Capacitor module
The capacitor module design with through holes or protrusions in the bus bars' buried portions within the resin stabilizes the bus bars, improving connection reliability and enabling miniaturization and low ESR.
Patent Information
- Application Number
- JP2023503639
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2021-03-02
- Filing Date
- 2022-01-27
- Publication Date
- 2025-07-01
- Estimated Expiration
- 2042-01-27
AI Technical Summary
The bus bar in capacitor modules moves within the sealing resin due to thermal shock or vibration, leading to connection failures.
The capacitor module design includes a case with an opening facing the bottom surface, filled with sealing resin, and bus bars with contact, buried, and exposed portions, where the buried portions have through holes or protrusions surrounded by resin to prevent movement.
This configuration enhances the connection reliability of the bus bars by suppressing movement, contributing to miniaturization and low ESR.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to a capacitor module.
Background Art
[0002] A capacitor module in which a capacitor is housed in a case and filled with a sealing resin is known. In such a capacitor module, the electrodes at both ends of each capacitor are respectively connected to a bus bar.
[0003] Patent Document 1 discloses a capacitor module in which a part of the bus bar is exposed outside the sealing resin in order to promote heat dissipation of the capacitor module.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Summary of the Invention
Problems to be Solved by the Invention
[0005] In the capacitor module described in Patent Document 1, there is a problem that the bus bar moves within the sealing resin due to thermal shock or vibration, etc., resulting in a connection failure.
[0006] Therefore, an object of the present invention is to provide a capacitor module with improved connection reliability of the bus bar.
Means for Solving the Problems
[0007] A capacitor module according to an aspect of the present invention includes: a case having an opening formed at a position facing the bottom surface; a sealing resin filled in the case; one or more capacitors housed in the case; A plate-shaped first bus bar connected to one electrode of the capacitor, A plate-shaped second bus bar connected to the other electrode of the capacitor, and comprising the capacitor is disposed inside the encapsulating resin, each of the first bus bar and the second bus bar has a contact portion disposed inside the encapsulating resin and contacting the electrode, a buried portion disposed inside the encapsulating resin and extending from the contact portion, and an exposed portion extending from the buried portion and disposed outside the encapsulating resin, In at least one of the first bus bar and the second bus bar, the contact portion and / or the buried portion is provided with a through hole filled with the encapsulating resin or a protrusion surrounded by the encapsulating resin.
Advantages of the Invention
[0008] According to the present invention, a capacitor module with improved connection reliability of the bus bar can be provided.
Brief Description of the Drawings
[0009]
Figure 1
Figure 2A
Figure 2B
Figure 2C
Figure 2D
Figure 3
Figure 4A
Figure 4B
Figure 5
Figure 6
Figure 7A
Figure 7B
Figure 8
Figure 9
Figure 10
Figure 11
Mode for Carrying Out the Invention
[0010] (Background of the Present Invention) In a capacitor module in which a capacitor is housed in a case and filled with a sealing resin, the electrodes at both ends of each capacitor are connected to a bus bar. When an electric current is applied to the capacitor, the capacitor module generates heat. Therefore, a capacitor module is known in which a part of the bus bar is exposed outside the sealing resin for the purpose of heat dissipation.
[0011] For example, in the capacitor module described in Patent Document 1, a part of the bus bar is buried in the sealing resin. When stress is applied to the sealing resin and the bus bar due to thermal shock or vibration, etc., the bus bar may come out of the sealing resin, the connection with the capacitor may become poor, or it may cause a defect in the capacitor module.
[0012] Therefore, the present inventors have studied the configuration of a capacitor module with improved connection reliability of the bus bar and have arrived at the following invention.
[0013] A capacitor module according to an aspect of the present invention is A case having an opening formed at a position facing the bottom surface, A sealing resin filled in the case, One or more capacitors housed in the case, A plate-shaped first bus bar connected to one electrode of the capacitor, A plate-shaped second bus bar connected to the other electrode of the capacitor, Comprising: The capacitor is disposed inside the sealing resin, Each of the first bus bar and the second bus bar has a contact portion disposed inside the sealing resin and contacting the electrode, a buried portion disposed inside the sealing resin and extending from the contact portion, and an exposed portion extending from the buried portion and disposed outside the sealing resin. In at least one of the first bus bar and the second bus bar, the contact portion and / or the buried portion is provided with a through hole filled with the sealing resin or a protrusion surrounded by the sealing resin.
