Resin Sealing Method and Resin Sealing Apparatus

Abstract

A resin-sealing method for producing a plurality of packages by compression-molding a resin on a workpiece (10) in which a plurality of components (12) are mounted on a carrier (11) such that at least one of the components (12) is sealed by the resin in each of the packages, the method comprising: a step (S15) for setting a sheet resin (SP1) in a resin molding die (190); and a step (S16) for compression-molding the sheet resin (SP1) set in the resin molding die (190), wherein a penetrating hole (ST1) is formed at a center portion of the sheet resin (SP1) so that the amount of the resin is less at the center portion than at a peripheral portion of the sheet resin (SP1) in a plan view.

Description

Technical Field

[0001] The present invention relates to a resin encapsulation method and a resin encapsulation apparatus.

Background Art

[0002] As a method for manufacturing a package in which components such as semiconductor elements are resin-encapsulated, there is known a method of molding resin on a workpiece in which a plurality of components are mounted on a carrier and forming a plurality of packages at once. One such resin encapsulation method is the compression molding method.

[0003] Patent Document 1 discloses a resin supply method to a compression molding resin mold, including a step of pressing the central portion of a sheet resin so as to be convex and bending the sheet resin, and pressing the sheet resin against an object to be supplied from the central portion of the sheet resin while keeping the sheet resin bent, and a step of pressing the sheet resin toward the outer peripheral portion of the sheet resin against the object to be supplied.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in the resin supply method described in Patent Document 1, when the sheet resin is heated and compressed, the end portion of the sheet resin flows to the outer edge of the cavity, while the central portion of the sheet resin cannot flow. Therefore, the thickness of the resin formed at the end portion of the workpiece becomes smaller than the thickness of the resin formed at the central portion of the workpiece, and the dimensions of the packages manufactured from one workpiece may vary.

[0006] The present invention has been made in view of such circumstances, and an object of the present invention is to provide a resin sealing method and a resin sealing apparatus capable of suppressing dimensional variations of packages.

Means for Solving the Problems

[0007] A resin sealing method according to an aspect of the present invention is a resin sealing method for producing a plurality of packages in which a plurality of components are mounted on a carrier and at least one component is resin-sealed in each, including a step of setting a sheet resin in a resin molding die, and a step of compression-molding the sheet resin set in the resin molding die, and at least one through-hole or recess is formed in the central portion of the sheet resin so that the amount of resin in the central portion is less than that in the peripheral portion of the sheet resin in a plan view.

[0008] According to this aspect, since at least one through-hole or recess is formed in the central portion of the sheet resin, the heat-compressed sheet resin flows inward so as to fill at least one through-hole or recess. Therefore, variations in the thickness of the molded resin formed on the workpiece are suppressed. Thus, dimensional variations of a plurality of packages formed from the workpiece can be suppressed.

[0009] In the above aspect, a step of feeding out a long resin film, a step of cutting out a sheet resin from the resin film, and a step of forming at least one through-hole or recess in the resin film or the sheet resin may be further included.

[0010] In the above aspect, at least one through-hole may be formed by punching.

[0011] In the above aspect, at least one through-hole may be formed by sucking a region where a cut is made.

[0012] In the above aspect, the cavity of the resin molding die may be circular, and the sheet resin may be rectangular with a diagonal length equal to or less than the diameter of the cavity.

[0013] In the above aspect, the sheet resin is rectangular, The reduction amount due to at least one through hole or recess of the resin in the portion along the diagonal of the sheet resin may be larger than the reduction amount due to at least one through hole or recess of the resin in the portion along the bisector of each side of the sheet resin.

[0014] In the above aspect, at least one through hole or recess is one through hole or recess, and in a plan view, the one through hole or recess and the sheet resin may be similar in shape.

[0015] In the above aspect, in the step of setting the sheet resin in the resin molding die, the sheet resin may be laminated on the work to be resin-sealed.

[0016] In the above aspect, in the step of setting the sheet resin in the resin molding die, the sheet resin may be laminated on the release film.

[0017] A resin sealing method according to another aspect of the present invention is a resin sealing method for compression molding a resin on a work in which a plurality of components are mounted on a carrier to manufacture a plurality of packages in which at least one component is resin-sealed respectively, including a step of setting a sheet resin in a resin molding die and a step of compression molding the sheet resin set in the resin molding die, wherein a plurality of through holes or recesses are formed on the entire surface in a plan view of the sheet resin, and the edges of the plurality of through holes or recesses of the sheet resin set in the resin molding die overlap with any of the plurality of components.

