Laser processing apparatus

Abstract

A laser processing device (1) is provided with a first laser oscillator (11) for emitting first laser light (L1) of which the peak wavelength is a first wavelength, a second laser oscillator (12) for emitting second laser light (L2) of which the peak wavelength is a second wavelength different from the first wavelength, a drive control unit (20) for driving each of the first laser oscillator (11) and the second laser oscillator (12), and an analyzing unit (30) which acquires signal light from a workpiece (2) and adjusts the processing conditions of the workpiece (2) on the basis of the acquired signal light, wherein the drive control unit (20) changes the intensity of at least one of the first laser light (L1) and the second laser light (L2) by driving the first laser oscillator (11) and the second laser oscillator (12) in accordance with the processing conditions, and causes the workpiece (2) to be irradiated with at least one of the first laser light (L1) and the second laser light (L2).

Description

Technical Field

[0001] The present disclosure relates to a laser processing apparatus, and more particularly to a laser processing apparatus for processing a composite material composed of two or more types of materials with a laser beam.

Background Art

[0002] Conventionally, as a laser processing apparatus for laser-processing an object by irradiating a laser beam, there is known one that can emit laser beams of a plurality of wavelengths so that the laser beam can be switched according to the difference in the material of the object. For example, FIG. 1 of Patent Document 1 discloses a multi-wavelength laser light emitting device having a semiconductor laser element that emits red laser light and a semiconductor laser element that emits infrared laser light as a light source used in this type of laser processing apparatus.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When the object to be processed is placed on the processing table and laser processed, by determining in advance the position where the object to be processed is placed on the processing table, the laser beam can be irradiated to a predetermined processing position of the object to be processed. Thereby, laser processing with high throughput and less sputtering (that is, high processing quality) in which the material of the object to be processed scatters due to laser irradiation can be performed.

[0005] However, if the object to be processed is displaced from the predetermined position when it is placed on the processing table, or if the outer shape of the object to be processed varies and there are individual differences (individual variations) in the object to be processed, an appropriate laser beam is not irradiated to the predetermined processing position of the object to be processed, which causes processing defects.

[0006] In particular, when using a composite material composed of two or more types of materials as the object to be processed, the wavelength of the laser beam may be switched at the change point of the materials. However, if the position of the object to be processed shifts at this time, the laser beam of an appropriate wavelength is not irradiated to each of the plurality of materials in the composite material, resulting in processing defects. As a result, the processing quality deteriorates or the throughput decreases.

[0007] The present disclosure has been made to solve such problems, and an object thereof is to provide a laser processing apparatus and the like that can achieve high-quality laser processing with high throughput.

Means for Solving the Problems

[0008] To achieve the above object, one aspect of a laser processing apparatus according to the present disclosure is a laser processing apparatus that processes an object with a laser beam, including a first laser oscillator that emits a first laser beam having a peak wavelength of a first wavelength, a second laser oscillator that emits a second laser beam having a peak wavelength different from the first wavelength, a drive control unit that drives each of the first laser oscillator and the second laser oscillator, and an analysis unit that acquires signal light from the object and adjusts processing conditions of the object based on the acquired signal light. The drive control unit drives the first laser oscillator and the second laser oscillator according to the processing conditions to change the intensity of at least one of the first laser beam and the second laser beam, and irradiates the object with at least one of the first laser beam and the second laser beam.

Effects of the Invention

[0009] According to the present disclosure, high-quality laser processing with high throughput can be achieved.

Brief Description of the Drawings

[0010]

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Embodiments for Carrying Out the Invention

[0011] (Process of Arriving at One Aspect of the Present Disclosure) First, prior to the description of the embodiments of the present disclosure, the process of arriving at one aspect of the present disclosure will be described.

[0012] When performing laser processing on a composite material composed of two or more types of materials, since the light absorption rate varies depending on the material, it is conceivable to perform laser processing by switching the wavelength of the laser light at the change point of the material using a laser processing apparatus capable of emitting laser light of multiple wavelengths. For example, as shown in FIGS. 1(a) and 1(b), two composite materials 2X in which a first part 2a made of a first material and a second part 2b made of a second material different from the first material are arranged side by side and connected in a plan view are stacked, and when joining the two composite materials 2X by welding the first parts 2a to each other and the second parts 2b to each other by irradiating a linear welding region, which is a predetermined processing position, with laser light, since the light absorption rates of the first part 2a and the second part 2b are different, at the welding location corresponding to the first part 2a, the first laser light L1 having a wavelength suitable for the first material constituting the first part 2a is irradiated, and at the welding location corresponding to the second part 2b, the second laser light L2 having a wavelength suitable for the second material constituting the second part 2b is irradiated. Specifically, when using a composite metal plate in which the first material constituting the first part 2a is made of aluminum and the second material constituting the second part 2b is made of copper as the composite material 2X, since aluminum has a high light absorption rate for infrared light and copper has a high absorption rate for blue light, the first laser light L1 is an infrared laser light and the second laser light L2 is a blue laser light. Then, the boundary between the first part 2a and the second part 2b is set as the laser switching position, and the laser light irradiated on the composite material 2X at this laser switching position is switched from the first laser light L1 to the second laser light L2.

[0013] When performing laser processing on an object to be processed in such a manner, by creating in advance processing conditions (a "recipe"), such as which material is placed at which position and what kind of laser light is irradiated, it is possible to select laser light with a wavelength suitable for each material at any position where a plurality of different materials exist. For example, as shown in FIG. 1(b), when laser welding a composite material 2X placed on a processing table with a laser processing apparatus, in the XY coordinate system on the laser processing apparatus (or laser processing system), the position where the composite material 2X is placed on the processing table is determined in advance, and the coordinate range of the welding area is determined in advance from the positions where the first part 2a and the second part 2b exist. At the same time, by determining in advance a laser condition of switching the laser light irradiated on the composite material 2X with the boundary between the first part 2a and the second part 2b as the laser switching coordinate from the first laser light L1 to the second laser light L2 at the laser switching coordinate, the welding area and the laser condition for the composite material 2X are created in advance as a recipe. As a result, based on this recipe, the laser light irradiated on the composite material 2X at the laser switching coordinate can be switched from the first laser light L1 to the second laser light L2, so that the first part 2a and the second part 2b with different materials can be irradiated with laser light suitable for each material. Therefore, it is possible to realize laser processing with high throughput and less sputtering (i.e., high processing quality).

[0014] However, due to the installation variation of the object to be processed or the positional accuracy of the laser processing apparatus, etc., when the object to be processed is placed on the processing table, the object to be processed may deviate from a predetermined position, or the outer shape of the object to be processed may vary, resulting in individual differences (individual variations) in the object to be processed. For example, as shown in FIG. 2, when the composite material 2X, which is the object to be processed, is placed on the processing table, if the composite material 2X deviates from the position predetermined in the recipe, causing the position of the object to be processed to shift, or if individual differences occur in the object to be processed due to variations in the outer shape of the object to be processed, etc., resulting in coordinate deviation, when the laser beam is switched at the laser switching coordinates predetermined in the recipe, the laser beam is not switched at the boundary between the first part 2a and the second part 2b, and the laser beam is switched at a position different from the boundary between the first part 2a and the second part 2b. For example, in FIG. 2, since the position of the composite material 2X is shifted to the negative side in the X-axis direction, the laser switching coordinates in the recipe will shift to the positive side in the X-axis direction along with the position shift of the composite material 2X. As a result, when scanning the laser beam from the first part 2a to the second part 2b to process the composite material 2X, the laser beam actually irradiated on the composite material 2X will be switched above the second part 2b beyond the boundary between the first part 2a and the second part 2b. As a result, although the entire welding area in the first part 2a is irradiated with laser light of an appropriate wavelength, the welding area in the second part 2b includes a portion irradiated with laser light of an inappropriate wavelength. Specifically, the second part 2b located between the actual boundary between the first part 2a and the second part 2b and the predetermined laser switching coordinates will be irradiated with the first laser light L1 suitable for the material of the first part 2a. As a result, it becomes impossible to irradiate the entire welding area (processing position) of the composite material 2X with laser light of an appropriate wavelength.

[0015] Thus, in the method of creating a predetermined recipe (processing conditions) in advance before performing laser processing and then performing laser processing, if a position shift or the like occurs in the object to be processed, it becomes impossible to irradiate the laser beam at a predetermined processing position of the object to be processed. As a result, processing defects occur in the object to be processed, the processing quality deteriorates, and ultimately the throughput decreases.

[0016] For example, in order to avoid variations in the switching coordinates of the wavelength of the laser beam, it is necessary to measure the outer shape variations and installation positions of individual objects to be processed, and create individual recipes that appropriately correspond the switching coordinates of the wavelength of the laser beam to each object to be processed each time. As a result, the throughput decreases.

[0017] The present disclosure has been made to solve such problems, and an object thereof is to provide a laser processing apparatus or the like that can achieve high-quality laser processing with high throughput even in the case of laser processing a composite material.

[0018] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Note that each of the embodiments described below shows a specific example of the present disclosure. Therefore, the numerical values, shapes, materials, components, arrangement positions and connection forms of the components, and the steps (processes) and the order of the steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure.

[0019] Further, each drawing is a schematic diagram and is not necessarily drawn precisely. Therefore, the scales etc. in each drawing do not necessarily match. In each drawing, the same reference numerals are given to substantially the same configurations, and overlapping explanations are omitted or simplified.

[0020] (Embodiment 1) First, the configuration of the laser processing apparatus 1 according to Embodiment 1 will be described with reference to FIG. 3. FIG. 3 is a block diagram showing the configuration of the laser processing apparatus 1 according to Embodiment 1.

[0021] As shown in FIG. 3, the laser processing apparatus 1 is an apparatus that processes an object to be processed 2 with a laser beam. That is, the laser processing apparatus 1 irradiates the object to be processed 2 with a laser beam by directing the laser beam toward the object to be processed 2, thereby performing laser processing on the object to be processed 2. The laser processing by the laser processing apparatus 1 is, for example, welding, cutting, drilling, or the like.

[0022] The object to be processed 2 is an object to be processed by the laser processing apparatus 1. That is, the object to be processed 2 is an object to be irradiated with laser light. In the present embodiment, the object to be processed 2 is the composite material 2X shown in FIG. 1 and is disposed on the processing table 3.

[0023] The processing table 3 is a stage on which the object to be processed 2 is placed. The processing table 3 is configured to be movable in two axial directions, namely, the X-axis direction and the Y-axis direction, which are perpendicular to each other. The processing table 3 may further be configured to be movable in the Z-axis direction (for example, the vertical direction) perpendicular to both the X-axis and the Y-axis, or may be configured to be rotatable about a predetermined θ-axis.

[0024] As shown in FIG. 3, the laser processing apparatus 1 includes a first laser oscillator 11, a second laser oscillator 12, a drive control unit 20, and an analysis unit 30.

[0025] The first laser oscillator 11 emits a first laser beam L1 having a peak wavelength of a first wavelength (λ1) as the processing laser beam for laser-processing the object to be processed 2. The second laser oscillator 12 emits a second laser beam L2 having a peak wavelength of a second wavelength (λ2≠λ1) different from the first wavelength as the processing laser beam for laser-processing the object to be processed 2. The first laser oscillator 11 and the second laser oscillator 12 are constituted by, for example, semiconductor laser elements that emit laser light.

[0026] In the present embodiment, the second wavelength of the second laser beam L2 emitted by the second laser oscillator 12 is shorter than the first wavelength of the first laser beam L1 emitted by the first laser oscillator 11 (λ1>λ2).

[0027] As an example, the first wavelength of the first laser beam L1 is a wavelength of near-infrared or longer. Specifically, the first wavelength of the first laser beam L1 is a wavelength of 800 nm or longer. Further, the second wavelength of the second laser beam L2 is a wavelength of visible light or shorter. Specifically, the second wavelength of the second laser beam L2 is a wavelength of 800 nm or shorter.

[0028] For example, when using a composite material 2X as the object to be processed 2, as shown in FIG. 1, where the first material constituting the first part 2a is made of aluminum and the second material constituting the second part 2b is made of copper, since aluminum has a high light absorption rate for infrared light and copper has a high absorption rate for blue light, it is advisable to use the first laser beam L1 as an infrared laser beam and the second laser beam L2 as a blue laser beam. Note that the combination of materials of the composite material 2X is not limited to aluminum and copper, and may also be a combination of aluminum and gold or nickel. The combination of materials of the composite material 2X may be any combination of dissimilar metals with different light absorption rates.

[0029] The first laser beam L1 emitted from the first laser oscillator 11 is irradiated onto the object to be processed 2 disposed on the processing table 3. Similarly, the second laser beam L2 emitted from the second laser oscillator 12 is irradiated onto the object to be processed 2 disposed on the processing table 3. Specifically, the first laser beam L1 and the second laser beam L2 are irradiated onto the processing position of the object to be processed 2. At this time, it is advisable to arrange an optical system such as an appropriate lens or mirror for guiding and condensing the laser beam toward the processing position.

