Cutting device

Abstract

To provide a cutting device which can prevent deposition of an end material on a bottom part of a draining tray with a simple structure without increasing costs.SOLUTION: A cutting device 1 includes: a holding table which holds a workpiece; an X axis moving unit which causes the holding table to reciprocate in an X axis direction; a cutting unit which cuts the workpiece with a cutting blade while supplying cutting water; and a discharge unit 50 which receives and discharges sawdust which occurs during cutting of the workpiece and the cutting water to an outside. The discharge unit 50 has: a draining tray 51 including longitudinal parts 511 which are drain passages disposed at both sides of a moving path of the holding table 10; a sawdust housing unit 53 which is disposed at one end of the draining tray 51 and houses the sawdust; and a water flow generation unit 54 which pushes the sawdust into the sawdust housing unit 53. The water flow generation unit 54 is a fluid oscillation nozzle.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a cutting device.

Background Art

[0002] In order to divide a workpiece such as a semiconductor wafer, a cutting device that processes along a street set on the wafer is used. Such a cutting device generally includes a holding table for holding a workpiece, a cutting means having a cutting blade for cutting the workpiece held on the holding table, a cutting water supply means for supplying cutting water to a cutting portion by the cutting blade, a cutting feed means for moving the holding table in the cutting feed direction, and a first bellows means and a second bellows means each having one end connected to both ends in the cutting feed direction of the holding table and covering the cutting feed means.

[0003] Further, a drainage tray for receiving cutting chips and cutting water generated during cutting and discharging them to the outside of the device is disposed along the cutting feed direction on both sides of each of the first bellows means and the second bellows means.

[0004] Here, depending on the size and weight of the end material generated by cutting the workpiece, the end material may accumulate at the bottom of the drainage tray. As a result, if the drainage path is blocked, there is a risk that the used cutting water will not be drained and will overflow from the drainage tray and enter the inside of the device.

[0005] Therefore, a method of removing end materials and cutting chips from the bottom of the drainage tray by providing an injection nozzle for injecting cleaning water from a slit and a wiper that moves in contact with the bottom of the drainage tray on the side surface of a moving support member that supports the holding table movably in the cutting feed direction has been disclosed (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] However, in the method of injecting cleaning water from the slit, sufficient water pressure cannot be generated, and the deposition of cutting chips on the bottom of the drainage tray cannot be eliminated. In addition, when a wiper is installed, the device configuration becomes complicated, which is a factor increasing the cost.

[0008] The present invention has been made in view of the above facts, and an object thereof is to provide a cutting device capable of preventing the deposition of end materials on the bottom of a drainage tray with a simple configuration without increasing the cost.

MEANS FOR SOLVING THE PROBLEMS

[0009] In order to solve the above-described problems and achieve the object, a cutting device according to the present invention includes a holding table for holding a workpiece, a cutting feed unit for reciprocating the holding table in a cutting direction, a cutting unit for cutting the workpiece with a cutting blade while supplying cutting water, and a discharge unit for receiving cutting chips and cutting water generated by cutting the workpiece and discharging them to the outside. The discharge unit includes a drainage tray provided with drainage channels disposed on both sides of a movement path of the holding table, a cutting chip accommodation unit disposed at one end of the drainage tray for accommodating cutting chips, and a water flow generation unit for pushing the cutting chips into the cutting chip accommodation unit. The water flow generation unit is a fluid oscillation nozzle. and a bottom wall, an inner wall erected from the inner edge of the bottom wall, and an outer wall erected from the outer edge of the bottom wall, and is formed in a gutter shape In the cutting device, the water flow generation unit may be disposed on the other end side of the discharge unit opposite to the one end side where the cutting chip accommodation unit is disposed. installed on the bottom wall and spraying water while swinging left and right along the bottom wall characterized in that it is a fluid oscillation nozzle. In the cutting device, the water flow generating unit may be installed on the bottom wall of each of the drain channels.

[0010] In the cutting device, the water flow generation unit may be disposed on the other end side of the discharge unit opposite to the one end side where the cutting chip accommodation unit is disposed.

