Probe card

Abstract

[Problem] To prevent a flexible wiring board from peeling off from a substrate. [Solution] This probe card comprises: a substrate 30 having a flat surface that faces an object 20 to be tested; a flexible wiring board 50 which is composed of an insulating film 51 and has an adhesive surface adhered to the substrate 30 via an adhesive agent 40 and a probe mounting surface on which two or more electrode pads 520 are aligned and arranged at a predetermined interval; and two or more probes 70 respectively disposed on the electrode pads 520. Two or more first anchor pads 521 are respectively formed at positions on the adhesive surface that correspond to the electrode pads 70.

Description

Technical Field

[0001] The present invention relates to a probe card, and more particularly to an improvement of a probe card provided with a flexible printed circuit board.

Background Art

[0002] A probe card is an inspection device used when inspecting the electrical characteristics of semiconductor devices formed on a semiconductor wafer, and two or more probes for respectively contacting two or more electrodes formed on the semiconductor wafer are provided on a wiring substrate. The inspection of semiconductor devices is performed by bringing the semiconductor wafer close to the probe card and bringing the tips of the probes into contact with the electrodes on the semiconductor wafer, and connecting the tester device to the semiconductor device via the probes and the wiring substrate.

[0003] A probe card in which probes are attached to a flexible printed circuit board has been conventionally known (for example, Patent Document 1). In the probe card described in Patent Document 1, the probes are attached to the central portion of the lower surface of the flexible printed circuit board. The peripheral portion of this flexible printed circuit board is fixed by a ring-shaped presser plate, and the central portion of the upper surface is adhered to the top of a pedestal having a frustum of a square pyramid shape attached to a leaf spring.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In the case of a probe card in which a probe is attached to a flexible printed circuit board and the flexible printed circuit board is adhered to a flat surface of a base material, if the adhesive strength is insufficient, the flexible printed circuit board may peel off from the base material. For example, when the tip of a probe having a cantilever structure is pressed against an object to be inspected, a force for tilting the probe is applied to the root of the probe. Therefore, there is a risk that the flexible printed circuit board may peel off from the base material at the attachment position of the probe.

[0006] In addition, due to variations in the thickness of the adhesive, variations may occur in the heights of two or more probes, which may reduce the contact with the object to be inspected. Furthermore, when adhering the flexible printed circuit board, air bubbles generated in the adhesive expand due to heat during high-temperature inspection and contract during low-temperature inspection, which may impair the flatness of the flexible printed circuit board and reduce the contact with the object to be inspected.

[0007] The present invention has been made in view of the above circumstances, and an object thereof is to prevent a flexible printed circuit board from peeling off from a base material in a probe card in which the flexible printed circuit board is adhered to the base material. Another object is to improve the contact with an object to be inspected of a probe card in which a flexible printed circuit board is adhered to a base material. In particular, an object is to suppress variations in the height of the probes. Another object is to prevent the flatness of the electrode pads on which the probes are arranged from being impaired.

Means for Solving the Problems

[0008] A probe card according to a first embodiment of the present invention includes a base material having a flat surface facing an object to be inspected, a flexible printed circuit board composed of an insulating film and having an adhesive surface adhered to the base material via an adhesive and a probe mounting surface on which two or more electrode pads are arranged in alignment at a predetermined interval, and two or more probes respectively arranged on the two or more electrode pads. Two or more first anchor pads corresponding to the two or more electrode pads are formed. Each formed. on the bonding surface at a predetermined interval are

[0009] By adopting such a configuration, the first anchor pads are arranged in alignment with a predetermined interval. The first anchor pads are convex portions provided on the adhesive surface of the flexible printed circuit board, and recesses are formed between adjacent first anchor pads. For this reason, unevenness in which convex and concave portions alternately appear is formed on the adhesive surface of the flexible printed circuit board, and by increasing the surface area, the flexible printed circuit board can be firmly adhered to the base material. Further, since the first anchor pads are formed at positions corresponding to the electrode pads, it is possible to prevent the flexible printed circuit board from peeling from the base material in the formation region of the electrode pads due to elastic deformation of the probe during inspection.

