Wafer processing method and removal device

Abstract

A wafer processing method capable of removing static electricity generated when cutting a ring-shaped reinforcing part is provided. [Solution] The wafer processing method includes a tape pressing step of positioning an opening of a frame 64, which has an opening in the center for accommodating a wafer 4, on the back surface 4b of the wafer 4, and pressing a tape 96 attached to the frame 64 against the back surface 4b of the wafer 4 to generate a frame unit U, and a reinforcement part removing step of forming a ring-shaped cutting groove for separating a ring-shaped reinforcement part 24 from the frame unit U, and acting a block 402 having a wedge on the outer periphery of the ring-shaped reinforcement part 24 to remove the ring-shaped reinforcement part 24 from the frame unit U. In the reinforcement part removing step, ionized air is blown onto the frame unit U to remove static electricity.

Description

Technical Field

[0001] The present invention relates to a method for processing a wafer having a front surface provided with device regions partitioned by a planned division line and a back surface provided with a ring-shaped reinforcing portion on the outer periphery, and a wafer having a front surface provided with device regions partitioned by a planned division line and a back surface provided with a ring-shaped reinforcing portion on the outer periphery and having a ring-shaped cutting groove formed for separating the ring-shaped reinforcing portion, and a removing device for removing the ring-shaped reinforcing portion from a frame unit in which a tape is adhered to a frame having an opening for accommodating the wafer at the center to integrate them.

Background Art

[0002] In a wafer having device regions partitioned by a planned division line and an outer peripheral surplus region surrounding the device regions formed on the front surface, after the back surface is ground to a desired thickness, it is divided into individual device chips by a dicing device or a laser processing device, and each divided device chip is used in an electric device such as a mobile phone or a personal computer.

[0003] The applicant of the present application proposed a technique of leaving a ring-shaped reinforcing portion on the back surface corresponding to the outer peripheral surplus region for easy conveyance of the ground wafer, performing predetermined processing, then adhering a dicing tape to the back surface of the wafer and supporting the wafer with a frame, and removing the ring-shaped reinforcing portion from the wafer (see, for example, Patent Document 1).

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, when cutting the ring-shaped reinforcing portion, static electricity is generated, and the cutting chips adhere to the tape, contaminating the next process. There are also problems such as the ring-shaped reinforcing portion sticking to the tape due to static electricity, making it impossible to smoothly remove the ring-shaped reinforcing portion, and static electricity discharging into the device area and damaging the device.

[0006] In view of the above facts, an object of the present invention is to provide a wafer processing method and a removing device capable of removing static electricity generated when cutting a ring-shaped reinforcing portion.

Means for Solving the Problems

[0007] According to the present invention, the following wafer processing method for solving the above problems is provided. That is, 「A method for processing a wafer having a front surface with a device area in which a plurality of devices are partitioned by a division planned line and a back surface with a ring-shaped reinforcing portion on the outer periphery, A tape pressing step of accommodating the wafer in an opening provided in the center of a frame having an opening for accommodating the wafer and integrating the frame and the wafer with a tape to generate a frame unit; A reinforcing portion removing step of forming a ring-shaped cutting groove for separating the ring-shaped reinforcing portion of the wafer from the frame unit, positioning a wafer having a wedge between the tape and the ring-shaped reinforcing portion, and separating and removing the ring-shaped reinforcing portion from the frame unit, including In the reinforcing portion removing step, a wafer processing method of blowing ionized air onto the frame unit to remove static electricity」 is provided.

[0008] Further, according to the present invention, the following removing device for solving the above problems is provided. That is, A wafer having a front surface with a device region divided by a division line into a plurality of devices and a back surface with a ring-shaped reinforcing portion on the outer periphery, and a ring-shaped cutting groove formed for separating the ring-shaped reinforcing portion, and a frame unit formed by attaching a tape to a frame having an opening for accommodating the wafer at the center to make them integral, and a removing device for removing the ring-shaped reinforcing portion from the frame unit, a lifting table for holding the wafer via the tape, a frame support portion for supporting the frame, a camming element having a wedge for acting between the tape and the ring-shaped reinforcing portion to separate and remove the ring-shaped reinforcing portion from the frame unit from the cutting groove, and an ionizer for blowing ionized air onto the frame unit to remove static electricity when the camming element acts on the outer periphery of the ring-shaped reinforcing portion. A removing device is provided.

Advantages of the Invention

[0009] The method for processing a wafer according to the present invention is a method for processing a wafer having a front surface with a device region divided by a division line into a plurality of devices and a back surface with a ring-shaped reinforcing portion on the outer periphery, including a tape pressing step of accommodating the wafer in the opening of a frame having an opening for accommodating the wafer at the center and forming a frame unit in which the frame and the wafer are integrated by a tape, and a reinforcing portion removing step of forming a ring-shaped cutting groove for separating the ring-shaped reinforcing portion of the wafer from the frame unit, positioning a camming element having a wedge between the tape and the ring-shaped reinforcing portion, and separating and removing the ring-shaped reinforcing portion from the frame unit. In the reinforcing portion removing step, since ionized air is blown onto the frame unit to remove static electricity, static electricity generated when cutting the ring-shaped reinforcing portion can be removed. Also, the removing device according to the present invention A wafer having a front surface with a device region partitioned by a division line by a plurality of devices and a back surface with a ring-shaped reinforcing portion on the outer periphery, and a ring-shaped cutting groove formed for separating the ring-shaped reinforcing portion, and a frame having an opening for accommodating the wafer in the center, and a removing device for removing the ring-shaped reinforcing portion from a frame unit formed by attaching a tape to the wafer and the frame integrally, a lifting table for holding the wafer via the tape, a frame support portion for supporting the frame, a camming having a wedge that acts between the tape and the ring-shaped reinforcing portion to separate and remove the ring-shaped reinforcing portion from the frame unit from the cutting groove, an ionizer for removing static electricity by blowing ionized air onto the frame unit when the camming is made to act on the outer periphery of the ring-shaped reinforcing portion. Therefore, static electricity generated when cutting the ring-shaped reinforcing portion can be removed.

Brief Description of the Drawings

[0010]

Figure 1

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Embodiments for Carrying Out the Invention

[0011] Hereinafter, preferred embodiments of a wafer processing method and a removal device according to the present invention will be described with reference to the drawings.

[0012] Referring to FIG. 1, a processing apparatus denoted by reference numeral 2 as a whole includes a wafer cassette table 8 on which a wafer cassette 6 containing a plurality of wafers is placed, a wafer unloading means 10 for unloading a wafer from the wafer cassette 6 placed on the wafer cassette table 8, and a wafer table 12 for supporting the front surface side of the wafer unloaded by the wafer unloading means 10.

[0013] FIG. 2 shows a wafer 4 to be processed by the processing apparatus 2. The front surface 4a of the wafer 4 has a device region 18 in which a plurality of devices 14 such as ICs and LSIs are partitioned by grid-like division planned lines 16, and an outer peripheral surplus region 20 surrounding the device region 18. In FIG. 2, for the sake of convenience, the boundary 22 between the device region 18 and the outer peripheral surplus region 20 is shown by a two-dot chain line, but actually there is no line indicating the boundary 22. On the back surface 4b side of the wafer 4, a ring-shaped reinforcing portion 24 is formed convexly in the outer peripheral surplus region 20, and the thickness of the outer peripheral surplus region 20 is larger than the thickness of the device region 18. Further, a notch 26 indicating the crystal orientation is formed at the periphery of the wafer 4.

[0014] As shown in FIG. 3, a plurality of wafers 4 are accommodated in the wafer cassette 6 with their front surfaces 4a facing upward at intervals in the vertical direction. The wafer cassette table 8 of the illustrated embodiment has a top plate 28 on which the wafer cassette 6 is placed and a support plate 30 for supporting the top plate 28. Note that the top plate 28 may be movable up and down, and lifting means for moving the top plate 28 up and down to position it at an arbitrary height may be provided.

[0015] Continuing the description with reference to FIG. 3, the wafer transfer means 10 includes a Y-axis movable member 32 movable in the Y-axis direction indicated by the arrow Y in FIG. 3, and a Y-axis feed means 34 for moving the Y-axis movable member 32 in the Y-axis direction. The Y-axis feed means 34 has a ball screw 36 connected to the lower end of the Y-axis movable member 32 and extending in the Y-axis direction, and a motor 38 for rotating the ball screw 36. The Y-axis feed means 34 converts the rotational motion of the motor 38 into a linear motion by the ball screw 36 and transmits it to the Y-axis movable member 32, and moves the Y-axis movable member 32 in the Y-axis direction along a pair of guide rails 40 extending in the Y-axis direction. Note that the X-axis direction indicated by the arrow X in FIG. 3 is a direction orthogonal to the Y-axis direction, and the Z-axis direction indicated by the arrow Z in FIG. 3 is the vertical direction orthogonal to the X-axis direction and the Y-axis direction. The XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal.

[0016] As shown in FIG. 3, the wafer transfer means 10 of the illustrated embodiment includes a transfer arm 42 and a hand 44 disposed at the tip of the transfer arm 42 for supporting the back surface 4b of the wafer 4 accommodated in the wafer cassette 6 and inverting the front and back of the wafer 4. The transfer arm 42 is provided on the upper surface of the Y-axis movable member 32 and is driven by an appropriate drive source such as an air drive source or an electric drive source (not shown). This drive source drives the transfer arm 42 to position the hand 44 at an arbitrary position in each of the X-axis direction, the Y-axis direction, and the Z-axis direction, and to turn the hand 44 upside down.

[0017] Referring to FIG. 4 for description, the hand 44 is preferably a Bernoulli pad that generates a negative pressure by jetting air and supports the wafer 4 in a non-contact manner. The hand 44 of the illustrated embodiment is generally C-shaped, and a plurality of air ejection ports 46 connected to a compressed air supply source (not shown) are formed on one side of the hand 44. A plurality of guide pins 48 are attached to the outer peripheral edge of the hand 44 at intervals in the circumferential direction. Each guide pin 48 is configured to be movable in the radial direction of the hand 44.