[0014] According to this configuration, it is possible to prevent the bus bar from coming out of the sealing resin, and the connection reliability of the bus bar can be improved.
[0015] The contact portion and / or the buried portion may form a through hole.
[0016] According to this configuration, since the periphery of the through hole is surrounded by the sealing resin, the movement of the bus bar in a direction perpendicular to the penetrating direction of the through hole can be suppressed, and the connection reliability of the bus bar can be improved.
[0017] The contact portion and / or the buried portion forming the through hole may extend in a direction from the bottom surface of the case toward the opening.
[0018] According to this configuration, since the through hole is formed in a direction parallel to the opening surface of the case, the movement of the bus bar from the bottom surface to the opening of the case can be suppressed.
[0019] The contact portion and / or the buried portion may be provided with a protrusion.
[0020] According to this configuration, since the periphery of the protrusion is surrounded by the encapsulation resin, movement of the bus bar in a direction perpendicular to the extending direction of the protrusion can be suppressed, and the connection reliability of the bus bar can be improved.
[0021] The protrusion may have a first protrusion portion formed by bending an end portion of the contact portion and / or the buried portion.
[0022] According to this configuration, since the first protrusion portion is surrounded by the resin, movement of the bus bar in a direction perpendicular to the extending direction of the protrusion can be suppressed, and the connection reliability of the bus bar can be improved.
[0023] The protrusion may have a second protrusion portion formed by extending a part of the contact portion and / or the buried portion in the width direction.
[0024] According to this configuration, since the second protrusion portions can be formed in a plurality of directions, detachment of the bus bar from the encapsulation resin can be further reduced.
[0025] At least one through hole or protrusion may be provided for each of the plurality of capacitors.
[0026] According to this configuration, it contributes to miniaturization of the capacitor module and enables realization of low ESR.
[0027] (Embodiment 1) FIG. 1 is a perspective view of a capacitor module 1 according to Embodiment 1 of the present invention. FIG. 2A is a perspective view of the capacitor module 1 of FIG. 1 with the case 51 and the encapsulating resin 52 omitted. FIG. 2B is a perspective view showing the case 51 of the capacitor module 1 of FIG. 1. FIG. 2C is a side view of the capacitor module 1 of FIG. 2A. FIG. 2D is a perspective view showing the capacitor 11 included in the capacitor module 1 of FIG. 1. FIG. 3 is a perspective view showing the main body portion 32 of the first bus bar 31 of the capacitor module 1 of FIGS. 2A and 2C. FIG. 4A is a perspective view of the capacitor module 1 of FIG. 2A viewed from another direction. FIG. 4B is a side view of the capacitor module 1 of FIG. 4A. FIG. 5 is a perspective view showing the main body portion 37 of the second bus bar 36 of the capacitor module 1 of FIGS. 4A and 4B. In the drawings, the X, Y, and Z directions indicate the lateral direction, the height direction, and the longitudinal direction of the capacitor module 1, respectively.
[0028] [Overall Configuration] As shown in FIGS. 1 and 2A to 2C, the capacitor module 1 includes a case 51, an encapsulating resin 52, a plurality of capacitors 11 to 18, a first bus bar 31, and a second bus bar 36. The capacitor module 1 houses the capacitors 11 to 18, a part of the first bus bar 31, and a part of the second bus bar 36 in the case 51, and the encapsulating resin 52 is filled inside the case 51.
[0029] As shown in FIG. 2B, the case 51 has an opening 51b formed at a position facing the bottom surface 51a.
[0030] Inside the case 51, eight capacitors 18 are arranged side by side. As shown in FIGS. 2A and 4A, in the present embodiment, the capacitors 11 to 14 are arranged in a row, the capacitors 15 to 18 are arranged in a row, and the eight capacitors are arranged in two rows in the Y direction.
