Transfer mechanism and processing device

Abstract

To provide a conveyance mechanism that makes it possible to check the state of a workpiece in a timely manner during conveyance.SOLUTION: The conveyance mechanism conveys a workpiece and includes a holding unit that holds a workpiece, a moving mechanism that moves the holding unit to position it at a predetermined location, and a level that measures a value corresponding to the magnitude of an inclination of the workpiece held by the holding unit with respect to the horizontal direction.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a transport mechanism for transporting a workpiece and a processing apparatus including the transport mechanism.

Background Art

[0002] By dividing a wafer on which a plurality of devices are formed into individual pieces, a plurality of device chips each including a device are manufactured. Further, by mounting a plurality of device chips on a predetermined substrate and covering the mounted device chips with a sealing material (mold resin) made of resin, a package substrate is obtained. By dividing this package substrate into individual pieces, a plurality of package devices each including a plurality of packaged device chips are manufactured. Device chips and package devices are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] A cutting device is used for dividing a wafer or a package substrate. The cutting device includes a chuck table for holding a workpiece and a cutting unit for performing cutting on the workpiece. An annular cutting blade for cutting the workpiece is attached to the cutting unit. By rotating the cutting blade and cutting into the workpiece, the workpiece is cut and divided.

[0004] In recent years, with the miniaturization of electronic devices, there has been a demand for thinning of device chips and package devices. Therefore, a method of thinning a wafer or a package substrate by performing grinding on the wafer or the package substrate before division may be used.

[0005] For grinding wafers and package substrates, a grinding device is used. The grinding device includes a chuck table for holding the workpiece and a grinding unit for performing grinding on the workpiece. An annular grinding wheel including a grinding stone for grinding the workpiece is mounted on the grinding unit. With the chuck table and the grinding wheel rotated, the grinding stone is brought into contact with the workpiece, whereby the workpiece is ground and thinned.

[0006] Various processing devices typified by cutting devices and grinding devices are equipped with a transfer mechanism for transferring the workpiece. For example, Patent Document 1 discloses a cutting device including a chuck table for holding a wafer and a cleaning unit (cleaning means) for cleaning the wafer, and equipped with a transfer mechanism for transferring the wafer between the chuck table and the cleaning unit. In this cutting device, the wafer after cutting is automatically transferred from the chuck table to the cleaning unit by the transfer mechanism, and the processing and cleaning of the wafer are continuously performed.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] When the workpiece is transferred by the transfer mechanism mounted on the processing device, if the workpiece tilts, it may cause inconvenience in the transfer operation and the state of the workpiece. For example, if the workpiece is placed at the transfer destination in a tilted state, there is a risk of displacement or damage to the workpiece when it lands.

[0009] During the machining of the workpiece, a liquid such as pure water (coolant) is supplied to the workpiece and the machining tool (cutting blade, grinding wheel, etc.), the workpiece and the machining tool are cooled, and the chips (machining chips) generated by the machining are washed away. Then, when the machined workpiece is conveyed from the chuck table to the cleaning unit with the coolant adhering thereto, drying of the workpiece during conveyance is prevented, and it is possible to prevent foreign matters such as residues of machining chips from firmly adhering to the workpiece. However, if the workpiece tilts during conveyance, the coolant adhering to the upper surface side of the workpiece will flow down, and foreign matters are likely to adhere due to drying of the workpiece.

[0010] Therefore, the conveyance mechanism is configured to hold and convey the workpiece while keeping it horizontal. However, due to deterioration of the components constituting the conveyance mechanism, variations in the weight of the workpiece, etc., the workpiece held by the conveyance mechanism may accidentally tilt. In this case, the operator of the processing apparatus will notice that the workpiece is tilted only after an abnormality (such as adhesion of foreign matter, damage, etc.) of the workpiece has occurred. As a result, there is a problem that the timing for performing maintenance such as adjustment and repair of the conveyance mechanism is delayed, and the number of defective products increases.

[0011] The present invention has been made in view of such problems, and an object thereof is to provide a conveyance mechanism capable of timely checking the state of the workpiece during conveyance, and a processing apparatus including the conveyance mechanism.

Means for Solving the Problems

[0013] This Invention one According to an aspect, a processing apparatus for processing a workpiece includes a chuck table that holds the workpiece, a processing unit that processes the workpiece held by the chuck table, a cleaning unit that cleans the processed workpiece, a conveyance mechanism that conveys the workpiece between the chuck table and the cleaning unit, a notification unit, and a control unit. The conveyance mechanism includes a holding unit that holds the workpiece, and a moving mechanism that moves the holding unit and positions it at a predetermined position. where the workpiece isHeld by the holding part in the state A level for measuring a value corresponding to the magnitude of the inclination of the workpiece with respect to the horizontal direction, and the control unit causes the notification unit to notify an error when the value measured by the level is an abnormal value. A processing apparatus is provided 。