[0018] According to this aspect, the flow amount on the entire surface of the heat-compressed sheet resin can be made uniform. Therefore, the variation in the thickness of the molded resin formed on the work is suppressed, and the dimensional variation of the plurality of packages formed from the work can be suppressed.

[0019] A resin encapsulation device according to another aspect of the present invention is a resin encapsulation device that compression-molds resin onto a workpiece having a plurality of components mounted on a carrier to manufacture a plurality of packages in which at least one component is resin-encapsulated in each. The resin encapsulation device includes a sheet cutting portion that cuts out a sheet resin from a long resin film, a weight-reducing portion that forms at least one through-hole or recess in the resin film or the sheet resin, and a resin molding die that compression-molds the set sheet resin. At least one through-hole or recess is formed in the central portion of the sheet resin such that the resin amount in the central portion is less than that in the peripheral portion of the sheet resin in a plan view.

[0020] According to this aspect, since at least one through-hole or recess is formed in the central portion of the sheet resin, the heated and compressed sheet resin flows inward so as to fill at least one through-hole or recess. Therefore, variations in the thickness of the molding resin formed on the workpiece are suppressed. Thus, variations in the dimensions of the plurality of packages formed from the workpiece can be suppressed.

Advantages of the Invention

[0021] According to the present invention, it is possible to provide a resin encapsulation method and a resin encapsulation device capable of suppressing variations in the dimensions of packages.

Brief Description of the Drawings

[0022]

Figure 1

Figure 2

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Figure 4

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Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Embodiments for Carrying Out the Invention

[0023] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of this embodiment are illustrative, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be construed as being limited to this embodiment.

[0024] <Resin Encapsulation Device> With reference to FIGS. 1 and 2, the configuration of a resin encapsulation device 1 according to an embodiment of the present invention will be described. FIG. 1 is a view schematically showing the configuration of a resin encapsulation device according to an embodiment. FIG. 2 is a plan view schematically showing a configuration example of a sheet resin set in a resin molding die.

[0025] The resin sealing device 1 is a device that compression-molds resin onto a workpiece 10 with a plurality of components 12 mounted on a carrier 11, and manufactures a plurality of packages in which at least one component 12 is resin-sealed (mold-molded). The resin sealing device 1 includes a resin supply device 100 that supplies a sheet resin SP1, and a resin molding die 190 that heat-compresses the sheet resin SP1. Here, the sheet resin SP1 is formed to an arbitrary thickness by rolling a thermosetting resin such as an epoxy resin into a sheet shape.

[0026] As an example, the carrier 11 is a stainless-steel carrier, and the component 12 is a semiconductor element (IC chip, diode, transistor, etc.) mounted on the carrier 11. However, the carrier 11 and the component 12 are not limited to the above. For example, the carrier 11 may be formed using materials such as resin, glass, metal, semiconductor, etc., and may be an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, etc. For example, the component 12 may be a MEMS device or an electronic device (capacitor, inductor, resistor, etc.). The component 12 may be mounted on the carrier 11 by a wire bonding method or a flip chip method, or may be detachably fixed. The component 12 includes, for example, two types of components 12a and 12b, but may also be a single component or may include three or more types of components.

[0027] The workpiece 10 is provided with a plurality of package areas PA partitioned by a plurality of dividing lines LN1 arranged in the X-axis direction and a plurality of dividing lines LN2 arranged in the Y-axis direction. The plurality of dividing lines LN1 and LN2 are virtual lines for dividing the workpiece 10 in which the resin is compression-molded into a plurality of packages, and the package area PA is an area that becomes a package. For example, a plurality of components 12a and 12b are arranged in the package area PA.

[0028] The resin supply device 100 includes a pay-off roll FR, a pinch roll PR, a take-up roll WR, a sheet cutter CT, and a mechanical punch PN.

[0029] The pay-out roll FR is a driving roll that pays out the resin film LP from a resin roll around which the long resin film LP is wound. The resin film LP fed out by the pay-out roll FR has, for example, protective films PF attached to both sides. The pay-out roll FR corresponds to an example of a film supply section that supplies the resin film LP.

