Method for manufacturing a power amplification device

Abstract

The present invention provides a power amplifier device and a manufacturing method thereof, in which a compact substrate is provided by stacking a plurality of substrates, a heat sink is provided facing one of the plurality of substrates, and a heat generating element mounted on the substrate comes into contact with the heat sink, thereby improving heat dissipation performance. [Solution] The power amplifier device includes a first board having a first through-hole that penetrates from front to back, a second board whose front surface is placed on the rear surface of the first board and has a second through-hole that penetrates from front to back at a position corresponding to the first through-hole, and on which a heat-generating element is mounted that penetrates the first through-hole and the second through-hole, and a heat sink whose front surface is placed on the rear surface of the second board and whose rear surface of the heat-generating element contacts the front surface.

Description

Technical Field

[0001] The present invention relates to an apparatus for power amplification and a method of manufacturing the same, and more particularly, to an apparatus for power amplification capable of efficiently dissipating heat generated from a heating element mounted on a printed circuit board (PCB) and a method of manufacturing the same.

Background Art

[0002] Generally, communication devices including antennas are internally provided with a power amplification device (PA; Power Amplifier) for amplifying communication signals, and the power amplification device is formed by mounting an amplification element on a circuit printed on the front surface of a substrate.

[0003] Since the amplification element is a heating element that generates heat during operation, the communication device including the amplification element must quickly dissipate the heat generated from the amplification element to the outside.

[0004] For this purpose, a conventional power amplification device adopts a structure in which, after mounting the amplification element on the front surface of the substrate, a large number of via holes penetrating through the front and back of the portion of the substrate where the amplification element is mounted are processed, or a plurality of coin insertion grooves are processed at positions corresponding to the large number of via holes on the back surface of the substrate, and heat transfer coins are inserted into the plurality of coin insertion grooves respectively to dissipate heat.

[0005] However, in the conventional power amplifier, since the substrate is generally made of a synthetic resin material with low thermal conductivity, the structure for discharging heat through the via hole has a problem that the contact area between the amplification element and the via hole is small and the heat dissipation efficiency is not good. In the structure in which the plurality of heat transfer coins are provided on the substrate, the heat dissipation effect is also reduced due to the contact tolerance of the contact surface with the amplification element. In addition, since a plurality of coin insertion grooves must be processed on the rear surface of the substrate to provide the plurality of heat transfer coins, there is also a problem that the number of working steps and costs increase.

Summary of the Invention

Problems to be Solved by the Invention

[0006] The technical problem of the present invention is to provide a compact substrate by laminating a plurality of substrates, and a heat sink is provided in surface contact with one of the plurality of substrates, and a heat generating element mounted on the substrate contacts the heat sink, thereby providing a power amplifier with improved heat dissipation performance and a method for manufacturing the same.

[0007] The technical problem of the present invention is not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

Means for Solving the Problems

[0008] To achieve the above problems, the power amplifier according to the present invention is composed of a first board, a second board, and a heat sink. A first through hole penetrating front and rear is formed in the first board. The front surface of the second board is disposed on the rear surface of the first board. A second through hole penetrating front and rear is formed in the second board at a position corresponding to the first through hole. A heat generating element penetrating the first through hole and the second through hole is mounted on the second board. The front surface of the heat sink is disposed on the rear surface of the second board. The rear surface of the heat generating element contacts the front surface of the heat sink.

[0009] The sizes of the peripheries of the first board, the second board, and the heat sink are formed to be the same as each other.

[0010] The terminals of the heating element are soldered to the terminal mounting portions of the circuit printed on the front surface of the second board.

[0011] The front-to-back thickness of the second board is formed to be thinner than the front-to-back thickness of the first board.

[0012] The front-to-back thickness when the first board and the second board are in contact is formed to be thinner than the front-to-back thickness of the heating element.

[0013] The front-to-back thickness when the first board and the second board are in contact is formed to be the same as the front-to-back thickness of the heating element.

[0014] Each of the first board and the second board is formed of a plurality of layers. The second board is formed of a smaller number of layers than the first board.

[0015] The first board is formed of a synthetic resin material. The second board is formed of a metal material.

[0016] The vertical length of the first through hole is formed to be at least half of the vertical length of the first board. The second through hole is formed to be smaller in size than the first through hole.

[0017] An insertion groove into which the rear end portion of the heating element is inserted is formed on the front surface of the heat sink.

[0018] The first board can include a plurality of sections divided in the left - right direction by plating portions that form circuits printed on the front surface of the first board. The first through - holes are formed one by one in the plurality of sections and are formed by a plurality of first through - holes. The second through - holes are formed at positions corresponding to each of the plurality of first through - holes and are formed by a plurality of second through - holes. The insertion grooves are formed at positions corresponding to each of the plurality of second through - holes and are formed by a plurality of insertion grooves. The heating elements are formed by a plurality of heating elements that respectively penetrate each of the plurality of first through - holes and each of the plurality of second through - holes, and the rear end portions thereof are respectively inserted into each of the plurality of insertion grooves.

[0019] The heating element is formed of an RF element.

[0020] The heating element is formed of a transmission - use amplification element.

[0021] A power element and a control element are mounted on the first board.

[0022] A circuit connection portion is formed on the first board. The circuit connection portion extends from the front surface of the first board to the rear surface of the first board and can be electrically connected to the circuit printed on the front surface of the second board. A connector pin connection hole that passes through in the front - rear direction is formed in the circuit connection portion. A connector pin formed on the rear surface of the filter is inserted into the connector pin connection hole and can be electrically connected to the circuit connection portion.

[0023] An opening hole that passes through in the front - rear direction is formed on the first board. The circuit connection portion is provided on the side surface of the opening hole. The connector pin connection hole has an opening at a portion facing the side surface of the opening hole.

