Chip peeling device, taping machine, and peeling method

Abstract

To provide a chip removal device, a taping machine and a removal method in which a possibility of failing to remove a chip component is reduced.SOLUTION: A chip removal device 10 includes: an ultrasonic vibration generation part 266 which generates ultrasonic vibration; and a contact member 262 which comes into contact with a chip component C attached to a sheet ST via the sheet ST to apply the ultrasonic vibration generated by the ultrasonic vibration generation part 266. When the chip component C is removed due to application of the ultrasonic vibration having an amplitude amount P1 for time T0, until the ultrasonic vibration generation part 266 satisfies a predetermined stop condition after the contact member 262 comes into contact with the sheet ST, the ultrasonic vibration is generated so that the envelope becomes a prescribed waveform W1, and the amplitude amount of the prescribed waveform W1 gradually increases with time and exceeds the amplitude amount P1 after the elapse of time T1 which is later than the time T0.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a chip peeling device, a taping machine, and a peeling method.

Background Art

[0002] Patent Document 1 describes a method for manufacturing a semiconductor device including a pickup step of dicing a semiconductor wafer with an adhesive sheet attached thereto into individual semiconductor chips, sucking and holding each semiconductor chip with a suction jig, and collecting it from the adhesive sheet. In this pickup step, ultrasonic vibration is applied to the semiconductor chip through the adhesive sheet, and a function is provided to perform the same separation operation again on a chip that has failed to separate from the adhesive sheet. If it cannot be separated again, the separation operation is not performed again.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] Generally speaking, if there is no failure in peeling in the first place, there is no need to perform a peeling operation again. An object of the present invention is to provide a chip peeling device, a taping machine, and a peeling method in which the possibility of failure in peeling chip components is reduced.

Means for Solving the Problems

[0005] The invention according to claim 1 includes an ultrasonic vibration generating unit that generates ultrasonic vibration, and a contact member that contacts a chip component attached to a sheet through the sheet and applies the ultrasonic vibration generated by the ultrasonic vibration generating unit. When the chip component is peeled off due to the ultrasonic vibration of the amplitude amount P1 being applied for a time T0, after the contact member contacts the sheet, the ultrasonic vibration generating unit generates ultrasonic vibration so that the envelope becomes a predetermined waveform until a predetermined stop condition is satisfied, the amplitude amount of the predetermined waveform increases with time, and exceeds the amplitude amount P1 after a time T1 that is later than the time T0 It is a chip peeling device.

[0006]

[0007] Claim 2 The invention according to claim 1 In the chip peeling device described in claim 、pre After the amplitude amount of the predetermined waveform reaches the determined amplitude amount P2, the amplitude amount P2 is maintained.

[0008] Claim 3 The invention according to claim 1 In the chip peeling device described in claim

[0009] Claim 4 The invention according to claim 1 In the chip peeling device described in claim further comprising an adsorption collet that air-adsorbs the chip component peeled from the sheet The predetermined stop condition is that the suction collet does not adsorb the chip component during the period from when the amplitude amount reaches the predetermined amplitude amount P2 until a preset time has elapsed.

[0010] Claim 5 The invention according to claim 3 or 4 In the chip peeling device described in claim

[0011] Claim 6 The invention according to claim is a taping machine comprising the chip peeling device according to any one of claims 1 to 4 and an insertion device for inserting the chip component peeled by the peeling device into a carrier tape.

[0012] Claim 7 The invention according to claim comprising an ultrasonic vibration generating unit that generates ultrasonic vibration, and a contact member that contacts a chip component attached to a sheet through the sheet and applies the ultrasonic vibration generated by the ultrasonic vibration generating unitSteps of preparing a chip peeling device, steps of applying ultrasonic vibration and preliminarily investigating an amplitude amount P1 and a time T0 at which chip components are peeled, and after the contact member contacts the sheet, the ultrasonic vibration generating unit generates ultrasonic vibration so that an envelope line has a predetermined waveform until a predetermined stop condition is satisfied, including, the amplitude amount of the predetermined waveform increases with time, and after a time T1 that is later than the time T0 has elapsed, the amplitude amount exceeds P1. increase to This is a peeling method.

