Apparatus, System, and Method for Repairing a Test Contact Assembly

Abstract

The present invention relates to an apparatus for repairing a test contact configuration comprising a test contact carrier (14) and a plurality of test contacts (16) each disposed spaced apart from one another on at least one contact surface (18) of the test contact carrier (14) and connected via at least one solder connection (22) via a solder bridge of which at least two are to be repaired, the apparatus comprising a movable arm (24) having at least one thermally conductive receptacle (28) formed in an end effector (26) and a heat absorption surface (30) formed in the at least one thermally conductive receptacle (28), a control device (32) configured to control the movement of the arm (24), a heating device (34) configured to heat the heat absorption surface (30), and a temperature measurement device (36) configured to measure a radiation temperature of a solder material of the solder connection (22). The receptacle (28) is configured to receive at least one thermally conductive blade element (40), and the controller (32) is configured to move the blade element (40) relative to the test contact arrangement via movement of the arm (24) to sever the at least one solder connection (22) such that the at least one solder bridge to be repaired is removable.

Description

Technical Field

[0001] The present invention relates to an apparatus for repairing a test contact structure including a test contact carrier and a plurality of test contacts each disposed at a distance from each other on at least one contact surface of the test contact carrier and connected via at least one solder connection through a solder bridge in which at least two are repaired. The apparatus includes a movable or moving arm in which at least one thermally conductive receptacle is formed in an end effector. A heat absorption surface is formed in the receptacle. Further, the apparatus includes a control device configured to control the movement of the arm, a heating device configured to heat the heat absorption surface, and a temperature measuring device configured to measure the radiation temperature of the solder material of the solder connection. Further, the present invention relates to a system having at least one test structure and an embodiment of the apparatus, and a method for repairing a test contact structure.

[0002] Methods and apparatuses for manufacturing a test contact structure are known in various embodiments. WO 2017 / 026802 discloses a method and an apparatus in which individual test contacts are gripped by a gripping tool for contacting the test contacts on a test contact carrier, and the lower edge of the gripping tool is immersed in a solder material bath for wetting the lower edge intended to contact the contact surface of the contact carrier. Subsequently, the lower edge of the test contact is placed on the contact surface of the test contact carrier by the gripping tool, and the solder material is subjected to laser radiation to produce a solder material connection between the test contact and the test contact carrier.

[0003] Furthermore, methods and apparatuses for repairing a test contact structure are generally known. For example, DE 10 2018 119 137 A1 discloses a method and an apparatus for repairing a test contact structure, in both of which at least one axial movement of a gripping tool is controlled to correct a misalignment of a test contact of the test contact structure due to the movement. By doing so, the test contact is repositioned to a target position for repairing the test contact structure.

[0004] Furthermore, methods and apparatuses for repairing solder bridges provided on test contact assemblies are known. Heretofore, repair of solder bridges on test contact assemblies or printed circuit boards has only been possible by removing or detaching test contacts, also called pins, together with the solder material. This complicates the repair of solder bridges in the prior art because several steps are required to restore the function of the test contact assembly. Therefore, new test contacts have to be disposed on the test contact assembly after removal of the solder bridge. Due to the narrow spacing between individual test contacts on the test contact carrier, this new arrangement is labor-intensive and bears the risk of array defects that may need to be repaired via repair means. As a result, a deviation can occur between the test contacts that define the pitch, i.e., the spacing between two adjacent test contacts within a row of corresponding test contact assemblies in each case is no longer correct. The inaccurate pitch results in malfunction of the test contact assembly.

[0005] Therefore, it is an object of the present invention to propose an apparatus and / or a method that can overcome the disadvantages of the prior art that occur when removing solder bridges. In particular, it is an object to enable removal of solder bridges during the process of repairing solder joints and thus avoid damage to the test contacts without detaching the test contacts.

[0006] To achieve this object, an apparatus having the features of independent claim 1 is proposed. Furthermore, a system having such an apparatus is proposed. Similarly, a method having the features of independent claim 10 is proposed.

