Electronic device, imaging device, and mobile body

Abstract

To improve heat dissipation properties with a configuration that is simple while having radiation noise blocking properties.SOLUTION: An electronic apparatus has a first substrate, a second substrate, a first sheet metal, and a second sheet metal. The first substrate and the second substrate have electronic components mounted thereon, and are located in a lamination direction such that principal surfaces are opposite to each other. The first sheet metal has: a plate part that is interposed between the first substrate and the second substrate and is in direct or indirect contact with the electronic components mounted respectively on the first substrate and the second substrate; and a first blocking part that covers part of a side face of the first substrate. The second sheet metal has a second blocking part that covers the entire periphery of a side face of the second substrate and a side face of the first substrate exposed from the first sheet metal. The first sheet metal and the second sheet metal are in direct or indirect contact with each other.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to an electronic device, an imaging device, and a moving body.

Background Art

[0002] In an electronic device such as an in-vehicle camera, it is required to miniaturize and perform various processes at high speed. With the multilayer and high integration of the circuit board for miniaturization, the radiation noise and heat generation of the electronic device on the circuit board are increasing. Therefore, a configuration has been proposed in which the entire side surface of the circuit board is covered with a shielding member and the circuit board is brought into contact with a heat transfer member formed of a soft material such as silicone gel (see Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in an electronic device, it is required to further improve heat dissipation with a simple configuration while having shielding properties against radiation noise.

[0005] Therefore, an object of the present disclosure made in view of the problems of the prior art as described above is to provide an electronic device, an imaging device, and a moving body that further improve heat dissipation with a simple configuration while having shielding properties against radiation noise.

Means for Solving the Problems

[0006] To solve the above-described various problems, an electronic device according to a first aspect includes a first substrate and a second substrate on which electronic components are mounted and which are positioned in a stacking direction so that their main surfaces face each other, and A first sheet metal having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly contacting the electronic components mounted on each of the first substrate and the second substrate, and a first shielding portion covering a part of the side surface of the first substrate. A second sheet metal having a second shielding portion covering the entire circumference of the side surface of the second substrate and the side surface of the first substrate exposed from the first sheet metal. The first sheet metal and the second sheet metal are in direct or indirect contact.

[0007] Also, an imaging device according to a second aspect A first substrate and a second substrate on which electronic components are mounted and are positioned in the stacking direction such that their main surfaces face each other. A first sheet metal having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly contacting the electronic components mounted on each of the first substrate and the second substrate, and a first shielding portion covering a part of the side surface of the first substrate. A second sheet metal having a second shielding portion covering the entire circumference of the side surface of the second substrate and the side surface of the first substrate exposed from the first sheet metal. The first sheet metal and the second sheet metal are in direct or indirect contact.

[0008] Also, a moving body according to a third aspect A first substrate and a second substrate on which electronic components are mounted and are positioned in the stacking direction such that their main surfaces face each other. A first sheet metal having a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly contacting the electronic components mounted on each of the first substrate and the second substrate, and a first shielding portion covering a part of the side surface of the first substrate. A second sheet metal having a second shielding portion covering the entire circumference of the side surface of the second substrate and the side surface of the first substrate exposed from the first sheet metal. Mounts an imaging device in which the first sheet metal and the second sheet metal are in direct or indirect contact.

Advantages of the Invention

[0009] According to the present disclosure configured as described above, while having shielding properties against radiation noise, the heat dissipation performance is further improved with a simple configuration.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Figure 21

Figure 22

Figure 23

Figure 24

Figure 25

Figure 26

Embodiments for Carrying Out the Invention

[0011] Hereinafter, an electronic device, an imaging device, and a moving body according to a first embodiment of the present disclosure will be described with reference to the drawings.

[0012] The electronic device according to the first embodiment is specifically, for example, an imaging device. As shown in FIG. 1, the electronic device 10 applied to the imaging device according to the first embodiment is mounted on, for example, a moving body 11.

[0013] The moving body 11 may include, for example, vehicles, ships, and aircraft. The vehicle may include, for example, automobiles, industrial vehicles, railway vehicles, living vehicles, and fixed-wing aircraft that run on runways. Automobiles may include, for example, passenger cars, trucks, buses, motorcycles, and trolley buses. Industrial vehicles may include, for example, industrial vehicles for agriculture and construction. Industrial vehicles may include, for example, forklifts and golf carts. Industrial vehicles for agriculture may include, for example, tractors, cultivators, transplanters, binders, combines, and lawn mowers. Industrial vehicles for construction may include, for example, bulldozers, scrapers, shovel cars, crane cars, dump trucks, and road rollers. Vehicles may include those that run by human power. The classification of vehicles is not limited to the examples described above. For example, automobiles may include industrial vehicles that can run on roads. The same vehicle may be included in multiple classifications. Ships may include, for example, marine jets, boats, and tankers. Aircraft may include, for example, fixed-wing aircraft and rotary-wing aircraft.

