Light-emitting device

Abstract

To provide a light emitting apparatus to facilitate wire jointing.SOLUTION: A light emitting apparatus comprises: a base having a side-face part surrounding a bottom face and extending upward; a light emitting device arranged on the bottom face; an electronic component irradiated with light emitted from the light emitting device arranged on the bottom face; first wiring electrically connected to the light emitting device; and second wiring electrically connected to the electronic component. The side-face part has: a first step which is a step composed of an inner face and a top face; and a second step located higher from the bottom face than the first step. The first step has one or more first wiring regions, and the second step has one or more second wiring regions. One end of the first wiring is connected to one of the first wiring region and the second wiring region, and one end of the second wiring is connected to the other one of the first wiring region and the second wiring region.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a light-emitting device.

Background Art

[0002] As disclosed in Patent Document 1, an optical module is already known in which a step is provided on a substrate in which a recess is formed, and a bonding wire is connected to this step portion. Further, in the optical module of Patent Document 1, in addition to the light-emitting element, a light-receiving element is arranged in the recess.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The optical module of Patent Document 1 is not in a form in which the light-emitting element and the light-receiving element are each electrically connected by wiring. Therefore, there is no disclosure regarding facilitating the joining of these wirings in a form in which wirings are joined to each of the light-emitting element and electronic components such as the light-receiving element.

Means for Solving the Problems

[0005] The light-emitting device according to the present invention includes a base having a side surface that surrounds the bottom surface and extends upward from the bottom surface, one or more light-emitting elements disposed on the bottom surface, an electronic component disposed on the bottom surface and irradiated with light emitted from the light-emitting elements, one or more first wirings electrically connected to the light-emitting elements, and one or more second wirings electrically connected to the electronic component. The side surface has a stepped portion composed of an inner surface and an upper surface, a first stepped portion, and a second stepped portion located at a position higher than the first stepped portion from the bottom surface. One or more first wiring regions are provided in the first stepped portion, and one or more second wiring regions are provided in the second stepped portion. One end of the first wiring is joined to one of the first wiring region and the second wiring region, and one end of the second wiring is joined to the other of the first wiring region and the second wiring region. Among the first wiring and the second wiring, the other end of the wiring joined to the first wiring region is joined at a position where the height from the bottom surface is lower than the other end of the wiring joined to the second wiring region.

Advantages of the Invention

[0006] According to the present invention, in a light-emitting device in which a light-emitting element and an electronic component are arranged, it is possible to facilitate the joining of wirings related to the light-emitting element and the electronic component.

Brief Description of the Drawings

[0007]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Embodiments for Carrying Out the Invention

[0008] In this specification or the claims, with regard to polygons such as triangles and quadrilaterals, those having been subjected to processing such as rounding, chamfering, corner rounding, or edge rounding at the corners of the polygon are also included in the term "polygon". Also, not limited to the corners (ends of the sides), those having been subjected to processing at the middle part of the sides are similarly included in the term "polygon". That is, shapes that have been partially processed while leaving the polygon as a base are included in the interpretation of the "polygon" described in this specification and the claims.

[0009] Moreover, not limited to polygons, the same applies to terms representing specific shapes such as trapezoids, circles, and unevenness. The same also applies when dealing with each side forming the shape. That is, even if a side has been subjected to processing at the corner or the middle part, the processed part is included in the interpretation of the "side". When distinguishing a "polygon" or a "side" without partial processing from the processed shape, "strict" is added, for example, described as "strict quadrilateral", etc.

[0010] In addition, in this specification or the claims, when there are a plurality of components corresponding to a certain component and they are to be distinguished and expressed separately, "first", "second" may be appended to the head of the component for distinction. Further, when the objects and viewpoints for distinction are different between this specification and the claims, the same appended notation may not refer to the same object between this specification and the claims.

[0011] For example, in this specification, there are objects distinguished by appending "first", "second", and "third", and when the claims are described targeting only "first" and "third" in this specification, the objects appended with "first" and "second" in the claims may refer to the objects appended with "first" and "third" in this specification.

[0012] Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. However, the disclosed embodiments embody the technical idea of the present invention but do not limit the present invention. Further, in the following description, the same names and reference numerals denote the same or equivalent members, and duplicate descriptions may be omitted as appropriate. Note that the sizes and positional relationships of the members shown in the respective drawings may be exaggerated for convenience of understanding.

[0013] <First Embodiment> The light-emitting device 1 according to the first embodiment will be described. FIGS. 1 to 4 are drawings for explaining an exemplary form of the light-emitting device 1. FIG. 1 is a perspective view of the light-emitting device 1. FIG. 2 is a perspective view of the light-emitting device 1 with the lid member 80 removed. FIG. 3 is a top view of the same state as FIG. 2. FIG. 4 is a cross-sectional view taken along the IV-IV cross-section line of FIG. 3.

[0014] The light-emitting device 1 includes, as components, a base 10, three semiconductor laser elements 20, a submount 30, electronic components 40, a support base 50, optical components 60, a plurality of wirings 70, and a lid member 80 (refer to FIG. 4 in particular for the support base 50).

[0015] In the light-emitting device 1, three semiconductor laser elements 20, a submount 30, electronic components 40, a support base 50, optical components 60, and a plurality of wirings 70 are arranged in a space surrounded by a base 10 and a lid member 80. Further, in the light-emitting device 1, light from the three semiconductor laser elements 20 arranged in the space is emitted. First, each component will be described.

[0016] (Base 10) The base 10 has an arrangement region which is a region for arranging other components, and side walls surrounding the arrangement region. Further, the base has a recess including the arrangement region and the side walls. The recess is recessed from the upper surface to the lower surface of the base 10. Here, the surface that becomes the bottom of the recess of the recess is referred to as the bottom surface. The bottom surface can be a main part of the arrangement region.

[0017] In a top view, the outer shape of the base 10 is rectangular. Also, in a top view, the outer shape of the recessed portion of the recess is rectangular. Further, in a top view, the outer shape of the bottom surface of the base 10 is rectangular and smaller than the outer shape of the recessed portion. Note that these outer shapes do not have to be rectangular.