EFFECTS OF THE INVENTION

[0011] The present invention has an effect of preventing the deposition of end materials on the bottom of the water case without increasing the cost with a simple configuration.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Embodiments for Carrying Out the Invention

[0013] Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. In addition, the constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the configurations described below can be combined as appropriate. Also, various omissions, substitutions, or changes in the configuration can be made without departing from the gist of the present invention.

[0014] 〔Embodiment 1〕 The cutting device according to Embodiment 1 of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a configuration example of the cutting device according to Embodiment 1. FIG. 2 is a perspective view showing a holding table, a water case, etc. of the cutting device shown in FIG. 1.

[0015] (Workpiece) The cutting device 1 according to Embodiment 1 is a processing device for cutting a workpiece 200. The workpiece 200 to be processed by the cutting device 1 shown in FIG. 1 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer having a base material such as silicon, gallium arsenide, SiC (silicon carbide), or sapphire. In the workpiece 200, devices 203 are formed in regions partitioned in a lattice shape by a plurality of division planned lines 202 formed in a lattice shape on the surface 201.

[0016] The device 203 is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), an MEMS (Micro Electro Mechanical Systems), or various memories (semiconductor storage devices).

[0017] Further, the workpiece 200 of the present invention may be a so-called TAIKO (registered trademark) wafer in which the central portion is thinned and a thick portion is formed in the outer peripheral portion. In addition to the wafer, a resin package substrate such as a rectangular QFN (Quad Flat No leaded) package substrate having a plurality of devices sealed with resin, a ceramic substrate, a ferrite substrate, a substrate containing at least one of nickel and iron, a glass substrate, etc. may also be used. In Embodiment 1, an adhesive tape 206 with an annular frame 205 attached to the outer peripheral edge is adhered to the back surface 204 on the back side of the surface 201 of the workpiece 200, and the workpiece 200 is supported by the annular frame 205.

[0018] (Cutting device) The cutting device 1 shown in Fig. 1 is a processing device that holds the workpiece 200 on the holding table 10 and cuts it with the cutting blade 21 along the planned division line 202. As shown in Fig. 1, the cutting device 1 includes a holding table 10 that sucks and holds the workpiece 200 on the holding surface 11, a cutting unit 20 that cuts the workpiece 200 held on the holding table 10 by the cutting blade 21 while supplying cutting water, an imaging unit 30 that images the workpiece 200 held on the holding table 10, and a control unit 100.

[0019] Further, as shown in Fig. 1, the cutting device 1 includes a moving unit 40 that relatively moves the holding table 10 and the cutting unit 20. The moving unit 40 includes an X-axis moving unit 41 that is a machining feed unit that feeds the holding table 10 in the X-axis direction, which is the cutting direction parallel to the horizontal direction; a Y-axis moving unit 42 that is an indexing feed unit that indexes and feeds the cutting unit 20 in the Y-axis direction parallel to the horizontal direction and orthogonal to the X-axis direction; a Z-axis moving unit 43 that is a cutting feed unit that feeds the cutting unit 20 in the Z-axis direction parallel to the vertical direction orthogonal to both the X-axis direction and the Y-axis direction; and at least a rotational moving unit 44 that rotates the holding table 10 around an axis parallel to the Z-axis direction.

[0020] The X-axis moving unit 41 relatively feeds the holding table 10 and the cutting unit 20 along the X-axis direction by moving the moving plate 4 that supports the holding table 10 and the rotational moving unit 44 in the X-axis direction, which is the machining feed direction. Further, the X-axis moving unit 41 is also a cutting feed unit that is installed on the apparatus main body 2 and reciprocates the holding table 10 in the X-axis direction, which is the cutting direction.

[0021] The Y-axis movement unit 42 is installed on the support frame 3 erected from the apparatus main body 2, and moves the cutting unit 20 in the Y-axis direction which is the indexing feed direction, thereby relatively indexing and feeding the holding table 10 and the cutting unit 20 along the Y-axis direction. The Z-axis movement unit 43 is installed on the support frame 3 erected from the apparatus main body 2, and moves the cutting unit 20 in the Z-axis direction which is the plunge feed direction, thereby relatively plunge feeding the holding table 10 and the cutting unit 20 along the Z-axis direction. The rotational movement unit 44 is disposed on the moving plate 4.