[0030] The drive control unit 20 drives each of the first laser oscillator 11 and the second laser oscillator 12.

[0031] Specifically, the drive control unit 20 can cause the first laser oscillator 11 to emit the first laser beam L1 by driving the first laser oscillator 11 to light up, or can prevent the first laser beam L1 from being emitted by driving the first laser oscillator 11 to turn off. That is, the drive control unit 20 can start or stop the emission of the first laser beam L1 by driving the first laser oscillator 11. Furthermore, the drive control unit 20 can change the intensity (output) of the first laser beam L1 by driving the first laser oscillator 11.

[0032] Similarly, the drive control unit 20 can cause the second laser oscillator 12 to emit the second laser beam L2 by driving the second laser oscillator 12 to light, or can prevent the second laser beam L2 from being emitted by driving the second laser oscillator 12 to turn off. That is, the drive control unit 20 can start or stop the emission of the second laser beam L2 by driving the second laser oscillator 12. Further, the drive control unit 20 can change the intensity (output) of the second laser beam L2 by driving the second laser oscillator 12.

[0033] The analysis unit 30 acquires the signal light from the object 2 to be processed and adjusts the processing conditions of the object 2 to be processed based on the acquired signal light. Specifically, the analysis unit 30 acquires the material information of the object 2 to be processed by analyzing the signal light obtained from the object 2 to be processed, and adjusts the processing conditions (laser processing conditions) when laser-processing the object 2 to be processed based on the acquired material information. For example, the analysis unit 30 includes a mechanism such as a photodetector that receives the signal light from the object 2 to be processed, and a control device such as a control circuit that adjusts the processing conditions of the object 2 to be processed according to the intensity of the received signal light.

[0034] As an example, when using the composite material 2X as the object 2 to be processed, the analysis unit 30 acquires the material information that the first part 2a is composed of the first material by analyzing the signal light from the first part 2a, and adjusts the processing conditions when laser-processing the first part 2a of the object 2 to be processed based on the acquired material information. Specifically, the analysis unit 30 selects the first laser beam L1 as the laser beam suitable for the first material of the first part 2a of the object 2 to be processed and sets the intensity of the first laser beam L1 to adjust the processing conditions. Similarly, the analysis unit 30 acquires the material information that the second part 2b is composed of the second material by analyzing the signal light from the second part 2b, and adjusts the processing conditions when laser-processing the second part 2b of the object 2 to be processed based on the acquired material information. Specifically, the analysis unit 30 selects the second laser beam L2 as the laser beam suitable for the second material of the second part 2b of the object 2 to be processed and sets the intensity of the second laser beam L2 to adjust the processing conditions.

[0035] And in the laser processing apparatus 1 according to the present embodiment, the drive control unit 20 drives the first laser oscillator 11 and the second laser oscillator 12 according to the processing conditions obtained by the analysis unit 30, so as to change the intensity of at least one of the first laser beam L1 and the second laser beam L2, and irradiate the object to be processed 2 with at least one of the first laser beam L1 and the second laser beam L2.

[0036] Specifically, the drive control unit 20 changes the intensity of each of the first laser beam L1 and the second laser beam L2 according to the processing conditions of the object to be processed 2 adjusted based on the material information of the object to be processed 2 obtained by analyzing the signal light from the object to be processed 2 by the analysis unit 30, and selectively irradiates the object to be processed 2 with the first laser beam L1 and the second laser beam L2. That is, the drive control unit 20 switches the laser beam so that the laser beam suitable for the material of the object to be processed 2 is irradiated according to the material information of the object to be processed 2 obtained by the analysis unit 30. In this case, the drive control unit 20 controls the driving of the first laser oscillator 11 and the second laser oscillator 12 to switch the laser beam irradiated on the object to be processed 2 from the first laser beam L1 to the second laser beam L2 or from the second laser beam L2 to the first laser beam L1.

[0037] For example, when using the composite material 2X as the object to be processed 2, when laser processing the first part 2a, since the first laser beam L1 and its intensity are adjusted by the analysis unit 30 as the processing conditions suitable for the first material of the first part 2a, the drive control unit 20 drives the first laser oscillator 11 to light up and drives the second laser oscillator 12 to turn off so that the first laser beam L1 suitable for the first material of the first part 2a is irradiated onto the first part 2a according to the processing conditions adjusted by the analysis unit 30. Similarly, when laser processing the second part 2b, since the second laser beam L2 and its intensity are adjusted by the analysis unit 30 as the processing conditions suitable for the second material of the second part 2b, the drive control unit 20 drives the second laser oscillator 12 to light up and drives the first laser oscillator 11 to turn off so that the second laser beam L2 suitable for the second material of the second part 2b is irradiated onto the second part 2b according to the processing conditions adjusted by the analysis unit 30.

[0038] Next, the laser processing method according to the present embodiment using the laser processing apparatus 1 will be described with reference to FIG. 3 and using FIG. 4. FIG. 4 is a flowchart of the laser processing method according to Embodiment 1.

[0039] As shown in FIG. 4, first, the object to be processed 2 is placed on the processing table 3 (step S11). Specifically, the object to be processed 2 that is the target of laser processing is arranged on the processing table 3 by the laser processing apparatus 1. For example, when welding two objects to be processed 2 by irradiating a laser beam at the processing position of the object to be processed 2 with the laser processing apparatus 1, the processing position of the object to be processed 2 becomes the welding area.

[0040] Next, the processing position of the object to be processed 2 is irradiated with light (step S12). For example, light for receiving the signal light from the processing position of the object to be processed 2 is irradiated onto the processing position of the object to be processed 2. As an example, a laser beam, LED light, illumination light, or the like is irradiated onto the object to be processed 2. Step S12 is performed by the analysis unit 30. Therefore, the analysis unit 30 has a mechanism for irradiating light onto the processing position of the object to be processed 2.

[0041] Next, the signal light from the processing position of the object to be processed 2 is received (step S13). For example, the reflected light of the light irradiated on the processing position of the object to be processed 2 is received as the signal light. Step S13 can be performed by a photodetector or the like included in the analysis unit 30.

[0042] Next, the processing conditions for performing laser processing are adjusted according to the received signal light (step S14). Specifically, as the processing conditions, the intensity (output) of each of the first laser light L1 emitted from the first laser oscillator 11 and the second laser light L2 emitted from the second laser oscillator 12 is determined. Step S14 can be performed by a control device or the like included in the analysis unit 30.

[0043] Next, the intensity of the laser light is changed according to the adjusted processing conditions (step S15). Specifically, according to the processing conditions adjusted in step S14, the intensity of at least one of the first laser light L1 emitted from the first laser oscillator 11 and the second laser light L2 emitted from the second laser oscillator 12 is changed. Step S15 is performed by the drive control unit 20.

[0044] Next, the object to be processed 2 is irradiated with the laser light (step S16). Specifically, according to the intensity of each of the first laser light L1 and the second laser light L2 set in step S15, the first laser light L1 is emitted from the first laser oscillator 11 to irradiate the processing position of the object to be processed 2 with the first laser light L1, or the second laser light L2 is emitted from the second laser oscillator 12 to irradiate the processing position of the object to be processed 2 with the second laser light L2. Step S16 is performed by the drive control unit 20.

[0045] The laser processing method according to this embodiment can be performed in the above-described procedure. In this case, laser processing can be completed by repeating steps S13 to S16 only once. Specifically, after performing steps S13 and S14 to obtain the signal light at all the processing positions on the object to be processed 2 and adjusting all the processing conditions at the processing positions of the object to be processed 2 first, steps S15 and S16 are performed based on the adjusted processing conditions to irradiate the first laser beam L1 and the second laser beam L2 for laser processing. That is, after creating the recipe for the processing conditions at all the processing positions of the object to be processed 2 first, laser processing is performed based on the created recipe.

[0046] Alternatively, instead of performing steps S13 to S16 only once, steps S13 to S16 may be repeated a plurality of times. That is, laser processing may be performed while repeating steps S13 to S16 each time at a plurality of locations of the processing positions of the object to be processed 2. For example, at a certain processing position on the object to be processed 2, after performing steps S13 and S14 to obtain the signal light at the processing position of the object to be processed 2 and adjusting the processing conditions of the object to be processed 2 (that is, after creating the recipe), steps S15 and S16 are performed based on the adjusted processing conditions (recipe) to irradiate the first laser beam L1 and the second laser beam L2 for laser processing. Next, at another processing position on the object to be processed 2, after performing steps S13 and S14 to obtain the signal light at the processing position of the object to be processed 2 and adjusting the processing conditions of the object to be processed 2, steps S15 and S16 are performed based on the adjusted processing conditions to irradiate the first laser beam L1 and the second laser beam L2 for laser processing. Thereafter, the same is sequentially performed at still another processing position. In this way, laser processing may be performed in real time while creating the processing conditions while obtaining the signal light at the processing positions of the object to be processed 2.

[0047] As described above, according to the laser processing apparatus 1 according to the present embodiment, the analysis unit 30 acquires the signal light from the workpiece 2, adjusts the processing conditions of the workpiece 2 based on the acquired signal light, and the drive control unit 20 drives the first laser oscillator 11 and the second laser oscillator 12 according to the adjusted processing conditions, thereby changing the intensity of at least one of the first laser beam L1 and the second laser beam L2 and irradiating the workpiece 2 with at least one of the first laser beam L1 and the second laser beam L2.

[0048] Thus, in the laser processing apparatus 1 according to the present embodiment, the signal light obtained from the workpiece 2 is analyzed to acquire the material information of the workpiece 2, and the processing conditions are adjusted according to the acquired material information to drive the first laser oscillator 11 and the second laser oscillator 12.

[0049] Thereby, the first laser beam L1 and the second laser beam L2 can be selectively irradiated to the processing position of the workpiece 2 under the processing conditions suitable for the material of the workpiece 2. In particular, in the laser processing apparatus 1 according to the present embodiment, even if a coordinate shift of the workpiece 2 occurs due to a positional shift of the workpiece 2 or an individual difference of the workpiece 2, etc., the processing conditions are adjusted for each workpiece 2. That is, instead of processing the workpiece 2 with a single recipe created in advance, the recipe can be modified (or adjusted) according to the actual workpiece 2 arranged on the processing table 3. Further, without creating a recipe in advance before arranging the workpiece 2 on the processing table 3, the material of the workpiece can be specified and the wavelength of the processing laser beam can be selected according to the actual workpiece 2 arranged on the processing table 3. Thereby, regardless of the coordinate position of the workpiece 2, appropriate laser processing can be performed at a predetermined processing position of the workpiece 2. For this reason, even if the workpiece 2 is the composite material 2X, laser processing can be performed at the processing positions of the first part 2a and the second part 2b under the processing conditions suitable for the materials of the first part 2a and the second part 2b respectively. Therefore, high-quality laser processing with high throughput can be realized.

[0050] Also, in the laser processing apparatus 1 according to the present embodiment, the drive control unit 20 causes one of the first laser beam L1 and the second laser beam L2 to be emitted according to the processing conditions adjusted by the analysis unit 30, and does not cause the other of the first laser beam L1 and the second laser beam L2 to be emitted, and drives the first laser oscillator 11 and the second laser oscillator 12.

[0051] Thereby, among the first laser oscillator 11 and the second laser oscillator 12, the one suitable for laser processing can be selectively driven according to the material information of the workpiece 2 obtained from the analysis unit 30. Therefore, high-quality laser processing can be realized.

[0052] Also, in the laser processing apparatus 1 according to the present embodiment, the first wavelength of the first laser beam L1 is a wavelength of near-infrared or longer.

[0053] With this configuration, since the first laser beam L1 has a high light absorption rate in the infrared region such as aluminum or a specific resin, heat generation and sputtering due to scattered light when laser processing these materials can be suppressed. Thereby, higher processing quality can be realized.

[0054] Also, in the laser processing apparatus 1 according to the present embodiment, the second wavelength of the second laser beam L2 is a wavelength of visible light or shorter.

[0055] With this configuration, since the second laser beam L2 has a high light absorption rate for a metal material with a high reflectivity or an organic material such as resin, heat generation and sputtering due to scattered light when laser processing these materials can be suppressed. Thereby, higher processing quality can be realized.

[0056] (Embodiment 2) Next, the configuration of the laser processing apparatus 1A according to Embodiment 2 will be described with reference to FIG. 5. FIG. 5 is a block diagram showing the configuration of the laser processing apparatus 1A according to Embodiment 2.

[0057] As shown in FIG. 5, the laser processing apparatus 1A according to the present embodiment includes a first laser oscillator 11, a second laser oscillator 12, a drive control unit 20, and an analysis unit 30, similar to the laser processing apparatus 1 according to the first embodiment. The laser processing apparatus 1A according to the present embodiment has a configuration that makes the laser processing apparatus 1 according to the first embodiment more specific.

[0058] In the present embodiment, the drive control unit 20 includes a drive circuit 21 and a drive power supply 22. The drive control unit 20 in the present embodiment has the same functions as those in the first embodiment.

