Film forming apparatus

Abstract

To improve accessibility during maintenance of a defensive plate.SOLUTION: An in-line type deposition apparatus for depositing onto a substrate, while transporting the substrate, includes a conveyance unit for conveying the substrate, a vapor deposition unit containing a vapor deposition source, and movable to a first position under the conveyance unit, and to a second position displaced in the lateral direction to the first position, and a defensive plate for preventing a vapor deposition material discharged from the vapor deposition source from adhering to an inner wall of the vapor deposition unit, while allowing adhesion to the substrate. The defensive plate is supported by the vapor deposition unit, and is movable to the first position and to the second position.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to a film forming apparatus.

Background Art

[0002] Conventionally, an in-line type apparatus that processes a substrate while transporting the substrate is known. Patent Document 1 discloses a technique in which, in an in-line type substrate processing apparatus, a film forming source can be moved from a film forming position in a vacuum chamber to a maintenance position outside the vacuum chamber.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] By the way, in such a film forming apparatus, an anti-deposition plate may be provided to suppress the adhesion of a deposited substance to members other than the substrate, such as a vacuum chamber. In the above prior art, when the film forming source is moved to the maintenance position, the anti-deposition plate remains in the vacuum chamber on the substrate transport side, so it may be difficult to access the anti-deposition plate during maintenance of the anti-deposition plate.

[0005] The present invention provides a technique for improving the accessibility during maintenance of the anti-deposition plate.

Means for Solving the Problems

[0006] According to one aspect of the present invention, a transport unit for transporting a substrate, a film forming source unit including an evaporation source, which is movable between a first position below the transport unit and a second position displaced laterally with respect to the first position, A deposition preventing plate is provided which allows the deposited material released from the evaporation source to adhere to the substrate while preventing it from adhering to the inner wall of the film forming source unit. An in-line film forming apparatus for forming a film on a substrate while transporting the substrate, wherein the deposition preventing plate is supported by the film forming source unit and is movable together with the film forming source unit between the first position and the second position. A film forming apparatus is provided, characterized by the above.

Advantages of the Invention

[0007] According to the present invention, the accessibility during maintenance of the deposition preventing plate can be improved.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Embodiments for Carrying Out the Invention

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims, and not all combinations of the features described in the embodiments are essential for the invention. Two or more of the features described in the embodiments may be arbitrarily combined. Also, the same or similar configurations are given the same reference numerals, and duplicate descriptions are omitted.

[0010] Also, in each figure, the X direction indicates the substrate conveyance direction, the Y direction indicates the substrate width direction, and the Z direction indicates the vertical direction.

[0011] <First Embodiment> <Outline of Film Deposition Apparatus> FIG. 1 is a front view schematically showing a film deposition apparatus 1 according to an embodiment. FIG. 2 is a side view of the film deposition apparatus 1 of FIG. 1. FIG. 3 is a view schematically showing the internal structure of the film deposition apparatus 1 of FIG. 1.

[0012] The film deposition apparatus 1 is an in-line type film deposition apparatus that performs vapor deposition on a substrate while conveying the substrate. The film deposition apparatus 1 is used, for example, in the manufacture of display panels of organic EL display devices for smartphones, and a plurality of units can be arranged side by side to constitute the manufacturing line.

[0013] In this embodiment, substrates held by the substrate holding tray 100 are sequentially conveyed to the film forming apparatus 1, and the film forming apparatus 1 vapor-deposits an organic EL on the conveyed substrates. The substrate is held by the substrate holding tray 100 in a state of being superposed with a mask in a process upstream of being conveyed to the film forming apparatus 1, for example, and is conveyed to the film forming apparatus 1. Therefore, in the film forming apparatus 1, a thin film of a vapor deposition material having a predetermined pattern is formed on the substrate by the mask. As the material of the substrate on which vapor deposition is performed in the film forming apparatus 1, glass, resin, metal, etc. can be appropriately selected, and a substrate having a resin layer such as polyimide formed on glass is preferably used. As the vapor deposition material, substances such as organic materials and inorganic materials (metals, metal oxides, etc.) are used. The film forming apparatus 1 is applicable to manufacturing apparatuses for manufacturing electronic devices such as display devices (flat panel displays, etc.), thin film solar cells, and organic optoelectronic conversion elements (organic thin film imaging elements), and optical members, etc., and in particular, is applicable to manufacturing apparatuses for manufacturing organic EL panels. In the following description, an example in which the film forming apparatus 1 forms a film on a substrate by vacuum vapor deposition will be described, but the mode of the film forming method is not limited to this, and various film forming methods such as sputtering and CVD can be applied.

