Component mounting system, component mounting apparatus, malfunction detection apparatus, and component mounting method

Abstract

To provide a component mounting system and the like which can detect an abnormality in a holding part at an early stage.SOLUTION: A component mounting system 1 comprises: a component mounting device M2 which mounts a component P on a substrate 3; a communication unit 110; and a determination unit 140. The component mounting device M2 includes: a holding part which holds the component P; and an imaging part which images the component P. The communication unit 110 acquires first positional deviation information of the component P to the holding part based on an image obtained by imaging the component P held by the holding part by the imaging part and second positional deviation information of the component P based on the image obtained by imaging the component P mounted on the substrate 3 by the imaging part. The determination unit 140 determines a trouble in the holding part on the basis of whether or not the first positional deviation information and the second positional deviation information are in a prescribed correlation.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present disclosure relates to a component mounting system, a component mounting device, a malfunction detection device, and a component mounting method.

Background Art

[0002] Conventionally, in a component mounting device for mounting components on a substrate, improving the accuracy of the mounting position (mounting location) of the components has been studied. For example, Patent Document 1 discloses calculating a feedback correction value for each suction holding part (holding part) from the amount of displacement of a selected component among the components mounted on the substrate, and correcting the mounting operation of the component mounting device using the feedback correction value.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in a component mounting device including a holding part that sucks components, if the holding part malfunctions, the mounting position of the components will shift, leading to mounting failures. And when the state of the holding part is confirmed and addressed after a mounting failure is detected by an inspection device on the downstream side of the component mounting device, since defective products with mounting failures have actually occurred, the defective cost increases. Therefore, although it is desirable to detect a malfunction of the holding part at an early stage, Patent Document 1 does not disclose detecting a malfunction of the holding part at an early stage.

[0005] Therefore, the present disclosure provides a component mounting system, a component mounting device, a malfunction detection device, and a component mounting method capable of detecting a malfunction of the holding part at an early stage.

Means for Solving the Problems

[0006] A component mounting system according to an aspect of the present disclosure includes a component mounting unit that mounts a component on a substrate, an acquisition unit, and a determination unit. The component mounting unit has a holding unit that holds the component and an imaging unit that images the component. The acquisition unit acquires first position deviation information of the component with respect to the holding unit based on a first image obtained by the imaging unit imaging the component held by the holding unit, and second position deviation information of the component based on a second image obtained by the imaging unit imaging the component mounted on the substrate. The determination unit determines whether there is a problem with the holding unit based on whether the first position deviation information and the second position deviation information have a predetermined correlation.

[0007] A component mounting apparatus according to an aspect of the present disclosure is a component mounting apparatus that mounts a component on a substrate, and includes a holding unit that holds the component, an imaging unit that images the component, an acquisition unit, and a determination unit. The acquisition unit acquires first position deviation information of the component with respect to the holding unit based on an image obtained by the imaging unit imaging the component held by the holding unit, and second position deviation information of the component based on an image obtained by the imaging unit imaging the component mounted on the substrate. The determination unit determines whether there is a problem with the holding unit based on whether the first position deviation information and the second position deviation information have a predetermined correlation.

[0008] A malfunction detection apparatus according to an aspect of the present disclosure is a malfunction detection apparatus that detects a malfunction of a holding unit in a component mounting apparatus including the holding unit that holds a component for mounting the component on a substrate. The malfunction detection apparatus includes an acquisition unit that acquires first position deviation information of the component with respect to the holding unit based on an image obtained by imaging the component held by the holding unit, and second position deviation information of the component based on an image obtained by imaging the component mounted on the substrate, and a determination unit that determines whether there is a malfunction of the holding unit based on whether the first position deviation information and the second position deviation information have a predetermined correlation.

[0009] A component mounting method according to an aspect of the present disclosure is a component mounting method using a component mounting apparatus including a holding unit that holds a component to mount the component on a substrate. The method includes imaging the component held by the holding unit, acquiring first displacement information of the component with respect to the holding unit based on the imaged image, imaging the component mounted on the substrate, acquiring second displacement information of the component mounted on the substrate based on the imaged image, and determining a malfunction of the holding unit based on whether or not there is a predetermined correlation between the first displacement information and the second displacement information.

Advantages of the Invention

[0010] According to a component mounting system or the like according to an aspect of the present disclosure, a malfunction of a holding unit can be detected at an early stage.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9A

Figure 9B

Figure 10

Figure 11A

Figure 11B

Figure 12

[0012] A component mounting system according to an aspect of the present disclosure includes a component mounting unit that mounts a component on a substrate, an acquisition unit, and a determination unit. The component mounting unit has a holding unit that holds the component and an imaging unit that images the component. The acquisition unit acquires first position deviation information of the component with respect to the holding unit based on a first image obtained by the imaging unit imaging the component held by the holding unit, and second position deviation information of the component based on a second image obtained by the imaging unit imaging the component mounted on the substrate. The determination unit determines whether the holding unit is malfunctioning based on whether the first position deviation information and the second position deviation information have a predetermined correlation.

[0013] Accordingly, when the first position deviation information and the second position deviation information have a predetermined correlation, the determination unit can determine that the holding unit is malfunctioning even before a defective product is produced. That is, the determination unit can detect a malfunction of the holding unit before a component mounting defect actually occurs. Therefore, the component mounting system can detect a malfunction of the holding unit at an early stage.

[0014] Further, for example, the component mounting portion has a plurality of the holding portions, the acquisition unit acquires the first positional deviation information corresponding to each of the plurality of the holding portions and the second positional deviation information, and the determination unit determines, for each of the plurality of the holding portions, whether there is a malfunction in the holding portion based on whether the first positional deviation information and the second positional deviation information corresponding to each of the plurality of the holding portions are in the predetermined correlation relationship.

[0015] Thereby, it is possible to identify which holding portion among the plurality of holding portions is malfunctioning. Therefore, when a malfunctioning holding portion occurs, the work of the operator or the administrator (hereinafter also referred to as the operator, etc.) to confirm which holding portion is malfunctioning can be shortened, so that it is possible to quickly take measures against the malfunctioning holding portion.

[0016] Further, for example, the determination unit further determines whether there is a malfunction in the holding portion and the type of the component based on whether the first positional deviation information and the second positional deviation information corresponding to the type of the component are in the predetermined correlation relationship for each type of the component.

[0017] Thereby, when it is determined that the holding portion is malfunctioning, it is possible to determine whether the holding portion is actually malfunctioning or the holding portion is determined to be malfunctioning due to the type of the component, so that the malfunction of the holding portion can be determined more accurately. For example, when it is determined that the holding portion is malfunctioning when production is performed using a specific component, the determination unit can determine that the holding portion is determined to be malfunctioning due to the type of the component.

[0018] Further, for example, the determination unit determines whether the first positional deviation information and the second positional deviation information are in the predetermined correlation relationship based on an index indicating the correlation relationship between the first positional deviation information and the second positional deviation information, which is calculated based on the first positional deviation information and the second positional deviation information.

[0019] Thereby, by using the index indicating the correlation relationship, it is possible to easily determine the malfunction of the holding portion.

[0020] Further, for example, the index may be a correlation coefficient, and the determination unit may determine that the first position shift information and the second position shift information have the predetermined correlation relationship when the correlation coefficient is equal to or greater than a predetermined value.

[0021] Accordingly, by using an index generally used such as a correlation coefficient, it is possible to easily determine a malfunction of the holding unit. Therefore, since it is not necessary to perform special calculations to calculate the index, the processing amount in determining a malfunction of the component mounting system can be reduced.

[0022] Further, for example, the predetermined value may be a value indicating that there is a weak positive correlation between the first position shift information and the second position shift information.

[0023] Accordingly, the determination unit can determine a malfunction of the holding unit simply by comparing the correlation coefficient with a value indicating that there is a weak positive correlation.

[0024] Further, for example, when the first position shift information and the second position shift information have the predetermined correlation relationship, an output unit that outputs a message indicating that the holding unit is malfunctioning may be further provided.

[0025] Accordingly, it is possible to notify an operator or the like that the holding unit is malfunctioning.

[0026] Further, for example, when the first position shift information and the second position shift information have the predetermined correlation relationship, the imaging unit further images a tip of the holding unit, and the determination unit further determines whether there is an abnormality in the tip based on a third image of the tip imaged by the imaging unit, and determines a malfunction of the holding unit based on a determination result.

[0027] As a result, when the correlation coefficient is equal to or greater than a predetermined value, it is possible to automatically determine whether the holding unit is truly malfunctioning based on the image. Therefore, it is possible to more accurately determine the malfunction of the holding unit. In addition, since it is not necessary for an operator or the like to determine whether the holding unit is truly malfunctioning, it contributes to labor savings on the production line.

[0028] Further, for example, the holding unit is a suction nozzle that sucks and holds the component, the component mounting unit further includes a measuring unit that measures the vacuum flow rate of the air flowing through the suction nozzle, and when the first displacement information and the second displacement information are in the predetermined correlation relationship, the measuring unit further measures the vacuum flow rate, and the determination unit further determines whether there is an abnormality in the measured vacuum flow rate, and based on the determination result, may determine the malfunction of the holding unit.

[0029] As a result, when the correlation coefficient is equal to or greater than a predetermined value, it is possible to automatically determine whether the suction nozzle is truly malfunctioning based on the flow rate. Therefore, it is possible to more accurately determine the malfunction of the holding unit. In addition, since it is not necessary for an operator or the like to determine whether the holding unit is truly malfunctioning, it contributes to labor savings on the production line.