[0059] The drive circuit 21 is a control circuit that drives and controls each of the first laser oscillator 11 and the second laser oscillator 12 according to the analysis result of the analysis unit 30. Specifically, the drive circuit 21 controls the lighting drive and the extinguishing drive of the first laser oscillator 11 and the second laser oscillator 12, or controls the intensity of each of the first laser beam L1 emitted from the first laser oscillator 11 and the second laser beam L2 emitted from the second laser oscillator 12.

[0060] The drive power supply 22 is a power supply that generates electric power for driving the drive circuit 21. For example, the drive power supply 22 converts the electric power of an external input power supply into predetermined electric power for driving the drive circuit 21.

[0061] The analysis unit 30 adjusts the processing conditions at the coordinates of the processing position of the workpiece 2 when acquiring the signal light from the workpiece 2. The drive control unit 20 drives the first laser oscillator 11 and the second laser oscillator 12 according to this processing condition, so as to irradiate at least one of the first laser beam L1 and the second laser beam L2 onto the workpiece 2 based on the coordinates of the processing position at the coordinates of the processing position of the workpiece 2.

[0062] In the present embodiment, the analysis unit 30 includes a data processing unit 31, a light source 32, a first detector 33a, a second detector 33b, a beam splitter 34, and a lens 35.

[0063] The data processing unit 31 analyzes the signal light from the object 2 to be processed. The data processing unit 31 adjusts the processing conditions at the coordinates at the processing position of the object 2 to be processed based on the signal light from the object 2 to be processed. In the present embodiment, the signal light from the object 2 to be processed is reflected light in which at least a part of the analysis light emitted by the light source 32 is reflected by the surface of the object 2 to be processed.

[0064] The light emitted from the light source 32 is irradiated as analysis light to the processing position of the object 2 to be processed via the beam splitter 34 and the lens 35. The beam splitter 34 and the lens 35 are an example of an optical system that irradiates the analysis light to the processing position of the object 2 to be processed.

[0065] The beam splitter 34 reflects the light emitted from the light source 32 and makes it incident on the lens 35. The lens 35 is a condenser lens that condenses the light from the light source 32 reflected by the beam splitter 34 and irradiates the processing position of the object 2 to be processed. Note that the condenser lens is, for example, a focusing lens that focuses light such as a convex lens and / or a collimating lens that makes light parallel. That is, not only irradiating the processing position with light by the focusing lens, but also irradiating the processing position with collimated light parallelized using the collimating lens may be possible.

[0066] Note that the optical system (irradiation / condensation optical system) that irradiates the analysis light to the processing position of the object 2 to be processed is not limited to the beam splitter 34 and the lens 35, and may be configured by optical elements different from the beam splitter 34 and the lens 35, or may include additional optical elements in addition to the beam splitter 34 and the lens 35. Also, the analysis light emitted from the light source 32 is preferably made monochromatic by a spectroscope or a filter that transmits a specific wavelength band.

[0067] The analysis light irradiated on the object 2 to be processed includes at least one of the first wavelength (λ1) which is the peak wavelength of the first laser light L1 and the second wavelength (λ2) which is the peak wavelength of the second laser light L2. In the present embodiment, the analysis light irradiated on the object 2 to be processed includes both the first wavelength and the second wavelength. Specifically, the object 2 to be processed is irradiated with the first analysis light including the first wavelength and the second analysis light including the second wavelength.

[0068] That is, the light source 32 emits the first analysis light and the second analysis light. Specifically, the light source 32 includes a first light source that emits the first analysis light which is light having the first wavelength (λ1) whose peak wavelength is the same as the peak wavelength of the first laser light L1, and a second light source that emits the second analysis light which is light having the second wavelength (λ2) whose peak wavelength is the same as the peak wavelength of the second laser light L2. The light source 32 is constituted by, for example, a laser oscillator having a semiconductor laser element or an LED (Light Emitting Diode). In the present embodiment, the light source 32 is constituted by a first laser element that emits a laser light having a peak wavelength of λ1 as the first analysis light and a second laser element that emits a laser light having a peak wavelength of λ2 as the second analysis light.

[0069] In this case, the first analysis light and the second analysis light emitted from the light source 32 are reflected by the beam splitter 34 and condensed by the lens 35 and irradiated on the object 2 to be processed. The first analysis light and the second analysis light irradiated on the object 2 to be processed are reflected by the object 2 to be processed and enter the analysis unit 30 as signal light. That is, the signal light from the object 2 to be processed includes the first signal light which is the reflected light obtained by irradiating the object 2 to be processed with the first analysis light and reflecting it by the object 2 to be processed, and the second signal light which is the reflected light obtained by irradiating the object 2 to be processed with the second analysis light and reflecting it by the object 2 to be processed. The first signal light is light related to the first wavelength (λ1) included in the first analysis light, and the second signal light is light related to the second wavelength (λ2) included in the second analysis light.

[0070] At this time, the first analysis light of the first wavelength (λ1) and the second analysis light of the second wavelength (λ2) do not necessarily need to be focused on the object to be processed 2 by the same optical system, and they may be focused on the object to be processed 2 by different optical paths using a plurality of optical systems according to the wavelength of the light source 32. Further, the signal light from the object to be processed 2 does not need to be guided to the detector using the same optical system as the first analysis light and the second analysis light. In order to also detect the light scattered on the surface of the object to be processed 2, an optical system that can collect the signal light at a wide angle is more desirable. Furthermore, when the first analysis light and the second analysis light are laser lights, a polarization optical system may be used to irradiate the object to be processed 2 with specific polarized light, and a polarization filter that does not transmit the polarization of the first analysis light and the second analysis light may be provided in the optical path of the signal light from the object to be processed 2. By doing so, the signal light from the object to be processed 2 can be detected with a high signal-to-noise ratio (S / N).

[0071] In this way, the data processing unit 31 adjusts the processing conditions of the object to be processed 2 by analyzing the analysis light emitted from the light source 32 and reflected by the object to be processed 2. Specifically, the data processing unit 31 analyzes the first analysis light emitted from the light source 32 and reflected by the object to be processed 2 as the first signal light, and analyzes the second analysis light emitted from the light source 32 and reflected by the object to be processed 2 as the second signal light, thereby adjusting the processing conditions of the object to be processed 2.

[0072] Specifically, the data processing unit 31 compares the intensity of the first signal light and the intensity of the second signal light at the coordinates of the processing position of the object to be processed 2 to adjust the processing conditions of the object to be processed 2. More specifically, the data processing unit 31 analyzes the reflection intensities of the first analysis light and the second analysis light from the intensities of the first signal light and the second signal light, and associates the coordinates at the processing position of the object to be processed with the reflection intensities of the first analysis light and the second analysis light, thereby adjusting the processing conditions at the coordinates at the processing position of the object to be processed. Further, the data processing unit 31 corrects the intensities of the first signal light and the second signal light received by the first detector 33a with the intensities of the first analysis light and the second analysis light received by the second detector 33b.

[0073] In this embodiment, the intensities of the first signal light and the second signal light are detected using the first detector 33a and the second detector 33b. As an example, the first detector 33a and the second detector 33b are photodetectors.

[0074] In this case, the first detector 33a receives the first signal light reflected by the processing object 2 from the first analysis light emitted from the light source 32, and also receives the second signal light reflected by the processing object 2 from the second analysis light emitted from the light source 32. In the present embodiment, the first signal light and the second signal light from the processing object 2 pass through the beam splitter 34 and enter the first detector 33a.

[0075] Also, the second detector 33b receives at least a part of the first analysis light and at least a part of the second analysis light. In the present embodiment, the first analysis light and the second analysis light emitted from the light source 32 pass through the beam splitter 34 and enter the second detector 33b.

[0076] The data processing unit 31 calculates the light reflectances of the first wavelength (λ1) and the second wavelength (λ2) based on the intensities of the first signal light and the second signal light received by the first detector 33a and the intensities of the first analysis light and the second analysis light received by the second detector 33b, and adjusts the processing conditions of the processing object 2. That is, the data processing unit 31 adjusts the intensities (outputs) of the first laser light L1 of the first laser oscillator 11 and the second laser light L2 of the second laser oscillator 12 according to the calculated light reflectances of the first wavelength (λ1) and the second wavelength (λ2).

[0077] Here, the intensities (reflected light intensities) of the first signal light and the second signal light received by the first detector 33a are represented as I ref (λ1) and as I ref (λ2), and the intensities (light source light intensities) of the first analysis light and the second analysis light received by the second detector 33b are represented as I in (λ1) and as I inLet it be (λ2), and when the light reflectivities of the first wavelength (λ1) and the second wavelength (λ2) are R(λ1) and R(λ2) respectively, R(λ1) and R(λ2) are represented by the following (Equation 1) and (Equation 2).

[0078] [Number]

[0079] [Number]

[0080] Note that I at this time in is to replace the output values of the first analysis light and the second analysis light in the light source 32. Therefore, for example, it is desirable to correct and output the light loss due to the optical system in FIG. 5. Also, the same can be said for the optical system that condenses the signal light from the object to be processed 2. Therefore, for I ref it is also desirable to perform correction considering NA or transmittance, etc.

[0081] And when the data processing unit 31 calculates R(λ1) and R(λ2) and determines that R(λ1)>R(λ2), the data processing unit 31 adjusts the processing conditions of the object to be processed 2 so as to irradiate the processing position of the object to be processed 2 mainly with the second laser light L2. Specifically, the data processing unit 31 turns off the first laser oscillator 11 (OFF) or reduces the output of the first laser light L1 emitted from the first laser oscillator 11, and turns on the second laser oscillator 12 (ON) or increases the output of the second laser light L2 emitted from the second laser oscillator 12, and adjusts the processing conditions of the object to be processed 2.

[0082] On the other hand, when the data processing unit 31 calculates R(λ1) and R(λ2) and determines that R(λ1) < R(λ2), the data processing unit 31 adjusts the processing conditions of the workpiece 2 so as to irradiate the processing position of the workpiece 2 with the laser light mainly composed of the first laser light L1. Specifically, the data processing unit 31 turns on (ON) the first laser oscillator 11 or increases the output of the first laser light L1 emitted from the first laser oscillator 11, and at the same time, turns off (OFF) the second laser oscillator 12 or reduces the output of the second laser light L2 emitted from the second laser oscillator 12, so as to adjust the processing conditions of the workpiece 2.

[0083] The drive control unit 20 drives each of the first laser oscillator 11 and the second laser oscillator 12 according to the processing conditions adjusted by the data processing unit 31, thereby changing the intensity of each of the first laser light L1 and the second laser light L2 and irradiating the workpiece 2 with the first laser light L1 and the second laser light L2.

[0084] In addition, in the present embodiment, the laser processing apparatus 1A includes a first optical fiber 41, a second optical fiber 42, and an optical system 50.

[0085] The first laser light L1 emitted from the first laser oscillator 11 is transmitted through the first optical fiber 41 and irradiated onto the workpiece 2 through the optical system 50. Also, the second laser light L2 emitted from the second laser oscillator 12 is transmitted through the second optical fiber 42 and irradiated onto the workpiece 2 through the optical system 50.

[0086] The optical system 50 includes a half mirror 51 and a lens 52. The half mirror 51 transmits the first laser light L1 and reflects the second laser light L2. The lens 52 is an example of a condensing optical element, and condenses the first laser light L1 transmitted through the half mirror 51 and irradiates the workpiece 2, and also condenses the second laser light L2 reflected by the half mirror 51 and irradiates the workpiece 2. Although a plurality of lenses 52 are arranged, one lens may be used.

[0087] In the present embodiment, the drive circuit 21 can control the position of the lens 52. For example, when it is calculated in the data processing unit 31 that R(λ1) > R(λ2), the drive circuit 21 controls the position of the lens 52 so that the second laser beam L2 converges on the workpiece 2. When it is calculated in the data processing unit 31 that R(λ1) < R(λ2), the drive circuit 21 controls the position of the lens 52 so that the first laser beam L1 converges on the workpiece 2. In the case where R(λ1) = R(λ2), either the first laser beam L1 or the second laser beam L2 may be selected.

[0088] Further, the drive circuit 21 may be configured to be able to control the position of the processing table 3. That is, the drive circuit 21 may move the processing table 3 in the X-axis direction, Y-axis direction, and Z-axis direction to change the position of the processing table 3. Thereby, the positions of the first laser beam L1 and the second laser beam L2 irradiated on the processing position of the workpiece 2 disposed on the processing table 3 can be changed, or the positions of the first analysis light and the second analysis light irradiated on the processing position of the workpiece 2 disposed on the processing table 3 can be changed. This is the same in other embodiments.

