Component processing apparatuses such as a pressure sintering apparatus and a component encapsulation apparatus

Abstract

The component processing apparatus defines component holding positions for holding components including, for example, semiconductor dies, substrates, cooling plates, packages, inverter casings, spacers, etc., and includes a displaceable member associated with each component holding position. Each displaceable member is configured and designed to enable application of a force to a component held in the associated component holding position. The component processing apparatus includes at least one device portion having a fiber Bragg grating (FBG) strain sensor that, during use, is subject to strain induced by a force applied by the displaceable member to an individual component held in the component holding position. The FBG strain sensor is configured and arranged to be mechanically attached to the individual device portion so as to enable measurement of strain in the individual device portion induced by a force applied to the individual component by the displaceable member during use.

Description

Technical Field

[0001]

[0001] The present invention relates to a component processing apparatus that defines at least one component holding position for holding components including a semiconductor die, a substrate, a cooling plate, a package, an inverter casing, a spacer, etc., and includes at least one displaceable member associated with each component holding position, and each displaceable member is configured and arranged to be able to apply a force to the component held at the associated component holding position. The component processing apparatus can be, for example, a pressure sintering apparatus or a component encapsulating apparatus.

Background Art

[0002]

[0002] The pressure sintering of components is carried out while applying pressure (while applying force) to the components in order to achieve good bonding between the components and their underlying elements. The semiconductor die and the underlying carrier can be joined to each other, for example, by sintering. Other examples are a power IC within a package and an inverter casing or a cooling plate joined to each other, spacers and substrates joined to each other, etc. Multiple types of components and underlying elements can be joined to each other by a pressure sintering process. First, the components to be sintered are placed on their underlying elements using a sintering paste, film, dispensed fluid, etc., such as a silver paste, film, dispensed fluid, etc., between the components and the underlying elements. Then, pressure is applied, for example, using a displaceable member that applies pressure to the respective associated components, and generally, the components and the underlying elements are heated. A processing apparatus using a displaceable insert (displaceable member) is disclosed in International Publication No. WO 2014 / 123413. The displaceable insert / member allows for changes in the height and unevenness of the components to be sintered, but can also be used in other ways in the apparatus to apply pressure to the components. The displaceable insert can be placed above the component to apply downward pressure, can be placed below the component to apply upward pressure, or can be placed both above and below the component to apply pressure from both sides by the displaceable insert. Generally, since the components and the elements are crimped to each other, the components are also called underlying elements, and the underlying elements are also called components. In this specification, it has been selected to refer to the components as parts associated with a displaceable insert that is displaceable depending on the corresponding size or position. In some embodiments, both parts to be crimped can be referred to as components or underlying elements.

[0003]

[0003] Another type of device that can use a displaceable insert relates to encapsulation or packaging devices used to encapsulate or package components such as semiconductor dies, substrates, cooling plates, packages, inverter casings, spacers, and their assemblies. The components are held in the space of the device, and the encapsulating material is introduced into the space in a liquid state. A displaceable member can be used to apply pressure to the components to solidify the encapsulating material while preventing the surface area of the components from contacting the sealing material. Thereby, the components can be encapsulated by the encapsulating material while leaving a part of the components exposed.

[0004]

[0004] The components to be encapsulated or sintered may further relate to chips, sensors, power ICs, flip chips, MEMs, etc. For manufacturing, failure, and reliability analysis and prediction, it is very important to know or monitor the pressure applied to the components during the sintering process, encapsulation process, or any other process in which pressure is applied to the components. In particular, when a displaceable member is used to apply pressure, it is very important to verify the applied pressure in real time. Failure to generate force may cause problems with the movable member. The displaceable member may, for example, stack during the process procedure. For the purpose of feedback control, it may also be very important to make the pressure applied in real time available. The sensors applied for this purpose must be very compact, accurate, and suitable for such upcoming high-pressure and / or high-temperature conditions. Currently applied sensors have drawbacks in this regard.

Summary of the Invention

[0005]

[0005] An object of the present invention is to provide a component processing device that provides improved control and process optimization, and / or improved risk control.