[0018] The base 10 has a bottom surface portion 11 and a side surface portion 12. The bottom surface portion 11 is a portion that constitutes the bottom surface of the base 10. Further, the bottom surface portion 11 includes the bottom surface and the lower surface of the base 10. The side surface portion 12 is a portion that constitutes the side wall of the base 10. Therefore, the side surface portion 12 surrounds the bottom surface of the base 10 and extends upward from the bottom surface. Further, the side surface portion 12 includes one or more outer side surfaces, one or more inner side surfaces, and an upper surface that intersects the outer side surface and the inner side surface of the base 10.

[0019] Here, the number of inner or outer side surfaces of the base 10 depends on the shape surrounding the bottom surface. For example, if the shape surrounding the bottom surface is rectangular, inner side surfaces corresponding to each of the four sides of the rectangle are formed, and the number of inner side surfaces is plural. Also, for example, if the shape surrounding the bottom surface is circular, an inner side surface corresponding to one circle is formed, and the number of inner side surfaces is one. The same applies to the outer side surface.

[0020] The base 10 has a plurality of stepped portions. Here, the stepped portion refers to a portion composed only of an upper surface and an inner surface that intersects with this upper surface and extends downward. The plurality of stepped portions are included in the side surface portion 12 of the base 10. Also, each of the plurality of stepped portions is provided between the bottom surface and the upper surface of the base 10. Further, it is formed between the outer shape of the recessed portion of the base 10 and the outer shape of the bottom surface in a top view.

[0021] The plurality of stepped portions are formed along the inner surface that intersects with the upper surface of the base 10. Therefore, the upper surfaces of the plurality of stepped portions intersect with the inner surface that intersects with the upper surface of the base 10. Also, the steps formed by the plurality of stepped portions extend over the entire circumference of one or more inner surfaces surrounding the arrangement region of the base 10. Note that the steps do not necessarily need to be formed over the entire circumference.

[0022] The plurality of stepped portions include a first stepped portion 13 and a second stepped portion 15. In the example of the light-emitting device 1 shown in the figure, the plurality of stepped portions are composed only of the first stepped portion 13 and the second stepped portion 15, but may have other stepped portions.

[0023] The first stepped portion 13 and the second stepped portion 15 have different heights. That is, the first stepped portion 13 and the second stepped portion 15 have different heights from the bottom surface of the base 10 to the upper surface of the stepped portion. In the example of the light-emitting device 1 shown in the figure, the second stepped portion 15 has a greater height from the bottom surface of the base 10 than the first stepped portion 13. Note that the first stepped portion 13 may be a base with a greater height than the second stepped portion 15.

[0024] The upper surface of the first stepped portion 13 and the second stepped portion 15 are each formed along a part of one or more inner surfaces that intersect with the upper surface of the base 10. Therefore, the upper surface of the first stepped portion 13 intersects with a part of one or more inner surfaces that intersect with the upper surface of the base 10, and the upper surface of the second stepped portion 15 intersects with a part of one or more inner surfaces that intersect with the upper surface of the base 10 and is different from the part where the upper surface of the first stepped portion 13 intersects.

[0025] In a top view, with respect to one or more inner surfaces that intersect the upper surface of the base 10, the length along which the first step portion 13 extends is longer than the length along which the second step portion 15 extends. Also, with respect to the entire circumference of these one or more inner surfaces, the second step portion 15 is formed along a part of the entire circumference, and the first step portion 13 is formed along the remaining part of the entire circumference.

[0026] Also, in the example of the light-emitting device 1 shown in the figure, a rectangular outer shape is formed by these four inner surfaces in a top view. However, the length of the portion along which the first step portion 13 extends is equal to or greater than the sum of the lengths of the two long sides of the rectangle, and equal to or less than the sum of the lengths of the two long sides and one short side of the rectangle. Also, the length of the portion along which the second step portion 15 extends is equal to or greater than the length of one short side of the rectangle and equal to or less than the length of one long side of the rectangle.

[0027] One or more inner surfaces of the first step portion 13 have a lower side that intersects the bottom surface of the base 10. Also, the inner surface of the second step portion 15 has a lower side that intersects the bottom surface of the base 10. Since the step portion is provided so as to rise from the bottom surface, the step portion can be provided at a position close to the arrangement region. The length of the portion where the first step portion 13 intersects the bottom surface of the base 10 is greater than the length of the portion where the second step portion 15 intersects the bottom surface of the base 10.

[0028] Also, the lower side on the inner surface of the first step portion 13 does not intersect the second step portion 15 except at the endpoints of this side. At this endpoint, the bottom surface of the base 10 and the inner surface of the second step portion 15 intersect.

[0029] Also, the inner surface of the second step portion 15 has a lower side that intersects the bottom surface of the base 10 and a lower side that intersects the upper surface of the first step portion 13. The length of the portion where the inner surface of the second step portion 15 intersects the bottom surface of the base 10 is greater than the length of the portion where the inner surface of the second step portion 15 intersects the upper surface of the first step portion 13. Thereby, a wide bottom surface can be secured, and a sufficient arrangement region can be secured.

[0030] The height of the base 10 from the bottom surface in the second stepped portion 15 is preferably in the range of 1.2 times or more and 3.0 times or less the height of the base 10 from the bottom surface in the first stepped portion 13. Further, the height of the first stepped portion 13 is preferably less than half of the height from the bottom surface to the upper surface of the base 10, and the height of the second stepped portion 15 is preferably greater than half of the height from the bottom surface to the upper surface of the base 10.

[0031] One or a plurality of first wiring regions 14 are provided on the upper surface of the first stepped portion 13. In the example of the light-emitting device 1 shown in the figure, a plurality of first wiring regions 14 are provided. This first wiring region 14 is electrically connected to a wiring region provided on the lower surface of the base 10 through the inside of the base 10. Note that the wiring region electrically connected to the first wiring region 14 is not limited to the lower surface of the base 10, and can be provided on the outer surface (upper surface, outer side surface, and lower surface) of the base 10.

