Circuit board, antenna package, and display device

Abstract

The present invention relates to a circuit board, an antenna package, and a display device. The circuit board according to one embodiment includes a core layer including a first region and a second region, and an antenna feed line disposed on the core layer across the first region and the second region, wherein the antenna feed line includes a first portion extending in a first direction over the first region, a second portion extending in a second direction over the first region, and a third portion extending in the first direction over the second region, and a distance between adjacent second portions of the antenna feed line may be three times or less the distance between adjacent third portions of the antenna feed line.

Description

Technical Field

[0001] The present invention relates to a circuit board, an antenna package, and a display device.

Background Art

[0002] In recent years, with the progress of the information society, wireless communication technologies such as Wi-Fi and Bluetooth (registered trademark) have been combined with display devices and realized, for example, in the form of smartphones. In this case, an antenna is coupled to the display device and can execute a communication function.

[0003] Recently, with the evolution of mobile communication technologies, it has been necessary to couple an antenna for performing communication in a high-frequency or ultra-high-frequency band corresponding to, for example, 3G to 5G, to a display device.

[0004] For driving the radiation of the antenna, a circuit board for power supply, transmission of control signals, etc. can be connected to the antenna. The circuit board can be bent, for example, for connection to an antenna drive circuit. In this case, damage to the wiring of the circuit board, poor bonding with the antenna due to bending stress, etc. may occur.

[0005] On the other hand, recently, the thickness of the display device to which the antenna is coupled has been decreasing, and the area of the bezel portion of the display device has a tendency to decrease. Therefore, it is necessary to design a circuit board and an antenna package that can couple the antenna even when the area of the bezel portion is small, while ensuring bonding of the circuit board and circuit connection reliability and maintaining or improving the radiation characteristics of the antenna.

Summary of the Invention

Problems to be Solved by the Invention

[0006] An object of the present invention is to provide a circuit board, an antenna package, and a display device.

Means for Solving the Problems

[0007] 1. A circuit board including a core layer including a first region and a second region, and an antenna power supply wiring disposed on the core layer across the first region and the second region, the antenna power supply wiring including a first portion extending in a first direction on the first region, a second portion extending in a second direction on the first region, and a third portion extending in the first direction on the second region, wherein an interval between adjacent second portions of the antenna power supply wiring is equal to or less than three times an interval between adjacent third portions of the antenna power supply wiring.

[0008] 2. The circuit board according to item 1, wherein an interval between adjacent second portions of the antenna power supply wiring is equal to or more than 0.5 times an interval between adjacent third portions of the antenna power supply wiring.

[0009] 3. The circuit board according to item 1, wherein an interval between adjacent third portions of the antenna power supply wiring is equal to or more than 0.05 mm and equal to or less than 1 mm.

[0010] 4. The circuit board according to item 1, wherein an interval between adjacent third portions of the antenna power supply wiring is equal to or more than 0.1 mm and equal to or less than 0.7 mm.

[0011] 5. The circuit board according to item 1, wherein the first region includes an antenna region where an antenna unit and the antenna power supply wiring are connected, and the second region includes an antenna driving unit region where an antenna driving unit and the antenna power supply wiring are connected.

[0012] 6. The circuit board according to item 1, wherein the antenna power supply wiring is formed to have substantially the same length.

[0013] 7. The circuit board according to item 6, wherein the antenna power supply wiring is formed such that a gain deviation of an antenna unit connected to the antenna power supply wiring is within 1 dBi, or a phase delay difference of the antenna power supply wiring is within 10 degrees.

[0014] 8. An antenna package including the circuit board according to the foregoing embodiment and an antenna unit connected to the antenna power supply wiring of the circuit board.

[0015] 9. A display device including the antenna package according to item 8 above.

Advantages of the Invention

[0016] According to one embodiment, the circuit board can include a core layer including a first region and a second region, and antenna power supply wiring disposed on the core layer across the first region and the second region. At this time, the antenna power supply wiring can be formed such that the interval in the first direction in the first region is within a predetermined multiple of the interval in the second direction in the second region.

[0017] Thereby, while maintaining the independence of the electrical signals applied to each antenna unit to prevent signal interference between the antenna power supply wirings, the length of the circuit board in the first direction of the first region can be shortened. As a result, even if the area of the light-shielding portion or the bezel portion formed on the front surface portion of the display device is small, the antenna package including the circuit board can be easily coupled to the display device.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Modes for Carrying Out the Invention

[0019] Hereinafter, embodiments of the present invention will be described more specifically with reference to the drawings. However, the drawings attached to this specification illustrate preferred embodiments of the present invention and serve to assist in further understanding the technical idea of the present invention together with the detailed description of the invention. Therefore, the present invention is not to be construed as being limited only to the matters described in the drawings.