Advantages of the Invention

[0013] According to the present invention, it is possible to provide a chip peeling device and a peeling method with a reduced possibility of failure in peeling chip components.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Embodiments for Carrying Out the Invention

[0015] Subsequently, with reference to the attached drawings, embodiments embodying the present invention will be described to facilitate understanding of the present invention. In the drawings, parts not relevant to the description may be omitted from illustration.

[0016] The taping machine 10 shown in Fig. 1 is provided with a chip peeling device 20 according to an embodiment of the present invention. In the taping machine 10, the chip peeling device 20 peels a semiconductor chip (an example of a chip component) C from the diced wafer fixed to the wafer ring 110, and the peeled semiconductor chip C is conveyed by the rotary table 115 while being subjected to predetermined inspections and the like by each processing unit 120a to 120g, and is encapsulated in a carrier tape by the taping unit 140.

[0017] Incidentally, among the processing units 120a to 120g, the processing unit 120a is an appearance inspection unit and can inspect the appearance of the semiconductor chip C and the amount of displacement from the reference position. The processing unit 120c is a three-axis correction unit and can correct the position of the semiconductor chip C in order to insert it into the carrier tape. The processing unit 120e is a ranking unit and can rank the semiconductor chips C according to quality. The processing unit 120g is a forced discharge unit and can discharge the semiconductor chips C that do not meet a predetermined quality.

[0018] The chip peeling device 20 can peel and take out a predetermined semiconductor chip C from a sheet ST to which a plurality of diced semiconductor chips C are attached. The thickness of the sheet ST is, for example, 0.1 mm. The length of the semiconductor chip C is, for example, 0.4 to 1.0 mm, the width is, for example, 0.2 to 0.7 mm, and the thickness is, for example, 0.05 to 0.2 mm.

[0019] As shown in Fig. 2, the chip peeling device 20 includes a chip suction portion 22 that sucks the semiconductor chip C, a sheet suction portion 24 that sucks the sheet ST, and an extrusion portion 26 that extrudes the semiconductor chip C. Note that the sheet suction portion 24 and the extrusion portion 26 constitute an example of the extrusion unit 150 shown in Fig. 1.

[0020] As shown in Fig. 2, the chip suction portion 22 has a suction collet 222. The suction collet 222 has suction holes HL1 for air suction (see Fig. 5(A)) formed on its tip surface, and can suction the semiconductor chip C attached to the sheet ST.

[0021] As shown in Fig. 2, a plurality of suction collets 222 are arranged around a rotation axis AX extending in the horizontal direction, and sequentially suction the semiconductor chips C by rotating around this rotation axis AX. The suctioned semiconductor chip C is delivered to the rotary table 115. The flow rate of the suction air for the suction collet 222 to suction the semiconductor chip C is measured by a flow rate sensor (not shown). Note that the suction collet 222 does not move forward and backward with respect to the sheet ST (semiconductor chip C).

[0022] The sheet suction part 24 has a suction holder 242 and a suction holder forward and backward mechanism 243. The suction holder 242 moves forward and backward with respect to the sheet ST, and can suction the sheet ST at its tip surface. As shown in Fig. 5(A), a hole HL2 is formed in the center of the tip surface of the suction holder 242. Around the hole HL2, suction holes HL3 for air suction of the sheet ST to which the semiconductor chip C is attached are formed.

[0023] As shown in Fig. 2, the suction holder forward and backward mechanism 243 has a cam 244 and a servo motor 246, and can move the suction holder 242 forward and backward with respect to the sheet ST. The cam 244 can move the attachment member 248 provided at the tip of the suction holder 242 forward and backward at a preset timing. That is, the suction holder 242 moves forward and backward according to the profile of the cam 244. The servo motor 246 is a motor that serves as a drive source for rotating the cam 244.

[0024] The extrusion unit 26 includes an extrusion member 262, an extrusion member holder 264, an ultrasonic vibration generator 266, and an extrusion member advancing / retracting mechanism 268. As shown in FIGS. 5(A) to 5(D), the tip of the extrusion member 262 extends from the tip of the suction holder 242.

