Processing device

Abstract

To provide a processing device that is easy to attach a dicing tape to the back surface of a wafer having a ring-shaped reinforcing potion formed in a convex shape, integrate the dicing tape with a frame, easily cut the reinforcing portion, and remove the reinforcing portion from the wafer.SOLUTION: A processing device 2 includes wafer unloading means 10, a wafer table 12, frame carrying-out means 68, a frame table 70, tape applying means 98 that applies a tape 96 to a frame 64, tape-attached frame conveying means 100, tape crimping means 102 that crimps the tape 96 of the tape-attached frame to the back surface of the wafer, frame unit unloading means 192, reinforcing portion removing means 194 that cuts and removes the ring-shaped reinforcing portion from the wafer of a frame unit, protective film coating means that coats a region of the wafer irradiated with a laser beam with a protective film, ringless unit carry-out means 196, and a frame cassette table 200.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a processing apparatus for removing a convex reinforcing portion from a wafer having a ring-shaped reinforcing portion convexly formed on the back surface corresponding to an outer peripheral surplus region.

Background Art

[0002] In a wafer having a device region partitioned by a dicing line for a plurality of devices such as ICs and LSIs and an outer peripheral surplus region surrounding the device region formed on the front surface, after the back surface is ground to a desired thickness, it is divided into individual device chips by a dicing apparatus or a laser processing apparatus, and each divided device chip is used in electrical devices such as mobile phones and personal computers.

[0003] The applicant of the present application proposed a technique in which a ring-shaped reinforcing portion is left on the back surface corresponding to the outer peripheral surplus region to facilitate the conveyance of the ground wafer, subjected to predetermined processing, then a dicing tape is attached to the back surface of the wafer, the wafer is supported by a frame, and the ring-shaped reinforcing portion is removed from the wafer (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, there are problems that it is difficult to attach a dicing tape to the back surface of a wafer having a ring-shaped reinforcing portion convexly formed on the back surface corresponding to the outer peripheral surplus region and integrate it with a frame, and it is difficult to cut and remove the ring-shaped reinforcing portion from the wafer, resulting in poor productivity.

[0006] In view of the above facts, an object of the present invention is to provide a processing apparatus that facilitates the operation of attaching a dicing tape to the back surface of a wafer having a ring-shaped reinforcing portion convexly formed on the back surface corresponding to the outer peripheral surplus region and integrating it with a frame, and that easily cuts and removes the ring-shaped reinforcing portion from the wafer.

Means for Solving the Problem

[0007] According to the present invention, the following processing apparatus is provided to solve the above problems. That is, a processing apparatus for removing a convex reinforcing portion from a wafer having a ring-shaped reinforcing portion convexly formed on the back surface corresponding to the outer peripheral surplus region, including a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed, a wafer unloading means for unloading a wafer from the wafer cassette placed on the wafer cassette table, a wafer table for supporting the front surface side of the wafer unloaded by the wafer unloading means, a frame accommodating means for accommodating a plurality of ring-shaped frames each having an opening for accommodating a wafer, a frame unloading means for unloading a frame from the frame accommodating means, a frame table for supporting the frame unloaded by the frame unloading means, a tape sticking means disposed above the frame table for sticking a tape to the frame, a tape-attached frame conveying means for conveying the frame with the tape attached to the wafer table and positioning the opening of the frame on the back surface of the wafer supported by the wafer table and placing the tape-attached frame on the wafer table, a tape crimping means for crimping the tape of the tape-attached frame to the back surface of the wafer with a pressing roller, a frame unit unloading means for unloading the frame unit in which the tape of the tape-attached frame and the back surface of the wafer are crimped from the wafer table, a reinforcing portion removing means for cutting and removing the ring-shaped reinforcing portion from the wafer, including a laser beam irradiating means for irradiating a laser beam toward the base of the ring-shaped reinforcing portion formed on the outer periphery of the wafer of the frame unit unloaded by the frame unit unloading means to form a cutting groove, a protective film coating means for coating a protective film on the region of the wafer irradiated with the laser beam, a ringless unit unloading means for unloading the ringless unit from which the ring-shaped reinforcing portion has been removed from the reinforcing portion removing means, and a frame cassette table on which a frame cassette for accommodating the ringless unit unloaded by the ringless unit unloading means is placed. See, the reinforcing part removing means includes a separating part that separates a ring-shaped reinforcing part from the cutting groove. The separating part includes a lifting table that exposes the ring-shaped reinforcing part on the outer periphery and sucks and holds the inside of the wafer of the frame unit, a separator that acts on the outer periphery of the ring-shaped reinforcing part to separate the ring-shaped reinforcing part, and a motor that rotates the lifting table. The separator includes a clamping roller that clamps the frame of the frame unit in the vertical direction and a pressing roller that presses the ring-shaped reinforcing part downward A processing apparatus is provided.

[0008] Preferably, the protective film coating means includes a tank for storing a liquid resin, a pump for sending out a predetermined amount of the liquid resin from the tank, and a coating nozzle for coating a region of a wafer irradiated with a laser beam with the liquid resin sent out from the pump. It is preferable to irradiate the laser beam on the region coated with the liquid resin at an output lower than the output of the laser beam irradiated on the wafer when forming the cutting groove to dry the coated liquid resin. It is convenient to provide an immerser for immersing the tip of the coating nozzle so that the tip does not dry. The frame unit carrying-out means preferably includes a frame unit holding part including a wafer holding part for holding a wafer and a frame holding part for holding a frame, and a conveying part for conveying the frame unit holding part to a temporary placement table. The reinforcing part removing means includes a first elevating table for holding and raising the frame unit temporarily placed on the temporary placement table and positioning it at the laser beam irradiation means, and a separating part for separating the ring-shaped reinforcing part from the cutting groove. The separating part includes an ultraviolet irradiation part for irradiating ultraviolet rays on a tape corresponding to the cutting groove to reduce the adhesive force of the tape, a second elevating table for exposing the ring-shaped reinforcing part on the outer periphery, sucking and holding the inside of the wafer, and supporting the frame, a separator for acting on the outer periphery of the ring-shaped reinforcing part to separate the ring-shaped reinforcing part, and a disposal part for disposing of the separated ring-shaped reinforcing part. The first elevating table temporarily places the frame unit in which the cutting groove is formed on the temporary placement table, the temporary placement table is positioned at the separating part by a temporary placement table conveying part, and it is desirable that the second elevating table supports the frame unit temporarily placed on the temporary placement table. 。

Advantages of the Invention

[0009] The processing apparatus of the present invention is a processing apparatus for removing a convex reinforcing portion from a wafer having a ring-shaped reinforcing portion convexly formed on the back surface corresponding to the outer peripheral surplus region, and includes a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed, a wafer unloading means for unloading a wafer from the wafer cassette placed on the wafer cassette table, a wafer table for supporting the front surface side of the wafer unloaded by the wafer unloading means, a frame accommodating means for accommodating a plurality of ring-shaped frames having openings for accommodating wafers, a frame unloading means for unloading a frame from the frame accommodating means, a frame table for supporting the frame unloaded by the frame unloading means, a tape sticking means disposed above the frame table for sticking a tape to the frame, a tape-attached frame conveying means for conveying the frame with the tape attached to the back surface of the wafer supported by the wafer table and positioning the opening of the frame at the back surface of the wafer and placing the tape-attached frame on the wafer table, a tape crimping means for crimping the tape of the tape-attached frame to the back surface of the wafer with a pressing roller, a frame unit unloading means for unloading the frame unit in which the tape of the tape-attached frame and the back surface of the wafer are crimped from the wafer table, a reinforcing portion removing means for cutting and removing the ring-shaped reinforcing portion from the wafer by irradiating a laser beam toward the base of the ring-shaped reinforcing portion formed on the outer periphery of the wafer of the frame unit unloaded by the frame unit unloading means to form a cutting groove, a protective film coating means for coating a protective film on the region of the wafer irradiated with the laser beam, a ringless unit unloading means for unloading the ringless unit from which the ring-shaped reinforcing portion has been removed from the reinforcing portion removing means, and a frame cassette table on which a frame cassette for accommodating the ringless unit unloaded by the ringless unit unloading means is placed. See, the reinforcing part removing means includes a separating part that separates a ring-shaped reinforcing part from the cutting groove. The separating part includes a lifting table that exposes the ring-shaped reinforcing part on the outer periphery and sucks and holds the inside of the wafer of the frame unit, a separator that acts on the outer periphery of the ring-shaped reinforcing part to separate the ring-shaped reinforcing part, and a motor that rotates the lifting table. The separator includes a clamping roller that clamps the frame of the frame unit in the vertical direction and a pressing roller that presses the ring-shaped reinforcing part downward Therefore, it is easy to attach a dicing tape to the back surface of a wafer having a ring-shaped reinforcing portion convexly formed on the back surface corresponding to the outer peripheral surplus region and integrate it with the frame, and it is easy to cut and remove the ring-shaped reinforcing portion from the wafer, resulting in good productivity.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

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Figure 14

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Figure 18

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Figure 20

Mode for Carrying Out the Invention

[0011] Hereinafter, a preferred embodiment of a processing apparatus configured according to the present invention will be described with reference to the drawings.

[0012] Referring to FIG. 1, a processing apparatus indicated by reference numeral 2 as a whole includes a wafer cassette table 8 on which a wafer cassette 6 containing a plurality of wafers is placed, a wafer carrying-out means 10 for carrying out a wafer from the wafer cassette 6 placed on the wafer cassette table 8, and a wafer table 12 for supporting the front surface side of the wafer carried out by the wafer carrying-out means 10.

[0013] FIG. 2 shows a wafer 4 to be processed by the processing apparatus 2. On the front surface 4a of the wafer 4, a device region 18 in which a plurality of devices 14 such as ICs and LSIs are partitioned by grid-like division planned lines 16 and an outer peripheral surplus region 20 surrounding the device region 18 are formed. In FIG. 2, for the sake of convenience, the boundary 22 between the device region 18 and the outer peripheral surplus region 20 is shown by a two-dot chain line, but actually there is no line indicating the boundary 22. On the back surface 4b side of the wafer 4, a ring-shaped reinforcing portion 24 is formed in a convex shape in the outer peripheral surplus region 20, and the thickness of the outer peripheral surplus region 20 is larger than the thickness of the device region 18. Further, a notch 26 indicating the crystal orientation is formed at the periphery of the wafer 4.

[0014] As shown in FIG. 3, in the cassette 6, a plurality of wafers 4 are accommodated at intervals in the vertical direction with the surface 4a facing upward. The wafer cassette table 8 of the illustrated embodiment has a top plate 28 on which the cassette 6 is placed and a support plate 30 that supports the top plate 28. Note that the top plate 28 may be movable up and down, and a lifting means for lifting the top plate 28 to position it at an arbitrary height may be provided.