[0030] Further, for example, the air supply unit that supplies air to the suction nozzle is further provided, and when the determination result includes an abnormality, the air may be supplied to the suction nozzle when the suction nozzle is located at a position other than above the substrate.

[0031] As a result, when there is an abnormality in the tip or the flow rate, the abnormality can be automatically eliminated by supplying air to the holding unit. In addition, since malfunctions that can be eliminated by supplying air can be eliminated without human operation, it further contributes to labor savings on the production line.

[0032] Also, a component mounting apparatus according to an aspect of the present disclosure is a component mounting apparatus that mounts a component on a substrate, and includes a holding unit that holds the component, an imaging unit that images the component, an acquisition unit, and a determination unit. The acquisition unit acquires first positional deviation information of the component with respect to the holding unit based on an image obtained by the imaging unit imaging the component held by the holding unit, and second positional deviation information of the component based on an image obtained by the imaging unit imaging the component mounted on the substrate. The determination unit determines a malfunction of the holding unit based on whether or not the first positional deviation information and the second positional deviation information have a predetermined correlation relationship.

[0033] Thereby, the same effects as those of the above-described component mounting system are achieved. Further, since it is not necessary to communicate with an external device, it is possible to detect a malfunction of the holding unit earlier and more reliably regardless of the state of the communication network.

[0034] Also, a malfunction detection apparatus according to an aspect of the present disclosure is a malfunction detection apparatus that detects a malfunction of a holding unit in a component mounting apparatus including the holding unit that holds a component for mounting the component on a substrate, and includes an acquisition unit that acquires first positional deviation information of the component with respect to the holding unit based on an image obtained by imaging the component held by the holding unit, and second positional deviation information of the component based on an image obtained by imaging the component mounted on the substrate, and a determination unit that determines a malfunction of the holding unit based on whether or not the first positional deviation information and the second positional deviation information have a predetermined correlation relationship.

[0035] Thereby, the same effects as those of the above-described component mounting system are achieved.

[0036] Also, a component mounting method according to an aspect of the present disclosure is a component mounting method using a component mounting apparatus including a holding unit that holds a component to mount the component on a substrate, the method including imaging the component held by the holding unit, obtaining first positional deviation information of the component with respect to the holding unit based on the captured image, imaging the component mounted on the substrate, obtaining second positional deviation information of the component mounted on the substrate based on the captured image, and determining a malfunction of the holding unit based on whether the first positional deviation information and the second positional deviation information have a predetermined correlation.

[0037] Thereby, the same effects as those of the above-described component mounting system are achieved.

[0038] Note that these general or specific aspects may be implemented by a system, a method, an integrated circuit, a computer program, or a non-transitory recording medium such as a computer-readable CD-ROM, or may be implemented by any combination of a system, a method, an integrated circuit, a computer program, or a recording medium. The program may be stored in the recording medium in advance or may be supplied to the recording medium via a wide-area communication network including the Internet or the like.

[0039] Hereinafter, embodiments will be specifically described with reference to the drawings.

[0040] Note that each of the embodiments described below shows general or specific examples. The numerical values, shapes, components, arrangement positions and connection forms of the components, steps, the order of steps, etc. shown in the following embodiments are merely examples and are not intended to limit the present disclosure. In addition, among the components in the following embodiments, the components not described in the independent claims are described as optional components.

[0041] Also, each figure is a schematic diagram and is not necessarily drawn precisely. Therefore, for example, the scales in each figure do not necessarily match. In each figure, substantially the same configuration is denoted by the same reference numeral, and redundant description is omitted or simplified.

[0042] In addition, in this specification and the drawings, the substrate conveyance direction is defined as the X-axis direction (the left-right direction in FIG. 3), the direction that is orthogonal to the substrate conveyance direction and parallel to the horizontal plane is defined as the Y-axis direction, and the direction that is orthogonal to the X-axis direction and the Y-axis direction is defined as the Z-axis direction (the up-down direction).

[0043] In addition, in this specification, terms indicating the relationship between elements such as the same, and terms indicating the shape of elements such as rectangular parallelepiped shape and columnar shape, as well as numerical values and numerical ranges, are not expressions representing only a strict meaning, but are expressions meaning that they include substantially equivalent ranges, for example, a difference of about several percent (for example, about 10%).

[0044] (Embodiment) Hereinafter, the component mounting system according to this embodiment will be described with reference to FIGS. 1 to 12.

[0045] [1. Configuration of Component Mounting System] First, the configuration of the component mounting system according to this embodiment will be described with reference to FIGS. 1 to 6. FIG. 1 is a diagram showing a schematic configuration of a component mounting system 1 according to this embodiment.

[0046] As shown in FIG. 1, the component mounting system 1 is a system for manufacturing a mounted substrate by mounting components P (see FIGS. 5 and 6) on a substrate 3 (see FIGS. 3 and 6), and includes a solder printing apparatus M1, component mounting apparatuses M2 and M3, an inspection apparatus M4, and a management computer 100. The solder printing apparatus M1, the component mounting apparatuses M2 and M3, the inspection apparatus M4, and the management computer 100 are communicably connected to each other via a communication network 200. Note that the number of the solder printing apparatus M1, the component mounting apparatuses M2 and M3, and the inspection apparatus M4 included in the component mounting system 1 is not limited to the number shown in FIG. 1. For example, the number of the component mounting apparatuses M2 and M3 is not limited to two, and may be one or three or more. The solder printing apparatus M1, the component mounting apparatuses M2 and M3, and the inspection apparatus M4 constitute a production line (component mounting line).

[0047] The solder printing device M1 screen-prints the cream solder for component bonding onto the substrate 3 to be mounted.

[0048] The component mounting devices M2 and M3 are provided downstream of the solder printing device M1, and perform a component mounting operation of transferring and mounting the component P taken out from the component supply unit 4 (see FIG. 3) onto the substrate 3 on which the cream solder for component bonding has been printed by the mounting head unit 8 (see FIGS. 2 to 4).

[0049] The inspection device M4 is provided downstream of the component mounting devices M2 and M3, and inspects the mounting state of the component P on the substrate 3 on which the component P has been mounted (attached) by the component mounting devices M2 and M3, and detects the displacement state of the component P from its normal position and the like. The component mounting devices M2 and M3 are an example of a component mounting unit.

[0050] The management computer 100 has a production line management function and a malfunction detection function for detecting a malfunction of the suction nozzle 15 (see FIG. 4) of the mounting head unit 8. Note that a malfunction refers to a state in which the production performance of the suction nozzle 15 has deteriorated, for example, a state in which the original production performance (for example, the original component holding force) cannot be exhibited, or a state in which it does not operate (function). Further, a malfunction may include a state or a failure in which, although within the range of normal production performance, it is predicted that the original production performance cannot be exhibited in the future (for example, within a predetermined time). The prediction of a malfunction may be performed based on, for example, the gradient of the measurement result of the flow sensor 34 (the degree of change in time-series data).

[0051] The solder printing device M1, the component mounting devices M2 and M3, and the inspection device M4 are, for example, devices provided in a factory. Further, the management computer 100 may be provided in the factory or may be provided at a remote location different from the factory.

[0052] Subsequently, the functional configuration of the component mounting system 1 will be further described with reference to FIG. 2. FIG. 2 is a block diagram showing the functional configuration of the component mounting system 1 according to the present embodiment. Note that in FIG. 2, the illustration of the solder printing device M1 is omitted.

[0053] As shown in FIG. 2, the component mounting apparatuses M2 and M3 include, as functional components, a communication unit 20, a mounting control unit 21, a mounting storage unit 22, a recognition processing unit 40, a display unit 50, an input unit 52, and a mounting head unit 8.

[0054] The communication unit 20 transmits and receives signals and data between the component mounting apparatuses M2 and M3, the inspection apparatus M4, and the management computer 100 via the communication network 200. The communication unit 20 is a communication circuit (communication module) for performing communication via the communication network 200. The communication performed by the communication unit 20 is, for example, wireless communication, but may also be wired communication. The communication standard used for communication is not particularly limited either.

[0055] The mounting control unit 21 controls each component based on programs, data, etc. stored in the mounting storage unit 22, thereby controlling the mounting operation of mounting the component P on the substrate 3 by the mounting head unit 8. The mounting control unit 21 corrects the mounting operation by the mounting head unit 8 based on the mounting data 23, the position of the substrate 3, and the position of the component P held by the mounting head unit 8, and mounts the component P on the substrate 3. Further, the mounting control unit 21 rotates the component P held by the suction nozzle 15 by the rotation angle specified in the mounting data 23 and mounts the component P on the substrate 3. The mounting control unit 21 is realized by an arithmetic device such as a CPU (Central Processing Unit).

[0056] The mounting storage unit 22 is a storage device that stores mounting data 23, a mounting program (not shown) for executing a component mounting operation including the mounting operation, etc. The mounting storage unit 22 is realized by a semiconductor memory or the like, but is not limited thereto. Note that the component mounting operation is an operation of mounting the component P supplied from the component supply unit 4 by the component mounting apparatuses M2 and M3 on the substrate 3.

[0057] The mounting data 23 is data referred to when mounting the component P on the substrate 3, and includes information such as the coordinates of the normal position (mounting position) of the component P on the substrate 3, the rotation angle of the component P during mounting, and the type of the component P to be mounted.

[0058] In addition, the mounting storage unit 22 further includes adsorption information regarding the adsorption position of the component P in a state where the mounting head unit 8 adsorbs the component P. The adsorption information includes information regarding adsorption variation (see FIG. 5) including the coordinates of the target normal position (adsorption position) of the component P, the position in the rotation direction of the component P during adsorption, and the like. The adsorption position may be, for example, the target position on the component P when the center position of the adsorption nozzle 15 adsorbs the component P. The information regarding adsorption variation is position deviation amount data including the amount of position deviation of the component P during adsorption.