[0022] The X-axis movement unit 41, the Y-axis movement unit 42, and the Z-axis movement unit 43 include a well-known ball screw rotatably provided around an axis, a well-known motor that rotates the ball screw around the axis, and a well-known guide rail that movably supports the holding table 10 or the cutting unit 20 in the X-axis direction, Y-axis direction, or Z-axis direction.

[0023] The holding table 10 has a disk shape, and the holding surface 11 for holding the workpiece 200 is formed of porous ceramic or the like. Further, the holding table 10 is movably provided by the X-axis movement unit 41 so as to span the processing area below the cutting unit 20 of the moving plate 4 and the loading / unloading area where the workpiece 200 is loaded and unloaded while being separated from below the cutting unit 20, and thus is movably provided in the X-axis direction. The holding table 10 is rotatably provided around an axis parallel to the Z-axis direction by the rotational movement unit 44.

[0024] The holding table 10 is connected to a vacuum suction source (not shown) and sucks and holds the workpiece 200 placed on the holding surface 11 by being sucked by the vacuum suction source. In Embodiment 1, the holding table 10 sucks and holds the back surface 204 side of the workpiece 200 via the adhesive tape 206. Further, as shown in FIG. 1, a plurality of clamping portions 12 for clamping the annular frame 205 are provided around the holding table 10. In the present invention, the adhesive tape 206 may not be attached to the workpiece 200, and the workpiece 200 may be directly held by the holding table 10, and the holding table 10 may not be disk-shaped.

[0025] The cutting unit 20 is a cutting means in which a cutting blade 21 is mounted on a spindle 23 and cuts the workpiece 200 held by the holding table 10. As shown in FIG. 1, the cutting apparatus 1 includes two cutting units 20, that is, a so-called facing dual type cutting apparatus with two spindles.

[0026] Each of the cutting units 20 is provided so as to be movable in the Y-axis direction by the Y-axis movement unit 42 and movable in the Z-axis direction by the Z-axis movement unit 43 with respect to the workpiece 200 held by the holding table 10. As shown in FIG. 1, each of the cutting units 20 is provided on a support frame 3 erected from the apparatus main body 2 via the Y-axis movement unit 42, the Z-axis movement unit 43, and the like. The cutting unit 20 can position the cutting blade 21 at an arbitrary position on the holding surface 11 of the holding table 10 by the Y-axis movement unit 42 and the Z-axis movement unit 43.

[0027] The cutting unit 20 includes a cutting blade 21, a spindle housing 22 provided so as to be movable in the Y-axis direction and the Z-axis direction by the Y-axis movement unit 42 and the Z-axis movement unit 43, a spindle 23 provided rotatably around the axis in the spindle housing 22 and rotated by a motor (not shown), and a blade cover 24 fixed to the front end surface of the spindle housing 22.

[0028] The cutting blade 21 is an extremely thin grinding wheel having a substantially ring shape. In Embodiment 1, the cutting blade 21 is a so-called hub blade including an annular circular base and an annular cutting edge disposed on the outer peripheral edge of the circular base for cutting the workpiece 200. The cutting edge is made of abrasive grains such as diamond or CBN (Cubic Boron Nitride) and a bonding material (binder) such as metal or resin, and is formed to have a predetermined thickness. The cutting edge of the cutting blade 21 wears when cutting the workpiece 200. In the present invention, the cutting blade 21 may be a so-called washer blade composed only of the cutting edge.

[0029] The spindle 23 rotates around its axis by a motor to rotate the cutting blade 21. The blade cover 24 covers at least the upper part of the cutting blade 21. The blade cover 24 is fixed to the front end surface of the spindle housing 22. Further, a nozzle 25 for supplying cutting water to the cutting blade 21 is attached to the blade cover 24.

[0030] Note that the axes of the cutting blade 21 and the spindle 23 of the cutting unit 20 are set parallel to the Y-axis direction.

[0031] The imaging unit 30 is fixed to one cutting unit 20 so as to move integrally with the one cutting unit 20. The imaging unit 30 includes an image sensor for photographing a region to be divided of the workpiece 200 before cutting held on the holding table 10. The image sensor is, for example, a CCD (Charge-Coupled Device) image sensor or a CMOS (Complementary MOS) image sensor. The imaging unit 30 photographs the workpiece 200 held on the holding table 10 to obtain an image for performing alignment for positioning the workpiece 200 and the cutting blade 21, and outputs the obtained image to the control unit 100.