[0010] Also, excess adhesive on the first anchor pads is accommodated in the recesses, and the thickness of the adhesive interposed between the first anchor pads and the base material can be suppressed. For this reason, variations in the thickness of the adhesive are also suppressed, and variations in the heights of two or more electrode pads are suppressed. As a result, variations in the heights of two or more probes are suppressed, and the contact property with the inspection object can be improved. Further, by suppressing the thickness of the adhesive, it is possible to suppress the flatness of the electrode pads from being impaired due to thermal expansion of bubbles generated in the adhesive, and the contact property with the inspection object can be improved.

[0011] The probe card according to the second embodiment of the present invention, in addition to the above configuration, the base material is constituted by a ceramic substrate. The ceramic substrate has a thermal expansion coefficient close to that of a silicon wafer, is less likely to warp, and has high flatness. For this reason, by adhering the flexible printed circuit board to the ceramic substrate, the contact property with the inspection object can be improved.

[0012] The probe card according to the third embodiment of the present invention, in addition to the above configuration, the electrode pads and the first anchor pads are integrally formed through a first through hole of the insulating film, and the first through hole is configured to be included in the outer edge of the electrode pad and the outer edge of the first anchor pad.

[0013] By adopting such a configuration, the first anchor pad and the electrode pad are integrally formed and formed so as to sandwich the insulating film. Therefore, when the first anchor pad is peeled off from the insulating film, it is possible to prevent the flexible printed circuit board from being peeled off from the base material.

[0014] The probe card according to the fourth embodiment of the present invention, in addition to the above configuration, is configured such that the first anchor pad has a shape corresponding to the electrode pad.

[0015] By adopting such a configuration, the thickness of the adhesive in the region corresponding to the electrode pad can be suppressed. Therefore, it is possible to prevent variations in the height of the electrode pad and to prevent the flatness of the electrode pad from being impaired due to the thermal expansion of the bubbles in the adhesive.

[0016] The probe card according to the fifth embodiment of the present invention, in addition to the above configuration, includes two or more connection pins. The base material has two or more through holes for inserting the two or more connection pins respectively arranged in alignment at a predetermined interval. The flexible printed circuit board has two or more second through holes for inserting the two or more connection pins respectively on the peripheral side of the electrode pad, and the electrode pad is configured to be electrically connected to the connection pins.

[0017] By inserting the connection pins into the through holes of the base material and the second through holes of the flexible printed circuit board and electrically connecting the connection pins to the probes, it is possible to easily align the flexible printed circuit board with respect to the base material and to improve the high-frequency characteristics of the wiring for the probes.

[0018] According to a sixth embodiment of the present invention, in addition to the above configuration, the flexible wiring board has two or more electrode terminals formed to surround the openings on the probe mounting surface of the two or more second through holes, the connection pins are connected to the electrode terminals, the electrode terminals are connected to the electrode pads on the flexible wiring board, and second anchor pads are formed at positions corresponding to the electrode terminals on the bonding surface.

[0019] By adopting such a configuration, the second anchor pads are arranged in alignment with a predetermined interval. The second anchor pads are convex portions provided on the bonding surface of the flexible wiring board, and the portions between adjacent second anchor pads are concave portions. Therefore, unevenness in which convex and concave portions alternately appear is formed on the bonding surface of the flexible wiring board, and by increasing the surface area, the flexible wiring board can be firmly bonded to the base material.

[0020] According to a seventh embodiment of the present invention, in addition to the above configuration, the electrode terminals and the second anchor pads are integrally formed through the second through holes, and the second through holes are configured to be included in the outer edges of the electrode terminals and the outer edges of the second anchor pads.

[0021] By adopting such a configuration, the second anchor pads and the electrode terminals are integrally formed and are formed so as to sandwich an insulating film. Therefore, it is possible to prevent the flexible wiring board from peeling from the base material due to the second anchor pads peeling from the insulating film.

[0022] According to an eighth embodiment of the present invention, in addition to the above configuration, the flexible wiring board has two or more third anchor pads that do not correspond to either the electrode pads or the electrode terminals arranged in alignment on the bonding surface at a predetermined interval.

[0023] By adopting such a configuration, the electrode pads and electrodeEven in a region where no terminals are formed, unevenness is formed on the adhesive surface of the flexible printed circuit board, and the flexible printed circuit board can be firmly adhered to the base material.

