Processing device

Abstract

To provide a processing device which can suppress fluctuation of a supply amount of a working fluid.SOLUTION: A processing device processes a workpiece, and includes a holding table for holding the workpiece, processing units 20A, 20B which process the workpiece held by the holding table, and a working fluid supply unit 100 which supplies a working fluid to the processing units 20A, 20B. The working fluid supply unit 100 includes a liquid supply passage 104 in which a liquid flows, pressure tanks 110A, 110B which store the liquid supplied from the liquid supply passage 104 and pressure-feed the liquid as the working fluid to the processing units 20A, 20B, a gas supply passage 116 in which gas flows, and regulators 122A, 122B which adjust a pressure of the gas supplied from the gas supply passage 116 to the pressure tanks 110A, 110B.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a processing apparatus for processing a workpiece.

Background Art

[0002] By dividing a wafer on which a plurality of devices are formed into individual pieces, a plurality of device chips each having a device are manufactured. Further, by mounting a plurality of device chips on a predetermined substrate and covering the mounted device chips with a sealing material (mold resin) made of resin, a package substrate is obtained. By dividing this package substrate into individual pieces, a plurality of package devices each having a packaged device chip are manufactured. Device chips and package devices are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] A cutting device is used for dividing a wafer or a package substrate. The cutting device includes a holding table for holding a workpiece and a processing unit (cutting unit) for performing cutting processing on the workpiece, and an annular cutting blade is mounted on the cutting unit. By cutting into the workpiece while rotating the cutting blade, the workpiece is cut and divided.

[0004] In recent years, with the miniaturization of electronic devices, device chips and package devices have been required to be thinned. Therefore, a process of thinning the wafer or package substrate before division may be performed. A grinding device is used for thinning the wafer or package substrate. The grinding device includes a holding table for holding a workpiece and a processing unit (grinding unit) for performing grinding processing on the workpiece, and a grinding wheel including a plurality of grinding wheels is mounted on the grinding unit. By bringing the grinding wheel into contact with the workpiece while rotating the grinding wheel, the workpiece is ground and thinned.

[0005] When machining a workpiece with a machining device such as a cutting device or a grinding device, a machining fluid such as pure water is supplied to the workpiece and the machining unit. As a result, the workpiece and the machining unit are cooled, and the chips (machining chips) generated by machining are washed away. For example, when cutting a workpiece with a cutting device, the machining fluid is supplied from a nozzle provided in the machining unit to the workpiece and the cutting blade (see Patent Document 1).

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] The machining device distributes a liquid such as pure water supplied from the outside of the machining device to each component of the machining device through a pipe (liquid supply path) provided inside the machining device. For example, the liquid flowing through the liquid supply path is supplied as a machining fluid to a machining unit that machines the workpiece and as a cleaning fluid to a cleaning unit that cleans the workpiece.

[0008] Here, the machining fluid supplied when machining the workpiece plays a role of cooling the workpiece and the machining unit to suppress the occurrence of machining defects. Therefore, the supply amount of the machining fluid needs to be strictly controlled so that the machining of the workpiece by the machining unit is not hindered and the workpiece and the machining unit are appropriately cooled.

[0009] However, during the processing of the workpiece, the flow rate of the processing fluid supplied to the workpiece and the processing unit may vary due to various factors. For example, when cutting a workpiece with a cutting device, the cleaning of another workpiece may start while the cutting blade is cutting one workpiece. At this time, a large amount of liquid (cleaning liquid) is rapidly supplied from the liquid supply path to the cleaning unit, causing the pressure inside the liquid supply path to fluctuate, and the flow rate of the processing fluid supplied from the liquid supply path to the processing unit to decrease. As a result, the amount of the processing fluid supplied to the workpiece and the cutting blade is not kept constant, and processing defects are likely to occur.

[0010] The present invention has been made in view of such problems, and an object thereof is to provide a processing apparatus capable of suppressing fluctuations in the supply amount of the processing fluid.

Means for Solving the Problems

[0011] According to one aspect of the present invention, there is provided a processing apparatus for processing a workpiece, comprising: a holding table for holding the workpiece; a processing unit for processing the workpiece held by the holding table; A cleaning unit for cleaning the workpiece with a cleaning liquid, a processing fluid supply unit for supplying a processing fluid to the processing unit, the processing fluid supply unit including: a liquid supply path through which a liquid flows; a pressure feed tank for storing the liquid supplied from the liquid supply path and pressure-feeding the liquid to the processing unit as the processing fluid; a gas supply path through which a gas flows; and a regulator for adjusting the pressure of the gas supplied from the gas supply path to the pressure feed tank. A cleaning liquid supply path for supplying the liquid as the cleaning liquid from the liquid supply path to the cleaning unit, A processing apparatus is provided which includes the above components.

[0012] Preferably, the processing apparatus Further comprising a liquid supply unit for supplying the liquid to the workpiece held by the holding table, and the liquid is supplied from the liquid supply path to the liquid supply unit . Further preferably, the processing unit includes a spindle to which a cutting blade for cutting the workpiece is attached, and a nozzle for supplying the processing fluid to the workpiece or the cutting blade.