[0089] In the present embodiment, the data processing unit 31 adjusts the processing conditions of the workpiece 2 based on the magnitude relationship (difference) between the light reflectivities R(λ1) and R(λ2), but is not limited thereto. For example, the data processing unit 31 is I which is the intensity (reflected light intensity) of each of the first signal light and the second signal light received by the first detector 33a ref (λ1) and ref I ref (λ2), and may adjust the processing conditions of the workpiece 2 based only on the magnitude relationship (difference) between them. In this case, when the data processing unit 31 determines that I ref (λ1) > I ref (λ2), the data processing unit 31 adjusts the processing conditions of the workpiece 2 so as to irradiate the processing position of the workpiece 2 mainly with the second laser beam L2, and I ref (λ1) < I refWhen it is determined that it is (λ2), the processing conditions of the workpiece 2 are adjusted so as to irradiate the processing position of the workpiece 2 with the laser light mainly composed of the first laser light L1. However, in this case, it is desirable that the wavelength dependency of the light output of the light source 32 is small, and it is desirable that the intensity of the first analysis light including the first wavelength (λ1) and the intensity of the second analysis light including the second wavelength (λ2) are the same.

[0090] Next, the laser processing method according to the present embodiment using the laser processing apparatus 1A will be described with reference to FIG. 5 and using FIG. 6. FIG. 6 is a flowchart of the laser processing method according to the second embodiment.

[0091] As shown in FIG. 6, first, the workpiece 2 is placed on the processing table 3 (step S21). Step S21 is the same as step S11 in the laser processing method of the above-described first embodiment.

[0092] Next, the analysis light including the first wavelength (λ1) and the second wavelength (λ2) is irradiated onto the processing position of the workpiece 2 (step S22). Specifically, the first analysis light and the second analysis light emitted from the light source 32 are irradiated onto the processing position of the workpiece 2.

[0093] Next, the signal light from the processing position of the workpiece 2 is received (step S23). Specifically, the first signal light and the second signal light, which are the reflected lights of the first analysis light and the second analysis light irradiated onto the processing position of the workpiece 2, are received by the first detector 33a.

[0094] Next, the reflected light intensity or the light reflectance is calculated (step S24). Specifically, based on the first signal light and the second signal light received by the first detector 33a, I ref (λ1) and I ref (λ2) are calculated. Also, based on the first analysis light and the second analysis light received by the second detector 33b, I in (λ1) and I inCalculate (λ2) and calculate the light reflectivities R(λ1) and R(λ2) for each of the first wavelength (λ1) and the second wavelength (λ2).

[0095] Next, compare the reflected light intensities or light reflectivities for the first wavelength (λ1) and the second wavelength (λ2) (step S25). Specifically, the data processing unit 31 compares the reflected light intensity I ref for the first wavelength (λ1) and the reflected intensity I ref for the second wavelength (λ2), or compares the reflectivities R(λ1) for the first wavelength (λ1) and R(λ2) for the second wavelength (λ2).

[0096] Next, adjust the processing conditions for the object to be processed 2 based on the comparison result of step S25 (step S26). Specifically, adjust the processing conditions for the object to be processed 2 according to the magnitude relationship between I ref (λ1) and I ref (λ2), or adjust the processing conditions for the object to be processed 2 according to the magnitude relationship between R(λ1) and R(λ2) in step S25.

[0097] Next, change the intensity of the laser light according to the adjusted processing conditions (step S27). Specifically, change the intensities of the first laser light L1 emitted from the first laser oscillator 11 and the second laser light L2 emitted from the second laser oscillator 12 according to the processing conditions adjusted in step S26.

[0098] Next, irradiate the object to be processed 2 with laser light (step S28). Specifically, according to the intensities of the first laser light L1 and the second laser light L2 set in step S27, emit the first laser light L1 from the first laser oscillator 11 and irradiate the processing position of the object to be processed 2 with the first laser light L1, or emit the second laser light L2 from the second laser oscillator 12 and irradiate the processing position of the object to be processed 2 with the second laser light L2. Step S16 is performed by the drive control unit 20.

[0099] The laser processing method according to this embodiment can be performed by the above-described procedure. In this case, as described above, steps S22 to S28 may be repeated only once to complete the laser processing, or steps S22 to S28 may be repeated a plurality of times in real time.

[0100] As described above, according to the laser processing apparatus 1A according to this embodiment, similar to the above-described Embodiment 1, the analysis unit 30 acquires the signal light from the workpiece 2, adjusts the processing conditions of the workpiece 2 based on the acquired signal light, and the drive control unit 20 drives the first laser oscillator 11 and the second laser oscillator 12 according to the adjusted processing conditions, thereby changing the intensity of at least one of the first laser beam L1 and the second laser beam L2 and irradiating the workpiece 2 with at least one of the first laser beam L1 and the second laser beam L2.

[0101] Thus, also in the laser processing apparatus 1A according to this embodiment, the signal light obtained from the workpiece 2 is analyzed to acquire the material information of the workpiece 2, and the processing conditions are adjusted according to the acquired material information, and the first laser oscillator 11 and the second laser oscillator 12 are driven.

[0102] Thereby, the first laser beam L1 and the second laser beam L2 can be irradiated onto the processing position of the workpiece 2 under processing conditions suitable for the material of the workpiece 2, so that high-quality laser processing can be realized with high throughput.

[0103] Further, in the laser processing apparatus 1A according to this embodiment, the analysis unit 30 includes a data processing unit 31 that analyzes the signal light from the workpiece 2.

[0104] Thus, by analyzing the signal light from the workpiece 2, the material information of the workpiece 2 can be obtained with high accuracy, so that the selection accuracy of the wavelength when laser processing the workpiece 2 is improved. Therefore, high-quality laser processing can be realized.

[0105] In the laser processing apparatus 1A according to the present embodiment, the analysis unit 30 adjusts the processing conditions at the coordinates at the processing position of the workpiece 2 when acquiring the signal light from the workpiece 2, and the drive control unit 20 drives the first laser oscillator 11 and the second laser oscillator 12 according to the processing conditions, so that at least one of the first laser light L1 and the second laser light L2 is irradiated onto the workpiece 2 based on the coordinates of the processing position of the workpiece 2.

[0106] In this way, by analyzing the signal light obtained from the coordinates of the processing position of the workpiece 2, the material information of the coordinates can be acquired. Thereby, the processing conditions can be adjusted according to the material information, and the more suitable one for laser processing among the first laser oscillator 11 and the second laser oscillator 12 can be driven, so that high-quality laser processing can be realized.

[0107] In the laser processing apparatus 1A according to the present embodiment, the data processing unit 31 adjusts the processing conditions at the coordinates at the processing position of the workpiece 2 based on the signal light from the workpiece 2.

[0108] Thereby, the material information of the workpiece 2 can be obtained with high accuracy, so that the selection accuracy of the wavelength when laser processing the workpiece 2 is further improved. Therefore, higher-quality laser processing can be realized.

[0109] In the laser processing apparatus 1A according to the present embodiment, the analysis unit 30 includes a light source 32 that emits analysis light to be irradiated onto the workpiece 2 and an optical system that irradiates the analysis light onto the processing position of the workpiece 2, and the signal light from the workpiece 2 is the reflected light obtained by reflecting at least a part of the analysis light from the light source 32 on the surface of the workpiece.

[0110] In this way, by making the signal light from the object 2 to be processed into the reflected light of the object 2 to be processed, it is possible to obtain, as the signal light, the reflected light corresponding to the physical properties of the material, such as the light absorption and light transmission of the analysis light of the object 2 to be processed. As a result, since the adjustment accuracy of the laser processing conditions according to the material of the object 2 to be processed is improved, it is possible to realize a laser processing apparatus capable of performing laser processing with higher processing quality.

[0111] Further, in the laser processing apparatus 1A according to the present embodiment, the analysis light irradiated on the object 2 to be processed includes first analysis light that is light having the same wavelength as the first wavelength, which is the peak wavelength of the first laser light L1, and second analysis light that is light having the same wavelength as the second wavelength, which is the peak wavelength of the second laser light L2. The signal light from the object 2 to be processed includes first signal light that is the reflected light obtained by irradiating the object 2 to be processed with the first analysis light and reflecting it from the object 2 to be processed, and second signal light that is the reflected light obtained by irradiating the object 2 to be processed with the second analysis light and reflecting it from the object 2 to be processed. Then, the data processing unit 31 adjusts the processing conditions by comparing the intensity of the first signal light and the intensity of the second signal light, or by comparing the reflectance at the first wavelength and the reflectance at the second wavelength, at the coordinates of the processing position of the object 2 to be processed.

[0112] In this way, by comparing the reflection intensities or reflectances at two wavelengths, it is possible to determine which of the first laser light L1 and the second laser light L2 is more suitable for the material at the processing position. Therefore, it is possible to realize a laser processing apparatus capable of performing laser processing with higher processing quality.

[0113] Further, in the laser processing apparatus 1A according to the present embodiment, the analysis light irradiated on the object 2 to be processed includes at least one of the first wavelength, which is the peak wavelength of the first laser light L1, and the second wavelength, which is the peak wavelength of the second laser light L2.

[0114] With this configuration, since the oscillation wavelength of the processing laser light is included in the analysis light, the reflection intensity or reflectance at the wavelength of the processing laser light can be analyzed with respect to the coordinates of the processing position of the object to be processed. As a result, the accuracy of adjusting the processing conditions can be improved, and a laser processing apparatus capable of performing laser processing with higher processing quality can be realized.

[0115] Also, in the laser processing apparatus 1A according to the present embodiment, the data processing unit 31 analyzes the reflectance of the analysis light irradiated on the object to be processed 2 from the intensity of the signal light from the object to be processed 2, and adjusts the processing conditions at the coordinates of the processing position of the object to be processed 2 by associating the coordinates and the reflectance at the processing position of the object to be processed.

[0116] As a result, since the reflection intensity or reflectance depending on the chemical composition or surface state of the material at the processing position of the object to be processed 2 can be analyzed, the analysis accuracy of the material characteristics is improved. Therefore, since the adjustment accuracy of the laser processing conditions according to the material at the processing position of the object to be processed 2 is improved, a laser processing apparatus capable of performing laser processing with higher processing quality can be realized.

[0117] Also, in the laser processing apparatus 1A according to the present embodiment, the analysis unit 30 includes a first detector 33a and a second detector 33b. The first detector 33a receives the signal light obtained by reflecting the analysis light irradiated on the object to be processed 2 by the object to be processed 2, and the second detector 33b receives at least a part of the analysis light irradiated on the object to be processed 2. Then, the data processing unit 31 corrects the intensity of the signal light received by the first detector 33a with the intensity of the analysis light received by the second detector 33b.

[0118] As a result, the intensity of the analysis light irradiated onto the object 2 to be processed and the signal light from the object 2 to be processed can be detected simultaneously, so that the reflected intensity or reflectance compensated for the variations or wavelength dependencies of the light source 32 that emits the analysis light can be obtained. As a result, the analysis accuracy of the material properties at the processing position of the object 2 to be processed is improved, so that the adjustment accuracy of the laser processing conditions according to the material at the processing position of the object 2 to be processed is improved. Therefore, a laser processing apparatus capable of performing laser processing with higher processing quality can be realized.

[0119] Further, in the laser processing apparatus 1A according to the present embodiment, the light source 32 that emits the analysis light is constituted by a laser oscillator or an LED.

[0120] As a result, the monochromatized analysis light is irradiated onto the object 2 to be processed, so that the reflected intensity or reflectance at a specific wavelength can be obtained. As a result, the analysis accuracy of the material properties at the processing position of the object 2 to be processed is further improved, so that the adjustment accuracy of the laser processing conditions according to the material at the processing position of the object 2 to be processed is further improved. Therefore, a laser processing apparatus capable of performing laser processing with even higher processing quality can be realized.

[0121] Further, in the laser processing apparatus 1A according to the present embodiment, the analysis light irradiated onto the object 2 to be processed is preferably monochromatized by a spectroscope or a filter that transmits a specific wavelength band.

[0122] Also in this case, since the monochromatized analysis light is irradiated onto the object 2 to be processed, the reflected intensity or reflectance at a specific wavelength can be obtained. Therefore, the analysis accuracy of the material properties at the processing position of the object 2 to be processed is further improved and the adjustment accuracy of the laser processing conditions according to the material at the processing position of the object 2 to be processed is improved, so that high-quality laser processing can be realized.

[0123] In the present embodiment, the light source 32 is provided in the analysis unit 30, but is not limited thereto. That is, the light source 32 may not be provided in the analysis unit 30.

[0124] (Embodiment 3) Next, the configuration of the laser processing apparatus 1B according to Embodiment 3 will be described with reference to FIG. 7. FIG. 7 is a block diagram showing the configuration of the laser processing apparatus 1B according to Embodiment 3.

[0125] The laser processing apparatus 1B according to the present embodiment, similar to the laser processing apparatus 1A according to the above Embodiment 2, has at least one of a first wavelength (λ1) and a second wavelength (λ2) included in the analysis light irradiated onto the workpiece 2. However, the laser processing apparatus 1B according to the present embodiment is different from the laser processing apparatus 1A according to the above Embodiment 2 in that a light source 32 that emits the analysis light irradiated onto the workpiece 2 is not separately arranged, and the processing laser light is used as the analysis light.

[0126] That is, in the laser processing apparatus 1B in the present embodiment, the analysis light irradiated onto the workpiece 2 is light that guides a part of at least one of the first laser light L1 emitted from the first laser oscillator 11 and the second laser light L2 emitted from the second laser oscillator 12.