[0025] The extrusion member (an example of a contact member) 262 contacts the semiconductor chip C attached to the sheet ST through the sheet ST and can apply ultrasonic vibrations generated by the ultrasonic vibration generator 266. The tip of the extrusion member 262 is formed to become thinner toward the tip, and the tip surface is a circular flat surface. The extrusion member 262 is housed inside a hole HL2 (see FIG. 5(A)) provided in the suction holder 242 and can contact and push the semiconductor chip C attached to the sheet ST from the side of the sheet ST through this hole HL2. Since the extrusion member 262 wears out with repeated use, it is a consumable part that is replaced according to the usage state. Therefore, a male thread is formed at the base so that replacement is easy.

[0026] The extrusion member holder 264 is a cylindrical member to which the extrusion member 262 is attached. A female thread corresponding to the male thread formed at the base of the extrusion member 262 is formed on the tip surface of the extrusion member holder 264.

[0027] As shown in FIG. 2, the ultrasonic vibration generator 266 includes an ultrasonic oscillator 270 and an ultrasonic vibrator 272, and can generate ultrasonic vibrations as shown in FIG. 3, for example, based on a command signal from a control device (not shown) that controls the entire taping machine 10. Note that the horizontal axis in FIG. 3 is time and the vertical axis is the amplitude amount.

[0028] The ultrasonic oscillator 270 can drive the ultrasonic vibrator 272 based on an output command signal from a control device (not shown). The ultrasonic vibrator 272 can generate ultrasonic vibrations, and the base end portion of the extrusion member holder 264 is fixed thereto. The extrusion member holder 264 and the extrusion member 262 provided at its tip function as an ultrasonic horn that transmits the generated ultrasonic vibrations.

[0029] The extrusion member advancing / retreating mechanism 268 has a cam 274 and a servo motor 276, and can advance and retreat the extrusion member 262 with respect to the sheet ST. The cam 274 can advance and retreat the ultrasonic vibrator 272 at a preset timing. That is, the extrusion member 262 and the extrusion member holder 264 advance and retreat according to the profile of the cam 274. The servo motor 276 is a motor that serves as a drive source for rotating the cam 274.

[0030] Next, the operation of the chip peeling device 20 (method for peeling the semiconductor chip C) will be described with reference to FIGS. 5 and 6. The semiconductor chip C attached to the sheet ST is peeled according to the following steps S1 to S6 after the chip peeling device 20 is prepared. The chip suction part 22, the sheet suction part 24, the extrusion part 26, each processing unit 120a to 120g, the taping unit, and other parts are controlled by the aforementioned control device (not shown).

[0031] (Step S1) This step is to apply test ultrasonic vibration to the semiconductor chip C to be peeled in order to investigate in advance the conditions for peeling the semiconductor chip C from the sheet ST. Note that the waveform W0 shown in FIG. 4 is the envelope of the test ultrasonic vibration, and only the positive envelope is drawn, and the negative envelope is omitted. The horizontal axis in FIG. 4 is time, and the vertical axis is the amplitude amount.

[0032] The test ultrasonic vibration is a sine-wave vibration having positive and negative amplitudes centered on the reference position (the zero point in FIG. 4), and the envelope until the semiconductor chip C is peeled has a stepped waveform. The vibration frequency is, for example, 30 to 60 kHz. However, the waveform mentioned here is the waveform set in the ultrasonic oscillator 270 (the same applies hereinafter). Therefore, although it is different in a strict sense from the waveform actually generated by the ultrasonic vibrator 272, it becomes substantially the same waveform.

[0033] For each of the plurality of semiconductor chips C, the amplitude amount of the waveform W0 is changed, and the excitation of the ultrasonic vibration for testing is repeated, thereby obtaining the R0 point (see FIG. 4 in the same drawing) at which the semiconductor chip C peels off. That is, by performing the preliminary investigation in this step in advance on the semiconductor chip C to be peeled off by the chip peeling device 20, the R0 point (the amplitude amount P1 and time T0 of the ultrasonic vibration for testing) with a high probability of peeling off the semiconductor chip C is confirmed.