[0030] The pinch roll PR is a driving roll that transfers the fed-out resin film LP to the sheet cutter CT. The resin film LP is pinched by the pinch roll PR and transferred by the rotation of the pinch roll PR. The resin film LP is fed out, for example, by the interlocked driving of the pay-out roll FR and the pinch roll PR. The pinch roll PR corresponds to an example of a film transfer section that transfers the resin film LP.

[0031] The take-up roll WR is a driving roll that peels off and takes up the protective film PF from the resin film LP. The take-up roll WR corresponds to an example of a film peeling section that peels off the protective film PF.

[0032] The sheet cutter CT is a cutting machine that cuts out the sheet resin SP1 from the resin film LP with the protective film PF removed. The sheet cutter CT corresponds to an example of a sheet cutting section that cuts out the sheet resin SP1 from the resin film LP. The sheet cutter CT may cut out the sheet resin SP1 in one cut, or may cut out the sheet resin SP1 in multiple cuts. When cutting out the sheet resin SP1 by multiple cuts, the sheet cutter CT may include, for example, a first sheet cutter that cuts the resin film LP and a second sheet cutter that cuts out the sheet resin SP1 from the cut resin film LP. Also, with the sheet cutter CT, the outer shape of the sheet resin SP1 may be cut out in a circular shape or a polygonal shape (such as an octagonal shape or a hexagonal shape).

[0033] The mechanical punch PN is a punching machine that forms a through hole ST1 in the sheet resin SP1 cut out by the sheet cutter CT by punching. The mechanical punch PN forms the through hole ST1 in the central portion of the sheet resin SP1 so that the resin amount in the central portion is less than that in the peripheral portion of the sheet resin SP1 in plan view. As a result, a portion with a small resin amount in the thickness direction is formed in the central portion of the sheet resin SP1. As shown in FIG. 2, the through hole ST1 formed by the mechanical punch PN when the sheet resin SP1 is viewed in plan view is, for example, one. However, the number of through holes formed by the mechanical punch PN in the central portion of the sheet resin SP1 is not limited, and two or more through holes may be formed. The two or more through holes may be formed by a single punching process or by a plurality of punching processes. The mechanical punch PN corresponds to an example of a weight-reducing portion that forms at least one through hole in the sheet resin SP1.

[0034] The mechanical punch PN may form at least one through hole in the resin film LP before the sheet resin SP1 is cut out by the sheet cutter CT. In this case, the sheet cutter CT cuts out the sheet resin SP1 from the resin film LP so that at least one through hole formed by the mechanical punch PN is located in the central portion of the sheet resin SP1. That is, the sheet resin SP1 is cut out from the resin film LP so that the resin amount in the central portion is less than that in the peripheral portion of the sheet resin SP1 in plan view by at least one through hole.

[0035] The mechanical punch PN may form at least one through hole simultaneously with the cutting out of the sheet resin SP1 by the sheet cutter CT.

[0036] In addition, in this embodiment, the mechanical punch PN that forms the through hole is described as an example of the forming unit. However, as long as the resin amount in the central portion is less than that in the peripheral portion of the sheet resin SP1 in a plan view, the forming unit is not limited to the device that forms the through hole. For example, the forming unit may be a device that forms at least one recess in the sheet resin SP1 or the resin film LP.

[0037] The resin molding die 190 is a pair of dies (lower die 191 and upper die 192) for resin-sealing the work 10 using a compression molding technique. Among the lower die 191 and the upper die 192, the release film RF is set on the die having the cavity 199, and the work 10 is set on the other die. Further, the sheet resin SP1 is laminated on the side set on the lower die 191 among the release film RF and the work 10, and is set in the resin molding die 190. In this embodiment, the resin molding die 190 has an upper die cavity structure having the cavity 199 in the upper die 192. Therefore, the work 10 and the sheet resin SP1 laminated on the work 10 are set on the lower die 191. When the resin molding die 190 has a lower die cavity structure having the cavity 199 in the lower die 191, the work 10 is set on the upper die 192, and the release film RF and the sheet resin SP1 laminated on the release film RF are set on the lower die 191.

[0038] The resin molding die 190 shown in FIG. 1 includes a seal ring 193 (for example, an O-ring) that seals the inside of the resin molding die 190 (the space between the lower die 191 and the upper die 192). Although not shown, the resin sealing device 1 includes a pressure adjusting unit (for example, a vacuum pump) that adjusts the internal pressure of the resin molding die 190 and a temperature adjusting unit (for example, a heater) that adjusts the internal temperature (molding temperature).