[0015] Continuing the description with reference to FIG. 3, the wafer unloading means 10 includes a Y-axis movable member 32 movable in the Y-axis direction indicated by the arrow Y in FIG. 3, and a Y-axis feed means 34 for moving the Y-axis movable member 32 in the Y-axis direction. The Y-axis feed means 34 has a ball screw 36 connected to the lower end of the Y-axis movable member 32 and extending in the Y-axis direction, and a motor 38 for rotating the ball screw 36. The Y-axis feed means 34 converts the rotational motion of the motor 38 into a linear motion by the ball screw 36 and transmits it to the Y-axis movable member 32, and moves the Y-axis movable member 32 in the Y-axis direction along a pair of guide rails 40 extending in the Y-axis direction. Note that the X-axis direction indicated by the arrow X in FIG. 3 is a direction orthogonal to the Y-axis direction, and the Z-axis direction indicated by the arrow Z in FIG. 3 is the vertical direction orthogonal to the X-axis direction and the Y-axis direction. The XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

[0016] As shown in FIG. 3, the wafer unloading means 10 of the illustrated embodiment includes a transfer arm 42 and a hand 44 disposed at the tip of the transfer arm 42 for supporting the back surface 4b of the wafer 4 accommodated in the wafer cassette 6 and inverting the front and back of the wafer 4. The transfer arm 42 is provided on the upper surface of the Y-axis movable member 32 and is driven by an appropriate drive source such as an air drive source or an electric drive source (not shown). This drive source drives the transfer arm 42 to position the hand 44 at an arbitrary position in each of the X-axis direction, the Y-axis direction, and the Z-axis direction, and to turn the hand 44 upside down.

[0017] Referring to FIG. 4, the hand 44 is preferably a Bernoulli pad that generates a negative pressure by the ejection of air and supports the wafer 4 in a non-contact manner. The hand 44 in the illustrated embodiment is generally C-shaped, and a plurality of air ejection ports 46 connected to a compressed air supply source (not shown) are formed on one side of the hand 44. A plurality of guide pins 48 are provided at intervals in the circumferential direction on the outer peripheral edge of the hand 44. Each guide pin 48 is configured to be movable in the radial direction of the hand 44.

[0018] As shown in FIGS. 3 and 4, after positioning the hand 44 on the back surface 4b side (lower side) of the wafer 4 in the wafer cassette 6 placed on the wafer cassette table 8, the wafer unloading means 10 ejects compressed air from the air ejection ports 46 of the hand 44 to generate a negative pressure on one side of the hand 44 by the Bernoulli effect, and the hand 44 sucks and supports the wafer 4 in a non-contact manner from the back surface 4b side. The horizontal movement of the wafer 4 sucked and supported by the hand 44 is restricted by each guide pin 48. Then, the wafer unloading means 10 unloads the wafer 4 sucked and supported by the hand 44 from the wafer cassette 6 by moving the Y-axis movable member 32 and the transfer arm 42.

[0019] As shown in FIG. 4, the wafer unloading means 10 in the illustrated embodiment includes a notch detection means 50 for detecting the position of the notch 26 of the wafer 4. The notch detection means 50 may include, for example, a light emitting element 52 and a light receiving element 54 arranged at intervals in the vertical direction, and a drive source (not shown) for rotating at least one of the guide pins 48 of the hand 44.

[0020] The light-emitting element 52 and the light-receiving element 54 can be attached to the Y-axis movable member 32 or the conveyance path via appropriate brackets (not shown). Further, when the guide pin 48 rotates by the drive source, the wafer 4 sucked and supported by the hand 44 rotates due to the rotation of the guide pin 48. In order to reliably transmit the rotation from the guide pin 48 to the wafer 4, it is preferable that the outer peripheral surface of the guide pin 48 rotated by the drive source is formed of an appropriate synthetic rubber.

[0021] The notch detection means 50 can detect the position of the notch 26 by rotating the wafer 4 via the guide pin 48 by the drive source in a state where the wafer 4 is sucked and supported by the hand 44 and the outer periphery of the wafer 4 is positioned between the light-emitting element 52 and the light-receiving element 54. As a result, the orientation of the wafer 4 can be adjusted to an arbitrary orientation.

[0022] As shown in FIG. 3, the wafer table 12 is arranged adjacent to the wafer unloading means 10. The wafer table 12 of the illustrated embodiment includes an annular support portion 56 that supports the outer peripheral surplus region 20 of the wafer 4 and keeps the portion inside the outer peripheral surplus region 20 non-contact, and a frame support portion 58 that is disposed on the outer periphery of the annular support portion 56 and supports a frame 64 (see FIG. 5) described later. A plurality of suction holes 60 are formed on the upper surface of the annular support portion 56 at intervals in the circumferential direction, and each suction hole 60 is connected to a suction means (not shown). The radially inner portion of the wafer table 12 than the annular support portion 56 is a circular recess 62 that is recessed downward.

[0023] When the hand 44 is inverted by 180° to invert the front and back of the wafer 4, and the wafer 4 is placed on the wafer table 12 with the surface 4a of the wafer 4 facing downward, the outer peripheral surplus region 20 of the wafer 4 is supported by the annular support portion 56, and the device region 18 of the wafer 4 is located in the recess 62. Therefore, even when the wafer 4 is placed on the wafer table 12 with the surface 4a on which the device 14 is formed facing downward, the device 14 and the wafer table 12 do not come into contact with each other, so damage to the device 14 is prevented. Further, after the wafer table 12 supports the outer peripheral surplus region 20 by the annular support portion 56, the suction means is operated to generate a suction force in each suction hole 60 to suction-hold the outer peripheral surplus region 20, thereby preventing displacement of the wafer 4.

[0024] Referring to FIG. 5 for explanation, the processing apparatus 2 further includes a frame accommodating means 66 that accommodates a plurality of ring-shaped frames 64 in which an opening 64a for accommodating the wafer 4 is formed, a frame carrying-out means 68 that carries out the frame 64 from the frame accommodating means 66, and a frame table 70 that supports the frame 64 carried out by the frame carrying-out means 68.

[0025] As shown in FIG. 5, the frame housing means 66 of the illustrated embodiment includes a housing 72, a lifting plate 74 disposed in the housing 72 so as to be movable up and down, and a lifting means (not shown) for lifting and lowering the lifting plate 74. In FIG. 5, a Z-axis guide member 78 extending in the Z-axis direction is disposed on the side surface of the housing 72 on the back side in the X-axis direction. The lifting plate 74 is supported by the Z-axis guide member 78 so as to be movable up and down, and the lifting means for lifting and lowering the lifting plate 74 is disposed inside the Z-axis guide member 78. The lifting means may have, for example, a configuration including a ball screw connected to the lifting plate 74 and extending in the Z-axis direction, and a motor for rotating the ball screw. In FIG. 5, a door 76 with a handle 76a attached is provided on the side surface of the housing 72 on the front side in the X-axis direction. In the frame housing means 66, the frame 64 can be accommodated inside the housing 72 by gripping the handle 76a and opening the door 76. An opening 80 is provided at the upper end of the housing 72.

[0026] As shown in FIG. 5, the frame 64 is stacked and accommodated on the upper surface of the lifting plate 74 inside the housing 72. The uppermost frame 64 among the plurality of stacked frames 64 is carried out from the opening 80 of the housing 72 by the frame carrying-out means 68. Further, when the frame 64 is carried out from the opening 80, the frame housing means 66 appropriately raises the lifting plate 74 by the lifting means, and positions the uppermost frame 64 at a position where it can be carried out by the frame carrying-out means 68.

[0027] Continuing the description with reference to Fig. 5, the frame carrying means 68 includes an X-axis guide member 82 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 84 supported by the X-axis guide member 82 so as to be movable in the X-axis direction, an X-axis feed means (not shown) for moving the X-axis movable member 84 in the X-axis direction, a Z-axis movable member 86 supported by the X-axis movable member 84 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 86 in the Z-axis direction. The X-axis feed means of the frame carrying means 68 may be configured to have a ball screw connected to the X-axis movable member 84 and extending in the X-axis direction, and a motor for rotating this ball screw, and the Z-axis feed means may be configured to have a ball screw connected to the Z-axis movable member 86 and extending in the Z-axis direction, and a motor for rotating this ball screw.

[0028] The Z-axis movable member 86 of the frame carrying means 68 has a holding portion 88 for holding the frame 64. The holding portion 88 of the illustrated embodiment has a rectangular substrate 90 and a plurality of suction pads 92 provided on the lower surface of the substrate 90, and each suction pad 92 is connected to a suction means (not shown).

[0029] After the frame carrying means 68 sucks and holds the uppermost frame 64 accommodated in the frame accommodating means 66 with the suction pads 92 of the holding portion 88, the frame carrying means 68 moves the X-axis movable member 84 and the Z-axis movable member 86 to carry out the uppermost frame 64 sucked and held from the frame accommodating means 66.

[0030] As shown in Fig. 5, the frame table 70 is supported by a Z-axis guide member 94 so as to be movable up and down between a lowered position shown by a solid line and a raised position shown by a two-dot chain line. An appropriate drive source (for example, an air drive source or an electric drive source) for moving the frame table 70 up and down between the lowered position and the raised position is attached to the Z-axis guide member 94. In the frame table 70, the frame 64 carried out by the frame carrying means 68 is received in the lowered position.

[0031] As shown in FIGS. 1 and 5, the processing apparatus 2 includes a tape sticking means 98 (see FIG. 1) disposed above the frame table 70 for sticking the tape 96 to the frame 64, and a frame 64 (hereinafter sometimes referred to as “taped frame 64′”) to which the tape 96 is stuck. A taped frame conveying means 100 (see FIG. 5) for conveying the wafer to the wafer table 12 and positioning the opening 64a of the frame 64 on the back surface 4b of the wafer 4 supported by the wafer table 12 and placing the taped frame 64′ on the wafer table 12; and a tape pressing means 102 (see FIG. 1) for pressing the tape 96 of the taped frame 64′ against the back surface 4b of the wafer 4.

[0032] Referring to FIG. 6 for explanation, the tape sticking means 98 of the illustrated embodiment includes a roll tape support portion 104 for supporting a roll tape 96R around which the tape 96 before use is wound, a tape winding portion 106 for winding up the used tape 96, a tape pulling portion 108 for pulling the tape 96 from the roll tape 96R, a crimping portion 110 for crimping the pulled tape 96 to the frame 64, and a cutting portion 112 for cutting the tape 96 protruding from the outer periphery of the frame 64 along the frame 64.