[0034] (Step S2) By means of a wafer positioning mechanism (not shown), the wafer with the sheet ST attached is positioned in a direction orthogonal to the normal direction of the wafer surface so that the semiconductor chip C to be peeled off is located at a predetermined peeling position (see FIG. 6(A)).

[0035] Here, FIG. 6 shows the relationship between the waveform W1 of the envelope of the ultrasonic vibration shown in FIG. 4 and the operation timing of each part. Regarding the waveform W1, unlike the waveform W1 in FIG. 4, the envelopes on both the positive and negative sides are drawn.

[0036] Among FIGS. 6(A) to (G), FIG. 6(A) shows the operation of the wafer positioning mechanism (not shown), indicating the timing of movement and rest. FIG. 6(B) simply shows the timing of the rotational operation of the suction collet 222, and the vertical axis does not indicate the rotation angle. FIG. 6(C) shows the flow rate of the suction air of the suction collet 222, indicating the timing of its change. FIG. 6(D) shows the operation of the extrusion member 262, indicating the timing of the forward and backward movements. FIG. 6(E) shows the operation of the suction holder 242, indicating the timing of the forward and backward movements. FIG. 6(F) shows the air suction operation of the suction holder 242. FIG. 6(G) shows the command signal output by the control device (not shown) to the ultrasonic oscillator 270, indicating the output timing of the command signal for generating ultrasonic vibration.

[0037] (Step S3) When the wafer is positioned, the suction collet 222 starts to rotate around the rotation axis AX shown in FIG. 2 (see FIG. 6(B)) and stops facing the semiconductor chip C at a predetermined peeling position. On the other hand, both the suction holder 242 and the extrusion member 262 advance toward the sheet ST. As shown in FIG. 5(A), when the suction holder 242 and the extrusion member 262 contact the sheet ST (see FIGS. 6(D) and 6(E)), the suction holder 242 sucks the sheet ST (see FIG. 6(F)).

[0038] When the suction holder 242 and the extrusion member 262 continue to advance further in the direction of the suction collet 222, the sheet ST pushed by the suction holder 242 moves in the direction of the suction collet 222, and as shown in FIG. 5(B), the sheet ST bends.

[0039] (Step S4) While the extrusion member 262 stops, the suction holder 242 retracts in the state of sucking the sheet ST (see FIG. 6(F)) (see FIG. 6(E)). As a result, as shown in FIG. 5(C), the semiconductor chip C is pushed out from the sheet ST by the extrusion member 262.

[0040] On the other hand, after the suction holder 242 starts to retract, a control device (not shown) outputs a command to the ultrasonic oscillator 270 to generate ultrasonic vibration (see FIG. 6(G)). Based on this command, the ultrasonic oscillator 270 drives the ultrasonic vibrator 272 and applies ultrasonic vibration as shown in FIG. 3 to the semiconductor chip C via the extrusion member 262.

[0041] Specifically, the ultrasonic vibration generating unit 266 generates ultrasonic vibration so that the envelope becomes a predetermined waveform W1 (see FIG. 4) until a predetermined stop condition is satisfied. Here, this predetermined waveform W1 is determined based on the amplitude amount P1 and the time T0 at the R0 point confirmed in the aforementioned step S1. The amplitude amount of the predetermined waveform W1 gradually increases with time, exceeds the amplitude amount P1 (R1 point) after the time T1 that is later than the time T0 has elapsed, and after the time T2 has elapsed and the amplitude amount reaches the predetermined amplitude amount P2, this amplitude amount P2 is maintained until the preset time T3.

[0042] The magnitude of the vibration frequency is the same as the ultrasonic vibration for testing. Note that the "same" mentioned here does not mean the same in a strict sense. That is, "same" means that, for example, errors in design, manufacturing, measurement, etc. are allowed, which means "substantially the same". Specifically, for example, there may be an error in the vibration frequency within the range of ±10%.