[0018] As shown in FIGS. 3 and 4, after positioning the hand 44 on the back surface 4b side (lower side) of the wafer 4 in the wafer cassette 6 placed on the wafer cassette table 8, the wafer unloading means 10 ejects compressed air from the air ejection port 46 of the hand 44 to generate a negative pressure on one side of the hand 44 by the Bernoulli effect, and the wafer 4 is attracted and supported non - contact from the back surface 4b side by the hand 44. The horizontal movement of the wafer 4 attracted and supported by the hand 44 is restricted by each guide pin 48. Then, the wafer unloading means 10 unloads the wafer 4 attracted and supported by the hand 44 from the wafer cassette 6 by moving the Y - axis movable member 32 and the transfer arm 42.

[0019] As shown in FIG. 4, the wafer unloading means 10 of the illustrated embodiment includes a notch detection means 50 for detecting the position of the notch 26 of the wafer 4. The notch detection means 50 may be configured to include, for example, a light - emitting element 52 and a light - receiving element 54 arranged at intervals in the vertical direction, and a drive source (not shown) for rotating at least one of the guide pins 48 of the hand 44.

[0020] The light - emitting element 52 and the light - receiving element 54 can be attached to the Y - axis movable member 32 or the transfer path via appropriate brackets (not shown). Also, when the guide pin 48 is rotated by the drive source, the wafer 4 attracted and supported by the hand 44 rotates due to the rotation of the guide pin 48. To reliably transmit the rotation from the guide pin 48 to the wafer 4, it is preferable that the outer peripheral surface of the guide pin 48 rotated by the drive source is formed of an appropriate synthetic rubber.

[0021] The notch detection means 50 can detect the position of the notch 26 by rotating the wafer 4 via the guide pin 48 with the drive source in a state where the wafer 4 is attracted and supported by the hand 44 and the outer periphery of the wafer 4 is positioned between the light - emitting element 52 and the light - receiving element 54. As a result, the orientation of the wafer 4 can be adjusted to an arbitrary orientation.

[0022] As shown in FIG. 3, the wafer table 12 is disposed adjacent to the wafer unloading means 10. The wafer table 12 in the illustrated embodiment includes an annular support portion 56 that supports the outer peripheral surplus region 20 of the wafer 4 and keeps the portion inside the outer peripheral surplus region 20 out of contact, and a frame support portion 58 that is disposed on the outer periphery of the annular support portion 56 and supports a frame 64 (see FIG. 5) described later. A plurality of suction holes 60 are formed at intervals in the circumferential direction on the upper surface of the annular support portion 56, and each suction hole 60 is connected to a suction means (not shown). The radially inner portion of the wafer table 12 than the annular support portion 56 is a circular recess 62 that is recessed downward.

[0023] When the hand 44 is inverted by 180° to invert the front and back of the wafer 4, and the wafer 4 is placed on the wafer table 12 with the surface 4a of the wafer 4 facing downward, the outer peripheral surplus region 20 of the wafer 4 is supported by the annular support portion 56, and the device region 18 of the wafer 4 is located in the recess 62. For this reason, even when the wafer 4 is placed on the wafer table 12 with the surface 4a on which the device 14 is formed facing downward, the device 14 and the wafer table 12 do not come into contact with each other, so damage to the device 14 is prevented. Further, after the wafer table 12 supports the outer peripheral surplus region 20 by the annular support portion 56, the suction means is operated to generate a suction force in each suction hole 60 and suction-hold the outer peripheral surplus region 20, thereby preventing the wafer 4 from shifting in position.

[0024] Referring to FIG. 5 for description, the processing apparatus 2 further includes a frame accommodating means 66 that accommodates a plurality of ring-shaped frames 64 in which an opening 64a for accommodating the wafer 4 is formed, a frame unloading means 68 that unloads the frame 64 from the frame accommodating means 66, and a frame table 70 that supports the frame 64 unloaded by the frame unloading means 68.

[0025] As shown in FIG. 5, the frame housing means 66 of the illustrated embodiment includes a housing 72, a lifting plate 74 disposed in the housing 72 so as to be movable up and down, and a lifting means (not shown) for lifting and lowering the lifting plate 74. In FIG. 5, a Z-axis guide member 78 extending in the Z-axis direction is disposed on the rear side surface of the housing 72 in the X-axis direction. The lifting plate 74 is supported by the Z-axis guide member 78 so as to be movable up and down, and the lifting means for lifting and lowering the lifting plate 74 is disposed inside the Z-axis guide member 78. The lifting means may be configured to have, for example, a ball screw connected to the lifting plate 74 and extending in the Z-axis direction, and a motor for rotating the ball screw. In FIG. 5, a door 76 with a handle 76a attached is provided on the front side surface of the housing 72 in the X-axis direction. In the frame housing means 66, the frame 64 can be housed inside the housing 72 by gripping the handle 76a and opening the door 76. An opening 80 is provided at the upper end of the housing 72.

[0026] As shown in FIG. 5, the frame 64 is stacked and housed on the upper surface of the lifting plate 74 inside the housing 72. The uppermost frame 64 among the plurality of stacked frames 64 is carried out from the opening 80 of the housing 72 by the frame carrying-out means 68. Further, when the frame 64 is carried out from the opening 80, the frame housing means 66 appropriately raises the lifting plate 74 by the lifting means, and positions the uppermost frame 64 at a position where it can be carried out by the frame carrying-out means 68.

[0027] Continuing the description with reference to Fig. 5, the frame carrying means 68 includes an X-axis guide member 82 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 84 supported by the X-axis guide member 82 so as to be movable in the X-axis direction, an X-axis feed means (not shown) for moving the X-axis movable member 84 in the X-axis direction, a Z-axis movable member 86 supported by the X-axis movable member 84 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 86 in the Z-axis direction. The X-axis feed means of the frame carrying means 68 may be configured to have a ball screw connected to the X-axis movable member 84 and extending in the X-axis direction and a motor for rotating this ball screw, and the Z-axis feed means may be configured to have a ball screw connected to the Z-axis movable member 86 and extending in the Z-axis direction and a motor for rotating this ball screw.

[0028] The Z-axis movable member 86 of the frame carrying means 68 has a holding portion 88 for holding the frame 64. The holding portion 88 of the illustrated embodiment has a rectangular substrate 90 and a plurality of suction pads 92 provided on the lower surface of the substrate 90, and each suction pad 92 is connected to a suction means (not shown).

[0029] After the frame carrying means 68 sucks and holds the uppermost frame 64 accommodated in the frame accommodating means 66 by the suction pads 92 of the holding portion 88, the frame carrying means 68 moves the X-axis movable member 84 and the Z-axis movable member 86 to carry out the sucked and held uppermost frame 64 from the frame accommodating means 66.

[0030] As shown in Fig. 5, the frame table 70 is supported by a Z-axis guide member 94 so as to be movable up and down between a lowered position shown by a solid line and a raised position shown by a two-dot chain line. An appropriate drive source (for example, an air drive source or an electric drive source) for moving the frame table 70 up and down between the lowered position and the raised position is attached to the Z-axis guide member 94. In the frame table 70, the frame 64 carried out by the frame carrying means 68 is received at the lowered position.

[0031] As shown in FIGS. 1 and 5, the processing apparatus 2 includes a tape sticking means 98 (see FIG. 1) disposed above the frame table 70 for sticking a tape 96 to the frame 64, and a frame 64 (hereinafter sometimes referred to as "taped frame 64'") to which the tape 96 is stuck. A taped frame conveying means 100 (see FIG. 5) that conveys the wafer table 12 to the wafer table 12 and positions the opening 64a of the frame 64 on the back surface 4b of the wafer 4 supported by the wafer table 12, and places the taped frame 64' on the wafer table 12, and a tape pressing means 102 (see FIG. 1) that presses the tape 96 of the taped frame 64' against the back surface 4b of the wafer 4.

[0032] Referring to FIG. 6 for explanation, the tape sticking means 98 of the illustrated embodiment includes a roll tape support portion 104 that supports a roll tape 96R around which the tape 96 before use is wound, a tape winding portion 106 that winds up the used tape 96, a tape pulling portion 108 that pulls out the tape 96 from the roll tape 96R, a pressure bonding portion 110 that pressure-bonds the pulled-out tape 96 to the frame 64, and a cutting portion 112 that cuts the tape 96 protruding from the outer periphery of the frame 64 along the frame 64.

[0033] As shown in FIG. 6, the roll tape support portion 104 includes a support roller 114 rotatably supported by an appropriate bracket (not shown) about an axis extending in the X-axis direction. A release paper 116 for protecting the adhesive surface of the tape 96 is attached to the adhesive surface of the tape 96, and a roll tape 96R wound in a cylindrical shape is supported on the support roller 114.

[0034] The tape winding portion 106 includes a winding roller 118 rotatably supported by an appropriate bracket (not shown) about an axis extending in the X-axis direction, and a motor (not shown) for rotating the winding roller 118. As shown in FIG. 6, the tape winding portion 106 winds up the used tape 96 in which a circular opening 120 corresponding to the portion attached to the frame 64 is formed by rotating the winding roller 118 by a motor.

[0035] Continuing the description with reference to FIG. 6, the tape pulling-out section 108 includes a pulling-out roller 122 disposed below the support roller 114 of the roll tape support section 104, a motor (not shown) for rotating the pulling-out roller 122, and a driven roller 124 that rotates as the pulling-out roller 122 rotates. The tape pulling-out section 108 pulls out the tape 96 sandwiched between the pulling-out roller 122 and the driven roller 124 from the roll tape 96R by rotating the driven roller 124 together with the pulling-out roller 122 by the motor.