[0014] The film forming apparatus 1 includes a conveyance unit 2, a vapor deposition source unit 3, a deposition prevention plate 6, a moving unit 7, and a frame portion 101.

[0015] The frame portion 101 is provided so as to be able to support components such as the conveyance unit 2 of the film forming apparatus 1. In the example of FIG. 1, the frame portion 101 includes columns and beams and supports the conveyance unit 2 and the vacuum pump 102. Further, the frame portion 101 may be provided with a work crane or a passage for maintenance by an operator.

[0016] The conveyance unit 2 conveys the substrate. In this embodiment, the conveyance unit 2 conveys the substrate by conveying the substrate holding tray 100 in a state of holding the substrate. The conveyance unit 2 includes a conveyance chamber 21 and conveyance rollers 22.

[0017] The transfer unit 2 transfers the substrate. In this embodiment, the transfer unit 2 transfers the substrate by transferring the substrate holding tray 100 while holding the substrate. The transfer unit 2 includes a transfer chamber 21 and transfer rollers 22.

[0018] The transfer chamber 21 is a box-shaped chamber capable of maintaining a vacuum inside. The internal space 210 of the transfer chamber 21 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the transfer chamber 21 is connected to a vacuum pump 102. Note that, in this specification, "vacuum" means a state filled with a gas having a pressure lower than atmospheric pressure, in other words, a decompressed state.

[0019] An inlet opening 211 through which the substrate holding tray 100 is carried in and an outlet opening 212 through which the substrate holding tray 100 is carried out are formed in the transfer chamber 21. Further, a communication opening 213 for communicating the internal space 210 with the internal space 310 of the evaporation source chamber 31 is formed at the lower part of the transfer chamber 21. Note that gate valves (not shown) or the like may be provided at the inlet opening 211 and the outlet opening 212 to maintain the internal space 210 in a vacuum.

[0020] The transfer rollers 22 transfer the substrate holding tray 100 while holding the substrate. The transfer rollers 22 are provided in the internal space 210 of the transfer chamber 21. The transfer rollers 22 are, for example, cylindrical members formed of a metal material and rotatably supported. The transfer rollers 22 are driven by an electric motor (not shown) provided outside the transfer chamber 21, for example.

[0021] Further, in this embodiment, reinforcing ribs 23 are provided at the lower part of the transfer unit 2.

[0022] The evaporation source unit 3 is a unit (film forming source unit) having an evaporation source 32 (film forming source) that releases an evaporation substance onto a substrate. In the present embodiment, three evaporation source units 3 are arranged side by side in the substrate conveyance direction (X direction) with respect to one conveyance unit 2. However, the number of evaporation source units 3 can be set as appropriate, and it may be two or less or four or more. Further, the evaporation source unit 3 is positioned below the conveyance unit 2 and connected to the lower part of the conveyance unit 2 during the execution of the evaporation process. The evaporation source unit 3 includes an evaporation source chamber 31 and an evaporation source 32.

[0023] The evaporation source chamber 31 is a box-shaped chamber capable of maintaining a vacuum inside. The internal space 310 of the evaporation source chamber 31 can communicate with the internal space 210 of the conveyance chamber 21 through a communication opening 311 provided in the upper part of the conveyance chamber 21. The internal space 310 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas, similar to the internal space 210 during operation.

[0024] The evaporation source 32 releases an evaporation substance for film formation on the substrate conveyed by the conveyance unit 2. For example, the evaporation source 32 includes a plurality of nozzles (not shown) arranged side by side in the Y direction, and the evaporation substance is released from each nozzle. Also, for example, the evaporation source 32 includes a storage section for storing the evaporation substance and a heater (both not shown) for heating the evaporation substance stored in the storage section. The evaporation substance stored in the storage section is heated by the heater and vaporized, whereby the evaporation substance is released from the evaporation source 32.

[0025] Further, the evaporation source unit 3 may include a shutter for shielding the evaporation source 32 when the evaporation source 32 is not in use, an evaporation rate monitor for monitoring the evaporation amount of the evaporation substance by the evaporation source 32, etc. (both not shown).

[0026] In the present embodiment, as shown in detail in FIG. 4, the evaporation source 32 is configured to be movable by the moving unit 7.