[0031] Also, as shown in FIG. 2C, the respective capacitors 11 to 18 are arranged such that the first electrodes 11a to 18a face each other and the second electrodes 11b to 18b face each other.
[0032] In this embodiment, each of the capacitors 11 to 18 is connected to the first bus bar 31 and the second bus bar 36 via a plurality of contact portions 35 and a plurality of contact portions 40.
[0033] Specifically, as shown in FIGS. 2C and 4B, the first electrodes 11a to 18a of the capacitors 11 to 18 are connected to the first bus bar 31 via the contact portions 35. Also, as shown in FIGS. 2C and 4B, the second electrodes 11b to 18b of the capacitors 11 to 18 are connected to the second bus bar 36 via the contact portions 40.
[0034] <Capacitor> The capacitors 11 to 18 are film capacitors. The capacitors 11 to 18 are formed by winding a dielectric film having a metal vapor deposition film formed on the surface and pressing the wound body of the dielectric film into a flat shape. As shown in FIG. 2A, the capacitors 11 to 18 each have a first electrode 11a to 18a and a second electrode 11b to 18b.
[0035] As shown in FIG. 2C, the capacitors 11 to 18 are arranged such that the first electrodes 11a to 18a face each other and the second electrodes 11b to 18b face each other. Specifically, the second electrode 11b and the second electrode 12b face each other, the second electrode 13b and the second electrode 14b face each other, the second electrode 15b and the second electrode 16b face each other, and the second electrode 17b and the second electrode 18b face each other. Further, the first electrode 12a and the first electrode 13a face each other, and the first electrode 16a and the first electrode 17a face each other.
[0036] Also, as shown in FIG. 2D, the capacitor 11 has a side surface 11c connecting the first electrode 11a and the second electrode 11b. The side surface 11c includes a pair of flat portions 11d and a pair of curved portions 11e connecting the pair of flat portions 11d. This configuration is the same for the capacitors 12 to 18. The capacitors 11 to 18 are arranged such that the pair of flat portions 11d face the bottom surface 51a and the opening 51b of the case 51, respectively.
[0037] As the dielectric films of the capacitors 11 to 18, for example, plastic films such as polyethylene terephthalate, polypropylene, polyphenylene sulfide, or polyethylene naphthalate can be used. Also, as the metal vapor deposition film formed on the surface of the plastic film, Al, Zn, etc. can be used. The first electrodes 11a to 18a and the second electrodes 11b to 18b are formed by spraying, for example, Zn or the like on the ends of the wound dielectric film.
[0038] <First bus bar> As shown in FIGS. 2A and 3, the first bus bar 31 is a plate-shaped conductive member connected to the first electrodes 11a to 18a of the capacitors 11 to 18. In the present embodiment, the first bus bar 31 is composed of a main body portion 32 and a contact portion 35. The main body portion 32 has a buried portion 33 disposed inside the sealing resin 52 and an exposed portion 34 extending from the buried portion 33 and disposed outside the sealing resin 52.
[0039] A plurality of contact portions 35 are disposed inside the sealing resin 52, and each contact portion 35 contacts each of the first electrodes 11a to 18a. More specifically, one contact portion 35 contacts the first electrode 11a and the first electrode 15a. Similarly, another contact portion 35 contacts the first electrode 12a and the first electrode 16a, and still another contact portion 35 contacts the first electrode 13a and the first electrode 17a, and still another contact portion 35 contacts the first electrode 14a and the first electrode 18a. That is, in the present embodiment, four contact portions 35 each contact the first electrodes 11a to 18a of two capacitors 11 to 18.
[0040] The contact portion 35 has a claw 35a (see FIGS. 2A and 2C) for connecting to the buried portion 33 described later and a claw 35b (see FIG. 2A) for connecting to each of the first electrodes 11a to 18a.
[0041] The buried portion 33 is the part that is buried in the sealing resin 52 when housed in the case 51. In the present embodiment, as shown in FIG. 3, three buried portions 33 are formed in the main body portion 32. As shown in FIG. 3, a through hole 41 and a connection portion 42 are formed in each buried portion 33.