[0014] As shown in FIGS. 2 and 3, the electronic device 10 includes a first substrate 12, a second substrate 13, a first sheet metal 14, and a second sheet metal 15. The electronic device 10 may further include an imaging optical system 16, a first housing 17, and a second housing 18.

[0015] As shown in FIGS. 4 and 5, the first substrate 12 is flat. The first substrate 12 may be substantially rectangular. As shown in FIGS. 2 and 3, on the side opposite to the surface facing the flat plate portion 23, which will be described later, the first substrate 12 mounts the imaging device 19 as an electronic component. The imaging device 19 is, for example, a CCD (Charge Coupled Device) image sensor and a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and generates an image signal by imaging an optical image formed on the light receiving surface. The first substrate 12 mounts the electronic component 20 on at least one main surface. The electronic component 20 drives the imaging device 19 or processes the image signal generated by the imaging device 19.

[0016] As shown in FIGS. 4 and 5, the second substrate 13 is flat. The second substrate 13 may be substantially rectangular. The second substrate 13 mounts the electronic component 20 on at least one main surface. The electronic component 20 drives the imaging device 19 or processes the image signal generated by the imaging device 19. The second substrate 13 may mount the first connector 21 for electrically connecting to the second housing 18 on one main surface.

[0017] The first substrate 12 may be electrically connected to the second substrate 13 by the flexible substrate 22. As shown in FIG. 4, in a state where the entire flexible substrate 22 is extended flat, the imaging device 19 of the first substrate 12 and the first connector 21 of the second substrate 13 may be mounted on the main surfaces on the same side.

[0018] As shown in FIGS. 2 and 3, in the electronic device 10, the first substrate 12 and the second substrate 13 are positioned in the stacking direction such that their main surfaces face each other.

[0019] As shown in FIG. 6, the first sheet metal 14 has a flat plate portion 23 and a first shielding portion 24.

[0020] The flat plate portion 23 is flat. The flat plate portion 23 may be substantially rectangular and wider than the first substrate 12 and the second substrate 13. As shown in FIGS. 2 and 3, in the electronic device 10, the flat plate portion 23 is interposed between the first substrate 12 and the second substrate 13 in the stacking direction. In the electronic device 10, the main surface of the flat plate portion 23 may be substantially parallel to the main surfaces of the first substrate 12 and the second substrate 13.

[0021] As shown in FIG. 6, the flat plate portion 23 has an opening 25 near the side connected to the first shielding portion 24. The opening 25 may be substantially rectangular. As shown in FIG. 2, in the electronic device 10, the opening 25 is latched to the two latching portions 33 of the second sheet metal 15.

[0022] In the electronic device 10, the flat plate portion 23 is in direct or indirect contact with the electronic components 20 mounted on the first substrate 12 and the second substrate 13 respectively. In the electronic device 10, the flat plate portion 23 is in indirect contact with, for example, the imaging element 19 which is an electronic component via the heat dissipation sheet 27 and the first substrate 12. In the electronic device 10, the flat plate portion 23 is in indirect contact with, for example, the electronic components 20 mounted on the second substrate 13 via the heat dissipation sheet 27. The heat dissipation sheet 27 may be formed of a soft material having shape followability, such as silicon rubber with filler, and having relatively high thermal conductivity.

[0023] As shown in FIG. 6, the first shielding portion 24 is erected along a part of the outer edge of the flat plate portion 23 on the main surface side of the flat plate portion 23 facing the first substrate 12. For example, the first shielding portion 24 is erected along all of any one side of the flat plate portion 23 and a part of the two sides sandwiching the one side. As shown in FIGS. 2 and 3, in the electronic device 10, the first shielding portion 24 covers a part of the side surface of the first substrate 12.

[0024] As shown in FIG. 6, the first shielding portion 24 has a first fixing portion 26. In the present embodiment, the first shielding portion 24 has the first fixing portion 26 at a substantially central portion of a side opposite to the side connected to the flat plate portion 23. As shown in FIGS. 2 and 3, the first sheet metal 14 is fixed to the lens barrel 16A that houses the imaging optical system 16 by the first fixing portion 26. The fixing of the first fixing portion 26 to the lens barrel 16A of the imaging optical system 16 is, for example, fixing by engagement, but is not limited thereto, and welding, adhesion by an adhesive, fastening by screwing, etc. may be applied.

