Antistatic polyamide resin composition and molded member

Abstract

To provide an antistatic polyamide-based resin composition capable of improving all of antistatic property, mechanical strength and heat resistance at a high level, while being capable of coloring in various colors, and a molding member formed by molding the resin composition.SOLUTION: An antistatic polyamide-based resin composition contains a semi-aromatic polyamide resin (A), a polymer type antistatic agent (B), and a reinforcement material (C) that is a single crystal fiber.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to an antistatic polyamide-based resin composition and a molded member formed by molding the resin composition.

Background Art

[0002] In the midst of the demand for miniaturization, weight reduction, and high functionality of electronic devices incorporating electronic components, when manufacturing electronic devices, electronic components are transported in trays and incorporated into electronic device products. An electronic component transport tray is a synthetic resin tray formed according to its shape, having a number of storage portions for storing electronic components including semiconductor elements such as semiconductor chips and hard disk components.

[0003] In an electronic component transport tray, a large number of trays are stacked with electronic components inserted into the storage portions, and are used for transporting and storing electronic components in the manufacturing process. In such an electronic component transport tray, static electricity may be generated due to friction between the tray and the electronic components, friction between the trays, etc. during transportation, storage, and other handling, and there is a problem of causing malfunctions due to this static electricity. Therefore, it is necessary to impart conductivity to the electronic component transport tray to suppress the generation of static electricity. In addition, the electronic component transport tray also requires heat resistance that can withstand the soldering process (about 250°C).

[0004] By the way, polyamide resins are widely used in various applications such as fiber materials for clothing and industrial materials, film materials for packaging, injection molding materials for various electrical and electronic parts, mechanical parts, and automotive parts because they have excellent heat resistance, mechanical strength, chemical resistance, processability, etc. However, synthetic resins such as polyamide resins generally have poor electrical conductivity and high surface resistivity, so there is a problem that static electricity induced by contact or friction is difficult to dissipate. As a method of imparting heat resistance and antistatic performance to polyamide resins, a method of blending conductive carbon black is known, but problems such as a decrease in mechanical strength have arisen. Therefore, a composition containing a polyamide resin, an impact modifier, conductive carbon black, and an inorganic filler in a specific composition has been proposed (Patent Document 1).

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] In an electronic component transport tray, in order to enhance the identifiability of electronic components and improve work efficiency, a tray that can be colored in various colors for each electronic component is required. However, a resin composition containing conductive carbon black has a problem that the color tone is black and it is difficult to color. Therefore, there is an increasing demand for a resin composition that can be colored in various colors, has antistatic properties, and is excellent in mechanical strength and heat resistance.

[0007] An object of the present invention is to solve such problems and provide an antistatic polyamide-based resin composition and a molded member formed by molding the resin composition, which can be colored in various colors and can improve any of antistatic properties, mechanical strength, and heat resistance to a high level.

Means for Solving the Problems

[0008] The present invention provides an antistatic polyamide-based resin composition having the following constitution and a molded member formed by molding the resin composition.

[0009] Item 1. An antistatic polyamide-based resin composition, characterized by comprising a semi-aromatic polyamide resin (A), a polymer-type antistatic agent (B), and a reinforcing material (C) which is a single crystal fiber.

[0010] Item 2. The antistatic polyamide-based resin composition according to Item 1, wherein the proportion of the structural unit derived from the aromatic monomer in all the structural units constituting the semi-aromatic polyamide resin (A) is 20 mol% or more.

[0011] Item 3. The antistatic polyamide-based resin composition according to Item 1 or Item 2, characterized in that the average fiber length of the reinforcing material (C) is 1 μm or more and less than 300 μm.

[0012] Item 4. The antistatic polyamide-based resin composition according to any one of Items 1 to 3, characterized in that the reinforcing material (C) is potassium titanate fiber.

[0013] Item 5. The antistatic polyamide-based resin composition according to any one of Items 1 to 4, characterized in that the polymer-type antistatic agent (B) is a polyether-based antistatic agent.

[0014] Item 6. The antistatic polyamide-based resin composition according to any one of Items 1 to 5, characterized in that the melt flow rate (MFR) value measured under the conditions of a temperature of 215 °C and a load of 21 N of the polymer-type antistatic agent (B) is 5 g / 10 min to 150 g / 10 min.

[0015] Item 7. The antistatic polyamide-based resin composition according to any one of Items 1 to 6, characterized in that the melting point of the polymer-type antistatic agent (B) is 180 °C to 220 °C.

[0016] Item 8. The antistatic polyamide-based resin composition according to any one of Items 1 to 7, wherein the melting point of the semi-aromatic polyamide resin (A) is 230°C to 350°C.

[0017] Item 9. The antistatic polyamide-based resin composition according to any one of Items 1 to 8, wherein the difference |mp1 - mp2| between the melting point mp1 of the semi-aromatic polyamide resin (A) and the melting point mp2 of the polymer-type antistatic agent (B) is 40°C to 150°C.

[0018] Item 10. The antistatic polyamide-based resin composition according to any one of Items 1 to 9, wherein when the total amount of the antistatic polyamide-based resin composition is 100 parts by mass, the total content of the polymer-type antistatic agent (B) and the reinforcing material (C) is 10 parts by mass to 60 parts by mass.

[0019] Item 11. The antistatic polyamide-based resin composition according to any one of Items 1 to 10, wherein when the total amount of the antistatic polyamide-based resin composition is 100 parts by mass, the total content of the polymer-type antistatic agent (B) and the reinforcing material (C) is 15 parts by mass to 55 parts by mass.

[0020] Item 12. A molded member, characterized in that it is formed by molding the antistatic polyamide-based resin composition according to any one of Items 1 to 11.

[0021] Item 13. The molded member according to Item 12, wherein the molded member is used for an electronic component transport tray.

Advantages of the Invention

[0022] According to the present invention, it is possible to provide an antistatic polyamide-based resin composition that can be colored in various colors and can improve any of antistatic properties, mechanical strength, and heat resistance to a high level, and a molded member formed by molding the resin composition.

Modes for Carrying Out the Invention

[0023] Hereinafter, preferred embodiments of the present invention will be described. However, the following embodiments are merely illustrative, and the present invention is not limited to the following embodiments.