[0059] The recognition processing unit 40 detects the position of the substrate 3 by recognizing the imaging result (for example, an image) by the substrate recognition camera 12. In addition, the recognition processing unit 40 detects the position of the component P held by the mounting head unit 8 by recognizing the imaging result (for example, an image) by the component recognition camera 11. For example, the recognition processing unit 40 detects the position deviation of the component P held by the mounting head unit 8 by recognizing the imaging result by the component recognition camera 11. The position deviation includes, for example, the position deviation between the center position of the adsorption nozzle 15 of the mounting head unit 8 and the center position of the component P, and the position deviation in the rotation direction of the component P.

[0060] The component recognition camera 11 images the component P. The component recognition camera 11 is, for example, attached so as to be able to image the mounting head unit 8 holding the component P from below the component P, but the attachment mode is not limited to this. The component recognition camera 11 is an example of an imaging unit. In addition, the image obtained by the component recognition camera 11 imaging the component P held by the adsorption nozzle 15 is an example of a first image.

[0061] The substrate recognition camera 12 images the substrate 3 for mounting the component P.

[0062] The display unit 50 displays various information such as an operation screen for operations by the input unit 52. Further, when the suction nozzle 15 is malfunctioning, the display unit 50 displays information indicating that the suction nozzle 15 is malfunctioning. The display unit 50 is realized by a display device such as a liquid crystal panel.

[0063] The input unit 52 receives inputs such as operation commands and data from a user (for example, an operator or a manager, hereinafter also referred to as an operator, etc.). The input unit 52 is realized by an input device such as a keyboard, a touch panel, a mouse, etc., but may be realized by a device that receives input by voice (for example, a microphone), for example.

[0064] The mounting head unit 8 executes a component mounting operation for mounting the component P on the substrate 3.

[0065] Here, regarding the mounting head unit 8, in addition to FIG. 2, FIGS. 3 and 4 will be further referred to for explanation. FIG. 3 is a plan view showing the component mounting apparatus M2 according to the present embodiment. FIG. 4 is a perspective view showing the mounting head unit 8 used in the component mounting apparatus M2 according to the present embodiment. Note that the plan view of the component mounting apparatus M3 may be the same as the plan view of the component mounting apparatus M2, and the explanation thereof will be omitted.

[0066] First, the configuration of the component mounting apparatus M2 will be described. The component mounting apparatus M2 includes a base 1a, a substrate transfer unit 2, a component supply unit 4, a Y-axis beam 6, an X-axis beam 7, a mounting head unit 8, a component waste box 10, a component recognition camera 11, and a substrate recognition camera 12.

[0067] The base 1a can arrange the substrate 3, the substrate transfer unit 2, etc. On the upper surface of the base 1a, a substrate transfer unit 2 extending along the X-axis direction is disposed.

[0068] The substrate transfer unit 2 positions and holds the substrate 3 at the mounting operation position by transferring the substrate 3 delivered from an upstream device (for example, a solder printing apparatus M1). Component supply units 4 are respectively disposed on both sides in the Y-axis direction with respect to the substrate transfer unit 2.

[0069] The component supply unit 4 is a structure for the mounting head unit 8 to take out the component P, in other words, for supplying the component P to the mounting head unit 8. A plurality of tape feeders 5 are arranged and mounted side by side on the component supply unit 4. By pitch-feeding the carrier tape in which the tape feeder 5 holds the component P, the mounting head unit 8 constituting the component mounting mechanism can position the component P at the mounting position. Note that the component supply unit 4 is not limited to the mounting of the tape feeder 5, and for example, a bulk feeder or the like may be mounted.

[0070] Also, a long Y-axis beam 6 is horizontally disposed along the Y-axis direction at one end on the +X-axis direction side of the upper surface of the base 1a. Further, a pair of long X-axis beams 7 are slidably mounted on the Y-axis beam 6 along the Y-axis direction.

[0071] One of the pair of X-axis beams 7 is disposed on the +Y-axis direction side with respect to the substrate conveyance unit 2, and the other of the pair of X-axis beams 7 is disposed on the -Y-axis direction side with respect to the substrate conveyance unit 2. Also, the pair of X-axis beams 7 are horizontally disposed along the X-axis direction.

[0072] The pair of X-axis beams 7 can move in the Y-axis direction by a linear drive mechanism provided in the Y-axis beam 6. The mounting head unit 8 is slidably mounted on each of the pair of X-axis beams 7.

[0073] The suction nozzle 15 is a component suction unit that sucks (holds) the component P and rotates the component P at a predetermined angle in the rotation direction (θ direction) parallel to the mounting surface of the substrate 3 to mount the component P. And the mounting head unit 8 has the component suction unit. Specifically, the mounting head unit 8 has a plurality of suction nozzles 15, and the component P is rotated in the rotation direction parallel to the mounting surface of the substrate 3 by the suction nozzles 15 to mount the component P on the substrate 3. The suction nozzle 15 is an example of the holding unit.

[0074] The mounting head unit 8 has a plurality of nozzle units 9. Further, the mounting head unit 8 can be moved along the X-axis direction by a linear drive mechanism provided in the X-axis beam 7.

[0075] By freely moving the X-axis beam 7 and the mounting head unit 8 in the X-Y plane by driving the linear drive mechanism, the mounting head unit 8 uses a plurality of suction nozzles 15 provided in the nozzle unit 9 to vacuum-suck (adsorb) the component P from the tape feeder 5 arranged in each component supply unit 4, takes out the component P, moves above the substrate 3, and mounts the component P at the mounting position of the substrate 3.

[0076] Also, between the substrate conveyance unit 2 and each component supply unit 4 on the base 1a, a component recognition camera 11 and a component waste box 10 are arranged. When the mounting head unit 8 that has taken out the component P from the component supply unit 4 passes above the component recognition camera 11, the component recognition camera 11 images the component P held by the plurality of suction nozzles 15 mounted on the mounting head unit 8 at the imaging timing when the mounting head unit 8 passes. Therefore, the component recognition camera 11 can recognize the component P adsorbed by the plurality of suction nozzles 15. The plurality of suction nozzles 15 may be nozzles for adsorbing the same type of component P, or may be nozzles for adsorbing different types of component P from each other.

[0077] The component waste box 10 is on the path where the mounting head unit 8 passes above the component recognition camera 11 and is arranged along the X-axis direction adjacent to the component recognition camera 11. When the mounting head unit 8 that has adsorbed the component P is located above the component waste box 10, the component P can be discarded. Also, in this embodiment, above the component waste box 10, an air blow for removing foreign matter or the like attached to the suction nozzle 15 is further performed.

[0078] In addition, the plurality of suction nozzles 15 can adsorb (vacuum adsorb) the component P and can separate the adsorbed component P. Further, the plurality of suction nozzles 15 can not only perform such vacuum adsorption but also blow air.

[0079] On the coupling plate 8a to which the mounting head unit 8 is attached, a board recognition camera 12 is disposed on the lower surface side of the X-axis beam 7 and moves integrally with the mounting head unit 8. The board recognition camera 12 is disposed on the coupling plate 8a with its imaging direction facing downward. By moving the mounting head unit 8 above the board 3 held by the board conveyance unit 2, the board recognition camera 12 can image the position recognition mark or the like of the board 3, or move above the board 3 after component mounting to image the components mounted on the board 3.

[0080] By performing image recognition processing on the image data acquired by the component recognition camera 11 and the board recognition camera 12, it is possible to detect the displacement of the component P held by the suction nozzle 15 in the mounting head unit 8 and the displacement of the board 3 held by the board conveyance unit 2. In the component mounting operation, the mounting head unit 8 corrects the position in consideration of these displacements and mounts the component P at the mounting position of the board 3.

[0081] As shown in FIGS. 3 and 4, the mounting head unit 8 is mounted on the X-axis beam 7 via the coupling plate 8a. The mounting head unit 8 is arranged with a plurality of nozzle units 9 juxtaposed. Each nozzle unit 9 is arranged such that the nozzle shaft 13 extends downward from the nozzle drive unit 9a. A plurality of suction nozzles 15 are detachably mounted on the nozzle mounting portion 14 coupled to the lower end portion of the nozzle shaft 13. Each nozzle drive unit 9a has a nozzle lifting mechanism that lifts and lowers a lifting shaft coupled to the nozzle shaft 13 by a linear motor. When the nozzle drive unit 9a is driven, the plurality of suction nozzles 15 mounted on the nozzle mounting portion 14 move up and down individually. Such a mounting head unit 8 has, in addition to the plurality of nozzle units 9, a nozzle drive unit 9a, a nozzle shaft 13, a nozzle mounting portion 14, and a suction nozzle 15. Note that the mounting head unit 8 has a plurality of nozzle units 9, a plurality of nozzle drive units 9a, a plurality of nozzle shafts 13, a plurality of nozzle mounting portions 14, and a plurality of suction nozzles 15. Unless otherwise specified, one nozzle unit 9, one nozzle drive unit 9a, one nozzle shaft 13, one nozzle mounting portion 14, and one suction nozzle 15 will be described.

[0082] A plurality of types of suction nozzles 15 are prepared according to the size and shape of the parts to be vacuum-sucked. For example, for large-sized parts, a suction nozzle 15 with a large suction surface at the lower end of the suction nozzle 15 is used.

[0083] Also, a plurality of types of mounting head units 8 are prepared according to the type of the suction nozzle 15 to be mounted. For example, when mounting a large suction nozzle 15 for sucking large parts, a mounting head unit 8 having a large nozzle unit 9 is used.