[0036] The release paper 116 is peeled off from the tape 96 that has passed between the pulling-out roller 122 and the driven roller 124, and the peeled release paper 116 is wound up by the release paper winding section 126. The release paper winding section 126 in the illustrated embodiment has a release paper winding roller 128 disposed above the driven roller 124 and a motor (not shown) for rotating the release paper winding roller 128. Further, the tape 96 from which the release paper 116 has been peeled off is guided to the winding roller 118 via a guide roller 130 disposed at a distance from the pulling-out roller 122 in the Y-axis direction.

[0037] The crimping section 110 includes a pressing roller 132 that is movably disposed in the Y-axis direction and a Y-axis feeding means (not shown) for moving the pressing roller 132 in the Y-axis direction. The Y-axis feeding means of the crimping section 110 can be constituted by an appropriate drive source (for example, an air drive source or an electric drive source).

[0038] As shown in FIG. 6, the cutting section 112 includes a Z-axis guide member 134 that is fixed to an appropriate bracket (not shown) and extends in the Z-axis direction, a Z-axis movable member 136 that is supported by the Z-axis guide member 134 so as to be movable in the Z-axis direction, and a Z-axis feeding means (not shown) for moving the Z-axis movable member 136 in the Z-axis direction. The Z-axis feeding means of the cutting section 112 may have a configuration including a ball screw that is connected to the Z-axis movable member 136 and extends in the Z-axis direction and a motor for rotating this ball screw.

[0039] Further, the cutting portion 112 includes a motor 138 fixed to the lower surface of the tip of the Z-axis movable member 136, and an arm piece 140 rotated by the motor 138 about an axis extending in the Z-axis direction. First and second hanging pieces 142a and 142b are attached to the lower surface of the arm piece 140 at intervals from each other. A circular cutter 144 is rotatably supported on the first hanging piece 142a about an axis orthogonal to the Z-axis direction, and a pressing roller 146 is rotatably supported on the second hanging piece 142b about an axis orthogonal to the Z-axis direction.

[0040] Before the frame table 70 that has received the frame 64 from the frame carrying-out means 68 is positioned from the lowered position (the position shown in Fig. 6(a)) to the raised position (the position shown in Fig. 6(b)), the tape sticking means 98 pulls out the unused tape 96 by the pulling roller 122 and the driven roller 124. Then, the frame table 70 is positioned at the raised position so that the tape 96 can be pressed against the frame 64 by the pressing roller 132 of the crimping portion 110, and the frame 64 is brought into contact with the pressing roller 132 via the tape 96. Then, while pressing the adhesive surface of the tape 96 against the frame 64 with the pressing roller 132, the pressing roller 132 is rolled in the Y-axis direction. Thereby, the tape 96 pulled out from the roll tape 96R by the tape pulling-out portion 108 can be crimped to the frame 64.

[0041] After pressing the tape 96 onto the frame 64, the tape sticking means 98 lowers the Z-axis movable member 136 of the cutting portion 112 by the Z-axis feeding means, presses the cutter 144 against the tape 96 on the frame 64, and presses the frame 64 from above the tape 96 with the pressing roller 146. Then, the arm piece 140 is rotated by the motor 138, and the cutter 144 and the pressing roller 146 are moved along the frame 64 in a circular motion. As a result, the tape 96 protruding beyond the outer periphery of the frame 64 can be cut along the frame 64. Also, since the frame 64 is pressed from above the tape 96 by the pressing roller 146, displacement of the frame 64 and the tape 96 is prevented when the tape 96 is being cut. Then, after lowering the frame table 70, the used tape 96 having a circular opening 120 formed therein that hits the portion attached to the frame 64 is wound up by the tape winding portion 106.

[0042] As shown in FIG. 5, the tape-attached frame conveying means 100 includes a Y-axis guide member 148 that is fixed to an appropriate bracket (not shown) and extends in the Y-axis direction, a Y-axis movable member 150 that is supported by the Y-axis guide member 148 so as to be movable in the Y-axis direction, a Y-axis feeding means (not shown) that moves the Y-axis movable member 150 in the Y-axis direction, a Z-axis movable member 152 that is supported by the Y-axis movable member 150 so as to be movable in the Z-axis direction, and a Z-axis feeding means (not shown) that moves the Z-axis movable member 152 in the Z-axis direction. The Y-axis feeding means of the tape-attached frame conveying means 100 may be configured to include a ball screw that is connected to the Y-axis movable member 150 and extends in the Y-axis direction, and a motor that rotates this ball screw. The Z-axis feeding means may be configured to include a ball screw that is connected to the Z-axis movable member 152 and extends in the Z-axis direction, and a motor that rotates this ball screw.

[0043] The Z-axis movable member 152 of the tape-attached frame conveying means 100 has a holding portion 154 for holding the tape-attached frame 64'. The holding portion 154 of the illustrated embodiment has a rectangular substrate 156 and a plurality of suction pads 158 provided on the lower surface of the substrate 156, and each suction pad 158 is connected to a suction means (not shown).

[0044] The tape-attached frame conveying means 100 holds the upper surface of the tape-attached frame 64' supported on the frame table 70 with each suction pad 158 of the holding portion 154 in a state where the adhesive surface of the tape 96 faces downward, and by moving the Y-axis movable member 150 and the Z-axis movable member 152, the tape-attached frame 64' held by suction by the holding portion 154 is conveyed from the frame table 70 to the wafer table 12, and the opening 64a of the frame 64 is positioned on the back surface 4b of the wafer 4 supported on the wafer table 12, and the tape-attached frame 64' is placed on the wafer table 12.

[0045] The tape pressing means 102 will be described with reference to FIGS. 7 to 9. As shown in FIG. 7, the tape pressing means 102 includes an upper chamber 160 disposed above the wafer table 12, a lower chamber 162 housing the wafer table 12, a lifting mechanism 164 that generates a closed state in which the upper chamber 160 is lowered and brought into contact with the lower chamber 162 and an open state in which the upper chamber 160 is separated from the lower chamber 162, a vacuum portion 166 that evacuates the upper chamber 160 and the lower chamber 162 in the closed state, and an atmosphere release portion 168 that releases the upper chamber 160 and the lower chamber 162 to the atmosphere.

[0046] The upper chamber 160 of the illustrated embodiment includes, as shown in FIG. 7, a circular top plate 170 and a cylindrical side wall 172 hanging from the periphery of the top plate 170. A lifting mechanism 164 that can be composed of an appropriate actuator such as an air cylinder is mounted on the upper surface of the top plate 170. In the accommodation space defined by the lower surface of the top plate 170 and the inner peripheral surface of the side wall 172, a pressing roller 174 for pressing the tape 96 of the tape-attached frame 64' against the back surface 4b of the wafer 4 supported on the wafer table 12, a support piece 176 that rotatably supports the pressing roller 174, and a Y-axis feeding means 178 that moves the support piece 176 in the Y-axis direction are disposed.

[0047] The Y-axis feed means 178 has a ball screw 180 connected to the support piece 176 and extending in the Y-axis direction, and a motor 182 for rotating the ball screw 180. Then, the Y-axis feed means 178 converts the rotational motion of the motor 182 into linear motion by the ball screw 180 and transmits it to the support piece 176, and moves the support piece 176 along a pair of guide rails 184 extending in the Y-axis direction.

[0048] As shown in FIG. 7, the lower chamber 162 has a cylindrical side wall 186. The upper part of the side wall 186 is open, and the lower part of the side wall 186 is closed. A connection opening 188 is formed in the side wall 186. A vacuum section 166, which may be composed of an appropriate vacuum pump, is connected to the connection opening 188 via a flow path 190. An atmosphere release section 168, which may be composed of an appropriate valve capable of opening the flow path 190 to the atmosphere, is provided in the flow path 190.

[0049] With the tape 96 of the tape-attached frame 64' positioned on the back surface 4b of the wafer 4 supported by the wafer table 12, the tape bonding means 102 lowers the upper chamber 160 by the elevating mechanism 164, brings the lower end of the side wall 172 of the upper chamber 160 into contact with the upper end of the side wall 186 of the lower chamber 162 to close the upper chamber 160 and the lower chamber 162, and brings the pressing roller 174 into contact with the tape-attached frame 64'.

[0050] Next, with the valve constituting the atmosphere release section 168 closed, the tape bonding means 102 operates the vacuum pump constituting the vacuum section 166 to evacuate the interiors of the upper chamber 160 and the lower chamber 162. Then, as shown in FIGS. 8 and 9, by rolling the pressing roller 174 in the Y-axis direction by the Y-axis feed means 178, the tape 96 is bonded to the back surface 4b of the wafer 4 to generate the frame unit U.

[0051] When the tape 96 is pressed against the back surface 4b of the wafer 4 by the pressing roller 174, a slight gap is formed between the wafer 4 and the tape 96 at the base of the ring-shaped reinforcing portion 24. However, since the wafer 4 and the tape 96 are pressed while the interiors of the upper chamber 160 and the lower chamber 162 are evacuated, the pressure in the slight gap between the wafer 4 and the tape 96 is lower than the atmospheric pressure. When the atmosphere release portion 168 is opened after the tape 96 is pressed, the tape 96 is pressed against the wafer 4 by the atmospheric pressure. As a result, the gap between the wafer 4 and the tape 96 at the base of the reinforcing portion 24 disappears, and the tape 96 adheres closely to the back surface 4b of the wafer 4 along the base of the reinforcing portion 24.

[0052] As shown in FIGS. 1 and 10, the processing apparatus 2 further includes a frame unit carrying means 192 for carrying out the frame unit U in which the tape 96 of the tape-attached frame 64' and the back surface 4b of the wafer 4 are pressed by the tape pressing means 102 from the wafer table 12 and temporarily placing it on the temporary placement table 204, a removing apparatus 194 for cutting and removing the ring-shaped reinforcing portion 24 from the wafer 4 of the frame unit U placed on the temporary placement table 204, a ringless unit carrying means 196 for carrying out the ringless unit from which the ring-shaped reinforcing portion 24 has been removed from the removing apparatus 194 (see FIG. 1), and a frame cassette table 200 on which a frame cassette 198 for accommodating the ringless unit carried out by the ringless unit carrying means 196 is placed (see FIG. 1).