[0039] The upper mold 192 includes a chase 19A, a cavity piece 19B fixed to the lower mold 191 side of the chase 19A, a clamper 19C surrounding the cavity piece 19B, and a chamber block 19D surrounding the clamper 19C with a space therebetween. The cavity piece 19B is fixed to the lower mold 191 side of the chase 19A. The clamper 19C protrudes toward the lower mold 191 from the cavity piece 19B and forms a cavity 199 together with the cavity piece 19B. The clamper 19C is connected to the chase 19A via a spring and is configured to be slidable with respect to the cavity piece 19B. When the mold is clamped, the outer edge portion (carrier 11) of the workpiece 10 is sandwiched between the clamper 19C and the lower mold 191. A plurality of air vents connecting the space on the chamber block 19D side and the cavity 199 are provided on the opposing surface (the surface opposing the lower mold 191) of the clamper 19C. The plurality of air vents are grooves provided radially around the cavity 199. The plurality of air vents function as exhaust holes for discharging air remaining in the cavity 199 of the resin molding die 190 after clamping and gas generated from the sheet resin SP1. The air vents are formed to a depth (for example, about several μm) such that air and gas are discharged but the resin does not flow out. A seal ring 193 contacts the chamber block 19D.

[0040] The sheet resin SP1 heated and compressed by the resin molding die 190 fills the cavity 199 and flows so as to have a uniform thickness. However, if a large amount of another resin exists in the resin flow direction, the resin flow may be inhibited.

[0041] However, as shown in FIG. 2, when the sheet resin SP1 set in the resin molding die 190 is viewed in plan, there is a gap between the edge of the sheet resin SP1 before heat compression and the edge of the cavity 199 (clamp 19C). As a result, the surplus of the peripheral portion of the heat-compressed sheet resin SP1 flows outward to fill the gap. Since the through-hole ST1 is formed in the central portion of the sheet resin SP1, the surplus of the central portion of the heat-compressed sheet resin SP1 flows inward to fill the through-hole ST1. Thus, in the case of the sheet resin SP1 in which the through-hole ST1 is formed, during heat compression, the resin flows evenly at both the peripheral portion and the central portion without causing resin flow only at the peripheral portion, so that a difference in thickness between the central portion and the peripheral portion of the molded resin formed on the workpiece 10 is suppressed.

[0042] In the example shown in FIG. 2, when viewed in plan, the shapes of the workpiece 10 and the cavity 199 are circular, and the sheet resin SP1 is circular. The gap between the sheet resin SP1 and the clamp 19C in the normal direction of the outer edge portion of the sheet resin SP1 is substantially equal in any direction within the XY plane. According to this, the amount of flow of the sheet resin SP1 outward in the direction within the XY plane (hereinafter referred to as the "radial direction") starting from the center of the sheet resin SP1 is substantially equal at any angle within the XY plane. Further, the through-hole ST1 and the sheet resin SP1 are similar, and the through-hole ST1 is formed in a circular shape. The through-hole ST1 and the sheet resin SP1 are concentric. According to this, the amount of flow of the sheet resin SP1 inward in the radial direction is substantially equal at any angle within the XY plane. From the above, the variation in the thickness of the molded resin depending on the angle in the radial direction is suppressed.

[0043] The size relationship and positional relationship between the through-hole ST1 and the component 12 are not particularly limited. For example, when viewed in plan, a part of the edge of the through-hole ST1 overlaps the component 12. The through-hole ST1 is provided across a plurality of package areas PA, and two or more components 12 are arranged inside the through-hole ST1.

[0044] Next, with reference to FIG. 3, an example of a resin sealing method using the resin sealing apparatus 1 will be described. FIG. 3 is a flowchart schematically showing a resin sealing method according to an embodiment.

[0045] First, a resin film is fed out (S11). A resin roll around which a long resin film LP is wound is set on a feed roll FR. Next, while driving the feed roll FR to feed out the resin film LP, the pinch roll PR is driven to transfer the resin film LP. At this time, the protective film PF is peeled off from the resin film LP.

[0046] Next, a sheet resin SP1 is cut out (S12). The sheet resin SP1 is cut out from the resin film LP by a sheet cutter CT. In the case of the sheet resin SP1 having a circular shape, for example, first, the sheet cutter CT cuts the resin film LP into a rectangular shape by a first sheet cutter extending in the width direction of the resin film LP. Next, the sheet cutter CT cuts out the sheet resin SP1 from the resin film LP cut into a rectangular shape by a second sheet cutter extending in a circular shape. Note that the sheet cutter CT may directly cut out the sheet resin SP1 from the resin film LP in one cutting.