[0024] The manufacturing method of the power amplification device according to the present invention comprises steps (a), (b), (c), (d), and (e). In step (a), after applying solder cream to the front surface of the first board having a first through hole passing through it front and back, the rear surface of the first element is reflowed onto the front surface of the first board, and then solder cream is applied to the rear surface of the first board. In step (b), after applying solder cream to the front surface of the second board having a second through hole passing through it front and back at a position corresponding to the first through hole, the rear surface of the second element is reflowed onto the front surface of the second board. In step (c), solder cream is applied to the front surface of the heat sink. In step (d), the rear surface of the second board is placed on the front surface of the heat sink, the rear surface of the first board is placed on the front surface of the second board, and then solder cream is applied to the terminal mounting portion of the circuit printed on the front surface of the second board. In step (e), the heating element is passed through the first through hole and the second through hole, the rear surface of the heating element is brought into contact with the front surface of the heat sink, the terminals of the heating element are brought into contact with the terminal mounting portion, and then the rear surface of the first board and the front surface of the second board, the rear surface of the second board and the front surface of the heat sink, and the terminals of the heating element and the terminal mounting portion are reflowed simultaneously.

[0025] In step (d), an insertion groove can be formed on the front surface of the heat sink through the first through hole and the second through hole, and in step (e), the rear end portion of the heating element can be inserted into the insertion groove.

[0026] In step (e), the rear end portion of the heating element can be inserted into the insertion groove formed on the front surface of the heat sink.

[0027] The first board can include a plurality of sections provided in the left - right direction by plating portions that form circuits printed on the front surface of the first board. The first through - holes are formed one by one in the plurality of sections and are formed by a plurality of first through - holes. The second through - holes are formed at positions corresponding to each of the plurality of first through - holes and are formed by a plurality of second through - holes. The insertion grooves are formed at positions corresponding to each of the plurality of second through - holes and are formed by a plurality of insertion grooves. The heating elements are formed by a plurality of heating elements that respectively penetrate each of the plurality of first through - holes and each of the plurality of second through - holes, and the rear end portions thereof are respectively inserted into each of the plurality of insertion grooves.

[0028] The manufacturing method of the power amplification device according to the present invention is composed of steps (a), (b), (c), (d), and (e). In step (a), after applying solder cream to the front surface of the first board in which first through - holes passing through in the front - rear direction are formed, the rear surface of the first element is mounted on the front surface of the first board, and solder cream is applied to the rear surface of the first board. In step (b), after applying solder cream to the front surface of the second board in which second through - holes passing through in the front - rear direction are formed at positions corresponding to the first through - holes, the rear surface of the second element is mounted on the front surface of the second board. In step (c), solder cream is applied to the front surface of the heat sink. In step (d), after arranging the rear surface of the second board on the front surface of the heat sink and arranging the rear surface of the first board on the front surface of the second board, solder cream is applied to the terminal mounting portion of the circuit printed on the front surface of the second board. In step (e), the heating element is passed through the first through - holes and the second through - holes, the rear surface of the heating element is brought into contact with the front surface of the heat sink, and the terminals of the heating element are brought into contact with the terminal mounting portion. Then, the rear surface of the first element and the front surface of the first board, the rear surface of the second element and the front surface of the second board, the rear surface of the first board and the front surface of the second board, the rear surface of the second board and the front surface of the heat sink, and the terminals of the heating element and the terminal mounting portion are reflowed simultaneously.

[0029] In the step (d), an insertion groove can be formed on the front surface of the heat sink through the first through hole and the second through hole, and in the step (e), the rear end portion of the heating element can be inserted into the insertion groove.

[0030] In the step (e), the rear end portion of the heating element can be inserted into the insertion groove formed on the front surface of the heat sink.

[0031] The first board can include a plurality of sections provided in the left-right direction by plating portions that form circuits printed on the front surface of the first board. The first through holes are formed one by one in the plurality of sections and are formed by a plurality of first through holes. The second through holes are formed at positions corresponding to each of the plurality of first through holes and are formed by a plurality of second through holes. The insertion grooves are formed at positions corresponding to each of the plurality of second through holes and are formed by a plurality of insertion grooves. The heating elements are formed by a plurality of heating elements that penetrate each of the plurality of first through holes and each of the plurality of second through holes, and the rear end portions thereof are inserted into the plurality of insertion grooves respectively.

[0032] In addition, specific matters of the embodiments are included in the detailed description and the drawings.

Effects of the Invention

[0033] According to the power amplification device and its manufacturing method according to the present invention, the first board and the second board are provided in surface contact with each other so that the first board and the second board are compact, and a heat sink is provided in surface contact with the second board, and the heating element mounted on the second board contacts the heat sink. Therefore, the heat generated from the heating element can be dissipated through the heat sink, and there is an effect of improving the heat dissipation performance.

[0034] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

Brief Description of the Drawings

[0035]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Modes for Carrying Out the Invention

[0036] Hereinafter, a power amplification device and a manufacturing method thereof according to an embodiment of the present invention will be described with reference to the drawings.

[0037] FIG. 1 is a perspective view showing a power amplification device according to an embodiment of the present invention, FIG. 2 is a right side view of the power amplification device shown in FIG. 1, FIG. 3 is a front view of the power amplification device shown in FIG. 1, FIG. 4 is an exploded perspective view of the power amplification device shown in FIG. 1, FIG. 5 is an exploded perspective view of the second board shown in FIG. 4, and FIG. 6 is a cross-sectional view taken along the line A-A of FIG. 3.

[0038] Referring to FIGS. 1 to 6, in the following description, the front-rear, up-down, left-right directions are based on the front-rear, up-down, left-right directions shown in FIG. 1, and the directions may be set differently depending on the structure of the communication device including the power amplification device 300 according to an embodiment of the present invention.

[0039] An RF (Radio Frequency) element is mounted on the power amplification device 300. The RF element may be an amplification element, or may include a transmission amplification element (Tx or PA (Power Amplifier)) and a reception amplification element (Rx or LNA (Low Noise Amplifier)). The power amplification device 300 can transmit the RF signal amplified by the transmission amplification element (Tx) to the outside via a filter and an antenna element provided in the communication device.

[0040] The power amplification device 300 according to an embodiment of the present invention may include a first board 310, a second board 320, and a heat sink 330. Here, the first board 310 is disposed in front of the second board 320, and the second board 320 is disposed in front of the heat sink 330.

[0041] The first board 310 may be a power supply and control board, and the second board 320 may be an RF board. A power supply element and a control element that generate a signal having no frequency, such as a power supply signal or a control signal, are mounted on the first board 310, and the RF element that generates an RF signal having a frequency is mounted on the second board 320.