[0025] The first sheet metal 14 is formed by bending a predetermined portion of a metallic flat plate having a desired shape, that is, a sheet metal, as shown in FIG. 7. In FIG. 7, the straight line bent to the front surface side is indicated by a broken line, and the straight line bent to the back surface side is indicated by a one-dot chain line. Therefore, by stretching the bent portions of the first sheet metal 14 into a planar shape, any portions of the first sheet metal 14 are separated from each other without causing interference. The first sheet metal 14 may be formed of a metal having high thermal conductivity such as copper.

[0026] As shown in FIG. 8, the second sheet metal 15 has a second shielding portion 28.

[0027] The second shielding portion 28 has a substantially rectangular corner tube shape, and one side of the rectangle in the axial cross section and a part of the two sides sandwiching the one side protrude in the axial direction in a C-shaped form. That is, the second shielding portion 28 has a substantially rectangular corner tube-shaped full shielding portion 30 and a partial shielding portion 29 that is axially continuous from the full shielding portion 30 and has a circumferential part cut out in a corner tube shape. As shown in FIGS. 2 and 3, in the electronic device 10, the second sheet metal 15 covers the entire circumference of the side surface of the second substrate 13 and the side surface of the first substrate 12 exposed from the first sheet metal 14. In this configuration, the full shielding portion 30 covers the entire circumference of the side surface of the second substrate 13. Also, the partial shielding portion 29 covers the side surface of the first substrate 12 exposed from the first sheet metal 14.

[0028] As shown in Fig. 8, the second shielding portion 28 has a second fixing portion 31 at the axial side end of the partial shielding portion 29. That is, the second shielding portion 28 has the second fixing portion 31 at the edge of the partial shielding portion 29 on the side opposite to the direction continuous with the full shielding portion 30. In the present embodiment, the second fixing portion 31 is disposed on the surface sandwiched between the other two surfaces among the three surfaces of the partial shielding portion 29. As shown in Fig. 2, the second sheet metal 15 is fixed to the lens barrel 16A that houses the imaging optical system 16 by the second fixing portion 31. The fixing of the second fixing portion 31 to the lens barrel 16A of the imaging optical system 16 is, for example, fixing by engagement, but is not limited thereto, and welding, adhesion by an adhesive, fastening by screwing, etc. may be applied.

[0029] As shown in Fig. 8, the full shielding portion 30 of the second shielding portion 28 has a gap 32 in the circumferential direction. The gap 32 is a gap between the ends of the flat plate when the metallic flat plate is bent to form the second sheet metal 15 with the ends of the flat plate facing each other. The full shielding portion 30 of the second shielding portion 28 has two latching portions 33 adjacent to each other with the gap 32 therebetween in the vicinity of the gap 32. The two latching portions 33 are located at the axial side end of the full shielding portion 30. As shown in Fig. 2, in the electronic device 10, the two latching portions 33 are latched with the opening 25 of the first sheet metal 14.

[0030] As shown in Fig. 8, in the second shielding portion 28, the second fixing portion 31 and the two latching portions 33 are provided on surfaces facing each other. Thereby, as shown in Fig. 2, when the first sheet metal 14 and the second sheet metal 15 are attached to the electronic device 10, the first fixing portion 26 of the first sheet metal 14 and the second fixing portion 31 of the second sheet metal 15 sandwich the lens barrel 16A that houses the imaging optical system 16 from two directions perpendicular to the optical axis.

[0031] The second sheet metal 15 is formed by bending a predetermined portion of a metallic flat plate having a desired shape, that is to say, as shown in FIG. 9. In FIG. 9, the straight line to be bent to the front surface side is indicated by a broken line, and the straight line to be bent to the back surface side is indicated by a one-dot chain line. Therefore, by stretching the bent portions of the second sheet metal 15 to make it flat, any parts of the second sheet metal 15 are separated from each other without causing interference. The second sheet metal 15 may be formed of a metal having high thermal conductivity such as copper, for example.

[0032] The imaging optical system 16 is composed of optical elements such as lenses. The imaging optical system 16 is designed and formed such that optical characteristics such as the angle of view and the depth of field of view become desired values. The imaging optical system 16 forms the imaged subject image on the light receiving surface of the imaging element 19.