[0024] The antistatic polyamide resin composition of the present invention is a resin composition composed of containing a semi-aromatic polyamide resin (A), a polymer type antistatic agent (B), and a reinforcing material (C). The reinforcing material (C) in the above resin composition is a single crystal fiber.

[0025] The antistatic polyamide resin composition of the present invention contains a semi-aromatic polyamide resin (A), a polymer type antistatic agent (B), and a reinforcing material (C) which is a single crystal fiber, so that it can be colored in various colors, and can improve any of antistatic property, mechanical strength, and heat resistance to a high level.

[0026] In the present invention, the proportion of the structural unit derived from the aromatic monomer in all the structural units constituting the semi-aromatic polyamide resin (A) is preferably 20 mol% or more.

[0027] In the present invention, the average fiber length of the reinforcing material (C) is preferably 1 μm or more and less than 300 μm. The reinforcing material (C) is more preferably potassium titanate fiber.

[0028] The polymer type antistatic agent (B) is preferably a polyether type antistatic agent. The melt flow rate (MFR) value measured under the conditions of a temperature of 215 °C and a load of 21 N of the polymer type antistatic agent (B) is preferably 5 g / 10 min to 150 g / 10 min. The melting point of the polymer type antistatic agent (B) is more preferably 180 °C to 220 °C.

[0029] The melting point of the semi-aromatic polyamide resin (A) is preferably 230 °C to 350 °C, and more preferably 260 °C to 330 °C.

[0030] The difference |mp1 - mp2| between the melting point mp1 of the semi-aromatic polyamide resin (A) and the melting point mp2 of the polymer type antistatic agent (B) is preferably from 40°C to 150°C.

[0031] When using the semi-aromatic polyamide resin (A), the polymer type antistatic agent (B), and the reinforcing material (C) that constitute such a resin, it is possible to easily color in various colors, and at the same time, the antistatic property, mechanical strength, and heat resistance can be further improved to a higher level.

[0032] In the above antistatic polyamide-based resin composition (hereinafter, may be simply referred to as "resin composition"), when the total amount of the resin composition is 100 parts by mass, the total content of the polymer type antistatic agent (B) and the reinforcing material (C) is preferably from 10 parts by mass to 60 parts by mass, and more preferably from 15 parts by mass to 55 parts by mass. In this case, any of the antistatic property, mechanical strength, and heat resistance can be further improved to a higher level.

[0033] The molded member of the present invention is formed by molding the above antistatic polyamide-based resin composition. The molded member of the present invention can be suitably used for an electronic component transport tray.

[0034] Each component etc. of the antistatic polyamide-based resin composition of the present invention will be described below.

[0035] <Antistatic polyamide-based resin composition> The antistatic polyamide-based resin composition used in the present invention contains a semi-aromatic polyamide resin (A), a polymer type antistatic agent (B), and a reinforcing material (C) which is a single crystal fiber, and may contain a coloring material and other additives other than the coloring material as required.

[0036] (Semi-aromatic polyamide resin (A)) The semi-aromatic polyamide resin (A) used in the present invention is a polymer having an amide bond (-NH-C(=O)-) in the main chain, and is a polymer containing structural units derived from monomer components such as the aliphatic monomers and aromatic monomers described below. The semi-aromatic polyamide resin (A) may be composed of one type of structural unit (a polymer of aminocarboxylic acid) or may be composed of a plurality of types of structural units (a copolymer of diamine and dicarboxylic acid, a copolymer of diamine, dicarboxylic acid and aminocarboxylic acid, etc.). In the case of a copolymer composed of a plurality of types of structural units, the copolymerization ratio, copolymerization form (random copolymer, block copolymer, alternating copolymer, etc.), etc. can be arbitrarily selected.

[0037] Specific examples of the semi-aromatic polyamide resin (A) include, for example, polyamide MXD6, polyamide 6T, polyamide 9T, polyamide 10T, and the like.

[0038] In the present invention, the semi-aromatic polyamide resin (A) means a polyamide resin containing a structural unit derived from an aliphatic monomer and a structural unit derived from an aromatic monomer as the structural units of the polyamide resin.

[0039] Examples of the structural unit derived from an aliphatic monomer include aliphatic dicarboxylic acid, aliphatic diamine, alicyclic diamine, aliphatic aminocarboxylic acid, alicyclic dicarboxylic acid, and the like.

[0040] Examples of the aliphatic dicarboxylic acid include succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, 1,9-nonanedicarboxylic acid, 1,10-decanedicarboxylic acid, 1,11-undecanedicarboxylic acid, and the like. Among these, adipic acid is preferred. These can be used alone or in combination of two or more.

[0041] Examples of the aliphatic diamine include ethylenediamine, trimethylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, 2-methyl-1,5-diaminopentane, 3-methyl-1,5-diaminopentane, 2-ethyltetramethylenediamine, and the like. Among these, hexamethylenediamine, 1,9-diaminononane, 1,10-diaminodecane, and 2-methylpentamethylenediamine are preferable. These can be used alone or in combination of two or more.

[0042] Examples of the alicyclic diamine include 1,2-diaminocyclohexane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, 1,3-bis(aminomethyl)cyclohexane, bis(aminomethyl)cyclohexane, bis(4-aminocyclohexyl)methane, 4,4'-diamino-3,3'-dimethyldicyclohexylmethane, isophoronediamine, piperazine, and the like. These can be used alone or in combination of two or more.

[0043] Examples of the aliphatic aminocarboxylic acid include 6-aminocaproic acid, 7-aminoheptanoic acid, 8-aminooctanoic acid, 9-aminononanoic acid, 10-aminodecanoic acid, 11-aminoundecanoic acid, 12-aminododecanoic acid, and the like. Also, cyclic lactams corresponding to these may be used. These can be used alone or in combination of two or more.

[0044] Examples of the alicyclic dicarboxylic acid include 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, and the like. Among these, 1,4-cyclohexanedicarboxylic acid is preferable. These can be used alone or in combination of two or more.

[0045] Examples of the structural unit derived from an aromatic monomer include aromatic diamines, aromatic dicarboxylic acids, aromatic aminocarboxylic acids, and the like.

[0046] Examples of the aromatic diamine include p-phenylenediamine, o-phenylenediamine, m-phenylenediamine, p-xylenediamine, o-xylenediamine, m-xylenediamine, and the like. These can be used alone or in combination of two or more.