Advantages of the Invention

[0024] According to the present invention, in a probe card in which a flexible printed circuit board is adhered to a base material, it is possible to prevent the flexible printed circuit board from peeling off from the base material. In addition, the contact property with the inspection object of the probe card in which the flexible printed circuit board is adhered to the base material can be improved. In particular, variations in the height of the probes can be suppressed. Further, it is possible to prevent the flatness of the electrode pads on which the probes are arranged from being impaired.

Brief Description of the Drawings

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Modes for Carrying Out the Invention

[0026] Embodiment 1. FIG. 1 is a diagram showing an example of the schematic configuration of a probe card 100 according to Embodiment 1 of the present invention, and shows a cross section when the probe card 100 is cut in a vertical plane. The probe card 100 is attached to a wafer prober with the probe mounting surface facing downward, faces the semiconductor wafer 20 placed on the stage 200, and by moving the stage 200 up and down, the probe 70 can be brought into contact with the inspection electrode 21 on the semiconductor wafer 20.

[0027] The probe card 100 is composed of a main board 10, a reinforcing plate 11, a ceramic substrate 30, an adhesive 40, a flexible wiring board 50, and two or more probes 70.

[0028] The main board 10 is a wiring board that is detachably attached to a wafer prober. For example, a disk-shaped glass epoxy board is used. The main board 10 is supported by the card holder 201 of the wafer prober at the peripheral portion of the lower surface and is disposed substantially horizontally.

[0029] A reinforcing plate 11 for suppressing distortion of the main board 10 is attached to the central portion of the upper surface of the main board 10. In addition, two or more external terminals 12 to which signal terminals of a tester device (not shown) are connected are provided at the peripheral portion of the upper surface of the main board 10.

[0030] The ceramic substrate 30 is a ceramic flat plate attached to the central portion of the lower surface of the main board 10 as a base material for supporting the flexible wiring board 50. The upper surface of the ceramic substrate 30 is an attachment surface facing the main board 10, and the lower surface of the ceramic substrate 30 is a flat adhesive surface to which the flexible wiring board 50 is adhered. Ceramic is a material with excellent flatness and strength that is not easily warped, and is also excellent in insulation. In addition, the difference in the coefficient of thermal expansion from a silicon wafer is small, and displacement is less likely to occur between the inspection object in a high-temperature test. For this reason, ceramic is suitable as a material for the base material that supports the probe 70.

[0031] The adhesive 40 forms an adhesive layer interposed between the ceramic substrate 30 and the flexible wiring board 50, and adheres the flexible wiring board 50 to the ceramic substrate 30. As the adhesive 40, for example, a thermosetting adhesive using an epoxy resin can be used.

[0032] The flexible wiring board 50 is a sheet-like wiring board attached to the bonding surface of the ceramic substrate 30. The upper surface of the flexible wiring board 50 is a bonding surface facing the ceramic substrate 30 via the adhesive 40, and the lower surface of the flexible wiring board 50 is a probe mounting surface on which two or more probes 70 are arranged.

[0033] The flexible wiring board 50 is a wiring board in which a conductive pattern is formed on a flexible insulating film, and has a shape thinner than that of the ceramic substrate 30. For example, a flexible printed circuit board using a resin film such as a polyimide film can be used, or a multilayer wiring board in which a plurality of resin films are laminated can also be used.

[0034] Since the resin film is easier to form patterns of electrodes and wirings and easier to manufacture a multilayer substrate than the ceramic substrate 30, it can be manufactured at low cost. On the other hand, compared with the ceramic substrate 30, the difference in the coefficient of thermal expansion from that of the silicon wafer is large, and the flatness and strength are also inferior. Therefore, by adhering the flexible wiring board 50 to the ceramic substrate 30, a probe card 100 can be obtained that can be manufactured at low cost, has excellent flatness and strength, and is less likely to be displaced during a high-temperature test.

[0035] The probe 70 is made of an elastically deformable conductive metal, for example, NiCo (nickel-cobalt alloy), has a tip for contacting the inspection electrode 21 on the semiconductor wafer 20, and is attached to the probe mounting surface of the flexible substrate. The shape of the probe 70 is arbitrary, and a cantilever type having a cantilever structure, a vertical type using buckling deformation, etc. can be used.