[0042] The peripheries of the first board 310, the second board 320, and the heat sink 330 are formed in the same shape as each other. In this embodiment, the peripheries of the first board 310, the second board 320, and the heat sink 330 are formed in a rectangular shape. The sizes of the peripheries of the first board 310, the second board 320, and the heat sink 330 are formed to be the same as each other.

[0043] The thickness of the second board 320 before and after is formed thinner than the thickness of the first board 310 before and after. In this embodiment, the thickness of the first board 310 before and after is formed to be 1.7 mm, and the thickness of the second board 320 before and after is formed to be 0.65 mm. Since the thickness of the second board 320 is formed thinner than that of the first board 310, the heat generated from the elements mounted on the first board 310 and the second board 320 can be easily transmitted to the heat sink 330.

[0044] Here, the heat sink 330 may be a plate-shaped pallet used to improve the productivity of the PCB and reduce defective products during the execution of the reflow process. Also, the heat sink 330 may be made of a heat-resistant material that can sufficiently withstand the high heat of the reflow process, or may be formed of a material with little thermal deformation, such as a composite material obtained by adding glass fibers to a heat-resistant resin, or may be formed of a metal material with high thermal conductivity, such as an aluminum / aluminum alloy plate, a copper plate, or a magnesium plate, so as to be advantageous for heat transfer to the outside of the communication device including the power amplifier device 300.

[0045] Each of the first board 310 and the second board 320 is formed of a plurality of layers. The second board 320 is formed of a smaller number of layers than the first board 310. Although the existing board is formed of 6 layers, in this embodiment, in order to maintain a thickness equivalent to that of the existing board, the first board 310 is formed of 4 layers, and the second board 320 is formed of 2 layers.

[0046] The first board 310 is formed of a synthetic resin material. For example, the first board 310 is formed of an FR4 resin material made of an epoxy resin material. The second board 320 is formed of a metal material. Since the second board 320 is formed of a metal material, the heat generated from the elements mounted on the first board 310 and the second board 320 can be easily transmitted to the heat sink 330.

[0047] The first board 310 can include a plurality of sections (S1, S2, S3, S4; see FIG. 3) that are equally spaced in the left-right direction. The plurality of sections S1, S2, S3, S4 are demarcated by plating portions that form circuits printed on the front surface of the first board 310.

[0048] In this embodiment, the plurality of sections S1, S2, S3, S4 are formed by four, but the number of the plurality of sections S1, S2, S3, S4 is not limited to four, and it may be formed by at least two or more sections. Hereinafter, the description will be limited to the case where the plurality of sections S1, S2, S3, S4 are formed by four.

[0049] The plurality of sections S1, S2, S3, S4 can include a first section S1, a second section S2, a third section S3, and a fourth section S4.

[0050] The first section S1 is arranged on the leftmost side of the first board 310. The first section S1 is arranged on the left side of the second section S2 on the first board 310.

[0051] The second section S2 is arranged on the right side of the first section S1 on the first board 310. The second section S2 is arranged on the left side of the third section S3 on the first board 310. The second section S2 is arranged between the first section S1 and the third section S3 on the first board 310.

[0052] The third section S3 is arranged on the right side of the second section S2 on the first board 310. The third section S3 is arranged on the left side of the fourth section S4 on the first board 310. The third section S3 is arranged between the second section S2 and the fourth section S4 on the first board 310.

[0053] The fourth section S4 is arranged on the right side of the third section S3 on the first board 310. The fourth section S4 is arranged on the rightmost side of the first board 310.

[0054] On the first board 310, a first through hole (311; see FIG. 6) penetrating through in the front - rear direction is formed. The first through hole 311 may be formed at the upper part of the first board 310, and the vertical length of the first through hole 311 may be formed to be half or more of the vertical length of the first board 310.

[0055] The first through hole 311 is formed by a plurality of first through holes 311. The plurality of first through holes 311 are formed one by one in a plurality of sections S1, S2, S3, S4. That is, the plurality of first through holes 311 can include a first - 1 through hole 3111 formed in the first section S1, a first - 2 through hole 3112 formed in the second section S2, a first - 3 through hole 3113 formed in the third section S3, and a first - 4 through hole 3114 formed in the fourth section S4.

[0056] The first board 310 and the second board 320 are provided in contact with each other. That is, the front surface of the second board 320 is disposed on the rear surface of the first board 310.

[0057] The second board 320 and the heat - dissipation plate 330 are provided in contact with each other. That is, the front surface of the heat - dissipation plate 330 is disposed on the rear surface of the second board 320.

[0058] The power element and the control element are disposed on the front surface of the first board 310, and since the rear surface of the first board 310 must be provided in contact with the front surface of the second board 320, no element is provided on the rear surface of the first board 310.

[0059] In addition, since the RF element is provided on the front surface of the second board 320 and the rear surface of the second board 320 must be provided in surface contact with the front surface of the heat sink 330, no element is provided on the rear surface of the second board 320. Further, since the rear surface of the first board 310 and the front surface of the second board 320 must be provided in surface contact, the RF element disposed on the front surface of the second board 320 can penetrate through the first through hole 311 formed in the first board 310.

[0060] A second through hole (321; see FIG. 6) penetrating in the front-rear direction is formed in the second board 320 at a position corresponding to the first through hole 311. The second through hole 321 is formed to be much smaller in size than the first through hole 311. The second through hole 321 is formed as a square hole through which a heat generating element 322 described later can penetrate.

[0061] The second through hole 321 is formed by a plurality of second through holes 321. Each of the plurality of second through holes 321 is formed at a position corresponding to each of the plurality of first through holes 311. That is, the plurality of second through holes 321 can include a second - 1 through hole 3211 formed at a position corresponding to the first - 1 through hole 3111, a second - 2 through hole 3212 formed at a position corresponding to the first - 2 through hole 3112, a second - 3 through hole 3213 formed at a position corresponding to the first - 3 through hole 3113, and a second - 4 through hole 3214 formed at a position corresponding to the first - 4 through hole 3114.

[0062] A heat generating element (322; see FIG. 6) is mounted on the second board 320. The heat generating element 322 can penetrate through the first through hole 311 formed in the first board 310 and the second through hole 321 formed in the second board 320.