Effects of the Invention

[0013] A processing apparatus according to an aspect of the present invention includes a machining fluid supply unit that supplies machining fluid to a machining unit. The machining fluid supply unit pumps a liquid as machining fluid to the machining unit by supplying a gas whose pressure is regulated by a regulator to a pressure feed tank that stores the liquid. Thereby, fluctuations in the supply amount of the machining fluid to the machining unit are suppressed.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments according to an aspect of the present invention will be described with reference to the accompanying drawings. First, a configuration example of the processing apparatus according to the present embodiment will be described. FIG. 1 is a perspective view showing a cutting device 2. The cutting device 2 is a processing device that cuts a workpiece with an annular cutting blade. In FIG. 1, the X-axis direction (processing feed direction, front-rear direction, first horizontal direction) and the Y-axis direction (index feed direction, left-right direction, second horizontal direction) are perpendicular to each other. The Z-axis direction (vertical direction, up-down direction, height direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0016] The cutting device 2 includes a rectangular parallelepiped base 4 that supports or houses each component constituting the cutting device 2. A rectangular opening 4a is provided at a corner on the front end side of the base 4. Inside the opening 4a, a cassette support base 6 that moves up and down by a lifting mechanism (not shown) is provided. On the upper surface of the cassette support base 6, a cassette 8 that can accommodate a plurality of workpieces 11 to be processed by the cutting device 2 is arranged. In FIG. 1, the outline of the cassette 8 is shown by a two-dot chain line.

[0017] The workpiece 11 is a disk-shaped wafer made of a semiconductor material such as silicon, and has a front surface and a back surface that are generally parallel to each other. The workpiece 11 is partitioned into a plurality of rectangular regions by a plurality of streets (lines to be divided) arranged in a grid pattern so as to intersect each other. In addition, devices such as IC (Integrated Circuit), LSI (Large Scale Integration), LED (Light Emitting Diode), and MEMS (Micro Electro Mechanical Systems) are formed in the regions partitioned by the streets on the front surface side of the workpiece 11, respectively.

[0018] A circular tape 13 having a diameter larger than that of the workpiece 11 is attached to the back surface side of the workpiece 11. The tape 13 includes a film-like base material and an adhesive (adhesive layer) on the base material. For example, the base material is made of a resin such as polyolefin, polyvinyl chloride, or polyethylene terephthalate, and the adhesive is an epoxy-based, acrylic-based, or rubber-based adhesive. Further, an ultraviolet curable resin that cures by irradiation with ultraviolet rays may be used as the adhesive.

[0019] The outer peripheral portion of the tape 13 is attached to an annular frame 15 made of a metal such as SUS (stainless steel). A circular opening that penetrates the frame 15 in the thickness direction is provided at the center of the frame 15. The diameter of the opening of the frame 15 is larger than the diameter of the workpiece 11, and the workpiece 11 is disposed inside the opening of the frame 15. When the central portion of the tape 13 is attached to the workpiece 11 and the outer peripheral portion of the tape 13 is attached to the frame 15, the workpiece 11 is supported by the frame 15 via the tape 13.

[0020] The workpiece 11 is housed in the cassette 8 while being supported by the frame 15, and is cut by the cutting device 2. For example, by cutting and dividing the workpiece 11 along the street with the cutting device 2, a plurality of device chips each including a device are manufactured.

[0021] However, there are no restrictions on the type, material, shape, structure, size, etc. of the workpiece 11. For example, the workpiece 11 may be a wafer (substrate) made of semiconductors other than silicon (such as GaAs, InP, GaN, SiC, etc.), glass, sapphire, ceramics, resin, metal, etc. Further, the workpiece 11 may be a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate. For example, a package substrate is formed by mounting a plurality of device chips on a rectangular base substrate and covering the plurality of device chips with a resin layer (mold resin).

[0022] On the side of the opening 4a, a rectangular opening 4b is provided such that its longitudinal direction is along the X-axis direction. Inside the opening 4b, a ball screw type moving unit (moving mechanism) 10 is provided. The moving unit 10 includes a flat moving table 12, and bellows-shaped dust and drip-proof covers 14 are provided before and after the moving table 12. The moving table 12 and the dust and drip-proof covers 14 are installed so as to cover the upper part of the opening 4b.

[0023] On the moving table 12, a holding table (chuck table) 16 for holding the workpiece 11 is provided. The upper surface of the holding table 16 is a flat surface generally parallel to the horizontal direction (XY plane direction), and constitutes a holding surface 16a for holding the workpiece 11. The holding surface 16a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), etc. provided inside the holding table 16.

[0024] The moving unit 10 moves the holding table 16 along the X-axis direction together with the moving table 12. Further, a rotational drive source (not shown) such as a motor for rotating the holding table 16 around a rotation axis generally parallel to the Z-axis direction is connected to the holding table 16. Furthermore, a plurality of clamps 18 for gripping and fixing an annular frame 15 that supports the workpiece 11 are provided around the holding table 16.