[0033] As shown in FIG. 10, the first housing 17 may have a cylindrical shape with a rectangular cross section. As shown in FIGS. 2 and 3, the first housing 17 may accommodate the imaging optical system 16 such that the optical axis of the imaging optical system 16 substantially coincides with the axis of the first housing 17 and the imaging optical system 16 is exposed from one opening. The first housing 17 may accommodate the first substrate 12 such that the imaging element 19 is fixed at a predetermined position and in a predetermined posture with respect to the imaging optical system 16. The first housing 17 may accommodate the second substrate 13, the first sheet metal 14, and the second sheet metal 15 such that the above-described configuration is satisfied with respect to the first substrate 12.

[0034] As shown in FIGS. 2 and 3, between the imaging optical system 16 and the first substrate 12, a third sheet metal 34 and an imaging element cover 35 that surround the side surface with respect to the stacking direction of the imaging element 19 are provided. The third sheet metal 34 may be formed of a metal having high thermal conductivity such as copper, for example. The third sheet metal 34 and the imaging element cover 35 dissipate the heat generated by the imaging element 19 to the outside. The imaging element cover 35 may be formed of a soft material having shape followability and relatively high thermal conductivity, such as silicon rubber with filler, for example.

[0035] As shown in FIG. 11, the second housing 18 may have a shape having a flat plate portion and a quadrangular prism extending perpendicular to the main surface of the flat plate portion. The second housing 18 may have a second connector 36 that can be fitted with the first connector 21. The second housing 18 may have a fourth sheet metal 37. As shown in FIGS. 2 and 3, in the electronic device 10, the fourth sheet metal 37 is in contact with the second sheet metal 15. The second housing 18 may be sealed in the flat plate portion on the side opposite to the side where the imaging optical system 16 of the first housing 17 is exposed, that is, on the image side opening in the optical axis direction of the imaging optical system 16.

[0036] Next, a method for manufacturing the electronic device 10 will be described below.

[0037] As shown in FIG. 12, a third sheet metal 34 and an imaging element cover 35 are attached to the image side in the optical axis direction of the imaging optical system 16 of the lens barrel 16A that houses the imaging optical system 16. The third sheet metal 34 is fixed to the lens barrel 16A of the imaging optical system 16 by a third fixing portion 38 that the third sheet metal 34 has.

[0038] As shown in FIG. 13, on the image side in the optical axis direction of the imaging optical system 16, the first substrate 12 is fixed so that the imaging optical system 16 and the imaging element 19 face each other.

[0039] As shown in FIG. 14, the flat plate portion 23 of the first sheet metal 14 is attached to the first substrate 12. A heat dissipation sheet 27 may be used for attaching the flat plate portion 23 of the first sheet metal 14 and the first substrate 12. At this time, the first shielding portion 24 of the first sheet metal 14 does not cover the portion of the first substrate 12 where the flexible substrate 22 is provided. Further, the first sheet metal 14 is fixed to the lens barrel 16A by a first fixing portion 26.

[0040] As shown in FIG. 15, the flexible substrate 22 is folded back, and the second substrate 13 is attached to the flat plate portion 23. A heat dissipation sheet 27 may be used for attaching the flat plate portion 23 of the first sheet metal 14 and the second substrate 13.

[0041] As shown in FIG. 16, the second sheet metal 15 is attached so as to cover the periphery of the second substrate 13 from the side of the first connector 21 in the optical axis direction of the imaging optical system 16. Two latching portions 33 of the second sheet metal 15 are latched with the opening 25 of the first sheet metal 14. Further, the second sheet metal 15 is fixed to the lens barrel 16A of the imaging optical system 16 by the second fixing portion 31. In this way, as shown in FIG. 17, the internal structure 39 of the electronic device 10 is configured.

[0042] As shown in FIGS. 2 and 3, the second substrate 13 is connected to the second housing 18 by fitting the first connector 21 into the second connector 36. As a result, the fourth sheet metal 37 abuts on the second sheet metal 15. Thereafter, the first housing 17 is placed over the second housing 18 so as to cover the internal structure 39. That is, the first housing 17 is placed over the second housing 18 so as to cover the imaging optical system 16, the first substrate 12, the second substrate 13, the first sheet metal 14, and the second sheet metal 15. With the first housing 17 covering the internal structure 39, the first housing 17 is fixed to the second housing 18, whereby the electronic device 10 is manufactured. For the fixation of the first housing 17 and the second housing 18, for example, welding, adhesion with an adhesive, and fastening with screws are applicable.

