Control method for component mounting system and component mounting system

Abstract

A control method according to the present disclosure is for controlling a component mounting system that comprises: a component mounting line in which a plurality of component mounting machines for mounting components on a substrate are disposed; imaging devices which are provided for the respective component mounting machines and which capture images of the substrate; and an appearance inspection device which executes appearance inspection for determining whether each of the plurality of components mounted on the substrate are in a mounting failed state or not. The control method for the component mounting system according to the present disclosure comprises: a step for setting a component that has been determined as being in a failed mounting state by the appearance inspection device as a to-be-inspected component; and a step in which a component mounting machine that has mounted the to-be-inspected component controls the corresponding imaging device so as to acquire an image of the to-be-inspected component, and performs post-mounting component inspection for determining, on the basis of the image of the to-be-inspected component, whether the mounting state of the to-be-inspected component is successful or failed.

Description

Technical Field

[0001] The present disclosure relates to a method for controlling a component mounting system and a component mounting system.

Background Art

[0002] Conventionally, there is known a component mounting system having a component mounting line in which a plurality of mounters for mounting components on a substrate are arranged along the conveyance direction of the substrate, and the component mounting system detects mounting defects of the components to be mounted on the substrate. For example, in Patent Document 1, an appearance inspection device is provided on the downstream side in the conveyance direction of the substrate from the component mounting line. When a mounting defect is detected in the appearance inspection device, the component mounter that caused the mounting defect is specified, and an operation stop command is output to the component mounter. On the other hand, Patent Document 2 discloses a component mounter having a function of inspecting components mounted on a substrate. In this component mounter, a camera provided on the head of the component mounter images the components immediately after mounting to inspect for mounting errors and misalignments. This inspection is referred to as post-mounting component inspection. The post-mounting component inspection is started when an operator inputs a start command for the component inspection mode.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in Patent Document 2, since it is determined whether or not to execute the post-mounting component inspection based on the judgment of the operator, for example, if the post-mounting component inspection is executed too frequently, productivity will decrease. Also, the timing of executing the post-mounting component inspection depends on the experience of the operator.

[0005] The present disclosure has been made to solve such problems, and the main object is to appropriately execute post-implementation component inspection regardless of the operator's experience.

Means for Solving the Problems

[0006] A control method for a component mounting system of the present disclosure is a component mounting line in which a plurality of component mounters for holding a substrate and mounting components on the substrate are arranged along the conveyance direction of the substrate, an imaging device provided for each of the component mounters and configured to image an image of the substrate held by the component mounter, an appearance inspection device provided on the downstream side of the conveyance direction from the component mounting line and configured to perform an appearance inspection for determining whether or not each of the plurality of components mounted on the substrate by the plurality of component mounters is in a defective mounting state, and a method for controlling a component mounting system including (a) setting the component determined to be in a defective mounting state by the appearance inspection device as a component to be inspected, (b) the component mounter that has mounted the component to be inspected controls the imaging device to acquire an image of the component to be inspected, and performs a post-implementation component inspection for determining whether the mounting of the component to be inspected is good or defective based on the image of the component to be inspected, and includes.

[0007] In the control method of this component mounting system, there are steps of setting, as inspection target components, components determined to be in a defective mounting state by an appearance inspection device, and a component mounter that has mounted the inspection target components controls an imaging device to acquire an image of the inspection target components, and performs post-mounting component inspection to determine whether the mounting of the inspection target components is good or defective based on the image of the inspection target components. Therefore, when the appearance inspection device determines in appearance inspection that a component mounted on a substrate is in a defective mounting state, post-mounting component inspection is executed. Thus, it becomes difficult for the post-mounting component inspection to be executed at an excessive frequency, and the timing for executing the post-mounting component inspection is not affected by the experience of the operator.

[0008] Note that the defective mounting state is, for example, a state where the mounting position of a component is shifted beyond the allowable range, a state where a component on the substrate is missing, or the like.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Modes for Carrying Out the Invention

[0010] Next, embodiments for carrying out the present disclosure will be described with reference to the drawings. FIG. 1 is a configuration diagram showing an outline of the component mounting system 1 of the present embodiment. FIG. 2 is an external perspective view of the component mounter 10, and FIG. 3 is a block diagram showing the electrical connection relationship of the component mounting system 1. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS. 1 and 2.