[0053] As shown in FIG. 10, the frame unit carrying means 192 of the illustrated embodiment includes a frame unit holding portion 202 including a wafer holding portion 202a for holding the wafer 4 and a frame holding portion 202b for holding the frame 64, and a conveying portion 206 for conveying the frame unit holding portion 202 to the temporary placement table 204.

[0054] The wafer holding portion 202a of the frame unit holding portion 202 includes a circular substrate 208 and a circular suction piece 210 attached to the lower surface of the substrate 208. A plurality of suction holes (not shown) are formed in the lower surface of the suction piece 210, and each suction hole is connected to a suction means (not shown). The frame holding portion 202b includes a plurality (four in the illustrated embodiment) of protruding pieces 212 that protrude radially outward at intervals in the circumferential direction from the periphery of the substrate 208 of the wafer holding portion 202a, and suction pads 214 attached to the lower surfaces of the protruding pieces 212. Each suction pad 214 is connected to a suction means (not shown).

[0055] The transfer unit 206 includes an X-axis guide member 216 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 218 supported by the X-axis guide member 216 so as to be movable in the X-axis direction, an X-axis feed means (not shown) for moving the X-axis movable member 218 in the X-axis direction, a Z-axis movable member 220 supported by the X-axis movable member 218 so as to be movable in the Z-axis direction, a Z-axis feed means (not shown) for moving the Z-axis movable member 220 in the Z-axis direction, a Y-axis movable member 222 supported by the Z-axis movable member 220 so as to be movable in the Y-axis direction, and a Y-axis feed means (not shown) for moving the Y-axis movable member 222 in the Y-axis direction. The substrate 208 of the wafer holding portion 202a is connected to the tip of the Y-axis movable member 222. Each of the X-axis, Y-axis, and Z-axis feed means of the transfer unit 206 may have a configuration including a ball screw and a motor for rotating the ball screw.

[0056] The frame unit unloading means 192 preferably includes a two-dimensional movement mechanism that moves the frame unit holding portion 202 two-dimensionally in the horizontal direction, and an imaging unit 224 that images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding portion 202. In the illustrated embodiment, the frame unit holding portion 202 moves two-dimensionally in the horizontal direction in the XY plane by the X-axis feed means and the Y-axis feed means of the transfer unit 206, and the transfer unit 206 constitutes the two-dimensional movement mechanism. Further, the imaging unit 224 of the illustrated embodiment is disposed between the wafer table 12 and the temporary placement table 204, and images the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding portion 202 from below the wafer 4.

[0057] The frame unit unloading means 192 sucks and holds the wafer 4 from the back surface 4b side (tape 96 side) by the suction piece 210 of the wafer holding portion 202a, and while sucking and holding the frame 64 by the suction pad 214 of the frame holding portion 202b, operates the transfer unit 206 to unload the frame unit U held by the frame unit holding portion 202 from the wafer table 12.

[0058] Further, the frame unit unloading means 192 of the illustrated embodiment operates the transfer unit 206 that constitutes the two-dimensional movement mechanism, images at least three points on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding portion 202 by the imaging unit 224, measures the coordinates of at least three points on the outer periphery of the wafer 4, and obtains the center coordinates of the wafer 4 based on the measured coordinates of the three points. Then, the frame unit unloading means 192 aligns the center of the wafer 4 with the center of the temporary placement table 204 and temporarily places the frame unit U on the temporary placement table 204.

[0059] As shown in FIG. 10, the temporary table 204 is arranged at an interval in the X-axis direction from the wafer table 12. The temporary table 204 in the illustrated embodiment includes an annular support portion 226 that supports the outer peripheral surplus region 20 of the wafer 4 of the frame unit U and keeps the portion inside the outer peripheral surplus region 20 non-contact, and a frame support portion 228 that is disposed on the outer periphery of the annular support portion 226 and supports the frame 64.

[0060] The radially inner portion than the annular support portion 226 is a circular recess 230 that is recessed downward. The frame support portion 228 of the temporary table 204 is provided with a heater (not shown). By heating the tape 96 of the frame unit U temporarily placed on the temporary table 204 with the heater, the tape 96 is softened, and it is preferable that the tape 96 is more closely adhered to the base of the ring-shaped reinforcing portion 24 by atmospheric pressure.

[0061] The processing apparatus 2 in the illustrated embodiment includes a temporary table transfer portion 232 that transfers the temporary table 204 in the Y-axis direction. The temporary table transfer portion 232 includes a Y-axis guide member 234 that extends in the Y-axis direction, a Y-axis movable member 236 that is supported by the Y-axis guide member 234 so as to be movable in the Y-axis direction, and a Y-axis feed means 238 that moves the Y-axis movable member 236 in the Y-axis direction. The temporary table 204 is fixed to the upper portion of the Y-axis movable member 236. The Y-axis feed means 238 includes a ball screw 240 that is connected to the Y-axis movable member 236 and extends in the Y-axis direction, and a motor 242 that rotates the ball screw 240. Then, the temporary table transfer portion 232 converts the rotational motion of the motor 242 into a linear motion by the ball screw 240 and transmits it to the Y-axis movable member 236, and transfers the temporary table 204 in the Y-axis direction together with the Y-axis movable member 236.

[0062] As shown in FIGS. 1 and 10, the removing device 194 includes a laser beam irradiating means 244 that irradiates a laser beam toward the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4 to form a cutting groove, a first elevating table 246 (see FIG. 1) that holds and raises the frame unit U temporarily placed on the temporary placement table 204 and moves in the X-axis direction to position it at the laser beam irradiating means 244, and a separating portion 248 that separates the ring-shaped reinforcing portion 24 from the cutting groove.

[0063] As shown in FIG. 10, the laser beam irradiating means 244 includes a housing 250 disposed adjacent to the temporary placement table 204 in the X-axis direction, an oscillator (not shown) housed in the housing 250 that oscillates a laser beam, a condenser 252 that condenses the laser beam oscillated by the oscillator and irradiates the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4, a suction nozzle 254 that sucks debris generated when the wafer 4 is irradiated with the laser beam, and a suction means (not shown) connected to the suction nozzle 254.

[0064] The condenser 252 extends obliquely upward from the upper surface of the housing 250 toward the suction nozzle 254 side, thereby suppressing the debris generated during the irradiation of the laser beam from falling onto the condenser 252. Further, the suction nozzle 254 extends obliquely upward from the upper surface of the housing 250 toward the condenser 252 side.

[0065] As shown in FIG. 11, the laser beam irradiating means 244 irradiates a laser beam LB toward the base of the ring-shaped reinforcing portion 24 formed on the outer periphery of the wafer 4 while rotating the frame unit U held by the first elevating table 246, and forms a ring-shaped cutting groove 256 along the base of the reinforcing portion 24 by ablation processing. Further, the laser beam irradiating means 244 sucks the debris generated by the ablation processing by the suction nozzle 254.

[0066] As shown in FIG. 1, the first elevating table 246 is disposed above the temporary placement table 204 and is movable in the X-axis direction and the Z-axis direction. Referring to FIG. 12 for description, the first elevating table 246 includes an X-axis guide member 258 fixed to an appropriate bracket (not shown) and extending in the X-axis direction, an X-axis movable member 260 supported by the X-axis guide member 258 so as to be movable in the X-axis direction, an X-axis feed means (not shown) for moving the X-axis movable member 260 in the X-axis direction, a Z-axis movable member 262 supported by the X-axis movable member 260 so as to be movable in the Z-axis direction, and a Z-axis feed means (not shown) for moving the Z-axis movable member 262 in the Z-axis direction. Each of the X-axis and Z-axis feed means of the first elevating table 246 may be configured to include a ball screw and a motor for rotating the ball screw.

[0067] A support shaft 264 extending downward is rotatably supported on the lower surface of the tip of the Z-axis movable member 262, and a motor 266 for rotating the support shaft 264 about an axis extending in the Z-axis direction is attached to the upper surface of the tip of the Z-axis movable member 262. A circular suction piece 268 is fixed to the lower end of the support shaft 264. A plurality of suction holes (not shown) are formed at intervals in the circumferential direction on the lower surface of the suction piece 268 on a circumference corresponding to the size of the frame 64, and each suction hole is connected to a suction means.

[0068] After the first elevating table 246 sucks and holds the frame 64 portion of the frame unit U in which the tape 96 is heated by the heater of the frame support portion 228 of the temporary placement table 204 and the tape 96 is in close contact with the base of the ring-shaped reinforcing portion 24 by the suction piece 268, the Z-axis movable member 262 and the X-axis movable member 260 are moved, and the frame unit U sucked and held by the suction piece 268 is lifted and moved in the X-axis direction to be positioned at the laser beam irradiation means 244. When the frame 64 is formed of a magnetic material, an electromagnet (not shown) may be attached to the lower surface of the suction piece 268 so that the suction piece 268 sucks the frame 64 by magnetic force.

[0069] Further, when the first elevating table 246 irradiates the wafer 4 with the laser beam LB by the laser beam irradiating means 244, the motor 266 is operated to rotate the frame unit U held by suction by the suction piece 268. Further, the first elevating table 246 moves the frame unit U having the cutting groove 256 formed at the base of the reinforcing portion 24 in the X-axis direction and the Z-axis direction and temporarily places it on the temporary placement table 204.

[0070] As shown in FIG. 1, the separation unit 248 is arranged at an interval in the Y-axis direction from the first elevating table 246 within the movable range of the temporary placement table 204 in the Y-axis direction. Referring to FIGS. 13 and 14 for description, the separation unit 248 includes an ultraviolet irradiation unit 270 (see FIG. 13) that irradiates ultraviolet rays on the tape 96 corresponding to the cutting groove 256 to reduce the adhesive force of the tape 96, and a ring-shaped reinforcing portion 24 is exposed on the outer periphery to suck and hold the inside of the wafer 4. A second elevating table 272 (see FIG. 13), a separator 274 (see FIG. 13) that acts on the outer periphery of the ring-shaped reinforcing portion 24 with the wafer 402 having a wedge to separate the ring-shaped reinforcing portion 24, and a waste portion 276 (see FIG. 14) where the separated ring-shaped reinforcing portion 24 is discarded.