[0025] In the vicinity of the openings 4a and 4b, a conveying unit (not shown) for conveying the workpiece 11 between the cassette 8 and the holding table 16 is provided. The workpiece 11 is drawn out from the cassette 8 by the conveying unit and conveyed to the holding table 16. At this time, the workpiece 11 is placed on the holding surface 16a of the holding table 16 via the tape 13. Further, the frame 15 is gripped by a plurality of clamps 18. In this state, when the suction force (negative pressure) of the suction source is applied to the holding surface 16a, the workpiece 11 is sucked and held by the holding table 16 via the tape 13.

[0026] Above the holding table 16, machining units (cutting units) 20A and 20B for performing cutting machining on the workpiece 11 are provided. Annular cutting blades 66 (see FIGS. 2(A) and 2(B)) for cutting the workpiece 11 are mounted on the machining units 20A and 20B, respectively.

[0027] On the upper surface of the base 4, a gantry support structure 22 for supporting the machining units 20A and 20B is provided along the Y-axis direction so as to straddle the opening 4b. At both side ends on the front side of the support structure 22, a moving unit (moving mechanism) 24A for moving the machining unit 20A along the Y-axis direction and the Z-axis direction and a moving unit (moving mechanism) 24B for moving the machining unit 20B along the Y-axis direction and the Z-axis direction are provided. The moving units 24A and 24B are mounted on a pair of guide rails 26 arranged along the Y-axis direction on the front side of the support structure 22.

[0028] The moving unit 24A includes a flat moving plate 28A. The moving plate 28A is slidably mounted on the pair of guide rails 26. Further, a nut portion (not shown) is provided on the back surface side (rear surface side) of the moving plate 28A. A ball screw 30A arranged substantially parallel to the guide rail 26 is screwed into this nut portion. A pulse motor 32 is connected to an end of the ball screw 30A. When the ball screw 30A is rotated by the pulse motor 32, the moving plate 28A moves in the Y-axis direction along the guide rail 26.

[0029] On the surface (front side) of the moving plate 28A, a pair of guide rails 34A are fixed along the Z-axis direction. A flat moving plate 36A is slidably mounted on the pair of guide rails 34A. On the back surface side (rear side) of the moving plate 36A, a nut portion (not shown) is provided. A ball screw 38A arranged substantially parallel to the guide rail 34A is screwed into this nut portion. A pulse motor 40A is connected to the end of the ball screw 38A. When the ball screw 38A is rotated by the pulse motor 40A, the moving plate 36A moves in the Z-axis direction along the guide rail 34A.

[0030] Similarly, the moving unit 24B includes a flat moving plate 28B. The moving plate 28B is slidably mounted on a pair of guide rails 26. Also, on the back surface side (rear side) of the moving plate 28B, a nut portion (not shown) is provided. A ball screw 30B arranged substantially parallel to the guide rail 26 is screwed into this nut portion. A pulse motor 32 is connected to the end of the ball screw 30B. When the ball screw 30B is rotated by the pulse motor 32, the moving plate 28B moves in the Y-axis direction along the guide rail 26.

[0031] On the surface (front side) of the moving plate 28B, a pair of guide rails 34B are fixed along the Z-axis direction. A flat moving plate 36B is slidably mounted on the pair of guide rails 34B. On the back surface side (rear side) of the moving plate 36B, a nut portion (not shown) is provided. A ball screw 38B arranged substantially parallel to the guide rail 34B is screwed into this nut portion. A pulse motor 40B is connected to the end of the ball screw 38B. When the ball screw 38B is rotated by the pulse motor 40B, the moving plate 36B moves in the Z-axis direction along the guide rail 34B.

[0032] The processing units 20A and 20B are respectively fixed to the lower parts of the moving plates 36A and 36B. Further, an imaging unit 42 is provided at a position adjacent to the processing unit 20A. The imaging unit 42 includes an image sensor such as a CCD (Charged-Coupled Devices) sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) sensor, and images the workpiece 11 and the like held by the holding table 16. There is no limitation on the type of the imaging unit 42, and for example, a visible light camera or an infrared camera is used. The image acquired by the imaging unit 42 is used for alignment between the workpiece 11 held by the holding table 16 and the processing units 20A and 20B, etc.

[0033] A circular opening 4c is provided on the side of the opening 4b opposite to the opening 4a. A cleaning unit 44 for cleaning the workpiece 11 is provided inside the opening 4c. The cleaning unit 44 includes a spinner table (chuck table) 46 that holds and rotates the workpiece 11, and a nozzle 48 that supplies a cleaning liquid (cleaning fluid) to the workpiece 11 held by the spinner table 46.

[0034] The upper surface of the spinner table 46 is a flat surface generally parallel to the horizontal direction (XY plane direction), and constitutes a holding surface 46a for holding the workpiece 11. The holding surface 46a is connected to a suction source (not shown) such as an ejector via a flow path (not shown), a valve (not shown), etc. provided inside the spinner table 46. Further, a rotation drive source (not shown) such as a motor for rotating the spinner table 46 around a rotation axis generally parallel to the Z-axis direction is connected to the spinner table 46.

[0035] The nozzle 48 supplies the cleaning liquid toward the holding surface 46a of the spinner table 46. As the cleaning liquid, a liquid such as pure water, or a mixed fluid generated by mixing a liquid (such as pure water) and a gas (such as air) can be used.