[0036] The stage 200 is a mounting table for the semiconductor wafer 20 and can move and rotate in the horizontal plane and move in the vertical direction. By horizontally moving or rotating the stage 200, the alignment between the tip of the probe 70 and the inspection electrode 21 of the semiconductor wafer 20 can be performed. After alignment, by raising the stage 200, the semiconductor wafer 20 can be brought closer to the probe card 100, and the tip of the probe 70 can be brought into contact with the inspection electrode 21.

[0037] FIG. 2 is an enlarged cross-sectional view of the main part of the probe card 100 in FIG. 1, showing the detailed configurations of the main board 10, the ceramic board 30, and the flexible wiring board 50.

[0038] The ceramic board 30 has two or more through holes 30h penetrating in the thickness direction. Connection pins 60 are inserted into the respective through holes 30h to electrically connect the main board 10 and the flexible wiring board 50.

[0039] The internal terminal 13 is an electrode formed on the lower surface of the main board 10 and is electrically connected to the external terminal 12 through wiring (not shown) of the main board 10. Further, the internal terminal 13 is arranged corresponding to the through hole 30h and is electrically connected to the flexible wiring board 50 through the connection pin 60.

[0040] The connection pin 60 is a through electrode penetrating the ceramic board 30 and is composed of a shaft portion 61 and an electrode portion 62 integrally formed of a conductive metal. The shaft portion 61 is disposed within the through hole 30h, and its tip protrudes from the lower surface (adhesive surface) of the ceramic board 30. The electrode portion 62 is wider than the shaft portion 61 and is locked to the upper surface of the ceramic board 30. The electrode portion 62 faces the internal terminal 13 and is connected to the internal terminal 13 through solder.

[0041] The flexible wiring board 50 is made of an insulating film 51 having two or more electrode pads 520, two or more anchor pads 521, and two or more through holes 53.

[0042] The electrode pad 520 is an electrode for probe mounting to which the probe 70 is attached, and is formed on the probe mounting surface of the flexible wiring board 50. The electrode pad 520 is arranged so as to correspond to the inspection electrode 21 on the semiconductor wafer 20. Generally, a number of inspection electrodes 21 are arranged on the semiconductor wafer 20 so as to be aligned at a predetermined interval. For this reason, the electrode pads 520 are also arranged in alignment at a predetermined interval.

[0043] The anchor pad 521 is a convex portion for preventing the flexible wiring board 50 from peeling off from the ceramic substrate 30, and is formed on the adhesive surface of the flexible wiring board 50. The anchor pad 521 does not necessarily need to have conductivity, but for example, by utilizing a well-known photolithography technique, it can be formed as an electrode similar to the electrode pad 520, that is, a thin film of a conductive metal.

[0044] The anchor pad 521 is arranged corresponding to the electrode pad 520. For this reason, convex portions by the anchor pads 521 are arranged in alignment on the adhesive surface of the flexible wiring board 50. Further, by arranging a number of anchor pads 521 in alignment at a predetermined interval, recesses are respectively formed between adjacent electrode pads 520. Also, the anchor pad 521 has a shape corresponding to the electrode pad 520. It is desirable that the outer edge of the electrode pad 520 coincides with the outer edge of the anchor pad 521. For example, if the anchor pad 521 is symmetric, the electrode pad 520 is made to have the same shape as the anchor pad 521, and if the anchor pad 521 is asymmetric, it is desirable that the electrode pad 520 has a shape that is the inversion of the anchor pad 521 when viewed from the back side.

[0045] Since the adhesive surface of the flexible wiring board 50 is formed as a smooth surface, by providing the anchor pad 521 to form irregularities, the surface area in contact with the adhesive 40 can be increased. For this reason, the adhesive strength can be improved, and peeling of the flexible wiring board 50 from the ceramic substrate 30 can be suppressed.

[0046] Also, when the flexible printed circuit board 50 is adhered to the ceramic substrate 30, the excess adhesive on the anchor pads 521 is accommodated in the recesses between the anchor pads 521. Therefore, the thickness of the adhesive interposed between the anchor pads 521 and the ceramic substrate 30 can be relatively reduced, and the generation of bubbles in the adhesive can be suppressed.

