Automotive floodlight light sources

Abstract

To provide a light emitting device in which a solder coupling between elements of a light emitting device is improved.SOLUTION: A light emitting device (1) for an automobile floodlight, contains: an SMD component (2); and a circuit support body (4). The SMD component (2) is coupled to the circuit support body (4) by solder coupling. The circuit support body includes a plurality of contact elements (5a). The circuit support body (4) includes a plurality of micro-vias (7) constructed so as to transmit a heat in order to exhaust a waste heat of the SMD component (2). The plurality of contact elements (5a) includes an actual hexagonal-shaped base surface (5b). In each of micro-vias (7), the actual hexagonal-shaped base surface (5b) of each contact element (5a) is oppositely arranged so as to be actually projected in complete in accordance with the maximum surface filling density by the plurality of micro-vias (7) in a filling structure of a two-dimensional hexagonal shape.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] This application claims the benefit of Paris Convention priority from European Patent Application No. 22194828.4, filed September 9, 2022, the entire contents of which are incorporated herein by reference.

[0002] The present invention relates to a light emitter for an automobile floodlight, comprising: The light emitter is an SMD component including a light source for generating light; and ·Circuit support Including, the SMD component has a light-emissive top surface on which the light source is disposed and a bottom surface opposite the light-emissive top surface; the SMD component is thermally and / or electrically conductively connected to the circuit support by solder bonding (jointing) at a mounting portion of the circuit support, the solder bond includes a solder layer having a solder material; the solder layer is disposed between a lower surface of the SMD component and a mounting portion of the circuit carrier, and the SMD component and the circuit carrier are joined together; the mounting portion of the circuit carrier has a plurality of spaced apart contact elements arranged in a grid pattern, the contact elements extending from a base surface of the circuit carrier toward the SMD component and contacting a surface of the solder layer opposite the SMD component; A gas outflow channel portion is formed between adjacent contact elements; the contact elements are arranged relative to one another such that the gas outflow channel portions form an integrated (interconnected) gas outflow channel system, such that each contact element is surrounded by a portion of the gas outflow channel system; the gas outflow channel portion is defined by side surfaces of adjacent contact elements, the base surface, and a surface of the solder layer opposite the SMD component; the gas outflow channel system is configured and adapted to allow gas leaking from the solder layer during a soldering process to escape (exhaust) through the gas outflow channel system from a volume formed between the solder layer and the bottom surface of the circuit support; for the exhaust of waste heat of the SMD components, the circuit carrier has a number of microvias adapted for thermal conduction; The heat is exhausted substantially along the longitudinal direction of the microvias, the microvias are formed (drilled) in the circuit support such that the microvias extend at least partially through the circuit support to the mounting portion and through the contact elements, such that the microvias contact the solder layer at a contact area of ​​the solder layer for heat dissipation; The microvias have a substantially circular cross-section in the contact area, relative to the light emitter.

[0003] The invention further relates to a vehicle floodlight including a light emitter. [Background technology]

[0004] Light emitters for automotive floodlights are known in the prior art, and such light emitters often have an SMD (Surface Mount Device) component with a (single) light source, which is fixed to a circuit carrier. The circuit carrier is generally also designed or adapted, inter alia, for cooling the SMD component (or the light source), which in the prior art is often done via so-called microvias, which extend at least partially through the circuit carrier (or from an inner region of the circuit carrier) to the SMD component. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] US 2013 / 087813 A1 Summary of the Invention [Problem to be solved by the invention]

[0006] Typically, SMD components are soldered to the circuit carrier, and during solder bonding, particularly with large-area solder layers (i.e. layers with hardened solder or solder material (after the soldering process) in order to create a material-bonding-type bond (due to inter-atomic forces between materials) between the components, hollow spaces can form in the solder layer. These hollow spaces are formed by gases that are generated during the soldering process (during liquefaction of the solder material used in the soldering process). The hollow spaces reduce the effective contact surface between the SMD component and the circuit carrier. To prevent the formation of hollow spaces, it must be ensured that the gas can escape from the solder layer, and corresponding gas outflow channels are usually formed between the solder layer and the circuit carrier. However, due to such gas outflow channels, the effective contact surface between the solder layer and the circuit carrier is reduced, whereby cooling is worsened. Therefore, the solutions known in the prior art must make a compromise between effective cooling (large number of microvias) and effective gas outflow (large number of gas outflow channels).