[0027] The anti-deposition plate 6 prevents the deposition material released from the evaporation source 32 from adhering to the inner wall of the evaporation source chamber 31 or the transfer chamber 21, etc. For example, the anti-deposition plate 6 is supported by the evaporation source chamber 31. In the present embodiment, the anti-deposition plate 6 is positioned across from the inner space 310 to the inner space 210 so as to cover the evaporation source 32, and an opening is formed at the upper part. With such a configuration, a part of the deposition material adheres to the substrate through the opening, while the remaining deposition material adheres to the anti-deposition plate 6. In this way, the anti-deposition plate 6 allows the deposition material to adhere to the substrate while preventing the deposition material from adhering to the inner wall of the evaporation source chamber 31 or the transfer chamber 21, etc. The specific configuration of the anti-deposition plate 6 will be described later.

[0028] In addition, in the transfer chamber 21 or the evaporation source chamber 31, anti-deposition plates other than the anti-deposition plate 6 may be provided. For example, an anti-deposition plate may be provided on the top surface or side surface inside the transfer chamber 21.

[0029] The moving unit 7 is a unit that moves the evaporation source unit 3 relative to the transfer unit 2. In the present embodiment, the moving unit 7 is provided below the evaporation source unit 3, and while supporting the evaporation source unit 3, it moves the evaporation source unit 3 in the vertical direction (Z direction) or the horizontal direction (Y direction). The moving unit 7 includes a lateral moving part 71 and a lifting part 72.

[0030] The lateral moving part 71 moves the evaporation source unit 3 in the horizontal direction (Y direction). In the present embodiment, the lateral moving part 71 moves the evaporation source unit 3 in the width direction (Y direction) of the substrate that intersects the conveyance direction (X direction) of the substrate. The lateral moving part 71 includes a guide part 711 provided on the floor surface and a driving part 712 for moving the evaporation source unit 3 along the guide part 711. As the driving part 712, well-known techniques can be appropriately adopted. For example, a driving wheel that can travel on a rail as the guide part 711 may be rotated by a motor or the like.

[0031] The elevating unit 72 raises and lowers the evaporation source unit 3. In the present embodiment, the elevating unit 72 raises and lowers the evaporation source unit 3 in the vertical direction (Z direction). The elevating unit 72 includes an evaporation source unit support portion 721 that supports the evaporation source unit 3, and a drive portion 722 that raises and lowers the evaporation source unit support portion 721. Although well-known techniques can be adopted as the drive portion 722, for example, the evaporation source unit support portion 721 may be raised and lowered by an electric cylinder or the like.

[0032] FIG. 4 is a diagram for explaining the movement operation of the evaporation source unit 3 by the moving unit 7.

[0033] The state ST1 is a state in which the evaporation source unit 3 is located at the connection position POS1 (third position) where it is connected to the transfer unit 2. The state ST1 is the state when the film forming apparatus 1 performs evaporation on the substrate. In the state ST1, the evaporation source unit 3 is located below the transfer unit 2, and the lower part of the transfer unit 2 and the upper part of the evaporation source unit 3 are connected.

[0034] The state ST2 is a state in which the evaporation source unit 3 has moved from the connection position POS1 to the connection release position POS2 (first position) below it. The evaporation source unit 3 moves in the -Z direction from the connection position POS1 to the connection release position POS2 by the elevating unit 72 of the moving unit 7.

[0035] The state ST3 is a state in which the lateral movement of the evaporation source unit 3 from the connection release position POS2 is completed. In the state ST3, the evaporation source unit 3 is located at the maintenance position POS3 (second position) where maintenance of the transfer unit 2 or the evaporation source unit 3 is performed. For example, when performing maintenance on the transfer unit 2, the operator can access the inside of the transfer chamber 21 from the space below the transfer unit 2 generated by the lateral movement of the evaporation source unit 3. Also, for example, when performing maintenance on the evaporation source unit 3, by moving the target evaporation source unit 3 to the maintenance position POS3, the operator can access the inside of the evaporation source chamber 31 from the longitudinal side surface of the evaporation source chamber 31.

[0036] In this embodiment, the moving unit 7 is provided for each of the plurality of evaporation source units 3. Therefore, the film forming apparatus 1 of this embodiment can move the plurality of evaporation source units 3 independently. Note that the plurality of moving units 7 may be synchronized to move the plurality of evaporation source units 3 together. Also, a number of moving units 7 fewer than the number of evaporation source units 3 may be provided, and one moving unit 7 may move the plurality of evaporation source units 3.