[0036] The workpiece 11 processed by the processing unit 20A or the processing unit 20B is conveyed to the spinner table 46 by a conveying unit (not shown) and placed on the holding surface 46a of the spinner table 46 via the tape 13. In this state, when the suction force (negative pressure) of the suction source is applied to the holding surface 46a, the workpiece 11 is sucked and held by the spinner table 46 via the tape 13. Then, while rotating the spinner table 46 holding the workpiece 11, a cleaning liquid is dropped from the nozzle 48 toward the workpiece 11, and the cleaning liquid flows along the upper surface side of the workpiece 11, and the workpiece 11 is cleaned.

[0037] On the upper side of the base 4, a cover 50 is provided to cover the components mounted on the base 4. In FIG. 1, the contour of the cover 50 is shown by a two-dot chain line.

[0038] On the side portion of the cover 50, a display unit (display unit, display device) 52 for displaying various information regarding the cutting device 2 is provided. For example, a touch panel display is used as the display unit 52. In this case, the display unit 52 also functions as an input unit (input unit, input device) for inputting various information to the cutting device 2, and the operator can input information such as processing conditions to the cutting device 2 by a touch operation on the display unit 52. That is, the display unit 52 functions as a user interface.

[0039] On the upper part of the cover 50, a notification unit (notification unit, notification device) 54 for notifying the operator of information is provided. For example, an indicator light (warning light) is provided as the notification unit 54. When an abnormality occurs in the cutting device 2, the indicator light lights up or blinks to notify the operator of the abnormality. Also, as the notification unit 54, a speaker for notifying the operator of information by sound or voice can be used. In this case, when an abnormality occurs in the cutting device 2, the speaker emits a sound or voice notifying of the occurrence of the abnormality.

[0040] The components that make up the cutting device 2 (cassette support base 6, moving unit 10, holding table 16, clamp 18, processing units 20A, 20B, moving units 24A, 24B, imaging unit 42, cleaning unit 44, display unit 52, notification unit 54, etc.) are connected to a control unit (control unit, control device) 56. The control unit 56 generates and outputs control signals for controlling the operations of the respective components of the cutting device 2, and operates the cutting device 2.

[0041] For example, the control unit 56 is constituted by a computer and includes an arithmetic unit that performs calculations necessary for the operation of the cutting device 2, and a storage unit that stores various types of information (data, programs, etc.) used for the operation of the cutting device 2. The arithmetic unit is configured to include a processor such as a CPU (Central Processing Unit). Further, the storage unit is configured to include memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory) that function as a main storage device, an auxiliary storage device, etc.

[0042] The workpiece 11 accommodated in the cassette 8 is conveyed one by one to the holding table 16 by a conveying unit (not shown). Then, the workpiece 11 is cut by the processing unit 20A or the processing unit 20B while being sucked and held by the holding table 16. Thereafter, the workpiece 11 is conveyed to the cleaning unit 44 by a conveying unit (not shown) and cleaned. The cleaned workpiece 11 is again accommodated in the cassette 8.

[0043] FIG. 2(A) is a perspective view showing the processing unit 20A, and FIG. 2(B) is a side view showing the processing unit 20A. In FIG. 2(B), for convenience of explanation, the illustration of the blade cover 72 described later is omitted.

[0044] The processing unit 20A includes a cylindrical housing 60. The housing 60 houses a columnar spindle 62 (see Fig. 2(B)) arranged along the Y-axis direction. The tip (one end side) of the spindle 62 protrudes from the housing 60. Also, a rotational drive source such as a motor (not shown) for rotating the spindle 62 is connected to the base end portion (the other end side) of the spindle 62.

[0045] A mount 64 (see Fig. 2(B)) is fixed to the tip of the spindle 62. The mount 64 includes a disc-shaped flange portion 64a and a columnar support shaft (boss portion) 64b protruding from the central portion of the flange portion 64a. An annular cutting blade 66 for cutting the workpiece 11 is mounted on the mount 64.

[0046] As the cutting blade 66, a hub type cutting blade (hub blade) can be used. The hub blade is configured by integrating an annular base made of metal or the like and an annular cutting edge formed along the outer peripheral edge of the base. For example, the cutting edge of the hub blade is constituted by an electroformed grindstone containing abrasive grains such as diamond and cubic boron nitride (cBN), and a bonding material such as a nickel plating layer for fixing the abrasive grains. However, a washer type cutting blade (washer blade) can also be used as the cutting blade 66. The washer blade is constituted only by an annular cutting edge containing abrasive grains and a bonding material made of metal, ceramics, resin, or the like for fixing the abrasive grains.

[0047] A columnar opening penetrating the cutting blade 66 in the thickness direction is provided at the central portion of the cutting blade 66. Then, the cutting blade 66 is mounted on the mount 64 such that the support shaft 64b is inserted into the opening. Also, a screw groove (not shown) is formed at the tip of the support shaft 64b, and a fixing nut 68 for fixing the cutting blade 66 is screwed into this screw groove. When the fixing nut 68 is tightened on the support shaft 64b with the cutting blade 66 mounted on the mount 64, the cutting blade 66 is clamped by the flange portion 64a and the fixing nut 68.