[0032] One or a plurality of second wiring regions 16 are provided on the upper surface of the second stepped portion 15. In the example of the light-emitting device 1 shown in the figure, a plurality of second wiring regions 16 are provided. This second wiring region 16 is electrically connected to a wiring region provided on the lower surface of the base 10 through the inside of the base 10. Note that the wiring region electrically connected to the second wiring region 16 is not limited to the lower surface of the base 10, and can be provided on the outer surface (upper surface, outer side surface, and lower surface) of the base 10.

[0033] The base 10 can be formed mainly of ceramic. Examples of the ceramic used for the base 10 include aluminum nitride, silicon nitride, aluminum oxide, silicon carbide, and the like.

[0034] The base 10 can be formed integrally with the bottom surface portion 11 and the side surface portion 12. Further, the bottom surface portion 11 and the side surface portion 12 may be separately formed using different materials as the main materials, and formed by joining the bottom surface portion 11 and the side surface portion 12. In this case, metal can be used as the main material for the bottom surface portion 11, and ceramic can be used as the main material for the side surface portion 12.

[0035] Also, in this case, the metal used for the bottom surface portion 11 is preferably one with better heat dissipation (higher thermal conductivity) than the ceramic used for the side surface portion 12. For example, copper, aluminum, iron, etc., or as composites, copper molybdenum, copper-diamond composite materials, copper tungsten, etc. can be used.

[0036] Also, metal films are provided at locations corresponding to the first wiring region 14 of the base portion 10 and the wiring region electrically connected thereto, and the second wiring region 16 and the wiring region electrically connected thereto. Also, metal is provided at locations passing through the interior for electrical connection, thereby achieving electrical connection.

[0037] (Semiconductor laser element 20) The semiconductor laser element 20 has a rectangular outer shape in a top view. Also, one of the side surfaces intersecting with one of the two short sides of the rectangle serves as the light emitting end face of the light emitted from the semiconductor laser element 20. Also, the top and bottom surfaces of the semiconductor laser element 20 have a larger area than the light emitting end face.

[0038] Also, the semiconductor laser element 20 is a multi-emitter having two emitters. One electrode common to the two emitters is provided on one of the top or bottom surfaces of the semiconductor laser element 20, and two electrodes corresponding to the respective emitters are provided on the other.

[0039] The light (laser light) emitted from each emitter of the semiconductor laser element 20 has a spread and forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emitting end face. The FFP is the shape and light intensity distribution of the emitted light at a position away from the light emitting end face.

[0040] Here, the light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis. Also, in the light intensity distribution of the FFP, the light having an intensity of 1 / e 2 or more of the peak intensity value is called the light of the main portion.

[0041] The shape of the far-field pattern (FFP) of the light emitted from the semiconductor laser element 20 is an elliptical shape in which the stacking direction perpendicular to the layer direction of the plurality of semiconductor layers including the active layer is longer than the layer direction. Here, the layer direction is defined as the horizontal direction of the FFP, and the stacking direction is defined as the vertical direction of the FFP.

[0042] Further, based on the light intensity distribution of the FFP, the angle corresponding to the full width at half maximum of the light intensity distribution is defined as the light divergence angle of the semiconductor laser element. The light divergence angle in the vertical direction of the FFP is defined as the vertical divergence angle, and the light divergence angle in the horizontal direction of the FFP is defined as the horizontal divergence angle.

[0043] As the semiconductor laser element 20, for example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, or a semiconductor laser element that emits red light can be adopted. Also, a semiconductor laser element that emits light other than these may be adopted.

[0044] Here, blue light refers to light whose emission peak wavelength is in the range of 420 nm to 494 nm. Green light refers to light whose emission peak wavelength is in the range of 495 nm to 570 nm. Red light refers to light whose emission peak wavelength is in the range of 605 nm to 750 nm.

[0045] Examples of the semiconductor laser element that emits blue light or the semiconductor laser element that emits green light include a semiconductor laser element including a nitride semiconductor. As the nitride semiconductor, for example, GaN, InGaN, and AlGaN can be used. Examples of the semiconductor laser element that emits red light include those including InAlGaP-based, GaInP-based, GaAs-based, and AlGaAs-based semiconductors.

[0046] (Submount 30) The submount 30 has two opposing bonding surfaces and is configured in the shape of a rectangular parallelepiped. Also, the distance between the two opposing bonding surfaces of the submount 30 is smaller than the distance between the other two opposing surfaces. Note that the shape of the submount 30 does not have to be limited to a rectangular parallelepiped. The submount 30 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. Also, a metal film is provided on the upper surface of the submount 30.

[0047] (Electronic component 40) The electronic component 40 has a bonding surface and a light irradiation surface. Also, the bonding surface and the light irradiation surface face each other. Also, the electronic component 40 constitutes a part of a light control unit that controls the light irradiated onto the light irradiation surface.

[0048] As the electronic component 40, for example, Micro Electro Mechanical Systems (hereinafter, abbreviated as MEMS is used) can be adopted. Also, for example, a light receiving element such as a photodiode (hereinafter, abbreviated as PD is used) can be adopted. Also, the electronic component 40 can reflect 80% or more of the light irradiated onto the light irradiation surface.

[0049] (Support base 50) The support base 50 has a lower surface and an inclined surface 51 that is inclined with respect to the lower surface. The inclined surface 51 is neither perpendicular nor parallel when viewed from the lower surface. For example, the inclined surface 51 is configured as a plane having an inclination angle of 45 degrees with respect to the lower surface. Note that the inclination angle does not have to be limited to 45 degrees. Also, the inclined surface 51 is one or a plurality of inclined surfaces that are inclined with respect to the lower surface in the support base 50, and when there are a plurality of inclined surfaces, it is the inclined surface with the largest area.

[0050] Also, the inclined surface 51 occupies 60% or more of the area of the support base 50 when viewed from above. Also, when viewed from above, the width from the upper end to the lower end of the inclined surface 51 is 60% or more of the width of the support base 50 in the same direction. That is, the support base 50 has a structure in which the inclined surface 51 occupies a major proportion in this direction.