[0037] <Configuration of the anti-deposition plate> FIG. 5 is a perspective view showing the configuration of the anti-deposition plate 6, and shows a state when the evaporation source unit 3 is connected to the transfer unit 2. That is, the state of the anti-deposition plate 6 when the evaporation source unit 3 is located at the connection position POS1 is shown. In this embodiment, the anti-deposition plate 6 includes an upper portion 61 and a lower portion 62.

[0038] The upper portion 61 includes a plurality of side wall members 611 to 618 that form its side walls. An opening 619 is formed in the upper part of the upper portion 61. The opening 619 is provided so as to face the substrate conveyed by the transfer unit 2 during the execution of the evaporation process (see FIG. 3). The evaporation substance released from the evaporation source 32 passes through this opening 619 and adheres to the substrate. The upper portion 61 also includes a connection portion 6110 for connecting to the evaporation source chamber 31. The connection portion 6110 is attached to, for example, a frame provided so as to surround the upper portion 61, and is connected to the evaporation source chamber 31 when this frame is supported by the evaporation source chamber 31.

[0039] The lower portion 62 includes a plurality of side wall members 621 to 628 that form its side walls. The upper portion 61 also includes a connection portion 6210 for connecting to the evaporation source chamber 31. The connection portion 6210 is attached to, for example, a frame provided so as to surround the lower portion 62, and is connected to the evaporation source chamber 31 when this frame is supported by the evaporation source chamber 31.

[0040] In this embodiment, the upper portion 61 is provided so as to be movable in the vertical direction with respect to the evaporation source chamber 31 by, for example, a frame to which the connection portion 6110 is attached being supported so as to be movable in the vertical direction with respect to the evaporation source chamber 31. On the other hand, the lower portion 62 is provided in a state where the vertical movement with respect to the evaporation source chamber 31 is restricted by, for example, a frame to which the connection portion 6210 is attached being fixed to the evaporation source chamber 31. That is, the upper portion 61 is provided so as to be relatively movable with respect to the lower portion 62.

[0041] FIG. 6 is a perspective view showing the configuration of the anti-deposition plate 6, and shows a state in which the upper portion 61 has moved downward relative to the lower portion 62. For example, the anti-deposition plate 6 is in the state shown in FIG. 6 when the connection between the evaporation source unit 3 and the transport unit 2 is released, that is, when the evaporation source unit 3 is at the disconnection position POS2, the maintenance position POS3, or located between them.

[0042] FIGS. 7(A) to 7(C) are diagrams schematically showing the arrangement of the anti-deposition plate 6 with respect to the transport unit 2. FIG. 7(A) shows the arrangement of the anti-deposition plate 6 in a state where the evaporation source unit 3 is at the connection position POS1. In this state, the upper end of the upper portion 61 is close to the transport path of the substrate holding tray 100. By bringing the substrate holding tray 100 closer to the upper end of the upper portion 61, it is possible to more effectively prevent the deposition material that does not adhere to the substrate from adhering to the inner wall of the evaporation source chamber 31 or the transport chamber 21 or the like. In this state, the distance from the lower end of the transport unit 2 to the upper end of the anti-deposition plate 6 is the distance ΔZ1.

[0043] FIG. 7(B) shows a state where the vapor deposition source unit 3 is at the disconnection position POS2, with the relative positional relationship between the upper portion 61 and the lower portion 62 of the anti-deposition plate 6 remaining unchanged, as an aspect different from the present embodiment. Here, when moving the anti-deposition plate 6 together with the vapor deposition source unit 3 from the disconnection position POS2 to the maintenance position POS3, it is necessary to avoid contact between the transfer unit 2 and the anti-deposition plate 6. In the case of the configuration shown in FIG. 7(B), in order to avoid contact between the transfer unit 2 and the anti-deposition plate 6, it is necessary to make the moving distance ΔZ2 of the vapor deposition source unit 3 from the connection position POS1 to the disconnection position POS2 larger than the distance ΔZ1.