[0006]

[0006] Another or alternative object of the present invention is to provide a component processing apparatus having good abnormality detection.

[0007]

[0007] Yet another or alternative object of the present invention is to provide a component processing apparatus that provides accurate and / or reliable monitoring of pressure and optionally temperature process conditions, particularly very close to the actual process area, i.e., the sintering or encapsulation / molding area.

[0008]

[0008] Yet another or alternative object of the present invention is to provide a component processing apparatus that enables real-time measurement of pressure and optionally temperature process conditions, particularly very close to the actual process area, i.e., the sintering or encapsulation / molding area.

[0009]

[0009] At least one of the above objects is achieved by a component processing apparatus defining at least one component holding position for holding components including, for example, semiconductor dies, substrates, cooling plates, packages, inverter casings, spacers, etc., the component processing apparatus comprising at least one displaceable member associated with each component holding position, each displaceable member being configured and arranged to be able to apply a force to a component held at the associated component holding position. The component processing apparatus comprises at least one device portion having a fiber Bragg grating (FBG) strain sensor that is susceptible to strain induced by a force applied by at least one displaceable member on an individual component (s) held at the component holding position (s) during use, the FBG strain sensor being configured and arranged to be mechanically attached to the individual device portion so as to be able to measure the strain of the individual device portion induced by the force applied to the individual component (s) by at least one displaceable member during use.

[0010]

[0010] The FBG strain sensor enables integration into individual device parts while achieving highly reliable and accurate strain measurements under actual process conditions without impairing the basic functional aspects of the processing device. The measurement signals from the FBG strain sensors depend on the strain of the individual device parts and the FBG strain sensors due to their mechanical connection, so they are called strain sensors. Strain measurement has been shown to clearly depend on the force applied to the individual components by the displaceable member(s). The FBG sensors are very compact and accurate and are suitable for process conditions at pressures and temperatures applicable to processes such as pressure sintering and component packaging or encapsulation.

[0011]

[0011] In one embodiment, at least one of the at least one device part having the FBG strain sensor has a fiber Bragg grating (FBG) temperature sensor, and the FBG temperature sensor is configured and arranged to be in thermal contact with the individual device part so as to be able to measure the temperature of the individual device part while being less susceptible to strain in the individual device part. In particular, the FBG temperature sensor is arranged to be mechanically separated from the individual device part.

[0012]

[0012] The measurement signals from the FBG temperature sensors depend on the temperature of the individual device part and the FBG temperature sensors due to their thermal contact, but do not depend on the strain of the individual device part due to the mechanical separation of the FBG temperature sensors from the individual device part, so the FBG temperature sensors are called temperature sensors. Furthermore, by measuring the temperature of the individual device part, the process temperature can be monitored and the measurement signals from the FBG strain sensors can be corrected for the influence of temperature changes in the FBG strain sensors. The latter enables strain measurement of the individual device part by the FBG strain sensors, which depends at least mostly not on temperature and at least mainly on strain.

[0013]

[0013] In one embodiment, the FBG strain sensor is mechanically attached to the aforementioned individual device part by an atmospheric pressure sintering process that provides a reliable mechanical bond between the FBG sensor and the individual device part. The atmospheric pressure sintering process that provides the sintered bond has been shown to affect the measurement characteristics of the FBG sensor.

[0014]

[0014] In one embodiment, at least one of the applicable parts of the FBG strain sensor and the aforementioned individual device part is coated with a material containing a noble metal such as silver or gold, optionally a silver or gold sintering paste, and then heated to provide an atmospheric pressure sintered bond between the FBG strain sensor and the aforementioned individual device part.

[0015]

[0015] In one embodiment, the FGB strain sensor is disposed within a channel provided in the aforementioned individual device part.

[0016]

[0016] In one embodiment, the FGB temperature sensor is disposed within a channel provided in the aforementioned individual device part.

[0017]

[0017] In one embodiment, the channel is a groove provided on the side surface of the aforementioned individual device part.

[0018]

[0018] In one embodiment, the aforementioned individual device part includes two sub-device parts having abutting side surfaces provided with corresponding grooves that provide the channel.

