Electronic device

Abstract

Provided is an electronic device capable of reducing component costs. 【Solution means】The electronic device includes a housing member, a substrate having a first surface and a second surface and provided with mounting holes penetrating in the plate thickness direction, a support surface supporting the first surface of the substrate, a screw hole into which a screw passed through the mounting hole is tightened from the second surface side toward the first surface side, a boss portion provided so as to protrude on the inner surface side of the housing member, a through hole coaxially disposed with the screw hole and through which the screw passes, a stud component mounted on the second surface of the substrate so as to cover the mounting hole, and a substrate fixing component fixed to the stud component by the screw tightened into the screw hole.

Description

Technical Field

[0001] The present invention relates to an electronic device including a substrate.

Background Art

[0002] An electronic device such as a notebook PC mounts a substrate on which components such as a CPU and connectors are mounted. In many cases, the substrate is screwed to a housing member or a keyboard device supported by the housing member. On the surface of the substrate, components such as brackets for holding electronic components connected to the connectors are fixed. For example, Patent Document 1 discloses a configuration in which such a component is screwed to a stud component mounted on the substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Conventionally, dedicated stud components have been mounted on the substrate to screw the above components. That is, the substrate is deprived of mounting space by the number of mounted stud components. For this reason, conventionally, it has been necessary to increase the substrate area according to the number of mounted stud components, and the component cost has increased.

[0005] The present invention has been made in consideration of the above problems of the prior art, and an object thereof is to provide an electronic device capable of reducing component costs.

Means for Solving the Problems

[0006] An electronic device according to one aspect of the present invention includes a housing member, a substrate having a first surface and a second surface and provided with mounting holes penetrating in the plate thickness direction, a support surface that supports the first surface of the substrate, and a screw hole into which a screw passed through the mounting hole from the second surface side toward the first surface side is tightened. The electronic device further includes a boss portion provided so as to protrude on the inner surface side of the housing member, a stud component mounted on the second surface of the substrate so as to cover the mounting hole and having a through hole coaxially arranged with the screw hole and through which the screw passes, and a substrate fixing component fixed to the stud component by the screw tightened into the screw hole.

Advantages of the Invention

[0007] According to the above aspect of the present invention, component costs can be reduced.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0009] Hereinafter, preferred embodiments of the electronic device according to the present invention will be given and described in detail with reference to the accompanying drawings.

[0010] FIG. 1 is a schematic plan view of an electronic device 10 according to an embodiment as viewed from above. As shown in FIG. 1, the electronic device 10 of this embodiment is a clamshell-type notebook PC. The electronic device 10 has a configuration in which a lid body 11 and a housing 12 are relatively rotatably connected by a hinge 14. In this embodiment, the electronic device 10 of the notebook PC is exemplified, but the electronic device may be other than a notebook PC, such as a desktop PC, a display device, a tablet PC, a smartphone, or a portable game machine.

[0011] The lid body 11 is a thin and flat box-shaped housing. The lid body 11 mounts a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0012] The housing 12 is a thin and flat box. A keyboard device 18 and a touch pad 19 face the upper surface (surface 12a) of the housing 12. Hereinafter, regarding the housing 12 and each component mounted thereon, based on the posture in which the operator operates the keyboard device 18, the width direction (left and right) of the housing 12 is referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 is referred to as the Y1 and Y2 directions, and the thickness direction (up and down) of the housing 12 is referred to as the Z1 and Z2 directions, respectively, for explanation. The X1 and X2 directions may be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may be similarly referred to as the Y direction and the Z direction. Also, for convenience of explanation, in the thickness direction of the housing 12, the Z1 direction may be referred to as down and the reverse (Z2 direction) may be referred to as up (see FIG. 3 etc.). These directions are directions defined for convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10.

[0013] The housing 12 is composed of a housing member 20 that forms the upper surface and the four peripheral side surfaces, and a cover material 21 that forms the lower surface. The housing member 20 is formed by forming vertical walls 20B at the four peripheral edges of a cover plate 20A that forms the surface 12a of the housing 12. Therefore, the housing member 20 has a substantially bathtub shape with an open lower surface. The cover material 21 has a substantially flat plate shape and serves as a lid for closing the lower surface opening of the housing member 20. The housing member 20 and the cover material 21 are overlapped in the thickness direction and detachably connected to each other. The vertical wall 20B may be formed on the cover material 21. In this case, the housing member 20 may be composed of only the cover plate 20A.