[0047] Examples of the aromatic dicarboxylic acid include terephthalic acid, isophthalic acid, phthalic acid, 2-methylterephthalic acid, naphthalenedicarboxylic acid, and the like. Among these, terephthalic acid or isophthalic acid is preferable, and terephthalic acid is more preferable. These can be used alone or in combination of two or more.

[0048] Examples of the aromatic aminocarboxylic acid include p-aminobenzoic acid, p-aminomethylbenzoic acid, and the like.

[0049] The semi-aromatic polyamide resin (A) used in the present invention preferably has a melting point of 230°C or higher, more preferably 260°C or higher, in order to further suppress deformation, discoloration, etc. Further, in order to suppress thermal decomposition of the semi-aromatic polyamide resin (A) in melt processing such as extrusion, molding, and spinning, the melting point is preferably 350°C or lower, more preferably 330°C or lower. The melting point can be measured according to JIS-K7121.

[0050] The semi-aromatic polyamide resin (A) used in the present invention can suppress deformation and deterioration of physical properties due to moisture absorption. In the semi-aromatic polyamide resin (A) used in the present invention, the proportion of the structural units derived from aromatic monomers in all the structural units constituting the semi-aromatic polyamide resin (A) is preferably 20 mol% or more, more preferably 25 mol% or more, and still more preferably 25 mol% to 60 mol%. Here, the molar fraction of the structural units derived from aromatic monomers in the semi-aromatic polyamide resin (A) means the molar fraction of aromatic monomers in all the monomers used as polymerization raw materials.

[0051] The semi-aromatic polyamide resin (A) is preferably a semi-aromatic polyamide resin containing a structural unit derived from an aromatic dicarboxylic acid and a structural unit derived from an aliphatic diamine as structural units, and more preferably a semi-aromatic polyamide resin containing a structural unit derived from an aromatic dicarboxylic acid, a structural unit derived from an aliphatic dicarboxylic acid, and a structural unit derived from an aliphatic diamine as structural units.

[0052] Among the semi-aromatic polyamide resins (A), as an example of particularly preferred ones, those copolymerized with 45 mol% to 55 mol% (especially about 50 mol%) of terephthalic acid, 20 mol% to 30 mol% (especially about 25 mol%) of hexamethylenediamine, and 20 mol% to 30 mol% (especially about 25 mol%) of 2-methylpentamethylenediamine; those copolymerized with 30 mol% to 35 mol% (especially about 32 mol%) of terephthalic acid, 15 mol% to 20 mol% (especially about 18 mol%) of adipic acid, and 45 mol% to 55 mol% (especially about 50 mol%) of hexamethylenediamine; those copolymerized with 25 mol% to 30 mol% (especially about 27.5 mol%) of terephthalic acid, 20 mol% to 25 mol% (especially about 22.5 mol%) of adipic acid, and 45 mol% to 55 mol% (especially about 50 mol%) of hexamethylenediamine, etc. can be mentioned. By appropriately selecting the composition ratio and types of the aromatic monomers and other monomer components constituting the semi-aromatic polyamide resin (A), physical properties such as the melting point can be appropriately adjusted.

[0053] In the present invention, from the viewpoint of further suppressing the decrease in antistatic properties due to the semi-aromatic polyamide resin (A) and further enhancing the heat resistance, the content of the semi-aromatic polyamide resin (A) is preferably 40% by mass to 90% by mass, more preferably 45% by mass to 85% by mass, and still more preferably 45% by mass to 75% by mass with respect to 100% by mass of the total amount of the antistatic polyamide-based resin composition. From the viewpoint of not further deteriorating the heat resistance by excessively enhancing the antistatic properties of the antistatic polyamide-based resin composition, the content of the semi-aromatic polyamide resin (A) is preferably 40% by mass or more.

[0054] (Polymeric antistatic agent (B)) As the polymeric antistatic agent (B) used in the present invention, a conventionally known polymeric antistatic agent (an antistatic agent having a polymer structure) can be used. As the polymeric antistatic agent (B), for example, a block copolymer of a hydrophobic block and a hydrophilic block bonded by an ester bond, an ether bond, an amide bond, an imide bond, a urethane bond, a urea bond, or the like can be used.

[0055] Examples of the hydrophobic block include a polyolefin block. Examples of the polyolefin block include blocks composed of polyethylene, polypropylene, ethylene-propylene copolymers, and the like. Here, the polyolefin block may be fluorine-modified. Further, the hydrophobic block may be any hydrophobic substance, for example, a hydrophobic amine, a hydrophobic ester, a hydrophobic amide, a hydrophobic imide, or a hydrophobic ester amide having a hydrophobic group such as an alkylene group or an aromatic group. Further, the hydrophobic block may have a hydrophobic side chain such as an alkyl group.

[0056] Hydrophobic blocks such as polyolefin blocks have polar groups such as carbonyl groups, hydroxyl groups, and amino groups at both of their ends. By polymerizing the polar groups that the hydrophobic block has at both ends with the carbonyl groups, hydroxyl groups, or amino groups, etc. that are present at both ends of the hydrophilic block, or by crosslinking them with diisocyanates, diglycidyl ethers, etc., a block copolymer of the hydrophobic block and the hydrophilic block can be obtained.

[0057] Examples of the hydrophilic block include a polyether block, a polyether-containing hydrophilic polymer block, a cationic polymer block, or an anionic polymer block. The polyether block is typically a polyether diol, and examples thereof include polyethylene glycol, polypropylene glycol, and a copolymer of ethylene glycol and propylene glycol.

[0058] The polyether-containing hydrophilic polymer block has a polyether segment, and examples thereof include polyether diamine, polyether ester amide, polyether amide imide, polyether ester, polyether amide, or polyether urethane. Note that the polyether block and the polyether segment may be linear or branched.

[0059] Examples of the cationic polymer block include a quaternary ammonium salt structure or a phosphonium salt structure having a superacid anion such as BF4 - , PF6 - , BF3Cl - , or PF5Cl - as a counter ion, and a cationic polymer block separated by a nonionic molecular chain.