[0063] The thickness before and after bringing the first board 310 into contact with the second board 320 is formed to be thinner than the thickness before and after the heating element 322. Therefore, when the first board 310, the second board 320, and the heat sink 330 are coupled to each other, the front surface of the heating element 322 is disposed on the same plane as the front surface of the first board 310, and the rear portion of the heating element 322 is disposed to protrude rearward of the second board 320.

[0064] The heating element 322 may be the RF element mounted on the second board 320. Since the transmission amplifying element (Tx) among the RF elements generates the most heat, the heating element 322 is preferably the transmission amplifying element (Tx). Also, in order to allow the heat generated from the heating element 322 to dissipate rearward, the heating element 322 is preferably mounted on the second board 320 closer to the rear than the first board 310.

[0065] When the first board 310, the second board 320, and the heat sink 330 are coupled to each other, the rear surface of the heating element 322 can contact the front surface of the heat sink 330. Therefore, the heat generated from the heating element 322 can be easily transmitted rearward through the heat sink 330.

[0066] In this embodiment, an insertion groove (331; see FIG. 6) is formed on the front surface of the heat sink 330. When the first board 310, the second board 320, and the heat sink 330 are coupled, the rear end portion of the heating element 322 is inserted into the insertion groove 331.

[0067] The insertion groove 331 is formed with an opening at the front at a position corresponding to the second through hole 321. The insertion groove 331 is formed to have the same size as the second through hole 321. The insertion groove 331 is formed to have the same shape as the second through hole 321, and in this embodiment, the shape of the insertion groove 331 is formed as a quadrilateral.

[0068] The insertion grooves 331 are formed by a plurality of insertion grooves 331. Each of the plurality of insertion grooves 331 is formed at a position corresponding to each of the plurality of second through holes 321. That is, the plurality of insertion grooves 331 may include a first insertion groove 3311 formed at a position corresponding to the second-1 through hole 3211, a second insertion groove 3312 formed at a position corresponding to the second-2 through hole 3212, a third insertion groove 3313 formed at a position corresponding to the second-3 through hole 3213, and a fourth insertion groove 3314 formed at a position corresponding to the second-4 through hole 3214.

[0069] The heating elements 322 are formed by a plurality of heating elements 322. Each of the plurality of heating elements 322 can penetrate each of the plurality of first through holes 311 and each of the plurality of second through holes 321, and the rear end portion of each of the plurality of heating elements 322 can contact the front surface of the heat dissipation plate 330. In this embodiment, since a plurality of insertion grooves 331 are formed on the front surface of the heat dissipation plate 330, the rear end portion of each of the plurality of heating elements 322 is inserted into each of the plurality of insertion grooves 331. That is, the plurality of heating elements 322 may include a first heating element 3221 that penetrates the first-1 through hole 3111 and the second-1 through hole 3211 and has its rear end portion inserted into the first insertion groove 3311, a second heating element 3222 that penetrates the first-2 through hole 3112 and the second-2 through hole 3212 and has its rear end portion inserted into the second insertion groove 3312, a third heating element 3223 that penetrates the first-3 through hole 3113 and the second-3 through hole 3213 and has its rear end portion inserted into the third insertion groove 3313, and a fourth heating element 3224 that penetrates the first-4 through hole 3114 and the second-4 through hole 3214 and has its rear end portion inserted into the fourth insertion groove 3314.

[0070] FIG. 7 is a perspective view showing the heating element shown in FIG. 5, and FIG. 8 is a bottom perspective view of FIG. 7.

[0071] Referring to FIGS. 6 to 8, the heating element 322 is formed in a substantially hexahedral shape. The peripheral edge of the rear portion of the heating element 322 protrudes outward compared to the peripheral edge of the front portion of the heating element 322, and this protruding portion is inserted into the insertion groove 331.

[0072] Further, the heating element 322 is provided with terminals 322A and 322B that are electrically connected to the circuit printed on the front surface of the second board 320. The terminals 322A and 322B are formed to protrude in opposite directions from the peripheral edge of the front portion of the heating element 322.

[0073] The terminals 322A and 322B are formed by a plurality of terminals 322A and 322B. The plurality of terminals 322A and 322B can include a first terminal 322A formed on the upper side of the heating element 322 and a second terminal 322B formed on the lower side of the heating element 322. The first terminal 322A is formed by a pair of first terminals 322A, and the second terminal 322B is formed by a pair of second terminals 322B.

[0074] The terminals 322A and 322B of the heating element 322 are soldered to the terminal mounting portions (328; see FIG. 10) of the circuit printed on the front surface of the second board 320 and can be electrically connected to the circuit printed on the front surface of the second board 320.

[0075] FIG. 9 is an enlarged view of part A of FIG. 1.

[0076] Referring to FIGS. 1 and 9, a circuit connection portion 316 is formed on the first board 310. The circuit connection portion 316 extends from the front surface to the rear surface of the first board 310 and can be electrically connected to the circuit 325 printed on the front surface of the second board 320.

[0077] A connector pin connection hole 317 that passes through in the front-rear direction is formed in the circuit connection portion 316. A connector pin formed on the rear surface of the filter is inserted into the connector pin connection hole 317 and can be electrically connected to the circuit connection portion 316. By electrically connecting the connector pin of the filter to the circuit connection portion 316, the filter can be electrically connected to the circuit printed on the front surface of the second board 320. Here, the filter may be configured to perform a function of filtering an input RF signal and inputting an RF signal in a specific frequency band to the power amplifier device 300.

[0078] Specifically, an opening hole 315 that penetrates through the front and back is formed in the first board 310. The circuit connection part 316 is provided on the side surface of the opening hole 315, and the connector pin connection hole 317 can have an opening at a portion facing the side surface of the opening hole 315.

[0079] FIG. 10 is a diagram showing an example of a process of manufacturing the power amplifier device shown in FIG. 1. Here, for the sake of understanding the description, an example will be given in which each of the first through hole 311, the second through hole 321, the insertion groove 331, and the heating element 322 is provided one by one.