[0014] The hinge 14 is installed in a concave hinge placement groove 12b formed at the rear edge of the housing 12 to connect the housing 12 and the lid 11. The hinge 14 has, for example, a structure in which a hinge shaft serving as a rotation axis is supported at both ends in the longitudinal direction of the hinge housing.

[0015] FIG. 2 is a plan view schematically showing the internal structure of the housing 12. FIG. 2 is a view of the inside of the housing member 20 looking from the bottom side with the cover material 21 removed.

[0016] As shown in FIG. 2, a thermal module 24, a substrate 25, and a battery device 26 are housed inside the housing 12. Inside the housing 12, various electronic components, mechanical components, etc. are further provided.

[0017] The substrate 25 is a circuit board that serves as the main board (mother board) of the electronic device 10. The substrate 25 is arranged closer to the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source of the electronic device 10. The battery device 26 is arranged closer to the Y1 side of the substrate 25 and extends in the X direction.

[0018] The substrate 25 of this embodiment mounts a CPU (Central Processing Unit) 25a. In addition to the CPU 25a, the substrate 25 can mount various electronic components such as a GPU. For example, the first surface 25A on the Z1 side of the substrate 25 serves as an attachment surface to the housing member 20 and the keyboard device 18, and the second surface 25B on the Z2 side serves as a mounting surface for the CPU 25a and the like. The first surface 25A of the substrate 25 is fixed to the inner surface (Z2 side surface) of the housing member 20 using, for example, screws 27. Further, the first surface 25A is also fixed to the bottom surface (Z2 side surface) of the keyboard device 18 using a fastening structure 52 described later.

[0019] The thermal module 24 can absorb and diffuse the heat generated by the CPU 25a, which is a heat-generating body, and discharge it outside the housing 12. The thermal module 24 may be configured to cool heat-generating bodies other than the CPU 25a, such as a GPU. As shown in FIG. 2, the thermal module 24 can include a heat dissipation member 32 including a metal plate 30, a pressing component 34, and a pair of left and right fans 36, 36.

[0020] The heat dissipation member 32 can absorb and diffuse the heat of the CPU 25a. The heat dissipation member 32 is provided so as to cover a part of the second surface 25B of the substrate 25 together with the CPU 25a. The metal plate 30 is a thin metal plate-like member formed of a material with high thermal conductivity such as copper or aluminum. The metal plate 30 of this embodiment is a copper plate. The heat dissipation member 32 can laminate a heat transport device such as a heat pipe or a vapor chamber on the Z1 side surface of the metal plate 30. The heat pipe is formed by flattening a metal pipe thinly into an elliptical cross-section and enclosing a working fluid in the inner sealed space. The vapor chamber is formed by enclosing a working fluid in a sealed space formed between two metal plates.

[0021] The pressing component 34 is a component for pressing the heat dissipation member 32 against the CPU 25a. The pressing component 34 constantly biases the heat dissipation member 32 toward the second surface 25B of the substrate 25. The pressing component 34 has a pair of leaf spring members 34a, 34a in the Y direction. The leaf spring member 34a is connected to, for example, a thin metal frame with its central portion fixed to the Z1 side surface of the heat dissipation member 32, and presses the heat dissipation member 32 against the CPU 25a through this metal frame. This metal frame is provided so as to surround the CPU 25a inside the frame and is fixed to the surface on the Z1 side of the heat dissipation member 32 by soldering or the like. Both ends of each leaf spring member 34a are fastened and fixed to stud components 42 mounted on the second surface 25B of the substrate 25 using screws 44. The stud component 42 has a female screw hole capable of fastening the screw 44 and protrudes from the second surface 25B.