[0048] As described above, the cutting blade 66 is attached to the tip of the spindle 62 (mount 64). Then, the cutting blade 66 rotates around a rotation axis generally parallel to the Y-axis direction by the power transmitted from the rotation drive source through the spindle 62 and the mount 64.

[0049] Also, a rectangular parallelepiped support member 70 is fixed to the tip of the housing 60. And a box-shaped blade cover 72 (see Fig. 2(A)) covering the cutting blade 66 is attached to the surface of the support member 70. A pair of first connection parts 74 connected to a pipe for supplying a liquid (processing liquid) such as pure water are provided at one end of the blade cover 72. Further, a second connection part 78 and a third connection part 82 connected to a pipe for supplying a liquid (processing liquid) such as pure water are provided at the other end of the blade cover 72.

[0050] A pair of first nozzles (cooler nozzles) 76 arranged so as to sandwich the lower end of the cutting blade 66 covered by the blade cover 72 are connected to the pair of first connection parts 74. Each of the pair of first nozzles 76 is provided with a supply port (not shown) opening toward the cutting blade 66. When the processing liquid flows into the first connection part 74, the processing liquid is supplied from the supply ports of the pair of first nozzles 76 toward the front and back surfaces of the cutting blade 66.

[0051] A second nozzle (spray nozzle) 80 provided inside the blade cover 72 is connected to the second connection part 78. The tip of the second nozzle 80 opens toward the outer peripheral edge of the cutting blade 66. When the processing liquid flows into the second connection part 78, the processing liquid is supplied from the tip of the second nozzle 80 toward the outer peripheral edge of the cutting blade 66.

[0052] A pair of third nozzles (shower nozzles) 84 opening downward are connected to the third connection part 82. When the processing liquid flows into the third connection part 82, the processing liquid is supplied from the tips of the third nozzles 84 toward the workpiece 11 held by the holding table 16 (see Fig. 1).

[0053] The cutting blade 66 is rotated and cut into the workpiece 11 held by the holding table 16, whereby the workpiece 11 is cut. Also, during the cutting of the workpiece 11, machining fluid is supplied from the first nozzle 76, the second nozzle 80, and the third nozzle 84 to the workpiece 11 and the cutting blade 66. Thereby, the workpiece 11 and the cutting blade 66 are cooled, and the chips (machining chips) generated by the cutting of the workpiece 11 are washed away.

[0054] In the above description, the configuration of the machining unit 20A has been described. However, the machining unit 20B is also configured in the same manner as the machining unit 20A (see FIG. 3). And, a pair of cutting blades 66 are mounted on the machining units 20A and 20B so as to face each other. That is, the cutting device 2 is a so-called facing dual spindle type cutting device. However, the number of machining units provided in the cutting device 2 may be one set.

[0055] FIG. 3 is a schematic diagram showing a machining fluid supply unit 100 that supplies machining fluid to the machining units 20A and 20B. The machining fluid supply unit 100 is mounted on the cutting device 2 and supplies machining fluid to the first connection portion 74, the second connection portion 78, and the third connection portion 82 provided in the machining units 20A and 20B, respectively.

[0056] The machining fluid supply unit 100 includes a liquid supply path 104 through which the liquid supplied from the liquid supply source 102 flows. The liquid supply path 104 is a flow path constituted by a tube, a pipe, or the like, and one end side of the liquid supply path 104 is connected to the liquid supply source 102. A liquid such as pure water is supplied from the liquid supply source 102 to the liquid supply path 104.

[0057] The other end side of the liquid supply path 104 branches into liquid supply paths 106A and 106B. The liquid supply paths 106A and 106B are flow paths constituted by a tube, a pipe, or the like, and one end sides of the liquid supply paths 106A and 106B are connected to the liquid supply path 104 via valves 108, respectively.

[0058] The other end side of the liquid supply path 106A is connected to the pressure feed tank 110A, and the other end side of the liquid supply path 106B is connected to the pressure feed tank 110B. The pressure feed tanks 110A and 110B are containers made of metal such as stainless steel and capable of storing liquid. When the valve 108 is opened, liquid is supplied from the liquid supply path 104 to the pressure feed tank 110A via the liquid supply path 106A, and liquid is supplied from the liquid supply path 104 to the pressure feed tank 110B via the liquid supply path 106B. As a result, the liquid 112 supplied from the liquid supply source 102 is stored in the pressure feed tanks 110A and 110B.

[0059] Moreover, the processing liquid supply unit 100 includes a gas supply path 116 through which the gas supplied from the gas supply source 114 flows. The gas supply path 116 is a flow path constituted by a tube, a pipe, etc., and one end side of the gas supply path 116 is connected to the gas supply source 114. Gas such as air and nitrogen gas (N2) is supplied from the gas supply source 114 to the gas supply path 116.

[0060] The other end side of the gas supply path 116 branches into gas supply paths 118A and 118B. The gas supply paths 118A and 118B are flow paths constituted by a tube, a pipe, etc., and one end sides of the gas supply paths 118A and 118B are connected to the gas supply path 116 via valves 120 respectively.