[0047] By reducing the thickness of the adhesive, variations in the thickness of the adhesive on the anchor pads 521 can be suppressed. Therefore, variations in the height of the electrode pads 520 can be suppressed, and variations in the height of the probes 70 can be suppressed. Also, by suppressing the generation of bubbles, the flatness of the flexible printed circuit board 50 is impaired due to the thermal expansion of the bubbles during high-temperature inspection and the thermal contraction of the bubbles during low-temperature inspection, and it is possible to prevent variations in the height of the probes 70 and displacement of the tip positions. Therefore, it becomes possible to reliably bring two or more probes 70 into contact with the object to be inspected, and the contact property with the object to be inspected can be improved.

[0048] The through-hole 53 is a hollow through electrode that penetrates the flexible printed circuit board 50 in the thickness direction, is made of a conductive metal such as copper Cu, and is formed by plating the through-hole 50h of the flexible printed circuit board 50. On the flexible printed circuit board 50, two or more through-holes 53 are arranged in alignment at a predetermined interval. Also, the through-hole 53 is composed of an electrode terminal 530, an anchor pad 531, and an inner wall conductor 532, and has a through-hole 53h surrounded by the inner wall conductor 532.

[0049] The electrode terminal 530 is an electrode formed on the probe mounting surface of the flexible printed circuit board 50. The electrode terminal 530 is formed so as to surround the opening of the through-hole 50h, and is connected to the electrode pad 520 via a wiring pattern 54 on the flexible printed circuit board 50.

[0050] The anchor pad 531 is a convex portion for preventing the flexible wiring board 50 from peeling off from the ceramic substrate 30, and is formed on the adhesive surface of the flexible wiring board 50. By forming the anchor pad 531, irregularities are formed on the adhesive surface, the contact area with the adhesive 40 can be increased, and the adhesive strength can be increased. The anchor pad 531 has a shape corresponding to the electrode terminal 530, for example, the same shape or an inverted shape, and is arranged corresponding to the electrode terminal 530. Here, it is formed so as to surround the opening of the through hole 50h.

[0051] The inner wall conductor 532 is a thin film formed on the inner wall of the through hole 50h, and connects the electrode terminal 530 and the anchor pad 531 to each other. Further, the through hole 50h is respectively included in the outer edges of the electrode terminal 530 and the anchor pad 531. Therefore, the insulating film 51 is sandwiched by the electrode terminal 530 and the anchor pad 531 connected to each other, and prevents the anchor pad 531 from peeling off from the insulating film 51.

[0052] The connection pin 60 is inserted into the through hole 53h of the through hole 53, soldered to the electrode terminal 530, and conducts with the through hole 53. Therefore, the electrode pad 520 conducts with the external terminal 12 via the electrode terminal 530, the connection pin 60, and the internal terminal 13. By connecting using the connection pin 60, it is possible to prevent poor contact due to the adhesion of the adhesive and the displacement during adhesion. In addition, the high-frequency characteristics can be improved.

[0053] FIG. 3 and FIG. 4 are diagrams showing an example of the flexible wiring board 50 viewed in plan view. FIG. 3 shows the probe mounting surface, and FIG. 4 shows the adhesive surface.

[0054] The flexible printed circuit board 50 is provided with an alignment viewing hole 50w in the center. Also, as shown in FIG. 3, on the probe mounting surface of the flexible printed circuit board 50, an electrode pad 520, a wiring pattern 54, and an electrode terminal 550 are formed. The electrode pads 520 are arranged in alignment along the periphery in the vicinity of the periphery of the viewing hole 50w. On the other hand, the electrode terminals 530 are formed along the periphery in the vicinity of the periphery of the flexible printed circuit board 50. The wiring pattern 54 connects the electrode pad 520 and the electrode terminal 530.

[0055] As shown in FIG. 4, anchor pads 521 and 531 are formed on the adhesive surface of the flexible printed circuit board 50. The anchor pads 521 are arranged in alignment at positions corresponding to the electrode pads 520 in FIG. 3. On the other hand, the anchor pads 531 are arranged in alignment at positions corresponding to the electrode terminals 530.