[0022] As shown in FIG. 2, the left and right fans 36 are arranged side by side in the X direction so as to straddle the heat dissipation member 32 between them and face each other. Each fan 36 has an air outlet 36b on the side surface 36a facing each other. The air outlets 36b of the left and right fans 36 face each other with the heat dissipation member 32 sandwiched therebetween. Thereby, each fan 36 can discharge air toward the thermal module 24. Each fan 36 has an air inlet 36c at least on the end face on the Z2 side among the upper and lower end faces facing the Z direction. The air inlet 36c can also be provided on the end face on the Z1 side. The air inlet 36c can suck in outside air (cool air) from, for example, a vent formed in the bottom surface of the housing 12. The fan 36 can be configured as a centrifugal fan that rotates an impeller housed inside the housing by a motor. The fan 36 can discharge the air sucked in from the air inlet 36c from the air outlet 36b.

[0023] The housing 12 is provided with an exhaust port 46 formed in the standing wall 20B at the rear edge portion (Y2 side edge portion) thereof. The exhaust port 46 is a vent that can discharge the air (warm air) discharged from the air outlets 36b of each fan 36 and flowing around the substrate 25 and the thermal module 24 to the outside of the housing 12. A plurality of fins are erected on the surface 30a on the Z2 side of the metal plate 30 to expand the heat exchange area.

[0024] As shown in FIG. 2, on the second surface 25B of the substrate 25, for example, a connector 25b, electronic components 25c, and an external connection port 25d are mounted.

[0025] The cable 48 is connected to the connector 25b. For example, a pair of left and right cables 48 are provided. One cable 48 is, for example, a wiring for connecting the display 16 mounted on the lid 11 to the substrate 25. The other cable 48 is, for example, a wiring for connecting the camera 17 (see FIG. 1) mounted on the lid 11 to the substrate 25. Each cable 48 can be composed of, for example, a flexible printed circuit (FPC). The connector 25b is a so-called BtoB connector (connector for substrate-to-substrate). A pair of left and right connectors 25b are provided corresponding to the left and right cables 48. The connector 25b can be provided, for example, near both ends of the leaf spring member 34a on the Y2 side.

[0026] The connection part between the cable 48 and the connector 25b is held by a bracket 50. The bracket 50 can be composed of a metal plate such as stainless steel (SUS). As shown in FIG. 2, the left and right brackets 50 can be used by arranging the same parts symmetrically left and right. The bracket 50 is arranged so as to straddle the cable 48 in the width direction, and presses and holds the cable 48 from above the connector 25b. Thereby, the bracket 50 prevents the cable 48 from coming off the connector 25b. One end of the bracket 50 in the direction (X direction) straddling the cable 48 is fixed to the substrate 25 using a fastening structure 52 described later. The other end of the bracket 50 is supported, for example, by the end of the leaf spring member 34a on the Y2 side. The fastening structure 52 may also be applied to the other end of the bracket 50.

[0027] The electronic component 25c is a communication module corresponding to, for example, an SSD or a WWAN. The electronic component 25c is connected to the substrate 25 via a connector 25c1. One end of the electronic component 25c opposite to the connector 25c1 side is fixed to the second surface 25B with a screw 25c2. The external connection port 25d is an IO port such as a USB or a LAN. The external connection port 25d is integrally provided, for example, on a metal bracket fixed to the second surface 25B with a screw 25d1.

[0028] As shown in FIG. 2, the battery device 26 can have mounting pieces 26a protruding from the edge on the Y2 side. For example, a pair of left and right mounting pieces 26a are provided. The mounting pieces 26a are arranged overlapping the second surface 25B of the substrate 25 and are fixed to the substrate 25 using a fastening structure 52 similar to that of the bracket 50. The edge on the Y1 side of the battery device 26 is connected to the housing member 20 by, for example, a hook structure.

[0029] Next, the fastening structure 52 will be described.

[0030] FIG. 3 is a schematic side cross-sectional view of the fastening structure 52. FIG. 4 is an exploded view of the fastening structure 52 shown in FIG. 3.

[0031] As shown in FIGS. 2 and 3, the fastening structure 52 can integrally fix the substrate 25 to the keyboard device 18 supported by the housing member 20 and fix a predetermined component to the substrate 25. The components fixed to the substrate 25 are, for example, the bracket 50 and the mounting piece 26a (battery device 26). Hereinafter, such components may also be collectively referred to as "substrate fixing components 53".