[0007] The object of the present invention is to reduce or overcome the disadvantages of the prior art. It is therefore an object of the present invention to provide, inter alia, a light emitter having improved solder bonds between components of the light emitter. [Means for solving the problem]

[0008] According to a first aspect of the present invention, there is provided a light emitter for an automobile floodlight. The light emitter is an SMD component including a light source for generating light; and ·Circuit support Including, the SMD component has a light-emissive top surface on which the light source is disposed and a bottom surface opposite the light-emissive top surface; the SMD component is thermally and / or electrically conductively connected to the circuit support by solder bonding (jointing) at a mounting portion of the circuit support, the solder bond includes a solder layer having a solder material; the solder layer is disposed between a lower surface of the SMD component and a mounting portion of the circuit carrier, and the SMD component and the circuit carrier are joined together; the mounting portion of the circuit carrier has a plurality of contact elements arranged in a grid and spaced apart from one another, the contact elements extending from a base surface of the circuit carrier toward the SMD component and contacting a surface of the solder layer opposite the SMD component; A gas outflow channel portion is formed between adjacent contact elements; the contact elements are arranged relative to one another such that the gas outflow channel portions form an integrated (interconnected) gas outflow channel system, such that each contact element is surrounded by a portion of the gas outflow channel system; the gas outflow channel portion is defined by side surfaces of adjacent contact elements, the base surface, and a surface of the solder layer opposite the SMD component; the gas outflow channel system is configured and adapted to allow gas leaking from the solder layer during a soldering process to escape (exhaust) through the gas outflow channel system from a volume formed between the solder layer and the bottom surface of the circuit support; for the exhaust of waste heat of the SMD components, the circuit carrier has a number of microvias adapted for thermal conduction; The heat is exhausted substantially along the longitudinal direction of the microvias, the microvias are formed (drilled) in the circuit support such that the microvias extend at least partially through the circuit support to the mounting portion and through the contact elements, such that the microvias contact the solder layer at a contact area of ​​the solder layer for heat dissipation; the microvias having a substantially circular cross-section at the contact region; The plurality of contact elements have a substantially hexagonal shaped base surface; the base surface lies in a plane oriented substantially parallel to a bottom surface of the circuit support; the microvias are arranged relative to one another in a two-dimensional hexagonal packing arrangement, such that the substantially hexagonal base surfaces of the contact elements are substantially completely filled by the microvias according to a maximum surface packing density. (Form 1) According to a second aspect of the present invention, there is provided an automobile floodlight including the light emitter of the present invention (Mode 15). DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Preferred embodiments of the present invention are described below. (Mode 1) See the first aspect of the present invention above. (Feature 2) In the light emitter according to feature 1, Adjacent microvias in the hexagonal base surface of one contact element are preferably positioned relative to one another so as to substantially directly abut one another. (Feature 3) In the light emitter according to feature 1, The microvias preferably have an inner hole diameter in the contact area of ​​<0.5mm, or <0.25mm, or <0.15mm. (Feature 4) In the light emitter according to feature 1, The microvias are preferably configured substantially conical or frustoconical along their longitudinal extension. (Feature 5) In the light emitter according to feature 1, The microvias are preferably arranged (formed) in the circuit support such that areas of the mounting portion having the gas outflow channel system are free of microvias. (Feature 6) In the light emitter according to feature 1, the circuit support has an outer surface oriented toward the SMD component, the mounting portion being formed on the outer surface; The circuit support preferably has a solder stop resin layer disposed at least partially around the mounting portion on the outer surface. (Feature 7) In the light emitter according to feature 1, The contact elements are preferably coated with or consist of a thermally and / or electrically conductive material, in particular a metal, for example copper. (Feature 8) In the light emitter according to feature 1, the circuit carrier is configured as a multilayer circuit board having a metal inlay, preferably a copper inlay; The microvias are preferably thermally coupled to the metal inlay. (Feature 9) In the light emitter according to feature 1, The hexagonal contact elements preferably form polyhedrons having hexagonal base faces of substantially equal size. (Mode 10) In the light emitter according to mode 1, Preferably, the base surfaces of the hexagonal shaped contact elements each form a regular hexagon. (Feature 11) In the light emitter according to feature 1, each gas outflow channel portion of the gas outflow channel system has a channel width defined as the vertical distance between the parallel side edges of two adjacent contact elements; The gas outflow channel system is preferably configured such that all gas outflow channel portions have substantially the same channel width. (Mode 12) In the light emitter according to mode 1, Each gas outflow channel portion of the gas outflow channel system preferably has a channel height which corresponds to the vertical distance between a base surface of the circuit support and a surface of the solder layer opposite the SMD component. (Feature 13) In the light emitter according to feature 1, The mounting portion of the circuit support preferably has a surface larger than the lower surface of the SMD component. (Feature 14) In the light emitter according to feature 1, Of the multiple contact elements arranged in a lattice (raster) pattern, it is preferred that at least 50%, or more than 75%, or more than 85%, or more than 95% of the contact elements have a hexagonal base surface. (Mode 15) See the second aspect of the present invention above.