[0032] Further, the cutting device 1 includes an X-axis direction position detection unit (not shown) for detecting the position of the holding table 10 in the X-axis direction, a Y-axis direction position detection unit (not shown) for detecting the position of the cutting unit 20 in the Y-axis direction, and a Z-axis direction position detection unit for detecting the position of the cutting unit 20 in the Z-axis direction. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale parallel to the X-axis direction or the Y-axis direction and a reading head. The Z-axis direction position detection unit detects the position of the cutting unit 20 in the Z-axis direction by the pulses of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the position of the holding table 10 in the X-axis direction, the position of the cutting edge of the cutting unit 20 of the cutting unit 20 in the Y-axis direction or the Z-axis direction to the control unit 100.

[0033] In Embodiment 1, the positions of the holding table 10 and the cutting unit 20 of the cutting device 1 in the X-axis direction, Y-axis direction, and Z-axis direction are determined based on a predetermined reference position (not shown). Further, in Embodiment 1, the reference position of the cutting unit 20 in the Z-axis direction is the position where the holding surface 11 of the holding table 10 and the lower end of the cutting edge of the cutting blade 21 are located on the same plane.

[0034] The cutting device 1 also includes a discharge unit 50. The discharge unit 50 receives the end material, cutting chips, and cutting water generated by cutting the workpiece 200 and discharges them to the outside. As shown in FIG. 2, the discharge unit 50 includes a drainage tray 51, a pair of bellows 52, a cutting chip storage unit 53 disposed at one end of the drainage tray 51 in the X-axis direction for storing the end material and cutting chips, and a water flow generation unit 54 for flushing the end material and cutting chips into the cutting chip storage unit 53.

[0035] As shown in FIGS. 1 and 2, the drainage tray 51 is disposed so as to surround the periphery of the moving path of the holding table 10 in the X-axis direction on the X-axis moving unit 41 installed on the apparatus main body 2, and is formed in a frame shape with its longitudinal direction parallel to the X-axis direction. Since the drainage tray 51 is formed in a frame shape, an opening 55 is formed inside. The opening 55 has the X-axis moving unit 41 disposed below it on the inner side, and the holding table 10 including the rotational moving unit 44 is movably disposed within the opening 55. Note that FIGS. 1 and 2 show a cutout of a part on the front side in the drawing of the drainage tray 51.

[0036] The drainage tray 51 includes a frame-shaped bottom wall 56 that forms an opening 55 inside and has a longitudinal direction parallel to the X-axis direction, an inner wall 57 erected from the inner edge of the bottom wall 56, and an outer wall 58 erected from the outer edge of the bottom wall 56, and is formed in a gutter shape. The drainage tray 51 receives end materials, cutting chips, and cutting water between the bottom wall 56, the inner wall 57, and the outer wall 58.

[0037] Further, the drainage tray 51 includes a pair of long portions 511 parallel to the X-axis direction, which is the cutting direction (also the moving direction) of the holding table 10, and short portions 512 that connect both ends of the long portions 511. These long portions 511 and short portions 512 are each constituted by the bottom wall 56, the inner wall 57, and the outer wall 58. The long portions 511 of the drainage tray 51 are disposed on both sides in the Y-axis direction of the moving path of the holding table 10 moving in the X-axis direction, and are drainage paths that guide the end materials, cutting chips, and cutting water received between the bottom wall 56, the inner wall 57, and the outer wall 58 to the cutting chip storage unit 53.

[0038] The snake belly 52 is attached to the outer peripheral surface of the rotary movement unit 44, covers the periphery of the holding table 10, and is attached to the table cover 5 and the inner side wall 57 of the short hand part 512 of the drainage tray 51 to block the opening 55 inside the drainage tray 51, and is arranged parallel to the X-axis direction. Each snake belly 52 is stretchable in the X-axis direction. One end is attached to the inner side wall 57 on one end side in the X-axis direction of the drainage tray 51 and the table cover 5, and the other end is attached to the inner side wall 57 on the other end side in the X-axis direction of the drainage tray 51 and the table cover 5, and is arranged on both sides in the X-axis direction of the holding table 10. The snake belly 52 covers the opening 55 inside the drainage tray 51 to prevent cutting water from entering the opening 55 inside the drainage tray 51 which is the inside of the device. The snake belly 52 has flexibility and is bendable, and bends along with the movement of the holding table 10 to allow the movement of the holding table 10 in the X-axis direction.