[0020] Terms such as first, second, etc. are used to describe multiple components, but are used only for the purpose of distinguishing one component from another. Singular expressions include plural expressions unless the context clearly dictates otherwise. Terms such as "including" or "having" indicate the presence of the features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, and do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof in advance.

[0021] Also, directional terms such as "one side", "the other side", "upper part", "lower part", "upper surface", "bottom surface", "first direction", "second direction", etc. are used in relation to the orientation of the disclosed drawings. Since the components of the embodiments of the present invention can be positioned in various orientations, the directional terms are used for illustrative purposes and do not limit them.

[0022] FIG. 1 is a schematic plan view showing an antenna package according to an embodiment, and FIG. 2 is a schematic cross-sectional view showing an antenna package according to an embodiment.

[0023] Referring to FIGS. 1 and 2, an antenna package according to an embodiment can include an antenna element 100 and a circuit board 200.

[0024] The antenna element 100 can include an antenna dielectric layer 110 and an antenna unit 120.

[0025] The antenna dielectric layer 110 can include an insulating material having a predetermined dielectric constant. According to one embodiment, the antenna dielectric layer 110 can include an inorganic insulating material such as glass, silicon oxide, silicon nitride, metal oxide, or an organic insulating material such as epoxy resin, acrylic resin, imide-based resin. The antenna dielectric layer 110 can function as a film base material of the antenna element 100 on which the antenna unit 120 is formed.

[0026] According to one embodiment, the antenna dielectric layer 110 can include polyester-based resins such as polyethylene terephthalate, polyethylene isophthalate, polyethylene naphthalate, polybutylene terephthalate; cellulose-based resins such as diacetyl cellulose, triacetyl cellulose; polycarbonate-based resins; acrylic-based resins such as polymethyl (meth)acrylate, polyethyl (meth)acrylate; styrene-based resins such as polystyrene, acrylonitrile-styrene copolymer; polyolefin-based resins such as polyethylene, polypropylene, polyolefin having a cyclo or norbornene structure, ethylene-propylene copolymer; vinyl chloride-based resins; amide-based resins such as nylon, aromatic polyamide; imide-based resins; polyethersulfone-based resins; sulfone-based resins; polyetheretherketone-based resins; sulfurized polyphenylene-based resins; vinyl alcohol-based resins; vinylidene chloride-based resins; vinyl butyral-based resins; arylate-based resins; polyoxymethylene-based resins; thermoplastic resins such as epoxy resins. These can be used alone or in combination of two or more. Further, a transparent film made of a thermosetting resin or an ultraviolet curable resin such as (meth)acrylic-based, urethane-based, acrylic urethane-based, epoxy-based, or silicone-based can be utilized as the antenna dielectric layer 110.

[0027] According to one embodiment, the antenna dielectric layer 110 can include an adhesive film such as an optically clear adhesive (OCA), an optically clear resin (OCR).

[0028] According to one embodiment, the antenna dielectric layer 110 may be formed of substantially a single layer or may be formed of a multi-layer structure of at least two layers or more.

[0029] The antenna dielectric layer 110 forms capacitance or inductance, and can adjust the frequency band in which the antenna element 100 can be driven or sensed. When the dielectric constant of the antenna dielectric layer 110 exceeds about 12, the driving frequency may drop too much and it may not be possible to achieve driving in the desired high-frequency band. Therefore, according to one embodiment, the dielectric constant of the antenna dielectric layer 110 can be adjusted in the range of about 1.5 to 12, preferably in the range of about 2 to 12.

[0030] The antenna unit 120 can be formed on the upper surface of the antenna dielectric layer 110. For example, a plurality of antenna units 120 can be arranged linearly or non-linearly on the upper surface of the antenna dielectric layer 110 to form an array antenna.

[0031] The antenna unit 120 can include low-resistance metals such as silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium (Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc (Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or alloys containing at least one of these. These can be used alone or in combination of two or more. For example, the antenna unit 120 can include silver (Ag) or a silver alloy (e.g., silver-palladium-copper (APC) alloy) in order to achieve low resistance. As another example, the antenna unit 120 can include copper (Cu) or a copper alloy (e.g., copper-calcium (CuCa) alloy) in consideration of low resistance and patterning of a fine line width.