[0044] FIG. 7(C) shows a state where the upper portion 61 of the anti-deposition plate 6 moves downward with respect to the lower portion 62, with the vapor deposition source unit 3 at the disconnection position POS2. In the case of the configuration shown in FIG. 7(C), the moving distance ΔZ3 of the vapor deposition source unit 3 from the connection position POS1 to the disconnection position POS2 required to avoid contact between the transfer unit 2 and the anti-deposition plate 6 is smaller than the distance ΔZ1. That is, in the case of the configuration shown in FIG. 7(C), it is sufficient that the sum of the moving distance of the vapor deposition source unit 3 and the distance by which the upper portion 61 moves downward with respect to the lower portion 62 is larger than the distance ΔZ1. Therefore, the moving distance ΔZ3 of the vapor deposition source unit 3 becomes smaller than the distance ΔZ1, and as a result, it becomes smaller than the moving distance ΔZ2.

[0045] As described above, according to the present embodiment, the anti-deposition plate 6 can move between the disconnection position POS2 and the maintenance position POS3 together with the vapor deposition source unit 3. Thereby, since the anti-deposition plate 6 can be pulled out together with the vapor deposition source unit 3, the accessibility during maintenance of the anti-deposition plate 6 is improved. Therefore, the removal of the anti-deposition plate 6 or the work on the anti-deposition plate 6 can be executed more easily.

[0046] Further, according to the present embodiment, when the deposition prevention plate 6 is pulled out together with the evaporation source unit 3, the deposition prevention plate 6 is movable downward with respect to the evaporation source unit 3. More specifically, the upper portion 61 of the deposition prevention plate 6 is movable downward with respect to the lower portion 62 and the evaporation source unit 3. Thereby, when moving the evaporation source unit 3 from the disconnection position POS2 to the maintenance position POS3 together with the deposition prevention plate 6, contact between the transfer unit 2 and the deposition prevention plate 6 can be avoided.

[0047] Further, according to the present embodiment, the moving distance ΔZ3 of the evaporation source unit 3 from the connection position POS1 to the disconnection position POS2 required to avoid contact between the transfer unit 2 and the deposition prevention plate 6 is smaller than the distance ΔZ1 from the lower end of the transfer unit 2 to the upper end of the deposition prevention plate 6. Therefore, the moving distance of the evaporation source unit 3 can be reduced as compared with a configuration in which the relative positional relationship between the upper portion 61 and the lower portion 62 of the deposition prevention plate 6 as shown in FIG. 7(B) does not change. Further, from another point of view, with the configuration in which the deposition prevention plate 6 is movable downward with respect to the evaporation source unit 3, the moving distance ΔZ3 of the evaporation source unit 3 required to avoid contact between the transfer unit 2 and the deposition prevention plate 6 during the movement of the evaporation source unit 3 is reduced, and the deposition prevention plate 6 can be brought closer to the substrate during the execution of the deposition process.

[0048] <Explanation of the operation of the deposition prevention plate> In the present embodiment, in conjunction with the downward movement of the evaporation source unit 3 with respect to the transfer unit 2, the upper portion 61 of the deposition prevention plate 6 moves downward with respect to the lower portion 62. Hereinafter, the interlocking operation between the evaporation source unit 3 and the deposition prevention plate 6 will be described. FIG. 8 is an explanatory diagram of the operation of the deposition prevention plate 6. Specifically, in conjunction with the movement of the evaporation source unit 3 from the connection position POS1 to the disconnection position POS2, an operation in which the upper portion 61 moves relatively downward with respect to the lower portion 62 is shown.

[0049] FIG. 8 shows a moving mechanism 5 for moving the upper portion 61 relative to the lower portion 62. The moving mechanism 5 includes a movable plate 51, a lever 52, and a guide 53. The movable plate 51 is connected to the upper portion 61 and moves vertically together with the upper portion 61. The lever 52 is rotatably supported by a shaft member 521 provided in the vapor deposition source chamber 31. A roller 522 that is movable along a guide groove 511 formed in the movable plate 51 is provided at one end of the lever 52. A roller 523 that is movable along the guide 53 is provided at the end of the lever 52 opposite to the end where the roller 522 is provided. The guide 53 is provided inside the transfer chamber 21 and includes an upper contact portion 531 and a lower contact portion 532 that contact the roller 523.

[0050] In the state (state ST11) where the vapor deposition source unit 3 is at the connection position POS1, the upper portion 61 of the anti-deposition plate 6 is in a state of not moving downward relative to the lower portion 62 (see FIG. 5). At this time, the position of the roller 523 of the lever 52 is defined to be below the shaft member 521 by the guide 53. Therefore, the roller 522 provided at the end of the lever 52 opposite to the end where the roller 523 is provided is engaged with the guide groove 511 of the movable plate 51 that connects to the upper portion 61 at a position above the shaft member 521. That is, the upper portion 61 is in a state of being lifted by the lever 52.