[0033] As shown in FIG. 6, the roll tape support portion 104 includes a support roller 114 rotatably supported by an appropriate bracket (not shown) about an axis extending in the X-axis direction. A release paper 116 for protecting the adhesive surface of the tape 96 is attached to the adhesive surface of the tape 96, and a roll tape 96R wound in a cylindrical shape is supported on the support roller 114.

[0034] The tape winding portion 106 includes a winding roller 118 rotatably supported by an appropriate bracket (not shown) about an axis extending in the X-axis direction, and a motor (not shown) for rotating the winding roller 118. As shown in FIG. 6, the tape winding portion 106 winds up the used tape 96 in which a circular opening 120 corresponding to the portion attached to the frame 64 is formed by rotating the winding roller 118 by a motor.

[0035] Continuing the description with reference to FIG. 6, the tape drawing-out section 108 includes a drawing-out roller 122 disposed below the support roller 114 of the roll tape support section 104, a motor (not shown) for rotating the drawing-out roller 122, and a driven roller 124 that rotates as the drawing-out roller 122 rotates. The tape drawing-out section 108 draws out the tape 96 sandwiched between the drawing-out roller 122 and the driven roller 124 from the roll tape 96R by rotating the driven roller 124 together with the drawing-out roller 122 by the motor.

[0036] The release paper 116 is peeled off from the tape 96 that has passed between the drawing-out roller 122 and the driven roller 124, and the peeled release paper 116 is wound up by the release paper winding section 126. The release paper winding section 126 of the illustrated embodiment has a release paper winding roller 128 disposed above the driven roller 124 and a motor (not shown) for rotating the release paper winding roller 128. Further, the tape 96 from which the release paper 116 has been peeled off is guided to the winding roller 118 via a guide roller 130 disposed at a distance from the drawing-out roller 122 in the Y-axis direction.

[0037] The crimping section 110 includes a pressing roller 132 that is movably disposed in the Y-axis direction and Y-axis feeding means (not shown) for moving the pressing roller 132 in the Y-axis direction. The Y-axis feeding means of the crimping section 110 can be composed of an appropriate drive source (for example, an air drive source or an electric drive source).

[0038] As shown in FIG. 6, the cutting section 112 includes a Z-axis guide member 134 fixed to an appropriate bracket (not shown) and extending in the Z-axis direction, a Z-axis movable member 136 supported by the Z-axis guide member 134 so as to be movable in the Z-axis direction, and Z-axis feeding means (not shown) for moving the Z-axis movable member 136 in the Z-axis direction. The Z-axis feeding means of the cutting section 112 may have a configuration including a ball screw connected to the Z-axis movable member 136 and extending in the Z-axis direction and a motor for rotating this ball screw.

[0039] Further, the cutting portion 112 includes a motor 138 fixed to the lower surface of the tip of the Z-axis movable member 136, and an arm piece 140 rotated by the motor 138 about an axis extending in the Z-axis direction. First and second hanging pieces 142a and 142b are attached to the lower surface of the arm piece 140 at intervals from each other. A circular cutter 144 is rotatably supported on the first hanging piece 142a about an axis orthogonal to the Z-axis direction, and a pressing roller 146 is rotatably supported on the second hanging piece 142b about an axis orthogonal to the Z-axis direction.

[0040] Before the frame table 70 that has received the frame 64 from the frame carrying-out means 68 is positioned from the lowered position (the position shown in Fig. 6(a)) to the raised position (the position shown in Fig. 6(b)), the tape sticking means 98 pulls out the unused tape 96 by the pulling roller 122 and the driven roller 124. Then, the frame table 70 is positioned at the raised position so that the tape 96 can be pressed against the frame 64 by the pressing roller 132 of the crimping portion 110, and the frame 64 is brought into contact with the pressing roller 132 via the tape 96. Then, while pressing the adhesive surface of the tape 96 against the frame 64 with the pressing roller 132, the pressing roller 132 is rolled in the Y-axis direction. Thereby, the tape 96 pulled out from the roll tape 96R by the tape pulling-out portion 108 can be crimped to the frame 64.

[0041] After the tape 96 is crimped to the frame 64, the tape attaching means 98 lowers the Z-axis movable member 136 of the cutting portion 112 by the Z-axis feeding means, presses the cutter 144 against the tape 96 on the frame 64, and presses the frame 64 from above the tape 96 with the pressing roller 146. Next, the arm piece 140 is rotated by the motor 138, and the cutter 144 and the pressing roller 146 are moved along the frame 64 so as to draw a circle. As a result, the tape 96 protruding beyond the outer periphery of the frame 64 can be cut along the frame 64. Further, since the frame 64 is pressed from above the tape 96 by the pressing roller 146, displacement of the frame 64 and the tape 96 is prevented when the tape 96 is being cut. Then, after the frame table 70 is lowered, the used tape 96 having a circular opening 120 formed therein that hits the portion attached to the frame 64 is wound up by the tape winding portion 106.

[0042] As shown in FIG. 5, the taped frame conveying stage 100 includes a Y-axis guide member 148 fixed to an appropriate bracket (not shown) and extending in the Y-axis direction, a Y-axis movable member 150 supported by the Y-axis guide member 148 so as to be movable in the Y-axis direction, a Y-axis feeding means (not shown) for moving the Y-axis movable member 150 in the Y-axis direction, a Z-axis movable member 152 supported by the Y-axis movable member 150 so as to be movable in the Z-axis direction, and a Z-axis feeding means (not shown) for moving the Z-axis movable member 152 in the Z-axis direction. The Y-axis feeding means of the taped frame conveying stage 100 may be configured to include a ball screw connected to the Y-axis movable member 150 and extending in the Y-axis direction, and a motor for rotating this ball screw. The Z-axis feeding means may be configured to include a ball screw connected to the Z-axis movable member 152 and extending in the Z-axis direction, and a motor for rotating this ball screw.

[0043] The Z-axis movable member 152 of the taped frame conveying means 100 has a holding portion 154 for holding the taped frame 64'. The holding portion 154 of the illustrated embodiment has a rectangular substrate 156 and a plurality of suction pads 158 provided on the lower surface of the substrate 156, and each suction pad 158 is connected to a suction means (not shown).

[0044] The tape-attached frame conveying means 100 holds the upper surface of the tape-attached frame 64' supported on the frame table 70 with the adhesive surface of the tape 96 facing downward by the suction pads 158 of the holding portion 154, and by moving the Y-axis movable member 150 and the Z-axis movable member 152, conveys the tape-attached frame 64' held by the holding portion 154 from the frame table 70 to the wafer table 12, positions the opening 64a of the frame 64 on the back surface 4b of the wafer 4 supported on the wafer table 12, and places the tape-attached frame 64' on the wafer table 12.

[0045] The tape pressing means 102 will be described with reference to FIGS. 7 to 9. As shown in FIG. 7, the tape pressing means 102 includes an upper chamber 160 disposed above the wafer table 12, a lower chamber 162 that houses the wafer table 12, a lifting mechanism 164 that generates a closed state in which the upper chamber 160 is lifted and brought into contact with the lower chamber 162 and an open state in which it is separated from the lower chamber 162, a vacuum portion 166 that evacuates the upper chamber 160 and the lower chamber 162 in the closed state, and an atmosphere release portion 168 that opens the upper chamber 160 and the lower chamber 162 to the atmosphere.

[0046] The upper chamber 160 of the illustrated embodiment includes, as shown in FIG. 7, a circular top plate 170 and a cylindrical side wall 172 that hangs down from the periphery of the top plate 170. A lifting mechanism 164 that can be composed of an appropriate actuator such as an air cylinder is mounted on the upper surface of the top plate 170. In the accommodation space defined by the lower surface of the top plate 170 and the inner peripheral surface of the side wall 172, there are disposed a pressing roller 174 for pressing the tape 96 of the tape-attached frame 64' against the back surface 4b of the wafer 4 supported on the wafer table 12, a support piece 176 that rotatably supports the pressing roller 174, and a Y-axis feeding means 178 that moves the support piece 176 in the Y-axis direction.

[0047] The Y-axis feed means 178 has a ball screw 180 connected to the support piece 176 and extending in the Y-axis direction, and a motor 182 for rotating the ball screw 180. Then, the Y-axis feed means 178 converts the rotational motion of the motor 182 into linear motion by the ball screw 180 and transmits it to the support piece 176, and moves the support piece 176 along a pair of guide rails 184 extending in the Y-axis direction.

[0048] As shown in FIG. 7, the lower chamber 162 has a cylindrical side wall 186. The upper part of the side wall 186 is open, and the lower part of the side wall 186 is closed. A connection opening 188 is formed in the side wall 186. A vacuum part 166 that can be constituted by an appropriate vacuum pump is connected to the connection opening 188 via a flow path 190. An atmosphere release part 168 that can be constituted by an appropriate valve capable of opening the flow path 190 to the atmosphere is provided in the flow path 190.

[0049] With the tape 96 of the tape-attached frame 64' positioned on the back surface 4b of the wafer 4 supported by the wafer table 12, the tape pressing means 102 lowers the upper chamber 160 by the elevating mechanism 164, and brings the lower end of the side wall 172 of the upper chamber 160 into contact with the upper end of the side wall 186 of the lower chamber 162 to close the upper chamber 160 and the lower chamber 162, and at the same time, brings the pressing roller 174 into contact with the tape-attached frame 64'.

[0050] Next, with the valve constituting the atmosphere release part 168 closed, the tape pressing means 102 operates the vacuum pump constituting the vacuum part 166 to evacuate the inside of the upper chamber 160 and the lower chamber 162. Then, as shown in FIGS. 8 and 9, by rolling the pressing roller 174 in the Y-axis direction by the Y-axis feed means 178, the tape 96 is pressed onto the back surface 4b of the wafer 4 to generate the frame unit U.

[0051] When the tape 96 is pressed against the back surface 4b of the wafer 4 by the pressing roller 174, a slight gap is formed between the wafer 4 and the tape 96 at the base of the ring-shaped reinforcing portion 24. However, since the wafer 4 and the tape 96 are pressed while the interiors of the upper chamber 160 and the lower chamber 162 are evacuated, the pressure in the slight gap between the wafer 4 and the tape 96 is lower than the atmospheric pressure. When the atmosphere release portion 168 is opened after the tape 96 is pressed, the tape 96 is pressed against the wafer 4 by the atmospheric pressure. As a result, the gap between the wafer 4 and the tape 96 at the base of the reinforcing portion 24 disappears, and the tape 96 adheres closely to the back surface 4b of the wafer 4 along the base of the reinforcing portion 24.