[0032] According to one embodiment, the antenna unit 120 can include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (ITZO), zinc oxide (ZnOx), or copper oxide (CuO).

[0033] According to one embodiment, the antenna unit 120 can include a stacked structure of a transparent conductive oxide layer and a metal layer. For example, it can have a two-layer structure of a transparent conductive oxide layer - metal layer, or a three-layer structure of a transparent conductive oxide layer - metal layer - transparent conductive oxide layer. In this case, the metal layer can improve the flexible characteristics while reducing the resistance to improve the signal transmission speed, and the transparent conductive oxide layer can improve the corrosion resistance and transparency.

[0034] According to an exemplary embodiment, the antenna unit 120 can include a blackening treatment part. Thereby, the reflectance on the surface of the antenna unit 120 can be reduced, and the visual recognition of the pattern due to light reflection can be reduced.

[0035] According to one embodiment, the surface of the metal layer included in the antenna unit 120 can be converted into a metal oxide or a metal sulfide to form a blackening layer. According to one embodiment, a blackening layer such as a black material coating layer or a plating layer can be formed on the antenna unit 120 or the metal layer. Here, the black material or the plating layer can include silicon, carbon, copper, molybdenum, tin, chromium, nickel, cobalt, or oxides, sulfides, alloys, etc. containing at least one of these.

[0036] The composition and thickness of the blackening layer can be adjusted in consideration of the reflectance reduction effect and the radiation characteristics of the antenna.

[0037] The antenna unit 120 can include a radiator 122 and a transmission line 124.

[0038] The radiator 122 can be formed in a mesh structure. Thereby, the transmittance of the radiator 122 can be increased, and the flexibility of the antenna element 100 can be improved. Therefore, the antenna element 100 can be effectively applied to a flexible display device.

[0039] The size of the radiator 122 can be determined by a desired resonance frequency, radiation resistance, and gain. For example, the antenna unit 120 or the radiator 122 can be realized so as to be capable of transmitting and receiving signals in a resonance frequency band enabling mobile communication such as high frequency or ultra-high frequency (e.g., 3G, 4G, 5G, or higher), Wi-Fi, Bluetooth, NFC, GPS, etc.

[0040] As shown in FIG. 1, the radiator 122 can be rectangular. However, this is only one embodiment, and there is no particular limitation on the shape of the radiator 122. That is, the radiator 122 can be embodied in a plate-like shape of various polygons such as a rhombus or a circle.

[0041] The transmission line 124 can be formed to extend from the radiator 122.

[0042] According to one embodiment, the transmission line 124 may be integrally connected to the radiator 122 and formed of a substantially single member, or may be formed of a member separate from the radiator 122.

[0043] According to one embodiment, the transmission line 124 can be formed in a mesh structure having substantially the same shape as the radiator 122 (e.g., the same line width, the same interval, etc.), but is not limited thereto, and may be formed in a mesh structure having a substantially different shape from the radiator 122.

[0044] The antenna unit 120 can further include a signal pad 126.

[0045] The signal pad 126 is connected to the end of the transmission line 124 and can be electrically connected to the radiator 122 via the transmission line 124. According to one embodiment, the signal pad 126 may be integrally connected to the transmission line 124 and formed of a substantially single member, or may be formed of a member separate from the transmission line 124. For example, the signal pad 126 may be formed of a member substantially integral with the transmission line 124, and the end portion of the transmission line 124 may be provided by the signal pad 126.

[0046] According to one embodiment, a ground pad 128 can be arranged around the signal pad 126. For example, a pair of ground pads 128 can be arranged opposite to each other with the signal pad 126 therebetween. The ground pad 128 can be electrically and physically separated from the signal pad 126 and the transmission line 124 around the signal pad 126.

[0047] According to one embodiment, the signal pad 126 and the ground pad 128 can be formed with a solid structure filled with the aforementioned metal or alloy, considering reduction of feeding resistance, noise absorption efficiency, etc.

[0048] On the other hand, according to one embodiment, a dummy pattern (not shown) can be formed around the radiator 122 and the transmission line 124. The dummy pattern can include the same metal as the radiator 122 and / or the transmission line 124 and can be formed with a mesh structure having substantially the same or different shape from the radiator 122 and / or the transmission line 124.

[0049] Also, according to one embodiment, the antenna element 100 can further include an antenna ground layer 130 formed on the bottom surface of the antenna dielectric layer 110. The antenna ground layer 130 can include the aforementioned metal or alloy. By including the antenna ground layer 130 in the antenna element 100, vertical radiation characteristics can be realized.