[0051] The support base 50 can be formed using, for example, ceramics, glass, or metal. For example, ceramics such as aluminum nitride, glass such as quartz or borosilicate glass, or metal such as aluminum can be used. Alternatively, it can also be formed using Si or the like.

[0052] (Optical component 60) The optical component 60 has a bonding surface and a lens surface 61. The lens surface 61 is a surface having the shape of a lens. The positional relationship between the bonding surface and the lens surface 61 is such that when the bonding surface is the lower surface, the lens surface 61 becomes the side surface.

[0053] The lens surface 61 has a shape in which a plurality of lenses are connected. Here, in a side view, the lens surface 61 is formed in a shape where three lenses are continuously connected. The optical component 60 can be formed using, for example, glass such as BK7.

[0054] (Wiring 70) The wiring 70 is configured in a linear shape with both ends being joints. That is, joints for joining to other components are provided at both ends of the linear portion. The wiring 70 is, for example, a metal wire. For the metal, for example, gold, aluminum, silver, copper, etc. can be used.

[0055] (Cover member 80) The cover member 80 has a lower surface and an upper surface, and is configured in a flat plate shape of a rectangular parallelepiped. Note that it does not have to be a rectangular parallelepiped. Also, the cover member 80 has light transmissibility. Therefore, the cover member 80 can also be referred to as a light transmissive member. Note that a light transmissive member that does not have the role of a cover may be used.

[0056] Here, the light transmissibility means that the transmittance with respect to light is 80% or more. Note that it does not have to have a transmittance of 80% or more for light of all wavelengths. Also, the cover member 80 may have a non-light transmissive region (a region that does not have light transmissibility) in part.

[0057] The lid member 80 can be formed using sapphire. Sapphire has light transmissibility, and is also a material with a relatively high refractive index and relatively high strength. In addition to sapphire, for example, glass or the like can also be used.

[0058] (Light-emitting device 1) Next, the light-emitting device 1 will be described. The light-emitting device 1 includes a base 10, three semiconductor laser elements 20 arranged on the base 10, electronic components 40 arranged on the base 10, a plurality of first wirings 71 for electrically connecting the three semiconductor laser elements 20 among the plurality of wirings 70, and a plurality of second wirings 72 for electrically connecting the electronic components 40 among the plurality of wirings 70.

[0059] In the light-emitting device 1, the three semiconductor laser elements 20 are arranged on the base 10 via submounts 30. Note that they may be directly arranged on the bottom surface of the base 10 without using the submounts 30. In this case, the outer shape of the semiconductor laser element 20 may be changed in order to adjust the light emission position (height) at the emission end face.

[0060] The electronic components 40 are arranged on the base 10 via a support base 50. Note that they may be directly arranged on the bottom surface of the base 10 without using the support base 50. In this case, the outer shape of the electronic component 40 may be changed in order to adjust the position (height) and orientation (tilt) of the light irradiation surface 41.

[0061] The light-emitting device 1 also includes an optical component 60 arranged on the base 10. The light-emitting device 1 also includes a lid member 80 that is joined to the base 10 and seals the space where the three semiconductor laser elements 20 are arranged.

[0062] The three semiconductor laser elements 20 are arranged on the bottom surface of the base 10. Therefore, it can be said that they are arranged on the bottom surface portion 11 of the base 10. The three semiconductor laser elements 20 are arranged side by side such that their emission end faces face the same direction. Also, between adjacent semiconductor laser elements 20, the side faces that intersect the respective emission end faces face each other.

[0063] The three semiconductor laser elements 20 can be composed of, for example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, and a semiconductor laser element that emits red light. Also, it may be configured to have a plurality of semiconductor laser elements that emit the same color of light, or may be configured to have semiconductor laser elements that emit other colors of light.

[0064] Note that the number of semiconductor laser elements 20 arranged in the light-emitting device 1 does not have to be three. It may be more than three or less than three. Also, instead of the semiconductor laser element 20, other light-emitting elements such as LEDs may be used. The light-emitting device 1 has at least one or more light-emitting elements.

[0065] The submount 30 is joined to the three semiconductor laser elements 20 on one joining surface. Also, on the other opposing joining surface, it is joined to the bottom surface of the base 10. Therefore, it can be said that it is arranged on the bottom surface portion 11 of the base 10.

[0066] Note that the light-emitting device 1 may have a plurality of submounts 30. At this time, the number of semiconductor laser elements 20 joined to one submount 30 does not have to be three. It may be two or one. That is, in the light-emitting device 1, each of the one or more submounts 30 is joined to at least one or more semiconductor laser elements 20.

[0067] The electronic component 40 is a MEMS. Also, the electronic component 40 is arranged on the bottom surface of the base 10. Therefore, it can be said that it is arranged on the bottom surface portion 11 of the base 10. Also, the electronic component 40 is arranged in such a direction that the light emitted from the semiconductor laser element 20 irradiates the light irradiation surface 41. Also, the entire main part of the light emitted from each of the three semiconductor laser elements 20 is irradiated onto the light irradiation surface 41.

[0068] The light irradiation surface 41 reflects upward the light emitted laterally from the semiconductor laser element 20. Therefore, the light irradiation surface 41 is inclined with respect to the emission end face and the optical axis. The light irradiation surface 41 is inclined at an angle of 10 degrees or more and 80 degrees or less with respect to the bottom surface of the base 10.

[0069] The support base 50 is joined to the electronic component 40 on the inclined surface 51. Further, the support base 50 is arranged such that the inclined surface 51 faces the semiconductor laser element 20. Therefore, it can be said that the electronic component 40 is disposed on the inclined surface 51. By disposing the electronic component 40 via the support base 50, it is not necessary to form the electronic component 40 in a complicated shape. It is preferable that a material that is easier to process in shape than the electronic component 40 be used for the support base 50.