[0011] As shown in FIG. 1, the component mounting system 1 includes a printer 2, a printing inspection machine 3, a component mounting line 12, a reflow device 13, an appearance inspection device 14, and a management device 80 that manages the entire system. The printer 2 prints solder on the substrate S to form a circuit pattern. The printing inspection machine 3 inspects the state of the solder printed by the printer 2. A plurality of component mounters 10 perform a mounting operation of mounting components on the substrate S and also perform a mounting inspection as to whether or not components have been mounted on the substrate S. The printer 2, the printing inspection machine 3, the component mounting line 12, and the appearance inspection device 14 are arranged side by side in the conveyance direction of the substrate S (the direction from left to right) to form a production line.

[0012] As shown in FIG. 1, the component mounting line 12 includes a plurality (here, five) of component mounters 10A to 10E arranged along the conveyance direction (X-axis direction) of the substrate S. In this embodiment, when the component mounters 10A to 10E are not particularly distinguished, they are referred to as the component mounter 10. As shown in FIG. 2, the component mounter 10 includes a component supply device 21 that supplies components, a substrate conveyance device 22 that conveys the substrate S, a head 40 having a suction nozzle 45 that sucks components, a head moving device 30 that moves the head 40 in the X-axis direction and the Y-axis direction, and a control device 60 (see FIG. 3) that controls the entire mounter. In addition to these, the component mounter 10 also includes a parts camera 23 for imaging the suction posture of the components adsorbed on the suction nozzle 45, a nozzle station 24 that houses the suction nozzles 45 for replacement, a mark camera 43 for imaging the substrate S, and the like. The mark camera 43 is attached to the lower surface of the X-axis slider 32 or the head 40. The mark camera 43 is a camera whose lower part is the imaging region, and reads the reference marks attached to the substrate S indicating the reference position of the substrate S, the reference position for arranging components, and the like.

[0013] The component supply device 21 is configured as a tape feeder including, for example, a tape reel around which a carrier tape containing components at predetermined intervals is wound, and a tape feeding mechanism that pulls out the carrier tape from the tape reel by driving a drive motor and feeds it to the component supply position.

[0014] The substrate conveyance device 22 includes a pair of conveyor rails arranged at intervals in the Y-axis direction, and conveys the substrate S from left to right (conveyance direction) in FIG. 1 by driving the pair of conveyor rails.

[0015] As shown in Fig. 2, the head moving device 30 includes a pair of X-axis guide rails 31, an X-axis slider 32, an X-axis actuator 33 (see Fig. 3), a pair of Y-axis guide rails 35, a Y-axis slider 36, and a Y-axis actuator 37 (see Fig. 3). The pair of Y-axis guide rails 35 are installed on the upper stage of the housing 16 so as to extend in parallel with each other in the Y-axis direction. The Y-axis slider 36 is spanned across the pair of Y-axis guide rails 35 and moves in the Y-axis direction along the Y-axis guide rails 35 by the drive of the Y-axis actuator 37. The pair of X-axis guide rails 31 are installed on the front surface of the Y-axis slider 36 so as to extend in parallel with each other in the X-axis direction. The X-axis slider 32 is spanned across the pair of X-axis guide rails 31 and moves in the X-axis direction along the X-axis guide rails 31 by the drive of the X-axis actuator 33. The head 40 is attached to the X-axis slider 32, and the head moving device 30 moves the head 40 in the X-axis direction and the Y-axis direction by moving the X-axis slider 32 and the Y-axis slider 36.

[0016] The head 40 includes a Z-axis actuator 41 (see Fig. 3) that moves the suction nozzle 45 in the Z-axis (vertical) direction and a θ-axis actuator 42 (see Fig. 3) that rotates the suction nozzle 45 around the Z-axis. The head 40 can adsorb a component by applying a negative pressure to the suction port by communicating a negative pressure source to the suction port of the suction nozzle 45. Further, the head 40 can release the adsorption of the component by applying a positive pressure to the suction port by communicating a positive pressure source to the suction port of the suction nozzle 45.

[0017] As shown in FIG. 3, the control device 60 is configured as a microprocessor centered around the CPU 61. In addition to the CPU 61, it includes a ROM 62, a storage 63 (e.g., HDD or SSD), and a RAM 64. Position signals from the X-axis position sensor 34 that detects the position of the X-axis slider 32, position signals from the Y-axis position sensor 38 that detects the position of the Y-axis slider 36, image signals from the mark camera 43, image signals from the parts camera 23, etc. are input to the control device 60. On the other hand, control signals to the component supply device 21, control signals to the substrate transfer device 22, drive signals to the X-axis actuator 33, drive signals to the Y-axis actuator 37, drive signals to the Z-axis actuator 41, drive signals to the θ-axis actuator 42, control signals to the parts camera 23, control signals to the mark camera 43, etc. are output from the control device 60. Further, the control device 60 is connected to be capable of two-way communication with the control devices 60 and the management device 80 provided in the reflow device 13, the appearance inspection device 14, and other component mounters 10, and exchanges data and control signals with each other.