[0039] The cutting chip accommodating unit 53 includes a discharge port 531 arranged at one end in the X-axis direction of the drainage tray 51 and a cutting chip accommodating part 532 connected to the discharge port 531. The discharge port 531 penetrates the drainage tray 51 and allows cutting chips and cutting water to pass through the inside to discharge end materials, cutting chips and cutting water outside the tray. The cutting chip accommodating part 532 accommodates the end materials, cutting chips and cutting water discharged from the discharge port 531.

[0040] Next, the water flow generation unit 54 will be described. Fig. 3 is a cross-sectional view along the horizontal direction of the water flow generation unit of the cutting device shown in Fig. 1. Fig. 4 is a cross-sectional view along the horizontal direction showing the state where the water flow generation unit shown in Fig. 3 injects water towards the right in a plan view. Fig. 5 is a cross-sectional view along the horizontal direction showing the state where the water flow generation unit shown in Fig. 3 injects water towards the left in a plan view.

[0041] The water flow generating unit 54 is disposed on the other end side of the longitudinal portion 511 of the drainage tray 51 in the X-axis direction, which is opposite to the one end side in the X-axis direction where the cutting chip accommodating unit 53 is disposed. In the first embodiment, water 70 (shown in FIGS. 4 and 5), which is a fluid, is jetted from the other end to the one end of the longitudinal portion 511 of the drainage tray 51 in the X-axis direction, and the jetted water 70 washes away end materials and cutting chips into the cutting chip accommodating unit 53.

[0042] In the first embodiment, the water flow generating unit 54 is installed on the bottom wall 56 of each of the longitudinal portions 511 of the drainage tray 51. As shown in FIG. 3, the water flow generating unit 54 is a so-called fluid oscillation nozzle including a flat plate-shaped unit body 60, a water channel generating space 62 provided inside the unit body 60 and through which water 70 is supplied from a fluid supply source through an inlet 61, and an injection port 63 for injecting the water 70 supplied into the water channel generating space 62.

[0043] The inlet 61 communicates with the side away from the one end in the X-axis direction of the longitudinal portion 511 of the drainage tray 51 of the water channel generating space 62. The water channel generating space 62 is a space having a circular planar shape. The injection port 63 penetrates the unit body 60 and communicates with the one end side in the X-axis direction of the longitudinal portion 511 of the drainage tray 51 of the water channel generating space 62. The injection port 63 is formed such that the opening area gradually increases as it goes from the throttle portion 631 communicating with the water channel generating space 62 toward the one end in the X-axis direction of the longitudinal portion 511 of the drainage tray 51.

[0044] In the water flow generating unit 54, the water 70 supplied into the water channel generating space 62 from the inlet 61 travels straight toward the injection port 63. In the water flow generating unit 54, due to a part of the water jet 64 (shown in FIGS. 4 and 5) of the water 70 flowing toward the injection port 63 hitting one of the throttle portions 631 on the left or right in the drawing, the water 70 is diverted, and the diverted water 70 forms a jet vortex 641 in one of the left and right vortex chambers 621, 622 (shown in FIGS. 4 and 5) in the water channel generating space 62 partitioned by the water jet 64.

[0045] When the water flow generation unit 54 forms a jet vortex 641 in the right vortex chamber 621 of the left and right vortex chambers 621 and 622, for example, as shown in FIG. 4, the jet flow 64 is attracted to the right and flows along the inner wall surface 632 on the right side of the injection port 63, and water 70 is injected from the injection port 63 toward the right. At this time, in the water flow generation unit 54, the pressure in the right vortex chamber 621 becomes higher than the atmospheric pressure in the left vortex chamber 622.