Advantages of the Invention

[0014] The transport mechanism according to one aspect of the present invention includes a level for measuring a value corresponding to the magnitude of the inclination of the workpiece held by the holding part with respect to the horizontal direction. Thereby, the inclination during the transport of the workpiece can be recognized before an abnormality (such as adhesion of foreign matter, damage, etc.) occurs in the workpiece, and it becomes possible to perform maintenance of the transport mechanism in a timely manner

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

Embodiments for Carrying Out the Invention

[0016] Hereinafter, an embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. First, a configuration example of the processing apparatus according to the present embodiment will be described. FIG. 1 is a perspective view showing a processing apparatus 2. The processing apparatus 2 is a cutting apparatus that processes a workpiece with an annular cutting blade. In FIG. 1, the X-axis direction (processing feed direction, first horizontal direction, front-rear direction) and the Y-axis direction (indexing feed direction, second horizontal direction, left-right direction) are perpendicular to each other. Also, the Z-axis direction (vertical direction, up-down direction, height direction) is perpendicular to the X-axis direction and the Y-axis direction

[0017] The processing device 2 includes a base 4 that supports or houses each component constituting the processing device 2. At the front corner of the base 4, a rectangular opening 4a that opens on the upper surface side of the base 4 is formed. Further, on the side of the opening 4a, a rectangular opening 4b that opens on the upper surface side of the base 4 and whose longitudinal direction is along the X-axis direction is formed.

[0018] Inside the opening 4a, a cassette mounting table 6 is provided. A lifting mechanism (not shown) is connected to the cassette mounting table 6, and this lifting mechanism raises and lowers the cassette mounting table 6 along the Z-axis direction. On the upper surface of the cassette mounting table 6, a cassette 8 capable of accommodating a plurality of workpieces 11 to be processed by the processing device 2 is placed. In FIG. 1, only the outline of the cassette 8 is shown by a dashed line.

[0019] FIG. 2 is a perspective view showing the workpiece 11. For example, the workpiece 11 is a disk-shaped wafer made of a semiconductor such as silicon, and includes surfaces 11a and 11b that are generally parallel to each other. The workpiece 11 is partitioned into a plurality of rectangular regions by a plurality of streets (division planned lines) 13 arranged in a grid pattern so as to intersect each other. Further, in each region partitioned by the streets 13 on the surface 11a side of the workpiece 11, devices 15 such as IC (Integrated Circuit), LSI (Large Scale Integration), LED (Light Emitting Diode), and MEMS (Micro Electro Mechanical Systems) devices are formed.

[0020] For example, the workpiece 11 is divided along the street 13 by the processing device 2 (see FIG. 1). As a result, a plurality of device chips each including a device 15 are manufactured. However, there are no restrictions on the material, shape, structure, size, etc. of the workpiece 11. For example, the workpiece 11 may be a substrate (wafer) made of a semiconductor other than silicon (such as GaAs, InP, GaN, SiC, etc.), sapphire, glass (such as quartz glass, borosilicate glass, etc.), ceramics, resin, or the like. Further, there are no restrictions on the type, quantity, shape, structure, size, arrangement, etc. of the device 15, and the device 15 may not be formed on the workpiece 11.

[0021] When the workpiece 11 is cut by the processing device 2, a tape (dicing tape) 17 is attached to the workpiece 11. For example, the tape 17 includes a film-shaped base material formed in a circular shape and an adhesive layer (paste layer) provided on the base material. The base material is made of a resin such as polyolefin, polyvinyl chloride, polyethylene terephthalate, or the like. Further, the adhesive layer is made of an epoxy-based, acrylic-based, or rubber-based adhesive or the like. Note that the adhesive layer may be an ultraviolet curable resin that is cured by irradiation with ultraviolet rays.

[0022] The outer peripheral portion of the tape 17 is attached to an annular frame 19 made of a metal such as SUS (stainless steel). A circular opening 19a that penetrates the frame 19 in the thickness direction is provided at the central portion of the frame 19. The opening 19a is formed to have a size such that the workpiece 11 can be disposed inside the opening 19a, and the diameter of the opening 19a is larger than the diameter of the workpiece 11. Further, the tape 17 is formed to have a size capable of covering the entire opening 19a of the frame 19, and the diameter of the tape 17 is larger than the diameter of the opening 19a.

[0023] With the workpiece 11 disposed inside the opening 19a, the central portion of the tape 17 is attached to the back surface 11b side of the workpiece 11, and the outer peripheral portion of the tape 17 is attached to the frame 19. As a result, the workpiece 11 is supported by the frame 19 via the tape 17.

[0024] As shown in Fig. 1, a ball screw type moving mechanism (moving unit) 10 is provided inside the opening 4b of the base 4. A chuck table (holding table) 12 for holding the workpiece 11 is connected to the moving mechanism 10. The moving mechanism 10 includes a table cover 10a that covers the periphery of the chuck table 12. Further, bellows-shaped dust and splash covers 14 that can expand and contract along the X-axis direction are provided in front of and behind the table cover 10a so as to cover the components of the moving mechanism 10.