[0042] Since the inside and the periphery of the through hole 41 are surrounded by the sealing resin 52, it is possible to prevent the main body portion 32 (the first bus bar 31) from coming off the sealing resin 52. By providing the through hole 41 in the buried portion 33, when a load such as a thermal shock or vibration is applied to the capacitor module 1, the movement and displacement of the first bus bar 31 can be suppressed. Therefore, the contact state between the first bus bar 31 and the first electrodes 11a to 18a of the capacitors 11 to 18 can be maintained with higher accuracy, and the connection reliability of the first bus bar 31 can be improved.
[0043] In the present embodiment, as shown in FIG. 3, the buried portion 33 is formed to extend from the exposed portion 34 in the direction (-Y direction) from the opening 51b to the bottom surface 51a of the case 51. For this reason, the through hole 41 is formed in the direction (Z direction) perpendicular thereto. By filling the inside and the periphery of the through hole 41 formed in the Z direction with the sealing resin 52, the movement of the first bus bar 31 in the Y direction perpendicular to the Z direction can be suppressed.
[0044] As shown in FIG. 3, a connection portion 42 is formed in the buried portion 33. The connection portion 42 is a hole formed in the buried portion 33, similar to the through hole 41. The claw 35a (see FIGS. 2A and 2C) formed on the contact portion 35 is inserted into the connection portion 42, and the main body portion 32 and the contact portion 35 are electrically connected by soldering around the connection portion 42. Therefore, the first electrodes 11a to 18a of the respective capacitors 11 to 18 and the main body portion 32 are electrically connected via the contact portion 35. Alternatively, the buried portion 33 and the contact portion 35 may be connected by welding.
[0045] In the present embodiment, a plurality of contact portions 35 are arranged. However, as long as the first electrodes 11a to 18a of each capacitor and the main body portion 32 can be comprehensively connected, their shapes and numbers are not particularly limited.
[0046] The exposed portion 34 is a portion that extends from the buried portion 33 of the first bus bar 31 and is arranged outside the sealing resin 52. As shown in FIG. 1, the exposed portion 34 is arranged along the opening 51b of the case 51. By arranging the exposed portion 34 in this way, a cooling member such as a thermal pad can be arranged on the exposed portion 34, and the heat dissipation performance of the capacitor module 1 can be improved.
[0047] Further, when the contact portion 35 and the buried portion 33 are connected by soldering, it is desirable that the heat capacity of the buried portion 33 is low. In the present embodiment, in the exposed portion 34, a plurality of holes 43 are formed in the vicinity of the buried portion 33 (see FIG. 3). By providing the holes 43, the heat capacity of the buried portion 33 can be reduced, the connection can be facilitated, and the productivity can be improved.
[0048] <Second bus bar> As shown in FIGS. 4A and 5, the second bus bar 36 is a plate-shaped conductive member connected to the second electrodes 11b to 18b of the capacitors 11 to 18. In FIG. 4A, the capacitors 14 and 18 are omitted. In the present embodiment, the second bus bar 36 is composed of a main body portion 37 and a contact portion 40. The main body portion 37 has a buried portion 38 arranged inside the sealing resin 52 and an exposed portion 39 extending from the buried portion 38 and arranged outside the sealing resin 52.
[0049] A plurality of contact portions 40 are arranged inside the sealing resin 52, and each contact portion 40 contacts each of the second electrodes 11b to 18b. More specifically, one contact portion 40 contacts the second electrode 11b and the second electrode 15b. Similarly, another contact portion 40 contacts the second electrode 12b and the second electrode 16b, still another contact portion 40 contacts the second electrode 13b and the second electrode 17b, and still another contact portion 40 contacts the second electrode 14b and the second electrode 18b. That is, in the present embodiment, four contact portions 40 each contact the second electrodes 11b to 18b of the two capacitors 11 to 18.
[0050] The contact portion 40 has a claw 40a for connecting to the buried portion 38 described later and a claw 40b for connecting to each of the second electrodes 11b to 18b.