[0052] As shown in FIGS. 1 and 10, the processing apparatus 2 further includes a frame unit carrying-out means 192 for carrying out from the wafer table 12 a frame unit U in which the tape 96 of the tape-attached frame 64' and the back surface 4b of the wafer 4 are pressed together by the tape pressing means 102, a reinforcing portion removing means 194 for cutting and removing the ring-shaped reinforcing portion 24 from the wafer 4 of the frame unit U carried out by the frame unit carrying-out means 192, a protective film coating means 195 for coating a protective film on the region of the wafer 4 irradiated with the laser beam, a ringless unit carrying-out means 196 (see FIG. 1) for carrying out from the reinforcing portion removing means 194 a ringless unit from which the ring-shaped reinforcing portion 24 has been removed, and a frame cassette table 200 (see FIG. 1) on which a frame cassette 198 for accommodating the ringless unit carried out by the ringless unit carrying-out means 196 is placed.

[0053] As shown in FIG. 10, the frame unit carrying-out means 192 of the illustrated embodiment includes a frame unit holding portion 202 including a wafer holding portion 202a for holding the wafer 4 and a frame holding portion 202b for holding the frame 64, and a conveying portion 206 for conveying the frame unit holding portion 202 to the temporary placement table 204.

[0054] The wafer holding portion 202a of the frame unit holding portion 202 includes a circular substrate 208 and a circular suction piece 210 attached to the lower surface of the substrate 208. A plurality of suction holes (not shown) are formed in the lower surface of the suction piece 210, and each suction hole is connected to a suction means (not shown). The frame holding portion 202b includes a plurality (four in the illustrated embodiment) of protruding pieces 212 that protrude radially outward at intervals in the circumferential direction from the periphery of the substrate 208 of the wafer holding portion 202a, and suction pads 214 attached to the lower surfaces of the protruding pieces 212. Each suction pad 214 is connected to a suction means (not shown).

[0055] The transfer unit 206 includes an X-axis guide member 216 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 218 supported by the X-axis guide member 216 so as to be movable in the X-axis direction, an X-axis feed means (not shown) for moving the X-axis movable member 218 in the X-axis direction, a Z-axis movable member 220 supported by the X-axis movable member 218 so as to be movable in the Z-axis direction, a Z-axis feed means (not shown) for moving the Z-axis movable member 220 in the Z-axis direction, a Y-axis movable member 222 supported by the Z-axis movable member 220 so as to be movable in the Y-axis direction, and a Y-axis feed means (not shown) for moving the Y-axis movable member 222 in the Y-axis direction. The substrate 208 of the wafer holding portion 202a is connected to the tip of the Y-axis movable member 222. Each of the X-axis, Y-axis, and Z-axis feed means of the transfer unit 206 may be configured to have a ball screw and a motor for rotating the ball screw.

[0056] The frame unit unloading means 192 preferably includes a two-dimensional movement mechanism that moves the frame unit holding portion 202 two-dimensionally in the horizontal direction, and an imaging unit 224 that images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding portion 202. In the illustrated embodiment, the frame unit holding portion 202 moves two-dimensionally in the horizontal direction in the XY plane by the X-axis feed means and the Y-axis feed means of the transport unit 206, and the two-dimensional movement mechanism is constituted by the transport unit 206. Further, the imaging unit 224 of the illustrated embodiment is disposed between the wafer table 12 and the temporary placement table 204, and images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding portion 202 from below the wafer 4.

[0057] The frame unit unloading means 192 sucks and holds the wafer 4 from the back surface 4b side (tape 96 side) by the suction piece 210 of the wafer holding portion 202a, and while sucking and holding the frame 64 by the suction pad 214 of the frame holding portion 202b, operates the transport unit 206 to unload the frame unit U held by the frame unit holding portion 202 from the wafer table 12.

[0058] Further, the frame unit unloading means 192 of the illustrated embodiment operates the transport unit 206 that constitutes the two-dimensional movement mechanism, images at least three points on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding portion 202 with the imaging unit 224, measures the coordinates of at least three points on the outer periphery of the wafer 4, and obtains the center coordinates of the wafer 4 based on the measured coordinates of the three points. Then, the frame unit unloading means 192 aligns the center of the wafer 4 with the center of the temporary placement table 204 and temporarily places the frame unit U on the temporary placement table 204.

[0059] As shown in FIG. 10, the temporary table 204 is arranged at a distance from the wafer table 12 in the X-axis direction. The temporary table 204 of the illustrated embodiment includes an annular support portion 226 that supports the outer peripheral surplus region 20 of the wafer 4 of the frame unit U and is non-contact with the portion inside the outer peripheral surplus region 20, and a frame support portion 228 that is disposed on the outer periphery of the annular support portion 226 and supports the frame 64.

[0060] The radially inner portion than the annular support portion 226 is a circular recess 230 that is recessed downward. The frame support portion 228 of the temporary table 204 is provided with a heater (not shown). By heating the tape 96 of the frame unit U temporarily placed on the temporary table 204 with the heater, the tape 96 is softened, and it is preferable that the tape 96 is further adhered to the base of the ring-shaped reinforcing portion 24 by atmospheric pressure.

[0061] The processing apparatus 2 of the illustrated embodiment includes a temporary table transfer portion 232 that transfers the temporary table 204 in the Y-axis direction. The temporary table transfer portion 232 includes a Y-axis guide member 234 that extends in the Y-axis direction, a Y-axis movable member 236 that is supported by the Y-axis guide member 234 so as to be movable in the Y-axis direction, and a Y-axis feed means 238 that moves the Y-axis movable member 236 in the Y-axis direction. The temporary table 204 is fixed to the upper portion of the Y-axis movable member 236. The Y-axis feed means 238 has a ball screw 240 that is connected to the Y-axis movable member 236 and extends in the Y-axis direction, and a motor 242 that rotates the ball screw 240. Then, the temporary table transfer portion 232 converts the rotational motion of the motor 242 into a linear motion by the ball screw 240 and transmits it to the Y-axis movable member 236, and transfers the temporary table 204 in the Y-axis direction together with the Y-axis movable member 236.

[0062] As shown in FIG. 11, the protective film coating means 195 includes a tank 400 that stores a liquid resin, a pump 402 that sends out a predetermined amount of the liquid resin from the tank 400, and a coating nozzle 404 that coats the region of the wafer 4 irradiated with the laser beam with the liquid resin sent out from the pump 402.

[0063] The tank 400 contains a water-soluble liquid resin such as PVA (polyvinyl alcohol). The tank 400 in the illustrated embodiment is in the shape of a hollow rectangular parallelepiped, and a lid 406 covering the supply port is attached to the upper surface of the tank 400, and a pump 402 is mounted thereon. The pump 402 is connected to the coating nozzle 404 via a liquid supply pipe 408.

[0064] The pump 402 is configured to suck up a predetermined amount of the liquid resin from the tank 400 by pushing down the pump head 402a downward and send it out to the coating nozzle 404 through the liquid supply pipe 408. Note that the form of the pump 402 is not limited to the push type that pushes down the pump head 402a, and various known forms can be adopted.

[0065] As can be understood by referring to FIG. 12, the coating nozzle 404 is equipped with an immersion device 410 that immerses the tip 404a of the coating nozzle 404 so that the tip 404a does not dry out. As shown enlarged in FIG. 12, the opening 404b at the tip 404a of the coating nozzle 404 is in the shape of a slender slit. The immersion device 410 has a circular bottom plate 412 and a cylindrical side wall 414 extending upward from the periphery of the bottom plate 412, and is fixed via an appropriate bracket (not shown). An opening 412a is formed in the central portion of the bottom plate 412, and the coating nozzle 404 passes through the opening 412a of the bottom plate 412 and extends in the vertical direction. A conical bellows-shaped rubber cover 416 that extends radially inward upward from the periphery of the opening 412a is attached to the bottom plate 412, and the rubber cover 416 prevents the water 418 stored inside the immersion device 410 from leaking from the opening 412a.

[0066] As shown in FIGS. 11 and 12, the coating nozzle 404 is equipped with lifting means 420 for raising and lowering the coating nozzle 404. The lifting means 420 of the illustrated embodiment includes a connecting piece 422 that is connected to the coating nozzle 404 and extends substantially horizontally, and an actuator 424 for raising and lowering the connecting piece 422. The actuator 424 may be, for example, an air cylinder or an electric cylinder. The lifting means 420 raises and lowers the coating nozzle 404 between a lowered position (the position shown by the solid line in FIG. 12) where the tip 404a of the coating nozzle 404 is located below the water surface of the immersion unit 410 and a raised position (the position shown by the two-dot chain line in FIG. 12) where the tip 404a of the coating nozzle 404 is located above the water surface of the immersion unit 410. Then, when coating the region of the wafer 4 with the liquid resin discharged from the tip 404a of the coating nozzle 404 and irradiated with the laser beam when forming the cutting groove at the base of the ring-shaped reinforcing portion 24, the coating nozzle 404 is positioned at the raised position, and when the coating of the liquid resin on the wafer 4 is completed, the coating nozzle 404 is positioned at the lowered position so that the tip 404a of the coating nozzle 404 does not dry out.

[0067] As shown in FIGS. 1 and 10, the reinforcing portion removing means 194 includes a laser beam irradiation means 244 for irradiating a laser beam toward the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4 to form a cutting groove, a first elevating table 246 (see FIG. 1) for holding and raising the frame unit U temporarily placed on the temporary placement table 204 and moving it in the X-axis direction to position it relative to the laser beam irradiation means 244, and a separating portion 248 for separating the ring-shaped reinforcing portion 24 from the cutting groove.

[0068] As shown in FIG. 10, the laser beam irradiation means 244 includes a housing 250 disposed adjacent to the temporary table 204 in the X-axis direction, an oscillator (not shown) housed in the housing 250 that oscillates a laser beam, a condenser 252 that condenses the laser beam oscillated by the oscillator and irradiates the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4, a suction nozzle 254 that sucks debris generated when the wafer 4 is irradiated with the laser beam, and a suction means (not shown) connected to the suction nozzle 254.

[0069] The condenser 252 extends obliquely upward from the upper surface of the housing 250 toward the suction nozzle 254 side, thereby suppressing the debris generated during the irradiation of the laser beam from falling onto the condenser 252. Further, the suction nozzle 254 extends obliquely upward from the upper surface of the housing 250 toward the condenser 252 side.

[0070] As shown in FIG. 14, the laser beam irradiation means 244 irradiates the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4 with a laser beam LB while rotating the frame unit U held by the first elevating table 246, and forms a ring-shaped cutting groove 256 along the base of the reinforcing portion 24 by ablation processing. Further, the laser beam irradiation means 244 sucks the debris generated by the ablation processing by the suction nozzle 254.