[0025] The upper surface of the chuck table 12 is a flat surface substantially parallel to the X-axis direction and the Y-axis direction, and constitutes a holding surface 12a for holding the workpiece 11. The holding surface 12a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), etc. formed inside the chuck table 12. Further, a plurality of clamps 16 for gripping and fixing a frame 19 that supports the workpiece 11 are provided around the chuck table 12.

[0026] The moving mechanism 10 moves the chuck table 12 along the X-axis direction together with the table cover 10a. A rotary drive source (not shown) such as a motor is connected to the chuck table 12, and this rotary drive source rotates the chuck table 12 around a rotation axis substantially parallel to the Z-axis direction.

[0027] Above the front end of the opening 4b, a pair of guide rails 18 are provided. The pair of guide rails 18 includes a support surface that supports the lower surface side of the frame 19 and a side surface that is substantially perpendicular to the support surface and contacts the outer peripheral edge of the frame 19, and approaches and separates from each other while maintaining a state substantially parallel to the Y-axis direction. The pair of guide rails 18 aligns the positions of the workpiece 11 and the frame 19 by sandwiching the frame 19 along the X-axis direction.

[0028] On the upper surface of the base 4, a gate-shaped first support structure 20 is arranged so as to straddle the opening 4b. On the front side (guide rail 18 side) of the first support structure 20, a guide rail 22 is fixed along the Y-axis direction. A transport mechanism (transport unit) 24 for transporting the workpiece 11 is mounted on the guide rail 22.

[0029] The transport mechanism 24 includes a moving mechanism 26 connected to the guide rail 22 and a holding part (holding mechanism) 28 connected to the moving mechanism 26. The moving mechanism 26 moves the holding part 28 along the Y-axis direction and the Z-axis direction and positions the holding part 28 at a predetermined position. Further, the holding part 28 holds the workpiece 11 and the frame 19.

[0030] Specifically, the moving mechanism 26 has a nut part (not shown), and this nut part is screwed onto a ball screw (not shown) provided along the guide rail 22. Further, a pulse motor (not shown) is connected to an end of the ball screw. When the ball screw is rotated by the pulse motor, the moving mechanism 26 moves along the guide rail 22, and the holding part 28 connected to the moving mechanism 26 moves along the Y-axis direction.

[0031] Also, an air cylinder is built in the moving mechanism 26. The air cylinder includes a rod that moves up and down along the Z-axis direction, and the holding part 28 is fixed to the lower end of the rod. When the rod of the air cylinder is moved up and down, the holding part 28 moves along the Z-axis direction.

[0032] For example, the holding part 28 includes a plurality of suction pads for holding the frame 19. The lower surface of the suction pad constitutes a suction surface for sucking and holding the upper surface side of the frame 19. The suction surface of the suction pad is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), etc. formed inside the suction pad. Further, a gripping part (gripping mechanism) 28a for gripping the frame 19 is provided at the tip of the holding part 28 on the opening 4a side (cassette 8 side).

[0033] The holding unit 28 moves along the Y-axis direction away from the cassette 8 while gripping the frame 19 housed in the cassette 8 with the gripping part 28a. Thereby, the workpiece 11 is carried out of the cassette 8 together with the frame 19 and is placed on the pair of guide rails 18. Further, the holding unit 28 sucks and holds the upper surface side of the frame 19 arranged on the pair of guide rails 18 by a plurality of suction pads, and conveys the workpiece 11 together with the frame 19 to the chuck table 12. Furthermore, the holding unit 28 moves along the Y-axis direction so as to approach the cassette 8 while gripping the frame 19 arranged on the pair of guide rails 18 with the gripping part 28a. Thereby, the workpiece 11 is carried into and housed in the cassette 8 together with the frame 19.

[0034] Also, a guide rail 30 is fixed along the Y-axis direction on the front side of the first support structure 20. A transport mechanism (transport unit) 32 for transporting the workpiece 11 is mounted on the guide rail 30. The transport mechanism 32 includes a movement mechanism 34 connected to the guide rail 30 and a holding part (holding mechanism) 36 connected to the movement mechanism 34. The movement mechanism 34 moves the holding part 36 along the Y-axis direction and the Z-axis direction, and positions the holding part 36 at a predetermined position. Also, the holding part 36 holds the workpiece 11 and the frame 19.

[0035] Specifically, the movement mechanism 34 has a nut part (not shown), and this nut part is screwed onto a ball screw (not shown) provided along the guide rail 30. Also, a pulse motor (not shown) is connected to the end of the ball screw. When the ball screw is rotated by the pulse motor, the movement mechanism 34 moves along the guide rail 30, and the holding part 36 connected to the movement mechanism 34 moves along the Y-axis direction.