[0061] The other end side of the gas supply path 118A is connected to the pressure feed tank 110A via a regulator 122A. Also, the other end side of the gas supply path 118B is connected to the pressure feed tank 110B via a regulator 122B. When the valve 120 is opened, gas 124 is supplied from the gas supply path 116 to the pressure feed tank 110A via the gas supply path 118A and the regulator 122A, and gas 124 is supplied from the gas supply path 116 to the pressure feed tank 110B via the gas supply path 118B and the regulator 122B. As a result, gas 124 flows into the internal space of the pressure feed tanks 110A and 110B in which the liquid 112 is stored.

[0062] The regulator 122A regulates the pressure of the gas 124 supplied from the gas supply passage 116 to the pressure feed tank 110A. Similarly, the regulator 122B regulates the pressure of the gas 124 supplied from the gas supply passage 116 to the pressure feed tank 110B. For example, electro-pneumatic regulators are used as the regulators 122A and 122B.

[0063] The liquid supply source 102 and the gas supply source 114 are, for example, factory facilities (liquid supply facilities, gas supply facilities) provided in the factory where the cutting device 2 is installed. Then, liquid and gas are supplied from the liquid supply source 102 and the gas supply source 114 to a plurality of cutting devices 2 installed in the factory. However, the cutting device 2 may be provided with the liquid supply source 102 and the gas supply source 114. For example, cylinders filled with liquid and cylinders filled with gas may be mounted or connected to the cutting device 2 as the liquid supply source 102 and the gas supply source 114.

[0064] The pressure feed tank 110A supplies the liquid 112 as a processing liquid to the processing liquid supply passage 126A. The processing liquid supply passage 126A is a flow passage constituted by a tube, a pipe, etc., and one end side of the processing liquid supply passage 126A is connected to the pressure feed tank 110A. When the gas 124 whose pressure is kept constant by the regulator 122A is supplied to the pressure feed tank 110A in a state where the liquid 112 is stored in the pressure feed tank 110A, the liquid 112 is pushed out from the pressure feed tank 110A by the gas 124 filled in the pressure feed tank 110A and supplied to the processing liquid supply passage 126A at a constant flow rate.

[0065] The other end side of the processing liquid supply passage 126A branches into three processing liquid supply passages 128A, 130A, and 132A. The processing liquid supply passages 128A, 130A, and 132A are flow passages constituted by a tube, a pipe, etc., and one end side of the processing liquid supply passages 128A, 130A, and 132A is connected to the processing liquid supply passage 126A via the electromagnetic valves 134A, respectively. Further, the other end sides of the processing liquid supply passages 128A, 130A, and 132A are connected to the first connection portion 74, the second connection portion 78, and the third connection portion 82 provided in the processing unit 20A via the flow meters 136A and the valves 138A, respectively.

[0066] When the electromagnetic valve 134A is opened, the liquid 112 is supplied from the pressure feed tank 110A to the machining liquid supply paths 128A, 130A, and 132A at a constant flow rate via the machining liquid supply path 126A. Further, when the valve 138A is opened, the liquid 112 is supplied from the machining liquid supply paths 128A, 130A, and 132A to the first connection portion 74, the second connection portion 78, and the third connection portion 82 of the machining unit 20A. In this way, the liquid 112 is pressure-fed from the pressure feed tank 110A to the machining unit 20A as the machining liquid. Then, the machining unit 20A cuts the workpiece 11 in a state where the machining liquid is supplied from the first nozzle 76, the second nozzle 80, and the third nozzle 84 to the workpiece 11 and the cutting blade 66.

[0067] The flow rate of the liquid 112 flowing through the machining liquid supply paths 128A, 130A, and 132A is monitored by the flow meter 136A. Then, according to the flow rate of the liquid 112 measured by the flow meter 136A, the opening / closing or the opening degree of the valve 138A is controlled. Thereby, the liquid 112 is supplied to the first connection portion 74, the second connection portion 78, and the third connection portion 82 of the machining unit 20A at a desired flow rate, respectively.

[0068] Similarly, the pressure feed tank 110B supplies the liquid 112 to the machining liquid supply path 126B as the machining liquid. The machining liquid supply path 126B is a flow path constituted by a tube, a pipe, or the like, and one end side of the machining liquid supply path 126B is connected to the pressure feed tank 110B. When the gas 124 whose pressure is kept constant by the regulator 122B is supplied to the pressure feed tank 110B in a state where the liquid 112 is stored in the pressure feed tank 110B, the liquid 112 is pushed out from the pressure feed tank 110B by the gas 124 filled in the pressure feed tank 110B and is supplied to the machining liquid supply path 126B at a constant flow rate.

[0069] The other end side of the machining fluid supply path 126B branches into three machining fluid supply paths 128B, 130B, and 132B. The machining fluid supply paths 128B, 130B, and 132B are flow paths constituted by tubes, pipes, etc. One end side of the machining fluid supply paths 128B, 130B, and 132B is connected to the machining fluid supply path 126B via electromagnetic valves 134B respectively. Also, the other end sides of the machining fluid supply paths 128B, 130B, and 132B are connected to the first connection part 74, the second connection part 78, and the third connection part 82 provided in the machining unit 20B via flow meters 136B and valves 138B respectively.