[0127] Specifically, in the laser processing apparatus 1B in the present embodiment, as shown in FIG. 7, the first laser light L1 emitted from the first laser oscillator 11 is irradiated onto the workpiece 2 as the first analysis light, and the second laser light L2 emitted from the second laser oscillator 12 is irradiated onto the workpiece 2 as the second analysis light.

[0128] Therefore, in the present embodiment, the half mirror 51 reflects a part of the first laser light L1 emitted from the first laser oscillator 11 and transmits a part of the second laser light L2 emitted from the second laser oscillator 12 and makes it incident on the beam splitter 34 of the analysis unit 30. The first laser light L1 and the second laser light L2 incident on the beam splitter 34 are irradiated onto the processing position of the workpiece 2 as the first analysis light and the second analysis light.

[0129] The first laser beam L1 emitted from the first laser oscillator 11 and irradiated onto the workpiece 2 as the first analysis light and the second laser beam L2 emitted from the second laser oscillator 12 and irradiated onto the workpiece 2 as the second analysis light are reflected by the workpiece 2 and enter the first detector 33a.

[0130] Also, a part of the first laser beam L1 and a part of the second laser beam incident on the beam splitter 34 pass through the beam splitter 34 and enter the second detector 33b. As a result, since the first laser beam L1 as the first analysis light and the second laser beam L2 as the second analysis light can be received by the second detector 33b, the intensity of the first laser beam L1 as the first analysis light and the intensity of the second laser beam L2 as the second analysis light can be detected.

[0131] In addition, in the present embodiment, it is basically the same as the laser processing apparatus 1A according to the second embodiment except that a processing laser beam is used as the analysis light irradiated onto the workpiece 2. For example, the processing in the data processing unit 31 is the same as that in the second embodiment.

[0132] Next, the laser processing method according to the present embodiment using the laser processing apparatus 1B will be described with reference to FIG. 8. FIG. 8 is a flowchart of the laser processing method according to the third embodiment.

[0133] As shown in FIG. 8, the laser processing method according to the present embodiment includes steps S31 to S38.

[0134] The laser processing method according to the present embodiment is different from the laser processing method of the second embodiment only in step S32, and the other steps S31 and S33 to S38 are the same as steps S21 and S23 to S28 in the laser processing method of the second embodiment shown in FIG. 6.

[0135] In the laser processing method of the above-described Embodiment 2, in step S22, the first analysis light and the second analysis light emitted from the light source 32 were irradiated onto the processing position of the workpiece 2. However, in the laser processing method of the present embodiment, in step S32, the first laser light L1 and the second laser light L2 emitted from the first laser oscillator 11 and the second laser oscillator 12 are irradiated onto the processing position of the workpiece 2.

[0136] As described above, according to the laser processing apparatus 1B according to the present embodiment, the same effects as those of the laser processing apparatus 1A according to the above-described Embodiment 2 are achieved. For example, effects such as realizing high-quality laser processing with high throughput are achieved.

[0137] Further, in the laser processing apparatus 1B according to the present embodiment, unlike the above-described Embodiment 2, the analysis light irradiated onto the workpiece 2 is light that guides at least a part of either the first laser light L1 or the second laser light L2, which is the processing laser light.

[0138] With this configuration, since the laser light emitted from the laser oscillator is directly used as the analysis light, the reflectance or reflection intensity of the workpiece 2 at the wavelength of the laser light emitted from the laser oscillator can be analyzed. Therefore, since the adjustment accuracy of the laser processing conditions is further improved, a laser processing apparatus capable of performing laser processing with higher processing quality can be realized.

[0139] Moreover, by using the laser light from the laser oscillator as the analysis light, an analysis light source (light source 32) is not required as in the above-described Embodiment 2. Therefore, a compact laser processing apparatus can be realized.

[0140] In addition, in the present embodiment, the first laser beam L1 and the second laser beam L2 used as the first analysis light and the second analysis light may have the same intensity as the first laser beam L1 and the second laser beam L2 used as the processing laser beam when processing the object to be processed 2, or may be smaller than the intensity of the first laser beam L1 and the second laser beam L2 used as the processing laser beam. Further, when simultaneously irradiating the processing position of the object to be processed 2 with the analysis light and the processing laser beam, the laser beam emitted from one laser oscillator may be split into the analysis light and the processing laser beam. For example, the first laser beam L1 emitted from the first laser oscillator 11 may be split into 1% of the first analysis light and 99% of the processing laser beam. Further, it is not necessary to simultaneously irradiate the processing position of the object to be processed 2 with the analysis light and the processing laser beam. In this case, the analysis light may be irradiated at a position slightly ahead of the position where the processing laser beam is irradiated.

[0141] Note that although the same light source is used for the analysis light (the first analysis light, the second analysis light) and the processing laser beam, the timings of the irradiation of the analysis light and the irradiation of the processing laser beam may be different. In this case, when irradiating the analysis light, a mirror for guiding light to the analysis unit 30 may be arranged, and when irradiating the object to be processed 2 with the laser beam, the optical system 50 and the half mirror 51 may be driven so as to be guided to the processing position, thereby switching the light guiding direction of the light from the laser oscillator.

[0142] (Embodiment 4) Next, the configuration of the laser processing apparatus 1C according to Embodiment 4 will be described with reference to FIG. 9. FIG. 9 is a block diagram showing the configuration of the laser processing apparatus 1C according to Embodiment 4.

[0143] As shown in FIG. 9, the laser processing apparatus 1C according to the present embodiment includes a first laser oscillator 11, a second laser oscillator 12, a drive control unit 20, and an analysis unit 30C, similar to the laser processing apparatus 1A according to the second embodiment.

[0144] In the laser processing apparatus 1A according to the second embodiment, the reflectance R(λ1) at the first wavelength and the reflectance R(λ2) at the second wavelength are compared, or the reflection intensity I ref (λ1) at the first wavelength and the reflection intensity I ref (λ2) at the second wavelength are compared to select the laser beam for laser processing. However, in the laser processing apparatus 1C according to the present embodiment, the material of the workpiece 2 is specified from the reflection intensity spectrum of the workpiece 2, and the laser beam for laser processing is selected.

[0145] Specifically, the laser processing apparatus 1C in the present embodiment is different from the laser processing apparatus 1A in the second embodiment in the configuration of the analysis unit 30C. Specifically, the analysis unit 30C in the present embodiment includes a data processing unit 31C, a light source 32C, a detector 33C, a mirror 34C, a lens 35, a spectroscope 36, and a database 37.

[0146] The light source 32C emits light including a first wavelength (λ1) that is the peak wavelength of the first laser beam L1 emitted by the first laser oscillator 11 and a second wavelength (λ2) that is the peak wavelength of the second laser beam L2 emitted by the second laser oscillator 12 as analysis light for irradiating the workpiece 2. In the present embodiment, the light source 32 emits white light including λ1 and λ2 in a relationship of λ1 > λ2.

[0147] The spectroscope 36 spectroscopes the signal light from the workpiece 2. Specifically, the spectroscope 36 spectroscopes the signal light that is the reflected light reflected by the workpiece 2 of the analysis light emitted from the light source 32, reflected by the mirror 34C, condensed by the lens 35, and irradiated onto the workpiece 2.

[0148] The signal light spectroscoped by the spectroscope 36 enters the detector 33C. The detector 33C measures the reflection spectrum indicating the wavelength dependence of the intensity or reflectance of the signal light from the workpiece 2 by measuring the signal light from the workpiece 2 spectroscoped by the spectroscope 36.

[0149] The database 37 stores a data group of a plurality of types of reflection spectra for each material. Specifically, the database 37 stores a data group of a plurality of types of reflection spectra that can be the material of at least the workpiece 2. The database 37 accumulates a plurality of data of the reflection spectra of existing materials.

[0150] Then, the data processing unit 31C adjusts the processing conditions at the coordinates of the processing position of the workpiece 2 based on the reflection spectrum measured by the detector 33C. Specifically, the data processing unit 31C is connected to the database 37, collates the reflection spectrum obtained from the signal light from the workpiece 2 with the data group of the reflection spectra stored in the database 37, and determines which of the materials stored in the database 37 the material at the coordinates of the processing position of the workpiece 2 is closest to, and adjusts the processing conditions at the coordinates of the processing position of the workpiece according to the determined material.

[0151] In this case, if there is a reflection spectrum in the data group of the database 37 that matches the reflection spectrum obtained from the signal light from the workpiece 2, the material corresponding to the reflection spectrum can be specified as the material of the workpiece 2. However, even if there is no reflection spectrum in the data group of the database 37 that matches the reflection spectrum obtained from the signal light from the workpiece 2, the material of the workpiece may be determined by the closest reflection spectrum in the data group of the database 37.

[0152] Note that the data of the newly acquired reflection spectrum may be linked to the material of the workpiece and additionally stored in the database 37. Thereby, the database 37 can be expanded. Also, the collation result of the reflection spectrum and the processing conditions may be linked and stored in the database 37 again.

[0153] Next, the laser processing method according to the present embodiment using the laser processing apparatus 1C will be described with reference to FIG. 10. FIG. 10 is a flowchart of the laser processing method according to the fourth embodiment.

[0154] As shown in FIG. 10, first, the object to be processed 2 is placed on the processing table 3 (step S41). Step S41 is the same as step S21 in the laser processing method of the above-described Embodiment 2.

[0155] Next, the object to be processed 2 at the processing position is irradiated with analysis light including a first wavelength (λ1) and a second wavelength (λ2) (step S42). Specifically, the analysis light including the first wavelength and the second wavelength emitted from the light source 32C is irradiated onto the processing position of the object to be processed 2.

[0156] Next, the signal light from the processing position of the object to be processed 2 is spectroscopically received (step S43). Specifically, the signal light, which is the reflected light of each of the analysis lights irradiated onto the processing position of the object to be processed 2, is spectroscopically separated by the spectroscope 36, and the signal light spectroscopically separated by the spectroscope 36 is received by the detector 33C.

[0157] Next, a reflection spectrum showing the wavelength dependence of the intensity or reflectance of the signal light from the object to be processed 2 is calculated (step S44). Specifically, by measuring the signal light spectroscopically separated by the spectroscope 36 and received by the detector 33C, a reflection spectrum showing the wavelength dependence of the reflection intensity as shown in FIG. 11 is calculated.

[0158] Next, the measured reflection spectrum of the signal light is compared with the database 37 to analyze the material (step S45). Specifically, by comparing the reflection spectrum measured by the detector 33C with the data group of a plurality of types of reflection spectra for each material stored in the database 37 as shown in FIG. 12, it is determined which material stored in the database 37 the material at the coordinates at the processing position of the processing object 2 is closest to. For example, when the reflection spectrum measured by the detector 33C is the reflection spectrum shown in FIG. 11, since the reflection spectrum shown in FIG. 11 is closest to the reflection spectrum of copper among the plurality of reflection spectra shown in FIG. 12 (since they almost coincide in FIGS. 11 and 12), it can be determined that the material at the coordinates at the processing position of the processing object 2 is copper. That is, by comparing the measured reflection spectrum of the signal light with the database, it is analyzed that the material at the processing position of the processing object 2 is likely to be copper.

[0159] Next, the processing conditions at the coordinates at the processing position of the processing object 2 are adjusted according to the material determined in step S45 (step S46). For example, as described above, when it is determined that the material at the processing position of the processing object 2 is copper, processing conditions for laser processing with a laser beam having a wavelength suitable for copper (in this embodiment, the second laser beam L2 which is a blue laser beam) are created.

[0160] Next, the intensity of the laser beam is changed from the adjusted processing conditions (step S47). Specifically, according to the processing conditions adjusted in step S46, the intensities of the first laser beam L1 emitted from the first laser oscillator 11 and the second laser beam L2 emitted from the second laser oscillator 12 are changed.

[0161] Next, the workpiece 2 is irradiated with laser light (step S48). Specifically, according to the intensity of each of the first laser light L1 and the second laser light L2 set in step S47, the first laser light L1 is emitted from the first laser oscillator 11 and the workpiece 2 is irradiated with the first laser light L1 at the processing position, or the second laser light L2 is emitted from the second laser oscillator 12 and the workpiece 2 is irradiated with the second laser light L2 at the processing position.

[0162] The laser processing method according to the present embodiment can be performed in the above-described procedure. In this case, as in the above-described Embodiment 2, the laser processing may be terminated by repeating steps S42 to S48 only once, or steps S42 to S48 may be repeatedly performed a plurality of times in real time.

[0163] As described above, according to the laser processing apparatus 1C according to the present embodiment, similar to the above-described Embodiment 2, the analysis unit 30C acquires the signal light from the workpiece 2, adjusts the processing conditions of the workpiece 2 based on the acquired signal light, and the drive control unit 20 drives the first laser oscillator 11 and the second laser oscillator 12 according to the adjusted processing conditions, thereby changing the intensity of at least one of the first laser light L1 and the second laser light L2 and irradiating the workpiece 2 with at least one of the first laser light L1 and the second laser light L2.