[0010] According to the invention, the contact elements each have a substantially hexagonal base surface, the base surface lying in a plane oriented substantially parallel to a base surface of the circuit support, preferably parallel to a lower surface of the SMD component, The microvias are arranged relative to one another in a two-dimensional hexagonal packing arrangement such that the substantially hexagonal base surface of the contact element is substantially completely (over the entire surface) filled with the microvias with maximum surface packing density (i.e., the microvias are arranged relative to one another in a two-dimensional hexagonal packing arrangement (e.g., if the openings are circles, the centers of the circles are arranged in a hexagonal lattice (honeycomb structure) in a plane and each circle is surrounded (circumscribed) by six other circles) such that the substantially hexagonal base surface of the contact element is substantially completely (almost completely) filled with the openings of the microvias with a maximum density (occupied area in the base surface) of the openings in the base surface).

[0011] Thus, the number of microvias per contact element surface can be advantageously maximized, which also improves the cooling of the SMD components. At the same time, gas can be evacuated from the liquefied solder material during the soldering process via the gas outflow channel system, and a solid solder layer can be produced. The solder layer can therefore be formed, inter alia, substantially bubble-free. In the present application, a polygon having six corners and six sides is understood as a hexagonal base surface. Preferably, the base surfaces of the contact elements form an equilateral hexagon (all six sides have the same length), and particularly preferably, the base surfaces of the contact elements form a regular hexagon (all six sides have the same length and, furthermore, all six corner angles have the same size). The plurality of contact elements having a substantially hexagonal base surface can include all the contact elements or can include less, for example at least 90%, 80%, 70%, 60% or 50% of all the contact elements of the total number of contact elements. The greater the number of contact elements having a substantially hexagonal base surface, the more efficient the cooling of the SMD component can be performed, since the microvias can be arranged (formed or drilled) in accordance with close-packing (arrangement) in the substantially hexagonal base surface. The microvias (preferably their thermally conductive (metal) cores) can inter alia open in or contact the solder layer for thermal conduction starting from an inner region (e.g. metal inlay) of the circuit carrier. The light source can include a pixel LED. The solder joints (joints) can be produced by a soldering process, which is preferably a reflow soldering process.

[0012] Adjacent microvias on the hexagonal base surface of a contact element can be arranged substantially directly adjacent to each other (with almost no gaps), preferably the microvias in the contact area can have substantially the same diameter, where the contact area is to be understood as the area where the microvias or contact elements contact the solder layer.

[0013] The microvias may advantageously have an inner hole diameter in the contact area of ​​<0.5 mm, preferably <0.25 mm, especially preferably <0.15 mm. The microvias preferably have a diameter of 0.1 to 0.2 mm. The distance between adjacent microvias is preferably 0.1 to 0.35 mm.

[0014] The microvia can be configured substantially conically or frustum-shaped along its longitudinal extension direction, advantageously the microvia can be configured such that the diameter of the cone or the diameter of the frustum decreases towards the solder layer, in particular the angle between the cone axis or frustum axis and the outer peripheral surface of the cone or frustum can be between 6° and 15°.

[0015] The microvias can be arranged (formed) in the circuit support such that the areas of the mounting part having the gas outflow channel system are free of microvias, in particular the microvias are arranged (formed or drilled) only in the contact elements.

[0016] The circuit support can have an outer surface oriented toward the SMD component, with a mounting portion formed on the outer surface, and the circuit support can have a solder-stop resin layer disposed at least partially, preferably completely, around the mounting portion on the outer surface.

[0017] The contact elements can be coated with or consist of a thermally and / or electrically conductive material, in particular a metal, for example copper.

[0018] The circuit carrier is configured as a multilayer circuit board with a metal inlay, preferably a copper inlay, and the microvias can be thermally coupled (connected) with the metal inlay. Advantageously, the microvias are filled with a metal, in particular with copper, and this metal filling is thermally coupled (connected) with the metal inlay. Advantageously, the thermally conductive filling metal of the microvias is the same material as the metal inlay of the circuit carrier.