[0071] As shown in FIG. 1, the first elevating table 246 is disposed above the temporary placement table 204 and is movable in the X-axis direction and the Z-axis direction. Referring to FIG. 11 for explanation, the first elevating table 246 includes an X-axis guide member 258 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 260 supported by the X-axis guide member 258 so as to be movable in the X-axis direction, an X-axis feed means (not shown) for moving the X-axis movable member 260 in the X-axis direction, a Z-axis movable member 262 supported by the X-axis movable member 260 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 262 in the Z-axis direction. Each of the X-axis and Z-axis feed means of the first elevating table 246 may be configured to include a ball screw and a motor for rotating the ball screw.

[0072] A support shaft 264 extending downward is rotatably supported on the lower surface of the tip of the Z-axis movable member 262, and a motor 266 for rotating the support shaft 264 about an axis extending in the Z-axis direction is attached to the upper surface of the tip of the Z-axis movable member 262. A circular suction piece 268 is fixed to the lower end of the support shaft 264. A plurality of suction holes (not shown) are formed at intervals in the circumferential direction on the lower surface of the suction piece 268 on a circumference corresponding to the size of the frame 64, and each suction hole is connected to a suction means.

[0073] After the first elevating table 246 sucks and holds the frame 64 portion of the frame unit U in which the tape 96 is heated by the heater of the frame holding portion 228 of the temporary placement table 204 and the tape 96 is in close contact with the base of the ring-shaped reinforcing portion 24 by the suction piece 268, the Z-axis movable member 262 and the X-axis movable member 260 are moved, and the frame unit U sucked and held by the suction piece 268 is lifted and moved in the X-axis direction. After being positioned above the protective film covering means 195, it is positioned above the laser beam irradiation means 244. When the frame 64 is formed of a magnetic material, an electromagnet (not shown) may be attached to the lower surface of the suction piece 268 so that the suction piece 268 sucks the frame 64 by magnetic force.

[0074] Further, when the liquid resin is coated on the region of the wafer 4 irradiated with the laser beam LB by the protective film coating means 195, or when the wafer 4 is irradiated with the laser beam LB by the laser beam irradiation means 244, the first elevating table 246 operates the motor 266 to rotate the frame unit U sucked and held by the suction piece 268. Further, the first elevating table 246 moves the frame unit U having the cutting groove 256 formed at the base of the reinforcing portion 24 in the X-axis direction and the Z-axis direction and temporarily places it on the temporary placement table 204.

[0075] As shown in FIG. 1, the separation unit 248 is arranged at an interval in the Y-axis direction from the first elevating table 246 within the movable range of the temporary placement table 204 in the Y-axis direction. Referring to FIGS. 15 and 17 for explanation, the separation unit 248 includes an ultraviolet irradiation unit 270 (see FIG. 15) that irradiates ultraviolet rays on the tape 96 corresponding to the cutting groove 256 to reduce the adhesive force of the tape 96, a second elevating table 272 (see FIG. 15) that exposes the outer periphery of the ring-shaped reinforcing portion 24 to suck and hold the inside of the wafer 4 and supports the frame 64, a separator 274 (see FIG. 15) that acts on the outer periphery of the ring-shaped reinforcing portion 24 to separate the ring-shaped reinforcing portion 24, and a waste portion 276 (see FIG. 17) where the separated ring-shaped reinforcing portion 24 is discarded.

[0076] As shown in FIG. 15, the separation unit 248 of the illustrated embodiment includes a Z-axis guide member 278 fixed to an appropriate bracket (not shown) and extending in the Z-axis direction, a Z-axis movable member 280 supported by the Z-axis guide member 278 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 280 in the Z-axis direction. The Z-axis feed means may have a configuration including a ball screw connected to the Z-axis movable member 280 and extending in the Z-axis direction, and a motor for rotating this ball screw.

[0077] A support piece 282 is supported on the lower surface of the tip of the Z-axis movable member 280, and a support shaft 286 is rotatably supported. The second elevating table 272 is connected to the support shaft 286. A motor 284 for rotating the second elevating table 272 together with the support shaft 286 is attached to the upper surface of the tip of the Z-axis movable member 280. A pair of the ultraviolet irradiation units 270 are attached to the support piece 282 at intervals in the Y-axis direction in the illustrated embodiment.

[0078] The second elevating table 272 is circular, and the diameter of the second elevating table 272 is slightly smaller than the diameter of the device region 18 (the portion inside the ring-shaped reinforcing portion 24) of the wafer 4. A plurality of suction holes (not shown) are formed on the lower surface of the second elevating table 272, and each suction hole is connected to a suction means.

[0079] Further, the separator 274 is attached to the support piece 282. The separator 274 includes a pair of movable pieces 288 movably arranged in the longitudinal direction of the support piece 282 at intervals on the lower surface of the support piece 282, and a pair of feeding means 290 for moving the pair of movable pieces 288. Each of the pair of feeding means 290 can be constituted by an appropriate actuator such as an air cylinder or an electric cylinder.

[0080] The separator 274 includes a pair of clamping rollers 292a, 292b supported by the respective movable pieces 288 at intervals in the vertical direction, and a Z-axis feeding means 294 for moving the upper clamping roller 292a in the Z-axis direction. The Z-axis feeding means 294 can be constituted by an appropriate actuator such as an air cylinder or an electric cylinder. Each of the clamping rollers 292a, 292b is rotatably supported by the movable piece 288 about an axis extending in the Y-axis direction. A pressing roller 298 is attached to the upper clamping roller 292a via a support shaft 296.

[0081] Referring to FIG. 17, the disposal unit 276 includes a belt conveyor 300 that conveys the separated ring-shaped reinforcing portion 24, and a dust box 302 that houses the ring-shaped reinforcing portion 24 conveyed by the belt conveyor 300. The belt conveyor 300 is positioned by an appropriate actuator (not shown) at a substantially horizontally extending recovery position (the position shown by the solid line in FIG. 17) and a substantially vertically extending standby position (the position shown by the two-dot chain line in FIG. 17). On the front side surface of the dust box 302 in the X-axis direction in FIG. 17, a door 304 with a handle 304a attached is provided. Inside the dust box 302, a crusher (not shown) for crushing the recovered ring-shaped reinforcing portion 24 is attached. In the dust box 302, by gripping the handle 304a and opening the door 304, the crushed debris of the ring-shaped reinforcing portion 24 housed in the dust box 302 can be taken out.

[0082] When the temporary placement table 204 on which the frame unit U with the cutting groove 256 formed at the base of the reinforcing portion 24 is temporarily placed is positioned below the separation unit 248 by the temporary placement table conveying unit 232, as shown in FIG. 16, the separation unit 248 sucks and holds the back surface 4b side of the wafer 4 of the frame unit U by the second lifting table 272, and after sandwiching the frame 64 with the sandwiching rollers 292a and 292b of the separator 274, irradiates ultraviolet rays from the pair of ultraviolet irradiation units 270 to reduce the adhesive force of the tape 96 attached to the ring-shaped reinforcing portion 24. While pressing the ring-shaped reinforcing portion 24 downward with the pressing roller 298, the frame unit U is rotated together with the support shaft 286 and the second lifting table 272 by the motor 284 with respect to the separator 274, thereby separating the ring-shaped reinforcing portion 24 from the frame unit U. The separated reinforcing portion 24 is conveyed to the dust box 302 by the belt conveyor 300 and recovered. When separating the reinforcing portion 24, the separator 274 may be rotated with respect to the frame unit U.

[0083] As shown in FIG. 1, the ringless unit unloading means 196 is disposed adjacent to the reinforcing portion removing means 194. Referring to FIGS. 18 and 19, the ringless unit unloading means 196 of the illustrated embodiment includes a frame holding portion 306 that faces the ringless unit supported by the second lifting table 272 and holds the frame 64, and moves toward the frame cassette table 200 while inverting the frame holding portion 306 (see FIG. 18), an inversion mechanism 308, a ringless unit support portion 310 that supports the ringless unit inverted by the inversion mechanism 308 with the surface 4a of the wafer 4 facing upward (see FIG. 19), and a pushing portion 312 that enters and accommodates the ringless unit supported by the ringless unit support portion 310 into the frame cassette 198 placed on the frame cassette table 200 (see FIG. 19).

[0084] As shown in FIG. 18, the inversion mechanism 308 includes a Y-axis guide member 314 extending in the Y-axis direction, a Y-axis movable member 316 movably supported by the Y-axis guide member 314 in the Y-axis direction, a Y-axis feeding means (not shown) for moving the Y-axis movable member 316 in the Y-axis direction, an arm 318 movably supported by the Y-axis movable member 316 in the Z-axis direction, and a Z-axis feeding means (not shown) for moving the arm 318 in the Z-axis direction. Each of the Y-axis and Z-axis feeding means of the inversion mechanism 308 may be configured to include a ball screw and a motor for rotating the ball screw.

[0085] The frame holding portion 306 is supported by the arm 318 so as to be vertically invertible, and a motor 320 for vertically inverting the frame holding portion 306 is attached thereto. The frame holding portion 306 of the illustrated embodiment includes a substrate 324 rotatably supported by the arm 318 via a pair of rotating shafts 322, and a plurality of suction pads 326 attached to one side of the substrate 324. Each suction pad 326 is connected to a suction means (not shown). One of the rotating shafts 322 is connected to the motor 320.

[0086] With the suction pad 326 facing upward, the inversion mechanism 308 sucks and holds the lower surface of the frame 64 of the unit U' without a ring supported by the second lifting table 272 with the suction pad 326, and receives the unit U' without a ring from the second lifting table 272. Further, the inversion mechanism 308 rotates the frame holding portion 306 by the motor 320 so that the surface 4a of the wafer 4 faces upward, and then moves the Y-axis movable member 316 to move the unit U' without a ring held by the frame holding portion 306 toward the frame cassette table 200.

[0087] As shown in FIG. 19, the unit U' without a ring support portion 310 of the illustrated embodiment includes a pair of support plates 328 movably supported in the X-axis direction via appropriate brackets (not shown), and spacing adjustment means (not shown) for adjusting the spacing between the pair of support plates 328 in the X-axis direction. The spacing adjustment means can be constituted by an appropriate actuator such as an air cylinder or an electric cylinder.

[0088] A heater (not shown) is attached to the pair of support plates 328 that support the unit U' without a ring. In a state where the spacing between the pair of support plates 328 is narrowed, the pair of support plates 328 extend the slack and wrinkles of the tape 96 caused by the removal of the reinforcing portion 24 by heating the tape 96 of the unit U' without a ring with the heater.