[0084] The nozzle shaft 13 passes through the nozzle mounting portion 14 and communicates with the suction nozzle 15. The flow path hole provided inside the nozzle shaft 13 is connected to an output path that communicates with the suction nozzle 15 via the flow rate sensor 34. That is, the suction hole of the nozzle shaft 13 is connected to the output port of the switching valve 36 via the flow rate sensor 34 and the output path, thereby forming a suction / air blow circuit that connects the switching valve 36 and the suction nozzle 15.

[0085] The flow rate sensor 34 measures the flow rate of air flowing through the suction nozzle 15. For example, the flow rate sensor 34 measures the flow rate of air flowing inside a predetermined suction nozzle 15 among the plurality of suction nozzles 15. For example, the flow rate sensor 34 measures the flow rates of air in two directions, the positive direction flowing out from the flow rate sensor 34 in the direction of the nozzle shaft 13 and the negative direction flowing into the flow rate sensor 34 from the nozzle shaft 13. In other words, the flow rate sensor 34 measures the vacuum flow rate (suction flow rate) when the suction nozzle 15 sucks, and the blow flow rate when the suction nozzle 15 blows. The flow rate sensor 34 outputs at least the measurement result of the vacuum flow rate and the measurement result of the blow flow rate to the management computer 100. The flow rate sensor 34 is an example of a measurement unit.

[0086] The switching valve 36 is composed of a solenoid valve or the like having two input ports and one output port. The two input ports include a first input port connected to a vacuum pump (not shown) and a second input port connected to the blow valve 38. The one output port is a first output port connected to an output path leading to the flow rate sensor 34. In the switching valve 36, the state of opening the path from the first input port to the first output port and the state of opening the path from the second input port to the first output port are switched by a selection signal from the outside. The vacuum pump can generate a negative pressure (vacuum).

[0087] The blow valve 38 is composed of a solenoid valve or the like having one or more input ports and one output port. The one or more input ports include a third input port connected to the air supply section 38a. The one output port includes a second output port connected to the second input port of the switching valve 36. In the blow valve 38, depending on a selection signal from the outside, the state in which the path from the third input port to the second output port is opened and the state in which the path is closed are switched. The air supply section 38a is an air supply device that supplies positive pressure air. Note that the one or more input ports may have a fourth input port connected to an atmospheric pressure supply section (not shown) that supplies air at atmospheric pressure. The atmospheric pressure supply section can also be realized by opening the fourth input port of the blow valve 38.

[0088] The switching valve 36 and the blow valve 38 are connected to a valve control section 31 included in the nozzle control section 30. The measurement result of the flow rate sensor 34 is input to the nozzle control section 30. In a valve storage section 32 included in the nozzle control section 30, timing information for switching the states of the switching valve 36 and the blow valve 38 by the valve control section 31, timing information for determining whether the air flow rate measured by the flow rate sensor 34 is normal, and a predetermined value (for example, a threshold value used for various determinations) are stored. Further, the flow rate value measured by the flow rate sensor 34 is stored in the valve storage section 32.

[0089] The nozzle control section 30 is disposed in the mounting head section 8.

[0090] When the valve control section 31 controls the switching valve 36 to open the path from the first input port to the first output port (suction state), the vacuum pump communicates with the suction nozzle 15 via the switching valve 36 and the flow rate sensor 34, and the suction nozzle 15 vacuum-sucks the component P from the suction surface at the lower end.

[0091] When the suction nozzle 15 vacuum-sucks the component P while the component P is in contact with the suction surface, the component P is vacuum-sucked by the suction nozzle 15. At this time, the air flow rate (vacuum flow rate) measured by the flow rate sensor 34 becomes substantially zero. When vacuum-sucking from the suction nozzle 15 while the component P is not in contact with the suction surface, outside air (air) is sucked from the suction nozzle 15. At this time, a negative air flow rate is measured by the flow rate sensor 34.

[0092] When the valve control unit 31 controls the switching valve 36 to open the path from the second input port to the first output port and controls the blow valve 38 to open the path from the third input port to the second output port (blow state), the air supply unit 38a communicates with the suction nozzle 15 via the blow valve 38, the switching valve 36, and the flow rate sensor 34, and positive-pressure air is discharged from the suction nozzle 15. That is, the air supply unit 38a discharges positive-pressure air from the suction nozzle 15. At this time, a positive air flow rate is measured by the flow rate sensor 34.

[0093] In this way, the switching valve 36 and the blow valve 38 selectively connect the vacuum pump and the air supply unit 38a to the suction nozzle 15. And the flow rate sensor 34 is provided in the suction / air blow circuit that connects the switching valve 36 and the blow valve 38 to the suction nozzle 15, and measures the air flow rate passing through the suction / air blow circuit in both the forward and reverse directions.

[0094] Here, regarding the suction variation when the suction nozzle 15 sucks the component P, it will be further described with reference to FIG. 5. FIG. 5 is a diagram for explaining an example of the suction variation of the suction nozzle 15 according to the present embodiment. Using FIG. 5, the displacement amounts △X1, △Y1, △θ1 from the normal position of the component P sucked by the suction nozzle 15 and stored in the mounting storage unit 22 will be described.

[0095] (a) of FIG. 5 shows a state where the suction nozzle 15 of the mounting head portion 8 sucks and lifts the component P. (b) of FIG. 5 shows an image 11a obtained by the component recognition camera 11 imaging the component P adsorbed on the suction nozzle 15. Specifically, (b) of FIG. 5 shows the image 11a captured such that the nozzle center Cn, which is the center position of the suction nozzle 15, coincides with the center 11c of the image 11a. Further, in (b) of FIG. 5, the suction nozzle 15 projected onto the image 11a is illustrated as the suction nozzle 11b.

[0096] As shown in (a) of FIG. 5, an operation is performed to move the mounting head portion 8 that holds the component P adsorbed by the suction nozzle 15 in a predetermined direction above the component recognition camera 11. Thereby, an image of the component P in a state of being adsorbed and held by the suction nozzle 15 is acquired. Note that the shape of the component P is not limited to a rectangular parallelepiped shape, and may be a columnar shape or other shapes.

[0097] As shown in (b) of FIG. 5, for example, the center line 11x in the X-axis direction and the center line 11y in the Y-axis direction are superimposed and displayed on the image 11a, and the intersection of the center line 11x in the X-axis direction and the center line 11y in the Y-axis direction is the center 11c of the image 11a. By subjecting such an image 11a to recognition processing by the recognition processing unit 40, the component center Cp, which is the center position of the component P, is extracted, and further, the displacement amounts ΔX1, ΔY1, and Δθ1 at the time of suction indicating the displacement amounts in the X-axis direction, Y-axis direction, and θ direction of the component center Cp from the center 11c of the image 11a are calculated. The θ direction is the direction of rotation with the axis (Z-axis) in the Z-axis direction as the rotation axis. The displacement at the time of suction can occur according to the malfunction of the suction nozzle 15. The suction position displacement can occur, for example, due to clogging of the suction nozzle 15, adhesion of foreign matter, etc. Further, the suction position displacement can also occur according to variations in the stop position of the carrier tape (target pocket) pitch-fed by the tape feeder 5, variations in the position or posture of the component P in the target pocket, variations in the suction position when the suction nozzle 15 sucks the component P, and the like.

[0098] Note that the displacement amounts ΔX1, ΔY1, and Δθ1 may be calculated for each of the plurality of suction nozzles 15, for example. Further, the displacement amounts ΔX1, ΔY1, and Δθ1 may be calculated for each type of component P. The displacement amounts ΔX1, ΔY1, and Δθ1 are an example of information indicating adsorption variations (first displacement information).

[0099] Referring to FIG. 2 again, the inspection apparatus M4 includes a communication unit 60, an inspection control unit 61, an inspection camera 63, an inspection storage unit 64, a display unit 67, and an input unit 69.

[0100] The communication unit 60 transmits and receives signals and data to and from the component mounting apparatuses M2 and M3 and the management computer 100 via the communication network 200. The communication unit 60 is a communication circuit (communication module) for performing communication via the communication network 200. The communication performed by the communication unit 60 is, for example, wireless communication, but may also be wired communication. The communication standard used for communication is not particularly limited either.

[0101] The inspection control unit 61 controls each component of the inspection apparatus M4. Further, the inspection control unit 61 manages the inspection in the inspection apparatus M4. The inspection control unit 61 has a displacement amount calculation unit 62 as an internal processing function. The inspection control unit 61 is realized by an arithmetic device such as a CPU.

[0102] The displacement amount calculation unit 62 executes a displacement amount calculation process for calculating the displacement amounts ΔX2, ΔY2, and Δθ2 (see FIG. 6) from the normal position of the component P mounted on the substrate 3 from the image captured by the inspection camera 63. The calculated displacement amounts ΔX2, ΔY2, and Δθ2 are stored in the inspection storage unit 64 as displacement amount data 66. Further, the displacement amounts ΔX2, ΔY2, and Δθ2 are output to the management computer 100 via the communication unit 60. Note that the displacement amount calculation unit 62 may calculate at least one of the displacement amounts ΔX2, ΔY2, and Δθ2.

[0103] Here, with reference to FIG. 6, the mounting variation of the component P after the suction nozzle 15 mounts the component P on the substrate 3 will be further described. FIG. 6 is a diagram for explaining the mounting variation of the component P according to the present embodiment.