[0019]

[0019] In one embodiment, at least one device part having an FBG strain sensor includes one or more of at least one displaceable member.

[0020]

[0020] In one embodiment, at least one device part having an FBG strain sensor includes a support portion of a support for components.

[0021]

[0021] In one embodiment, the FBG strain sensor and the FBG temperature sensor provided in a single individual device part are included in a single optical fiber.

[0022]

[0022] In one embodiment, the component processing device includes a component holding tool part that defines at least one component holding position for holding a component, and at least one pressing tool part having at least one displaceable member, and during operation, the component processing device applies a force to the component held at an individual component holding position (s) by at least one displaceable member Each in order to 、 structure the component holding tool part and the pressing tool part are arranged relative to each other so as to may be arranged relative to each other be configured as such.

[0023]

[0023] The pressing tool part is called so because it enables applying a force (corresponding to exerting / applying pressure) to the component (s) held on the component holding tool part.

[0024]

[0024] In one embodiment, the component holding tool part is configured to hold a base element such as a carrier substrate, a lead frame, a cooling plate, an inverter casing, etc. that supports at least one component.

[0025]

[0025] In one embodiment, the component processing device includes an upper pressing tool part and a bottom pressing tool part arranged on both sides of the component holding tool part, and by the opposing displaceable members of the upper pressing tool part and the bottom pressing tool part respectively, it is possible to apply a force to each of at least one component held at an individual component holding position on the component tool part on both opposing sides of the respective one component.

[0026]

[0026] In another aspect, the present invention provides a pressure sintering device, and the pressure sintering device is the above-described component processing device.

[0027]

[0027] In another aspect, the present invention provides a component encapsulation device, which is the above-mentioned component processing device. The component encapsulation device is also called a (component) packaging device.

[0028]

[0028] Further features and advantages of the present invention will become apparent from the description of the present invention by way of non-limiting and non-exclusive embodiments. These embodiments should not be construed as limiting the scope of protection. Those skilled in the art will understand that other alternative forms and equivalent embodiments of the present invention can be conceived and implemented without departing from the scope of the present invention. Embodiments of the present invention are described with reference to the accompanying drawings, and like or identical reference numerals indicate like, identical or corresponding parts.

Brief Description of the Drawings

[0029]

Figure 1a

Figure 1b

Figure 2a

Figure 2b

Figure 3a

Figure 3b

Figure 4a

Figure 4b

Figure 4c

Figure 4d

Figure 5

Figure 6

Figure 7

Figure 8

[0030]

[0029] FIG. 1a schematically shows a component processing apparatus 100 according to an embodiment of the present invention. The component processing apparatus shown in FIG. 1a is a pressure sintering apparatus including a component holding tool unit 110 and a pressure tool unit 120 having a displaceable member (displaceable insert) 125. The component holding tool unit is provided with a base element 11 such as a component carrier or a lead frame that supports the component 10. There is a sintering paste 12 between each component 10 and the component carrier 11. In the embodiment of FIG. 1a, one component carrier that supports a plurality of components is provided as the base element. The apparatus layout is such that the components supported on those component carriers are provided at predetermined component holding positions. The position of the displaceable member 125 is associated with an individual component holding position. The embodiment of FIG. 1b is substantially the same as the embodiment of FIG. 1a, but shows that each component 10 is provided on a separate base element 11.

[0031] While the component carrier 110 having the component 10 is provided on the component holding tool part 110, the component holding tool part 110 and the pressing tool part 120 are generally moved away from each other. Then, the component holding part 110 and the pressing tool part 120 are moved towards each other. They can move towards each other until the displaceable member 125 of the pressing tool part 120 contacts their respective associated component 10, or both tool parts 110, 120 can move towards each other leaving a gap between the displaceable member 125 and their respective associated component 10. Alternatively, the component carrier 11 supporting the component 10 may be moved between the stationary component holding tool part 110 and the pressing tool part 120 while having a gap between the displaceable member 125 and the component 10.