[0051] In the state (state ST12) where the vapor deposition source unit 3 is descending from the connection position POS1, the lever 52 rotates clockwise in the direction shown by the guide 53. This rotation is caused by the force applied to the roller 522 through the movable plate 51 by the weight of the upper portion 61 or the force applied to the roller 523 from the lower contact portion 532 of the guide 53. Due to this rotation, the upper portion 61 moves downward relative to the lower portion 62.

[0052] Finally, in the state (state ST13) where the evaporation source unit 3 is located at the disconnection position POS2, the upper part 61 has moved downward by a predetermined distance with respect to the lower part 62. This predetermined distance may be, for example, the distance necessary to avoid contact between the transfer unit 2 and the anti-deposition plate 6 as shown in FIG. 7(C).

[0053] When the evaporation source unit 3 moves from the disconnection position POS2 to the connection position POS1, the upper part 61 moves upward with respect to the lower part 62 by an operation reverse to the above description. Briefly, when the evaporation source unit 3 starts to rise from the disconnection position POS2, the roller 523 abuts against the guide 53 at a certain height. Then, due to the force received by the roller 523 from the upper contact portion 531 of the guide 53, the lever 52 rotates counterclockwise. By this rotation, an upward force from the roller 522 is applied to the guide groove 511 of the movable plate 51, and the movable plate 51 and the upper part 61 connected thereto move upward with respect to the lower part 62.

[0054] According to the present embodiment, since the vertical movement of the evaporation source unit 3 and the relative movement of the anti-deposition plate 6 with respect to the evaporation source unit 3 are interlocked, the anti-deposition plate 6 can be moved more easily together with the evaporation source unit 3.

[0055] <Other Embodiments> In the above embodiment, the anti-deposition plate 6 is moved up and down relatively with respect to the evaporation source unit 3, but a configuration in which the anti-deposition plate 6 does not move up and down with respect to the evaporation source unit 3 can also be adopted. However, by relatively moving the anti-deposition plate 6 with respect to the evaporation source unit 3 as in the above embodiment, the amount of descent of the evaporation source unit 3 necessary to avoid interference between the anti-deposition plate 6 and the transfer chamber 21 can be reduced.

[0056] In the above-described embodiment, the deposition prevention plate 6 is divided into an upper portion 61 and a lower portion 62, but a configuration in which it is not divided vertically is also applicable. That is, instead of moving the upper portion 61 relative to the lower portion 62 and the evaporation source unit 3, the entire deposition prevention plate 6 may be moved vertically relative to the evaporation source unit 3. However, in the above-described embodiment, since the deposition prevention plate 6 is separated into the upper portion 61 and the lower portion 62, the amount of downward movement of the evaporation source unit 3 necessary to avoid interference between the deposition prevention plate 6 and the transfer chamber 21 can be reduced.

[0057] Specifically, in order to suppress the adhesion of the deposited material to the inner wall of the evaporation source chamber 31 of the deposition prevention plate 6, its lower end may be provided relatively close to the bottom of the evaporation source chamber 31. Therefore, when the entire deposition prevention plate 6 is lowered relative to the evaporation source unit 3, the lowering width of the deposition prevention plate 6 cannot be increased significantly, and the amount of downward movement of the evaporation source unit 3 may increase. On the other hand, when the upper portion 61 is lowered relative to the lower portion 62, since the distance from the lower end of the upper portion 61 to the bottom of the evaporation source chamber 31 is relatively large, the lowering width of the upper portion 61 can be increased significantly. Therefore, it is not necessary to increase the amount of downward movement of the evaporation source unit 3 so much. Therefore, by dividing the deposition prevention plate 6 vertically, the amount of downward movement of the evaporation source unit 3 necessary to avoid interference between the deposition prevention plate 6 and the transfer chamber 21 can be reduced.

[0058] In the above-described embodiment, in conjunction with the vertical movement of the evaporation source unit 3, the upper portion 61 moves vertically relative to the lower portion 62, but a configuration in which the movement of the evaporation source unit 3 and the movement of the upper portion 61 are not interlocked is also applicable. For example, from the state shown in FIG. 7(B), an operator may manually move the upper portion 61 relative to the lower portion 62, or the upper portion 61 may be moved relative to the lower portion 62 using a motor or the like.