[0071] As shown in FIG. 13, the separation unit 248 of the illustrated embodiment includes a Z-axis guide member 278 fixed to an appropriate bracket (not shown) and extending in the Z-axis direction, a Z-axis movable member 280 supported by the Z-axis guide member 278 so as to be movable in the Z-axis direction, and a lifting means (not shown) for moving the Z-axis movable member 280 in the Z-axis direction. The lifting means may have a configuration including a ball screw connected to the Z-axis movable member 280 and extending in the Z-axis direction, and a motor for rotating this ball screw.

[0072] A support piece 282 is supported on the lower surface of the tip of the Z-axis movable member 280, and the second elevating table 272 is rotatably supported. A motor 284 for rotating the second elevating table 272 is attached to the upper surface of the tip of the Z-axis movable member 280. A pair of the ultraviolet irradiation units 270 are provided on the support piece 282 of the illustrated embodiment at intervals in the Y-axis direction.

[0073] The second elevating table 272 includes a support shaft 286 that extends downward from the lower surface of the tip of the Z-axis movable member 280, and a circular table head 287 that is detachably attached to the lower end of the support shaft 286. A plurality of suction holes (not shown) are formed in the lower surface of the table head 287, and each suction hole is connected to a suction means.

[0074] The table head 287 has an outer diameter corresponding to the inner diameter of the reinforcing portion 24 of the wafer 4. Specifically, the diameter of the table head 287 is slightly smaller than the diameter of the device region 18 of the wafer 4. Further, the table head 287 is detachably attached to the support shaft 286 and can be exchanged according to the diameter of the wafer 4. The support shaft 286 to which the table head 287 is attached is connected to the elevating means of the separating portion 248 via the Z-axis movable member 280. Thus, the second elevating table 272 includes two or more types of table heads 287 having an outer diameter corresponding to the inner diameter of the reinforcing portion 24 of the wafer 4, and the table heads 287 are detachably attached to the elevating means of the separating portion 248.

[0075] Further, the separator 274 is attached to the support piece 282. The separator 274 includes a pair of movable pieces 288 that are movably arranged in the longitudinal direction of the support piece 282 with a space therebetween on the lower surface of the support piece 282, a pair of feeding means 290 for moving the pair of movable pieces 288, a pair of support substrates 400 that are vertically supported by each movable piece 288, and a pair of Z-axis feeding means 294 for moving the pair of support substrates 400 in the Z-axis direction. Each of the pair of feeding means 290 and the Z-axis feeding means 294 can be constituted by an appropriate actuator such as an air cylinder or an electric cylinder.

[0076] Continuing the description with reference to FIG. 13, on the upper surface of each support substrate 400, a disk 402 having a wedge, a frame support portion 404 for supporting the frame 64, and an ionizer 406 for removing static electricity from the frame unit U are attached.

[0077] The disk 402 has a frustum of a cone shape with a diameter gradually decreasing from top to bottom, and a wedge is formed by the upper surface 402a of the disk 402 and the side surface 402b of the disk 402. A pair of disks 402 are arranged at intervals on the upper surface of each support substrate 400 and are supported by the support substrate 400 so as to be rotatable about an axis extending in the Z-axis direction.

[0078] The frame support portions 404 are arranged in a pair on the upper surface of each support substrate 400 adjacent to the disk 402. The frame support portions 404 have a housing 404a fixed to the support substrate 400 and a sphere 404b rotatably supported by the housing 404a. In the frame support portions 404, the frame 64 is supported by each sphere 404b.

[0079] The ionizer 406 is disposed adjacent to the disk 402. In the ionizer 406, static electricity is removed from the frame unit U by blowing ionized air toward the frame unit U.

[0080] The separation unit 248 of the illustrated embodiment includes a detection means (not shown) for detecting whether or not the type of the table head 287 input to a control means (not shown) for controlling the operation of the processing apparatus 2 matches the type of the table head 287 actually mounted on the processing apparatus 2.

[0081] The control means is composed of a computer having a central processing unit (CPU) that performs arithmetic processing according to a control program, a read-only memory (ROM) that stores the control program and the like, and a readable and writable random access memory (RAM) that stores the arithmetic results and the like. Processing conditions such as the diameter of the wafer 4, the width of the reinforcing portion 24, and the outer diameter of the table head 287 are input by the operator to the control means.

[0082] The detection means of the illustrated embodiment includes the wafer 402 of the separator 274 and the feeding means 290 that moves the movable piece 288 to approach and separate the wafer 402 from the table head 287. In the detection means, before starting the processing of the wafer 4, the feeding means 290 is operated to move the movable piece 288, and as shown in FIG. 15, it is detected whether the outer diameter of the table head 287 obtained by bringing the wafer 402 of the separator 274 into contact with the outer periphery of the table head 287 matches the outer diameter of the table head 287 input to the control means. When it is detected by the detection means that the two do not match, an error notification (for example, a display indicating non - match on a control panel (not shown)) is made.

[0083] Even if the diameter of the wafer 4 is the same, for example, 200 mm, the width of the ring - shaped reinforcing portion 24 may be different, such as 3 mm or 5 mm. For this reason, in the processing apparatus 2, it is necessary to mount the table head 287 corresponding to the device region 18 of the wafer 4. If the type of the table head 287 input to the control means does not match the type of the table head 287 actually mounted, the ring - shaped reinforcing portion 24 cannot be properly removed from the wafer 4.

[0084] In this regard, in the processing apparatus 2 of the illustrated embodiment, since it is provided with a detection means for detecting whether the type of the table head 287 input to the control means matches the type of the table head 287 actually mounted on the processing apparatus 2, before starting the processing of the wafer 4, it is possible to confirm whether the appropriate table head 287 corresponding to the wafer 4 is mounted, and the ring - shaped reinforcing portion 24 can be properly removed from the wafer 4 during the processing of the wafer 4.

[0085] Referring to FIG. 14, the disposal unit 276 includes a belt conveyor 300 that conveys the separated ring-shaped reinforcing portion 24, and a dust box 302 that houses the ring-shaped reinforcing portion 24 conveyed by the belt conveyor 300. The belt conveyor 300 is positioned by an appropriate actuator (not shown) at a recovery position that extends substantially horizontally (the position shown by the solid line in FIG. 14) and a standby position that extends substantially vertically (the position shown by the two-dot chain line in FIG. 14).

[0086] In FIG. 14, a door 304 with a handle 304a attached is provided on the front side surface of the dust box 302 in the X-axis direction. Inside the dust box 302, a crusher (not shown) for crushing the recovered ring-shaped reinforcing portion 24 is attached. In the dust box 302, by gripping the handle 304a and opening the door 304, the crushed debris of the ring-shaped reinforcing portion 24 housed in the dust box 302 can be taken out.

[0087] When a temporary placement table 204 on which a frame unit U having a cutting groove 256 formed at the base of the reinforcing portion 24 is temporarily placed is positioned below the separation unit 248 by a temporary placement table conveyance unit 232, the separation unit 248 exposes the ring-shaped reinforcing portion 24 on the outer periphery and sucks and holds the inside of the wafer 4 by a second lifting table 272 as shown in FIG. 16. Next, the movable piece 288 is moved by the feeding means 290 and the support substrate 400 is moved by the Z-axis feeding means 294, and a wafer 402 having a wedge is caused to act on the outer periphery of the ring-shaped reinforcing portion 24 as shown in FIG. 17. Specifically, the wedge of the wafer 402 is positioned between the tape 96 and the reinforcing portion 24. Further, the lower surface of the frame 64 is brought into contact with the sphere 404b of the frame support portion 404, and the frame 64 is supported by the sphere 404b.

[0088] Next, ultraviolet rays are irradiated from a pair of ultraviolet irradiation units 270 to reduce the adhesive force of the tape 96 attached to the ring-shaped reinforcing portion 24, and the frame unit U is rotated by a motor 284 together with the second lifting table 272 with respect to the separator 274. As a result, since the tape 96 with reduced adhesive force and the reinforcing portion 24 are separated by the wedge of the frame 402, as shown in FIG. 18, the ring-shaped reinforcing portion 24 can be separated from the frame unit U. The separated reinforcing portion 24 is conveyed to the dust box 302 by the belt conveyor 300 and recovered. Note that when separating the reinforcing portion 24, the separator 274 may be rotated with respect to the frame unit U.

[0089] Also, when separating the reinforcing portion 24, ionized air is blown from the ionizer 406 toward the frame unit U. As a result, even if static electricity is generated due to the frame 402 coming into contact with the tape 96 and the reinforcing portion 24, the static electricity is removed by the ionized air blown from the ionizer 406. For this reason, the tape 96 and the reinforcing portion 24 are not attracted to each other by static electricity, and the reinforcing portion 24 is surely separated from the frame unit U.

[0090] Note that when separating the reinforcing portion 24, as the relative rotation between the frame unit U and the separator 274 occurs, the frame 402 acting on the frame unit U rotates and the sphere 404b in contact with the lower surface of the frame 64 rotates, so that the relative rotation between the frame unit U and the separator 274 is smoothly performed.

[0091] As shown in FIG. 1, the ringless unit carrying-out means 196 is arranged adjacent to the removing device 194. Referring to FIGS. 19 and 20, the ringless unit carrying-out means 196 of the illustrated embodiment includes a frame holding portion 306 that faces the ringless unit supported by the second elevating table 272 and holds the frame 64, and moves toward the frame cassette table 200 while inverting the frame holding portion 306 (see FIG. 19); a ringless unit supporting portion 310 (see FIG. 20) that supports the ringless unit inverted by the inverting mechanism 308 with the surface 4a of the wafer 4 facing upward; and a pushing-in portion 312 (see FIG. 20) that causes the ringless unit supported by the ringless unit supporting portion 310 to enter and be accommodated in the frame cassette 198 placed on the frame cassette table 200.