[0050] The antenna ground layer 130 can at least partially overlap with the antenna unit 120. For example, the antenna ground layer 130 can entirely overlap with the radiator 122, and may not overlap with the transmission line 124, the signal pad 126, and the ground pad 128. As another example, the antenna ground layer 130 can entirely overlap with the radiator 122 and the transmission line 124, and may not overlap with the signal pad 126 and the ground pad 128. As yet another example, the antenna ground layer 130 can entirely overlap with the radiator 122, the transmission line 124, the signal pad 126, and the ground pad 128.

[0051] According to one embodiment, the conductive member of the display device or the display panel on which the antenna package is mounted can be provided by the antenna ground layer 130. For example, the conductive member can include electrodes or wirings such as gate electrodes, source / drain electrodes, pixel electrodes, common electrodes, data lines, scan lines, etc. of thin film transistors (TFTs) included in the display panel, and SUS (Stainless steel) plates, heat dissipation sheets, digitizers, electromagnetic wave shielding layers, pressure sensors, fingerprint sensors of the display device.

[0052] The circuit board 200 can include a core layer 210 and an antenna power supply wiring 220. According to one embodiment, the circuit board 200 may be a flexible printed circuit board (FPCB).

[0053] The core layer 210 can include, for example, flexible resins such as polyimide resin, MPI (Modified Polyimide), epoxy resin, polyester, cycloolefin polymer (COP), liquid crystal polymer (LCP). The core layer 210 can include an internal insulation layer included in the circuit board 200.

[0054] The core layer 210 can include a first region 210a and a second region 210b. The first region 210a includes an antenna region 211 to which the antenna element 100 is connected, and the second region 210b can include an antenna drive unit region 212 to which the antenna drive unit 300 is connected. The pads 126, 128 of the antenna element 100 can be joined to the core layer 210 via the antenna region 211, and the antenna unit 120 can be connected to the antenna power supply wiring 220. Also, as shown in FIG. 1, the antenna drive unit 300 can be mounted on the core layer 210 via the antenna drive unit region 212, and the antenna drive unit 300 can be connected to the antenna power supply wiring 220. Thereby, power supply and application of a drive signal to the antenna unit 120 can be performed by the antenna drive unit 300 via the antenna power supply wiring 220. On the other hand, according to one embodiment, different from FIG. 1, a connector for connecting the circuit board 200 and another circuit board on which the antenna drive unit is mounted to the antenna drive unit region 212 can also be mounted. In this case, the antenna power supply wiring 220 and the antenna drive unit mounted on another circuit board can be connected by the connector. Also, according to one embodiment, the antenna drive unit region 212 can be formed in a form (for example, FFC (Flexible Flat Cable) or FFC connector (ZIF (Zero Insertion Force) type and Non-ZIF type), etc.) that can be fastened to the connector of another circuit board on which the antenna drive unit is mounted without mounting the antenna drive unit 300 and the connector.

[0055] According to one embodiment, the first region 210a and the second region 210b can have different widths. For example, the first region 210a can have a relatively wider width than the second region 210b, and the first region 210a with the relatively wider width can ensure sufficient bonding stability with the antenna element 100. Also, the second region 210b with the relatively narrow width can improve the flexibility and circuit connection characteristics of the antenna package. For example, the circuit board 200 can be folded at the boundary between the first region 210a and the second region 210b. Thereby, the antenna element 100 and the first region 210a can be disposed on the front surface portion of the display device, and the antenna driving unit 300 and the second region 210b can be disposed on the side surface portion or the back surface portion of the display device.

[0056] The antenna power supply wiring 220 can be disposed on one surface of the core layer 210. For example, the circuit board 220 can be formed on one surface of the core layer 210 and can further include a coverlay film covering the antenna power supply wiring 220. In this case, a part of the coverlay film of the circuit board 200 can be removed to expose one end portion of the antenna power supply wiring 220, and one end portion of the exposed antenna power supply wiring 220 can be joined onto the signal pad 126. More specifically, after attaching a conductive intermediate structure 150 such as an anisotropic conductive film (ACF) onto the signal pad 126 and the ground pad 128, the antenna region 211 of the circuit board 200 where one end portion of the exposed antenna power supply wiring 220 is located can be disposed on the conductive intermediate structure 150. Thereafter, the antenna region 211 of the circuit board 200 can be attached to the antenna element 100 by a heat treatment / pressurization process, and the antenna power supply wiring 220 can be electrically connected to each signal pad 126. Also, by arranging the ground pad 128 around the signal pad 126, the adhesion with the anisotropic conductive film (ACF) can be increased, and the bonding stability can be improved.