[0059] Further, the mode of interlocking the movement of the evaporation source unit 3 and the movement of the upper portion 61 is not limited to being interlocked by a mechanical mechanism using a link or the like as in the above embodiment. For example, the film forming apparatus 1 may include a motor that moves the upper portion 61 relative to the lower portion 62. Then, the control device of the film forming apparatus 1 may drive the motor that moves the upper portion 61 based on the start of the lifting of the evaporation source unit 3 by the lifting unit 72. That is, the movement of the evaporation source unit 3 and the movement of the upper portion 61 may be controllably interlocked.

[0060] Also, in the above embodiment, the anti-deposition plate 6 is disposed below the conveyance path of the substrate holding tray 100, but the anti-deposition plate 6 may extend up to the upper side of the substrate holding tray 100. That is, instead of the opening 619 through which the deposited material passes as in the above embodiment, the anti-deposition plate 6 may have an opening through which the substrate holding tray 100 can pass at the upper part of the side surface intersecting the conveyance direction of the substrate.

[0061] Further, the film forming apparatus 1 may include a sensor that detects a value related to the inclination of the evaporation source unit 3. Then, when the value related to the inclination of the evaporation source unit 3 detected by this sensor does not satisfy a predetermined condition, the film forming apparatus 1 may stop the lifting operation of the evaporation source unit 3, that is, the movement operation between the connection position POS1 and the disconnection position POS2.

[0062] For example, the sensor may directly detect the inclination of the evaporation source unit 3 like a pendulum type or float type inclination sensor, or may indirectly detect the inclination like an acceleration sensor. Also, for example, the sensor may detect a value that can grasp that the evaporation source unit 3 is inclined, such as a value related to the driving load of the driving units 722 on both sides (for example, the driving current value) or the load of the evaporation source unit 3 applied to the evaporation source unit support portions 721 on both sides.

[0063] For example, the film forming apparatus 1 may stop the lifting operation of the evaporation source unit 3 when the inclination of the evaporation source unit 3 detected by the sensor is equal to or greater than a threshold value. Alternatively, the film forming apparatus 1 may stop the lifting operation of the evaporation source unit 3 when the difference between the drive current values of the drive units 722 on both sides or the load on the evaporation source unit support 721 of the evaporation source unit 3 is equal to or greater than a threshold value.

[0064] <Second Embodiment> FIG. 9 is a front view schematically showing a film forming apparatus 13 according to the third embodiment. FIG. 10 is a plan view of the film forming apparatus 13 of FIG. 9, showing a state in which the central evaporation source unit 3 is located at the maintenance position POS3. This embodiment is different from the first embodiment in that the film forming apparatus 13 includes a take-out unit 50. Hereinafter, the same components as those in the first embodiment may be denoted by the same reference numerals and the description thereof may be omitted.

[0065] The take-out unit 50 takes out predetermined components from above the evaporation source unit 3 located at the maintenance position POS3. Examples of the predetermined components include the evaporation source chamber 31 and the anti-deposition plate 6 housed in the evaporation source chamber 31 of the evaporation source unit 3. The take-out unit 50 is supported by the frame portion 101 so as to be movable above the evaporation source unit 3. The take-out unit 50 includes a holding portion 501, a vertical movement portion 502, and a horizontal movement portion 503.

[0066] The holding portion 501 holds the predetermined components. For example, the holding portion 501 may grip the predetermined components by moving the tip portion thereof in a predetermined direction such as the horizontal direction. Alternatively, the holding portion 501 may be provided with a hook for hooking a wire for hanging, and may hold the predetermined components by suspending them with the wire. Note that the holding portion 501 may be configured to be foldable so as to be able to handle components of different sizes.

[0067] The vertical moving part 502 moves the holding part 501 in the vertical direction. As the vertical moving part 502, known techniques can be appropriately adopted. For example, an electric cylinder having a ball screw mechanism, a pneumatic balance cylinder, or the like may be used.

[0068] The horizontal moving part 503 moves the holding part 501 in the horizontal direction. Specifically, the horizontal moving part 503 moves the holding part 501 in the horizontal direction by moving the vertical moving part 502 in the horizontal direction. For example, the horizontal moving part 503 includes an X-direction moving part 5031 that moves the vertical moving part 502 in the X direction and a Y-direction moving part 5032 that moves the vertical moving part 502 in the Y direction. In the present embodiment, the Y-direction moving part 5032 moves the vertical moving part 502 in the Y direction, and the X-direction moving part 5031 moves the Y-direction moving part 5032 in the X direction. As the X-direction moving part 5031 and the Y-direction moving part 5032, known techniques can be appropriately adopted. For example, it may be configured to include a rack and pinion mechanism and an electric motor that rotates the pinion thereof. Also, using a pulley-type mechanism, at least one of the movements in the X direction and the Y direction may be manually performed by an operator without a drive source.