[0007] Advantageous embodiments of the present invention are the subject matter of the dependent claims. All combinations of at least two features disclosed in the description, the claims and / or the drawings are part of the scope of the present invention. It goes without saying that the description of the apparatus equally relates to the system according to the present invention without the need for separate mention. All features and embodiments disclosed with respect to the apparatus equally relate to the method according to the present invention, if not verbatim. In particular, the linguistically general paraphrases and / or similar substitutions of each term within the scope of general language practice, in particular the use of synonyms supported by generally recognized language literature, are of course included in the present disclosure without the need to explicitly mention any variations.

[0008] In a first aspect, the present invention relates to an apparatus for repairing a test contact configuration comprising a test contact carrier and a plurality of test contacts connected via at least one solder connection, each of which is spaced apart from one another on at least one contact surface of the test contact carrier and connected via at least one solder bridge to be repaired. The apparatus preferably comprises a movable arm or a moving arm, also preferably called a cantilever, on the end effector of which at least one thermally conductive receptacle is formed. A heat-absorbing surface is formed on the receptacle. Further, the apparatus comprises a control device configured to control the movement of the arm, a heating device configured to heat the absorbing surface, and a temperature measuring device configured to measure the radiant temperature of the solder material of the solder connection. The apparatus is characterized in that the receptacle is configured to receive at least one thermally conductive blade element and the control device is configured to move the blade element relative to the test contact configuration via the movement of the arm in order to cut at least one solder connection and make at least one solder bridge to be repaired removable.

[0009] In a second aspect, the present invention relates to a method for repairing a test contact configuration comprising a test contact carrier and a plurality of test contacts connected via at least one solder connection, each solder connection being arranged spaced apart from each other on at least one contact surface of the test contact carrier and at least two of which are connected via a solder bridge to be repaired. The method includes heating the receptacle via a heat-absorbing surface formed on the receptacle of the end effector, moving the end effector relative to the test contact configuration, and measuring the radiation temperature of the solder material of the solder connection. The method according to the present invention is characterized in that the receptacle has at least one thermally conductive blade element and the movement of the end effector relative to the test contact configuration is controlled such that at least one solder connection is cut by the blade element, in particular using a cutting movement, to remove at least one solder bridge to be repaired.

[0010] In a third aspect, the present invention relates to a repair system comprising at least one test contact configuration comprising a test contact carrier and a plurality of test contacts connected via at least one solder connection, each solder connection being arranged spaced apart from each other on at least one contact surface of the test contact carrier and at least two of which are connected via a solder bridge to be repaired, and comprising a device according to any of the embodiments of the present invention.

[0011] Particularly preferably, the present invention relates to a repair system comprising a device according to any embodiment of the present invention and a plurality of, in particular various, blade elements that can be arranged on the receptacle so as to be replaceable. As a result, preferably a set of various blade elements is provided from which an appropriate blade element can be selected as required by the situation, in particular depending on the solder bridge to be repaired. The plurality of blade elements can preferably be provided on a stand such that a predetermined blade element can be arranged on the receptacle via movement of the arm to the stand.

[0012] Removing and / or detaching solder bridges during the repair process of a test contact assembly, particularly a fine pitch probe card, has hitherto only been possible by also detaching the test contacts. This was disadvantageous because the test contacts were no longer available as connection positions after the corresponding solder bridges were removed. In order to fully restore the functionality of the test contact assembly, it was necessary to newly arrange the test contacts from which the solder bridges on the test contact carrier had been removed. The device according to the invention and the method according to the invention make it possible to detach the solder bridges from the test contact assembly without the need to remove the test contacts. Thus, the method according to the invention is clearly easier to handle and, in particular, makes it possible to dispense with further repair means that were necessary in the prior art after the detachment of the solder bridges. According to the invention, the advantage is achieved in particular by cutting, in particular milling, at least one solder bridge with a blade element. For this purpose, the blade element has at least one "sharp" blade that can cut the solder connection. In the prior art, "scraping off" of the solder connection has hitherto been necessary and the corresponding test contacts have also been removed during the process. In particular, the use of the device in the LaPlace-Can repair process seems to be advantageous. The LaPlace-Can repair process is provided for the repair of fine pitch probe cards by the applicant. In the LaPlace-Can repair process, the solder connections of the test contacts for correcting misalignments of the test contacts are fused by a gripping tool that can be heated at least partially, which means that the test contacts can be gripped and repositioned. Through the solution according to the invention that does not require the detachment of the test contacts, the degree of the repair function is enhanced with respect to the invention.