[0032] The keyboard device 18 occupies a large area on the inner surface side of the housing member 20. The keyboard device 18 has, for example, a metal base plate 18a that supports keycaps, a scissor mechanism, rubber domes, and a membrane sheet (see FIG. 3). In the present embodiment, a fastening structure 52 configured to fix the substrate 25 to the base plate 18a is illustrated.

[0033] The fastening structure 52 can also be used in a configuration for directly fixing the substrate 25 to the inner surface of the housing member 20. In this case, for example, as indicated by the reference numerals 20 and 20A enclosed in parentheses in FIG. 3, the fastening structure 52 may be applied to the cover plate 20A of the housing member 20 instead of the base plate 18a. The object to which the substrate (substrate 25) is fixed by the fastening structure 52 may be a member other than the housing member 20 or the keyboard device 18, for example, a predetermined metal bracket supported by the housing member 20 or the like.

[0034] As shown in FIGS. 3 and 4, the fastening structure 52 includes a boss portion 54, a stud component 56, and a screw 58.

[0035] The boss portion 54 is provided so as to protrude in the Z2 direction on the inner surface side of the housing member 20. The boss portion 54 is a portion for fixing the substrate 25 to the base plate 18a. The boss portion 54 can be composed of a columnar member standing from the base plate 18a toward the substrate 25 side (Z2 side). The boss portion 54 may be fixed to the base plate 18a by screwing or welding, or may be integrally formed with the base plate 18a. When providing the boss portion 54 on the housing member 20, if the housing member 20 is made of metal, it may be integrally formed with the housing member 20. If the housing member 20 is made of resin, it is preferable to use an insert nut. Among the plurality of fastening structures 52, some of the boss portions 54 may be provided on the keyboard device 18, and another part of the boss portions 54 may be provided on the housing member 20.

[0036] The boss portion 54 can have a support surface 54a, a protruding portion 54b, and a screw hole 54c.

[0037] The support surface 54a is a surface that supports the first surface 25A of the substrate 25. The support surface 54a is a flange-shaped portion formed in a ring shape around the protruding portion 54b and the screw hole 54c. The support surface 54a is preferably brought into contact with the ground pattern 60a provided on the first surface 25A. Then, the substrate 25 can be easily grounded to the frame ground. The ground pattern 60a is formed in a ring shape surrounding the mounting hole 25C of the substrate 25. The mounting hole 25C is a through hole that penetrates the substrate 25 in the plate thickness direction.

[0038] The protruding portion 54b is a cylindrical portion protruding upward (on the Z2 side) from the center of the support surface 54a. The protruding portion 54b is passed through the mounting hole 25C. In the configuration example shown in FIG. 3, the protruding portion 54b protrudes through the mounting hole 25C to the second surface 25B side.

[0039] The threaded hole 54c is a hole into which the screw 58 is tightened, and an internal thread is formed on the inner peripheral surface. The threaded hole 54c is provided inside the protruding portion 54b and opens at the top surface (protruding end surface 54b1) of the protruding portion 54b. The depth of the threaded hole 54c only needs to be such that the screw 58 can be securely tightened. In the configuration example shown in FIG. 3, the threaded hole 54c reaches from the protruding end surface 54b1 to near the middle in the height direction of the boss portion 54.

[0040] The stud component 56 is a component for connecting the board fixing component 53 to the board 25. The stud component 56 can be mounted on the second surface 25B of the board 25 and is composed of a cylindrical metal component standing up from the second surface 25B to the Z2 side. The stud component 56 is fixed to the ground pattern 60b provided on the second surface 25B by soldering or the like. The ground pattern 60b is formed in a ring shape surrounding the mounting hole 25C.

[0041] The stud component 56 can have a through hole 56a, a fixing surface 56b, and a relief hole 56c.

[0042] The through hole 56a is a through hole in the Z direction that is coaxially arranged with the threaded hole 54c and through which the screw 58 is passed. The inner diameter of the through hole 56a is smaller than the head 58a of the screw 58 and larger than the threaded portion (shaft portion) 58b.