[0070] Further, the support base 50 is joined to the bottom surface of the base 10 on the bottom surface. Therefore, it can be said that it is disposed on the bottom surface portion 11 of the base 10. By joining the bottom surface of the support base 50 to the bottom surface of the base 10, the inclined surface 51 is inclined with respect to the bottom surface.

[0071] The optical component 60 is disposed between the emission end face of the semiconductor laser element 20 and the light irradiation surface 41 of the electronic component 40 in a top view. Further, it is arranged such that the lens surface 61 faces the light irradiation surface 41. The three lenses correspond to the light emitted from each of the three semiconductor laser elements 20. Each lens collimates the light from each semiconductor laser element 20. Therefore, the collimated light is irradiated onto the MEMS as the electronic component 40.

[0072] The MEMS reflects the irradiated light upward. The main part of the light emitted from the semiconductor laser element 20 toward the electronic component 40 travels in a direction different from this. Further, the MEMS reflects only the necessary light among the irradiated light.

[0073] In the electronic component 40, the light emitted from the semiconductor laser element 20 and spread is collimated and irradiated by the optical component 60. Therefore, it is necessary to provide the light irradiation surface 41 at a position higher than the light emission point of the semiconductor laser element 20. Therefore, the height of the electronic component 40 is higher than that of the semiconductor laser element 20.

[0074] The light irradiation surface 41 has a longer length in the direction perpendicular to the bottom surface at the central portion and becomes smaller as it moves away from the center. Therefore, the semiconductor laser element 20 having the largest divergence angle in the vertical direction of the light among the three semiconductor laser elements 20 arranged side by side is arranged in the center. By doing so, the light irradiation surface 41 can be utilized efficiently. Note that the arrangement of the semiconductor laser elements 20 is not limited to this.

[0075] Also, in the example of the light emitting device 1 shown in the figure, the electronic component 40 is higher than the semiconductor laser element 20 also at the joint portion where the wiring is joined. Therefore, in the light emitting device 1 of the figure, the lower first step portion 13 is used for the wiring connection to the semiconductor laser element 20 at the lower position, and the higher second step portion 15 is used for the wiring connection to the electronic component 40 at the higher position to facilitate the wiring joining.

[0076] In a state where the submount 30 is arranged on the bottom surface of the base 10, the height from the bottom surface of the base 10 to the joint surface where the semiconductor laser element 20 of the submount 30 is joined is preferably the same as or less than the height of the first step portion 13 of the base 10. Also, the height from the bottom surface of the base 10 to the upper surface of the semiconductor laser element 20 is preferably higher than or equal to the height of the first step portion 13 of the base 10. By doing so, the connection of the first wiring 71 becomes easier.

[0077] In a state where the electronic component 40 is arranged on the bottom surface of the base 10, the height of the electronic component 40 exceeds the height of the first step portion 13. Also, the height of the joint portion of the second wiring 72 in the electronic component 40 exceeds the height of the first step portion 13. Also, the height of the joint portion of the second wiring 72 in the electronic component 40 is at a position higher than the upper end of the main part of the light irradiated on the light irradiation surface 41.

[0078] In addition, the maximum height (height at the upper end) of the light irradiation surface 41 of the electronic component 40 exceeds the height of the first step portion 13 and the height of the semiconductor laser element 20. On the other hand, the minimum height (height at the lower end) of the light irradiation surface 41 is lower than the height of the first step portion 13 and the height of the semiconductor laser element 20.

[0079] The inner surface of the base 10 can be divided into two surface regions that face each other with the semiconductor laser element 20 and the electronic component 40 sandwiched in series, and two surface regions that face each other with the semiconductor laser element 20 and the electronic component 40 sandwiched in parallel, in a state where the semiconductor laser element 20 and the electronic component 40 are arranged on the base 10. When the outer shape of the recessed portion is rectangular in a top view like the light emitting device 1, the inner surfaces corresponding to each of the four sides of the rectangle become the respective surface regions.

[0080] At this time, the inner surface of the first step portion 13 is formed in two surface regions that face each other with the semiconductor laser element 20 and the electronic component 40 sandwiched in parallel. This makes it easier to provide the first wiring region 14 at a position avoiding the optical path of the light of the main part.

[0081] In addition, the inner surface of the second step portion 15 is formed in the surface region where the distance to the electronic component 40 is shorter than the distance to the semiconductor laser element 20 among the two surface regions that face each other with the semiconductor laser element 20 and the electronic component 40 sandwiched in series. Since the second step portion 15 is located on the back surface of the light irradiation surface 41 of the electronic component 40, it becomes easier to avoid the step portion from entering the optical path of the light reflected from the electronic component 40.

[0082] In addition, the inner surface of the first step portion 13 is formed in the surface region where the distance to the electronic component 40 is longer than the distance to the semiconductor laser element 20 among the two surface regions that face each other with the semiconductor laser element 20 and the electronic component 40 sandwiched in series. Thereby, the first wiring region 14 can be provided in the region where light travels in the direction opposite to the direction in which light travels from the emission end surface of the semiconductor laser element 20, and it becomes easier to join the wiring 70 while avoiding the optical path of the light of the main part.

[0083] In the example of the light-emitting device 1 in FIG. 3, the first step portion 13 has an inner surface on which the distance to the electronic component 40 is longer than the distance to the semiconductor laser element 20 among two inner surfaces facing each other with a parallel sandwich and two inner surfaces facing each other with a series sandwich. Further, the second step portion 15 has an inner surface on which the distance to the electronic component 40 is shorter than the distance to the semiconductor laser element 20 among two inner surfaces facing each other with a series sandwich.

[0084] One of the joining portions at both ends of the first wiring 71 is joined to the first wiring region 14. Further, the joining portion at the other end of both ends is joined to the upper surface of the semiconductor laser element 20 or the upper surface of the submount 30. A joining region is provided on the upper surface of the semiconductor laser element 20 or the upper surface of the submount 30 for joining with the first wiring 71.

[0085] Note that not all of the plurality of first wirings 71, that is, all the wirings used for the electrical connection of the three semiconductor laser elements 20 need to be joined to the first wiring region 14. One joining portion at one end of one or more first wirings 71 is joined to the first wiring region 14.