[0036] Also, an air cylinder is built in the movement mechanism 34. The air cylinder includes a rod that moves up and down along the Z-axis direction, and the holding part 36 is fixed to the lower end of the rod. When the rod of the air cylinder is moved up and down, the holding part 36 moves along the Z-axis direction.

[0037] FIG. 3 is a perspective view showing the transport mechanism 32. The transport mechanism 32 includes a support member 38 that supports the holding portion 36. The support member 38 includes a support portion 40 connected to the holding portion 36 and a columnar arm portion 42 that supports the support portion 40.

[0038] For example, the support portion 40 is formed in a rectangular parallelepiped shape and includes an upper surface 40a and a lower surface 40b that are disposed generally parallel to the horizontal direction (XY plane direction). Also, for example, the arm portion 42 is formed in a rectangular parallelepiped shape and is disposed such that the height direction is along the Z-axis direction. The lower end side of the arm portion 42 is connected to an end portion on the upper surface 40a side of the support portion 40, and the upper end side of the arm portion 42 is connected to the moving mechanism 34 (see FIG. 1).

[0039] The holding portion 36 is fixed to the lower surface 40b side of the support portion 40. The holding portion 36 includes a frame body 44 and a plurality of suction pads 46 attached to the frame body 44. For example, the frame body 44 is a plate-like member formed in an H shape in plan view and is disposed generally parallel to the horizontal direction. The suction pads 46 are attached to the corners (four corners) of the frame body 44, respectively.

[0040] The lower surface of the suction pad 46 constitutes a suction surface 46a that suctions the frame 19 that supports the workpiece 11. The suction surface 46a is made of a flexible elastic member such as rubber or resin, for example, and is disposed generally parallel to the horizontal direction. Also, the suction surface 46a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), etc. formed inside the suction pad 46.

[0041] Further, the transport mechanism 32 includes a level 48 that measures a value (levelness) corresponding to the magnitude of the inclination of the workpiece 11 (frame 19) held by the holding portion 36 in the horizontal direction. For example, the level 48 is fixed to the upper surface 40a side of the support portion 40 and measures the inclination angle of the upper surface 40a of the support portion 40 with respect to the horizontal direction. Thereby, the inclination angles of the workpiece 11 and the frame 19 held by the plurality of suction surfaces 46a that are generally parallel to the upper surface 40a of the support portion 40 are indirectly measured.

[0042] Note that there is no limitation on the type of the level 48. For example, as the level 48, a bubble tube level, a disk level, a laser level, etc. can be used. Further, the level 48 may be a digital level capable of displaying or outputting a measured value.

[0043] In addition, the installation location of the level 48 is not limited as long as the level 48 can measure the flatness of the workpiece 11. For example, the level 48 may be fixed to the lower surface 40b side of the support portion 40, the side surface of the arm portion 42, the upper surface side of the frame body 44, or the lower surface side of the frame body 44.

[0044] As shown in FIG. 1, behind the first support structure 20, a gate-shaped second support structure 50 is arranged so as to straddle the opening 4b. A pair of ball screw type moving mechanisms 52a and 52b are fixed to both side ends on the front surface side (the first support structure 20 side) of the second support structure 50. A processing unit (cutting unit) 54a for cutting the workpiece 11 with an annular cutting blade 56 is fixed to the lower part of the moving mechanism 52a. Further, a processing unit (cutting unit) 54b for cutting the workpiece 11 with an annular cutting blade 56 is fixed to the lower part of the moving mechanism 52b.

[0045] By moving the processing unit 54a along the Y-axis direction and the Z-axis direction by the moving mechanism 52a, the positions of the cutting blade 56 mounted on the processing unit 54a in the Y-axis direction and the Z-axis direction are adjusted. Similarly, by moving the processing unit 54b along the Y-axis direction and the Z-axis direction by the moving mechanism 52b, the positions of the cutting blade 56 mounted on the processing unit 54b in the Y-axis direction and the Z-axis direction are adjusted.

[0046] The processing units 54a and 54b include a cylindrical spindle (not shown) arranged along the Y-axis direction. A cutting blade 56 is mounted on the tip end portion (one end side) of the spindle, and a rotation drive source (not shown) such as a motor is connected to the base end portion (the other end side) of the spindle. When the spindle is rotated by the rotation drive source, the cutting blade 56 fixed to the spindle rotates around a rotation axis substantially parallel to the Y-axis direction.

[0047] The cutting blade 56 is a processing tool that cuts into the workpiece 11 to cut the workpiece 11. For example, as the cutting blade 56, a hub-type cutting blade (hub blade) configured by integrating an annular base made of metal or the like and an annular cutting edge formed along the outer peripheral edge of the base is used. The cutting edge of the hub blade is composed of an electroformed grinding wheel in which abrasive grains made of diamond, cubic boron nitride (cBN), or the like are fixed by a binder such as a nickel plating layer. Further, as the cutting blade 56, a washer-type cutting blade (washer blade) composed of an annular cutting edge in which abrasive grains are fixed by a binder made of metal, ceramics, resin, or the like can also be used.