[0092] As shown in FIG. 19, the inverting mechanism 308 includes a Y-axis guide member 314 extending in the Y-axis direction, a Y-axis movable member 316 movably supported by the Y-axis guide member 314 in the Y-axis direction, a Y-axis feeding means (not shown) for moving the Y-axis movable member 316 in the Y-axis direction, an arm 318 movably supported by the Y-axis movable member 316 in the Z-axis direction, and a Z-axis feeding means (not shown) for moving the arm 318 in the Z-axis direction. Each of the Y-axis and Z-axis feeding means of the inverting mechanism 308 may be configured to include a ball screw and a motor for rotating the ball screw.

[0093] The frame holding portion 306 is supported by the arm 318 so as to be vertically invertible, and a motor 320 for vertically inverting the frame holding portion 306 is attached thereto. The frame holding portion 306 of the illustrated embodiment includes a substrate 324 rotatably supported by the arm 318 via a pair of rotating shafts 322, and a plurality of suction pads 326 attached to one side of the substrate 324. Each suction pad 326 is connected to a suction means (not shown). Further, one of the rotating shafts 322 is connected to the motor 320.

[0094] The reversing mechanism 308 sucks and holds the lower surface of the frame 64 of the unit U' without a ring supported by the second lifting table 272 with the suction pad 326 facing upward, and receives the unit U' without a ring from the second lifting table 272. Further, the reversing mechanism 308 reverses the frame holding portion 306 by the motor 320 to turn the surface 4a of the wafer 4 upward, and then moves the Y-axis movable member 316 to move the unit U' without a ring held by the frame holding portion 306 toward the frame cassette table 200.

[0095] As shown in FIG. 20, the unit U' without a ring support portion 310 of the illustrated embodiment includes a pair of support plates 328 movably supported in the X-axis direction via appropriate brackets (not shown), and spacing adjustment means (not shown) for adjusting the spacing between the pair of support plates 328 in the X-axis direction. The spacing adjustment means can be composed of an appropriate actuator such as an air cylinder or an electric cylinder.

[0096] A heater (not shown) is attached to the pair of support plates 328 that support the unit U' without a ring. In a state where the spacing between the pair of support plates 328 is narrowed, the pair of support plates 328 are configured to stretch the slack and wrinkles of the tape 96 caused by the removal of the reinforcing portion 24 by heating the tape 96 of the unit U' without a ring with the heater.

[0097] Continuing the description with reference to FIG. 20, the pushing-in portion 312 of the illustrated embodiment includes a Y-axis guide member 330 extending in the Y-axis direction, a Y-axis movable member 332 movably supported by the Y-axis guide member 330 in the Y-axis direction, and Y-axis feed means (not shown) for moving the Y-axis movable member 332 in the Y-axis direction. The Y-axis movable member 332 has a base portion 334 supported by the Y-axis guide member 330, a support column 336 extending upward from the upper surface of the base portion 334, and a pressing piece 338 attached to the upper end of the support column 336. The Y-axis feed means of the pushing-in portion 312 may be configured to include a ball screw connected to the Y-axis movable member 332 and extending in the Y-axis direction, and a motor for rotating this ball screw.

[0098] As shown in FIG. 21, before receiving the ringless unit U', the ringless unit support portion 310 expands the interval between the pair of support plates 328 by the interval adjusting means, and then receives the ringless unit U' held by the suction pad 326. Then, when the ringless unit support portion 310 receives the ringless unit U', the pushing portion 312 moves the Y-axis movable member 332 in the Y-axis direction by the Y-axis feeding means, so that the ringless unit U' supported by the ringless unit support portion 310 is pressed by the pressing piece 338 and enters and is accommodated in the frame cassette 198 placed on the frame cassette table 200.

[0099] In the frame cassette 198 shown in FIGS. 1 and 21, a plurality of ringless units U' are accommodated at intervals in the vertical direction with the surface 4a of the wafer 4 facing upward. As shown in FIGS. 20 and 21, the frame cassette table 200 includes a placement portion 340 on which the frame cassette 198 is placed, and a lifting portion 342 that lifts the placement portion 340 to position it at an arbitrary height. The lifting portion 342 may have a configuration including a ball screw connected to the placement portion 340 and extending in the Z-axis direction, and a motor that rotates the ball screw.

[0100] Next, using the processing apparatus 2 as described above, a dicing tape 96 is attached to the back surface 4b of the wafer 4 in which the ring-shaped reinforcing portion 24 is formed convexly on the back surface 4b corresponding to the outer peripheral surplus region 20 to be integrated with the frame 64, and a processing method for cutting the ring-shaped reinforcing portion 24 and removing it from the wafer 4 will be described.

[0101] In the illustrated embodiment, first, as shown in FIGS. 1 and 3, a wafer cassette placing step of placing a wafer cassette 6 in which a plurality of wafers 4 are accommodated on a wafer cassette table 8 is performed. In the wafer cassette 6, a plurality of wafers 4 are accommodated at intervals in the vertical direction with the surface 4a facing upward.

[0102] Also, as shown in FIGS. 1 and 5, a frame accommodating step is performed in which a plurality of ring-shaped frames 64 each having an opening 64a for accommodating a wafer 4 are accommodated in frame accommodating means 66. The frame accommodating step may be performed before the wafer cassette placing step or after the wafer cassette placing step.

[0103] In the frame accommodating step, after the elevating plate 74 of the frame accommodating means 66 is lowered to an arbitrary position, the handle 76a is gripped to open the door 76, and a plurality of frames 64 are stacked and accommodated on the upper surface of the elevating plate 74. Also, the height of the elevating plate 74 is appropriately adjusted, and the uppermost frame 64 is positioned at a position where it can be carried out by the frame carrying-out means 68.

[0104] After performing the wafer cassette placing step and the frame accommodating step, a wafer carrying-out step is performed in which the wafer 4 is carried out from the wafer cassette 6 placed on the wafer cassette table 8.

[0105] Referring to FIG. 3 for explanation, in the wafer carrying-out step, first, the Y-axis feed means 34 of the wafer carrying-out means 10 is operated to position the Y-axis movable member 32 near the wafer cassette table 8. Next, the transfer arm 42 is driven to position a hand 44 with an air ejection port 46 facing upward on the back surface 4b side (lower side) of the wafer 4 in the wafer cassette 6. When the hand 44 is positioned on the back surface 4b side of the wafer 4, a gap is provided between the back surface 4b of the wafer 4 and the hand 44, and each guide pin 48 is positioned radially outward.

[0106] Next, compressed air is ejected from the air ejection port 46 of the hand 44 to generate a negative pressure on one side of the hand 44 by the Bernoulli effect, and the wafer 4 is attracted and supported non-contactly from the back surface 4b side by the hand 44. Next, each guide pin 48 is moved radially inward, and the horizontal movement of the wafer 4 attracted and supported by the hand 44 is restricted by each guide pin 48. Then, the Y-axis movable member 32 and the transfer arm 42 of the wafer carrying-out means 10 are moved to carry out the wafer 4 attracted and supported by the hand 44 from the wafer cassette 6.

[0107] After performing the wafer unloading process, it is preferable to perform a notch detection process for detecting the position of the notch 26 of the wafer 4. In the notch detection process, as shown in FIG. 4, the outer circumference of the wafer 4 sucked and supported by the hand 44 is positioned between the light emitting element 52 and the light receiving element 54 of the notch detection means 50. Next, the wafer 4 is rotated via the guide pin 48 by a drive source, thereby detecting the position of the notch 26 of the wafer 4. As a result, the orientation of the wafer 4 can be adjusted to an arbitrary orientation.

[0108] After performing the notch detection process, a wafer support process is performed in which the surface 4a side of the wafer 4 unloaded by the wafer unloading means 10 is supported by the wafer table 12.

[0109] Referring to FIG. 3 for explanation, in the wafer support process, first, the hand 44 of the wafer unloading means 10 is turned upside down so that the surface 4a of the wafer 4 faces downward. Next, the Y-axis movable member 32 and the transfer arm 42 of the wafer unloading means 10 are moved so that the outer peripheral surplus region 20 of the surface 4a of the wafer 4 sucked and supported by the hand 44 contacts the annular support portion 56 of the wafer table 12. At this time, since the device region 18 of the surface 4a of the wafer 4 is located in the recess 62 of the wafer table 12, the device 14 and the wafer table 12 do not come into contact with each other, and damage to the device 14 is prevented.

[0110] Next, the suction means of the wafer table 12 is operated to generate a suction force in each suction hole 60, thereby suction-holding the outer peripheral surplus region 20 of the surface 4a of the wafer 4. Next, the suction support of the wafer 4 by the hand 44 is released, and the hand 44 is separated from the wafer table 12. In this way, the wafer 4 is transferred from the wafer unloading means 10 to the wafer table 12. Since the wafer 4 transferred to the wafer table 12 is suction-held by each suction hole 60, the position of the wafer 4 does not shift.

[0111] After performing the wafer cassette placement process and the frame accommodation process, a frame unloading process of unloading the frame 64 from the frame accommodating means 66 is carried out in parallel with the wafer unloading process and the wafer support process.

[0112] Referring to FIG. 5 for explanation, in the frame unloading process, first, the X-axis movable member 84 and the Z-axis movable member 86 of the frame unloading means 68 are moved, and the suction pad 92 of the holding portion 88 is brought into contact with the upper surface of the uppermost frame 64 accommodated in the frame accommodating means 66. Next, the suction means of the frame unloading means 68 is operated to generate a suction force on the suction pad 92, thereby suction-holding the uppermost frame 64 with the suction pad 92. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame unloading means 68 are moved, and the uppermost frame 64 suction-held by the suction pad 92 of the holding portion 88 is unloaded from the frame accommodating means 66.