[0164] As a result, the same effect as that of the above-described Embodiment 2 is obtained. That is, since the workpiece 2 can be irradiated with the first laser light L1 and the second laser light L2 at the processing position under the processing conditions suitable for the material of the workpiece 2, high-quality laser processing with high throughput can be realized.

[0165] Further, in the laser processing apparatus 1C according to the present embodiment, the analysis unit 30C includes a spectroscope 36 that splits the signal light from the workpiece 2, and a detector 33C that measures the signal light split by the spectroscope 36 to measure a reflection spectrum indicating the wavelength dependence of the intensity or reflectivity of the signal light. The data processing unit 31C adjusts the processing conditions at the coordinates of the processing position of the workpiece 2 based on the reflection spectrum measured by the detector 33C.

[0166] In this way, by acquiring the reflection spectrum, which is the wavelength dependence of the reflection intensity or reflectivity specific to the material, the analysis accuracy of the material characteristics or the chemical composition of the material at the coordinates of the processing position of the workpiece 2 is improved, and the adjustment accuracy of the laser processing conditions according to the material is improved. Therefore, a laser processing apparatus capable of performing laser processing with higher processing quality can be realized.

[0167] Also, in the laser processing apparatus 1C according to the present embodiment, the data processing unit 31C is connected to a database 37 in which a data group of a plurality of types of reflection spectra for each material is stored. The data processing unit 31 collates the reflection spectrum obtained from the signal light from the workpiece 2 with the data group of the reflection spectra stored in the database 37, determines which of the materials stored in the database 37 the material at the coordinates of the processing position of the workpiece 2 is closest to, and adjusts the processing conditions at the coordinates of the processing position of the workpiece 2 according to the determined material.

[0168] In this way, by collating the reflectivity spectrum specific to the material with the database 37, the analysis accuracy of the material characteristics or the chemical composition of the material at the coordinates of the processing position of the workpiece 2 is improved, and the adjustment accuracy of the laser processing conditions according to the material is further improved. Therefore, a laser processing apparatus capable of performing laser processing with even higher processing quality can be realized.

[0169] In this embodiment, the signal light, which is the reflected light of the analysis light irradiated on the object 2 to be processed, is split by the spectroscope 36 to calculate the reflection spectrum of the material of the object 2 to be processed. However, the present invention is not limited to this. For example, the light split by the spectroscope may be used as the analysis light to irradiate the object 2 to be processed. In this case, the analysis unit 30C only needs to have a spectroscope that splits the analysis light emitted from the light source 32, irradiates the split analysis light on the processing position of the object to be processed, and measures the signal light reflected from the surface of the object 2 to be processed by the split analysis light, so as to measure the intensity of the signal light from the object 2 to be processed or a detector that measures the reflection spectrum indicating the wavelength dependence of the reflectance. Also in this case, the same effects as those of the present embodiment are achieved.

[0170] Also, in this embodiment, the database 37 is a storage device such as a memory, which is included in the analysis unit 30C, but the present invention is not limited to this. The database 37 may be arranged outside the laser processing apparatus 1C. Further, the database 37 may be installed in a cloud server or the like connected to the data processing unit 31C via a network such as the Internet. By installing the database 37 on the cloud server, along with the expansion and extension of the database 37, machine learning using artificial intelligence can be introduced to improve the accuracy of the collation result.

[0171] (Embodiment 5) Next, the configuration of the laser processing apparatus 1D according to Embodiment 5 will be described with reference to FIG. 13. FIG. 13 is a block diagram showing the configuration of the laser processing apparatus 1D according to Embodiment 5.

[0172] As shown in FIG. 13, the laser processing apparatus 1D according to the present embodiment includes a first laser oscillator 11, a second laser oscillator 12, a drive control unit 20, and an analysis unit 30D, similar to the laser processing apparatuses 1A to 1C according to the above-described Embodiments 2 to 4.

[0173] In the laser processing apparatuses 1A to 1C according to the second to fourth embodiments, the signal light from the workpiece 2 is received by a detector and analyzed to select the laser light for laser processing. However, in the laser processing apparatus 1D according to the present embodiment, the signal light from the workpiece 2 is imaged by an image sensor 38 to select the laser light for laser processing.

[0174] Specifically, the laser processing apparatus 1D in the present embodiment differs from the laser processing apparatuses 1A to 1C in the second to fourth embodiments in the configuration of the analysis unit 30D. Specifically, the analysis unit 30D in the present embodiment includes a data processing unit 31D, an image sensor 38, and an image processing unit 39.

[0175] The laser processing apparatus 1D in the present embodiment further includes a light source 60. The light source 60 irradiates the workpieces 2A and 2B with analysis light. The analysis light irradiated by the light source 60 is, for example, white light. In the present embodiment, unlike the first to fourth embodiments, as shown in FIG. 13, two workpieces 2A each made of only one type of metal material are welded and joined, and two workpieces 2B each made of only one type of metal material are welded and joined are exemplified. The material constituting the workpiece 2A is, for example, aluminum, and the material constituting the workpiece 2B is, for example, copper.

[0176] The image sensor 38 is an example of a solid-state imaging device in which a plurality of pixels that receive light are two-dimensionally arranged. In the present embodiment, the image sensor 38 is a color image sensor. In the present embodiment, the image sensor 38 has at least a first pixel provided with a filter that transmits near-infrared rays as a first filter that transmits a first wavelength (λ1), and a second pixel provided with a filter that transmits at least a part of the wavelengths in the visible light region as a second filter that transmits a second wavelength (λ2).

[0177] The image sensor 38 captures a two-dimensional image of the workpieces 2A and 2B by receiving the signal light from the workpieces 2A and 2B, and outputs this two-dimensional image to the data processing unit 31D. Specifically, the image sensor 38 captures the signal light, which is the reflected light obtained by the analysis light irradiated from the light source 60 being reflected by the workpieces 2A and 2B. The two-dimensional image captured by the image sensor 38 is input to the data processing unit 31D via the image processing unit 39. The image processing unit 39 generates the image data of the two-dimensional image as shown in FIG. 14 based on the signal light received by the image sensor 38, and outputs this image data to the data processing unit 31D.

[0178] Then, the data processing unit 31D adjusts the processing conditions of the workpieces 2A and 2B according to the brightness corresponding to the processing positions (welding regions) of the workpieces 2A and 2B in the two-dimensional image. Specifically, the data processing unit 31D compares the pixel signal intensity of the first wavelength of the signal light and the pixel signal intensity of the second wavelength of the signal light at the processing positions of the workpieces 2A and 2B in the two-dimensional image received by the image sensor 38, thereby adjusting the processing conditions of the workpieces 2A and 2B. That is, in the present embodiment, the reflectance of the workpieces 2A and 2B is estimated from the two-dimensional image composed of spectral pixels provided with a spectral filter that transmits light of a specific wavelength on the pixels, and the wavelength of the processing laser light suitable for each coordinate is selected from the relationship between the coordinates and the brightness at the processing position of the workpiece 2.

[0179] Next, the laser processing method according to the present embodiment using the laser processing apparatus 1D will be described with reference to FIG. 15. FIG. 15 is a flowchart of the laser processing method according to Embodiment 5.

[0180] As shown in FIG. 15, first, the workpieces 2A and 2B are placed on the processing table 3 (step S51). Step S51 is the same as step S21 in the laser processing method of the above-described Embodiment 2.

[0181] Next, irradiate the processing positions of the objects to be processed 2A and 2B with analysis light (step S52). Specifically, irradiate the area including the processing positions of the objects to be processed 2A and 2B with the analysis light emitted from the light source 60.

[0182] Next, image the signal light from the processing positions of the objects to be processed 2A and 2B with the image sensor 38 (step S53). Specifically, image the signal light, which is the reflected light obtained by reflecting the analysis light of the light source 60 irradiated on the processing positions of the objects to be processed 2A and 2B, with the image sensor 38 to acquire a two-dimensional image. That is, for the objects to be processed 2A and 2B, a two-dimensional image including a plurality of spectroscopic pixels is acquired.

[0183] Next, analyze the captured two-dimensional image (step S54). Specifically, in the two-dimensional image captured by the image sensor 38, compare the pixel signal intensity (spectroscopic pixel intensity) of the first wavelength of the signal light with the pixel signal intensity (spectroscopic pixel intensity) of the second wavelength of the signal light at the processing positions of the objects to be processed 2A and 2B.

[0184] Next, adjust the processing conditions at the coordinates of the processing positions of the objects to be processed 2A and 2B according to the comparison result of step S54 (step S55).

[0185] Steps S54 and S55 can be performed, for example, as follows.

[0186] Since the image sensor 38 has a plurality of spectroscopic pixels arranged periodically, by receiving the signal light from the objects to be processed 2A and 2B with the image sensor 38, the color and brightness (luminance) of each pixel are determined from the intensity information of adjacent spectroscopic pixels, and a two-dimensional image is captured. Thereby, the spectroscopic pixel intensity can be acquired at the pixels corresponding to the respective coordinates of the processing positions of the objects to be processed 2A and 2B.

[0187] For example, as one of the spectroscopic pixels of a general color image sensor, a Bayer array pixel shown in FIG. 16 is known. In this case, one spectroscopic pixel is composed of four sub-pixels: two green sub-pixels (G), one red sub-pixel (R), and one blue sub-pixel (B). A color filter such as a pigment is provided on each sub-pixel, and each sub-pixel has a specific spectral sensitivity. Usually, the brightness and color of one spectroscopic pixel are determined by the four sub-pixels of the Bayer array pixel and output as one piece of data. For the spectroscopic pixel of the Bayer array, there are a blue sub-pixel sensitive to blue and a red sub-pixel sensitive to red, and an image can be constructed for each color combination to obtain the reflection intensity corresponding to each coordinate.

[0188] And in each spectroscopic pixel of the two-dimensional image captured by the image sensor 38, when the signal intensity of the blue sub-pixel is greater than the signal intensity of the red sub-pixel, the reflectance of blue light is high. Therefore, in this case, for example, the processing condition is laser processing (infrared processing) with the first laser beam L1.

[0189] On the other hand, in each spectroscopic pixel of the two-dimensional image captured by the image sensor 38, when the signal intensity of the blue sub-pixel is smaller than the signal intensity of the red sub-pixel, the reflectance of blue light is low. Therefore, in this case, for example, the processing condition is laser processing (blue processing) with the second laser beam L2.

[0190] Note that since the green sub-pixel indicates luminance information, a monochrome two-dimensional image can be constructed with the signal intensity of the green sub-pixel, and it is also possible to display which positions on the two-dimensional image are suitable for laser processing with the first laser beam L1 and which positions are suitable for laser processing with the second laser beam L2. Also, the output of the red sub-pixel and the output of the blue sub-pixel can be combined to reproduce the color and display it as a normal color image.

[0191] Further, the layout of each spectroscopic pixel of the image sensor 38 is not limited to the Bayer array shown in FIG. 16. For example, it may be a white pixel in which one or two color filters of the green sub-pixels are not arranged. With this configuration, since it is a white pixel, a monochrome luminance image can be captured with high sensitivity for all materials. Also, as shown in FIG. 17, each spectroscopic pixel of the image sensor 38 may be a Bayer array pixel in which at least one or more near-infrared (NIR) sub-pixels are provided in each spectroscopic pixel. Also in this case, an image can be formed for each color combination and the reflection intensity corresponding to each coordinate can be obtained.

[0192] And, for example, when the signal intensity of the blue sub-pixel is greater than the signal intensity of the NIR sub-pixel, laser processing (blue processing) is performed with the second laser beam L2, and when the signal intensity of the blue sub-pixel is about the same as the signal intensity of the NIR sub-pixel, the processing condition is to perform laser processing (infrared processing) with the first laser beam L1.

[0193] Next, the intensity of the laser beam is changed from the adjusted processing conditions (step S56). Specifically, according to the processing conditions adjusted in step S55, the intensities of the first laser beam L1 emitted from the first laser oscillator 11 and the second laser beam L2 emitted from the second laser oscillator 12 are changed.

[0194] Next, the processing objects 2A and 2B are irradiated with the laser beam (step S57). Specifically, according to the intensities of the first laser beam L1 and the second laser beam L2 set in step S56, the first laser beam L1 is emitted from the first laser oscillator 11 to irradiate the processing positions of the processing objects 2A and 2B with the first laser beam L1, or the second laser beam L2 is emitted from the second laser oscillator 12 to irradiate the processing positions of the processing objects 2A and 2B with the second laser beam L2.

[0195] The laser processing method according to this embodiment can be performed in the above-described procedure. In this case, as in the above-described Embodiment 2, the steps S52 to S57 may be repeated only once to finish the laser processing, or the steps S52 to S57 may be repeated a plurality of times in real time.