[0048] The processing device 2 is a so-called facing dual spindle type cutting device that includes two sets of processing units 54a and 54b, and a pair of cutting blades 56 are arranged to face each other. However, the number of processing units provided in the processing device 2 may be one set.

[0049] Imaging units (cameras) 58 for imaging the workpiece 11 and the like held by the chuck table 12 are provided at positions adjacent to the processing units 54a and 54b, respectively. For example, the imaging unit 58 is composed of a visible light camera including an image sensor that receives visible light and converts it into an electrical signal, an infrared camera including an image sensor that receives infrared light and converts it into an electrical signal, or the like. Based on the image acquired by the imaging unit 58, alignment between the workpiece 11 held by the chuck table 12 and the processing units 54a and 54b is performed.

[0050] A cleaning unit 60 is provided on the side opposite to the opening 4a of the opening 4b. The cleaning unit 60 includes a spinner table 62 that holds the workpiece 11 in a cylindrical cleaning space. The upper surface of the spinner table 62 is a flat surface substantially parallel to the X-axis direction and the Y-axis direction, and constitutes a holding surface 62a for holding the workpiece 11.

[0051] The holding surface 62a is connected to a suction source (not shown), such as an ejector, via a flow path (not shown) formed inside the chuck table 12, a valve (not shown), etc. Further, a rotary drive source (not shown) for rotating the spinner table 62 around a rotation axis substantially parallel to the Z-axis direction is connected to the spinner table 62.

[0052] Above the spinner table 62, a nozzle 64 for supplying a cleaning fluid (cleaning liquid) toward the workpiece 11 held by the spinner table 62 is disposed. As the cleaning fluid, for example, a mixed fluid in which a liquid such as pure water and a gas such as air are mixed can be used. By holding the workpiece 11 by the spinner table 62 and supplying the cleaning fluid from the nozzle 64 while rotating the spinner table 62, the workpiece 11 is cleaned.

[0053] The transfer mechanism 32 transfers the workpiece 11 between the chuck table 12 and the cleaning unit 60, and between the cleaning unit 60 and the pair of guide rails 18. Specifically, the workpiece 11 processed by the processing units 54a and 54b is transferred from above the chuck table 12 onto the spinner table 62 by the transfer mechanism 32. Further, the workpiece 11 cleaned by the cleaning unit 60 is transferred from above the spinner table 62 onto the pair of guide rails 18 by the transfer mechanism 32.

[0054] On the upper side of the base 4, a cover 66 for covering each component disposed on the base 4 is provided. In FIG. 1, only the contour of the cover 66 is shown by a broken line. Further, on the side surface of the cover 66, a display unit (display portion, display device) 68 for displaying various information regarding the processing apparatus 2 is provided.

[0055] For example, a touch panel type display is used as the display unit 68. In this case, the display unit 68 also functions as an input unit (input unit, input device) for inputting information to the processing apparatus 2. Then, the operator can input information such as processing conditions to the processing apparatus 2 by touch-operating the display unit 68.

[0056] A notification unit (notification section) 70 for notifying the operator of predetermined information is provided on the upper surface of the cover 66. For example, a warning lamp is used as the notification unit 70. When an abnormality occurs in the processing apparatus 2, the notification unit 70 lights up in a predetermined color or pattern to notify the operator of an error. Note that, as the notification unit 70, a speaker or the like that emits a sound or voice for notifying predetermined information can also be used.

[0057] Each component (cassette mounting table 6, moving mechanism 10, chuck table 12, clamp 16, transfer mechanism 24, transfer mechanism 32, moving mechanisms 52a, 52b, processing units 54a, 54b, imaging unit 58, cleaning unit 60, display unit 68, notification unit 70, etc.) constituting the processing apparatus 2 is connected to a control unit (control section, control device) 72. The control unit 72 generates a control signal for controlling the operation of each component of the processing apparatus 2.

[0058] For example, the control unit 72 is constituted by a computer and includes a processing section that performs various processes (such as calculations) necessary for the operation of the processing apparatus 2, and a storage section that stores various information (data, programs, etc.) used for the operation of the processing apparatus 2. The processing section is constituted to include a processor such as a CPU (Central Processing Unit). Further, the storage section is constituted to include memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0059] When machining the workpiece 11 using the machining apparatus 2, first, the cassette 8 containing the workpiece 11 is placed on the cassette mounting table 6. Then, the workpiece 11 is carried out of the cassette 8 by the transfer mechanism 24. Specifically, the end of the frame 19 accommodated in the cassette 8 is gripped by the gripping portion 28a of the holding portion 28, and the workpiece 11 and the frame 19 are pulled out from the cassette 8 onto the pair of guide rails 18.

[0060] Next, the frame 19 is sandwiched by the pair of guide rails 18, and the workpiece 11 and the frame 19 are aligned. Thereafter, the holding portion 28 sucks and holds the upper surface side of the frame 19, and conveys the workpiece 11 and the frame 19 to the chuck table 12.