[0113] After performing the frame unloading process, a frame support process of supporting the frame 64 unloaded by the frame unloading means 68 with the frame table 70 is carried out.

[0114] Continuing the explanation with reference to FIG. 5, in the frame support process, first, the X-axis movable member 84 and the Z-axis movable member 86 of the frame unloading means 68 are moved, and the frame 64 suction-held by the suction pad 92 is brought into contact with the upper surface of the frame table 70. At this time, the frame table 70 is positioned at the lowered position (the position shown by the solid line in FIG. 5). Next, the suction force of the suction pad 92 of the frame unloading means 68 is released, and the frame 64 is placed on the frame table 70. Then, the X-axis movable member 84 and the Z-axis movable member 86 of the frame unloading means 68 are moved, and the holding portion 88 is separated from above the frame table 70.

[0115] After performing the frame support process, a tape sticking process of sticking the tape 96 to the frame 64 is carried out.

[0116] Referring to FIG. 6, in the tape sticking process, first, before moving the frame table 70 from the lowered position (the position shown in FIG. 6(a)) to the raised position (the position shown in FIG. 6(b)) where the tape 96 can be stuck to the frame 64, the tape 96 is pulled out from the roll tape 96R and the tape 96 with the release paper 116 peeled off is positioned above the frame table 70. Note that the adhesive surface of the tape 96 positioned above the frame table 70 faces downward.

[0117] Next, the frame table 70 is raised to such an extent that the tape 96 can be pressed against the frame 64 from above by the pressing roller 132 of the crimping portion 110 of the tape sticking means 98. Then, while pressing the adhesive surface of the tape 96 against the frame 64 with the pressing roller 132, the pressing roller 132 is rolled in the Y-axis direction. Thereby, the tape 96 pulled out from the roll tape 96R by the tape pulling-out portion 108 can be crimped to the frame 64.

[0118] Next, the cutter 144 and the pressing roller 146 of the cutting portion 112 of the tape sticking means 98 are lowered, the cutter 144 is pressed against the tape 96 on the frame 64, and the frame 64 is pressed from above the tape 96 with the pressing roller 146. Then, the arm piece 140 is rotated by the motor 138, and the cutter 144 and the pressing roller 146 are moved along the frame 64 in a circular motion. Thereby, the tape 96 protruding beyond the outer periphery of the frame 64 can be cut along the frame 64. Also, since the frame 64 is pressed from above the tape 96 with the pressing roller 146, displacement of the frame 64 or the tape 96 is prevented when the tape 96 is being cut. Note that the used tape 96 with the circular opening 120 formed is wound up by the tape winding portion 106.

[0119] After performing the tape sticking process, the frame 64 with the tape 96 stuck thereto is conveyed to the wafer table 12, and the opening 64a of the frame 64 is positioned on the back surface 4b of the wafer 4 supported by the wafer table 12, and a tape-attached frame conveying process of placing the tape-attached frame 64' on the wafer table 12 is performed.

[0120] In the tape-attached frame conveying process, first, the frame table 70 is moved from the raised position to the lowered position. Next, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame conveying means 100 (see FIG. 5) are moved, and each suction pad 158 of the holding portion 154 of the tape-attached frame conveying means 100 is brought into contact with the upper surface of the tape-attached frame 64' (see FIG. 7) supported by the frame table 70 with the adhesive surface of the tape 96 facing downward.

[0121] Next, the suction means of the tape-attached frame conveying means 100 is operated to generate a suction force on the suction pads 158, thereby suction-holding the upper surface of the tape-attached frame 64' with the suction pads 158. Next, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame conveying means 100 are moved, and the tape-attached frame 64' suction-held by the suction pads 158 is carried out from the frame table 70.

[0122] Next, the tape-attached frame 64' suction-held by the suction pads 158 of the tape-attached frame conveying means 100 is conveyed to the wafer table 12, and as shown in FIG. 7, the opening 64a of the frame 64 is positioned on the back surface 4b of the wafer 4 supported by the wafer table 12, and the tape-attached frame 64' is brought into contact with the frame support portion 58 of the wafer table 12. At this time, the adhesive surface of the tape 96 of the tape-attached frame 64' faces downward, and the back surface 4b of the wafer 4 faces upward and faces the adhesive surface of the tape 96.

[0123] Next, the suction force of the suction pad 158 of the tape-attached frame conveying means 100 is released, and the tape-attached frame 64' is placed on the frame support portion 58 of the wafer table 12. Then, the Y-axis movable member 150 and the Z-axis movable member 152 of the tape-attached frame conveying means 100 are moved, and the holding portion 154 is separated from above the wafer table 12.

[0124] After performing the tape-attached frame conveying step, a tape pressing step of pressing the tape 96 of the tape-attached frame 64' against the back surface 4b of the wafer 4 is performed.

[0125] Referring to FIGS. 7 to 9 for explanation, in the tape pressing step, first, the upper chamber 160 is lowered by the elevating mechanism 164 of the tape pressing means 102, and the lower end of the side wall 172 of the upper chamber 160 is brought into contact with the upper end of the side wall 186 of the lower chamber 162. Thereby, the upper chamber 160 and the lower chamber 162 are closed, and the pressing roller 174 is brought into contact with the tape-attached frame 64'. Then, as shown in FIG. 8, the upper end of the ring-shaped reinforcing portion 24 of the wafer 4 adheres to the adhesive surface of the tape 96 of the tape-attached frame 64'.

[0126] Next, with the air release portion 168 of the tape pressing means 102 closed, the vacuum portion 166 is operated to evacuate the interiors of the upper chamber 160 and the lower chamber 162. Then, as shown in FIGS. 8 and 9, by rolling the pressing roller 174 of the tape pressing means 102 in the Y-axis direction, the tape 96 is pressed against the back surface 4b of the wafer 4. Thereby, a frame unit U in which the back surface 4b of the wafer 4 and the tape 96 are pressed together can be generated. Next, the air release portion 168 is opened, and the tape 96 is brought into close contact with the back surface 4b of the wafer 4 along the base of the ring-shaped reinforcing portion 24 by atmospheric pressure. Then, the upper chamber 160 is raised by the elevating mechanism 164.

[0127] Note that by evacuating the interiors of the upper chamber 160 and the lower chamber 162, the suction force of the wafer 4 by the wafer table 12 is lost. However, when the upper chamber 160 and the lower chamber 162 are in a closed state, the upper end of the ring-shaped reinforcing portion 24 of the wafer 4 adheres to the adhesive surface of the tape 96 of the taped frame 64'. Therefore, the position of the wafer 4 does not shift during the tape pressing process.

[0128] After performing the tape pressing process, a frame unit unloading process is performed to unload the frame unit U in which the tape 96 of the taped frame 64' and the back surface 4b of the wafer 4 are pressure-bonded from the wafer table 12.

[0129] Referring to FIG. 5 for explanation, in the frame unit unloading process, first, the transport unit 206 of the frame unit unloading means 192 is operated, and the lower surface of the suction piece 210 of the wafer holding portion 202a of the frame unit holding portion 202 is brought into contact with the tape 96 on the back surface 4b side of the wafer 4, and the suction pad 214 of the frame holding portion 202b is brought into contact with the frame 64.

[0130] Next, a suction force is generated in the suction piece 210 of the wafer holding portion 202a and the suction pad 214 of the frame holding portion 202b. The wafer 4 is suction-held from the back surface 4b side (tape 96 side) by the suction piece 210 of the wafer holding portion 202a, and the frame 64 is suction-held by the suction pad 214 of the frame holding portion 202b. Next, the suction holding of the wafer 4 by the wafer table 12 is released. Then, the transport unit 206 is operated to unload the frame unit U held by the frame unit holding portion 202 from the wafer table 12.

[0131] After performing the frame unit unloading process, an interim placement process is performed to align the center of the wafer 4 with the center of the interim placement table 204 and interim-place the frame unit U on the interim placement table 204.

[0132] Referring to FIG. 10, in the temporary placement process, first, the frame unit U held by the frame unit holding portion 202 is positioned above the imaging unit 224. Next, the transport unit 206 that constitutes the two-dimensional movement mechanism of the frame unit carrying means 192 is operated to image at least three locations on the outer periphery of the wafer 4 of the frame unit U held by the frame unit holding portion 202 with the imaging unit 224. Thereby, at least three point coordinates on the outer periphery of the wafer 4 are measured. Next, the center coordinates of the wafer 4 are obtained based on the measured three point coordinates.

[0133] Next, the transport unit 206 is operated to position the center of the wafer 4 at the center of the annular support portion 226 of the temporary placement table 204, and the outer peripheral surplus region 20 of the surface 4a of the wafer 4 is brought into contact with the upper surface of the annular support portion 226 of the temporary placement table 204, and the lower surface of the frame 64 is brought into contact with the upper surface of the frame support portion 228 of the temporary placement table 204. At this time, although the surface 4a of the wafer 4 faces downward, since the device region 18 is located in the recess 230 of the temporary placement table 204, the device 14 and the temporary placement table 204 do not come into contact with each other, and damage to the device 14 is prevented.

[0134] Next, the suction holding of the wafer 4 by the wafer holding portion 202a is released, and the suction holding of the frame 64 by the frame holding portion 202b is released, and the frame unit U is transferred from the frame unit carrying means 192 to the temporary placement table 204. Next, the heater of the frame support portion 228 is operated to heat the tape 96 of the frame unit U temporarily placed on the temporary placement table 204 with the heater. Thereby, the tape 96 is softened and the tape 96 adheres closely to the base of the ring-shaped reinforcing portion 24 of the wafer 4.

[0135] After the temporary placement process is performed, a reinforcing portion removing process is performed to cut and remove the ring-shaped reinforcing portion 24 from the wafer 4 of the frame unit U carried out by the frame unit carrying means 192.