[0057] The antenna power supply wiring 220 can be connected independently of each of the antenna units 120. Thereby, power supply / drive control can be performed independently for each of the antenna units 120. For example, different phase signals can be applied to each of the antenna units 120 by the antenna power supply wiring 220 connected to each of the antenna units 120.

[0058] The antenna power supply wiring 220 can be formed across the first region 210a and the second region 210b. For example, the antenna power supply wiring 220 can be formed to extend from the antenna region 211 toward the antenna drive unit region 212.

[0059] The antenna power supply wiring 220 can be formed to have substantially the same length. Here, having substantially the same length includes not only the case where the lengths are exactly the same, but also the case where the lengths are not exactly the same due to process problems but satisfy a predetermined condition. At this time, the predetermined condition may be that the gain deviation of the antenna unit 120 connected to the antenna power supply wiring 220 is within 1 dBi, and / or the phase delay difference of the antenna power supply wiring 220 is within 10 degrees.

[0060] The antenna power supply wiring 220 can be bent once or more in the first region 210a. Thereby, the antenna power supply wiring 220 having substantially the same length can be arranged in a limited region. For example, the antenna power supply wiring 220 can include one or more first portions 220a extending from the first region 210a in the first direction (for example, the y direction in FIG. 1), one or more second portions 220b extending from the first region 210a in the second direction (for example, the x direction in FIG. 1), and a third portion 220c extending from the second region 210b in the first direction (for example, the y direction in FIG. 1).

[0061] According to one embodiment, the distance a between adjacent second portions 220b of the antenna power supply wiring 220 may be 0.5 times or more and 3 times or less the distance b between adjacent third portions 220c of the antenna power supply wiring 220. At this time, the distance b between adjacent third portions 220c of the antenna power supply wiring 220 may be 0.05 mm or more and 1 mm or less, preferably 0.1 mm or more and 0.7 mm or less. By forming the distance a between adjacent second portions 220b of the antenna power supply wiring 220 to be 0.5 times or more and 3 times or less the distance b between adjacent third portions 220c of the antenna power supply wiring 220, the independence of the electrical signals applied to each antenna unit 120 is maintained to prevent signal interference between the antenna power supply wirings 220, and the length of the first region 210a in the first direction (for example, the y direction in FIG. 1) can be shortened. Thereby, even if the area of the light shielding portion or the bezel portion formed on the front surface portion of the display device is small, the first region 210a can be arranged in the light shielding portion or the bezel portion of the display device.

[0062] According to one embodiment, the ground layer 230 can be disposed on the other surface of the core layer 210.

[0063] The ground layer 230 can overlap with the antenna power supply wiring 220. The ground layer 230 can absorb or shield noise and signal interference around the antenna power supply wiring 220. Also, the ground layer 230 can promote the generation of an electric field from the antenna power supply wiring 220 and improve the signal transmission efficiency.

[0064] On the other hand, according to one embodiment, the aforementioned antenna power supply wiring 220 and ground layer 230 can include the aforementioned metal or alloy.

[0065] FIG. 3 is a schematic plan view showing an antenna package according to another embodiment. Referring to FIG. 3, the circuit board 200 can include bonding pads 225 formed around the antenna power supply wiring 220. The bonding pads 225 may be included in the antenna region 211 of the circuit board 200.

[0066] The bonding pads 225 can be formed on one surface of the core layer 210 together with the antenna power supply wiring 220. For example, a pair of bonding pads 225 can be arranged with one antenna power supply wiring 220 interposed therebetween.

[0067] The bonding pads 225 are electrically and physically separated from the antenna power supply wiring 220 and can be joined to the ground pad 128 of the antenna element 100 via a conductive intermediate structure 150 (see FIG. 2). Since the bonding pads 225 are included in the antenna region 211 of the circuit board 200, the bonding stability between the antenna element 100 and the circuit board 200 can be further improved.

[0068] FIG. 4 is a schematic plan view showing a display device according to an embodiment. More specifically, FIG. 4 is a view showing the front portion or the window surface of the display device.

[0069] Referring to FIG. 4, the front portion of the display device 400 can include a display region 410 and a peripheral region 420. The display region 410 indicates a region where visual information is displayed, and the peripheral region 420 can indicate an opaque region disposed on both side portions and / or both end portions of the display region 410. For example, the peripheral region 420 can correspond to a light-shielding portion or a bezel portion of the display device 400.