[0104] In the mounting operation by the mounting head unit 8, the component P taken out from the tape feeder 5 of the component supply unit 4 by the suction nozzle 15 of the mounting head unit 8 is transferred and mounted aiming at the normal position Cs which is the mounting position set on the substrate 3. At this time, the component center Cp of the component P does not necessarily correctly coincide with the normal position Cs, and it may be mounted in a state where it is displaced by the displacement amount ΔX2 in the X-axis direction, the displacement amount ΔY2 in the Y-axis direction, and the displacement amount Δθ2 in the θ direction (the rotation direction parallel to the mounting surface).

[0105] The displacement amounts ΔX2, ΔY2, and Δθ2 are obtained by performing a displacement amount calculation process on the image of the component P mounted on the substrate 3 by the inspection camera 63 by the displacement amount calculation unit 62. The displacement amounts ΔX2, ΔY2, and Δθ2 are respectively obtained for a plurality of components P mounted on one substrate 3 and stored as displacement amount data 66. Further, the displacement amounts ΔX2, ΔY2, and Δθ2 are calculated, for example, for each of the plurality of suction nozzles 15. Further, the displacement amounts ΔX2, ΔY2, and Δθ2 may be calculated for each type of component P. The displacement amounts ΔX2, ΔY2, and Δθ2 are an example of information indicating the mounting variation (second displacement information).

[0106] The inspection camera 63 images the component P mounted on the substrate 3. The inspection camera 63 is attached, for example, so as to be able to image the substrate 3 on which the component P is mounted from above the component P, but the attachment mode is not limited to this. The inspection camera 63 is an example of an imaging unit. Further, the image obtained by the inspection camera 63 imaging the component P mounted on the substrate 3 is an example of the second image.

[0107] The inspection memory unit 64 is a storage device that stores implementation data 65, misalignment amount data 66, etc. The implementation data 65 contains data related to the substrate 3 on which the component P is mounted, such as the coordinates of the mounting position (normal position) of the component P on the substrate 3, the rotation angle of the component P during mounting, and the type of the mounted component P. The inspection memory unit 64 is realized by, for example, a semiconductor memory, but is not limited thereto.

[0108] The display unit 67 displays various information such as an operation screen for the operation by the input unit 69. The display unit 67 is configured by a display device such as a liquid crystal panel.

[0109] The input unit 69 receives inputs of operation commands, data, etc. from an operator or the like. The input unit 69 is realized by an input device such as a keyboard, a touch panel, a mouse, etc., but may be realized by, for example, a device that receives input by voice (e.g., a microphone).

[0110] As described above, the inspection device M4 includes an inspection camera 63 that images the component P, and a misalignment amount calculation unit 62 that calculates the misalignment amounts ΔX2, ΔY2, and Δθ2 from the normal position Cs of the component P from the image imaged by the inspection camera 63.

[0111] Referring to FIG. 2 again, the management computer 100 includes a communication unit 110, a management control unit 120, a management memory unit 130, a determination unit 140, a display unit 150, and an input unit 152. The management computer 100 is an example of a malfunction detection device that detects malfunctions of the suction nozzles 15 in the component mounting devices M2 and M3. Also, the management computer 100 may be realized by a server device.

[0112] The communication unit 110 transmits and receives signals and data to and from the solder printing device M1, the component mounting devices M2 and M3, and the management computer 100 via the communication network 200. The communication unit 110, for example, acquires the implementation data 23 (e.g., suction information) from the component mounting devices M2 and M3, and acquires the misalignment amount data 66 from the inspection device M4. The communication unit 110 is an example of an acquisition unit.

[0113] The communication unit 110 is a communication circuit (communication module) for performing communication via the communication network 200. The communication performed by the communication unit 110 may be, for example, wireless communication or may be wired communication. The communication standard used for communication is not particularly limited either.

[0114] In the present embodiment, when the first displacement information and the second displacement information described later have a predetermined correlation, the communication unit 110 may output information indicating that the suction nozzle 15 is malfunctioning to another device via the communication network 200 or an external communication network (for example, the Internet). The communication unit 110 may function as an output unit that outputs the said information.

[0115] The management control unit 120 manages each component of the management computer. Further, the management control unit 120 manages production in the production line. The management control unit 120 is realized by an arithmetic device such as a CPU.

[0116] The management storage unit 130 is a storage device that stores mounting data 131, component information 132, displacement amount data 133, etc. The management storage unit 130 is realized by a semiconductor memory or the like, but is not limited thereto.

[0117] The mounting data 131 is data referred to when mounting the component P on the substrate 3, and includes information such as the coordinates of the mounting position (normal position) of the component P on the substrate 3, the rotation angle of the component P during mounting, and the type of the component P to be mounted.

[0118] The component information 132 includes at least one of the shape and size of the component P mounted on the substrate 3 and the gap between the size of the pocket of the component supply unit 4 (for example, carrier tape) in which the component P is stored and the size of the component P.

[0119] The displacement amount data 133 is data regarding the displacement of the component P. The displacement amount data 133 includes information regarding adsorption variations (first displacement information) acquired from the component mounting apparatuses M2 and M3, and information regarding mounting variations (second displacement information) acquired from the inspection apparatus M4. In the present embodiment, the displacement amount data 133 includes displacement amounts ΔX1, ΔY1, Δθ1, ΔX2, ΔY2, and Δθ2.

[0120] The determination unit 140 determines whether there is a malfunction in the suction nozzle 15 based on the displacement amount data 133. Specifically, the determination unit 140 determines whether there is a malfunction in the suction nozzle 15 based on the adsorption variations and the mounting variations included in the displacement amount data 133. More specifically, the determination unit 140 determines whether there is a malfunction in the suction nozzle 15 based on the correlation between the adsorption variations and the mounting variations. In the present embodiment, it is characterized by using the correlation between the adsorption variations and the mounting variations to determine the occurrence of a malfunction in the suction nozzle 15.

[0121] The determination unit 140 performs the determination during production on the production line. The determination unit 140 may perform the determination, for example, each time the component P is mounted on the substrate 3. The determination method in the determination unit 140 will be described later.

[0122] The display unit 150 displays various information such as an operation screen for operations by the input unit 152. In the present embodiment, when the first displacement information and the second displacement information described later are in a predetermined correlation, the display unit 150 may display information indicating that the suction nozzle 15 is malfunctioning. The display unit 150 may function as an output unit that outputs the information. The display unit 150 is configured by a display device such as a liquid crystal panel.

[0123] The input unit 152 receives inputs of operation commands, data, etc. from an operator or the like. The input unit 152 is realized by an input device such as a keyboard, a touch panel, a mouse, etc., but may be realized by a device that receives input by voice (for example, a microphone), for example.

[0124] [Operation of Component Mounting System] Next, the operation of the above-described component mounting system 1 will be described with reference to FIGS. 7 to 12. FIG. 7 is a flowchart showing the operation (component mounting method) of the component mounting system 1 according to the present embodiment. Note that the processes from steps S16 to S20 shown in FIG. 7 may not be performed.

[0125] As shown in FIG. 7, first, production is started (S11). For example, based on control information from the management computer 100, the production line operates.

[0126] Next, the communication unit 110 of the management computer 100 acquires first position deviation information regarding the suction position of the component P from the component mounting devices M2 and M3 (S12). The first position deviation information is information indicating the deviation of the suction position of the component P with respect to the suction nozzle 15 based on the first image. In the present embodiment, the communication unit 110 acquires information indicating suction variation (position deviation amounts ΔX1, ΔY1, Δθ1) as the first position deviation information.

[0127] FIG. 8 is a diagram showing an example of suction variation. The horizontal axis in FIG. 8 indicates the deviation amount (ΔX) of the suction position in the X-axis direction, and the vertical axis in FIG. 8 indicates the deviation amount (ΔY) of the suction position in the Y-axis direction. FIG. 8 is a diagram in which information indicating suction variation is plotted on a graph. A plurality of points are plotted in FIG. 8. When there are a plurality of suction nozzles 15, the position deviation amounts ΔX1, ΔY1, Δθ1 of each of the plurality of suction nozzles 15 may be plotted on the graph. Also, the position deviation amounts ΔX1, ΔY1, Δθ1 during a plurality of suction operations of one suction nozzle 15 may be plotted on the graph.

[0128] Note that the information indicating suction variation may include identification information of the suction nozzle 15 that measured the suction variation, the measurement time (for example, the time when the suction nozzle 15 was imaged), information indicating the type of the component P, and the like.

[0129] Note that the adsorption variation shown in Fig. 8 is within the range of variations that can occur even when the adsorption nozzle 15 is normal. That is, the adsorption variation shown in Fig. 8 is a variation within the normal range of adsorption variation. That is, the amounts of displacement ΔX1, ΔY1, and Δθ1 are values within the normal range.

[0130] The component mounting devices M2 and M3 mount the adsorbed component P at a predetermined position on the substrate 3. The adsorption nozzle 15 places the adsorbed component P on the cream solder of the substrate 3. The substrate 3 on which the component P is mounted is conveyed to the inspection device M4, and the substrate 3 including the component P is imaged by the inspection camera 63.

[0131] Next, the communication unit 110 acquires second displacement information regarding the mounting position of the component P on the substrate 3 from the inspection device M4 (S13). The second displacement information is information indicating the mounting displacement (mounting position displacement) of the component P from the normal position Cs on the substrate 3 based on the second image. In the present embodiment, the communication unit 110 acquires, as the second displacement information, information indicating the mounting variation (amounts of displacement ΔX2, ΔY2, and Δθ2).