[0060] Examples of the anionic polymer block include a polymer block obtained by copolymerizing an aromatic dicarboxylic acid or an aliphatic dicarboxylic acid having a sulfonyl group that has become a salt only with a sulfonyl group, and a diol or a polyether.

[0061] Regarding such a polymer type antistatic agent (B), for example, it is described in detail in JP-A-2001-278985, JP-A-2003-048990, or JP-A-2012-031395.

[0062] Among the polymer type antistatic agents (B) having the above structure, for example, polyether-polyolefin block copolymers; polyether ester amides which are block copolymers of polyethers and hydrophobic ester amides; polyether amides which are block copolymers of polyethers and hydrophobic amides, and polyether amide imides which are block copolymers of polyethers and hydrophobic amide imides, etc., polyether-based antistatic agents are preferred. Among these, from the viewpoint of being more excellent in compatibility with the semi-aromatic polyamide resin (A), it is more preferably at least one of polyether amide or polyether ester amide, and even more preferably polyether ester amide.

[0063] From the viewpoint of further improving the antistatic property and mechanical strength of the molded member, the number average molecular weight of the polymer type antistatic agent (B) is preferably 1,000 to 100,000, more preferably 2,000 to 50,000, and even more preferably 3,000 to 5,000. The number average molecular weight can be measured by weight conversion using, for example, gel permeation chromatography (GPC) or 1 1H-NMR.

[0064] The polymer antistatic agent (B) used in the present invention preferably has a melt flow rate (MFR) value measured under the conditions of a temperature of 215°C and a load of 21 N of 5 g / 10 min or more, more preferably 10 g / 10 min or more, still more preferably 20 g / 10 min or more, preferably 150 g / 10 min or less, more preferably 50 g / 10 min or less, and still more preferably 40 g / 10 min or less, from the viewpoint that it can improve any of the antistatic property, mechanical strength, and heat resistance of the resulting molded member to a high level.

[0065] By setting the MFR value of the polymer antistatic agent (B) within the above range, the mechanism by which the antistatic property among the effects of the present invention is further enhanced is not clear. However, it is presumed that in the polymer antistatic agent (B) of the present invention, when the antistatic polyamide resin composition of the present invention is formed, a linear network structure (conductive circuit) is formed in the vicinity of the surface of the molded member by the shearing force during molding, and the network structure (conductive circuit) is further formed between single crystal fibers, so that the network structure (conductive circuit) exhibits the function of efficiently discharging static electricity. The MFR value of the polymer antistatic agent (B) used in the present invention can be measured in accordance with JIS K7210.

[0066] The polymer antistatic agent (B) used in the present invention preferably has a melting point of 175°C or higher, more preferably 180°C or higher, still more preferably 185°C or higher, preferably less than 260°C, more preferably less than 250°C, and still more preferably 220°C or lower, in order to enhance the compatibility with the semi-aromatic polyamide resin (A) and further suppress aggregation during molding. The melting point of the polymer antistatic agent (B) can be measured in accordance with JIS-K7121.

[0067] The polymer antistatic agent (B) used in the present invention preferably has a 10% weight loss temperature in TGA (thermogravimetric analysis) of 370°C or higher. When the 10% weight loss temperature is at or above the above lower limit value, the heat resistance during production is improved and thermal degradation can be further suppressed. Therefore, the dispersibility or compatibility of the polymer antistatic agent (B) in the resin composition during melt-kneading is improved, and the production suitability such as the moldability of the molded member made of the antistatic polyamide-based resin composition and the antistatic property become even better. The upper limit value of the 10% weight loss temperature is not particularly limited, but in reality, for example, it can be 400°C. In addition, the 10% weight loss temperature in TGA (thermogravimetric analysis) in this specification refers to the temperature at 10% weight loss in differential thermal-thermogravimetric simultaneous measurement (TG-DTA).

[0068] In the present invention, from the viewpoint of further suppressing the decrease in mechanical strength caused by the polymer antistatic agent (B) and further enhancing the antistatic property, the content of the polymer antistatic agent (B) is preferably 3% by mass to 20% by mass, more preferably 4% by mass to 20% by mass, still more preferably 5% by mass to 18% by mass, and particularly preferably 7% by mass to 18% by mass, based on 100% by mass of the total amount of the antistatic polyamide-based resin composition. From the viewpoint of not further deteriorating the mechanical strength due to excessive enhancement of the antistatic property of the polymer antistatic agent (B), the content of the polymer antistatic agent (B) is preferably 20% by mass or less.

[0069] (Reinforcing material (C)) The reinforcing material (C) used in the present invention is a reinforcing material composed of single crystal fibers. From the viewpoint of further suppressing the reduction of the reinforcing effect by the reinforcing material (C) and further enhancing the mechanical strength, the reinforcing material (C) is preferably a particulate inorganic fiber composed of single crystal fibers. The average fiber length of the particulate reinforcing material (C) composed of single crystal fibers is preferably 300 μm or less, more preferably 1 μm or more and less than 300 μm, still more preferably 1 μm to 200 μm, particularly preferably 3 μm to 100 μm, and most preferably 5 μm to 50 μm. The average aspect ratio of the particulate reinforcing material (C) composed of single crystal fibers is preferably 3 to 200, more preferably 3 to 100, still more preferably 3 to 50, and particularly preferably 3 to 40.

[0070] Inorganic fibers are classified into amorphous fibers such as glass fibers; polycrystalline fibers such as carbon fibers; and single crystal fibers such as wollastonite fibers and potassium titanate fibers. By being composed of single crystal fibers, the reinforcing material (C) used in the present invention can further improve the mechanical strength and antistatic property. Although the mechanism by which the antistatic property among the effects of the present invention is further enhanced is not clear, it is presumed that since single crystal fibers have few structural defects such as crystal grain boundaries, the ionic components present in the crystal when a voltage is applied enhance the antistatic effect of the polymer type antistatic agent (B). In particular, from the viewpoint of being more easily colorable with various colors, the reinforcing material (C) is preferably not a carbon fiber.

[0071] Specific examples of the reinforcing material (C) composed of single crystal fibers include, for example, inorganic fibers such as potassium titanate fibers, wollastonite fibers, silicon carbide fibers, silicon nitride fibers, and graphite fibers. These reinforcing materials (C) may be used alone or in combination of two or more. From the viewpoint of further suppressing the decrease in the reinforcing effect by the reinforcing material (C) and further increasing the mechanical strength, the reinforcing material (C) is preferably at least one of potassium titanate fibers and wollastonite fibers, more preferably potassium titanate fibers or wollastonite fibers, and even more preferably potassium titanate fibers.