[0018] The reflow device 13 is arranged on the downstream side of the component mounting line 12. The reflow device 13 heats the substrate S to melt the solder, then cools it to electrically connect the components on the substrate S and fix the components to the substrate S.

[0019] The appearance inspection device 14 is arranged on the downstream side of the reflow device 13 (that is, on the downstream side in the conveyance direction from the component mounting line 12). The appearance inspection device 14 includes an inspection camera 75 (see FIG. 3) and a control device 70 (see FIG. 3). The inspection camera 75 is an imaging device that images the substrate S conveyed from the reflow device 13 from above. The control device 70 is configured as a microprocessor centered on the CPU 71 as shown in FIG. 3, and in addition to the CPU 71, it includes a ROM 72, a storage 73, and a RAM 74. The control device 70 outputs a control signal to the inspection camera 75 and inputs an image signal from the inspection camera 75. Based on the image captured by the inspection camera 75, the control device 70 performs an appearance inspection to determine whether the amount of displacement between the actual mounting position and the predetermined target mounting position of each component on the substrate S is within the appearance inspection allowable range. Further, the control device 70 is connected to the control devices 60 and the management device 80 provided in the component mounters 10A to 10E so as to be capable of two-way communication, and exchanges data and control signals with each other.

[0020] The management device 80 is, for example, a general-purpose computer and includes a CPU 81, a ROM 82, a storage 83, and a RAM 84 as shown in FIG. 3. An input signal is input to this management device 80 from an input device 87 such as a mouse or a keyboard. The management device 80 is connected to be capable of two-way communication with the component mounters 10A to 10E, the reflow device 13, and the appearance inspection device 14. Also, an image signal is output from the management device 80 to a display 88. The storage 83 stores the production job of the substrate S. Here, the production job of the substrate S includes production schedules such as which components are to be mounted on the substrate S in what order in each component mounter 10, information regarding target mounting positions such as where such components are to be mounted on the substrate S, and information for inspecting the mounting state such as criteria (allowable range of displacement amount) for determining whether the mounting state of the components is good or bad in the appearance inspection performed by the appearance inspection device 14. The management device 80 generates a production job based on the data input by the operator via the input device 87, and instructs the component mounters 10A to 10E to start production by transmitting the generated production job to the component mounters 10A to 10E.

[0021] Next, the appearance inspection by the appearance inspection device 14 in the component mounting system 1 of the present embodiment configured in this way will be described with reference to FIGS. 4 and 5. FIG. 4 is a flowchart showing an example of an appearance inspection routine, and FIG. 5 is an explanatory diagram showing an example of the appearance inspection result 76. Here, the appearance inspection result 76 is data in which the components inspected by the appearance inspection device 14 are associated with the mounting state (good or bad) and stored. The appearance inspection routine is stored in the ROM 72 of the control device 70 provided in the appearance inspection device 14 and starts after the substrate S is conveyed to the appearance inspection device 14.

[0022] When this routine starts, the CPU 71 first acquires a production job (S100). Specifically, the CPU 71 acquires the production job from the management device 80 and stores it in the storage 73. Subsequently, the CPU 71 captures an image of the substrate S after conveyance (S110). Specifically, the CPU 71 controls the inspection camera 75 to capture an image of the substrate S conveyed to the appearance inspection device 14 and stores the image in the storage 73. Subsequently, the CPU 71 detects the position of the substrate S (S120). Specifically, the CPU 71 detects a reference mark from the image captured in S110 and detects the position of the substrate S based on the position of the reference mark. Subsequently, the CPU 71 selects components for which appearance inspection is to be performed (S130).

[0023] Subsequently, the CPU 71 calculates the amount of deviation (S140). Specifically, for the components selected in S130, the CPU 71 obtains the values of the X-axis coordinate, Y-axis coordinate, and angle when actually mounted based on the image captured in S110. Here, the X-axis coordinate, Y-axis coordinate, and angle are as follows. That is, when the substrate S is regarded as an XY plane with the left front corner of the substrate S as the origin, the X-axis coordinate is the X-axis coordinate of the center of the component, the Y-axis coordinate is the Y-axis coordinate of the center of the component, and the angle is the angle formed by the long side of the component and a line parallel to the Y-axis. Then, the CPU 71 calculates the amount of deviation from the target mounting position by calculating the difference between the values of the X-axis coordinate, Y-axis coordinate, and angle of the component selected in S130 and the target mounting position.