[0132] Fig. 9A is a diagram showing an example of mounting variation when the adsorption nozzle 15 is normal. Fig. 9B is a diagram showing an example of mounting variation when the adsorption nozzle 15 is malfunctioning. The horizontal axis in Figs. 9A and 9B indicates the amount of displacement (ΔX) of the mounting position in the X-axis direction, and the vertical axis in Figs. 9A and 9B indicates the amount of displacement (ΔY) of the mounting position in the Y-axis direction.

[0133] As shown in FIGS. 9A and 9B, the degree of mounting variation differs depending on whether or not the suction nozzle 15 is malfunctioning. Specifically, the mounting variation when the suction nozzle 15 is malfunctioning is greater than the mounting variation when the suction nozzle 15 is normal. This is presumably because when there is a malfunction in the suction nozzle 15, a displacement of the position of the component P occurs due to the movement of the suction nozzle 15 from when the component P is sucked until it is mounted on the substrate 3. For example, when the suction nozzle 15 is malfunctioning, the suction force for sucking the component P by the suction nozzle 15 (the component holding force for holding the component P) is weak, so due to the movement of the suction nozzle 15 in the X-axis direction, Y-axis direction, and Z-axis direction (mainly the X-axis direction and Y-axis direction), as well as the inertia, air resistance, etc. caused by the rotation in the θ direction, the component P deviates from the suction position. On the other hand, when the suction nozzle 15 is normal, the suction force for sucking the component P by the suction nozzle 15 is strong, so due to the movement of the suction nozzle 15 in the X-axis direction, Y-axis direction, and Z-axis direction (mainly the X-axis direction and Y-axis direction), as well as the inertia, air resistance, etc. caused by the rotation in the θ direction, the component P is less likely to deviate from the suction position.

[0134] The inventors of the present application have found that, as shown in FIGS. 9A and 9B, the amount of deviation of the component P from the suction position due to the movement of the suction nozzle 15 differs depending on whether or not the suction nozzle 15 is malfunctioning. Then, in the component mounting system 1, by focusing on the difference in the amount of deviation of the component P from the suction position, a malfunction of the suction nozzle 15 is detected.

[0135] Note that the mounting variation shown in FIG. 9B is within the range of variation that can occur even when the suction nozzle 15 is normal. That is, the mounting variation shown in FIG. 9B is a variation within the normal range of mounting variation. Also, the suction variation shown in FIG. 9B is a mounting variation that occurs when the position of the suction nozzle 15 at the time of mounting the component P is normal.

[0136] Note that in steps S12 and S13, the communication unit 110 may acquire the first position deviation information corresponding to each of the plurality of suction nozzles 15 and the second position deviation information.

[0137] Note that the amount of misalignment is not limited to the above. FIG. 10 is a diagram for explaining another example of adsorption variation according to the present embodiment.

[0138] As shown in FIG. 10, the adsorption variation may be a misalignment amount (distance) R calculated based on the misalignment amounts ΔX1 and ΔY1. The determination unit 140 may calculate a misalignment amount R (hereinafter also referred to as an adsorption position misalignment Rv) at the time of adsorption based on information regarding the adsorption variation. The adsorption position misalignment Rv is an example of the first misalignment information.

[0139] Similarly, the adsorption variation may be a misalignment amount (distance) R calculated based on the misalignment amounts ΔX2 and ΔY2. The determination unit 140 may calculate a misalignment amount R (hereinafter also referred to as a mounting position misalignment Rm) after mounting based on information regarding the mounting variation. The mounting position misalignment Rm is an example of the second misalignment information.

[0140] Note that the adsorption position misalignment Rv and the mounting position misalignment Rm are calculated using, for example, the Pythagorean theorem.

[0141] Note that the first misalignment information and the second misalignment information may include at least one misalignment amount in the X-axis direction, Y-axis direction, θ direction, and distance.

[0142] Next, the determination unit 140 calculates a correlation coefficient between the first misalignment information and the second misalignment information (S14). The determination unit 140 may calculate, for example, the correlation coefficient of each of the misalignment amounts in the X-axis direction, Y-axis direction, θ direction, and distance. For example, the determination unit 140 may calculate the correlation coefficient between the misalignment amounts ΔX1 and ΔX2, the correlation coefficient between the misalignment amounts ΔY1 and ΔY2, the correlation coefficient between the misalignment amounts Δθ1 and Δθ2, and the correlation coefficient between the adsorption position misalignment Rv and the mounting position misalignment Rm, respectively.

[0143] Note that the determination unit 140 only needs to calculate at least one of the above four correlation coefficients. Further, the correlation coefficient is an example of an index indicating the correlation between the first position shift information and the second position shift information.

[0144] Regarding the calculation of the correlation coefficient, the adsorption position shift Rv and the mounting position shift Rm will be described as examples. Let the covariance of the adsorption position shift Rv and the mounting position shift Rm be SRvRm, the standard deviation of the adsorption position shift Rv be SRv, and the standard deviation of the mounting position shift Rm be SRm. Then, the correlation coefficient r between the adsorption position shift Rv and the mounting position shift Rm is calculated by the following formula (1).

[0145] r = SRvRm / (SRv × SRm) ···(Formula 1)

[0146] The other three correlation coefficients r are calculated in the same way.

[0147] Note that the correlation coefficient r may be calculated for each type of component P. The determination unit 140 may calculate the correlation coefficient r corresponding to the type of the component P based on the first position shift information and the second position shift information corresponding to the type of the component P. The determination unit 140 may calculate the correlation coefficient r from the corresponding first position shift information and second position shift information in each combination of the plurality of suction nozzles 15 and the type of the component P.

[0148] Here, the correlation coefficients in the case where the suction nozzle 15 is normal and in the case where there is a malfunction will be described with reference to FIGS. 11A and 11B. FIG. 11A is a diagram showing the correlation between the adsorption position shift Rv and the mounting position shift Rm when the suction nozzle 15 is normal. FIG. 11B is a diagram showing the relationship between the adsorption position shift Rv and the mounting position shift Rm when the suction nozzle 15 is malfunctioning. Note that the broken lines shown in FIGS. 11A and 11B indicate the regression lines for the respective points plotted on the figure.

[0149] As shown in FIG. 11A, when the suction nozzle 15 is normal, no correlation is found between the suction position deviation Rv (an example of the first position deviation information) and the mounting position deviation Rm (an example of the second position deviation information). This is because although there is variation in the suction position deviation Rv of the component P during suction, the value of the mounting position deviation Rm becomes small due to the correction of the mounting position based on the position (suction position) of the component P held by the mounting head unit 8.

[0150] As shown in FIG. 11B, when the suction nozzle 15 is malfunctioning, a predetermined correlation is found between the suction position deviation Rv (an example of the first position deviation information) and the mounting position deviation Rm (an example of the second position deviation information). This is because there is variation in the suction position deviation Rv of the component P during suction, and when the component P is transferred to the substrate 3, the suction position of the component P is displaced. As a result, even if the position of the suction nozzle 15 is the normal position, a displacement in the mounting position occurs. Therefore, variations occur in both the suction position deviation Rv and the mounting position deviation Rm, and a predetermined correlation is found between the suction position deviation Rv and the mounting position deviation Rm.

[0151] Therefore, the determination unit 140 determines whether the suction nozzle 15 is malfunctioning based on whether there is a predetermined correlation between the first position deviation information and the second position deviation information.

[0152] Next, the determination unit 140 determines whether the correlation coefficient is equal to or greater than a predetermined value (S15). The predetermined value is a value indicating that there is a predetermined correlation between the first position deviation information and the second position deviation information, and may be, for example, a value indicating a weak positive correlation. The predetermined value is set in advance and stored in the management storage unit 130. The weak positive correlation will be described with reference to FIG. 12. FIG. 12 is a diagram showing the relationship between the correlation coefficient and the strength of the correlation.

[0153] As shown in FIG. 12, a weak positive correlation is, for example, any value between a value of the correlation coefficient r being 0.2 or more and less than 0.4. The predetermined value may be, for example, a value where the value of the correlation coefficient r is 0.2. Note that the predetermined value is not limited to a value indicating a weak positive correlation, and among the numerical values shown in FIG. 12, it may be a numerical value other than the numerical value corresponding to "almost no relationship" in terms of the strength of the correlation coefficient. For example, the predetermined value may be any value other than -0.2 or more and less than 0.2 within the range where the correlation coefficient r is -1 or more and 1 or less. Note that the predetermined value may be set to a value less than the value of the correlation coefficient r at which defects begin to occur in the mounting position of the component P. The correlation coefficient r at which defects begin to occur is, for example, preset in advance based on past production records and the like. The correlation coefficient r at which defects begin to occur may be set for each type of component P, for example.

[0154] The process of step S15 is an example of determining whether the first displacement information and the second displacement information have a predetermined correlation.

[0155] Note that when the correlation coefficient r of any of the plurality of displacement amounts is equal to or greater than the predetermined value, it is determined as Yes in step S15.

[0156] Next, when it is determined by the determination unit 140 that the correlation coefficient r is equal to or greater than the predetermined value (Yes in S15), the imaging unit (for example, the component recognition camera 11) images the tip 15a of the suction nozzle 15 (S16), and the flow rate sensor 34 measures the flow rate of the suction nozzle 15 (for example, the vacuum flow rate) (S17). At least one of steps S16 and S17 may be executed. Note that determining Yes in step S15 means that the first displacement information and the second displacement information have a predetermined correlation.

[0157] In step S16, the imaging unit images the tip 15a of the suction nozzle 15 in a state where the component P is not adsorbed and the correlation coefficient r is equal to or greater than a predetermined value. The imaging unit may image the tip 15a of the suction nozzle 15, for example, from below, that is, from a direction in which the inside (flow path) of the suction nozzle 15 can be imaged, or may image the tip 15a from the side of the suction nozzle 15. The captured image (an example of the third image) is output to the management computer 100.