[0080] Referring to FIG. 10, in the manufacturing method of the power amplifier device 300 according to an embodiment of the present invention, after mounting and reflowing the elements 319 and 329 on the first board 310 and the second board 320 respectively, the first board 310, the second board 320, and the heat sink 330 can be laminated and reflowed to be joined.

[0081] Specifically, the manufacturing method of the power amplifier device 300 according to an embodiment of the present invention can include (a) step, (b) step, (c) step, (d) step, and (e) step.

[0082] In the step (a), after applying solder cream to the front surface of the first board 310 in which the first through hole 311 passing through the front and back is formed, the back surface of the first element 319 can be reflowed (which means the process of applying heat to the solder cream for soldering) to the front surface of the first board 310. In this case, the first element 319 is completely fixedly mounted on the front surface of the first board 310. Here, the first element 319 may be the power element and the control element mounted on the front surface of the first board 310. Thereafter, in the step (a), solder cream can be applied to the back surface of the first board 310. When applying solder cream to the back surface of the first board 310, after fixing the first board 310 to the jig so that the back surface of the first board 310 faces upward, solder cream can be applied to the back surface of the first board 310. Here, the solder cream applied to the back surface of the first board 310 can be applied for reflowing the back surface of the first board 310 to the front surface of the second board 320 in the step (e).

[0083] In the step (b), after applying solder cream to the front surface of the second board 320 in which the second through hole 321 passing through the front and back is formed at a position corresponding to the first through hole 311, the back surface of the second element 329 can be reflowed to the front surface of the second board 320. In this case, the second element 329 is completely fixedly mounted on the front surface of the second board 320. Here, the second element 329 may be an element excluding the transmission amplifying element (Tx), which is the heat generating element 322, among the RF elements mounted on the front surface of the second board 320.

[0084] In the step (c), solder cream can be applied to the front surface of the heat sink 330. Here, the solder cream applied to the front surface of the heat sink 330 can be applied for reflowing the back surface of the second board 320 to the front surface of the heat sink 330 in the step (e).

[0085] In the step (d), the rear surface of the second board 320 can be disposed on the front surface of the heat sink 330, and the rear surface of the first board 310 can be disposed on the front surface of the second board 320. In this way, the second element 329 mounted on the second board 320 can penetrate through the first through hole 311 formed in the first board 310. In this state, since the rear surface of the first board 310 is not reflowed onto the front surface of the second board 320 and the rear surface of the second board 320 is not reflowed onto the front surface of the heat sink 330, the first board 310 and the second board 320 are not completely joined to each other, and the second board 320 and the heat sink 330 are not completely joined to each other either. Thereafter, in the step (d), solder cream can be applied to the terminal mounting portion 328 of the circuit printed on the front surface of the second board 320. Here, the solder cream applied to the terminal mounting portion 328 can be applied for reflowing the terminals 322A and 322B of the heating element 322 to the terminal mounting portion 328 in the step (e). Also, in the step (d), an insertion groove 331 can be formed on the front surface of the heat sink 330 through the first through hole 311 and the second through hole 321.

[0086] In the step (e), the heating element 322 is passed through the first through hole 311 and the second through hole 321, the rear surface of the heating element 322 is brought into contact with the front surface of the heat sink 330, and after the terminals 322A and 322B of the heating element 322 are brought into contact with the terminal mounting portion 328, the rear surface of the first board 310 and the front surface of the second board 320, the rear surface of the second board 320 and the front surface of the heat sink 330, and the terminals 322A and 322B of the heating element 322 and the terminal mounting portion 328 can be reflowed simultaneously. On the other hand, in this embodiment, since the insertion groove 331 is formed on the front surface of the heat sink 330 in the step (d), in the step (e), the rear end portion of the heating element 322 can be inserted into the insertion groove 331.

[0087] The power amplification device 300 of the embodiment shown in FIG. 10 is configured such that the first board 310 and the second board 320 are provided in surface contact with each other, the heat sink 330 is provided in surface contact with the second board 320, and the heat generating element 322 mounted on the second board 320 contacts the heat sink 330. Therefore, the first board 310 and the second board 320 can be configured compactly, and the heat generated from the heat generating element 322 can be easily dissipated through the heat sink 330.

[0088] On the other hand, in the manufacturing method of the power amplification device 300 according to an embodiment of the present invention described above, the reflow process, which is a process of soldering by applying heat to the solder cream, must be performed once in the step (a), once in the step (b), and once in the step (e). Therefore, there is the trouble that the reflow process must be performed three times in total.

[0089] Hereinafter, an embodiment in which the reflow process is performed only once will be described with reference to FIG. 10 again.

[0090] Referring to FIG. 10, in the manufacturing method of the power amplification device 300 according to an embodiment of the present invention, the elements 319 and 329 are only mounted on the first board 310 and the second board 320 respectively without reflow, and the first board 310, the second board 320, and the heat sink 330 are laminated and reflowed, so that the elements 319 and 329 can be joined to the respective boards 310 and 320, and the boards 310 and 320 can be joined to each other at the same time.

[0091] Specifically, in the manufacturing method of the power amplification device 300 according to an embodiment of the present invention, in the step (a), after applying solder cream to the front surface of the first board 310 in which the first through hole 311 passing through in the front and rear directions is formed, the rear surface of the first element 319 can be mounted on the front surface of the first board 310. In this case, the first element 319 is temporarily fixed to the front surface of the first board 310 by the viscosity of the solder cream applied to the front surface of the first board 310. Here, the solder cream applied to the front surface of the first board 310 can be applied for reflowing the rear surface of the first element 319 to the front surface of the first board 310 in the step (e). Thereafter, in the step (a), solder cream can be applied to the rear surface of the first board 310. When applying solder cream to the rear surface of the first board 310, after fixing the first board 310 to the jig so that the rear surface of the first board 310 faces upward, solder cream can be applied to the rear surface of the first board 310. Here, the solder cream applied to the rear surface of the first board 310 can be applied for reflowing the rear surface of the first board 310 to the front surface of the second board 320 in the step (e).

[0092] In the step (b), after applying solder cream to the front surface of the second board 320 in which the second through hole 321 passing through in the front and rear directions is formed at a position corresponding to the first through hole 311, the rear surface of the second element 329 can be mounted on the front surface of the second board 320. In this case, the second element 329 is temporarily fixed to the front surface of the second board 320 by the viscosity of the solder cream applied to the front surface of the second board 320. Here, the solder cream applied to the front surface of the second board 320 can be applied for reflowing the rear surface of the second element 329 to the front surface of the second board 320 in the step (e).