[0086] One of the joining portions at both ends of the second wiring 72 is joined to the second wiring region 16. Further, the joining portion at the other end of both ends is joined to the electronic component 40. A joining region is provided on the electronic component 40 for joining with the second wiring 72.

[0087] Note that not all of the plurality of second wirings 72, that is, all the wirings used for the electrical connection of the electronic component 40 need to be joined to the second wiring region 16. One joining portion at one end of one or more second wirings 72 is joined to the second wiring region 16.

[0088] The joining region of the electronic component 40 is above the center of the light irradiation surface 41. Further, the height of the joining region of the electronic component 40 is higher than the height of the joining regions of the semiconductor laser element 20 and the submount 30. The joining region of the electronic component 40 is preferably near the upper end of the surface on which the light irradiation surface 41 is provided. By providing it at such a position, it becomes easier to join the second wiring 72.

[0089] Also, the joining region with the second wiring 72 in the electronic component 40 is preferably located at a position away from the light irradiation surface 41. By providing it outside the light irradiation surface 41, it becomes easier to stretch the second wiring 72 so as not to block the light from the semiconductor laser element 20.

[0090] In the example of the light-emitting device 1 shown in the figure, the number of wirings related to the electrical connection of the semiconductor laser element 20 is larger than the number of wirings related to the electrical connection of the electronic component 40. Therefore, there are more first wirings 71 than second wirings 72, and accordingly, more first wiring regions 14 are provided than second wiring regions 16.

[0091] Also, in the example of the light-emitting device 1 shown in the figure, the length of the portion along the periphery of the first step portion 13 is longer than the length of the portion along the periphery of the second step portion 15. By providing a longer step portion for providing more wiring regions, convenience of wiring joining is achieved. Therefore, the magnitude relationship between the number of first wiring regions and the number of second wiring regions is consistent with the magnitude relationship between the length of the portion along the periphery of the first step portion 13 and the length of the portion along the periphery of the second step portion 15.

[0092] The lid member 80 is disposed on the upper surface of the base 10. Therefore, it can be said that it is disposed on the side surface portion 12 of the base 10. Also, the lid member 80 is joined to the upper surface of the base 10 located above the second step portion 15. Also, when the lid member 80 is joined, a closed space surrounded by the base 10 and the lid member 80 is created. This space is the space where the semiconductor laser element 20 is disposed.

[0093] Also, by joining the lid member 80 to the base 10 in a predetermined atmosphere, a hermetically sealed closed space is created. By hermetically sealing the space where the semiconductor laser element 20 is disposed, quality degradation due to dust collection can be suppressed.

[0094] In the light-emitting device 1, the light emitted from the light-emitting device 1 through the lid member 80 can be controlled by the MEMS used as the electronic component 40. Further, the lid member 80 has translucency with respect to the light emitted from the semiconductor laser element 20. The light control unit is realized by electrically connecting a control mechanism provided outside the light-emitting device 1 and the electronic component 40 through the wiring region of the base 10.

[0095] As described above, in the light-emitting device 1, since the joining positions of the semiconductor laser element 20 and the electronic component 40 for electrical connection are at different heights, stepped portions of different heights are also formed in the base 10 to connect the wiring 70. By doing so, the joining of the wiring can be facilitated.

[0096] Note that based on such a technical idea, the light-emitting device according to the present invention may not be limited to the first embodiment. In the light-emitting device 1, the first wiring 71 related to the electrical connection of the semiconductor laser element 20 is joined to the first stepped portion 13 which is the lower stepped portion, and the second wiring 72 related to the electrical connection of the electronic component 40 is joined to the second stepped portion 15 which is the higher stepped portion. This is because the joining position of the electronic component 40 is higher than the joining position of the semiconductor laser element 20. However, when the joining position of the semiconductor laser element 20 is higher than the joining position of the electronic component 40, it is better to join the first wiring 71 to the second stepped portion 15 and the second wiring 72 to the first stepped portion 13.

[0097] That is, one end of the first wiring 71 is joined to one of the first wiring region 14 and the second wiring region 16, and one end of the second wiring 72 is joined to the other of the first wiring region 14 and the second wiring region 16. Then, among the first wiring 71 and the second wiring 72, the other end of the wiring joined to the first wiring region 14 is joined at a position where the height from the bottom surface of the base 10 is lower than the other end of the wiring joined to the second wiring region 16. Also, among the first wiring 71 and the second wiring 72, the other end of the wiring joined to the second wiring region 16 is arranged at a position where the height from the bottom surface of the base 10 is higher than the first wiring region 14.

[0098] <Second Embodiment> The light-emitting device 2 according to the second embodiment will be described. FIGS. 5 to 9 are drawings for explaining an exemplary form of the light-emitting device 2. FIG. 5 is a perspective view of the light-emitting device 2. FIG. 6 is a perspective view of the light-emitting device 2 with the lid member 80 removed. FIG. 7 is a top view of the same state as FIG. 6. FIG. 8 is a cross-sectional view taken along the VIII-VIII cross-section line of FIG. 7. FIG. 9 is a top view of the electronic component 40 according to the second embodiment as viewed from the light-irradiating surface. The ellipse shown in FIG. 9 indicates the region irradiated with the main part of the light from the semiconductor laser element 20. Also, the major axis of the ellipse is marked with a dashed line.

[0099] The light-emitting device 2 includes, as components, a base 10, three semiconductor laser elements 20, a submount 30, an electronic component 40, a support base 50, a plurality of wirings 70, and a lid member 80. The light-emitting device 2 of the second embodiment is different from the light-emitting device 1 of the first embodiment in that it does not have an optical component 60. Also, it is different from the light-emitting device 1 of the first embodiment in that the electronic component is a PD.

[0100] In the example of the illustrated light-emitting device 2, the number of first wirings 71 is larger than that of the light-emitting device 1 shown in FIG. 3. In the light-emitting device 2 according to the second embodiment, the three semiconductor laser elements 20 are individually electrically connected so that the outputs can be individually adjusted. Note that each of the semiconductor laser elements 20 is a multi-emitter having two emitters.