[0158] In step S17, the flow rate sensor 34 measures the vacuum flow rate when the suction nozzle 15, for which the correlation coefficient r is equal to or greater than a predetermined value, sucks in a state where the component P is not adsorbed. The measured vacuum flow rate is output to the management computer 100.

[0159] Next, the determination unit 140 determines whether there is an abnormality in the tip 15a of the suction nozzle 15 or in the flow rate (for example, the vacuum flow rate) (S18). The determination unit 140 determines whether there is an abnormality in the tip 15a by image analysis of the third image. The determination unit 140 determines that there is an abnormality in the tip 15a when a foreign object is attached to the tip 15a, the tip 15a is clogged, or the tip 15a is deformed (for example, the tip 15a is chipped, bent, etc.). Further, the determination unit 140 determines that there is an abnormality in the tip 15a when the vacuum flow rate is equal to or greater than a predetermined flow rate (for example, when it is equal to or greater than a predetermined negative flow rate).

[0160] Next, when there is an abnormality in the tip 15a of the suction nozzle 15 or in the flow rate (Yes in S18), the determination unit 140 causes the air supply unit 38a to supply air to the suction nozzle 15 (S19). The determination unit 140 causes the air supply unit 38a to supply air to the suction nozzle 15 when the suction nozzle 15 (mounting head unit 8) is located at a position other than above the substrate 3. The determination unit 140 may, for example, cause the air supply unit 38a to supply air to the suction nozzle 15 on the component discard box 10 through which the suction nozzle 15 (mounting head unit 8) passes on the movement path when returning from the mounting position to the suction position. In this case, the processes from steps S14 to S18 may be performed while the suction nozzle 15 (mounting head unit 8) moves from the mounting position to the component discard box 10.

[0161] Thus, in step S19, the air supply unit 38a supplies air to the suction nozzle 15 when the suction nozzle 15 is located at a position other than above the substrate 3, including when there is an abnormality in the determination result of step S18.

[0162] Note that the amount of air supplied from the air supply unit 38a may be, for example, larger than the amount of air supplied from the air supply unit 38a when the suction nozzle 15 places the component P on the substrate 3 and separates from the substrate 3. The air supply unit 38a is provided in advance in the component mounting apparatuses M2 and M3 in order to discharge air from the inside to the outside of the suction nozzle 15 when the suction nozzle 15 separates from the substrate 3. That is, in step S19, measures are taken to eliminate the malfunction of the suction nozzle 15 without adding equipment.

[0163] Note that when it is determined Yes in step S18 because the tip 15a is deformed, the process of step S19 may not be executed. The determination unit 140 may determine whether to execute the process of step S19 based on the determination result.

[0164] Next, the determination unit 140 determines whether the abnormality of the tip 15a or the flow rate has been resolved according to the determination result in step S18 (S20). For example, when it is determined as Yes in step S18 based on the third image, the determination unit 140 may image the tip 15a of the suction nozzle 15 again in step S20 to determine whether the adhesion or clogging of foreign matter has been resolved. Further, for example, when it is determined as Yes in step S18 based on the vacuum flow rate, the determination unit 140 may measure the vacuum flow rate again in step S20 to determine whether the vacuum flow rate is within the normal range. When the abnormality of the tip 15a or the flow rate is not resolved, the determination unit 140 determines that the suction nozzle 15 is malfunctioning.

[0165] Note that in step S20, the determination of whether the abnormality has been resolved may be made based on both the image of the tip 15a and the vacuum flow rate.

[0166] Next, when the abnormality of the tip 15a or the flow rate is not resolved (No in S20), the determination unit 140 causes an error to be notified (S21). For example, the determination unit 140 may cause the display unit 150 to display information indicating that the suction nozzle 15 is malfunctioning. Further, when there are a plurality of suction nozzles 15, the determination unit 140 may also cause the display unit 150 to display information for identifying the malfunctioning suction nozzle 15 (for example, information indicating the installation position of the malfunctioning suction nozzle 15). Further, the determination unit 140 may cause the display unit 150 to display information indicating the cause of the determination as abnormal in step S18 (for example, foreign matter adhesion at the tip 15a, abnormal vacuum flow rate, or deformation). Note that the notification mode is not limited to display, and may be voice, light emission of a light source such as a lamp, or output of the information to an information terminal (for example, a mobile terminal) of an operator or the like.

[0167] Further, when the correlation coefficient r is less than a predetermined value (No in S15), or when there is no abnormality in the flow rate (No in S18), and when the abnormality in the tip 15a or the flow rate is resolved (Yes in S20), the determination unit 140 determines whether production has ended (S22). Then, when production has ended (Yes in S22), the determination unit 140 ends the process, and when production has not ended (No in S22), since the suction nozzle 15 is normal, it returns to step S12 to continue production.

[0168] Note that, for example, when Yes in step S15, the determination unit 140 may determine that the suction nozzle 15 is malfunctioning. That is, the determination unit 140 does not necessarily have to perform imaging of the tip 15a and measurement of the flow rate. In this case, when determined as Yes in step S15, for example, step S21 is executed. Also, for example, when Yes in step S18, the determination unit 140 may determine that the suction nozzle 15 is malfunctioning. That is, the determination unit 140 does not necessarily have to supply air to the air supply unit 38a. In this case, when determined as Yes in step S18, for example, step S21 is executed.

[0169] As described above, the determination unit 140 determines the malfunction of the suction nozzle 15 based on whether the first displacement information and the second displacement information have a predetermined correlation.

[0170] Since the determination unit 140 determines the malfunction of the suction nozzle 15 based on whether there is a predetermined correlation between the first position deviation information and the second position deviation information, for example, compared with the case of determining the malfunction of the suction nozzle 15 based only on the second position deviation information (for example, the standard deviation of the mounting position deviation Rm), it is possible to accurately determine the malfunction of the suction nozzle 15. For example, when detecting the malfunction of the suction nozzle 15 based only on the second position deviation information, if the mounting variation is small, the suction nozzle 15 will be determined to be normal. On the other hand, in the present embodiment, since the determination is made based on the correlation between the suction variation and the mounting variation, even when the mounting variation is small, if there is a predetermined correlation between the suction variation and the mounting variation, the malfunction of the suction nozzle 15 can be detected.

[0171] Also, for example, the determination unit 140 may determine the malfunction of each of the plurality of suction nozzles 15 based on whether there is a predetermined correlation between the first position deviation information and the second position deviation information corresponding to each of the plurality of suction nozzles 15. In this case, when the correlation coefficient r of at least one suction nozzle 15 is equal to or greater than a predetermined value, the determination unit 140 determines Yes in step S15.

[0172] Also, for example, the determination unit 140 may determine the malfunction in the type of the suction nozzle 15 and the type of the component P based on whether there is a predetermined correlation between the first position deviation information and the second position deviation information corresponding to the type of the component P. In this case, when it is determined that the suction nozzle 15 is malfunctioning in a specific component P, instead of the malfunction of the suction nozzle 15, it is determined that the suction nozzle 15 is not the suction nozzle corresponding to the specific component P, that is, the suction nozzle 15 and the specific component P do not match, and the determination result may be notified. Thereby, the determination unit 140 can determine whether the cause of the correlation coefficient r being equal to or greater than a predetermined value is the malfunction of the suction nozzle 15 or the poor combination of the suction nozzle 15 and the component P, so that the malfunction of the suction nozzle 15 can be detected more accurately.

[0173] (Other embodiments) The component mounting system and the like according to one or more aspects have been described based on the embodiments. However, the present disclosure is not limited to these embodiments. Without departing from the spirit of the present disclosure, various modifications conceived by those skilled in the art to the embodiments, or forms constructed by combining components in different embodiments may also be included in the present disclosure.

[0174] For example, in the above embodiment, the holding part has been described as an adsorption nozzle. However, the holding part is not limited to holding the component by adsorption. The holding part may hold the component by gripping it, for example. Further, the holding part is not limited to being an adsorption nozzle as long as it can hold the component.

[0175] Also, in step S15 of the above embodiment, it is determined whether there is a predetermined correlation based on a predetermined value (absolute value). However, the determination method is not limited to this. In step S15, the determination unit may determine whether there is a predetermined correlation based on whether the amount of change in the time series of the correlation coefficient (for example, the amount of change within a predetermined time) is equal to or greater than a predetermined value (relative value).

[0176] Also, in the above embodiment, an example has been described in which the threshold value (the above-mentioned predetermined value) used to determine whether there is a predetermined correlation between the first displacement information and the second displacement information is common regardless of the type of component. However, the present disclosure is not limited to this, and the threshold value may be set for each type of component.

[0177] Also, in the above embodiment, the correlation coefficient is used as an index indicating the correlation between the first displacement information and the second displacement information. However, the index is not limited to the correlation coefficient. The index may be another coefficient obtained by a calculation formula other than Formula 1 as long as the relationship between the first displacement information and the second displacement information can be understood.

[0178] Also, the regression lines shown in FIGS. 11A and 11B of the above embodiment are not limited to straight lines passing through the origin.

[0179] In the above-described embodiment, an example where the object on which the component mounting device mounts components is a substrate has been described. However, the present invention is not limited to this, and other objects on which components can be mounted may be used.

[0180] In the above-described embodiment, an example where the component recognition camera and the inspection camera are separate bodies, that is, the imaging unit is realized by two cameras has been described. However, the imaging unit may be realized by one camera.