[0024] Subsequently, the CPU 71 determines whether the amount of deviation is within the allowable range (S150). If all of the X-axis coordinate, Y-axis coordinate, and angle among the amounts of deviation from the target mounting position calculated in S140 are within the allowable range of the amount of deviation, the CPU 71 makes an affirmative determination. On the other hand, if at least one of the X-axis coordinate, Y-axis coordinate, and angle among the amounts of deviation calculated in S140 exceeds the allowable range of the amount of deviation, the CPU 71 makes a negative determination.

[0025] If an affirmative determination is made in S150, the CPU 71 updates the appearance inspection result 76 with the mounting state of the component being good (S160). Specifically, as shown in FIG. 5, the CPU 71 stores in the storage 73 by associating the component selected in S130 and the mounting state (good). On the other hand, if a negative determination is made in S150, the CPU 71 updates the appearance inspection result 76 with the mounting state of the component being bad (S170). Specifically, as shown in FIG. 5, the CPU 71 stores in the storage 73 by associating the component selected in S130 and the mounting state (bad) determined in S150.

[0026] After S160 or S170, the CPU 71 determines whether there are uninspected components (S180). If an affirmative determination is made in S180, the CPU 71 returns to S130 again. On the other hand, if a negative determination is made in S180, the CPU 71 determines whether there are components with a bad mounting state in the appearance inspection result 76 (S190). For example, when the appearance inspection result 76 is as shown in FIG. 6 (the mounting state of component P3 is bad), the CPU 71 makes an affirmative determination. On the other hand, when the appearance inspection result 76 shows that the mounting state of all components is good, the CPU 71 makes a negative determination. If a negative determination is made in S190, the CPU 71 ends this routine. On the other hand, if an affirmative determination is made in S190, the CPU 71 outputs the appearance inspection result 76 to all the component mounters 10 (component mounters 10A to 10E) (S200) and ends this routine. When the CPU 61 provided in the control device 60 of the component mounters 10A to 10E inputs the appearance inspection result 76 output from the control device 70 in S200, the CPU 61 stores the appearance inspection result 76 in the storage 63.

[0027] Next, the operation of the component mounter 10 in the component mounting system 1 of the present embodiment will be described with reference to FIGS. 7 and 8. FIG. 7 is a flowchart showing an example of a component mounting routine, and FIG. 8 is a flowchart showing an example of a post-mounting component inspection subroutine. The component mounting routine is stored in the ROM 62 of the control device 60 and is started after a production job is input from the management device 80. The component mounting routine is executed by each of the CPUs 61 provided in the control devices 60 of the component mounters 10A to 10E.

[0028] When this routine is started, first, the CPU 61 loads the substrate S (S300). Specifically, the CPU 61 drives and controls the substrate transfer device 22 to transfer the substrate S to a predetermined position of the component mounter 10. Subsequently, the CPU 61 determines whether or not a mounting stop instruction has been input (S310). This mounting stop instruction will be described later. If a negative determination is made in S310, the CPU 61 captures an image of the substrate S (S320). Specifically, the CPU 61 controls the mark camera 43 to capture an image of the substrate S immediately after it has been transferred to the component mounter 10, and stores the image in the storage 63. Subsequently, the CPU 61 detects the position of the substrate S (S330). Specifically, the reference mark is detected from the image captured in S320, and the position of the substrate S is detected based on the position of the reference mark.

[0029] Subsequently, the CPU 61 mounts components on the substrate S (S340). Specifically, the CPU 61 first obtains the target mounting positions of the components to be mounted from the input production job. Then, the CPU 61 controls the head moving device 30 and the head 40 so that the components are mounted at the target mounting positions with respect to the position of the substrate S obtained in S330. Subsequently, the CPU 61 determines whether there are unmounted components (S350). If an affirmative determination is made in S350, the CPU 61 returns to S340 again. On the other hand, if a negative determination is made in S350, the CPU 61 determines whether the appearance inspection result 76 is stored in the storage 63 (S360). If an affirmative determination is made in S360, the CPU 61 sets the component to be inspected (S370). Specifically, the CPU 61 finds out the components with defective mounting states from the appearance inspection result 76 and sets those components as the components to be inspected. For example, if the appearance inspection result 76 as shown in FIG. 6 is stored in the storage 63, the CPU 61 sets the component P3 as the component to be inspected. Subsequently, the CPU 61 determines whether the component to be inspected has been mounted by the own machine (the component mounter 10 in which the CPU 61 is provided) (S380). Specifically, the CPU 61 compares the component to be inspected set in S370 with the production job to determine whether the own machine has mounted the component to be inspected. For example, consider the case where the component to be inspected is set as a component mounted by the component mounter 10A. In this case, the CPU 61 provided in the component mounter 10A determines that the component to be inspected has been mounted by the own machine, and the CPU 61 provided in the component mounters 10B to 10E determines that the component to be inspected has not been mounted by the own machine. If an affirmative determination is made in S380, the CPU 61 executes a post-mounting component inspection subroutine (see FIG. 8) (S390).