[0019] The hexagonal contact elements may each form a polyhedron (approximately a hexagonal prism) with a hexagonal base surface of substantially the same size. The gas outflow channel system is formed in particular between the (side surfaces of) the polyhedrons (more precisely between the side surfaces of the polyhedrons, the base surface and the surface of the solder layer located opposite the SMD component). The contact elements in particular have a first number of peripheral elements and a second number of central elements, the peripheral elements being arranged on the peripheral edge of the mounting part and the central elements being surrounded by the peripheral elements. Advantageously, at least the central elements, but preferably also the peripheral elements, have a hexagonal base surface.

[0020] The base surfaces of the hexagonal-shaped contact elements may each form a regular hexagon.

[0021] Each gas outflow channel portion of the gas outflow channel system has a channel width defined as the vertical distance between the parallel side edges of two adjacent contact elements, and the gas outflow channel system can be configured such that all gas outflow channel portions have substantially the same channel width. The channel width of the gas outflow channel portions is preferably 150-250 μm.

[0022] Each gas outflow channel part of the gas outflow channel system has a channel height which corresponds to the vertical distance between the base surface of the circuit carrier and the surface of the solder layer located opposite the SMD component, advantageously the channel height of the gas outflow channel system is constant over the entire mounting part, advantageously the channel height can be 100-200 μm. The channel height can in particular correspond to the vertical height of the contact element (advantageously the vertical height between the base surface and the solder layer). The channel height can therefore be understood as the layer thickness of the contact element.

[0023] The mounting portion of the circuit carrier can have a surface area larger than the underside of the SMD component. The mounting portion is preferably an area (or surface portion) formed on the circuit carrier, which is wettable with a solder material (solder wettable) and configured to receive the SMD component for subsequent electrical, thermal and / or mechanical contact of the SMD component.

[0024] The bond (connection) between the SMD component and the mounting portion of the circuit support can be formed by a solder layer such that the underside of the SMD component, the base surface of the circuit support and the base surface of the hexagonal-shaped contact element (respectively) lie in planes oriented substantially parallel to each other.

[0025] Of the contact elements arranged in a lattice (raster) pattern, at least 50%, advantageously more than 75%, preferably more than 85%, and especially preferably more than 95% of the contact elements may have a hexagonal base surface.

[0026] Automotive floodlights (headlights, etc.) including the light emitters of the present invention are also possible.

[0027] In the following, the invention is explained in more detail using exemplary, non-limiting embodiments shown in the drawings. [Brief description of the drawings]

[0028] [Figure 1]FIG. 2 is a schematic cross-sectional view of an example of a light emitter of the present invention. [Diagram 2] FIG. 2 is a schematic diagram of an example of a circuit carrier according to a first embodiment of the light emitter of the present invention; [Diagram 3] FIG. 4 is a schematic diagram of an example of a circuit carrier according to a second embodiment of the light emitter of the present invention; EXAMPLES

[0029] In the following figures, like drawing reference numbers represent like features unless otherwise specified.

[0030] Figure 1 shows an example of an inventive light emitter 1 for an automobile floodlight in a schematic cross-sectional view. The light emitter 1 comprises an SMD component 2 with a light source 3 for generating light. The SMD component 2 has a top surface 2a on which the light source 3 is arranged, such that the top surface 2a is configured to emit light. The SMD component 2 further has a bottom surface 2b opposite the light-emitting top surface 2a. The light source 3 can be a pixel LED light source.

[0031] The light emitter 1 comprises a circuit carrier 4, to which the SMD component 2 is thermally and electrically conductively connected by a solder joint. The solder joint is configured as a solder layer 9 with a solder material. The basic principles for producing solder joints of this kind are known to the person skilled in the art and therefore will not be considered in detail here. The solder layer 9 is arranged between the underside 2b of the SMD component 2 and the mounting part 4a of the circuit carrier 4 and connects the SMD component 2 to the circuit carrier 4. The solder joint is produced by a soldering process, which may be a reflow soldering process. In order to enable a uniform (uniform) application of the solder material (or a uniform layer thickness), it may be preferable, especially in the case of large-area solder joints (or mounting parts 4a), not to apply the solder material continuously (during the soldering process) but to divide the solder material into a number of solder material segments by means of a template (Schablone). The resulting solder layer 9 (hardened according to the manufacturing process) is formed continuously (in particular over substantially the entire mounting portion 4a).