[0056] Regions a1 to a3 in the figure are regions on the adhesive surface of the flexible printed circuit board 50. Region a1 is the arrangement region of the electrode pads 520, region a2 is the arrangement region of the electrode terminals 530, and region a3 is the region other than regions a1 and a2. A large number of anchor pads 521 are arranged in region a1, and irregularities are formed. Similarly, a large number of anchor pads 531 are arranged in region a2, and irregularities are formed. It is desirable that the entire adhesive surface is adhered to the ceramic substrate 30 via the adhesive 40, but at least the first region a1 and the second region a2 are adhered via the adhesive.

[0057] FIG. 5 is a diagram showing a formation region of an adhesive layer on the bonding surface of the ceramic substrate 30. In the figure, (a) shows the entire bonding surface of the ceramic substrate 30, and (b) in the figure shows an enlarged view of the vicinity of the through hole 30h. The ceramic substrate 30 is provided with a viewing hole 30w corresponding to the viewing hole 50w of the flexible wiring board 50, and an adhesive 40 is applied to the hatched region to form an adhesive layer. The adhesive 40 is formed over the entire bonding surface of the ceramic substrate 30, but a predetermined clearance region 40c where the adhesive 40 is not formed is provided around the through hole 30h to prevent the adhesive 40 from entering the through hole 53h.

[0058] FIG. 6 is a diagram schematically showing an example of a method for manufacturing the probe card 100 of FIG. 1. The ceramic substrate 30 is placed with the vertical direction reversed so that the bonding surface faces upward.

[0059] First, a through hole 30h is formed in the ceramic substrate 30 using a drill (FIG. 6(a)). Next, a connection pin 60 is inserted into the through hole 30h (FIG. 6(b)). The connection pin 60 has the electrode portion 62 in contact with and locked to the mounting surface of the ceramic substrate 30, and the tip of the shaft portion 61 protrudes from the bonding surface.

[0060] Next, an adhesive layer made of an adhesive 40 is formed on the bonding surface of the ceramic substrate 30 (FIG. 6(c)), and the flexible wiring board 50 is attached (FIG. 6(d)). The flexible wiring board 50 is aligned so that the connection pin 60 is inserted into the through hole 53h and is disposed on the bonding surface of the ceramic substrate 30, and is pressed from above so that the bonding surface is in close contact with the ceramic substrate 30. Then, by heating, the adhesive 40 is cured and firmly adhered. Thereafter, the connection pin 60 and the electrode terminal 530 are soldered, and the probe 70 is soldered onto the electrode pad 520.

[0061] In addition, in the present embodiment, an example of forming an adhesive layer on the bonding surface of the ceramic substrate 30 has been described. Needless to say, instead of this, an adhesive layer may be formed on the bonding surface of the flexible wiring board 50.

[0062] Embodiment 2 FIG. 7 is a cross-sectional view showing a configuration example of a main part of the probe card 100 according to Embodiment 2 of the present invention, and shows detailed configurations of the ceramic substrate 30, the adhesive 40, and the flexible wiring board 50.

[0063] The electrode pad 520 and the anchor pad 521 are connected via a through connection portion 522. The through connection portion 522 is a through electrode that penetrates the flexible wiring board 50, and is formed by embedding a through hole 52h that penetrates the flexible wiring board 50 in the thickness direction with a conductive material. For example, after the formation of the through hole 52h, a conductive metal such as copper Cu is plated to integrally form the electrode pad 520, the anchor pad 521, and the through connection portion 522.

[0064] Also, the outer edge of the through hole 52h is respectively included in the outer edges of the electrode pad 520 and the anchor pad 521. Therefore, the insulating film 51 is sandwiched between the electrode pad 520 and the anchor pad 521 that are connected to each other. Therefore, it is possible to prevent the anchor pad 521 from peeling off from the flexible wiring board 50, and it is possible to prevent the flexible wiring board 50 from peeling off from the ceramic substrate 30.

[0065] Embodiment 3 In Embodiments 1 and 2, an example in which unevenness is formed in these regions a1 and a2 by arranging the anchor pad 521 in the region a1 and the anchor pad 531 in the region a2 on the adhesive surface of the flexible wiring board 50 has been described. On the other hand, in the present embodiment, a case where unevenness is formed in a region a3 other than the regions a1 and a2 will be described.