[0013] In this application, the phrase "at least one" is understood to mean that the device and / or method according to the invention can include one or more of the corresponding components. The test contact structure is preferably a test contact structure that is arranged in a grid pattern and has a particularly small pitch of less than 0.5 mm, i.e., a narrow spacing, between the individual test contacts arranged on the test contact carrier. The pitch preferably represents the center-to-center spacing between two test points or component links, particularly between the test contacts of the test contact structure. This type of test contact structure is also called a fine pitch probe card. The test contacts preferably represent pins, i.e., the test points and / or the link contacts of the test contact structure. A solder bridge is preferably a connecting element made of a conductive and solderable material for manufacturing a conductive connection between two or more test contacts on the test contact structure. Furthermore, a solder bridge can also be an unintended electrical and mechanical connection between two or more electrical test contacts, particularly one to be repaired in the sense of the present invention. If the solder bridge is defective or has a misalignment due to deterioration, the electrical connection is interrupted, which means that it can cause, for example, a measurement failure. The solder connection can preferably be a mechanical and electrical connection provided between at least one test contact and the test contact carrier for the solder bridge or its connection. As the solder material, for example, lead, tin, zinc, silver, and / or copper can be used. In this application and generally in robotics, the last element of a kinematic chain, in this case the kinematic chain of the arm, is called an "end effector". In this application, the end effector preferably has a receptacle, particularly a tool receptacle, or is designed as a receptacle. The heat-absorbing surface formed on the receptacle preferably represents a part of the receptacle designed to be heated via a heat flow or energy input. The heat-absorbing surface can be, for example, the side surface of the receptacle. The control device preferably has at least one processor and / or volatile and / or non-volatile memory and can be configured as a system-on-chip or a printed circuit board control unit, etc.The temperature measuring device is preferably configured to non - contact measure the radiant temperature of the solder material. The temperature measuring device preferably has an infrared measuring unit. In particular, the radiant temperature, also called the radiant equivalent temperature, preferably represents the thermal radiation of the surface of the solder joint and the emissivity of the surface material, in this case the solder material. The blade element is preferably arranged in the receptacle so as to be in thermally conductive contact, which means that the heat introduced into the receptacle via the heat absorption surface can be transferred to the blade element. The thermally conductive connection is preferably established by the blade element being in direct contact with the receptacle, preferably with at least a part thereof.

[0014] According to a preferred embodiment, the control device is configured to move the arm so that at least one blade element performs a cutting movement capable of cutting at least one solder joint. Particularly preferably, in order to enable an optimal separation effect, the movement of the blade element in the vertical direction (z - direction) is optimized. The speed of the cutting movement is preferably limited to 1.0 mm / s, preferably 0.75 mm / s, and particularly preferably 0.5 mm / s. At this cutting speed, the blade element can be optimally impregnated into the solder to be cut.

[0015] After the complete movement in the z - direction, the speed of the shearing force for tearing or cutting the solder is limited to 1 mm / s in order to effectively utilize the force shearing effect and at the same time avoid the inclination of the blade element. Particularly preferably, according to the present invention, a process - controlled drive program for moving the arm via the control device is started and executed, and at least one blade element arranged in the receptacle is moved relative to the test contact structure so as to be able to detach at least one solder bridge, particularly with the help of thermal energy. The test contact structure is preferably received so as not to move during repair and to be immovable within the tool receptacle.

[0016] Particularly preferably, a predetermined cutting position at which the solder bridge is detached via the blade element is registered via image evaluation by an optical device, in particular a camera. Subsequently, based on the image data, it is possible to preferably determine a template for performing the cutting movement, and the solder bridge can be cut by guiding the blade along the template. In other words, the arm is moved relative to the test contact assembly based on the image data, in particular along the template, as a result of which the cutting movement can be performed. Particularly preferably, the device has two optically separated devices and / or a stereo camera for this purpose, such that the device is also capable of depth evaluation of the image data, in particular by means of triangulation. Thus, particularly preferably, the device optically captures the test contact assembly in the form of image data, identifies from the captured image data the cutting position to be aligned at which the solder bridge is to be cut via at least one blade element, and has at least one optical device configured to transmit the identified cutting position to be aligned to the control device in the form of a control signal, based on which the control device controls the movement of the arm to the cutting position to be aligned. Particularly preferably, the control device is configured to control the arm at the cutting position such that the arm performs a cutting movement for cutting the solder bridge.