[0089] Continuing the description with reference to FIG. 19, the pushing-in portion 312 of the illustrated embodiment includes a Y-axis guide member 330 extending in the Y-axis direction, a Y-axis movable member 332 movably supported by the Y-axis guide member 330 in the Y-axis direction, and Y-axis feed means (not shown) for moving the Y-axis movable member 332 in the Y-axis direction. The Y-axis movable member 332 has a base portion 334 supported by the Y-axis guide member 330, a support column 336 extending upward from the upper surface of the base portion 334, and a pressing piece 338 attached to the upper end of the support column 336. The Y-axis feed means of the pushing-in portion 312 may have a configuration including a ball screw connected to the Y-axis movable member 332 and extending in the Y-axis direction, and a motor for rotating this ball screw.

[0090] As shown in FIG. 20, before receiving the ringless unit U', the ringless unit support portion 310 expands the interval between the pair of support plates 328 by the interval adjusting means, and then receives the ringless unit U' held by the suction pad 326. Then, when the ringless unit support portion 310 receives the ringless unit U', the pushing portion 312 moves the Y-axis movable member 332 in the Y-axis direction by the Y-axis feed means, so that the ringless unit U' supported by the ringless unit support portion 310 is pressed by the pressing piece 338 and enters and is accommodated in the frame cassette 198 placed on the frame cassette table 200.

[0091] In the frame cassette 198 shown in FIGS. 1 and 20, a plurality of ringless units U' are accommodated at intervals in the vertical direction with the surface 4a of the wafer 4 facing upward. As shown in FIGS. 19 and 20, the frame cassette table 200 includes a placement portion 340 on which the frame cassette 198 is placed, and a lifting portion 342 that lifts the placement portion 340 to position it at an arbitrary height. The lifting portion 342 may have a configuration including a ball screw connected to the placement portion 340 and extending in the Z-axis direction, and a motor that rotates the ball screw.

[0092] Next, using the processing apparatus 2 as described above, a dicing tape 96 is adhered to the back surface 4b of the wafer 4 having a ring-shaped reinforcing portion 24 formed in a convex shape on the back surface 4b corresponding to the outer peripheral surplus region 20 so as to be integrated with the frame 64, and a processing method for cutting the ring-shaped reinforcing portion 24 and removing it from the wafer 4 will be described.

[0093] In the illustrated embodiment, first, as shown in FIGS. 1 and 3, a wafer cassette placing step of placing a wafer cassette 6 containing a plurality of wafers 4 on a wafer cassette table 8 is performed. In the cassette 6, a plurality of wafers 4 are accommodated at intervals in the vertical direction with the surface 4a facing upward.

[0094] Also, as shown in FIGS. 1 and 5, a frame accommodating step is performed in which a plurality of ring-shaped frames 64 each having an opening 64a for accommodating a wafer 4 are accommodated in frame accommodating means 66. The frame accommodating step may be performed before the wafer cassette placing step or after the wafer cassette placing step.

[0095] In the frame accommodating step, after lowering the elevating plate 74 of the frame accommodating means 66 to an arbitrary position, the handle 76a is grasped to open the door 76, and a plurality of frames 64 are stacked and accommodated on the upper surface of the elevating plate 74. Also, the height of the elevating plate 74 is adjusted as appropriate, and the uppermost frame 64 is positioned at a position where it can be carried out by the frame carrying-out means 68.

[0096] After performing the wafer cassette placing step and the frame accommodating step, a wafer carrying-out step is performed in which the wafer 4 is carried out from the wafer cassette 6 placed on the wafer cassette table 8.

[0097] Referring to FIG. 3 for explanation, in the wafer carrying-out step, first, the Y-axis feeding means 34 of the wafer carrying-out means 10 is operated to position the Y-axis movable member 32 near the wafer cassette table 8. Next, the transfer arm 42 is driven to position a hand 44 with an air ejection port 46 facing upward on the back surface 4b side (lower side) of the wafer 4 in the wafer cassette 6. When the hand 44 is positioned on the back surface 4b side of the wafer 4, there is a gap between the back surface 4b of the wafer 4 and the hand 44, and each guide pin 48 is positioned radially outward.

[0098] Next, compressed air is ejected from the air ejection port 46 of the hand 44 to generate a negative pressure on one side of the hand 44 by the Bernoulli effect, and the wafer 4 is sucked and supported non-contact from the back surface 4b side by the hand 44. Next, each guide pin 48 is moved radially inward, and the horizontal movement of the wafer 4 sucked and supported by the hand 44 is restricted by each guide pin 48. Then, the Y-axis movable member 32 and the transfer arm 42 of the wafer carrying-out means 10 are moved to carry out the wafer 4 sucked and supported by the hand 44 from the wafer cassette 6.

[0099] After performing the wafer unloading process, it is preferable to perform a notch detection process for detecting the position of the notch 26 of the wafer 4. In the notch detection process, as shown in FIG. 4, the outer periphery of the wafer 4 sucked and supported by the hand 44 is positioned between the light emitting element 52 and the light receiving element 54 of the notch detection means 50. Then, the wafer 4 is rotated via the guide pin 48 by the drive source, thereby detecting the position of the notch 26 of the wafer 4. As a result, the orientation of the wafer 4 can be adjusted to an arbitrary orientation.

[0100] After performing the notch detection process, a wafer support process is performed in which the surface 4a side of the wafer 4 unloaded by the wafer unloading means 10 is supported by the wafer table 12.

[0101] Referring to FIG. 3, in the wafer support process, first, the hand 44 of the wafer unloading means 10 is turned upside down so that the surface 4a of the wafer 4 faces downward. Next, the Y-axis movable member 32 and the transfer arm 42 of the wafer unloading means 10 are moved so that the outer peripheral surplus region 20 of the surface 4a of the wafer 4 sucked and supported by the hand 44 contacts the annular support portion 56 of the wafer table 12. At this time, since the device region 18 of the surface 4a of the wafer 4 is located in the recess 62 of the wafer table 12, the device 14 and the wafer table 12 do not come into contact with each other, and damage to the device 14 is prevented.

[0102] Next, the suction means of the wafer table 12 is operated to generate a suction force in each suction hole 60, thereby sucking and holding the outer peripheral surplus region 20 of the surface 4a of the wafer 4. Next, the suction support of the wafer 4 by the hand 44 is released, and the hand 44 is separated from the wafer table 12. In this way, the wafer 4 is transferred from the wafer unloading means 10 to the wafer table 12. Since the wafer 4 transferred to the wafer table 12 is sucked and held by each suction hole 60, the position of the wafer 4 does not shift.

[0103] After performing the wafer cassette placement process and the frame accommodation process, a frame unloading process of unloading the frame 64 from the frame accommodation means 66 is performed in parallel with the wafer unloading process and the wafer support process.

[0104] Referring to FIG. 5 for explanation, in the frame unloading process, first, the X-axis movable member 84 and the Z-axis movable member 86 of the frame unloading means 68 are moved, and the suction pad 92 of the holding portion 88 is brought into contact with the upper surface of the uppermost frame 64 accommodated in the frame accommodation means 66. Next, the suction means of the frame unloading means 68 is operated to generate a suction force on the suction pad 92, thereby suction-holding the uppermost frame 64 with the suction pad 92. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame unloading means 68 are moved, and the uppermost frame 64 suction-held by the suction pad 92 of the holding portion 88 is unloaded from the frame accommodation means 66.

[0105] After performing the frame unloading process, a frame support process of supporting the frame 64 unloaded by the frame unloading means 68 with the frame table 70 is performed.

[0106] Continuing the explanation with reference to FIG. 5, in the frame support process, first, the X-axis movable member 84 and the Z-axis movable member 86 of the frame unloading means 68 are moved, and the frame 64 suction-held by the suction pad 92 is brought into contact with the upper surface of the frame table 70. At this time, the frame table 70 is positioned at the lowered position (the position shown by the solid line in FIG. 5). Next, the suction force of the suction pad 92 of the frame unloading means 68 is released, and the frame 64 is placed on the frame table 70. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame unloading means 68 are moved, and the holding portion 88 is separated from above the frame table 70.

[0107] After performing the frame support process, a tape sticking process of sticking the tape 96 to the frame 64 is performed.

[0108] Referring to FIG. 6, in the tape sticking process, first, before moving the frame table 70 from the lowered position (the position shown in FIG. 6(a)) to the raised position (the position shown in FIG. 6(b)) where the tape 96 can be stuck to the frame 64, the tape 96 is pulled out from the roll tape 96R and the tape 96 with the release paper 116 peeled off is positioned above the frame table 70. Note that the adhesive surface of the tape 96 positioned above the frame table 70 faces downward.

[0109] Next, the frame table 70 is raised to such an extent that the tape 96 can be pressed against the frame 64 from above by the pressing roller 132 of the crimping portion 110 of the tape sticking means 98. Then, while pressing the adhesive surface of the tape 96 against the frame 64 with the pressing roller 132, the pressing roller 132 is rolled in the Y-axis direction. Thereby, the tape 96 pulled out from the roll tape 96R by the tape pulling portion 108 can be crimped to the frame 64.

[0110] Next, the cutter 144 and the pressing roller 146 of the cutting portion 112 of the tape sticking means 98 are lowered, the cutter 144 is pressed against the tape 96 on the frame 64, and the frame 64 is pressed from above the tape 96 with the pressing roller 146. Then, the arm piece 140 is rotated by the motor 138, and the cutter 144 and the pressing roller 146 are moved along the frame 64 in a circular motion. Thereby, the tape 96 protruding beyond the outer periphery of the frame 64 can be cut along the frame 64. Also, since the frame 64 is pressed from above the tape 96 with the pressing roller 146, displacement of the frame 64 or the tape 96 is prevented when the tape 96 is being cut. Note that the used tape 96 with the circular opening 120 formed is wound up by the tape winding portion 106.

[0111] After performing the tape attachment process, the frame 64 with the tape 96 attached is conveyed to the wafer table 12, and the opening 64a of the frame 64 is positioned on the back surface 4b of the wafer 4 supported by the wafer table 12, and the tape-attached frame 64' is placed on the wafer table 12 in a tape-attached frame conveyance process.

[0112] In the tape-attached frame conveyance process, first, the frame table 70 is moved from the raised position to the lowered position. Next, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame conveyance means 100 (see FIG. 5.) are moved, and each suction pad 158 of the holding portion 154 of the tape-attached frame conveyance means 100 is brought into contact with the upper surface of the tape-attached frame 64' (see FIG. 7.) supported by the frame table 70 with the adhesive surface of the tape 96 facing downward.