[0093] In the step (c), solder cream can be applied to the front surface of the heat sink 330. Here, the solder cream applied to the front surface of the heat sink 330 can be applied for reflowing the rear surface of the second board 320 to the front surface of the heat sink 330 in the step (e).

[0094] In the step (d), the rear surface of the second board 320 can be disposed on the front surface of the heat sink 330, and the rear surface of the first board 310 can be disposed on the front surface of the second board 320. In this way, the second element 329 mounted on the second board 320 can penetrate through the first through hole 311 formed in the first board 310. In this state, since the rear surface of the first board 310 is not reflowed to the front surface of the second board 320, and the rear surface of the second board 320 is not reflowed to the front surface of the heat sink 330, the first board 310 and the second board 320 are not completely joined to each other, and the second board 320 and the heat sink 330 are not completely joined to each other either. Thereafter, in the step (d), solder cream can be applied to the terminal mounting portion 328 of the circuit printed on the front surface of the second board 320. Here, the solder cream applied to the terminal mounting portion 328 can be applied to reflow the terminals 322A and 322B of the heating element 322 to the terminal mounting portion 328 in the step (e). Further, in the step (d), an insertion groove 331 can be formed on the front surface of the heat sink 330 through the first through hole 311 and the second through hole 321.

[0095] In the step (e), the heating element 322 is passed through the first through hole 311 and the second through hole 321, the rear surface of the heating element 322 is brought into contact with the front surface of the heat sink 330, and the terminals 322A and 322B of the heating element 322 are brought into contact with the terminal mounting portion 328. Then, the rear surface of the first element 319 and the front surface of the first board 310, the rear surface of the second element 329 and the front surface of the second board 320, the rear surface of the first board 310 and the front surface of the second board 320, the rear surface of the second board 320 and the front surface of the heat sink 330, and the terminals 322A and 322B of the heating element 322 and the terminal mounting portion 328 can be reflowed simultaneously. On the other hand, in this embodiment, since the insertion groove 331 is formed on the front surface of the heat sink 330 in the step (d), in the step (e), the rear end portion of the heating element 322 can be inserted into the insertion groove 331.

[0096] FIG. 11 is a diagram showing another example of the process of manufacturing the power amplification device shown in FIG. 1. Here, for the sake of understanding the description, it will be described by taking as an example that only one each of the first through-hole 311, the second through-hole 321, the insertion groove 331, and the heating element 322 is provided.

[0097] Referring to FIG. 11, the manufacturing method of the power amplification device 300 according to another embodiment of the present invention can be seen to have differences compared with the manufacturing method of the power amplification device 300 according to an embodiment of the present invention, as described with reference to FIG. 10.

[0098] That is, in one embodiment described with reference to FIG. 10, the insertion groove 331 was formed on the front surface of the heat sink 330 in step (d), but in another embodiment described with reference to FIG. 11, the insertion groove 331 can be formed in advance on the front surface of the heat sink 330 before step (a). It shows that the insertion groove 331 was formed in advance on the front surface of the heat sink 330 shown in step (c) of FIG. 11.

[0099] Specifically, the manufacturing method of the power amplification device 300 according to another embodiment of the present invention can include step (a), step (b), step (c), step (d), and step (e).

[0100] In the step (a), after applying solder cream to the front surface of the first board 310 in which a first through hole 311 passing through the front and rear is formed, the rear surface of the first element 319 can be reflowed (which means the process of applying heat to the solder cream to perform soldering) to the front surface of the first board 310. In this case, the first element 319 is completely fixedly mounted on the front surface of the first board 310. Here, the first element 319 may be the power element and the control element mounted on the front surface of the first board 310. Thereafter, in the step (a), solder cream can be applied to the rear surface of the first board 310. When applying solder cream to the rear surface of the first board 310, after fixing the first board 310 to the jig so that the rear surface of the first board 310 faces upward, solder cream can be applied to the rear surface of the first board 310. Here, the solder cream applied to the rear surface of the first board 310 can be applied for reflowing the rear surface of the first board 310 to the front surface of the second board 320 in the step (e).

[0101] In the step (b), after applying solder cream to the front surface of the second board 320 in which a second through hole 321 passing through the front and rear is formed at a position corresponding to the first through hole 311, the rear surface of the second element 329 can be reflowed to the front surface of the second board 320. In this case, the second element 329 is completely fixedly mounted on the front surface of the second board 320. Here, the second element 329 may be an element excluding the transmitting amplifier element (Tx), which is the heat generating element 322, among the RF elements mounted on the front surface of the second board 320.

[0102] In the step (c), solder cream can be applied to the front surface of the heat sink 330. Here, the solder cream applied to the front surface of the heat sink 330 can be applied for reflowing the rear surface of the second board 320 to the front surface of the heat sink 330 in the step (e).

[0103] In the step (d), the rear surface of the second board 320 can be disposed on the front surface of the heat sink 330, and the rear surface of the first board 310 can be disposed on the front surface of the second board 320. In this way, the second element 329 mounted on the second board 320 can penetrate through the first through hole 311 formed in the first board 310. In this state, since the rear surface of the first board 310 is not reflowed onto the front surface of the second board 320, and the rear surface of the second board 320 is not reflowed onto the front surface of the heat sink 330, the first board 310 and the second board 320 are not completely joined to each other, and the second board 320 and the heat sink 330 are not completely joined to each other either. Thereafter, in the step (d), solder cream can be applied to the terminal mounting portion 328 of the circuit printed on the front surface of the second board 320. Here, the solder cream applied to the terminal mounting portion 328 can be applied in order to reflow the terminals 322A and 322B of the heating element 322 to the terminal mounting portion 328 in the step (e).