[0030] When the implementation post-component inspection subroutine starts, the CPU 61 captures an image of the substrate S using the mark camera 43 of its own device (S500). Specifically, the CPU 61 controls the mark camera 43 to capture an image of the substrate S immediately after all the components to be implemented by its own device have been implemented, and stores the image in the storage 63. Subsequently, the CPU 61 calculates the amount of misalignment (S510). Specifically, the CPU 61 obtains the values of the X-axis coordinate, Y-axis coordinate, and angle when the component is actually implemented on the substrate S based on the image captured in S500. Then, the CPU 61 calculates the amount of misalignment from the target implementation position by calculating the differences between the values of the X-axis coordinate, Y-axis coordinate, and angle of the component to be inspected and the target implementation position. Subsequently, the CPU 61 determines whether the amount of misalignment is within the allowable range (S520). If all of the X-axis coordinate, Y-axis coordinate, and angle of the amount of misalignment calculated in S510 are within the allowable range of the amount of misalignment, the CPU 61 makes an affirmative determination. On the other hand, if at least one of the X-axis coordinate, Y-axis coordinate, and angle of the amount of misalignment calculated in S510 exceeds the allowable range of the amount of misalignment, the CPU 61 makes a negative determination.

[0031] If a negative determination is made in S520, the CPU 61 sets 0 to the number of good determinations (S530). Specifically, the CPU 61 sets 0 to the number of good determinations and stores it in the storage 63. Subsequently, the CPU 61 determines whether its own device is in the implementation stop instruction output state (S540). The implementation stop instruction output state will be described later.

[0032] If a negative determination is made at S540, the CPU 61 outputs an implementation stop instruction (S550). Specifically, the CPU 61 outputs a signal for implementing a stop so that the component mounter 10 arranged downstream in the conveyance direction from the own machine stops mounting components, and sets the state of the own machine to the implementation stop instruction output state and stores it in the storage 63. The control device 60 provided in the component mounter 10 arranged downstream in the conveyance direction from the own machine inputs the implementation stop instruction. The CPU 61 provided in the control device 60 that has input the implementation stop instruction makes an affirmative determination at S310 of the above-described component mounting routine, controls various members so that components are not mounted in the component mounter 10 including the CPU 61 (itself), and controls the substrate conveyance device 22 to convey the substrate S downstream (S400). Therefore, it is possible to prevent a situation where components mounted on the substrate S become wasted in the component mounter 10 arranged downstream in the conveyance direction from the component mounter 10 that has mounted the component to be inspected. For example, when the component to be inspected is mounted by the component mounter 10A, the CPU 61 provided in the component mounter 10A outputs an implementation stop instruction so that the component mounters 10B to 10E stop mounting components. On the other hand, the control devices 60 provided in the component mounters 10B to 10E input the implementation stop instruction, control various members so that components are not mounted, and convey the substrate S downstream.

[0033] After making an affirmative determination in S540 or after S550, the CPU 61 notifies the operator of a warning and temporarily suspends production (S552). The warning is notified, for example, by displaying a warning message (e.g., a message indicating that the mounting of the component to be inspected is defective in the post-mounting component inspection) on a display device (not shown) provided in the own machine. When temporarily suspending production, production is temporarily suspended not only in the own machine but also in all devices of the component mounting system 1. The operator who has received the warning corrects the production job, corrects the shape data, etc. via the input device 87 of the management device 80. Thereafter, the operator inputs an instruction to cancel the interruption to the management device 80 via the input device 87. The CPU 61 waits for the instruction to cancel the interruption and resumes the production that has been interrupted (S554). The instruction to cancel the interruption is notified to all devices of the component mounting system 1. Therefore, the production that has been interrupted in all devices of the component mounting system 1 is resumed.

[0034] On the other hand, if an affirmative determination is made in S520, the CPU 61 determines whether the state of the own machine is the mounting stop instruction output state (S560). If an affirmative determination is made in S560, the CPU 61 outputs a mounting resume instruction (S570). Specifically, a mounting resume signal is output to the component mounter 10, which is the output destination where the mounting stop instruction was output in S550, and the mounting stop instruction output state of the own machine is released. The component mounter 10 that has received the mounting resume signal resumes the mounting of components.