[0136] Referring to FIGS. 1, 10, and 12, in the reinforcing portion removal step, first, the X-axis movable member 260 and the Z-axis movable member 262 of the first lifting table 246 of the removal device 194 are moved so that the lower surface of the suction piece 268 contacts the upper surface of the frame 64 of the frame unit U temporarily placed on the temporary placement table 204. Next, a suction force is generated in each suction hole of the suction piece 268 of the first lifting table 246 to suck and hold the frame 64 portion of the frame unit U.

[0137] Next, the X-axis movable member 260 and the Z-axis movable member 262 of the first lifting table 246 are operated to position the frame unit U sucked and held by the suction piece 268 above the laser beam irradiation means 244 as shown in FIG. 11. Next, the condensing point of the laser beam LB is positioned at the base of the ring-shaped reinforcing portion 24 of the wafer 4 of the frame unit U.

[0138] Next, while rotating the suction piece 268 and the frame unit U by the motor 266 of the first lifting table 246, the ring-shaped reinforcing portion 24 of the wafer 4 is irradiated with the laser beam LB. As a result, ablation processing can be performed on the base of the ring-shaped reinforcing portion 24 of the wafer 4 to form a ring-shaped cutting groove 256. Further, when irradiating the wafer 4 with the laser beam LB, the suction means of the laser beam irradiation means 244 is operated to generate a suction force in the suction nozzle 254, and the debris generated by the ablation processing is sucked by the suction nozzle 254.

[0139] Next, the X-axis movable member 260 and the Z-axis movable member 262 of the first lifting table 246 are moved so that the outer peripheral surplus region 20 of the surface 4a of the wafer 4 of the frame unit U sucked and held by the suction piece 268 contacts the upper surface of the annular support portion 226 of the temporary placement table 204, and the lower surface of the frame 64 contacts the upper surface of the frame support portion 228 of the temporary placement table 204. Next, the suction force of the suction piece 268 of the first lifting table 246 is released, and the frame unit U is transferred from the first lifting table 246 to the temporary placement table 204.

[0140] Next, the temporary placement table 204 that has received the frame unit U is positioned by the temporary placement table conveyor 232 below the separation unit 248 of the removal device 194 (see FIG. 10). At this time, the belt conveyor 300 of the waste unit 276 is positioned at the standby position. Next, the second lifting table 272 of the separation unit 248 is lowered, and the lower surface of the second lifting table 272 is brought into contact with the tape 96 on the back surface 4b portion of the wafer 4. Next, a suction force is generated on the lower surface of the second lifting table 272, and as shown in FIG. 16, with the ring-shaped reinforcing portion 24 exposed on the outer periphery, the inside of the wafer 4 of the frame unit U is suction-held by the table head 287 of the second lifting table 272.

[0141] Next, the second lifting table 272 that has suction-held the wafer 4 of the frame unit U is raised to separate the frame unit U from the temporary placement table 204 and move the temporary placement table 204 below the first lifting table 246. Next, the movable piece 288 is moved by the feeding means 290 and the support substrate 400 is moved by the Z-axis feeding means 294. As shown in FIG. 17, the piece 402 having a wedge is made to act on the outer periphery of the ring-shaped reinforcing portion 24, the wedge of the piece 402 is positioned between the tape 96 and the reinforcing portion 24, and the frame 64 is supported by the sphere 404b of the frame support portion 404. Also, the belt conveyor 300 of the waste unit 276 is positioned from the standby position to the collection position.

[0142] Next, ultraviolet rays are irradiated from a pair of ultraviolet irradiation units 270 to reduce the adhesive force of the tape 96 attached to the ring-shaped reinforcing portion 24, and the frame unit U together with the second elevating table 272 is rotated by the motor 284 with respect to the separator 274. Also, ionized air is blown from the ionizer 406 toward the frame unit U. As a result, as shown in FIG. 18, the ring-shaped reinforcing portion 24 can be separated from the frame unit U, and static electricity generated when separating the reinforcing portion 24 does not remain in the frame unit U. The reinforcing portion 24 that has fallen from the frame unit U is conveyed to the dust box 302 by the belt conveyor 300 and recovered. Note that when separating the reinforcing portion 24, the separator 274 may be rotated with respect to the frame unit U.

[0143] After performing the reinforcing portion removal step, a ringless unit unloading step of unloading the ringless unit U' from which the ring-shaped reinforcing portion 24 has been removed from the removing device 194 is performed.

[0144] In the ringless unit unloading step, first, the belt conveyor 300 of the waste portion 276 of the removing device 194 is positioned from the collection position to the standby position. Next, the frame holding portion 306 of the reversing mechanism 308 (see FIG. 19) of the ringless unit unloading means 196 is positioned below the ringless unit U' held by suction on the second elevating table 272.

[0145] Next, with the suction pad 326 of the frame holding portion 306 facing upward, the arm 318 is raised, and the suction pad 326 of the frame holding portion 306 is brought into contact with the lower surface side of the frame 64 of the ringless unit U' in a state where the surface 4a of the wafer 4 is facing downward and supported by the second elevating table 272.

[0146] Next, an attraction force is generated on the suction pad 326 of the frame holding unit 306, and the frame 64 of the unit U' without a ring is suction-held by the suction pad 326. Next, the suction holding of the unit U' without a ring by the second elevating table 272 is released. As a result, the unit U' without a ring is transferred from the second elevating table 272 of the removing device 194 to the frame holding unit 306 of the unit U' without a ring carrying-out means 196.

[0147] After performing the step of carrying out the unit U' without a ring, a step of accommodating the unit U' without a ring carried out by the unit U' without a ring carrying-out means 196 is performed.

[0148] In the step of accommodating the unit U' without a ring, first, the inversion mechanism 308 of the unit U' without a ring carrying-out means 196 is inverted up and down to invert the unit U' without a ring suction-held by the frame holding unit 306. As a result, the unit U' without a ring is positioned below the frame holding unit 306, and the surface 4a of the wafer 4 faces upward.

[0149] Next, the Y-axis movable member 316 and the arm 318 of the inversion mechanism 308 are moved to bring the unit U' without a ring into contact with the upper surfaces of the pair of support plates 328 of the unit U' without a ring support portion 310. At this time, the interval between the pair of support plates 328 is narrowed by the interval adjusting means, and the pair of support plates 328 are in close contact with each other. Next, the suction holding of the unit U' without a ring by the frame holding unit 306 is released, and the unit U' without a ring is placed on the pair of support plates 328. Next, the heaters mounted on the respective support plates 328 are operated to heat the tape 96 of the unit U' without a ring, thereby stretching the deflection and wrinkles of the tape 96 caused by the removal of the reinforcing portion 24. Then, the unit U' without a ring is suction-held again by the frame holding unit 306 and lifted.

[0150] Next, after expanding the distance between the pair of support plates 328 by the distance adjusting means, the ringless unit U' is placed on the upper surface of the support plate 328. Then, as shown in FIG. 21, the ringless unit U' supported by the ringless unit support portion 310 is pushed by the pressing piece 338 of the pushing portion 312 and is made to enter and be accommodated in the frame cassette 198 placed on the frame cassette table 200.

[0151] As described above, in the processing apparatus 2 of the illustrated embodiment, it is easy to attach the dicing tape 96 to the back surface 4b of the wafer 4 in which the ring-shaped reinforcing portion 24 is formed convexly on the back surface 4b corresponding to the outer peripheral surplus region 20 and integrate it with the frame 64. At the same time, it is easy to cut the ring-shaped reinforcing portion 24 and remove it from the wafer 4, resulting in good productivity.

Explanation of Signs

[0152] 2: Processing apparatus 4: Wafer 4a: Front surface of the wafer 4b: Back surface of the wafer 6: Wafer cassette 8: Wafer cassette table 10: Wafer unloading means 12: Wafer table 20: Outer peripheral surplus region 24: Reinforcing portion 64: Frame 64’: Taped frame 66: Frame accommodating means 68: Frame unloading means 70: Frame table 98: Taping means 100: Taped frame conveying means 102: Tape crimping means 192: Frame unit unloading means 194: Removing device 196: Ringless unit unloading means 198: Frame cassette 200: Frame cassette table 204: Temporary table 244: Laser beam irradiation means 246: First elevating table 248: Separation part 256: Cutting groove 270: Ultraviolet irradiation part 272: Second elevating table 274: Separator 276: Disposal part 287: Table head 400: Support substrate 402: Frame 404: Frame support part 404b: Sphere 406: Ionizer

Claims

1. A method for processing a wafer having a front surface with a device region partitioned by a planned division line into a plurality of devices and a back surface with a ring-shaped reinforcing portion on the outer periphery, comprising: a tape bonding step of accommodating the wafer in an opening provided at the center of a frame having an opening for accommodating the wafer and integrating the frame and the wafer with a tape to generate a frame unit; a reinforcing portion removing step of forming a ring-shaped cutting groove for separating the ring-shaped reinforcing portion of the wafer from the frame unit, positioning a piece having a wedge between the tape and the ring-shaped reinforcing portion, and separating and removing the ring-shaped reinforcing portion from the frame unit. The method for processing a wafer according to claim 1, wherein in the reinforcing portion removing step, ionized air is blown onto the frame unit to remove static electricity.

2. A removing device for removing a ring-shaped reinforcing portion from a frame unit formed by attaching a tape to a wafer having a front surface with a device region partitioned by a planned division line into a plurality of devices and a back surface with a ring-shaped reinforcing portion on the outer periphery and having a ring-shaped cutting groove formed for separating the ring-shaped reinforcing portion, and a frame having an opening for accommodating the wafer at the center, the removing device comprising: a lifting table for holding the wafer via the tape; a frame support portion for supporting the frame; a piece having a wedge for acting between the tape and the ring-shaped reinforcing portion to separate and remove the ring-shaped reinforcing portion from the frame unit from the cutting groove; an ionizer for blowing ionized air onto the frame unit to remove static electricity when the piece is made to act on the outer periphery of the ring-shaped reinforcing portion.

Images