[0104] In the step (e), the heating element 322 is passed through the first through hole 311 and the second through hole 321, the rear surface of the heating element 322 is brought into contact with the front surface of the heat sink 330, and after the terminals 322A and 322B of the heating element 322 are brought into contact with the terminal mounting portion 328, the rear surface of the first board 310 and the front surface of the second board 320, the rear surface of the second board 320 and the front surface of the heat sink 330, and the terminals 322A and 322B of the heating element 322 and the terminal mounting portion 328 can be reflowed simultaneously. On the other hand, in the present embodiment, since the insertion groove 331 is formed in the front surface of the heat sink 330 before the step (a), in the step (e), the rear end portion of the heating element 322 can be inserted into the insertion groove 331.

[0105] On the other hand, in the manufacturing method of the power amplifier device 300 according to another embodiment of the present invention described above, since the reflow process, which is a process of applying heat to the solder cream for soldering, has to be performed once in the step (a), once in the step (b), and once in the step (e), there is a nuisance that the reflow process has to be performed three times in total.

[0106] Hereinafter, another embodiment in which the reflow process is performed only once will be described with reference to FIG. 11 again.

[0107] Referring to FIG. 11, in the manufacturing method of the power amplifier device 300 according to another embodiment of the present invention, in the step (a), after applying solder cream to the front surface of the first board 310 in which the first through hole 311 passing through the front and rear is formed, the rear surface of the first element 319 can be mounted on the front surface of the first board 310. In this case, the first element 319 is temporarily fixed to the front surface of the first board 310 by the viscosity of the solder cream applied to the front surface of the first board 310. Here, the solder cream applied to the front surface of the first board 310 can be applied for reflowing the rear surface of the first element 319 to the front surface of the first board 310 in the step (e). Thereafter, in the step (a), solder cream can be applied to the rear surface of the first board 310. When applying solder cream to the rear surface of the first board 310, after fixing the first board 310 to the jig so that the rear surface of the first board 310 faces upward, solder cream can be applied to the rear surface of the first board 310. Here, the solder cream applied to the rear surface of the first board 310 can be applied for reflowing the rear surface of the first board 310 to the front surface of the second board 320 in the step (e).

[0108] In the step (b), after applying solder cream to the front surface of the second board 320 in which the second through hole 321 passing through the front and rear is formed at a position corresponding to the first through hole 311, the rear surface of the second element 329 can be mounted on the front surface of the second board 320. In this case, the second element 329 is temporarily fixed to the front surface of the second board 320 by the viscosity of the solder cream applied to the front surface of the second board 320. Here, the solder cream applied to the front surface of the second board 320 can be applied for reflowing the rear surface of the second element 329 to the front surface of the second board 320 in the step (e).

[0109] In the step (c), solder cream can be applied to the front surface of the heat sink 330. Here, the solder cream applied to the front surface of the heat sink 330 can be used for reflowing the rear surface of the second board 320 onto the front surface of the heat sink 330 in the step (e).

[0110] In the step (d), the rear surface of the second board 320 can be placed on the front surface of the heat sink 330, and the rear surface of the first board 310 can be placed on the front surface of the second board 320. In this way, the second element 329 mounted on the second board 320 can penetrate through the first through hole 311 formed in the first board 310. In this state, since the rear surface of the first board 310 is not reflowed onto the front surface of the second board 320 and the rear surface of the second board 320 is not reflowed onto the front surface of the heat sink 330, the first board 310 and the second board 320 are not completely joined to each other, and the second board 320 and the heat sink 330 are not completely joined to each other either. Subsequently, in the step (d), solder cream can be applied to the terminal mounting portion 328 of the circuit printed on the front surface of the second board 320. Here, the solder cream applied to the terminal mounting portion 328 can be used for reflowing the terminals 322A and 322B of the heat generating element 322 onto the terminal mounting portion 328 in the step (e).

[0111] In the step (e), the heat generating element 322 is passed through the first through hole 311 and the second through hole 321, the rear surface of the heat generating element 322 is brought into contact with the front surface of the heat sink 330, and after the terminals 322A and 322B of the heat generating element 322 are brought into contact with the terminal mounting portion 328, the rear surface of the first element 319 and the front surface of the first board 310, the rear surface of the second element 329 and the front surface of the second board 320, the rear surface of the first board 310 and the front surface of the second board 320, the rear surface of the second board 320 and the front surface of the heat sink 330, and the terminals 322A and 322B of the heat generating element 322 and the terminal mounting portion 328 can be reflowed simultaneously. On the other hand, in this embodiment, since the insertion groove 331 is formed in the front surface of the heat sink 330 before the step (a), in the step (e), the rear end portion of the heat generating element 322 can be inserted into the insertion groove 331.

[0112] On the one hand, referring to FIG. 10, in a power amplification device according to an embodiment of the present invention, an insertion groove 331 is formed, and the thickness before and after the first board 310 and the second board 320 are brought into contact is formed to be thinner than the thickness before and after the heating element 322. In this case, when the first board 310, the second board 320, and the heat sink 330 are coupled to each other, the rear portion of the heating element 322 is inserted into the insertion groove 331, and the front surface of the heating element 322 is disposed on the same plane as the front surface of the first board 310.

[0113] FIG. 12 is a diagram showing still another embodiment of the process of manufacturing the power amplification device shown in FIG. 1. Here, the same components as those in the embodiment described above with reference to FIG. 10 are denoted by the same reference numerals, and detailed descriptions thereof are omitted, and only the differences will be described.

[0114] Referring to FIG. 12, it can be seen that a power amplification device according to still another embodiment of the present invention is different from the power amplification device of the embodiment described above shown in FIG. 10. That is, in the power amplification device of the embodiment described above shown in FIG. 10, the insertion groove 331 is formed in the front surface of the heat sink 330, but in the power amplification device of the present embodiment shown in FIG. 12, the insertion groove is not formed in the heat sink 330. In the power amplification device of the present embodiment shown in FIG. 12, the thickness before and after the first board 310 and the second board 320 are brought into contact is formed to be the same as the thickness before and after the heating element 322. In this case, in the power amplification device of the present embodiment shown in FIG. 12, when the first board 310, the second board 320, and the heat sink 330 are coupled to each other, the rear surface of the heating element 322 contacts the upper surface of the heat sink 330, and the front surface of the heating element 322 is disposed on the same plane as the front surface of the first board 310.