[0043] The electronic device 10 according to the first embodiment having the above-described configuration has a flat plate portion 23 that is interposed between the first substrate 12 and the second substrate 13 and indirectly abuts on the imaging element 19 mounted on the first substrate 12 and the electronic component 20 mounted on the second substrate 13. With such a configuration, in the electronic device 10, the imaging element 19 mounted on the first substrate 12 and the electronic component 20 mounted on the second substrate 13, which are heat sources, are close to the flat plate portion 23 having generally higher heat conductivity than the heat dissipation sheet 27. Therefore, the heat dissipation performance is improved as compared with the configuration in which only the heat dissipation sheet 27 is interposed.

[0044] Furthermore, the electronic device 10 according to the first embodiment is covered by the first shielding portion 24 and the second shielding portion 28 over the entire circumference of the side surface of the first substrate 12. With such a configuration, the electronic device 10 can have shielding properties against the radiation noise of the electronic components 20 mounted on the first substrate 12. Also, the electronic device 10 according to the first embodiment is covered by the second shielding portion 28 over the entire circumference of the side surface of the second substrate 13. With such a configuration, the electronic device 10 can have shielding properties against the radiation noise of the electronic components 20 mounted on the second substrate 13.

[0045] Furthermore, in the electronic device 10 according to the first embodiment, the first sheet metal 14 has the flat plate portion 23 and the first shielding portion 24. Also, in the electronic device 10, the second sheet metal 15 has the second shielding portion 28. With such a configuration, in the electronic device 10, the flat plate portion 23 and the first shielding portion 24 having the above-described configuration, and the second shielding portion 28 having the above-described configuration can be manufactured with a simple configuration without going through processes such as welding.

[0046] Therefore, as described above, the electronic device 10 according to the first embodiment can further improve heat dissipation with a simple configuration while having shielding properties against radiation noise.

[0047] Also, in the electronic device 10 according to the first embodiment, the first sheet metal 14 and the second sheet metal 15 are in direct or indirect contact. With such a configuration, the electronic device 10 can improve heat transfer between the first sheet metal 14 and the second sheet metal 15 as compared to a configuration that isolates them from each other. Therefore, the electronic device 10 can further improve heat dissipation by transferring the heat generated by a component that is in direct or indirect contact with only one of the first sheet metal 14 and the second sheet metal 15 to the other sheet metal. For example, in the above-described configuration, in a configuration where one of the first sheet metal 14 and the second sheet metal 15 is brought into contact with a heat transfer body such as the fourth sheet metal 37 for transferring the heat inside the electronic device 10 to the outside, the electronic device 10 can transfer the heat of the other sheet metal to the heat transfer body.

[0048] Also, in the electronic device 10 according to the first embodiment, the first shielding portion 24 in the first sheet metal 14 covers a part of the side surface of the first substrate 12, and the second shielding portion 28 in the second sheet metal 15 covers a part of the side surface of the first substrate 12 exposed from the first shielding portion 24 and the entire circumference of the second substrate 13. With such a configuration, even if the electronic device 10 is configured to connect the first substrate 12 and the second substrate 13 by wiring such as a flexible substrate 22 extending from the side surface of the first substrate 12, while facilitating the attachment of the first substrate 12 and the second substrate 13 to the first sheet metal 14, it can have shielding properties against the radiation noise of the electronic components 20 mounted on each of the first substrate 12 and the second substrate 13.

[0049] Also, in the electronic device 10 according to the first embodiment, the second sheet metal 15 has a latching portion 33, and the first sheet metal 14 and the second sheet metal 15 directly contact each other at the latching portion 33. With such a configuration, the electronic device 10 can increase the heat transfer between the first sheet metal 14 and the second sheet metal 15 and stably connect the first sheet metal 14 and the second sheet metal 15.

[0050] Also, in the electronic device 10 according to the first embodiment, the second sheet metal 15 has two latching portions 33 adjacent to each other with a gap 32 interposed therebetween in the second shielding portion 28. With such a configuration, the electronic device 10 can give spring properties to the latching portion 33, facilitating the insertion and fixing of the latching portion 33 of the second sheet metal 15 into the opening 25 of the first sheet metal 14. Further, the electronic device 10 can sandwich the two latching portions 33 adjacent to each other with the gap 32 between them by the opening 25, making it difficult for the gap 32 to expand, thereby reducing the reduction in shielding properties.

[0051] Also, in the electronic device 10 according to the first embodiment, the flexible substrate 22 connecting the first substrate 12 and the second substrate 13 is covered by the second shielding portion 28. With such a configuration, the electronic device 10 can suppress the reduction in shielding properties against the radiation noise of the electronic components 20 mounted on each of the first substrate 12 and the second substrate 13 while using the flexible substrate 22 that contributes to the facilitation of manufacturing and the reduction of manufacturing costs.