[0043] The fixing surface 56b is a surface that supports the board fixing component 53. The fixing surface 56b is provided on the top surface of the stud component 56 and is a flange-shaped portion formed one step lower than the peripheral edge of the through hole 56a. The board fixing component 53 has, for example, a fixing hole 53a. The fixing hole 53a is a hole that penetrates the plate-shaped bracket 50 or the attachment piece 26a in the plate thickness direction. The central portion of the top surface of the stud component 56 is inserted into the fixing hole 53a. The peripheral edge of the fixing hole 53a of the board fixing component 53 is placed on the fixing surface 56b. Thereby, the board fixing component 53 is clamped between the head portion 58a and the fixing surface 56b and is fixed to the stud component 56 and the board 25.

[0044] The relief hole 56c is a concave hole formed in the fixing surface (Z1 side surface) of the stud component 56 with respect to the second surface 25B and communicates coaxially with the through hole 56a. The inner diameter of the relief hole 56c is larger than the inner diameter of the through hole 56a and is further larger than the outer diameter of the protruding portion 54b. The depth of the relief hole 56c is larger than the protruding height of the protruding portion 54b from the second surface 25B. Thereby, the upper portion (Z2 side portion) including the protruding end surface 54b1 of the protruding portion 54b is inserted into the relief hole 56c, and interference with the stud component 56 is avoided.

[0045] Next, one procedure of the fixing operation of the board 25 and the board fixing component 53 using the fastening structure 52 will be described.

[0046] As shown in FIGS. 3 and 4, first, the stud component 56 is mounted on the second surface 25B of the board 25 via the ground pattern 60b. The mounting of the stud component 56 can be performed by reflow, for example, simultaneously with other components (e.g., CPU 25a) mounted on the board 25.

[0047] Next, the board 25 on which the stud component 56 is mounted is fixed to the keyboard device 18 and the housing member 20. The boss portion 54 passes the protruding portion 54b through the mounting hole 25C and applies the support surface 54a to the first surface 25A (ground pattern 60a). Subsequently, the board 25 is fixed to the housing member 20 with a screw 27 (see FIG. 2).

[0048] Place the board fixing component 53 on the fixing surface 56b of the stud component 56. Subsequently, tighten the screw 58 into the screw hole 54c. The screw 58 has its threaded portion 58b inserted through the fixing hole 53a and the through hole 56a and tightened into the screw hole 54c. Thereby, the board fixing component 53 is fastened to the stud component 56 by the screw 58, and the board fixing component 53 is fixed to the board 25 on the second surface 25B side. At the same time, the board 25 and the stud component 56 mounted thereon are also fastened to the boss portion 54 by the screw 58. That is, the board 25 and the board fixing component 53 are fixed to the keyboard device 18. As described above, the board 25 and the board fixing component 53 are fixed to the housing member 20 by the fastening structure 52 using a single screw 58.

[0049] As described above, the electronic device 10 of the present embodiment includes a housing member 20 and a board 25 provided with a mounting hole 20C. Further, the electronic device 10 includes a boss portion 54, a stud component 56, and a board fixing component 53. The boss portion 54 has a support surface 54a that supports the first surface 25A of the board 25 and a screw hole 54c into which a screw 58 passed through the mounting hole 20C from the second surface 25B side toward the first surface 25A side is tightened, and is provided so as to protrude on the inner surface side of the housing member 20. The stud component 56 has a through hole 56a that is coaxially arranged with the screw hole 54c and through which the screw 58 passes, and is mounted on the second surface 25B so as to cover the mounting hole 25C. The board fixing component 53 is fixed to the stud component 56 by a screw 58 tightened into the screw hole 54c.