[0196] As described above, according to the laser processing apparatus 1D according to this embodiment, similar to the above-described Embodiment 2, the analysis unit 30D acquires the signal light from the workpieces 2A and 2B, and adjusts the processing conditions of the workpieces 2A and 2B based on the acquired signal light. The drive control unit 20 drives the first laser oscillator 11 and the second laser oscillator 12 according to the adjusted processing conditions, thereby changing the intensity of at least one of the first laser beam L1 and the second laser beam L2, and irradiating the workpiece 2 with at least one of the first laser beam L1 and the second laser beam L2.

[0197] Thereby, the same effects as those in the above-described Embodiment 2 are achieved. That is, since the first laser beam L1 and the second laser beam L2 can be irradiated to the processing positions of the workpieces 2A and 2B under the processing conditions suitable for the respective materials of the workpieces 2A and 2B, high-quality laser processing with high throughput can be realized.

[0198] Further, in the laser processing apparatus 1D according to this embodiment, the analysis unit 30D includes an image sensor 38 that outputs a two-dimensional image of the workpieces 2A and 2B to the data processing unit 31D by receiving the signal light from the workpieces 2A and 2B. The data processing unit 31D adjusts the processing conditions of the workpieces 2A and 2B according to the brightness corresponding to the processing positions of the two-dimensional image captured by the image sensor 38.

[0199] With this configuration, by comparing and analyzing the brightness of each spectral pixel of the two-dimensional image, the intensity of the signal light at each coordinate of the processing positions of the workpieces 2A and 2B can be analyzed simultaneously in a two-dimensional plane. Thereby, a laser processing apparatus that can easily achieve both high processing quality and high throughput can be realized.

[0200] Further, in the laser processing apparatus 1D according to the present embodiment, the image sensor 38 preferably has a first pixel equipped with a first filter that transmits at least a third wavelength (λ3) and a second pixel equipped with a second filter that transmits a fourth wavelength (λ4). In this case, the data processing unit 31D may adjust the processing conditions of the workpiece by comparing the pixel signal intensity of the third wavelength of the signal light and the pixel signal intensity of the fourth wavelength of the signal light at the processing positions of the workpieces 2A and 2B in the two-dimensional image received by the image sensor 38.

[0201] With this configuration, since it is possible to compare the intensities of the signal light for each wavelength at the spectral pixels corresponding to the coordinates of the processing positions of the workpieces 2A and 2B, it is possible to simultaneously analyze the reflection intensities or reflectivities at different wavelengths on a two-dimensional plane. As a result, it is possible to realize a laser processing apparatus that can more easily achieve both high processing quality and high throughput.

[0202] In this case, for example, the first filter is preferably a filter that transmits near-infrared light, and the second filter is preferably a filter that transmits at least some wavelengths in the visible light region.

[0203] With this configuration, it becomes possible to acquire color signals in a wide wavelength range. Therefore, in the comparison of the reflection spectrum or reflection intensity, it is possible to simultaneously analyze the material characteristics with high accuracy on a two-dimensional plane. As a result, it is possible to realize a laser processing apparatus that can more easily achieve both high processing quality and high throughput.

[0204] Note that according to this embodiment, by comparing the signal intensities of each spectral pixel of the two-dimensional image captured by the image sensor 38, the reflection spectrum in one Bayer array can be synthesized. For example, when each spectral pixel of the two-dimensional image captured by the image sensor 38 is in the arrangement shown in FIG. 17, for each spectral pixel, a reflection spectrum as exemplified in FIG. 18 can be obtained. In this case, the data processing unit 31D connects to a database in which a data group of reflection spectra is stored, and collates the reflection spectra obtained by each spectral pixel of the two-dimensional image captured by the image sensor 38 with the database, thereby analyzing the material at the coordinate position of each spectral pixel.

[0205] That is, in this case, the data processing unit 31D, as in the fourth embodiment, collates the pixel signal intensity of the third wavelength (λ3) of the signal light and the pixel signal intensity of the fourth wavelength (λ4) of the signal light at the processing positions of the workpieces 2A and 2B with the data group of the reflection spectra stored in the database respectively, determines which material stored in the database the material at the coordinates at the processing positions of the workpieces 2A and 2B is closest to, and may adjust the processing conditions at the coordinates at the processing positions of the workpieces 2A and 2B according to the determined material.

[0206] With this configuration, since the reflection spectrum can be output for each spectral pixel corresponding to each coordinate at the processing positions of the workpieces 2A and 2B, the material can be analyzed simultaneously on a two-dimensional plane. As a result, a laser processing apparatus capable of achieving both high processing quality and high throughput can be realized.

[0207] Here, it is desirable that the third wavelength (λ3) and the fourth wavelength (λ4) are the same as the wavelengths of the first laser light L1 emitted from the first laser oscillator 11 and the second laser light L2 emitted from the second laser oscillator 12, respectively. With this configuration, the reflectance or reflection intensity of the workpiece 2 at the wavelengths of the laser light emitted from these laser oscillators can be directly compared. Therefore, since the adjustment accuracy of the laser processing conditions is further improved, a laser processing apparatus capable of performing laser processing with higher processing quality can be realized.

[0208] In addition, in this embodiment, as described above, the case of welding and joining two workpieces 2A or 2B made of only one type of metal material has been described, but it is not limited to this. For example, this embodiment can also be applied to the case of welding and joining two composite materials 2X as in the above-described Embodiments 1 to 4.

[0209] (Embodiment 6) Next, the configuration of the laser processing apparatus 1E according to Embodiment 6 will be described with reference to FIG. 19. FIG. 19 is a block diagram showing the configuration of the laser processing apparatus 1E according to Embodiment 6.

[0210] As shown in FIG. 19, the laser processing apparatus 1E according to this embodiment includes a first laser oscillator 11, a second laser oscillator 12, a drive control unit 20, and an analysis unit 30E, similar to the laser processing apparatus 1D according to the above-described Embodiment 5.

[0211] Also, the laser processing apparatus 1E according to this embodiment images and analyzes the signal light from the workpiece 2 with the image sensor 38, similar to the laser processing apparatus 1D according to the above-described Embodiment 5. Specifically, the analysis unit 30E includes a data processing unit 31E, an image sensor 38, and an image processing unit 39.

[0212] The difference between the laser processing apparatus 1E according to this embodiment and the laser processing apparatus 1D according to the above-described Embodiment 5 is that, in Embodiment 5, the analysis light was irradiated onto the workpieces 2A and 2B using the light source 60, but in this embodiment, the workpieces 2A and 2B are not irradiated with the analysis light.

[0213] Specifically, in the laser processing apparatus 1E according to this embodiment, the plume (laser plume) generated during laser processing is analyzed as the signal light. Therefore, in this embodiment, the signal light from the workpieces 2A and 2B is the light emission generated during processing when at least one of the first laser light L1 and the second laser light L2 is irradiated onto the workpieces 2A and 2B. Note that the plume is the metal element plasma that becomes hot and rises during laser processing, and the color of the plume varies depending on the material, similar to a flame test.

[0214] The image sensor 38 acquires the emission spectrum of the plume by imaging the plume generated during laser processing in real time.

[0215] The data processing unit 31E adjusts the processing conditions with respect to the coordinates of the processing positions of the workpieces 2A and 2B from the emission spectrum of the plume acquired by the image sensor 38. In this way, by measuring the plume, it is possible to select the optimal wavelength of the processing laser light and perform output control, so that the processing quality of the workpieces 2A and 2B can be improved.

[0216] As shown in FIG. 19, in this embodiment, the case of welding and joining one workpiece 2A made of the first material (Material A) and one workpiece 2B made of the second material (Material B) is illustrated.

[0217] Next, the laser processing method according to this embodiment using the laser processing apparatus 1E will be described with reference to FIG. 20. FIG. 20 is a flowchart of the laser processing method according to Embodiment 6.

[0218] As shown in FIG. 20, first, the workpieces 2A and 2B are overlapped and placed on the worktable 3 (step S61). Step S61 is the same as step S21 in the laser processing method of the second embodiment described above.

[0219] Next, the workpiece 2A or 2B is irradiated with laser light (step S62). Specifically, since the workpiece 2A is disposed on the workpiece 2B, at least one of the first laser light L1 and the second laser light is irradiated as the processing laser light to the processing position of the workpiece 2A.

[0220] Next, the plume generated by the laser irradiation is imaged by the image sensor 38 (step S63). Specifically, the plume generated by irradiating at least one of the first laser light L1 and the second laser light as the processing laser light to the processing positions of the workpieces 2A and 2B is imaged by the image sensor 38 as the signal light from the workpiece 2A or 2B, and the emission spectrum of the plume is acquired.

[0221] In this case, for example, when the processing depth increases due to the laser processing (that is, as the processing time elapses), the image sensor 38 can obtain the dependency of the emission intensity of a specific wavelength included in the plume as shown in FIG. 21 on the processing depth (or processing time).

[0222] Next, the image of the imaged plume is analyzed (step S64). Specifically, the emission spectrum of the plume imaged by the image sensor 38 is collated with a database (not shown) in which a data group of a plurality of types of emission spectra for each material is stored, and it is determined which of the materials stored in the database the material of the workpiece during the laser processing is closest to.

[0223] At this time, as the processing depth increases due to laser processing, as shown in FIG. 21, when the emission intensities of the first material (material A) and the second material (material B) are swapped, it can be seen that the processing target has changed from the workpiece 2A made of the first material (material A) to the workpiece 2B made of the second material (material B) at the point when the emission intensities are swapped.

[0224] Next, the processing conditions of the workpiece are adjusted according to the analysis result of step S64 (step S65). Specifically, among the first laser beam L1 and the second laser beam L2, the laser beam with the wavelength suitable for the material determined in step S64 is selected.

[0225] Next, the intensity of the laser beam is changed from the adjusted processing conditions (step S66). Specifically, according to the processing conditions adjusted in step S65, the intensities of the first laser beam L1 emitted from the first laser oscillator 11 and the second laser beam L2 emitted from the second laser oscillator 12 are changed.

[0226] Next, the workpiece is irradiated with the laser beam (step S67). Specifically, according to the intensities of the first laser beam L1 and the second laser beam L2 set in step S66, the first laser beam L1 is emitted from the first laser oscillator 11 to irradiate the processing position of the workpiece 2 with the first laser beam L1, or the second laser beam L2 is emitted from the second laser oscillator 12 to irradiate the processing position of the workpiece 2 with the second laser beam L2.

[0227] The laser processing method according to the present embodiment can be performed in the above-described procedure.

[0228] As described above, according to the laser processing apparatus 1E according to this embodiment, similar to the fifth embodiment, the analysis unit 30E acquires the signal light from the workpieces 2A and 2B, adjusts the processing conditions of the workpieces 2A and 2B based on the acquired signal light, and the drive control unit 20 drives the first laser oscillator 11 and the second laser oscillator 12 according to the adjusted processing conditions, thereby changing the intensity of at least one of the first laser beam L1 and the second laser beam L2 and irradiating the workpiece 2 with at least one of the first laser beam L1 and the second laser beam L2.

[0229] As a result, the same effects as those of the fifth embodiment are achieved. That is, since the first laser beam L1 and the second laser beam L2 can be irradiated onto the processing positions of the workpieces 2A and 2B under processing conditions suitable for the respective materials of the workpieces 2A and 2B, high-quality laser processing with high throughput can be realized.

[0230] In addition, in the laser processing apparatus 1E according to this embodiment, the signal light from the workpieces 2A and 2B is light emission generated during processing when at least one of the first laser beam L1 and the second laser beam L2 is irradiated onto the workpiece 2A or 2B.

[0231] With this configuration, since the material of the workpiece 2A or 2B during laser processing can be specified by the plume generated when the workpieces 2A and 2B are laser processed, the laser beam for processing optimal for the material can be selected. That is, the material identification of the workpieces 2A and 2B and the wavelength selection of the laser beam for processing can be performed in real time. As a result, since the analysis of the material of the workpiece can be performed simultaneously with the laser processing, the adjustment of the processing conditions of the workpiece can be performed simultaneously with the laser processing. Therefore, a laser processing apparatus capable of achieving both high processing quality and high throughput can be realized.

[0232] In the present embodiment, the emission spectrum of the plume is acquired using the image sensor 38, but it is not limited to this. For example, instead of the image sensor 38, a spectroscope may be used. In this case, the analysis unit 30E includes a spectroscope that spectroscopically analyzes the plume (emission) and a data processing unit that outputs the emission spectrum of the plume. The data processing unit may adjust the processing conditions with respect to the coordinates of the processing position of the object to be processed based on the emission spectrum of the plume.

[0233] Even with this configuration, the emission spectrum unique to the material can be acquired. As a result, the analysis accuracy of the material characteristics or the chemical composition of the material at the coordinates of the processing position of the object to be processed is improved, and the adjustment accuracy of the laser processing conditions according to the material is improved. Thereby, a laser processing apparatus capable of performing laser processing with high processing quality can be realized.

[0234] (Modification example) As described above, the laser processing apparatus and the like according to the present disclosure have been described based on the embodiments. However, the present disclosure is not limited to the above-described embodiments.