[0017] According to a preferred embodiment, the blade element has a heat conduction connection to the heat absorption surface and is configured to heat at least one solder connection to the softening temperature of the solder material. In other words, the blade element has a heat conduction connection to the heat absorption surface and is thus heated such that at least one solder connection is heated to at least the softening temperature of the solder material. The blade element is preferably arranged on or received by the receptacle such that at least a region or part of the blade element contacts the receptacle at the heat conduction connection. Particularly preferably, the thermal conductivity of the blade element is at least as great as the thermal conductivity of the receptacle. The blade element is preferably manufactured from a material containing tungsten carbide. Particularly preferably, the blade element is manufactured from silicon-impregnated tungsten carbide and / or cobalt-impregnated tungsten carbide. The blade element preferably has a thickness of 20 μm to 100 μm, preferably a thickness of 30 μm or 40 μm or 50 μm. Of course, the blade element can also have any other thickness not explicitly mentioned.

[0018] Alternatively, in order to improve the hardness and surface roughness, it is possible to provide the blade with a DLC coating (diamond-like carbon coating). Particularly preferably, the blade element has at least one abutment surface that contacts directly the corresponding opposing contact surface of the receptacle.

[0019] According to a preferred embodiment, the heating device comprises a laser unit configured to heat the heat absorption surface via a laser beam directed onto the heat absorption surface. In other words, the heat absorption surface is irradiated with a laser beam in order to heat the receptacle and thus the blade element. Particularly preferably, the receptacle and thus the blade element are heated via the laser. This enables in particular non-contact heating. Preferably, the irradiation of the heat absorption surface is carried out at a wavelength in the range of blue light to infrared light, i.e., in the range of wavelengths from 380 nm to 1 mm. Particularly preferably, the irradiation is in the range of 380 nm to 500 nm or 780 nmIt is carried out in the range of ~1 mm. In particular, wavelengths in the range of 380 nm to 500 nm enable a longer service life of the blade element because absorption into the metallic material is improved. Preferably, the improved absorption effect results in a weaker thermoreversible effect in the material. In particular, wavelengths in the range of 780 nm to 1200 nm have an economic advantage because inexpensive integration is possible and there is a possibility of alternatively or additionally providing active temperature control.

[0020] More preferably, the heat absorption surface's rectangular surface is irradiated with a laser. This can preferably be carried out by bundling the laser radiation by means of a mask and / or an orientation optical system, in particular by means of a collimator. The laser unit is preferably configured to focus at least on the heat absorption surface of the receptacle in order to enable an uninterrupted heat input to the receptacle even when the receptacle is moving. This kind of focusing of the heat absorption surface can be carried out, for example, by optically tracking the heat absorption surface with at least one camera.

[0021] According to a preferred embodiment, the heating device is configured to heat the heat absorption surface via a high-temperature nitrogen fluid flow. In other words, a high-temperature nitrogen fluid flow is passed over the heat absorption surface, heating the receptacle and thus also the blade element. Generally, the heat absorption surface can also be heated using different fluid flows. However, due to the low reactivity of nitrogen and its easy availability, a nitrogen fluid flow is preferred. Particularly preferably, the heating device is configured to focus at least on the heat absorption surface of the receptacle in order to enable an uninterrupted heat input to the receptacle even when the receptacle is moving.

[0022] According to a preferred embodiment, the temperature measuring device comprises a temperature control unit configured to adjust the thermal performance of the heating device according to the radiant temperature of the solder material. In other words, the thermal performance for heating the receptacle is adjusted according to the measured radiant temperature of the solder material. Particularly preferably, the device has a TC circuit. The temperature control (TC) circuit is preferably closed. If the temperature measuring device records, for example, that the radiant temperature of the solder temperature does not correspond to a predetermined target temperature and / or a predetermined target temperature interval, i.e., is not met or exceeded, for example, the heat or energy input to the receptacle is correspondingly adapted. For example, the intensity of the laser beam or the nitrogen fluid flow is increased or reduced for this purpose. Particularly preferably, the heating device communicates with a control device for this purpose. Particularly preferably, the temperature control unit is included in the control device, which means that only one control part is required.