[0072] In the present invention, the particulate inorganic fiber composed of single crystal fibers is composed of fibrous inorganic particles made of single crystals. When the longest side of the rectangular parallelepiped (circumscribed rectangular parallelepiped) having the smallest volume among the rectangular parallelepipeds circumscribing the particles is defined as the major axis L, the next longest side as the minor axis B, and the shortest side as the thickness T (B>T), particles with both L / B and L / T being 3 or more are referred to. The major axis L corresponds to the fiber length and the minor axis B corresponds to the fiber diameter.

[0073] Examples of potassium titanate fibers include single crystal fibers represented by the general formula K2O·nTiO2 (where n is an integer from 2 to 8) or the general formula K2O·nTiO2·1 / 2H2O (where n is an integer from 2 to 8). Specific examples thereof include 4-potassium titanate fibers, 6-potassium titanate fibers, 8-potassium titanate fibers, etc. and mixtures thereof.

[0074] In the present invention, from the viewpoint of further improving the antistatic property, the water dispersion pH of the above potassium titanate fibers is preferably 7 to 10, and more preferably 9 to 10.

[0075] The water dispersion pH of the above potassium titanate fibers can be calculated as the water dispersion pH, for example, by adding 1 g of a test sample of potassium titanate fibers to 100 mL of distilled water to prepare a 1 mass% slurry, measuring the pH (temperature 20°C) of the obtained slurry with a pH meter (manufactured by Horiba, Ltd., product number "F21"), and using the measurement result.

[0076] The dimensions of the potassium titanate fibers are not particularly limited as long as they are within the range of the dimensions of the reinforcing material (C) composed of the above-mentioned single crystal fibers. However, the average fiber length is preferably 1 μm to 50 μm, more preferably 3 μm to 30 μm, and still more preferably 3 μm to 20 μm. The average fiber diameter of the potassium titanate fibers is preferably 0.01 μm to 1 μm, more preferably 0.05 μm to 0.8 μm, and still more preferably 0.1 μm to 0.7 μm. The average aspect ratio of the potassium titanate fibers is preferably 10 or more, more preferably 10 to 100, and still more preferably 15 to 35. These potassium titanate fibers can be commercially available products. For example, "TISMO D" (average fiber length 15 μm, average fiber diameter 0.5 μm), "TISMO N" (average fiber length 15 μm, average fiber diameter 0.5 μm), etc. manufactured by Otsuka Chemical Co., Ltd. can be used.

[0077] The wollastonite fibers are single crystal fibers composed of calcium metasilicate, and conventionally known ones can be widely used. The dimensions of the wollastonite fibers are not particularly limited as long as they are within the range of the dimensions of the reinforcing material (C) composed of the above-mentioned single crystal fibers. However, the average fiber length is preferably 5 μm to 180 μm, more preferably 10 μm to 100 μm, and still more preferably 20 μm to 40 μm. The average fiber diameter of the wollastonite fibers is preferably 0.1 μm to 15 μm, more preferably 1 μm to 10 μm, and still more preferably 2 μm to 7 μm. The average aspect ratio of the wollastonite fibers is preferably 3 or more, more preferably 3 to 30, and still more preferably 3 to 15. These wollastonite fibers can be commercially available products. For example, "Vistal W" (average fiber length 25 μm, average fiber diameter 3 μm), etc. manufactured by Otsuka Chemical Co., Ltd. can be used.

[0078] The above average fiber length and average fiber diameter can be measured by observing with a scanning electron microscope, and the average aspect ratio (average fiber length / average fiber diameter) can be calculated from the average fiber length and average fiber diameter. For example, a reinforcing material (C) composed of a plurality of single crystal fibers is photographed with a scanning electron microscope, 300 single crystal fibers constituting the reinforcing material (C) are arbitrarily selected from the observed image, their fiber lengths and fiber diameters are measured, and the sum of all the fiber lengths is divided by the number to obtain the average fiber length, and the sum of all the fiber diameters is divided by the number to obtain the average fiber diameter.

[0079] In the present invention, from the viewpoint of further enhancing the wettability with the semi-aromatic polyamide resin (A) and further improving the physical properties such as the mechanical properties of the obtained antistatic polyamide-based resin composition, a treatment layer composed of a surface treatment agent may be formed on the surface of the reinforcing material (C).

[0080] Examples of the surface treatment agent include silane coupling agents and titanium coupling agents. Among these, silane coupling agents are preferred, and amino-based silane coupling agents, epoxy-based silane coupling agents, and alkyl-based silane coupling agents are more preferred. The above surface treatment agent may be used alone or in combination of two or more.

[0081] Examples of the amino-based silane coupling agent include N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-ethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane, and the like.

[0082] Examples of the epoxy-based silane coupling agent include 3-glycidyloxypropyl(dimethoxy)methylsilane, 3-glycidyloxypropyltrimethoxysilane, diethoxy(3-glycidyloxypropyl)methylsilane, triethoxy(3-glycidyloxypropyl)silane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and the like.

[0083] Examples of the alkyl-based silane coupling agent include methyltrimethoxysilane, dimethyldimethoxysilane, trimethylmethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, n-propyltrimethoxysilane, isobutyltrimethoxysilane, isobutyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, cyclohexylmethyldimethoxysilane, n-octyltriethoxysilane, n-decyltrimethoxysilane, and the like.

[0084] As a method for forming a treatment layer composed of a surface treatment agent on the surface of the reinforcing material (C), a known surface treatment method can be used. For example, a method can be used in which the surface treatment agent is dissolved in a solvent that promotes hydrolysis (e.g., water, alcohol, or a mixed solvent thereof) to form a solution, and the solution is sprayed onto the reinforcing material (C).

[0085] The amount of the surface treatment agent for treating the surface of the reinforcing material (C) used in the present invention is not particularly limited. For example, a solution of the surface treatment agent may be sprayed so that the amount of the surface treatment agent is 0.1 part by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the reinforcing material (C). By setting the amount of the surface treatment agent within the above range, the adhesion to the semi-aromatic polyamide resin (A) can be further improved, and the dispersibility of the reinforcing material (C) can be further improved.