[0113] Next, the suction means of the tape-attached frame conveyance means 100 is operated to generate a suction force on the suction pads 158, thereby suction-holding the upper surface of the tape-attached frame 64' with the suction pads 158. Next, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame conveyance means 100 are moved, and the tape-attached frame 64' suction-held by the suction pads 158 is carried out from the frame table 70.

[0114] Next, the tape-attached frame 64' suction-held by the suction pads 158 of the tape-attached frame conveyance means 100 is conveyed to the wafer table 12, and as shown in FIG. 7, the opening 64a of the frame 64 is positioned on the back surface 4b of the wafer 4 supported by the wafer table 12, and the tape-attached frame 64' is brought into contact with the frame support portion 58 of the wafer table 12. At this time, the adhesive surface of the tape 96 of the tape-attached frame 64' faces downward, and the back surface 4b of the wafer 4 faces upward and faces the adhesive surface of the tape 96.

[0115] Next, the suction force of the suction pad 158 of the tape-attached frame conveying means 100 is released, and the tape-attached frame 64' is placed on the frame support portion 58 of the wafer table 12. Then, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame conveying means 100 are moved to separate the holding portion 154 from above the wafer table 12.

[0116] After performing the tape-attached frame conveying process, a tape pressing process is performed in which the tape 96 of the tape-attached frame 64' is pressed against the back surface 4b of the wafer 4.

[0117] Referring to FIGS. 7 to 9, in the tape pressing process, first, the upper chamber 160 is lowered by the elevating mechanism 164 of the tape pressing means 102, and the lower end of the side wall 172 of the upper chamber 160 is brought into contact with the upper end of the side wall 186 of the lower chamber 162. As a result, the upper chamber 160 and the lower chamber 162 are closed, and the pressing roller 174 is brought into contact with the tape-attached frame 64'. Then, as shown in FIG. 8, the upper end of the ring-shaped reinforcing portion 24 of the wafer 4 adheres to the adhesive surface of the tape 96 of the tape-attached frame 64'.

[0118] Next, with the atmosphere opening portion 168 of the tape pressing means 102 closed, the vacuum portion 166 is operated to evacuate the interiors of the upper chamber 160 and the lower chamber 162. Next, as shown in FIGS. 8 and 9, the pressing roller 174 of the tape pressing means 102 is rolled in the Y-axis direction to press the tape 96 onto the back surface 4b of the wafer 4. Thereby, a frame unit U in which the back surface 4b of the wafer 4 and the tape 96 are pressed together can be generated. Next, the atmosphere opening portion 168 is opened, and the tape 96 is brought into close contact with the back surface 4b of the wafer 4 along the base of the ring-shaped reinforcing portion 24 by atmospheric pressure. Then, the elevating mechanism 164 raises the upper chamber 160. Although the suction force of the wafer 4 by the wafer table 12 is lost by evacuating the interiors of the upper chamber 160 and the lower chamber 162, when the upper chamber 160 and the lower chamber 162 are in a closed state, the upper end of the ring-shaped reinforcing portion 24 of the wafer 4 adheres to the adhesive surface of the tape 96 of the tape-attached frame 64', so the position of the wafer 4 does not shift during the tape pressing process.

[0119] After performing the tape pressing process, a frame unit unloading process is performed to unload the frame unit U in which the tape 96 of the tape-attached frame 64' and the back surface 4b of the wafer 4 are pressed together from the wafer table 12.

[0120] Referring to FIG. 5 for explanation, in the frame unit unloading process, first, the transport portion 206 of the frame unit unloading means 192 is operated, and the lower surface of the suction piece 210 of the wafer holding portion 202a of the frame unit holding portion 202 is brought into contact with the tape 96 on the back surface 4b side of the wafer 4, and the suction pad 214 of the frame holding portion 202b is brought into contact with the frame 64.

[0121] Next, a suction force is generated on the suction piece 210 of the wafer holding part 202a and the suction pad 214 of the frame holding part 202b. The wafer 4 is sucked and held from the back surface 4b side (tape 96 side) by the suction piece 210 of the wafer holding part 202a, and the frame 64 is sucked and held by the suction pad 214 of the frame holding part 202b. Next, the suction holding of the wafer 4 by the wafer table 12 is released. Then, the transfer unit 206 is operated to carry out the frame unit U held by the frame unit holding part 202 from the wafer table 12.

[0122] After performing the frame unit carry-out step, an interim placement step is carried out in which the center of the wafer 4 is aligned with the center of the interim placement table 204 and the frame unit U is intermediately placed on the interim placement table 204.

[0123] Referring to FIG. 10 for explanation, in the interim placement step, first, the frame unit U held by the frame unit holding part 202 is positioned above the imaging unit 224. Next, the transfer unit 206 constituting the two-dimensional movement mechanism of the frame unit carry-out means 192 is operated to image at least three locations on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding part 202 with the imaging unit 224. Thereby, at least three-point coordinates on the outer periphery of the wafer 4 are measured. Next, the center coordinates of the wafer 4 are obtained based on the measured three-point coordinates.

[0124] Next, the transfer unit 206 is operated to position the center of the wafer 4 at the center of the annular support part 226 of the interim placement table 204, and the outer peripheral surplus region 20 of the surface 4a of the wafer 4 is brought into contact with the upper surface of the annular support part 226 of the interim placement table 204, and the lower surface of the frame 64 is brought into contact with the upper surface of the frame support part 228 of the interim placement table 204. At this time, although the surface 4a of the wafer 4 faces downward, since the device region 18 is located in the recess 230 of the interim placement table 204, the device 14 and the interim placement table 204 do not come into contact with each other, and damage to the device 14 is prevented.

[0125] Next, the suction and holding of the wafer 4 by the wafer holding portion 202a is released, and the suction and holding of the frame 64 by the frame holding portion 202b is released, and the frame unit U is transferred from the frame unit carrying means 192 to the temporary placement table 204. Next, the heater of the frame support portion 228 is operated, and the tape 96 of the frame unit U temporarily placed on the temporary placement table 204 is heated by the heater. As a result, the tape 96 is softened and brought into close contact with the base of the ring-shaped reinforcing portion 24 of the wafer 4.

[0126] After performing the temporary placement step, a reinforcing portion removing step is performed in which the ring-shaped reinforcing portion 24 is cut and removed from the wafer 4 of the frame unit U carried out by the frame unit carrying means 192.

[0127] Referring to FIGS. 1, 10, and 11 for description, in the reinforcing portion removing step, first, the X-axis movable member 260 and the Z-axis movable member 262 of the first elevating table 246 of the reinforcing portion removing means 194 are moved so that the lower surface of the suction piece 268 contacts the upper surface of the frame 64 of the frame unit U temporarily placed on the temporary placement table 204. Next, a suction force is generated in each suction hole of the suction piece 268 of the first elevating table 246 to suction and hold the frame 64 portion of the frame unit U.

[0128] Next, the X-axis movable member 260 and the Z-axis movable member 262 of the first elevating table 246 are operated to position the frame unit U suction-held by the suction piece 268 above the protective film coating means 195 as shown in FIGS. 11 and 12. At this time, the base of the ring-shaped reinforcing portion 24 of the wafer 4 is positioned above the coating nozzle 404. Next, the coating nozzle 404 is raised by the elevating means 420 from the lowered position to the raised position, and the tip 404a of the coating nozzle 404 is brought close to the surface 4a (lower surface) of the wafer 4. The gap between the tip 404a of the coating nozzle 404 positioned at the raised position and the downward-facing surface 4a of the wafer 4 may be about 20 μm, for example.

[0129] Next, while rotating the suction piece 268 and the frame unit U by the motor 266 of the first lifting table 246, the liquid resin in the tank 400 is sent out by the pump 402, and the liquid resin is discharged from the tip 404a of the coating nozzle 404. Thereby, the region of the wafer 4 irradiated with the laser beam LB when forming the cutting groove 256 can be coated with the liquid resin to cover the annular protective film 426 (see FIG. 13).

[0130] After coating the wafer 4 with the liquid resin, the coating nozzle 404 is lowered by the lifting means 420, and the tip 404a of the coating nozzle 404 is immersed in the water 418 of the immerser 410. Next, the X-axis movable member 260 and the Z-axis movable member 262 of the first lifting table 246 are operated to position the frame unit U suction-held by the suction piece 268 above the laser beam irradiation means 244. At this time, the protective film 426, which is the region coated with the liquid resin, is positioned above the condenser 252. Next, while rotating the suction piece 268 and the frame unit U by the motor 266 of the first lifting table 246, the protective film 426 is irradiated with the laser beam LB. At this time, the protective film 426 is irradiated with the laser beam LB at an output lower than the output of the laser beam LB irradiated to the wafer 4 when forming the cutting groove 256, and the coated liquid resin is dried.

[0131] For example, by positioning the condensing point in front of the protective film 426, the laser beam LB irradiated to the protective film 426 diverges more than the condensing point, so that the output per unit area of the laser beam LB irradiated to the protective film 426 can be reduced compared to when forming the cutting groove 256 (when the condensing point is positioned on the protective film 426 and the laser beam LB is irradiated). Thereby, the coated liquid resin can be dried without performing ablation processing on the protective film 426, and the drying time of the liquid resin can be shortened. Further, in the illustrated embodiment, since the liquid resin is dried using the laser beam irradiation means 244 for forming the cutting groove 256, a dedicated drying means (for example, a heater) for drying the liquid resin is not required.

[0132] After drying the liquid resin coated on the wafer 4, the condensing point of the laser beam LB is positioned at the base (the portion covered with the protective film 426) of the ring-shaped reinforcing portion 24 of the wafer 4 of the frame unit U. Next, as shown in FIG. 14, while rotating the suction piece 268 and the frame unit U by the motor 266 of the first elevating table 246, the base of the ring-shaped reinforcing portion 24 of the wafer 4 is irradiated with the laser beam LB. Thereby, ablation processing can be performed on the base of the ring-shaped reinforcing portion 24 of the wafer 4 to form a ring-shaped cutting groove 256.

[0133] Also, when irradiating the wafer 4 with the laser beam LB, the suction means of the laser beam irradiation means 244 is operated to generate a suction force in the suction nozzle 254, and the debris generated by the ablation processing is sucked by the suction nozzle 254. Thus, in the illustrated embodiment, since the debris is sucked by the suction nozzle 254 and the protective film 426 covers the region of the wafer 4 where the laser beam LB is irradiated when forming the cutting groove 256, it is possible to surely prevent the debris generated by the ablation processing from adhering to the surface 4a of the wafer 4.