[0023] According to a preferred embodiment, the receptacle has a gripper or a vacuum suction unit configured to receive at least one blade element. In other words, at least one blade element is received by a gripper or a vacuum suction unit provided on the receptacle before starting the repair process and is arranged on the receptacle. For example, at least one blade element can be clamped between two grippers for arranging it on the receptacle. Alternatively, the receptacle can have a vacuum suction unit through which at least one blade element can be received, particularly sucked in. Through the gripper and / or the vacuum suction unit, the blade element can preferably be arranged on the receptacle in a reversible or detachable manner. This enables the blade element to be replaced with another blade element that may be more convenient for a particular application case depending on the situation. At least one blade element can be selected, for example, from a set of blade elements according to the solder bridge to be removed and arranged on the receptacle.

[0024] According to a preferred embodiment, the blade element has a Scotch abrasive material having a secondary bevel, in particular on at least one side, and / or a flat abrasive material having a secondary bevel, in particular, and / or a saber-shaped abrasive material, and / or a hollow abrasive material, and / or a convex abrasive material, and / or a one-sided flat abrasive material, and / or an abrasive material having at least one convex side, and / or a beveled abrasive materials, and and / or a serrated abrasive material, and / or a saw-shaped abrasive material, and / or a wavy-tooth abrasive material. The above-mentioned abrasive materials are merely illustrative and should not be understood as limiting the scope of the present invention. In particular, at least one blade element can also have several blade parts and / or blade tips. Similarly, for example, several blade elements can be arranged in a receptacle at a predetermined interval from each other, for example, to cut, in particular to detach, two or more solder joints simultaneously. Through at least one blade element, not only is the solder joint cut, but it is also preferred that the solder material is further melted and cut through the heated blade element. Preferably, the cutting is carried out when the solder material is at least partially melted, in particular before the solder material is completely melted. Thereby, the solder material can be cut easily and efficiently.

[0025] In this context, the Scandi grinding material has been proven to be optimal for cutting both sides of the solder bridge, since the wedge shape at its tip results in rapid and optimal cutting. The generated gap or kerf is particularly favorable when, in particular, the force acting on the test contacts (also called test pins) can be exerted via the movement of the solder, with a larger spacing and / or a greater amount of solder material to be cut. In this case, for example, a lateral shearing movement can be used when performing the cutting. One-sided flat grinding allows for deep immersion into the solder bridge and produces sharp (cut or severed) edges without exerting large forces. Thus, preferably, a small gap is produced that preferably does not involve the risk that the forces caused, in particular, by displaced solder material are applied to adjacent test pins. This is particularly preferred when the test contacts are close to each other, i.e., spaced closely apart from each other, which means there is a risk of displacement due to the accumulation of solder material. In the case of a closely meshed arrangement of the test contacts and / or a low height of the solder bridge, a hollow grinding material is preferred since little displacement of the solder material is required. The saw-shaped grinding material is preferably used when a large amount of solder material is cut, which is cut slowly, in particular, by the feed movement. The saw-tooth grinding material is preferably used for a large amount of oxidized solder material that is cut slowly by a pulling movement.

[0026] Of course, the embodiments and exemplary embodiments described above and further described below can be realized not only individually without departing from the scope of the present invention, but also in any combination with each other. Furthermore, the embodiments and exemplary embodiments described above and further described below need not be referred to separately and also relate to the method according to the present invention in an equivalent or at least similar way.

[0027] Embodiments of the present invention are schematically shown in the drawings and explained below in an exemplary manner.

Brief Description of the Drawings

[0028]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

[0029] FIG. 1 shows a repair system 100 including a test contact structure 10 and a device 12 for repairing the test contact structure 10. The test contact structure 10 includes a test contact carrier 14 and a plurality of test contacts 16 (see also FIG. 2). The plurality of test contacts 16 are spaced apart from each other on the contact surface 18 of the test contact carrier 14. The interval between the test contacts 16 is called a pitch. Exemplarily, two of the plurality of test contacts 16 are connected via at least one solder connection 22 via a solder bridge 20 to be repaired (see also FIG. 3).