[0047] Next, a punching process is performed on the sheet resin SP1 (S13). A through hole ST1 is formed in the sheet resin SP1 by a mechanical punch PN. The through hole ST1 is formed in the central portion of the sheet resin SP1 such that the resin amount in the central portion is less than that in the peripheral portion of the sheet resin SP1. Note that the order of steps S12 and S13 may be reversed. That is, the through hole ST1 may be formed in the resin film LP by the mechanical punch PN, and the sheet resin SP1 may be cut out such that the through hole ST1 is located in the central portion.

[0048] Next, the sheet resin SP1 is laminated on the work 10 (S14). When viewed in plan, the sheet resin SP1 is disposed inside the work 10. The sheet resin SP1 covers most of the plurality of components 12. A part of the edge of the through hole ST1 overlaps, for example, the component 12, and two or more components 12 are disposed inside the through hole ST1. Here, the sheet resin SP1 is disposed so as to be centered with the work 10.

[0049] Next, the work 10 with the sheet resin SP1 placed thereon is set in the resin molding die 190 (S15). The sheet resin SP1 is set in the lower die 191 of the resin molding die 190 together with the work 10.

[0050] Finally, the sheet resin SP1 is heat-compressed (S16). The sheet resin SP1 accommodated in the cavity 199 in the mold-closed resin molding die 190 softens by heating. The softened sheet resin SP1 is filled into the gaps between the components 12, the gaps between the carrier 11 and the components 12, etc. by compression. At this time, the sheet resin SP1 flows so as to fill the gap between the sheet resin SP1 and the clamper 19C and the through hole ST1. When the resin compression-molded from the sheet resin SP1 is cured, the resin molding die 190 is opened, and the work 10 with the components 12 resin-sealed is taken out. The taken-out work 10 is divided along a plurality of dividing lines LN1, LN2 and separated into a plurality of packages.

[0051] As described above, by performing compression molding using the sheet resin SP1 having the through hole ST1 formed in the central portion, it is possible to equalize the flow amount of the peripheral portion and the flow amount of the central portion of the sheet resin SP1 when heat-compressed. Thereby, the difference in the thickness of the resin molded with respect to the central portion of the work 10 and the thickness of the resin molded with respect to the peripheral portion can be reduced. That is, it is possible to suppress the dimensional variation of the plurality of packages manufactured from one work 10.

[0052] A modified example of the sheet resin will be described below. Regarding matters common to the above-described embodiment, the same applies to each of the following modified examples, and the description thereof will be omitted, and only the differences will be described. In particular, the same reference numerals are given to the same configurations, and the same configurations and the same effects thereof will not be sequentially mentioned.

[0053] FIG. 4 is a plan view schematically showing a modified example of the sheet resin set in the resin molding die. When viewed in plan, the sheet resin SP2 is formed in a rectangular shape with respect to the circular workpiece 10 and the cavity 199. The sheet resin SP2 is formed, for example, in a square shape having a pair of sides extending in the X-axis direction and facing in the Y-axis direction, and a pair of sides extending in the Y-axis direction and facing in the X-axis direction. The length of the diagonal of the sheet resin SP2 is substantially equal to the diameter of the cavity 199 or slightly smaller than the diameter of the cavity 199. The sheet resin SP2 approaches the edge (clamp 19C) of the cavity 199 most closely at the corners and is farthest from the edge of the cavity 199 near the midpoint of each side. The sheet resin SP2 is cut out, for example, by a sheet cutter extending in the width direction of a long resin film. At this time, the width of the sheet resin SP2 is substantially equal to the width of the resin film.