[0101] In the light-emitting device 2, on the light-irradiating surface 241 of the electronic component 40, light-receiving regions 242 corresponding to the light emitted from each of the three semiconductor laser elements 20 are provided. Part of the light irradiated on the light-receiving region 242 is received, and the rest is reflected upward. To emit a large amount of light, it is preferable to reflect 90% or more of the light. In the example of the light-emitting device 2, the three light-receiving regions 242 are provided so as to be arranged in the same direction as the direction in which the three semiconductor laser elements 20 are arranged.

[0102] Further, the light-receiving region 242 of 1 corresponds to the semiconductor laser element 20 of 1, and each light-receiving region 242 is separated. That is, each light-receiving region 242 is separated and does not overlap. Further, corresponding to each light-receiving region 242, a joining region with the second wiring 72 for electrical connection is provided.

[0103] As shown in FIG. 9, the joining region with the second wiring 72 in the electronic component 40 has a first joining region 243 corresponding to each of the light-receiving regions and a second joining region 244 that is commonly used for the plurality of light-receiving regions.

[0104] Both the first joining region 243 and the second joining region 244 are provided above the region irradiated with the main part of the light from the semiconductor laser element 20. In other words, in the light-emitting device 2, it is provided at a position farther from the semiconductor laser element 20 than the region irradiated with the main part of the light.

[0105] Also, in a top view, each light-receiving region 242 has a portion where the lateral width becomes narrower at the upper end. Specifically, it has a shape with a notch at the upper end corner. The shape and position of the portion where the lateral width is narrowed are common to each light-receiving region 242.

[0106] Further, the first joining region 243 is provided in the region vacated by the narrowing of the width. The first joining region 243 related to one light-receiving region 242 protrudes laterally from that light-receiving region 242. When the adjacent light-receiving regions 242 are arranged in this protruding direction, this protruding portion is provided in the region vacated by the narrowing of the width of the adjacent light-receiving region 242.

[0107] The first joining region 243 is not provided on the straight line passing through the major axis of the light mainly irradiated to the light-receiving region 242. That is, the first joining region 243 is provided at a position avoiding this straight line. As shown in FIGS. 7 and 8, the second wiring 72 joined to the first joining region 243 extends upward therefrom and is joined to the second wiring region 16. By avoiding the straight line passing through the major axis of the light, it becomes easier to avoid the second wiring 72 from blocking the light reflected by the electronic component 40.

[0108] The first junction region 243 disposed between the two light-receiving regions 242 is provided between the straight lines passing through the major axes of the light of the main portions irradiated to the respective two light-receiving regions 242. That is, the first junction region 243 does not exceed these two straight lines. This makes it easier to avoid the second wiring 72 from blocking the light irradiated to the adjacent light-receiving region 242 and reflected.

[0109] Also, among the two closest sides of the two opposing sides of the two adjacent light-receiving regions 242, the first junction region 243 protrudes from one side, and the straight line passing through the other side passes through the first junction region 243. With such a positional relationship, the first junction region 243 can be provided while arranging the light-receiving regions 242 close to each other, and it can contribute to miniaturization of the light-emitting device 2.

[0110] Also, in a top view, the second junction region 244 is provided near the upper end of the electronic component 40 and near the side side among the two side sides in the direction opposite to the protruding direction of the first junction region 243. The second junction region 244 is not provided on the straight line passing through the major axis of the light of the main portion irradiated to the light-receiving region 242 closest to the second junction region 244.

[0111] Note that the form is not limited to the form in which one light-receiving region corresponds to one semiconductor laser element 20, and one light-receiving region may correspond to a plurality of semiconductor laser elements 20. One or a plurality of light-receiving regions are provided on the light irradiation surface 241.

[0112] In the light-emitting device 2, the PD used as the electronic component 40 can receive a predetermined ratio of the light irradiated to the light irradiation surface 241. The light control unit can calculate the light amount of the light emitted from the light-emitting device 2 and the light amount of the light reflected by the electronic component 40 based on this light reception result. Also, based on the calculation result, control such as adjusting the intensity of the light emitted from the semiconductor laser element 20 becomes possible.

[0113] <Third Embodiment> FIG. 10 is a perspective view of the light-emitting device 3 according to the third embodiment. FIG. 11 is a top view of the light-emitting device 3 shown in FIG. 10 with the lid member 80 removed.

[0114] The light-emitting device 3 includes, as components, a base 310, three semiconductor laser elements 20, a submount 30, electronic components 40, a support base 50, a plurality of wirings 70, and a lid member 80. The light-emitting device 3 of the third embodiment has a different portion where a step portion is formed compared to the bases 10 of the first and second embodiments. Also, in the light-emitting device 3, the number of first wiring regions 14 that need to be secured is smaller than that of the light-emitting device 1 and the light-emitting device 2.

[0115] The number of first wiring regions 14 to be secured can be affected by, for example, the number of semiconductor laser elements 20. When individually driving the semiconductor laser elements 20, if the number of semiconductor laser elements 20 increases, the number of required wiring regions also increases. If this wiring region is provided in the above-described first step portion, the number of first wiring regions 14 will increase.

[0116] Also, for example, the number of first wiring regions 14 to be secured can be affected by the number of emitters of one semiconductor laser element 20. When driving the semiconductor laser element 20 in units of emitters, if the number of emitters increases, the number of required wiring regions also increases. If this wiring region is provided in the first step portion, the number of first wiring regions 14 will increase.

[0117] In the example of the illustrated light-emitting device 3, each of the three semiconductor laser elements 20 is composed of a single emitter having only one emitter. Note that the number of first wiring regions is not limited to this and can also change due to other factors. For example, there may be a case where a protection element such as a Zener diode is provided to protect the semiconductor laser element 20.

[0118] The region that must be secured as the first step portion also changes depending on the number of first wiring regions that need to be provided. If the region forming the first step portion is appropriately designed and the size of the base can be reduced, it will lead to miniaturization of the light-emitting device.