[0030] The machine 12 is provided with a movable arm 24, and at least one heat-conductive receptacle 28, in particular a tool receptacle, is formed in the end effector 26 of the movable arm 24. A heat-absorbing surface 30 is formed in the receptacle 28. The machine 12 further comprises a control device 32 configured to control, in particular, the movement of the arm 24 in three-dimensional space. According to FIG. 2, two spatial dimensions x, y in which the arm 24 is movable are exemplarily shown. Further, the arm 24 is also movable in the z direction (pointing inside the plane of FIG. 2). Further, the machine 12 has a heating device 34 configured to heat the heat-absorbing surface 30 preferably without contact. The heating device 34 is, for example, a laser unit and / or a laser module, or a heating device that focuses a high-temperature nitrogen fluid flow onto the heat-absorbing surface 30. Similarly, the machine 12 has a temperature measuring device 36 configured to measure the radiant temperature of the solder material of the solder connection 22. Exemplarily, according to FIG. 1, the machine 12 comprises a temperature control device 38 configured to control the thermal performance of the heating device 34 according to the measured radiant temperature of the solder material. Thus, there is feedback from the perspective of control between the temperature measuring device 36 and the control device 32. For this purpose, the control device 32 is designed as the temperature control device 38.

[0031] Machine 12 is characterized in that the receptacle 28 is configured to receive at least one thermally conductive blade element 40. The control device 32 is configured to move the blade element 40 relative to the test contact assembly 10 via the movement of the arm 24 in order to disconnect at least one solder connection 22 and make at least one solder bridge 20 to be repaired removable. For this purpose, the arm 24, in particular the receptacle 28 in which at least one blade element 40 is arranged, is displaced along at least the x and / or y and / or z directions. It is also possible to control the rotational movement around at least one of the main movement axes x, y, z. According to FIG. 1, the receptacle 28 comprises two blade elements 40, and the two blade elements 40 are arranged in the receptacle 28 so as to pass through both sides of the test contact 16 in synchronization (viewed along the extension of its longitudinal direction) and cut the solder connection 22.

[0032] The control device 32 is configured to move the arm 24 so that at least one blade element 40 performs a cutting movement capable of cutting at least one solder connection 22. Furthermore, the blade element 40 is in thermally conductive contact with the heat absorption surface 30 and is configured to heat at least one solder connection 22 to the softening temperature of the solder material. This softening temperature preferably depends on the material and represents the threshold temperature at which the solder material leaves the solid state and becomes deformable or changes to the liquid state.

[0033] The blade element 40 can be held in the receptacle 28 via, for example, a gripper 42 (see FIG. 1) or a vacuum suction unit 44 (see FIG. 3).

[0034] FIGS. 4 and 5 exemplarily show various blade shapes of at least one blade element 40, each of which is preferably used according to the solder bridge to be cut. The various blade forms are marked with different letters (a) to (l) in this figure.

[0035] The following can be seen: (a) a blade element 40 having a scandi grinding material with a secondary bevel, (b) a blade element 40 having a flat grinding material with a secondary bevel, (c) a blade element 40 having a saber-shaped grinding material, (d) a blade element 40 having a hollow grinding material, (e) a blade element 40 having a convex grinding material, (f) a blade element 40 having one-sided flat grinding, (g) a blade element 40 having a grinding material that is convex on at least one side, (h) a blade element 40 having a beveled grinding material and a saber-shaped grinding material, (i) a blade element 40 having a beveled grinding material and a hollow grinding material, (j) a blade element 40 having a serrated grinding material, (k) a blade element 40 having a saw-shaped grinding material, and (l) a blade element 40 having a wavy-tooth grinding material. FIGS. 5(j) and 5(k) show the blade element 40 in two figures each.

Claims

1. A device for repairing a test contact structure (10) comprising a test contact carrier (14) and a plurality of test contacts (16) each connected via at least one solder connection (22) to at least one solder bridge (20) which is arranged spaced apart from one another on at least one contact surface (18) of the test contact carrier (14) and at least two of which are to be repaired, the device (12) comprising: A movable arm (24) having at least one thermally conductive receptacle (28) formed in an end effector (26), the at least one thermally conductive receptacle (28) having a heat absorption surface (30) formed therein; A control device (32) configured to control the movement of the arm (24); A heating device (34) configured to heat the heat absorption surface (30); A temperature measuring device (36) configured to measure the radiant temperature of the solder material of the solder connection (22); And comprising; The receptacle (28) is configured to receive at least one thermally conductive blade element (40), and the control device (32) is configured to move the blade element (40) relative to the test contact structure (10) via the movement of the arm (24) so as to be able to cut the at least one solder connection (22) and remove the at least one solder bridge (20) to be repaired. A device characterized by that.