[0054] When viewed in plan view, four circular through-holes ST2a, ST2b, ST2c, and ST2d are formed in the central portion of the sheet resin SP2. The sizes of the through-holes ST2a, ST2b, ST2c, and ST2d are substantially equal. The through-holes ST2a, ST2b, ST2c, and ST2d are arranged in two rows and two columns along each side of the sheet resin SP2. Specifically, the through-hole ST2a and the through-hole ST2b are arranged in the X-axis direction, and the through-hole ST2c and the through-hole ST2d are arranged in the X-axis direction. The through-hole ST2a and the through-hole ST2c are arranged in the Y-axis direction, and the through-hole ST2b and the through-hole ST2d are arranged in the Y-axis direction. The through-hole ST2a and the through-hole ST2d are arranged on one diagonal line of the sheet resin SP2, and the through-hole ST2b and the through-hole ST2c are arranged on the other diagonal line of the sheet resin SP2. That is, the resin amount in the portion along the diagonal line of the sheet resin SP2 is reduced, and the resin amount in the portion along the bisector of each side is not reduced. According to this, on the diagonal line of the sheet resin SP2 where the distance between the edge of the sheet resin SP2 and the edge of the cavity 199 is narrow, a large amount of resin can flow inward during thermocompression, and on the bisector of each side of the sheet resin SP2 where the distance between the edge of the sheet resin SP2 and the edge of the cavity 199 is wide, a large amount of resin can flow outward during thermocompression. Therefore, it becomes possible to use the rectangular sheet resin SP2 for the circular cavity 199, and the loss of the resin film generated when cutting out the circular sheet resin SP2 from the strip-shaped resin film can be reduced. The through-holes ST2a, ST2b, ST2c, and ST2d may be arranged, for example, at an angle of 45 degrees or at an arbitrary angle with respect to the center of the sheet resin SP2 from the arrangement shown in FIG. 4.

[0055] FIG. 5 is a plan view schematically showing a modified example of the sheet resin set in the resin molding die. When viewed in plan, the workpiece 20 and the cavity 299 are rectangular, and the sheet resin SP3 is also formed in a rectangular shape in the same manner. The cavity 299 has a pair of sides extending in the X-axis direction and facing each other in the Y-axis direction, and a pair of sides extending in the Y-axis direction and facing each other in the X-axis direction. The same applies to the sheet resin SP3. The distance between the edge of the sheet resin SP3 and the edge of the cavity 299 on the +X-axis direction side of the workpiece 20 is substantially equal to the distance between the edge of the sheet resin SP3 and the edge of the cavity 299 on the -X-axis direction side of the workpiece 20. The distance between the edge of the sheet resin SP3 and the edge of the cavity 299 on the +Y-axis direction side of the workpiece 20 is substantially equal to the distance between the edge of the sheet resin SP3 and the edge of the cavity 299 on the -Y-axis direction side of the workpiece 20. In the central portion of the sheet resin SP3, one circular through hole ST3 is formed.

[0056] FIG. 6 is a plan view schematically showing a modified example of the sheet resin set in the resin molding die. When viewed in plan, the sheet resin SP4 is formed in a rectangular shape in the same manner as the sheet resin SP3 shown in FIG. 5. In the central portion of the sheet resin SP4, four circular through holes ST4a, ST4b, ST4c, and ST4d are formed. The sizes of the through holes ST4a to ST4d are substantially equal. The through hole ST4a and the through hole ST4b are arranged on the bisector of the side extending in the Y-axis direction of the sheet resin SP4. The through hole ST4c and the through hole ST4d are arranged on the bisector of the side extending in the X-axis direction of the sheet resin SP4.

[0057] FIG. 7 is a plan view schematically showing a modified example of the sheet resin set in the resin molding die. When viewed in plan, the sheet resin SP5 is formed in a rectangular shape in the same manner as the sheet resin SP3 shown in FIG. 5. Four through holes ST51a, ST51b, ST51c, ST51d and four through holes ST52a, ST52b, ST52c, ST52d are formed in the central portion of the sheet resin SP5. The sizes of the four through holes ST51a to ST51d are substantially equal. The sizes of the four through holes ST52a to ST52d are substantially equal and smaller than the sizes of the four through holes ST51a to ST51d. The through hole ST51a and the through hole ST51b are arranged in the X-axis direction, and the through hole ST51c and the through hole ST51d are arranged in the X-axis direction. The through hole ST51a and the through hole ST51c are arranged in the Y-axis direction, and the through hole ST51b and the through hole ST51d are arranged in the Y-axis direction. The through hole ST51a and the through hole ST51d are arranged on one diagonal line of the sheet resin SP5, and the through hole ST51b and the through hole ST51c are arranged on the other diagonal line of the sheet resin SP5. The through hole ST52a and the through hole ST52b are arranged on the bisector of the side extending in the Y-axis direction of the sheet resin SP5. The through hole ST52c and the through hole ST52d are arranged on the bisector of the side extending in the X-axis direction of the sheet resin SP5. Therefore, the amount of resin reduction in the portion along the diagonal line of the sheet resin SP5 is larger than the amount of resin reduction in the portion along the bisector of each side. In the sheet resin SP5 before the through holes ST51a to ST51d and ST52a to ST52d are formed, the amount of resin in the portion along the diagonal line is larger than the amount of resin in the portion along the bisector. By forming the through holes ST51a to ST51d and ST52a to ST52d having different sizes, the flow amount of the sheet resin SP5 during heat compression can be made uniform.