[0032]

[0031] Thereafter, the displaceable member 125 is actuated to apply pressure to (it should be understood that applying pressure and applying force are equivalent) their respective associated component 10. The embodiment shown in FIG. 1 shows a pressure chamber 121 that is pressurized to move the displaceable member towards their respective associated component. Alternative embodiments can use any other means for displacing the displaceable member 125, such as by electrical actuation, for example. The component 10 is generally heated to sinter the sintered material 12 and achieve bonding between the component 10 and their component carriers 11. Heating can be achieved in various ways, for example, by heating elements provided on the component support tool part 110, the pressing tool part 120, and / or the displaceable member 125. A time-dependent temperature profile can be applied during the pressure sintering process, and the pressure applied can be set according to time and / or temperature.

[0033]

[0032] Each displaceable member 125 is provided with an optical fiber 200. Each optical fiber 200 includes an FBG strain sensor 210 and an FBG temperature sensor 220. The FBG strain sensor 210 is configured and arranged to measure the strain induced in each displaceable member 125 while exerting a force on the associated component 10. The FBG temperature sensor is configured and arranged to measure the temperature of each displaceable member 125. The FBG strain sensor 210 and the FBG temperature sensor 220 can both be of the same type of FBG sensor, but they differ in that they are provided on the displaceable member 125. The FBG strain sensor 210 is mechanically attached to the displaceable member 125, which means that any mechanical strain of the displaceable member is also induced in the FBG strain sensor 210. The FBG strain sensor is provided on the displaceable member such that the strain induced by applying a force to the individual component 10 can be measured by the FBG strain sensor. This means that the grating provided in the FBG strain sensor is oriented to enable the measurement of a signal using the FBG strain sensor that depends on the strain induced in the displaceable member. The grating of the FBG strain sensor 210 in the fiber 200 has a grating period along the optical fiber. Thus, the grating period changes in response to the strain induced in the displaceable member 125 while exerting a force on the individual component 10, resulting in variations related to the signal measured using the FBG strain sensor 210.

[0034]

[0033] A portion of the optical fiber 200 having the FBG strain sensor 210 is mechanically attached to the displaceable member 125 by an atmospheric pressure sintering process. FIGS. 2a and 2b show the embodiment of the displaceable member 125 of FIG. 1 in more detail. A channel 125.1 in the form of a groove is made on one side of the displaceable member. To achieve a mechanical attachment between the FBG strain sensor 210 (a portion of the fiber 200 having it) and the displaceable member 125, the portion of the groove where the FBG strain sensor and / or the FBG strain sensor 210 is provided is coated with a sintering paste such as a silver sintering paste, and then the FBG strain sensor is placed in the groove. Subsequently, the displaceable member is heated to sinter and solidify the paste, providing a mechanical connection between the FBG strain sensor and the displaceable member. The embodiments of FIGS. 2a and 2b are somewhat different in the layout and guidance of the optical fiber 200, and the embodiment of FIG. 2b has a fiber guide 201 for guiding the optical fiber 200 laterally.

[0035]

[0034] FIGS. 3a and 3b show yet another embodiment of the displaceable member of the device shown in FIG. 1. The displaceable member 125 is formed of two halves 125a, both of which have grooves 125.1a on the sides that abut each other. Both grooves 125.1a constitute the channel 125.1 when the two halves 125a are combined to form the displaceable member 125. Before joining the two halves together, a sintering paste is provided on one or both of at least one of the FBG strain sensor 210 and the portion of the groove 125.1a where the FBG strain sensor is to be provided. The FBG strain sensor (a portion of the fiber 200 having it) is placed in one of the grooves 125.1a, the two halves are joined together, and then the displaceable member is heated to provide a mechanical attachment by a mechanical bond between the FBG sensor and the displaceable member. The bond provided by the sintering process described with reference to FIGS. 2a, 2b, 3a and 3b does not impart any strain to the FBG strain sensor, but results in a good mechanical connection between the FBG strain sensor 210 and the displaceable member 125. The bond also provides a thermal connection between the FBG strain sensor and the displaceable member.