[0181] In addition, the division of the functional blocks in the block diagram is merely an example, and a plurality of functional blocks may be realized as one functional block, one functional block may be divided into a plurality, or some functions may be transferred to other functional blocks. Further, the functions of a plurality of functional blocks having similar functions may be processed by a single piece of hardware or software in parallel or in a time-sharing manner.

[0182] In addition, the malfunction detection device according to the above-described embodiment may be realized as a single device or may be realized by a plurality of devices. When the malfunction detection device is realized by a plurality of devices, each component included in the malfunction detection device may be distributed among the plurality of devices in any manner. Further, when the malfunction detection device is realized by a plurality of devices, the communication method between the plurality of devices is not particularly limited, and may be wireless communication or may be wired communication. Further, wireless communication and wired communication may be combined between the devices.

[0183] In addition, some functions of the management computer (malfunction detection device) according to the above-described embodiment may be provided in the component mounting device. For example, the determination unit included in the management computer may be provided in the component mounting device or the inspection device. Further, some functions of the component mounting device and the inspection device according to the above-described embodiment may be provided in the component mounting device. For example, at least one of the recognition processing unit included in the component mounting device and the misalignment amount calculation unit included in the inspection device may be provided in the management computer.

[0184] Further, each component described in the above embodiments and the like may be realized as dedicated hardware, may be realized as software, or typically may be realized as an LSI which is an integrated circuit. These may be individually formed into one chip, or may be formed into one chip so as to include some or all of them. Here, an LSI has been described, but depending on the degree of integration, it may also be referred to as an IC, a system LSI, a super LSI, or an ultra LSI. Also, the method of integrating into a circuit is not limited to an LSI, and it may be realized by a dedicated circuit or a general-purpose processor. After manufacturing the LSI, an FPGA (Field Programmable Gate Array) which can be programmed, or a reconfigurable processor capable of reconfiguring the connection or setting of circuit cells inside the LSI may be used. Furthermore, if an integrated circuit technology that replaces the LSI appears due to the progress of semiconductor technology or a derived other technology, naturally, the components may be integrated using that technology.

[0185] A system LSI is a super multi-functional LSI manufactured by integrating a plurality of processing units on one chip. Specifically, it is a computer system including a microprocessor, a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. A computer program is stored in the ROM. By the microprocessor operating according to the computer program, the system LSI achieves its function.

[0186] Also, one aspect of the present disclosure may be a computer program that causes a computer to execute each characteristic step included in the component mounting method shown in FIG. 7.

[0187] Further, for example, the program may be a program for causing a computer to execute. Also, one aspect of the present disclosure may be a computer-readable non-transitory recording medium on which such a program is recorded. For example, such a program may be recorded on a recording medium and distributed or circulated. For example, the distributed program may be installed in a device having another processor, and the device may be caused to perform each of the above processes by causing the processor to execute the program.

[0188] Also, the order in which each step (each process) in the flowchart shown in FIG. 7 is executed is for illustration in order to specifically describe the present disclosure, and may be an order other than the above. Also, some of the above steps (processes) may not be executed.

[0189] Also, each process in the component mounting method described in the above embodiment may be implemented in one process or in separate processes. Note that implementing in one process means that each process is implemented using one device, each process is continuously implemented, or each process is implemented at the same location. Also, separate processes mean that each process is implemented using separate devices, each process is implemented at different times (e.g., different days), or each process is implemented at different locations.

Industrial Applicability

[0190] The present disclosure is useful for a component mounting system including a holding part such as a nozzle.

Description of Reference Numerals

[0191] 1 Component mounting system 1a Base 2 Substrate conveyance unit 3 Substrate 4 Component supply unit 5 Tape feeder 6 Y-axis beam 7 X-axis beam 8 Mounting head unit 8a Coupling Plate 9 Nozzle Unit 9a Nozzle Driving Part 10 Parts Waste Bin 11 Parts Recognition Camera 11a Image 11b, 15 Suction Nozzle 11c Center 11x, 11y Center Line 12 Substrate Recognition Camera 13 Nozzle Shaft 14 Nozzle Mounting Part 15a Tip 20, 60, 110 Communication Part 21 Mounting Control Part 22 Mounting Memory Part 23, 65, 131 Mounting Data 30 Nozzle Control Part 31 Valve Control Part 32 Valve Memory Part 34 Flow Sensor 36 Switching Valve 38 Blow Valve 38a Air Supply Part 40 Recognition Processing Part 50, 67, 150 Display Part 52, 69, 152 Input Part 61 Inspection Control Part 62 Amount of Position Deviation Calculation Part 63 Inspection Camera 64 Inspection Memory Part 66, 133 Amount of Position Deviation Data 100 Management Computer (Malfunction Detection Device) 120 Management Control Part 130 Management Memory Part 132 Parts Information 140 Judgment Part 200 Communication Network Cn Nozzle Center Cp Parts Center Cs Normal Position M1 Solder Printing Device M2, M3 Parts Mounting Device (Parts Mounting Part) M4 Inspection Device P Parts Rm Mounting position deviation (second position deviation information) Rv Adsorption position deviation (first position deviation information) △X1, △Y1, △θ1, R Position deviation amount (first position deviation information) △X2, △Y2, △θ2 Position deviation amount (second position deviation information)

Claims

1. A component mounting system comprising: a component mounting unit for mounting a component on a substrate; an acquisition unit; a determination unit, wherein the component mounting unit has a holding unit for holding the component, and an imaging unit for imaging the component, the acquisition unit acquires first positional deviation information of the component with respect to the holding unit based on a first image obtained by the imaging unit imaging the component held by the holding unit, and second positional deviation information of the component based on a second image obtained by the imaging unit imaging the component mounted on the substrate, and the determination unit determines a malfunction of the holding unit based on whether or not the first positional deviation information and the second positional deviation information have a predetermined correlation. Component mounting system.

2. The component mounting unit has a plurality of the holding units, the acquisition unit acquires the first positional deviation information corresponding to each of the plurality of the holding units and the second positional deviation information, and the determination unit determines a malfunction of each of the plurality of the holding units based on whether or not the first positional deviation information and the second positional deviation information corresponding to each of the plurality of the holding units have the predetermined correlation. The component mounting system according to Claim 1.

3. The determination unit further determines a malfunction in the holding unit and the type of the component based on whether or not the first positional deviation information and the second positional deviation information corresponding to the type of the component have the predetermined correlation for each type of the component. The component mounting system according to Claim 2.

4. The determination unit determines whether or not the first positional deviation information and the second positional deviation information have the predetermined correlation based on an index indicating the correlation between the first positional deviation information and the second positional deviation information, which is calculated based on the first positional deviation information and the second positional deviation information. The component mounting system according to any one of Claims 1 to 3.

5. The index is a correlation coefficient, and the determination unit determines that the first positional deviation information and the second positional deviation information have the predetermined correlation when the correlation coefficient is equal to or greater than a predetermined value. The component mounting system according to Claim 4.

6. The predetermined value is a value indicating that there is a weak positive correlation between the first positional deviation information and the second positional deviation information. The component mounting system according to Claim 5.

7. When the first positional deviation information and the second positional deviation information have the predetermined correlation, the system further includes an output unit that outputs a message indicating that the holding unit is malfunctioning. The component mounting system according to any one of claims 1 to 6.

8. When the first displacement information and the second displacement information are in the predetermined correlation relationship, the imaging unit further images the tip of the holding unit. Based on the third image of the tip imaged by the imaging unit, the determination unit further determines whether there is an abnormality in the tip, and based on the determination result, determines the malfunction of the holding unit. The component mounting system according to any one of claims 1 to 7.

9. The holding unit is a suction nozzle that sucks and holds the component. The component mounting unit further includes a measurement unit that measures the vacuum flow rate of the air flowing through the suction nozzle. When the first displacement information and the second displacement information are in the predetermined correlation relationship, the measurement unit further measures the vacuum flow rate. The determination unit further determines whether there is an abnormality in the measured vacuum flow rate, and based on the determination result, determines the malfunction of the holding unit. The component mounting system according to any one of claims 1 to 8.

10. The suction nozzle further includes an air supply unit that supplies air to the suction nozzle. When the determination result includes an abnormality, the air supply unit supplies the air to the suction nozzle when the suction nozzle is located at a position other than above the substrate. The component mounting system according to claim 9.

11. A component mounting apparatus for mounting a component on a substrate, A holding unit that holds the component, An imaging unit that images the component, An acquisition unit, A determination unit, and The acquisition unit acquires first displacement information of the component with respect to the holding unit based on an image obtained by the imaging unit imaging the component held by the holding unit, and second displacement information of the component based on an image obtained by the imaging unit imaging the component mounted on the substrate. The determination unit determines the malfunction of the holding unit based on whether the first displacement information and the second displacement information are in a predetermined correlation relationship. Component mounting apparatus.

12. A malfunction detection device for detecting a malfunction of the holding unit in a component mounting apparatus including the holding unit for holding the component to mount the component on a substrate, An acquisition unit that acquires first displacement information of the component with respect to the holding unit based on an image obtained by imaging the component held by the holding unit, and second displacement information of the component based on an image obtained by imaging the component mounted on the substrate. A determination unit that determines a malfunction of the holding unit based on whether or not the first displacement information and the second displacement information have a predetermined correlation; and is provided with. Malfunction detection device.

13. A component mounting method using a component mounting device including a holding unit that holds a component to be mounted on a substrate, imaging the component held by the holding unit, acquiring first displacement information of the component with respect to the holding unit based on the captured image, imaging the component mounted on the substrate, acquiring second displacement information of the component mounted on the substrate based on the captured image, determining a malfunction of the holding unit based on whether or not the first displacement information and the second displacement information have a predetermined correlation. Component mounting method.

Images