[0058] FIG. 8 is a plan view schematically showing a modified example of the sheet resin set in the resin molding die. When viewed in plan, the sheet resin SP6 is formed in a rectangular shape in the same manner as the sheet resin SP3 shown in FIG. 5. In the central portion of the sheet resin SP6, one rectangular through-hole ST6 is formed. That is, the through-hole ST6 and the sheet resin SP6 are similar in shape. The sheet resin SP6 has a pair of sides extending in the X-axis direction and facing each other in the Y-axis direction, and a pair of sides extending in the Y-axis direction and facing each other in the X-axis direction. The through-hole ST6 also has similar sides. Note that the extending direction of each side of the through-hole ST6 may be inclined from the X-axis direction and the Y-axis direction. For example, the through-hole ST6 may be arranged at an angle of 45 degrees with respect to the center of the sheet resin SP6 from the arrangement shown in FIG. 8, or may be arranged at an arbitrary angle.

[0059] FIG. 9 is a plan view schematically showing a modified example of the sheet resin set in the resin molding die. When viewed in plan, the sheet resin SP7 is formed in a rectangular shape in the same manner as the sheet resin SP3 shown in FIG. 5. In the central portion of the sheet resin SP7, one diagonal cross-shaped through-hole ST7 is formed. That is, the through-hole ST7 is a shape in which a rectangle having a long side along the diagonal of the sheet resin SP7 intersects. Therefore, the amount of resin reduction in the portion along the diagonal of the sheet resin SP7 is larger than the amount of resin reduction in the portion along the bisector of each side, and the flow amount of the sheet resin SP7 during heat compression can be made uniform.

[0060] FIG. 10 is a plan view schematically showing a modified example of a sheet resin set in a resin molding die. When viewed in plan, the sheet resin SP8 is formed in a rectangular shape in the same manner as the sheet resin SP3 shown in FIG. 5. A plurality of through holes ST8 are formed in the sheet resin SP8. The resin amounts in the central portion and the peripheral portion of the sheet resin SP8 are reduced by the plurality of through holes ST8. The edges of the plurality of through holes ST8 overlap with any one of the plurality of components 12. The plurality of through holes ST8 are arranged at equal intervals. Since it is not necessary to adjust the position of the central portion of the sheet resin SP8 or the position with respect to the plurality of components 12, the formation of the plurality of through holes ST8 is easier than the formation of the through holes ST1 shown in FIG. 2. For example, a plurality of through holes ST8 may be formed in the resin film before being wound around the resin roll. In this case, the sheet resin SP8 cut out from the resin film can be directly set in the resin molding die.

[0061] FIG. 11 is a diagram schematically showing an example of a method for forming a through hole. The through hole ST9 shown in FIG. 12 is formed by making a cut with an edge ED in the sheet resin SP9 and sucking and lifting the cut area with a vacuum VC to remove it. The step of forming the through hole ST9 is carried out, for example, after laminating the sheet resin SP9 on the workpiece 10, but the sheet resin SP9 may be laminated on the workpiece 10 after forming the through hole ST9.

[0062] FIG. 12 is a diagram schematically showing an example of a method for forming a recess. FIG. 13 is a diagram schematically showing an example of a method for forming a recess. If the resin amount in the central portion is less than that in the peripheral portion of the sheet resin in plan view, a recess may be formed in the central portion instead of a through hole. The recess ST10 shown in FIG. 12 is formed by machining the sheet resin SP10. The recess ST11 shown in FIG. 13 is formed by laminating the sheet resin SP11a having through holes on the flat sheet resin SP11b. Note that the machining may be performed by cutting with a single cutting tool as shown in the figure, or may be performed using a continuous cutting tool such as an end mill.

[0063] As described above, according to one aspect of the present invention, it is possible to provide a resin sealing method and a resin sealing apparatus capable of suppressing dimensional variations of a package.