[0061] The workpiece 11 is disposed on the holding surface 12a of the chuck table 12 via the tape 17. Also, the frame 19 is fixed by a plurality of clamps 16. In this state, when the negative pressure of the suction source is applied to the holding surface 12a, the workpiece 11 is sucked and held by the chuck table 12 via the tape 17.

[0062] Then, the workpiece 11 is machined by the cutting blade 56 attached to the machining unit 54a or the machining unit 54b. By cutting into the workpiece 11 while rotating the cutting blade 56, the workpiece 11 is subjected to cutting. For example, the cutting blade 56 cuts into the workpiece 11 along the street 13 (see FIG. 2) with a cutting depth exceeding the thickness of the workpiece 11. Thereby, the workpiece 11 is divided along the street 13, and a plurality of device chips each including the device 15 are obtained.

[0063] During the machining of the workpiece 11, a liquid (processing liquid) such as pure water is supplied to the workpiece 11 and the cutting blade 56. Thereby, the workpiece 11 and the cutting blade 56 are cooled, and the chips (processing chips) generated by the cutting are washed away.

[0064] When the cutting of the workpiece 11 is completed, the workpiece 11 and the frame 19 are conveyed from the chuck table 12 to the cleaning unit 60 by the conveying mechanism 32. Specifically, first, the holding portion 36 is moved along the Y-axis direction by the moving mechanism 34 and positioned directly above the workpiece 11 held by the chuck table 12. Then, the holding portion 36 is lowered by the moving mechanism 34, and the suction surfaces 46a of the suction pads 46 (see FIG. 3) come into contact with the upper surface of the frame 19 respectively. In this state, when a suction force (negative pressure) is applied to the suction surface 46a, the workpiece 11 and the frame 19 are suction-held by the holding portion 36.

[0065] Then, the suction of the workpiece 11 by the chuck table 12 is released, and the holding portion 36 is raised by the moving mechanism 34. As a result, the workpiece 11 is conveyed from above the chuck table 12.

[0066] Next, the holding portion 36 is moved along the Y-axis direction by the moving mechanism 34 and positioned directly above the spinner table 62 of the cleaning unit 60. Then, the holding portion 36 is lowered by the moving mechanism 34, and the workpiece 11 is placed on the spinner table 62. After that, the suction of the workpiece 11 by the plurality of suction pads (see FIG. 3) is released, and the workpiece 11 is suction-held by the holding surface 62a of the spinner table 62.

[0067] While the workpiece 11 is held by the spinner table 62, when the cleaning fluid is supplied from the nozzle 64 while rotating the spinner table 62, the workpiece 11 is cleaned. As a result, foreign matters such as machining chips attached to the workpiece 11 are washed away.

[0068] When the cleaning of the workpiece 11 is completed, the workpiece 11 is conveyed onto the pair of guide rails 18 by the conveying mechanism 32. Then, after the alignment of the workpiece 11 and the frame 19 is performed by the pair of guide rails 18, the workpiece 11 and the frame 19 are housed in the cassette 8 by the conveying mechanism 24. In this way, the machining of the workpiece 11 by the machining apparatus 2 is performed.

[0069] Here, when the workpiece 11 is conveyed by the conveying mechanism 32, if the workpiece 11 tilts, it may cause inconvenience to the conveying operation and the state of the workpiece 11. For example, when the workpiece 11 is placed on the conveying destination (such as the spinner table 62, the guide rail 18, etc.) in a tilted state, there is a risk of displacement or damage to the workpiece 11 when it touches the ground.

[0070] Also, on the surface 11a side of the workpiece 11 after processing, the processing fluid attached during processing remains. And when the processed workpiece 11 is conveyed from the chuck table 12 to the cleaning unit 60 with the processing fluid still attached, drying of the workpiece 11 during conveyance can be prevented, and foreign matters such as residues of processing chips can be prevented from firmly adhering to the workpiece 11. However, if the workpiece 11 tilts during conveyance, the processing fluid attached to the surface 11a side of the workpiece 11 will flow down, and it will be easier for foreign matters to adhere due to drying of the workpiece 11.

[0071] Therefore, the conveying mechanism 32 is configured to hold and convey the workpiece 11 while keeping it horizontal (see FIG. 3). However, due to deterioration of the components constituting the conveying mechanism 32, variations in the weight of the workpiece 11, etc., the workpiece 11 held by the conveying mechanism 32 may accidentally tilt. In this case, the operator of the processing apparatus 2 will notice that the workpiece 11 is tilted only after an abnormality (such as adhesion of foreign matter, damage, etc.) occurs in the workpiece 11. As a result, the timing for performing maintenance such as adjustment and repair of the conveying mechanism 32 may be delayed, and there is a risk of an increase in defective products.