[0052] Next, with reference to FIGS. 18 to 26, the electronic device 10 according to the second embodiment of the present disclosure will be described. In the second embodiment, the configuration of the internal structure of the electronic device 10 is different from that of the first embodiment. More specifically, as shown in FIG. 18, in the internal structure 39-2 according to the second embodiment, the shapes of the first sheet metal 14-2 and the second sheet metal 15-2 are different from the shapes of the first sheet metal 14 and the second sheet metal 15 of the internal structure 39 according to the first embodiment shown in FIG. 17. Hereinafter, the second embodiment will be described centering on the points different from the first embodiment. Note that the same reference numerals are given to the parts having the same configuration as those in the first embodiment.

[0053] With reference to FIGS. 19 and 20, the first sheet metal 14-2 will be described. As shown in FIG. 19, the first sheet metal 14-2 has a flat plate portion 23-2 and a first shielding portion 24-2.

[0054] The flat plate portion 23-2 is different from the flat plate portion 23 according to the first embodiment in that it does not have an opening 25 on its main surface. The structure of the flat plate portion 23-2 other than the point of not having the opening 25 may be the same as that of the flat plate portion 23 in the first embodiment. Also, the relationship between the flat plate portion 23-2 and the first substrate 12 and the second substrate 13 may be the same as that in the first embodiment.

[0055] The first shielding portion 24-2 is erected along a part of the outer edge of the flat plate portion 23-2. For example, the first shielding portion 24-2 is connected to the flat plate portion 23-2 at all of any two opposing sides of the flat plate portion 23-2. The first shielding portion 24-2 is erected along the two sides and a part of the other two sides sandwiching the two sides. On one of the two sides not connected to the first shielding portion 24-2, the first shielding portion 24-2 is erected at both ends of the one side with a gap of distance D. The distance D may be longer than the width of the flexible substrate 22.

[0056] The flat plate portion 23-2 has a standing portion 40 that stands upright along a part of the outer edge of the flat plate portion 23-2 in a direction opposite to the first shielding portion 24-2. The main surface of the standing portion 40 faces the surface of the first shielding portion 24-2 having a gap of distance D. The standing portion 40 is connected to the first shielding portion 24-2 and a side of the outer edge of the flat plate portion 23-2 that is different from the side to which the first shielding portion 24-2 is connected.

[0057] FIG. 20 is a view showing the first sheet metal 14-2 from the opposite side in the direction perpendicular to the flat plate portion 23-2 as compared with FIG. 19. As shown in FIG. 20, on the surface of the first shielding portion 24-2 that faces the surface with the gap of distance D, there is a contact portion 41 that extends to the side opposite to the standing portion 40. In the electronic device 10, the contact portion 41 contacts the third sheet metal 34.

[0058] The first sheet metal 14-2 is formed by bending a predetermined portion of a metallic flat plate having a desired shape, that is, as shown in FIG. 21. In FIG. 21, the straight line for bending to the front surface side is shown by a broken line, and the straight line for bending to the back surface side is shown by a one-dot chain line. Therefore, by stretching the bent portions of the first sheet metal 14-2 to a planar shape, any parts of the first sheet metal 14-2 are separated from each other without causing interference. The first sheet metal 14-2 may be formed of a metal having high thermal conductivity such as copper, for example.

[0059] As shown in FIG. 22, the second sheet metal 15-2 has a second shielding portion 28-2.

[0060] The second shielding portion 28-2 is in a substantially rectangular corner tube shape, and a part of any two opposing sides in the rectangle of the axial cross-section protrudes axially. That is, the second shielding portion 28-2 has a substantially rectangular corner tube-shaped full shielding portion 30-2 and two partial shielding portions 29-2 that are axially continuous from the full shielding portion 30-2 and protrude from a part of each of any two opposing sides in the rectangle of the axial cross-section. The main surfaces of the two partial shielding portions 29-2 face each other. The widths of the main surfaces of the two partial shielding portions 29-2, that is, the lengths in the direction perpendicular to the axial direction, may be different. In the electronic device 10, the second sheet metal 15-2 covers the entire circumference of the side surface of the second substrate 13 and a part of the side surface of the first substrate 12 exposed from the first sheet metal 14-2. In this configuration, the full shielding portion 30-2 covers the entire circumference of the side surface of the second substrate 13, and the partial shielding portion 29-2 covers a part of the side surface of the first substrate 12 exposed from the first sheet metal 14.

[0061] The two partial shielding portions 29-2 of the second shielding portion 28-2 each have a second fixing portion 31 at the end on the side where the full shielding portion 30-2 is not continuous. As a result, when the second sheet metal 15-2 is attached to the electronic device 10, the two second fixing portions 31 sandwich the lens barrel 16A that houses the imaging optical system 16 from two directions perpendicular to the optical axis.