[0069] For example, when the extraction unit 50 extracts a predetermined component from the evaporation source unit 3 located at the maintenance position POS3, the extracted component is placed on a maintenance table (not shown) or the like. Thereby, maintenance by the operator becomes easier than when the component to be maintained is inside the evaporation source chamber 31.

[0070] It should be noted that a configuration in which a plurality of extraction units 50 are provided is also adoptable. In this case, when the two outer evaporation source units 3 are pulled out to the maintenance position POS3, components can be extracted from each evaporation source unit 3 in parallel. Also, when a plurality of extraction units 50 are provided, for example, the rail portion of the X-direction moving part 5031 or the like may be shared.

[0071] The invention is not limited to the above-described embodiments, and various modifications and changes are possible within the scope of the gist of the invention.

Explanation of Symbols

[0072] 1 Film forming apparatus, 2 Conveying unit, 3 Evaporation source unit, 6 Anti-deposition plate

Claims

1. A transfer unit for transferring a substrate, A film forming source unit including an evaporation source and movable between a first position below the transfer unit and a second position displaced laterally with respect to the first position, A deposition prevention plate that allows the deposited material released from the evaporation source to adhere to the substrate while preventing it from adhering to the inner wall of the film forming source unit, An in-line film forming apparatus for forming a film on a substrate while transferring the substrate, The deposition prevention plate is supported by the film forming source unit and is movable together with the film forming source unit between the first position and the second position, A film forming apparatus characterized by the above.

2. The deposition prevention plate is movable up and down with respect to the film forming source unit. The film forming apparatus according to claim 1, characterized by this.

3. The deposition prevention plate includes a lower portion fixed to the film forming source unit and an upper portion movable up and down with respect to the film forming source unit. The film forming apparatus according to claim 1, characterized by this.

4. The film forming source unit is also movable to a third position above the first position and connected to the lower portion of the transfer unit, In conjunction with the film forming source unit moving from the third position to the first position, the deposition prevention plate moves downward with respect to the film forming source unit, The film forming apparatus according to any one of claims 1 to 3, characterized by this.

5. The deposition prevention plate moves downward with respect to the film forming source unit to a position where contact with the transfer unit can be avoided when the film forming source unit moves from the first position to the second position. The film forming apparatus according to any one of claims 1 to 4, characterized by this.

6. The deposition prevention plate, A side wall covering the periphery of the evaporation source, An opening facing the substrate through which the deposited material released from the evaporation source passes, and includes, The film forming apparatus according to any one of claims 1 to 5, characterized by this.

7. When the film forming source unit is in the third position connected to the lower portion of the transfer unit, the deposition prevention plate is arranged such that the upper end of the deposition prevention plate is located above the lower end of the transfer unit. The film forming apparatus according to claim 2, characterized by this.

8. When the film-forming source unit is in the third position, the distance from the lower end of the transfer unit to the upper end of the anti-deposition plate is greater than the moving distance from the third position to the first position of the film-forming source unit. The film-forming apparatus according to claim 7, characterized in that.

9. A transfer unit for transferring a substrate, A film-forming source unit including an evaporation source, movable between a first position below the transfer unit and a second position displaced laterally with respect to the first position, An anti-deposition plate that allows the deposited material released from the evaporation source to adhere to the substrate while preventing it from adhering to the inner wall of the film-forming source unit, An in-line film-forming apparatus that forms a film on a substrate while transferring the substrate, The anti-deposition plate is supported by the film-forming source unit and is movable between the first position and the second position together with the film-forming source unit, The film-forming source unit is also movable to a third position above the first position and connected to the lower part of the transfer unit, The film-forming apparatus includes detection means for detecting a value related to the inclination of the film-forming source unit, A film-forming apparatus characterized by that.

10. Further comprising a stop means for stopping the lifting operation when the value related to the inclination detected by the detection means does not satisfy a predetermined condition during the lifting operation between the first position and the third position of the film-forming source unit, The film-forming apparatus according to claim 9, characterized in that.

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