[0064] The embodiments described above are for facilitating the understanding of the present invention and are not for limiting and interpreting the present invention. Each element included in the embodiments, as well as its arrangement, material, conditions, shape, size, etc. are not limited to those exemplified and can be appropriately changed. Also, it is possible to partially substitute or combine the configurations shown in different embodiments.

Description of Reference Numerals

[0065] 1... Resin Sealing Apparatus, 10... Workpiece, 11... Carrier, 12... Component, 100... Resin Supply Apparatus, Pay-Out Roll... FR, Pinch Roll... PR, Sheet Cutter... CT, Mechanical Punch... PN, Sheet Resin SP1, Through-Hole ST1, 190... Resin Molding Die, 191... Lower Die, 192... Upper Die, 199... Cavity.

Claims

1. A resin encapsulation method for manufacturing a plurality of packages in which a plurality of components are mounted on a carrier and at least one component is resin-encapsulated in each, comprising: a step of setting a sheet resin in a resin molding die; a step of compression-molding the sheet resin set in the resin molding die to flow the sheet resin; including: at least one through-hole or recess is formed in the central portion of the sheet resin so that the resin amount in the central portion is less than that in the peripheral portion of the sheet resin in a plan view, the through-hole or recess is provided so as to extend over a plurality of package areas, the step of flowing the sheet resin includes flowing the sheet resin in the peripheral portion toward the central portion, a resin encapsulation method.

2. a step of feeding out a long resin film; a step of cutting out the sheet resin from the resin film; further including a step of forming the at least one through-hole or recess in the resin film or the sheet resin, the resin encapsulation method according to claim 1.

3. the at least one through-hole is formed by punching, the resin encapsulation method according to claim 1 or 2.

4. the at least one through-hole is formed by sucking a cut-in area, the resin encapsulation method according to claim 1 or 2.

5. the cavity of the resin molding die is circular, the sheet resin is rectangular with a diagonal length less than or equal to the diameter of the cavity, the resin encapsulation method according to any one of claims 1 to 4.

6. The sheet resin is rectangular, The reduction amount of the resin due to the at least one through hole or recess in the portion along the diagonal of the sheet resin is larger than the reduction amount of the resin due to the at least one through hole or recess in the portion along the bisector of each side of the sheet resin, The resin encapsulation method according to any one of claims 1 to 5.

7. The at least one through hole or recess is one through hole or recess, In a plan view, the one through hole or recess and the sheet resin are similar in shape, The resin encapsulation method according to any one of claims 1 to 4.

8. In the step of setting the sheet resin in the resin molding die, the sheet resin is laminated on the work to be resin-encapsulated, The resin encapsulation method according to any one of claims 1 to 7.

9. In the step of setting the sheet resin in the resin molding die, the sheet resin is laminated on the release film, The resin encapsulation method according to any one of claims 1 to 7.

10. A resin encapsulation method for manufacturing a plurality of packages in which a resin is compression-molded for a work in which a plurality of components are mounted on a carrier and at least one component is resin-encapsulated in each, A step of punching holes in a sheet resin, A step of setting the sheet resin subjected to the punching process in a resin molding die, A step of compression-molding the sheet resin set in the resin molding die to flow the sheet resin, including By the step of performing the punching process, a plurality of through holes are formed in the entire surface in a plan view of the sheet resin, The plurality of through holes are provided so as to extend over a plurality of package areas, The edges of the plurality of through-holes of the sheet resin set in the resin molding die overlap with any one of the plurality of components. The step of flowing the sheet resin includes flowing the sheet resin at the peripheral portion toward the central portion. Resin encapsulation method.

11. A resin encapsulation device for compression molding resin on a workpiece having a plurality of components mounted on a carrier to manufacture a plurality of packages in which at least one component is resin-encapsulated respectively, A sheet cutting portion for cutting out a sheet resin from a long resin film, A weight-reducing portion for forming at least one through-hole or recess in the resin film or the sheet resin, A resin molding die for compression molding the set sheet resin to flow the sheet resin, Comprising The at least one through-hole or recess is formed in the central portion of the sheet resin so that the resin amount in the central portion is less than that in the peripheral portion of the sheet resin in plan view. The through-hole or recess is provided so as to extend over a plurality of package areas. Flowing the sheet resin includes flowing the sheet resin at the peripheral portion toward the central portion. Resin encapsulation device.

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