[0043] Also, the predetermined stop condition is at least one of the following stop condition A or stop condition B. Stop condition A is that the adsorption collet 222 has adsorbed the semiconductor chip C. More specifically, stop condition A is that the flow rate of the adsorption air of the adsorption collet 222 has changed. Since it is determined that the adsorption collet 222 has adsorbed the semiconductor chip C due to the change in the flow rate of the adsorption air, the ultrasonic vibration can be stopped early and the subsequent peeling operation of the semiconductor chip C can be carried out.

[0044] Stop condition B is that the adsorption collet 222 has not adsorbed the semiconductor chip C before the preset time T3 has elapsed. More specifically, stop condition B is that the flow rate of the adsorption air of the adsorption collet 222 has not changed before the preset time T3 has elapsed. When this stop condition B is satisfied, it is determined that the adsorption of the semiconductor chip C has failed due to some factor, so an alert can be output early.

[0045] As a result of applying such ultrasonic vibration, except when it stops due to the establishment of stop condition B, the semiconductor chip C is peeled off at the latest by the time T3.

[0046] Therefore, since the amplitude of the ultrasonic vibration increases beyond the point R0 where the probability of the semiconductor chip C peeling off is high, even if there are fluctuations in the peeling conditions such as the adhesive force of the sheet ST or the suction force of the suction collet 222, the possibility of peeling failure is reduced. On the other hand, since the semiconductor chip C may peel off before the amplitude of the ultrasonic vibration reaches the point R0, in such a case, the mechanical stress applied to the semiconductor chip C is suppressed.

[0047] (Step S5) The wafer positioning mechanism (see Fig. 6(A)), the suction collet 222 (see Fig. 6(B)), the extrusion member 262 (see Fig. 6(D)), and the suction holder 242 (see Fig. 6(E)) are each stationary. On the other hand, the ultrasonic vibration generating unit 266 continues to apply the ultrasonic vibration shown in Fig. 3 to the semiconductor chip C from the previous step S4 (see Fig. 6(G)).

[0048] If the semiconductor chip C peels off between the elapse of time T2 and the elapse of time T3 (see Fig. 4), and as shown in Fig. 5(D), when the suction collet 222 adsorbs this semiconductor chip C, as shown in Fig. 6(C), the flow rate of the suction air of the suction collet 222 decreases, and it is detected that the semiconductor chip C has been peeled off. When it is detected that the semiconductor chip C has been peeled off, the aforementioned stop condition A is satisfied, and the control device (not shown) outputs a command to stop the generation of ultrasonic vibration to the ultrasonic generating unit 222 (see Fig. 6(G)). As a result, the driving of the ultrasonic vibrator 272 is stopped.

[0049] As described above, the semiconductor chip C may peel off before the elapse of time T2, and the stop condition A may be satisfied. In that case, even before the elapse of time T2, the process proceeds to the next step S6.

[0050] (Step S6) Due to the stop of the driving of the ultrasonic vibrator 272, the ultrasonic vibration decays. The separated semiconductor chip C is adsorbed by the adsorption collet 222 and conveyed to a predetermined position (see Fig. 6(B)). On the other hand, both the extrusion member 262 and the adsorption holder 242 return to their initial positions (the positions at the start of step S2) (see Figs. 6(D) and 6(E)).

[0051] Thereafter, by repeating the aforementioned steps S2 to S6 for the semiconductor chip C to be separated, all the semiconductor chips C attached to one sheet ST are separated, and the separated semiconductor chips C are sequentially inserted into the carrier tape.

[0052] As described above, according to the chip separation device 20, the possibility of separation failure is reduced, so the burden of adjusting the output of ultrasonic vibration is reduced.

[0053] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described forms, and all changes and the like without departing from the gist are within the scope of application of the present invention. The object to be separated by the chip separation device 20 is not limited to the semiconductor chip C, and may be any chip component. Examples of such chip components include chip resistors, chip capacitors, and other chip-shaped electronic components.

[0054] In the foregoing embodiment 、absorb The directions in which the adsorption holder 242 and the extrusion member 262 advance and retreat may be arbitrary directions. That is, the directions in which the adsorption collet 222, the adsorption holder 242, and the extrusion member 262 advance and retreat are not limited to the horizontal direction. The extrusion member 262 may be a member of any shape as long as it can extrude the chip component.