[0070] When the electromagnetic valve 134B is opened, the liquid 112 is supplied from the pressure feed tank 110B to the machining fluid supply paths 128B, 130B, and 132B via the machining fluid supply path 126B at a constant flow rate. Also, when the valve 138B is opened, the liquid 112 is supplied from the machining fluid supply paths 128B, 130B, and 132B to the first connection part 74, the second connection part 78, and the third connection part 82 of the machining unit 20B. In this way, the liquid 112 is pressure-fed from the pressure feed tank 110B to the machining unit 20B as the machining fluid. Then, the machining unit 20B cuts the workpiece 11 in a state where the machining fluid is supplied to the workpiece 11 and the cutting blade 66 from the first nozzle 76, the second nozzle 80, and the third nozzle 84.

[0071] The flow rate of the liquid 112 flowing through the machining fluid supply paths 128B, 130B, and 132B is monitored by the flow meter 136B. Then, according to the flow rate of the liquid 112 measured by the flow meter 136B, the opening and closing or the opening degree of the valve 138B is controlled. Thereby, the liquid 112 is supplied to the first connection part 74, the second connection part 78, and the third connection part 82 of the machining unit 20B at a desired flow rate respectively.

[0072] Note that the liquid supplied from the liquid supply source 102 is also used in components other than the processing units 20A and 20B. For example, a cleaning unit 44 is connected to the liquid supply path 104 via a cleaning liquid supply path 140 and a valve 142. The cleaning liquid supply path 140 is a flow path constituted by a tube, a pipe, or the like. One end side of the cleaning liquid supply path 140 is connected to the liquid supply path 104, and the other end side of the liquid supply path 104 is connected to the cleaning unit 44.

[0073] When the valve 142 connected to the cleaning liquid supply path 140 is opened, the liquid is supplied as a cleaning liquid from the liquid supply path 104 to the cleaning unit 44 via the cleaning liquid supply path 140. Then, the cleaning liquid is supplied from the nozzle 48 (see FIG. 1) of the cleaning unit 44 toward the workpiece 11 to clean the workpiece 11.

[0074] The components of the processing liquid supply unit 100 (valve 108, valve 120, regulators 122A and 122B, solenoid valves 134A and 134B, flow meters 136A and 136B, valves 138A and 138B, valve 142, etc.) are each connected to the control unit 56 (see FIG. 1). Then, the control unit 56 controls the opening and closing or the opening degree of the valve 108, valve 120, solenoid valves 134A and 134B, valves 138A and 138B, and valve 142. Further, the control unit 56 adjusts the pressure of the gas 124 supplied to the pressure feed tanks 110A and 110B by controlling the regulators 122A and 122B. Furthermore, the control unit 56 controls the measurement of the flow rate of the liquid 112 by the flow meters 136A and 136B and records the flow rate of the liquid 112 measured by the flow meters 136A and 136B.

[0075] When machining the workpiece 11 with the machining units 20A and 20B, machining fluid is supplied from the above-mentioned machining fluid supply unit 100 to the machining units 20A and 20B. Here, when the cleaning unit 44 starts cleaning another workpiece 11 while the machining units 20A and 20B are cutting one workpiece 11, the valve 142 opens, and a large amount of liquid suddenly flows from the liquid supply path 104 into the cleaning liquid supply path 140. As a result, the pressure inside the liquid supply path 104 fluctuates, and the flow rate of the liquid supplied from the liquid supply path 104 to the liquid supply paths 106A and 106B decreases.

[0076] However, the machining fluid supply unit 100 includes a pressure feed tank 110A in which the liquid 112 is stored, and gas 124 whose pressure is controlled by a regulator 122A is supplied to the pressure feed tank 110A. Then, the liquid 112 stored in the pressure feed tank 110A is supplied to the machining fluid supply path 126A at a constant flow rate according to the pressure of the gas 124 controlled by the regulator 122A. Similarly, the liquid 112 stored in the pressure feed tank 110B is supplied to the machining fluid supply path 126B at a constant flow rate according to the pressure of the gas 124 controlled by the regulator 122B.

[0077] Therefore, even if the flow rate of the liquid supplied from the liquid supply path 104 to the liquid supply paths 106A and 106B fluctuates, the flow rate of the machining fluid supplied to the machining units 20A and 20B is maintained. Thereby, fluctuations in the supply amount of the machining fluid to the workpiece 11 and the cutting blade 66 are suppressed, and the occurrence of machining defects is prevented.

[0078] In addition to the machining units 20A and 20B and the cleaning unit 44, the machining fluid supply unit 100 can also supply liquid to other components of the cutting device 2. For example, a liquid supply unit (water curtain) for supplying liquid to the workpiece 11 held by the holding table 16 may be provided around the holding table 16 (see FIG. 1). This liquid supply unit prevents the workpiece 11 from drying by supplying liquid to the entire workpiece 11 held by the holding table 16.

[0079] The above-described liquid supply unit may be connected to the liquid supply path 104 (see FIG. 3). In this case, the liquid supplied from the liquid supply source 102 to the liquid supply path 104 is also supplied to the liquid supply unit.