[0051] The buried portion 38 is a portion that is buried in the sealing resin 52 when housed in the case 51. In the present embodiment, as shown in FIG. 5, two buried portions 38 are formed in the main body portion 37. As shown in FIG. 5, a through hole 46 and a connection portion 47 are formed in each buried portion 38.
[0052] Since the inside and the periphery of the through hole 46 are surrounded by the sealing resin 52, it is possible to prevent the main body portion 37 (the second bus bar 36) from coming out of the sealing resin 52. By providing the through hole 46 in the buried portion 38, when a load such as a thermal shock or vibration is applied to the capacitor module 1, movement and displacement of the second bus bar 36 can be suppressed. For this reason, the contact state between the second bus bar 36 and the second electrodes 11b to 18b of the capacitors 11 to 18 can be maintained more accurately, and the connection reliability of the second bus bar 36 can be improved.
[0053] In this embodiment, as shown in FIG. 5, the buried portion 38 extends in the direction (-Y direction) from the exposed portion 39 toward the bottom surface 51a through the opening 51b of the case 51. Therefore, the through hole 46 is formed in the direction perpendicular thereto (Z direction). By filling the inside and the periphery of the through hole 46 formed in the Z direction with the sealing resin 52, the movement of the second bus bar 36 in the Y direction perpendicular to the Z direction can be suppressed.
[0054] As shown in FIG. 5, a connection portion 47 is formed in the buried portion 38. The connection portion 47 is a hole formed in the buried portion 38, similar to the through hole 46. The claw 40a (see FIG. 4B) formed on the contact portion 40 is inserted into the connection portion 47, and the main body portion 37 and the contact portion 40 are electrically connected by soldering around the connection portion 47. Therefore, the second electrodes 11b to 18b of the respective capacitors and the main body portion 37 are electrically connected via the contact portion 40. Alternatively, the buried portion 38 and the contact portion 40 may be connected by welding.
[0055] In this embodiment, a plurality of contact portions 40 are arranged. However, as long as the second electrodes 11b to 18b of the respective capacitors and the main body portion 37 can be comprehensively connected, their shapes and numbers are not particularly limited.
[0056] The exposed portion 39 is a portion that extends from the buried portion 38 of the second bus bar 36 and is disposed outside the sealing resin 52. As shown in FIG. 1, the exposed portion 39 is disposed along the opening 51b of the case 51. By disposing the exposed portion 39 in this manner, a cooling member such as a thermal pad can be disposed on the exposed portion 39, and the heat dissipation performance of the capacitor module 1 can be improved.
[0057] Also, when connecting the contact portion 40 and the buried portion 38 by soldering, it is desirable that the heat capacity of the buried portion 38 is low. In this embodiment, a plurality of holes 48 are formed in the vicinity of the buried portion 38 in the exposed portion 39. By providing the holes 48, the heat capacity of the buried portion 38 can be reduced, the connection can be facilitated, and the productivity can be improved.
[0058] Also, as shown in FIG. 1, the portions of the first bus bar 31 and the second bus bar 36 that are disposed outside the case 51 are insulated by insulating paper 61.
[0059] <Case> The case 51 houses each component of the capacitor module 1. In the present embodiment, as shown in FIG. 2B, an opening 51b is formed at a position facing the bottom surface 51a. The case 51 can be formed of a resin such as a synthetic resin. The case 51 can be formed of, for example, a synthetic resin such as polyphenylene sulfide (PPS resin) or polybutylene terephthalate (PBT resin).
[0060] <Sealing resin> The sealing resin 52 is filled in the case 51 to seal the capacitors 11 to 18, the contact portion 35 and the buried portion 33 of the first bus bar 31, and the contact portion 40 and the buried portion 38 of the second bus bar 36. The sealing resin 52 is a thermosetting resin, and for example, an epoxy resin can be used. Alternatively, a urethane resin or the like may be used.
[0061] [Effect] According to the capacitor module 1 according to the first embodiment, the following effects can be achieved.