[0035] After performing a negative determination at S560 or after S570, the CPU 61 increments the number of successful determinations by one (S580). Subsequently, the CPU 61 determines whether the number of successful determinations has reached a predetermined number (S590). Here, the predetermined number is a number set in advance regardless of the type of component, and for example, it is set to 5 times. If an affirmative determination is made at S590, the CPU 61 executes inspection end processing (S600). Specifically, the CPU 61 deletes the appearance inspection result 76 from the storage 63, resets the number of good product determinations to 0, and outputs a signal for deleting the appearance inspection result to the component mounter 10 at the output destination where the mounting stop instruction was output at S550. The CPU 61 provided in the control device 60 of the component mounter 10 that has received the signal for deleting the appearance inspection result deletes the appearance inspection result 76 from the storage 63. After S554, after performing a negative determination at S590, or after S600, the CPU 61 ends the post-mounting component inspection subroutine and proceeds to S400 of the component mounting routine.

[0036] Returning to the component mounting routine of FIG. 7, after making an affirmative determination at S310, after making a negative determination at S360, after making a negative determination at S380, or after S390, the CPU 61 controls the substrate transfer device 22 to transfer the substrate S downstream (S400), and then ends the component mounting routine.

[0037] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The component mounting system 1 of this embodiment corresponds to the component mounting system of the present disclosure, the component mounting line 12 corresponds to the component mounting line, the component mounter 10 corresponds to the component mounter, the mark camera 43 corresponds to the imaging device, the control device 60 corresponds to the control device, the appearance inspection device 14 corresponds to the appearance inspection device, S370 of this embodiment corresponds to step (a) of the present disclosure, and S500 to S520 correspond to step (b). Also, the process of ending the post-mounting component inspection after an affirmative determination is made at S590 of this embodiment corresponds to step (c) of the present disclosure.

[0038] In the control method of the component mounting system 1 described in detail above, the step of setting a component determined to be in a defective mounting state by the appearance inspection device 14 as a component to be inspected (S370), and the component mounter 10 that mounts the component to be inspected controls the mark camera 43 to acquire an image of the component to be inspected (S500), and performs post-mounting component inspection to determine whether the mounting of the component to be inspected is good or bad based on the image of the component to be inspected (S510, S520). Therefore, when the appearance inspection device 14 determines in the appearance inspection that the component mounted on the substrate S is in a defective mounting state, the CPU 61 of the component mounter 10 executes the post-mounting component inspection. Thus, it becomes difficult for the post-mounting component inspection to be executed at an excessive frequency, and the timing of executing the post-mounting component inspection is not affected by the experience of the operator.

[0039] In the control method of the component mounting system 1, if it is determined in the post-mounting component inspection that the mounting of the component to be inspected is defective, subsequent component mounting on the substrate S determined to be defective is aborted (S310, S550). Therefore, it is possible to prevent a situation where components mounted on the substrate S by the component mounter 10 downstream of the component mounter 10 that mounts the component to be inspected are wasted.

[0040] The control method of the component mounting system 1 includes the step of ending the post-mounting component inspection (S590, S600) if the determination results of the post-mounting component inspection are continuously good for a predetermined number of times. Therefore, for example, when the component to be inspected accidentally becomes in a defective mounting state, etc., a good determination is made continuously for a predetermined number of times in the subsequent post-mounting component inspection and the post-mounting component inspection ends. Thus, it is possible to further suppress a decrease in production efficiency due to executing the post-mounting component inspection.

[0041] In the component mounting system 1, components determined to be in a defective mounting state by the appearance inspection device 14 are set as inspection target components, and the component mounter 10 that mounts the inspection target components controls the mark camera 43 to acquire an image of the inspection target components, and controls so as to perform post-mounting component inspection for determining whether the mounting of the inspection target components is good or bad based on the image of the inspection target components. Therefore, it becomes difficult for the post-mounting component inspection to be executed at an excessive frequency, and the timing of executing the post-mounting component inspection is not affected by the experience of the operator.

[0042] Note that the present invention is not limited to the above-described embodiments at all, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

[0043] For example, in the above-described embodiment, in S500 of the post-mounting component inspection subroutine, the mark camera 43 provided in the component mounter 10 that mounts the inspection target components was controlled to acquire an image of the substrate S, but the present invention is not limited thereto. For example, in the above-described embodiment, for the substrate S for which the post-mounting component inspection subroutine by the component mounter 10 that mounts the inspection target components was not executed, the component mounter 10 arranged on the downstream side of the component mounter 10 that mounts the inspection target components may execute the post-mounting component inspection (for one inspection target component, one component mounter 10 may perform the post-mounting component inspection). In this case, the control device 60 provided in the component mounter 10 that mounts the inspection target components may output a signal for starting the post-mounting component inspection so that the control device 60 provided in the component mounter 10 arranged on the downstream side executes the post-mounting component inspection subroutine. Further, in this case, the number of good determinations may be the total number of the number of times the control device 60 of the component mounter 10 that mounts the inspection target components determines that the mounting state of the inspection target components is good and the number of times the control device 60 of the component mounter 10 at the output destination where the signal for starting the post-mounting component inspection is output determines that the mounting state of the inspection target components is good.