[0086] In the present invention, from the viewpoint of further suppressing the reduction of the reinforcing effect by the reinforcing material (C) and further enhancing the mechanical strength, the content of the reinforcing material (C) is preferably 0.1% by mass to 40% by mass, more preferably 5% by mass to 35% by mass, and still more preferably 10% by mass to 30% by mass, based on 100% by mass of the total amount of the antistatic polyamide-based resin composition. From the viewpoint of not further deteriorating the antistatic property due to excessive enhancement of the reinforcing effect of the reinforcing material (C), the content of the reinforcing material (C) is preferably 40% by mass or less.

[0087] In the present invention, the mass ratio of the reinforcing material (C) to the polymer type antistatic agent (B) contained in the antistatic polyamide-based resin composition (reinforcing material (C) / polymer type antistatic agent (B)) is preferably 0.1 to 15, more preferably 0.5 to 10, still more preferably 1 to 10, particularly preferably 1.5 to 10, and most preferably 2 to 5.

[0088] By setting the mass ratio of the reinforcing material (C) to the polymer type antistatic agent (B) in the antistatic polyamide-based resin composition of the present invention within the above range, the reinforcing effect of the reinforcing material (C) can be further improved while further improving the antistatic property, and the antistatic property and mechanical strength of the molded member formed by molding the resin composition can be improved in harmony at a higher level.

[0089] (Colorant) The antistatic polyamide resin composition of the present invention can contain a colorant within a range that does not impair its favorable physical properties. The type of colorant can be appropriately selected according to its use. For example, organic pigments, inorganic pigments, organic dyes, etc. can be used. A plurality of types of the above colorants may be used for adjusting chromaticity and the like, and one or more of pigments and dyes can be used. Specific examples of colorants that can be used include organic pigments such as azo pigments, anthraquinone pigments, phthalocyanine pigments, quinacridone pigments, perylene pigments, diketopyrrolopyrrole pigments, dioxazine pigments, carbon blacks, titanium dioxide, ultramarine, cobalt blue, lead white, etc. inorganic pigments, extender pigments such as calcium carbonate and barium sulfate, azo dyes, anthraquinone dyes, perylene dyes, etc. It is also possible to use a combination of a pigment and a dye, and examples include various oil-soluble dyes, disperse dyes, and those obtained by processing dyes and pigments with higher fatty acids, synthetic resins, etc.

[0090] (Other additives other than colorants) The antistatic polyamide resin composition of the present invention can contain other additives within a range that does not impair its favorable physical properties.

[0091] Examples of other additives include thermoplastic resins and thermosetting resins excluding semi-aromatic polyamide resin (A); inorganic fillers excluding reinforcing material (C) (e.g., calcium carbonate, mica, muscovite, sericite, illite, kaolinite, montmorillonite, boehmite, smectite, vermiculite, palygorskite, pyrophyllite, halloysite, diatomaceous earth, titanium dioxide, etc.); conductive fillers (e.g., metal particles (e.g., aluminum flakes), metal fibers, metal oxide particles, carbon fibers, ionic liquids, surfactants, etc.); antistatic agents excluding polymeric antistatic agent (B) (e.g., nonionic antistatic agents, etc.); antioxidants and heat stabilizers (e.g., hindered phenols, hydroquinones, phosphites, and their substituents, etc.); ultraviolet absorbers (e.g., resorcinols, salicylates, benzotriazoles, benzophenones, triazines, etc.); light stabilizers (e.g., hindered phenols, etc.); weathering agents; lightfast agents; mold release agents (e.g., higher fatty acids, higher fatty acid esters, higher fatty acid amides, higher fatty acid metal salts (where the higher fatty acid means those having 10 to 25 carbon atoms), fatty acids, fatty acid metal salts, etc.); lubricants; fluidity improvers; plasticizers (e.g., polyester plasticizers, glycerin plasticizers, polyvalent carboxylic acid ester plasticizers, phosphate ester plasticizers, polyalkylene glycol plasticizers, epoxy plasticizers); impact resistance improvers; flame retardants (e.g., phosphazene compounds, phosphate esters, condensed phosphate esters, inorganic phosphorus-based, halogen-based, silicone-based flame retardants, metal oxide-based flame retardants, metal hydroxide-based flame retardants, organic metal salt-based flame retardants, nitrogen-based flame retardants, boron compound-based flame retardants, etc.); anti-dripping agents; nucleating agents; dispersants; vibration damping agents; neutralizing agents; anti-blocking agents, etc. Other additives can contain one or more of these.

[0092] When the antistatic polyamide-based resin composition of the present invention contains other additives, the blending amount is not particularly limited as long as it does not impair the preferable physical properties of the molded member of the present invention. The blending amount of other additives is preferably 10% by mass or less, more preferably 5% by mass or less, in 100% by mass of the total amount of the antistatic polyamide-based resin composition.

[0093] However, from the perspective of further improving heat resistance and chemical resistance, it is preferable that, as other additives, it substantially does not contain additives selected from the group consisting of cationic antistatic agents or anionic antistatic agents, metals or metal salts that release ions such as cations and anions, and it is more preferable that it substantially does not contain alkali metals or alkaline earth metals that release ions as the metals or metal salts. In the present specification, "substantially does not contain" means that the content is less than 0.001% by mass with respect to 100% by mass of the total amount of the resin composition. Naturally, "substantially does not contain" also includes the case of not containing at all.

[0094] <Method for producing antistatic polyamide-based resin composition> The antistatic polyamide-based resin composition of the present invention can be produced by heating and mixing (particularly, melt-kneading) a mixture containing a semi-aromatic polyamide resin (A), a polymer-type antistatic agent (B), a reinforcing material (C) which is a single crystal fiber, and, if necessary, a coloring agent and other additives other than the coloring agent.

[0095] For melt-kneading, for example, a known melt-kneading apparatus such as a twin-screw extruder can be used. Specifically, (1) a method in which each component is preliminarily mixed with a mixer (tumbler, Henschel mixer, etc.), melt-kneaded with a melt-kneading apparatus, and pelletized with a pelletizing means (pelletizer, etc.); (2) a method in which a masterbatch of desired components is prepared, and if necessary, other components are mixed and melt-kneaded with a melt-kneading apparatus and pelletized; (3) a method in which each component is supplied to a melt-kneading apparatus and pelletized, etc. can be used for production.