[0055] As described in the foregoing embodiment, whether the adsorption collet 222 has adsorbed the semiconductor chip C is determined by a flow sensor (not shown). However, it is not limited to the flow sensor, and any other sensor may be used as long as the adsorption collet 222 can detect that it has adsorbed the semiconductor chip C. As other sensors, for example, a reflection type or transmission type photoelectric sensor can be mentioned. By detecting that there is a semiconductor chip at the tip of the adsorption collet 222, it can be determined that the semiconductor chip C has been adsorbed. Also, as other sensors, for example, a pressure sensor can be mentioned. By detecting the pressure change of the adsorption air, it can be determined that the semiconductor chip C has been adsorbed.

Explanation of Signs

[0056] 10 Taping machine 20 Chip peeling device 22 Chip adsorption part 24 Sheet adsorption part 26 Extrusion part 110 Wafer ring 115 Rotating table 120a~120g Processing unit 140 Taping unit 150 Extrusion unit 222 Adsorption collet 242 Adsorption holder 243 Adsorption holder advancing and retreating mechanism 244 Cam 246 Servo motor 248 Mounting member 262 Extrusion member 264 Extrusion member holder 266 Ultrasonic vibration generating part 268 Extrusion member advancing and retreating mechanism 270 Ultrasonic oscillator 272 Ultrasonic vibrator 274 Cam 276 Servo motor AX Rotation axis C Semiconductor chip HL1 Adsorption hole HL2 Hole HL3 Adsorption hole ST Sheet

Claims

1. An ultrasonic vibration generating unit that generates ultrasonic vibrations, A contact member that contacts a chip component attached to a sheet through the sheet and applies ultrasonic vibrations generated by the ultrasonic vibration generating unit, When the chip component is peeled off by applying ultrasonic vibrations with an amplitude amount P1 for a time T0, After the contact member contacts the sheet, the ultrasonic vibration generating unit generates ultrasonic vibrations so that the envelope becomes a predetermined waveform until a predetermined stop condition is satisfied, A chip peeling device in which the amplitude amount of the predetermined waveform increases with time and exceeds the amplitude amount P1 after a time T1 that is later than the time T0.

2. In the chip peeling device according to Claim 1, A chip peeling device in which the amplitude amount of the predetermined waveform is maintained at a predetermined amplitude amount P2 after reaching the predetermined amplitude amount P2.

3. In the chip peeling device according to Claim 1, Further comprising an adsorption collet that air-adsorbs the chip component peeled from the sheet, The chip peeling device in which the predetermined stop condition is that the adsorption collet has adsorbed the chip component.

4. In the chip peeling device according to Claim 1, Further comprising an adsorption collet that air-adsorbs the chip component peeled from the sheet, The chip peeling device in which the predetermined stop condition is that the adsorption collet has not adsorbed the chip component during a preset time after the amplitude amount reaches a predetermined amplitude amount P2.

5. In the chip peeling device according to Claim 3 or 4, The chip peeling device in which the adsorption collet adsorbs the chip component without moving forward and backward with respect to the sheet.

6. A taping machine comprising the chip peeling device according to any one of Claims 1 to 4, And an insertion device that inserts the chip component peeled by the peeling device into a carrier tape.

7. A step of preparing a chip peeling device including an ultrasonic vibration generating unit that generates ultrasonic vibrations, and a contact member that contacts a chip component attached to a sheet through the sheet and applies ultrasonic vibrations generated by the ultrasonic vibration generating unit, A step of applying ultrasonic vibrations and preliminarily investigating an amplitude amount P1 and a time T0 at which the chip component is peeled off, After the contact member contacts the sheet, the ultrasonic vibration generating unit generates ultrasonic vibration so that an envelope has a predetermined waveform until a predetermined stop condition is satisfied. A peeling method in which an amplitude amount of the predetermined waveform increases with time and exceeds the amplitude amount P1 after a time T1 that is later than the time T0 has elapsed.

Images