[0066] Figs. 8 and 9 are diagrams showing a configuration example of a main part of the probe card 100 according to Embodiment 3 of the present invention. Fig. 8 is a diagram showing an example when the adhesive surface of the flexible wiring board 50 is viewed in plan view, and Fig. 9 is a cross-sectional view showing the detailed configuration of the ceramic substrate 30, the adhesive 40, and the flexible wiring board 50. The probe card according to the present embodiment is different in that two or more anchor pads 55 are arranged in the region a3 as compared with the probe cards of Figs. 4 and 7, and since the other configurations are the same, duplicate explanations are omitted.

[0067] The anchor pad 55 is a convex portion for preventing the flexible wiring board 50 from peeling off from the ceramic substrate 30, and is formed on the adhesive surface of the flexible wiring board 50. The anchor pad 55 does not necessarily have to be conductive, but for example, it can be formed as an electrode similar to the electrode pad 520, that is, a thin film of a conductive metal, by utilizing a well-known photolithography technique.

[0068] The anchor pads 55 have an arbitrary shape and are arranged in alignment with a predetermined interval. For this reason, the convex portions by the anchor pads 55 are also arranged in alignment in the region a3, and recesses are respectively formed between the adjacent anchor pads 55. For this reason, the contact area with the adhesive 40 can be increased, the adhesive strength can be improved, and the peeling of the flexible wiring board 50 from the ceramic substrate 30 can be suppressed.

Explanation of Reference Numerals

[0069] 100 Probe card 10 Main substrate 11 Reinforcing plate 12 External terminal 13 Internal terminal 20 Semiconductor wafer 21 Inspection electrode 30 Ceramic substrate 30h Through hole 30w Peep hole 40 Adhesive 40c Clearance region 50 Flexible wiring board 50h Through-hole 50w Peek hole 51 Insulating film 52h Through-hole 520 Electrode pad 521 Anchor pad 522 Through-connection part 53 Through-hole 530 Electrode terminal 531 Anchor pad 532 Inner wall conductor 53h Through-hole 54 Wiring pattern 55 Anchor pad 60 Connection pin 61 Shaft part 62 Electrode part 70 Probe Regions a1 to a3

Claims

1. A substrate having a flat surface facing an object to be inspected, A flexible wiring board composed of an insulating film and having an adhesive surface bonded to the substrate via an adhesive and a probe mounting surface on which two or more electrode pads are arranged in alignment with a predetermined interval, and Two or more probes respectively arranged on the two or more electrode pads, A probe card, characterized in that two or more first anchor pads respectively corresponding to the two or more electrode pads are formed on the adhesive surface at a predetermined interval.

2. The probe card according to claim 1, wherein the substrate is a ceramic substrate.

3. The electrode pads and the first anchor pads are integrally formed through a first through hole of the insulating film, The probe card according to claim 1, wherein the first through hole is included in the outer edge of the electrode pad and the outer edge of the first anchor pad.

4. The probe card according to claim 1, wherein the first anchor pad has a shape corresponding to the electrode pad.

5. Comprising two or more connection pins, The substrate has two or more through holes for inserting the two or more connection pins respectively arranged in alignment with a predetermined interval, The flexible wiring board has two or more second through holes for inserting the two or more connection pins respectively on the peripheral side of the electrode pads, The probe card according to any one of claims 1 to 4, wherein the electrode pads are electrically connected to the connection pins.

6. The flexible wiring board is formed with two or more electrode terminals respectively surrounding the openings on the probe mounting surface of the two or more second through holes, The connection pins are connected to the electrode terminals, The electrode terminal is connected to the electrode pad on the flexible wiring board, The probe card according to claim 5, wherein a second anchor pad is formed at a position corresponding to the electrode terminal on the bonding surface.

7. The electrode terminal and the second anchor pad are integrally formed through the second through hole, The probe card according to claim 6, wherein the second through hole is included in the outer edge of the electrode terminal and the outer edge of the second anchor pad.

8. The probe card according to claim 6, wherein two or more third anchor pads that do not correspond to either the electrode pad or the electrode terminal are arranged in alignment on the bonding surface at a predetermined interval.

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