[0036]

[0035] The FBG temperature sensor 220 is provided on the displaceable member so as to be in thermal contact with the displaceable member without being subjected to strain. The FBG temperature sensor 220 is arranged to be mechanically isolated from the displaceable member 125. FIGS. 2a, 2b, 3a and 3b also show the FBG temperature sensor 220 provided in the channel 125.1 of the displaceable member. In the illustrated embodiment, a part of the fiber 200 (having the FBG temperature sensor 220) is provided in the channel 125.1 under the FBG strain sensor 210 in a freely suspended manner. Since the FBG temperature sensor is within the channel 125.1 closely surrounded by the displaceable member 125, it is in thermal radiative contact with the displaceable member and acquires the temperature of the displaceable member at that position. In an alternative embodiment, the FBG temperature sensor 220 may be attached to the displaceable member using a suitable material that provides mechanical separation but good thermal contact and can withstand the temperatures used when the device 100 operates. A suitable kit that maintains elasticity at hand temperature may be suitable for that purpose.

[0037]

[0036] Figures 4a - 4d illustrate the operating principle of a general fiber Bragg grating (FBG) sensor. Figure 4a shows the FBG sensor, which is denoted by the same reference numerals 210, 220 used to denote the FBG strain and temperature sensors in the other figures. The FBG sensor is a grating or grid provided in the fiber 200 as a result of a change Δn in the refractive index n of the core of the fiber. The grating or grid has a grid period Λ. Figure 4b shows the spectral intensity SI of the input light I as a function of the wavelength λ on the grid of the FBG sensor when using the FBG sensor. A portion of the input light I is reflected back by the grid as the reflected light R at the Bragg wavelength λB given by the grid period Λ as shown in Figure 4c. The transmitted light T is shown as a drop in the spectral intensity SI of the transmitted light T at the Bragg wavelength λB as shown in Figure 4d. The Bragg wavelength λB depends on the grid period Λ. The grid period changes due to the strain induced in the FBG sensors 210, 220 within the fiber 200 and the temperature of the FBG sensor. Thus, the Bragg wavelength λB changes in response to the strain and temperature of the FBG sensor. Accordingly, the measurement of the Bragg wavelength λB provides an indication of the strain and temperature of the FBG sensor. Only the general principle of the FBG sensor is disclosed. Their operation is known as such. Some of the principles of their operation are disclosed, for example, in European Patent No. 2811257 and European Patent No. 3144633.

[0038]

[0037] The FBG temperature sensor 220 is provided on each displaceable member 125 so as not to be subjected to strain. Accordingly, the Bragg wavelength of the FBG temperature sensor 220 provides a measured value of the temperature of the displaceable member 125 and the individual components 10. The FBG strain sensor 210 is provided on a displaceable member 125 that is subject to the strain of the displaceable member 125 that affects the Bragg wavelength of the FBG strain sensor 210. Further, the FBG strain sensor 210 is at the temperature of the displaceable member 125. Accordingly, the Bragg wavelength of the FBG strain sensor 220 depends on both the strain and the temperature of the FBG strain sensor. Since the temperature of the displaceable member can be known from the Bragg wavelength shift of the FBG temperature sensor 220, the Bragg wavelength shift of the FBG strain sensor 210 can be corrected for the wavelength shift due to temperature change, whereby the strain of the FBG strain sensor can be determined from the signal readout of the FBG strain sensor. When the temperature is kept constant in the component processing process and apparatus, only the FBG strain sensor is required to determine the strain of the FBG strain sensor and the displaceable member, or any other mechanical component in which the FBG strain sensor is used.

[0039]

[0038] FIG. 5 shows another embodiment of the component processing apparatus 100 according to the present invention as a pressure sintering apparatus. The embodiment of FIG. 5 is different from the embodiment of FIG. 1 in that not all of the displaceable members 125 are provided with the FBG strain sensor 210 and the FBG temperature sensor 220. Only one displaceable member 125 is shown as having the fiber 200 with the FBG strain sensor 210 and the FBG temperature sensor 220. One displaceable member having the FBG strain and temperature sensors represents an embodiment in which the FBG strain and temperature sensors are incorporated into the displaceable member only at strategic locations, such as the corners and / or the center of an array of displaceable members used in the component processing apparatus. In another embodiment, both the FBG strain sensor and the temperature sensor are used on one or more displaceable members at strategic locations, while some of the other displaceable members have only the FBG strain sensor.