[0072] In response to the above problems, in the present embodiment, a level gauge 48 (see FIG. 3) for measuring a value (levelness) corresponding to the magnitude of the inclination of the workpiece 11 held by the holding portion 36 with respect to the horizontal direction is mounted on the conveying mechanism 32. And the levelness of the workpiece 11 during conveyance is monitored by the level gauge 48.

[0073] For example, when the level 48 is a bubble tube level, the operator can check the inclination of the workpiece 11 by directly visually recognizing the position and scale of the bubble in the bubble tube level. Further, the bubble tube level may be imaged by an imaging unit (camera) built into the processing apparatus 2, and the image obtained by the imaging may be displayed on the display unit 68. In this case, the operator checks the position and scale of the bubble in the bubble tube level displayed on the display unit 68. Also, when the level 48 is a digital level, the value of the inclination displayed on the digital level is read by the operator.

[0074] Furthermore, the level 48 may be a digital level capable of outputting measurement values externally. In this case, for example, the level 48 is connected to the control unit 72 (see FIG. 1). Then, the operation of the level 48 is controlled by the control unit 72, and the measurement value (levelness) of the level 48 is input to the control unit 72.

[0075] Hereinafter, a specific example of the operation of the control unit 72 to which the level 48 is connected will be described. FIG. 4 is a perspective view showing the transport mechanism 32 holding the workpiece 11 and the control unit 72. In FIG. 4, the functional configuration of the control unit 72 and some components (display unit 68 and notification unit 70) of the processing apparatus 2 are shown in blocks.

[0076] The control unit 72 is connected to the level 48, the display unit 68, and the notification unit 70. The control unit 72 includes a determination unit 80 that determines whether the value (levelness) measured by the level 48 is a normal value or an abnormal value, a storage unit 82 that stores a threshold value (reference value) of the levelness, and an error notification unit 84 that outputs a control signal to the display unit 68 and the notification unit 70.

[0077] When the workpiece 11 is held by the holding part 36 of the transfer mechanism 32, the control unit 72 controls the level gauge 48 to measure the levelness of the workpiece 11 with the level gauge 48. Specifically, the level gauge 48 measures the tilt angle of the upper surface 40a of the support part 40 in the horizontal direction. Note that the suction surface 46a of the suction pad 46 is arranged in parallel with the upper surface 40a of the support part 40, and the workpiece 11 and the frame 19 held by the suction pad 46 are also arranged in parallel with the upper surface 40a of the support part 40. Therefore, the tilt angle measured by the level gauge 48 corresponds to the tilt angles of the workpiece 11 and the frame 19. Then, the levelness measured by the level gauge 48 is input to the control unit 72.

[0078] When the levelness is input from the level gauge 48 to the control unit 72, the determination unit 80 determines whether the levelness measured by the level gauge 48 is a normal value or an abnormal value. Specifically, in the storage unit 82, a threshold value (reference value) of the levelness is stored in advance. For example, the upper limit value and the lower limit value that define the allowable range of the levelness are stored in the storage unit 82 as the threshold value. Then, the determination unit 80 accesses the storage unit 82 to read the threshold value, and compares the levelness measured by the level gauge 48 with the threshold value. Thereby, it is determined whether the levelness of the workpiece 11 and the frame 19 is a normal value or an abnormal value.

[0079] The result of the determination by the determination unit 80 is input to the error notification unit 84. When the levelness of the workpiece 11 is an abnormal value, the error notification unit 84 outputs a control signal to the display unit 68 and the notification unit 70 to notify an error. For example, the error notification unit 84 causes the display unit 68 to display an error indicating that the inclination of the workpiece 11 is out of the allowable range, and causes the notification unit 70 to light up in a color or pattern corresponding to the error. Thereby, the operator is notified that an abnormality has occurred in the transfer mechanism 32. In this case, the display unit 68 also functions as a notification unit.

[0080] Further, when the level of the workpiece 11 is an abnormal value, the control unit 72 may output a control signal to the transfer mechanism 32 to stop the movement of the holding unit 36. Thereby, it is possible to prevent the workpiece 11 from being continuously transferred while being tilted.

[0081] The series of operations of the control unit 72 described above are realized by executing a program stored in the storage unit 82. Specifically, the storage unit 82 stores a program that describes processes such as measuring the level of the workpiece 11 by the level gauge 48, comparing the measured level with a threshold value, and causing the display unit 68 and the notification unit 70 to notify an error. Then, when the workpiece 11 is held by the transfer mechanism 32, the control unit 72 reads and executes the program from the storage unit 82.

[0082] As described above, the transfer mechanism 32 according to the present embodiment includes a level gauge 48 that measures a value (level) corresponding to the magnitude of the inclination of the workpiece 11 held by the holding unit 36 with respect to the horizontal direction. Thereby, the inclination of the workpiece 11 during transfer can be recognized before an abnormality (such as adhesion of foreign matter, damage, etc.) occurs in the workpiece 11, and it becomes possible to perform maintenance such as adjustment and repair of the transfer mechanism 32 in a timely manner.