[0062] The capacitor module 1 includes a case 51, a sealing resin 52, a plurality of capacitors 11 to 18, a first bus bar 31, and a second bus bar 36. The case 51 has an opening 51b formed at a position facing the bottom surface 51a. The sealing resin 52 is filled in the case 51. The capacitors 11 to 18 are housed in the case 51 and arranged inside the sealing resin 52. The first bus bar 31 is connected to one of the electrodes 11a to 18a of the capacitors 11 to 18. The second bus bar 36 is connected to the other electrodes 11b to 18b of the capacitors 11 to 18. Each of the first bus bar 31 and the second bus bar 36 has contact portions 35, 40, buried portions 33, 38, and exposed portions 34, 39. The contact portions 35, 40 are arranged inside the sealing resin 52 and contact the electrodes 11a to 18b of the capacitors 11 to 18. The buried portions 33, 38 extend from the contact portions 35, 40 and are arranged inside the sealing resin 52. The exposed portions 34, 39 extend from the buried portions 33, 38 and are arranged outside the sealing resin 52. In each of the first bus bar 31 and the second bus bar 36, through holes 41, 46 for filling the sealing resin 52 are provided in the buried portions 33, 38.
[0063] With such a configuration, it is possible to prevent the first bus bar 31 and the second bus bar 36 from coming off from the sealing resin 52 and improve the connection reliability of the first bus bar 31 and the second bus bar 36.
[0064] Further, the buried portions 33, 38 forming the through holes 41, 46 extend in the direction from the bottom surface 51a of the case 51 toward the opening 51b.
[0065] Since the through holes 41 and 46 are formed in a direction parallel to the opening 51b of the case 51, the movement of the first bus bar 31 and the second bus bar 36 in the Y direction can be suppressed. Specifically, since the sealing resin 52 is filled inside and around the through hole 41 provided in the Z direction in the buried portion 33 of the first bus bar 31, the movement of the first bus bar 31 in the direction perpendicular to the direction in which the through hole 41 is formed (Y direction) can be suppressed. Therefore, when a thermal shock or vibration or the like is applied to the capacitor module 1, the first bus bar 31 can be prevented from coming out of the sealing resin 52. Similarly, since the sealing resin 52 is filled inside and around the through hole 46 provided in the Z direction in the buried portion 38 of the second bus bar 36, the movement of the bus bar in the direction perpendicular to the direction in which the through hole 46 is formed (Y direction) can be suppressed. Therefore, when a thermal shock or vibration or the like is applied to the capacitor module 1, the second bus bar 36 can be prevented from coming out of the sealing resin 52.
[0066] [Modification Example] In addition, in the first embodiment, the example in which the capacitor module 1 includes eight capacitors 11 to 18 has been described. However, the capacitor module 1 only needs to include one or more capacitors, and the number of capacitors is not limited to this.
[0067] Further, in the first embodiment, the example in which the through holes 41 and 46 are provided in the buried portions 33 and 38 of the first bus bar 31 and the second bus bar 36, respectively, has been described. However, the present invention is not limited to this. Depending on the arrangement position of each bus bar, etc., it is sufficient that through holes are formed in the buried portion of at least one of the first bus bar 31 and the second bus bar 36.
[0068] Further, in the first embodiment, the example in which the through holes 41 and 46 are provided in the buried portions 33 and 38 has been described. However, the present invention is not limited to this. FIG. 6 is a partially enlarged view of a capacitor module according to a modification of the first embodiment. As shown in FIG. 6, protrusions 41a, 41b, and 41c may be provided in the buried portion 33a of the first bus bar 31a.
[0069] As shown in FIG. 6, in the buried portion 33a, a first protrusion 41a is formed by bending the end of the buried portion 33. By forming the first protrusion 41a, the periphery of the first protrusion 41a is surrounded by the sealing resin 52, and the movement of the first bus bar 31a inside the sealing resin 52 can be suppressed.
[0070] Also, as shown in FIG. 6, in the buried portion 33a, second protrusions 41b and 41c are formed by extending a part of the buried portion 33a in the width direction. Since the second protrusions can be formed in a plurality of directions with respect to each buried portion 33a, the detachment of the first bus bar 31a from the sealing resin 52 can be further reduced.