[0080] As described above, the cutting device 2 according to the present embodiment includes a machining fluid supply unit 100 that supplies machining fluid to the machining units 20A and 20B. The machining fluid supply unit 100 supplies the gas 124 whose pressure is adjusted by the regulators 122A and 122B to the pressure feed tanks 110A and 110B that store the liquid 112, thereby pressure-feeding the liquid 112 as machining fluid to the machining units 20A and 20B. Thereby, fluctuations in the supply amount of the machining fluid to the machining units 20A and 20B are suppressed.

[0081] In the above embodiment, the cutting device 2 (see FIG. 1) has been described as an example of a machining device. However, the machining fluid supply unit 100 can also be mounted on a machining device other than the cutting device 2. For example, the machining fluid supply unit 100 can also be mounted on a grinding device that grinds the workpiece 11.

[0082] The grinding device includes a holding table (chuck table) that holds the workpiece 11, a machining unit (grinding unit) that grinds the workpiece 11, and a cleaning unit that cleans the workpiece. The grinding unit includes a columnar spindle, and an annular grinding wheel having a plurality of grinding wheels is mounted at the tip of the spindle. In addition, a machining fluid supply path (such as a nozzle) for supplying machining fluid such as pure water to the workpiece 11 and the grinding wheel is provided inside or in the vicinity of the grinding unit.

[0083] By rotating the grinding wheel and bringing it into contact with the workpiece 11 held by the holding table of the grinding wheel, the workpiece 11 is ground and thinned. Also, during the grinding of the workpiece 11, the machining fluid is supplied from the machining fluid supply path to the workpiece 11 and the grinding wheel. Here, the machining fluid supply unit 100 is mounted on the grinding device, and by supplying the machining fluid from the machining fluid supply unit 100 to the machining fluid supply path, the supply amount of the machining fluid to the workpiece 11 and the grinding wheel is kept constant. Thereby, the occurrence of machining defects due to excess or deficiency of the machining fluid is prevented.

[0084] In addition, the structures, methods, etc. according to the above embodiments can be appropriately changed and implemented as long as they do not deviate from the scope of the object of the present invention.

Explanation of Signs

[0085] 11 Workpiece 13 Tape 15 Frame 2 Cutting device 4 Base 4a, 4b, 4c Openings 6 Cassette support base 8 Cassette 10 Moving unit (moving mechanism) 12 Moving table 14 Dust and splash cover 16 Holding table (chuck table) 16a Holding surface 18 Clamp 20A, 20B Processing unit (cutting unit) 22 Support structure 24A, 24B Moving unit (moving mechanism) 26 Guide rail 28A, 28B Moving plate 30A, 30B Ball screw 32 Pulse motor 34A, 34B Guide rail 36A, 36B Moving plate 38A, 38B Ball screw 40A, 40B Pulse motor 42 Imaging unit 44 Cleaning unit 46 Spinner table (chuck table) 46a Holding surface 48 Nozzle 50 Cover 52 Display unit (display device) 54 Notification unit (notification device) 56 Control unit (control device) 60 Housing 62 Spindle 64 Mount 64a Flange part 64b Support shaft (boss part) 66 Cutting blade 68 Fixed nut 70 Support member 72 Blade cover 74 First connection part 76 First nozzle (cooler nozzle) 78 Second connection part 80 Second nozzle (spray nozzle) 82 Third connection part 84 Third nozzle (shower nozzle) 100 Machining fluid supply unit 102 Liquid supply source 104, 106A, 106B Liquid supply path 108 Valve 110A, 110B Pressure feed tank 112 Liquid 114 Gas supply source 116, 118A, 118B Gas supply path 120 Valve 122A, 122B Regulator 124 Gas 126A, 126B Machining fluid supply path 128A, 128B, 130A, 130B, 132A, 132B Machining fluid supply path 134A, 134B Electromagnetic valve 136A, 136B Flow meter 138A, 138B Valve 140 Cleaning liquid supply path 142 Valve

Claims

1. A processing apparatus for processing a workpiece, comprising: a holding table for holding the workpiece; a processing unit for processing the workpiece held by the holding table; a cleaning unit for cleaning the workpiece with a cleaning liquid; a processing liquid supply unit for supplying a processing liquid to the processing unit, wherein the processing liquid supply unit includes a liquid supply passage through which a liquid flows; a pressure-feeding tank for storing the liquid supplied from the liquid supply passage and pressure-feeding the liquid as the processing liquid to the processing unit; a gas supply passage through which a gas flows; a regulator for adjusting the pressure of the gas supplied from the gas supply passage to the pressure-feeding tank; and a cleaning liquid supply passage for supplying the liquid from the liquid supply passage to the cleaning unit as the cleaning liquid.

2. The processing apparatus according to claim 1, further comprising a liquid supply unit for supplying the liquid to the workpiece held by the holding table, wherein the liquid is supplied from the liquid supply passage to the liquid supply unit.

3. The processing unit according to claim 1 or 2, comprising a spindle to which a cutting blade for cutting the workpiece is attached, and a nozzle for supplying the processing liquid to the workpiece or the cutting blade.

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