[0062] The second shielding portion 28-2 has a gap 32 in the circumferential direction across one of the partial shielding portions 29-2 and the full shielding portion 30-2. The gap 32 is provided substantially parallel to the axial direction. The gap 32 is a gap between the ends where the ends of the flat plate are opposed to each other when the metallic flat plate is bent to form the second sheet metal 15-2. In one of the partial shielding portions 29-2, the second fixing portion 31 is located in the vicinity of the gap 32. Also, in the said one of the partial shielding portions 29-2, a contact portion 42 adjacent to the second fixing portion 31 with the gap 32 interposed therebetween contacts the third sheet metal 34 in the electronic device 10.

[0063] The second sheet metal 15-2 is formed by bending a predetermined portion of a metallic flat plate having a desired shape, that is, as shown in FIG. 23. In FIG. 23, the straight line for bending to the front surface side is indicated by a broken line, and the straight line for bending to the back surface side is indicated by a one-dot chain line. Therefore, by stretching the bent portions of the second sheet metal 15-2 to make them flat, any parts of the second sheet metal 15-2 are separated from each other without causing interference. The second sheet metal 15-2 may be formed of a metal having high thermal conductivity such as copper, for example.

[0064] Next, a method for manufacturing the internal structure 39-2 will be described below.

[0065] As described above with reference to FIGS. 12 and 13, the first substrate 12 is attached to the lens barrel 16A that houses the imaging optical system 16 via the third sheet metal 34 and the imaging element cover 35.

[0066] As shown in FIG. 24, the flat plate portion 23-2 of the first sheet metal 14-2 is attached to the first substrate 12. A heat dissipation sheet 27 may be used for attaching the flat plate portion 23-2 of the first sheet metal 14-2 to the first substrate 12. The first sheet metal 14-2 is attached to the first substrate 12 such that the flexible substrate 22 of the first substrate 12 can pass through the gap of the distance D that the first shielding portion 24-2 has. As a result, as shown in FIG. 25, the contact portion 41 of the first sheet metal 14-2 contacts the third sheet metal 34. Note that FIG. 25 is a diagram showing the state where the first sheet metal 14-2 is attached to the first substrate 12, rotated 180 degrees about the axial direction of the lens barrel 16A from FIG. 19. In FIG. 25, a part of the flexible substrate 22 and the description of the second substrate 13 are omitted.

[0067] As shown in FIG. 26, the flexible substrate 22 is folded back, and the second substrate 13 is attached to the flat plate portion 23-2. A heat dissipation sheet 27 may be used for attaching the flat plate portion 23-2 of the first sheet metal 14-2 to the second substrate 13.

[0068] The second sheet metal 15-2 is attached so as to cover the periphery of the second substrate 13 from the side of the first connector 21 in the optical axis direction of the imaging optical system 16. The second sheet metal 15-2 is fixed to the lens barrel 16A that houses the imaging optical system 16 by two second fixing portions 31. As a result, the contact portion 42 of the second sheet metal 15-2 comes into contact with the third sheet metal 34. Therefore, the first sheet metal 14-2 and the second sheet metal 15-2 are indirectly abutted via the third sheet metal 34. In this way, as shown in FIG. 18, the internal structure 39-2 of the electronic device 10 is configured.

[0069] In the electronic device 10 according to the second embodiment having the above-described configuration, the flat plate portion 23-2 of the first sheet metal 14-2 is not provided with an opening for latching the first sheet metal 14-2 and the second sheet metal 15-2 as in the first embodiment. With such a configuration, the electronic device 10 can widen the area of the flat plate portion 23 that can directly or indirectly abut against the imaging element 19 mounted on the first substrate 12 and the electronic component 20 mounted on the second substrate 13, which are heat sources, and improve the heat dissipation.

[0070] Further, in the electronic device 10 according to the present embodiment, the first sheet metal 14-2 and the second sheet metal 15-2 are indirectly abutted via the third sheet metal 34. With such a configuration, the electronic device 10 can reduce the heat transfer between the first sheet metal 14-2 and the second sheet metal 15-2 as compared with a configuration in which they are directly abutted against each other. Therefore, even when the other one of the first sheet metal 14-2 and the second sheet metal 15-2 is heated up in a configuration where one of the first sheet metal 14-2 and the second sheet metal 15-2 is close to a component greatly affected by high temperature, the electronic device 10 can reduce the heat transfer from the other one to the one.