[0044] In the above-described embodiment, after all the components are mounted by the component mounter 10, it is determined whether the component to be inspected is mounted by the own machine, and the post-mounting component inspection subroutine is executed, but it is not limited thereto. For example, the post-mounting component inspection subroutine may be executed immediately after the component to be inspected is mounted. In this case, the CPU 61 may set the component to be inspected between the negative determination in S310 and the mounting of the component.

[0045] In the above-described embodiment, the control device 60 provided in the component mounter 10 sets the component to be inspected (S370), but it is not limited thereto. For example, the management device 80 or the control device 70 of the appearance inspection device 14 may set the component to be inspected. Further, in the above-described embodiment, the control device 60 provided in the component mounter 10 determines whether the own machine has mounted the component to be inspected (S380), but it is not limited thereto. For example, in the above-described embodiment, the management device 80 or the control device 70 may identify the component mounter 10 that has mounted the component to be inspected.

[0046] In the above-described embodiment, the predetermined number of times is set to a fixed number regardless of the type of component, but it is not limited thereto. For example, the predetermined number of times may be set for each type of component. In this case, the predetermined number of times may be set based on the defect occurrence rate in the appearance inspection by the appearance inspection device 14. That is, the defect occurrence rate for each component is calculated each time the appearance inspection is performed by the appearance inspection device 14, and the number of times obtained by multiplying the calculated occurrence rate by a predetermined specified number of times may be set as the predetermined number of times.

[0047] In the above-described embodiment, the CPU 61 outputs a mounting stop instruction after making a negative determination in S520, but it is not limited thereto. For example, the CPU 61 may output a mounting stop instruction before starting the post-mounting component inspection subroutine.

[0048] In the above-described embodiment, after a positive determination is made in S520, if it is determined in S560 that the component mounter 10 on which the component to be inspected is mounted is in the mounting stop output state, a mounting restart instruction is output in S570, but it is not limited thereto. For example, after a positive determination is made in S520, S560 and S570 may be omitted and the process may proceed to S580. In this case, a mounting restart instruction may be output when the inspection end process is executed in S600.

[0049] The control method of the component mounting system and the component mounting system of the present disclosure may be configured as follows.

[0050] In the control method of the component mounting system of the present disclosure, in the step (b), for the substrate on which the post-mounting component inspection by the component mounter that has mounted the component to be inspected has not been performed, the component mounter arranged downstream of the component mounter that has mounted the component to be inspected may perform the post-mounting component inspection. In this way, for example, even if the substrate on which the component to be inspected is mounted has already passed through the component mounter that has mounted the component to be inspected, the post-mounting component inspection can be executed using the image captured by the imaging device provided in the component mounter located downstream in the conveyance direction from that component mounter.

[0051] In the control method of the component mounting system of the present disclosure, in the step (b), if it is determined in the post-mounting component inspection that the mounting of the component to be inspected is defective, subsequent component mounting on the substrate determined to be defective may be aborted. In this way, it is possible to prevent a situation where components mounted on the substrate by a component mounter downstream of the component mounter that has mounted the component to be inspected are wasted.

[0052] The control method of the component mounting system of the present disclosure may also include the step of ending the post-mounting component inspection if the determination results of the post-mounting component inspection are good for a predetermined number of consecutive times. In this way, for example, when the component to be inspected accidentally has a defective mounting state, etc., the post-mounting component inspection will end after a good determination is made for a predetermined number of consecutive times in the subsequent post-mounting component inspection. Therefore, it is possible to further suppress the decrease in production efficiency caused by performing the post-mounting component inspection.

[0053] The component mounting system of the present disclosure A component mounting line in which a plurality of component mounters for holding a substrate and mounting components on the substrate are arranged along the conveyance direction of the substrate An imaging device provided for each of the component mounters to image the substrate held by the component mounter An appearance inspection device provided on the downstream side of the conveyance direction from the component mounting line, and performing an appearance inspection for determining whether each of the plurality of components mounted on the substrate by the plurality of component mounters is in a defective mounting state A control device that sets the component determined to be in a defective mounting state by the appearance inspection device as an inspection target component, and the component mounter that has mounted the inspection target component controls the imaging device to acquire an image of the inspection target component, and performs a post-mounting component inspection for determining whether the mounting of the inspection target component is good or bad based on the image of the inspection target component It is provided with.