[0115] Since the insertion groove 331 is not formed in the heat sink 330 in the power amplification device of the embodiment shown in FIG. 12 as compared with the power amplification device of the embodiment shown in FIG. 10, the manufacturing process can be simplified as compared with the power amplification device of the embodiment described above shown in FIG. 10.

[0116] Depending on the thicknesses of the first board 310 before and after and the thicknesses of the second board 320 before and after, one of the heat sinks 330 with the insertion grooves 331 shown in FIG. 10 and the heat sinks 330 without the insertion grooves 331 shown in FIG. 12 is used so that the front surface of the heating element 322 is arranged on the same plane as the front surface of the first board 310.

[0117] As described above, according to the power amplifier 300 and the method of manufacturing the same according to the embodiments of the present invention, the first board 310 and the second board 320 are provided in surface contact with each other, the heat sink 330 is provided in surface contact with the second board 320, and the heating element 322 mounted on the second board 320 contacts the heat sink 330. Therefore, the first board 310 and the second board 320 can be configured compactly, and the heat generated from the heating element 322 can be easily dissipated through the heat sink 330.

[0118] Those of ordinary skill in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing its technical idea and essential features. Therefore, it should be understood that the embodiments described above are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the claims described below rather than the above detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalent concept thereof should be construed as being included in the scope of the present invention.

Industrial Applicability

[0119] The present invention provides a power amplifier and a method of manufacturing the same in which a plurality of substrates are stacked to provide a compact substrate, a heat sink is provided in surface contact with one of the plurality of substrates, and a heating element mounted on the substrate contacts the heat sink, thereby improving heat dissipation performance.

Explanation of Reference Numerals

[0120] 300: Power amplifier 310: First board 316: Circuit connection part 317: Connector pin connection hole 319: First element 320: Second board 321: Second through-hole 322: Heating element 322A, 322B: Terminals of the heating element 328: Terminal mounting part 329: Second element 330: Heat sink 331: Insertion groove

Claims

1. After applying solder cream to the front surface of the first board having a first through hole passing through it front and back, reflowing the rear surface of the first element onto the front surface of the first board (a) step; After applying solder cream to the front surface of the second board having a second through hole passing through it front and back at a position corresponding to the first through hole, reflowing the rear surface of the second element onto the front surface of the second board (b) step; Applying solder cream to the front surface of the heat sink (c) step; Placing the rear surface of the second board on the front surface of the heat sink, placing the rear surface of the first board on the front surface of the second board, and then applying solder cream to the terminal mounting portion of the circuit printed on the front surface of the second board (d) step; Passing the heating element through the first through hole and the second through hole, bringing the rear surface of the heating element into contact with the front surface of the heat sink, bringing the terminals of the heating element into contact with the terminal mounting portion, and then simultaneously reflowing the rear surface of the first board and the front surface of the second board, the rear surface of the second board and the front surface of the heat sink, and the terminals of the heating element and the terminal mounting portion (e) step; A method for manufacturing a power amplifier device including.

2. In the (d) step, an insertion groove is formed on the front surface of the heat sink through the first through hole and the second through hole, In the (e) step, the rear end portion of the heating element is inserted into the insertion groove. The method for manufacturing a power amplifier device according to claim 1.

3. In the (e) step, the rear end portion of the heating element is inserted into an insertion groove formed on the front surface of the heat sink. The method for manufacturing a power amplifier device according to claim 1.

4. The first board includes a plurality of sections divided in the left - right direction by a plating portion forming a circuit printed on the front surface of the first board, The first through holes are formed one by one in the plurality of sections and are formed of a plurality of first through holes, The second through holes are formed at positions corresponding to the plurality of first through holes, and are formed by the plurality of second through holes. The insertion grooves are formed at positions corresponding to the plurality of second through holes, and are formed by the plurality of insertion grooves. The heating elements are formed by a plurality of heating elements that respectively penetrate through each of the plurality of first through holes and each of the plurality of second through holes, and the rear end portions thereof are respectively inserted into the plurality of insertion grooves. The method for manufacturing a power amplification device according to claim 2 or 3.

5. After applying solder cream to the front surface of the first board in which the first through holes passing through front and back are formed, mount the rear surface of the first element on the front surface of the first board, and apply solder cream to the rear surface of the first board (step (a)); After applying solder cream to the front surface of the second board in which the second through holes passing through front and back are formed at positions corresponding to the first through holes, mount the rear surface of the second element on the front surface of the second board (step (b)); Apply solder cream to the front surface of the heat sink (step (c)); Place the rear surface of the second board on the front surface of the heat sink, place the rear surface of the first board on the front surface of the second board, and then apply solder cream to the terminal mounting portion of the circuit printed on the front surface of the second board (step (d)); Pass the heating element through the first through hole and the second through hole, bring the rear surface of the heating element into contact with the front surface of the heat sink, bring the terminal of the heating element into contact with the terminal mounting portion, and then simultaneously reflow the rear surface of the first element and the front surface of the first board, the rear surface of the second element and the front surface of the second board, the rear surface of the first board and the front surface of the second board, the rear surface of the second board and the front surface of the heat sink, and the terminal of the heating element and the terminal mounting portion (step (e)). The method for manufacturing a power amplification device includes these steps.

6. In the step (d), insertion grooves are formed on the front surface of the heat sink through the first through hole and the second through hole. In the step (e), the method for manufacturing a power amplification device according to claim 5, wherein a rear end portion of the heating element is inserted into the insertion groove.

7. In the step (e), the method for manufacturing a power amplification device according to claim 5, wherein a rear end portion of the heating element is inserted into the insertion groove formed on the front surface of the heat sink.

8. The first board includes a plurality of sections divided in the left - right direction by plating portions that form circuits printed on the front surface of the first board, The first through - holes are formed one by one in the plurality of sections and are formed by a plurality of first through - holes, The second through - holes are formed at positions corresponding to each of the plurality of first through - holes and are formed by a plurality of second through - holes, The insertion grooves are formed at positions corresponding to each of the plurality of second through - holes and are formed by a plurality of insertion grooves, The heating element is formed by a plurality of heating elements that respectively penetrate each of the plurality of first through - holes and each of the plurality of second through - holes, and each rear end portion is inserted into each of the plurality of insertion grooves. The method for manufacturing a power amplification device according to claim 6 or 7.

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