[0134] Next, the X-axis movable member 260 and the Z-axis movable member 262 of the first elevating table 246 are moved so that the outer peripheral surplus region 20 of the surface 4a of the wafer 4 of the frame unit U held by suction by the suction piece 268 contacts the upper surface of the annular support portion 226 of the temporary placement table 204, and the lower surface of the frame 64 contacts the upper surface of the frame support portion 228 of the temporary placement table 204. Next, the suction force of the suction piece 268 of the first elevating table 246 is released, and the frame unit U is transferred from the first elevating table 246 to the temporary placement table 204.

[0135] Next, the temporary placement table 204 that has received the frame unit U is positioned by the temporary placement table conveyor 232 below the separation unit 248 of the reinforcing part removing means 194 (see FIG. 10). At this time, the belt conveyor 300 of the waste unit 276 is positioned at the standby position. Next, the second elevating table 272 of the separation unit 248 is lowered, and the lower surface of the second elevating table 272 is brought into contact with the tape 96 on the back surface 4b portion of the wafer 4. Next, a suction force is generated on the lower surface of the second elevating table 272, and the back surface 4b side of the wafer 4 of the frame unit U is suction-held by the second elevating table 272.

[0136] Next, the second elevating table 272 that has suction-held the wafer 4 of the frame unit U is raised to separate the frame unit U from the temporary placement table 204, and the temporary placement table 204 is moved below the first elevating table 246. Next, as shown in FIG. 16, the pair of feeding means 290 and the Z-axis feeding means 294 of the separator 274 are operated, and the frame 64 is sandwiched in the vertical direction by the upper and lower sandwiching rollers 292a and 292b. Also, the belt conveyor 300 of the waste unit 276 is positioned from the standby position to the recovery position.

[0137] Next, ultraviolet rays are irradiated from the pair of ultraviolet irradiation units 270 to reduce the adhesive force of the tape 96 attached to the ring-shaped reinforcing part 24, and while the ring-shaped reinforcing part 24 is pressed downward by the pressing roller 298, the frame unit U is rotated together with the support shaft 286 and the second elevating table 272 by the motor 284 with respect to the separator 274. Thereby, the ring-shaped reinforcing part 24 can be separated from the frame unit U. The reinforcing part 24 that has fallen from the frame unit U is conveyed to the dust box 302 by the belt conveyor 300 and recovered. When separating the reinforcing part 24, the separator 274 may be rotated with respect to the frame unit U.

[0138] After performing the reinforcing part removing step, a ringless unit carrying-out step of carrying out the ringless unit U' from which the ring-shaped reinforcing part 24 has been removed from the reinforcing part removing means 194 is performed.

[0139] In the process of unloading the unit without ring, first, the belt conveyor 300 of the waste portion 276 of the reinforcing portion removing means 194 is positioned from the collection position to the standby position. Next, the frame holding portion 306 of the inversion mechanism 308 (see FIG. 18.) of the unit unloading means 196 without ring is positioned below the unit without ring U' sucked and held by the second elevating table 272.

[0140] Next, with the suction pads 326 of the frame holding portion 306 facing upward, the arm 318 is raised, and the suction pads 326 of the frame holding portion 306 are brought into contact with the lower surface side of the frame 64 of the unit without ring U' in a state where the second elevating table 272 supports the unit without ring U' and the surface 4a of the wafer 4 faces downward.

[0141] Next, a suction force is generated in the suction pads 326 of the frame holding portion 306, and the frame 64 of the unit without ring U' is sucked and held by the suction pads 326. Next, the suction holding of the unit without ring U' by the second elevating table 272 is released. As a result, the unit without ring U' is transferred from the second elevating table 272 of the reinforcing portion removing means 194 to the frame holding portion 306 of the unit unloading means 196 without ring.

[0142] After performing the process of unloading the unit without ring, a process of accommodating the unit without ring U' unloaded by the unit unloading means 196 without ring is performed.

[0143] In the process of accommodating the unit without ring, first, the inversion mechanism 308 of the unit unloading means 196 without ring is turned upside down, and the unit without ring U' sucked and held by the frame holding portion 306 is turned upside down. As a result, the unit without ring U' is positioned below the frame holding portion 306, and the surface 4a of the wafer 4 faces upward.

[0144] Next, move the Y-axis movable member 316 and the arm 318 of the inversion mechanism 308 to bring the unit U' without a ring into contact with the upper surfaces of the pair of support plates 328 of the unit support portion 310 without a ring. At this time, the interval between the pair of support plates 328 is narrowed by the interval adjusting means, and the pair of support plates 328 are in close contact with each other. Next, release the suction holding of the unit U' without a ring by the frame holding portion 306, and place the unit U' without a ring on the pair of support plates 328. Next, operate the heaters mounted on the respective support plates 328 to heat the tape 96 of the unit U' without a ring, thereby stretching the deflection and wrinkles of the tape 96 caused by the removal of the reinforcing portion 24. Then, suck and hold the unit U' without a ring again by the frame holding portion 306 and raise it.

[0145] Next, after expanding the interval between the pair of support plates 328 by the interval adjusting means, place the unit U' without a ring on the upper surface of the support plate 328. Then, as shown in FIG. 20, push the unit U' without a ring supported by the unit support portion 310 of the ringless unit support portion 310 by the pressing piece 338 of the pushing portion 312, and cause it to enter and be accommodated in the frame cassette 198 placed on the frame cassette table 200.

[0146] As described above, in the processing apparatus 2 of the illustrated embodiment, it is easy to attach the dicing tape 96 to the back surface 4b of the wafer 4 in which the ring-shaped reinforcing portion 24 is formed in a convex shape on the back surface 4b corresponding to the outer peripheral surplus region 20 and integrate it with the frame 64. At the same time, it is easy to cut the ring-shaped reinforcing portion 24 and remove it from the wafer 4, resulting in good productivity.

Explanation of Reference Numerals

[0147] 2: Processing apparatus 4: Wafer 4a: Front surface of wafer 4b: Back surface of wafer 6: Wafer cassette 8: Wafer cassette table 10: Wafer unloading means 12: Wafer table 20: Outer peripheral surplus area 24: Reinforcing part 64: Frame 64a: Opening 64’: Tape-attached frame 66: Frame housing means 68: Frame unloading means 70: Frame table 96: Tape 98: Tape sticking means 100: Tape-attached frame conveying means 102: Tape crimping means 192: Frame unit unloading means 194: Reinforcing part removing means 195: Protective film coating means 196: Ringless unit unloading means 198: Frame cassette 200: Frame cassette table 244: Laser beam irradiation means 256: Cutting groove 400: Tank 402: Pump 404: Coating nozzle 404a: Tip of coating nozzle 410: Immersion device 426: Protective film U: Frame unit U’: Ringless unit

Claims

1. A processing apparatus for removing a convex reinforcing portion from a wafer having a ring-shaped reinforcing portion convexly formed on the back surface corresponding to the outer peripheral surplus region, comprising: a wafer cassette table on which a wafer cassette containing a plurality of wafers is placed; a wafer unloading means for unloading a wafer from the wafer cassette placed on the wafer cassette table; a wafer table for supporting the front surface side of the wafer unloaded by the wafer unloading means; a frame accommodating means for accommodating a plurality of ring-shaped frames having openings for accommodating wafers; a frame unloading means for unloading a frame from the frame accommodating means; a frame table for supporting the frame unloaded by the frame unloading means; a tape attaching means disposed above the frame table for attaching a tape to the frame; a tape-attached frame conveying means for conveying the tape-attached frame to the wafer table, positioning the opening of the frame on the back surface of the wafer supported by the wafer table, and placing the tape-attached frame on the wafer table; a tape crimping means for crimping the tape of the tape-attached frame to the back surface of the wafer with a pressing roller; a frame unit unloading means for unloading the frame unit in which the tape of the tape-attached frame and the back surface of the wafer are crimped by the tape crimping means from the wafer table; a reinforcing portion removing means for cutting and removing the ring-shaped reinforcing portion from the wafer, comprising a laser beam irradiating means for irradiating a laser beam toward the base of the ring-shaped reinforcing portion formed on the outer periphery of the wafer of the frame unit unloaded by the frame unit unloading means to form a cutting groove; a protective film coating means for coating a protective film on the region of the wafer irradiated with the laser beam; a ringless unit unloading means for unloading the ringless unit from which the ring-shaped reinforcing portion has been removed from the reinforcing portion removing means; a frame cassette table on which a frame cassette for accommodating the ringless unit unloaded by the ringless unit unloading means is placed; including the reinforcing portion removing means includes a separating portion for separating the ring-shaped reinforcing portion from the cutting groove; the separating portion includes a lifting table for exposing the ring-shaped reinforcing portion to the outer periphery and sucking and holding the inside of the wafer of the frame unit, a separator for acting on the outer periphery of the ring-shaped reinforcing portion to separate the ring-shaped reinforcing portion, and a motor for rotating the lifting table. The separator is a processing device including a sandwiching roller that sandwiches the frame of the frame unit in the vertical direction and a pressing roller that presses the ring-shaped reinforcing portion downward.

2. The protective film coating means includes a tank for storing a liquid resin, a pump for sending out a predetermined amount of the liquid resin from the tank, and a coating nozzle for coating the region of the wafer irradiated with the laser beam with the liquid resin sent out from the pump. The processing device according to claim 1.

3. The processing device according to claim 2, wherein the laser beam is irradiated onto the region coated with the liquid resin at an output lower than the output of the laser beam irradiated onto the wafer when forming the cutting groove to dry the coated liquid resin.

4. The processing device according to claim 2, further comprising an immerser for immersing the tip of the coating nozzle so that the tip does not dry.

5. The frame unit carrying-out means includes a frame unit holding portion including a wafer holding portion for holding a wafer and a frame holding portion for holding a frame, and a conveying portion for conveying the frame unit holding portion to a temporary placement table. The processing device according to claim 1.

6. The reinforcing portion removing means includes a first elevating table for holding and raising the frame unit temporarily placed on the temporary placement table and positioning it at the laser beam irradiation means, and a separating portion for separating the ring-shaped reinforcing portion from the cutting groove. The separating portion includes an ultraviolet irradiation portion for irradiating ultraviolet rays onto a tape corresponding to the cutting groove to reduce the adhesive force of the tape, a second elevating table for exposing the ring-shaped reinforcing portion to the outer periphery, sucking and holding the inside of the wafer, and supporting the frame, a separator for acting on the outer periphery of the ring-shaped reinforcing portion to separate the ring-shaped reinforcing portion, and a waste portion for discarding the separated ring-shaped reinforcing portion. The first elevating table temporarily places the frame unit in which the cutting groove is formed on the temporary placement table, the temporary placement table is positioned at the separating portion by a temporary placement table conveying portion, and the second elevating table supports the frame unit temporarily placed on the temporary placement table. The processing device according to claim 5.

Images