[0096] The processing temperature in melt-kneading is not particularly limited as long as it is a temperature at which the semi-aromatic polyamide resin (A) can melt. Usually, the cylinder temperature of the melt-kneading apparatus used for melt-kneading is adjusted within this range. Thus, the antistatic polyamide-based resin composition of the present invention that exhibits a desired effect is produced.

[0097] <Method for producing and uses of molded members> The molded member of the present invention can be manufactured by molding the antistatic polyamide-based resin composition of the present invention by known resin molding methods such as injection molding, insert molding, compression molding, blow molding, inflation molding, coextrusion molding, etc., according to the type, use, shape, etc. of the intended molded member. As the resin molding method, injection molding or insert molding is preferred. Also, a molding method combining the above molding methods can be adopted.

[0098] By adopting the manufacturing method and molding method of the antistatic polyamide-based resin composition of the present invention described above and molding, a molded member of the present invention can be manufactured, in which any of antistatic property, mechanical strength, and heat resistance can be improved to a high level.

[0099] The molded member of the present invention, in particular, when used as a molded member where contact or friction may occur in devices or parts where static electricity is likely to be generated, can improve both antistatic property and mechanical strength, so it is difficult for static electricity to be induced on the surface of the molded member due to contact or friction, and it is easy to process because of its strength. Also, it has the advantage of suppressing the adhesion of dust to the surface of the molded member, the generation of noise and malfunction in electronic products such as electronic components. Furthermore, the molded member of the present invention has molding heat resistance (high heat resistance) and can be colored in various colors, so it can be suitably used in the field related to electronic component transport trays where control of static electricity requiring these physical properties is demanded, especially in applications related to transport trays for camera module assembly.

[0100] In the manufacturing process of the camera module, the first process includes a soldering process, and the second process includes a cleaning process. In the soldering process, which is the first process, soldering is performed in a temperature range of about 240°C to 260°C. Therefore, the molding member that constitutes the transport tray for camera module assembly is required to have heat resistance that can withstand this temperature range. Also, in the cleaning process, which is the second process, chemical resistance is required to wash away the solder that has oozed out from the camera module parts using an organic solvent or the like. Therefore, for the transport tray for camera module assembly, high levels of heat resistance to withstand the soldering temperature and chemical resistance to organic solvents and the like are required.

[0101] From the viewpoint of excellent heat resistance and chemical resistance, the molding member of the present invention can be suitably used particularly for applications related to transport trays for camera module assembly.

[0102] (Examples and Comparative Examples) Specific descriptions will be given below based on examples and comparative examples, but it is not limited thereto as long as the gist of the present invention is not impaired. The raw materials used in the present examples and comparative examples are specifically as follows.

[0103] Semi-aromatic polyamide resin: manufactured by Kuraray Co., Ltd., melting point: 306°C, polyamide 9T resin, trade name "Genesta PA9T" Polymeric antistatic agent: Polyether-based polymeric antistatic agent (manufactured by Sanyo Chemical Industries, Ltd., melting point 195°C, MFR value (temperature 215°C, 21 N) 30 g / 10 min, number average molecular weight of about 4000 ( 1 calculated by 1H-NMR), trade name "Pelektron (registered trademark) AS") Potassium titanate fiber 1: average fiber length 15 μm, average fiber diameter 0.5 μm, Mohs hardness: 4, water dispersion pH 7 - 8 Potassium titanate fiber 2: average fiber length 15 μm, average fiber diameter 0.5 μm, Mohs hardness: 4, water dispersion pH 9 - 10 Wollastonite fiber: average fiber length 20 μm, average fiber diameter 2 μm, Mohs hardness: 4.5 Amorphous fiber: Mild fiber (average fiber length: 40 μm, fiber diameter: 13 μm, treated with silane coupling agent, manufactured by Nitto Boseki Co., Ltd., product name "PFE-301S", Mohs hardness: 6) Platy particle: Talc (average particle diameter (D50) 13 μm, manufactured by Fuji Talc Industry Co., Ltd., product name "ML112S")

[0104] <Examples 1 to 3 and Comparative Examples 1 to 3> Using a twin-screw extruder, each material was melt-kneaded at the compounding ratios shown in Table 1 to produce resin compositions in pellet form. The cylinder temperature of the twin-screw extruder was 320°C.

[0105] By injection molding the obtained resin compositions, flat plates (all 90 mm long, 50 mm wide, and 3 mm thick) necessary for evaluating Hunter whiteness and charge decay characteristics (antistatic property), and JIS test pieces for measuring mechanical strength were produced. The cylinder temperature of the injection molding machine was 320°C, and the mold temperature was 140°C.

[0106] <Evaluation> (Hunter whiteness) Using a color difference meter (product name: ZE6000, manufactured by Nippon Denshoku Industries Co., Ltd.), the Hunter whiteness of the flat plate immediately after molding was measured. The results are shown in Table 1 below.

[0107] (Charge decay characteristics) The charge decay characteristics (antistatic property) were measured as follows. First, the flat plate immediately after molding was cut into test pieces for measuring charge voltage (flat plate test pieces 40 mm long, 40 mm wide, and 3 mm thick) using a diamond cutter. The obtained test pieces for measuring charge voltage were placed on the turntable of a charge decay characteristics (antistatic property) measuring device (product name: STATIC HONESTMETER H-0110, manufactured by Shishido Electrostatic Co., Ltd.). While rotating the turntable, a +10 kV voltage was applied for 30 seconds, and then the application was stopped. While the turntable was rotated as it was, the charge voltage on the surface of the test piece 10 seconds and 60 seconds after the application was measured, and the degree of attenuation was evaluated.

[0108] (Volume resistivity) The volume resistivity was measured as follows. First, the flat plate immediately after molding was cut into a test piece for measuring volume resistivity (a flat plate test piece with a length of 40 mm, a width of 40 mm, and a thickness of 3 mm) using a diamond cutter. The volume resistivity of the obtained test piece for measuring volume resistivity was measured using a resistivity meter (trade name: Hiresta-UX, manufactured by Mitsubishi Chemical Analytech Co., Ltd.) when a voltage of 1000 V was applied. The results are shown in Table 1 below.