[0050] In this way, the electronic device 10 integrally combines the boss portion 54 that directly or indirectly fixes the substrate 25 to the housing member 20 and the stud component 56 that fixes the substrate fixing component 53 to the substrate 25. That is, the fastening structure 52 uses the mounting hole 25C and the screw 58 for fixing the substrate 25 to the housing member 20 etc. also for fixing the substrate fixing component 53 to the substrate 25. As a result, it is not necessary to secure a dedicated mounting space for the stud component 56 on the substrate 25. That is, the fastening structure 52 can fix the substrate fixing component 53 using the dead space above the boss portion 54. As a result, the electronic device 10 can reduce the area of the substrate 25, reduce the component cost, and also reduce the weight. Since the substrate 25 of the electronic device 10 is miniaturized and there is also a surplus of space in the housing 12, it is possible to increase the capacity of the thermal module 24 and miniaturize the housing 12. The housing member to which the fastening structure 52 is applied may be a member that constitutes the bottom surface of the housing 12.

[0051] In the electronic device 10, the through hole 56a of the stud component 56 is arranged above the screw hole 54c. As a result, after the screw 58 is removed from the screw hole 54c, the screw portion 58b is caught and held by the through hole 56a and does not easily fall off. For this reason, the operator can easily grip and pull up the screw 58 with a fingertip or the like. In this way, the through hole 56a also functions as a grip for holding the screw 58 removed from the screw hole 54c.

[0052] The boss portion 54 can have a protruding portion 54b that protrudes from the support surface 54a, passes through the mounting hole 30C, and has a screw hole 54c opened on the protruding end surface 54b1. Then, it is possible to easily form a screw hole 54c with a depth that can more reliably tighten the screw 58. That is, the protruding portion 54b can expand the depth of the screw hole 54c. In this case, as shown in FIG. 5, the height of the boss portion 54 can also be reduced.

[0053] FIG. 5 is a schematic side cross-sectional view of a fastening structure 52A according to a modified example. The fastening structure 52A shown in FIG. 5 is a configuration example in which the height H1 from the base plate 18a (cover plate 20A) to the first surface 25A of the substrate 25 is set to a lower height H1a compared to the fastening structure 52 shown in FIG. 3. That is, the boss portion 54 of the fastening structure 52A is lower in height than the boss portion 54 of the fastening structure 52 shown in FIG. 3. In the fastening structure 52A, the height H2 from the second surface 25B of the substrate 25 to the head 58a of the screw 58 is the same as or substantially the same as that of the fastening structure 52 shown in FIG. 3.

[0054] In this way, by providing the protruding portions 54b, the fastening structures 52 and 52A can secure the amount of screwing while reducing the height of the boss portion 54. Therefore, the electronic device 10 can reduce the height H1 from the base plate 18a (cover plate 20A) to the substrate 25, and can cope with further thinning of the housing 12.

[0055] The protruding portion 54b can be omitted or configured to have a height that does not penetrate the mounting hole 25C. In this case, as shown in FIG. 6, the height of the stud component 56 can also be reduced.

[0056] FIG. 6 is a schematic side cross-sectional view of a fastening structure 52B according to another modified example. The fastening structure 52B shown in FIG. 6 is a configuration example in which, compared to the fastening structure 52 shown in FIG. 3, the protruding portion 54b is eliminated and the height H2 from the second surface 25B to the head 58a of the screw 58 is set to a lower height H2a. That is, since the stud component 56 of the fastening structure 52B does not require the relief hole 56c for escaping the protruding portion 54b, its height can be made lower than that of the stud component 56 of the fastening structure 52 shown in FIG. 3. As shown by the two-dot chain line in FIG. 6, the fastening structure 52B may be provided with a protruding portion 54b having a height that does not penetrate the mounting hole 25C.

[0057] In this way, by omitting the protruding portion 54b or making it lower than the second surface 25B in the fastening structure 52B, the escape hole 56c becomes unnecessary, and the height of the stud component 56 can be reduced. On the other hand, even in the fastening structure 52B, by ensuring the height H1 of the boss portion 54, the depth of the screw hole 54c necessary for securely tightening the screw 58 can be sufficiently ensured. Therefore, the electronic device 10 can reduce the height H2 from the substrate 25 to the substrate fixing component 53 and can cope with further thinning of the housing 12.

[0058] Next, as a comparative example, a configuration example of the fixing structure of the conventional substrate 25 and the substrate fixing component 53 will be described. FIG. 7 is a schematic side cross-sectional view showing the fixing structure of the substrate 25 and the substrate fixing component 53 according to the comparative example.