[0032] 1, the circuit carrier 4 is configured as a multilayer circuit board with a metal inlay 8, preferably a copper inlay. The (shown) microvias 7 are filled, inter alia, with a metal, preferably copper, and are connected to the metal inlay 8.

[0033] As can be seen in Figures 2 and 3, the mounting part 4a is formed from a number of contact elements 5a arranged in a grid and spaced apart from one another, forming a contact element grid 5. Between adjacent contact elements 5a, gas outflow channel portions 6a are formed. The contact elements 5a are arranged relative to one another such that the gas outflow channel portions 6a form an associated gas outflow channel system 6 through the mounting part 4a. Each contact element 5a is bordered by a part of the associated gas outflow channel system 6. The gas outflow channel system 6 is configured and adapted to allow gases from the solder volumes liquefied during the soldering process forming the solder layer 9 after cooling to escape from the space formed between the underside 2b of the SMD component 2 and the mounting part 4a of the circuit carrier 4 via the gas outflow channel system 6.

[0034] In other words, the gas outflow channel system 6 divides the mounting part 4a into a plurality of partial regions separated from one another by a plurality of gas outflow channel portions 6a, and the gas outflow channel system 6 is formed in the mounting part 4a in such a way that the partial regions of the mounting part 4a (or the plurality of contact elements 5a) have (in a plan view) hexagonal gaps. The mounting part 4a is thus configured as a plurality of segmented mounting parts 4a by the gas outflow channel system 6 passing through the mounting part 4a, and the individual segments are configured as hexagonal contact elements 5a (or contact elements 5a with a hexagonal base surface).

[0035] For the removal of the waste heat of the SMD components 2, the circuit carrier 4 has a number of microvias 7 (a number of small circles inside each polygon in Fig. 2, Fig. 3) adapted for heat conduction, the microvias 7 having a substantially circular cross section and a longitudinal extension (longitudinal direction). The heat conduction takes place substantially along the longitudinal extension direction of the microvias. The microvias 7 are arranged on the circuit carrier 4 in such a way that they extend at least partially through the circuit carrier 4 to the mounting part 4a and are at least partially arranged (formed or drilled) in this mounting part 4a or open in the solder layer 9. The microvias are thus arranged (formed or drilled) in the mounting part 4a in the contact area of ​​the solder layer 9 for the removal of heat. The contact area is in particular formed (only) exclusively in the contact element 5a of the mounting part 4a.

[0036] 2 and 3, the contact elements 5a have a substantially hexagonal base surface 5b that lies in a plane oriented substantially parallel to the bottom surface 2b of the SMD component 2.

[0037] The microvias 7 are arranged relative to one another in a two-dimensional hexagonal packing arrangement such that the substantially hexagonal base surface 5b of the contact elements 5a is substantially completely filled (formed or drilled) with the microvias 7 with a maximum surface-filling density, preferably with a minimum distance between adjacent microvias 7. The hexagonal base surface 5b of the contact elements 5a is thus substantially filled (occupied) by the microvias 7 having substantially circular surfaces. Adjacent microvias 7 are arranged relative to one another in the interior of the hexagonal base surface 5b of the contact elements 5a such that they abut one another substantially directly. The microvias 7 can have diameters of substantially the same size. The microvias 7 have an inner hole diameter d which is advantageously <0.5 mm, preferably <0.25 mm, particularly preferably <0.15 mm, in particular maximum, in the contact region of the solder layer 9. The microvias 7 are arranged in the mounting part 4a of the circuit carrier 4 such that the regions of the mounting part 4a which have the gas outflow channel system 6 are free of microvias 7.

[0038] The hexagonal contact elements 5a each have a hexagonal base surface 5b of substantially equal size. The base surfaces 5b of the hexagonal contact elements 5a each form a regular hexagon.

[0039] In the embodiment shown in Fig. 2, the contact element surface has five central hexagonal contact elements 5a. These are bordered (surrounded) by further contact elements having other shapes (further polygonal) and also arranged (formed or drilled) with microvias 7. Around the mounting area 4a, the SMD component 2 is shown diagrammatically.

[0040] In the embodiment shown in Fig. 3, the mounting part 4a has twelve central hexagonal contact elements 5a, which are bordered (surrounded) by further contact elements having other shapes (further polygonal) and in which the microvias 7 are also arranged (formed or drilled). Around the mounting part 4a the SMD component 2 is shown diagrammatically.