[0071] Note that, also in the second bus bar 36, instead of the through hole 46, the first protrusion and / or the second protrusion may be formed.
[0072] (Embodiment 2) The capacitor module 2 according to Embodiment 2 of the present invention will be described.
[0073] In Embodiment 2, mainly the points different from Embodiment 1 will be described. In Embodiment 2, the same reference numerals are given to the configurations that are the same as or equivalent to those in Embodiment 1, and the description thereof will be made. Also, in Embodiment 2, the description overlapping with that in Embodiment 1 will be omitted.
[0074] FIG. 7A is a perspective view of the capacitor module 2 according to Embodiment 2 of the present invention. FIG. 7B is a perspective view showing the arrangement of the capacitors 111 to 114 inside the case 151 of the capacitor module 2 in FIG. 7A. FIG. 8 is a perspective view of the first bus bar 131 of the capacitor module 2 in FIG. 7A.
[0075] In Embodiment 2, as shown in FIG. 7A, it is different from Embodiment 1 in that the first bus bar 131 is integrally formed. Also, the arrangement directions of the respective capacitors 111 to 114 are different from those in Embodiment 1.
[0076] As shown in FIG. 7B, in the present embodiment, four capacitors 111 to 114 are arranged in a case 151 in which an opening 151b is formed at a position facing the bottom surface 151a. Each of the capacitors 111 to 114 is arranged such that the first electrodes 111a to 114a face the opening 151b.
[0077] Further, as shown in FIG. 7A, a first bus bar 131 is in contact with each of the first electrodes 111a to 114a. The electrodes (not shown) on the opposite sides of the capacitors 111 to 114 are in contact with second bus bars (not shown), respectively.
[0078] As shown in FIG. 8, the first bus bar 131 has four contact portions 142a to 142d, four buried portions 132a to 132d, and an exposed portion 133. Each of the contact portions 142a to 142d is in contact with each of the first electrodes 111a to 114a. Each of the buried portions 132a to 132d extends from the contact portions 142a to 142d and is disposed inside the sealing resin 152. The exposed portion 133 extends from the buried portions 132a to 132d and is disposed outside the sealing resin 152. Through holes 141a to 141d for filling the sealing resin 152 are provided in each of the buried portions 132a to 132d.
[0079] In the present embodiment, the first bus bar 131 can be formed by, for example, press working or the like. Since the first electrodes 111a to 114a of the respective capacitors 111 to 114 are arranged to face the opening 51b of the case 151, the first bus bar 131 and the first electrodes 111a to 114a can be directly connected by soldering or welding.
[0080] Further, in the present embodiment, one contact portion 142a to 142d is provided for each of the capacitors 111 to 114, and through holes 141a to 141d are formed in each of the contact portions 142a to 142d.
[0081] Also, although not shown in FIG. 7A, the second bus bars connected to the second electrodes (not shown) of the respective capacitors 111 to 114 are arranged such that the buried portions and the contact portions are along the bottom surface 151a of the case 151. When the second bus bars are arranged in this way, the movement of the second bus bars within the case 151 is suppressed by the capacitors 111 to 114 and the sealing resin 152 within the case 151. For this reason, in the present embodiment, no through holes or protrusions are formed in the second bus bars.
[0082] [Effect] According to the capacitor module 2 according to the second embodiment, the same effects as those of the first embodiment can be achieved.
[0083] At least one through hole 141 is provided for each of the capacitors 111 to 114 in the capacitor module 2.
[0084] With such a configuration, it contributes to the miniaturization of the capacitor module 2 and enables the realization of low ESR.
[0085] (Embodiment 3) The capacitor module 3 according to the third embodiment of the present invention will be described.
[0086] In the third embodiment, mainly the differences from the second embodiment will be described. In the third embodiment, the same reference numerals are given to the same or equivalent configurations as those in the second embodiment and will be described. Also, in the third embodiment, the descriptions overlapping with those in the second embodiment are omitted.