[0040]

[0039] FIG. 6 shows yet another embodiment of the component processing apparatus 100 according to the present invention as a pressure sintering apparatus. The embodiment of FIG. 6 has FBG strain sensors 210 and FBG temperature sensors 220, both of which are provided within a single optical fiber 200 within the component holding tool part 110. In the same way as disclosed with reference to FIG. 1, the FBG strain and temperature sensors 210, 220 of the embodiment of the figure are used. However, measurements of all of the integrated forces applied to their associated components 10 by all of the displaceable members 125 are provided. Thus, a failure of one or more of the displaceable members can be detected when the measured strain deviates from the strain expected when all of the displaceable members apply the forces required to their associated components. Any applicable combination of the embodiments of FIGS. 1, 5, and 6 can also be envisioned, such as having FBG strain and temperature sensors within a support such as the component holding tool part 110 for the component 10 and FBG strain and temperature sensors only in some of the displaceable members. The embodiment of FIG. 6, as well as the embodiment of FIG. 7, also shows that each component 10 is provided on a separate underlying element 11 such as a packaged inverter that is pressure sintered, for example, on a cooling plate. Both the packaged inverter and the cooling plate of the embodiments of FIGS. 6 and 7 can be considered components associated with the displaceable member 125 for the purposes of this specification.

[0041]

[0040] FIG. 7 shows still another embodiment of the component processing apparatus 100 according to the present invention as a pressure sintering apparatus. The component processing apparatus 100 of FIG. 7 has an upper pressure tool part 120T having a displaceable member 125 and a bottom pressure tool part 120B having a displaceable member 125. The upper pressure tool part 120T and the bottom pressure tool part 120B are disposed above and below the component holding tool part 110, respectively. Pressure is applied to the component 10 held at an individual component holding position by the associated upper displaceable member 125T and the associated bottom displaceable member 125B. By having upper and bottom displaceable members, a higher degree and more accurate pressure (or force) control of the component 10 and its base element 12 becomes possible. The embodiment of FIG. 7 has only some of the displaceable members 125T, 125B and the component holding tool part 110 with FBG strain sensors 210 and FBG temperature sensors 220.

[0042]

[0041] FIG. 8 shows yet another embodiment of the component processing apparatus 100 in the form of a packaging or component encapsulation apparatus. Components 10, such as semiconductor dies, are provided on respective base elements 11 held on the component holding tool part 110. Contact wires 15 are provided from the components to the contact regions of the base elements. The components are held in individual component holding positions associated with respective displaceable members 125 of the pressing tool part 120. During operation, the pressing and component holding tool parts 120, 110 are brought together to define a cavity 130 between the tool parts. The cavity 130 is filled with a packaging material that is fluid at high temperatures and solidifies as the temperature decreases, encapsulating (packaging) the components 10 as defined by the cavity 130. FIG. 7 schematically shows only the component encapsulation apparatus. For example, European Patent No. 2954550 discloses embodiments of encapsulation methods and apparatuses. The displaceable members 125 press on their respective components to prevent the surface area of the components from being covered by the packaging material. A suitable material film may generally be provided on the side surface of the pressing tool part 120 including the displaceable members 125 facing the components 10. The pressure should be sufficient to prevent the encapsulation (packaging) material from coming between the displaceable members 125 and the components 10. The force applied by the displaceable members can vary depending on the temperature and pressure of the liquid packaging material in the cavity 130. Accordingly, the components 10 are joined to their base elements 11 to provide packaged components. The FBG strain sensor 210 and the FBG temperature sensor 220 provided on a single fiber 200 are arranged on each displaceable member in the manner described with reference to FIGS. 1, 2a, 2b, 3a, and 3b. The FBG strain and temperature sensors 210, 220 may also be arranged as disclosed with reference to FIGS. 5, 6, and 7.