[0046] For this reason, the water flow generation unit 54 redirects the jet flow 64 to the low-pressure side, that is, the left side, and forms a jet vortex 641 in the left vortex chamber 622 of the left and right vortex chambers 621 and 622 as shown in FIG. 5. The jet flow 64 flows along the inner wall surface 633 on the left side of the injection port 63, and water 70 is injected from the injection port 63 toward the left. In this way, the water flow generation unit 54 repeatedly alternates between the state of injecting water 70 toward the right as shown in FIG. 4 and the state of injecting water 70 toward the left as shown in FIG. 5, and injects water 70 toward the chip collection unit 53 while swinging left and right along the bottom wall 56, thereby generating a flow of water 70, that is, a water flow, toward the chip collection unit 53 on the entire surface of the bottom wall 56. In Embodiment 1, the water flow generation unit 54 repeats the state shown in FIG. 4 and the state shown in FIG. 5 at a frequency of 20 Hz.

[0047] The control unit 100 controls each component of the cutting device 1 to cause the cutting device 1 to perform a machining operation on the workpiece 200. The control unit 100 is a computer having an arithmetic processing unit with a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device. The arithmetic processing unit of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs a control signal for controlling the cutting device 1 to each component of the cutting device 1 via the input / output interface device.

[0048] The control unit 100 is connected to a display unit (not shown) composed of a liquid crystal display device or the like that displays the state and image of the processing operation, and an input unit (not shown) used when the operator registers processing content information and the like. The input unit is composed of at least one of a touch panel provided on the display unit and an external input device such as a keyboard.

[0049] (Processing operation) When starting the processing operation of the cutting device 1, the operator registers the processing content information in the control unit 100 and places the workpiece 200 before cutting on the holding surface 11 of the holding table 10. Thereafter, when the control unit 100 receives an instruction to start the processing operation from the operator, the cutting device 1 starts the processing operation. When starting the processing operation, the cutting device 1 sucks and holds the back surface 204 side on the holding surface 11 of the holding table 10 via the adhesive tape 206, and clamps the annular frame 205 with the clamp portion 12.

[0050] In the processing operation, the cutting device 1 moves the holding table 10 toward the processing area by the X-axis moving unit 41, the imaging unit 30 captures the workpiece 200, and performs alignment based on the image obtained by the imaging unit 30. The cutting device 1 relatively moves the workpiece 200 and the cutting unit 20 along the division planned line 202, supplies water 70 from the fluid supply source to the water flow generating unit 54, injects water 70 from the water flow generating unit 54, and cuts the cutting blade 21 into each division planned line 202 while supplying cutting water from the nozzle 25 to divide the workpiece 200 into individual devices 203.

[0051] The cutting device 1 receives end materials, cutting chips, cutting water, etc. generated by cutting with the drainage tray 51, flushes them with the water flow generated by the water flow generation unit 54, and stores them in the cutting chip storage unit 53. When the cutting device 1 cuts all the planned division lines 202 of the workpiece 200 and divides the workpiece 200 into individual devices 203, the workpiece 200 divided into individual devices 203 moves toward the loading / unloading area, and the suction holding of the holding surface 11 and the clamping of the clamping portion 12 are released in the loading / unloading area to end the processing operation.

[0052] As described above, the cutting device 1 according to Embodiment 1 is configured such that the water 70 is ejected while being oscillated by the water flow generation unit 54 which is a fluid oscillation nozzle, and the end materials and cutting chips are flushed toward the cutting chip storage unit 53. Thereby, compared with the case where a plurality of ejection ports for ejecting the water 70 are provided across the inner wall 57 and the outer wall 58 of the long side portion 511 of the drainage tray 51, even if the ejection port 63 of the water flow generation unit 54 is made into one, a water flow can be generated on the entire surface of the bottom wall 56. As a result, the cutting device 1 can increase the water pressure of the water flow, and even with the same amount of water as in the conventional case, the end materials and cutting chips can be sufficiently flushed, so that the deposition of the end materials and cutting chips on the bottom of the drainage tray 51 can be suppressed.

[0053] Further, since the cutting device 1 according to Embodiment 1 generates a water flow by the water flow generation unit 54 which is a fluid oscillation nozzle, a water flow can be generated even with a simple configuration that does not require a drive unit or the like. Therefore, it is possible to suppress an increase in cost and reduce the risk of failure. In addition, the cutting device 1 according to Embodiment 1 can increase the water pressure of the water flow, and even with the same amount of water as in the conventional case, the end materials and cutting chips can be sufficiently flushed. Therefore, there is no need to increase the amount of water in an attempt to forcibly flush the end materials and cutting chips, which contributes to water conservation.