[0041] The number of hexagonal contact elements 5a is substantially predetermined by their size and by the size and shape of the mounting part 4a.

[0042] Each gas outflow channel portion 6a of the gas outflow channel system 6 has a channel width defined as the vertical distance between the parallel side edges of two adjacent contact elements 5a. The gas outflow channel system 6 is preferably configured such that all gas outflow channel portions 6a have the same channel width.

[0043] Each gas outflow channel portion 6a of the gas outflow channel system 6 has a channel height which corresponds to the vertical distance between the base surface 4b of the circuit support 4 and the surface of the solder layer 9 which is located opposite (away from) the SMD component 2. The channel height of the gas outflow channel system 6 is advantageously constant over the entire mounting portion 4a, the channel height being advantageously between 100 and 200 μm.

[0044] Of the total number of contact elements 5a arranged in a lattice (raster), at least 50%, advantageously more than 75%, preferably more than 85%, very particularly preferably more than 95% have a hexagonal-shaped base surface 5b.

[0045] The present invention is not limited to the illustrated embodiments, but is defined by the full scope of protection of the claims. Moreover, individual aspects or embodiments of the invention can be taken up (separately) and combined with each other. Drawing reference signs, which may appear in the claims, are exemplary and do not limit the claims, but only serve to make the claims easier to read.

[0046] The present invention can be described as follows: [Appendix 1] A light emitter for automobile floodlights. The light emitter is an SMD component including a light source for generating light; and ·Circuit support Includes. The SMD component has a light-emissive upper surface on which the light source is disposed and a lower surface opposite the light-emissive upper surface. The SMD component is thermally and / or electrically conductively coupled to the circuit support by solder bonding (jointing) at a mounting portion of the circuit support. The solder joint includes a solder layer having a solder material. The solder layer is disposed between the underside of the SMD component and the mounting portion of the circuit carrier, and bonds the SMD component to the circuit carrier. The mounting portion of the circuit support has a plurality of contact elements arranged in a grid (raster) pattern and spaced apart from one another, the contact elements extending from a base surface of the circuit support toward the SMD component and contacting a surface of the solder layer opposite the SMD component. Gas outflow channel portions are formed between adjacent contact elements. The contact elements are arranged relative to one another such that the gas outflow channel portions are integrated (interconnected) to form a gas outflow channel system, such that each contact element is surrounded by a portion of the gas outflow channel system. The gas outflow channel portion is defined by the side surfaces of adjacent contact elements, the base surface and a surface of the solder layer opposite the SMD component. The gas outflow channel system is configured and adapted to allow gas leaking from the solder layer during the soldering process to escape (exhaust) through the gas outflow channel system from a volume formed between the solder layer and the base surface of the circuit support. For the extraction of the waste heat of the SMD components, the circuit carrier has a number of microvias adapted for heat conduction. The heat is removed substantially along the longitudinal direction of the microvias. The microvias are formed (drilled) in the circuit support such that the microvias extend at least partially through the circuit support to the mounting portion and through the contact elements, thereby contacting the solder layer at a contact area of ​​the solder layer for heat dissipation. The microvias have a substantially circular cross-section in the contact region. The plurality of contact elements have a substantially hexagonal shaped base surface. The base surface lies in a plane oriented substantially parallel to a bottom surface of the circuit carrier. The microvias are arranged relative to one another in a two-dimensional hexagonal packing arrangement such that the substantially hexagonally shaped base surface of the contact elements is substantially completely filled by the microvias in accordance with a maximum surface packing density. [Appendix 2] 2. The light emitter according to claim 1, Adjacent microvias in the hexagonal base surface of a contact element are positioned relative to one another so as to substantially directly abut one another. [Appendix 3] In the light emitter according to claim 1 or 2, The microvias have an inner hole diameter in the contact area that is <0.5 mm, or <0.25 mm, or <0.15 mm. [Appendix 4] In the light emitter according to any one of claims 1 to 3, The microvias are configured substantially conical or frustoconical along their longitudinal extension. [Appendix 5] In the light emitting device according to any one of claims 1 to 4, The microvias are formed in the circuit support such that areas of the mounting portion having the gas outflow channel system are free of microvias. [Appendix 6] In the light emitting device according to any one of claims 1 to 5, the circuit support has an outer surface oriented toward the SMD component, the mounting portion being formed on the outer surface; The circuit support has a solder stop resin layer disposed at least partially around the mounting portion on the outer surface. [Appendix 7] In the light emitter according to any one of claims 1 to 6, The contact elements are coated with or consist of a thermally and / or electrically conductive material, in particular a metal, for example copper. [Appendix 8] In the light emitter according to any one of claims 1 to 7, The circuit support is configured as a multilayer circuit board having a metal inlay, preferably a copper inlay; The microvias are thermally coupled to the metal inlay. [Appendix 9] In the light emitter according to any one of appendix 1 to 8, The hexagonal contact elements form a polyhedron having substantially equal sized hexagonal base surfaces. [Appendix 10] In the light emitter according to any one of claims 1 to 9, The base surfaces of the hexagonal shaped contact elements each form a regular hexagon. [Appendix 11] In the light emitter according to any one of claims 1 to 10, Each gas outflow channel portion of the gas outflow channel system has a channel width defined as the vertical distance between the parallel side edges of two adjacent contact elements; The gas outflow channel system is configured such that all gas outflow channel portions have substantially the same channel width. [Appendix 12] In the light emitter according to any one of claims 1 to 11, Each gas outflow channel portion of the gas outflow channel system has a channel height corresponding to the vertical distance between a base surface of the circuit support and a surface of the solder layer opposite the SMD component. [Appendix 13] In the light emitter according to any one of claims 1 to 12, The mounting portion of the circuit carrier has a surface area larger than the lower surface of the SMD component. [Appendix 14] In the light emitter according to any one of claims 1 to 13, Of the contact elements arranged in a lattice (raster) pattern, at least 50%, or more than 75%, or more than 85%, or more than 95% of the contact elements have a hexagonal base surface. [Appendix 15] 15. An automobile floodlight comprising a light emitter according to any one of claims 1 to 14.