[0071] Although the present disclosure has been described based on the drawings and examples, it should be noted that those skilled in the art can easily make various modifications and corrections based on the present disclosure. Therefore, it should be noted that these modifications and corrections are included in the scope of the present disclosure.

Description of Reference Numerals

[0072] 10 Electronic device 11 Moving body 12 First substrate 13 Second substrate 14, 14-2 First sheet metal 15, 15-2 Second sheet metal 16 Imaging optical system 16A Lens barrel 17 First housing 18 Second housing 19 Image sensor 20 Electronic component 21 First connector 22 Flexible substrate 23, 23-2 Flat plate part 24, 24-2 First shielding part 25 Opening 26 First fixing part 27 Heat dissipation sheet 28, 28-2 Second shielding part 29, 29-2 Partial shielding part 30, 30-2 Full shielding part 31 Second fixing part 32 Gap 33 Hooking part 34 Third sheet metal 35 Image sensor cover 36 Second connector 37 Fourth sheet metal 38 Third fixing part 39, 39-2 Internal structure 40 Standing part 41, 42 Contact part D Distance

Claims

1. An electronic device comprising a first substrate on which an imaging element is mounted and which mounts an electronic component serving as a heat source, a second substrate on which an electronic component serving as a heat source is mounted, an optical system that forms a subject image formed on a light-receiving surface of the imaging element, a lens barrel including the optical system, a sheet metal that covers at least a part of a side surface of the first substrate and includes a fixing portion that engages with the lens barrel, a flat plate portion that is interposed between the first substrate and the second substrate so as to indirectly contact the first substrate, and is provided with.

2. further comprising a housing portion having another sheet metal and a connector, the second substrate is electrically connected to the connector, the electronic device according to claim 1, wherein the sheet metal and the other sheet metal are in direct or indirect contact with each other.

3. An electronic device comprising a first substrate on which an imaging element is mounted and which mounts an electronic component serving as a heat source, a second substrate having an electronic component serving as a heat source, an optical system that forms a subject image formed on a light-receiving surface of the imaging element, a lens barrel including the optical system, a sheet metal including a shielding portion that covers at least a part of a side surface of the first substrate and a fixing portion that engages with the lens barrel, a flat plate portion that is interposed between the first substrate and the second substrate so that the electronic components mounted on the first substrate and the second substrate are in direct or indirect contact with each other, and is provided with.

4. the shielding portion is cylindrical, the electronic device according to claim 3, wherein the shielding portion covers at least a part of a side surface of the second substrate.

5. the second substrate includes a first connector, a first housing having an opening for exposing the optical system, A second housing having a second connector that is electrically connected to the first connector, The electronic device according to claim 4, further comprising

6. The electronic device according to claim 5, wherein the second housing has a fourth sheet metal that abuts against the sheet metal.

7. The electronic device according to claim 1, wherein the flat plate portion is made of metal.

8. The electronic device according to claim 1, 3 or 7, wherein the flat plate portion indirectly abuts against the electronic components mounted on each of the first substrate and the second substrate.

9. The flat plate portion indirectly abuts against the electronic components mounted on the first substrate via the first substrate, The electronic device according to claim 8, wherein the flat plate portion indirectly abuts against the electronic components mounted on the second substrate via the second substrate.

10. The electronic device according to claim 1 or 3, wherein the fixing portion engages with the lens barrel from the outside in a direction perpendicular to the optical axis in a cross-sectional view along the optical axis of the optical system.

11. The electronic device according to claim 3, wherein the flat plate portion contacts the sheet metal.

12. A first substrate including an imaging element and mounting electronic components that are heat sources, An optical system that forms a subject image formed on a light receiving surface of the imaging element, A lens barrel including the optical system, A sheet metal including a shielding portion that covers at least a part of a side surface of the first substrate and a fixing portion that engages with the lens barrel, A second substrate having electronic components that are heat sources, Comprising The sheet metal is interposed between the first substrate and the second substrate, and includes a flat plate portion that directly or indirectly abuts against the electronic components mounted on each of the first substrate and the second substrate. Electronic device.

13. A first substrate including an imaging device and mounting an electronic component serving as a heat source; An optical system that forms a subject image imaged on a light receiving surface of the imaging device; A lens barrel including the optical system; A sheet metal having a shielding portion that covers at least a part of a side surface of the first substrate and a fixing portion that engages with the lens barrel; A second substrate having an electronic component serving as a heat source; A flat plate portion interposed between the first substrate and the second substrate, and directly or indirectly contacting the electronic components mounted on the first substrate and the second substrate respectively; An electronic device comprising the above.

Images