[0119] In the light-emitting device 3, on the side surface portion 312, the inner surface of the first stepped portion 313 is not formed in the surface region where the distance to the electronic component 40 is shorter than the distance to the semiconductor laser element 20 among the two surface regions facing each other with the semiconductor laser element 20 and the electronic component 40 sandwiched in series. Thereby, the light-emitting device can be designed to be small.

[0120] In the illustrated example of the light-emitting device 3, the first stepped portion 313 has two inner surfaces facing each other with being sandwiched in parallel. Further, among the two inner surfaces facing each other with being sandwiched in series, there is no stepped portion having the inner surface where the distance to the electronic component 40 is longer than the distance to the semiconductor laser element 20.

[0121] Further, in the light-emitting device 3, the first stepped portion 313 is formed in a region that is a straight line perpendicular to the emission end surface of the semiconductor laser element 20 and does not intersect any straight line passing through the semiconductor laser element 20, with respect to all of the three semiconductor laser elements 20 in a top view.

[0122] As described above, the light-emitting device according to the embodiment has been described. However, the light-emitting device according to the present invention is not strictly limited to the light-emitting device of the embodiment. That is, the present invention can be realized without being limited to the outer shape and structure of the light-emitting device disclosed by the embodiment. Further, it can be applied without necessarily including all the components in a necessary and sufficient manner. For example, when a part of the components of the light-emitting device disclosed by the embodiment is not described in the claims, regarding that part of the components, the freedom of design by those skilled in the art such as substitution, omission, deformation of the shape, and change of the material is recognized, and it is specified that the invention described in the claims is applied thereon.

Industrial Applicability

[0123] The light-emitting device described in each embodiment can be used for a head-mounted display, a projector, an in-vehicle headlight, illumination, a display, and the like.

Explanation of Signs

[0124] 1, 2, and 3 Light-emitting devices 10 and 310 Bases 11 Bottom surface 12 and 312 Side surfaces 13 and 313 First step portions 14 First wiring region 15 Second step portion 16 Second wiring region 20 Semiconductor laser element 30 Submount 40 Electronic component 41 and 241 Light-irradiating surfaces 242 Light-receiving region 243 First bonding region 244 Second bonding region 50 Support base 51 Inclined surface 60 Optical component 61 Lens surface 70 Wiring 71 First wiring 72 Second wiring 80 Cover member

Claims

1. A base having a side portion surrounding a bottom surface and extending upward from the bottom surface; A first light emitting element disposed on the bottom surface; One or more first wirings electrically connected to the first light emitting element; having the side surface portion includes a first step portion and a second step portion opposed to the first step portion, a height of the first step portion from the bottom surface is different from a height of the second step portion from the bottom surface, A first wiring region is provided in the first step portion, one end of each of the one or more first wirings is joined to the first wiring region; The first light-emitting element is located between the first step portion and the second step portion in a top view, and is arranged to emit light toward the second step portion.

2. A light-emitting device as described in claim 1, wherein the height of the second step portion from the bottom surface is greater than the height of the first step portion from the bottom surface.

3. The light emitting device further comprises a second light emitting element, the second light emitting element is located between the first step portion and the second step portion in a top view and is arranged to emit light toward the second step portion; The light emitting device according to claim 1 , wherein the one or more first wirings are a plurality of first wirings, and at least one of the plurality of first wirings is electrically connected to the second light emitting element.

4. The light emitting device further comprises a third light emitting element, the third light emitting element is located between the first step portion and the second step portion in a top view and is arranged to emit light toward the second step portion; The light emitting device according to claim 3 , wherein at least one of the plurality of first wirings is electrically connected to the third light emitting element.

5. The light emitting device further comprises a light reflecting member, The light emitting device according to claim 1 , wherein the light reflecting member is located between the first light emitting element and the second step portion when viewed from above, and is arranged so as to reflect light emitted from the first light emitting element.

6. The light-emitting device as described in claim 5, wherein the light-reflecting member is an electronic component.

7. The light emitting device further has one or more second wirings electrically connected to the light reflecting member, A second wiring region is provided in the second step portion, The light emitting device according to claim 6 , wherein one end of each of the one or more second wirings is joined to the second wiring region.

8. A base having a side portion surrounding a bottom surface and extending upward from the bottom surface; A first light emitting element disposed on the bottom surface; One or more first wirings electrically connected to the first light emitting element; having The side surface portion includes a first step portion and a second step portion, a height of the first step portion from the bottom surface is different from a height of the second step portion from the bottom surface, A first wiring region is provided in the first step portion, one end of each of the one or more first wirings is joined to the first wiring region; The first light emitting element has a side surface facing the light exit surface and facing the first step portion, and is disposed so as to emit light toward the second step portion.

9. The light-emitting device as described in claim 8, wherein the height of the second step portion from the bottom surface is greater than the height of the first step portion from the bottom surface.

10. The light emitting device further comprises a second light emitting element, the second light emitting element has a side surface facing the emission surface and facing the first step portion, and is disposed so as to emit light toward the second step portion; The light emitting device according to claim 8 , wherein the one or more first wirings are a plurality of first wirings, and at least one of the plurality of first wirings is electrically connected to the second light emitting element.

11. The light emitting device further comprises a third light emitting element, the third light emitting element has a side surface facing the emission surface and facing the first step portion, and is disposed so as to emit light toward the second step portion; The light emitting device according to claim 10 , wherein at least one of the plurality of first wirings is electrically connected to the third light emitting element.

12. The light emitting device further comprises a light reflecting member, 12. The light emitting device according to claim 8, wherein the light reflecting member is located between the first light emitting element and the second step portion when viewed from above, and is arranged so as to reflect light emitted from the first light emitting element.

13. The light emitting device as described in claim 12, wherein the light reflective member is an electronic component.

14. The light emitting device further has one or more second wirings electrically connected to the light reflecting member, A second wiring region is provided in the second step portion, The light emitting device according to claim 13 , wherein one end of each of the one or more second wirings is joined to the second wiring region.

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