[0047] Within the scope of the entire disclosure of the present invention (including the claims and drawings), modifications and adjustments of the embodiments are possible based on the basic technical ideas. Furthermore, within the scope of the entire disclosure of the present invention, various combinations or selections (including "non-selection") of various disclosed elements (including each element of each claim, each element of each embodiment, each element of each drawing, etc.) are possible. In other words, the present invention naturally includes various modifications and corrections that a person skilled in the art would be able to make in accordance with the entire disclosure including the claims and drawings and the technical ideas of the present invention. In particular, with regard to the numerical ranges described in this specification, any numerical value or subrange included in the range should be interpreted as being specifically described even if not otherwise specified.

[0048] Furthermore, the reference numerals in the drawings attached in the claims are intended solely to aid in the understanding of the invention, and are not intended to limit the invention to the embodiments and examples shown.

[0049] Furthermore, the entire contents of each of the above references are hereby incorporated by reference. [Explanation of symbols]

[0050] 1. Light emitter 2 SMD components 2a Top surface for light emission 2b The underside of the opposite side 3 light source 4 Circuit support 4a Mounting part 4b Basal plane 5 Contact element raster 5a Contact elements 5b Base surface 6 Gas Outflow Channel System 6a Gas outflow channel part 7 Microvia 8 Metal Inlays 9 Solder Layer