Claims

A component processing apparatus (100) for defining at least one component holding position for holding a component (10), comprising at least one displaceable member (125) associated with each component holding position, each displaceable member being configured and arranged to be able to apply a force to a component held at the associated component holding position. The component processing apparatus comprises at least one apparatus part having an FBG (fiber Bragg grating) strain sensor (210) that is susceptible to distortion induced by a force applied by the at least one displaceable member to an individual component held at the component holding position during use, the FBG strain sensor being configured and arranged to be mechanically attached to an individual apparatus part so as to be able to measure the distortion of the individual apparatus part induced by the force applied to the individual component by the at least one displaceable member during use.

2. At least one of the at least one apparatus part having the FBG strain sensor (210) has an FBG (fiber Bragg grating) temperature sensor (220), the FBG temperature sensor being configured and arranged to be in thermal contact with an individual apparatus part so as to be able to measure the temperature of the individual apparatus part while being less susceptible to the distortion of the individual apparatus part, in particular, the FBG temperature sensor being arranged to be mechanically separated from the individual apparatus part. The component processing apparatus according to claim 1.

3. The component processing apparatus according to claim 1 or 2, wherein the FBG strain sensor (210) is mechanically attached to an individual apparatus part by an atmospheric pressure sintering process.

4. The component processing apparatus according to claim 3, wherein at least one of the FBG strain sensor (210) and an applicable part of an individual apparatus part is coated with a material containing a noble metal and then heated to effect an atmospheric pressure sintering bond between the FBG strain sensor and the individual apparatus part.

5. The component processing apparatus according to claim 4, wherein the noble metal is silver or gold.

6. The component processing apparatus according to claim 5, wherein the noble metal is a silver or gold sintering paste or film.

7. The component processing apparatus according to any one of claims 1 to 6, wherein the FBG strain sensor (210) is disposed in a channel (125.1) provided in an individual apparatus part.

8. The component processing apparatus according to any one of claims 3 to 7, which depends on claim 2, wherein the FBG temperature sensor (220) is disposed in a channel (125.1) provided in an individual apparatus part.

9. The component processing apparatus according to claim 7 or 8, wherein the channel (125.1) is a groove provided on a side surface of an individual apparatus part.

10. The component processing apparatus according to claim 9, wherein an individual apparatus part includes two sub-apparatus parts having abutting side surfaces provided with corresponding grooves (125.1a) that provide the channel (125.1).

11. The component processing apparatus according to any one of claims 1 to 10, wherein the at least one apparatus part having the FBG strain sensor (210) includes one or more of the at least one displaceable member (125).

12. The component processing apparatus according to any one of claims 1 to 11, wherein the at least one apparatus part having the FBG strain sensor (210) includes a support portion of a support for the component.

13. The component processing apparatus according to any one of claims 3 to 12, which depends on claim 2, wherein the FBG strain sensor (210) and the FBG temperature sensor (220) provided in a single individual apparatus part are included in a single optical fiber (200).

14. The component processing apparatus includes a component holding tool part (110) that defines the at least one component holding position for holding a component, and at least one pressing tool part (120) including the at least one displaceable member (125), and the component processing apparatus is configured such that the component holding tool part and the pressing tool part are arranged relative to each other, or can be arranged relative to each other, to apply a force to each component (10) held at an individual component holding position by the at least one displaceable member during operation. The component processing apparatus according to any one of claims 1 to 13.

15. The component processing apparatus according to claim 14, wherein the component holding tool part (110) is configured to hold a base element (11) that supports each component (10).

16. The component processing apparatus includes an upper pressing tool part (120T) and a bottom pressing tool part (120B) disposed on both sides of the component holding tool part (110), and each of the opposing displaceable members (125T, 125B) of the upper pressing tool part and the bottom pressing tool part is configured to apply a force to each of the components held at individual component holding positions on the component holding tool part on both opposing sides of the component. The component processing apparatus according to claim 14 or 15, which enables this.

17. A pressure sintering apparatus that is the component processing apparatus according to any one of claims 1 to 16.

18. A component encapsulating apparatus that is the component processing apparatus according to any one of claims 1 to 16.

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