2. The device according to claim 1, characterized in that the control device (32) is configured to move the arm (24) so that the at least one blade element (40) performs a cutting movement capable of cutting the at least one solder connection (22).

3. The device according to claim 1 or 2, characterized in that the blade element (40) has a thermally conductive connection to the heat absorption surface (30) and is configured to heat the at least one solder connection (22) to the softening temperature of the solder material.

4. The device according to claim 1 or 2, characterized in that the heating device (34) comprises a laser unit configured to heat the heat absorption surface (30) via a laser beam directed towards the heat absorption surface (30).

5. The equipment according to claim 1 or 2, characterized in that the heating device (34) is configured to heat the heat absorption surface (30) through a high-temperature nitrogen fluid flow.

6. The equipment according to claim 1 or 2, characterized in that the temperature measuring device (36) comprises a temperature control unit (38) configured to adjust the thermal performance of the heating device (34) according to the radiation temperature of the solder material.

7. The equipment according to claim 1 or 2, characterized in that the receptacle (28) has a gripper (42) or a vacuum suction unit (44) configured to receive the at least one blade element.

8. The equipment according to claim 1 or 2, characterized in that the blade element (40) has a Scotch abrasive with a secondary bevel on at least one side, and / or a flat abrasive with a secondary bevel, and / or a saber-shaped abrasive, and / or a hollow abrasive, and / or a convex abrasive, and / or a one-sided flat abrasive, and / or an abrasive with at least one convex side, and / or an abrasive with a bevel, and / or a serrated abrasive, and / or a saw-shaped abrasive, and / or a wavy-tooth abrasive.

9. A repair system comprising at least one test contact structure (10) comprising a test contact carrier (14) and a plurality of test contacts (16) each connected via at least one solder connection (22) spaced apart from each other on at least one contact surface (18) of the test contact carrier (14) and via at least one solder bridge (20) to be repaired, and comprising the equipment according to claim 1 or 2.

10. A method for repairing a test contact structure (10) comprising a test contact carrier (14) and a plurality of test contacts (16) each connected via at least one solder connection (22) spaced apart from each other on at least one contact surface (18) of the test contact carrier (14) and via at least one solder bridge (20) to be repaired, comprising: heating the receptacle (28) through a heat absorption surface (30) formed on the receptacle (28) of the end effector (26); moving the end effector (26) relative to the test contact structure (10); measuring the radiation temperature of the solder material of the solder connection (22) comprising, wherein the receptacle (28) has at least one thermally conductive blade element (40), and the movement of the end effector (26) relative to the test contact assembly (10) is controlled such that the at least one solder connection (22) is severed by the blade element (40) to remove at least one solder bridge (20) to be repaired. **Claim 11** The method according to claim 10, wherein the blade element (40) has a thermally conductive connection to the heat absorption surface (30), and is thus heated to heat the at least one solder connection (22) to the softening temperature of the solder material. **Claim 12** The method according to claim 10 or 11, wherein the heat absorption surface (30) is irradiated with laser light or a nitrogen fluid flow is passed over the heat absorption surface (30) to heat the receptacle (28) and the blade element (40). **Claim 13** The method according to claim 10 or 11, wherein the thermal performance for heating the receptacle (28) is adjusted according to the measured radiant temperature of the solder material. **Claim 14** The method according to claim 10 or 11, wherein the at least one blade element (40) is received by a gripper (42) or a vacuum suction unit (44) provided on the receptacle (28) and disposed on the receptacle (28) before the repair process is started. **Claim 15** The method according to claim 10 or 11, wherein the at least one solder connection (22) is severed by the blade element (40) having at least one of a Scotch abrasive with a secondary bevel on at least one side, and / or a flat abrasive with a secondary bevel, and / or a serrated abrasive, and / or a hollow abrasive, and / or a convex abrasive, and / or a flat abrasive on at least one side, and / or an abrasive with at least one convex side, and / or an abrasive with a bevel, and / or a saw-tooth abrasive, and / or a saw-shaped abrasive, and / or a wavy-tooth abrasive.

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