[0087] FIG. 9 is a perspective view showing the capacitor module 3 according to the third embodiment of the present invention. FIG. 10 is a perspective view showing the first bus bar 231 of the capacitor module 3 in FIG. 9. FIG. 11 is a cross-sectional view showing a part of the capacitor module 3 in FIG. 9.
[0088] In Embodiment 3, as shown in FIG. 9, the orientation in which the capacitors 211 and 212 are arranged and the configuration of the first bus bar 231 according to the orientations of the capacitors 211 and 212 are different from those in Embodiment 2.
[0089] In the present embodiment, as shown in FIG. 10, the first bus bar 231 has contact portions 242a to 242b, buried portions 232a to 232b, and an exposed portion 233. The contact portions 242a to 242b and the buried portions 232a to 232b are formed by bending the ends of the exposed portion 233.
[0090] As shown in FIG. 11, the contact portion 242a is in contact with the first electrode 211a of the capacitor 211, and the buried portion 232a extends from the contact portion 242a. The boundary between the contact portion 242a and the buried portion 232a is indicated by a dashed line B. In the present embodiment, the through hole 241a is formed across the contact portion 242a and the buried portion 232a. The through hole 241a may be formed across the contact portion 242a and the buried portion 232b as in the present embodiment, or may be formed in either the contact portion 242a or the buried portion 232a. Note that the contact portion 242b and the buried portion 232b have the same configuration.
[0091] [Effect] According to the capacitor module 3 according to Embodiment 3, the same effects as those in Embodiment 1 and Embodiment 2 can be achieved.
[0092] The present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, but various modifications and corrections will be apparent to those skilled in the art. Such modifications and corrections should be understood to be included therein as long as they do not depart from the scope of the present invention as defined by the appended claims.
Industrial Applicability
[0093] The present invention is useful for capacitor modules used in various electronic devices, electrical devices, industrial devices, vehicle devices, and the like.
Description of Symbols
[0094] 1 to 3 capacitor modules Capacitors 11 to 18, 111 to 114, 211 to 212 First electrodes 11a to 18a, 111a to 114a, 211a to 212a Second electrodes 11b to 18b First bus bars 31, 131, 231 Embedded parts 33, 132, 232 Through holes 41, 141, 241 Exposed parts 34, 133, 233 Contact parts 35, 142, 242 First protrusion 41a Second protrusions 41b, 41c Second bus bars 36, 36a Embedded parts 38, 38a Exposed part 39 Contact part 40 Through hole 46 Cases 51, 151, 251 Bottom surfaces 51a, 151a, 251a Openings 51b, 151b, 251b Sealing resins 52, 152, 252
Claims
1. A case having an opening formed at a position facing the bottom surface, A sealing resin filled in the case, One or more capacitors housed in the case, A plate-shaped first bus bar connected to one electrode of the capacitor, A plate-shaped second bus bar connected to the other electrode of the capacitor, Comprising, The capacitor is disposed inside the sealing resin, Each of the first bus bar and the second bus bar has a contact portion disposed inside the sealing resin and contacting the electrode, a buried portion disposed inside the sealing resin and extending from the contact portion, and an exposed portion extending from the buried portion and disposed along the opening of the case outside the sealing resin. The buried portion extends in a direction from the opening of the case toward the bottom surface, In at least one of the first bus bar and the second bus bar, there are provided a through hole formed at least in the buried portion and filled with the sealing resin, and a protrusion formed in the contact portion and / or the buried portion and surrounded by the sealing resin. The protrusion has a second protrusion portion formed by extending a part of the contact portion and / or the buried portion in the width direction. A capacitor module.
2. The contact portion and / or the buried portion form the through hole. The capacitor module according to claim 1.
3. The contact portion forming the through hole extends in a direction from the bottom surface of the case toward the opening. The capacitor module according to claim 2.
4. The protrusion has a first protrusion portion formed by bending an end portion of the contact portion and / or the buried portion. The capacitor module according to claim 1.
5. For each of the plurality of capacitors, at least one of the through holes or the protrusions is provided. The capacitor module according to any one of claims 1 to 4.
6. A cooling member is disposed on the exposed portion. The capacitor module according to any one of claims 1 to 5.
Citation Information
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