[0083] Further, in the processing apparatus 2 according to the present embodiment, when the value measured by the level gauge 48 is an abnormal value, an error is transmitted by the notification unit (the display unit 68 or the notification unit 70). Thereby, the operator of the processing apparatus 2 immediately recognizes that an abnormality has occurred in the transfer mechanism 32.

[0084] In addition, in this embodiment, an example in which the level gauge 48 is mounted on the transport mechanism 32 has been described. However, the level gauge 48 can also be mounted on other transport mechanisms. For example, the transport mechanism 24 (see FIG. 1) may be configured in the same manner as the transport mechanism 32 (see FIG. 3), and the level gauge 48 may be mounted on the transport mechanism 24. In this case, the levelness of the workpiece 11 can be monitored when the workpiece 11 is transported between the cassette 8 and the pair of guide rails 18, or between the pair of guide rails 18 and the chuck table 12.

[0085] Further, in this embodiment, an example in which the processing apparatus 2 is a cutting apparatus including the processing units 54a and 54b (cutting units) for cutting the workpiece 11 has been described. However, there is no limitation on the type of the processing apparatus 2 on which the level gauge 48 is mounted. For example, the processing apparatus 2 may be a grinding apparatus including a processing unit (grinding unit) for grinding the workpiece 11, or a polishing apparatus including a processing unit (polishing unit) for polishing the workpiece 11.

[0086] The grinding unit of the grinding apparatus includes a spindle, and an annular grinding wheel having a plurality of grinding wheels fixed to the tip of the spindle is mounted. Then, the grinding unit grinds the workpiece 11 by bringing the grinding wheel into contact with the workpiece 11 while rotating the grinding wheel. Further, the polishing unit of the polishing apparatus includes a spindle, and a disk-shaped polishing pad is mounted on the tip of the spindle. Then, the polishing unit polishes the workpiece 11 by bringing the polishing pad into contact with the workpiece 11 while rotating the polishing pad.

[0087] Further, the processing apparatus 2 may be a laser processing apparatus including a processing unit (laser irradiation unit) for processing the workpiece 11 by irradiating a laser beam. The laser irradiation unit includes a laser oscillator that oscillates a laser having a predetermined wavelength, and a condenser that condenses the laser oscillated from the laser oscillator. The workpiece 11 is processed by irradiating the workpiece 11 with a laser beam from the laser irradiation unit.

[0088] The above grinding device, polishing device, and laser processing device are also equipped with a transfer mechanism that transfers the workpiece 11 from the chuck table to the cleaning unit, for example. By providing a level gauge on this transfer mechanism, it becomes possible to monitor the levelness during the transfer of the workpiece 11.

[0089] In addition, the structures, methods, etc. according to the above embodiments can be appropriately modified and implemented without departing from the scope of the object of the present invention.

Explanation of Reference Numerals

[0090] 11 Workpiece 11a Surface 11b Back surface 13 Street (planned division line) 15 Device 17 Tape (dicing tape) 19 Frame 19a Opening 2 Processing device 4 Base 4a, 4b Openings 6 Cassette mounting table 8 Cassette 10 Moving mechanism (moving unit) 10a Table cover 12 Chuck table (holding table) 12a Holding surface 14 Dust and drip-proof cover 16 Clamp 18 Guide rail 20 First support structure 22 Guide rail 24 Transfer mechanism (transfer unit) 26 Moving mechanism 28 Holding part (holding mechanism) 28a Gripping part (gripping mechanism) 30 Guide rail 32 Transfer mechanism (transfer unit) 34 Moving mechanism 36 Holding part (holding mechanism) 38 Support member 40 Support part Above 40a Below 40b Arm part 42 Frame body 44 Suction pad 46 Suction surface 46a Level gauge 48 Second support structure 50 Moving mechanisms 52a, 52b Processing units (cutting units) 54a, 54b Cutting blade 56 Imaging unit (camera) 58 Washing unit 60 Spinner table 62 Holding surface 62a Nozzle 64 Cover 66 Display unit (display section, display device) 68 Notification unit (notification section) 70 Control unit (control section, control device) 72 Judgment section 80 Memory section 82 Error notification section 84

Claims

【Claim 1】 A processing apparatus for processing a workpiece, comprising: a chuck table for holding the workpiece; a processing unit for processing the workpiece held by the chuck table; a cleaning unit for cleaning the processed workpiece; a transfer mechanism for transferring the workpiece between the chuck table and the cleaning unit; a notification unit; and a control unit, wherein the transfer mechanism includes a holding portion for holding the workpiece, a moving mechanism for moving the holding portion to position it at a predetermined position, and a level for measuring a value corresponding to the magnitude of the inclination of the workpiece in the horizontal direction while the workpiece is held by the holding portion; and the control unit causes the notification unit to notify an error when the value measured by the level is an abnormal value.

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