[0070] The aforementioned antenna element 100 can be arranged facing the front portion of the display device 400, for example, on the display panel. In one embodiment, the radiator 122 and / or the transmission line 124 can at least partially overlap with the display region 410.

[0071] In this case, the radiator 122 and / or the transmission line 124 can form a mesh structure, and a decrease in the transmittance due to the radiator 122 and / or the transmission line 124 can be prevented.

[0072] The circuit board 200 can be disposed in the peripheral region 420 in order to prevent a deterioration in image quality in the display region 410. According to one embodiment, the circuit board 200 can be folded at the boundary portion between the first region 210a and the second region 210b. As a result, the first region 210a can be disposed in the peripheral region 420 of the display device, and the antenna driving unit 300 and the second region 210b can also be disposed on a side surface portion or a back surface portion of the display device.

[0073] As described above, by forming the interval in the first direction in the first region 210a of the antenna power supply wiring 220 within a predetermined multiple of the interval in the second direction in the second region 210b, the independence of the electrical signals applied to each antenna unit 120 is maintained, signal interference between the antenna power supply wirings 220 is prevented, and the length of the first region 210a in the first direction can be shortened. Thereby, even if the area of the light shielding portion or the bezel portion formed on the front surface portion of the display device is small, it is possible to dispose the first region 210a in the light shielding portion or the bezel portion of the display device.

[0074] As described above, the present invention has been described mainly with reference to the preferred embodiments. Those having ordinary knowledge in the technical field to which the present invention pertains will be able to understand that the present invention can be implemented in a modified form without departing from the essential characteristics of the invention. Therefore, the scope of the present invention is not limited to the above-described embodiments, and it should be construed that the present invention includes various embodiments within the scope equivalent to the content shown in the claims.

[0075] [Experimental Example: Evaluation of the signal transmission rate of the antenna power supply wiring based on the ratio of the interval a between adjacent second portions and the interval b between adjacent third portions in the antenna power supply wiring] An antenna package having the form shown in FIG. 1 was formed. The signal transmission rate of the antenna power supply wiring was evaluated while adjusting the ratio of the interval a between adjacent second portions 220b of the antenna power supply wiring 220 to the interval b between adjacent third portions 220c of the antenna power supply wiring 220.

[0076]

Table 1

[0077] Referring to Table 1, unlike the comparative examples where the ratio of the interval a between the adjacent second portions 220b of the antenna power supply wiring 220 to the interval b between the adjacent third portions 220c of the antenna power supply wiring 220 is 0.2 and 3.5, in the examples where it is 0.5 to 3, it can be confirmed that the signal transmission rate in the antenna power supply wiring is excellent.

Claims

1. A core layer including a first region and a second region, and an antenna power supply wiring disposed on the core layer across the first region and the second region, wherein the antenna power supply wiring includes a first portion extending in a first direction on the first region, a second portion extending in a second direction perpendicular to the first direction on the first region, and a third portion extending in the first direction on the second region, and a circuit board, wherein a distance between adjacent second portions of the antenna power supply wiring is equal to or less than three times a distance between adjacent third portions of the antenna power supply wiring.

2. The circuit board according to claim 1, wherein the distance between adjacent second portions of the antenna power supply wiring is equal to or greater than 0.5 times the distance between adjacent third portions of the antenna power supply wiring.

3. The circuit board according to claim 1, wherein the distance between adjacent third portions of the antenna power supply wiring is equal to or greater than 0.05 mm and equal to or less than 1 mm.

4. The circuit board according to claim 1, wherein the distance between adjacent third portions of the antenna power supply wiring is equal to or greater than 0.1 mm and equal to or less than 0.7 mm.

5. The first region includes an antenna region where an antenna unit and the antenna power supply wiring are connected, and the circuit board according to claim 1, wherein the second region includes an antenna driving unit region where an antenna driving unit and the antenna power supply wiring are connected.

6. The circuit board according to claim 1, wherein the antenna power supply wiring is formed to have substantially the same length.

7. The circuit board according to claim 6, wherein the antenna power supply wiring is formed such that a gain deviation of an antenna unit connected to the antenna power supply wiring is within 1 dBi, or a phase delay difference of the antenna power supply wiring is within 10 degrees.

8. An antenna package including the circuit board according to claim 1 and an antenna unit connected to the antenna power supply wiring of the circuit board.

9. A display device including the antenna package according to claim 8.

Images