[0109] (Mechanical strength) The mechanical strength was measured in accordance with JIS K7171. A three-point bending test with a support span of 60 mm was performed using an autograph AG-5000 (manufactured by Shimadzu Corporation), and the flexural strength and flexural modulus were measured. The results are shown in Table 1 below.

[0110] (Temperature of weight loss on heating) The temperature of weight loss on heating was measured using a thermogravimetry-differential thermal simultaneous measurement device (TG-DTA) (manufactured by HITACHI, STA7200RV). The measurement sample was dried at a temperature of 120 °C for 6 hours before measurement. The measurement conditions were a sample mass of approximately 10 mg, an air inflow rate of 200 ml / min, a heating rate of 10 °C / min, and a measurement temperature range of 30 °C to 600 °C. The temperature at which the sample mass decreased by 10% was read from the obtained TG curve, and this was defined as the temperature of weight loss on heating (10% weight loss thermogravimetric temperature). The results are shown in Table 1 below.

[0111]

Table 1

[0112] As is clear from Table 1, in the molded members of the resin compositions of Examples 1 to 3 in which the semi-aromatic polyamide resin (A) is blended with the polymer type antistatic agent (B) and the reinforcing material (C) which is a single crystal fiber, the charge decay characteristics (antistatic property) and the mechanical strength (bending strength) are improved in combination as compared with Comparative Example 1. In particular, it can be seen that an excellent synergistic effect is obtained by the combination with respect to the effect of improving the charge decay characteristics (antistatic property). Further, it can be seen that the charge decay characteristics (antistatic property) are remarkably improved in the molded members of the resin compositions of Examples 1 to 2.

[0113] On the other hand, in Comparative Example 2 in which a reinforcing material which is a fibrous reinforcing material but not a single crystal fiber is blended, it can be seen that the charge decay characteristics (antistatic property) are improved as compared with Comparative Example 1, but the mechanical strength (bending strength) is not improved but decreased. Similarly, in Comparative Example 3 in which a plate-like filler which is not fibrous is blended, it can be seen that the charge decay characteristics (antistatic property) are improved as compared with Comparative Example 1, but the mechanical strength (bending strength) is decreased.

[0114] From these results, it can be seen that the antistatic polyamide-based resin composition of the present invention improves both the charge decay characteristics (antistatic property) and the mechanical strength, and in particular, an unexpected effect that an excellent synergistic effect of improving the charge decay characteristics (antistatic property) is obtained due to the characteristics of the resin composition in which the polymer type antistatic agent (B) and the reinforcing material (C) which is a single crystal fiber are used in combination is achieved. Further, contrary to the prediction based on the comparison between Comparative Example 2 and Comparative Example 3 and Comparative Example 1 regarding the mechanical strength (bending strength), it can be seen that an unexpected effect of further improving the mechanical strength (bending strength) is also achieved in the antistatic polyamide-based resin composition of the present invention.

[0115] Therefore, the resin composition obtained by blending the semi-aromatic polyamide resin (A) of the present invention with the polymer type antistatic agent (B) and the reinforcing material (C) which is a single crystal fiber in combination is excellent in charge decay characteristics (antistatic property) and mechanical strength (flexural strength), and since it is possible to improve these characteristics to a high level, it has excellent freedom in product design, further has molding heat resistance (high heat resistance), and can be colored in various colors. Therefore, it can be suitably used in the field related to electronic component transport trays that require electrostatic control for which these physical properties are required, particularly in applications such as transport trays for camera module assembly.

Claims

1. A charge - preventing polyamide - based resin composition comprising a semi - aromatic polyamide resin (A), a polymer - type antistatic agent (B), and a reinforcing material (C) which is a single - crystal fiber, wherein the reinforcing material (C) is potassium titanate fiber, and the pH of the aqueous dispersion of the potassium titanate fiber is 9 to 10.

2. The charge - preventing polyamide - based resin composition according to claim 1, wherein the proportion of the structural unit derived from the aromatic monomer in all the structural units constituting the semi - aromatic polyamide resin (A) is 20 mol% or more.

3. The charge - preventing polyamide - based resin composition according to claim 1 or claim 2, wherein the average fiber length of the reinforcing material (C) is 1 μm or more and less than 300 μm.

4. The charge - preventing polyamide - based resin composition according to any one of claims 1 to 3, wherein the polymer - type antistatic agent (B) is a polyether - type antistatic agent.

5. The charge - preventing polyamide - based resin composition according to any one of claims 1 to 4, wherein the melt flow rate (MFR) value of the polymer - type antistatic agent (B) measured under the conditions of a temperature of 215 °C and a load of 21 N is 5 g / 10 min to 150 g / 10 min.

6. The charge - preventing polyamide - based resin composition according to any one of claims 1 to 5, wherein the melting point of the polymer - type antistatic agent (B) is 180 °C to 220 °C.

7. The charge - preventing polyamide - based resin composition according to any one of claims 1 to 6, wherein the melting point of the semi - aromatic polyamide resin (A) is 230 °C to 350 °C.

8. The charge - preventing polyamide - based resin composition according to any one of claims 1 to 7, wherein the difference |mp1 - mp2| between the melting point mp1 of the semi - aromatic polyamide resin (A) and the melting point mp2 of the polymer - type antistatic agent (B) is 40 °C to 150 °C.

9. The charge - preventing polyamide - based resin composition according to any one of claims 1 to 8, wherein when the total amount of the charge - preventing polyamide - based resin composition is 100 parts by mass, the total content of the polymer - type antistatic agent (B) and the reinforcing material (C) is 10 parts by mass to 60 parts by mass.

10. When the total amount of the antistatic polyamide resin composition is 100 parts by mass, the total content of the polymer antistatic agent (B) and the reinforcing material (C) is 15 parts by mass to 55 parts by mass. The antistatic polyamide resin composition according to any one of claims 1 to 9, characterized in that.

11. A molded member, characterized in that it is formed by molding the antistatic polyamide resin composition according to any one of claims 1 to 10.

12. The molded member according to claim 11, characterized in that the molded member is used for an electronic component transport tray.

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