Claims

1. A light emitter for an automobile floodlight, comprising: The light emitter is an SMD component (2) including a light source (3) for generating light, and ・Circuit support (4) Including, The SMD component (2) has a light-emitting upper surface (2a) on which the light source (3) is arranged and a lower surface (2b) located opposite the light-emitting upper surface (2a), the SMD component (2) is thermally and / or electrically conductively connected to the circuit support (4) by solder bonding at a mounting portion (4a) of the circuit support (4); The solder joint comprises a solder layer (9) having a solder material; the solder layer (9) is disposed between the underside of the SMD component (2) and the mounting portion (4a) of the circuit carrier (4), and the SMD component (2) and the circuit carrier (4) are joined together; the mounting portion (4a) of the circuit carrier (4) has a plurality of contact elements (5a) arranged in a grid and spaced apart from one another, the contact elements (5a) extending from a base surface (4b) of the circuit carrier (4) towards the SMD component (2) and contacting a surface of the solder layer (9) located opposite the SMD component (2); A gas outflow channel portion (6a) is formed between adjacent contact elements (5a), the contact elements (5a) are arranged relative to one another such that the gas outflow channel portions (6a) form an integrated gas outflow channel system (6), such that each contact element (5a) is surrounded by a portion of the gas outflow channel system (6); the gas outflow channel portion (6a) is defined by the side surfaces of adjacent contact elements (5a), the base surface (4b) and a surface of the solder layer (9) located opposite the SMD component (2); the gas outflow channel system (6) is configured and adapted to allow gas escaping from the solder layer (9) during the soldering process to escape through the gas outflow channel system (6) from a volume formed between the solder layer (9) and the base surface (4b) of the circuit support (4); For the purpose of dissipating the waste heat of the SMD components (2), the circuit carrier (4) has a number of microvias (7) adapted for thermal conduction, The heat is exhausted substantially along the longitudinal direction of the microvias (7), the plurality of microvias (7) are formed in the circuit support (4) such that the plurality of microvias (7) extend at least partially through the circuit support (4) to the mounting portion (4a) and through the plurality of contact elements (5a) so that the plurality of microvias contact the solder layer (9) in a contact area of ​​the solder layer (9) for heat dissipation; said plurality of microvias (7) having a substantially circular cross-section in said contact area; The plurality of contact elements (5a) have substantially hexagonal base surfaces (5b); said base surface (5b) lying in a plane oriented substantially parallel to the bottom surface (4b) of said circuit carrier; the microvias (7) are arranged relative to one another in a two-dimensional hexagonal packing arrangement such that the substantially hexagonal base surface (5b) of the contact element (5a) is substantially completely filled with the microvias (7) according to a maximum surface packing density. A light-emitting device characterized by:

2. 2. The light emitter of claim 1, Adjacent microvias (7) in the hexagonal base surface (5b) of one contact element (5a) are arranged relative to one another so as to substantially directly abut one another. A light-emitting device characterized by:

3. 2. The light emitter of claim 1, The microvia (7) has an inner hole diameter (d) in the contact area of ​​<0.5 mm, or <0.25 mm, or <0.15 mm. A light-emitting device characterized by:

4. 2. The light emitter of claim 1, The microvias (7) are configured substantially conical or frustoconical along their longitudinal extension. A light-emitting device characterized by:

5. 2. The light emitter of claim 1, the plurality of microvias (7) are formed in the circuit support (4) such that the area of ​​the mounting part (4a) having the gas outflow channel system (6) is free of microvias (7); A light-emitting device characterized by:

6. 2. The light emitter of claim 1, The circuit support (4) has an outer surface directed toward the SMD component (2), and the mounting portion (4a) is formed on the outer surface; The circuit support (4) has a solder-stop resin layer disposed at least partially around the mounting portion (4a) on the outer surface. A light-emitting device characterized by:

7. 2. The light emitter of claim 1, the contact elements (5a) are coated with or made of a thermally and / or electrically conductive material; A light-emitting device characterized by:

8. 2. The light emitter of claim 1, the circuit carrier (4) is configured as a multilayer circuit board having a metal inlay (8); The plurality of microvias (7) are thermally coupled to the metal inlay (8). A light-emitting device characterized by:

9. 2. The light emitter of claim 1, The plurality of hexagonal contact elements (5a) form a polyhedron having substantially equal sized hexagonal base surfaces (5b). A light-emitting device characterized by:

10. 2. The light emitter of claim 1, The base surfaces (5b) of the plurality of hexagonal contact elements (5a) each form a regular hexagon. A light-emitting device characterized by:

11. 2. The light emitter of claim 1, each gas outflow channel portion (6a) of said gas outflow channel system (6) has a channel width defined as the vertical distance between the parallel side edges of two adjacent contact elements (5a); said gas outflow channel system (6) being configured such that all gas outflow channel portions (6a) have substantially the same channel width; A light-emitting device characterized by:

12. 2. The light emitter of claim 1, each gas outflow channel portion (6a) of said gas outflow channel system (6) has a channel height corresponding to the vertical distance between a base surface (4b) of said circuit support (4) and a surface of said solder layer (9) located opposite said SMD component (2); A light-emitting device characterized by:

13. 2. The light emitter of claim 1, The mounting portion (4a) of the circuit support (4) has a surface area larger than the lower surface (2b) of the SMD component. A light-emitting device characterized by:

14. 2. The light emitter of claim 1, Among the contact elements (5a) arranged in a lattice pattern, at least 50%, or more than 75%, or more than 85%, or more than 95% of the contact elements (5a) have a hexagonal base surface (5b). A light-emitting device characterized by:

15. A vehicle floodlight comprising a light emitter (1) according to any one of the preceding claims.

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