[0059] In the configuration according to the comparative example shown in FIG. 7, the boss portion 70 for fixing the substrate 25 to the base plate 18a (cover plate 20A) and the stud component 72 for fixing the substrate fixing component 53 to the substrate 25 are at different positions. Therefore, the substrate 25 is fixed to the boss portion 70 with the screw 74, and the substrate fixing component 53 is fixed to the stud component 72 with the screw 76. Therefore, in the configuration shown in FIG. 7, the screws 74 and 76 are arranged at different positions on the substrate 25, occupying a large installation space on the substrate 25.

[0060] Also, the substrate 25 needs to be provided with a hole portion 78 through which the screw 74 passes and a hole portion 80 for fitting the stud component 72 at different positions. The hole portion 80 is an escape hole for extending a part of the stud component 72 in the Z1 direction. The extended portion of the stud component 72 into the hole portion 80 is a structure necessary for ensuring a screw hole 72a with a depth that can securely tighten the screw 76 while suppressing the protruding height of the stud component 72 from the second surface 25B. Note that the height of the boss portion 70 also needs to be ensured to be a height necessary for ensuring a screw hole 72a with a depth that can securely tighten the screw 74.

[0061] As described above, in the comparative example shown in FIG. 7, it is necessary to provide two hole portions 78 and 80 and two screws 74 and 76 on the substrate 25. Therefore, the area of the substrate 25 needs to be enlarged. Also, the heights of the boss portion 70 and the stud component 72 must respectively ensure the heights required for fastening the screws 74 and 76, and it is difficult to reduce the thickness as in the configuration examples shown in FIGS. 5 and 6 described later. Further, in the comparative example shown in FIG. 7, since there is no configuration similar to the through-hole 56a, the screws 74 and 76 lose support immediately after being removed from the screw holes 70a and 72a, resulting in low workability.

[0062] Note that the present invention is not limited to the above-described embodiments, and it goes without saying that it can be freely changed without departing from the gist of the present invention.

[0063] In the above, the fastening structures 52, 52A, and 52B are used for fixing the bracket 50 and the battery device 26, but the fastening structures 52 and the like may be applied to other fixing portions of screws 25c2, 25d1, 27, 44, etc.

Explanation of Reference Numerals

[0064] 10 Electronic device 11 Cover 12 Housing 18 Keyboard device 20 Housing member 24 Thermal module 25 Substrate 25a CPU 25c2, 25d1, 44, 58, 76 Screws 42, 56, 72 Stud components 52, 52A, 52B Fastening structures 53 Substrate fixing component 54, 70 Boss portions 54a Support surface 54b Protrusion 56a Through-hole 56c Relief hole

Claims

1. An electronic device, A housing member; A substrate having a first surface and a second surface and a mounting hole penetrating in a thickness direction of the substrate; a boss portion having a support surface that supports a first surface of the substrate and a screw hole into which a screw that is passed through the mounting hole from the second surface side toward the first surface side is fastened, the boss portion being provided so as to protrude from an inner surface side of the housing member; a stud component having a through hole arranged coaxially with the screw hole and through which the screw is inserted, the stud component being mounted on the second surface of the board so as to cover the mounting hole; a board fixing component that is fixed to the stud component by the screw that is fastened to the screw hole; Equipped 1. An electronic device comprising:

2. 2. The electronic device according to claim 1, The boss portion has a protruding portion that protrudes from the support surface, is inserted into the mounting hole, and has the screw hole formed therein.

1. An electronic device comprising:

3. 3. The electronic device according to claim 2, the protrusion protrudes through the mounting hole onto the second surface of the substrate; The stud component has a relief hole into which the protrusion is inserted, The relief hole is coaxially connected to the through hole and has a larger diameter than the through hole.

1. An electronic device comprising:

4. The electronic device according to any one of claims 1 to 3, The board fixing component includes any one of a bracket that holds a cable connected to a connector mounted on the second surface, a battery device that serves as a power source for the electronic device, a thermal module that cools a heat generating element mounted on the second surface, an electronic component mounted on the second surface, and an external connection port mounted on the second surface.

1. An electronic device comprising:

Images