[0235] For example, in the above-described Embodiments 2 to 6, the first laser beam L1 emitted from the first laser oscillator 11 and the second laser beam L2 emitted from the second laser oscillator 12 are irradiated onto the object to be processed on the same optical axis by the optical system 50, which is a single condensing optical system including the half mirror 51 and the lens 52. However, it is not limited to this. For example, as in the laser processing apparatus 1F shown in FIG. 22, the first laser beam L1 emitted from the first laser oscillator 11 and the second laser beam L2 emitted from the second laser oscillator 12 may be irradiated onto the object to be processed on separate optical axes by the optical system 50F, which is an individual condensing optical system including the first lens group 52a and the second lens group 52b.

[0236] In addition, in the above-described Embodiment 1, the light source 32 was constituted by a first light source that emits light including a first wavelength (λ1) which is the peak wavelength of the first laser beam L1, and a second light source that emits light including a second wavelength (λ2) which is the peak wavelength of the second laser beam L2. However, the present invention is not limited to this. For example, the light source 32 may be constituted by a first light source that emits light including a third wavelength (λ3) different from the first wavelength (λ1) and the second wavelength (λ2), and a second light source that emits light including a fourth wavelength (λ4) different from the first wavelength (λ1), the second wavelength (λ2), and the third wavelength (λ3). In this case, the first light source of the light source 32 emits light having a peak wavelength of the third wavelength (λ3) as the first analysis light, and the second light source of the light source 32 emits light having a peak wavelength of the fourth wavelength (λ4) as the second analysis light. The third wavelength (λ3) and the fourth wavelength (λ4) are preferably in the range from ultraviolet to near-infrared. This is because changes in the absorption and reflection spectra of metals and other materials often occur in the ultraviolet region to the near-infrared region. Further, it is preferable that one of the third wavelength (λ3) and the fourth wavelength (λ4) is a wavelength equal to or shorter than visible light, and the other is a wavelength equal to or longer than near-infrared. This is because it becomes difficult to identify the material if the third wavelength (λ3) and the fourth wavelength (λ4) are close wavelengths.

[0237] In addition, in the above-described Embodiments 1 to 6, two processing laser oscillators, i.e., the first laser oscillator 11 and the second laser oscillator 12, were used as the processing laser oscillator. However, the present invention is not limited to this. For example, three or more processing laser oscillators may be used. That is, wavelength selection and output control may be performed for three or more laser beams.

[0238] In addition, in the above-described Embodiments 1 to 6, it is not necessary to create in advance a prior recipe as described with reference to FIGS. 1 and 2 before performing laser processing. However, in the above-described Embodiments 1 to 6, such a prior recipe may be used in combination.

[0239] In addition, in the above-described Embodiments 1 to 6, the case of laser processing between metals has been described, but the present invention is not limited thereto. For example, the present disclosure can also be applied to the case of laser processing between a metal and a resin, and can also be applied to the case of laser processing between resins. In addition, not limited to metals and resins, the present disclosure can also be applied to the case of laser processing between various materials. In particular, the present disclosure is suitable for the case of laser processing between different materials having different light absorption rates.

[0240] In addition, forms obtained by applying various modifications conceivable by those skilled in the art to the embodiments, and forms realized by arbitrarily combining the components and functions in each embodiment without departing from the gist of the present disclosure are also included in the present disclosure.

Industrial Applicability

[0241] The technology of the present disclosure is useful in a laser processing apparatus or the like that processes a processing object by irradiating a laser beam.

Explanation of Signs

[0242] 1, 1A, 1B, 1C, 1D, 1E, 1F Laser processing apparatus 2, 2A, 2B Processing object 2X Composite material 2a First part 2b Second part 3 Processing table 11 First laser oscillator 12 Second laser oscillator 20 Drive control unit 21 Drive circuit 22 Drive power supply 30, 30C, 30D, 30E Analysis unit 31, 31C, 31D, 31E Data processing unit 32, 32C Light source 33a First detector 33b Second detector 33C Detector 34 Beam splitter 34C Mirror 35 Lens 36-way optical splitter 37 Database 38 Image sensor 39 Image processing unit 41 First optical fiber 42 Second optical fiber 50, 50F Optical system 51 Half mirror 52 Lens 52a Lens group 52b Lens group 60 Light source

Claims

1. A laser processing apparatus for processing an object with laser light, a first laser oscillator that emits first laser light having a peak wavelength of a first wavelength; a second laser oscillator that emits second laser light having a peak wavelength different from the first wavelength; a drive control unit that drives each of the first laser oscillator and the second laser oscillator; an analysis unit that acquires signal light from the object and adjusts processing conditions of the object based on the acquired signal light, the drive control unit drives the first laser oscillator and the second laser oscillator according to the processing conditions to change the intensity of at least one of the first laser light and the second laser light, and irradiates the object with at least one of the first laser light and the second laser light, the analysis unit has a data processing unit that analyzes the signal light, the analysis unit adjusts the processing conditions at the coordinates at the processing position of the object when the signal light is acquired, the drive control unit drives the first laser oscillator and the second laser oscillator according to the processing conditions to irradiate the object with at least one of the first laser light and the second laser light based on the coordinates of the processing position, Laser processing apparatus.

2. The drive control unit drives the first laser oscillator and the second laser oscillator so that one of the first laser light and the second laser light is emitted and the other of the first laser light and the second laser light is not emitted according to the processing conditions. The laser processing apparatus according to claim 1.

3. The data processing unit adjusts the processing conditions at the coordinates at the processing position of the object based on the signal light. The laser processing apparatus according to claim 1.

4. The analysis unit includes a light source that emits analysis light and an optical system that irradiates the analysis light onto the processing position of the object. The signal light is reflected light in which at least a part of the analysis light is reflected by the surface of the object. The laser processing apparatus according to claim 1 or 2.

5. The analysis light includes first analysis light that is light of the first wavelength and second analysis light that is light of the second wavelength. The signal light includes first signal light that is reflected light in which the first analysis light is irradiated onto the object and reflected by the object, and second signal light that is reflected light in which the second analysis light is irradiated onto the object and reflected by the object. The data processing unit adjusts the processing conditions by comparing the intensity of the first signal light and the intensity of the second signal light, or by comparing the reflectance at the first wavelength and the reflectance at the second wavelength, at the coordinates of the processing position of the object. The laser processing apparatus according to claim 4.

6. The analysis light includes at least one of the wavelengths of the first laser light and the second laser light. The laser processing apparatus according to claim 4 or 5.

7. The analysis light is light that guides at least a part of at least one of the first laser light and the second laser light. The laser processing apparatus according to claim 6.

8. The data processing unit analyzes the reflection intensity or reflectance of the analysis light from the intensity of the signal light, and adjusts the processing conditions at the coordinates of the processing position of the object by associating the coordinates at the processing position of the object with the reflection intensity or the reflectance. The laser processing apparatus according to any one of claims 4 to 7.

9. The analysis unit has a first detector and a second detector. The first detector receives the signal light reflected by the object from the analysis light. The second detector receives at least a part of the analysis light. The data processing unit corrects the intensity of the signal light received by the first detector with the intensity of the analysis light received by the second detector. The laser processing apparatus according to any one of claims 4 to 8.

10. The analysis unit has a spectroscope that spectroscopically analyzes light. The spectroscopically analyzed light is irradiated as analysis light to the processing position of the object. The analysis unit has a detector that measures a reflection spectrum showing the wavelength dependence of the intensity or reflectance of the signal light by measuring the signal light reflected from the surface of the object by the analysis light. The data processing unit adjusts the processing conditions at the coordinates at the processing position of the object based on the reflection spectrum. The laser processing apparatus according to claim 1 or 2.

11. The analysis unit has a spectroscope that spectroscopically analyzes the signal light, and a detector that measures a reflection spectrum showing the wavelength dependence of the intensity or reflectance of the signal light by measuring the signal light spectroscopically analyzed by the spectroscope. The data processing unit is based on the reflection spectrum at the coordinates at the processing position of the object And adjusts the processing conditions. The laser processing apparatus according to claim 1 or 2.

12. The data processing unit is connected to a database. In the database, a data group of a plurality of types of reflection spectra for each material is stored. The data processing unit collates the reflection spectrum obtained from the signal light with the data group of the reflection spectra stored in the database, determines which material stored in the database the material at the coordinates of the processing position of the object is closest to, and adjusts the processing conditions at the coordinates of the processing position of the object according to the determined material. The laser processing apparatus according to claim 10 or 11.

13. The light source of the analysis light is a laser oscillator or an LED. The laser processing apparatus according to any one of claims 4 to 10 and 12.

14. The analysis light is made monochromatic by a spectroscope or a filter that transmits a specific wavelength band. The laser processing apparatus according to any one of claims 4 to 10, 12, and 13.

15. A laser processing apparatus for processing an object with laser light, A first laser oscillator that emits first laser light having a peak wavelength of a first wavelength, A second laser oscillator that emits second laser light having a peak wavelength of a second wavelength different from the first wavelength, A drive control unit that drives each of the first laser oscillator and the second laser oscillator, An analysis unit that acquires signal light from the object and adjusts processing conditions of the object based on the acquired signal light, The drive control unit drives the first laser oscillator and the second laser oscillator according to the processing conditions to change the intensity of at least one of the first laser light and the second laser light and irradiate the object with at least one of the first laser light and the second laser light. The analysis unit includes a solid-state imaging device in which a plurality of pixels for receiving light are two-dimensionally arranged. The solid-state imaging device outputs a two-dimensional image of the object to a data processing unit by receiving the signal light. The data processing unit adjusts the processing conditions of the object according to the brightness corresponding to the processing position of the object in the two-dimensional image. The solid-state imaging device has at least a first filter that transmits a third wavelength, a first pixel on which the first filter is mounted, a second filter that transmits a fourth wavelength, and a second pixel on which the second filter is mounted. The data processing unit adjusts the processing conditions of the object by comparing the pixel signal intensity of the first wavelength of the signal light and the pixel signal intensity of the second wavelength of the signal light at the processing position of the object in the two-dimensional image received by the solid-state imaging device. Laser processing device.

16. The first filter is a filter that transmits near-infrared light. The second filter is a filter that transmits at least a part of the wavelengths in the visible light region. The laser processing device according to claim 15.

17. The data processing unit includes the pixel signal intensity of the third wavelength of the signal light at the processing position, and the pixel signal intensity of the fourth wavelength of the signal light, and respectively collates them with a data group of reflection spectra stored in a database to determine which material stored in the database the material at the coordinates at the processing position of the object is closest to, and adjusts the processing conditions at the coordinates at the processing position of the object according to the determined material. The laser processing device according to claim 15 or 16.

18. A laser processing device that processes an object with laser light, a first laser oscillator that emits first laser light having a peak wavelength of a first wavelength, a second laser oscillator that emits second laser light having a peak wavelength of a second wavelength different from the first wavelength, a drive control unit that drives each of the first laser oscillator and the second laser oscillator, An analysis unit that acquires signal light from the object and adjusts the processing conditions of the object based on the acquired signal light, The drive control unit drives the first laser oscillator and the second laser oscillator according to the processing conditions, thereby changing the intensity of at least one of the first laser light and the second laser light, and irradiating the object with at least one of the first laser light and the second laser light. The signal light is light emitted during processing when at least one of the first laser light and the second laser light irradiates the object. Laser processing apparatus.

19. The analysis unit includes a spectroscope that spectroscopically analyzes the light emission, and a data processing unit that outputs the emission spectrum of the light emission. The data processing unit adjusts the processing conditions with respect to the coordinates of the processing position of the object from the emission spectrum. The laser processing apparatus according to claim 18.

20. The analysis unit has a solid-state imaging device in which a plurality of pixels for receiving light are two-dimensionally arranged. The solid-state imaging device outputs a two-dimensional image of the object to the data processing unit by receiving the signal light. The data processing unit adjusts the processing conditions of the object according to the brightness corresponding to the processing position of the object in the two-dimensional image. The laser processing apparatus according to claim 18.

21. The solid-state imaging device has at least a first filter that transmits a third wavelength, a first pixel on which the first filter is mounted, a second filter that transmits a fourth wavelength, and a second pixel on which the second filter is mounted. The data processing unit adjusts the processing conditions of the object by comparing the pixel signal intensity of the first wavelength of the signal light and the pixel signal intensity of the second wavelength of the signal light at the processing position of the object in the two-dimensional image received by the solid-state imaging device. The laser processing apparatus according to claim 20. Claim 22 The first filter is a filter that transmits near-infrared light, The second filter is a filter that transmits at least a part of the wavelengths in the visible light region The laser processing apparatus according to claim 21. Claim 23 The data processing unit collates the pixel signal intensity of the third wavelength of the signal light at the processing position with the pixel signal intensity of the fourth wavelength of the signal light, respectively, with a data group of reflection spectra stored in a database, and determines which of the materials stored in the database is closest to the material at the coordinates at the processing position of the object, and adjusts the processing conditions at the coordinates at the processing position of the object according to the determined material The laser processing apparatus according to claim 21 or 22. Claim 24 The analysis unit includes a data processing unit that analyzes the signal light The laser processing apparatus according to any one of claims 15 to 23.

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