[0054] In this component mounting system, the component determined to be in a defective mounting state by the appearance inspection device is set as the inspection target component, and the component mounter that has mounted the inspection target component controls the imaging device to acquire an image of the inspection target component, and performs a post-mounting component inspection for determining whether the mounting of the inspection target component is good or bad based on the image of the inspection target component. Therefore, it becomes difficult for the post-mounting component inspection to be executed at an excessive frequency, and the timing of executing the post-mounting component inspection is not affected by the experience of the operator.

Industrial Applicability

[0055] The present disclosure can be used in a component mounting system incorporating a component mounter and the like.

Description of Reference Numerals

[0056] 1 Component mounting system, 2 Printer, 3 Printing inspection machine, 10, 10A, 10B, 10C, 10D, 10E Component mounter, 12 Component mounting line, 13 Reflow device, 14 Appearance inspection device, 16 Housing, 21 Component supply device, 22 Substrate transfer device, 23 Parts camera, 24 Nozzle station, 30 Head movement device, 31 X-axis guide rail, 32 X-axis slider, 33 X-axis actuator, 34 X-axis position sensor, 35 Y-axis guide rail, 36 Y-axis slider, 37 Y-axis actuator, 38 Y-axis position sensor, 40 Head, 41 Z-axis actuator, 42 θ-axis actuator, 43 Mark camera, 45 Suction nozzle, 60 Control device, 61 CPU, 62 ROM, 63 Storage, 64 RAM, 70 Control device, 71 CPU, 72 ROM, 73 Storage, 74 RAM, 75 Inspection camera, 76 Appearance inspection result, 80 Management device, 81 CPU, 82 ROM, 83 Storage, 84 RAM, 87 Input device, 88 Display, S Substrate.

Claims

1. A component mounting line in which a plurality of component mounters for holding a substrate and mounting components on the substrate are arranged along the conveyance direction of the substrate, An imaging device provided for each of the component mounters and configured to image an image of the substrate held by the component mounter, An appearance inspection device provided on the downstream side of the component mounting line in the conveyance direction and configured to perform an appearance inspection for determining whether each of the plurality of components mounted on the substrate by the plurality of component mounters is in a defective mounting state, A method for controlling a component mounting system including: (a) setting the component determined to be in a defective mounting state by the appearance inspection device as a component to be inspected; (b) the component mounter that mounted the component to be inspected controls the imaging device to acquire an image of the component to be inspected, and performs a post-mounting component inspection for determining whether the mounting of the component to be inspected is good or defective based on the image of the component to be inspected; including: In step (b), if it is determined in the post-mounting component inspection that the mounting of the component to be inspected is defective, in order to stop subsequent component mounting on the substrate determined to be defective, the component mounter arranged on the downstream side of the component mounter that mounted the component to be inspected in the conveyance direction outputs a mounting stop signal so as to stop the mounting of the component. A method for controlling a component mounting system.

2. In step (b), for the substrate on which the post-mounting component inspection by the component mounter that mounted the component to be inspected was not performed, the component mounter arranged on the downstream side of the component mounter that mounted the component to be inspected performs the post-mounting component inspection. The method for controlling a component mounting system according to claim 1.

3. The method for controlling a component mounting system according to claim 1 or 2, including: (c) if the determination results of the post-mounting component inspection are continuously good for a predetermined number of times, ending the post-mounting component inspection. A method for controlling a component mounting system.

4. A component mounting line in which a plurality of component mounters for holding a substrate and mounting components on the substrate are arranged along the conveyance direction of the substrate, An imaging device provided for each of the component mounters and configured to image an image of the substrate held by the component mounter, An appearance inspection device that is provided on the downstream side of the component mounting line in the conveyance direction, and performs an appearance inspection for determining whether each of a plurality of components mounted on the substrate by a plurality of the component mounters is in a defective mounting state; A control device that sets the component determined to be in a defective mounting state by the appearance inspection device as an inspection target component, the component mounter that mounts the inspection target component controls the imaging device to acquire an image of the inspection target component, and controls to perform a post-mounting component inspection for determining whether the mounting of the inspection target component is good or defective based on the image of the inspection target component. If the mounting of the inspection target component is determined to be defective in the post-mounting component inspection, the component mounter arranged on the downstream side of the component mounter that mounts the inspection target component in the conveyance direction outputs a mounting stop signal to stop the mounting of the component; A component mounting system comprising the above.

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