guide layer according to this embodiment is a p-type AlN layer having a thickness of 50 nm, similar to the p-side guide layer 61 according to the first embodiment. 0.05 Ga 0.95 The p-side guide layer according to the present embodiment is different from the p-side guide layer 61 according to the first embodiment in the method of formation. In the present embodiment, the p-side guide layer is grown using Cp 2 Mg is supplied to the p-side guide layer by thermal diffusion from the electron barrier layer without supplying a gas containing Mg such as Mg. This makes it possible to form a p-side guide layer having an average Mg concentration lower than that of the electron barrier layer. 1 Similarly to the p-side guide layer 61 according to the above, the Mg concentration in the p-side guide layer near the interface farther from the electron barrier layer is lower than the Mg concentration in the p-side guide layer near the interface closer to the electron barrier layer. The average Mg concentration in the p-side guide layer may be, for example, less than 1 / 10 of the average Mg concentration in the electron barrier layer.

[0090] The nitride semiconductor light emitting device according to the present embodiment having the above-mentioned configuration also exhibits the same effects as the nitride semiconductor light emitting device 10 according to the first embodiment.

[0091] (Embodiment 5) A nitride semiconductor light-emitting device according to embodiment 5 will be described. The nitride semiconductor light-emitting device according to this embodiment differs from the nitride semiconductor light-emitting device 10 according to embodiment 1 in the configuration of the second barrier layer. The nitride semiconductor light-emitting device according to this embodiment will be described below, focusing on the differences from the nitride semiconductor light-emitting device 10 according to embodiment 1.

[0092] The nitride semiconductor light emitting device according to the present embodiment has the same configuration as the nitride semiconductor light emitting device 10 according to the first embodiment, except for the configuration of the second barrier layer.

[0093] The second barrier layer according to the present embodiment is made of Al X2 Ga 1-X2N layer. In the second barrier layer according to this embodiment, the Al composition ratio is not uniform. The Al composition ratio X2 of the second barrier layer according to this embodiment increases as it approaches the p-side guide layer. In this embodiment, the Al composition ratio X2 in the vicinity of the interface of the second barrier layer farther from the p-side guide layer is 0.05 (5%), and the Al composition ratio X2 in the vicinity of the interface closer to the p-side guide layer is 0.07 (7%). The Al composition ratio X2 of the second barrier layer may change at a uniform rate of change with respect to the position in the stacking direction, or may change in a step-like manner. In addition, the configuration of the second barrier layer is not limited to a configuration in which the Al composition ratio X2 is not uniform throughout the second barrier layer, and only the Al composition ratio X2 of a portion of the second barrier layer may be non-uniform. That is, the second barrier layer may include a region in which the Al composition ratio X2 is not uniform. For example, the second barrier layer may include a region in which the Al composition ratio X2 increases as it approaches the p-side guide layer.

[0094] The nitride semiconductor light emitting device according to the present embodiment having the above-mentioned configuration also exhibits the same effects as the nitride semiconductor light emitting device 10 according to the first embodiment.

[0095] (Embodiment 6) A nitride semiconductor light-emitting device according to embodiment 6 will be described. The nitride semiconductor light-emitting device according to this embodiment differs from the nitride semiconductor light-emitting device 10 according to embodiment 1 in the Mg concentration distribution in the p-side guide layer. The nitride semiconductor light-emitting device according to this embodiment will be described below with reference to Figs. 9 and 10, focusing on the differences from the nitride semiconductor light-emitting device 10 according to embodiment 1.

[0096] Fig. 9 is a schematic side view showing the overall configuration of the nitride semiconductor light-emitting device 110 according to this embodiment. Fig. 10 is a graph showing the Mg concentration distribution from the second barrier layer 52 to the p-side cladding layer 71 of the nitride semiconductor light-emitting device 110 according to this embodiment. The horizontal axis of Fig. 10 represents the position in the stacking direction of the nitride semiconductor light-emitting device 110, and the vertical axis represents the Mg concentration.

[0097] As shown in FIG. 9, the nitride semiconductor light-emitting element 110 according to this embodiment includes a substrate 20, an n-side semiconductor layer 30, a first n-side guide layer 41, a second n-side guide layer 42, a third barrier layer 53, a light-emitting layer 55, a first barrier layer 51, a second barrier layer 52, a p-side guide layer 161, an electron barrier layer 62, and a p-side semiconductor layer 70.

[0098] The p-side guide layer 161 according to the present embodiment is a p-type Al layer having a thickness of 50 nm, similar to the p-side guide layer 61 according to the first embodiment. 0.05 Ga 0.95 The p-side guide layer 161 is an N layer, and the average Mg concentration in the p-side guide layer 161 is lower than the average Mg concentration in the electron barrier layer 62 .

[0099] The p-side guide layer 161 according to the present embodiment differs from the p-side guide layer 61 according to the first embodiment in the Mg concentration distribution. The Mg concentration of the p-side guide layer 161 according to the present embodiment is uniform in the stacking direction, as shown in FIG. 10. Here, a configuration with a uniform Mg concentration is not limited to a configuration in which Mg is distributed completely uniformly in the p-side guide layer 161, but also includes a configuration in which Mg is substantially uniform. For example, a configuration with a uniform Mg concentration may include a configuration in which the fluctuation range of the Mg concentration is less than 10% of the average Mg concentration of the p-side guide layer 161.

[0100] The nitride semiconductor light emitting device 110 according to this embodiment having the above-mentioned configuration also exhibits the same effects as the nitride semiconductor light emitting device 10 according to the first embodiment.