[0054] As a result, the cutting device 1 according to Embodiment 1 has an effect that it is possible to prevent the deposition of end materials and cutting chips on the bottom of the drainage tray 51 with a simple configuration without increasing the cost.

[0055] Next, the inventors of the present invention confirmed the effects of the cutting device 1 according to Embodiment 1. The results are shown in FIG. 6. Note that FIG. 6 is a diagram showing the results of measuring the water pressure of the water flow generation unit of the cutting device according to the present invention and the water flow of the pipe nozzle of the comparative example. FIG. 7 is a plan view schematically showing the main part of the cutting device of the comparative example.

[0056] As shown in FIG. 7, the comparative example is an example in which water 70 is ejected from a pipe nozzle 300 having both ends attached to the inner wall 57 and the outer wall 58 and provided with a plurality of injection ports 301 in the longitudinal direction. In FIG. 7, the same parts as those in Embodiment 1 are denoted by the same reference numerals and the description thereof is omitted. The product of the present invention is an example in which water 70 is ejected from the water flow generation unit 54 according to Embodiment 1.

[0057] In the pressure measurement whose results are shown in FIG. 6, the flow rate of the supplied water 70 was changed, and the water pressure at a position 30 mm away from the injection port 63 of the water flow generation unit 54 and the injection port 301 of the pipe nozzle 300 was measured with a well-known AE (Acoustic Emission) sensor. In FIG. 6, the horizontal axis represents the flow rate of the supplied water 70, and the vertical axis represents the voltage value which is the measurement result of the AE sensor indicating the pressure of the water 70, that is, the water pressure. Note that the voltage value which is the measurement result of the AE sensor increases as the pressure of the water 70, that is, the water pressure, increases.

[0058] In FIG. 6, for example, when the flow rate of the supplied water 70 is 1.5 L / min, the water pressure of the product of the present invention is about 5 times that of the comparative example. Therefore, according to FIG. 6, by adopting a configuration in which the water 70 is ejected while being swung by the water flow generation unit 54 which is a fluid oscillation nozzle and the end material and the cutting chips are washed away toward the cutting chip storage unit 53, the water pressure of the water flow on the surface of the bottom wall 56 can be increased, and it has become clear that it is possible to prevent the deposition of the end material and the cutting chips on the bottom of the drainage tray 51.

[0059] Note that the present invention is not limited to the above-described embodiment. That is, various modifications can be made and implemented without departing from the gist of the present invention.

Description of Reference Numerals

[0060] 1 Cutting device 10 Holding table 20 Cutting unit 21 Cutting blade 41 X-axis movement unit (cutting feed unit) 50 Discharge unit 51 Drain tray 53 Chip collection unit 54 Water flow generation unit 200 Workpiece 511 Long part (discharge path) X Cutting direction

Claims

1. A holding table for holding a workpiece; A cutting feed unit for reciprocating the holding table in the cutting direction; A cutting unit for cutting the workpiece with a cutting blade while supplying cutting water; A cutting device comprising a discharge unit for receiving cutting chips and cutting water generated by cutting the workpiece and discharging them to the outside, wherein the discharge unit is provided on both sides of the moving path of the holding table, and includes a drainage tray formed in a trough shape with a bottom wall, an inner wall erected from the inner edge of the bottom wall, and an outer wall erected from the outer edge of the bottom wall; a cutting chip storage unit disposed at one end of the drainage tray for storing cutting chips; a water flow generating unit for flushing the cutting chips into the cutting chip storage unit, and the water flow generating unit is a fluid oscillation nozzle installed on the bottom wall and ejecting water while swinging left and right along the bottom wall, characterized in that it is a cutting device.

2. The cutting device according to Claim 1, wherein the water flow generating unit is installed on the bottom wall of each of the drainage channels.

3. The water flow generating unit is disposed on the other end side opposite to the one end side where the cutting chip storage unit of the discharge unit is disposed, characterized in that it is a cutting device according to Claim 1 or Claim 2.

Images