[0101] The Mg concentration distribution in the p-side guide layer 161 is not limited to the above example. Other examples of the Mg concentration distribution in the p-side guide layer 161 will be described below with reference to Fig. 11 and Fig. 12. Fig. 11 and Fig. 12 are graphs showing other examples of the Mg concentration distribution from the second barrier layer 52 to the p-side cladding layer 71 of the nitride semiconductor light emitting device 110 according to this embodiment.

[0102] As shown in FIG. 11, the Mg concentration of the p-side guide layer 161 may increase stepwise toward the electron barrier layer 62.

[0103] 12, the Mg concentration in the vicinity of the interface of the p-side guide layer 161 away from the electron barrier layer 62 may be higher than the Mg concentration in the vicinity of the interface closer to the electron barrier layer 62. In the example shown in FIG. 12, the Mg concentration in the p-side guide layer 161 decreases stepwise toward the electron barrier layer 62.

[0104] The nitride semiconductor light emitting device 110 including the p-side guide layer 161 having the Mg concentration distribution as shown in FIGS. 11 and 12 also exerts effects similar to those of the nitride semiconductor light emitting device 10 according to the first embodiment.

[0105] (Variations, etc.) Although the nitride semiconductor light emitting device according to the present disclosure has been described based on each embodiment, the present disclosure is not limited to the above-described embodiments.

[0106] For example, the nitride semiconductor light emitting devices according to the above-described embodiments and modifications include the underlayer 31, the strain relaxation layer 32, and the cap layer 33, but none of these layers are essential components. The nitride semiconductor light emitting device according to the present disclosure does not need to include at least one of these layers.

[0107] Furthermore, the nitride semiconductor light-emitting element according to each of the above embodiments and modifications may be a semiconductor laser element having an optical resonator, a light-emitting diode not having an optical resonator, or a superluminescent diode.

[0108] In addition, the present disclosure also includes forms obtained by applying various modifications to the above-described embodiments that a person skilled in the art may conceive, and forms realized by arbitrarily combining the components and functions of the above-described embodiments within the scope that does not deviate from the spirit of the present disclosure. [Industrial Applicability]

[0109] The nitride semiconductor light emitting element according to the present disclosure can be applied to light sources for various applications, such as a high-output, highly efficient short-wavelength light source for exposure. [Explanation of symbols]

[0110] 10, 10a, 110 Nitride semiconductor light emitting device 20 Substrate 30 n-side semiconductor layer 31 Base layer 32 Strain relaxation layer 33 Cap Layer 34 n-side cladding layer 41 1st n-side guide layer 42 2nd n-side guide layer 51 First Barrier Layer 52 Second Barrier Layer 53 Third Barrier Layer 54a, 54b Fourth barrier layer 55, 55a, 55b, 55c Light-emitting layer 61, 161 p-side guide layer 62 Electron Barrier Layer 70 p-side semiconductor layer 71 p-side cladding layer 72 Contact layer

Claims

1. An n-side semiconductor layer; one or more light emitting layers disposed above the n-side semiconductor layer; a first barrier layer disposed above the one or more light emitting layers and comprising Al; a second barrier layer disposed above the first barrier layer and including Al; a p-side guide layer disposed above the second barrier layer and having an Al composition ratio smaller than that of the second barrier layer; an electron barrier layer disposed above the p-side guide layer, containing Mg and having a higher Al composition ratio than the second barrier layer; a p-side semiconductor layer disposed above the electron barrier layer; The average Mg concentration in the p-side guide layer is lower than the average Mg concentration in the electron barrier layer. Nitride semiconductor light emitting element.

2. The Mg concentration in the p-side guide layer near the interface closer to the second barrier layer is lower than the Mg concentration in the p-side guide layer near the interface farther from the second barrier layer. The nitride semiconductor light emitting device according to claim 1 .

3. An n-side semiconductor layer; one or more light emitting layers disposed above the n-side semiconductor layer; a first barrier layer disposed above the one or more light emitting layers and comprising Al; a second barrier layer disposed above the first barrier layer and including Al; a p-side guide layer disposed above the second barrier layer and having an Al composition ratio smaller than that of the second barrier layer; an electron barrier layer disposed above the p-side guide layer, containing Mg and having a higher Al composition ratio than the second barrier layer; a p-side semiconductor layer disposed above the electron barrier layer; The Mg concentration in the p-side guide layer near the interface closer to the second barrier layer is lower than the Mg concentration in the p-side guide layer near the interface farther from the second barrier layer. Nitride semiconductor light emitting element.

4. The average Mg concentration in the p-side guide layer is lower than the average Mg concentration in the electron barrier layer. The nitride semiconductor light emitting device according to claim 3 .

5. The Al composition ratio of the second barrier layer is higher than the Al composition ratio of the first barrier layer. The nitride semiconductor light emitting device according to any one of claims 1 to 4.

6. The p-side guide layer contains Mg. The nitride semiconductor light emitting device according to any one of claims 1 to 5.

7. The second barrier layer has a thickness smaller than that of the first barrier layer. The nitride semiconductor light emitting device according to any one of claims 1 to 6.

8. The Al composition ratio of the electron barrier layer is greater than the Al composition ratio of the p-side semiconductor layer. The nitride semiconductor light emitting device according to any one of claims 1 to 7.

9. the one or more light emitting layers contain In, The emission wavelength of the nitride semiconductor light emitting element is 390 nm or less. The nitride semiconductor light emitting device according to any one of claims 1 to 8.

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